JP6886416B2 - Resin molding equipment and manufacturing method of resin molded products - Google Patents

Resin molding equipment and manufacturing method of resin molded products Download PDF

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JP6886416B2
JP6886416B2 JP2018043431A JP2018043431A JP6886416B2 JP 6886416 B2 JP6886416 B2 JP 6886416B2 JP 2018043431 A JP2018043431 A JP 2018043431A JP 2018043431 A JP2018043431 A JP 2018043431A JP 6886416 B2 JP6886416 B2 JP 6886416B2
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resin
mold
cavity
molding
adjusting
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JP2019155664A (en
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祐輔 下多
祐輔 下多
優里奈 小神
優里奈 小神
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Towa Corp
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Towa Corp
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Priority to JP2018043431A priority Critical patent/JP6886416B2/en
Priority to TW108107387A priority patent/TWI740109B/en
Priority to KR1020190025766A priority patent/KR102237166B1/en
Priority to CN201910171982.3A priority patent/CN110239016B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

本発明は、樹脂成形装置、及び樹脂成形品の製造方法に関するものである。 The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

圧縮成形による樹脂成形装置において、成形される樹脂成形品の厚みのばらつきを抑える技術としては、特許文献１に示すものが考えられている。 As a technique for suppressing variation in the thickness of a resin molded product to be molded in a resin molding apparatus by compression molding, the technique shown in Patent Document 1 is considered.

特許文献１の樹脂成形装置では、成形型を加熱するヒータプレートと、当該ヒータプレートを支持するプラテンとの間に複数個の柱状部材からなる断熱部材が配置されている。そして、型締め時におけるプラテンの撓みを複数個の柱状部材の変形量によって打ち消して、樹脂成形品の厚みのばらつきを抑えている。 In the resin molding apparatus of Patent Document 1, a heat insulating member composed of a plurality of columnar members is arranged between the heater plate that heats the molding die and the platen that supports the heater plate. Then, the bending of the platen at the time of mold clamping is canceled by the amount of deformation of the plurality of columnar members, and the variation in the thickness of the resin molded product is suppressed.

特開２０１７−４３０３５号公報JP-A-2017-43035

しかしながら、近年の樹脂成形品の薄型化や高精度化に伴って、更なる厚みのばらつきの低減が求められている。 However, with the recent decrease in thickness and accuracy of resin molded products, further reduction in thickness variation is required.

樹脂成形品の厚みがばらつく原因について、特許文献１の図１を参照して説明する。第１に、第１プラテン１１の変形に沿って下型１６１及びキャビティ１６１２の形状が変形することが考えられる。このような変形の原因は、型締め時に生じる圧力がトグルリンク１３３等の駆動機構から第１プラテン１１へ動力を伝達する負荷点に動力が集中することと、型締め時に生じる上型１６２等の圧力バランスによることが考えられる。第２の原因として、第１プラテン１１の温度分布のばらつきによることが考えられる。ヒータプレート１５１、１５２の熱を第１プラテン１１及び第２プラテン１２に伝達しないよう断熱部材が配置されている。しかし、完全に断熱することは難しく、僅かながら熱が伝達する。この熱により第１プラテン１１及び第２プラテン１２の一部に温度差が生じて変形することが考えられる。 The cause of the variation in the thickness of the resin molded product will be described with reference to FIG. 1 of Patent Document 1. First, it is conceivable that the shapes of the lower mold 161 and the cavity 1612 are deformed along with the deformation of the first platen 11. The causes of such deformation are that the pressure generated during mold clamping is concentrated at the load point where the power is transmitted from the drive mechanism such as the toggle link 133 to the first platen 11, and that the upper mold 162 and the like generated during mold clamping. It may be due to the pressure balance. The second cause is considered to be the variation in the temperature distribution of the first platen 11. A heat insulating member is arranged so as not to transfer the heat of the heater plates 151 and 152 to the first platen 11 and the second platen 12. However, it is difficult to completely insulate, and a small amount of heat is transferred. It is conceivable that this heat causes a temperature difference in a part of the first platen 11 and the second platen 12 to cause deformation.

そこで本発明は、樹脂成形品の厚みのばらつきを低減することをその主たる課題とするものである。 Therefore, the main object of the present invention is to reduce variations in the thickness of resin molded products.

すなわち本発明に係る樹脂成形装置は、キャビティを有する第１の成形型と、当該第１の成形型に対向配置された第２の成形型とを有し、前記第１の成形型及び前記第２の成形型を型締めして樹脂成形品を成形する樹脂成形装置であって、前記第１の成形型は、前記キャビティの底面を形成する底面部材と、前記底面部材の前記底面とは反対側の面に接触して型締め時における前記底面の形状を調整する調整部材とを有することを特徴とする。 That is, the resin molding apparatus according to the present invention has a first molding die having a cavity and a second molding die arranged to face the first molding die, and the first molding die and the first molding die. A resin molding apparatus for molding a resin molded product by molding a molding mold of 2, wherein the first molding mold is opposite to the bottom surface member forming the bottom surface of the cavity and the bottom surface of the bottom surface member. It is characterized by having an adjusting member that comes into contact with a side surface and adjusts the shape of the bottom surface at the time of molding.

このように構成した本発明によれば、樹脂成形品の厚みのばらつきを低減することができる。 According to the present invention configured in this way, it is possible to reduce variations in the thickness of the resin molded product.

本実施形態の樹脂成形装置の構成を模式的に示す平面図である。It is a top view which shows typically the structure of the resin molding apparatus of this embodiment. 同実施形態の一対の成形型及び型締機構を主として示す縦断面図である。It is a vertical cross-sectional view mainly showing a pair of molding dies and a mold clamping mechanism of the same embodiment. 同実施形態の第１の成形型（下型）の主要部を示す縦断面図である。It is a vertical sectional view which shows the main part of the 1st molding die (lower die) of the same embodiment. 同実施形態の（ａ）底面部材の平面図及び（ｂ）調整部材の斜視図である。It is a top view of (a) bottom surface member and (b) perspective view of the adjustment member of the same embodiment. 同実施形態の樹脂成形品の製造方法を示す図である。It is a figure which shows the manufacturing method of the resin molded article of the same embodiment. 同実施形態の樹脂成形品の製造方法を示す図である。It is a figure which shows the manufacturing method of the resin molded article of the same embodiment. 同実施形態の樹脂成形品の製造方法を示す図である。It is a figure which shows the manufacturing method of the resin molded article of the same embodiment.

次に、本発明について、例を挙げてさらに詳細に説明する。ただし、本発明は、以下の説明により限定されない。 Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

本発明の樹脂成形装置は、前述のとおり、キャビティを有する第１の成形型と、当該第１の成形型に対向配置された第２の成形型とを有し、前記第１の成形型及び前記第２の成形型を型締めして樹脂成形品を成形する樹脂成形装置であって、前記第１の成形型は、前記キャビティの底面を形成する底面部材と、前記底面部材の前記底面とは反対側の面に接触して型締め時における前記底面の形状を調整する調整部材とを有することを特徴とする。
この樹脂成形装置であれば、キャビティの底面を形成する底面部材における底面とは反対側の面に接触して調整部材を設けているので、キャビティの底面の形状を調整しやすくなり、樹脂成形品の厚みのばらつきを低減することができる。 As described above, the resin molding apparatus of the present invention has a first molding die having a cavity and a second molding die arranged to face the first molding die, and the first molding die and the first molding die. A resin molding apparatus for molding a resin molded product by molding the second molding die, wherein the first molding die includes a bottom surface member forming the bottom surface of the cavity and the bottom surface of the bottom surface member. Is characterized by having an adjusting member that contacts the opposite surface and adjusts the shape of the bottom surface at the time of molding.
In this resin molding device, since the adjusting member is provided in contact with the surface of the bottom member forming the bottom surface of the cavity opposite to the bottom surface, the shape of the bottom surface of the cavity can be easily adjusted, and the resin molded product. It is possible to reduce the variation in the thickness of.

前記調整部材は、前記底面部材の前記底面とは反対側の面の複数箇所に設けられていることが望ましい。
この構成であれば、キャビティの底面の形状を複数箇所で調整することができるので、樹脂成形品の厚みのばらつきを一層低減することができる。 It is desirable that the adjusting member is provided at a plurality of positions on the surface of the bottom surface member opposite to the bottom surface.
With this configuration, the shape of the bottom surface of the cavity can be adjusted at a plurality of locations, so that variations in the thickness of the resin molded product can be further reduced.

前記第１の成形型は、前記底面部材との間で前記調整部材を挟むように設けられた挟み部材と、前記調整部材を挟んだ状態で前記挟み部材を前記底面部材に締結する締結ボルトとをさらに有することが望ましい。
この構成であれば、調整部材の高さ寸法（厚み寸法）を異ならせ、締結ボルトの締め込み量を調整することによって、キャビティの底面の形状を調整することができ、その結果、樹脂成形品の厚みのばらつきを一層低減することができる。 The first molding mold includes a sandwiching member provided so as to sandwich the adjusting member with the bottom surface member, and a fastening bolt for fastening the sandwiching member to the bottom surface member while sandwiching the adjusting member. It is desirable to have more.
With this configuration, the shape of the bottom surface of the cavity can be adjusted by making the height dimension (thickness dimension) of the adjusting member different and adjusting the tightening amount of the fastening bolt, and as a result, the resin molded product. It is possible to further reduce the variation in the thickness of the.

また、締結ボルトの締め込み量を調整することによって、調整部材を交換すること無く調整部材の厚み（変形量）を微調整することもできる。その結果、樹脂成形品の厚みのばらつきを一層低減することができる。 Further, by adjusting the tightening amount of the fastening bolt, the thickness (deformation amount) of the adjusting member can be finely adjusted without exchanging the adjusting member. As a result, the variation in the thickness of the resin molded product can be further reduced.

締結ボルトの締め込み量によってキャビティ底面の形状又は調整部材の厚み（変形量）を調整しやすくするためには、前記調整部材には、前記締結ボルトが貫通する貫通孔が形成されており、前記締結ボルトは、前記貫通孔を貫通した状態で前記挟み部材を前記底面部材に締結することが望ましい。 In order to make it easier to adjust the shape of the bottom surface of the cavity or the thickness (deformation amount) of the adjusting member by the tightening amount of the fastening bolt, the adjusting member is formed with a through hole through which the fastening bolt penetrates. It is desirable that the fastening bolt is fastened to the bottom surface member with the sandwiching member penetrating the through hole.

第１の成形型のキャビティの内面には、樹脂成形品が離型しやすくなるように離型フィルムを密着させる場合がある。この場合、第１の成形型には、離型フィルムをキャビティの内面に密着させるために空気を吸引する吸引流路が形成されることになる。底面部材の下面に調整部材を設ける構成において無理なく吸引流路を形成するためには、前記第１の成形型は、前記底面部材を取り囲むとともに前記キャビティを形成する側面部材をさらに有し、前記側面部材に、前記キャビティ内の空気を吸引するための吸引流路が形成されていることが望ましい。 A release film may be adhered to the inner surface of the cavity of the first molding mold so that the resin molded product can be easily released from the mold. In this case, the first molding die is formed with a suction flow path for sucking air in order to bring the release film into close contact with the inner surface of the cavity. In order to form the suction flow path reasonably in the configuration in which the adjusting member is provided on the lower surface of the bottom surface member, the first molding die further has a side surface member that surrounds the bottom surface member and forms the cavity. It is desirable that the side surface member is formed with a suction flow path for sucking the air in the cavity.

また、上述した樹脂成形装置を用いた樹脂成形品の製造方法も本発明の一態様である。 Further, a method for producing a resin molded product using the resin molding apparatus described above is also an aspect of the present invention.

＜本発明の一実施形態＞
以下に、本発明に係る樹脂成形装置の一実施形態について、図面を参照して説明する。なお、以下に示すいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。同一の構成要素については、同一の符号を付して説明を適宜省略する。 <One Embodiment of the present invention>
Hereinafter, an embodiment of the resin molding apparatus according to the present invention will be described with reference to the drawings. In addition, all of the figures shown below are schematically drawn by omitting or exaggerating them as appropriate for the sake of clarity. The same components are designated by the same reference numerals and the description thereof will be omitted as appropriate.

＜樹脂成形装置１００の全体構成＞
本実施形態の樹脂成形装置１００は、電子部品が搭載された基板Ｗに対して電子部品が搭載された部品搭載面を樹脂で封止して樹脂成形品Ｐを製造するものである。なお、基板としては、例えば金属基板、樹脂基板、ガラス基板、セラミックス基板、回路基板、半導体基板、リードフレーム等を挙げることができる。 <Overall configuration of resin molding apparatus 100>
The resin molding apparatus 100 of the present embodiment manufactures a resin molded product P by sealing a component mounting surface on which electronic components are mounted with a resin on a substrate W on which electronic components are mounted. Examples of the substrate include a metal substrate, a resin substrate, a glass substrate, a ceramics substrate, a circuit board, a semiconductor substrate, a lead frame, and the like.

この樹脂成形装置１００は、図１に示すように、基板供給・収納モジュールＡと、２つの樹脂成形モジュールＢと、樹脂材料供給モジュールＣとを、それぞれ構成要素として備える。各構成要素（各モジュールＡ〜Ｃ）は、それぞれの構成要素に対して着脱可能かつ交換可能である。 As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply / storage module A, two resin molding modules B, and a resin material supply module C, respectively, as constituent elements. Each component (each module A to C) is removable and replaceable with respect to each component.

基板供給・収納モジュールＡは、封止前基板Ｗを供給する基板供給部１１と、封止済基板Ｗ（樹脂成形品Ｐ）を収納する基板収納部１２と、封止前基板Ｗ及び封止済基板Ｗを受け渡しする基板載置部１３と、封止前基板Ｗ及び封止済基板Ｗを搬送する基板搬送機構１４とを有する。基板載置部１３は、基板供給・収納モジュールＡ内において、基板供給部１１に対応する位置と基板収納部１２に対応する位置との間でＹ方向に移動する。基板搬送機構１４は、基板供給・収納モジュールＡ及びそれぞれの樹脂成形モジュールＢ内において、Ｘ方向及びＹ方向に移動する。 The substrate supply / storage module A includes a substrate supply unit 11 for supplying a pre-sealed substrate W, a substrate accommodating unit 12 for accommodating a sealed substrate W (resin molded product P), a pre-sealed substrate W, and sealing. It has a substrate mounting portion 13 for delivering the finished substrate W, and a substrate transport mechanism 14 for transporting the pre-sealed substrate W and the sealed substrate W. The board mounting unit 13 moves in the Y direction between the position corresponding to the board supply unit 11 and the position corresponding to the board storage unit 12 in the board supply / storage module A. The substrate transfer mechanism 14 moves in the X direction and the Y direction in the substrate supply / storage module A and the respective resin molding modules B.

各樹脂成形モジュールＢは、キャビティ２Ｃが形成された第１の成形型である下型２と、基板Ｗを保持する第２の成形型である上型３と、下型２及び上型３を型締めする型締め機構４とを有する。具体的な構成について後述する。 Each resin molding module B has a lower mold 2 which is a first molding mold in which a cavity 2C is formed, an upper mold 3 which is a second molding mold for holding a substrate W, and a lower mold 2 and an upper mold 3. It has a mold clamping mechanism 4 for mold clamping. The specific configuration will be described later.

樹脂材料供給モジュールＣは、移動テーブル１５と、移動テーブル１５上に載置される樹脂材料収容部１６と、樹脂材料収容部１６に樹脂材料Ｊを投入する樹脂材料投入機構１７と、樹脂材料収容部１６を搬送して下型のキャビティ２Ｃに樹脂材料Ｊを供給する樹脂材料供給機構１８とを有する。移動テーブル１５は、樹脂材料供給モジュール内においてＸ方向及びＹ方向に移動する。樹脂材料供給機構１８は、樹脂材料供給モジュールＣ及びそれぞれの樹脂成形モジュールＢ内において、Ｘ方向及びＹ方向に移動する。なお、樹脂材料Ｊは、顆粒状や粉末状の樹脂材料の他、液状、シート状、タブレット状等を用いることができる。 The resin material supply module C includes a moving table 15, a resin material accommodating portion 16 mounted on the moving table 15, a resin material charging mechanism 17 for charging the resin material J into the resin material accommodating portion 16, and a resin material accommodating portion 16. It has a resin material supply mechanism 18 that conveys the portion 16 and supplies the resin material J to the cavity 2C of the lower mold. The moving table 15 moves in the X direction and the Y direction in the resin material supply module. The resin material supply mechanism 18 moves in the X direction and the Y direction in the resin material supply module C and the respective resin molding modules B. As the resin material J, a liquid, sheet, tablet, or the like can be used in addition to the granular or powdery resin material.

＜樹脂成形モジュールＢの具体的構成＞
次に、本実施形態における樹脂成形モジュールＢの具体的な構成について以下に説明する。 <Specific configuration of resin molding module B>
Next, the specific configuration of the resin molding module B in this embodiment will be described below.

樹脂成形モジュールＢは、上述したように、図２に示すように、キャビティ２Ｃが形成された下型２と、基板Ｗを保持する上型３と、下型２及び上型３が取り付けられるとともに下型２及び上型３を型締めする型締め機構４とを有する。 As described above, as shown in FIG. 2, the resin molding module B is attached with the lower mold 2 in which the cavity 2C is formed, the upper mold 3 for holding the substrate W, and the lower mold 2 and the upper mold 3. It has a mold clamping mechanism 4 for molding the lower mold 2 and the upper mold 3.

型締め機構４は、下型２が取り付けられる可動盤４１と、上型３が取り付けられる上部固定盤４２と、可動盤４１を昇降移動させるための駆動機構４３とを有している。 The mold clamping mechanism 4 has a movable platen 41 to which the lower mold 2 is attached, an upper fixed platen 42 to which the upper mold 3 is attached, and a drive mechanism 43 for moving the movable platen 41 up and down.

可動盤４１は、その上面に下型２が取り付けられるものであり、下部固定盤４４に立て設けられた複数の支柱部４５により昇降移動可能に支持されている。本実施形態では、左右一対の支柱部４５により可動盤４１が昇降移動可能に支持されている。 The lower mold 2 is attached to the upper surface of the movable platen 41, and the movable platen 41 is supported so as to be movable up and down by a plurality of support columns 45 provided upright on the lower fixed platen 44. In the present embodiment, the movable board 41 is supported by a pair of left and right strut portions 45 so as to be movable up and down.

上部固定盤４２は、その下面に上型３が取り付けられるものであり、左右一対の支柱部４５の上端部において可動盤４１と対向するように固定されている。 The upper mold 3 is attached to the lower surface of the upper fixing plate 42, and is fixed so as to face the movable plate 41 at the upper ends of the pair of left and right strut portions 45.

駆動機構４３は、可動盤４１及び下部固定盤４４の間に設けられており、可動盤４１を昇降移動させることによって下型２及び上型３を型締めするとともに所定の成形圧を加えるものである。本実施形態の駆動機構４３は、サーボモータ等の回転を直線移動に変換するボールねじ機構４３１を用いて可動盤４１に伝達する直動方式のものであるが、サーボモータ等の動力源を例えばトグルリンクなどのリンク機構を用いて可動盤４１に伝達するリンク方式のものであっても良い。 The drive mechanism 43 is provided between the movable platen 41 and the lower fixed platen 44, and by moving the movable platen 41 up and down, the lower mold 2 and the upper mold 3 are molded and a predetermined molding pressure is applied. is there. The drive mechanism 43 of the present embodiment is of a linear motion type that transmits to the movable panel 41 by using a ball screw mechanism 431 that converts the rotation of the servomotor or the like into a linear movement. For example, the power source of the servomotor or the like is used. It may be a link type that transmits to the movable board 41 by using a link mechanism such as a toggle link.

なお本実施形態は、下部固定盤４４、左右一対の支柱部４５及び上部固定盤４２によって、可動盤４１及び駆動機構４３を収容する固定フレーム４０を構成している。 In this embodiment, the lower fixing plate 44, the pair of left and right strut portions 45, and the upper fixing plate 42 constitute a fixed frame 40 for accommodating the movable plate 41 and the drive mechanism 43.

そして、下型２と可動盤４１との間には、下型保持部４６が設けられている。この下型保持部４６は、下型２を加熱するヒータプレート４６１と、当該ヒータプレート４６１の下面に設けられた断熱部材４６２と、ヒータプレート４６１の上面に設けられて下型２の周囲を取り囲む側壁部材４６３と、当該側壁部材４６３の上端に設けられたシール部材４６４とを有している。 A lower mold holding portion 46 is provided between the lower mold 2 and the movable plate 41. The lower mold holding portion 46 is provided on the upper surface of the heater plate 461 for heating the lower mold 2, the heat insulating member 462 provided on the lower surface of the heater plate 461, and the lower surface of the heater plate 461, and surrounds the periphery of the lower mold 2. It has a side wall member 463 and a seal member 464 provided at the upper end of the side wall member 463.

上型３と上部固定盤４２との間には、上型保持部４７が設けられている。この上型保持部４７は、上型３を加熱するヒータプレート４７１と、当該ヒータプレート４７１の上面に設けられた断熱部材４７２と、ヒータプレート４７１の下面に設けられて上型３の周囲を取り囲む側壁部材４７３と、当該側壁部材４７３の下端に設けられたシール部材４７４とを有している。そして、駆動機構４３による型締め時において側壁部材４６３のシール部材４６４及び側壁部材４７３のシール部材４７４が密着して、下型２及び上型３を収容する空間が外気と遮断される。なお、シール部材４６４又はシール部材４７４の一方を設けない構成としても良い。 An upper mold holding portion 47 is provided between the upper mold 3 and the upper fixing plate 42. The upper mold holding portion 47 is provided on the lower surface of the heater plate 471 for heating the upper mold 3, the heat insulating member 472 provided on the upper surface of the heater plate 471, and the lower surface of the heater plate 471, and surrounds the periphery of the upper mold 3. It has a side wall member 473 and a seal member 474 provided at the lower end of the side wall member 473. Then, at the time of mold clamping by the drive mechanism 43, the seal member 464 of the side wall member 463 and the seal member 474 of the side wall member 473 are in close contact with each other, and the space accommodating the lower mold 2 and the upper mold 3 is blocked from the outside air. It should be noted that one of the seal member 464 and the seal member 474 may not be provided.

上型３は、基板Ｗの裏面を吸着して保持するものである。上型３の下面（基板Ｗを保持する基板保持面）には吸着孔（不図示）が形成されており、上型３の内部には吸引流路（不図示）が形成されている。この内部流路は外部の吸引装置（不図示）に接続されている。 The upper mold 3 attracts and holds the back surface of the substrate W. A suction hole (not shown) is formed on the lower surface of the upper mold 3 (the substrate holding surface for holding the substrate W), and a suction flow path (not shown) is formed inside the upper mold 3. This internal flow path is connected to an external suction device (not shown).

下型２には、図２及び図３に示すように、基板Ｗに搭載された電子部品及び樹脂材料Ｊを収容するキャビティ２Ｃが形成されている。具体的に下型２は、キャビティ２Ｃの底面を形成する単一の部材である底面部材２１と、当該底面部材２１を取り囲む側面部材２２とを有している。この底面部材２１の上面と側面部材２２の内周面によってキャビティ２Ｃが形成される。本実施形態の底面部材２１は平面視矩形状をなす平板であり、側面部材２２は平面視矩枠状をなすものである。 As shown in FIGS. 2 and 3, the lower mold 2 is formed with a cavity 2C for accommodating an electronic component mounted on the substrate W and a resin material J. Specifically, the lower mold 2 has a bottom surface member 21 which is a single member forming the bottom surface of the cavity 2C, and a side surface member 22 surrounding the bottom surface member 21. The cavity 2C is formed by the upper surface of the bottom surface member 21 and the inner peripheral surface of the side surface member 22. The bottom surface member 21 of the present embodiment is a flat plate having a rectangular shape in a plan view, and the side surface member 22 has a rectangular frame shape in a plan view.

側面部材２２は、底面部材２１に対して相対的に上下移動可能に設けられている。具体的は、下型２のベースプレート２３に対してコイルばね等の複数の弾性部材２４によって支持されている（図２参照）。 The side surface member 22 is provided so as to be vertically movable relative to the bottom surface member 21. Specifically, the base plate 23 of the lower mold 2 is supported by a plurality of elastic members 24 such as coil springs (see FIG. 2).

そして、本実施形態の下型２は、特に図３に示すように、底面部材２１におけるキャビティ２Ｃの底面とは反対側の面（下面）に接触して設けられた調整部材２５と、底面部材２１との間で調整部材２５を挟むように設けられた挟み部材２６と、調整部材２５を挟んだ状態で挟み部材２６を底面部材２１に締結する締結ボルト２７とを有している。 Further, as shown in FIG. 3, the lower mold 2 of the present embodiment has an adjusting member 25 provided in contact with a surface (lower surface) of the bottom surface member 21 opposite to the bottom surface of the cavity 2C, and a bottom surface member. It has a sandwiching member 26 provided so as to sandwich the adjusting member 25 between the adjusting member 25, and a fastening bolt 27 for fastening the sandwiching member 26 to the bottom surface member 21 with the adjusting member 25 sandwiched between them.

調整部材２５は、型締め時におけるキャビティ２Ｃの底面の形状を直に調整するものであり、図４に示すように、底面部材２１の下面において複数箇所に互いに離間して設けられている。本実施形態の調整部材２５は、例えば円板形状をなし、その中央部に締結ボルト２７が貫通する貫通孔２５Ｈが形成されている。複数の調整部材２５はそれぞれ同一形状をなすものであり、例えばマトリックス状（格子状）に縦横等間隔に設けられている。調整部材２５の材質としては、例えばステンレス鋼又は合金工具鋼等である。 The adjusting member 25 directly adjusts the shape of the bottom surface of the cavity 2C at the time of mold clamping, and is provided at a plurality of locations on the lower surface of the bottom surface member 21 so as to be separated from each other as shown in FIG. The adjusting member 25 of the present embodiment has, for example, a disk shape, and a through hole 25H through which the fastening bolt 27 penetrates is formed in the central portion thereof. The plurality of adjusting members 25 each have the same shape, and are provided, for example, in a matrix shape (lattice shape) at equal intervals in the vertical and horizontal directions. The material of the adjusting member 25 is, for example, stainless steel or alloy tool steel.

挟み部材２６は、平面視において底面部材２１と同一形状をなすものである。また、挟み部材２６は、底面部材２１よりも厚みが大きい平板形状をなしている。この挟み部材２６には、締結ボルト２７を取り付けるための取り付け孔２６Ｈが形成されている。なお、底面部材２１及び挟み部材２６の材質としては、例えばステンレス鋼等である。 The sandwiching member 26 has the same shape as the bottom surface member 21 in a plan view. Further, the sandwiching member 26 has a flat plate shape having a thickness larger than that of the bottom surface member 21. A mounting hole 26H for mounting the fastening bolt 27 is formed in the sandwiching member 26. The material of the bottom surface member 21 and the sandwiching member 26 is, for example, stainless steel.

締結ボルト２７は、挟み部材２６の取り付け孔２６Ｈ及び調整部材２５の貫通孔２５Ｈを介して、底面部材２１の下面に形成されたねじ穴２１１に螺合される。この締結ボルト２７をねじ穴２１１に螺合させることで、底面部材２１及び挟み部材２６の間に調整部材２５が挟持される。ここで、この締結ボルト２７の締め込み量を調整することによって、各調整部材２５の変形量が調整される。その結果、型締め時におけるキャビティ２Ｃの底面の形状が調整され、樹脂成形品Ｐの平坦度が調整される。このとき、底面部材２１の厚みを挟み部材２６の厚みよりも小さくしているので、挟み部材２６よりも底面部材２１が変形しやすく、キャビティ２Ｃの底面の形状が調整しやすくなる。 The fastening bolt 27 is screwed into the screw hole 211 formed on the lower surface of the bottom surface member 21 via the mounting hole 26H of the sandwiching member 26 and the through hole 25H of the adjusting member 25. By screwing the fastening bolt 27 into the screw hole 211, the adjusting member 25 is sandwiched between the bottom surface member 21 and the sandwiching member 26. Here, by adjusting the tightening amount of the fastening bolt 27, the deformation amount of each adjusting member 25 is adjusted. As a result, the shape of the bottom surface of the cavity 2C at the time of mold clamping is adjusted, and the flatness of the resin molded product P is adjusted. At this time, since the thickness of the bottom surface member 21 is made smaller than the thickness of the sandwiching member 26, the bottom surface member 21 is more easily deformed than the sandwiching member 26, and the shape of the bottom surface of the cavity 2C is easily adjusted.

また、本実施形態の下型２は、樹脂成形品Ｐの離型性を向上させるために離型フィルム２８で覆われる。ここで、底面部材２１の下面に調整部材２５を設けたことに伴い、離型フィルム２８をキャビティ２Ｃの内面に密着させるための吸引流路Ｒ１が側面部材２２に形成されている。具体的には、側面部材２２の内側面に吸引流路Ｒ１の開口（吸引口Ｒ１ａ）が形成されている。また、外部の吸引装置に接続される接続口は側面部材２２の底面に形成されており、例えばベースプレート２３に形成された吸引用の内部流路（不図示）に接続されている。なお、側面部材２２は弾性部材２４によって移動する部材のため、側面部材２２の吸引流路Ｒ１とベースプレート２３の内部流路とはシール部材（不図示）によってシールされている。 Further, the lower mold 2 of the present embodiment is covered with a mold release film 28 in order to improve the mold releasability of the resin molded product P. Here, with the provision of the adjusting member 25 on the lower surface of the bottom surface member 21, a suction flow path R1 for bringing the release film 28 into close contact with the inner surface of the cavity 2C is formed on the side surface member 22. Specifically, an opening (suction port R1a) of the suction flow path R1 is formed on the inner surface of the side surface member 22. Further, a connection port connected to an external suction device is formed on the bottom surface of the side member 22, and is connected to, for example, an internal flow path for suction (not shown) formed on the base plate 23. Since the side surface member 22 is a member that is moved by the elastic member 24, the suction flow path R1 of the side surface member 22 and the internal flow path of the base plate 23 are sealed by a seal member (not shown).

また、側面部材２２の内側面に形成された吸引口Ｒ１ａから空気を吸引しやすくするために、側面部材２２の内側面に対向する底面部材２１の外側面には溝２１Ｍが形成されている。この溝２１Ｍは、底面部材２１の外側面において全周に亘って形成されていても良いし、吸引口Ｒ１ａを含む所定範囲に亘って形成されていても良い。このように底面部材２１の外側面に溝２１Ｍを形成することによって、吸引口Ｒ１ａから空気を吸引しやすくできる。また、底面部材２１と側面部材２２の接触面積を減らすことができ、底面部材２１に対する側面部材２２のスライド移動を容易にすることができる。 Further, in order to facilitate suction of air from the suction port R1a formed on the inner side surface of the side surface member 22, a groove 21M is formed on the outer surface of the bottom surface member 21 facing the inner side surface of the side surface member 22. The groove 21M may be formed on the outer surface of the bottom surface member 21 over the entire circumference, or may be formed over a predetermined range including the suction port R1a. By forming the groove 21M on the outer surface of the bottom surface member 21 in this way, it is possible to easily suck air from the suction port R1a. Further, the contact area between the bottom surface member 21 and the side surface member 22 can be reduced, and the side surface member 22 can be easily slid with respect to the bottom surface member 21.

その他、側面部材２２の上面には、離型フィルム２８を側面部材２２の上面に保持するための外側吸着溝２２１が形成されている。この外側吸着溝２２１は、側面部材２２の上面において全周に亘って連続的に又は間欠的に形成されている。また、側面部材２２の上面には、離型フィルム２８に張力を加えるための内側吸着溝２２２が形成されている。この内側吸着溝２２２は、外側吸着溝２２１の内側に形成されており、側面部材２２の上面において全周に亘って連続的に又は間欠的に形成されている。そして、側面部材２２には、外側吸着溝２２１に接続される吸引流路Ｒ２が形成されており、内側吸着溝２２２に接続される吸引流路Ｒ３が形成されている。これら吸引流路Ｒ２、Ｒ３は、上記の吸引流路Ｒ１と同様に、例えばベースプレート２３に形成された内部流路（不図示）に接続される。 In addition, an outer suction groove 221 for holding the release film 28 on the upper surface of the side surface member 22 is formed on the upper surface of the side surface member 22. The outer suction groove 221 is continuously or intermittently formed on the upper surface of the side surface member 22 over the entire circumference. Further, an inner suction groove 222 for applying tension to the release film 28 is formed on the upper surface of the side surface member 22. The inner suction groove 222 is formed inside the outer suction groove 221 and is continuously or intermittently formed on the upper surface of the side surface member 22 over the entire circumference. The side surface member 22 is formed with a suction flow path R2 connected to the outer suction groove 221 and a suction flow path R3 connected to the inner suction groove 222. These suction flow paths R2 and R3 are connected to, for example, an internal flow path (not shown) formed on the base plate 23, similarly to the suction flow path R1 described above.

＜樹脂成形装置１００の動作＞
この樹脂成形装置１００における樹脂成形（樹脂封止）の動作について図１、図５〜図７を参照して説明する。 <Operation of resin molding apparatus 100>
The operation of resin molding (resin sealing) in the resin molding apparatus 100 will be described with reference to FIGS. 1, 5 and 7.

まず基板供給・収納モジュールＡにおいて、基板供給部１１から基板載置部１３に封止前基板Ｗを送り出す。次に、所定の待機位置にある基板搬送機構１４を移動させて、基板載置部１３から封止前基板Ｗを受け取る（図１参照）。そして、基板搬送機構１４を樹脂成形モジュールＢに移動させて、封止前基板Ｗを型開きされた上型３に保持する（図５参照）。その後、基板搬送機構１４を、所定の待機位置に戻す。 First, in the substrate supply / storage module A, the pre-sealed substrate W is sent from the substrate supply unit 11 to the substrate mounting unit 13. Next, the substrate transfer mechanism 14 at the predetermined standby position is moved to receive the pre-sealed substrate W from the substrate mounting portion 13 (see FIG. 1). Then, the substrate transfer mechanism 14 is moved to the resin molding module B, and the substrate W before sealing is held in the mold-opened upper mold 3 (see FIG. 5). After that, the substrate transport mechanism 14 is returned to a predetermined standby position.

一方、樹脂材料供給モジュールＣにおいて、離型フィルム２８を所定の形状にし、所定の待機位置にある移動テーブル１５を移動させて、その上に離型フィルム２８と枠部材（不図示）とを順次載置して樹脂材料収容部１６とする。その後、樹脂材料収容部１６を樹脂材料投入機構１７に移動させる（図１参照）。次に、樹脂材料投入機構１７から樹脂材料収容部１６の枠部材の内側に所定量の樹脂材料Ｊを投入する。その後、移動テーブル１５を所定の待機位置に戻す。 On the other hand, in the resin material supply module C, the release film 28 is formed into a predetermined shape, the moving table 15 at the predetermined standby position is moved, and the release film 28 and the frame member (not shown) are sequentially placed on the moving table 15. It is placed and used as the resin material accommodating portion 16. After that, the resin material accommodating portion 16 is moved to the resin material charging mechanism 17 (see FIG. 1). Next, a predetermined amount of the resin material J is charged from the resin material charging mechanism 17 into the frame member of the resin material accommodating portion 16. After that, the moving table 15 is returned to a predetermined standby position.

次に、所定の待機位置にある樹脂材料供給機構１８を移動させて、移動テーブル１５から樹脂材料Jを収容した樹脂材料収容部１６を受け取る。そして、樹脂材料供給機構１８を樹脂成形モジュールＢに移動させて、樹脂材料収容部１６の離型フィルム２８と樹脂材料収容部１６に収容されている樹脂材料Ｊとを型開きされた下型２のキャビティ２Ｃに供給する（図５参照）。その後、樹脂材料供給機構１８を、所定の待機位置に戻す。なお、離型フィルム２８は、樹脂材料Jをキャビティ２Ｃに供給する前に密着させてもよい。 Next, the resin material supply mechanism 18 at the predetermined standby position is moved to receive the resin material accommodating portion 16 accommodating the resin material J from the moving table 15. Then, the resin material supply mechanism 18 is moved to the resin molding module B, and the release film 28 of the resin material accommodating portion 16 and the resin material J accommodating in the resin material accommodating portion 16 are molded into the lower mold 2. (See FIG. 5). After that, the resin material supply mechanism 18 is returned to a predetermined standby position. The release film 28 may be brought into close contact with the resin material J before being supplied to the cavity 2C.

ここで、下型２はヒータプレート４６１によって予め所定温度に加熱されており、樹脂材料Ｊは軟化又は溶融した状態である。 Here, the lower mold 2 is preheated to a predetermined temperature by the heater plate 461, and the resin material J is in a softened or melted state.

上記の工程の後、樹脂成形モジュールＢにおいて、駆動機構４３によって可動盤４１を上昇させて、上型保持部４７のシール部材４７４と下型保持部４６のシール部材４６４とを密着させることで密閉空間を形成する（図６参照）。この状態で、図示しない排気機構によって密閉空間を真空状態とする。 After the above steps, in the resin molding module B, the movable platen 41 is raised by the drive mechanism 43, and the seal member 474 of the upper mold holding portion 47 and the seal member 464 of the lower mold holding portion 46 are brought into close contact with each other to seal the resin molding module B. Form a space (see FIG. 6). In this state, the closed space is evacuated by an exhaust mechanism (not shown).

そして、駆動機構４３によって可動盤４１を更に上昇させて、側面部材２２が上型３に押されて弾性部材２４が圧縮変形するとともに、基板Ｗの電子部品が樹脂材料Ｊに浸漬するとともに基板Ｗの部品搭載面が樹脂材料Ｊにより被覆される。この状態で下型２と上型３とは所定の成形圧により型締めされる（図６参照）。所定時間が経過した後、型締め機構により下型２を下降させて下型２と上型３とを型開きする（図７参照）。なお、型締めの途中で、密閉空間を大気圧に戻しても良い。 Then, the movable platen 41 is further raised by the drive mechanism 43, the side surface member 22 is pushed by the upper mold 3, the elastic member 24 is compressed and deformed, the electronic components of the substrate W are immersed in the resin material J, and the substrate W is immersed. The component mounting surface of the above is covered with the resin material J. In this state, the lower mold 2 and the upper mold 3 are molded by a predetermined molding pressure (see FIG. 6). After a predetermined time has elapsed, the lower mold 2 is lowered by the mold clamping mechanism to open the lower mold 2 and the upper mold 3 (see FIG. 7). The closed space may be returned to atmospheric pressure during mold clamping.

次に、基板供給・収納モジュールＡの基板搬送機構１４を移動させて、型開きされた上型３から封止済基板Ｗを受け取る。基板搬送機構１４を基板載置部１３に移動させて、基板載置部１３に封止済基板Ｗを受け渡す（図１参照）。基板載置部１３から基板収納部１２に封止済基板Ｗを収納する。このようにして、樹脂封止が完了する。 Next, the substrate transfer mechanism 14 of the substrate supply / storage module A is moved to receive the sealed substrate W from the mold-opened upper mold 3. The substrate transfer mechanism 14 is moved to the substrate mounting portion 13 and the sealed substrate W is delivered to the substrate mounting portion 13 (see FIG. 1). The sealed substrate W is stored in the substrate storage portion 12 from the substrate mounting portion 13. In this way, the resin sealing is completed.

＜本実施形態の効果＞
本実施形態の樹脂成形装置１００によれば、キャビティ２Ｃの底面を形成する底面部材２１の底面とは反対側の下面に接触して調整部材２５を設けているので、キャビティ２Ｃの底面の形状を調整しやすくなり、樹脂成形品Ｐの厚みのばらつきを低減することができる。 <Effect of this embodiment>
According to the resin molding apparatus 100 of the present embodiment, since the adjusting member 25 is provided in contact with the lower surface of the bottom surface member 21 forming the bottom surface of the cavity 2C on the opposite side to the bottom surface, the shape of the bottom surface of the cavity 2C can be changed. It becomes easy to adjust, and the variation in the thickness of the resin molded product P can be reduced.

また、本実施形態では、調整部材２５を複数箇所に設けているので、キャビティ２Ｃの底面の形状を複数箇所で調整できるようにすることができ、樹脂成形品Ｐの厚みのばらつきを一層低減することができる。 Further, in the present embodiment, since the adjusting members 25 are provided at a plurality of locations, the shape of the bottom surface of the cavity 2C can be adjusted at a plurality of locations, and the variation in the thickness of the resin molded product P can be further reduced. be able to.

さらに、本実施形態では、調整部材２５の高さ寸法（厚み寸法）を異ならせることによってキャビティ２Ｃの底面の形状を調整することができ、その結果、樹脂成形品Ｐの厚みのばらつきを一層低減することができる。 Further, in the present embodiment, the shape of the bottom surface of the cavity 2C can be adjusted by making the height dimension (thickness dimension) of the adjusting member 25 different, and as a result, the variation in the thickness of the resin molded product P is further reduced. can do.

その上、調整部材２５に形成された貫通孔２５Ｈを貫通させて締結ボルト２７を締結しているので、調整部材２５の位置ずれを防ぐとともに、締結ボルト２７の締め込みによって調整部材２５の変形量を調整しやすくすることができる。 Further, since the fastening bolt 27 is fastened by penetrating the through hole 25H formed in the adjusting member 25, the adjustment member 25 is prevented from being displaced, and the amount of deformation of the adjusting member 25 due to the tightening of the fastening bolt 27 is achieved. Can be easily adjusted.

＜その他の変形実施形態＞
なお、本発明は前記実施形態に限られるものではない。 <Other modified embodiments>
The present invention is not limited to the above embodiment.

例えば、前記実施形態では、下型２を型締め方向において複数の部材に分割し、分割した部材（底面部材２１及び挟み部材２６）の間に調整部材２５を設けた構成であったが、上型３も下型２と同様に構成しても良い。つまり、上型３を締め込み方向において複数の部材に分割し、分割した部材の間に調整部材を設けても良い。 For example, in the above-described embodiment, the lower mold 2 is divided into a plurality of members in the mold clamping direction, and the adjusting member 25 is provided between the divided members (bottom member 21 and sandwiching member 26). The mold 3 may be configured in the same manner as the lower mold 2. That is, the upper die 3 may be divided into a plurality of members in the tightening direction, and an adjusting member may be provided between the divided members.

また、前記実施形態の他、底面部材２１及び挟み部材２６の間に挟んで締結ボルト２７で締結することによって、当該締結ボルト２７の締め込み量を調整するようにしても良い。また、調整部材２５の材質、断面形状又は断面積を異ならせることによってキャビティ２Ｃの底面の形状を調整するようにしても良い。その他、複数の調整部材２５の配置によってキャビティ２Ｃの底面の形状を調整するようにしても良い。例えば、複数の調整部材を底面部材の中央部に密に配置し、端部に疎に配置することが考えられる。 Further, in addition to the above-described embodiment, the tightening amount of the fastening bolt 27 may be adjusted by sandwiching it between the bottom surface member 21 and the sandwiching member 26 and fastening it with the fastening bolt 27. Further, the shape of the bottom surface of the cavity 2C may be adjusted by changing the material, the cross-sectional shape, or the cross-sectional area of the adjusting member 25. In addition, the shape of the bottom surface of the cavity 2C may be adjusted by arranging a plurality of adjusting members 25. For example, it is conceivable that a plurality of adjusting members are densely arranged at the center of the bottom surface member and sparsely arranged at the ends.

さらに、前記実施形態では、１つの調整部材２５に対して１つの締結ボルト２７を設けているが、例えば長尺状をなす１つの調整部材２５に複数の貫通孔２５Ｈを形成し、当該複数の貫通孔２５Ｈそれぞれに締結ボルト２７を設けて、それら締結ボルト２７の締め付け力を調整することによって１つの調整部材２５において部分的に変形量を調整する構成としても良い。その他、調整部材２５に貫通孔２５Ｈを形成せずに、調整部材２５の側方において締結ボルト２７により締結することによって調整部材２５の変形量を調整する構成としても良い。 Further, in the above-described embodiment, one fastening bolt 27 is provided for one adjusting member 25. For example, a plurality of through holes 25H are formed in one elongated adjusting member 25, and the plurality of through holes 25H are formed. A fastening bolt 27 may be provided in each of the through holes 25H, and the amount of deformation may be partially adjusted in one adjusting member 25 by adjusting the tightening force of the fastening bolt 27. In addition, the amount of deformation of the adjusting member 25 may be adjusted by fastening with fastening bolts 27 on the side of the adjusting member 25 without forming the through hole 25H in the adjusting member 25.

前記実施形態では、調整部材を底面部材と挟み部材で挟む構成であったが、調整部材を底面部材の下面に接触して固定する構造であれば、前記実施形態に限られない。 In the above embodiment, the adjusting member is sandwiched between the bottom surface member and the sandwiching member, but the structure is not limited to the above embodiment as long as the adjusting member is in contact with and fixed to the lower surface of the bottom surface member.

その上、前記実施形態では、挟み部材２６の下面がベースプレート２３に接触して、調整部材２５とベースプレート２３との間のスペーサとしての機能を発揮するものであったが、挟み部材２６の下面とベースプレート２３との間にスペーサの役割を果たす別部材を設ける構成としても良い。 Further, in the above-described embodiment, the lower surface of the sandwiching member 26 comes into contact with the base plate 23 and functions as a spacer between the adjusting member 25 and the base plate 23. A separate member acting as a spacer may be provided between the base plate 23 and the base plate 23.

前記実施形態の調整部材２５に加えて、下型２のヒータプレート４６１と可動盤４１との間に設けられる断熱部材４６２を用いてキャビティ２Ｃの底面の形状を調整しても良い。例えば、断熱部材４６２を複数の柱状部材とし、当該複数の柱状部材によって可動盤４１の撓みを大まかに打ち消す粗動調整として用い、前記実施形態の調整部材２５を微調整として用いることが考えられる。 In addition to the adjusting member 25 of the above embodiment, the shape of the bottom surface of the cavity 2C may be adjusted by using a heat insulating member 462 provided between the heater plate 461 of the lower mold 2 and the movable platen 41. For example, it is conceivable to use the heat insulating member 462 as a plurality of columnar members, use the plurality of columnar members as coarse motion adjustment for roughly canceling the bending of the movable platen 41, and use the adjusting member 25 of the embodiment as a fine adjustment.

前記実施形態においては、基板供給・収納モジュールＡと樹脂材料供給モジュールＣとの間に、２個の樹脂成形モジュールＢを接続した構成であるが、基板供給・収納モジュールＡと樹脂材料供給モジュールＣとを１つのモジュールにして、そのモジュールに樹脂成形モジュールＢを接続した構成としても良い。また、樹脂成形装置は、前記実施形態のように各モジュールにモジュール化されていなくても良い。 In the above embodiment, two resin molding modules B are connected between the substrate supply / storage module A and the resin material supply module C, but the substrate supply / storage module A and the resin material supply module C are connected. And may be made into one module, and the resin molding module B may be connected to the module. Further, the resin molding apparatus does not have to be modularized in each module as in the above embodiment.

その他、本発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能であるのは言うまでもない。 In addition, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

１００・・・樹脂成形装置
Ｗ ・・・基板（封止前基板、封止済基板）
Ｐ ・・・樹脂成形品
Ａ ・・・基板供給・収納モジュール
Ｂ ・・・樹脂成形モジュール
Ｃ ・・・樹脂材料供給モジュール
Ｊ ・・・樹脂材料
１１ ・・・基板供給部
１２ ・・・基板収納部
１３ ・・・基板載置部
１４ ・・・基板搬送機構
２Ｃ ・・・キャビティ
２ ・・・下型
３ ・・・上型
４ ・・・型締め機構
１５ ・・・移動テーブル
１６ ・・・樹脂材料収容部
１７ ・・・樹脂材料投入機構
１８ ・・・樹脂材料供給機構
４０ ・・・固定フレーム
４１ ・・・可動盤
４２ ・・・上部固定盤
４３ ・・・駆動機構
４３１・・・ボールねじ機構
４４ ・・・下部固定盤
４５ ・・・支柱部
４６ ・・・下型保持部
４６１・・・ヒータプレート
４６２・・・断熱部材
４６３・・・側壁部材
４６４・・・シール部材
４７ ・・・上型保持部
４７１・・・ヒータプレート
４７２・・・断熱部材
４７３・・・側壁部材
４７４・・・シール部材
２１ ・・・底面部材
２１Ｍ・・・溝
２１１・・・ねじ穴
２２ ・・・側面部材
２２１・・・外側吸着溝
２２２・・・内側吸着溝
Ｒ１ ・・・吸引流路
Ｒ１ａ・・・吸引口
Ｒ２ ・・・吸引流路
Ｒ３ ・・・吸引流路
２３ ・・・ベーススレート
２４ ・・・弾性部材
２５ ・・・調整部材
２５Ｈ・・・貫通孔
２６ ・・・挟み部材
２６Ｈ・・・取り付け孔
２７ ・・・締結ボルト
２８ ・・・離型フィルム 100 ... Resin molding device W ... Substrate (pre-sealed substrate, sealed substrate)
P ・ ・ ・ Resin molded product A ・ ・ ・ Substrate supply / storage module B ・ ・ ・ Resin molding module C ・ ・ ・ Resin material supply module J ・ ・ ・ Resin material 11 ・ ・ ・ Substrate supply unit 12 ・ ・ ・ Substrate storage Part 13 ・ ・ ・ Board mounting part 14 ・ ・ ・ Board transfer mechanism 2C ・ ・ ・ Cavity 2 ・ ・ ・ Lower mold 3 ・ ・ ・ Upper mold 4 ・ ・ ・ Mold tightening mechanism 15 ・ ・ ・ Moving table 16 ・ ・ ・Resin material accommodating part 17 ・ ・ ・ Resin material input mechanism 18 ・ ・ ・ Resin material supply mechanism 40 ・ ・ ・ Fixed frame 41 ・ ・ ・ Movable board 42 ・ ・ ・ Upper fixed board 43 ・ ・ ・ Drive mechanism 431 ・ ・ ・ Ball Screw mechanism 44 ・ ・ ・ Lower fixing plate 45 ・ ・ ・ Support column 46 ・ ・ ・ Lower mold holding part 461 ・ ・ ・ Heater plate 462 ・ ・ ・ Insulation member 463 ・ ・ ・ Side wall member 464 ・ ・ ・ Seal member 47 ・ ・・ Upper mold holding part 471 ・ ・ ・ Heater plate 472 ・ ・ ・ Insulation member 473 ・ ・ ・ Side wall member 474 ・ ・ ・ Seal member 21 ・ ・ ・ Bottom member 21M ・ ・ ・ Groove 211 ・ ・ ・ Screw hole 22 ・ ・ ・Side member 221 ・ ・ ・ Outer suction groove 222 ・ ・ ・ Inner suction groove R1 ・ ・ ・ Suction flow path R1a ・ ・ ・ Suction port R2 ・ ・ ・ Suction flow path R3 ・ ・ ・ Suction flow path 23 ・ ・ ・ Base slate 24・ ・ ・ Elastic member 25 ・ ・ ・ Adjusting member 25H ・ ・ ・ Through hole 26 ・ ・ ・ Holding member 26H ・ ・ ・ Mounting hole 27 ・ ・ ・ Fastening bolt 28 ・ ・ ・ Release film

Claims (6)

キャビティを有する第１の成形型と、当該第１の成形型に対向配置された第２の成形型とを有し、前記第１の成形型及び前記第２の成形型を型締めして樹脂成形品を圧縮成形する樹脂成形装置であって、
前記第１の成形型は、
前記キャビティの底面を形成する平板形状の底面部材と、
前記底面部材の前記底面とは反対側の面に接触して型締め時における前記底面の形状を調整する複数の調整部材と、
前記底面部材との間で前記調整部材を挟むように設けられた挟み部材とを有し、
前記底面部材の厚みは、前記挟み部材の厚みよりも小さく、
複数の前記調整部材は、各々が独立して高さ寸法を異ならせることにより前記底面部材の変形量を部分的に調整し、前記樹脂成形品の平坦度を調整する、樹脂成形装置。 It has a first molding die having a cavity and a second molding die arranged to face the first molding die, and the first molding die and the second molding die are molded to form a resin. A resin molding device that compresses molded products.
The first molding mold is
A flat plate-shaped bottom member forming the bottom surface of the cavity,
A plurality of adjusting members that come into contact with the surface of the bottom surface member opposite to the bottom surface to adjust the shape of the bottom surface at the time of mold clamping .
It has a sandwiching member provided so as to sandwich the adjusting member with the bottom surface member.
The thickness of the bottom member is smaller than the thickness of the sandwiching member.
A resin molding apparatus in which the plurality of adjusting members partially adjust the amount of deformation of the bottom surface member by independently differentizing the height dimensions, and adjust the flatness of the resin molded product. 前記調整部材は、前記底面部材の下面の複数箇所に設けられている、請求項１記載の樹脂成形装置。 The resin molding apparatus according to claim 1, wherein the adjusting member is provided at a plurality of locations on the lower surface of the bottom surface member. 前記第１の成形型は、
前記調整部材を挟んだ状態で前記挟み部材を前記底面部材に締結する締結ボルトをさらに有する、請求項１又は２記載の樹脂成形装置。 The first molding mold is
The resin molding apparatus according to claim 1 or 2, further comprising a fastening bolt for fastening the sandwiching member to the bottom surface member while sandwiching the adjusting member. 前記調整部材には、前記締結ボルトが貫通する貫通孔が形成されており、
前記締結ボルトは、前記貫通孔を貫通した状態で前記挟み部材を前記底面部材に締結する、請求項３記載の樹脂成形装置。 The adjusting member is formed with a through hole through which the fastening bolt penetrates.
The resin molding apparatus according to claim 3, wherein the fastening bolt fastens the sandwiching member to the bottom surface member while penetrating the through hole. 前記第１の成形型は、前記底面部材を取り囲むとともに前記キャビティを形成する側面部材をさらに有し、
前記側面部材には、前記キャビティ内の空気を吸引するための吸引流路が形成されている、請求項１乃至４の何れか一項に記載の樹脂成形装置。 The first molding mold further has a side member that surrounds the bottom member and forms the cavity.
The resin molding apparatus according to any one of claims 1 to 4, wherein a suction flow path for sucking air in the cavity is formed in the side surface member. 請求項１乃至５の何れか一項に記載の樹脂成形装置を用いた樹脂成形品の製造方法。 A method for producing a resin molded product using the resin molding apparatus according to any one of claims 1 to 5.
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