JPH06252190A - Semiconductor encapsulating device - Google Patents

Abstract

PURPOSE:To well clean the inside of a pot, sufficiently fill the pot and prevent the generation of defective products. CONSTITUTION:A semiconductor sealing device is provided with a fixed platen 1, a movable platen 2, a fixed side die mounted on the fixed platen 1, a movable side die which is mounted on the movable platen 2 and forms a cavity 6 between the movable side die and fixed side die and a pot 5. A plunger 7 is arranged in the pot 5 to freely slide, a compressed air hole 35 is opened at a prescribed position on the pot 5 and compressed air is jetted into the pot 5. When the pot 5 is filled with resin and compressed air is jetted into the pot 5 at the time of shifting the plunger 7 downward, the remaining resin in the pot 5 is blown away by the pressure of the compressed air and is completely removed from the pot 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor encapsulation device.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element is sealed in a plurality of cavities formed in a molding die, and a resin is filled in the cavities to seal the semiconductor element. In the device, insert a tablet-shaped resin into the pot of the transfer cylinder,
It can be melted. Then, by moving the plunger, the resin melted in the pot can be filled in the cavity through the gate portion.

FIG. 2 is a schematic view of a conventional semiconductor sealing device, and FIG. 3 is a sectional view taken along the line AA of FIG. In the figure, 1 is a fixed platen, 2 is arranged facing the fixed platen 1,
Movable platen moved by a driving device (not shown), 3 is an upper mold as a fixed side mold attached to the fixed platen 1, and 4 is a lower mold as a movable side mold attached to the movable platen 2. Is. The upper die 3
Also, the lower mold 4 forms a plurality of cavities 6 as shown in FIG.

On the upper surface of the lower mold 4, there are formed a plurality of pots 5 facing the upper mold 3 and opening.
Further, the pot 5 is integrally formed with a transfer cylinder 5a formed by penetrating the lower mold 4,
A plunger 7 is slidably arranged in the pot 5 so that a tablet-shaped resin can be inserted and melted. And the plunger 7
The resin melted in the pot 5 can be filled in the cavity 6 through the gate portion 8 by moving the above.

A multi-piston 9 is fixed to the rear end of the plunger 7, and the plunger 7 moves in conjunction with the movement of the multi-piston 9. The multi-piston 9 slides in a multi-cylinder 11 formed on the plunger holding frame 10. The plunger holding frame 10 is connected to a main piston 14 via a rod 13, and the main piston 14 slides inside a main cylinder 15 formed inside the movable platen 2. The plunger holding frame 10 is the main cylinder 1
By supplying and draining oil to and from the main piston 1
It can be moved up and down via 4. Then, the force for urging the plunger holding frame 10 upward is transmitted to the resin in the multi-cylinder 11 through the oil in the multi-cylinder 11, the multi-piston 9, and the plunger 7, and the resin is introduced into the cavity 6 through the gate portion 8. Is filled.

Therefore, a hydraulic circuit 20 is provided to supply and discharge oil to and from the main cylinder 15 and the multi-cylinder 11. Reference numeral 21 is an oil pump, 22 and 23 are electromagnetic switching valves, 24 and 25 are electromagnetic proportional pressure reducing valves, and 26 is a speed proportional control valve. In the semiconductor encapsulation apparatus having the above structure, first, a semiconductor element (not shown) is loaded in each cavity 6, and oil is supplied into the multi-cylinder 11 to raise the plunger 7 to the maximum upper limit in the multi-cylinder 11. In that state, a tablet-shaped resin is inserted into the pot 5, and after the insertion is completed, oil is supplied into the main cylinder 15 to raise the plunger holding frame 10 while holding the plunger 7 at the uppermost limit. At this time, the tablet-shaped resin is heated and melted.

When the plunger holding frame 10 is raised, the plunger 7 moves upward in the pot 5, and the molten resin in the pot 5 is filled in the cavity 6 via the gate portion 8. During this time, the hydraulic pressure in the main cylinder 15 is high (high pressure filling) as high as the resistance of the resin. Immediately before the filling is completed, the hydraulic system is regulated to obtain an appropriate resin pressure in the cavity 6. The tablet-shaped resin inserted into the pot 5 inevitably has variations in weight and height dimensions, and since they are different from each other, they melt as the plunger holding frame 10 rises. The predetermined molding pressure is reached in order from the pot 5 in which the amount of resin that has been caused is large. Therefore, the main cylinder 15
Is raised to the theoretical position of the end of filling, and the plunger 7 that has reached the forming pressure is sequentially retracted to absorb the variation in the supply amount, and the hydraulic pressure in the multi-cylinder 11 is always maintained at the set pressure by the electromagnetic proportional pressure reducing valve 25. The pressure applied to the resin by each plunger 7 is made equal.

Then, in the pressure-holding stage after the filling is completed,
The holding pressure is applied for a set time, but the holding pressure is further changed as necessary. After that, the resin encapsulating the semiconductor element is solidified into a lead frame (not shown), which is opened and taken out. Then, the semiconductor element is loaded into each cavity 6 again, and the semiconductor element is repeatedly sealed.

[0009]

However, in the conventional semiconductor encapsulation device, the resin remains in the pot 5 every time the semiconductor element is encapsulated, and the encapsulation cannot be performed sufficiently. , Will cause defective products.
FIG. 4 is an enlarged view of a main part of a conventional semiconductor sealing device.

In the figure, 1 is a fixed platen, 2 is a movable platen, 3 is an upper mold, 4 is a lower mold, 5 is a pot, and 6 is a cavity. A plunger 7 is slidably disposed in the pot 5 so that a tablet-shaped resin 31 can be inserted and melted. Then, by moving the plunger 7 upward, the resin melted in the pot 5 can be filled in the cavity 6 through the gate portion 8.

Thereafter, when the plunger 7 is moved downward, the resin remains in the pot 5. Therefore, after the lead frame (not shown) that has been opened by the mold opening is taken out, the lower surface of the upper mold 3 and the upper surface of the lower mold 4 are cleaned by a cleaning device (not shown) such as a brush. However, the resin cannot be removed sufficiently.

Therefore, the residual resin 32 adheres to the outer peripheral surface of the head 7a of the plunger 7 and the inner peripheral surface of the pot 5, and is caught between the head 7a and the pot 5 when the resin is filled. It becomes a resistance against the pressurization of the plunger 7. As a result, the actual filling pressure becomes lower than the designed value, the filling is not sufficiently performed, and unfilled sealing occurs, resulting in defective products.

According to the present invention, the problems of the conventional semiconductor encapsulation device are solved, the inside of the pot can be sufficiently cleaned, the filling can be sufficiently performed, and a defective product is not generated. An object is to provide a semiconductor sealing device.

[0014]

To this end, in the semiconductor encapsulation device of the present invention, a fixed platen, a movable platen arranged to face the fixed platen, and a fixed side attached to the fixed platen. Any of a movable side mold attached to the movable platen and forming a cavity between the fixed side mold in a state where the mold is clamped, and the fixed side mold and the movable side mold. It has a pot extending through one of them.

A plunger is slidably arranged in the pot, and a compressed air hole is opened at a set position of the pot to inject compressed air into the pot.

[0016]

According to the present invention, in the semiconductor encapsulation apparatus as described above, the fixed platen, the movable platen disposed so as to face the fixed platen, and the fixed-side mold attached to the fixed platen. And a movable side mold attached to the movable platen and forming a cavity between the fixed side mold and the fixed side mold in a state where the mold is clamped, and one of the fixed side mold and the movable side mold. Has a pot extending therethrough.

Then, when a tablet-shaped resin is inserted into the pot and melted and the plunger is moved upward, the melted resin is filled in the cavity,
The semiconductor element is sealed. Further, a plunger is slidably arranged in the pot, a compressed air hole is opened at a set position of the pot, and compressed air is injected into the pot.

When the filling of the resin is completed and the compressed air is injected into the pot when the plunger is moved downward,
The resin remaining in the pot is blown off by the pressure of the compressed air and is completely removed from the pot.

[0019]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a sectional view of an essential part of a semiconductor encapsulation device showing an embodiment of the present invention. In the figure, 1 is a fixed platen, 2 is a movable platen which is arranged so as to face the fixed platen 1 and is moved by a drive device (not shown), and 3 is a fixed-side mold attached to the fixed platen 1. Molds 4 are lower molds attached to the movable platen 2 as movable molds. The upper mold 3 and the lower mold 4 form a plurality of cavities 6 in a state where the molds are clamped.

On the upper surface of the lower mold 4, there are formed a plurality of pots 5 facing the upper mold 3 and opening.
Further, the pot 5 is integrally formed with a transfer cylinder 5a (see FIG. 2) formed by penetrating the lower mold 4, and a plunger 7 is slidably arranged in the pot 5. A tablet-shaped resin (not shown) can be inserted and melted. Then, by moving the plunger 7 upward, the pot 5
The resin melted inside can be filled into the cavity 6 through the gate portion 8.

In the semiconductor encapsulation apparatus having the above structure, first, a semiconductor element (not shown) is loaded in each cavity 6, and a tablet-shaped resin is inserted into the pot 5. At this time, the tablet-shaped resin is heated and melted. Next, when the plunger 7 is moved upward in the pot 5, the molten resin in the pot 5 is transferred to the cavity 6 via the gate portion 8.
Filled inside. Subsequently, the holding pressure is applied for a set time in the holding pressure stage after the filling is completed, and the holding pressure is further changed as necessary.

Thereafter, the resin encapsulating the semiconductor element is cooled and solidified to form a lead frame (not shown), which is opened and taken out. Then, the semiconductor element is loaded into each cavity 6 again, and the semiconductor element is repeatedly sealed. By the way, the plunger 7 shown in the drawing is at the lowest position in the pot 5, and in this state, the compressed air hole 35 is opened slightly above the tip of the head 7a in the pot 5. The compressed air hole 35 is provided in the pipe 3
It communicates with a compressed air source (not shown) via 6 and is capable of injecting compressed air into the pot 5.

When the semiconductor element is completely sealed and the mold is opened, and the plunger 7 moves downward to reach the lowest limit position, compressed air is ejected from the compressed air hole 35 and the pot 5 is opened. The resin remaining inside is blown off by the pressure of compressed air and completely removed. Therefore, the residual resin 32 (see FIG. 4) does not adhere to the outer peripheral surface of the head 7a of the plunger 7 and the inner peripheral surface of the pot 5, and is caught between the head 7a and the pot 5 when the resin is filled. It does not become a resistance against the pressurization of the plunger 7. As a result, the filling pressure as designed can be obtained, and the filling can be sufficiently performed.

Thereafter, the blown resin is discharged to the outside of the semiconductor encapsulation device by a cleaning device (not shown) such as a brush. It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0025]

As described above in detail, according to the present invention, in the semiconductor encapsulation device, the fixed platen, the movable platen arranged to face the fixed platen, and the fixed platen are attached. A fixed mold and a movable mold attached to the movable platen to form a cavity between the fixed mold and the fixed mold, and the fixed mold and the movable mold. It has a pot that extends through one of the molds.

A plunger is slidably arranged in the pot, a compressed air hole is opened at a set position of the pot, and compressed air is jetted into the pot. When the compressed air is injected into the pot when the filling of the resin is completed and the plunger is moved downward, the resin remaining in the pot is blown off by the pressure of the compressed air and is completely removed from the pot.

Therefore, the residual resin does not adhere to the outer peripheral surface of the head of the plunger or the inner peripheral surface of the pot, and when the resin is filled, the residual resin is caught between the head and the pot and the plunger is pressed against the pressure. There is no resistance. As a result, the filling pressure as designed can be obtained, and the filling can be sufficiently performed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts of a semiconductor encapsulation device showing an embodiment of the present invention.

FIG. 2 is a schematic view of a conventional semiconductor sealing device.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an enlarged view of a main part of a conventional semiconductor sealing device.

[Explanation of symbols]

 1 Fixed Platen 2 Movable Platen 3 Upper Mold 4 Lower Mold 5 Pot 6 Cavity 7 Plunger 35 Compressed Air Hole

Claims (1)

[Claims] 1. (a) a fixed platen; (b) a movable platen disposed so as to face the fixed platen; (c) a fixed mold attached to the fixed platen; and (d) the above. A movable mold attached to a movable platen and forming a cavity between the fixed mold and the fixed mold in a state where the mold is clamped; and (e) one of the fixed mold and the movable mold. (F) a plunger slidably disposed in the pot, and (g) compressed air that opens at a set position in the pot and injects compressed air into the pot. A semiconductor encapsulation device having a hole.