TW201916997A - Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method - Google Patents

Abstract

There is provided a resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method that can reduce variation in thickness of a resin molded product. The resin molded product manufacturing apparatus includes: a first platen; a first mold chase holder provided on the first platen and configured to hold a first mold chase; a second platen spaced from the first platen and facing the first platen; and a second mold chase holder provided on the second platen and configured to hold a second mold chase. A notch is provided on a side of the first platen closer to the second platen. A thickness of the first platen at an outer end portion of the notch is smaller than a thickness of the first platen at an inner end portion of the notch.

Description

Manufacturing apparatus of resin molded article, resin molding system, and method of producing resin molded article

The present invention relates to a device for producing a resin molded article, a resin molding system, and a method for producing a resin molded article.

For example, JP-A-H07-132108 (Patent Document 1) discloses that the base portion other than the mold mounting portion of the upper platen on which the upper mold is attached is thinned, instead of increasing the upper platen. A device for manufacturing a resin molded article in which the rigidity of the upper platen is increased by the thickness or the reinforcing member, and the flatness of the mold clamping surface at the time of mold clamping can be improved.

However, in the apparatus for manufacturing a resin molded article described in Patent Document 1, since the upper platen is made thinner, the rigidity of the upper platen cannot be increased.

In the case of the production of a resin molded article using a manufacturing apparatus of a resin molded article, the mold holder for holding the upper mold is attached to the upper press plate. And attaching the mold holder holding the lower mold to the lower pressing plate. In the apparatus for manufacturing a resin molded article, the upper platen and the lower platen are deformed by pressurization when the upper die and the lower die are clamped, and the die holder attached to each of the press plates is deformed in accordance with the deformation.

When resin molding is performed by a mold attached to a deformed mold holder, variations in the thickness of the resin molded article may become large and may become inferior products. In particular, when the mold holder is attached to the apparatus for manufacturing a resin molded article described in Patent Document 1, when the resin molded article is produced, since the upper press plate does not have high rigidity, it is considered that the mold holder for holding the upper mold is The amount of deformation is increased, and the variation in the thickness of the resin molded article is further increased.

According to the embodiment disclosed herein, there is provided an apparatus for producing a resin molded article, comprising: a first pressure plate; the first mold holder is provided on the first pressure plate, and is configured to hold the first mold; and the second pressure plate And the first platen is disposed to be spaced apart from the first platen, and the second die holder is disposed on the second platen to hold the second die, and the second platen of the first platen is formed. A slit is provided on the side, and the thickness of the first platen at the outer end portion of the slit is thinner than the thickness of the first platen at the inner end portion of the slit.

According to the embodiment disclosed herein, a resin forming system including a manufacturing apparatus of the resin molded article can be provided.

According to the embodiment disclosed herein, there can be provided a method of producing a resin molded article using the apparatus for manufacturing a resin molded article, and comprising: a step of providing a support member to the first mold; and a cavity supply for the second mold a step of resin material; and a step of clamping the first mold and the second mold.

The above and other objects, features, aspects and advantages of the present invention will become apparent from the accompanying claims

Hereinafter, an embodiment will be described. In addition, in the drawings for the description of the embodiments, the same reference numerals indicate the same or equivalent parts.

Fig. 1 is a schematic front view showing an apparatus for manufacturing a resin molded article according to an embodiment. The apparatus 1 for manufacturing a resin molded article according to the embodiment includes a first pressure plate 11 , a second pressure plate 12 , and a third pressure plate 13 . One end of a press frame 17 extending vertically upward from the third pressure plate 13 is fixed to both ends of the third pressure plate 13, and the other ends of the first pressure plate 11 are respectively fixed with a press frame 17 One end. Further, the first pressure plate 11 , the third pressure plate 13 , and the press frame 17 may be integrally formed as a casting, for example.

Between the first pressure plate 11 and the third pressure plate 13, the pressure frame 17 is attached so that the second pressure plate 12 can move vertically upward and downward. In the region between the press frames 17 of the third pressure plate 13, a drive mechanism 16 configured to move the second pressure plate 12 vertically upward and vertically downward is provided. Further, in the present embodiment, since the first pressure plate 11 is fixed, the second pressure plate 12 can relatively move relative to the first pressure plate 11.

A first mold holder 14 configured to hold a first mold (not shown) is attached to the vertically lower side of the first pressure plate 11 . A second mold holder 15 configured to hold a second mold (not shown) is attached to the vertically upper side of the second pressure plate 12 .

Fig. 2 is a schematic enlarged front view showing the apparatus for manufacturing the resin molded article shown in Fig. 1. The first pressure plate 11 of the apparatus for manufacturing a resin molded article shown in FIG. 2 is characterized in that a slit 123 is provided on the lower surface of the first pressure plate 11, and an inclined surface 121 and a step are provided on the upper surface of the first pressure plate 11. 122.

In the apparatus for manufacturing a resin molded article shown in FIG. 2, the thickness a of the first platen 11 in the vertical direction at the outer end portion 124 of the slit 123 becomes larger than the first platen 11 at the inner end portion 125 of the slit 123. The thickness b in the vertical direction is thin. In the present embodiment, the thickness a of the first pressure plate 11 at the outer end portion 124 of the slit 123 is from the outer end portion 124 of the slit 123 on the lower surface of the first pressure plate 11 to the upper surface of the first pressure plate 11. The thickness a. Further, in the present embodiment, the thickness b of the first pressure plate 11 at the inner end portion 125 of the slit 123 is from the inner end portion 125 of the slit 123 on the lower surface of the first pressure plate 11 to the first pressure plate 11 The thickness b from the surface.

In the apparatus for manufacturing a resin molded article shown in FIG. 2, the slit 123 can be configured to surround the first mold holder 14, for example. Moreover, in the apparatus for manufacturing a resin molded article shown in FIG. 2, the inclined surface 121 can be configured to extend outward from the step 122, for example, obliquely downward.

In the apparatus for manufacturing a resin molded article in which the slits 123 are not provided in the first platen 11, for example, when the drive mechanism 16 is a linear motion mechanism, as shown in the schematic cross-sectional view of FIG. 3, the first pressure plate 11 and the first pressure plate 11 are clamped. The second pressure plate 12 partially receives the pressure from the first mold holder 14 and the second mold holder 15 at the center portion, and may be deformed into a shape that is convex upward. Further, when the drive mechanism 16 is a toggle link mechanism, as shown in the schematic cross-sectional view of FIG. 4, the first pressure plate 11 receives the stress from the first die holder 14 at the center portion during the mold clamping, and the first 2 The pressure plate receives the stress on the outer side, and thus the first pressure plate 11 may be deformed into a shape that is convex upward, and the second pressure plate 12 may be deformed into a shape that is convex downward.

However, in the present embodiment, the first pressure plate 11 is provided with the slit 123, and the thickness a of the first pressure plate 11 at the outer end portion 124 of the slit 123 is made larger than the thickness of the first pressure plate 11 at the inner end portion 125 of the slit 123. The thickness b is thin. In this case, even if the first pressure plate 11 receives stress from the first mold holder 14 at the time of mold clamping, the stress can be alleviated by the relatively thin thickness a of the first pressure plate 11, and the stress can be relieved by the first The portion of the first platen 11 above the mounting portion 20 of the die holder 14 having a relatively thick thickness b holds the rigidity of the first platen 11. Therefore, the stress received by the first pressure plate 11 at the time of mold clamping can be concentrated to a position outside the mounting portion 20 of the first mold holder 14 (for example, a portion surrounded by a circle in FIG. 5), so that the film can be suppressed. The mounting portion 20 of the first die holder 14 of the first pressure plate 11 is deformed. Therefore, as will be described later, it is possible to manufacture a resin molded article having less variation in thickness. Further, the inner end portion 125 of the slit 123 corresponds to the end portion of the attachment portion 20 of the first die holder 14 of the first pressure plate 11 .

Further, by providing the inclined surface 121 to the first pressure plate 11, the inclined surface 121 can receive the stress received by the first pressure plate 11 at the time of mold clamping, so that the stress received by the first pressure plate 11 during the mold clamping can be dispersed to In other portions, deformation of the mounting portion 20 of the first die holder 14 of the first pressure plate 11 can be further suppressed.

Further, as shown in FIG. 6 and FIG. 1 and FIG. 2 of Patent Document 1, only the step 122 may be provided on the upper surface of the first pressure plate 11 instead of the inclined surface 121. In this case, if the thickness a of the first pressure plate 11 at the outer end portion 124 of the slit 123 is thinner than the thickness b of the first pressure plate 11 at the inner end portion 125 of the slit 123, the same content as that described above can be obtained. Effect. Therefore, on the upper surface of the first pressure plate 11, only the inclined surface 121 may be provided, or only the step 122 may be provided, or both the inclined surface 121 and the step 122 may be provided.

As shown in the schematic cross-sectional view of Fig. 7, the first mold holder 14 includes the first heat insulating member 22 on the first pressure plate 11 side, and includes the first mold in the first heating plate 23 on the second pressure plate 12 side. 41 is a first mold holder heater 25 configured to be heated. Further, the first die holder 14 includes the first plate 21 on the side closer to the first pressure plate 11 than the first heat insulating member 22, and includes a first side wall 24 that extends vertically downward from the edge of the first heating plate 23. In the present embodiment, the first heating plate 23 has four first mold holder heaters 25 that extend in the horizontal direction at intervals.

The second mold holder 15 includes a second heat insulating member 32 on the second pressure plate 12 side, and includes a second mold holder that is configured to heat the second mold 42 on the second heating plate 33 on the first pressure plate 11 side. Heater 35. Further, the second mold holder 15 includes the second plate 31 on the side closer to the second pressure plate 12 than the second heat insulating member 32, and includes a second side wall 34 that extends vertically upward from the edge of the second heating plate 33. In the present embodiment, the second heating plate 33 has four second mold holder heaters 35 that extend in the horizontal direction at intervals.

In the following, a method of manufacturing a resin molded article which is an example of a method of producing a resin molded article using the apparatus 1 for manufacturing a resin molded article of the embodiment will be described with reference to FIG. 7 to FIG. First, as shown in the schematic cross-sectional view of FIG. 7, the first mold 41 is fixed to the first heating plate 23 of the first mold holder 14, and the second mold 42 is fixed to the second mold holder 15. On the heating plate 33. A cavity 43 is provided on the first mold 41 side of the second mold 42.

Then, as shown in the schematic cross-sectional view of FIG. 8, the release film 52 is provided so as to cover the cavity 43 of the second mold 42. Then, the space in the cavity 43 covered by the release film 52 is evacuated, whereby the release film 52 is adhered to the surface of the second mold 42 constituting the cavity 43 as shown in the schematic sectional view of Fig. 9 . on.

Then, the support member supply device 201 of the supply module 1001 of the resin molding system 1000 of the embodiment shown in the schematic plan view of FIG. 10 supplies the support member 51 which is a molded object of resin molding to the upper side of the conveyance mechanism 301. .

The support member 51 may include, for example, a lead frame, a substrate, an interposer, or a semiconductor substrate that can support a semiconductor chip, a chip-shaped electronic component, or a film (including a conductive film, an insulating film, a semiconductor film, or the like). (矽 wafer, etc.), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, a wiring substrate, and the like. Further, the shape of the support member 51 is not particularly limited, and the surface shape of the support member 51 may be, for example, a circular shape or a quadrangular shape. Further, the support member 51 may or may not include wiring. Further, the support member 51 includes a carrier of a support member used in a fan-out wafer level package (FO-WLP) or a fan-out panel level package (FO-PLP).

Then, the transport mechanism 301 to which the support member 51 is supplied is moved along the longitudinal movement guide 401 provided in the supply module 1001 to reach the resin material supply device 202.

Then, the resin material supply device 202 supplies the resin material 61 to the lower side of the transport mechanism 301 so that the transport mechanism 301 holds the solid resin material 61 on the lower side of the transport mechanism 301. Therefore, at this stage, the conveying mechanism 301 holds the support member 51 on the upper side and holds the resin material 61 on the lower side.

Then, the conveyance mechanism 301 is moved to the resin sealing module 1002 of the resin molding system 1000 of the embodiment in a state where the support member 51 is held on the upper side and the resin material 61 is held on the lower side, and is moved laterally along the lateral movement guide 402. The conveying mechanism 301 that has reached the resin sealing module 1002 is longitudinally moved along the longitudinal moving rail 403, and reaches the manufacturing apparatus 1 of the resin molded article of the embodiment. Further, although four resin sealing modules 1002 are described in FIG. 10, the present invention is not limited thereto, and the number of the resin sealing modules 1002 may be increased or decreased.

Then, as shown in the schematic cross-sectional view of FIG. 11, the support member 51 is placed on the first mold 41 from the transport mechanism 301, and the resin material 61 is supplied from the transport mechanism 301 to the release mold that is in close contact with the second mold 42. On the membrane 52. Further, in the present embodiment, the support member 51 including the semiconductor substrate 51a and the semiconductor chip 51b on the semiconductor substrate 51a is used.

Then, the first mold 41 is heated by the first mold holder heater 25 of the first heating plate 23, and the second mold 42 is heated by the second mold holder heater 35 of the second heating plate 33. . In addition, the resin material 61 is melted by heating of the second mold 42 by the second mold holder heater 35, and the fluid resin 71 is produced as shown in the schematic cross-sectional view of FIG.

Then, as shown in the schematic front view of FIG. 13, the second pressing plate 12 is moved vertically upward to perform mold clamping of the first die 41 and the second die 42. At this time, as shown in the schematic cross-sectional view of FIG. 14, the fluid resin 71 contacts the surface of the support member 51.

Then, the fluid resin 71 is cured, and then the second pressure plate 12 is moved vertically downward. Thereby, as shown in the schematic cross-sectional view of FIG. 15, the resin molded article 82 whose surface of the support member 51 is sealed by the hardening resin 81 is manufactured.

The resin molded product 82 manufactured as described above is carried out from the resin molded article manufacturing apparatus 1 by the transport mechanism 301 shown in FIG. Then, the conveyance mechanism 301 holding the resin molded article 82 moves toward the lateral movement guide rail 402 along the longitudinal movement guide rail 403 provided in the resin sealing module 1002. Then, the conveyance mechanism 301 is moved laterally along the lateral movement guide 402 to the storage module 1003 of the resin molding system 1000 of the embodiment. The conveyance mechanism 301 that has reached the storage module 1003 moves toward the resin molded article storage device 203 along the longitudinal movement guide 404 provided in the storage module 1003. Thereafter, the resin molded article 82 is stored in the resin molded article storage device 203 from the transport mechanism 301.

Fig. 16 is a schematic front view showing a modification of the apparatus for manufacturing a resin molded article of the embodiment. The apparatus 1 for manufacturing a resin molded article shown in FIG. 16 includes an intermediate plate 91 between the first pressure plate 11 and the second pressure plate 12, and a third mold holder 93 provided on the first pressure plate 11 side of the intermediate plate 91. The third mold (not shown) is held; and the fourth mold holder 94 is provided on the second pressure plate 12 side of the intermediate plate 91 to hold the fourth mold (not shown). Composition.

Fig. 17 is a schematic enlarged cross-sectional view showing the apparatus 1 for manufacturing a resin molded article shown in Fig. 16. The third mold holder 93 includes the third heat insulating member 102 on the side of the intermediate plate 91, and the third heating plate 103 on the side of the first pressure plate 11 includes a third mold 96 having a cavity 97. The third mold holder heater 105. Further, the third mold holder 93 includes the third plate 101 on the side closer to the intermediate plate 91 than the third heat insulating member 102, and includes a third side wall 104 that extends vertically upward from the edge of the third heating plate 103. In the present embodiment, the third heating plate 103 includes four third mold holder heaters 105 that are spaced apart from each other in the horizontal direction.

The fourth mold holder 94 includes the fourth heat insulating member 112 on the side of the intermediate plate 91, and includes the fourth mold holder heated to heat the fourth mold 98 on the fourth heating plate 113 on the second pressure plate 12 side. 115. Further, the fourth mold holder 94 includes the fourth plate 111 on the side closer to the intermediate plate 91 than the fourth heat insulating member 112, and includes a fourth side wall 114 that extends vertically downward from the edge of the fourth heating plate 113. In the present embodiment, the fourth heating plate 113 includes four fourth mold holder heaters 115 that are spaced apart from each other in the horizontal direction. [Examples]

<Comparative Example> Fig. 18 is a schematic perspective view showing another modification of the apparatus for manufacturing a resin molded article of a comparative example. The apparatus for manufacturing a resin molded article of the comparative example shown in FIG. 18 is different from the apparatus 1 for manufacturing a resin molded article of the embodiment shown in FIG. 2 in that the upper surface of the first pressure plate 11 is flat, and the outer end of the slit 123 is provided. The thickness a of the first pressure plate 11 at the portion 124 is equal to the thickness of the first pressure plate 11 at the inner end portion 125 of the slit 123.

<First Embodiment> Fig. 19 is a schematic perspective view showing an apparatus for manufacturing a resin molded article of the first embodiment. The apparatus for manufacturing a resin molded article of the first embodiment shown in FIG. 19 is different from the apparatus for manufacturing a resin molded article of the embodiment shown in FIG. 2 in that a step 122 is provided on the upper surface of the first pressure plate 11 . The inclined surface 121 is not provided.

<Example 2> Fig. 20 is a schematic perspective view showing a manufacturing apparatus of a resin molded article of Example 2. The apparatus for manufacturing a resin molded article of the second embodiment shown in FIG. 20 is different from the apparatus for manufacturing a resin molded article of the embodiment shown in FIG. 2 in that a recessed portion 127 is provided on the upper surface of the first pressure plate 11. The step 122 is not set.

<Example 3> Fig. 21 is a schematic perspective view showing a manufacturing apparatus of a resin molded article of Example 3. The apparatus for manufacturing a resin molded article of the third embodiment shown in FIG. 21 is different from the apparatus for manufacturing a resin molded article of the second embodiment shown in FIG. 20 in that a step 122 is provided on the upper surface of the first pressure plate 11. Instead of the inclined surface 121.

<Example 4> Fig. 22 is a schematic perspective view showing a manufacturing apparatus of a resin molded article of Example 4. The apparatus for manufacturing a resin molded article of the fourth embodiment shown in FIG. 22 is different from the apparatus for manufacturing a resin molded article of the embodiment shown in FIG. 2 in that the thickness of the first pressure plate 11 is increased.

<Example 5> Fig. 23 is a schematic perspective view showing a manufacturing apparatus of a resin molded article of Example 5. The apparatus for manufacturing a resin molded article of the fifth embodiment shown in FIG. 23 is different from the apparatus for manufacturing a resin molded article of the second embodiment shown in FIG. 20 in that a recessed portion is not provided on the upper surface of the first pressure plate 11. 127.

<Embodiment 6> Fig. 24 is a schematic perspective view showing a manufacturing apparatus of a resin molded article of Example 6. The apparatus for manufacturing a resin molded article of the sixth embodiment shown in FIG. 24 is different from the apparatus for manufacturing a resin molded article of the fourth embodiment shown in FIG. 22 in that a recessed portion is provided on the upper surface of the first pressure plate 11. 127.

<Embodiment 7> Fig. 25 is a schematic perspective view showing a manufacturing apparatus of a resin molded article of Example 7. The apparatus for manufacturing a resin molded article of the seventh embodiment shown in FIG. 25 is different from the apparatus for manufacturing a resin molded article of the fourth embodiment shown in FIG. 22 in that two cylinders are provided on the upper surface of the first pressure plate 11. Shaped protrusions 126.

<Evaluation> In the following Table 1, the first platen of the manufacturing apparatus of the resin molded article of the comparative example shown in FIGS. 18 to 25 and the first, fourth, and seventh examples obtained by the simulation is shown. When the force of 18 tons is pressed from below, the thickness (maximum value) of the thickest portion of the first pressure plate 11 and the thickness (minimum value) of the thinnest portion of the mounting portion 20 of the first mold holder 14 are The result of the difference (thickness deviation).

In addition, the column of "maximum value" in Table 1 shows the thickness (maximum value) of the thickest portion of the first pressure plate 11 at the mounting portion 20 of the first die holder 14 at the time of pressurization [mm] ]. Further, the column of "minimum value" in Table 1 shows the thickness (minimum value) of the thinnest portion of the first pressure plate 11 at the mounting portion 20 of the first mold holder 14 at the time of pressurization [mm] ]. Moreover, the difference (thickness deviation) [mm] between the maximum value and the minimum value is shown in the column of "difference value" in Table 1. Further, in the column of "the relationship between a and b" in Table 1, the thickness a of the first pressure plate 11 and the inner end portion 125 of the slit 123 at the outer end portion 124 of the slit 123 before pressurization are shown. The magnitude relationship of the thickness b of the first pressure plate 11 at the place.

[Table 1]

As shown in Table 1, it was confirmed that the thickness a of the first pressure plate 11 at the outer end portion 124 of the slit 123 before the pressurization was thinner than the thickness b of the first pressure plate 11 at the inner end portion 125 of the slit 123. In the apparatus for manufacturing a resin molded article of the first embodiment, the fourth embodiment, and the seventh embodiment, the mounting portion 20 of the first mold holder 14 at the time of pressurization can be reduced as compared with the apparatus for manufacturing a resin molded article of the comparative example. The difference (thickness deviation) between the thickness (maximum value) of the thickest portion of the first platen 11 and the thickness (minimum value) of the thinnest portion.

Therefore, it is considered that the apparatus for manufacturing a resin molded article of the first embodiment, the fourth embodiment, and the seventh embodiment can suppress the mounting portion 20 of the first die holder 14 at the time of mold clamping as compared with the device for manufacturing a resin molded article of the comparative example. The deformation of the first pressure plate 11 can produce a resin molded article in which the variation in thickness is reduced.

Moreover, the comparison between the apparatus for manufacturing a resin molded article of the fourth embodiment and the apparatus for manufacturing a resin molded article of the first and seventh embodiments is clear, and the first portion of the mounting portion 20 of the first die holder 14 is confirmed. When the thickness of the pressure plate 11 is thick, deformation of the first pressure plate 11 during the pressurization can be suppressed. Therefore, it is considered that the resin molded article of the fourth embodiment and the resin molded article of the seventh embodiment can produce a resin molded article which is further reduced in thickness.

In addition, FIG. 26 shows that the second pressure plate 12 in which the thickness of the second pressure plate 12 at the attachment portion of the second mold holder 15 is increased is attached to the manufacturing apparatus of the resin molded article of the fourth embodiment, and the same content as described above is performed. The simulation results at the time of pressurization.

As shown in FIG. 26, it was confirmed that the thickness of the second pressure plate 12 at the mounting portion of the second mold holder 15 was increased from 232.5 mm to 382.7 mm by the apparatus for manufacturing a resin molded article of Example 4, and the second mold was used. The thickness deviation of the second pressure plate 12 at the mounting portion of the bracket 15 is 0.008 mm from 0.012 mm, and deformation of the second pressure plate 12 during the pressurization can be suppressed. Therefore, it is considered that a resin molded article which further reduces the variation in thickness can be produced in this case.

In addition, as a modification of the resin molding system of the embodiment shown in FIG. 10, an embodiment in which the resin molded article storage device 203 is provided in the supply module 1001 without using the storage module 1003 can be exemplified. In this case, the one transporting means can supply the support member 51 from the supply module 1001 to the resin sealing module 1002, and the resin molded article 82 manufactured by the manufacturing apparatus 1 of the resin molded product can be accommodated again in the supply module 1001. In the resin molded article storage device 203.

Moreover, as a modification of the resin molding system of the embodiment shown in FIG. 10, an embodiment in which the resin material supply device 202 is provided in the storage module 1003 can be exemplified. In this case, the transfer mechanism (not shown) can supply the release film 52 and the resin material 61 together from the storage module 1003 to the manufacturing apparatus 1 of the resin molded product provided in the resin sealing module 1002, and the resin is used. After the resin molded product 82 is manufactured by the manufacturing apparatus 1 of a molded article, this conveyance mechanism can collect the release film 52.

Although the embodiment and the examples have been described above, the configurations of the respective embodiments and the respective embodiments are appropriately combined and predetermined from the beginning.

The embodiments of the present invention have been described, but the embodiments disclosed herein are intended to be illustrative and not restrictive. The scope of the present invention is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. [Industrial availability]

According to the embodiment disclosed herein, a manufacturing apparatus of a resin molded article, a resin molding system, and a method of producing a resin molded article can be provided.

1‧‧‧Manufacturer of resin molded articles

11‧‧‧1st platen

12‧‧‧2nd platen

13‧‧‧3rd platen

14‧‧‧1st mold holder

15‧‧‧2nd mold holder

16‧‧‧Drive mechanism

17‧‧‧ Type pressure frame

20‧‧‧Installation Department

21‧‧‧1st board

22‧‧‧1st insulation member

23‧‧‧1st heating plate

24‧‧‧1st side wall

25‧‧‧1st mold holder heater

31‧‧‧2nd board

32‧‧‧2nd insulation member

33‧‧‧2nd heating plate

34‧‧‧ second side wall

35‧‧‧2nd mold holder heater

41‧‧‧1st mould

42‧‧‧2nd mould

43‧‧‧ cavity

51‧‧‧Support members

51a‧‧‧Semiconductor substrate

51b‧‧‧Semiconductor chip

52‧‧‧ release film

61‧‧‧Resin materials

71‧‧‧Liquid resin

81‧‧‧ hardened resin

82‧‧‧Resin molded products

91‧‧‧Intermediate board

93‧‧‧3rd mold holder

94‧‧‧4th mold bracket

96‧‧‧3rd mould

97‧‧‧ cavity

98‧‧‧4th mould

101‧‧‧3rd board

102‧‧‧3rd insulation member

103‧‧‧3rd heating plate

104‧‧‧3rd side wall

105‧‧‧3rd mold holder heater

111‧‧‧4th board

112‧‧‧4th thermal insulation component

113‧‧‧4th heating plate

114‧‧‧4th side wall

115‧‧‧4th mold holder heater

121‧‧‧Sloping surface

122‧‧ ‧ step

123‧‧‧ incision

124‧‧‧Outer end

125‧‧‧Inside end

126‧‧ ‧ prominence

127‧‧‧ recessed

201‧‧‧Support member supply device

202‧‧‧Resin material supply device

203‧‧‧Resin molded product storage device

301‧‧‧Transportation agency

401‧‧‧Longitudinal moving rail

402‧‧‧Horizontal moving rail

403‧‧‧Longitudinal moving rail

1000‧‧‧Resin Forming System

1001‧‧‧Supply module

1002‧‧‧Resin Sealing Module

1003‧‧‧Storage module

a, b‧‧‧ thickness

Fig. 1 is a schematic front view of an apparatus for manufacturing a resin molded article according to an embodiment. Fig. 2 is a schematic enlarged front view of the apparatus for manufacturing the resin molded article shown in Fig. 1. FIG. 3 is a view illustrating deformation of the first pressure plate and the second pressure plate of the apparatus for manufacturing a resin molded article. FIG. 4 is a view illustrating deformation of the first pressure plate and the second pressure plate of the apparatus for manufacturing a resin molded article. FIG. 5 is a view showing a concentrated portion of stress at the time of mold clamping of the first pressure plate according to the embodiment. Fig. 6 is a schematic front view showing a modification of the first pressure plate. FIG. 7 is a schematic cross-sectional view showing a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 8 is a schematic cross-sectional view illustrating a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 9 is a schematic cross-sectional view illustrating a part of the procedure of the method of manufacturing the resin molded article of the embodiment. Fig. 10 is a schematic plan view of a resin molding system of the embodiment. FIG. 11 is a schematic cross-sectional view showing a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 12 is a schematic cross-sectional view illustrating a part of the procedure of the method of manufacturing the resin molded article of the embodiment. FIG. 13 is a schematic front view showing a part of the steps of the method of manufacturing the resin molded article of the embodiment. FIG. FIG. 14 is a schematic cross-sectional view showing a part of the procedure of the method of manufacturing the resin molded article of the embodiment. Fig. 15 is a schematic cross-sectional view showing a part of the steps of a method of manufacturing a resin molded article of the embodiment. Fig. 16 is a schematic front view showing a modification of the apparatus for manufacturing a resin molded article of the embodiment. Fig. 17 is a schematic enlarged cross-sectional view showing the apparatus for manufacturing a resin molded article shown in Fig. 16; 18 is a schematic perspective view of a manufacturing apparatus of a resin molded article of a comparative example. 19 is a schematic perspective view of an apparatus for manufacturing a resin molded article of Example 1. Fig. 20 is a schematic perspective view of the apparatus for manufacturing a resin molded article of the second embodiment. Fig. 21 is a schematic perspective view of the apparatus for manufacturing a resin molded article of the third embodiment. Fig. 22 is a schematic perspective view of the apparatus for manufacturing a resin molded article of the fourth embodiment. Fig. 23 is a schematic perspective view of the apparatus for manufacturing a resin molded article of the fifth embodiment. Fig. 24 is a schematic perspective view of the apparatus for manufacturing a resin molded article of the sixth embodiment. Fig. 25 is a schematic perspective view of the apparatus for manufacturing a resin molded article of the seventh embodiment. FIG. 26 is a simulation result when the second pressure plate to which the thickness of the second pressure plate of the attachment portion of the second mold holder is increased is attached to the manufacturing apparatus of the resin molded article of the fourth embodiment.

Claims (6)

A manufacturing apparatus for a resin molded article, comprising: a first pressure plate; a first mold holder provided on the first pressure plate to hold the first mold; and a second pressure plate facing the first pressure plate The second mold holder is disposed on the second pressure plate and is configured to hold the second mold, and the second mold holder is configured to be spaced apart from each other. The platen side is provided with a slit, and the thickness of the first platen at the outer end portion of the slit is thinner than the thickness of the first platen at the inner end portion of the slit. The apparatus for manufacturing a resin molded article according to claim 1, wherein the first platen is provided with an inclination on a side opposite to the second platen. The apparatus for manufacturing a resin molded article according to claim 1, wherein at least one of a step or a recessed portion is provided on a side of the first pressure plate opposite to the second pressure plate. The apparatus for producing a resin molded article according to claim 1, further comprising: an intermediate plate between the first pressure plate and the second pressure plate; and a third mold holder provided on the intermediate plate The first platen side is configured to hold the third mold, and the fourth mold holder is provided on the second platen side of the intermediate plate, and is configured to hold the fourth mold. A resin molding system comprising the apparatus for producing a resin molded article according to any one of claims 1 to 4. A manufacturing method of a resin molded article according to any one of claims 1 to 4, wherein the method for producing a resin molded article includes: a step of providing a support member to the mold; a step of supplying a resin material to the cavity of the second mold; and a step of clamping the first mold and the second mold.