KR20180103714A - Resin molding apparatus, resin molding method and method for manufacturing resin-molded component - Google Patents

Abstract

Provided is a resin molding apparatus capable of efficiently producing a plurality of resin molded articles while suppressing an increase in an installation area of the apparatus. To this end, in the resin molding apparatus (10) of the present invention, two or more molding dies are stacked, and each of the molding dies includes an upper die (100A), a lower die (200A), an upper die (100B), and a lower die (200B). The lower die (200A) has a lower die side member (201A) and a lower die bottom surface member (202A). The lower die (200B) has a lower die side member (201B) and a lower die bottom surface member (202B). In each of the lower die, the lower die side member and the lower die bottom surface member are vertically movable separately.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus, a resin molding method, and a method of manufacturing a resin molded article,

The present invention relates to a resin molding apparatus, a resin molding method, and a method of manufacturing a resin molded article.

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-046044, filed on March 10, 2017, the entire contents of which are incorporated herein by reference.

In the resin molding, for example, a compression molding apparatus for driving a side member and a bottom member constituting a die cavity, respectively, has been proposed (for example, Patent Document 1).

Patent Document 1: JP-A-2008-283111

However, in the resin molding apparatus for driving the side member and the bottom surface member, if the number of the resin molding apparatuses is increased in order to increase the number of resin molded articles produced, the footprint may increase.

Accordingly, an object of the present invention is to provide a resin molding apparatus, a resin molding method, and a method of manufacturing a resin molded article, which can efficiently manufacture a plurality of resin molded articles while suppressing an increase in the installation area of the apparatus.

In order to achieve the above object, the resin molding apparatus of the present invention is characterized in that at least two molding dies are laminated, each of the molding dies has an upper die and a lower die, and the upper die and the lower die One die has a side member and a bottom surface member, and each of the side members and the bottom surface member are vertically movable separately.

The resin molding method of the present invention is characterized in that two or more molding dies are stacked and each of the molding dies has an upper die and a lower die, and one of the upper die and the lower die in each molding die has a side member and a floor A resin molding step of forming a resin molding by resin molding with a resin molding apparatus having a face member; a mold releasing step of releasing the side or bottom surface of the resin molding body by raising or lowering the side member or the bottom face member .

The method for producing a resin molded article of the present invention is characterized in that the resin is molded by the above resin molding method of the present invention.

According to the present invention, it is possible to provide a resin molding apparatus, a resin molding method, and a resin molded product manufacturing method capable of efficiently manufacturing a plurality of resin molded articles while suppressing an increase in the installation area of the apparatus.

Fig. 1 is a cross-sectional view schematically showing an example of the configuration of a resin molding apparatus of the present invention.
Fig. 2 is a cross-sectional view schematically showing a step in an example of the resin molding method of the present invention using the apparatus of Fig. 1;
Fig. 3 is a sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
Fig. 4 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
Fig. 5 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
6 is a cross-sectional view schematically showing another step of the resin molding method of Fig.
7 is a cross-sectional view schematically showing another step of the resin molding method of Fig.
Fig. 8 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
Fig. 9 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
10 is a cross-sectional view schematically showing another step of the resin molding method of Fig.
Fig. 11 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2; Fig.
Fig. 12 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
Fig. 13 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
Fig. 14 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2. Fig.
Fig. 15 is a cross-sectional view schematically showing another step of the resin molding method of Fig. 2;
16 is a cross-sectional view schematically showing another example of a resin molding method using the resin molding apparatus of the present invention.
17 is a cross-sectional view schematically showing another example of the constitution of the resin molding apparatus of the present invention and an example of a resin molding method using the same.

Next, the present invention will be described in detail by way of example. However, the present invention is not limited by the following description.

In the resin molding apparatus of the present invention, the upper die and the lower die in each of the molding dies may be, for example, the lower die may be the one die (the die having the side member and the bottom surface member) One die (a die having a side member and a bottom surface member). For example, the one die may be a lower die, the side member may be a lower die side member, and the bottom member may be a lower die bottom member. Further, the one die may be an upper die, the side member may be an upper die side member, and the bottom surface member may be an upper die bottom surface member. The other die (the die other than the one die) of the upper die and the lower die is not particularly limited. The other die may be, for example, capable of fixing a substrate.

In the resin molding apparatus of the present invention, for example, the substrate may be fixed to a surface of the other die of the upper die and the lower die opposite to the one die. For example, the lower die may be the one die (the die having the side member and the bottom surface member), and the substrate may be fixed to the lower surface of the upper die. Further, for example, the upper die may be the one die (the die having the side member and the bottom surface member), and the substrate may be fixed on the upper surface of the lower die.

In the resin molding apparatus of the present invention, for example, in the upper and lower molding dies, the one die (the die having the side member and the bottom face member) in each molding die is the lower die, Die, and the bottom surface member of the upper (upper) molding die may be integral with the upper die of the lower (lower) molding die. Alternatively, the one die (the die having the side member and the bottom face member) in each molding die is the upper die, the other die is the lower die, and the bottom member of the lower die is connected to the lower die of the upper molding die It may be integrated.

The resin molding apparatus of the present invention may be provided with a fixing mechanism for fixing the bottom surface member of the upper molding die so as not to move up and down with respect to the bottom surface member of the lower molding die.

The resin molding apparatus of the present invention may be, for example, a compression molding apparatus.

The resin molding method of the present invention is characterized in that the mold releasing step includes a side mold releasing step of releasing the side surface of the resin molded article by rising or falling of the side member, And a bottom surface releasing step of releasing the bottom surface of the molded body. In this case, the order of carrying out the side mold releasing process and the bottom mold releasing process is not particularly limited. For example, after the side surface of the resin molded article is released by the side surface releasing process, the bottom surface of the resin molded article may be released by the bottom surface releasing process. Alternatively, after the bottom surface of the resin molded article is released by the bottom surface releasing process, the side surface of the resin molded article may be released by the side surface releasing process.

The resin molding apparatus used in the resin molding method of the present invention may be, for example, the resin molding apparatus of the present invention.

The "resin molding" in the present invention is not particularly limited, and for example, a component such as a chip may be resin-sealed, but the resin may be simply molded without sealing the resin. Likewise, in the present invention, the "resin molded article" is not particularly limited and may be, for example, a resin-sealed resin-sealed article (such as a product or a semi-finished product) of a component such as a chip. However, Or the like. In the present invention, the 'resin molded article' may be the resin molded article (product or semi-finished product) itself, but it may be a resin molded article during the manufacturing method of the resin molded article. For example, the " resin molded article " may be a resin molded article after the resin molding step and before the mold releasing step. Further, in the present invention, the "side" of the resin molded article is a surface in which the resin molded article is in contact with the side member of the one die during molding of the resin molded article. In the present invention, the "bottom surface" of the resin molded article is a surface in which the resin molded article is in contact with the bottom surface member of the one die during molding of the resin molded article.

In the present invention, "resin molding" or "resin sealing" may be a method of resin molding or resin sealing one or both sides of a substrate. However, the present invention is not limited to this, and for example, resin molding or resin sealing may be simply performed without using a substrate. Further, for example, a component such as a chip fixed to one or both surfaces of the substrate may be resin-sealed. However, one or both surfaces of the substrate may be simply resin-molded or resin-sealed without resin sealing the component.

In the present invention, the "resin molding" or "resin sealing" method is not particularly limited and may be compression molding, for example, but may also be transfer molding or the like.

The term "resin sealing" in the present invention means, for example, that the resin is in a cured (solidified) state, but is not limited thereto. That is, in the present invention, the term "resin sealing" means a state in which at least the resin is filled in the die cavity when the die is clamped, and the resin may be in a fluidized state without being hardened (solidified).

In the present invention, 'mounting' also includes 'fixing'.

In general, an 'electronic component' refers to a case where a chip is sealed before resin sealing, and a case where a chip is sealed with a resin. In the present invention, the term 'electronic component' , And an electronic component (an electronic component as a finished product) in which the chip is resin-sealed. The term " chip " in the present invention refers to a chip in which at least a part of the chip is exposed without being resin-sealed, and at least one of the chip before the resin sealing, And a chip in a state of being in a state of being. The "chip" in the present invention specifically includes, for example, a chip such as an IC (Integrated Circuit), a semiconductor chip, and a power control semiconductor device. In the present invention, at least a part of a chip which is not subjected to resin sealing and is exposed is referred to as a " chip " for the sake of distinction from an electronic component after resin sealing. However, the "chip" in the present invention is not particularly limited as long as at least a part of the chip is in a state in which it is not subjected to resin sealing and is exposed, and may not be a chip. In the present invention, the component to be resin-sealed is not limited to a chip but may be at least one of a chip, a wire, a bump, an electrode, a wiring pattern and the like.

The substrate to be resin-molded or resin-sealed (also referred to as a frame or interposer) by the resin molding apparatus or the resin molding method of the present invention is not particularly limited, and for example, a lead frame, a wiring board, a wafer, Or may be a circuit board such as a printed board. In the present invention, for example, only one side of the substrate may be resin-sealed, or both sides may be resin-sealed. Further, the substrate may be, for example, a mounting substrate on which chips are mounted on one or both sides thereof. The method of mounting the chip is not particularly limited, and examples thereof include wire bonding, flip chip bonding, and the like. In the present invention, for example, an electronic part in which the chip is resin-sealed may be produced by resin-sealing one side or both sides of the mounting board. The use of the resin-molded or resin-sealed substrate by the resin molding apparatus or the resin molding method of the present invention is not particularly limited. For example, the high-frequency module substrate for a portable communication terminal, the module board for power control, And the like. The 'substrate' in the present invention may be, for example, a lead frame or a silicon wafer. The shape of the substrate may be any shape or shape as long as it can be formed. For example, a rectangular or circular substrate may be used when viewed from the plane.

In the present invention, the term "flip chip" refers to an IC chip having a lump-like protruding electrode called bump on an electrode (bonding pad) on the surface of the IC chip, or a chip like the IC chip. The chip can be mounted face down on a wiring part such as a printed board, for example. The flip chip is used, for example, as a chip for wireless bonding or as a mounting method.

In the present invention, the "resin molded article" or "resin sealed article" is not particularly limited, but may be an electronic component which is resin sealed by compression molding, for example. The "resin molded article" or "resin seal article" in the present invention may be an intermediate article for producing a single or plural electronic components such as semiconductor products, circuit modules, and the like. In addition, the "resin molded article" or "resin sealed article" in the present invention is not limited to an electronic part resin sealed with a chip and an intermediate product thereof, but may be a resin sealed product or the like other than the electronic part.

The resin for resin molding or resin sealing in the present invention is not particularly limited and may be thermosetting resin such as epoxy resin or silicone resin, or thermoplastic resin. Further, a thermosetting resin or a composite material containing a part of a thermoplastic resin may be used. Examples of the resin to be supplied to the resin molding apparatus include a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, and a powdery resin.

The 'fluid resin' in the present invention is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the term "liquid phase" means fluidity at room temperature (room temperature), which means that the fluid flows by applying a force, and it is independent of the high and low fluidity, in other words, the degree of viscosity. That is, in the present invention, the term 'liquid resin' refers to a resin having flowability at room temperature (room temperature) and flowing by applying a force. In the present invention, the term "molten resin" refers to a resin that has been in a liquid state or in a fluid state by melting, for example. The form of the molten resin is not particularly limited, but can be supplied to, for example, a cavity or a port of a molding die.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For the sake of convenience of explanation, each drawing is schematically drawn out and exaggerated appropriately.

≪ Example 1 >

In this embodiment, an example of the resin molding apparatus of the present invention and an example of the resin molding method of the present invention performed using the same will be described.

1 schematically shows a configuration of the resin molding apparatus of the present embodiment. As shown in the drawing, the resin molding apparatus 10 is constituted by stacking two molding dies, that is, an upper (upper) molding die and a lower (lower) molding die in this order from above. Each molding die has an upper die and a lower die, and the lower die is the one die (a die having a side member and a bottom member).

The upper molding die has an upper die (upper plate) 100A and a lower die 200A. The lower die 200A has a lower die side member (upper side member 201A) and a lower die base member (upper floor member, 202A). The lower die side member (upper side member 201A) and lower die base member (upper floor member, 202A) can be moved up and down, respectively, as described later. A space surrounded by the upper surface of the lower die base member 202A and the inner peripheral surface (inner side) of the lower die side member 201A forms a lower die cavity (upper cavity 203A). Further, the upper die (upper plate 100A) at the upper end is provided with a hole 101 therein. The upper mold die and the lower mold die can be decompressed by sucking the gas inside the upper mold die and the lower mold die from the hole 101 as described later.

The lower molding die has an upper die (intermediate plate, 100B) and a lower die (200B). The lower die 200B has a lower die side member (lower side member 201B) and a lower die base member (lower floor member, 202B). The lower die side member (lower side member 201B) and the lower die base member (lower side floor member, 202B) can be moved up and down, respectively, as described later. A space surrounded by the upper surface of the lower die bottom surface member 202B and the inner peripheral surface (inner surface) of the lower die side member 201B forms a lower die cavity (lower cavity 203B).

Further, the lower die bottom member (upper floor member) 202A of the upper molding die is fixed on the upper surface of the upper die (middle plate, 100B) of the lower molding die.

Further, the upper molding die has a support member (support member A, 300A) and a support member (support member B, 300B). The support member 300A penetrates through the through hole opened in the upper die (upper plate 100A). The support member 300A is movable up and down in the through-hole by a driving mechanism (not shown). The support member 300A is fixed to the lower die side member (upper side member 201A), and the lower die side member 201A can be moved up and down by the vertical movement of the support member 300A. On the other hand, the support member 300B is fixed to the upper die (the intermediate plate) 100B of the lower mold die while the lower end of the support member 300B is fixed inside the lower die side member (upper side member 201A) It is possible to move up and down. The intermediate plate 100B and the lower die bottom member (upper floor member) 202A fixed to the support member 300B are movable up and down together with the vertical movement of the support member 300B. The upper end portion of the support member 300B has a flange shape. The flange-shaped portion prevents the support member 300B from falling out of the lower die side member 201A.

The lower die has a movable plate (lower plate, 100C), supporting members (supporting members C and 300C), and a fixing mechanism (fixing hook, 600). The movable plate (lower plate 100C) has a lower die bottom member (lower bottom member 202B) fixed on the upper surface thereof. The movable plate (lower plate 100C) is movable up and down together with the lower die bottom member (lower floor member) 202B by a drive mechanism (not shown). The supporting member 300C penetrates through the through hole opened in the movable plate (lower plate 100C). The supporting member 300C is movable up and down in the through-hole by a driving mechanism (not shown). The upper portion of the support member 300C is fixed to the lower die side member 201B and the lower die side member 201B is movable up and down by the vertical movement of the support member 300C. The fixing mechanism (fixing hook) 600 is formed by a pair of fixing hooks, and the lower portion of the fixing hook is attached to the movable plate (the lower plate 100C), and the upper portion of the fixing hook is openable to the right and left. The pair of fixing hooks have protrusions on the inside of the upper portion thereof. By closing the pair of fixing hooks, the upper die (middle plate, 100B) can be held by the pair of fixing hooks and the protrusion can be hooked to the upper die (middle plate, 100B). Accordingly, the upper die (intermediate plate) 100B can be fixed so as not to move up and down relative to the movable plate (lower plate, 100C).

The resin molding apparatus 10 shown in Fig. 1 includes an outer airblock member (outer airblock member A, 400A), an outer airblock member (outer airblock member B, 400B), an outer airblock member Rings 501, 502, 503, and 504, respectively. The outside air shutoff member (outside air shutoff member A, 400A) is provided at an outer circumferential position of the upper die (upper plate, 100A). The O-ring 501 is provided on the upper end surface (the upper plate 100A of the ambient air shutoff member 400A and the portion sandwiched by the ambient air shutoff member 400A). The O-ring 502 is provided on the lower end face of the outside air blocking member 400A. Further, the outside air shutoff member (outside air shutoff member B, 400B) and the outside air shutoff member (outside air shutoff member C, 400C) are located at the outer circumferential positions of the movable plate (400A) and the O-ring (502). The outside air blocking member 400B and the outside air blocking member 400C are laminated in this order from the top. An O-ring 503 for blocking outside air is provided on the lower end surface (the portion sandwiched between the outside air blocking member 400B and the outside air blocking member 400C) of the outside air blocking member 400B. An O-ring 504 for blocking outside air is provided on the lower end surface (the portion sandwiched between the outside air blocking member 400C and the lower plate 100C) of the outside air blocking member 400C. Owing to the above configuration, the outside air shutoff member 400A including the O-rings 501 and 502 and the outside air shutoff members 400B and 400C including the O-rings 503 and 504 at O -Ring 502 is bonded and joined, at least the inside of the lower die cavity (upper cavity 203A) and the inside of the lower die cavity (lower cavity 203B) can be put in the outside air cutoff state.

The resin molding method using the resin molding apparatus shown in Fig. 1 can be carried out as shown in Figs. 2 to 15, for example. Figs. 2 to 15 are resin molding methods (compression molding methods) by compression molding.

First, as shown in Figs. 2 to 8, a resin molding process for manufacturing a resin molded article is performed. Hereinafter, the resin molding step will be described.

First, as shown in Fig. 2, granular resin (resin material) 20a is supplied (mounted) in the lower die cavity (upper cavity 203A) and in the lower die cavity (lower cavity 203B). At this time, the entire lower die 200A or 200B may be heated by a heating mechanism (not shown) before feeding the granular resin 20a. The method of supplying the granular resin 20a is not particularly limited, and for example, the granular resin 20a may be transported to the positions of the lower die cavities 203A and 203B by using a transport mechanism (not shown) or the like. Further, a suitable amount of the granular resin 20a may be supplied into the lower die cavities 203A and 203B by using, for example, a metering mechanism (not shown).

On the other hand, the resin material 20a exemplifies the granular resin in the present embodiment, but is not limited thereto. For example, the resin material 20a may be in a solid form (for example, powder, granule, agglomerate, sheet, flake, or the like) at room temperature. As described above, the resin material 20a may be, for example, a thermosetting resin (for example, an epoxy resin, a silicone resin or the like), or a thermoplastic resin.

On the other hand, as shown in FIG. 2, the substrate 1 is fixed to the lower surfaces of the upper die (upper plate) 100A and the upper die (intermediate plate) 100B, respectively. (Upper cavity) 203A or the lower die cavity (lower cavity 203B) opposite to the upper die (upper plate 100A) or the upper die (middle plate 100B) And the chip 2 is fixed on the surface of the chip. As described below, this chip 2 is resin-sealed (resin molded) by compression molding.

Next, as shown in Fig. 3, the movable plate (lower plate 100C) is moved in the direction of arrow X1, the support member 300A in the direction of arrow Y1, the support member 300C in the direction of arrow Z1 . The lower die bottom member (lower floor member, 202B) fixed to the upper surface of the movable plate (lower plate, 100C) rises by the rise of the movable plate (lower plate, 100C). As the support member 300A is lifted, the lower die side member (upper side member 201A) fixed to the support member 300A rises. The upper die (intermediate plate) 100B of the lower molding die fixed to the supporting member 300B is pulled by the lower die side member (upper side member 201A) by opening the supporting member 300B It goes up and rises. On the other hand, the upper die (upper plate 100A) does not move up and down in all processes described in this embodiment. The movable plate (lower plate 100C), the support member 300A, and the support member 300C are connected to a drive mechanism (not shown), respectively, as described above, and they can move up and down separately. At this time, the rising speed of the movable plate (lower plate 100C), the supporting member 300A and the supporting member 300C is not particularly limited, but the rising speed of the movable plate (lower plate 100C) and the supporting member 300C is It is preferable to make them almost equal. It is also preferable that the lifting speed of the supporting member 300A be approximately half of that of the movable plate (the lower plate 100C) and the supporting member 300C. In this way, the molding timings of the upper molding die and the lower molding die can be made almost equal. At this time, the resin material 20a is heated by the heat of the lower dies 200A and 200B to become a molten resin (fluid resin) 20b, as shown in Fig.

Next, as shown in Fig. 4, the movable plate (lower plate 100C) is moved in the direction of arrow X2, the support member 300A in the direction of arrow Y2, the support member 300C in the direction of arrow Z2 . Thereby, as shown in the figure, the inside of the molding die is sealed by bringing the outside air shutoff member 400B and the O-ring 502 into contact with each other. Then, as shown in the drawing, the air in the molding die is sucked in the direction of the arrow V1 from the holes 101 of the upper die (upper plate 100A) to reduce the pressure in the molding die. On the other hand, air in the molding die is sucked in the direction of the arrow V1 until the step shown in FIG. 8 to be described later, that is, just before the mold releasing step is started, and the state in which the inside of the molding die is decompressed is maintained.

5, the support member 300A is lifted until the lower die side member (upper side member 201A) connected to the support member 300A comes into contact with the upper substrate 1, as shown in Fig. From this state, the supporting member 300A can not rise further. On the other hand, as shown in Fig. 5, the support member 300C is raised until the lower die side member (lower side member 201B) connected to the support member 300C comes into contact with the lower substrate 1. From this state, the support member 300C can not rise further. After the lower die side member (upper side member 201A) is brought into contact with the upper substrate 1 and the lower die side member (lower side member 201B) is brought into contact with the lower substrate 1, As shown in Fig. 8, the upward force is continuously applied to the support member 300C in the direction of the arrow Z3 until just before the release process is started. Thus, a predetermined clamping force is applied to the lower substrate 1 through the lower die side member (lower side member 201B) connected to the support member 300C. Similarly, as shown in Figs. 5 to 8, a predetermined clamp pressure is applied to the upper substrate 1 through the lower die side member (upper side member 201A) until immediately before the mold releasing step is started, The upward force is continuously applied to the member 300A in the direction of the arrow Y3.

Next, as shown in Fig. 6, the movable plate (lower plate 100C) is raised in the direction of the arrow X4. By the elevation of the movable plate (lower plate 100C), the lower die bottom member (lower floor member, 202B) fixed to the upper surface rises. Further, the upper die (intermediate plate, 100B) and the lower die bottom member (upper floor member, 202A) fixed to the upper die are pushed up and raised. By these operations, as shown in Fig. 6, the upper and lower chips 2 are immersed in the fluid resin 20b, respectively. Thereafter, upward force is applied to the movable plate (lower plate 100C) in the direction of the arrow X4 until the step of FIG. 8 to be described later, that is, just before the start of the release process, 20b so that a predetermined resin pressure is applied thereto. Thus, the die fastening is completed.

7, by closing the fixing mechanism (fixing hook) 600, the upper die (middle plate, 100B) is sandwiched by the pair of fixing hooks, and at the same time, To the upper die (intermediate plate, 100B). Thereby, the upper die (intermediate plate) 100B and the lower die bottom member (upper floor member) 202A fixed to the upper surface thereof are fixed so as not to move up and down relative to the movable plate (lower plate, 100C) Fixing process of the upper floor member). On the other hand, the timing for fixing the upper floor member (lower die floor member) by the fixing mechanism is not limited to this, and may be arbitrarily set between the completion of die clamping and the start of the bottom surface forming process Timing.

Then, in the state shown in Fig. 7 (die clamped state), the die clamped state is maintained for the time required for the fluid resin 20b to solidify. Thus, as shown in Fig. 8, the fluid resin 20b solidifies to become a cured resin (sealing resin) 20. On the other hand, a method of solidifying the fluid resin 20b is not particularly limited. For example, when the fluid resin 20b is a thermosetting resin, the fluid resin 20b may be heated and cured (solidified) as it is. Further, for example, when the fluid resin 20b is a thermoplastic resin, the heating of the fluid resin 20b may be stopped, and the fluid resin 20b may be solidified by keeping it still for a while. As described above, a resin molded product in which the chips 2 on the substrate 1 are sealed with the cured resin (sealing resin) 20 can be formed.

Next, as shown in Figs. 9 to 13, the release process is carried out. In this embodiment, both the side surface and the bottom surface of the resin molded article are released.

First, as shown in Fig. 9, the side mold releasing step for lowering the lower die side member and releasing the side surface of the resin molded article is performed. Specifically, after the fluid resin 20b solidifies to become a hardened resin (sealing resin) 20, the supporting member 300A is lowered in the direction of the arrow Y4 as shown in Fig. 9, 300C in the direction of the arrow Z4. As a result, the lower die side face member (upper side face member 201A) connected to the support member 300A and the lower die side face member (lower side face member 201B) connected to the support member 300C are lowered do. Thereby, the lower die side member (upper side member 201A) and the lower die side member (lower side member 201B) are released from the side of the sealing resin 20 of the resin molded article, respectively.

Next, as shown in Fig. 10, the support member 300A is raised in the direction of the arrow Y5, and the support member 300C is raised in the direction of the arrow Z5. Thus, as shown in the drawing, the lower die side member (upper side member 201A) and the lower die side member (lower side member 201B) are respectively returned to the position where they contact the substrate 1. Thus, the upper substrate 1 is sandwiched and fixed by the upper die (upper plate) 100A and the lower die side member (upper side member) 201A, and the lower substrate 1 is fixed to the upper die 100B and the lower die side member (lower side member 201B) to be fixed (substrate holding step). By doing so, it is possible to suppress or prevent the substrate 1 from being unfixed by the subsequent bottom-surface-releasing process, making it impossible to perform the bottom-surface releasing process.

Next, as shown in Fig. 11, a bottom surface releasing step for releasing the bottom surface of the resin molded article is performed on the upper molding die. More specifically, as shown in Fig. 11, the movable plate (lower plate 100C) is lowered in the direction of arrow X5 and the support member 300C is lowered in the direction of arrow Z6. Thus, the lower die bottom member (lower bottom member) 202B fixed to the upper surface of the movable plate (lower plate 100C) is lowered and the lower die side member Member 201B is lowered. At this time, the upper die (intermediate plate, 100B) of the lower molding die is fixed so as not to move up and down relative to the movable plate (lower plate, 100C) by the fixing hooks. For this reason, the upper die (intermediate plate, 100B) descends with the lower die side member (lower side member 201B) and lower die base member (lower floor member, 202B). Therefore, the bottom surface of the resin molded article is not released in the lower die. On the other hand, the lower die bottom member (upper floor member) 202A of the upper molding die is fixed to the upper die (middle plate 100B) of the lower molding die, and thus falls with the upper die (middle plate 100B). Thus, as shown in the drawing, the bottom surface of the sealing resin (cured resin) 20 is released from the resin molding of the upper molding die (the bottom surface releasing step at the top).

Next, as shown in Fig. 12, the fixing hook 600 is opened to release the locking (fixing) of the upper die (intermediate plate, 100B) in the lower molding die (fixing releasing step of the upper floor member).

Further, as shown in Fig. 13, the bottom surface molding step for releasing the bottom surface of the resin molded article is performed in the lower molding die. Specifically, as shown in the figure, the movable plate (lower plate 100C) is lowered in the direction of arrow X6. Thus, the lower die bottom member (lower bottom member) 202B fixed on the upper surface of the movable plate (lower plate 100C) is lowered, so that the resin molding of the lower molding die The bottom surface is released (the lower surface of the bottom surface is deformed). On the other hand, at this time, the support member 300C and the lower die side member (lower side member 201B) are not lowered and remain as they are to prevent the fixing of the substrate 1 from being released.

14, the movable plate (lower plate) 100C and the lower die bottom member (lower floor member) 202B are lowered in the direction of the arrow X7, and the support members 300C and the lower The die side member (lower side member 201B) is lowered in the direction of the arrow Z6. Thus, the resin molding at the lower end is separated from the lower die 200B of the lower mold die.

Further, as shown in Fig. 15, the support member 300A is lowered in the direction of the arrow Y6. Thereby, the lower die side member (upper side member 201A) connected to the support member 300A and the intermediate plate 100B vertically descending from the lower die side member (upper side member 201A) and the lower die base member Upper floor member, 202A) descend. Then, the upper resin molding is separated from the lower die 200A of the upper molding die.

As described above, the resin molding method using the resin molding apparatus 10 of Fig. 1 can be carried out. This resin molding method is also a method of producing a resin molded article having the substrate 1, the chip 2 and the sealing resin 20. [ The resin molded article is an electronic component in which a chip 2 fixed on one side of a substrate 1 is resin-sealed with a sealing resin 20. Further, as described with reference to Figs. 2 to 15, according to this resin molding method, it is possible to manufacture the two resin molded articles at substantially the same time.

In the present invention, the side mold releasing process and the bottom mold releasing process may be simultaneously performed. However, in order to suppress or prevent the peeling (separation) of the package (resin molded article) from the substrate, it is preferable to separately perform the side mold releasing process and the bottom mold releasing process. In Figs. 2 to 15, an example has been described in which the above-described bottom surface forming step is carried out after the side surface forming step is performed. However, as described above, the order of performing the side mold releasing process and the bottom mold releasing process is not limited. For example, contrary to FIGS. 2 to 15, the above-described side mold releasing process may be performed after the above-described bottom mold releasing process is performed.

1, the upper side member 201A (supporting member 300A), the lower side member 201B (supporting member 300C), and the lower floor member 202B , And a lower plate 100C) are connected to a driving source (not shown), respectively, so that they can move up and down separately. The three drive sources are not particularly limited, and may be individual ones, and two or more of the three drive sources may be combined by one drive source. In addition, the position of the drive source is not particularly limited, but it is preferable to arrange the drive source in one or both of the vertical direction of the molding die from the viewpoint of suppressing an increase in the installation area of the device. As described above, the upper bottom member 202A is pulled up by the upper side member 201A by opening the supporting member 300B or by moving the upper die (the intermediate plate 100B) And can be driven by being pushed up by the bottom surface member 202B or the bottom side member 201B. However, the present invention is not limited to these descriptions, and for example, the member to which the driving source is connected, the number of the driving sources, the arrangement position, and the like are arbitrary.

Further, in the resin molding apparatus 10 of FIG. 1, an example in which the fixing mechanism 600 is a fixed hook is shown. However, the present invention is not limited to this. For example, the fixing mechanism is not limited to the fixing hook, as long as it is a mechanism that can fix the lower die bottom member of the upper molding die so as not to move up and down with respect to the lower die bottom member of the lower molding die. Mechanism. In this case, for example, as described above, even if the upper molding die and the lower molding die are vertically adjacent and the lower die base member of the upper molding die is integral with the upper die of the lower molding die do. Further, in the present invention, the fixing mechanism is not essential but may be optional or not.

Further, in this embodiment (Figs. 1 to 15), an example in which the lower die is the one die (the die having the side member and the bottom surface member) is shown. However, the present invention is not limited to this, and as described above, the upper die may be the one die (the die having the side member and the bottom surface member). In this case, for example, the substrate may be supplied to the lower die and the resin material may be supplied onto the substrate fixed to the lower die. Further, the substrate may be supplied to the lower die together with the resin material in a state where the resin material is mounted on the substrate. On the other hand, when the resin material is supplied onto the substrate, for example, the resin material is preferably a liquid resin rather than the granular resin in order to prevent the resin material from overflowing from above the substrate.

According to the present invention, as described above, it is possible to efficiently manufacture a plurality of resin molded articles while suppressing an increase in the installation area of the apparatus. Specifically, for example, by stacking two or more molding dies, it is possible to efficiently manufacture a plurality of resin molded articles while suppressing an increase in the installation area of the apparatus. For example, as shown in Figs. 1 to 15, when two molding dies are stacked, the installation area of the device can be reduced to about half as compared with a case where two molding dies are arranged in parallel in the horizontal direction. Thus, two resin molded articles can be produced at substantially the same time while suppressing an increase in the installation area of the apparatus.

Figs. 1 to 15 show examples in which two molding dies are stacked. However, the present invention is not limited to this, and three or more arbitrary number of molding dies may be laminated.

In the present invention, for example, as described in this embodiment, a resin molded article can be produced without using a release film. Specifically, for example, by performing the side mold releasing step and the bottom side releasing step, it is possible to reliably mold the resin molded article without using a release film.

In the present invention, the lower die bottom member of the upper mold die and the upper die of the lower mold die may be integrated with each other in vertically adjacent lamination dies as shown in Figs. 1 to 15, for example. Alternatively, when the upper die is the one die (the die having the side member and the bottom surface member), the bottom surface member (upper die bottom surface member) of the lower shaping die and the lower die of the upper shaping die may be integrated. Accordingly, it is possible to reduce the number of members of the resin molding apparatus, simplify the structure, simplify the process of the resin molding method, and the like. However, the present invention is not limited to this, and the lower die bottom member of the upper molding die and the upper die of the lower molding die may not be fixed but may be separate members in vertically adjacent lamination dies. Alternatively, the upper die bottom surface member of the lower shaping die and the lower die of the upper shaping die may not be fixed, but may be separate members.

≪ Example 2 >

Fig. 16 shows another example of the resin molding method using the resin molding apparatus 10 of Fig. Fig. 16 is a step of the resin molding method, which corresponds to the step of Fig. 7 (the state of the die fastening and the fixing of the upper floor member) in the resin molding method described with reference to Figs. 2 to 15. The process shown in Fig. 16 is the same as the process of Fig. 7 except that the fixing hook 600 is pulled downward. Otherwise, the resin molding method shown in Fig. 16 can be carried out in the same manner as the resin molding method shown in Figs. 2 to 15. The resin molding apparatus 10 of Fig. 16 may further include a mechanism for pulling the fixing hook 600 downward.

Although illustration and description are omitted in Fig. 7, upward force is exerted on the resin and the substrate in this process (the state of the die fastening and the state of the upper floor member being fixed). More specifically, an upward force is applied to the movable plate (lower plate 100C), the supporting member 300C and the supporting member 300A by a driving mechanism (not shown) As shown by arrows A1 to A3 and B1 to B2 of Fig. The arrows A1 to A3 indicate the upward resin clamping force. Arrow A1 shows an upward force applied to the movable plate (lower plate, 100C) and lower die bottom member (lower floor member, 202B). Arrow A2 indicates an upward resin clamping force applied to the fluid resin 20b in the lower mold die. Arrow A3 represents the upward resin clamping force applied to the fluid resin 20b in the upper molding die. The arrows B1 and B2 indicate the upward substrate clamping force. The arrow B1 indicates a substrate clamping force applied to the lower substrate 1 by a force exerted by a driving mechanism (not shown) on the supporting member 300C. Arrow B2 indicates the substrate clamping force applied to the lower substrate 1 by a force exerted by a driving mechanism (not shown) on the supporting member 300A.

For example, as shown in Fig. 16, in order to prevent the upward resin clamping forces A1 to A3 and the upward substrate clamping forces B1 to B2 from becoming excessive, . Thus, as shown by the downward-pointing arrow C1, it is possible to apply a force to cancel the upward resin clamping forces A1 to A3 and the upward substrate clamping forces B1 to B2.

When the downward force is not applied, for example, the lower substrate clamping force B1 is added to the upper clamping force A3. Thereby, there is a possibility that the resin clamping force A3 at the upper end, in particular, among the upwardly-facing resin clamping forces A1 to A3 becomes excessive. In order to prevent this, as described above, the lower end clamping force B1 is canceled by the downward force C1 by pulling down the fixing hook 600 and the upper and lower resin pressures can be adjusted.

On the other hand, the description of FIG. 16 is illustrative and does not limit the present invention. In the present invention, the downward force C1 is optional and not required.

≪ Example 3 >

Fig. 17 shows another example of the resin molding apparatus 10 of Fig. 1 and the resin molding method using the same. 17 is the same as the resin molding apparatus 10 of Fig. 1 except that the resin molding apparatus 10 has the elastic member 204. Fig. As shown, the elastic member 204 is disposed so as to be sandwiched between the lower die side member (upper side member 201A) and the upper die (middle plate 100B), and is stretchable in the vertical direction. 17 is a step of the resin molding method, and corresponds to the step of FIG. 7 (a state in which the die is fastened and the upper floor member is fixed) in the resin molding method described with reference to FIGS. 2 to 15. FIG. The process shown in Fig. 17 is the same as the process of Fig. 7 except that a force in the vertical direction is exerted by the stretching force of the elastic member 204. Fig. Otherwise, the resin molding method shown in Fig. 17 can be carried out in the same manner as the resin molding method shown in Figs. 2 to 15.

In Fig. 17, the meanings of the arrows A1 to A3 and B1 are the same as those in Fig. The upward arrow D1 indicates the direction of the upper substrate clamping force applied to the upper substrate 1 by the stretching force of the elastic member 204. [ The downward arrow D2 indicates the direction of the downward force applied by the stretching force of the elastic member 204. [ The lower substrate clamping force applied to the lower substrate 1 by the force represented by D2 can be canceled.

As shown in Fig. 17, the upward force D1 and the upward force D1 are applied to the upper and lower substrate 1, respectively, by causing the elastic member 204 to be bent (contracted) by die clamping to generate an elastic restoring force (stretching force) The downward force D2 is applied. Thus, the resin pressure applied to the upper and lower resin can be adjusted. Thus, by providing the elastic member 204, it is possible to suppress the increase in the installation area of the apparatus. Specifically, according to the apparatus configuration shown in Fig. 16, a mechanism (not shown) for pulling the fixed hook 600 downward is required. On the other hand, according to the apparatus configuration shown in Fig. 17, since the elastic member 204 is provided, the mechanism for pulling the fixed hook 600 downward can be omitted, which makes it possible to suppress the increase in the installation area of the apparatus.

On the other hand, the description of FIG. 17 is illustrative and does not limit the present invention. In the present invention, the elastic member 204 is optional and not required.

The present invention is not limited to the above-described embodiments, but may be appropriately combined, changed, or selected as necessary within a range not deviating from the gist of the present invention.

1: substrate
2: Chip
10: resin molding device
20a: Granular resin (resin material)
20b: molten resin (fluid resin)
20: Curing resin (sealing resin)
100A: upper die (upper plate)
100B: upper die (intermediate plate)
100C: movable plate (lower plate)
101: hole of the upper plate
200A, 200B: Lower die
201A: Lower die side member (upper side member)
201B: Lower die side member (lower side member)
202A: Lower die bottom member (upper bottom member)
202B: Lower die bottom member (lower bottom member)
203A: Lower die cavity (upper cavity)
203B: Lower die cavity (lower cavity)
204: elastic member
300A: support member A
300B: Support member B
300C: Support member C
400A: outside air blocking member A
400B: Outside air shutoff member B
400C: outside air blocking member C
501, 502, 503, 504: O-rings
600: Fixture (fixed hook)
A1 to A3: arrows indicating the direction in which the resin clamping force is applied
B1 to B2: arrows indicating the direction in which the substrate clamping force is applied
C1: arrow indicating the direction in which the force for canceling the lower substrate clamping force is applied
D1: arrow indicating the direction in which the upper substrate clamping force is applied
D2: arrow indicating the direction in which the force for canceling the lower substrate clamping force is applied
V1: arrow indicating the suction direction of air in the molding die
X1 to X7: arrows indicating the moving direction of the lower plate or the direction in which the force is applied
Y1 to Y6: arrows indicating the moving direction of the support member A or the direction in which the force is applied
Z1 to Z6: arrows indicating the moving direction of the support member C or the direction in which the force is applied

Claims (11)

Two or more molding dies are laminated,
Each molding die has an upper die and a lower die,
Wherein one of the upper die and the lower die in each of the molding dies has a side member and a bottom member,
Wherein each of the side dies and the bottom side member is vertically movable independently of each other. The method according to claim 1,
Wherein the substrate is fixed to a surface of the other of the upper die and the lower die opposite to the one die. The method according to claim 1,
In which the one die in each molding die is a lower die and the other die is an upper die and the bottom surface member of the upper molding die is integral with the upper die of the lower molding die, Wherein the one die in each molding die is an upper die, the other die is a lower die, and the bottom surface member of the lower die is integral with the lower die of the upper die. The method of claim 3,
And a fixing mechanism for fixing the bottom surface member of the upper molding die so as not to move up and down with respect to the bottom surface member of the lower molding die. 5. The method according to any one of claims 1 to 4,
Wherein said one die is a lower die,
Wherein the side member is a lower die side member,
Wherein the bottom surface member is a lower die bottom surface member. 5. The method according to any one of claims 1 to 4,
A resin molding apparatus as a compression molding apparatus. Two or more molding dies are laminated,
Each molding die having an upper die and a lower die,
A resin molding process for producing a resin molded product by resin molding by a resin molding apparatus having one of the upper die and the lower die in each of the molding dies having a side member and a bottom face member,
And a mold releasing step of releasing the side surface or the bottom surface of the resin molded article by raising or lowering the side member or the bottom surface member. 8. The method of claim 7,
Wherein the mold releasing step includes a side mold releasing step of releasing the side surface of the resin molded article by raising or lowering the side surface member and a bottom surface releasing step of releasing the bottom surface of the resin molded article by the rising or falling of the bottom surface member / RTI >
Wherein a side surface of the resin molded body is released by the side mold releasing step and then the bottom surface of the resin molded body is released by the bottom surface releasing step. 8. The method of claim 7,
Wherein the mold releasing step includes a side mold releasing step of releasing the side surface of the resin molded article by raising or lowering the side surface member and a bottom surface releasing step of releasing the bottom surface of the resin molded article by the rising or falling of the bottom surface member / RTI >
And the side surface of the resin molded body is released by the side surface releasing step after the bottom surface of the resin molded body is released by the bottom surface releasing step. 10. The method according to any one of claims 7 to 9,
Wherein each of the above steps is carried out by the resin molding apparatus according to claim 1. A method for producing a resin molded article, which comprises molding a resin by the resin molding method according to any one of claims 7 to 9.

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