JPS58168142U - Resin molded semiconductor device - Google Patents
Resin molded semiconductor deviceInfo
- Publication number
- JPS58168142U JPS58168142U JP6440982U JP6440982U JPS58168142U JP S58168142 U JPS58168142 U JP S58168142U JP 6440982 U JP6440982 U JP 6440982U JP 6440982 U JP6440982 U JP 6440982U JP S58168142 U JPS58168142 U JP S58168142U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- molded semiconductor
- resin molded
- leads
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は夫々異なる従来の樹脂モールド型半
導体装置の断面図、第３図ａ及びｂは夫々落下試験の際
の異なる落下状態を示す側面図及び背面図、第４図は本
考案の前提となる樹脂モールド型半導体装置の断面図、
第５図は本考案の一実施例の樹脂モールド型半導体装置
の断面図、第６図は本考案の他の実施例を示す断面図、
第７図は本考案のさらに他の実施例を示す断面図である
。
３・・・リード、７・・・モール１部、１０・・・樹脂
モールド型半導体装置、１３．１４・・・針状突起。1 and 2 are cross-sectional views of different conventional resin-molded semiconductor devices, FIGS. 3a and 3b are side and rear views showing different falling states during a drop test, and FIG. A cross-sectional view of a resin molded semiconductor device, which is the premise of the invention,
FIG. 5 is a cross-sectional view of a resin molded semiconductor device according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view showing another embodiment of the present invention.
FIG. 7 is a sectional view showing still another embodiment of the present invention. 3... Lead, 7... Molding 1 part, 10... Resin molded semiconductor device, 13.14... Needle-like projection.
Claims (1)
において、モールド部表面に前記リードとは別に複数の
針状突起を設けたことを特徴とする樹脂モールド型半導
体装置。1. A resin-molded semiconductor device having leads led out from one side, characterized in that a plurality of needle-like protrusions are provided on the surface of the mold portion in addition to the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440982U JPS58168142U (en) | 1982-04-30 | 1982-04-30 | Resin molded semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440982U JPS58168142U (en) | 1982-04-30 | 1982-04-30 | Resin molded semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58168142U true JPS58168142U (en) | 1983-11-09 |
Family
ID=30074438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6440982U Pending JPS58168142U (en) | 1982-04-30 | 1982-04-30 | Resin molded semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168142U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548679U (en) * | 1977-06-21 | 1979-01-20 |
-
1982
- 1982-04-30 JP JP6440982U patent/JPS58168142U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548679U (en) * | 1977-06-21 | 1979-01-20 |
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