JP5146232B2 - Lead-type electronic components - Google Patents

Description

  The present invention provides an electronic device having a plurality of external electrodes, a plurality of pad portions to which each external electrode of the electronic device is electrically connected, and one of the pad portions that is integrally formed and electrically connected. Further, the present invention relates to a lead-type electronic component comprising a plurality of lead terminals and a resin package part for resin-sealing the electronic device and the pad part.

  As an example of a conventional lead type electronic component, there is a lead type oscillator including a piezoelectric vibration device. As an example of this lead type oscillator, there is a lead type crystal oscillator having a crystal resonator as a piezoelectric vibration device as shown in FIG.

  The lead-type crystal oscillator shown in FIG. 16 includes a metallic base 105, a bonding material 106 comprising a solder 161 having a truncated cone shape at the center and an insulating resin 162 covering the side surface of the solder 161 on the upper surface of the base 105. Printed circuit board 102 that is mounted using a solder, and electronic material that is mounted on the upper surface of the printed circuit board 102 using a bonding material 104 that includes a truncated cone-shaped solder 141 and an insulating resin 142 that covers the side surface of the solder 141. A quartz crystal resonator element 101 mounted on supports 131 and 132 provided with a component 133 and an excitation electrode and disposed on the upper surface of the printed wiring board 102; an upper surface of the base 105; the printed wiring board 102; the electronic component 133; Etc., and a metallic cap 107 that covers the like.

  Further, this lead-type crystal oscillator includes three terminals 151, 152, and 153, and two of these terminals 151, 152, and 153 are lead terminals, and the base 105 The printed circuit board 102 is individually inserted into through holes (not shown) provided in the printed circuit board 102, and one end of the printed circuit board 102 is fixed to the upper surface of the printed circuit board 102. On the other hand, the remaining one terminal 152 is a ground terminal, and one end thereof is connected to the metal portion of the base 105.

An electronic component connection structure having such a configuration is disclosed in, for example, Japanese Patent Application Laid-Open No. 4-222109 of Patent Document 1 below.
JP-A-4-222109

  However, in the crystal oscillator shown in FIG. 16, since the weight ratio of the main body housing portion composed of the metallic cap and the metallic base to the lead terminal is likely to be large, the zigzag folded tape packaging or the radial taping packaging state When the product is shipped, the main body housing part is tilted with respect to the taping part or disposed in a collapsed state. Therefore, there is a problem that automatic mounting cannot be easily performed when mounting a crystal oscillator on an electronic device. Further, the crystal oscillator shown in FIG. 16 has a problem that it is difficult to cope with downsizing of the lead type crystal oscillator.

  The present invention has been devised to solve such a problem, and its purpose is to include a piezoelectric vibration device, which can be easily mounted automatically when mounted on an electronic device, and is also compatible with downsizing. An object of the present invention is to provide a lead-type electronic component that can be used.

In order to solve the above problems, a lead-type electronic component according to the present invention includes a plurality of lead terminals, a plurality of pad portions provided at one end of the plurality of lead terminals, and a piezoelectric vibration including a piezoelectric vibrating piece. A plurality of pad portions and a resin package portion for resin-sealing the piezoelectric vibration device together with one end portions of the plurality of lead terminals, and at least one pad portion of the plurality of pad portions includes at least the pad portion. Protruding portions projecting in a direction perpendicular to the one principal surface are provided on the outer peripheral edge of one principal surface of one pad portion, the piezoelectric vibration device is mounted on the one principal surface side, and the pad portion is , which punching with means punching the metal sheet was subjected molded, the protrusion is what punching burr der Rutoitta formed during punching

  As the piezoelectric vibration device, a small surface-mount type piezoelectric vibration device can be used. This surface-mount type piezoelectric vibration device is, for example, a surface-mount type piezoelectric resonator including a crystal resonator element (piezoelectric vibrator) including a pair of excitation electrodes and a housing including a cavity in which the crystal resonator element is disposed. Surface mounted type comprising a quartz crystal resonator, a quartz crystal vibrating piece provided with a pair of excitation electrodes, a housing provided with a cavity in which the quartz crystal vibrating piece is arranged, and an integrated circuit element arranged in the cavity A crystal oscillator or a surface mount provided with a crystal vibrating piece in which an input electrode and an output electrode are formed on one main surface of a crystal piece, and a ground electrode corresponding to the input electrode and the output electrode is formed on the other main surface Type crystal filter.

  Referring to FIG. 1 and FIG. 2, the lead-type electronic component of the present invention includes first to third lead terminals 1a to 1c, which are a plurality of lead terminals, and first to third leads. The first to third pad portions 2a to 2c, which are a plurality of pad portions extended by being integrally formed at each one end portion of the lead terminals 1a to 1c, and the second pad portion 2b, are mounted on the first pad portion 1b. The piezoelectric vibration device (for example, a crystal oscillator 3, a crystal resonator, or a crystal filter) that is electrically connected to the third pad portions 2a and 2c and includes a piezoelectric vibrating piece, and the first to third lead terminals 1a. The first to third pad portions 2a to 2c and the resin package portion 4 that seals the crystal oscillator 3 together with the one end portions to 1c.

  Further, the second pad 2b, which is one of the plurality of pad portions, is a protrusion that protrudes in a direction perpendicular to the one main surface at the outer peripheral edge of one main surface of the second pad portion 2b. (A punching burr described later (see FIG. 5)) is provided. The crystal oscillator 3 is mounted on one main surface side of the second pad 2b.

  As a result, when the piezoelectric vibration device is mounted on the pad portion and electrically and mechanically connected, a work surface on which the pad portion is placed is formed on the other main surface of the pad portion (a protruding portion that is a punching burr). Since the flat surface is not in contact, the flatness of the pad portion can be improved. Therefore, the stability of the electromechanical joining between the piezoelectric vibrating device and the pad portion can be improved, and the occurrence of poor connection can be prevented. Therefore, a small surface-mount type piezoelectric vibration device can be mounted, and a resin package portion can be used as a member for sealing the piezoelectric vibration device. As a result, zigzag folding tape packaging and radial taping packaging can be performed, and automatic mounting can be easily performed when mounting on electronic equipment. Furthermore, a lead-type electronic component that is miniaturized can be obtained.

Further, according to the present invention, the pad portion is formed by punching a metal thin plate using a punching means, and the protrusion is a punching burr formed at the time of punching, When a lead frame is formed by punching a thin metal plate, the protrusions can be formed at the same time, and the protrusions can be formed more inexpensively and easily.

  Further, at least one lead terminal of the plurality of lead terminals may include a skew portion.

  In this case, the lead pitch can be set according to the specifications of the electronic device.

  Moreover, it is preferable that the said resin package part is shape | molded by the column shape of a cross-sectional semicircle or a cross-sectional substantially semicircle.

  The resin package portion may be formed in a tapered column shape having a semicircular cross section or a substantially semicircular cross section.

  In this case, since the resin package part can be easily extracted from the mold, even a single mold can be formed.

  The resin package part may be molded in a hemispherical shape or a substantially hemispherical shape.

  In this case, the resin package can be positioned more accurately.

  Further, at least a part of the end surface of at least one of the plurality of pad portions may be formed in a zigzag shape.

  In this case, since the contact area between the pad portion and the resin mold portion can be increased, it is possible to prevent the lead terminal from dropping (dropping out) together with the pad portion from the resin mold portion.

  Moreover, the bank part may be provided in at least one part of the edge part of the at least 1 pad part of the said some pad parts.

  In this case, the contact area between the pad portion and the resin mold portion can be increased, and the bank portion is caught inside the resin mold portion, so that the lead terminal is dropped from the resin mold portion together with the pad portion. Can be prevented.

  Since the present invention is configured as described above, the piezoelectric vibration device is provided and can be automatically mounted on an electronic apparatus.

  Hereinafter, embodiments of a lead-type electronic component of the present invention will be described with reference to the drawings. As the piezoelectric vibration device, a surface mounting type can be used, and here, a description will be given using a crystal oscillator including a crystal vibrating piece as an example of the surface mounting type piezoelectric vibration device. Here, a case will be described in which a crystal oscillator is bonded and fixed to a second pad portion among a plurality of pad portions constituting a lead type electronic component.

  1A and 1B are explanatory views showing Embodiment 1 of the lead type electronic component of the present invention, where FIG. 1A is a perspective view, and FIG. 1B is a view of the lead type electronic component from the direction indicated by D1. FIG. 4C is a front view showing the state of the lead-type electronic component viewed from the direction indicated by D2, and FIG. 4D is a view of the lead-type electronic component viewed from the direction indicated by D3. It is a side view which shows the state. 2 is an explanatory diagram showing a state in which the resin mold portion of the lead type electronic component shown in FIG. 1 is omitted, and FIG. 3 is an example of a crystal oscillator constituting the lead type electronic component shown in FIG. It is sectional drawing which expands and shows.

  As shown in FIGS. 1 and 2, the lead-type electronic component of the present embodiment includes a plurality of lead terminals (here, the first lead terminal 1a, the second lead terminal 1b, and the third lead terminal 1c), and these A plurality of pad portions extending to one end portions of the first to third lead terminals 1a to 1c (here, a first pad portion 2a extending to one end portion of the first lead terminal 1a, a second lead terminal) The second pad portion 2b extending to one end portion of 1b and the third pad portion 2c extending to one end portion of the third lead terminal 1c) are mounted on the second pad portion 2b. The first to third pad portions 2a to 2c are electrically connected to the pad portions 2a and 2c, and the crystal oscillator 3 having the piezoelectric vibrating reed and the one end portions of the first to third lead terminals 1a to 1c are provided. And a resin package part 4 for resin-sealing the crystal oscillator 3. There.

  As shown in FIG. 3, the crystal oscillator 3 covers, for example, an insulating base 31 a made of a ceramic multilayer substrate or the like having a stepped recess 31 a 1 as a cavity on one main surface and an opening portion of the stepped recess 31 a 1. A casing 31 composed of a lid 31b, a plurality of electrode pads (not shown) formed in the stepped recess 31a1, and an upper step of the stepped recess 31a1 (the step closest to the opening of the stepped recess 31a1) Part) 31a11, the crystal resonator element 32 supported by at least a part of the upper step portion 31a11 by placing the end portion thereof, and the integrated circuit element 33 constituted by an amplifier circuit on the bottom surface 31a12 of the stepped recess portion 31a1. It consists of and. Further, the crystal oscillator 3 includes a plurality of external electrodes (here, four external electrodes 34a, 34b, 34c, 34d) electrically connected to the electrode pads on the other main surface of the base 31a. Further, the contact portion (outer peripheral edge portion) between the base 31a and the lid 31b is joined by a sealing joining material (not shown), and the inside (cavity) of the housing 31 is hermetically sealed.

  The quartz crystal vibrating piece 32 includes a pair of excitation electrodes (not shown), and each excitation electrode is bonded by a conductive resin bonding material 35 formed on the electrode pad and connected to an integrated circuit element to be described later. Has been.

  A plurality of external electrodes (not shown) of the integrated circuit element 33 are electrode pads (not shown) formed on the lower step portion (step portion provided on the bottom surface 31a12 side of the upper step portion 31a11) 31a13. In addition, wire bonding is performed via wires 36a and 36b. At least a part of each excitation electrode of the crystal vibrating piece 32 and at least a part of each external electrode of the integrated circuit element 33 are electrically connected to each other via the electrode pad and the wire according to the specifications of the lead type electronic component. Connected.

  In the present embodiment, the lid 31b of the crystal oscillator 3 is formed using a conductive material such as metal for noise removal, and is a pad portion (integrated with a lead terminal for GND (installation)) ( For example, it is fixed and electrically connected to the second pad portion 2b) integrally formed with the second lead terminal 1b using a conductive paste. Although not shown, among the plurality of external electrodes of the crystal oscillator 3, the GND external electrode (for example, the external electrode 34b on the upper right side in FIG. 2) is connected to the second pad portion 2b by wire bonding using a wire. May be electrically connected.

  Of the plurality of external electrodes of the crystal oscillator 3, the output external electrode (for example, the external electrode 34c on the lower right side in FIG. 2) is a pad portion (here, the first electrode) formed integrally with the output lead terminal. An external electrode for input (for example, the external electrode on the lower left side of FIG. 2 in FIG. 2) is electrically connected to the first pad portion 2a integrally formed with one lead terminal 1a by wire bonding using the first wire 5a. 34d) is electrically connected to a pad portion integrally formed with the input lead terminal (here, the third pad portion 2c integrally formed with the third lead terminal 1c) by wire bonding using the second wire 5b. Has been.

  Although not shown, among the plurality of external electrodes of the crystal oscillator 3, an external electrode for operation (ON / OFF) control (for example, the external electrode 34a on the upper left in FIG. 2) is a lead terminal for operation control. The pad portion formed integrally may be electrically connected via a wire, and in order to control the crystal oscillator 3 to be always turned on when a voltage is applied, the external electrode 34a is used for input. You may electrically connect to the 3rd pad part 2c which is a pad part integrally formed in the lead terminal by wire bonding using a wire.

  Further, in the present embodiment, the lead pitch of the first to third lead terminals 1a to 1c can be changed according to the specifications of the electronic device to be mounted. In the present embodiment, the skewed portions 1a1 and 1c1 are formed in the first lead terminal 1a and the third lead terminal 1c, and the skewed portion 1a1 of the first lead terminal 1a and the skewed portion of the third lead terminal 1c. 1c1 is extended in the direction away from the 2nd lead terminal 1b toward each front-end | tip part (lower end part in FIG. 1) of the 1st lead terminal 1a and the 3rd lead terminal 1c. Thereby, the lead pitch of the 1st-3rd lead terminals 1a-1c in a front-end | tip part (lower end part in FIG. 1) is wider than the lead pitch of the 1st-3rd lead terminals 1a-1c in the resin package part 4 surface. It has become.

  The lead-type electronic component of the present embodiment includes three lead terminals (first to third lead terminals 1a to 1c) as a plurality of lead terminals. The number of lead terminals is a crystal resonator or the like. The piezoelectric vibration device can be changed in accordance with the specification (for example, the number of external electrodes) and the electronic component.

  Furthermore, a protrusion (explained in detail later) is formed on one main surface of the first to third pad portions 2a to 2c so as to protrude in a direction perpendicular to the one main surface on the outer peripheral edge of the one main surface. In this embodiment, a piezoelectric vibration device is fixed and mounted on one main surface of the second pad portion 2b using an adhesive.

  Next, the lead frame and the protrusions used when manufacturing the lead-type electronic component shown in FIG. 1 will be described.

  FIG. 4 is an explanatory view showing an example of a lead frame used when manufacturing the lead-type electronic component shown in FIG. 1, and FIG. 5 is a diagram of a pad portion constituting the lead-type electronic component shown in FIG. FIG. 6 is an enlarged explanatory view showing a cross section taken along the line C-C, and FIG. 6 is a cross-sectional view showing an example of a punching means used when the lead frame shown in FIG. 4 is molded.

  Note that a broken line A in FIG. 4 is a boundary line between a portion disposed inside the resin package portion 4 and a portion disposed outside the resin package portion 4 when completed, and more specifically, a paper surface than the broken line A. The upper region (A) is disposed inside the resin package part 4, and the region (B) below the paper surface from the broken line A is disposed outside the resin package unit 4. FIG. 5 shows only the second pad portion 2b among the first to third pad portions 2a to 2c constituting the lead-type electronic component shown in FIG.

  As shown in FIG. 4, the lead frame 11 is integrally formed with the first to third lead terminals 1a to 1c, the first to third pad portions 2a to 2c, and the first to third lead terminals 1a to 1c. Thus, the first to third lead terminals 1a to 1c are configured to support the tie bar portion 11a. The lead frame 11 is formed by punching a thin metal plate using a punching means (for example, a punching device 80 shown in FIG. 6).

  A punching device 80 shown in FIG. 6 includes a holding portion 81 that fixes an unnecessary portion of the thin metal plate 10 and fixes the thin metal plate 10, and a cross-sectional shape of both main surfaces (one main surface and the other main surface) of the lead frame 11. It is comprised from the punch part 82 which corresponds to a shape. More preferably, the holding part 81 is a first die pad 81a pressed against one main surface (upper surface 10a in the drawing) of the thin metal plate 10 and a first die pad 81a pressed against the other main surface (lower surface 10b in the drawing) of the thin metal plate 10. 2 pads 81b. The first die pad 81a is provided with a guide hole 81a1 through which one end of the punch portion 82 is fitted and penetrated, and the second die pad 81b is provided with a guide hole 81b1 through which one end of the punch portion 82 is fitted and penetrated. (Or a guide groove into which one end portion of the punch portion 82 is fitted) is provided.

  When forming the lead frame 11, first, the thin metal plate 10 is sandwiched and fixed between the first die pad 81a and the second die pad 81b (see FIG. 6A). At this time, the guide hole 81a1 of the first die pad 81a and the guide hole 81b1 of the second die pad 81b are opposed to each other with the thin metal plate 10 interposed therebetween.

  Subsequently, the punch portion 82 is inserted into the guide hole 81a1 of the first die pad 81a along the punching direction (the direction in which the punch portion is lowered from the top to the bottom on the paper surface), and the metal thin plate 10 is pressed by the punch portion 82. Through the punching process, the lead frame 11 is punched and molded (see FIG. 6B).

  Since the lead frame 11 is molded using such a punching device, punching burrs are formed on the cut surface which is an end surface formed by punching. That is, a punching burr that protrudes in a direction perpendicular to the one main surface is also formed on the outer peripheral edge of one main surface of the first to third pad portions 2a to 2b. In this embodiment, this punching burr is used as the projection.

  Specifically, as shown in FIG. 5, a punching burr 2b1 is formed at the end of the upper surface of the second pad portion 2b. Since this punching burr 2b1 is slightly formed at the end, in this specification, the punching burr is shown only in FIG. 5, and the punching burr is not shown in other drawings.

  In general, when punching burrs occur, when performing die bonding or wi bonding, the lead frame with the surface where the punching burrs are generated (here, the main surface) being the back surface on the support base When 11 is placed, the height of the punching burr and the portion to be formed are not uniform, so that the lead frame 11 is inclined and the flatness of the pad portion is lost. As a result, when performing die bonding or wi bonding, there are cases where the position where the bonding is performed shifts or a connection failure occurs. Therefore, conventionally, after the lead frame 11 is molded, the punching burrs are removed by polishing or the like.

  However, in the present embodiment, the lead frame 11 is disposed and used in a state where the surface where the punching burrs are generated is the front surface and the surface where the punching burrs are not generated (here, the other main surface) is the back surface. This prevents the lead frame 11 from being tilted and the flatness of the pad portion from being lost. As a result, it is possible to prevent the execution position from being shifted when performing die bonding or wire bonding on the pad portion, and a defect occurs in electrical connection between the piezoelectric vibrating device and the pad portion. Can be prevented.

  Further, without removing the punching burrs, die bonding is performed on one main surface (the upper surface of the second pad portion 2b in FIG. 5) on which the padding burrs are generated by using a conductive adhesive, and the crystal The oscillator 3 is electrically connected and fixed. Thereby, the punching burr (in FIG. 5, punching burr 2b1 formed in the upper surface end part of the 2nd pad part 2b) plays the role of the bank part in the edge part of one main surface of a pad part, and a conductive adhesive is It is possible to prevent the pad portion from overflowing (overflowing) from one main surface.

  When punching is performed, punching burrs are formed not only on the outer peripheral edge of one main surface of the second pad portion 2b but also on the entire outer peripheral edge of the lead frame. That is, punching burrs are also formed on the outer peripheral edge of one main surface of the first to third lead terminals 1a to 1c and the first and third pad portions 2a and 2c. As a result, in the completed lead-type electronic component, it is possible to prevent the punching burr from being caught inside the resin package part 4 and the first to third lead terminals 1a to 1c from falling off the resin mold part 4.

  Further, when there is a portion to be removed among the punching burrs formed on the entire outer periphery of the lead frame, the portion to be removed may be removed by polishing or the like.

  Furthermore, etching may be used in place of the punching process when forming the protrusion such as the punching burr.

  FIG. 7 is an enlarged plan view showing the lead-type electronic component shown in FIG. In the figure, the second pad portion 2b, the crystal oscillator 3, the first wire 5a, and the second wire 5b arranged in the resin package portion 4 are shown using broken lines.

  The resin package portion 4 is formed, for example, in a semicircular column shape (not shown) or a substantially semicircular column shape, and the height direction is parallel to the length direction of the second lead terminal 1b. It has become.

  The columnar shape having a semicircular cross section is a shape obtained by cutting a cylindrical shape along the height direction, and the columnar shape having a substantially semicircular cross section is obtained by cutting the columnar shape along the height direction, This is a shape obtained by further cutting the boundary portion between the cut surface formed by this cutting and the tunnel-like curved surface (the surface that has become the cylindrical side surface) along the height direction.

  FIG. 1 and FIG. 7 show a resin package portion 4 molded into a columnar shape having a substantially semicircular cross section. A portion 4a of the side surface (surface parallel to the length direction of the second lead terminal 1b) of the resin package portion 4 is a flat surface (front surface shown in FIG. 1C) and is not shown. However, printing such as laser marking is applied to the flat portion 4a. On the other hand, another part of the side surface of the resin package part 4 (part facing the flat part 4a) 4b is a tunnel-like curved surface.

  In the resin package portion 4 having such a shape, the second pad portion 2b is disposed on the portion 4a side which is a flat surface, and the crystal oscillator 3 is another portion 4b which is a tunnel-like curved surface. Arranged on the side.

  As described above, the second pad portion 2b and the crystal oscillator 3 are arranged in the resin package portion 4 in a state as shown in FIG. 7, so that the first wire 5a and the second wire 5b are printed such as laser marking. Can be prevented from being affected. Furthermore, since the first wire 5a and the second wire 5b are arranged on the other part 4b side which is a tunnel-like curved surface, there are variations in the slackness of the first wire 5a and the second wire 5b and the position of the apex. Even if it occurs, the distance from the first wire 5a and the second wire 5b to the surface of the resin package part 4 can be maintained at a sufficient length.

  For example, the distance B1 from the center portion of the second pad portion 2b to the flat portion 4a and the top portion of the other portion 4b having a tunnel-like curved surface from the center portion of the second pad portion 2b. The position of the second pad portion 2b in the resin package portion 4 may be set so that the ratio of the length to the distance B2 is in the state shown in Expression (1).

B1: B2 = 1.5: 2.5 Formula (1)
The resin package portion 4 is formed using a mold composed of an upper mold and a lower mold, for example.

  FIG. 8 is a cross-sectional view showing an example of the state of the manufacturing process of the lead-type electronic component shown in FIG. 1, and a part disposed inside the resin package part 4 and a part disposed outside the resin package part 4 when completed. The state cut along the boundary surface is shown.

  On the lower surface of the upper mold 61 of the mold 60 and the upper surface of the lower mold 62, a concave portion 61a that forms a cavity having the same shape as the resin package portion 4 when the upper mold 61 and the lower mold 62 are overlapped with each other. 62a is formed.

  A groove portion having substantially the same shape as a portion of the lead frame 11 that is not resin-sealed by the resin package portion 4 is formed on the upper surface of the lower die 62 of the mold 60 shown in FIG. Therefore, when the lead frame 11 is sandwiched between the upper die 61 and the lower die 62, a portion of the lead frame 11 that is not resin-sealed by the resin package portion 4 is accommodated in the groove portion. However, the groove may be formed on the lower surface of the upper mold 61 instead of the lower mold 62, or may be formed across the upper mold 61 and the lower mold 62.

  When forming a lead-type electronic component using such a mold 60, first, the crystal oscillator 3 is electrically and mechanically connected to the lead frame 11 by die bonding and wire bonding.

  Next, in a state where the lead frame 11 is positioned and fixed so that the region (a) of the lead frame 11 together with the crystal oscillator 3 and the first and second wires 5a and 5b is disposed in the recess 61a of the lower die 61, The upper die 62 is lowered from above the die 61, and the lead frame 11 is sandwiched between the lower die 61 and the upper die 62 from above and below in the drawing (see FIG. 8A). At this time, in the cavity formed by the concave portions 61a and 62a of the lower die 61 and the upper die 62, the region (ii) of the lead frame 11, the crystal oscillator 3, and the first and second wires 5a shown in FIG. , 5b.

  In such a state, the cavity is filled with a thermosetting resin (for example, an epoxy-based resin (tablet-shaped, high-temperature curing), and subjected to vacuum heat treatment to cure the thermosetting resin. The package part 4 is formed (see FIG. 8B).

  Thereafter, the lead mold 11 is released from being sandwiched between the lower mold 61 and the upper mold 62 by raising the upper mold or the like, and then the resin package portion 4 is taken out from the mold (lower mold).

  Finally, by removing unnecessary parts such as the resin flash formed when the resin package part 4 is taken out of the mold and the diver part 11a (see FIG. 4), a lead type electronic component (crystal oscillator) ) Can be obtained.

  In the lead-type electronic component (crystal oscillator) of this embodiment, the flatness of the pad portion can be stabilized. For this reason, even when a miniaturized surface-mount type crystal oscillator is used as a piezoelectric vibration device, a connection failure occurs between the piezoelectric vibration device and the pad due to a shift in the position where die bonding or wire bonding is performed. Can be prevented. Accordingly, the surface-mount type crystal oscillator can be easily used as a lead-type electronic component with a simpler configuration and easily. In addition, a lead-type electronic component that is miniaturized can be obtained by using a miniaturized surface-mount crystal oscillator. As a result, zigzag folding tape packaging and radial taping packaging can be performed, and automatic mounting can be easily performed when mounting on electronic equipment.

  In addition, the shape of the resin package part 4 is not limited to the shape shown in FIG.

  FIG. 9 is a perspective view showing a modification of the resin package part constituting the lead type electronic component shown in FIG. 1, and FIG. 10 shows the lead type electronic part having the resin package part shown in FIG. It is explanatory drawing which shows an example of the metal mold | die used when forming.

  In the present modification, the resin package part 40 has a bowl-shaped cross section like the resin package part 4 shown in FIG. 1, but is formed in a tapered column shape unlike the resin package part 4 shown in FIG. 1. In other words, the resin package portion 40 is different in that the cross-sectional shape is not a semicircular shape but a bowl shape, but is formed into a shape substantially the same as a shape obtained by dividing the truncated cone shape into two equal parts along the height direction. . More specifically, the area of one end surface of the resin package portion 40 (the surface from which the first to third lead terminals 1a to 1c protrude and the lower surface of the paper surface) 40a is the other end surface (the end surface facing the one end surface). , The upper surface of the paper surface) 40b.

  When the resin package portion 40 is formed into a tapered column shape as shown in FIG. 9, it is composed of two types such as a lower die and an upper die as shown in FIG. 8 in the same manner as the resin package 4 shown in FIG. A mold may be used, but a single mold 50 as shown in FIG. 10 can also be used.

  A recess 50a is formed in the mold 50 by machining or the like, and the recess 50a has a shape in which the resin package portion 40 is rotated halfway so that the positions of the one end surface and the other end surface are interchanged. Further, for example, a cylindrical through hole 50a1 is provided at the bottom of the recess 50a, and the resin package part 40 is inserted into the recess 50a when the resin package part 40 is taken out from the recess 50a after molding. A push-up member 50b for pushing up toward the opening is disposed. The push-up member 50b is a rod-shaped member having a shape in which one end can be fitted into the through hole 50a1. That is, the push-up member 50b prevents the thermosetting resin from flowing out of the through hole 50a1 to the outside of the recess 50a when the recess 50a is filled with the thermosetting resin.

  When forming the resin package portion 40, the region (a) of the lead frame 11 together with the crystal oscillator 3 and the first and second wires 5a, 5b is inserted into the recess 50a from the opening, and the region of the lead frame 11 ( In the state where the lead frame 11 is positioned and fixed so that the crystal oscillator 3 and the first and second wires 5a and 5b are disposed in the recess 50a, the recess 50a is filled with a thermosetting resin. In such a state, the molding of the resin package part 40 is completed by applying a heat treatment to cure the thermosetting resin.

  Finally, the resin package part 40 is pushed up toward the opening by the push-up member 50b, and the resin package part 40 is extracted from the recess 50a. In this modification, since the shape of the resin package part 40 is tapered, the resin package part 40 can be easily extracted from the mold 50 as compared with the resin package part 4 shown in FIG.

  The shape of the push-up member 50b is not limited to the shape shown in FIG. For example, the end portion (the one end portion) on the side disposed in the through hole 50a1 in both end portions of the push-up member 50b may be provided with a flange prevention flange portion having a larger diameter than the through hole 50a1. This flange portion for preventing slipping is disposed on the bottom surface of the recess 50a so as to cover the end portion (upper end portion of the paper surface) of the through hole 50a1. In addition, the cross-sectional shape of the pull-out preventing flange portion may be circular or other shapes such as a square shape.

  Moreover, when forming the resin package parts 4 and 40, as the thermosetting resin, a thermosetting resin (for example, an epoxy resin (tablet-like, high-temperature curing) different from the epoxy resin described above is used. (Liquid and low-temperature curing) or silicone resins (liquid and low-temperature curing)) may be used. In addition, when the former thermosetting resin (for example, epoxy resin (tablet-shaped, high-temperature curing)) is used, disconnection and deformation of the first and second wires 5a and 5b are more reliably prevented. This is preferable. On the other hand, when the latter thermosetting resin (for example, a poxy resin (liquid, low temperature curing) or a silicone resin (liquid, low temperature curing)) is used, the former thermosetting resin is used. The resin package part can be molded by using a mold formed of an inexpensive material having lower heat resistance than that of using a mold, and this is preferable because the manufacturing cost can be reduced.

  Next, another modification of the resin package part will be described.

  FIG. 11 is a perspective view showing another modified example of the resin package portion constituting the lead type electronic component shown in FIG. 1, wherein FIG. 11 (a) is a perspective view and FIG. 11 (b) is a lead type electronic device. The top view which shows the state which looked at the components from the direction shown by D11, the figure (c) is a front view which shows the state which looked at the lead type electronic parts from the direction shown by D12, and the figure (d) is the lead type electronic. It is a side view which shows the state which looked at the components from the direction shown by D13.

  In this modification, the resin package part is molded in a hemispherical shape or a substantially hemispherical shape. The hemispherical shape is a convex lens shape obtained by cutting and removing a part of the spherical shape. Also, the substantially hemispherical shape means that a part of the spherical shape is cut and removed, and the circular cut surface and the convex lens shape are formed so that the circular cut surface formed by this cutting becomes a square cut surface. The boundary portion with the curved surface (the surface that has been a spherical surface) is cut at two points along a direction parallel to the length direction of the second lead terminal 1b and perpendicular to the length direction. It is the shape which cut | disconnected two places along an arbitrary direction.

  FIG. 11 illustrates a lead-type electronic component including the resin package portion 70 molded in the substantially hemispherical shape. A portion 70a of the surface of the resin package portion 70 is a flat surface (the front surface shown in FIG. 11B). Although not shown, the flat surface 70a has a laser marking or the like. Is printed. On the other hand, another part of the surface of the resin package part 70 (part facing the flat part 70a) 70b is a convex lens-shaped curved surface.

  When a lead-type electronic component is mounted on an electronic device by forming a convex lens-shaped curved surface by molding the resin package part into a hemispherical shape or a substantially hemispherical shape, the vertical direction (the length direction of the second lead terminal 1b) The resin package 70 can be positioned not only in the direction perpendicular to the horizontal direction but also in the horizontal direction (direction parallel to the length direction of the second lead terminal 1b).

  In the lead-type electronic component of the present invention, the shape of the resin package part is not limited to the form shown in FIGS. 1, 9, and 11, and may be, for example, a rectangular parallelepiped shape or a cubic shape.

  Next, a modification of the pad portion constituting the lead type electronic component shown in FIG. 1 will be described.

  FIG. 12 is an explanatory view showing a modification of the pad portion constituting the lead type electronic component shown in FIG. 1, and shows the lead type electronic component with the resin mold portion omitted. FIG. 13 is an explanatory diagram showing the pad portion shown in FIG. 12 in an enlarged manner.

  In this modification, at least a part of the end surface of at least one of the plurality of pad portions constituting the lead type electronic component is formed in a zigzag shape.

  In this specification, the zigzag shape refers to a shape in which an uneven shape is formed on the end face, and the protrusions of the protrusions and the recesses of the recesses form acute angles.

  In FIG. 12, in the substantially rectangular first pad portion 12a and third pad portion 12c, out of end surfaces (upper and lower end surfaces of the paper surface) perpendicular to the length direction (up and down direction of the paper surface) of the second lead terminal 1b. The end surfaces (lower surface on the paper) 12a1 and 12c1 adjacent to the boundary portion with the first lead terminal 1a and the third lead terminal 1c are formed in a zigzag shape.

  Since the contact area between the first pad portion 12a and the third pad portion 12c and the resin mold portion can be increased by forming the zigzag in this manner, the first pad portion 12a and the first pad portion 12a It is possible to prevent the first lead terminal 1a and the third lead terminal 1c from dropping together with the third pad portion 12c.

  In addition, the site | part shape | molded in zigzag shape is not limited to the site | part shown in FIG. 12, At least one part of all the end surfaces of each pad part should just be shape | molded in zigzag shape. For example, end faces (the left end face and the right end face on the paper) parallel to the length direction of the second lead terminal 1b may be formed in a zigzag shape. In this case, the portion formed in the zigzag shape is a resin. Since it is caught inside the mold part, it is possible to more reliably prevent the lead terminal from falling off.

  In addition, in order to mold the end surface of the pad portion in a zigzag shape, the lead frame may be formed using a mold in which a zigzag shape is previously provided on the inner surface of the recess. Alternatively, the lead frame may be formed using a mold, and after the lead frame is taken out from the mold, the end face may be formed in a zigzag shape by etching, punching or cutting.

  Next, another modification of the pad portion constituting the lead type electronic component shown in FIG. 1 will be described.

  FIG. 14 is an explanatory view showing another modification of the pad portion constituting the lead type electronic component shown in FIG. 1, and FIG. 14 (a) shows both main surfaces (one main surface and another main surface of the pad portion). Is a diagram illustrating one main surface on which die bonding is performed, in which (b) is a diagram illustrating a state viewed from a direction indicated by an arrow D21, and (c) is an arrow. It is explanatory drawing which shows the state seen from the direction shown by D22.

  In this modification, a bank portion is provided on at least a part of an end of at least one pad portion of a plurality of pad portions constituting a lead type electronic component.

  In FIG. 14, in the substantially rectangular first pad portion 12a and third pad portion 12c, the end portions (FIG. 14) perpendicular to the length direction of the second lead terminal 1b (the vertical direction in FIG. 14A). In (a), the upper end portion and the lower end portion of the paper surface) from the one main surface to the end portion (the lower end portion of the paper surface in FIG. 14A) including the boundary portion with the first lead terminal 1a and the third lead terminal 1c. Projecting bank portions 22a1 and 22c1 are formed.

  By forming the bank portions 22a1 and 22c1 as described above, the contact area between the first pad portion 12a and the third pad portion 12c and the resin mold portion can be increased, and the bank portion 22a can be a resin mold portion. Since it is hooked inside, it is possible to prevent the first lead terminal 1a and the third lead terminal 1c from dropping together with the first pad portion 22a and the third pad portion 22c from the resin mold portion.

  In addition, the site | part which forms a bank part is not limited to the site | part shown in FIG. 14, The bank part should just be formed in at least one part of all the edge parts of each pad part.

  In addition, when forming the lead frame using a mold, the bank portion is previously extended from the end of the pad portion to become a bank portion, after the lead frame is taken out from the mold, You may form by performing a bending process to the boundary part of the said edge part and the member currently extended.

  The above-mentioned zigzag-shaped portion and the portion where the bank portion is provided are not limited to the end portions and end surfaces of the first pad portion 12a and the third pad portion 12c, but at least a pad portion having a small size (for example, a wire It is preferably provided in a pad portion used for bonding. Moreover, you may provide the fall prevention site | part of both a zigzag-shaped site | part and a bank part in one pad part. Furthermore, in one resin package part 4, the pad part provided with the zigzag-shaped site | part and the pad part provided with the bank part may be arrange | positioned.

  In the above-described embodiment, the lid 31b of the crystal oscillator 3 is formed using a conductive material (metal), but may be formed using a non-conductive material. The lid 31b (crystal oscillator 3) is only mechanically fixed to the second pad portion 2b by die bonding, and a wire is used for electrical connection between the second pad portion 2b and the crystal oscillator 3. This is performed by connecting the second pad portion 2b and the external electrode of the crystal oscillator 3 by wire bonding.

  In the lead type electronic component shown in FIG. 2, the crystal oscillator 3 is adhered and fixed by die bonding only to the second pad portion 2b, and is mounted on the first pad portion 2a and the third pad portion 2c. The crystal oscillator 3 is electrically and mechanically connected to the first to third pad portions 2a to 2c by performing wire bonding, respectively. The mounting and connection form of the piezoelectric vibration device such as the crystal oscillator 3 is herewith. It is not limited. For example, the piezoelectric vibration device may be mounted on the plurality of pad portions by individually bonding different portions of the piezoelectric vibration device to the plurality of pad portions.

  Further, the mounting and connection form of the piezoelectric vibration device (crystal oscillator 3) with respect to the first to third pad portions 2a to 2c is not limited to that shown in FIG. Furthermore, the number, shape, and arrangement of the pad portions, and the mounting and connection procedures may be changed according to the mounting and connection configuration and the specifications of the external electrodes of the crystal oscillator 3.

  For example, the crystal oscillator 3 is rotated halfway so that the positions of the base 31a and the lid 31b are switched from the state shown in FIG. 2, and the crystal oscillator 3 is set so that the base 31a faces the first to third pad portions 2a to 2c. You may arrange. In this case, the number, shape, and arrangement of the pad portions are set according to the specifications of the external electrodes of the crystal oscillator 3, and each external electrode has a metal bump, a metal plated bump, or a metal wire bump on any one pad portion. (Wire) or the like is used for flip chip bonding, or bonding is performed using a conductive adhesive (for example, an epoxy resin containing a conductive material) or a metal brazing material.

  With such a configuration, when each external electrode is electrically and mechanically connected to any one lead terminal, the same conductive member (metal bump, metal plating bump, metal wire bump, conductive adhesive) is used for all the external electrodes. Or a metal brazing material) can be used to complete the connection operation in a lump so that a lead-type electronic component can be formed using a general surface-mount crystal oscillator. The configuration can be further simplified. Furthermore, a general surface-mount crystal oscillator can be easily used for lead-type electronic components, and automatic mounting can be easily performed when mounted on an electronic device.

  Further, in the present invention, when forming the lead frame, a punching burr is formed on the outer peripheral edge, and a bump is formed by mounting the piezoelectric vibrating device on the surface where the punching burr is formed, that is, on one main surface side. When ultrasonic vibration is applied to a member (metal bump, metal plating bump, metal wire bump (wire), etc.), the other main surface, which is a flat surface on which no punching burr is formed, is a work table (lead frame is placed Therefore, the flatness of the pad portion can be improved, and the stability of electrical bonding between the piezoelectric vibration device and the pad portion can be improved. Further, since the punching burr plays the role of a bank portion, it is possible to prevent the conductive member (metal brazing material, conductive adhesive, or the like) from protruding (overflowing) from one main surface of the pad portion. it can.

  Next, as another example of mounting and connection of a piezoelectric vibration device, a case where the piezoelectric vibration device is electrically and mechanically connected to a plurality of lead terminals by performing flip chip bonding using metal bumps will be described with reference to the drawings. To do.

  FIG. 15 is an explanatory diagram showing another mounting and connection example of the crystal oscillator constituting the lead type electronic component shown in FIG.

  Here, the crystal oscillator is half-rotated so that the positions of the base 31 a and the lid 31 b are switched from the state shown in FIG. 2, and the external electrodes are arranged so as to face the plurality of pad portions 2. In FIG. 15, the crystal oscillator is simply indicated by a two-dot chain line E1, and the external electrodes provided at the four corners of the bottom surface of the crystal oscillator are indicated by two-dot chain lines E2 to E5.

  In the mounting and connection example shown in FIG. 15, a plurality of lead terminals are shown on the left side of the drawing as a strip-like first lead terminal 21a, on the right side of the drawing, on the right side of the drawing. It is comprised by the strip | belt-shaped 3rd lead terminal 21c. In addition, two pad portions functioning as a first pad portion and a second pad portion are provided at one end portion of the first lead terminal 21a, and the one end portion of the second lead terminal 21b is provided in the right direction in the drawing. An extended portion projecting toward the first pad portion is provided as a third pad portion, and one pad portion serving as a fourth pad portion is provided at one end portion of the third lead terminal 21c.

  When the crystal oscillator indicated by the two-dot chain line E1 is mounted on the first to third lead terminals 21a to 21c and is electrically and mechanically connected, first, on each external electrode indicated by the two-dot chain line E2 to E5. Metal bumps 20a to 20d are formed on the substrate.

  Subsequently, a crystal oscillator is disposed on the first to third lead terminals 21a to 21c so that the metal bumps 20a to 20d on the external electrodes are in contact with the first to fourth pad portions, respectively.

  Finally, ultrasonic vibration is applied to electrically and mechanically connect the external electrodes and the pad portions via the metal bumps 20a to 20d.

  In the present invention, when applying ultrasonic vibration, the other main surface, which is a flat surface on which no punching burr is formed, comes into contact with the work table (the table on which the lead frame is placed), so that the pad portion And the stability of electrical bonding between the piezoelectric vibrating device and the pad portion can be improved. Therefore, when the mounting example as shown in FIG. 15 is implemented, it is possible to more reliably prevent the occurrence of connection failure.

  In the above-described embodiment, the surface mount type crystal oscillator is used as the piezoelectric vibration device. However, for example, a surface mount type crystal resonator or a surface mount type crystal filter may be used.

  Furthermore, in order to more clearly distinguish one main surface and the other main surface of the pad portion, a mark is formed by embossing or the like in an empty region of the one main surface of the pad portion where the piezoelectric vibration device does not contact. Also good. This mark is formed, for example, by providing a convex portion at a portion of the one end face of the punch portion facing the empty region, and simultaneously pressing the convex portion into the empty region of the pad portion when punching is performed. It may be a thing.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. Therefore, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  The lead-type electronic component of the present invention can be utilized when shipped in a zigzag folded taping package or a radial taping package in order to be automatically mounted on an electronic device.

It is explanatory drawing which shows Embodiment 1 of the lead type electronic component of this invention. It is explanatory drawing which shows the state which abbreviate | omitted the resin mold part of the lead type electronic component shown in FIG. FIG. 2 is an enlarged cross-sectional view showing an example of a crystal oscillator constituting the lead type electronic component shown in FIG. 1. It is explanatory drawing which shows an example of the lead frame used when manufacturing the lead type electronic component shown in FIG. It is explanatory drawing which expands and shows the CC line cross section of the pad part which comprises the lead type electronic component shown in FIG. FIG. 5 is a cross-sectional view showing an example of a punching unit used when the lead frame shown in FIG. 4 is molded. FIG. 2 is an enlarged plan view showing the lead-type electronic component shown in FIG. 1. FIG. 2 is a cross-sectional view showing an example of a state of a manufacturing process of the lead type electronic component shown in FIG. It is a perspective view which shows the modification of the resin package part which comprises the lead type electronic component shown in FIG. It is explanatory drawing which shows an example of the metal mold | die used when forming the lead type electronic component provided with the resin package part shown in FIG. It is a perspective view which shows the other modification of the resin package part which comprises the lead type electronic component shown in FIG. It is explanatory drawing which shows the modification of the pad part which comprises the lead type electronic component shown in FIG. It is explanatory drawing which expands and shows the pad part shown in FIG. It is explanatory drawing which shows the other modification of the pad part which comprises the lead type electronic component shown in FIG. It is explanatory drawing which shows the other mounting and connection example of the piezoelectric vibration device which comprises the lead type electronic component shown in FIG. It is sectional drawing which shows an example of the conventional lead type crystal oscillator.

Explanation of symbols

1a 1st lead terminal 1b 2nd lead terminal 1c 3rd lead terminal 2a 1st pad part 2b 2nd pad part 2b1 punching burr 2c 3rd pad part 3 crystal oscillator 4 resin package part 5a 1st wire 5b 2nd wire 31 housing Body 31a Base 31b Lid 32 Crystal vibrating piece 33 Integrated circuit elements 34a, 34b, 34c, 34d External electrode 35 Conductive resin bonding material

Claims (7)

A plurality of lead terminals, a plurality of pad portions provided at one end portions of the plurality of lead terminals, a piezoelectric vibration device including a piezoelectric vibrating piece, a plurality of pad portions together with one end portion of the plurality of lead terminals, and It consists of a resin package part that seals the piezoelectric vibration device with resin,
At least one pad portion of the plurality of pad portions is provided with a protruding portion projecting in a direction perpendicular to the one principal surface at an outer peripheral edge of one principal surface of the at least one pad portion, The piezoelectric vibration device is mounted on the surface side ,
The at least one pad is a lead-type electronic component in which a thin metal plate is stamped and molded using a punching means, and the protrusion is a punching burr formed by punching . The lead-type electronic component according to claim 1,
A lead-type electronic component in which at least one of the plurality of lead terminals includes a skew portion . The lead-type electronic component according to claim 1 or 2,
The resin package part is a lead-type electronic component molded in a column shape having a semicircular cross section or a substantially semicircular cross section . In the lead type electronic component according to any one of claims 1 to 3,
The resin package part is a lead-type electronic component molded into a tapered column shape having a semicircular cross section or a substantially semicircular cross section. In the lead type electronic component according to any one of claims 1 to 3 ,
The resin package part is a lead type electronic component molded into a hemispherical shape or a substantially hemispherical shape . In the lead type electronic component according to any one of claims 1 to 5,
A lead-type electronic component in which at least a part of an end surface of at least one of the plurality of pad portions is formed in a zigzag shape . In the lead type electronic component according to any one of claims 1 to 6,
A lead-type electronic component in which a bank portion is provided on at least a part of an end of at least one of the plurality of pad portions.

Images