JPS592152U - Chip carrier with lead - Google Patents

Chip carrier with lead

Info

Publication number
JPS592152U
JPS592152U JP9589182U JP9589182U JPS592152U JP S592152 U JPS592152 U JP S592152U JP 9589182 U JP9589182 U JP 9589182U JP 9589182 U JP9589182 U JP 9589182U JP S592152 U JPS592152 U JP S592152U
Authority
JP
Japan
Prior art keywords
chip carrier
lead
width
leads
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9589182U
Other languages
Japanese (ja)
Inventor
小野　道夫
杉浦　力夫
昭弘 窪田
強 青木
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9589182U priority Critical patent/JPS592152U/en
Publication of JPS592152U publication Critical patent/JPS592152U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係るリード付チップキャリアの斜視図
、第２図ないし第４図は本考案に係るリードの各別の例
を示す正面図である。 １・・・モールド体、２・・・リード、２ａ・・・根元
部、２ｂ・・・テーパ部、２Ｃ・・・先端部。FIG. 1 is a perspective view of a chip carrier with leads according to the present invention, and FIGS. 2 to 4 are front views showing different examples of the leads according to the present invention. DESCRIPTION OF SYMBOLS 1... Mold body, 2... Lead, 2a... Root part, 2b... Taper part, 2C... Tip part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップを封止した絶縁性モールド体の外周部より
複数のリードが突出し、該リードが該絶縁性モールド体
にそって折り曲げられたリード付チップキャリアにおい
て、上記リードの根元部の幅が先端部の幅より広く、且
つ両者の中間にテーパ部が形成されて成ることを特徴と
するリード付チップキャリア。In a lead-equipped chip carrier in which a plurality of leads protrude from the outer periphery of an insulating molded body in which a semiconductor chip is sealed, and the leads are bent along the insulating molded body, the width of the base of the leads is equal to the width of the tip. A chip carrier with leads, characterized in that the width is wider than the width of the chip carrier, and a tapered part is formed in the middle between the two.
JP9589182U 1982-06-28 1982-06-28 Chip carrier with lead Pending JPS592152U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9589182U JPS592152U (en) 1982-06-28 1982-06-28 Chip carrier with lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9589182U JPS592152U (en) 1982-06-28 1982-06-28 Chip carrier with lead

Publications (1)

Publication Number Publication Date
JPS592152U true JPS592152U (en) 1984-01-09

Family

ID=30228780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9589182U Pending JPS592152U (en) 1982-06-28 1982-06-28 Chip carrier with lead

Country Status (1)

Country Link
JP (1) JPS592152U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029402A (en) * 2009-07-24 2011-02-10 Daishinku Corp Lead type electronic component and lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317276A (en) * 1976-07-30 1978-02-17 Amp Inc Integrated circuit package and method of manufacture thereof
JPS5827354A (en) * 1981-07-27 1983-02-18 テキサス・インスツルメンツ・インコ−ポレイテツド Carrier for integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317276A (en) * 1976-07-30 1978-02-17 Amp Inc Integrated circuit package and method of manufacture thereof
JPS5827354A (en) * 1981-07-27 1983-02-18 テキサス・インスツルメンツ・インコ−ポレイテツド Carrier for integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029402A (en) * 2009-07-24 2011-02-10 Daishinku Corp Lead type electronic component and lead frame

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