CN113748510B - Electronic module - Google Patents

Electronic module Download PDF

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Publication number
CN113748510B
CN113748510B CN202080031810.7A CN202080031810A CN113748510B CN 113748510 B CN113748510 B CN 113748510B CN 202080031810 A CN202080031810 A CN 202080031810A CN 113748510 B CN113748510 B CN 113748510B
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China
Prior art keywords
lead
distal end
electrode pad
tip
electronic module
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CN202080031810.7A
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Chinese (zh)
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CN113748510A (en
Inventor
安永尚司
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads

Abstract

The present disclosure provides an electronic module capable of suppressing a decrease in bonding strength of a lead wire to a wiring substrate. The electronic module (1) is provided with: a wiring substrate (2) having a 2 nd electrode pad (12) having a bonding surface (12 a) provided on a lower surface (2 b); a lead (4) electrically connected to the 2 nd electrode pad (12) via a solder (24); and a sealing body (5) for sealing the lead (4). The lead (4) has: an exposure part (21) exposed outside the sealing body (5); and a main body portion (22) extending from the exposed portion (21) toward the wiring substrate (2), wherein a distal end portion (23) is provided on the wiring substrate (2) side, and the distal end portion (23) is connected to the 2 nd electrode pad (12) via solder (24). A tip surface (23 a) of the tip portion (23) is formed such that the thickness of solder (24) between the tip surface (23 a) and the joint surface (12 a) of the 2 nd electrode pad (12) in a direction orthogonal to the joint surface (12 a) becomes uneven.

Description

Electronic module
Technical Field
The present disclosure relates to electronic modules.
Background
Conventionally, patent document 1 discloses an electronic module in which electronic components and leads are mounted on a wiring board and sealed with a sealing body such as a resin. The electronic module of this document includes: a wiring substrate having a plurality of electrode pads provided on a lower surface thereof; a lead electrically connected to the electrode pad; and a sealing body for sealing the lead. The lead wire has: part 1, which is formed by bending a conductive metal plate and extends parallel to the lower surface of the wiring substrate; a 2 nd portion extending from an end of the 1 st portion in a direction crossing a lower surface of the wiring substrate; and a 3 rd part extending from an end of the 2 nd part in parallel with the 1 st part. Part 1 is connected to the electrode pad via a bonding material having conductivity such as solder. The upper surface and the side surface of the 3 rd portion are exposed from the main surface and the side surface of the sealing body, respectively. Thus, the lead wire functions as an external connection terminal for connecting the electronic module to another electronic module or the like provided outside the lead wire.
In addition, in manufacturing the electronic module, the leads are connected to the wiring substrate by reflow soldering. In this step, after the electrode pads are coated with the cream solder, an aggregate substrate having a plurality of leads formed at given positions is placed on the lower surface of the wiring substrate, and the cream solder is melted by heat treatment and then solidified, whereby the leads are connected to the electrode pads.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2011-40602
Disclosure of Invention
Problems to be solved by the invention
However, when the solder paste melts during the connection of the leads by reflow soldering, the melted solder between the electrode pad and the 1 st portion is pushed out due to the weight of the collective substrate of the leads. In this case, in the above-described conventional structure, since the 1 st portion connected to the electrode pad extends parallel to the lower surface of the wiring board, the solder between the electrode pad and the 1 st portion is liable to be thinned as a whole, and there is a problem that the bonding strength of the wire is lowered.
In addition, such a problem is not limited to the case where the leads are connected to the wiring board by reflow soldering using the aggregate board, but may also occur in the case where the leads are connected to the wiring board by other methods.
An object of the present disclosure is to provide an electronic module capable of suppressing a decrease in bonding strength of a lead wire to a wiring substrate.
Means for solving the problems
An electronic module according to an embodiment of the present disclosure includes: a wiring substrate having a main surface on which electrode pads having bonding surfaces are provided; a lead electrically connected to the electrode pad via a bonding material having conductivity; and a sealing body sealing the lead. The lead wire has: an exposure portion exposed to the outside of the sealing body; and a main body portion extending from the exposed portion toward the wiring board and having a distal end portion on the wiring board side. The tip portion is connected to the electrode pad via the bonding material. The tip surface of the tip portion is formed to have a non-uniform thickness in a direction orthogonal to the bonding surface of the bonding material between the tip surface and the bonding surface of the electrode pad.
According to the above configuration, since the thickness of the bonding material becomes uneven on the tip surface, even if the melted bonding material between the electrode pad and the tip end portion of the main body portion is extruded due to the weight of the lead wire, for example, the entire thickness of the bonding material between the bonding surface and the tip end surface of the electrode pad can be suppressed unlike the case where the solder is extruded from between the two parallel surfaces. This can suppress a decrease in bonding strength of the lead wire to the wiring board.
Effects of the invention
According to one aspect of the present disclosure, a decrease in bonding strength of the lead wire to the wiring substrate can be suppressed.
Drawings
Fig. 1 is a perspective view of an electronic module according to an embodiment, as viewed from the upper surface side of a wiring board.
Fig. 2 is a perspective view of the electronic module according to the embodiment, as seen from the lower surface side of the wiring board.
Fig. 3 is a cross-sectional view of an electronic module of one embodiment, taken along line III-III of fig. 1.
Fig. 4 is an enlarged cross-sectional view of the vicinity of a lead in an electronic module of an embodiment.
Fig. 5 (a) and (b) are schematic diagrams showing the definition of the top end face.
Fig. 6 is a cross-sectional view perpendicular to the thickness direction of the lead in the electronic module according to one embodiment, and is a VI-VI cross-sectional view of fig. 4.
Fig. 7 is a plan view of the aggregate substrate before molding the leads according to the embodiment.
Fig. 8 is a cross-sectional view of the aggregate substrate before molding the leads, which is placed on a mold according to an embodiment.
Fig. 9 is a cross-sectional view of the aggregate substrate after molding the leads, which is placed on a mold according to an embodiment.
Fig. 10 is a perspective view of an aggregate substrate in which leads are mounted on a substrate base according to an embodiment.
Fig. 11 is a cross-sectional view perpendicular to the thickness direction of the lead in the electronic module of the modification.
Fig. 12 is an enlarged cross-sectional view of the vicinity of the lead in the electronic module of the modification.
Fig. 13 is an enlarged cross-sectional view of the vicinity of the lead in the electronic module of the modification.
Detailed Description
An embodiment of the electronic module will be described below with reference to the drawings.
As shown in fig. 1 to 3, the electronic module 1 includes a wiring board 2, a plurality of electronic components 3 and a plurality of leads 4 mounted on the wiring board 2, a sealing body 5 sealing the electronic components 3 and the leads 4, and a heat sink 6 embedded in the sealing body 5.
The wiring substrate 2 is formed in a quadrangular plate shape. A plurality of 1 st electrode pads 11 are provided on the upper surface 2a of the wiring substrate 2, and a plurality of 1 st electrode pads 11 and a plurality of 2 nd electrode pads 12 are provided on the lower surface 2b which is a main surface of the wiring substrate 2. The 1 st electrode pad 11 is a connection portion for electrically connecting the electronic component 3, and is provided at a predetermined position on the upper surface 2a and the lower surface 2 b. The 2 nd electrode pad 12 is a connection portion for electrically connecting the lead 4, and is provided at a predetermined position in the lower surface 2 b.
The 2 nd electrode pad 12 of the present embodiment is formed in a rectangular shape, and the 2 nd electrode pad 12 is arranged on the lower surface 2b so that the longitudinal direction thereof is along the outer peripheral edge of the wiring substrate 2. The bonding surface 12a of the 2 nd electrode pad 12 is formed in a planar shape without irregularities.
A via electrode and a wiring, not shown, are provided on the wiring board 2, and electrically connect the predetermined electronic component 3 and the lead 4 mounted on the 1 st electrode pad 11 and the 2 nd electrode pad 12. The wiring board 2 of the present embodiment may be a resin board containing a resin material such as polychlorinated biphenyl or a ceramic board containing a ceramic material such as low-temperature co-fired ceramic, and the wiring board 2 may be a single-layer board or a multilayer board. A barrier layer, not shown, is provided on the upper surface 2a and the lower surface 2b except for the 1 st electrode pad 11 and the 2 nd electrode pad 12.
The plurality of electronic components 3 include chip-like components such as capacitors, inductors, and resistors, semiconductor devices, and the like. Each electronic component 3 is connected to a predetermined 1 st electrode pad 11 corresponding to the type of the electronic component 3 via a solder 13 as a bonding material having conductivity.
The plurality of leads 4 are each formed in a plate shape by bending a metal plate such as copper. The lead 4 has: an exposure portion 21 exposed to the outside of the sealing body 5; and a main body 22 extending from the exposed portion 21 toward the side where the wiring board 2 is located, and having a distal end portion 23 on the wiring board 2 side. The distal end 23 of the lead 4 is connected to the 2 nd electrode pad 12 via a solder 24 as a conductive bonding material. The lead 4 is connected to the 2 nd electrode pad 12 in such a manner that a direction perpendicular to the thickness of the lead 4 is along the outer peripheral edge of the wiring board 2, that is, along the longitudinal direction of the 2 nd electrode pad 12. The leads 4 are formed to have a height from the lower surface 2b of the wiring board 2 higher than the height of the electronic component 3 mounted on the lower surface 2 b.
As shown in fig. 4, the exposed portion 21 is formed in a flat plate shape that is continuous with the base end portion 25 on the opposite side of the lower surface 2b in the main body portion 22, and is bent toward the side where the wiring substrate 2 is located so as to form an obtuse angle with respect to the main body portion 22. Specifically, the exposed portion 21 is formed in a flat plate shape bent with respect to the main body portion 22 so as to be substantially parallel to the wiring substrate 2. The upper surface 21a and the side surface 21b of the exposed portion 21 are exposed from the sealing body 5.
The main body 22 is formed in a flat plate shape extending in a straight line in a direction inclined with respect to the bonding surface 12a of the 2 nd electrode pad 12. The angle θ1 between the extending direction of the main body 22 and the perpendicular to the joint surface 12a is preferably 30 ° or less. By setting θ1 to 30 ° or less, the mounting area of the leads 4 on the wiring board 2 can be prevented from becoming excessively large, and the electronic module 1 can be highly integrated. The tip end surface 23a of the tip end portion 23 facing the bonding surface 12a of the 2 nd electrode pad 12 is formed such that the thickness of the solder 24 between the tip end surface 23a and the bonding surface 12a orthogonal to the bonding surface 12a becomes uneven. That is, the thickness of the solder 24 in the direction orthogonal to the joint surface 12a becomes uneven in the tip surface 23a.
Specifically, the distal end surface 23a is formed in a rectangular shape so as to form a substantially right angle with an upper surface 22a of the main body 22 continuous with the upper surface 21a of the exposed portion 21 and a lower surface 22b of the main body 22 continuous with the lower surface 21c of the exposed portion 21. In addition, the upper surface 22a and the lower surface 22b of the main body 22 are substantially parallel to each other. The tip end surface 23a is inclined with respect to the joint surface 12a so as to gradually move away from the joint surface 12a from the side continuous with the lower surface 22b toward the side continuous with the upper surface 22 a. In other words, the tip end surface 23a is inclined with respect to the joint surface 12a such that the thickness of the solder 24 gradually increases from the side of the tip end surface 23a where the exposed portion 21 is located toward the opposite side of the exposed portion 21. The thickness of the solder 24 at the end portion of the tip end surface 23a on the side continuous with the lower surface 22b may be zero or greater than zero. That is, the end portion of the distal end surface 23a on the side continuous with the lower surface 22b may or may not be in contact with the joint surface 12a. The angle θ2 formed by the distal end surface 23a and the joint surface 12a is substantially equal to the angle θ1 formed by the extending direction of the body 22 and the perpendicular to the joint surface 12a.
Here, as shown in fig. 5 (a) and 5 (b), the distal end surface 23a may not be strictly planar according to the method of manufacturing the lead 4, and thus the distal end surface 23a may be defined as follows. As described later, when the lead material portion 43 serving as the lead 4 is formed by punching from a metal plate serving as a material, burrs B may occur on the distal end surface 23a as shown in fig. 5 (a), for example. In this case, a straight line connecting the distal end position P1 of the upper surface 22a and the distal end position P2 of the virtual lower surface 22B in which the lower surface 22B is extended straight by ignoring the burr B is set as a line showing the cross section of the distal end surface 23a. When the lead material portion 43 serving as the lead 4 is formed by dissolving a metal plate serving as a material by etching, for example, as shown in fig. 5 (b), the distal end surface 23a is a curved surface. In this case, a straight line connecting the distal end position P1 of the upper surface 22a and the distal end position P2 of the lower surface 22b is a line showing the cross section of the distal end surface 23a.
As described later, since the lead 4 according to the present embodiment is formed by bending the lead raw material portion 43, the distal end surface 23a may be inclined such that one side of the distal end surface 23a continuous with the lower surface 22b protrudes. Therefore, even if the angle θ2 formed by the distal end surface 23a and the joint surface 12a is equal to the angle θ1, the angle θ2 may be slightly larger than the angle θ1.
As shown in fig. 6, a notch 31 cut to include the distal end surface 23a and the side surface 22c of the body 22 is formed in the distal end portion 23. The side surfaces 22c are surfaces of the main body 22 on both sides in a direction perpendicular to the plate thickness direction, and are substantially perpendicular to the upper surface 22a and the lower surface 22b, respectively. In the distal end portion 23 of the present embodiment, cutouts 31 are formed on both sides in a direction orthogonal to the plate thickness direction. The slit 31 penetrates in the plate thickness direction of the tip end portion 23, and is formed in a fan shape as viewed from the plate thickness direction. The solder 24 wets, causing the kerf 31 to fill and form a fillet.
As shown in fig. 2 and 3, the sealing body 5 includes an insulating resin material such as epoxy resin. The sealing body 5 covers the entire lower surface 2b of the wiring board 2, and is formed in a rectangular parallelepiped shape having a main surface 5a flush with the upper surface 21a of the exposed portion 21 and a side surface 5b flush with the side surface 21b, and seals the entire electronic component 3 inside thereof. Thereby, the upper surface 21a and the side surface 21b of the exposed portion 21 are exposed from the sealing body 5. When the electronic module 1 is mounted on another wiring board or the like, the upper surface 21a and the side surface 21b are connected to the other wiring board via a conductive bonding material. That is, the lead 4 functions as an external connection terminal for connecting the electronic module 1 to another electronic module or the like provided outside.
The heat sink 6 includes a metal material such as copper. The heat sink 6 is formed in a rectangular plate shape smaller than the wiring board 2 by one turn, and has legs extending radially from four corners thereof. The heat sink 6 is embedded in the sealing body 5 so as to be flush with the main surface 5a of the sealing body 5.
Next, the manufacture of the electronic module 1 of the present embodiment will be described centering on the molding of the lead 4. Here, for convenience of explanation, the case where two electronic modules 1 are manufactured simultaneously will be described, but even in the case where a single electronic module 1 is manufactured one by one, or in the case where three or more electronic modules 1 are manufactured simultaneously, the same manufacturing can be performed.
As shown in fig. 7, the lead 4 is manufactured using a collective substrate 41 made of a metal plate such as copper. The aggregate substrate 41 has the frame portions 42 equal to the number of simultaneously manufactured electronic modules 1. Each frame portion 42 is formed in a square frame shape corresponding to the wiring board 2, and one side between adjacent frame portions 42 is shared. The aggregate board 41 further includes a lead material portion 43 connected to the frame portion 42, and a heat sink material portion 44. In each frame portion 42, the same number of lead material portions 43 as the leads 4 of the manufactured electronic module 1 are formed at positions corresponding to the 2 nd electrode pad 12 of the wiring substrate 2. The lead raw material portion 43 is formed in an elongated plate shape, and a notch having the same shape as the notch 31 of the lead 4 is formed at the tip end portion thereof. The radiator raw material portion 44 is formed in the same shape as the radiator 6.
Such a collective substrate 41 is manufactured by punching or etching a single metal plate to form a frame portion 42, a lead raw material portion 43, and a heat sink raw material portion 44.
Next, as shown in fig. 8, the aggregate substrate 41 is placed on the support mold 51, and the aggregate substrate 41 is sandwiched between the support mold 51 and the pressing mold 52. The support mold 51 is formed in a four-sided frame shape like the frame portion 42. The mounting surface 51a for mounting the aggregate substrate 41 in the support mold is formed in a planar shape without irregularities, and the width of the mounting surface 51a is formed larger than the width of the frame portion 42. Thus, the mounting surface 51a is in contact with the entire frame portion 42 and the base end portion of the lead raw material portion 43. The side surface 51b of the support mold 51 is formed in a planar shape forming a right angle with respect to the mounting surface 51 a. The pressing die 52 is formed in substantially the same shape as the supporting die 51. Then, in a state where the aggregate substrate 41 is placed on the placement surface 51a and the aggregate substrate 41 is sandwiched by the pressing die 52, a portion of the lead raw material portion 43 protruding from the placement surface 51a is bent along the side surface 51b by press working using the pressing die 53 composed of a punch or the like.
As a result, as shown in fig. 9, the distal end side of the lead stock portion 43 is bent while the base end portion of the lead stock portion 43 is kept parallel to the frame portion 42. At this time, the distal end side of the lead stock portion 43 is inclined so as to form an obtuse angle with respect to the base end portion by restoring its elastic deformation amount. The base end portion of the lead raw material portion 43 cut from the frame portion 42 is the exposed portion 21, and the portion on the bent distal end side is the main body portion 22.
Next, as shown in fig. 10, the aggregate substrate 41 is connected to the substrate base 61. The substrate base 61 is formed by integrating the same number of wiring substrates 2 as the number of electronic modules 1 to be manufactured simultaneously. When connecting the aggregate substrate 41 to the wiring substrate 2, first, the 2 nd electrode pad 12 of the wiring substrate 2 is coated with a cream solder, and the aggregate substrate 41 is placed on the substrate base 61 so as to be placed on the 2 nd electrode pad 12 corresponding to the distal end portion of the lead raw material portion 43, that is, the distal end portion 23 of the lead 4. The electronic component 3 may be mounted before the aggregate substrate 41 is placed on the substrate base 61, or may be mounted after the aggregate substrate 41 is connected to the substrate base 61. Then, the cream solder is solidified after being melted by heat treatment, whereby the lead raw material portion 43 is connected with the 2 nd electrode pad 12. Then, the sealing body 5 is formed, the lead material portion 43 and the heat sink material portion 44 are cut from the frame portion 42, and the wiring substrates 2 are cut from the substrate precursors 61, whereby the electronic module 1 is manufactured.
Next, the operation and effects of the present embodiment will be described.
(1) The lead 4 has: an exposure portion 21 exposed to the outside of the sealing body 5; and a main body 22 extending from the exposed portion 21 toward the wiring board 2 and having a distal end portion 23 on the wiring board 2 side, wherein the distal end portion 23 on the side of the main body 22 where the wiring board 2 is located is connected to the 2 nd electrode pad 12 via solder 24. The tip surface 23a of the tip portion 23 is formed such that the thickness of the solder 24 between the tip surface 23a and the bonding surface 12a of the 2 nd electrode pad 12 in the direction orthogonal to the bonding surface 12a becomes uneven. Therefore, even if the melted solder 24 between the 2 nd electrode pad 12 and the distal end portion 23 is pushed out by the weight of the aggregate substrate 41, for example, the solder 24 between the bonding surface 12a and the distal end surface 23a can be suppressed from becoming thinner as a whole, unlike the case where the solder is pushed out from between two parallel surfaces when connecting the leads 4. This can suppress a decrease in bonding strength of the lead 4 to the wiring board 2. Further, by connecting the distal end surface 23a to the bonding surface 12a, the mounting area of the lead 4 can be reduced, as compared with a case where, for example, a portion extending parallel to the bonding surface 12a is provided on the lead 4 and the portion is connected.
(2) The main body 22 extends in a direction inclined with respect to the joint surface 12a, and the exposed portion 21 is continuous with the base end portion 25 of the main body 22 and is bent toward the side where the wiring substrate 2 is located so as to form an obtuse angle with respect to the main body 22. Therefore, in the case of manufacturing the lead 4 by bending a part of the metal plate by press working or the like as in the present embodiment, the molded lead raw material portion 43, that is, the lead 4 can be easily removed from the supporting die 51.
The tip surface 23a is inclined with respect to the joint surface 12a such that the thickness of the solder 24 between the tip surface 23a and the joint surface 12a gradually increases from the side of the tip surface 23a where the exposed portion 21 is located toward the side opposite to the exposed portion 21. Here, if the distal end surface 23a is a plane substantially orthogonal to the extending direction of the main body 22, the exposed portion 21 becomes substantially parallel to the wiring board 2 only by disposing the lead 4 on the lower surface 2b, and the distal end surface 23a is inclined with respect to the bonding surface 12a so that the gap between the bonding surface 12a gradually increases from the side where the exposed portion 21 is located toward the side opposite to the exposed portion 21. Therefore, for example, even if the distal end surface 23a is not subjected to a process of forming irregularities or the like, the thickness of the solder 24 between the distal end surface 23a and the bonding surface 12a can be made uneven, and the lead 4 can be easily manufactured.
(3) Since the angle θ2 formed by the joint surface 12a and the distal end surface 23a is substantially equal to the angle θ1 formed by the extending direction of the main body 22 and the perpendicular to the joint surface 12a, the degree of inclination of the distal end surface 23a with respect to the joint surface 12a can be easily grasped by observing the degree of inclination of the main body 22 with respect to the 2 nd electrode pad 12.
(4) Since the notch 31 cut to include the side surface 22c and the distal end surface 23a of the main body 22 is formed in the distal end portion 23, the solder 24 is wetted on the inner surface of the notch 31, so that the fillet can be formed, and the bonding strength of the lead 4 to the wiring board 2 can be appropriately improved. Further, since the rounded corners are formed in the cutouts 31, the mounting area of the leads 4 can be suppressed from becoming large, and the wiring board 2 can be highly integrated.
The present embodiment can be modified as follows. The present embodiment and the following modifications can be combined with each other within a range that is not technically contradictory.
In the above embodiment, the lead 4 is formed in a plate shape, but the present invention is not limited thereto, and for example, the lead may be formed in a quadrangular prism shape, and the shape thereof may be changed as appropriate. The lead 4 may not be bent, and the base end 25 of the main body 22 may be exposed to the outside of the sealing body 5. In this case, the base end portion 25 functions as an exposed portion.
In the above embodiment, the main body 22 extends in the direction inclined with respect to the joint surface 12a, but the present invention is not limited thereto, and the main body 22 may extend in the direction orthogonal to the joint surface 12a, for example, as long as the thickness of the solder 24 between the distal end surface 23a and the joint surface 12a becomes uneven.
In the above embodiment, the slit 31 is formed in a fan shape, but the present invention is not limited thereto, and may be formed in a triangular shape as shown in fig. 11, for example, and the shape thereof may be changed as appropriate. Note that the notch 31 may be formed only in any one of the front end portions 23 in the direction orthogonal to the plate thickness direction, and the notch 31 may not be formed in the front end portions 23.
In the above embodiment, the angle θ2 formed by the joint surface 12a and the distal end surface 23a may be different from the angle θ1 formed by the extending direction of the main body 22 and the perpendicular to the joint surface 12a.
In the above embodiment, the tip end surface 23a is inclined with respect to the joint surface 12a so that the thickness of the solder 24 gradually increases from the side of the tip end surface 23a where the exposed portion 21 is located toward the side opposite to the exposed portion 21. However, the thickness of the solder 24 may be increased gradually from the side opposite to the exposed portion 21 in the distal end surface 23a toward the side where the exposed portion 21 is located, for example, by tilting the distal end surface 23a with respect to the joint surface 12a as shown in fig. 12. Further, the entire distal end surface 23a may not be inclined with respect to the joint surface 12a, and for example, as shown in fig. 13, the distal end surface 23a may be formed so that the thickness of the solder 24 is smallest at the center of the distal end surface 23a in the plate thickness direction of the main body portion 22 and gradually increases toward both sides in the plate thickness direction.
In the above embodiment, the electronic module 1 may not include the heat sink 6.
In the above embodiment, the solders 13 and 24 are used as the bonding material having conductivity, but the invention is not limited thereto, and other bonding materials such as silver paste may be used.
Description of the reference numerals
θ1, θ2: angle, 1: electronic module, 2: wiring substrate, 2a: upper surface, 2b: lower surface, 3: electronic component, 4: lead wire, 5: sealing body, 11: 1 st electrode pad, 12: 2 nd electrode pad, 12a: joint surface, 21: exposed portion, 22: body portion, 22a: upper surface, 22b: lower surface, 22c: side, 23: tip end portion, 23a: top end face, 24: solder, 25: base end portion, 31: and (5) cutting.

Claims (4)

1. An electronic module is provided with:
a wiring substrate having a main surface on which electrode pads having bonding surfaces are provided;
a lead electrically connected to the electrode pad via a bonding material having conductivity; and
a sealing body for sealing the lead wire,
wherein,
the lead wire has:
an exposure portion exposed to the outside of the sealing body; and
a main body portion extending from the exposed portion toward the wiring board and having a distal end portion on the wiring board side,
the tip portion is connected to the electrode pad via the bonding material,
the tip surface of the tip portion is formed to have a non-uniform thickness in a direction orthogonal to the bonding surface of the bonding material between the tip surface and the bonding surface of the electrode pad.
2. The electronic module of claim 1, wherein,
the body portion extends in a direction inclined with respect to the engagement surface,
the exposed portion is continuous with a base end portion of the main body portion on the opposite side of the main surface, and is bent toward the side where the wiring substrate is located so as to form an obtuse angle with respect to the main body portion,
the tip end surface is inclined with respect to the joint surface such that the thickness of the joint material between the tip end surface and the joint surface gradually increases from a side of the tip end surface where the exposed portion is located toward a side opposite to the exposed portion.
3. The electronic module of claim 2, wherein,
the angle formed by the joint surface and the top end surface is equal to the angle formed by the extending direction of the main body part and the perpendicular line relative to the joint surface.
4. The electronic module according to any one of claim 1 to 3, wherein,
a notch is formed in the distal end portion, and the notch is cut to include the side surface of the main body portion and the distal end surface.
CN202080031810.7A 2019-06-24 2020-06-09 Electronic module Active CN113748510B (en)

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JP2019-116764 2019-06-24
PCT/JP2020/022599 WO2020261969A1 (en) 2019-06-24 2020-06-09 Electronic module

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JP7103519B2 (en) 2022-07-20
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US20220093502A1 (en) 2022-03-24
WO2020261969A1 (en) 2020-12-30

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