SG10201808664WA - Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method - Google Patents

Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method

Info

Publication number
SG10201808664WA
SG10201808664WA SG10201808664WA SG10201808664WA SG10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA SG 10201808664W A SG10201808664W A SG 10201808664WA
Authority
SG
Singapore
Prior art keywords
molded product
resin molded
product manufacturing
platen
resin
Prior art date
Application number
SG10201808664WA
Inventor
Ichihashi Hideo
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201808664WA publication Critical patent/SG10201808664WA/en

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

RESIN MOLDED PRODUCT MANUFACTURING APPARATUS, RESIN MOLDING SYSTEM, AND RESIN MOLDED PRODUCT MANUFACTURING METHOD OF THE DISCLOSURE 5 There is provided a resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method that can reduce variation in thickness of a resin molded product. The resin molded product manufacturing apparatus includes: a first platen; a first mold chase holder provided on the first platen and configured to hold a first mold chase; a second platen spaced from 10 the first platen and facing the first platen; and a second mold chase holder provided on the second platen and configured to hold a second mold chase. A notch is provided on a side of the first platen closer to the second platen. A thickness of the first platen at an outer end portion of the notch is smaller than a thickness of the first platen at an inner end portion of the notch. 15 FIG. 1
SG10201808664WA 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method SG10201808664WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017206004A JP6845781B2 (en) 2017-10-25 2017-10-25 Resin molded product manufacturing equipment, resin molding system, and resin molded product manufacturing method

Publications (1)

Publication Number Publication Date
SG10201808664WA true SG10201808664WA (en) 2019-05-30

Family

ID=66254743

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201808664WA SG10201808664WA (en) 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method

Country Status (5)

Country Link
JP (1) JP6845781B2 (en)
KR (1) KR102209919B1 (en)
CN (1) CN109702944B (en)
SG (1) SG10201808664WA (en)
TW (1) TWI736804B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785896B2 (en) * 2019-01-28 2020-11-18 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (en) * 1988-09-02 1990-03-08
JPH0631736A (en) * 1992-07-14 1994-02-08 Apic Yamada Kk Molding equipment
JPH0929747A (en) * 1995-07-19 1997-02-04 Ricoh Co Ltd Mold heat insulating apparatus
JP4625488B2 (en) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 Mold platen, mold clamping device, injection molding machine
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
JP6066889B2 (en) * 2013-11-25 2017-01-25 Ｔｏｗａ株式会社 Compression molding apparatus and compression molding method
CN204011392U (en) * 2014-07-01 2014-12-10 比亚迪股份有限公司 Automobile, IGBT module and bottom deck assembly thereof
JP6440599B2 (en) 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP6012893B1 (en) * 2016-01-27 2016-10-25 エムテックスマツムラ株式会社 Resin molding equipment

Also Published As

Publication number Publication date
KR20190046661A (en) 2019-05-07
TW201916997A (en) 2019-05-01
JP2019077106A (en) 2019-05-23
TWI736804B (en) 2021-08-21
CN109702944B (en) 2021-05-04
JP6845781B2 (en) 2021-03-24
KR102209919B1 (en) 2021-02-01
CN109702944A (en) 2019-05-03

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