SG10201806043PA - Resin molding apparatus and method for manufacturing resin molded product - Google Patents

Resin molding apparatus and method for manufacturing resin molded product

Info

Publication number
SG10201806043PA
SG10201806043PA SG10201806043PA SG10201806043PA SG10201806043PA SG 10201806043P A SG10201806043P A SG 10201806043PA SG 10201806043P A SG10201806043P A SG 10201806043PA SG 10201806043P A SG10201806043P A SG 10201806043PA SG 10201806043P A SG10201806043P A SG 10201806043PA
Authority
SG
Singapore
Prior art keywords
upper mold
holding surface
jaw portion
molding apparatus
molded product
Prior art date
Application number
SG10201806043PA
Inventor
Keita Mizuma
Takeaki Taka
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201806043PA publication Critical patent/SG10201806043PA/en

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

RESIN MOLDING APPARATUS AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT 5 Shown is a resin molding apparatus includes an upper mold having a holding surface configured to hold a molding object on a lower side thereof, a lower mold disposed to face the upper mold and having a cavity, a molding object suctioning mechanism provided on the holding surface, a jaw portion provided in the upper mold to extend downward from a lateral side of the molding object held by the holding surface, 10 and a jaw portion moving mechanism configured to move the jaw portion to an outer side of the molding object held by the holding surface when the upper mold and the lower mold come close to each other at a jaw portion movement starting distance or less at the time of clamping the upper mold and the lower mold. 15 FIG.1A and FIG. 1B
SG10201806043PA 2017-08-21 2018-07-13 Resin molding apparatus and method for manufacturing resin molded product SG10201806043PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017158388A JP6482616B2 (en) 2017-08-21 2017-08-21 Resin molding apparatus and resin molded product manufacturing method

Publications (1)

Publication Number Publication Date
SG10201806043PA true SG10201806043PA (en) 2019-03-28

Family

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SG10201806043PA SG10201806043PA (en) 2017-08-21 2018-07-13 Resin molding apparatus and method for manufacturing resin molded product

Family Applications Before (1)

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Country Status (5)

Country Link
JP (1) JP6482616B2 (en)
KR (2) KR102167306B1 (en)
CN (1) CN109421208B (en)
SG (2) SG10202002603SA (en)
TW (2) TWI720526B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7203715B2 (en) * 2019-12-06 2023-01-13 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT
JP7203778B2 (en) * 2020-01-21 2023-01-13 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
CN110919965B (en) * 2020-02-13 2020-06-12 宁波方正汽车模具股份有限公司 Automobile front and rear door attached wood mechanism
JP7406247B2 (en) * 2020-05-22 2023-12-27 アピックヤマダ株式会社 resin mold equipment
JP7444452B2 (en) * 2020-10-26 2024-03-06 アピックヤマダ株式会社 Resin sealing device and workpiece transportation method
JP7035243B1 (en) * 2021-03-10 2022-03-14 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products

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JP3691621B2 (en) * 1997-02-14 2005-09-07 カルソニックカンセイ株式会社 Manufacturing method and manufacturing apparatus for resin molded product
JP2001353748A (en) * 2000-04-14 2001-12-25 Polyplastics Co Metal foil laminated molded article and molding method
JP2004090118A (en) * 2002-08-30 2004-03-25 Koshin:Kk Vacuum chuck
JP4474381B2 (en) * 2006-05-15 2010-06-02 住友重機械工業株式会社 Molded product fall prevention mechanism
JP4836661B2 (en) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 Resin sealing molding method for electronic parts and mold for resin sealing molding
JP5174874B2 (en) * 2010-09-16 2013-04-03 Ｔｏｗａ株式会社 Compression molding die and compression molding method
JP5229292B2 (en) * 2010-10-01 2013-07-03 第一精工株式会社 Resin sealing device and resin sealing method
ITTV20110177A1 (en) * 2011-12-20 2013-06-21 Da Lio Spa STATION, MOLD AND INJECTION MOLDING METHOD FOR PIECES WITH INSERTS
KR102455987B1 (en) * 2014-07-22 2022-10-18 아피쿠 야마다 가부시키가이샤 Molding die, molding device, method for manufacturing molded article and resin molding method
JP2016111323A (en) * 2014-11-26 2016-06-20 株式会社デンソー Substrate fixing device
JP6560498B2 (en) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 Resin sealing method and resin molded product manufacturing method
JP6491508B2 (en) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 Resin sealing device and method of manufacturing resin molded product
JP6564227B2 (en) 2015-04-10 2019-08-21 アピックヤマダ株式会社 Resin molding die, resin molding apparatus and resin molding method
JP6438913B2 (en) * 2015-07-15 2018-12-19 アピックヤマダ株式会社 Mold and resin molding equipment
US20190109021A1 (en) * 2016-11-11 2019-04-11 Shin-Etsu Engineering Co., Ltd. Resin-sealing device and resin-sealing method

Also Published As

Publication number Publication date
CN109421208A (en) 2019-03-05
TW201936358A (en) 2019-09-16
TWI720526B (en) 2021-03-01
TWI688465B (en) 2020-03-21
KR20200120584A (en) 2020-10-21
TW201912362A (en) 2019-04-01
JP6482616B2 (en) 2019-03-13
KR20190020610A (en) 2019-03-04
CN109421208B (en) 2021-06-29
SG10202002603SA (en) 2020-05-28
KR102167306B1 (en) 2020-10-19
KR102276028B1 (en) 2021-07-13
JP2019034510A (en) 2019-03-07

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