TWI485820B - Resin sealing forming device - Google Patents

Description

Resin sealing forming device

The present invention relates to a resin sealing and forming apparatus for sealing a resin of an electronic component mounted on a substrate.

In the past, a resin sealing and molding apparatus including a compression molding die including the upper and lower molds has been used to seal and compress the electronic component such as a semiconductor wafer mounted on the substrate (see, for example, Patent Document 1).

An example of the resin sealing and molding apparatus used for such resin sealing compression molding is shown in Fig. 11 . The resin sealing and molding apparatus 50 of Fig. 11 is provided with a compression molding die composed of an upper mold 51 and a lower mold 52. The upper mold 51 is fixed to a predetermined position on the upper side of the apparatus 50, and the substrate 70 on which the electronic component 71 is mounted is held on the lower surface. The lower mold 52 is composed of a frame member 55 and a bottom member 54 that slides up and down in the frame member 55, and houses a seal in a space (cavity 53) surrounded by the frame member 55 and the bottom member 54. Resin used. A plate-shaped pressing member 57 is provided below the lower mold 52, and an elastic member 58 such as a compression spring is provided between the pressing member 57 and the frame member 55. A drive mechanism (not shown) for moving the pressurizing member 57 in the vertical direction is provided below the pressurizing member 57.

When resin sealing molding is performed by the resin sealing molding apparatus 50, first, a granular resin is supplied to the cavity 53 of the lower mold 52, and is melted by heating. Thereby, the molten resin 72 is generated in the cavity 53. Further, the substrate 70 is mounted on the lower surface of the upper mold 51. this At the time of the substrate 70, the mounting surface of the electronic component 71 faces the lower side. Then, by raising the pressing member 57, the mold 52 is placed under the mold 52, and the frame member 55 is brought into contact with the peripheral portion of the substrate 70 fixed to the upper mold 51 (Fig. 12(a)). Then, when the pressing member 57 is further raised, the frame member 55 is held in contact with the substrate 70 by the elastic member 58, and the upper and lower molds 51 and 52 are closed, so that the upper and lower molds 51 and 52 are not closed. On the other hand, the bottom member 54 is raised while sliding inside the frame member 55. Thereby, the electronic component 71 is immersed in the molten resin 72, and the molten resin 72 is pressurized. The pressurized state is maintained for a predetermined period of time, and the molten resin 72 is cured, whereby compression molding is completed, and the electronic component 71 on the substrate 70 is resin-sealed (FIG. 12(b)).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-296382

In the conventional resin sealing and molding apparatus, there are the following problems.

(1) In order to appropriately slide the bottom member into the frame member, it is necessary to provide a certain degree of clearance between the two. Therefore, during pressurization, the molten resin in the cavity enters the gap. The molten resin that has entered the gap is hardened to become a resin burr, and the slidability between the frame member and the bottom member is lowered. Further, there is also a case where, during the release step (release step), the resin burr enters the cavity and is mixed into the product (compressed package) in the subsequent compression step (this is called For the "indentation of the raw edge", the quality of the product is reduced.

(2) In the conventional resin sealing and molding apparatus, the moving distance of the bottom member in the frame member is closed by the driving source and the pressing of the melting resin 72 in the cavity. It is limited to the extent that the elastic member is deformable. Therefore, the depth of the cavity when the resin is compressed is limited, and the thickness of the compression-molded package is limited.

(3) In the conventional resin sealing and molding apparatus, when the pressing member is moved downward after the compression molding is completed, the force of pressing the substrate member to the upper mold by the frame member is weak. Further, as described above, since the burrs are present in the gap between the frame member and the bottom member, the two members of the frame member and the bottom member are integrally moved downward, so that the compression-molded package cannot be stably released ( Demoulding).

An object of the present invention is to provide a resin sealing and molding apparatus which can solve the above problems.

A first aspect of the resin sealing and molding apparatus for an electronic component according to the present invention, which is provided to solve the above problems, comprising: a) holding an upper mold of the electronic component mounting substrate on a lower surface; and b) arranging the upper mold opposite to the upper mold a lower mold having: b1) a frame member placed on the pressing member driven up and down by the first driving mechanism via the elastic member; and b2) a bottom member by the second driving mechanism It is driven to slide up and down inside the frame member.

In the conventional resin sealing and molding apparatus, only the first driving mechanism is provided, and when the pressing member is pushed up, only the elastic member provided between the frame member and the pressing member is deformed, and the bottom member is inside the frame member. Slide up and down. In the resin sealing and molding apparatus according to the first aspect of the present invention, the second driving mechanism is further provided, and the second driving mechanism allows the bottom member and the frame. Since the body members move up and down independently, the following actions are possible.

(1) After the resin sealing molding, the bottom member is moved up and down inside the frame member, whereby the resin burrs penetrating the sliding surfaces can be removed. After the resin burrs are removed, the resin burrs can be attracted by a suction mechanism provided in the apparatus. Thereby, the resin burrs can be prevented from entering the cavity and being mixed into the package in the next step. Moreover, the device can be operated stably.

(2) The height of the bottom member (i.e., the depth of the cavity) of the inside of the frame member can be arbitrarily set by the second drive mechanism provided independently. Thereby, the degree of freedom in setting the thickness of the package can be improved, so that resin sealing of a plurality of types of electronic substrates can be performed by the same compression molding die.

(3) The state in which the substrate is pressed by the frame member can be maintained, and the bottom member can be moved downward by the second drive mechanism, so that the package can be stably released.

(4) In the conventional resin sealing and molding apparatus, the driving source is one, and therefore it is necessary to manufacture according to the type of the driving source (transfer driving source, air cylinder driving source, or servomotor driving source). In the resin sealing and molding apparatus of the present invention, the driving source for the frame member (the mold closing driving source) and the driving source for the bottom surface member (the plunger (the plunger) are separately provided. The plunger is driven by the source), so that the mold of the present invention can also be used for transfer molding.

Further, in the present resin sealing and molding apparatus, the bottom member is moved up and down. However, even if the frame member is moved up and down, the same function can be obtained.

In other words, in the second aspect of the resin sealing and molding apparatus for an electronic component of the present invention which is produced to solve the above problems, the second aspect includes: a) holding a mold on the lower surface of the electronic component mounting substrate; and b) a mold disposed opposite to the upper mold; the lower mold having: b1) a bottom member placed on the first driving mechanism And the b2) frame member is driven by the second drive mechanism to be slidable up and down on the outer periphery of the bottom member, and an elastic member is provided between the pressing member and the pressing member.

In the resin sealing and molding apparatus of the present invention, a second driving mechanism that directly moves the bottom member or the frame member provided via the elastic member up and down is provided on the pressing member on the lower mold side. Thereby, the resin burr that penetrates into the gap between the bottom member and the frame member can be removed, and the depth of the cavity surrounded by the frame member and the bottom member can be changed, and the package can be stably released. The mold of the invention is used for transfer forming.

10, 30, 50‧‧‧ resin sealing and forming device

101‧‧‧Resin sealing forming die

11, 51‧‧‧Upper mold

12, 52‧‧‧ lower mold

13, 53‧‧ ‧ cavity

14, 54‧‧‧ bottom member

14A‧‧‧ week slot

15, 55‧‧‧ frame components

17, 57‧‧‧ Pressurized components

18‧‧‧1st drive mechanism

19‧‧‧2nd drive mechanism

20, 33, 58‧‧‧ elastic members

30‧‧‧Resin sealing and forming device

31‧‧‧ movable plate

32‧‧‧Connected components

70‧‧‧Substrate

71‧‧‧Electronic parts

72‧‧‧Soluble resin

73‧‧‧Resin materials

75‧‧‧Intermediate board

76‧‧‧ cylinder

Fig. 1 is a schematic configuration diagram of a first embodiment of a resin sealing and molding apparatus according to the present invention.

Fig. 2 is an explanatory view showing a resin sealing step by the resin sealing and molding apparatus of the first embodiment.

Fig. 3 is an explanatory view showing a releasing step of the resin sealing and molding apparatus of the first embodiment.

Fig. 4 is an explanatory view showing a cleaning step by the resin sealing and molding apparatus of the first embodiment.

Fig. 5 is a cross-sectional view showing a modification of the bottom member in the resin sealing and molding apparatus of the first embodiment.

Figure 6 is a schematic view showing a second embodiment of a resin sealing and molding apparatus for an electronic component according to the present invention; Mapping.

Fig. 7 is an explanatory view showing a resin sealing step by the resin sealing and molding apparatus of the second embodiment.

Fig. 8 is an explanatory view showing a releasing step of the resin sealing and molding apparatus of the second embodiment.

Fig. 9 is an explanatory view showing a cleaning step of the resin sealing and molding apparatus of the second embodiment.

Fig. 10 is a schematic block diagram showing a modification of the resin sealing and molding apparatus of the second embodiment.

Fig. 11 is a schematic configuration diagram showing a conventional example of a resin sealing and molding apparatus.

Fig. 12 is an explanatory view showing a resin sealing step by a resin sealing and molding apparatus of a conventional example.

[Example 1]

Hereinafter, a first embodiment of a resin sealing and molding apparatus for an electronic component according to the present invention will be described with reference to Figs. 1 to 5 . As shown in FIG. 1, the resin sealing and molding apparatus 10 of the present embodiment includes a resin sealing molding die 101, and a mold 11 on a substrate 70 on which an electronic component 71 such as a semiconductor wafer is mounted on a lower surface, and a mold 11 and the upper mold 11 are attached thereto. The mold 12 is disposed opposite to each other, and the pressing member 17 is placed to move the lower mold 12 in the vertical direction. The pressurizing member 17 is driven up and down by the first drive mechanism 18 provided below the pressurizing member 17.

The lower mold 12 is composed of a frame member 15 and a bottom member 14 that can slide up and down in the frame member 15, and can accommodate a resin material in a space (cavity 13) surrounded by the frame member 15 and the bottom member 14. Here, the frame member 15 is placed on the pressing member 17 via the elastic member 20. Further, the bottom member 14 is driven to be vertically slidable inside the frame member 15 by the second driving mechanism 19 provided below the bottom member 14 (inside of the pressing member 17 in Fig. 1).

Next, a resin sealing step using the electronic component of the above-described resin sealing and molding apparatus 10 will be described. First, as shown in Fig. 2(a), the resin sealing molding die 101 is opened, and the substrate 70 is fixed to the lower surface of the upper mold 11. At this time, the substrate 70 is mounted on the lower surface of the electronic component 71. Further, similarly, as shown in FIG. 2(a), the resin material 73 is supplied to the cavity 13 of the lower mold 12. The resin material 73 is used to seal the electronic component 71, for example, an epoxy resin. The resin material 73 may be in the form of particles or liquid when supplied to the cavity 13, but in the present embodiment, the granular resin material 73 is supplied into the cavity 13. After the granular resin material 73 is supplied into the cavity 13, it is melted by heating the resin material 73 in the cavity 13, thereby forming a melting resin 72 (Fig. 2(b)).

At this time, the volume of the resin is largely reduced, and the bottom member 14 is raised by the second drive mechanism 19, and the height from the upper surface of the bottom member 14 to the upper surface of the frame member 15 is appropriately adjusted (FIG. 2(c) ). Then, the pressing member 17 is raised by the first drive mechanism 18, and the upper surface of the frame member 15 of the lower mold 12 is brought into contact with the peripheral portion of the substrate 70 (Fig. 2(d)). Thereafter, the pressurizing member 17 is further raised, the electronic component 71 is immersed in the molten resin 72 in the cavity 13, and the molten resin 72 is pressurized by the bottom member 14 (Fig. 2(e)).

The molten resin 72 is pressurized at a predetermined temperature for a predetermined period of time, and the molten resin 72 is cured to form a cured resin. Thereby, a sealed molded article obtained by sealing the electronic component 71 with a curing resin is formed.

Further, the timing at which the bottom member 14 is moved up and down by the second drive mechanism 19 may be any timing. For example, the bottom member 14 may be raised after the upper surface of the frame member 15 abuts against the substrate 70. Further, when the granular resin 73 is introduced into the cavity 13, the bottom member 14 can be moved up and down by the second drive mechanism 19 as appropriate depending on the amount of the input.

Fig. 3 is an explanatory view showing a releasing step in the resin sealing and molding apparatus 10 of the present embodiment. As shown in FIG. 3(a), in the resin sealing and molding apparatus 10 of the present embodiment, the state in which the substrate 70 is pressed by the frame member 15 can be maintained, and the bottom member 14 is lowered by the second driving mechanism 19. The bottom member 14 can be stabilized and the package released. Thereafter, the pressing member 17 is lowered by the first drive mechanism 18 (Fig. 3(b)).

Further, in the above description, the first driving mechanism 18 raises the pressing member 17 to pressurize the molten resin 72 in the cavity 13, but the bottom member 14 can be raised by the second driving mechanism 19. The molten resin 72 in the cavity 13 is pressurized. Also, both can be used in combination. The elastic member 20 can compensate the inclination of the frame member 15 and uniformly press the entire surface of the bottom member 14, so that it is preferably pressurized by the first driving mechanism 18 or used in combination for uniform resin sealing. The first drive mechanism 18 and the second drive mechanism 19 are pressurized.

As described above, in the resin sealing and molding apparatus 10 of the present embodiment, the bottom member 14 is raised by the second drive mechanism 19, and the depth of the cavity 13 is adjusted at an arbitrary timing, whereby the stroke of the elastic member 58 can be made ( Stroke) width does not exceed fixed. Therefore, even a relatively thick resin mold (for example, a semiconductor package having a thickness of about 5 mm for a power transistor for controlling a large current) can be sufficiently pressurized. Compression forming.

Further, in the resin sealing and molding apparatus 10 of the present embodiment, after the resin sealing molding is completed, the bottom surface member 14 is moved up and down by the second driving mechanism 19. Thereby, the resin burrs that penetrate the sliding surfaces of the frame member 15 and the bottom member 14 can be removed (FIG. 4). Further, at this time, in order to easily remove the resin burrs, it is preferable to provide the grooves 14A on the side of the bottom member 14 (Figs. 5(a) and (b)). After the resin burrs are removed, they are sucked by a suction mechanism not shown. The resin is burred and removed. Thereby, the resin sealing and molding apparatus 10 can be stably operated continuously.

[Embodiment 2]

Next, a second embodiment of the resin sealing and molding apparatus for an electronic component according to the present invention will be described with reference to Figs. 6 to 9 . In the resin sealing and molding apparatus 30 of the present embodiment, the frame member 15 is vertically moved by the second drive mechanism 19. The frame member 15 is coupled to the coupling member 32 , and the coupling member 32 is coupled to the frame-shaped movable plate 31 via the elastic member 33 . The movable plate 31 is moved up and down by the second drive mechanism 19 placed inside the pressing member 17 (FIG. 6). The other configuration is the same as that of Fig. 1. The pressing member 17 is driven up and down by a first driving mechanism 18 (not shown) provided below the pressing member 17.

The resin sealing step using the electronic component having the above-described resin sealing and molding apparatus 30 will be described. First, as shown in Fig. 7 (a), the resin sealing molding die 101 is opened, and the substrate 70 is fixed to the lower surface of the upper mold 11. At this time, the substrate 70 is mounted on the lower surface of the electronic component 71. Further, a granular resin material 73 is supplied to the cavity 13 of the lower mold 12. After the granular resin material 73 is supplied into the cavity 13, the molten resin 72 is melted by heating the resin material 73 in the cavity 13, thereby forming a melting resin 72 (Fig. 7(b)). At this time, the total volume of the resin is reduced. Therefore, the frame member 15 is lowered by the second drive mechanism 19, and the height of the upper surface of the bottom member 14 and the upper surface of the frame member 15 is appropriately adjusted (FIG. 7(c)).

Then, the pressing member 17 is raised by the first drive mechanism 18, and the upper surface of the frame member 15 of the lower mold 12 is brought into contact with the peripheral portion of the substrate 70 (Fig. 7(d)). Thereafter, the pressing member 17 is further raised, the electronic component 71 is immersed in the molten resin 72 in the cavity 13, and the molten resin 72 is pressurized by the bottom member 14 (FIG. 7(e)). Make the pressurized state The predetermined temperature is maintained for a predetermined period of time, and the molten resin 72 is hardened to form a hardened resin. Thereby, a sealed molded article obtained by sealing the electronic component 71 with a curing resin is formed.

Further, the timing at which the frame member 15 is moved up and down by the second drive mechanism 19 may be any timing. For example, when the molten resin 72 is pressurized, the frame member 15 can be lowered by the second drive mechanism 19 in synchronization with the rise of the pressing member 17. Moreover, when the granular resin 73 is put into the cavity 13, the frame member 15 can be moved up and down by the second drive mechanism 19 as appropriate depending on the amount of the input.

Fig. 8 is an explanatory view showing a releasing step in the resin sealing and molding apparatus 30 of the present embodiment. In FIG. 8(a), the pressing member 17 is lowered by the first drive mechanism 18, and the frame member 15 is raised by the second drive mechanism 19 at a distance corresponding to the lowering of the pressing member 17. Thereby, the state in which the substrate 70 is pressed by the frame member 15 can be maintained, and the bottom member 14 can be lowered by the second drive mechanism 19, so that the bottom member 14 can be stably released from the package. Thereafter, the pressing member 17 is further lowered by the first drive mechanism 18 (Fig. 8(b)).

As described above, in the resin sealing and molding apparatus 30 of the present embodiment, the depth of the cavity 13 after the volume reduction of the resin can be appropriately adjusted by the second driving mechanism 19. Therefore, the resin sealing and molding apparatus 30 of the present embodiment can also be preferably used for a relatively thick resin mold (for example, a semiconductor package having a thickness of about 5 mm for controlling a large current power transistor). Sealed and formed.

Further, in the resin sealing and molding apparatus 30 of the present embodiment, after the resin sealing molding is completed, the frame member 15 is moved up and down by the second driving mechanism 19. Thereby, the resin burrs that penetrate the sliding surfaces of the frame member 15 and the bottom member 14 can be removed (FIG. 9). Further, similarly to the resin sealing and molding apparatus 10 of the first embodiment, it is preferable to provide the bottom member 14 There is a weekly slot 14A.

Furthermore, the above-described embodiments are merely examples, and it is obvious that they can be appropriately modified or corrected in accordance with the gist of the present invention.

For example, as a modification of the resin sealing and molding apparatus 30 of the second embodiment, the intermediate plate 75 may be coupled to the frame member 15 and moved up and down by the air cylinder 76 (FIG. 10). The resin sealing step in the resin sealing and molding apparatus of Fig. 10 and the resin burr removal step after the resin sealing step are the same as in the second embodiment.

10‧‧‧Resin sealing forming device

11‧‧‧Upper mold

12‧‧‧ Lower mold

13‧‧‧ cavity

14‧‧‧Bottom components

15‧‧‧Frame components

17‧‧‧ Pressurized components

18‧‧‧1st drive mechanism

19‧‧‧2nd drive mechanism

20‧‧‧Flexible components

70‧‧‧Substrate

71‧‧‧Electronic parts

101‧‧‧Resin sealing forming die

Claims (8)

A resin sealing and molding apparatus comprising: a) a mold for holding an electronic component mounting substrate on a lower surface; and b) a lower mold disposed to face the upper mold, having: a frame member and sliding up and down inside the frame member a bottom member that may be disposed; c) a pressing member disposed below the frame member through the elastic member; d) a first driving mechanism that moves the pressing member up and down; and e) a second driving mechanism that causes the bottom surface The member is moved up and down, and the bottom member can be moved such that the upper surface of the bottom member is located above the upper surface of the frame member. The resin sealing and molding apparatus according to claim 1, wherein the bottom member is moved up and down after the resin sealing step. A resin sealing molding apparatus comprising: a) a mold for holding an electronic component mounting substrate on a lower surface; and b) a lower mold disposed opposite to the upper mold, having: a frame member and sliding up and down inside the frame member a bottom member that may be disposed; c) a pressing member disposed below the frame member through the elastic member; d) a first driving mechanism that moves the pressing member up and down; and e) a second driving mechanism that causes the bottom surface The member moves up and down, and the bottom member is moved up and down after the resin sealing step. The resin sealing and molding apparatus according to any one of claims 1 to 3, wherein a groove is provided on a side circumference of the bottom member. A resin sealing and molding apparatus comprising: a) a mold for holding an electronic component mounting substrate on a lower surface; and b) a lower mold disposed opposite to the upper mold, and sliding up and down on a peripheral portion of the bottom member and the bottom member a frame member that may be disposed; c) a pressing member disposed below the bottom member; d) a first driving mechanism that moves the pressing member up and down; and e) a second driving mechanism that transmits the frame through the elastic member The body member is moved up and down, and the frame member can be moved such that the upper surface of the frame member is located below the upper surface of the bottom member. The resin sealing and molding apparatus according to claim 5, wherein the frame member is moved up and down after the resin sealing step. A resin sealing and molding apparatus comprising: a) holding a mold on an electronic component mounting substrate on a lower surface; b) a lower mold disposed opposite to the upper mold, and having a sliding up and down on a peripheral portion of the bottom member and the bottom member a frame member disposed in the ground; c) a pressing member disposed below the bottom member; d) a first driving mechanism that moves the pressing member up and down; and e) a second driving mechanism that transmits the frame through the elastic member The member moves up and down, and the frame member is moved up and down after the resin sealing step. The resin sealing and molding apparatus according to any one of claims 5 to 7, wherein a groove is provided on a side circumference of the bottom member.