JP2009090503A - Mold for resin sealing molding of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To aim high production efficiency of a resin material 9 and efficiently improve productivity of the product (resin molded body 18) in a mold 1 for resin sealing molding of an electronic component. <P>SOLUTION: The mold 1 composed of an upper mold 2, a lower mold 3 and an intermediate mold 4 is provided with an intermediate type cavity corresponding part 8, a lower mold hole part 10 for supplying a resin material, and a resin-pressurizing block 11 for pressurizing the resin material 9 supplied to the hole part 10. A mold cavity 8 is formed with the cavity corresponding part 8 and a lower mold surface in mold-clamping the intermediate mold 4 and the lower mold 3, and an edge gate (short mold gate) 16 is formed between the cavity 8 and the hole part 10. The resin material 15 heated and melted in the hole part 10 coated with a mold-releasing film 17 is injected and filled in the cavity 8 by pressurizing with the resin-pressurizing block 11 through the edge gate 16, and the electronic component 5 mounted on a substrate 6 is sealed and molded in the resin molded body 16 corresponding to the shape of the mold cavity 8. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an improvement in a mold for resin sealing molding of an electronic component in which an electronic component such as an IC mounted on a substrate is sealed with a resin material.

  Conventionally, an electronic component mounted on a substrate is resin-sealed and molded (so-called single-sided molding) by a transfer molding method. This method is performed as follows.

That is, first, the substrate on which the electronic component is mounted is supplied and set at a predetermined position on the lower mold, and the upper and lower molds are clamped to place the electronic component mounted on the substrate in the upper mold cavity.
Next, the resin material heated and melted in the lower mold pot is pressurized with a plunger, and the resin material heated and melted is passed through the resin passage (cal, runner, gate) provided in the upper mold, For example, the resin cavity is injected and filled into a mold cavity through a mold runner including a mold gate.
Therefore, after the time required for curing has elapsed, the electronic component on the substrate is resin-sealed and molded in a resin molded body (product) corresponding to the shape of the upper mold cavity.
In addition, since the mold runner including the mold gate is provided on the substrate, the runner resin (cured resin) including the gate resin cured in the mold runner including the mold gate is attached to the substrate. It was formed with.
Therefore, after projecting and releasing the resin molded body from the upper mold cavity, the runner resin containing the gate resin formed in a state of adhering to the substrate is cut by cutting the connection portion of the gate resin with the resin molded body. Removal from the substrate (gate break process) has been performed.
In addition, as the cured resin shown in the conventional example, there are a resin molded body (product) and a cured resin unnecessary for the product, that is, a cal resin, a runner resin, and a gate resin.

JP-A-10-291231

However, conventionally, since the mold runner including the mold gate is provided on the substrate, an installation space for the mold runner including the mold gate is required on the substrate.
That is, as described above, the gate break process is required (as a separate process), and the product (resin molded product) cannot be efficiently produced. There was a need for molds.
Therefore, there is an adverse effect that the productivity of the product cannot be improved efficiently in the mold for resin sealing molding of electronic parts.
In addition, since the conventional configuration requires a space for installing a mold runner including a mold gate on the substrate, a resin amount corresponding to the runner resin including the gate resin is required. There is a detrimental effect that the ratio of the resin molded body), that is, the product rate (%) of the resin material is lowered.
Therefore, there is a demand for a mold for resin sealing molding of electronic parts that can efficiently improve the productization rate of the resin material and has a high productization rate of the resin material.

That is, an object of the present invention is to provide a resin-sealing mold for electronic parts that can efficiently improve product productivity.
Also. An object of this invention is to provide the metal mold | die for resin sealing molding of the electronic component which has the high product rate of a resin material.

  In order to solve the above technical problem, the mold for resin-sealing molding of an electronic component according to the present invention is obtained by injecting and filling a resin material heated and melted into a mold cavity, so that the electronic component mounted on the substrate A mold for resin sealing molding of an electronic component to be sealed and molded in a resin molded body corresponding to the shape of a mold cavity, wherein the mold is an upper mold, and a lower mold disposed opposite to the upper mold, The intermediate mold provided between the upper and lower molds described above, a substrate supply unit provided on the mold surface of the upper mold and supplying the above-described substrate to the mold, and penetrating through the intermediate mold A cavity-corresponding portion provided in the above-described state, a hole portion provided in the mold surface of the lower mold and supplying the resin material, and a resin pressure block for pressing the resin material supplied to the hole portion, , Bullets that pressurize the resin pressure block And forming a resin molding cavity between the corresponding portion of the intermediate mold cavity and the surface on the lower mold side when the intermediate mold and the lower mold are clamped. The present invention is characterized in that a gate is formed between the mold cavity and the hole so as not to contact the substrate on the surface on the intermediate mold side and the surface on the lower mold side.

  The mold for resin-sealing molding of an electronic component according to the present invention for solving the technical problem described above is provided with a release film that covers the lower mold side surface and the lower mold hole. It is characterized by comprising.

According to the present invention, since a gate break process (as a separate process) can be omitted, it is possible to provide a mold for resin-sealing molding of an electronic component that can efficiently improve product productivity. There is an excellent effect that it can be done.
Also. According to the present invention, by using an edge gate (short gate), it is possible to efficiently reduce the amount of cured resin (edge gate resin) that is unnecessary as a product and efficiently improve the product rate of the resin material. In addition, it is possible to provide a mold for resin sealing molding of an electronic component having a high product rate of resin material.

Hereinafter, the present invention will be described in detail with reference to the drawings.
1, 2 and 3 show a mold for resin sealing molding of an electronic component according to the present invention.

(Configuration of mold for resin sealing molding of electronic parts)
As shown in the figure, a mold 1 for resin sealing molding of an electronic component according to the present invention includes a fixed upper mold 2, a movable lower mold 3 disposed opposite to the upper mold 2, and both upper and lower molds 2, 3. And an intermediate mold 4 provided so as to be movable up and down.
Accordingly, the upper die 2, the intermediate die 4, and the lower die 3 can be clamped by moving the lower die 3 upward.
Although not shown, the mold 1 (upper mold 2, intermediate mold 4, lower mold 3) is provided with a heating means for heating the mold 1 to a required molding temperature. .

The mold surface of the upper mold 2 is provided with a substrate supply unit 7 for supplying the substrate 6 on which the electronic component 5 is mounted in a state where the electronic component mounting surface side is directed downward. 4, a cavity corresponding portion 8 is provided in a state of penetrating the intermediate mold 4 (two cavity corresponding portions 8 in the illustrated example).
Further, the mold surface of the lower mold 3 is provided with a resin material supply hole 10 (pot) for supplying a resin material 9 (for example, a resin tablet). A pressure block 11 (plunger) is slidable up and down.
Although not shown, the peripheral wall surface on the inner side of the hole 10 is provided with a required peripheral groove for locking the resin cured in the hole 10.
In the example shown in the figure, a hole 10 is provided between two cavity corresponding parts 8.
A pressure table 12 (lower mold base) is provided below the lower mold 3 (floating cavity block), and the resin pressure block 11 is disposed between the resin pressure block 11 and the pressure table 12. A first elastic member 13 such as a compression spring that elastically pressurizes in the upward direction (in the resin pressurizing direction) is provided, and the lower mold 3 is positioned upward (in the mold) between the lower mold 3 and the pressure table 12. A second elastic member 14 such as a compression spring that elastically pressurizes (in the tightening direction) is provided.
That is, the first elastic member 13 has a required resin pressure to pressurize the resin material (molten resin) 15 heated and melted in the hole 10, and the second elastic member 14 presses the lower mold 3 in the mold clamping direction. This is the required mold clamping pressure.
Therefore, by pressurizing the pressurization table 12 upward, the resin pressurization block 11 can be pressed upward (in the resin pressurization direction) by the first elastic member 13. The resin material 15 heated and melted in the hole 10 can be pressurized by the resin pressure block 11.
In addition, the lower mold 3 can be pressed upward (clamping direction) by the second elastic member 14 by pressing the pressurizing table 12 upward.

(About the structure of the mold cavity and short mold gate)
Further, as shown in FIG. 2, by clamping the intermediate die 4 and the lower die 3, the through cavity corresponding portion 8 of the intermediate die 4 and the lower die 3 side surface (die surface) 3a are used for resin molding. The mold cavity 8 is formed.
Therefore, when the upper mold 2, the intermediate mold 4 and the lower mold 3 are clamped, the upper mold 2 is mounted on the substrate 6 supplied to the substrate supply unit 7 (with the electronic component mounting side facing downward). The electronic component 5 is configured to be fitted into a mold cavity (cavity corresponding part) 8.
Further, as shown in FIG. 2, by clamping the intermediate mold 4 and the lower mold 3, a surface on the lower mold 3 side (mold surface) of the intermediate mold 4 is provided between the hole 10 and the mold cavity 8. ) A short mold gate (edge gate) 16 for injecting the molten resin 15 into the mold cavity 8 is sandwiched between the upper mold 2 and the intermediate mold 4 by the surface (mold surface) 16b on the lower mold 3 side. The substrate can be formed without being in contact with the substrate.
Therefore, in the present invention, as shown in the conventional example, a space for disposing a mold runner including a mold gate on the substrate is not required, and the resin 19 cured in the edge gate 16 is formed on the substrate. 6 is not touched.
Further, the edge gate 16 is formed at the corner between the cavity bottom surface (surface on the lower mold 3 side) 3a and the cavity side surface (8).

In addition, about the structure of the short metal mold | die 16, the structure which joins and forms the corner | angular part of the bottom face 3a and the side surface in the mold cavity 8 and the corner | angular part of the upper side opening part of the hole 10 slightly is employ | adopted. be able to.
In this case, since the hole 10 and the mold cavity 8 can be disposed at extremely close positions, the mold gate 16 between the hole 10 and the mold cavity 8 can be configured to be extremely short.

(About release film)
Further, a release film 17 is provided between the intermediate mold 4 and the lower mold 3 in a stretched state, and the intermediate mold 4 and the lower mold 3 are clamped by clamping the intermediate mold 4 and the lower mold 3. It is comprised so that the release film 17 can be pinched and fixed between.
That is, the tension release film 17 is moved downward to cover and attach the mold surface of the lower mold 3, and the intermediate mold 4 and the lower mold 3 are clamped to place the release film 17 between the molds 3 and 4. Then, the release film 17 is configured to be covered and attached along the inner surface of the hole 10 and the top surface of the resin pressure block 11 in the hole 10.
Therefore, when the mold 1 (2 3 4) is clamped, the release film 17 is a lower mold including the lower mold 3 side surface (mold surface) 16b of the mold gate 16 and the mold cavity bottom surface 3a. It is configured so that it can be covered and mounted on the surface on the 3 side (mold surface) and in the hole 10.
For this reason, the resin cured in the hole 10 and the mold gate 16 can be efficiently released from the lower mold 3 side and removed by the releasing action of the release film 17.

In addition, although not shown in figure, about the structure which coat | covers and mounts the release film 17 mentioned above, the structure which provides a suction | inhalation coating | coated means in the surface at the side of the lower mold | type 3 is employable, for example.
The suction coating means includes, for example, a suction hole provided at a required portion on the surface on the lower mold 3 side and a required portion on the top surface of the resin pressure block 11 in the hole 10, and air is forcibly sucked and discharged. A vacuuming mechanism such as a vacuum pump, and a vacuum path for connecting the suction hole and the vacuuming mechanism in communication are provided.
That is, since the air can be forcibly sucked and discharged through the vacuum path and the suction hole by the vacuuming mechanism, the suction hole can be formed from the surface on the lower mold 3 side or from the inside of the hole 10. The release film 17 is configured to be sucked and coated.
Accordingly, first, the release film 17 is sucked onto the surface of the lower mold 3 so as to be covered and then sucked from the inside of the hole 10 to form a recess in the release film 17 so that the inside of the hole 10 It is comprised so that covering mounting | wearing can be carried out along the shape of this.
At this time, the resin material 9 (resin tablet) is supplied into the hole 10 covered with the release film 17 so as to be melted by heating.
Further, the release film 17 is adsorbed and fixed to the mold surface of the lower mold 3 and the upper opening of the hole portion (at the surface of the intermediate mold 4 on the lower mold 3 side) when the intermediate mold 4 and the lower mold 3 are clamped. Alternatively, the resin tablet 9 may be pressed downward to supply the resin tablet 9 into the hole 10.

(About the effect)
That is, the resin material 15 heated and melted in the hole 10 covered with the release film 17 is pressurized by the resin pressure block 11 and injected into the mold cavity 8 through the edge gate (short mold gate) 16. It is comprised so that it can be filled.
Further, as a product including a resin cured in the mold cavity 8 (resin molded body 18), a resin cured in the edge gate 16 (edge gate resin) 19, and a resin 20 cured in the hole 10, The unnecessary cured resin 21 is pulled downward with the resin 21 (19, 20) unnecessary for the product remaining in the hole 10 when the mold 1 is opened. The edge gate resin 19 and the resin molded body 18 can be cut and separated at a joint portion of the edge gate resin 19 with the resin molded body 18.
Therefore, since the gate break process shown in the conventional example (which is a separate process) is unnecessary and can be omitted, the productivity of the product (resin molded body 18) can be improved efficiently.
Further, since the resin 19 is cured in the edge gate (short mold gate) 16, compared with the runner resin including the gate resin shown in the conventional example, the cured resin unnecessary for the product can be efficiently reduced. .
Accordingly, the ratio of the resin molded body (product) 18 to the resin material 9, that is, the so-called product rate of the resin material can be efficiently increased, and a high product rate of the resin material can be achieved.
The product rate of the resin material is expressed by, for example, (weight of resin molded body / weight of resin material) × 100 (wt%), and the weight (volume) of the resin material is (weight of resin molded body + product). Is the weight of unnecessary cured resin).
In addition, the weight of the resin 20 cured in the hole 10 according to the present invention and the weight of the cal resin cured in the mold cull shown in the conventional example are equal to or more than the weight of the conventional cal resin. The weight of the internal curing resin 20 is reduced.

(About resin sealing molding method for electronic parts)
That is, by using the mold 1 for resin sealing molding of electronic parts, first, as shown in FIG. 1, the board 6 having the electronic parts 5 mounted on the board supply part 7 of the upper mold 2 is placed on the electronic part mounting surface side. Is set in a state of facing downward, and the release film 17 is coated and mounted on the surface on the lower mold 3 side and in the hole 10 to supply the resin material 9 into the hole 10 of the release film coating. The mold 1 (upper mold 2, intermediate mold 4 and lower mold 3) is clamped while being heated and melted.
At this time, the electronic component 5 mounted on the substrate 6 is fitted into the mold cavity 8 formed by the cavity corresponding portion 8 of the intermediate die 4 and the surface (cavity bottom surface) 3a on the lower die 3 side, and the intermediate die The edge gate 16 is formed between the hole 10 and the mold cavity 8 by the surface 16a on the 4 side and the surface 16b on the lower mold 3 side.
At this time, by pressing the pressurizing table 12 upward, the second elastic member 14 can press the lower mold 3 upward with a required clamping pressure, and the resin pressurizing block 11. The resin material 15 heated and melted in the hole 10 can be pressurized with a required resin pressure through the release film 17.
That is, the resin material 15 heated and melted in the hole 10 is then pressurized by the resin pressure block 11 to be injected and filled (single-sided mold) into the mold cavity 8 through the edge gate 16.
After the time required for curing has elapsed, the electronic component 5 mounted on the substrate 6 can be resin-sealed and molded in a resin molded body (product) 18 corresponding to the shape of the mold cavity 8.
Next, the mold 1 (the upper mold 2, the intermediate mold 4, and the lower mold 3) is opened.
At this time, in a state where the resin 20 cured in the hole 10 is retained and retained in the hole 10, the lower mold 3 is moved downward relative to the intermediate mold 4 to open the mold, thereby providing an edge gate. The edge gate resin 19 cured within 16 can be pulled.
Therefore, the edge gate resin 19 and the resin molded body 18 can be cut and separated at the joint portion between the edge gate resin 19 and the resin molded body 18.
At this time, in a state where the substrate 6 is locked to the substrate supply portion 7 of the upper mold 2, the intermediate mold 4 is moved downward to open the mold, thereby releasing the resin molded body 18 from the mold cavity 8. can do.
Next, the resin pressure block 11 is moved up to protrude the resin 20 cured in the hole 10, so that it is not necessary as a product composed of the resin 20 cured in the hole 10 and the edge gate resin 19. The hardened resin 21 (and the used release film 17) can be taken out.

According to the present invention, as described above, the resin molded body 18 cured in the mold cavity 8 and the resin 21 (19/20) cured in the edge gate 16 and the hole 10 are formed by the mold 1. When the mold is opened, the resin 20 hardened in the hole 10 is pulled downward in a state where the resin 20 is retained. Therefore, the edge gate resin 19 is joined to the resin molded body 18 at the edge gate resin 19. 19 (21) and the resin molded body 18 can be cut and separated.
Therefore, according to the present invention, the gate break treatment shown in the conventional example is unnecessary and can be omitted. Therefore, in the mold 1 for resin sealing molding of electronic parts according to the present invention, a product (resin molded body) The productivity of 18 can be improved efficiently.

Further, according to the present invention, as described above, since the resin 19 is hardened in the edge gate (short mold gate) 16, it is unnecessary as a product as compared with the runner resin including the gate resin shown in the conventional example. The hardened resin (edge gate resin 19) can be reduced efficiently.
Therefore, according to the present invention, in the mold 1 for resin-encapsulation molding of electronic parts according to the present invention, it is possible to efficiently increase the product rate of the resin material and achieve a high product rate of the resin material. it can.

  As described above, the resin sealing mold 1 for the electronic component according to the present invention includes the resin material supply hole 10, the resin pressure block 11 for resin pressure, and the resin pressure block 11. The first elastic member 13 absorbs variations in the amount of resin injected and filled into the mold cavity 8 through the edge gate 16. can do.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

FIG. 1 is a schematic longitudinal sectional view schematically showing a mold for resin-sealing molding of an electronic component according to the present invention, and shows a mold open state before molding in the above-described mold. FIG. 2 is a schematic longitudinal sectional view schematically showing a mold for resin sealing molding of an electronic component corresponding to FIG. 1, and shows the mold clamping state of the above-described mold. FIG. 3 is a schematic longitudinal sectional view schematically showing a mold for resin sealing molding of an electronic component corresponding to FIG. 1, and shows a mold open state after molding in the above-described mold.

Explanation of symbols

1 Mold for Resin Sealing Molding of Electronic Components 2 Fixed Upper Mold 3 Movable Lower Mold 3a Cavity Bottom (Lower Mold Surface)
4 Intermediate mold 5 Electronic component 6 Substrate 7 Substrate supply part 8 Cavity corresponding part (mold cavity)
9 Resin materials (resin tablets)
10 hole 11 resin pressure block 12 pressure table (lower mold base)
13 First elastic member 14 Second elastic member 15 Heat-melted resin material (molten resin)
16 Mold gate (edge gate)
16a Surface on the middle mold side of the edge gate 16b Surface on the lower mold side of the edge gate 17 Release film 18 Resin molded product (product)
19 Edge gate resin (cured resin)
20 cured resin in the hole 21 cured resin

Claims (2)

  Resin-sealing mold for electronic components that molds and molds electronic components mounted on a substrate into a resin-molded body corresponding to the shape of the mold cavity by injecting and filling a resin material heated and melted into the mold cavity The mold includes an upper mold, a lower mold disposed opposite to the upper mold, and an intermediate mold provided between the upper and lower molds. A substrate supply unit that is provided on the mold surface of the mold and supplies the above-described substrate, a cavity corresponding part that is provided in a state of penetrating the intermediate mold, and a resin that is provided on the mold surface of the lower mold and that is described above. It comprises a hole for supplying material, a resin pressure block for pressing the resin material supplied to the hole, and an elastic member for pressing the resin pressure block. And the lower die during clamping, A cavity for resin molding is formed by the mold cavity corresponding part and the lower mold side surface, and the intermediate mold side surface and the lower mold side surface are formed between the mold cavity and the hole. A mold for resin-sealing molding of electronic parts, characterized in that the gate is formed without contacting the substrate.   The mold for resin-sealing molding of an electronic component according to claim 1, wherein a release film for covering the lower mold side surface and the inside of the lower mold hole is provided.

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