TWI668769B - Transfer molding machine and method of manufacturing electronic components - Google Patents

Abstract

The present invention provides an electronic component sealing mold, comprising: a lower mold cavity block for mounting a substrate on which an electronic component is disposed; and an upper mold cavity holding portion that moves up and down in conjunction with the lower die cavity block to move up and down And holding the substrate with the lower mold cavity block; the upper die holder holding portion moves up and down in conjunction with the upper and lower mold holding portions to move up and down, and has a through hole; the upper mold spring member is kept with the upper mold block The upper mold cavity block is positioned to be movable up and down in the upper mold chamber holding portion, and forms a chamber between the upper mold chamber block and the lower mold chamber block; and the joint member is slidably Inserted into the through hole of the upper die holder holding portion and fixed to the upper surface of the upper mold cavity block. A kettle portion into which a plunger is inserted is provided in the lower mold cavity block, and the plunger is used to inject a molten resin covering the surface of the electronic component in the chamber.

Description

Transfer forming machine and method of manufacturing electronic parts Field of invention

The present invention relates to an electronic component sealing mold for sealing electronic parts, a transfer molding machine including the electronic component sealing mold, and an electronic component sealing method using the electronic component sealing mold.

Background of the invention

Heretofore, as an electronic component sealing mold for resin sealing of electronic parts, there is an electronic component sealing mold using a fixed chamber block. However, in the case of using a fixed chamber block, when the mold gap is very narrow, it is easy to be entangled with the sealing resin or air. Therefore, a weld mark or a void may occur on the surface of the electronic component due to the encapsulating resin or air, and the bonding wire may be easily damaged.

In order to solve this problem, in the semiconductor package manufacturing apparatus described in Patent Document 1, as shown in FIG. 2(b), the plunger 15 in the kettle 14 is raised to press the molten resin 18a into the chamber. The resin 18a is filled in the chamber recess 7. Thereafter, as shown in FIG. 3(a), the block 10 is pushed and pushed. The shaft is pushed so that the movable chamber 9 in the upper mold 3 is further slightly lowered to be compression-molded.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-277470

Summary of invention

However, in the molding die 1 of the above-described manufacturing apparatus, after the molten resin 18a is filled in the chamber recessed portion 7, the pressing shaft block 10 and the pressing shaft are further subjected to compression molding. Therefore, in the molding die 1, the internal pressure in the chamber recess 7 is changed to be high, and the resin 18a is likely to leak.

Further, in the molding die 1 of the above-described manufacturing apparatus, it is necessary to attach the pressing shaft block 10 and the pressing shaft. Therefore, the structure of the forming mold 1 is complicated, and there is a problem that the manufacturing cost is high.

In view of the above problems, an object of the present invention is to provide an electronic component sealing mold which does not cause voids and weld lines, and which does not cause damage to the bonding wires, and which has no resin leakage, and which has a simple structure and a low manufacturing cost.

An electronic component sealing mold according to a first aspect of the present invention, comprising: a lower mold chamber block for placing a substrate on which an electronic component is disposed; an upper mold chamber holding portion, and a lower mold cavity block Moving up and down to move up and down, and holding the substrate with the aforementioned lower mold cavity block; The upper mold holder holder moves up and down in conjunction with the upper and lower mold holding portions to move up and down, and has a through hole; the upper mold spring member is interlocked with the upper mold holder holding portion And stretching; the upper mold cavity block is positioned to be movable up and down in the upper mold cavity holding portion, and a cavity is formed between the lower mold cavity block; and the connecting member is slidably inserted into the foregoing a through hole of the upper die holder holding portion and fixed to the upper surface of the upper mold cavity block, and a plug portion into which the plunger is inserted is disposed in the lower mold cavity block, the plunger being used in the cavity A molten resin covering the surface of the aforementioned electronic component is injected.

According to the electronic component sealing mold of the first aspect of the invention, the molten resin can be injected into the wider mold gap at a relatively low pressure until the molten resin covers the upper surface of the electronic component. Therefore, the molten resin or the air is not caught, and the occurrence of voids and weld lines can be prevented, and damage of the bonding wires can be prevented at the same time.

Further, there is no need for a new drive mechanism that can generate a higher pressure to thinly spread the molten resin covering the upper surface of the aforementioned electronic component. Therefore, an electronic component sealing mold having no resin leakage, a simple structure, and a low manufacturing cost can be obtained.

A transfer molding machine according to a second aspect of the present invention includes the electronic component sealing mold according to the first aspect of the present invention, and a plunger that can be inserted back and forth into the kettle portion, and the transfer molding machine is mounted for the first time. Injection step, push step, And a second injection step of stopping the plunger to a position covering at least the upper surface of the electronic component with the molten resin; the pressing step is using the upper mold chamber The lower surface of the block is pressed to melt the molten resin to cover the upper surface of the electronic component. In the second injection step, the molten resin is filled into the space remaining in the chamber by the plunger.

A transfer molding machine according to a third aspect of the present invention includes the electronic component sealing mold according to the first aspect of the present invention, and a plunger that can be inserted back and forth into the kettle portion, and the transfer molding machine is mounted with the first execution. a sub-injection step, a pressing step, and a second injection step of moving the plunger to a position where at least the upper surface of the electronic component is covered with the molten resin, and then moving up and down Stopping in the state; the pressing step is to spread the molten resin covering the upper surface of the electronic component by using the lower surface of the upper mold cavity block, and simultaneously move the plunger up and down; the second injection step is The plunger fills the molten resin into a space remaining in the chamber.

According to the second aspect of the present invention, in the transfer molding machine, the molten resin can be injected into the wider mold gap at a relatively low pressure until the molten resin covers the upper surface of the electronic component. Therefore, it is not involved in the molten resin or air, and the occurrence of voids and weld lines can be prevented, and the bonding wire can be prevented at the same time. Damage.

Further, there is no need for a new drive mechanism that can generate a higher pressure to thinly spread the molten resin covering the upper surface of the aforementioned electronic component. Therefore, it is possible to obtain a transfer molding machine having an electronic component sealing mold which is free from resin leakage, has a simple mold structure, and has a low manufacturing cost.

Further, according to the third aspect of the present invention, the transfer molding machine can be moved up and down by the plunger even if the amount of movement of the upper mold chamber block is larger than the height of the electronic component sealed by the resin. And adjust the resin pressure in the chamber. Therefore, the resin pressure in the aforementioned chamber does not exceed a certain pressure. As a result, a resin seal having no resin leakage and higher dimensional accuracy can be obtained.

In the second or third aspect of the invention, the release film may be disposed between the upper mold cavity block and the substrate including the electronic component.

According to this embodiment, it is possible to further effectively prevent leakage of the molten resin by the release film. Therefore, compared with the prior art, the mold structure is simplified, and a transfer molding machine having an electronic component sealing mold having a low manufacturing cost can be obtained.

In the second or third aspect of the present invention, the position adjusting spacer may be exchangeably disposed between the connecting member and the connecting member.

According to the present embodiment, even if the thickness of the resin portion to be resin-sealed is not uniform due to the volume of the electronic component, the position of the upper mold cavity block can be adjusted by exchanging the position adjustment spacer. Therefore, it is not necessary to exchange the entire upper mold cavity block. As a result, versatility is obtained Transfer molding machine.

In the second or third aspect of the invention, the mold chamber holding portion under the lower mold cavity block may be supported from the lower side, and the floating member capable of adjusting the upper and lower positions of the lower mold chamber block may be disposed.

According to this embodiment, the lower mold cavity block can be moved up and down by moving the floating member up and down. Therefore, even if the thickness of the substrate is not uniform, it can be formed by absorption error, so that an electronic component sealing mold having a better yield can be obtained.

Further, according to the present embodiment, even when the substrate having different thicknesses is resin-sealed, the floating member can be moved up and down to perform resin sealing. Therefore, a versatile transfer molding machine can be obtained.

An electronic component sealing method according to a fourth aspect of the present invention is the electronic component sealing method of the electronic component sealing mold according to the first aspect of the present invention, comprising: the first injection step of moving the plunger to use Stopping after the molten resin covers at least the upper surface of the electronic component; the step of dispersing is to melt the surface of the upper surface of the upper mold cavity block to cover the surface of the electronic component; and the second injection In the step, the molten resin is filled into the space remaining in the chamber by the plunger.

According to the electronic component sealing method of the fourth aspect of the invention, the molten resin can be injected into the wider mold gap at a lower pressure until the molten resin covers the upper surface of the electronic component. Therefore, it does not get caught in the molten resin or air, and can prevent the occurrence of voids and weld lines, and can simultaneously prevent Damage to the bond wire.

Further, there is no need for a new drive mechanism that can generate a higher pressure to thinly spread the molten resin covering the upper surface of the aforementioned electronic component. Therefore, an electronic component sealing method which is free from resin leakage, has a simple mold structure, and has a low manufacturing cost can be obtained.

An electronic component sealing method according to a fifth aspect of the present invention is the electronic component sealing method using the electronic component sealing mold according to the first aspect of the present invention, comprising: the first injection step of moving the plunger to use After the molten resin covers at least the upper surface of the electronic component, it is stopped in a state of being movable up and down; and the pressing step is to press the lower surface of the upper mold cavity block to cover the upper surface of the electronic component. The resin is melted and simultaneously moved up and down; and in the second injection step, the molten resin is filled into the space remaining in the chamber by the plunger.

According to the electronic component sealing method of the fifth aspect of the invention, the molten resin can be injected into the wider mold gap at a lower pressure until the molten resin covers the upper surface of the electronic component. Therefore, the molten resin or the air is not caught, and the occurrence of voids and weld lines can be prevented, and the damage of the bonding wire can be prevented at the same time.

In addition, a new drive mechanism is not required to generate a higher pressure to spread the molten resin covering the upper surface of the aforementioned electronic component thinly. Therefore, the resin-free leakage can be obtained, the structure of the mold is simple, and the manufacturing cost is obtained. Lower electronic part sealing method.

In particular, compared with the height dimension of the electronic component sealed by the resin, even if the amount of movement of the upper mold cavity block is large, the resin pressure in the chamber can be adjusted by the vertical movement of the plunger. Therefore, the resin pressure in the aforementioned chamber does not exceed a certain pressure. As a result, it is possible to obtain a resin sealing effect without resin leakage and higher dimensional accuracy.

1‧‧‧Transformation molding machine

10‧‧‧ tied

11‧‧‧Fixed template

12‧‧‧Upper mold base

13‧‧‧Upper base plate

14‧‧‧Upper mold holding block

14a, 18a‧‧‧ protrusion

15‧‧‧ movable template

16‧‧‧ lower mold base

17‧‧‧Mold base plate

18‧‧‧Down mold holding block

19‧‧‧Transfer unit

2‧‧‧Electronic parts sealing mould

20‧‧‧上模棋座

21‧‧‧Upper support block

22‧‧‧Upper Chess Holder

22a, 58, 60, 64, 70‧‧‧through holes

23‧‧‧Upper mold chamber holding unit

23a‧‧‧Capture Department

24‧‧‧Upper stop block

25‧‧‧Links

26‧‧‧Upper mold back seat

27‧‧‧Upper cavity block

27a‧‧‧室

28‧‧‧Upper mold first spring parts

3‧‧‧Upper mold

30‧‧‧Upper formwork board

31‧‧‧Upper die plate

32‧‧‧Capture department for top selling

33‧‧‧ recess

34‧‧‧Upper bolt

35‧‧‧Top mold anti-shedding ring

36‧‧‧Upper mold 2 spring parts

4‧‧‧ Lower mold

40‧‧‧ Position adjustment gasket

50‧‧‧The lower chess seat

51‧‧‧Mold support block

52‧‧‧The lower die holder

53‧‧‧ Lower cavity block

55‧‧‧ Lower mold rear seat plate

56‧‧‧ Lower die plate

57‧‧‧Production for topping

59‧‧‧Mold stop block

61‧‧‧Down bolt

62‧‧‧Anti-falling ring

63‧‧‧ Lower mold spring parts

65‧‧‧Plunger

66‧‧‧ Kettle

71‧‧‧ Floating components

91‧‧‧Substrate

92‧‧‧Electronic components (semiconductor components)

93‧‧‧ flat resin

93a‧‧‧ molten resin

94‧‧‧Formed products

95‧‧‧Release film

S1~S9‧‧‧Steps

Fig. 1 is a schematic view of a transfer molding machine according to a first embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a state in which the electronic component sealing mold shown in Fig. 1 is opened.

Fig. 3 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 2;

4 is a flow chart showing a method of sealing an electronic component by the transfer molding machine according to the first embodiment of the present invention.

Fig. 5 is a cross-sectional view showing a state in which a flat plate resin and a substrate are placed in the electronic component sealing mold shown in Fig. 2;

Fig. 6 is a cross-sectional view showing the first closed mold state of the electronic component sealing mold shown in Fig. 5;

Fig. 7 is a cross-sectional view showing a state in which a molten resin is injected through a plunger in a chamber of the electronic component sealing mold shown in Fig. 6;

Fig. 8 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 7.

Fig. 9 is a cross-sectional view showing a state in which the operation of the plunger shown in Fig. 8 is stopped in the middle. Surface map.

Fig. 10 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 9.

Fig. 11 is a cross-sectional view showing the second closed state of the cavity block above the electronic component sealing mold shown in Fig. 9.

Fig. 12 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 11;

Fig. 13 is a cross-sectional view showing a state in which the plunger of the electronic component sealing mold shown in Fig. 9 is pushed up again to fill the molten resin into the chamber.

Figure 14 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Figure 13 .

Fig. 15 is a cross-sectional view showing a state in which the electronic component sealing mold shown in Fig. 14 is opened and the molded article is ejected.

Fig. 16 is a cross-sectional view showing a transfer molding machine according to a second embodiment of the present invention.

Fig. 17 is a cross-sectional view showing a transfer molding machine according to a third embodiment of the present invention.

Fig. 18 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 17;

Fig. 19 is a cross-sectional view showing a transfer molding machine in a fourth embodiment of the present invention.

Figure 20 is a cross-sectional view showing a transfer molding machine in a fifth embodiment of the present invention.

21 is a view for explaining filling of the electronic component sealing mold shown in FIG. A cross-sectional view of the steps.

Fig. 22 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Fig. 21;

Figure 23 is a cross-sectional view for explaining a filling step of the electronic component sealing mold shown in Figure 20 .

Figure 24 is a partially enlarged cross-sectional view showing the electronic component sealing mold shown in Figure 23 .

Form for implementing the invention

The transfer molding machine 1 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 14 .

(Configuration of Transfer Forming Machine 1)

The transfer molding machine 1 is an electronic component 92 (a semiconductor element, a capacitor, a resistor, an inductor, or the like) provided on the surface of the substrate 91, and is sealed with a resin by a flat plate resin 93 (see FIG. 5 and the like).

As shown in Fig. 1, the transfer molding machine 1 includes an electronic component sealing mold 2, a transfer unit 19, and a plunger 65 shown in Fig. 2 and the like. The electronic component sealing mold 2 has an upper mold 3 and a lower mold 4.

The upper mold 3 has an upper die holder 12 and an upper die holder 20. The upper die holder 20 is slidably assembled to the lower side of the upper die holder 12 with respect to the paper surface in the vertical direction. Therefore, the entire mold block 20 can be exchanged in response to the resin-sealed product. The upper die holder 20 is fixed to the upper die holder 12 by a fixture not shown.

The lower mold 4 has a lower die holder 16 and a lower die block 50. Die chess 50 is assembled to the lower die holder 16 on the upper side of the lower die holder 16 and slidably movable in the vertical direction with respect to the paper surface. Therefore, the entire mold block 50 can be exchanged in response to the resin-sealed product. The lower die block 50 is fixed to the lower die holder 16 by a fixture not shown.

The upper die holder 12 of the upper mold 3 is mounted on the lower surface of the fixed fixed platen 11 supported by the four tie bars 10. The lower die holder 16 of the lower mold 4 is mounted on the upper surface of the movable stationary die plate 15, and the movable stationary die plate 15 is supported to be movable up and down along the tie bar 10.

The transfer unit 19 includes a hydraulic device, a motor, and the like (not shown) for driving the movable fixed platen 15, the plunger 65, and the like. The hydraulic machine and the motor are each connected to a controller (not shown) and act in accordance with a program stored in the memory of the controller.

Next, the configuration of the upper mold 3 and the lower mold 4 of the electronic component sealing mold 1 will be described.

(Upper mold 3)

Upper mold base 12.

As shown in FIG. 2, the upper die holder 12 has an upper die base plate 13 fixed to a lower surface of the fixed die plate 11, and an upper die holding block 14 fixed to a lower surface of the upper die base plate 13. A projection portion 14a for position restriction is provided on the inner side surface of the upper mold holding block 14.

The upper chess house 20.

As shown in Fig. 2, the upper die block 20 is constituted by components different from the upper die base 12 (the upper die base plate 13 and the upper die holding block 14). The upper mold support block 21 of the upper mold holder 20 is disposed on the protrusion 14a and the lower portion of the upper mold holding block 14 The upper mold rear seat plate 26 is described between the upper and lower sides (the opening and closing direction of the mold). The upper die holding portion 22 having a substantially U-shaped cross section (or a U-shaped cross section) is fixed to the lower surface of the upper mold supporting block 21. The upper mold chamber holding portion 23 is fixed to the inner peripheral surface of the upper mold holder holding portion 22, and a plurality of upper mold stoppers 24 are fixed to the upper surface of the upper mold holding portion 22.

Thereby, the upper mold support block 21, the upper mold holder holding portion 22, the upper mold chamber holding portion 23, and the upper mold stopper 24 can be integrally moved up and down.

The upper die holder holding portion 22 is provided with a plurality of through holes 22a, and the connecting bars 25 are slidably inserted into the respective through holes 22a. An upper mold rear seat plate 26 is fixed to the upper end of the connecting rod 25, and an upper mold chamber block 27 is fixed to the lower end of the connecting rod 25. Therefore, the upper mold rear seat plate 26 and the upper mold cavity block 27 are integrated by the connecting rod 25, and are opposed to each other at a specific interval. Further, the connecting rod 25 is an example of the "connecting member" of the patent application.

An upper mold first spring member 28 is disposed between the upper mold rear seat plate 26 and the upper mold holder holding portion 22. The upper mold first spring member 28 imparts potential energy to the outer mold rear seat panel 26 and the upper mold holder holding portion 22, respectively.

The upper dieboard 20 also has an upper dieboard 30 and an upper dieboard 31. The upper die plate 30 and the upper die plate 31 are provided with pin holes, and the cull portion pin 32 is inserted into the pin hole from the upper die backup plate 30 side. Thereby, the upper die rest plate 30 and the upper die pin plate 31 are integrated up and down, and the pick-up portion top pin 32 can be prevented from coming off. Thereby, the upper die rest plate 30, the upper die pin plate 31, and the pick-up portion top pin 32 can be integrally moved up and down. Further, the picking portion can enter and exit the picking portion 23a of the upper mold cavity holding portion 23 by the top pin 32. As shown in Fig. 2, in the state where the forming mold is opened, the picking portion is sunk by the top pin 32 without protruding from the 撷. The inside of the portion 23a is taken.

A recess 33 is provided in the upper die plate 30 and the upper die plate 31, and the upper die bolt 34 is inserted into the recess 33. The upper mold second spring member 36 is housed in the recess 33. The lower end portion of the upper die bolt 34 is screwed to the upper surface of the upper die holding portion 22 to be integrated. Further, since the upper mold fall prevention ring 35 is engaged with the head portion of the upper mold bolt 34, it is possible to prevent the second spring member 36 of the upper mold stored in the concave portion 33 from coming off.

The upper mold backup plate 30 and the upper die plate 31 are provided with a plurality of through holes, and the connecting rods 25 penetrating through the through holes 22a of the upper die holding portion 22 are inserted into the through holes, and simultaneously inserted. There is an upper die stop 24 and an upper die first spring member 28. Further, the upper mold backup plate 30 and the upper die pin plate 31 are vertically movable between the upper mold rear seat plate 26 and the upper mold holding portion 22. The upper mold backup plate 30 and the upper die pin plate 31 are permeable to the upper mold bolt 34 and the upper mold second spring member 36, and are provided with potential energy toward the upper mold holder holding portion 22.

Further, in Fig. 2, a state in which the upper mold backup plate 30 and the upper die plate 31 are restricted by the upper limit fixed stopper and the lower limit variable stopper, which are not shown, are illustrated.

(lower mold 4)

Lower die holder 16.

As shown in FIG. 2, the lower die holder 16 has a lower die base plate 17 fixed to the upper surface of the movable stationary die plate 15, and a lower die holding block 18 fixed to the upper surface of the lower die base plate 17. A projection 18a for position restriction is provided on the inner side surface of the lower mold holding block 18.

Lower die chess 50.

As shown in Fig. 2, the lower die block 50 is constituted by components different from the lower die base 16 (the lower die base plate 17 and the lower die holding block 18). That is, the lower mold supporting block 51 of the lower mold holder 50 is disposed between the protruding portion 18a of the lower mold holding block 18 and the lower mold base plate 17, and the position is restricted to the up and down direction (the opening and closing direction of the mold). . On the upper surface of the lower mold supporting block 51, a mold holder holding portion 52 having a slightly U-shaped cross section (or a U-shaped cross section) is fixed. The lower mold cavity block 53 is fixed to the inner peripheral surface of the lower mold holder holding portion 52.

Further, although the lower mold supporting block 51, the lower mold holding portion 52, and the lower mold chamber block 53 are integrated, they do not move up and down.

The lower die block 50 has a lower die rear seat plate 55 and a lower die pin plate 56. A pin hole is provided in the lower die plate 56, and the molded product pin 57 is inserted into the pin hole from the side of the lower die rear seat plate 55. Thereby, the lower mold rear seat plate 55 and the lower mold pin plate 56 are integrated, and the molded article pin 57 can be prevented from coming off. The molded article is provided with a top pin 57 so as to be able to enter and exit from the upper surface of the lower mold cavity block 53.

A through hole 58 is provided in the lower mold rear seat plate 55 and the lower die pin plate 56, and the through hole 58 is inserted through the lower mold stopper 59. The lower mold stopper 59 is fixed to the upper surface of the lower mold base plate 17. Thereby, the lower mold rear seat plate 55, the lower mold pin plate 56, and the molded article top pin 57 can be integrally moved up and down.

The lower mold rear seat plate 55 and the lower mold pin plate 56 are provided with a through hole 60 having a T-shaped cross section, and the lower mold bolt 61 is inserted into the through hole 60. The shaft portion of the lower die bolt 61 is screwed to the lower surface of the lower die holding portion 52 to be integrated. Further, the head of the lower die bolt 61 is engaged with the lower die pin plate 56 through the fall-prevention ring 62. Further, as shown in Fig. 2, in the state in which the forming mold is opened, the molded article push-up needle 57 is sunk without being applied from the lower mold chamber block 53. The surface is prominent.

A lower mold spring 63 is disposed between the lower die holding portion 52 and the lower die plate 56. The lower die spring members 63 respectively impart potential energy to the lower die holder holding portion 52 and the lower die pin plate 56.

The lower die base plate 17, the lower die rear seat plate 55, the lower die pin plate 56, the lower die holder holding portion 52, and the lower mold cavity block 53 are provided through the through holes 64 along the same axis. . The kettle portion 66 is formed in the through hole 64, and the plunger 65 is housed in the kettle portion 66 so as to be movable back and forth.

(Operation of Transfer Forming Machine 1)

Next, the operation of the transfer molding machine 1 will be described.

The transfer molding machine 1 is operated in accordance with a program (electronic component sealing method) stored in the memory of the transfer unit 19. As shown in FIG. 4, the electronic component sealing method includes the following steps S1 to S9.

In step S1, as shown in FIG. 5, the substrate 91 on which the electronic component 92 is provided is disposed in the lower mold cavity block 53. In step S2, as shown in FIG. 5, the flat plate resin 93 is put into the kettle portion 66.

In step S3, as shown in FIG. 6, the drive transfer unit 19 raises the movable fixed platen 15 (FIG. 1) to bring the lower die block 50 into contact with the upper die block 20. At this time, the substrate 91 is only held between the upper mold chamber holding portion 23 and the lower mold chamber block 53 by the spring force of the upper mold first spring member 28 (the first closed mold state). Thereby, the chamber 27a is formed between the upper mold 3 and the lower mold 4. At this time, the upper mold cavity block 27 supported by the connecting rod 25 is not displaced from the original position.

In step S4, as shown in Fig. 7, the transfer unit 19 is driven to push up the plunger 65. Thereby, the plunger 65 pushes the plate resin with respect to the scooping portion 23a. 93, while heating, promotes heating of the flat plate resin 93. The pressed flat plate resin 93 starts to melt, and the molten flat plate resin (hereinafter referred to as molten resin) 93a is injected into the scooping portion 23a (FIG. 7, FIG. 8) and injected into the chamber 27a.

In steps S3, S4, the upper mold cavity block 27 supported by the connecting rod 25 is not displaced from the original position, so that the upper surface of the electronic component 92 and the lower surface of the upper mold cavity block 27 can be The chamber gap becomes larger. Therefore, the molten resin 93a does not stay, and smoothly covers the surface of the electronic component 92.

In step S5, the plunger 65 is stopped at a specific position before the filling of the molten resin 93a is completed (Fig. 9, Fig. 10). The pressing amount of the plunger 65 at this time is preferably 75% or more and 85% or less of the total stroke. By setting the pressing amount to 75% or more of the total stroke, a sufficient molten resin 93a can be supplied into the inside of the film chamber 27a, thereby sufficiently covering the upper surface of the electronic component 92, and the second plunger 65 can be suppressed. The voids, weld lines, etc. generated by the filling operation. Further, by setting the pressing amount to 85% or less of the total stroke, when the upper mold cavity block 27 is pressed down, the pressure acting on the molten resin injected into the chamber 27a can be suppressed from becoming large, and compression molding can be prevented. .

In step S6, as shown in FIG. 11, the movable fixed platen 15 is raised again to become the second closed mode state. In the second closed mode state, the lower die base plate 17 is pushed up by the lower mold base 16, and the lower mold block block 53 passes through the substrate 91 and pushes up the upper mold cavity 20 The upper holding portion 23 compresses the upper mold first spring member 28. Therefore, the upper surface of the electronic component 92 is close to the lower surface of the upper mold cavity block 27. As a result, the molten resin 93a covering the upper surface of the electronic component 92 is crushed and thinned by the lower surface of the upper mold cavity block 27. this At this time, the molten resin 93a is not completely filled in the chamber 27a.

According to the first embodiment, the substrate 91 is held by the spring force of the first spring member 28 of the upper mold between the first mold closing state in the step S3 and the second mold closing state in the step S6. The resin pressure in the chamber 27a is not greater than a specific pressure. Therefore, it is possible to prevent the molten resin 93a from leaking from the joint surface of the upper mold 3 and the lower mold 4.

In step S7, as shown in Fig. 13, the plunger 65 is again raised, and the molten resin 93a remaining in the kettle portion 66 is pushed out from the scooping portion 23a into the chamber 27a. In step S8, after the molten resin 93a is completely filled into the chamber 27a (FIG. 14), the molten resin 93a is hardened by holding and holding at a specific pressure for a specific time.

In step S9, the movable platen 15 is lowered, and the lower die block 50 is moved away from the upper die block 20. Thereby, the lower limit variable stopper shown in the figure is released. Therefore, the upper mold top bar is not shown, and the upper mold backup plate 30 and the upper mold pin plate 31 are pressed downward toward the lower side. As a result, the scooping portion ejects the molded product by the top pin 32, and the molded product 94 is separated from the upper mold cavity block 27 (FIG. 15). At the same time, the lower ejector pin 55 pushes the lower die rear seat plate 55 and the lower die pin plate 56 upward as shown. Therefore, the molded article push-out of the molded article 94 by the top pin 57, and the molded article 94 is separated from the lower mold cavity block 53.

Thereafter, the resin sealing operation can be continuously performed by repeating the same operation.

(Other embodiments)

Next, a transfer molding machine according to another embodiment of the present invention will be described.

In the transfer molding machine 1 of the second embodiment, as shown in Fig. 16, before the movable fixed die plate 15 is raised to bring the lower die block 50 into contact with the upper die pad 20 (Fig. 6), A release film 95 is disposed between the cavity block 27 and the lower die cavity block 53. In the release film 95, a release material such as silicone is applied to the film. The other configuration of the second embodiment is the same as that of the first embodiment. Therefore, the same reference numerals as in Figs. 1 to 15 are used in Fig. 16, and the description thereof is omitted.

According to the second embodiment, by using the release film 95, it is possible to effectively prevent the resin from leaking out, and it is advantageous in that the molded article 94 is more easily released from the upper mold cavity block 27.

In the transfer molding machine 1 of the third embodiment, as shown in Figs. 17 and 18, a position adjusting spacer 40 is disposed between the lower end surface of the connecting rod 25 and the upper mold chamber block 27. The position adjusting spacer 40 is provided to be slidable in the vertical direction with respect to the paper surface, and can be exchanged in response to the electronic component 92. The other configuration of the third embodiment is the same as that of the first embodiment. Therefore, the same reference numerals as in Figs. 1 to 15 are used in Figs. 17 and 18, and the description thereof is omitted.

According to the third embodiment, even if the thickness dimension of the electronic component 92 or the thickness dimension of the resin portion is different, the position of the upper mold cavity block 27 can be adjusted by exchanging the position adjusting pad 40. Therefore, it is not necessary to exchange the entire upper mold cavity block 27. As a result, there is an advantage that the transfer molding machine 1 having versatility can be obtained.

In the transfer molding machine 1 of the fourth embodiment, as shown in FIG. 19, the lower die holder holding portion 52 is provided with a through hole 70, and the floating member 71 is disposed to be movable back and forth along the axial direction (vertical direction). Through the hole 70. float The member 71 is driven by a hydraulic machine, a spring member, a cotter, etc., which are not shown. The other configuration of the fourth embodiment is the same as that of the first embodiment. Therefore, in FIG. 19, the same reference numerals as those in FIGS. 1 to 15 are used, and the description thereof is omitted.

According to the fourth embodiment, the position of the lower mold cavity block 53 can be adjusted by moving the floating member 71 back and forth in the axial direction. Further, according to the fourth embodiment, the lower mold chamber block 53 can be moved up and down by moving the floating member 71 up and down. Therefore, even if the thickness of the substrate 91 does not match, the error can be absorbed and formed, and a transfer molding machine excellent in yield can be obtained. Further, according to the fourth embodiment, even when the substrate 91 having different thicknesses is resin-sealed, the floating member 71 can be moved up and down to perform resin sealing. Therefore, there is an advantage of the transfer molding machine 1 which is versatile.

In the transfer molding machine 1 of the fifth embodiment, as shown in Figs. 20 to 24, the height dimension of the electronic component 92 provided on the surface of the substrate 91 is small, and the thickness of the surface of the substrate 91 to the surface of the resin after molding is small. Also small. For example, the height dimension of the electronic component 92 is 0.1 mm, the height of the surface of the substrate 91 to the surface of the formed resin portion is 0.2 mm, and the moving distance of the upper mold cavity block 27 is 0.5 mm.

Therefore, as shown in FIG. 20, the substrate 91 is held by the upper mold chamber holding portion 23 and the lower mold chamber block 53 only by the spring force of the upper mold first spring member 28, and is in the first closed state. Thereby, the chamber 27a is formed on the lower surface of the upper mold chamber block 27.

Next, as shown in FIG. 21, after the plunger 65 is pushed up, the plunger 65 pushes the plate resin 93 to the scooping portion 23a, thereby performing pressurization and simultaneously promoting heating. Therefore, as shown in FIG. 21, the flat plate resin 93 starts to melt, and the molten resin 93a is injected into the scooping portion 23a, and then injected into the chamber 27a. At this time, the chamber gap between the upper surface of the electronic component 92 and the lower surface of the upper mold cavity block 27 is large. Therefore, the molten resin 93a does not stay and smoothly covers the surface of the electronic component 92.

Then, the plunger 65 is stopped at a specific position before the end of filling. However, the pressing amount of the plunger 65 at this time is a pressing amount that can reliably cover the surface of the electronic component 92 with the molten resin 93a, but is not the pressing of completely filling the molten resin 93a in the chamber 27a. the amount. Therefore, since the inside of the chamber 27a does not exceed a specific resin pressure or more, the molten resin 93a does not leak from the joint surface of the upper mold 3 and the lower mold 4.

Further, as shown in Fig. 22, the movable fixed platen 15 (Fig. 1) is raised again. Thereby, the lower die base plate 17 of the lower die holder 16 is pushed up, and the lower mold cavity block 53 of the lower die block 50 is pushed up through the substrate 91 to push up the upper mold cavity holding portion 23 of the die block 20, The first spring member 28 of the upper mold is compressed. Therefore, the upper surface of the electronic component 92 is close to the lower surface of the upper mold cavity block 27 (Fig. 23). As a result, the molten resin 93a covering the upper surface of the electronic component 92 is shrunk and thinned by the lower surface of the upper mold cavity block 27, and at the same time, it is in the second closed state. At this time, although the molten resin 93a is dispersed in the chamber 27a, the plunger 65 is also lowered. Therefore, the resin pressure in the chamber 27a is not greater than a specific pressure, and the molten resin 93a does not leak from the joint surface of the upper mold 3 and the lower mold 4.

Then, by causing the plunger 65 to rise again, the molten resin 93a remaining in the kettle portion 66 is pressed out of the chamber 27a from the scooping portion 23a. Then, after the molten resin 93a is completely filled in the aforementioned chamber 27a, at a specific time The pressure and the specific pressure are maintained, and the molten resin 93a is hardened.

According to the fifth embodiment, the inside of the chamber 27a is adjusted to a specific pressure by moving the plunger 65 up and down before the second mold closing state. Therefore, even if the upper mold cavity block 27 is pressed more deeply, compression molding is not caused, and thus there is an advantage that a resin seal having high dimensional accuracy can be performed.

The present invention is not limited by the embodiments, and various modifications and changes in design may be made without departing from the spirit and scope of the invention. Further, any of the embodiments can be realized by freely combining the features described in the respective embodiments.

Claims (4)

A transfer molding machine comprising: an electronic component sealing mold for sealing an electronic component, and a plunger for injecting a molten resin covering a surface of the electronic component to form the electronic component In the chamber of the part sealing mold, the transfer molding machine is characterized in that the electronic component sealing mold includes: a lower mold chamber block for mounting a substrate on which an electronic component is disposed; an upper mold chamber holding portion, and the foregoing The lower mold cavity block holds the substrate; the upper die holder holding portion moves up and down in conjunction with the upper and lower mold holding portions to move up and down, and has a through hole; the upper mold rear seat plate is disposed on the upper mold Above the seat holding portion; the upper mold spring member is extended and contracted in conjunction with the upper and lower mold holding portions, and the upper mold cavity block is vertically movable in the upper mold chamber holding portion, and is Forming the chamber between the lower mold chamber blocks; and connecting the rods, inserting into the through holes of the upper mold holder holding portion, and joining the upper mold chamber block and the foregoing Die rear seat, provided the vessel portion of the plunger can be inserted in the lower die cavity block, the transfer molding machine is attached to execution of the first step of the second injection, the pressing In the step of the second injection step, the first injection step is to raise the plunger to a position where the molten resin injected into one of the chambers covers the upper surface of the electronic component, and the pressing step The lower mold cavity block is raised in a state in which the plunger is moved up and down to restrict the molten resin from being scattered by the lower surface of the upper mold cavity block, and the second injection step is to cause the plunger Ascending, the molten resin is filled into the space remaining in the chamber. The transfer molding machine of claim 1, wherein the upper mold chamber holding portion is provided with a picking portion for connecting the kettle portion and the chamber, between the upper mold chamber block and the upper mold rear seat plate, A top pin that protrudes into the aforementioned picking portion to assist in demolding is provided. A transfer molding machine according to claim 1 or 2, wherein a floating member below the lower mold cavity block is disposed to support the lower mold cavity lower mold cavity holding portion from the lower side. A method for manufacturing an electronic component is a method for manufacturing an electronic component by using an electronic component sealing mold, the electronic component sealing die having: a lower mold cavity block for mounting a substrate on which an electronic component is disposed; and an upper mold cavity holding And holding the substrate with the lower mold cavity block; the upper die holder holding portion moves up and down in conjunction with the upper and lower mold holding portions to move up and down, and has a through hole; The upper mold rear seat plate is disposed above the upper mold holder holding portion; the upper mold spring member is extended and contracted in conjunction with the upper mold holder holding portion to move up and down; the upper mold chamber block is in the upper mold cavity Positioning in the chamber holding portion is movable up and down, and a cavity is formed between the lower mold cavity block; and a connecting rod is inserted into the through hole of the upper die holder holding portion, and the upper mold cavity block is coupled And the upper mold rear seat plate, wherein the lower mold cavity block is provided with a plug portion into which a plunger is inserted, the plunger is for injecting molten resin covering the surface of the electronic component in the chamber, and the electronic component is manufactured as described above. The method includes: a first injection step of raising the plunger to a position where the molten resin injected into a portion of the chamber covers a surface of the electronic component; and the pressing step limits the column The lower mold cavity block is raised in a state in which the plug moves up and down to spread the molten resin by the lower surface of the upper mold cavity block; and the second injection step is to raise the plunger The molten resin is filled into the space remaining in the chamber.