JP2003053791A - Semiconductor manufacturing apparatus and semiconductor device manufactured thereby - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus equipped with an efficient resin sealing mold assembly capable of using a mold in common even if the thickness of the mold or the thickness of a lead frame is different. SOLUTION: A movable member is moved to a fixed member corresponding to the mold thickness of a package by a cavity depth adjusting mechanism 8 to regulate the depth of a cavity. The movable member 12 is moved to the fixed member 10 corresponding to the thickness of the lead frame to be loaded by a substrate thickness adjusting mechanism 6 to regulate the position of the loading surface of the lead frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor device manufactured by this apparatus, and more particularly to a unit structure of a semiconductor manufacturing apparatus, a transport system and a semiconductor resin sealing mold apparatus.

[0002]

2. Description of the Related Art FIG. 14 shows a conventional semiconductor resin-sealed mold device, which comprises a lower mold 100 and an upper mold 102 which is attached to the lower mold 100 so as to be vertically movable. . The lower mold 100 has a frame mounting surface 100a, and a cavity 102a having a predetermined shape is formed on the lower surface of the upper mold 102 facing the lower mold 100.

In the conventional semiconductor resin-sealed mold device having the above structure, the lead frame 104 connected to the semiconductor element via the bonding wire is mounted on the frame mounting surface 100a of the lower mold 100, and then the upper mold is formed. 102 is closely attached to the lower mold 100, and the runner 10 is placed in the cavity 102a.
Resin sealing is performed by press-fitting the sealing resin from 4.

Incidentally, FIG. 14 shows a pair of lead frames 1.
In contrast to 04, one mold resin is used to simultaneously seal four pairs of lead frames 104 with resin.

FIGS. 15 to 17 show a plane unit structure of a semiconductor manufacturing apparatus in which a plurality of press units can be added. FIG. 15 shows one material supply / product discharge unit 112, a transport unit 114 and a press. 16 shows a configuration in which one unit 116 is installed in parallel, and FIG. 16 shows a configuration in which a combination of the transport rail unit 118 and the press unit 116 is installed in parallel in FIG.
7 is the structure of FIG. 16 and further two sets of carrier rail units 1
18 and the combination of the press unit 116 are shown in parallel.

In the configurations shown in FIGS. 15 to 17,
As shown in FIG. 18, a plurality of lead frames 124 are vertically mounted on a frame supply magazine 122 provided in the material supply / product discharge unit 112.
Each lead frame 124 is connected to a plurality of endless belts 12.
A so-called free-flow conveyance, which conveys to a predetermined position using six or a plurality of pulleys 128, is generally adopted.

On the other hand, when the upper mold is opened after molding,
As shown in FIG. 19, the molded IC package 108 and the cull 110 placed on the lower die 100 are pressed and sucked by a plurality of suction pads 132, and are carried out.

FIGS. 20 and 21 are schematic perspective views of the plane unit configuration shown in FIGS. 15 and 17, and as shown in the same figure, in the conventional configuration, resin injection, maintenance and money are not necessary. Mold exchange through one side, frame loading and product ejection through adjacent sides,
The waste material is discharged through the next adjacent side surface. That is, since the human access and the utility connection surface are provided on three adjacent side surfaces, the remaining 1
Multiple press units are added using the side surface.

[0009]

In the configuration shown in FIG. 14 among those described in the prior art, the IC package 1
If the mold planar shape of 08 is the same and the mold thickness is different, or if the frame 104 has the same planar external shape but the thickness is different, the mold dies cannot be shared and a new mold investment is required. .

Japanese Unexamined Patent Publication (Kokai) No. 4-348536 discloses a resin mold die which can be shared even if the resin sealing height of electronic parts varies depending on the product type.
The cavity depth is changed by adjusting the position of the knockout pin, which also serves as the cavity bottom, by replacing the spacers with different dimensions, which not only complicates the mold structure but also the lead frame thickness. No case is disclosed.

On the other hand, in Japanese Patent Laid-Open No. 8-57906,
Although a molding die in which a lead frame is mounted after changing the cavity size is disclosed, a technique for resin-sealing a lead frame having a different thickness is not mentioned.

Further, in the semiconductor manufacturing apparatus shown in FIGS. 15 to 17, in which a plurality of press units 116 can be added, the processing capacity of the material supply / product unloading unit 112 is the maximum number of press units that can be added ( For example, 4
It is prepared according to the production capacity of each unit, and if it is less than the maximum number, the utilization efficiency was poor in terms of the occupied space of the device and the device cost.

On the other hand, a molding method in which a plurality of upper and lower molds are used and the units are divided / independent for each function required for resin sealing and the work of each unit is performed in parallel has already been carried out. (See, for example, Japanese Patent Application Laid-Open No. 11-309751 or Japanese Patent Application Laid-Open No. 8-224753), the matching of the processing capacity of the material supply / product unloading unit and the production capacity of the press unit to improve the utilization efficiency of the apparatus The examination of technology was not enough.

Further, in the free flow transfer of the materials and jigs and tools of the semiconductor manufacturing apparatus shown in FIG. 18, the transfer target interferes with the joints of the endless belt 126 and the pulley 128 and the joints of the guide rails 130, and the convey is carried out. There were things I couldn't do. Also, in the transport system of the semiconductor manufacturing equipment,
Since there were many free-flow conveyances to the conveyance target position, the cost was high.

On the other hand, as shown in FIG. 19, in the pressure suction conveyance using a plurality of suction pads 132, since the package surface after molding is pressure-sucked, especially in a thin wafer or a thin package, a chip or a package is formed. There was damage such as cracks (for example, Japanese Patent Laid-Open No.
0-4105).

Further, since the cull 110 after molding is pressed and adsorbed, the cull 110 and the runner 106 are separated by the pressing force, the separated runner 106 is scattered in the apparatus, and the gate part is originally pressed by the pressing force of the package 108. There was a case where the gate remained (outer shape defect) due to the separation from the parts other than the separation part. Further, a material carrying-in unit onto the mold, a frame 104 after molding, and a cull 1
It was necessary to separately prepare 10 carry-out units, which was expensive.

Also, as shown in FIGS. 20 and 21, since there are human access and utility connection surfaces on the surfaces other than the two opposite side surfaces, it is not possible to install adjacently except for one side surface. The usage efficiency of the installation floor surface was poor.

The present invention has been made in view of the above problems of the prior art, and is an efficient resin that can be used as a molding die even if the molding thickness and the lead frame thickness are different. An object of the present invention is to provide a semiconductor manufacturing apparatus equipped with a sealing die device.

Another object of the present invention is to maximize the use efficiency of the installation surface by adjusting the number of connected material supply / product discharge units according to the number of connected press units and the production capacity. An object of the present invention is to provide a semiconductor manufacturing apparatus capable of performing the same.

Still another object of the present invention is to provide a semiconductor having a highly reliable and inexpensive carrier system capable of smoothly carrying the lead frame and the package without damage even when the lead frame is warped. It is to provide a manufacturing apparatus.

Another object of the present invention is to provide a highly reliable and inexpensive semiconductor device.

[0022]

In order to achieve the above object, the invention according to claim 1 of the present invention is a semiconductor resin encapsulation in which a cavity is formed in at least one of a lower mold and an upper mold. A semiconductor manufacturing apparatus provided with a stopper mold device,
The distance between the contact surface between the lower mold and the upper mold and the bottom surface of the cavity is variable.

In the invention according to claim 2, a fixed member, a movable member slidably attached to the fixed member, and a cavity depth for sliding the movable member are attached to the upper mold. An adjusting mechanism is provided, and the depth of the cavity is adjusted by moving the movable member with respect to the fixed member by the cavity depth adjusting mechanism according to the mold thickness of the package.

Further, in the invention described in claim 3, after the molding, the movable member is moved toward the contact / separation surface between the lower mold and the upper mold by the cavity depth adjusting mechanism, and the package is manufactured. It is characterized in that the mold is released.

In the invention according to claim 4, the depth of the cavity is adjusted by attaching a spacer to at least one of the lower mold and the upper mold according to the mold thickness of the package. It is characterized by having done.

Further, the invention according to claim 5 is characterized in that the die cutting angle on the side surface of the mold of the package is set to approximately 0 degree.

Further, the invention according to claim 6 is a semiconductor manufacturing apparatus including a semiconductor resin-sealed mold device in which a cavity is formed in at least one of a lower mold and an upper mold. It is characterized in that the distance between the contact / separation surface between the die and the upper die and the lead frame mounting surface is variable.

In the invention according to claim 7, a fixing member, a movable member having the lead frame mounting surface slidably attached to the fixing member, and the movable member are attached to the lower mold. Is provided with a base material thickness adjusting mechanism, and the base material thickness adjusting mechanism moves the movable member with respect to the fixed member in accordance with the thickness of the lead frame to be mounted. The feature is that the position is adjusted.

Further, the invention according to claim 8 supplies a lead frame for resin encapsulation, conveys the lead frame and the package, and a material supply / product discharge unit for discharging the package after molding. And a press unit having a lower mold and an upper mold for resin-sealing the lead frame, and the number of connections of the material supply / product discharge unit is variable. .

The invention according to claim 9 is characterized in that the number of connected material supply / product discharge units is adjusted according to the number of connected press units.

The invention according to claim 10 is characterized in that the access and utility connection surfaces are provided only on two opposing side surfaces.

Further, in the invention described in claim 11, chucking means is provided in the carrying unit, and the chucking means holds both side surfaces of the lead frame before molding or both side surfaces of the package after molding. It is characterized by having done.

According to a twelfth aspect of the present invention, the conveying unit is provided with a chucking means, and the cull after molding is gripped by the chucking means to supply the material.
It is characterized in that it is conveyed to the product discharge unit.

According to a thirteenth aspect of the present invention, the transfer of the lead frame before molding to the lower mold of the press unit and the transfer of the package after molding and cull from the press unit are performed by the same transfer unit. It is characterized in that it is done.

In the fourteenth aspect of the present invention, the transport unit directly receives the lead frame placed on the material supply / product discharge unit and transports it to the lower die of the press unit. It is characterized by

Japanese Patent Laid-Open No. 7-290488 discloses an auto-molding mechanism in which the lead frames are fed from the frame supply magazine one by one, but the lead frames directly received by the carrying unit are pressed into the press unit. It is disclosed that the configuration is such that it is carried to the lower mold of the mold, and that the lead frame before molding is carried to the lower mold and the package after molding is carried out from the press unit by the same carrying unit. Not not.

The invention as set forth in claim 15 is characterized in that the molded package is held by the carrying unit and carried out from the press unit, and the cull is separated from the package while being held. .

Incidentally, Japanese Patent Laid-Open No. 8-222593 discloses a technique for removing cull from a package by pushing up a punch after molding, but it is a technique completely different from the invention described in claim 15. .

According to the sixteenth aspect of the present invention, after the cull is separated from the package, the package is directly loaded from the transport unit into a product unloading magazine provided in the material supply / product discharge unit. Is characterized by.

The invention according to claim 17 is a semiconductor device manufactured by the semiconductor manufacturing apparatus according to any one of claims 1 to 16.

[0041]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. FIG. 1 shows a semiconductor resin-sealed mold device according to the present invention.
And an upper mold 4 attached to the lower mold 2 so as to be vertically movable. The lower mold 2 is provided with a base material thickness adjusting mechanism 6, and the upper mold 4 is provided with a cavity depth adjusting mechanism 8.

As shown in FIG. 2, the lower mold 2 has a plurality of fixed members 10 arranged at predetermined intervals and a movable member 12 slidably provided between the fixed members. The fixed member 10 holds a direct drive motor 14 electrically connected to a drive source (not shown) via a motor support 16. The direct drive motor 14 has a ball screw 18
Is rotatably attached, and the ball screw 18 is
A ball screw nut 22 held by the movable member 12 via a bracket 20 is screwed. As described above, the base material thickness adjusting mechanism 6 includes the movable member 12, the direct drive motor 14, the ball screw 18, the ball screw nut 22, and the like.

On the other hand, as shown in FIG. 3, the upper mold 4 has a fixed member 24 and a plurality of movable members 26 arranged on the fixed member 24 at predetermined intervals. It is held integrally with the movable member support 28, and a ball screw nut 30 is attached to the movable member support 28. Further, the motor support 3 is attached to the fixing member 24.
The direct coupling drive motor 34 is held via the ball screw 2, and the ball screw 36 rotatably attached to the direct coupling drive motor 34 is screwed into the ball screw nut 30. As described above, the cavity depth adjusting mechanism 8 includes the movable member 2
6, a direct drive motor 34, a ball screw 36, a ball screw nut 30 and the like.

In the semiconductor resin-sealed mold device of the present invention having the above-mentioned structure, the lead frame connected to the semiconductor element via the bonding wire is placed on the movable member 12 of the lower mold 2 and After the mold 4 is brought into close contact with the lower mold 2, resin is sealed by press-fitting a sealing resin into the cavity 38 from the gate. Further, after the resin sealing, the movable member 26 of the upper mold 4 is moved downward via the direct coupling drive motor 34, so that the package is released.

Here, the die cutting angle on the side surface of the mold of the package is set to approximately 0 degree, and the package is smoothly released from the mold.

In the above structure, the position of the movable member 12 (the distance between the contact / separation surface between the lower mold 2 and the upper mold 4 and the lead frame mounting surface) is directly connected to the drive motor 1 from the drive source.
4 and the position of the movable member 26 (the distance between the contact surface between the lower die 2 and the upper die 4 and the bottom surface of the cavity) can be adjusted by driving the direct drive motor. Since it can be adjusted by driving 34, even if the thickness of the lead frame mounted on the movable member 12 changes or the depth of the cavity 38 (mold thickness of the package) changes, it is possible to respond appropriately. be able to.

Further, the depth of the cavity 38 can be changed by using an upper mold 4A as shown in FIG. 4 instead of using the upper mold 4 of FIG.

More specifically, the upper mold 4A shown in FIG. 4 is not provided with a cavity depth adjusting mechanism, but is provided with a square hole 40a having the same outer shape (contour) as the cavity 38. The spacer 40 can be attached to the lower surface of the upper mold 4A. Therefore, according to the desired cavity depth, the spacer 4 having a predetermined thickness is formed on the upper mold 4A having the plurality of cavities 38 formed therein.
By attaching 0, various cavity depths can be accommodated.

However, in this structure, it is necessary to provide the ejecting pin on the upper mold 4A, and the package is released by lowering the ejecting pin after resin sealing.

Embodiment 2. 5 to 7 show a planar unit configuration of a semiconductor manufacturing apparatus in which a plurality of press units can be added. FIG. 5 shows one material supply / product discharge unit 42, a transport unit 44 and a press unit 4.
6 shows a configuration in which one unit 6 is arranged in parallel, and FIG. 6 shows a configuration in which a combination of the material supply / product discharge unit 42, the transport rail unit 48, and the press unit 46 is arranged in parallel in FIG. 2 in addition to the configuration of FIG.
The configurations in which a combination of the material supply / product discharge unit 42, the transport rail unit 48, and the press unit 46 are arranged in parallel are shown.

As described above, in the plane unit structure according to the present invention, the number of material supply / product discharge units can be changed according to the number of connected press units 46 and the production capacity. The number of discharge units can be selected.

The configuration of FIG. 7 will be described in more detail with reference to FIGS. 8 to 10. As shown in FIG. 8, the material supply / product transport unit 42 includes a frame supply magazine 50 and a product discharge magazine 52, and a mold resin supply unit 53 is provided above the frame supply magazine 50.

Further, as shown in FIG.
The product feeding unit 42 includes a frame supply magazine 50.
A self-propelled shuttle transport unit 55 for transporting the lead frame 54 placed on the substrate to a predetermined position, and a foldable break plate for separating cull (resin waste material) from the lead frame 54 after resin sealing. And 56 are provided. The self-propelled shuttle transport unit 55 includes two frame holding parts 55a for holding one lead frame 54, respectively, and a plurality of first chucking means 55b provided between the two frame holding parts 55a. Each frame holding portion 55a is provided with a second chucking means 55c.

Further, the material supply / product transport unit 42
A plurality of sets (for example, four sets) of press units 46 are arranged in a row at a position separated from one side surface of the press unit 46 by a predetermined distance, and between the material supply / product transport unit 42 and the press unit 46. A transport unit 44 and a transport rail unit 48 are provided.

As shown in FIG. 10, the transport unit 4
The reference numeral 4 includes a substantially rectangular housing 57, and a plurality of pinions 58 are rotatably attached to both sides of the housing 57 and a plurality of cam followers 60 are provided upright.

On the other hand, the transport rail unit 48 is provided with a substantially rectangular casing 62, and a part of a timing belt 66 driven by a servomotor 64 is attached to one side surface of the casing 62 by a holding plate 68. . An LM (linear motion) guide 70 for transporting the housing 62 is provided on the side surface of the housing 62 to which the timing belt 66 is attached and the side surface opposite to the side surface. further,
A pair of cam grooves 72 extending in a direction orthogonal to the LM guide 70 are attached to the lower surface of the housing 62 so as to be separated from each other by a predetermined distance, and inside each of the cam grooves 72, a pinion 58 of the transport unit is fitted. A rack 74 is attached.

In the semiconductor manufacturing apparatus M having the above-mentioned structure, the plurality of lead frames 54 connected to the semiconductor element (not shown) via the bonding wires include the frame supply magazine 5 provided in the material supply / product discharge unit 42.
First, they are placed at regular intervals in the vertical direction of 0. Next, the shuttle transport unit 55 is moved to and placed on a rotating mechanism (not shown) provided in front of the frame supply magazine 50, and one frame holding portion 55a is positioned with respect to the frame supply magazine 50 to set the frame. Supply magazine 50
One of the lead frames 54 placed on is transferred to the second chucking means 55c of the frame holding portion 55a by the slidable push plate 51.

Thereafter, the rotation mechanism is rotated by 180 ° and the frame supply magazine 50 is moved up and down to move the second chucking means 55c of the other frame holding portion 55a.
Another lead frame 54 is transferred to. Further, the plurality of cylindrical mold resins 76 placed on the feeder 53a of the mold resin supply unit 53 are clamped one by one to the clamp 53.
It is gripped by b and is sequentially transferred to the plurality of first chucking means 55b provided in the shuttle transport unit 55.

Next, the second of the two frame holding portions 55a
The shuttle transport unit 55 having the lead frame 54 whose both sides are gripped by the chucking means 55c and the mold resin 76 gripped by the plurality of first chucking means 55b is caused to travel to a position below the transport unit 44 to transport the transport unit 44. The shuttle transport unit 55 is gripped by a chucking means (not shown) provided in the. At this time, the cam follower 60 of the transport unit 44 is fitted into the corresponding cam groove 72 of the transport rail unit 48, and the pinion 58 of the transport unit 44 is meshed with the corresponding rack 74 of the transport rail unit 48, so that the shuttle transport is performed. With the unit 55 held downward, the pinion 58 is driven to move toward the first press unit 46.

As shown in FIG. 10, racks 78 that mesh with the pinions 58 of the transport unit 44 are provided at predetermined intervals in each of the press units 46, and moved toward the first press unit 46. Transport unit 4
4, the pinion 58 now meshes with the rack 78 of the first press unit 46,
6 is conveyed to a predetermined position of the lower mold. Next, the shuttle transport unit 55 held below the transport unit 44.
Is the mold resin 7 formed by the first chucking means 55b.
The chucking 6 and the chucking of the lead frame 54 by the second chucking means 55c are released, and the plurality of mold resins 76 and the two lead frames 54 are arranged at predetermined positions of the lower mold.

The shuttle transport unit 55, which has released the mold resin 76 and the lead frame 54, is
6 and the lead frame 54 are conveyed by the conveying unit 44 in the opposite direction along the same path as when supplying the first press unit 46, and move toward the frame supply magazine 50.

Similarly, the shuttle transport unit 55 receives the two lead frames 54 and the plurality of cylindrical mold resins 76 from the material supply / product discharge unit 42, and chucks the transport unit 44 held by the transport rail unit 48. It is gripped by the king means.

Next, the casing 62 of the transport rail unit 48.
Is driven by the servo motor 64 and moves to the second press unit 46 along the LM guide 70. Further, the pinion 58 of the transport unit 44 is driven to sequentially mesh with the rack 74 of the transport rail unit 48 to the rack 78 of the second press unit 46. Mold resin 7
6 and two lead frames 54 are arranged at predetermined positions of the lower mold of the second press unit 46.

Thereafter, similar to the second press unit 46, the plurality of mold resins 76 and the two lead frames 54 are conveyed to the third and fourth press units 46.

The mold resin 76 conveyed to each of the first to fourth press units 46 is melted by moving the upper mold toward the lower mold and applying pressure, and the melted resin is the runner and gate. Is injected into the plurality of cavities via the. As a result, the lead frame 54 arranged in each cavity is sealed with the molding resin 76 together with the semiconductor element and the bonding wire.

When the upper mold is opened after the resin sealing, the shuttle transfer unit 55 held by the transfer unit 44.
Are arranged on a plurality of packages (semiconductor devices) as products, and as shown in FIG. 11, both side surfaces of the package are held by the second chucking means 55c, and the cull ( Material supply / product discharge unit 4 while gripping resin waste material)
It is conveyed to a position above the break plate 56 provided on the No. 2.

Next, when the break plate 56 rises and is placed on the break plate 56 while the package is held by the second chucking means 55c, as shown in FIG. 56 is folded around the center line to separate the cull, runner, and gate from the package. One of the separated packages is first inserted into the product discharge magazine 52 and then rotated by 180 °.
Be thrown into.

As shown in FIG. 13, the semiconductor manufacturing apparatus having the above-described structure has no human access and utility connection surfaces on the two opposing side surfaces, and only the other two opposing side surfaces are directly charged. It is possible to install each unit next to each other because the access and utility connection surface for people such as the discharge of products and waste materials, maintenance, and mold replacement are provided.

The operation of the semiconductor manufacturing apparatus provided with four sets of press units 46 has been described above. The timing belt 6 of the transport rail unit 48 has been described above.
By appropriately selecting the length of 6 and the length of the LM guide 70, a plurality of press units 46 can be supported.

However, when the press unit 46 is one set, as shown in FIG. 5, it is not necessary to provide the transport rail unit 48, and the cam groove 72 and the rack 74 are provided at predetermined positions, and the transport unit 44 is made of material. It may be moved between the supply / product discharge unit 42 and the press unit 46.

[0071]

Since the present invention is constructed as described above, it has the following effects. According to the first aspect of the present invention, the distance between the contact / separation surface between the lower mold and the upper mold and the bottom surface of the cavity is variable, so that the mold thickness is different. Since the molding die can be shared, an efficient resin-sealed die device and thus an efficient semiconductor manufacturing device can be provided.

According to the second aspect of the invention, the cavity depth is adjusted by moving the movable member with respect to the fixed member by the cavity depth adjusting mechanism according to the mold thickness of the package. Therefore, it is possible to quickly respond even if the mold thickness is different.

Further, according to the invention described in claim 3,
After molding, the cavity depth adjusting mechanism moves the movable member toward the contact / separation surface between the two molds to release the package.Therefore, it is not necessary to provide eject pins, etc. The efficiency of the device can be improved.

Further, according to the invention described in claim 4, the depth of the cavity is adjusted by attaching a spacer to at least one of the two molds according to the mold thickness of the package, which is simple. With the configuration, it is possible to achieve common use of the resin-sealed mold device.

Further, according to the invention described in claim 5, since the die cutting angle on the side surface of the mold of the package is set to about 0 degree, the package can be released smoothly, and the resin sealing metal Efficiency of the mold device can be achieved.

According to the invention of claim 6, since the distance between the contact / separation surface between the two molds and the lead frame mounting surface is variable, the molding mold is different even if the thickness of the lead frame is different. Therefore, it is possible to provide an efficient resin-sealed mold device and an efficient semiconductor manufacturing device.

According to the invention described in claim 7, the movable member is moved with respect to the fixed member by the base material thickness adjusting mechanism according to the thickness of the lead frame to be mounted, and the position of the lead frame mounting surface is adjusted. I adjusted the
Even if the thickness of the lead frame is different, it can be dealt with promptly.

Further, according to the invention described in claim 8,
Since the number of connected material supply / product discharge units is variable, it is possible to improve the utilization efficiency of the installation surface of the device.

According to the invention described in claim 9, since the number of connected material supply / product discharge units is adjusted according to the number of connected press units, the utilization efficiency of the installation surface of the apparatus is improved. Can be maximized.

According to the invention described in claim 10,
Since the access and utility connection surfaces are provided only on the two opposite side surfaces, another unit can be arranged adjacent to any of the other two side surfaces, and the efficiency of using the installation surface of the device can be further improved. .

According to the invention described in claim 11,
Since the chucking means of the transfer unit is used to grip both sides of the lead frame before molding or both sides of the package after molding, unlike the conventional case, the chucking means of the transfer unit is used. There is no damage to the gate and no remaining gates occur. As a result, the reliability of the semiconductor device as a product is improved.

According to the invention described in claim 12,
Since the cull after molding is grasped by the chucking means of the transport unit and transported to the material supply / product discharge unit, there is no damage to the package, cull, or gate portion, and no gate residue occurs. As a result, the reliability of the semiconductor device as a product is improved.

According to the invention described in claim 13,
Transporting the lead frame before molding to the lower mold of the press unit and unloading the package and cull after molding from the press unit are performed in the same transport unit, so the reliability during transport is improved and the cost is low. It is possible to provide various transport systems.

According to the invention described in claim 14,
Since there is no free-flow transport as in the past, the transport unit directly receives the lead frame placed on the material supply / product discharge unit and transports it to the lower die of the press unit, so reliability during transport It is possible to provide a low-priced transport system with improved efficiency.

According to the invention described in claim 15,
Since the package after molding is gripped by the transport unit and carried out from the press unit, and the cull is separated from the package while gripping it, there is no damage to the package, cull, or the gate part, and gate residue may occur. Absent. As a result, the reliability of the semiconductor device as a product is improved.

According to the invention described in claim 16,
After the cull is separated from the package, the package is directly loaded from the transport unit to the product unloading magazine provided in the material supply / product discharge unit, improving the reliability during transport and providing an inexpensive transport system. can do.

According to the seventeenth aspect of the present invention, since the semiconductor device is manufactured by the semiconductor manufacturing apparatus according to any one of the first to sixteenth aspects, the semiconductor device is highly reliable and inexpensive. A device can be provided.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a semiconductor resin-sealed mold device according to the present invention.

2 is a schematic vertical cross-sectional view of a substrate thickness adjusting mechanism provided in the semiconductor resin-sealed mold device of FIG.

FIG. 3 is a schematic vertical sectional view of a cavity depth adjusting mechanism provided in the semiconductor resin-sealed mold device of FIG.

FIG. 4 is a vertical cross-sectional view of a spacer attached to an upper mold instead of the cavity depth adjusting mechanism of FIG.

FIG. 5 is a schematic plan view of a semiconductor manufacturing apparatus according to the present invention.

FIG. 6 is a schematic plan view of another semiconductor manufacturing apparatus according to the present invention.

FIG. 7 is a schematic plan view of still another semiconductor manufacturing apparatus according to the present invention.

8 is a schematic perspective view of the semiconductor manufacturing apparatus in FIG.

FIG. 9 is a perspective view of a shuttle transport unit provided in the semiconductor manufacturing apparatus of FIGS.

10 is a schematic exploded perspective view of a carrier rail unit provided in the semiconductor manufacturing apparatus of FIGS. 6 and 7. FIG.

FIG. 11 is a plan view showing the semiconductor manufacturing apparatus of FIGS.
It is a schematic perspective view which shows the state which hold | grips and conveys the package after molding.

FIG. 12 is a plan view showing the semiconductor manufacturing apparatus of FIGS.
It is a side view of a break plate showing a state where the package after molding is broken.

13 is a schematic perspective view of the semiconductor manufacturing apparatus in FIG.

FIG. 14 is a schematic perspective view of a conventional semiconductor resin-sealed mold device.

FIG. 15 is a schematic plan view of a conventional semiconductor manufacturing apparatus.

FIG. 16 is a schematic plan view of another conventional semiconductor manufacturing apparatus.

FIG. 17 is a schematic plan view of still another conventional semiconductor manufacturing apparatus.

FIG. 18 is a schematic perspective view showing a state where the lead frame is conveyed from the frame supply magazine in the conventional semiconductor manufacturing apparatus.

FIG. 19 is a schematic perspective view showing a state in which a package after molding is pressed and adsorbed and conveyed in a conventional semiconductor manufacturing apparatus.

20 is a schematic perspective view of the semiconductor manufacturing apparatus in FIG.

21 is a schematic perspective view of the semiconductor manufacturing apparatus in FIG.

[Explanation of symbols]

2 Lower mold, 4, 4A Upper mold, 6 Base material thickness adjusting mechanism, 8 Cavity depth adjusting mechanism, 1
0 fixed member, 12 movable member, 14 direct drive motor, 16 motor support, 18 ball screw, 2
0 bracket, 22 ball screw nut, 24
Fixed member, 26 movable member, 28 movable member support, 30 ball screw nut, 32 motor support, 34 direct drive motor, 36 ball screw, 3
8 cavities, 40 spacers, 40a square holes,
42 material supply / product discharge unit, 44 transfer unit, 46 press unit, 48 transfer rail unit, 50 frame supply magazine, 51 push plate,
52 product discharge magazine, 53 mold resin supply unit, 53a feeder, 53b clamp, 54
Lead frame, 55 shuttle transport unit, 5
5a frame holding part, 55b first chucking means, 55c second chucking means, 56 break plate, 57 housing, 58 pinion, 60 cam follower, 62 housing, 64 servo motor, 66 timing belt, 68 holding plate, 70 LM guide, 72 cam groove, 74 rack, 76 mold resin, 78 rack

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 4F202 AH33 CB01 CB12 CK17 CK27                       CK52 CK73 CK89 CM03 CM11                       CM21                 4F206 AH37 JA02 JB17 JF05 JQ81                       JW23                 5F061 AA01 CA21 DA06 DA11

Claims (17)

[Claims] 1. A semiconductor manufacturing apparatus comprising a semiconductor resin-sealed mold device in which a cavity is formed in at least one of a lower mold and an upper mold, wherein A semiconductor manufacturing apparatus, wherein a distance between a contact surface and a bottom surface of the cavity is variable. 2. The upper mold is provided with a fixed member, a movable member slidably attached to the fixed member, and a cavity depth adjusting mechanism for sliding the movable member,
2. The semiconductor manufacturing apparatus according to claim 1, wherein the movable member is moved with respect to the fixed member by the cavity depth adjusting mechanism according to the mold thickness of the package to adjust the depth of the cavity. 3. After the molding, the movable member is moved toward the contact / separation surface between the lower die and the upper die by the cavity depth adjusting mechanism to release the package. 2. The semiconductor manufacturing apparatus according to item 2. 4. The semiconductor manufacturing according to claim 1, wherein a depth of the cavity is adjusted by attaching a spacer to at least one of the lower mold and the upper mold according to a mold thickness of a package. apparatus. 5. The semiconductor manufacturing apparatus according to claim 1, wherein the die cutting angle on the side surface of the mold of the package is set to approximately 0 degree. 6. A semiconductor manufacturing apparatus provided with a semiconductor resin-sealed mold device in which a cavity is formed in at least one of a lower mold and an upper mold, wherein the semiconductor manufacturing device is provided between the lower mold and the upper mold. A semiconductor manufacturing apparatus characterized in that the distance between the contact surface and the lead frame mounting surface is variable. 7. A fixed member, a movable member having the lead frame mounting surface slidably attached to the fixed member, and a base material thickness adjust for sliding the movable member on the lower mold. A mechanism is provided, and the position of the lead frame mounting surface is adjusted by moving the movable member with respect to the fixed member by the base material thickness adjusting mechanism according to the thickness of the mounted lead frame. 6. The semiconductor manufacturing apparatus according to item 6. 8. A material supply / product discharge unit for supplying a lead frame for resin sealing and discharging a package after molding, a transfer unit for transferring the lead frame and the package, and a lead frame. A semiconductor manufacturing apparatus comprising: a lower mold for resin-sealing a lower mold; and a press unit having an upper mold, wherein the number of connected material supply / product discharge units is variable. 9. The semiconductor manufacturing apparatus according to claim 8, wherein the number of connected material supply / product discharge units is adjusted according to the number of connected press units. 10. The semiconductor manufacturing apparatus according to claim 8, wherein the access and utility connection surfaces are provided only on the two opposite side surfaces. 11. The conveying unit is provided with a chucking means, and the chucking means holds both side surfaces of a lead frame before molding or both side surfaces of a package after molding. The semiconductor manufacturing apparatus according to item 1. 12. The conveying unit is provided with a chucking means, and the chuck after the molding is grasped by the chucking means and conveyed to the material supply / product discharge unit. The semiconductor manufacturing apparatus according to item. 13. The same transport unit transports the lead frame before molding to the lower die of the press unit and unloads the package and cull after molding from the press unit in the same transport unit. The semiconductor manufacturing apparatus according to claim 1. 14. The transport unit directly receives the lead frame placed on the material supply / product discharge unit, and transports the lead frame to a lower mold of the press unit. The semiconductor manufacturing apparatus according to item. 15. The package after molding is gripped by the transport unit and carried out from the press unit,
15. The semiconductor manufacturing apparatus according to claim 8, wherein the cull is separated from the package while being held. 16. The semiconductor manufacturing apparatus according to claim 15, wherein after the cull is separated from the package, the package is directly loaded into the product unloading magazine provided in the material supply / product discharge unit from the transport unit. 17. A semiconductor device manufactured by the semiconductor manufacturing apparatus according to claim 1. Description: