JP2011029402A - Lead type electronic component and lead frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead type electronic component and a lead frame, capable of preventing deterioration in electric characteristics of the lead type electronic component because of heat in mounting the electronic component onto a wiring board. <P>SOLUTION: The lead type electronic component includes: a pad 7, a pad 8 and a pad 9 which are adjacently disposed; and a lead terminal 1, a lead terminal 2 and a lead terminal 3 which are provided to extend respectively in the same direction from the pads 7, 8 and 9. The lead terminals 1, 2 and 3 are each equipped with a narrow pitch portion having a narrow pitch between the adjacent lead terminals (portion shown by a region D1 in the figure), and a wide pitch portion having a wide pitch between the adjacent lead terminals (portion shown by a region D3 in the figure), the narrow pitch portion is arranged closer to the pads 7, 8 and 9 than the wide pitch portion, and an at least one lead terminal in the lead terminals 1, 2 and 3 is equipped with first protruding pieces 12, 12 on the wide pitch portion. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a lead-type electronic component including a plurality of pad portions and a plurality of lead terminals extending from each pad portion, and a lead frame.

  The lead type electronic component is mounted on the wiring board by electrically connecting the through hole and the lead terminal by soldering with the lead terminal of the electronic component inserted into the through hole of the wiring board, for example.

  As an example of a method for mounting a lead type electronic component on a wiring board in such a procedure, there is an electronic component mounting method disclosed in Japanese Patent Laid-Open No. 2005-26457 of the following Patent Document 1.

JP 2005-26457 A

  Normally, when lead-type electronic components are mounted on a wiring board, they are melted at the joint between the lead terminal and the through hole in order to electrically connect the through hole and the lead terminal with solder. In this case, it is necessary to supply the solder or to melt the solder supplied to the joint portion between the lead terminal and the through hole. When the lead terminal is joined to the through hole, the lead terminal and the wiring board are heated. The heat applied to the lead terminal spreads over the entire lead terminal, and further, this heat reaches a part or member connected (connected) to the lead terminal. For this reason, there is a problem that the electrical characteristics of the lead-type electronic component may deteriorate due to this heat.

  The present invention was devised to solve such problems. The purpose of the present invention is to deteriorate the electrical characteristics of the lead-type electronic component due to heat when the lead-type electronic component is mounted on the wiring board. An object of the present invention is to provide a lead-type electronic component and a lead frame that can prevent this.

  In order to solve the above-described problem, a lead-type electronic component (hereinafter referred to as an electronic component) according to the present invention includes a plurality of pad portions and a plurality of lead terminals extending in the same direction from each pad portion. The plurality of lead terminals are arranged adjacent to each other, and each lead terminal has a narrow pitch portion where the pitch between the adjacent lead terminals is narrow and a wide pitch portion where the pitch between the adjacent lead terminals is wide. The narrow pitch portion is disposed closer to the plurality of pad portions than the wide pitch portion, and at least one lead terminal of the plurality of lead terminals has a first protruding piece on the wide pitch portion. It has a configuration with.

  According to the electronic component according to the present invention, by having such a configuration, heat conduction from the lead terminal to the pad portion can be suppressed by the first protruding piece, and the pad portion is excessive. Can be prevented from being heated. As a result, it is possible to prevent the electrical characteristics of the electronic component from deteriorating due to heat when the electronic component is mounted on the wiring board. Furthermore, since the first projecting piece is provided at the wide pitch portion, the lead terminal arranged adjacent to the lead terminal provided with the first projecting piece and the first projecting piece are in contact with each other. Can be prevented. Further, for example, the distance from the first protruding piece to the pad portion can be increased as compared with the case where the first protruding piece is provided in the narrow-pitch region, so that the first protruding piece is made larger. It is possible to form (widely) and more reliably suppress heat conduction to the pad portion.

  Moreover, the electronic component which concerns on this invention WHEREIN: The taper shape which becomes narrow as the said 1st protrusion piece leaves | separates from the said pad part may be sufficient.

  With such a configuration, when the electronic component according to the present invention is mounted on the wiring board, the first protruding piece is press-fitted into the through hole of the wiring board, so that the electronic component according to the present invention is stronger than the wiring board. The electronic component according to the present invention can be fixed, and the electronic component according to the present invention can be removed (or is likely to come off and float), and the electronic component according to the present invention can be mounted in a tilted state with respect to the wiring substrate. Can be prevented.

  Further, in the electronic component according to the present invention, the lead terminal including the first protruding portion includes a second protruding piece having a tapered shape that becomes narrower as the distance from the pad portion increases in the wide pitch portion. The first projecting piece may be arranged closer to the pad portion than the second projecting piece.

  With such a configuration, a part of the heat applied (generated) to the lead terminal when mounting the electronic component according to the present invention on the wiring board is retained on the first protruding piece and the second protruding piece. Thus, heat conduction to the pad portion can be suppressed. Further, when the electronic component according to the present invention is mounted on the wiring board, the second protruding piece having a tapered shape is press-fitted into the through hole of the wiring board, thereby making the electronic component according to the present invention stronger to the wiring board. The electronic component according to the present invention can be fixed, and the electronic component according to the present invention can be removed (or is likely to come off and float), and the electronic component according to the present invention can be mounted in a tilted state with respect to the wiring substrate. Can be prevented.

  Moreover, the electronic component which concerns on this invention WHEREIN: The structure which protruded rather than the said 2nd protrusion piece may be sufficient as a said 1st protrusion piece. Specifically, the first projecting piece may be configured to project in the width direction of the lead terminal from the second projecting piece.

  With such a configuration, when the electronic component according to the present invention is mounted on the wiring board, the second projecting piece is press-fitted into the through hole, so that the electronic component according to the present invention is firmly fixed to the wiring board. it can. Further, a portion of the first projecting piece that protrudes from the second projecting piece can be brought into contact with the wiring board, and the electronic component according to the present invention can be placed in the height direction (the extension of the lead terminal) with respect to the wiring board. The position in the installation direction (the length direction of the lead terminal) can be a desired position.

  Further, in the electronic component according to the present invention, a plurality of pad portions, a plurality of lead terminals respectively extending in the same direction from each pad portion, and a tie bar portion connecting the wide pitch portions of the plurality of lead terminals, The pad portion and the lead terminal are formed by using a lead frame including: the first protruding piece is a part of the tie bar portion at the time of tie bar cutting that cuts the tie bar portion and individually divides a plurality of lead terminals. The structure formed by leaving may be sufficient.

  With such a configuration, the first projecting piece can be provided without adding a new part to the lead frame.

  Further, in the electronic component according to the present invention, the plurality of pad portions have different volumes, and at least two of the plurality of lead terminals each include the first projecting piece, and the pad having a small volume. The volume of the first protruding piece of the lead terminal including the portion may be larger than the volume of the first protruding piece of the other lead terminal.

  With such a configuration, when the electronic component according to the present invention is mounted on the wiring board, the pad portion having a small volume can be prevented from being heated more excessively than the other pad portions. When a plurality of the first projecting pieces are provided for one lead terminal, the total volume of all the first projecting pieces is the sum of the first projecting pieces of the one lead terminal. Volume.

  The lead frame according to the present invention includes a plurality of pad portions, a plurality of lead terminals extending from the respective pad portions in the same direction, and a tie bar portion connecting the plurality of lead terminals. The terminals are arranged adjacent to each other, and each lead terminal includes a narrow pitch portion where the pitch between the adjacent lead terminals is narrow and a wide pitch portion where the pitch between the adjacent lead terminals is wide, the narrow pitch portion Is arranged on the side of the pad portion with respect to the wide pitch portion, and the tie bar portion connects the wide pitch portions.

  According to the present invention, the electronic component according to the present invention including the first projecting piece can be manufactured by cutting the tie bar portion with the projecting shape of the first projecting piece remaining. In addition, since the wide pitch portions are connected by the tie bar portion, even if the precision of the mold used at the time of tie bar cutting is relaxed, a part of the lead terminal is not cut by mistake.

  In the lead frame according to the present invention, at least one lead terminal of the plurality of lead terminals is a second protrusion having a tapered shape that becomes narrower as the distance from the pad portion increases in the wide pitch portion. A piece may further be provided, and the tie bar portion may be disposed closer to the pad portion than the second protruding piece. Accordingly, the first projecting piece and the second projecting piece are obtained by tie-bar cutting the tie bar portion in a state in which the projecting shape of the first projecting piece remains with respect to the lead terminal provided with the second projecting piece. It is possible to manufacture an electronic component according to the present invention including:

  According to the electronic component of the present invention, it is possible to prevent the electrical characteristics of the electronic component of the present invention from deteriorating due to heat when the electronic component of the present invention is mounted on a wiring board.

It is the schematic block diagram which showed the state which mounted the electronic component which concerns on one Embodiment of this invention on the wiring board. It is a schematic block diagram of the electronic component which concerns on one Embodiment of this invention. It is a schematic block diagram of the electronic device which concerns on one Embodiment of this invention. It is a partial schematic block diagram of a lead frame according to an embodiment of the present invention. It is a schematic plan view of the pad part which concerns on one Embodiment of this invention. It is a partial schematic plan view of Modification 1 of the lead terminal according to the embodiment of the present invention. It is a partial schematic plan view of Modification Example 2 of the lead terminal according to the embodiment of the present invention. It is a partial schematic plan view of Modification 3 of the lead terminal according to the embodiment of the present invention. It is the schematic block diagram which showed the state which mounted the electronic component provided with the lead terminal shown in FIG. 8 on the wiring board. It is a partial schematic block diagram of the lead frame which concerns on the other form of one Embodiment of this invention. It is a partial schematic plan view of Modification 4 of the lead terminal according to the embodiment of the present invention. It is a partial schematic plan view of Modification Example 5 of the lead terminal according to the embodiment of the present invention. It is a partial schematic block diagram which showed the state which mounted the electronic component provided with the lead terminal shown in FIG. 12 on the wiring board. It is a schematic plan view of the modification 1 of the pad part which concerns on one Embodiment of this invention. It is a schematic block diagram of the modification 2 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 3 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 4 of the pad part which concerns on one Embodiment of this invention. It is a schematic block diagram of the modification 5 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 6 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 7 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 8 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 9 of the pad part which concerns on one Embodiment of this invention. It is a schematic sectional drawing of the modification 10 of the pad part which concerns on one Embodiment of this invention. It is a schematic plan view of the modification 11 of the pad part which concerns on one Embodiment of this invention. It is a schematic side view of the modification 12 of the pad part which concerns on one Embodiment of this invention. It is a schematic perspective view of the modification 1 of the resin package part which concerns on one Embodiment of this invention. It is a schematic perspective view of the modification 2 of the resin package part which concerns on one Embodiment of this invention. It is a schematic perspective view of the modification 3 of the resin package part which concerns on one Embodiment of this invention. It is a schematic perspective view of the modification 4 of the resin package part which concerns on one Embodiment of this invention. It is a schematic perspective view of the modification 5 of the resin package part which concerns on one Embodiment of this invention.

  Embodiments of an electronic component and a lead frame according to the present invention will be described below with reference to the drawings.

  First, an embodiment of an electronic component according to the present invention will be described.

  FIG. 1 is a schematic configuration diagram illustrating a state in which an electronic component 100 according to an embodiment of the present invention is mounted on a wiring board 6, and FIG. 2 is a schematic configuration of the electronic component 100 according to an embodiment of the present invention. FIG.

  The electronic component 100 is a lead-type electronic component, and as shown in FIG. 1, the electronic component 100 is mounted on the wiring board 6 using solder (not shown).

  A wiring pattern (not shown), a through hole 61, a through hole 62, and a through hole 63 (through holes 61 to 63) are formed on the wiring substrate 6 shown in FIG. The through holes 61 to 63 are through holes that are provided with a plating layer (not shown) on the inner wall and penetrate both main surfaces of the wiring board 6.

  As shown in FIG. 2, the electronic component 100 includes a first pad portion 7, a second pad portion 8, a third pad portion 9 (hereinafter referred to as pad portions 7 to 9) as a plurality of pad portions, and a pad portion. The first lead terminal 1, the second lead terminal 2, and the third lead terminal 3 (hereinafter referred to as lead terminals) as a plurality of lead terminals respectively extending from 7 to 9 in the same direction (in the present embodiment, −Y axis direction). 1 to 3). The electronic device 4 is mounted on the mounting surface of each of the pad portions 7 to 9 (in this embodiment, the mounting surface is an XY plane including an X axis and a Y axis orthogonal to the X axis). 7 to 9 and the electronic device 4 are electrically connected.

  In the present embodiment, of both ends of the lead terminal 1, one end on the pad portion 7 side is a base end and the other end is a front end. Of both ends of the lead terminal 2, one end on the pad portion 8 side is a base end and the other end is a front end. Of both ends of the lead terminal 3, one end on the pad portion 9 side is a base end and the other end is a front end. In this embodiment, Cu (copper), 42 alloy (Ni (nickel) alloy), or the like is used as the base material of the lead terminal, and the surface of the base material is subjected to base plating such as Ni. Further, Ag (silver) plating, Au (gold) plating, or the like is applied.

  The pad portions 7 to 9 are a portion to which the electronic device 4 is bonded and a portion around the portion (a portion indicated by a region D0), and a width (X-axis direction (+ X-axis direction and −X-axis) in the pad portions 7 to 9. (Dimension in the axial direction) is wider than the width of the lead terminals 1 to 3 (dimension in the X-axis direction (+ X-axis direction and -X-axis direction)) W0.

  In the electronic component 100, the pad portions 7 to 9 and the electronic device 4 are resin-sealed by a resin package portion 5 formed using an insulating resin. Here, a part of the base end side of each of the lead terminals 1 to 3 is also resin-sealed by the resin package part 5.

  The lead terminals 1 to 3 are arranged adjacently in order along the + X axis direction. The lead terminal 1 extends from the pad portion 7 in the −Y axis direction, the lead terminal 2 extends from the pad portion 8 in the −Y axis direction, and the lead terminal 3 extends from the pad portion 9 in the −Y axis direction. ing. That is, these lead terminals 1 to 3 are extended from the pad portions 7 to 9 in the −Y axis direction which is the same direction. In this embodiment, the lead terminal 1 is a lead terminal (for Vdd) for inputting a power supply voltage, the lead terminal 2 is a ground terminal for GND (ground), and the lead terminal 3 takes out an output. This is a lead terminal (for output). The combination (extended state) of the lead terminals 1 to 3 and the pad portions 7 to 9 shown in this embodiment is merely an example, and can be arbitrarily changed according to the specifications of the electronic component 100 and the like.

  Moreover, although not shown, the plating layers on the inner walls of the through holes 61 to 63 and the lead terminals 1 to 3 are electrically connected using solder or the like.

  The electronic device 4 is, for example, a surface-mount type piezoelectric vibration device, and includes a crystal oscillator, a crystal resonator, a crystal filter, or a surface acoustic wave device. When such a surface-mount type electronic device is used as the electronic device 4, the surface-mount type electronic device can be widely used as a lead-type electronic component, and the manufacturing cost of the electronic component can be reduced.

  In the present embodiment, a case where a crystal oscillator is used as the electronic device 4 will be described.

  FIG. 3 is a cross-sectional view showing an example of the electronic device 4 according to an embodiment of the present invention.

  As shown in FIG. 3, the electronic device 4 includes a housing 14 including an insulating base 34 made of a ceramic multilayer substrate and a lid 24 that covers an opening portion of the stepped recess 341.

  In this electronic device 4, the contact portion (outer peripheral edge portion) between the base 34 and the lid 24 is joined by a sealing joining material (not shown), and the inside (cavity) of the housing 14 is hermetically sealed by this joining. Has been.

  The lid 24 is formed using a conductive material such as metal, and is electrically connected to the pad portion 8 formed integrally with the GND lead terminal 2 to remove noise. The lid 24 is not limited to a conductive material, and may be formed using an insulating material such as ceramic. Further, although not shown, the lid 24 and the pad portion 8 are preferably electrically connected via a wiring pattern or a wire formed on the housing 14.

  The base 34 is provided with a stepped recess 341 as a cavity on one surface (the surface on the upper side of the paper (hereinafter referred to as the upper side)).

  In the stepped recess 341, two steps are provided. A crystal vibrating piece 54 in which a pair of excitation electrodes (not shown) is formed on both main surfaces is placed on the upper step of the stepped recess 341 (the stepped portion closest to the opening of the stepped recess 341). The end portion of the crystal vibrating piece 54 is supported by at least a part of the upper step portion 342.

  A plurality of electrode pads (not shown) are provided on the upper step 342 of the stepped recess 341, and the excitation electrodes of the crystal vibrating piece 54 are formed on the plurality of electrode pads using the conductive bonding material 741 and the conductive bonding material 742. It is joined. Note that the two conductive bonding materials 741 and 742 are disposed at the same position in the cross-sectional view shown in FIG. 3, and on the front side of the paper (hereinafter referred to as the front side) and the back side of the paper (hereinafter referred to as the back side). It is arranged. Note that a resinous adhesive, a metal bump, a plating bump, or the like may be used as the conductive bonding materials 741 and 742.

  An integrated circuit element 64 including an amplifier circuit is placed on the bottom surface 343 of the stepped recess 341. The integrated circuit element 64 includes a plurality of external electrodes (not shown), and the plurality of external electrodes of the integrated circuit element 64 are provided on a lower step portion of the stepped recess 341 (on the bottom surface 343 side than the upper step portion 342). Further, a plurality of electrode pads (not shown) provided on the step 344 are wire-bonded via a plurality of wires 84, respectively. Instead of wire bonding using the wire 84, flip chip bonding (FCB) using metal bumps may be used.

  3 includes a first external electrode 41, a second external electrode 42, a third external electrode 43, and a fourth external electrode 44 (hereinafter referred to as external electrodes 41 to 44) as a plurality of external electrodes. (See FIG. 2). These external electrodes 41 to 44 are formed on the outer surface of the base 34 (the lower surface of the paper (hereinafter referred to as the lower side)). For example, the external electrode 41 is electrically connected to the Vdd external electrode (for inputting the power supply voltage) of the integrated circuit element 64, and the external electrode 42 is the OE (integrated circuit element) of the integrated circuit element 64. The external electrode 43 is electrically connected to the GND excitation electrode of the quartz crystal vibrating piece 54 and the GND external electrode of the integrated circuit element 64. The external electrode 44 is electrically connected to an output external electrode (for extracting the output of the integrated circuit element 64) of the integrated circuit element 64. In FIG. 3, the external electrode 41 and the external electrode 42 are illustrated in a state of being overlapped on the front side and the back side, and the external electrode 43 and the external electrode 44 are illustrated in a state of being overlapped on the front side and the back side. Has been.

  At least a part of the excitation electrode of the crystal vibrating piece 54 placed on the upper step 342 of the stepped recess 341 and the external electrode of the integrated circuit element 64 placed on the lower step 343 of the stepped recess 341. Is electrically connected to at least a part of the electronic device 4 according to the specifications of the electronic device 4.

  In the electronic component 100 shown in FIG. 2, the external electrodes 41 to 44 of the electronic device 4 are mounted facing (facing) the mounting surfaces of the pad portions 7 to 9. In such a state, in the electronic component 100, the external electrode 41 and the external electrode 42 are provided on the surface of the pad portion 7, the external electrode 43 is provided on the surface of the pad portion 8, and the external electrode 44 is provided on the pad portion 9 with solder (not shown). Each is fixed and connected. In the electronic component 100 shown in FIG. 1, not only the external electrode 41 but also the external electrode 42 is connected to the surface of the pad portion 7 for the purpose of always turning on the electronic device 4 when the power supply voltage is input. The power supply voltage is input. However, in the present invention, the number of the pad portions, the number of the lead terminals, and the connection state between the pad portions 7 to 9 and the external electrodes 41 to 44 are not limited to those shown in FIG. It can be changed as appropriate according to 100 specifications. In addition, for the connection between the pad portions 7 to 9 and the external electrodes 41 to 44, a conductive adhesive may be used instead of the solder, or an FCB using Au bumps may be used. Further, the electronic device 4 may be mounted with the external electrodes 41 to 44 of the electronic device 4 facing away from the mounting surface of the pad portions 7 to 9. In this case, a wire is used instead of the solder. Connect using.

  As shown in FIG. 2, the lead terminals 1 to 3 have a narrow pitch portion (a portion indicated by a region D1 in the drawing) where the pitch P1 between adjacent lead terminals is narrow and a wide pitch P2 between the adjacent lead terminals. And a pitch portion (a portion indicated by a region D3 in the drawing). The narrow pitch portion is arranged closer to the base end side (pad portion 7 to 9 side) of each of the lead terminals 1 to 3 than the wide pitch portion. In the electronic component 100 shown in FIG. 1, in order to provide the narrow pitch portion and the wide pitch portion, the lead terminal 1 and the lead terminal 3 are disposed between the narrow pitch portion and the wide pitch portion. (A site indicated by a region D2 in the drawing) is composed of skewed portions that are separated from the lead terminals 2 from the base end side toward the tip end side.

  Note that the pitch of the lead terminals 1 to 3 (the dimension of the gap between the lead terminals 1 to 3 in the X-axis direction) is the specification of the electronic device 4 mounted on the pad portions 7 to 9 (for example, external shape, external electrode, etc. ) And the specifications of the wiring board 6 (for example, the interval between the through holes 61 to 63, etc.).

  In the electronic component 100 shown in FIG. 2, two first projecting pieces 12, 12 are provided at a wide pitch portion of the lead terminal 2.

  Of the two first projecting pieces 12, 12, one first projecting piece 12 is provided on the end surface on the lead terminal 1 side of the lead terminal 2, and the direction close to the lead terminal 1 from this end surface (of the lead terminal 2. The other first protruding piece 12 protrudes in the width direction (−X-axis direction), and is provided on the end surface of the lead terminal 2 on the lead terminal 3 side, and the direction close to the lead terminal 3 from this end surface (lead terminal). 2 in the + X-axis direction).

  The total dimension (W1 + W1 + W0) of the width (dimension in the X-axis direction (protrusion direction)) W1 of each first projecting piece 12, 12 and the width W0 of the lead terminal 2 is equal to the through hole 62 of the wiring board 6 shown in FIG. Since the diameter is larger, when mounting the electronic component 100 on the wiring board 6, the first projecting pieces 12, 12 are not inserted into the through holes 62, but on the mounting surface (upper surface in FIG. 1) 60. Abut. Therefore, the first projecting pieces 12 and 12 can perform positioning with the position in the height direction (Y-axis direction (+ Y-axis direction and −Y-axis direction)) of the electronic component 100 with respect to the wiring board 6 as a desired position. it can.

  In FIG. 2, the boundary between the lead terminal 2 and the first projecting pieces 12 and 12 is indicated by a two-dot chain line, but actually, the lead terminal 2 and the first projecting pieces 12 and 12 are integrally formed. ing. In the electronic component 100 shown in FIG. 2, the lead terminal 2 is provided with two rectangular first protruding pieces 12 and 12, but the lead terminal provided with the first protruding piece is not limited to the lead terminal 2, Is not limited to a rectangle, and the number of first protruding pieces is not limited to two.

  Next, a lead frame used when manufacturing the electronic component 100 shown in FIG. 2 will be described with reference to the drawings.

  FIG. 4 is a partial schematic configuration diagram of a lead frame 10 according to an embodiment of the present invention.

  In the present embodiment, description will be made using a lead frame 10 capable of simultaneously manufacturing a plurality of electronic components 100, and FIG. 4 shows only a region corresponding to one electronic component in the lead frame 10.

  The lead frame 10 is formed by patterning a metal plate using, for example, etching or punching using a mold.

  The lead frame 10 includes pad portions 7 to 9, lead terminals 1 to 3 extending from the pad portions 7 to 9 in the −Y axis direction, two support frames 20 and 20 extending in the X axis direction, Two crosspiece frames 30, 30 extending in the Y-axis direction passed so as to be bridged between the support frames 20, 20, and extending in the X-axis direction where both ends are connected to the two crosspiece frames 30, 30, respectively. And a tie bar portion 40. In FIG. 4, the two support frames 20 are shown on the upper side and the lower side, and the two cross frames 30 and 30 are shown on the left side (hereinafter referred to as the left side) and on the right side (hereinafter referred to as the right side). Has been. The length direction of the support frames 20 and 20 and the tie bar portion 40 is the X-axis direction, and the length direction of the crosspiece frames 30 and 30 is the Y-axis direction. One end of each crosspiece frame 30, 30 is connected to the upper support frame 20, and the other end of each crosspiece frame 30 is connected to the lower support frame 20.

  Lead ends of the lead terminals 1 to 3 are connected to the lower support frame 20, and the wide pitch portions of the lead terminals are connected by a tie bar portion 40.

  As shown in FIG. 5, the pad portions 7 and 9 include positioning portions for determining positions (mounting positions) on which the electronic devices 4 are mounted on the mounting surfaces 70 and 90 (XY plane). FIG. 5 is a schematic plan view of the pad portions 7 to 9 according to the embodiment of the present invention. FIG. 5 also shows the mounting position of the electronic device 4 using a two-dot chain line.

  As shown in FIG. 5, the positioning portions are a notch portion 71 provided in the pad portion 7 and a notch portion 91 provided in the pad portion 9.

  The cutout portion 71 is formed by cutting out the upper left corner (not shown) of the pad portion 7 in the drawing, and the upper end surface (upper end surface in the X axis direction) of the pad portion 7 and the left end surface of the drawing (in the Y axis direction). It is a slope (surface inclined at an angle set in advance with respect to the X-axis direction and the Y-axis direction) connecting to the left end surface). The cutout portion 91 is formed by cutting out the upper right corner (not shown) of the pad portion 9 on the paper surface, and the upper end surface (upper surface in the X axis direction) of the pad portion 9 and the right end surface of the paper surface (in the Y axis direction). It is a slope that connects to the right end surface.

  When the electronic device 4 is mounted on the pad units 7 to 9, first, image data of the pad units 7 to 9 is acquired using an imaging device or the like, and image processing is performed on the image data using an arithmetic processing unit or the like. A reference line L for determining the mounting position of the electronic device 4 in the −Y plane is obtained. The reference line L includes a reference point 711 (here, one end on the left side) that is a preset part of the notch 71 and a reference point 911 (here, one end on the right side) that is a preset part of the notch 91. ). When the electronic device 4 is mounted on the pads 7 to 9, the mounting position in the X-axis direction is determined based on the reference point 711 or the reference point 911, and the mounting position in the Y-axis direction is determined based on the reference line L. Note that the electronic device 4 may be transported by determining only one of the mounting position in the X-axis direction and the mounting position in the Y-axis direction.

  In FIG. 5, in order to more clearly show the reference line L, the electronic device 4 is illustrated in a state of being separated from the reference line L, but the upper end surface of the electronic device 4 overlaps the reference line L. Positioning may be performed, and positioning may be performed in a state where the reference line L and the electronic device 4 are separated by a preset distance as illustrated.

  When the positioning part is provided, the contact area between the resin package part 5 and the pad parts 7 and 9 can be increased. As a result, it is possible to prevent the lead terminals 1 and 3 including the pad portions 7 and 9 from dropping out of the resin package portion 5.

  As described above, according to the electronic component 100 according to the present embodiment, when the electronic device 4 is mounted on the pad portions 7 to 9, the mounting position can be determined with high accuracy. The reliability of the electrical connection between the parts 7 to 9 can be increased. Moreover, the said positioning part shows the mounting position of the electronic device 4 in the mounting surface (said XY plane) in the pad parts 7-9, and such a positioning part is provided in the pad parts 7-9. Thus, the electronic device 4 can be accurately placed at a preset position on the mounting surface.

  Next, a procedure for manufacturing the electronic component 100 using the lead frame 10 will be described.

  When the electronic component 100 shown in FIG. 2 is formed, first, the electronic device 4 is mounted on the pad portions 7 to 9 of the lead frame 10 shown in FIG. 4 (device mounting process). In the device mounting step, first, after the mounting position of the electronic device 4 in the pad portions 4 to 9 is determined by the above-described procedure, a screen is formed in a region where the external electrodes 41 to 44 are joined later in the pad portions 7 to 9. Apply cream solder by printing. After the cream solder is applied, the electronic device 4 is transported and placed at the mounting position, and the cream solder is melted by a reflow soldering apparatus or the like, and the external electrodes 41 to 44 are heated and welded to the pad portions 7 to 9. The external electrodes 41 to 44 are electrically and mechanically connected to the pad portions 7 to 9. As the cream solder, lead-free cream solder containing lead-free solder or the like is used. The lead-free solder preferably has a high melting point in order to prevent remelting after mounting. For example, SnAg solder containing Sn (tin) and Ag (melting point is about 221 degrees), Sn and Cu are used. SnCu solder containing (melting point is about 227 degrees), SnAgCu solder containing Sn, Ag, and Cu (melting point is about 217 degrees to about 220 degrees), and SnSb solder containing Sn and antimony (Sb) ( The melting point is about 245 degrees to about 250 degrees).

  After performing the device mounting step, the resin package portion 5 for resin-sealing the pad portions 7 to 9 and the electronic device 4 is formed (resin molding step). Here, as shown in FIG. 2, part of the base end side of each of the lead terminals 1 to 3 may also be resin-sealed by the resin package portion.

  After performing the resin molding step, the tie bar part 40 is cut using a tie bar cutting device equipped with a tie bar cut die (punch die) and a tie bar cut punch (punch blade) (tie bar cut step). In the present embodiment, in this tie bar cutting step, a portion of the tie bar portion 40 that connects the lead terminal 1 and the lead terminal 2 and a portion that connects the lead terminal 2 and the lead terminal 3 are The first projecting pieces 12 and 12 are formed by cutting a tie bar so as to leave a portion connected to the lead terminal 2. Specifically, the portion indicated by Lcut1 in FIG. 4 of the tie bar portion 40 and the boundary between the lead terminal 1 and the boundary with the lead terminal 3 are cut off, although not shown. Generally, when cutting the tie bar portion 40 with a tie bar cutting device, in order to prevent the cutting position from being shifted and a part of the lead terminal 1 and the lead terminal 3 from being accidentally cut, in practice, the lead terminal 1 Further, a position on the tie bar part side (a position away from the lead terminal 1 and the lead terminal 3) is cut slightly from each boundary between the lead terminal 3 and the tie bar part 40. In the present embodiment, since the tie bar portion 40 connects the wide pitch portions of the lead terminals 1 to 3, the lead terminals 1 to 3 are compared with the case where the narrow pitch portions of the lead terminals 1 to 3 are connected. The lead terminals 1 to 3 can be reliably separated even if the positions further away from the lead are cut. Thereby, the precision which concerns on the cutting position of a tie bar cutting device can be eased.

  After performing the tie bar cutting step, the lead terminals 1 to 3 are cut from the support frame 20 to individually separate the electronic components 100 (trimming step) to obtain the electronic component 100 shown in FIG.

  In addition, you may add the forming process for removing the burr | flash produced when forming the resin package part 5 and adjusting the shape of the lead terminals 1-3 to the procedure mentioned above as needed.

  When the electronic component 100 manufactured by the above manufacturing process is mounted on the wiring board 6, first, the lead terminal 1 is inserted into the through hole 61, the lead terminal 2 is inserted into the through hole 62, and the lead terminal 3 is inserted into the through hole 63. Thus, the electronic component 100 is arranged on the wiring board 6. After the arrangement as described above, the wiring board 6 is put into a dip tank to dip the solder. Specific examples of the solder include lead-free solder, for example, SnAg solder including Sn and Ag, SnCu solder including Sn and Cu, SnAgCu solder including Sn, Ag and Cu, and Sn. And SnSb solder containing antimony.

  In general, these lead-free solders have a higher melting point than solders containing lead. Therefore, the heat applied to the lead terminals 1 to 3 when the electronic component 100 is mounted on the wiring board 6 is also transmitted to the pad portions 7 to 9, and the pad portions 7 to 9 (particularly the pad portion 8 having a small volume) are excessively formed. There is a concern that the element (for example, the integrated circuit element 64) included in the electronic device 4 is destroyed by heat and the electronic component 100 is destroyed by being heated. Further, the pad portions 7 to 9 (particularly the pad portion 8 having a small volume) are excessively heated, so that the solder between the electronic device 4 and the pad portions 7 to 9 (particularly the pad portion 8 having a small volume) is formed. There is also a concern that the electrical connection between the external electrodes 41 to 44 of the electronic device 4 and the pad portions 7 to 9 is lowered and the electrical characteristics of the electronic component 100 are deteriorated due to remelting.

  On the other hand, as shown in FIGS. 1 and 2, the electronic component 100 according to the present embodiment includes the first protruding pieces 12 and 12 on the lead terminal 2 extended from the pad portion 8 having a small volume. Since a part of the heat can be retained in the first projecting pieces 12, 12, heat conduction to the pad portion 8 can be suppressed, and the pad portion 8 can be prevented from becoming excessively hot. Therefore, when the electronic component 100 is mounted on the wiring board 6, it is possible to prevent the integrated circuit element 64 from being destroyed and the solder between the pad portion 8 and the external electrode 43 from being remelted. . As a result, it is possible to prevent the electronic component 100 from being destroyed or the electrical characteristics of the electronic component 100 from being deteriorated by heat during mounting.

  Further, in order to more reliably prevent remelting of solder or the like between the pad portions 7 to 9 and the external electrodes 41 to 44, the solder used for connection between the pad portions 7 to 9 and the external electrodes 41 to 44 can be prevented. The melting point is preferably the same as the melting point of the solder used for connecting the electronic component 100 and the wiring board 6 or higher than the melting point of the solder used for connecting the electronic component 100 and the wiring board 6. Specifically, when SnAgCu-based solder is used as the solder for connecting the electronic component 100 and the wiring board 6, SnAg-based solder is used as the solder for connecting the pad portions 7 to 9 and the external electrodes 41 to 44. It is preferable to use solder, SnCu solder, or SnSb solder, and it is more preferable to use SnSb solder because it has the highest melting point.

  In addition, the magnitude | size (volume), arrangement | positioning, and the number of every lead terminals 1-3 of the above-mentioned 1st protrusion piece are examples, and can be suitably changed according to the magnitude | size etc. of the pad parts 7-9. For example, when the pad portion 8 is larger than the pad portions 7 and 9, the lead terminal 2 is not provided with the first protruding piece, and the lead terminals 1 and 3 have the first protrusion. A piece may be provided.

  Further, the shape of the first protruding piece described above is an example, and can be changed as appropriate. Further, the dimension (width dimension) in the projecting direction (X-axis direction) of the first projecting pieces 12 and 12 of the lead terminal 2 is not limited to the dimensions shown in FIGS. 1 and 2 and can be arbitrarily set. is there. Specifically, a configuration in which the lead terminals 1 and 3 are provided with first projecting pieces and the dimensions (width dimensions) of the projecting direction (X-axis direction) of the first projecting pieces 12 and 12 of the lead terminal 2 are changed is shown in FIG. Shown in

  FIG. 6 is a schematic configuration diagram of Modification 1 of the lead terminals 1 to 3 according to the embodiment of the present invention. FIG. 6 shows only the first projecting piece and the peripheral portion of the lead terminal.

  The lead terminals 1 to 3 shown in FIG. 6 have first projecting pieces 11 and 11 having different volumes according to the respective volumes of the pad portions 7 to 9 instead of the first projecting pieces 12 and 12 shown in FIG. Protruding pieces 12 and 12 and first protruding pieces 13 and 13 are provided. Specifically, the lead terminal 1 includes first protruding pieces 11 and 11, the lead terminal 2 includes first protruding pieces 12 and 12, and the lead terminal 3 includes first protruding pieces 13 and 13, respectively.

  Further, as shown in FIG. 2, the volume of the pad portion 8 is very small compared to the volumes of the pad portion 7 and the pad portion 9. Therefore, the total volume of the first protruding pieces 12, 12 is sufficiently larger than the total volume of the first protruding pieces 11, 11, and the total volume of the first protruding pieces 13, 13. The volume of each of the first protruding pieces 11, 11, the first protruding pieces 12, 12, and the first protruding pieces 13, 13 is set.

  The first protruding pieces 11, 11, the first protruding pieces 12, 12, and the first protruding pieces 13, 13 are the same as the first protruding pieces 12 shown in FIG. 2 except that the cutting position in the tie bar cutting process is changed. In the procedure, the lead frame 10 shown in FIG. 4 is used.

  Moreover, although the above-mentioned 1st protrusion piece 12 shown in FIG. 2 and the 1st protrusion pieces 11-13 shown in FIG. 6 are shape | molded by the planar view rectangle, the planar view shape of a 1st protrusion piece is limited to this. For example, as shown in FIGS. 7 and 8, the first protruding piece may have a tapered shape that becomes narrower as it is separated from the pad portion. Moreover, the trapezoid which became narrow as the shape of the 1st protrusion pieces 11-13 was spaced apart from the pad parts 7-9 may be sufficient.

  7 and 8 are schematic configuration diagrams of modifications 2 and 3 of the lead terminals 1 to 3 according to the embodiment of the present invention. 7 and 8 show only the first projecting piece and the peripheral portion of the lead terminal.

  In the lead terminals 1 to 3 shown in FIG. 7, instead of the rectangular first protruding pieces 12 and 12 shown in FIG. 2, the tapered first protruding pieces 12 and 12 that become narrower as they are separated from the pad portion 8. Is provided in the lead terminal 2. Specifically, the first projecting pieces 12 and 12 have a shape that tapers toward the tip side of the lead terminal 2 (hereinafter referred to as the lead terminal tip side). The first projecting pieces 12 and 12 shown in FIG. 7 have a small dimension on the leading end side of the lead terminal and are easy to insert into the through hole 62 of the wiring board 6.

  The sum of the dimension of the maximum width (maximum width) of each of the two first projecting pieces 12, 12 (dimension in the projecting direction (X-axis direction)) and the width of the lead terminal 2 is the through hole. Slightly larger than 62 diameter.

  In the present embodiment, when at least the first projecting piece has a configuration that becomes narrower toward the leading end side of the lead terminal, the shape of the first projecting piece 12, 12 is referred to as a tapered shape. In the present embodiment, the width of the first protruding piece is a dimension in the X-axis direction.

  Since the first projecting pieces 12 and 12 are tapered, they can be press-fitted into the through holes 62. Thereby, the electronic component 100 can be more firmly fixed to the wiring board 6. As a result, it is possible to prevent the electronic component 100 from being removed from the wiring board 6 (or coming off and floating), and mounting the electronic component 100 in an inclined state with respect to the wiring board 6.

  The first projecting pieces 12 and 12 are formed using the lead frame 10 shown in FIG. 4 in the same procedure as the first projecting piece 12 shown in FIG. 2 except that the cutting position in the tie bar cutting process is changed. .

  In the lead terminals 1 to 3 shown in FIG. 8, the lead terminal 2 shown in FIG. 7 is used, and the lead terminals 1 and 3 are further tapered first projecting pieces 11 that become narrower as the distance from the pad portion 8 increases. 13 are provided. The first protruding piece 11 of the lead terminal 1 is provided on the left end surface of the lead terminal 1 (the end surface on the side where there is no adjacent lead terminal). The first protruding piece 13 of the lead terminal 3 is provided on the right end surface of the lead terminal 3 (the end surface on the side where there is no adjacent lead terminal). The first projecting pieces 11 and 13 are tapered toward the lead terminal tip side of the lead terminals 1 to 7, have a small size on the lead terminal tip side, and are formed in the through holes 61 to 63 of the wiring board 6. The shape is easy to insert (see FIG. 9).

  Further, the sum of the width dimension of the lead terminal 1 and the maximum width dimension of the first protruding piece 11 is slightly larger than the diameter of the through hole 61. The sum of the width dimension of the lead terminal 3 and the maximum width dimension of the first protruding piece 13 is slightly larger than the diameter of the through hole 61.

  The first projecting piece 11 and the first projecting piece 13 are the same procedure as the first projecting piece 12 shown in FIG. 2 except that the cutting position in the tie bar cutting process is changed in the same manner as the first projecting pieces 12 and 12. Thus, the lead frame 10 shown in FIG. 4 is used.

  In FIG. 9, the first protruding piece 11, the first protruding pieces 12, 12 and the entire first protruding piece 13 are completely inserted into the through holes 61 to 63. The maximum widths of the first protruding pieces 12 and 12 and the first protruding piece 13 may be changed, and only a part thereof (a part on the leading end side of the lead terminal) may be inserted into the through holes 61 and 63.

  In this embodiment, the lead frame 10 shown in FIG. 4 is used. However, the present invention is not limited to this, and the lead frame 10 shown in FIG. 10 may be used.

  The lead frame 10 shown in FIG. 10 has a configuration in which two second projecting pieces 22 and 22 are added to the lead frame 10 shown in FIG. Therefore, the content regarding the 2nd protrusion pieces 22 and 22 is described here, and the description is abbreviate | omitted about another structure.

  The second projecting pieces 22 and 22 are provided at the wide pitch portion (the portion indicated by the region D3 in the drawing) of the lead terminal 2, and are disposed on the lead terminal tip side with respect to the tie bar portion 40. The shape of the second projecting pieces 22, 22 is a tapered shape that becomes narrower as the distance from the pad portion 8 increases.

  In FIG. 10, the boundaries between the lead terminal 2, the tie bar portion 40, and the second projecting pieces 22, 22 are indicated by two-dot chain lines, but actually, the lead terminal 2, the tie bar portion 40, and the second projecting portion are shown. The pieces 22 and 22 are integrally formed. Specifically, of the second projecting pieces 22, 22, the second projecting piece 22 provided on the lead terminal 1 side (left side) has an upper end surface integrally formed with a lower end surface of the tie bar portion 40, The right end surface is integrally formed with the left end surface of the lead terminal 2. The second projecting piece 22 provided on the lead terminal 2 side (right side) has an upper end surface integrally formed with the lower end surface of the tie bar portion 40, and a left end surface integrally formed with the right end surface of the lead terminal 2. ing. In the embodiment shown in FIG. 10, the tie bar portion 40 and the second protruding pieces 22 and 22 are integrally formed. However, the embodiment is not limited to this, and the tie bar portion 40 and the second protruding pieces 22 and 22 are not limited thereto. And may not be integrally formed. For example, the second projecting pieces 22, 22 may be separated from the tie bar portion 40 toward the lead terminal tip side.

  When the lead terminal 2 is manufactured by the above-described manufacturing method using the lead frame shown in FIG. 10, the lead terminal 2 shown in FIGS. 11 and 12 is formed.

  In the modification 4 of the lead terminal 2 shown in FIG. 11, second projecting pieces 22 and 22 are additionally formed on the lead terminal 2 shown in FIG. 2.

  The lead terminals 1 to 3 shown in FIG. 11 are the tie bar cutting step of the manufacturing process, the boundary between the portion indicated by Lcut2 of the tie bar portion 40 of the lead frame 10 shown in FIG. It is obtained by cutting the boundary with the terminal 3. In this tie bar cutting step, Lcut2 is set so that the width of the first protruding pieces 12, 12 is the same as the maximum width of the second protruding pieces 22, 22.

  The sum (W3 + W3 + W0) of the dimension of the maximum width (lead terminal base end side width) W3 of each of the two second projecting pieces 22 and 22 and the width W0 of the lead terminal 2 is the diameter of the through hole 62. A little bigger than. In the present embodiment, the width of the second protruding piece is a dimension in the X-axis direction.

  In the lead terminals 1 to 3 shown in FIG. 11, a part of the heat applied to the lead terminals 1 to 3 can be retained on the first protruding pieces 12 and 12 and the second protruding pieces 22 and 22. Thereby, the heat conduction to the pad portion 8 can be more reliably suppressed.

  Further, when the lead terminals 1 to 3 are respectively inserted into the through holes 61 to 63 and the second projecting pieces 22 and 22 are press-fitted into the through holes 62, the second projecting pieces 22 are pressed against the inner wall of the through hole 62 and are in pressure contact with each other. become. Thereby, the electronic component 100 can be firmly fixed to the wiring board 6. As a result, it is possible to prevent the electronic component 100 from being removed from the wiring board 6 (or coming off and floating), and mounting the electronic component 100 in an inclined state with respect to the wiring board 6.

  In Modification 5 of the lead terminal 2 shown in FIG. 12, the width W3 of the first projecting pieces 12 and 12 shown in FIG. 11 is changed to a width W2 (W3 <W2).

  The lead terminals 1 to 3 shown in FIG. 12 are the boundary between the portion indicated by Lcut3 of the tie bar portion 40 of the lead frame 10 shown in FIG. It is obtained by cutting the boundary with the terminal 3. In this tie bar cutting step, the width W2 of the first protruding pieces 12, 12 is sufficiently larger than the maximum width W3 of the second protruding pieces 22, 22, and the first protruding pieces 12, 12 and the second protruding pieces Lcut3 is set so that a step is formed at the boundary portion E1 between the pieces 22 and 22.

  In the lead terminals 1 to 3 shown in FIG. 12, a part of heat applied to the lead terminals 1 to 3 can be retained on the first protruding pieces 12 and 12 and the second protruding pieces 22 and 22. Thereby, the heat conduction to the pad portion 8 can be more reliably suppressed.

  Further, when the lead terminals 1 to 3 are respectively inserted into the through holes 61 to 63 and the second projecting pieces 22 and 22 are press-fitted into the through holes 62 as shown in FIG. 13, the second projecting pieces 22 and 22 are inserted into the through holes. It will be in the state pressed against the inner wall of 62. Thereby, the electronic component 100 can be strongly fixed to the wiring board 6. As a result, it is possible to prevent the electronic component 100 from being removed from the wiring board 6 (or coming off and floating), and mounting the electronic component 100 in an inclined state with respect to the wiring board 6. In addition, the first projecting pieces 12 and 12 are not inserted into the through holes 62, and the portions projecting from the second projecting pieces 22 and 22 of the first projecting pieces 12 and 12 are mounted on the mounting surface of the wiring board 6 (FIG. 13). Then, it can be brought into contact with the upper surface 60). Accordingly, the first protruding pieces 12 and 12 can position the electronic component 100 in the height direction (Y-axis direction) with respect to the wiring board 6.

  In the present embodiment, the taper-shaped first projecting pieces 11, 12, 13 and the second projecting pieces 22, 22 have end surfaces on the lead terminal base end side parallel to the X-axis direction. However, the angle of the end side of the lead terminal base end side with respect to the X-axis direction may be smaller than 90 degrees or larger, and can be changed as appropriate.

  Moreover, in this embodiment, although the notch part 71 and the notch part 91 are provided in the pad parts 7 and 9 as said positioning part, it is not limited to this, In the form shown to FIGS. There may be.

  In Modification 1 shown in FIG. 14, a notch 71 and a notch 91 are applied as the positioning part.

  The notch 71 is formed by cutting a rectangular shape from the left end of the pad portion 7 along the + X axis direction, and the notch 91 is formed from the right end of the pad portion 9 along the −X axis direction. It is formed by cutting out into a rectangle.

  When the electronic device 4 is mounted on the pad portions 7 to 9 using the positioning portion having such a configuration, the Y axis is based on the reference line L using a virtual line passing through the reference point 711 and the reference point 911. Determine the mounting position in the direction.

  In this modification, the reference point 711 is the corner between the notch 71 and the outer peripheral end of the pad portion 7, and the reference point 911 is the corner between the notch 91 and the outer peripheral end of the pad portion 9. However, the positions of the reference point 711 and the reference point 911 are not limited to this, and may be any corner of the notch 71 or the notch 91, for example.

  Further, the cutout portion 71 and the cutout portion 91 are formed by cutting out into a rectangle along the + X axis direction or the −X axis direction, but the present invention is not limited thereto, and a reference point is provided. However, other shapes may be used. Specifically, it may be cut out obliquely with respect to the outer peripheral direction of the pad portion 7 and the pad portion 9, or may be cut out along (in parallel with) the outer peripheral direction. The shape of the notch 71 and the notch 91 may be a rectangle (rectangle or square) as described above, or may be a triangle. Further, the cutout portion 71 and the cutout portion 91 may be provided on one side of the plurality of sides constituting the outer peripheral ends of the pad portion 7 and the pad portion 9, and are provided on the plurality of sides. May be.

  FIG. 15 is an explanatory view showing Modification Example 2 of the pad portions 7 to 9 according to one embodiment of the present invention, and FIG. 15 is a view of FIG. 15 (a), FIG. 15 (b), FIG. 15 (d), FIG. 15 (e) and FIG. 15 (f). 15 (a) and 15 (b) show the mounting surface of the pad portion, and FIGS. 15 (c), 15 (d), 15 (e) and 15 (f) show FIG. A-A line cross section of FIG. 15A shows only the pad portion, FIG. 15B also shows the mounting position of the electronic device using a two-dot chain line, and FIG. 15C shows the positioning provided in the pad portion. An example in which the portion (positioning mark) is a concave portion is shown, and FIG. 15 (d) shows an example in which the positioning portion (positioning mark) provided in the pad portion is a through hole, and FIG. Shows an example when the positioning portion (positioning mark) provided in the pad portion is a marking, and FIG. 15 (f) shows a case where the positioning portion (positioning mark) provided in the pad portion is a convex portion. An example is shown.

  In Modification 2 shown in FIG. 15, a positioning mark 171 and a positioning mark 191 are applied as the positioning portion.

  The positioning mark 171 and the positioning mark 191 are provided around the area where the electronic device 4 is mounted (the mounting position) on the mounting surface 70 of the pad unit 7 and the mounting surface 90 of the pad unit 9. The positioning mark 171 and the positioning mark 191 are along at least two corners of a rectangular (rectangular or square) region on which the electronic device 4 is mounted (here, along the two corners constituted by three sides). And so on) formed L-shaped mark in plan view. The planar view shape of the positioning mark 171 is a shape obtained by rotating the L-shape 90 degrees clockwise, and the planar view shape of the positioning mark 191 is a shape obtained by rotating the L-shape 180 degrees clockwise.

  Note that the positioning mark 171 and the positioning mark 191 referred to here may be a recess not penetrating the pad portion 7 or the pad portion 9 as shown in FIG. 15C, or a pad as shown in FIG. 15D. It may be a through-hole penetrating the portion 7 or the pad portion 9, or may be a marking formed by printing or the like on the surface of the pad portion 7 or the pad portion 9 as shown in FIG. A convex portion press-molded on the surface of the pad portion 7 or the pad portion 9 by changing the mold used when forming the lead frame 10 as shown in FIG.

  When the electronic device 4 is mounted on the pad portions 7 to 9 using the positioning portion having such a configuration, the Y axis is based on the reference line L using a virtual line passing through the reference point 711 or the reference point 911. Determine the mounting position in the direction.

The formation positions of the positioning marks 171 and 191 are not limited to the positions shown in FIG. When the positioning mark 171 and the positioning mark 191 are the concave portion or the through-hole, for example, the positioning mark 171 and the positioning mark 191 are placed on the lead terminals 1 to 3 side of the mounting position (the lead terminals 1 to 3 and the pad portions 7 to 7). For example, the positioning mark 171 and the positioning mark 191 are formed so as to surround the portion where the external electrodes 41 to 44 of the electronic device 4 are joined,
With the positioning marks 171 and 191, the heat conduction to the portion where the external electrodes 41 to 44 are joined can be more reliably prevented. Thereby, it can prevent more reliably that the said solder remelts after mounting.

  In the second modification shown in FIG. 15, the positioning mark 171 and the positioning mark 191 are applied as the positioning portion. However, this is a preferable example, and only the positioning mark 171 is shown in FIG. Even so, the effects as described above can be obtained.

  In the second modification shown in FIG. 15, the positioning mark 171 and the positioning mark 191 are applied as the positioning portion. However, as shown in FIG. 17, a positioning mark 175 may be further provided.

  The positioning mark 175 has a rectangular shape in plan view, and is provided in the pad portion 7 between each portion where the external electrode 41 and the external electrode 42 that are adjacent external electrodes of the electronic device 4 are individually connected. . The positioning mark 175 may be a concave portion that does not penetrate the pad portion 7 or a through hole that penetrates the pad portion 7.

  According to the modification 4 shown in FIG. 17, since the positioning part also includes the positioning mark 175 in addition to the positioning mark 171 and the positioning mark 191, the mounting position of the electronic device 4 can be determined with higher accuracy. it can.

  By the way, generally, when the solder is melted by the reflow apparatus, the solder spreads along the gap between the external electrode of the electronic device and the pad portion, and may flow out around the applied region. In this case, there is a concern that the amount of solder between the external electrode and the pad portion is insufficient, and the electrical connection between the external electrode and the pad portion is lowered.

  On the other hand, according to the positioning portion shown in FIG. 17, the spread of solder can be prevented by the positioning mark 175, and the reliability related to the electrical connection between the electronic device 4 and the pad portion 7 can be improved. Can be maintained.

  The formation positions of the positioning marks 171 and 191 are not limited to the positions shown in FIG. For example, in the pad portion 7, in addition to the positioning marks 171 and 175, as shown by a broken line in FIG. 17, the lead terminal 1 side (the boundary portion side between the lead terminal 1 and the pad portion 7) from the mounting position. A positioning mark 176 may be formed. Here, the planar view shape of the positioning mark 176 is L-shaped. By forming the positioning mark 176 at such a position, the heat conduction to the portion where the external electrode 42 is joined by the positioning mark 176 can be prevented more reliably, and the solder can be remelted after mounting. This can be prevented more reliably.

  FIG. 18 is an explanatory view showing Modification 5 of the pad portions 7 to 9 according to one embodiment of the present invention, and FIG. 18 is a view of FIG. 18 (a), FIG. 18 (b), FIG. 18 (d), FIG. 18 (e) and FIG. 18 (f). 18 (a) and 18 (b) show the mounting surface of the pad portion, and FIGS. 18 (c), 18 (d), 18 (e) and 18 (f) show FIG. BB line cross section is shown. 18A shows only the pad portion, FIG. 18B shows the mounting position of the electronic device using a two-dot chain line, and FIG. 18C shows the positioning provided on the pad portion. FIG. 18D shows an example in which the portion (positioning mark) is a recess, and FIG. 18D shows an example in which the positioning portion (positioning mark) provided in the pad portion is a through hole. Shows an example of the case where the positioning portion (positioning mark) provided in the pad portion is a marking, and FIG. 18 (f) shows the case where the positioning portion (positioning mark) provided in the pad portion is a convex portion. An example is shown.

  In Modification 5 shown in FIG. 18, a positioning mark 171 and a positioning mark 191 are applied as the positioning portion.

  The positioning mark 171 is provided in the vicinity of the upper left corner of the paper in the region where the electronic device 4 is mounted (the region that matches the outer shape of the electronic device 4), and the positioning mark 191 is the region where the electronic device 4 is mounted (the outer shape of the electronic device 4). In the vicinity of the upper right corner of the drawing). The planar view shape of the positioning mark 171 and the positioning mark 191 is circular.

  Note that the positioning mark 171 and the positioning mark 191 referred to here may be a recess not penetrating the pad portion 7 or the pad portion 9 as shown in FIG. 18C, or a pad as shown in FIG. It may be a through-hole penetrating the portion 7 or the pad portion 9, or may be a marking formed by printing or the like on the surface of the pad portion 7 or the pad portion 9 as shown in FIG. A convex part press-molded on the surface of the pad part 7 or the pad part 9 by changing the mold used when forming the lead frame 10 as shown in FIG.

  When the electronic device 4 is mounted on the pad portions 7 to 9 using the positioning portion having such a configuration, the Y axis is based on the reference line L using a virtual line passing through the reference point 711 or the reference point 911. Determine the mounting position in the direction.

The formation positions of the positioning marks 171 and 191 are not limited to the positions shown in FIG. When the positioning mark 171 and the positioning mark 191 are the concave portion or the through-hole, for example, the positioning mark 171 and the positioning mark 191 are placed on the lead terminals 1 to 3 side of the mounting position (the lead terminals 1 to 3 and the pad portions 7 to 7). For example, the positioning mark 171 and the positioning mark 191 are formed so as to surround the portion where the external electrodes 41 to 44 of the electronic device 4 are joined,
With the positioning marks 171 and 191, the heat conduction to the portion where the external electrodes 41 to 44 are joined can be more reliably prevented. Thereby, it can prevent more reliably that the said solder remelts after mounting.

  In the positioning part shown in FIG. 18 described above, a circular positioning mark 171 provided on the pad part 8 and a circular positioning mark 191 provided on the pad part 9 are used. The number is not limited to one, and a plurality as shown in FIG.

  In the sixth modification shown in FIG. 19, positioning marks 171 to 173 and positioning marks 191 to 193 are applied as the positioning portions.

  With respect to the positioning marks 171 to 173, a positioning mark 171 is provided in the pad portion 7 at the same position as the positioning mark 171 in FIG. 18, and a positioning mark 172 is provided at an arbitrary position in the −Y-axis direction from the positioning mark 171. The positioning mark 173 is provided at an arbitrary position on the + X axis direction from the positioning mark 171. Then, an L-shaped virtual line is created from a virtual line passing through the positioning marks 171 and 173 and a virtual line passing through the positioning marks 171 and 172.

  Similarly, with respect to the positioning marks 191 to 193, a positioning mark 191 is provided at the same position as the positioning mark 191 in FIG. 18 in the pad portion 9, and the positioning mark 192 is located at an arbitrary position in the −Y-axis direction from the positioning mark 191. The positioning mark 193 is provided at an arbitrary position on the −X axis direction from the positioning mark 191. Then, an L-shaped virtual line is created from the virtual lines passing through the positioning marks 191 and 192 and the virtual lines passing through the positioning marks 191 and 193.

  And when mounting the electronic device 4 in the pad parts 7-9 using the said positioning part of such a structure, the L-shaped virtual line created with the positioning marks 171-173 and the positioning marks 191-193 The mounting position of the electronic device 4 in the X-axis direction and the Y-axis direction is determined from the created L-shaped virtual line.

  The formation positions of the positioning marks 171 and 191 are not limited to the positions shown in FIG. For example, in the pad portion 7, in addition to the positioning marks 171 to 173, a plurality of positioning marks 177 are formed so as to surround a portion where the external electrodes 41 and 42 of the electronic device 4 are joined, as indicated by broken lines in FIG. 19. In the pad portion 9, in addition to the positioning marks 191 to 193, a plurality of positioning marks 197 are formed so as to surround a portion where the external electrode 44 of the electronic device 4 is joined, as indicated by a broken line in FIG. Also good. Here, the planar view shapes of the positioning marks 177 and 197 are circular. By forming the positioning marks 177 and 197 at such positions, the heat conduction to the portion where the external electrodes 41, 42 and 44 are joined by the positioning marks 177 and 197 can be more reliably prevented, and the soldering can be performed. Can be reliably prevented from being remelted after mounting.

  Further, the positioning unit may be not only the above-described embodiment but also an embodiment as shown in FIG.

  In Modification 7 shown in FIG. 20, positioning marks 172 and 173 and positioning marks 192 and 193 are applied as the positioning portions.

  The positioning marks 172 and 173 are formed in a rectangular shape in plan view on the mounting surface of the pad portion 7. The positioning mark 172 is formed outside the mounting area of the electronic device 4 mounted on the mounting surface, and the longitudinal direction of the positioning mark 172 is formed in the upper left corner of the mounting surface of the electronic device 4 along the Y-axis direction. The positioning mark 172 is used for positioning in the X-axis direction in the mounting area of the electronic device 4 to be mounted. The positioning mark 173 is formed outside the mounting area of the electronic device 4 to be mounted on the mounting surface, and its longitudinal direction is formed along the X-axis direction at the upper left corner of the mounting area of the electronic device 4 in the drawing. . The positioning mark 173 is used for positioning in the Y-axis direction in the mounting area of the electronic device 4 to be mounted. The intersection of the extended lines along the long sides of the positioning marks 172 and 173 is a reference point 711.

  The positioning marks 192 and 193 are formed in a rectangular shape in plan view on the mounting surface of the pad portion 7. The positioning mark 192 is formed outside the mounting area of the electronic device 4 mounted on the mounting surface, and the longitudinal direction of the positioning mark 192 is formed along the Y-axis direction in the upper right corner of the mounting area of the electronic device 4. This positioning mark 192 is used for positioning in the X-axis direction in the mounting area of the electronic device 4 to be mounted. The positioning mark 193 is formed outside the mounting area of the electronic device 4 to be mounted on the mounting surface, and the longitudinal direction of the positioning mark 193 is formed in the upper right corner of the mounting area of the electronic device 4 along the X-axis direction. . This positioning mark 193 is used for positioning in the Y-axis direction in the mounting area of the electronic device 4 to be mounted. The intersection of the extended lines along the long sides of the positioning marks 192 and 193 is a reference point 911.

  The positioning marks 172, 173, 192, 193 may be concave portions that do not penetrate the pad portion 7 or the pad portion 9, or may be through holes that penetrate the pad portion 7 or the pad portion 9. It may be a marking formed on the surface of the part 9 by printing or the like, and may be a pad part 7 or a convex part press-molded on the surface of the pad part 9 by changing the mold used when forming the lead frame 10. There may be.

  When the electronic device 4 is mounted on the pad portions 7 to 9 using the positioning marks 172, 173, 192, and 193, the mounting position Y of the electronic device 4 is based on the virtual line L passing through the reference points 711 and 911. Determine the mounting position in the axial direction.

  Moreover, in this embodiment, although the form shown in FIGS. 5 and 14 to 20 is shown as the positioning portion, these forms may be used alone, but are used in combination as shown in FIG. Also good. FIG. 21 shows a modified example 8 in which the notches 71 and 91 shown in FIG. 5, the positioning marks 171 to 173 shown in FIG. 19, and the positioning marks 191 to 193 are combined.

  As described above, when the positioning mark is a marking, it can be formed at a relatively low cost by printing or the like.

  When the positioning mark includes any one of a concave portion, a convex portion, and a through hole, the contact area between the resin package portion 5 and the pad portions 7 to 9 can be increased. As a result, it is possible to prevent the lead terminals 1 to 3 including the pad portions 7 to 9 from falling out (dropping out) from the resin package portion 5. In addition, since the heat conduction can be more reliably prevented by the positioning mark, it is possible to more reliably prevent the solder from being remelted after mounting. In particular, when the positioning mark is a concave or convex portion, the strength of the pad portions 7 to 9 can be maintained, and when the positioning mark is a through hole, the positioning mark is more reliably detected during image processing. can do.

  In this embodiment, for example, the pad portions 7 to 9 shown in FIG. 5 are used. However, the shape of the pad portions 7 to 9 is not limited to this, and the electronic device 4 can be mounted. It can be set arbitrarily, and may be a modification 9 of the pad portions 7 to 9 shown in FIG.

  In the modification 9 shown in FIG. 22, the pad part 9, the pad part 7, and the pad part 8 are arranged in order from the left side. The arrangement of the pad portions 7 to 9 is related to the positions of the external electrodes 41 to 44 of the electronic device 4 to be mounted. In the pad portions 7 to 9 shown in FIG. 22, the volumes of the pad portions 8 and 9 are the same, and the volume of the pad portion 7 is smaller than the volume of the pad portions 8 and 9.

  Further, in the pad portions 7 to 9, the positioning portions (notch portions 91 and 81) instead of the positioning portions (notch portions 71 and 91) in the form shown in FIG. 2 are formed in the pad portions 8 and 9. ing.

  Moreover, the modification of the pad parts 7-9 is not limited to an above-described form, The modifications 10-12 shown to FIGS. 23-25 mentioned below may be sufficient.

  Modification 10 will be described using the pad portion 7 as an example as shown in FIG. In the modified example 10, a protrusion 75 that protrudes in a direction perpendicular to the mounting surface 70 is provided on the outer peripheral edge of the pad portion 7. In FIG. 23, the pad portion 7 is described as an example, but the pad portions 8 and 9 have the same configuration.

  As described above, the protrusion 75 is provided in the pad portion 7, so that the protrusion 75 serves as a bank portion and prevents solder or the like from protruding (overflowing) from the mounting surface of the pad portion 7. You can also

  In the case where the pad portion 7 (lead frame 10) is formed by patterning a metal plate material using a punching process using a mold or the like, the protrusion 75 is formed during the punching process. It may be a punching burr formed when the pad portion 7 (lead frame 10) is removed from the mold.

  In this case, when the lead frame 10 is formed by punching a metal plate material, the protrusions can be formed at the same time, and the protrusions 75 can be easily formed at a lower cost.

  Further, when the electronic device 4 is mounted on the pad unit 7 with the pad unit 7 placed on the work table, the punching burr contacts the work table and the mounting surface 70 of the pad unit 7 becomes the work table. There is a concern that it will be inclined to

  However, according to the present embodiment, since the punching burr is the protrusion 75, the flat surface of the pad portion 7 (the flat surface where the protrusion 75 is not formed) is in contact with the work table, and the pad It is possible to prevent the mounting surface 70 of the portion 7 from being inclined with respect to the work table. Thereby, the stability of the electromechanical connection between the electronic device 4 and the pad part 7 after mounting can be improved, and the occurrence of a connection failure can be prevented. Thereby, the reliability regarding the electrical connection between the electronic device 4 and the pad part 7 can be improved. The external electrodes 41 to 44 of the electronic device 4 and the pad portions 7 to 9 are preferably electrically connected by wire bonding or FCB.

  Modification 11 will be described using the pad portion 7 as an example as shown in FIG. In the pad portion 7 according to the modified example 11, an end face (lower end face) 76 adjacent to the boundary portion with the lead terminal 1 is formed in a zigzag shape. In FIG. 24, the pad portion 7 is described as an example, but the same configuration is formed in the pad portions 8 and 9. In the present embodiment, the zigzag shape indicates a shape (wedge shape) in which an uneven shape is formed on the end surface, and the protrusions of the protrusions and the recesses of the recesses form acute angles.

  By forming the end face in a zigzag shape in this way, the contact area between the pad portion 7 and the resin package portion 5 can be increased, so that the lead terminal 1 is dropped together with the pad portion 7 from the resin package portion 5. Can be prevented.

  In addition, the site | part (end surface) shape | molded in zigzag shape is not limited to the site | part (end surface 76) shown in FIG. 24, At least one part of all the end surfaces of the pad parts 7-9 may be shape | molded in zigzag shape. . For example, the left end surface and the right end surface of the pad portion 7 may be formed in a zigzag shape. In this case, the portion molded in the zigzag shape is caught inside the resin package portion 5, so that the lead terminal 1 falls off. Can be more reliably prevented.

  In addition, in order to mold the end face in a zigzag shape, the lead terminal 1 (lead frame 10) may be formed using a mold in which a zigzag shape is provided in advance in the inner surface of the recess. Further, after forming the lead terminal 1 (lead frame 10) using a mold and taking out the lead terminal 1 (lead frame 10) from the mold, the end face is zigzag shaped by etching, punching or cutting. It may be molded.

  The modified example 12 will be described using the pad portion 7 as an example as shown in FIG. In the pad portion 7 according to the modified example 12, the outer periphery of the mounting surface 70 of the electronic device 4 (particularly, the portion adjacent to the lead terminal 1) is perpendicular to the mounting surface 70 (XY plane). A protruding bank portion 77 is provided. 25, the pad portion 7 is described as an example, but the same configuration is formed in the pad portions 8 and 9 as well.

  As the pad portion 7 is provided with the bank portion 77 in this way, the contact area between the pad portion 7 and the resin package unit 5 can be increased, and the bank portion 77 is placed inside the resin package unit 5. Therefore, it is possible to prevent the lead terminal 1 from dropping together with the pad portion 7 from the resin package portion 5.

  25 is preferable as the part for forming the bank part 77, but the part shown in FIG. 25 is not limited to this, and the bank part is formed in at least a part of all the end parts of the pad part 7. Has the same effect.

  Further, when the bank portion 77 forms the lead terminal 1 (lead frame 10) using a mold, a member that will later become the bank portion 77 extends from the end portion of the lead terminal 1 in advance. After the 1 (lead frame 10) is taken out from the mold, it may be formed by bending the boundary portion between the end and the extended member.

  In addition, in this embodiment mentioned above, although the shape of the resin package part 5 is made into a rectangular parallelepiped, it is not limited to this, If the pad parts 7-9 and the electronic device 4 can be resin-sealed, it will be in another form. There may be. Specifically, Modifications 1 to 5 of the resin package part as shown in FIGS. 26 to 30 are schematic perspective views illustrating Modifications 1 to 5 of the resin package portion 5.

  The shape of the resin package part 5 of the electronic component 100 shown in FIG. 26 is a columnar shape with a semicircular cross section. The columnar shape having a semicircular cross section referred to here is a shape obtained by cutting a cylindrical shape along the height direction.

  The shape of the resin package portion 5 of the electronic component 100 shown in FIG. 27 is a column shape having a substantially semicircular cross section. The column shape having a substantially semicircular cross section referred to here is a column shape in which the outer periphery of the cross section is formed of a circle and a straight line.

  The shape of the resin package portion 5 of the electronic component 100 shown in FIG. 28 is a tapered column shape having a semicircular cross section. The tapered columnar shape having a semicircular cross section referred to here is a shape obtained by cutting a truncated cone along the height direction.

  The shape of the resin package part 5 of the electronic component 100 shown in FIG. 29 is hemispherical. The said hemispherical shape here is the convex lens shape which cut | disconnected and removed a part of spherical shape.

  The shape of the resin package part 5 of the electronic component 100 shown in FIG. 30 is substantially hemispherical. The substantially hemispherical shape referred to here is a case in which a housing having a hemispherical shape and a rectangular parallelepiped shape are integrally formed on a plane.

  It should be noted that the present invention can be implemented in various other forms without departing from the spirit, gist, or main features. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

10 lead frame 1 first lead terminal 11 first protruding piece 2 second lead terminal 12 first protruding piece 22 second protruding piece 3 third lead terminal 13 first protruding piece 4 electronic device 41 first external electrode 42 second external Electrode 43 Third external electrode 44 Fourth external electrode 5 Resin package part 6 Wiring board 7 First pad part 71 Notch part 171, 172, 173, 175 Positioning mark 8 Second pad part 9 Third pad part 91 Notch part 191,192,193 Positioning mark 100 Electronic component

Claims (8)

A lead-type electronic component comprising a plurality of adjacent pad portions and a plurality of lead terminals extending in the same direction from each of the pad portions,
Each of the lead terminals includes a narrow pitch portion where the pitch between the adjacent lead terminals is narrow and a wide pitch portion where the pitch between the adjacent lead terminals is wide,
The narrow pitch portion is disposed on the side of the plurality of pads than the wide pitch portion,
At least one lead terminal of the plurality of lead terminals is provided with a first projecting piece at the wide pitch portion. The lead-type electronic component according to claim 1,
The lead-type electronic component according to claim 1, wherein the first protruding piece has a tapered shape that becomes narrower as it is separated from the pad portion. The lead-type electronic component according to claim 1,
The lead terminal including the first protruding portion includes a second protruding piece having a tapered shape that becomes narrower as the distance from the pad portion increases in the wide pitch portion, and the first protruding piece includes the second protruding piece. A lead-type electronic component, wherein the lead-type electronic component is disposed closer to the pad portion than the protruding piece. A lead-type electronic component according to claim 3,
The lead-type electronic component, wherein the first protruding piece protrudes more than the second protruding piece. A lead-type electronic component according to any one of claims 1 to 4,
A plurality of adjacent pad portions, a plurality of lead terminals extending in the same direction from the respective pad portions, and a tie bar portion connecting the wide pitch portions of the plurality of lead terminals. Using the lead frame, the pad portion and the lead terminal are formed,
The lead-type electronic component is characterized in that the first protruding piece is formed by leaving a part of the tie bar part at the time of tie bar cutting by cutting the tie bar part and individually dividing a plurality of lead terminals. A lead-type electronic component according to any one of claims 1 to 5,
The volumes of the plurality of pad portions are different from each other, and at least two of the plurality of lead terminals each include the first protruding piece, and the first of the lead terminals including the pad portion having a small volume. A lead-type electronic component, wherein the volume of one protruding piece is larger than the volume of the first protruding piece of the other lead terminal. A lead frame comprising a plurality of adjacent pad portions, a plurality of lead terminals extending in the same direction from the respective pad portions, and a tie bar portion connecting the plurality of lead terminals,
The plurality of lead terminals include a narrow pitch portion where the pitch between the adjacent lead terminals is narrow and a wide pitch portion where the pitch between the adjacent lead terminals is wide, and the narrow pitch portion corresponds to the wide pitch portion. For the pad part side,
The lead frame, wherein the tie bar portion connects the wide pitch portions. The lead frame according to claim 7,
At least one lead terminal of the plurality of lead terminals includes a taper-shaped second projecting piece that becomes narrower as the distance from the pad portion increases in the wide pitch portion.
The lead frame according to claim 1, wherein the tie bar portion is disposed closer to the pad portion than the second projecting piece.

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