CN202241834U - IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure - Google Patents

IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure Download PDF

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Publication number
CN202241834U
CN202241834U CN2011203752651U CN201120375265U CN202241834U CN 202241834 U CN202241834 U CN 202241834U CN 2011203752651 U CN2011203752651 U CN 2011203752651U CN 201120375265 U CN201120375265 U CN 201120375265U CN 202241834 U CN202241834 U CN 202241834U
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CN
China
Prior art keywords
mold
diaphragm capsule
plate
counterdie
head
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Withdrawn - After Issue
Application number
CN2011203752651U
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Chinese (zh)
Inventor
曹阳根
廖秋慧
曹雨楠
阮勤超
张霞
唐佳
黄晨
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Shanghai University of Engineering Science
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Shanghai University of Engineering Science
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Priority to CN2011203752651U priority Critical patent/CN202241834U/en
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Publication of CN202241834U publication Critical patent/CN202241834U/en
Anticipated expiration legal-status Critical
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Abstract

The utility model relates to an IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure, which comprises an upper mold bottom plate, an upper mold plate, an upper box, a lower mold bottom plate, a lower mold plate, a lower mold box, an injecting head, a high-pressure injection molding cylinder, a heater and a temperature control system. A cavity insert is arranged on the upper mold box, an upper mold material cavity plate is disposed in the center of the cavity insert, another cavity insert is disposed on the lower mold box, a lower mold material cavity plate is arranged in the center of the cavity insert of the lower mold box, a lower mold injecting head lining is arranged below the lower mold material cavity plate, the injecting head is slidably assembled on the lower mold injecting head lining, and the high-pressure injection molding cylinder is connected to the lower end of the injecting head. By the aid of the IC plastic packaging mold, internal stress can be reduced, the density of a solidified plastic-packaged body is increased under high holding pressure, a sealing effect can be improved, possibility of permeation of humidity is reduced, and the service life of a product is prolonged. In addition, solidification is realized in a higher holding pressure statue, possible breakage and sealing-off of leads are avoided to a certain degree, and a low stress effect formed by a high holding pressure method is better than that of a method for simply reducing the coefficient of line-expansion of plastics.

Description

A kind of low high IC of guarantor plastic package die that fills
[technical field]
The utility model relates to the encapsulating mould technical field of semiconductor devices and integrated circuit thereof, a kind of specifically low high IC of guarantor plastic package die that fills.
[background technology]
The develop rapidly of As IC technology, to product reliability and service life the aspect requirement improve constantly.The introducing of new material, new structure and new technology makes the integrated level of chip improve constantly, and package dimension constantly dwindles, and the integrity problem influence that is caused by various stress increases gradually.
Epoxy resin (EP) is the main material of present IC plastic packaging, and plastic packaging material is sealed semi-conductor silicon chip, lead frame and lead-in wire, can play the effect of protection IC product.But plastic packaging material contacts with the tight of IC structure, has mutual active force, and this active force is sometimes to causing bigger influence in reliability of products, qualification rate and service life.With the silicon chip is example, because the thermal linear expansion coefficient of plastic packaging material and silicon differs an one magnitude (25 * 10-6 ℃-1 of plastic packaging material ≈, 2.3 * 10-6 ℃-1 of silicon ≈), when variations in temperature, their change in size phase missionary society is bigger.For example, diagonal is the chip of 1cm, 1 ℃ of the every variation of temperature, the cornerwise vary in length 2.3 * 10-2 of chip μ m; Change 100 ℃, vary in length 2.3 μ m.And 1 ℃ of the every variation of plastic packaging material of same length, its length will change 25 * 10-2 μ m; 100 ℃ of variations in temperature, its length will change 25 μ m.If plastic packaging material separates with chip surface, plastic packaging material will move at chip surface, and its maximum displacement will be greater than 11.35 μ m.Yet in the ordinary course of things, plastic packaging material is attached on chip surface, and it can not move (but having this trend) at chip surface.So, will have shear stress at chip and plastic packaging material interface.This power may make the weak metal layer of adhesive force on the chip produce slippage, and (temperature raises, to the chip edge slippage; Temperature reduces, to chip center's slippage), cause short circuit or open circuit between bonding jumper; Passivation layer or polysilicon layer are broken, cause the multiple-layer metallization layer short circuit.In addition, the mismatch of the thermal coefficient of expansion between plastic packaging material and lead frame, the gold thread can cause that also the lead frame buckling deformation causes the change of circuit parasitic parameter, or makes solder joint receive bigger additional potential stress and integrity problems such as sealing-off take place.The temperature of IC product plastic package die is about 165 ℃, and the temperature difference has 150 ℃ approximately before and after the processing, can cause inherent residual stress.And the environment for use temperature of IC product exists: 0 ℃~70 ℃ (commercial temperature) ,-40 ℃~+ 85 ℃ (industrial temperature) ,-40 ℃~+ 125 ℃ (automobile temperature).A large amount of inefficacy cases is illustrated in above 3 kinds of temperature ranges, and the ratio of component failure is all very high.Analysis to ineffective part shows that the capsulation material that extraneous temperature shock or low temperature environment cause is a dominant mechanism to the stress of chip.
In general; Electric stress, thermal stress, chemical stress, radiation stress and mechanical stress and other factors all can cause semiconductor devices to degenerate or lost efficacy; Conversion each other between the various stress, wherein the influence of thermal stress in processing and the use and mechanical stress is the most remarkable.
So far, the way of solution all is with the way that changes additive, reduces the linear expansion coefficient of plastic packaging material, but owing to the difference of linear expansion coefficient between nonmetallic materials and the metal material is excessive, best result also is difficult to fundamentally solve the problem of internal stress.And along with the reducing of linear expansion coefficient after the modification, the density of plastic packaging material reduces thereupon, and sealing effectiveness and conductivity of heat all decrease.
[summary of the invention]
The purpose of the utility model is exactly to solve above-mentioned deficiency, and a kind of low high IC of guarantor plastic package die that fills is provided, and can obviously improve plastic packaging internal stress problem.Low filling refers to that low speed fills mould, can reduce fusion materials flow impact to chip and gold thread when moulding is flowed, and reduces the product latent defect.High guarantor is meant in the plastic packaging material cure stage and applies very high dwell pressure.Under high pressure the actual shrinkage factor of plastics solidification can be for zero even for negative; Through the control type cavity pressure; Make the shrinkage factor of plastics in suitable scope; It is adaptive between plastic packaging material, chip, lead-in wire and chip, to reach heat, thereby reduces the product internal stress, improves IC reliability of products and service life.
The utility model adopts following technical scheme: a kind of low high IC of guarantor plastic package die that fills; Comprise baffle plate, cope match-plate pattern, last diaphragm capsule, following baffle plate, lower bolster, following diaphragm capsule, head, high-pressure injection moulding oil cylinder, heater and temperature-controlling system; Cope match-plate pattern 03 is fixed with diaphragm capsule 04, and lower bolster 08 is fixed with down diaphragm capsule 07, and last diaphragm capsule is provided with cavity block 05; The centre of said cavity block is provided with patrix material chamber plate 28; Also be provided with cavity block on the diaphragm capsule under said, the centre is provided with counterdie material chamber plate 12, and plate below in said counterdie material chamber is provided with counterdie head lining 15; Said counterdie head lining cunning has been joined head 16, and said head lower end connects high-pressure injection moulding oil cylinder 17.
Between said cope match-plate pattern and the last diaphragm capsule patrix support column 33 is housed, between said lower bolster and the following diaphragm capsule counterdie support column 14 is housed.Can bear high dwell pressure, prevent die cavity or template deformation, cause demoulding difficulty.
The said diaphragm capsule of going up has thermal insulation board 37 with following diaphragm capsule outer periphery, and patrix thermal insulation board 02 is equipped with in said cope match-plate pattern upper surface, and counterdie thermal insulation board 09 is equipped with in the lower surface of said lower bolster.
Said head lower end connects high-pressure injection moulding oil cylinder 17 through the quick connector 22 of head, and injecting head can be changed through quick connector.
On the said down baffle plate force transmitting board guiding mechanism is housed, said force transmitting board guiding mechanism comprises counterdie force transmitting board 13, force transmitting board guide runner 20 and force transmitting board guide holder 21, and injecting head applies in the whole stroke of high pressure all has reliable guiding.
The said diaphragm capsule of going up is provided with quick cooling body with following diaphragm capsule place, and said quick cooling body connects temperature-controlling system by circuit.
The beneficial effect of the utility model: reduce internal stress, the density of solidifying plastic-sealed body under the high packing pressure improves, and can improve sealing effectiveness, reduces the probability that moisture infiltrates, and improves product service life; The high density plastic packaging improves thermal conduction effect, helps the IC chip cooling; Higher compressive stress state solidifies down, has avoided to a certain extent making the possibility of wire breaking, sealing-off reduce owing to the materials flow impact pulls the additional potential stress that causes destruction; The low stress effect that high pressurize method forms is better than the bloated coefficient method of simple reduction plastic cord; The utility model can be adapted to the encapsulation of multiple different moral character plastics.Such as same chip, be applied to fields such as high temperature, low temperature or high radiation fashionable to plastic packaging material require differently, but because the difference of their shrinkage factors, just needs manufacturing different dies is produced.And if adopt high pressurize method just can adopt same secondary mould, the plastic packaging material of different qualities is adjusted shrinkage factor through the control dwell pressure, satisfy the requirement of using.
[description of drawings]
The structural representation of Fig. 1 the utility model;
Among Fig. 1, baffle plate on 01,02 patrix thermal insulation board, 03 cope match-plate pattern, diaphragm capsule on 04,05 cavity block, 06 runner push rod; 07 time diaphragm capsule, 08 lower bolster, 09 counterdie thermal insulation board, 10 counterdie gating inserts, 11 counterdie backing plates, 12 counterdie material chamber plates, 13 counterdie force transmitting boards; 14 counterdie support columns, 15 counterdie head linings, 16 heads, 17 high-pressure injection moulding oil cylinders, 18 counterdie liftout plates, 19 times baffle plates; 20 force transmitting board guide runners, 21 force transmitting board guide holders, the quick connector of 22 heads, 23 counterdie knock-pins, 24 counterdie head part plates, 25 counterdies eject base plate; 26 circular alignment pins, 27 guide pin bushings, 28 patrix material chamber plates, 29 patrix liftout base plates, 30 patrix die pads, 31 upper die plates; 32 guide pillars, 33 patrix support columns, 34 thimbles, 35 heater temperature controllers, 36 patrix liftout springs, 37 thermal insulation boards.
[specific embodiment]
Further specify below below in conjunction with accompanying drawing the utility model being done:
As shown in Figure 1, the utility model comprises baffle plate, cope match-plate pattern, last diaphragm capsule, following baffle plate, lower bolster, following diaphragm capsule, head, high-pressure injection moulding oil cylinder, heater and temperature-controlling system, and cope match-plate pattern 03 is fixed with diaphragm capsule 04; Lower bolster 08 is fixed with down diaphragm capsule 07; Last diaphragm capsule is provided with cavity block 05, and the centre of said cavity block is provided with patrix material chamber plate 28, and said diaphragm capsule down is provided with counterdie gating insert 10; The centre of said counterdie gating insert is provided with counterdie material chamber plate 12; Plate below in said counterdie material chamber is provided with counterdie head lining 15, and said counterdie head lining connects head 16, the said head lower end high-pressure injection moulding oil cylinder 17 that is connected.Between said cope match-plate pattern and the last diaphragm capsule patrix support column 33 is housed, between said lower bolster and the following diaphragm capsule counterdie support column 14 is housed.Can bear high dwell pressure, prevent die cavity or template deformation, cause demoulding difficulty.The said diaphragm capsule of going up has thermal insulation board 37 with following diaphragm capsule outer periphery, and patrix thermal insulation board 02 is equipped with in said cope match-plate pattern upper surface, and counterdie thermal insulation board 09 is equipped with in the lower surface of said lower bolster.Said head lower end connects high-pressure injection moulding oil cylinder 17 through the quick connector 22 of head, and injecting head can be changed through quick connector.
On the said down baffle plate force transmitting board guiding mechanism is housed, said force transmitting board guiding mechanism comprises counterdie force transmitting board 13, force transmitting board guide runner 20 and force transmitting board guide holder 21, and injecting head applies in the whole stroke of high pressure all has reliable guiding.
The said diaphragm capsule of going up is provided with quick cooling body with following diaphragm capsule place, and said quick cooling body connects temperature-controlling system by circuit.
IC plastic packaging with the SSOP-20L product is an example, adopts EP material (Samsung Co., Ltd, the trade mark is SL-7300SPM).The plastic package process flow process parameter of press automatic mode is set, and mold temperature is arranged on 165 ℃, and injection phase adopts low speed to fill mould, and system pressure is about 2Mpa, and cure stage adopts the high pressure pressurize, and system pressure is about about 14MPa.
Specific operation process is: as shown in Figure 1, install six heads, 16 cleaning backs appropriate with socket wrench specially adapted for it and the quick connector 22 of head.When mould after heating such as heating system and displays temperature reach 165 ℃; With bonding chip, bonding the lead frame of gold thread be positioned over the counterdie mold cavity surface; Correctly locate lead frame with circular alignment pin 26; Drop into six EP cylinder material in the counterdie material chamber plate 12, the control press is closed die joint, starts automatic compaction procedure.System pressure is raised to 2MPa, and high-pressure injection moulding oil cylinder 17 pressurizes to the material chamber through quick connector 22 of head and head 16 under the precise guidance effect of force transmitting board guide runner 20, force transmitting board guide holder 21; Because the fusion of high temperature EP material, under injection pressure through runner on the die joint and gating insert 10 entering IC plastic packaging die cavities, 5-19 within second die cavity be full of; The actual measurement cavity pressure raises, and system pressure gets into the high pressure conditions (pressure requires and can adjust according to the shrinkage factor of reality) of 14MPa after 20 seconds, and the plastics in the chamber begin to take place curing reaction; At this moment the die cavity internal pressure reaches 95MPa, and the process of curing is attended by the high pressure effect always, and the effect of high pressure forces the quality of plastics in the die cavity constantly to increase; Plastics are compressed, but along with the raising of plastics solidification ratio, the transmission effect of system pressure weakens; The actual measurement cavity pressure is gradually low gradually, solidifies fully in the die cavity during near 90 seconds, and heating system 35 control die cavities begin to cool down; Cool to about 40 ℃, plastic cool is shunk.In the time of 120 seconds, press is opened die joint, and counterdie liftout plate 18 is limited downwards, and promotion counterdie knock-pin 23 upwards pushes counterdie head part plate 24, counterdie ejects base plate 25 drive runner push rods 06 and thimble 34 ejects plastic packaging runner, plastic and lead frame.After taking out lead frame, Mo Wen rises to 165 ℃ again, repeats next circulation.

Claims (6)

1. one kind low is filled the high IC of guarantor plastic package die; Comprise baffle plate, cope match-plate pattern, last diaphragm capsule, following baffle plate, lower bolster, following diaphragm capsule, head, high-pressure injection moulding oil cylinder, heater and temperature-controlling system; Cope match-plate pattern (03) is fixed with diaphragm capsule (04), and lower bolster (08) is fixed with down diaphragm capsule (07), it is characterized in that: go up diaphragm capsule and be provided with cavity block (05); The centre of said cavity block is provided with patrix material chamber plate (28); Also be provided with cavity block on the diaphragm capsule under said, the centre is provided with counterdie material chamber plate (12), and plate below in said counterdie material chamber is provided with counterdie head lining (15); Said counterdie head lining cunning has been joined head (16), and said head lower end connects high-pressure injection moulding oil cylinder (17).
2. according to the said low high IC of the guarantor plastic package die that fills of claim 1, it is characterized in that: patrix support column (33) is housed between said cope match-plate pattern and the last diaphragm capsule, between said lower bolster and the following diaphragm capsule counterdie support column (14) is housed.
3. according to claim 1 or the 2 said low high IC of the guarantor plastic package dies that fill; It is characterized in that: the said diaphragm capsule of going up has thermal insulation board (37) with following diaphragm capsule outer periphery; Patrix thermal insulation board (02) is equipped with in said cope match-plate pattern upper surface, and counterdie thermal insulation board (09) is equipped with in the lower surface of said lower bolster.
4. according to the said low high IC of the guarantor plastic package die that fills of claim 3, it is characterized in that: said head lower end connects high-pressure injection moulding oil cylinder (17) through the quick connector of head (22).
5. according to the said low high IC of the guarantor plastic package die that fills of claim 4, it is characterized in that: on the baffle plate force transmitting board guiding mechanism is housed under said, said force transmitting board guiding mechanism comprises counterdie force transmitting board (13), force transmitting board guide runner (20) and force transmitting board guide holder (21).
6. according to the said low high IC of the guarantor plastic package die that fills of claim 5, it is characterized in that: the said diaphragm capsule of going up is provided with quick cooling body with following diaphragm capsule place, and said quick cooling body connects temperature-controlling system by circuit.
CN2011203752651U 2011-09-28 2011-09-28 IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure Withdrawn - After Issue CN202241834U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203752651U CN202241834U (en) 2011-09-28 2011-09-28 IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203752651U CN202241834U (en) 2011-09-28 2011-09-28 IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure

Publications (1)

Publication Number Publication Date
CN202241834U true CN202241834U (en) 2012-05-30

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Application Number Title Priority Date Filing Date
CN2011203752651U Withdrawn - After Issue CN202241834U (en) 2011-09-28 2011-09-28 IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102347248A (en) * 2011-09-28 2012-02-08 上海工程技术大学 IC (integrated circuit) plastic package process with low-speed stamping die and high packaging pressure
CN109786294A (en) * 2018-12-29 2019-05-21 铜陵三佳山田科技股份有限公司 The mould bases of the multiple rows of automatic diaphragm capsule of ultra-wide suitable for automatic packaging system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102347248A (en) * 2011-09-28 2012-02-08 上海工程技术大学 IC (integrated circuit) plastic package process with low-speed stamping die and high packaging pressure
CN102347248B (en) * 2011-09-28 2013-01-09 上海工程技术大学 IC (integrated circuit) plastic package process with low-speed injection molding and high pressure
CN109786294A (en) * 2018-12-29 2019-05-21 铜陵三佳山田科技股份有限公司 The mould bases of the multiple rows of automatic diaphragm capsule of ultra-wide suitable for automatic packaging system

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RGAV Abandon patent right to avoid regrant
AV01 Patent right actively abandoned

Granted publication date: 20120530

Effective date of abandoning: 20130306