JPH0543475Y2 - - Google Patents
Info
- Publication number
- JPH0543475Y2 JPH0543475Y2 JP11147087U JP11147087U JPH0543475Y2 JP H0543475 Y2 JPH0543475 Y2 JP H0543475Y2 JP 11147087 U JP11147087 U JP 11147087U JP 11147087 U JP11147087 U JP 11147087U JP H0543475 Y2 JPH0543475 Y2 JP H0543475Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- lead frame
- lower mold
- gauge
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000008188 pellet Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Description
【考案の詳細な説明】
産業上の利用分野
本考案は半導体装置製造工程で使用され、リー
ドフレームを樹脂モールド成型する樹脂モールド
装置に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a resin molding device used in a semiconductor device manufacturing process, for molding a lead frame with a resin mold.
従来の技術
例えば、トランジスタやIC等の樹脂封止型半
導体装置はCu系金属やFe−Ni合金系金属の平板
を打抜き加工したリードフレームを半導体ペレツ
トマウント工程、ワイヤボンデイング工程、樹脂
モールド工程等に順次搬送して製造される。Conventional technology For example, resin-sealed semiconductor devices such as transistors and ICs are manufactured by punching a lead frame from a flat plate of Cu-based metal or Fe-Ni alloy metal through semiconductor pellet mounting process, wire bonding process, resin molding process, etc. The products are transported and manufactured in sequence.
上記リードフレームの具体例を第４図を参照し
ながら説明する。同図に於いて、２……は半導体
ペレツト３が固着されるペレツトマウント部、４
は前記ペレツトマウント部２周辺の近傍までその
端部が延設されたリードである。上記リードフレ
ーム１は複数のペレツトマウント部２，２……と
複数のリード部４，４とをフレーム５に複数組一
連に一体化した帯板状のものである。６，６……
はリードフレーム１の片側又は両側の長手方向に
沿つて定ピツチで穿設された位置決め用のピン穴
である。 A specific example of the above lead frame will be explained with reference to FIG. 4. In the figure, 2... is a pellet mount part to which a semiconductor pellet 3 is fixed, 4
is a lead whose end extends close to the periphery of the pellet mount section 2. The lead frame 1 is a strip-shaped member in which a plurality of pellet mount parts 2, 2 . . . and a plurality of lead parts 4, 4 are integrated into a frame 5 in series. 6,6...
are positioning pin holes drilled at regular pitches along the longitudinal direction of one or both sides of the lead frame 1.
上記リードフレーム１を樹脂モールド成型する
樹脂モールド装置の一例を第５図を参照しながら
説明する。同図に示す樹脂モールド装置７に於い
て、８，９は上下金型で、下金型９は昇降可能に
設けてある。１０は上下金型８，９の衝合面８
ａ，９ａに形成したキヤビテイ、１１は下金型９
のキヤビテイ１０′底面に穿設した貫通孔９ｂに
挿通したノツクアウトピンを示す。１２は下金型
９の所定位置に垂設したリードフレーム位置決め
用ゲージピン、１３は溶融樹脂を導くランナ、１
４は前記ランナ１３とキヤビテイ１０とを連通す
るゲートである。 An example of a resin molding apparatus for molding the lead frame 1 will be described with reference to FIG. 5. In the resin molding device 7 shown in the figure, 8 and 9 are upper and lower molds, and the lower mold 9 is provided so as to be movable up and down. 10 is the abutment surface 8 of the upper and lower molds 8 and 9
a, the cavity formed in 9a, 11 is the lower mold 9
A knockout pin is shown inserted into a through hole 9b drilled in the bottom surface of the cavity 10'. 12 is a lead frame positioning gauge pin vertically installed at a predetermined position of the lower mold 9; 13 is a runner that guides the molten resin;
4 is a gate that communicates the runner 13 and the cavity 10.
上記下金型９のゲージピン１２にリードフレー
ム１のピン穴６を嵌合させて位置決め載置した
後、下金型８を上昇させてリードフレーム１を上
下金型８，９にて挾持する。そして、上、下金型
８，９間に形成されたランナ１３内を圧送されて
きた樹脂をゲート１４からキヤビテイ１０内に充
填し、所定時間が経過した後、下金型８を下降さ
せて上下金型を開く。 After the gauge pins 12 of the lower mold 9 are fitted into the pin holes 6 of the lead frame 1 and positioned and placed, the lower mold 8 is raised and the lead frame 1 is held between the upper and lower molds 8 and 9. Then, the resin that has been pumped through the runner 13 formed between the upper and lower molds 8 and 9 is filled into the cavity 10 through the gate 14, and after a predetermined time has elapsed, the lower mold 8 is lowered. Open the upper and lower molds.
この時、ノツクアウトピン１１が下金型９から
キヤビテイ１０′内に突出して成形品をキヤビテ
イから取り出す。 At this time, the knockout pin 11 projects from the lower mold 9 into the cavity 10' and takes out the molded product from the cavity.
考案が解決しようとする問題点
ところで、上記樹脂モールド時に上、下金型
８，９は加熱されており、その熱によつてリード
フレーム１自体が熱膨張する。このリードフレー
ム１の熱膨張によつてゲージピン１２に対するピ
ン穴６の位置がずれて、ゲージピン１２にピン穴
６が引掛つた状態になることがある。その結果、
樹脂モールド成形後、ノツクアウトピン１１によ
つて成形品を排出する際に、ピン穴６からゲージ
ピン１２が抜けず、リードフレーム１が変形する
といつた不具合が発生したいた。Problems to be Solved by the Invention By the way, the upper and lower molds 8 and 9 are heated during the resin molding process, and the lead frame 1 itself thermally expands due to the heat. Due to this thermal expansion of the lead frame 1, the position of the pin hole 6 relative to the gauge pin 12 may shift, resulting in a state where the pin hole 6 is caught on the gauge pin 12. the result,
When the molded product is ejected by the knockout pin 11 after resin molding, the gauge pin 12 cannot be removed from the pin hole 6, resulting in a problem that the lead frame 1 is deformed.
問題点を解決するための手段
本考案は上記問題点に鑑みて提案されたもの
で、リードフレーム位置決め用ゲージピン及び下
型と相対上下動可能に配設されてキヤビテイ内に
入退するノツクアウトピンを備えた下型と、上型
とでリードフレームを挾持して樹脂モールドする
装置において、上記ゲージピンを上下動自在に配
設すると共に、前記ゲージピンをノツクアウトピ
ンの相対上下動と逆方向に連動して上下動自在に
配設したことである。Means for Solving the Problems The present invention was proposed in view of the above problems, and consists of a gauge pin for positioning the lead frame and a knockout pin that is arranged to be movable up and down relative to the lower die and enters and retracts into the cavity. In an apparatus for resin molding by holding a lead frame between a lower mold and an upper mold, the gauge pin is arranged to be movable up and down, and the gauge pin is interlocked in a direction opposite to the relative up and down movement of the knockout pin. It was arranged so that it could be moved up and down.
作 用
上記技術的手段によれば、樹脂モールド成形
後、ノツクアウトピンを突出させてリードフレー
ムを取り出す際に、リードフレームのピン穴から
ゲージピンを積極的に抜出させることが可能とな
る。Effect: According to the above technical means, when the knockout pin is projected to take out the lead frame after resin molding, the gauge pin can be actively pulled out from the pin hole of the lead frame.
実施例
本考案に係る樹脂モールド装置の一実施例を第
１図乃至第３図を参照しながら説明する。但し、
第５図に示す従来の樹脂モールド装置７と同一部
分には同一参照符号を付して詳細な説明は省略す
る。第１図に示す樹脂モールド装置２１に於い
て、１は半導体ペレツト３が固着されたリードフ
レーム、８，２２はリードフレーム１を位置決め
した状態で挾持した上、下金型で、前記下金型２
２のキヤビテイ２３の下方には、ノツクアウトピ
ン２４と後述するゲージピンとに跨る空間部２５
を形成してある。２６は前記下金型２２の空間部
２５から上方に向かつて貫通した挿通穴２７に上
下動自在に配設したゲージピンである。前記ゲー
ジピン２６とノツクアウトピン２４を互いに逆方
向に上下動させる連動機構２８が下金型２２の空
間部２５内に配設されており、前記連動機構２８
は第２図に示すように、下金型２２の空間部２５
内のノツクアウトピン２４とゲージピン２６間に
回動中心となる支持軸２９を固着したレバー３０
を配し、前記レバー３０の両端部に穿設した長穴
３０ａ，３０ａにゲージピン２６の下端部のノツ
クアウトピン２４の一部をピン３１，３２を介し
て連結してある。Embodiment An embodiment of the resin molding apparatus according to the present invention will be described with reference to FIGS. 1 to 3. however,
Components that are the same as those of the conventional resin molding device 7 shown in FIG. 5 are given the same reference numerals and detailed explanations will be omitted. In the resin molding apparatus 21 shown in FIG. 1, numeral 1 denotes a lead frame to which a semiconductor pellet 3 is fixed, and numerals 8 and 22 denote upper and lower molds which hold the lead frame 1 in a positioned state. 2
Below the cavity 23 of No. 2, there is a space 25 extending between the knockout pin 24 and a gauge pin to be described later.
has been formed. Reference numeral 26 denotes a gauge pin that is vertically movably disposed in an insertion hole 27 extending upward from the space 25 of the lower mold 22 and penetrating through it. An interlocking mechanism 28 that moves the gauge pin 26 and the knockout pin 24 up and down in opposite directions is disposed within the space 25 of the lower mold 22, and the interlocking mechanism 28
As shown in FIG. 2, the space 25 of the lower mold 22
A lever 30 has a support shaft 29 fixed between the knockout pin 24 and the gauge pin 26 inside.
A portion of the knockout pin 24 at the lower end of the gauge pin 26 is connected to elongated holes 30a, 30a formed at both ends of the lever 30 via pins 31, 32.
上記連動機構２８を備えた樹脂モールド装置２
１において、リードフレーム１の樹脂モールド成
形時には、ノツクアウトピン２４の上面がキヤビ
テイ２３の下面の高さ位置にあり、一方、ゲージ
ピン２６は従来と同様に下金型２２の所定位置か
ら所定高さ突出し、突出した部分にリードフレー
ム１のピン穴６が嵌合して、リードフレーム１を
位置決めしている。その後、第３図に示すよう
に、樹脂モールド成形後、上金型８を上昇させる
と共に、下金型２２を降下させると、レバー３０
の回動中心である支持軸２９が降下するに伴つて
レバー３０のノツクアウトピン２４側の端部が上
昇すると共に、レバー３０のゲージピン２６側の
端部が下降する。従つて、レバー３０は支持軸２
９を中心に時計回りの方向に回動してノツクアウ
トピン２４をキヤビテイ２３内に突出させてモー
ルド成形後のリードフレーム１を下金型２２から
突上げ、且つ、ゲージピン２６を下金型２２内に
降下させる。前記ゲージピン２６の降下によつて
リードフレーム１のピン穴６からゲージピン２６
が確実に抜け出ることになる。 Resin molding device 2 equipped with the above-mentioned interlocking mechanism 28
1, during resin molding of the lead frame 1, the upper surface of the knockout pin 24 is at a height position of the lower surface of the cavity 23, while the gauge pin 26 is placed at a predetermined height from a predetermined position of the lower mold 22 as in the conventional case. The pin hole 6 of the lead frame 1 is fitted into the protruding portion to position the lead frame 1. Thereafter, as shown in FIG. 3, after resin molding, the upper mold 8 is raised and the lower mold 22 is lowered, and the lever 30
As the support shaft 29, which is the center of rotation, descends, the end of the lever 30 on the knockout pin 24 side rises, and the end of the lever 30 on the gauge pin 26 side descends. Therefore, the lever 30 is attached to the support shaft 2
9 in a clockwise direction to project the knockout pin 24 into the cavity 23 to push the molded lead frame 1 up from the lower mold 22, and move the gauge pin 26 out of the lower mold 22. descend into the interior. By lowering the gauge pin 26, the gauge pin 26 is removed from the pin hole 6 of the lead frame 1.
will definitely come out.
尚、本考案に係るノツクアウトピンとゲージピ
ンとを連結する連動機構は上記実施例のレバー３
０に限定されず、例えば、両ピンにラツクを取付
ける共に中間にピニオンを配したラツク＆ピニオ
ンによる連動機構を採用しても良い。また、上記
実施例では連動機構を下型に支持した場合につい
て記載したが、下型から独立して支持してもよ
い。 Incidentally, the interlocking mechanism for connecting the knockout pin and the gauge pin according to the present invention is the lever 3 of the above embodiment.
For example, a rack and pinion interlocking mechanism may be adopted in which racks are attached to both pins and a pinion is disposed in the middle. Further, in the above embodiment, the interlocking mechanism is supported by the lower mold, but it may be supported independently from the lower mold.
考案の効果
本考案によれば、樹脂モールド成形後、下型と
ノツクアウトピンとの相対上下動によるリードフ
レームの取出時に、ゲージピンを前記ノツクアウ
トピンと逆方向に連動させるから、リードフレー
ムは下型に支持され、変形が防止された状態でピ
ン穴からゲージピンが確実に抜けでる。従つて、
リードフレームの下型からの取出し時に、ピン穴
とゲージピンの引掛りによるリードフレームの折
れ曲がり等の取出し不良は一掃されることにな
る。Effects of the invention According to the invention, after resin molding, when the lead frame is taken out by the relative vertical movement between the lower mold and the knockout pin, the gauge pin is interlocked in the opposite direction to the knockout pin, so the lead frame is attached to the lower mold. The gauge pin can surely come out from the pin hole while being supported and prevented from deformation. Therefore,
When the lead frame is removed from the lower die, defects such as bending of the lead frame due to the pin hole and the gauge pin being caught will be eliminated.
第１図は本考案に係る樹脂モールド装置を示す
要部断面図、第２図は第１図のＡ−Ａ線矢視図、
第３図は上記モールド装置の動作時での要部断面
図である。第４図はリードフレームの一例を示す
平面図、第５図は従来の樹脂モールド装置を示す
要部断面図である。
１……リードフレーム、８……上金型、２１…
…樹脂モールド装置、２２……下金型、２３……
キヤビテイ、２４……ノツクアウトピン、２６…
…リードフレーム位置決め用ゲージピン（ゲージ
ピン）、２８……連動機構。
FIG. 1 is a sectional view of a main part showing a resin molding device according to the present invention, FIG. 2 is a view taken along the line A-A in FIG. 1,
FIG. 3 is a sectional view of the main part of the molding device during operation. FIG. 4 is a plan view showing an example of a lead frame, and FIG. 5 is a sectional view of a main part showing a conventional resin molding device. 1...Lead frame, 8...Upper mold, 21...
... Resin molding device, 22 ... Lower mold, 23 ...
Cavity, 24... Knockout pin, 26...
...Gauge pin for lead frame positioning (gauge pin), 28...Interlocking mechanism.
Claims (1)
と相対上下動可能に配設されてキヤビテイ内に入
退するノツクアウトピンを備えた下型と、上型と
でリードフレームを挾持して樹脂モールドする装
置において、 上記ゲージピンをノツクアウトピンの相対上下
動と逆方向に連動して上下動自在に配設したこと
を特徴とする樹脂モールド装置。[Scope of Claim for Utility Model Registration] A lead frame is held between an upper mold and a lower mold equipped with a gauge pin for positioning the lead frame and a knock-out pin that is arranged to be movable up and down relative to the lower mold and enters and retreats into the cavity. A resin molding apparatus characterized in that the gauge pin is arranged to be movable up and down in conjunction with the relative up and down movement of the knockout pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11147087U JPH0543475Y2 (en) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11147087U JPH0543475Y2 (en) | 1987-07-20 | 1987-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416635U JPS6416635U (en) | 1989-01-27 |
| JPH0543475Y2 true JPH0543475Y2 (en) | 1993-11-02 |
Family
ID=31349543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11147087U Expired - Lifetime JPH0543475Y2 (en) | 1987-07-20 | 1987-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543475Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11107746B2 (en) | 2016-02-09 | 2021-08-31 | Mitsubishi Electric Corporation | Power semiconductor apparatus and manufacturing method therefor |
-
1987
- 1987-07-20 JP JP11147087U patent/JPH0543475Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11107746B2 (en) | 2016-02-09 | 2021-08-31 | Mitsubishi Electric Corporation | Power semiconductor apparatus and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6416635U (en) | 1989-01-27 |
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