TWI740109B - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The present invention relates a resin molding apparatus for reducing a variation in thickness of a resin molded product, and a resin molded product manufacturing method. The resin molding apparatus includes: a first mold having a cavity; and a second mold arranged opposite to the first mold and molds a resin molded product by clamping the first mold and the second mold. In addition, the first mold includes: a bottom surface member forming the bottom surface of the cavity; and adjustment members that are in contact with a surface on the side opposite to the bottom surface of the bottom surface member and adjust the shape of the bottom surface when clamping the molds.

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

As a technique for suppressing the thickness unevenness of the molded resin molded product in a resin molding apparatus using compression molding, a technique shown in Patent Document 1 is conceivable.

In the resin molding apparatus of Patent Document 1, a heat insulating member including a plurality of columnar members is arranged between a heater plate that heats a molding die and a platen that supports the heater plate . In addition, the amount of deformation of the plurality of columnar members eliminates the deflection of the platen at the time of mold-clamping, thereby suppressing the thickness unevenness of the resin molded product. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-43035

[The problem to be solved by the invention] However, with the recent reduction in thickness and accuracy of resin molded products, there is a demand for further reduction in thickness unevenness.

The reason for the uneven thickness of the resin molded product will be described with reference to FIG. 1 of Patent Document 1. First, it can be considered that according to the deformation of the first platen 11, the shapes of the lower mold 161 and the cavity 1612 are deformed. The reason for this deformation can be considered to be that the power is concentrated on the pressure generated when the mold is closed, which transmits the power from the driving mechanism such as the toggle link (toggle link) 133 to the load point of the first platen 11, and the pressure when the mold is closed. The resulting pressure of the upper mold 162 and the like is balanced. As the second cause, it can be considered that it is caused by the uneven temperature distribution of the first platen 11. A heat insulating member is arranged so that the heat of the heating plate 151 and the heating plate 152 is not transferred to the first platen 11 and the second platen 12. However, it is difficult to completely insulate and transfer a small amount of heat. It can be considered that the heat causes a temperature difference between a part of the first platen 11 and the second platen 12 to deform.

Therefore, the main subject of the present invention is to reduce the thickness unevenness of the resin molded product. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention includes a first molding die having a cavity, and a second molding die disposed opposite to the first molding die, and the first molding die and the second molding die are combined. The resin molding apparatus is characterized in that the first molding die includes: a bottom surface member forming a bottom surface of the cavity; and an adjustment member, and the bottom surface of the bottom surface member The shape of the bottom surface at the time of mold clamping is adjusted for surface contact on the opposite side. [Effects of the invention]

According to the present invention constituted as described above, it is possible to reduce the thickness unevenness of the resin molded product.

Then, the present invention will be further described in detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention includes a first molding die having a cavity, and a second molding die disposed opposite to the first molding die, so that the first molding die and the second molding die The resin molding apparatus is characterized in that the first molding die includes: a bottom surface member forming a bottom surface of the cavity; and an adjustment member, which is connected to the bottom surface member The bottom surface is in contact with the opposite side surface, and the shape of the bottom surface at the time of mold clamping is adjusted. In the case of the above-mentioned resin molding apparatus, an adjustment member is provided in contact with the surface opposite to the bottom surface of the bottom surface members forming the bottom surface of the cavity. Therefore, the shape of the bottom surface of the cavity can be easily adjusted and the resin molded product can be reduced. The thickness is uneven.

The adjustment member is preferably provided at a plurality of locations on the surface of the bottom surface member opposite to the bottom surface. With this configuration, the shape of the bottom surface of the cavity can be adjusted at a plurality of locations, so that the thickness unevenness of the resin molded product can be further reduced.

Preferably, the first forming mold further includes: a clamping member provided so as to sandwich the adjustment member with the bottom surface member; The clamping member is fastened to the bottom surface member. With the above structure, the height dimension (thickness dimension) of the adjusting member is different, and the amount of tightening bolts is adjusted to adjust the shape of the bottom surface of the cavity. As a result, the thickness of the resin molded product can be further reduced. Uneven.

In addition, by adjusting the screwing amount of the fastening bolt, the thickness (deformation amount) of the adjustment member can be fine-tuned without replacing the adjustment member. As a result, it is possible to further reduce the thickness unevenness of the resin molded product.

In order to easily adjust the shape of the bottom surface of the cavity or the thickness (deformation amount) of the adjustment member by the amount of screwing of the fastening bolt, it is preferable that the adjustment member is formed with a through hole through which the fastening bolt penetrates The fastening bolt fastens the clamping member to the bottom surface member in a state where the fastening bolt penetrates the through hole.

On the inner surface of the cavity of the first molding die, there are cases in which the release film is brought into close contact with each other in order to facilitate the release of the resin molded product. At this time, in the first molding die, a suction flow path that sucks air so that the release film is in close contact with the inner surface of the cavity is formed. In order to easily form the suction flow path in the structure in which the adjustment member is provided on the lower surface of the bottom surface member, it is preferable that the first forming mold further includes a side member that surrounds the bottom surface member and forms the cavity, In the side member, a suction flow path for sucking air in the cavity is formed.

In addition, a method of manufacturing a resin molded product using the resin molding apparatus is also an aspect of the present invention.

<One embodiment of the present invention> Hereinafter, one embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, in order to facilitate understanding, all the figures shown below are schematically depicted in an appropriately omitted or exaggerated manner. Regarding the same constituent elements, the same reference numerals are assigned, and the description is appropriately omitted.

<The overall structure of the resin molding apparatus 100> The resin molding apparatus 100 of the present embodiment is an apparatus for manufacturing a resin molded product P by sealing the component mounting surface on which the electronic components are mounted with resin on the substrate W on which the electronic components are mounted. In addition, as the substrate, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a lead frame, etc. can be cited.

As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply and storage module A, two resin molding modules B and a resin material supply module C, as constituent elements. Each constituent element (each module A to module C) is detachable and replaceable with respect to each constituent element.

The substrate supply and storage module A includes the substrate supply unit 11 for supplying the substrate W before sealing, the substrate storage unit 12 for storing the sealed substrate W (resin molded product P), and the substrate mounting for the transfer of the sealed substrate W and the sealed substrate W Section 13 and a substrate transport mechanism 14 that transports the substrate W before sealing and the substrate W after sealing. The substrate placement section 13 moves in the Y direction between a position corresponding to the substrate supply section 11 and a position corresponding to the substrate storage section 12 in the substrate supply and storage module A. The substrate transport mechanism 14 moves in the X direction and the Y direction in the substrate supply and storage module A and each resin molding module B.

Each resin molding module B includes a first molding die formed with a cavity 2C, which is a lower mold 2, a second molding die that holds the substrate W, which is an upper mold 3, and a mold clamping mechanism that closes the lower mold 2 and the upper mold 3 4. The specific structure will be described later.

The resin material supply module C includes a moving table 15, a resin material accommodating part 16 placed on the moving table 15, a resin material input mechanism 17 that puts the resin material J into the resin material accommodating part 16, and a conveying resin material accommodating part 16. On the other hand, the resin material supply mechanism 18 supplies the resin material J to the cavity 2C of the lower mold. The moving table 15 moves in the X direction and the Y direction in the resin material supply module. The resin material supply mechanism 18 moves in the X direction and the Y direction in the resin material supply module C and each resin molding module B. In addition, the resin material J can also use resin materials in a liquid form, a sheet form, a tablet form, etc., in addition to a pelletized or powdered resin material.

<Specific structure of resin molding module B> Next, the specific structure of the resin molding module B in this embodiment will be described below.

The resin molding module B, as described above, as shown in FIG. 2, includes a lower mold 2 formed with a cavity 2C, an upper mold 3 holding a substrate W, and a lower mold 2 and an upper mold 3 installed and a lower mold 2 and an upper mold Clamping mechanism 4 for mold 3 clamping.

The mold clamping mechanism 4 includes a movable disk 41 to which the lower mold 2 is installed, an upper fixed disk 42 to which the upper mold 3 is installed, and a driving mechanism 43 for moving the movable disk 41 up and down.

The movable plate 41 is a member to which the lower mold 2 is mounted on the upper surface thereof, and is supported by a plurality of pillar portions 45 erected on the lower fixed plate 44 so as to move up and down. In this embodiment, the movable platen 41 is supported by a pair of left and right pillar portions 45 so as to be vertically movable.

The upper fixed disk 42 is a member to which the upper mold 3 is mounted on the lower surface thereof, and is fixed to the upper end portions of the pair of left and right pillar portions 45 so as to face the movable disk 41.

The drive mechanism 43 is provided between the movable disk 41 and the lower fixed disk 44, and by moving the movable disk 41 up and down, the lower mold 2 and the upper mold 3 are closed, and a predetermined molding pressure is applied. The drive mechanism 43 of this embodiment is a linear motion mechanism that transmits the rotation to the movable plate 41 using a ball screw mechanism 431 that converts the rotation of a servo motor or the like into linear motion. A link mechanism such as a toggle link transmits a power source such as a servo motor to the movable disk 41.

In addition, in this embodiment, the lower fixed plate 44, the pair of left and right pillar portions 45, and the upper fixed plate 42 constitute a fixed frame 40 that houses the movable plate 41 and the drive mechanism 43.

In addition, a lower mold holding portion 46 is provided between the lower mold 2 and the movable disk 41. The lower mold holding portion 46 includes a heating plate 461 for heating the lower mold 2, an insulating member 462 provided on the lower surface of the heating plate 461, and an upper surface of the heating plate 461 to surround the periphery of the lower mold 2. The side wall member 463 and the sealing member 464 provided at the upper end of the side wall member 463.

An upper mold holding portion 47 is provided between the upper mold 3 and the upper fixed disk 42. The upper mold holding portion 47 includes a heating plate 471 for heating the upper mold 3, a heat insulating member 472 provided on the upper surface of the heating plate 471, and a lower surface of the heating plate 471 to surround the upper mold 3. The side wall member 473 and the sealing member 474 provided at the lower end of the side wall member 473. In addition, when the mold is clamped by the drive mechanism 43, the sealing member 464 of the side wall member 463 and the sealing member 474 of the side wall member 473 are in close contact, and the space accommodating the lower mold 2 and the upper mold 3 is isolated from the outside air. In addition, it is also possible to set it as the structure which does not provide either the sealing member 464 or the sealing member 474.

The upper mold 3 is a member that sucks and holds the back surface of the substrate W. A suction hole (not shown) is formed on the lower surface of the upper mold 3 (a substrate holding surface that holds the substrate W), and a suction flow path (not shown) is formed in the upper mold 3. The internal flow path is connected to an external suction device (not shown).

In the lower mold 2, as shown in FIGS. 2 and 3, a cavity 2C for accommodating electronic components mounted on the substrate W and a resin material J is formed. Specifically, the lower mold 2 includes a bottom surface member 21 which is a single member forming the bottom surface of the cavity 2C, and a side member 22 surrounding the bottom surface member 21. The upper surface of the bottom surface member 21 and the inner peripheral surface of the side surface member 22 form a cavity 2C. The bottom surface member 21 of the present embodiment is a flat plate having a rectangular shape in a plan view, and the side member 22 is a rectangular frame-shaped member in a plan view.

The side member 22 is provided so as to be relatively movable up and down with respect to the bottom surface member 21. Specifically, it is supported on the bottom plate 23 of the lower mold 2 by a plurality of elastic members 24 such as coil springs (refer to FIG. 2 ).

In addition, the lower mold 2 of the present embodiment particularly shown in FIG. 3 includes an adjustment member 25 provided in contact with the surface (lower surface) of the bottom surface member 21 that is opposite to the bottom surface of the cavity 2C, so as to be in contact with The clamping member 26 provided so that the adjustment member 25 is sandwiched between the bottom surface members 21, and the fastening bolt 27 that fastens the clamping member 26 to the bottom surface member 21 with the adjustment member 25 sandwiched therebetween.

The adjustment member 25 is a member that directly adjusts the shape of the bottom surface of the cavity 2C when the mold is clamped. As shown in FIGS. On each site. The adjustment member 25 of the present embodiment has, for example, a circular plate shape, and a through hole 25H through which the fastening bolt 27 penetrates is formed in the center portion thereof. The plurality of adjustment members 25 have the same shape, for example, arranged in a matrix (lattice) at regular intervals in the vertical and horizontal directions. The material of the adjustment member 25 is, for example, stainless steel or alloy tool steel.

The clamping member 26 has the same shape as the bottom surface member 21 in a plan view. In addition, the clamping member 26 has a flat plate shape whose thickness is greater than that of the bottom surface member 21. The clamping member 26 has a mounting hole 26H for mounting a fastening bolt 27. In addition, as the material of the bottom surface member 21 and the clamping member 26, stainless steel etc. are mentioned, for example.

The fastening bolt 27 is threadedly engaged with the screw hole 211 formed on the lower surface of the bottom surface member 21 through the mounting hole 26H of the clamping member 26 and the through hole 25H of the adjustment member 25. By screwing the fastening bolt 27 to the screw hole 211, the adjustment member 25 is clamped between the bottom surface member 21 and the clamping member 26. Here, the amount of deformation of each adjustment member 25 is adjusted by adjusting the amount of screwing of the tightening bolt 27. As a result, the shape of the bottom surface of the cavity 2C at the time of mold clamping is adjusted, and the flatness of the resin molded product P is adjusted. At this time, the thickness of the bottom surface member 21 is made smaller than the thickness of the clamping member 26, so the bottom surface member 21 is more easily deformed than the clamping member 26, so that the shape of the bottom surface of the cavity 2C is easier to adjust.

In addition, the lower mold 2 of the present embodiment is covered with a mold release film 28 to improve the mold release property of the resin molded product P. Here, with the adjustment member 25 provided on the lower surface of the bottom surface member 21, a suction flow path R1 for closely contacting the release film 28 with the inner surface of the cavity 2C is formed in the side member 22. Specifically, an opening (suction port R1 a) of the suction flow path R1 is formed on the inner surface of the side member 22. In addition, a connection port connected to an external suction device is formed on the bottom surface of the side member 22, and is connected to an internal flow path (not shown) for suction formed on the bottom plate 23, for example. In addition, since the side member 22 is a member that moves by the elastic member 24, the suction flow path R1 of the side member 22 and the internal flow path of the bottom plate 23 are sealed by a sealing member (not shown).

In addition, in order to facilitate suction of air from the suction port R1 a formed on the inner surface of the side member 22, a groove 21M is formed on the outer surface of the bottom surface member 21 facing the inner surface of the side member 22. The groove 21M may be formed over the entire circumference on the outer surface of the bottom surface member 21, or may be formed over a predetermined range including the suction port R1a. By forming the groove 21M on the outer surface of the bottom surface member 21 as described above, it is possible to easily suck air from the suction port R1a. In addition, the contact area between the bottom surface member 21 and the side member 22 can be reduced, and the sliding of the side member 22 with respect to the bottom surface member 21 can be facilitated.

In addition, on the upper surface of the side member 22, an outer suction groove 221 for holding the release film 28 on the upper surface of the side member 22 is formed. The outer suction groove 221 is continuously or intermittently formed on the upper surface of the side member 22 throughout the entire circumference. In addition, on the upper surface of the side member 22, an inner suction groove 222 for applying tension to the release film 28 is formed. The inner suction groove 222 is formed inside the outer suction groove 221, and is continuously or intermittently formed on the upper surface of the side member 22 throughout the entire circumference. In addition, on the side member 22, a suction flow path R2 connected to the outer suction tank 221 is formed, and a suction flow path R3 connected to the inner suction tank 222 is formed. The suction flow path R2 and the suction flow path R3 are connected to an internal flow path (not shown) formed on the bottom plate 23 in the same manner as the suction flow path R1 described above, for example.

<Operation of the resin molding apparatus 100> 1, 5 to 7, the operation of resin molding (resin sealing) in the resin molding apparatus 100 will be described.

First, in the substrate supply and storage module A, the substrate W before sealing is sent from the substrate supply portion 11 to the substrate placement portion 13. Next, the substrate transport mechanism 14 located at the predetermined standby position is moved, and the substrate W before sealing is received from the substrate mounting portion 13 (see FIG. 1 ). Then, the substrate transport mechanism 14 is moved to the resin molding module B, and the substrate W before sealing is held in the opened upper mold 3 (see FIG. 5). Then, the substrate transport mechanism 14 is returned to the predetermined standby position.

On the other hand, in the resin material supply module C, the mold release film 28 is set in a predetermined shape, the mobile table 15 located at the predetermined standby position is moved, and the mold release film is sequentially placed on the mobile table 15 28 and a frame member (not shown) are formed as the resin material accommodating part 16. Then, the resin material accommodating part 16 is moved to the resin material input mechanism 17 (refer FIG. 1). Next, a predetermined amount of the resin material J is fed from the resin material feeding mechanism 17 into the inner side of the frame member of the resin material accommodating portion 16. Then, the mobile station 15 is returned to the predetermined standby position.

Then, the resin material supply mechanism 18 located at the predetermined standby position is moved, and the resin material accommodating portion 16 in which the resin material J is accommodated is received from the moving table 15. Then, the resin material supply mechanism 18 is moved to the resin molding module B, and the release film 28 of the resin material accommodating part 16 and the resin material J accommodated in the resin material accommodating part 16 are supplied to the opened lower mold 2 Mold cavity 2C (refer to Figure 5). Then, the resin material supply mechanism 18 is returned to the predetermined standby position. In addition, the release film 28 may be in close contact before supplying the resin material J to the cavity 2C.

Here, the lower mold 2 is heated to a predetermined temperature in advance by the heating plate 461, and the resin material J is in a softened or melted state.

After the above steps, in the resin molding module B, the movable platen 41 is raised by the drive mechanism 43, and the sealing member 474 of the upper mold holding portion 47 is in close contact with the sealing member 464 of the lower mold holding portion 46 to form a hermetic seal. Space (refer to Figure 6). In this state, the enclosed space is brought into a vacuum state by an exhaust mechanism not shown.

Then, the movable plate 41 is further raised by the drive mechanism 43, the side member 22 is pressed to the upper mold 3 to compress the elastic member 24, and the electronic components of the substrate W are impregnated with the resin material J, and the component mounting surface of the substrate W is Coated with resin material J. In this state, the lower mold 2 and the upper mold 3 are clamped by a predetermined molding pressure (see FIG. 6). After the predetermined time has elapsed, the lower mold 2 is lowered by the mold clamping mechanism to open the lower mold 2 and the upper mold 3 (see FIG. 7). Furthermore, it is also possible to return the enclosed space to atmospheric pressure during the mold clamping process.

Next, the substrate transport mechanism 14 of the substrate supply and storage module A is moved, and the sealed substrate W is received from the opened upper mold 3. The substrate transport mechanism 14 is moved to the substrate mounting portion 13 and the sealed substrate W is transferred to the substrate mounting portion 13 (see FIG. 1 ). The sealed substrate W is stored in the substrate storage portion 12 from the substrate placement portion 13. In this way, the resin sealing is completed.

<Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, the adjustment member 25 is provided in contact with the bottom surface of the bottom surface member 21 forming the bottom surface of the cavity 2C on the side opposite to the bottom surface, so that the shape of the bottom surface of the cavity 2C can be easily adjusted. On the other hand, the thickness unevenness of the resin molded product P is reduced.

In addition, in the present embodiment, the adjustment members 25 are provided at a plurality of locations, so the shape of the bottom surface of the cavity 2C can be adjusted at a plurality of locations, and the thickness unevenness of the resin molded product P can be further reduced.

In addition, in this embodiment, the shape of the bottom surface of the cavity 2C can be adjusted by making the height dimension (thickness dimension) of the adjustment member 25 different. As a result, the thickness unevenness of the resin molded product P can be further reduced.

In addition, the fastening bolt 27 is fastened through the through hole 25H formed in the adjustment member 25, so that the position shift of the adjustment member 25 can be prevented, and the deformation of the adjustment member 25 can be easily adjusted by screwing the fastening bolt 27. quantity.

<Other modified embodiments> Furthermore, the present invention is not limited to the above-mentioned embodiments.

For example, in the above embodiment, the lower mold 2 is divided into a plurality of members in the mold clamping direction, and the adjustment member 25 is provided between the divided members (the bottom surface member 21 and the clamping member 26). However, the upper mold 3 can also be constructed in the same manner as the lower mold 2. That is, the upper mold 3 may be divided into a plurality of members in the screwing direction, and an adjustment member may be provided between the divided members.

In addition to the above-mentioned embodiment, it is also possible to adjust the screwing amount of the tightening bolt 27 by sandwiching between the bottom surface member 21 and the clamping member 26 and tightening with the tightening bolt 27. In addition, the shape of the bottom surface of the cavity 2C may be adjusted by making the material, cross-sectional shape, or cross-sectional area of the adjustment member 25 different. In addition, the shape of the bottom surface of the cavity 2C may be adjusted by the arrangement of a plurality of adjustment members 25. For example, it is conceivable to arrange a plurality of adjustment members closely at the center part of the bottom surface member and sparsely arrange at the end parts.

Furthermore, in the above-described embodiment, one fastening bolt 27 is provided for one adjustment member 25, but it may be configured such that, for example, a plurality of through holes 25H are formed in one adjustment member 25 having a long strip shape, Tightening bolts 27 are respectively provided in the plurality of through holes 25H, and the amount of deformation is partially adjusted in one adjustment member 25 by adjusting the tightening force of these tightening bolts 27. In addition, a configuration may be adopted in which the through-hole 25H is not formed in the adjustment member 25, and the adjustment member 25 is fastened with a fastening bolt 27 on the side of the adjustment member 25 to adjust the amount of deformation of the adjustment member 25.

In the above-mentioned embodiment, the adjustment member is sandwiched by the bottom surface member and the clamping member. However, as long as the adjustment member is fixed in contact with the bottom surface of the bottom surface member, it is not limited to the above-mentioned embodiment.

In addition, in the above-mentioned embodiment, the lower surface of the clamping member 26 is in contact with the bottom plate 23 and functions as a spacer between the adjustment member 25 and the bottom plate 23. However, it may be configured as follows: Another member that functions as a spacer is provided between the lower surface of the member 26 and the bottom plate 23.

In addition to the adjustment member 25 of the above-described embodiment, a heat insulating member 462 provided between the heating plate 461 of the lower mold 2 and the movable plate 41 may be used to adjust the shape of the bottom surface of the cavity 2C. For example, it is conceivable to use the heat insulation member 462 as a plurality of column-shaped members, and use the plurality of column-shaped members as coarse motion adjustment to roughly eliminate the deflection of the movable plate 41, and use the adjustment member 25 of the embodiment as a coarse motion adjustment. Make fine adjustments.

In the above embodiment, two resin molding modules B are connected between the substrate supply and storage module A and the resin material supply module C. However, the substrate supply and storage module may also be connected A and the resin material supply module C are formed as one module, and the resin molding module B is connected to the module. In addition, the resin molding apparatus may not be modularized into modules as in the above-mentioned embodiment.

In addition, of course, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit thereof.

2‧‧‧Die 2C‧‧‧Mold cavity 3‧‧‧Upper die 4‧‧‧Clamping mechanism 11‧‧‧Substrate Supply Department 12‧‧‧Substrate storage section 13‧‧‧Substrate placement section 14‧‧‧Substrate handling mechanism 15‧‧‧Mobile Station 16‧‧‧Resin Material Storage Department 17‧‧‧Resin material input mechanism 18‧‧‧Resin material supply mechanism 21‧‧‧Bottom surface member 21M‧‧‧Slot 22‧‧‧Side members 23‧‧‧Bottom plate 24‧‧‧Elastic member 25‧‧‧Adjustment member 25H‧‧‧Through hole 26‧‧‧Clamping member 26H‧‧‧Mounting hole 27‧‧‧Tightening bolt 28‧‧‧Release film 40‧‧‧Fixed frame 41‧‧‧Activity plate 42‧‧‧Upper fixed plate 43‧‧‧Drive mechanism 44‧‧‧Lower fixed plate 45‧‧‧Pillars 46‧‧‧Lower mold holding part 47‧‧‧Upper mold holding part 100‧‧‧Resin molding device 211‧‧‧Screw hole 221‧‧‧Outside adsorption tank 222‧‧‧Inner adsorption tank 431‧‧‧Ball screw mechanism 461、471‧‧‧heating plate 462、472‧‧‧Insulation component 463、473‧‧‧Side wall member 464、474‧‧‧Sealing components A‧‧‧Substrate supply and storage module B‧‧‧Resin Molding Module C‧‧‧Resin material supply module J‧‧‧Resin material P‧‧‧Resin molded products R1, R2, R3‧‧‧Suction flow path R1a‧‧‧Suction port W‧‧‧Substrate (substrate before sealing, substrate after sealing)

FIG. 1 is a plan view schematically showing the structure of the resin molding apparatus of the present embodiment. Fig. 2 is a longitudinal sectional view mainly showing a pair of forming molds and a mold clamping mechanism of the embodiment. Fig. 3 is a longitudinal sectional view showing the main part of the first forming die (lower die) of the embodiment. Fig. 4(a) is a plan view of the bottom surface member of the embodiment, and Fig. 4(b) is a perspective view of the adjustment member of the embodiment. Fig. 5 is a diagram showing a method of manufacturing a resin molded product according to the embodiment. Fig. 6 is a diagram showing a method of manufacturing a resin molded product according to the embodiment. Fig. 7 is a diagram showing a method of manufacturing a resin molded product of the embodiment.

2C‧‧‧Mold cavity

3‧‧‧Upper die

21‧‧‧Bottom surface member

22‧‧‧Side members

23‧‧‧Bottom plate

24‧‧‧Elastic member

25‧‧‧Adjustment member

26‧‧‧Clamping member

40‧‧‧Fixed frame

41‧‧‧Activity plate

42‧‧‧Upper fixed plate

43‧‧‧Drive mechanism

44‧‧‧Lower fixed plate

45‧‧‧Pillars

46‧‧‧Lower mold holding part

47‧‧‧Upper mold holding part

431‧‧‧Ball screw mechanism

461、471‧‧‧heating plate

462、472‧‧‧Insulation component

463、473‧‧‧Side wall member

464、474‧‧‧Sealing components

B‧‧‧Resin Molding Module

Claims (5)

A resin molding apparatus includes a first molding die having a cavity, and a second molding die disposed opposite to the first molding die, and the first molding die and the second molding die are closed to make the resin For molding a molded product, in the resin molding apparatus, the first molding die includes: a bottom surface member forming a bottom surface of the cavity; a plurality of adjustment members, and a surface of the bottom surface member opposite to the bottom surface Contact to adjust the shape of the bottom surface when the mold is closed; and a clamping member is provided so as to sandwich the plurality of adjustment members with the bottom surface member, and the thickness of the bottom surface member is smaller than that of the clamping member The thickness of the member, the plurality of adjustment members are configured to each have an independent height dimension, and the plurality of adjustment members partially adjust the amount of deformation of the bottom surface member based on the height dimension. The resin molding apparatus according to claim 1, wherein the plurality of adjustment members are provided at a plurality of locations on the lower surface of the bottom surface member. The resin molding apparatus according to claim 1, wherein the plurality of adjustment members are formed with through holes through which the fastening bolts pass, The clamping member is fastened to the bottom surface member in the state. The resin molding apparatus according to the first patent application, wherein the first molding die further includes a side member that surrounds the bottom surface member and forms the cavity, and in the side member, a side member is formed for A suction flow path that sucks air in the cavity. A method of manufacturing a resin molded product using the resin molding device described in any one of the first to fourth items in the scope of the patent application.

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