JPS58112528U - Resin mold equipment - Google Patents

Resin mold equipment

Info

Publication number
JPS58112528U
JPS58112528U JP908182U JP908182U JPS58112528U JP S58112528 U JPS58112528 U JP S58112528U JP 908182 U JP908182 U JP 908182U JP 908182 U JP908182 U JP 908182U JP S58112528 U JPS58112528 U JP S58112528U
Authority
JP
Japan
Prior art keywords
runner
resin mold
mold equipment
gate
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP908182U
Other languages
Japanese (ja)
Inventor
「あま」田　秀雄
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP908182U priority Critical patent/JPS58112528U/en
Publication of JPS58112528U publication Critical patent/JPS58112528U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本案の一実施例を示す側断面図、第２図は下部
金型の平面図である。 図中、９は下部金型、１０．１９はポット部、１１はラ
ンナ部、１１ｄは副ランナ部、１２□は第１のゲート部
、１２゜は第２のゲート部、１３はキャビディ部である
。FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view of the lower mold. In the figure, 9 is the lower mold, 10.19 is the pot part, 11 is the runner part, 11d is the sub-runner part, 12□ is the first gate part, 12° is the second gate part, and 13 is the cavity part. be.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上部金型と下部金型とを具え、これらの衝合部分に、ポ
ット部と、ポット部より延びる複数のランナ部と、ラン
ナ部に第１のゲート部を介して連通ずる複数のキャビテ
ィ部と、複数のキャビティ部より第２のゲート部を介し
て連通ずる副ランナ部とを形成したことを特徴とする樹
脂モールド装置。An upper mold and a lower mold are provided, and a pot portion, a plurality of runner portions extending from the pot portion, and a plurality of cavity portions communicating with the runner portion via a first gate portion are provided at the abutting portion thereof. 1. A resin molding device, comprising: a sub-runner section that communicates with a plurality of cavity sections via a second gate section.
JP908182U 1982-01-25 1982-01-25 Resin mold equipment Pending JPS58112528U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP908182U JPS58112528U (en) 1982-01-25 1982-01-25 Resin mold equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP908182U JPS58112528U (en) 1982-01-25 1982-01-25 Resin mold equipment

Publications (1)

Publication Number Publication Date
JPS58112528U true JPS58112528U (en) 1983-08-01

Family

ID=30021745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP908182U Pending JPS58112528U (en) 1982-01-25 1982-01-25 Resin mold equipment

Country Status (1)

Country Link
JP (1) JPS58112528U (en)

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