JPS61128012U - - Google Patents
Info
- Publication number
- JPS61128012U JPS61128012U JP1267985U JP1267985U JPS61128012U JP S61128012 U JPS61128012 U JP S61128012U JP 1267985 U JP1267985 U JP 1267985U JP 1267985 U JP1267985 U JP 1267985U JP S61128012 U JPS61128012 U JP S61128012U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin molding
- molding device
- movable platform
- knockout pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図は、本考案の実施例を示す縦断面図、第
２図は従来例の樹脂モールド装置を示す要部縦断
面図である。
１……ベース、２……可動台、４……下金型、
４５……シリンダ部、５……天盤、６……上金型
、７……ノツクアウトピン、８……油圧ポンプ。
FIG. 1 is a longitudinal cross-sectional view showing an embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view of a main part of a conventional resin molding apparatus. 1...Base, 2...Movable base, 4...Lower mold,
45...Cylinder part, 5...Top plate, 6...Upper mold, 7...Knockout pin, 8...Hydraulic pump.
Claims (1)
ぞれ、ベースに対して昇降可能な可動台及び可動
台上方に配置された天盤の対向面に固定し、上記
下金型のキヤビテイ底部よりキヤビテイ内にノツ
クアウトピンを突出退入させるようにした樹脂モ
ールド装置において、 上記ノツクアウトピンをキヤビテイ底部に開口
しかつ油圧ポンプに連通したシリンダ部に嵌合す
るピストンに連結したことを特徴とする樹脂モー
ルド装置。[Scope of Claim for Utility Model Registration] Upper and lower molds with cavities formed on their abutting surfaces are respectively fixed to opposing surfaces of a movable platform that can be raised and lowered relative to the base and a top plate placed above the movable platform, and In a resin molding device in which a knockout pin is projected into and retracted from the bottom of the cavity of a mold, the knockout pin is connected to a piston that fits into a cylinder part that opens at the bottom of the cavity and communicates with a hydraulic pump. A resin molding device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1267985U JPS61128012U (en) | 1985-01-30 | 1985-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1267985U JPS61128012U (en) | 1985-01-30 | 1985-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61128012U true JPS61128012U (en) | 1986-08-11 |
Family
ID=30495973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1267985U Pending JPS61128012U (en) | 1985-01-30 | 1985-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61128012U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
| JPS58122835A (en) * | 1982-01-18 | 1983-07-21 | Omron Tateisi Electronics Co | Mold for injection molding |
-
1985
- 1985-01-30 JP JP1267985U patent/JPS61128012U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649207A (en) * | 1979-09-28 | 1981-05-02 | Hitachi Ltd | Molding die |
| JPS58122835A (en) * | 1982-01-18 | 1983-07-21 | Omron Tateisi Electronics Co | Mold for injection molding |