TWI711520B - Resin sealing forming device and resin sealing forming method - Google Patents

Abstract

In order to provide a resin sealing molding device and a resin sealing molding method, the exposed member of the electronic component can be pressed against the inner surface of the cavity at any timing before and after the mold is closed, before and after the resin is injected, so as to prevent the exposed member of the electronic component from cracking And resin leakage. The resin sealing molding device includes: a mold (11) with a cavity (21A, 21B, 22A, 22B) for molding a resin package, and electronic components to be set in the cavity (21A, 21B, 22A, 22B) (2) The exposed member (2A, 2B) is pressed tightly against at least one movable pin (12A, 12B) on the inner surface of the mold cavity (21A, 21B, 22A, 22B), and supports at least one movable pin through a spring (14A, 14B) The movable plate (15) of the pins (12A, 12B), and the driving part (16) that drives the movable plate (15).

Description

Resin sealing forming device and resin sealing forming method

The present invention relates to a resin sealing molding apparatus and a resin sealing molding method for resin sealing and molding an electronic component to form a resin package, and more specifically, it relates to a state where a part of the electronic component is exposed on the surface of the resin package The following is a resin seal molding device and a resin seal molding method that implement resin seal molding.

When performing resin sealing and molding with a part of the electronic component exposed on the surface of the resin package, the exposed member of the electronic component placed in the molding cavity is pressed against the bottom surface of the cavity with a pin to avoid molding resin The resin is molded and hardened by entering between the cavity and the exposed surface of the exposed member, and the following methods (1) to (3) can be used.

(1) Fix and install the pin (fixing pin) on the forming mold, and with the mold clamping, use the fixing pin to press the exposed member against the bottom surface of the cavity to prevent resin from entering. (2) A spring supporting pin is used in the molding die, and the pin is pressed against the exposed member by spring pressure along with mold clamping, and the pressing force is adjusted by selecting and replacing the spring pressure (for example, refer to Patent Document 1). (3) Mount the pin (movable pin) on the movable plate that can be controlled up and down. By lowering the movable plate, the exposed member is pressed against the bottom surface of the cavity with the movable pin, and the resin is filled, and the movable pin is raised before the resin hardens. And let the resin harden (for example, refer to Patent Document 2). [Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Application Publication No. 2012-138517 Patent Document 2: Japanese Patent Application Publication No. 2015-225874

[The problem to be solved by the invention]

When the material of the exposed member is a member that is prone to cracks such as ceramics, it is necessary to prevent cracks from occurring when the exposed member is pressed against the bottom surface of the cavity with a pin.

However, according to the above method (1), since the pressing force cannot be adjusted, in order to prevent cracks, a gap must be left between the exposed member and the fixing pin to avoid applying a load, and there is a concern that resin may leak from the gap.

In addition, according to the method (2) above, the spring must be replaced in order to adjust the pressing force, and there is a problem that load control cannot be performed. Moreover, when filling resin into the cavity, there is a concern that the pin will be pushed up by the resin pressure. Therefore, it is necessary to use a spring pressure that takes this resin pressure into account, because the exposed member is clamped from before the resin injection. Applying a large force may expose the component to damage.

In addition, according to the method (3) above, when multiple exposed members are formed in batches, if multiple movable pins are mounted on the movable plate, and the movable plate is lowered to press the multiple movable pins together, there is The problem of thickness deviation between members cannot be absorbed. Therefore, in the thick exposed member, there is a concern that it will cause high load and cause damage; in the thinner exposed member, insufficient pressing force or gaps are the main reasons for resin leakage. In addition, if the movable pins are driven individually for a plurality of exposed members, there are problems such as increased costs, complicated adjustments, and larger sizes.

Therefore, the object of the present invention is to provide a resin sealing molding apparatus and a resin sealing molding method, which can press the exposed members of electronic components against the inner surface of the cavity at any timing before and after mold clamping, before and after resin injection, and can prevent electronic The exposed components of the component are cracked and resin leaks. [Technical means to solve the problem]

The resin sealing and molding device of the present invention includes: a mold having one or more cavities for molding a resin package, and pressing the exposed members of the electronic components provided in the one or more cavities into the mold cavity The inner surface of the at least one movable pin, the movable plate that supports the at least one movable pin through the elastic member, and the driving part that drives the movable plate.

According to the resin sealing and molding apparatus of the present invention, the movable plate is driven at any timing before and after mold clamping, before and after resin injection, etc., and at least one movable pin supported by an elastic member on the movable plate is used to form a resin The exposed components of the electronic components in the mold cavity of one or more cavities of the package are pressed tightly against the inner surface of the mold cavity, so that the resin can be prevented from entering between the mold cavity and the exposed surface of the exposed member. The resin is molded and hardened. At this time, the exposed member of the electronic component is pressed against the inner surface of the mold cavity by the elastic deformation of the elastic member.

Preferably, in the resin sealing and molding device of the present invention, at least one movable pin is a plurality of movable pins, and the resin sealing and molding device has a holding member interposed between the elastic member and the movable pin and for holding the movable pin. The holding member is provided so as to be able to tilt with respect to the advancing and retreating direction of the movable pin. In this way, the holding member is tilted in accordance with the inclination and unevenness of the surface of the exposed member of the electronic component, and the advance and retreat of a plurality of movable pins are used to absorb the inclination and unevenness of the surface of the exposed member of the electronic component. The movable pin evenly presses the exposed member of the electronic component to prevent cracking of the exposed member of the electronic component and resin leakage.

In addition, in the resin sealing and molding device of the present invention, it is preferable that the exposed member of the electronic component provided in the one or more cavities is a plurality of exposed members, and at least one movable pin is a plurality of movable corresponding to the plurality of exposed members. The pin and the movable plate are supported by a plurality of elastic members and a plurality of holding members. The plurality of elastic members correspond to the plurality of exposed members, and the plurality of holding members hold the movable pins and the exposed members correspondingly. In this way, when a plurality of exposed members are provided in one or more mold cavities, even if there are deviations in height and inclination between the plurality of exposed members, a plurality of elastic members, a plurality of holding members, and a plurality of movable pins are used with the plurality of Each exposed member presses it against the inner surface of the mold cavity accordingly, so that the resin can be molded and hardened by preventing resin from entering between the mold cavity and the exposed surface of the exposed member.

In the resin sealing molding device of the present invention, it is preferable that the driving part and the mold can be separated between the driving part and the movable plate. In this way, by separating the driving part and the mold between the driving part and the movable plate, only the mold can be replaced.

Preferably, the resin sealing and molding device of the present invention has a joint portion that connects the driving portion and the movable plate, and the joint portion can be attached and detached only in a direction orthogonal to the moving direction of the movable plate . In this way, the movable plate is driven by the driving part, and the exposed member is pressed against the inner surface of the cavity by the movable pin. After the resin is injected, the driving part is used to forcibly move the movable plate to the initial position, and when the mold is replaced, the mold By moving in a direction orthogonal to the moving direction of the movable plate, the joint part can be detached.

Preferably, the resin sealing and molding apparatus of the present invention includes a first sensor that detects the pressure of the resin filled in the cavity, a second sensor that detects the pressing force of the movable pin, and The detection results of the first sensor and the second sensor control the drive unit to adjust the pressing force of the movable pin. In this way, it is possible to adjust the pressing force applied by the movable pin to the exposed member of the electronic component in response to changes in the pressure of the resin filled in the cavity and the pressing force of the movable pin, and it is possible to prevent cracks and resin leakage of the exposed member of the electronic component. leak.

The resin sealing molding method of the present invention includes: by driving a movable plate that supports at least one movable pin through an elastic member, pressing an exposed member of an electronic component set in a cavity of a mold having one or more cavities On the inner surface of the mold cavity, the mold cavity is used to mold the resin package; fill the mold cavity with resin; retreat the movable pin to further fill the resin; and after the resin is hardened, the resin package is released from the mold.

According to the resin seal molding method of the present invention, the movable plate is driven at any timing before and after mold clamping, before and after resin injection, etc., and at least one movable pin supported by the movable plate through an elastic member is used to set the resin The exposed components of the electronic components in the mold cavity of one or more cavities of the package are pressed tightly against the inner surface of the mold cavity, so that the resin can be prevented from entering between the mold cavity and the exposed surface of the exposed member. The resin is molded and hardened. At this time, the exposed member of the electronic component is pressed against the mold cavity by the elastic deformation of the elastic member, so it is possible to prevent the exposed member of the electronic component from cracking and resin leakage.

Another resin sealing molding method of the present invention includes: by driving a movable plate, a plurality of exposed members of an electronic component disposed in a cavity of a mold having one or more cavities are pressed into the cavity On the surface, the mold cavity is used to mold the resin package; the movable plate supports the movable pins corresponding to the plurality of exposed members through a plurality of elastic members and a plurality of holding members, and the plurality of elastic members are connected to the plurality of exposed members. Correspondingly, the plurality of holding members respectively hold the plurality of movable pins and the plurality of exposed members; fill the cavity with resin; retreat the plurality of movable pins, and further fill the resin; and after the resin hardens, let the resin encapsulate The body is released from the mold.

According to this resin sealing molding method, when a plurality of exposed members are provided in one or more mold cavities, the movable plate is driven at any timing before and after mold clamping, before and after resin injection, even if there is a height between the plurality of exposed members. The deviation of the inclination is pressed against the inner surface of the mold cavity by a plurality of elastic members, a plurality of holding members and a plurality of movable pins corresponding to the plurality of exposed members, so that it can prevent the resin from entering the cavity and being exposed The way between the exposed surfaces of the component allows the resin to be molded and hardened.

It is also preferable that when the electronic components are arranged in the cavity, the release film is interposed between the inner surface of the cavity and the exposed member. In this way, when the exposed member of the electronic component is pressed against the inner surface of the cavity with the movable pin, the flexibility of the release film absorbs the minute gap between the exposed member and the inner surface of the cavity, thereby further preventing the resin from entering To between the cavity and the exposed surface of the exposed member. [Effects of Invention]

(1) According to the present invention, the movable plate is driven at any timing before and after mold clamping, before and after resin injection, etc., to prevent resin from entering between the mold cavity and the exposed surface of the exposed member. When the resin is molded and hardened, the electronic components are exposed The member is pressed against the inner surface of the mold cavity by the elastic deformation of the elastic member, so it is possible to prevent cracking of the exposed member of the electronic component and resin leakage.

(2) It has: a first sensor that detects the pressure of the resin filled in the cavity, a second sensor that detects the pressing force of the movable pin, and the detection results based on the first sensor and the second sensor The control unit that controls the drive unit to adjust the pressing force of the movable pin. According to this structure, the pressing force of the movable pin applied to the exposed member of the electronic component can be adjusted according to the pressure of the resin filled in the cavity and the pressing force of the movable pin. Pressure can further prevent cracks in exposed components of electronic components and resin leakage.

(3) At least one movable pin is a plurality of movable pins and includes a holding member, the holding member is interposed between the elastic member and the movable pin and used to hold the movable pin, and the holding member is set to be able to move forward and backward relative to the movable pin Tilting. According to this structure, the exposed member of the electronic component can be evenly pressed by a plurality of movable pins corresponding to the inclination and unevenness of the surface of the exposed member of the electronic component, which can further prevent the exposed member of the electronic component from cracking and resin leakage .

(4) The exposed members of the electronic components arranged in one or more mold cavities are a plurality of exposed members, at least one movable pin is a plurality of movable pins corresponding to the plurality of exposed members, and the movable plate penetrates the plurality of elastic members and A plurality of holding members are supported, a plurality of elastic members correspond to a plurality of exposed members, and a plurality of holding members respectively hold a plurality of movable pins and a plurality of exposed members. According to this structure, it can correspond to a plurality of exposed members. The deviation of the height and the inclination of the product can be used for batch resin sealing molding of multiple exposed members.

(5) The driving part and the mold can be separated between the driving part and the movable plate, so that only the mold can be replaced to correspond to different types of electronic components.

(6) It has a joint part that connects the driving part and the movable plate. The joint part can only be attached and detached in the direction orthogonal to the moving direction of the movable plate. According to this structure, the driving part can be used to reliably move the movable plate to the initial position. The position is moved, and when the mold is replaced, by moving the mold in a direction orthogonal to the moving direction of the movable plate, the joint can be detached and the mold can be easily replaced.

(7) When installing electronic components in the cavity, the release film is interposed between the inner surface of the cavity and the exposed member. In this way, the flexibility of the release film can be used to prevent the resin from entering the cavity and the exposed member. Between the exposed surfaces, resin leakage can be further prevented.

Fig. 1 is a schematic configuration diagram of a resin seal molding apparatus according to an embodiment of the present invention. As shown in FIG. 1, the resin seal molding apparatus 1 according to the embodiment of the present invention includes a mold 11, movable pins 12A and 12B, a movable plate 15, a driving unit 16, and a control unit 17. The mold 11 is composed of an upper mold 21 and a lower mold 22, and has cavities 21A, 21B, 22A, and 22B for molding a resin package. The movable pins 12A, 12B correspond to the exposed members 2A, 2B of the electronic component 2 provided in the mold cavities 21A, 21B, 22A, 22B, respectively, and are used to press the exposed members 2A, 2B in the mold cavities 22A, 22B. surface. The movable plate 15 supports the movable pins 12A, 12B through corresponding springs 14A, 14B as elastic members, respectively. The driving unit 16 drives the movable plate 15 with a driving rod 16A that can move forward and backward. The control unit 17 is used to control the drive unit 16.

The mold 11 is formed by combining an upper mold 21 and a lower mold 22. On the lower surface of the upper mold 21, cavities 21A and 21B for molding the resin package are formed. On the upper surface of the lower mold 22, cavities 22A and 22B for forming a resin package are formed. In addition, the lower mold 22 is provided with ejector pins 24 for taking out the molded resin package from the mold 11. In addition, the upper mold 21 and the lower mold 22 are configured to be installed in a pressing device not shown so as to be able to approach and move away relatively.

The movable pins 12A and 12B are provided on the upper mold 21. The upper mold 21 is provided with guide holes 23A, 23B for receiving the movable pins 12A, 12B. The movable pins 12A, 12B are provided with plural pieces of the holding members 13A, 13B between the movable pins and the springs 14A, 14B. The holding members 13A and 13B are configured to be able to move through the springs 14A and 14B in accordance with the movement of the movable plate 15 driven by the drive unit 16. The movable pins 12A and 12B enter or exit the cavity 21A, the cavity 22A, the cavity 21B, and the cavity 22B in accordance with the movement of the holding members 13A and 13B.

In the resin sealing molding device 1 of the above structure, the upper mold 21 and the lower mold 22 of the mold 11 are separated, and the cavities 21A, 21B, 22A, and 22B are opened in the open cavities 21A, 21B, 22A, and 22B. Supply and install electronic components 2. After that, the upper mold 21 and the lower mold 22 are brought close, and the mold 11 is closed. In this state, on the left and right sides of the cavities 21A, 21B, 22A, 22B, the electronic component 2 is clamped by the mold 11 to be fixed in position, and the cavities 21A, 21B, 22A, 22B are closed to be in a closed state.

Next, move the movable pins 12A, 12B into the mold cavities 21A, 21B, 22A, 22B of the mold 11 after the mold is closed, and press the exposed members 2A, 2B of the electronic component 2 against the inner surfaces of the mold cavities 22A, 22B. . At this time, in accordance with the downward movement of the movable plate 15 driven by the advancement of the drive rod 16A of the drive unit 16, the movable pins 12A, 12B are pressed against the exposed members 2A, 2A, 12B by the holding members 13A, 13B through the springs 14A, 14B. 2B.

2 and 3 are explanatory diagrams showing how the exposed members 2A, 2B of the electronic component 2 are pressed against the inner surfaces of the mold cavities 22A, 22B by the movable pins 12A, 12B in the resin sealing molding apparatus 1 of Fig. 1 . As shown in FIG. 2, when the thickness of the exposed members 2A and 2B are different (in the example of the figure, the exposed member 2A on the left is thicker than the exposed member 2B on the right), first the movable pin 12A abuts on the exposed member 2A on the left, With the elastic deformation of the left spring 14A, only the left exposed member 2A is pressed by the movable pin 12A.

On the other hand, the movable pin 12B on the right side is not in contact with the exposed member 2B on the right side in the state shown in FIG. 2, but when the movable plate 15 is further lowered, the movable pin 12B on the right side will contact the exposed member 2B on the right side. The contact is elastically deformed by the spring 14B on the right side as shown in FIG. 3, and the exposed member 2B on the right side is pressed by the movable pin 12B. In this way, according to the resin seal molding apparatus 1 of this embodiment, even if there is a deviation in thickness between the plurality of exposed members 2A, 2B, the plurality of exposed members 2A, 2B can be moved by the movable pin 12A by the expansion and contraction of the springs 14A, 14B. , 12B press equally.

In this way, a plurality of exposed members 2A, 2B are pressed against the inner surfaces of the mold cavities 22A, 22B to prevent resin from entering the mold cavities 22A, 22B and the exposed surfaces of the exposed members 2A, 2B (the inner surfaces of the mold cavities 22A, 22B). The cavity 21A, 21B, 22A, 22B is filled with resin in a manner between the contact surfaces with the exposed members 2A, 2B). After that, the drive rod 16A is retracted, the movable plate 15 is raised, the movable pins 12A, 12B are retracted, and the cavities 21A, 21B, 22A, and 22B are further filled with resin. Then, after the resin is cured, the upper mold 21 and the lower mold 22 of the mold 11 are separated, the ejector pins 24 are protruded, and the resin package is released from the mold 11. In this way, it is possible to obtain a resin package in which the exposed surfaces of the exposed members 2A, 2B are exposed.

As mentioned above, according to the resin sealing and molding device 1 of this embodiment, when the movable plate 15 is driven to prevent resin from entering between the cavities 22A, 22B and the exposed surfaces of the exposed members 2A, 2B, the resin is molded and hardened. The exposed members 2A, 2B of the element 2 are pressed against the inner surfaces of the mold cavities 22A, 22B by the elastic deformation of the springs 14A, 14B. Therefore, they can correspond to the height and inclination between the plurality of exposed members 2A, 2B. The deviation can prevent cracks and resin leakage of the exposed members 2A, 2B of the electronic component 2, and the plurality of exposed members 2A, 2B can be resin-sealed in batches. In addition, the movable plate 15 can be driven at any timing before and after mold clamping, before and after resin injection.

In addition, when the electronic components 2 are installed in the cavities 22A, 22B, as shown in FIG. 4, the release film 3 can be interposed between the inner surfaces of the cavities 22A, 22B and the exposed members 2A, 2B. In this way, when the exposed members 2A, 2B of the electronic component 2 are pressed against the inner surfaces of the mold cavities 22A, 22B by the movable pins 12A, 12B, the flexibility of the release film 3 is used to absorb the exposed members 2A, 2B and the cavity The minute gaps between the inner surfaces of 22A and 22B can prevent resin from entering between the cavities 22A and 22B and the exposed surfaces of the exposed members 2A and 2B, and can further prevent resin leakage.

In addition, in the resin sealing molding apparatus 1 of the present embodiment, the driving part 16 and the mold 11 can be separated between the driving rod 16A of the driving part 16 and the movable plate 15. The driving part 16 advances the driving rod 16A of the driving part 16 from the initial position shown in FIG. 1 and presses the movable plate 15 downward as shown in FIGS. 2 and 3 to move it. When the position is returned (moved), the movable plate 15 is raised by an elastic member such as a spring (not shown) accompanying the retreat of the drive rod 16A. In addition, in the initial position shown in FIG. 1, the driving part 16 and the mold 11 are separated between the driving rod 16A of the driving part 16 and the movable plate 15 so that only the mold 11 can be replaced to correspond to different types of electronic components.

FIG. 5 shows another embodiment of the separation mechanism of the driving unit 16 and the movable plate 15. In the example shown in FIG. 5, the driving rod 16A of the driving part 16 and the movable plate 15 are connected by the joint part 18. The joint portion 18 includes a substantially dovetail-shaped guide portion 18A and a substantially dovetail-shaped slider portion 18B. The guide portion 18A faces in a direction (the paper thickness direction in FIG. 5 (hereinafter referred to as the "Y direction") perpendicular to the moving direction of the movable plate 15 (the up-down direction in FIG. 5 (hereinafter referred to as "Z direction")) ) Extension, the slider portion 18B can move in the Y direction within the guide portion 18A. The guide portion 18A is provided on the side of the drive rod 16A, and the slider portion 18B is provided on the side of the movable plate 15.

The joint portion 18 of such a structure can only be attached and detached in the direction (Y direction) orthogonal to the moving direction (Z direction) of the movable plate 15, but cannot be attached and detached in the moving direction (Z direction) of the movable plate 15 , The movable plate 15 can move in accordance with the forward and backward movement of the drive rod 16A. Therefore, according to the resin seal molding apparatus 1 having the joint portion 18, the movable plate 15 is driven by the driving portion 16, and the exposed members 2A, 2B are pressed against the inner surfaces of the mold cavities 22A, 22B by the movable pins 12A, 12B, After applying the resin, the drive unit 16 forcibly moves the movable plate 15 to the initial position. When the mold 11 is to be replaced, the mold 11 is moved in a direction (Y direction) orthogonal to the moving direction (Z direction) of the movable plate 15 so that the joint portion 18 can be detached and the mold 11 can be easily replaced.

Moreover, the resin sealing and molding apparatus 1 of this embodiment may be configured to include a first sensor for detecting the pressure of the resin filled in the cavities 21A, 21B, 22A, 22B, and a sensor for detecting the movable pin 12A, The second sensor of the pressing force of 12B, and the control unit 17 that controls the driving unit 16 to adjust the pressing force of the movable pins 12A and 12B based on the detection results of the first sensor and the second sensor.

Fig. 6 is an explanatory diagram showing an example of the arrangement of sensors. In the example shown in FIG. 6, as the first sensor for detecting the pressure of the resin filled in the cavities 21A, 21B, 22A, and 22B, a pressure sensor 25 is provided at the bottom of the cavity 22A of the lower mold 22. Furthermore, as a second sensor for detecting the pressing force of the movable pins 12A, 12B, a pressure sensor 26 is provided on the movable plate 15 side of the springs 14A, 14B. In addition, instead of the pressure sensor 25, the pressure sensor 27 may be provided at the bottom of the ejector pin 24.

According to the above structure, based on the detection results of the pressure sensors 25, 27 and the pressure sensor 26, the control unit 17 controls the drive unit 16 to adjust the pressing force of the movable pins 12A, 12B, and can feed back the molding resin to the control unit 17. The change in the pressing force of the movable pins 12A, 12B caused by abnormal pressure changes, stacking, etc., can correspondingly control the pressure applied by the movable pins 12A, 12B to the exposed members 2A, 2B, or issue an alarm. Furthermore, with respect to fatigue of the springs 14A and 14B, the load control of the springs 14A and 14B can be performed by adjusting the pressing amount of the movable plate 15.

Next, another embodiment of the resin sealing molding apparatus of the present invention will be described. Fig. 7 is an explanatory diagram showing another embodiment of the resin sealing and molding apparatus of the present invention. Fig. 7(A) shows the position and posture of the movable pin and the holding member when the thickness of the exposed member of the pressed electronic component is uniform Figure 7 (B) shows the position and posture of the movable pin and the holding member when the exposed member of the pressed electronic component is thicker, and Figure 7 (C) shows the exposed member of the pressed electronic component has a A diagram showing the position and posture of the movable pin and the holding member when it is thin.

The example shown in FIG. 7 uses two types of springs 31 and 32 instead of the above-mentioned spring 14A. In this example, the smaller spring 31 is combined inside the larger spring 32 on the outer side. By combining a plurality of springs 31 and 32 in this way, the load to be applied to the exposed member of the electronic component can be appropriately set.

Moreover, the example shown in FIG. 7 replaces the above-mentioned movable pin 12A, and adopts a plurality of movable pins 33 whose head 33A is formed as a curved surface as shown in FIG. 8. Furthermore, in place of the above-mentioned holding member 13A, a holding member 34 provided so as to be inclined with respect to the advancing and retreating direction of the plurality of movable pins 33 is adopted.

According to the holding member 34, even if the exposed member of the electronic component pressed as shown in FIG. 7(B) is thicker (thicker on the left), or the electronic component pressed as shown in FIG. 7(C) There is a case where the exposed member of the component is thinner (thin on the left side), etc. That is, even if the height of the plurality of movable pins 33 is changed corresponding to the inclination and unevenness of the surface of the exposed member of the electronic component, it can correspond to the plural The position of the two movable pins 33 tilts the holding member 34. In this way, the amount of advance and retreat of the plurality of movable pins 33 can absorb the inclination and unevenness of the surface of the exposed member of the electronic component, and the exposed member of the electronic component can be evenly pressed by the plurality of movable pins 33 to prevent the exposure of the electronic component. Cracked components and resin leakage.

In particular, in this example, by using a plurality of movable pins 33 whose head 33A is formed as a curved surface, even if the height of the plurality of movable pins 33 is changed corresponding to the inclination and unevenness of the surface of the exposed member of the electronic component, The movable pin 33 and the holding member 34 can be maintained in contact. In this way, the exposed members of the electronic components can be evenly pressed by the plurality of movable pins 33 to further prevent cracks in the exposed components of the electronic components and resin leakage.

In addition, in the example described in the above example, for each exposed member to be pressed, a plurality of movable pins 12A, 12B are respectively pressed by one spring 14A, 14B through the holding members 13A, 13B, but it may be as As shown in FIG. 9, it is generally configured that a spring 35 is attached to a plurality of movable pins 33 individually. In this case, based on the restriction on the distance between the movable pins 33, the spring 35 with a small outer diameter is used. Compared with the case where each exposed member is pressed by one spring 14A, 14B, the free length deviation, The load difference caused by the load deviation will become larger. On the other hand, when each exposed member is pressed by one spring 14A, 14B, since springs 14A, 14B with a large amount of deflection can be used, the initial deflection can be increased, and the deviation caused by the free length can be reduced. The load is poor. [Industrial Utilization]

The resin sealing and molding apparatus and the resin sealing and molding method of the present invention are useful as an apparatus and method for performing resin sealing and molding in a state where a part of an electronic component is exposed on the surface of a resin package.

1: Resin seal molding device 2: electronic components 2A, 2B: exposed components 3: Release film 11: Mould 12A, 12B, 33: movable pin 13A, 13B, 34: holding member 14A, 14B, 31, 32: Spring 15: movable plate 16: drive part 16A: Drive rod 17: Control Department 18: Joint 18A: Guidance 18B: Sliding part 21: upper die 22: Lower die 21A, 21B, 22A, 22B: mold cavity 23A, 23B: guide hole 24: ejector pin 25, 26, 27: pressure sensor 33A: head 35: spring

Fig. 1 is a schematic configuration diagram of a resin seal molding apparatus according to an embodiment of the present invention. Fig. 2 is an explanatory diagram showing an operating state of a movable pin of the resin seal molding apparatus of Fig. 1. Fig. 3 is an explanatory diagram showing an operating state of a movable pin of the resin sealing and molding device of Fig. 1. Fig. 4 is an explanatory diagram showing an example in which a release film is interposed between the inner surface of the cavity and the exposed member. Fig. 5 is an explanatory diagram showing another embodiment of the separation mechanism of the driving section and the movable plate. Fig. 6 is an explanatory diagram showing an example of the arrangement of sensors. FIG. 7 is an explanatory diagram showing another embodiment of the resin sealing and molding apparatus of the present invention. FIG. 7(A) shows the position and posture of the movable pin and the holding member when the thickness of the exposed member of the pressed electronic component is uniform 7(B) is a diagram showing the position and posture of the movable pin and the holding member when the exposed member of the pressed electronic component is thicker, and FIG. 7(C) shows the position and posture of the pressed electronic component A diagram showing the position and posture of the movable pin and the holding member when the exposed member is thin. Fig. 8 is a side view of the movable pin of Fig. 7. Fig. 9 is an explanatory diagram showing an example in which a spring is attached to a plurality of movable pins.

1: Resin seal molding device

2: electronic components

2A, 2B: exposed components

11: Mould

12A, 12B: movable pin

13A, 13B: Holding member

14A, 14B: Spring

15: movable plate

16: drive part

16A: Drive rod

17: Control Department

21: upper die

22: Lower die

21A, 21B, 22A, 22B: mold cavity

23A, 23B: guide hole

24: ejector pin

Claims (9)

A resin sealing molding device comprising: a mold having one or more cavities for forming a resin package, and pressing the exposed members of the electronic components arranged in the aforementioned one or more cavities into the cavity At least one movable pin on the surface, a movable plate that supports the at least one movable pin through an elastic member and a holding member, and a driving part that drives the movable plate. The resin sealing and molding device according to claim 1, wherein the at least one movable pin is a plurality of movable pins, and the resin sealing and molding device has a holding member interposed between the elastic member and the plurality of movable pins It is used to hold the plurality of movable pins occasionally, and the holding member is arranged to be able to tilt with respect to the advance and retreat direction of the plurality of movable pins. The resin sealing molding device according to claim 1 or 2, wherein the exposed member of the electronic component provided in the one or more cavities is a plurality of exposed members, and the at least one movable pin is the same as the plurality of exposed members. A plurality of movable pins corresponding to the exposed members, and the aforementioned movable plate enters through a plurality of elastic members and a plurality of holding members. For supporting, the plurality of elastic members correspond to the plurality of exposed members, respectively, and the plurality of holding members hold the plurality of movable pins and the plurality of exposed members correspondingly. The resin sealing molding device according to claim 1 or 2, wherein the driving part and the mold can be separated between the driving part and the movable plate. The resin sealing and molding device according to claim 1 or 2, wherein the resin sealing and molding device has a joint portion that connects the drive portion and the movable plate, and the joint portion can only move with the movable plate Load and unload in the direction orthogonal to the direction. The resin sealing and molding device according to claim 1 or 2, wherein the resin sealing and molding device has a first sensor that detects the pressure of the resin filled in the cavity, and a first sensor that detects the pressing force of the movable pin 2 A sensor, and a control unit that controls the drive unit and adjusts the pressing force of the movable pin based on the detection results of the first sensor and the second sensor. A resin sealing molding method includes: by driving a movable plate that supports at least one movable pin through an elastic member and a holding member, exposing an electronic component disposed in the aforementioned cavity of a mold having one or more cavities Press tightly on the inner surface of the aforementioned cavity On the other hand, the mold cavity is used to mold the resin package; the resin is filled in the mold cavity; the movable pin is retracted to further fill the resin; and after the resin is cured, the resin package is released from the mold. A resin sealing molding method includes: pressing a plurality of exposed members of an electronic component arranged in the cavity of a mold having one or more cavities against the inner surface of the cavity by driving a movable plate, The aforementioned mold cavity is used for molding a resin package, the aforementioned movable plate supports a plurality of movable pins corresponding to the aforementioned plurality of exposed members through a plurality of elastic members and a plurality of holding members, and the aforementioned plurality of elastic members is the same as the aforementioned plural. Each of the exposed members corresponds to each of the plurality of holding members, respectively holding the plurality of movable pins and the plurality of exposed members; filling the mold cavity with resin; retreating the plurality of movable pins, and further filling the resin; And after the resin is cured, the resin package is released from the mold. The resin sealing molding method according to claim 7 or 8, wherein when the electronic component is placed in the mold cavity, a release film is interposed between the inner surface of the mold cavity and the exposed member.

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