JPS58175640U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS58175640U JPS58175640U JP7400182U JP7400182U JPS58175640U JP S58175640 U JPS58175640 U JP S58175640U JP 7400182 U JP7400182 U JP 7400182U JP 7400182 U JP7400182 U JP 7400182U JP S58175640 U JPS58175640 U JP S58175640U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flat surface
- main flat
- semiconductor device
- side surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例装置の外観斜視図、第２図は同装置の成
形に用いる金型の要部断面図、第３図は本考案の一実施
例装置の外観斜視図、第４図は同装置の成形に用いる金
型の要部断面図、第５図は本考案の別の実施例装置の外
観斜視図、第６図は同装置の成型に用いる金型の要部断
面図である。
１・・・・・・半導体基板支持体、２・・・・・・外囲
樹脂、３・・・・・・側面、４・・・・・・主要平坦面
、５・・・・・・周辺平坦面（第３の面）、６・・・・
・・傾斜面（第３の面）、７・・・・・・金型、８・・
・・・・外部電極体。Fig. 1 is an external perspective view of a conventional device, Fig. 2 is a sectional view of a main part of a mold used for molding the same device, Fig. 3 is an external perspective view of an embodiment of the device of the present invention, and Fig. 4 is FIG. 5 is an external perspective view of another embodiment of the device of the present invention, and FIG. 6 is a sectional view of the main part of the mold used for molding the same device. . DESCRIPTION OF SYMBOLS 1...Semiconductor substrate support, 2...Outer resin, 3...Side surface, 4...Main flat surface, 5... Peripheral flat surface (third surface), 6...
... Inclined surface (third surface), 7 ... Mold, 8 ...
...External electrode body.
Claims (5)
、前記主要平坦面を取り囲んで第３の面を備えたことを
特徴とする樹脂封止形半導体装置。(1) A resin-molded semiconductor device characterized in that a third surface surrounding the main flat surface is provided between the main flat surface and the surrounding side surfaces of the resin molded envelope.
円形の内にあり、第３の面と段をなしたことを特徴とす
る実用新案登録請求の範囲第１項に記載の樹脂封止形半
導体装置。(2) The resin sealing according to claim 1 of the utility model registration claim, characterized in that the main flat surface is within a circular or elliptical shape inscribed in the surrounding side surfaces and forms a step with the third surface. shaped semiconductor device.
、Ｏｍｍの範囲にあることを特徴とする実用新案登録請
求の範囲第２項に記載の樹脂封止形半導体装置。(3) The difference in level between the main flat surface and the third surface is 0.0!5~1
, Omm.
前記主要平坦面とに交差する傾斜面をなしたことを特徴
とする実用新案登録請求の範囲第１項に記載の樹脂封止
形半導体装置。(4) The resin-sealed type according to claim 1, wherein the third surface surrounding the main flat surface is an inclined surface that intersects the surrounding side surfaces and the main flat surface. Semiconductor equipment.
が１〜２ｒｒａｎの範囲トあることを特徴とする実用新
案登録請求の範囲第４項に記載の樹脂封止形半導体装置
。(5) The resin-sealed semiconductor device according to claim 4, wherein the width of the third surface intersecting the main flat surface and the surrounding side surfaces is in the range of 1 to 2 rran. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7400182U JPS58175640U (en) | 1982-05-19 | 1982-05-19 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7400182U JPS58175640U (en) | 1982-05-19 | 1982-05-19 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58175640U true JPS58175640U (en) | 1983-11-24 |
Family
ID=30083477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7400182U Pending JPS58175640U (en) | 1982-05-19 | 1982-05-19 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175640U (en) |
-
1982
- 1982-05-19 JP JP7400182U patent/JPS58175640U/en active Pending
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