JPS5918439U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS5918439U JPS5918439U JP11437382U JP11437382U JPS5918439U JP S5918439 U JPS5918439 U JP S5918439U JP 11437382 U JP11437382 U JP 11437382U JP 11437382 U JP11437382 U JP 11437382U JP S5918439 U JPS5918439 U JP S5918439U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- heat sink
- encapsulated semiconductor
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来の半導体装置の一例を示す正面
図及び側面図、第３図は第１図の半導体装置を得る前段
階の正面図、第４図及び第５図は樹脂モールド装置を説
明するための部分断面図及び動作図、第６図は従来の半
導体装置の問題点を説明するための部分断面図、第７図
及び第８図は本考案の一実施例を示す正面図笈びＡ−Ａ
線拡大断面図、第９図は第７図の半導体装置を得る樹脂
モールド装置の部分断面図である。
１・・・・・・放熱板、１′・・・・・・頭部、ｎ、・
・・・・・テーパ部、５・・・・・・樹脂材。1 and 2 are front and side views showing an example of a conventional semiconductor device, FIG. 3 is a front view of a stage before obtaining the semiconductor device of FIG. 1, and FIGS. 4 and 5 are resin molds. FIG. 6 is a partial sectional view and operation diagram for explaining the device; FIG. 6 is a partial sectional view for explaining the problems of the conventional semiconductor device; FIGS. 7 and 8 are front views showing an embodiment of the present invention. Illustration A-A
9 is a partial cross-sectional view of a resin molding apparatus for producing the semiconductor device of FIG. 7. 1... Heat sink, 1'... Head, n,...
...Tapered portion, 5...Resin material.
Claims (1)
体ペレットの電極とリードとを電気的に接続し、から半
導体ペレットを含む主要部分を樹脂材にて、放熱板の裏
面が露呈するようにモールド被覆したものにおいて、上
記樹脂材より露呈する放熱板の表面側の端部エツジ部に
テーパ部を形成したことを特徴とする樹脂封止型半導体
装置。The semiconductor pellet is fixed on the surface of the heat sink, the electrodes and leads of the semiconductor pellet are electrically connected, and the main part including the semiconductor pellet is molded and covered with a resin material so that the back side of the heat sink is exposed. 1. A resin-sealed semiconductor device characterized in that a tapered portion is formed at an edge portion of the front surface side of the heat sink exposed from the resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437382U JPS5918439U (en) | 1982-07-27 | 1982-07-27 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437382U JPS5918439U (en) | 1982-07-27 | 1982-07-27 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5918439U true JPS5918439U (en) | 1984-02-04 |
Family
ID=30264409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11437382U Pending JPS5918439U (en) | 1982-07-27 | 1982-07-27 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918439U (en) |
-
1982
- 1982-07-27 JP JP11437382U patent/JPS5918439U/en active Pending
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