KR102276028B1 - Resin molding apparatus and method for manufacturing resin molded article - Google Patents

Abstract

The resin molding apparatus which can enlarge the resin molded article to manufacture as much as possible while reducing the possibility that a molding object will fall from an upper die is provided.
The resin molding apparatus 10 includes an upper die (first upper die 151A) having a holding surface (first holding surface 1511A) at the lower side for holding the object to be molded, and disposed opposite to the upper die, A lower die (first lower die 152A) having a cavity C, a molding object adsorption mechanism 19 provided on the holding surface, and a molding object held by the holding surface extend downward from the side, When the hook portion 16 provided on the upper die and the upper die and the lower die are molded together, when the upper die and the lower die come close to the hook portion movement start distance or less, the outer side of the molded object held by the holding surface and a claw part moving mechanism (a pressing part 173, a first to-be-pressed part 163, and a pressing mechanism 165) for moving the claw part.

Description

A resin molding apparatus and the manufacturing method of a resin molded article TECHNICAL FIELD

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article using the resin molding apparatus.

In order to protect electronic components from environments such as light, heat, and moisture, electronic components are generally sealed in resin. Therefore, resin molding is performed by a compression molding method, a transfer molding method, or the like. In the compression molding method, using a molding die for resin molding consisting of a lower die and an upper die, a resin material is supplied to the cavity of the lower die, a molding object (for example, a substrate on which an electronic component is mounted) is installed in the upper die, and then the resin Resin molding is performed by mold-clamping both while heating the lower and upper molds to melt the material. In the transfer molding method, a cavity is provided in one of the upper mold and the lower mold, the object to be molded is installed in the other, and both are molded while heating the lower mold and the upper mold, and the resin is supplied to the cavity with a plunger, whereby resin molding is performed.

Two examples are shown in patent document 1 as a structure for installing a shaping|molding object to an upper die. In the first example, an air circuit having an opening on the clamp surface (lower surface) of the upper die passing through the upper die is provided, and gas is sucked from the opening through the air circuit by a vacuum pump, so that the object to be molded is attached to the clamp surface. adsorbed. In the second example, a chuck claw is provided on the clamp face of the upper die, and the outer periphery of the object to be molded is gripped by the chuck claw.

Japanese Patent Laid-Open No. 2016-198945 ([0021] etc.)

In the case where the object to be molded is adsorbed on the clamp surface by sucking the gas with the vacuum pump, when the vacuum pump is stopped for some reason, the suction of the gas is stopped and the suction adsorption cannot be maintained, and the object to be molded falls from the upper die.

On the other hand, in the case of gripping the object to be molded with the chuck claw, the size of the resin molded article is limited because resin molding cannot be performed on the portion to be gripped by the chuck claw.

The problem to be solved by the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product capable of making the resin molded product to be manufactured as large as possible while reducing the possibility that the molding object may fall from an upper die.

The first aspect of the resin molding apparatus according to the present invention made in order to solve the above problems,

a) an upper mold having a holding surface at the lower side for holding the object to be molded;

b) a lower mold having a cavity disposed opposite the upper mold;

c) a molding object adsorption mechanism installed on the holding surface;

d) a hook portion provided on the upper die so as to extend downward from the side of the object to be molded held on the holding surface;

e) When the upper die and the lower die are molded together, when the upper die and the lower die come close to the hook part movement start distance or less, the hook portion located below the object to be molded held by the holding surface is the object to be molded. The hook part moving mechanism that moves it to the outside

It is characterized in that it is provided.

A second aspect of the resin molding apparatus according to the present invention,

a) an upper mold having a holding surface at the lower side for holding the object to be molded;

b) a lower mold having a cavity disposed opposite the upper mold;

c) a first molding object adsorption mechanism provided on the holding surface to adsorb the molding object to the holding surface by suction of gas by a vacuum pump;

d) a second object adsorption mechanism for adsorbing the object to be formed on the support surface by other than the suction of the gas by the vacuum pump provided on the holding surface;

It is characterized in that it is provided.

A first aspect of the method for manufacturing a resin molded article according to the present invention is a method for manufacturing a resin molded article using the resin molding apparatus of the first aspect,

a molding target holding step of extending the claw portion below the molding target in a state in which the molding target is adsorbed on the holding surface by the molding target adsorption mechanism;

a resin material supply step of supplying a resin material to the cavity;

A claw moving step in which the upper die and the lower die are brought into close proximity, and when the upper die and the lower die come close to less than the starting distance of the claw moving, the claw moving mechanism moves the claw to the outside of the object to be molded and,

a mold clamping step of clamping the upper mold and the lower mold;

a resin material curing process of curing the resin material after heating the resin material to a temperature at which the resin material in the cavity softens or melts;

characterized by having.

A second aspect of the method for manufacturing a resin molded article according to the present invention is a method for manufacturing a resin molded article using the resin molding apparatus of the second aspect,

a molding target holding step of adsorbing the molding target on the holding surface by the first molding target adsorption mechanism and the second molding target suction mechanism;

a resin material supply step of supplying a resin material to the cavity;

a mold clamping step of clamping the upper mold and the lower mold;

a resin material curing process of curing the resin material after heating the resin material to a temperature at which the resin material in the cavity softens or melts;

characterized by having.

A third aspect of the method for manufacturing a resin molded article according to the present invention is a method for manufacturing a resin molded article using the resin molding apparatus of the first aspect,

a molding target holding step of extending the claw portion below the molding target in a state in which the molding target is adsorbed on the holding surface by the molding target adsorption mechanism;

A claw moving step in which the upper die and the lower die are brought into close proximity, and when the upper die and the lower die come close to less than the starting distance of the claw moving, the claw moving mechanism moves the claw to the outside of the object to be molded and,

a mold clamping step of clamping the upper mold and the lower mold;

a resin material supply process of supplying a softened or melted resin material into the cavity;

A resin material curing process for curing the resin material supplied into the cavity

It is characterized by having.

A fourth aspect of the method for manufacturing a resin molded article according to the present invention is a method for manufacturing a resin molded article using the resin molding apparatus of the second aspect,

a molding target holding step of adsorbing the molding target on the holding surface by the first molding target adsorption mechanism and the second molding target suction mechanism;

a mold clamping step of clamping the upper mold and the lower mold;

a resin material supply process of supplying a softened or melted resin material into the cavity;

a resin material curing process of curing the resin material supplied into the cavity;

characterized by having.

ADVANTAGE OF THE INVENTION According to this invention, while reducing the possibility that a molding object will fall from an upper die, the resin molded article to manufacture can be enlarged as much as possible.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram (a) which shows one Embodiment (1st Embodiment) of the resin molding apparatus of a 1st aspect, and the figure (b) which expands and shows the shaping|molding die of this resin molding apparatus, and its surroundings.
Fig. 2 is a perspective view (a) and a side view (b) of a claw portion in the resin molding apparatus according to the first embodiment.
Fig. 3 is a schematic configuration diagram showing a molding object transport mechanism included in the resin molding apparatus according to the first embodiment;
It is a figure which shows the operation|movement of the resin molding apparatus of 1st Embodiment, and the manufacturing method of a resin molded article.
It is an enlarged view which shows the operation|movement of the claw part in the resin molding apparatus of 1st Embodiment, and the manufacturing method of a resin molded article, and its surroundings.
Fig. 6 is a schematic configuration diagram showing a modified example of a molding object transport mechanism;
Fig. 7 is a schematic configuration diagram (a) showing one embodiment (second embodiment) of a resin molding apparatus according to a second aspect, and an enlarged view (b) of a molding die of the resin molding apparatus and its surroundings.
Fig. 8 is a schematic configuration diagram showing a molding object transport mechanism included in the resin molding apparatus according to the second embodiment;
It is a figure which shows the operation|movement of the resin molding apparatus of 2nd Embodiment, and the manufacturing method of a resin molded article.
Fig. 10 is a schematic configuration diagram showing another embodiment (third embodiment) of the resin molding apparatus according to the first aspect.
Fig. 11 is a top view (a) of a lower mold and a bottom view (b) of an upper mold that the resin molding apparatus according to the third embodiment has.
It is a figure which shows the operation|movement of the resin molding apparatus of 3rd Embodiment, and the manufacturing method of a resin molded article.
Fig. 13 is a schematic configuration diagram showing another embodiment (fourth embodiment) of the resin molding apparatus according to the second aspect.
It is a figure which shows the operation|movement of the resin molding apparatus of 4th Embodiment, and the manufacturing method of a resin molded article.
Fig. 15 is a schematic configuration diagram showing an example of a modularized resin molding unit.

(1) Resin molding apparatus according to the first aspect

In the resin molding apparatus of the first aspect, the object to be molded is adsorbed to the holding surface by the molding object adsorption mechanism provided on the holding surface, and is held by the upper die. And the hook part is arrange|positioned below the shaping|molding object (thus the inside of the shaping|molding object). For this reason, even if the adsorption|suction to the holding surface of the shaping|molding object by the shaping|molding object adsorption|suction mechanism ceases to act for some reason, the shaping|molding object does not fall.

On the other hand, when the upper and lower molds come close to each other by less than the claw movement start distance, the claw portion moves outwardly than the object to be molded by the claw portion moving mechanism, so that even the portion of the surface of the object where the hook portion is disposed below there is also , resin sealing can be performed. Thereby, the resin molded article to produce can be enlarged. Here, the "claw part movement start distance" refers to the upper and lower molds that do not cause a problem even if the object to be molded falls from the upper mold (even if the clamp part is not disposed below the object to be molded) because, for example, the object adsorption mechanism does not function. defined by distance.

Further, since the claw portion is for preventing the object to be molded from falling when the object to be molded cannot be adsorbed onto the holding surface by the object adsorption mechanism, when the claw portion is disposed below the object to be molded, the surface of the object to be molded There may be some gaps between the hooks and the hooks.

In the present invention, the object to be molded is, for example, a substrate, and more specifically, for example, a substrate, a resin substrate, a wiring board, a wafer, glass, a metal plate, etc. are mentioned. However, the shaping|molding object in this invention is not limited to these, It is arbitrary. In addition, in the present invention, a member such as a chip may or may not be mounted on one surface of the object to be molded.

In the resin molding apparatus of the first aspect, the claw part moving mechanism is located above the lower end of the molded object held by the holding surface when the upper die and the lower die come close to each other by less than or equal to the claw moving start distance. It is preferable if it is to move the said hook part.

Explain why. In general, in a resin molding apparatus, in order to release the resin molded article after shaping|molding easily from a cavity, before supplying a resin material to a cavity, a release film is extended and provided in the inner surface of a cavity. The release film must cover a larger range than the upper and lower clamping surfaces (adhesion surfaces) in order to take out the resin molded product later and to reliably adhere the upper and lower clamp surfaces. In the resin molding apparatus of Patent Document 1, a relief portion for accommodating the chuck claw when the mold is clamped while holding the object to be molded with the chuck claw is provided on the clamp surface of the lower die, and also on the relief section The release film is stretched and installed. Then, the chuck claw presses the release film into the relief portion at the time of clamping the mold, thereby causing wrinkles in the release film, and there is a fear that the wrinkles may be transferred to the resin molded article. On the other hand, in the resin molding apparatus of the first aspect, according to the configuration using the claw moving mechanism that moves the claw upwards above the lower end of the object to be molded when the upper die and the lower die are close to each other by less than or equal to the claw moving start distance, relief is provided on the lower die There is no need to provide the part, and thereby the claw part does not press the release film into the relief part. Therefore, it can prevent that wrinkles arise in a release film, and it can prevent that wrinkles are transcribe|transferred to a resin molded article.

In the resin molding apparatus of the first aspect, the claw part moving mechanism further comprises the upper mold and the lower mold when the upper mold and the lower mold are mold-opened when the upper mold and the lower mold are spaced apart from the second claw part movement start distance, the holding surface It is preferable if the said hook part is moved to the lower side of the shaping|molding object hold|maintained by the. Thereby, even when the mold is opened, when the molding object cannot be adsorbed to the holding surface by the molding object adsorption mechanism, the molding object is held by the claw, so that the molding object does not fall. In addition, the said hook part movement start distance and the said 2nd hook part movement start distance may be same or different.

The resin molding apparatus of the first aspect comprises:

In addition, a pressing part and a pressing mechanism for pressing the claw part below the object to be molded held by the holding surface are provided;

The claw portion is provided with a substantially horizontal rotation shaft, and the upper die and the lower die provided at a lower portion in the vicinity of the outer side of the holding surface than the rotation shaft is pressed by the pressing portion when the hook portion moves closer than the starting distance. having a to-be-compressed part

it is preferable

According to the resin molding apparatus of the first aspect having such a portion to be pressed, a pressing portion and a pressing mechanism, the pressing mechanism presses the hook portion until the upper die and the lower die come close to less than the hook portion movement start distance during mold clamping. The hook portion is disposed below the object to be molded. On the other hand, when the upper die and the lower die come close to the claw part movement start distance or less, when the pressing part presses the to-be-pressed part, the claw part rotates about the rotation axis so as to move from the lower side of the molding object to the outside of the molding object. exert one effect.

If the claw part is rotated here, the claw part can be moved to the upper end of the shaping|molding object in the outer side of the shaping|molding object.

In the resin molding apparatus of the first aspect including the part to be pressed, the pressing part, and the pressing mechanism, the claw part is also closer to the outer side of the holding surface than the rotation shaft, and a second position is different from the part to be pressed. It is preferable to provide the to-be-pressed part. This second to-be-pressed portion can be used to move the claw portion to the outside of the molding object when holding the object to be molded on the holding surface and when removing the object from the holding surface. In that case, although the 2nd to-be-pressed part is pressed with the 2nd press part different from the said press part, what is necessary is just to provide a 2nd press part outside the resin molding apparatus of a 1st aspect. Since the second to-be-pressed portion is provided at a position different from the to-be-pressed portion, the second pressing portion and the pressing portion do not interfere.

The resin molding apparatus of the first aspect including the second part to be pressed further includes:

A molding object loading table for loading the molding object;

a first lifting mechanism for lifting and lowering the molding object loading table;

a second lifting mechanism for loading the first lifting mechanism and for raising and lowering the first lifting mechanism;

a second pressing unit that is an upper end of the second lifting mechanism and provided on both sides with the object mounting table interposed therebetween to correspond to the lateral position of the second pressed unit;

The second lifting mechanism is moved horizontally between a position where the object to be molded loaded on the object mounting table is directly below the holding surface between the upper die and the lower die and a position deviated from between the upper die and the lower die. a lateral movement mechanism that moves in the direction

It is preferable to further provide the shaping|molding object conveyance mechanism which has.

Using this shaping|molding object conveyance mechanism, the shaping|molding object before resin shaping|molding can be carried in to the holding surface of an upper mold as follows. First, the object to be molded is loaded on the object loading table, and then the second lifting mechanism (and the first lifting mechanism, the object loading table and the object to be formed directly or indirectly loaded thereon) is connected to the upper die by the lateral movement mechanism. move between the lower molds. At that time, the second pressing portion is made to correspond to the lateral position of the second pressed portion of the claw portion. By raising the second lifting mechanism there, the second pressing portion presses the second pressing portion. Then, the claw part moves to the outside of the holding surface. Next, the 1st raising/lowering mechanism rises until the shaping|molding object contact|abuts against a holding surface. At that time, since the claw part is on the outside of the holding surface, it is not obstructed. After the shaping|molding object adsorption|suction mechanism makes the shaping|molding object adsorb|suck to the holding surface, the 1st raising/lowering mechanism and the 2nd raising/lowering mechanism descend. Thereby, the 2nd pressing part is spaced apart from the 2nd to-be-pressed part, and the claw|claw part moves to the holding surface and the lower part of the shaping|molding object hold|maintained by the said holding surface. Thereafter, the second lifting mechanism (and the first lifting mechanism and the object mounting table) is moved to a position deviated between the upper die and the lower die by the lateral movement mechanism, and compression molding can be performed.

Moreover, it is also possible to carry out the shaping|molding object after resin molding from the holding surface of an upper mold using this shaping|molding object conveyance mechanism. In that case, first, the second lifting mechanism (and the first lifting mechanism and the object mounting table) is moved between the upper die and the lower die by the lateral movement mechanism, and then the second lifting mechanism is raised to remove the second pressing unit. 2 By pressing the part to be pressed, the claw part moves to the outside of the holding surface, and then the first elevating mechanism rises, and suction by the object adsorption mechanism is released from there to mount the object to be molded on the object mounting table. Then, after the first lifting mechanism and the second lifting mechanism are lowered, the position where the second lifting mechanism (and the first lifting mechanism, the object mounting table, and the object) is deviated from between the upper die and the lower die by the lateral movement mechanism By moving to the to-be-molded object is carried out.

The resin molding apparatus of the first aspect comprising the part to be pressed, the pressing part and the pressing mechanism further comprises:

a lower mold pressing part extending downward from the upper mold and having the lower mold in contact with the upper surface of the lower mold when the upper mold and the lower mold come close to a movement start distance of the hook part;

An elastic member installed between the upper mold and the lower mold pressing part

It is preferable to have

According to the resin molding apparatus of the first aspect having such a lower die pressing portion and an elastic member, when the upper die and the lower die come close to each other by less than or equal to the claw portion movement start distance at the time of clamping, the pressing portion provided in the lower die pressing portion presses the portion to be pressed. and, thereby, the claw portion moves from the lower side of the molding object to the outside of the molding object while being higher than the lower end of the molding object. Thereby, since the claw part moves only by the power of the relative movement mechanism (die clamping mechanism) of an upper mold|type and a lower mold|type, the power for separately moving a claw part is not required. At the same time, since the lower end of the lower die presser abuts against the upper surface of the lower die, the release film extending outside the cavity can be held by the lower die presser, particularly when a release film is used. In this case, the moving start distance of the hook part may be defined as the distance between the upper mold and the lower mold when the lower end of the lower mold pressing part is in contact with the upper surface of the lower mold.

(2) Resin molding apparatus according to the second aspect

In the resin molding apparatus of the second aspect, a first molding object adsorption mechanism for adsorbing a molding object to the holding surface by suction of gas by a vacuum pump, and holding the molding object by other than suction of gas by a vacuum pump By using the second object adsorption mechanism to be adsorbed to the support surface, even if the vacuum pump stops for any reason, the second object adsorption mechanism can maintain the adsorption of the object to be molded. On the other hand, even when the operation of the second object adsorption mechanism is stopped, the adsorption of the object to be molded can be maintained by the first object adsorption mechanism. In this way, by using the two systems of the object adsorption mechanism together, the possibility that the object to be molded falls from the upper die can be reduced.

Moreover, in the resin molding apparatus of a 2nd aspect, since it is not necessary to use a claw part, the resin molded article to produce can be enlarged.

Furthermore, since there is no need to use a hook part, when a release film is used, wrinkles can be prevented from occurring in the release film, and wrinkles can be prevented from being transferred to a resin molded article.

As the second object adsorption mechanism, a vacuum ejector, a Bernoulli chuck, an electrostatic chuck, or the like can be used. Among these, vacuum ejectors operate by stored compressed air, and usually do not require power for a while. Therefore, even when power is cut off due to a power failure or emergency stop operation by an operator, the vacuum ejector adsorbs the object to be molded. It is preferable because it can hold for a while.

(3) The manufacturing method of the resin molded article of 1st - 4th aspect

The manufacturing method of the resin molded article of a 1st aspect manufactures a resin molded article by the compression molding method using the resin molding apparatus of a 1st aspect. The manufacturing method of the resin molded article of a 2nd aspect manufactures a resin molded article by the compression molding method using the resin molding apparatus of a 2nd aspect. The manufacturing method of the resin molded article of a 3rd aspect manufactures a resin molded article by the transfer molding method using the resin molding apparatus of a 1st aspect. The manufacturing method of the resin molded article of a 4th aspect manufactures a resin molded article by the transfer molding method using the resin molding apparatus of a 2nd aspect. In any method for producing a resin molded article, the point of operating the resin molding apparatus as described above is different from the conventional method for producing a resin molded article, and the other points are the same as in the conventional method for producing a resin molded article.

(4) Specific embodiments of the first and second aspect resin molding apparatuses and the method for manufacturing the resin molded article of the first to fourth aspects

Hereinafter, more specific embodiment of the manufacturing method of the resin molding using the 1st and 2nd aspect resin molding apparatus and these resin molding apparatus is demonstrated using FIGS. 1-15.

(4-1) One Embodiment (1st Embodiment) of the manufacturing method of the resin molding apparatus of 1st aspect, and the resin molded article of 1st aspect

(4-1-1) Configuration of the resin molding apparatus of the first embodiment

1, the resin molding apparatus 10 which is one Embodiment (1st Embodiment) of the resin molding apparatus of a 1st aspect is shown. In (a) of FIG. 1, the whole resin molding apparatus 10 is shown, and in (b), the mold and its surroundings are enlarged and shown. The resin molding apparatus 10 of the first embodiment is an apparatus for performing compression molding, and includes a base 111, two tie bars 112 erected on the base 111, and a tie bar so as to be movable up and down. The lower movable platen 121 and the upper movable platen 122 held by the 112, the fixed platen 123 fixed to the upper end of the tie bar 112, and the base 111 ) provided on, a toggle link 113 for moving the lower movable platen 121 up and down is provided. In addition, the resin molding apparatus 10 has a first lower mold 152A on the upper surface of the lower movable platen 121 , a first upper mold 151A on the lower surface of the upper movable platen 122 , and an upper movable platen 122 . A second lower mold 152B is provided on the upper surface of the , and a second upper mold 151B is provided on the lower surface of the fixed platen 123 . The first forming die 15A is constituted by the first upper die 151A and the first lower die 152A, and the second forming die 15B is constituted by the second upper die 151B and the second lower die 152B. do. The resin molding apparatus 10 further includes a heat insulating material 141 in the vicinity of the platen between each platen and the upper or lower mold, and a heater 142 in the vicinity of the upper or lower mold, respectively. In this embodiment, the heat insulating material 141 uses what has arrange|positioned the columnar heat insulating member in two-dimensional shape, but you may use other heat insulating materials, such as a plate heat insulating material.

Next, the structure of the 1st shaping|molding die 15A and the 2nd shaping|molding die 15B is demonstrated, referring FIG.1(b). The 1st shaping|molding die 15A and the 2nd shaping|molding die 15B have the same structure. Therefore, below, each component of 15 A of 1st shaping|molding die is demonstrated. What changed the code|symbol with "A" at the end in the said description to "B" is a component of the 2nd shaping|molding die 15B.

The first molding die 15A includes a first upper die 151A and a first lower die 152A.

The first upper die 151A has a lower surface serving as a first holding surface 1511A for holding a molded object, and a gas suction hole 1512A is provided on the first holding surface 1511A. The gas suction hole 1512A is connected to the gas suction pipe 1513A installed in the first upper mold 151A and the heater 142, and the gas suction pipe 1513A, through a flexible connection pipe (not shown). , connected to the vacuum pump 191 . The molding object adsorption mechanism 19 is constituted by these gas suction holes 1512A, the gas suction pipe 1513A, the connection pipe, and the vacuum pump 191 . In addition, a vacuum ejector may be used instead of the vacuum pump 191 . Alternatively, instead of the object adsorption mechanism 19 shown here, a Bernoulli chuck, an electrostatic chuck, or the like may be used as the object adsorption mechanism.

The first lower die 152A includes a circumferential wall member 1521A having a planar shape (viewed from the top) and including a rectangular frame, a rectangular bottom face member 1522A charged in the frame of the circumferential wall member 1521A; It has an elastic member 1523A provided on the lower surface of 1521A of peripheral wall members. The space surrounded by these peripheral wall members 1521A and the bottom member 1522A becomes the cavity C to which the resin material is supplied. In addition, the planar shape of the peripheral wall member 1521A may take a shape other than a rectangle, such as a circle|round|circle, depending on the shape of the resin molded article to manufacture, The shape of the bottom face member 1522A is the planar shape of the peripheral wall member 1521A. It can be changed accordingly.

Claw portions 16 are provided on both sides of the first holding surface 1511A with the first holding surface 1511A of the first upper die 151A sandwiched therebetween. The perspective view of the hook part 16 is shown to Fig.2 (a), and the side view is shown to (b). The hook part 16 includes a hook part main body 161, a rotation shaft 162, a first part to be pressed (corresponding to the part to be pressed) 163, a second part to be pressed 164, and pressurization. A mechanism 165 is provided. The claw main body 161 extends from the outside to the inside of the first holding surface 1511A, and in a state pressed by the pressing mechanism 165 , the first holding surface 1511A and the first holding surface 1511A It is arrange|positioned below the shaping|molding object hold|maintained by the holding surface 1511A (FIG.1(b)). The rotation shaft 162 is substantially horizontal, and the entire hook portion 16 is rotatable about the rotation shaft 162 . Both the first part to be pressed 163 and the second part to be pressed 164 are in the vicinity of the outer side of the first holding surface 1511A rather than the rotation shaft 162, and are provided in the lower part of the claw part 16 as a whole, have. In the direction in which the rotation shaft 162 extends, the second part to be pressed 164 is disposed on the central side of the hook part 16 , and the first part to be pressed 163 is the second part to be pressed 164 . It is arranged on both sides (ie, two places). Moreover, the 2nd to-be-pressed part 164 is arrange|positioned below the 1st to-be-pressed part 163. As shown in FIG. The pressing mechanism 165 presses the claw part 16 as a whole so that the claw part main body 161 rotates downward from the outer side of the 1st holding surface 1511A centering on the rotation shaft 162. . When the claw main body 161 is at a position below the first holding surface 1511A by the pressurization by the pressing mechanism 165 , the pressing portion 173 described later is applied to the first pressed portion 163 By abutting, the claw part 16 as a whole does not rotate any longer, and the claw part main body 161 is held at the said position. Accordingly, the pressing portion 173, the first portion to be pressed 163, and the pressing mechanism 165 function as a claw portion moving mechanism.

A lower mold pressing portion 17 is provided on the side of the first holding surface 1511A and outside the claw portion 16 (FIG. 1(b)). The lower mold pressing part 17 has a lower mold pressing part main body 171 , a lower mold pressing part elastic member 172 , and a pressing part 173 . The lower mold pressing part main body 171 is a bar extending downwardly provided with the lower mold pressing part elastic member 172 interposed therebetween with the first upper mold 151A. The pressing part 173 is a bar extending from the lower mold pressing part main body 171 toward the hook part 16, and is provided at a height in contact with the first part to be pressed 163 when the mold is not fastened. Two of the pressing parts 173 are provided in one lower die pressing part 17 in response to the two first to-be-pressed parts 163 being provided in one claw part 16 .

In addition, the resin molding apparatus 10 has a molding object conveying mechanism 80 . As shown in Fig. 3, the molding object transport mechanism 80 includes a molding object mounting table 81 for loading a molding object, a first lifting mechanism 82 for lifting and lowering the molding object loading table 81, and a first A second lifting mechanism 83 for loading and lowering one lifting mechanism 82 and raising and lowering the first lifting mechanism 82, and an upper end of the second lifting mechanism 83, a molding object mounting table 81 is interposed between A lateral movement for moving the second pressing portions 84 provided on both sides thereof and the second lifting mechanism 83 in the lateral direction (approximately horizontal direction; a direction perpendicular to the paper in FIGS. 1A and 3 ). It has a mechanism (85). The lateral movement mechanism 85 is a position where the object loaded on the object mounting table 81 is directly below the first holding surface 1511A between the first upper die 151A and the first lower die 152A. , The second lifting mechanism 83 is moved in the lateral direction between the positions deviated from between the first upper die 151A and the first lower die 152A. The position of the second pressing portion 84 in the lateral direction is when the position in the lateral direction of the molding target mounting table 81 and the first holding surface 1511A is aligned, the second pressing target of the claw portion 16 is It coincides with the position in the transverse direction of the part 164 . In addition, although the 1st shaping|molding die 15A was mentioned as an example and demonstrated here, the same shaping|molding object conveyance mechanism 80 is provided also about the 2nd shaping|molding die 15B.

(4-1-2) The operation of the resin molding apparatus of the first embodiment and the manufacturing method of the resin molded article

The operation|movement of the resin molding apparatus 10 of 1st Embodiment and the manufacturing method of a resin molded article are demonstrated using FIG.4 and FIG.5. The overall operation of the resin molding apparatus 10 of the first embodiment is shown in FIG. 4 , and the operation of the claw 16 and surrounding components of the resin molding apparatus 10 is enlarged and shown in FIG. 5 . In reality, although the 1st shaping|molding die 15A and the 2nd shaping|molding die 15B perform the same operation|movement at the same time, only the operation|movement of the 1st shaping|molding die 15A is demonstrated except for the part specifically mentioned below.

Before the start of operation, as described above, the claw main body 161 of the claw part 16 is located below the lower surface of the first holding surface 1511A (FIG. 5(a)).

First, the object S is loaded on the object mounting table 81 of the object transport mechanism 80, and then, by the lateral movement mechanism 85, the second lifting mechanism 83, and directly there or The indirectly loaded first lifting mechanism 82, the object mounting table 81 and the object S are moved between the first upper die 151A and the first lower die 152A of the first forming die 15A. . In addition, the lateral position of the second pressing portion 84 provided on the upper end of the first lifting mechanism 82 is aligned with the lateral position of the second pressed portion 164 . Next, the first lifting mechanism 82 is raised by the second lifting mechanism 83 , and the second pressing part 164 is pressed by the second pressing part 84 ( FIG. 4A ). Thereby, the claw part 16 rotates, and the claw part main body 161 moves to the outer side of the 1st holding surface 1511A of the 1st upper die 151A (FIG.5(b)). In this state, the object mounting table 81 is raised by the first lifting mechanism 82 so that the object S on the object mounting table 81 is brought into contact with the first holding surface 1511A ( 4 (b)). At that time, since the claw main body 161 is on the outside of the first holding surface 1511A, the claw main body 161 does not obstruct the rise of the object mounting table 81 .

Then, by operating the vacuum pump 191 and sucking air from the gas suction hole 1512A through the gas suction pipe 1513A, the molding object S on the molding object mounting table 81 is held on the first holding surface ( 1511A). Thereafter, the object mounting table 81 is lowered by the first lifting mechanism 82, and the first lifting mechanism 82 is lowered by the second raising and lowering mechanism 83, and further, the lateral movement mechanism ( 85) moves the second lifting mechanism 83, the first lifting mechanism 82, and the object mounting table 81 to a position transversely deviated from between the first upper mold 151A and the first lower mold 152A. move (FIG. 4(c)). Here, when the first raising/lowering mechanism 82 is lowered, the pressure of the second to-be-pressed portion 164 by the second pressing portion 84 is released, so that the claw portion 16 is in the opposite direction to that of the pressing. rotates, and the claw part main body 161 moves below (inside) 1511A of 1st holding surfaces (FIG.5(c)).

Next, the release film F is extended and installed on the inner surface of the cavity C of the 1st lower mold 152A by the release film extension installation mechanism (not shown). Specifically, the release film F is stretched between the peripheral wall member 1521A and the bottom member 1522A in a state in which the upper side of the cavity C and the upper surface of the peripheral wall member 1521A around it are covered. This is performed by sucking air with a vacuum pump 191 . At this time, the release film F exists not only on the inner surface of the cavity C, but also on the upper surface of the peripheral wall member 1521A. Then, the resin material P is supplied in the cavity C by the resin material supply mechanism (not shown) (FIG.4(d)). Thereafter, the resin material P is melted by heating with the heater 142 .

When the resin material P in the cavity C is melted, the lower movable platen 121 is raised by the toggle link 113 . Thereby, the first lower mold 152A on the lower movable platen 121 abuts against the first upper mold 151A to push up the first upper mold 151A and the upper movable platen 122, and furthermore, the upper movable platen The second lower mold 152B of the upper mold 122 abuts against the second upper mold 151B. Since the second upper mold 151B is fixed to the fixed platen 123, the first upper mold 151A, the first lower mold 152A, and the second upper mold 151B and the second lower mold 152B are molded together. do.

When attention is again focused on the 1st shaping|molding die 15A, when the 1st shaping|molding die 15A is clamping, the 1st lower die 152A approaches the 1st upper die 151A. At this stage, the claw part main body 161 exists below the 1st holding surface 1511A, and if the vacuum pump 191 stops, etc., the shaping|molding object S on the 1st holding surface 1511A. ) even if the adsorption is stopped, since the molding object S is received by the claw main body 161, it is possible to prevent the molding object S from falling. In addition, when the first lower die 152A approaches the first upper die 151A by the first distance (the distance to start movement of the hook part), the lower die presser body 171 moves to the peripheral wall member 1521A of the first lower die 152A. ) is in contact with the upper surface of That is, the moving start distance of the hook part may be defined as a distance between the first upper mold 151A and the first lower mold 152A at which the lower mold pressing part main body 171 abuts against the peripheral wall member 1521A. In addition, when the first lower die 152A approaches the first upper die 151A, the lower die pressing portion elastic member 172 is compressed, and the pressing portion 173 is the first pressed portion of the claw portion 16 ( 163) is pushed up. Thereby, the claw part 16 rotates, and the claw part main body 161 moves to the outside of the 1st holding surface 1511A of the 1st upper die 151A (FIG.5(d)). The 1st distance and the 2nd distance mentioned later are set to the distance in which a problem does not generate|occur|produce even if the shaping|molding object adsorption|suction mechanism does not function here, for example and the shaping|molding object falls from an upper die. Therefore, there is no protection by the claw main body 161 until the first upper die 151A and the first lower die 152A are spaced apart by a second distance by performing die clamping and further die opening thereafter. , no problem occurs even if the object to be molded falls.

Thereafter, the first lower die 152A approaches the first upper die 151A, and the first upper die 151A and the first lower die 152A are clamped (FIG. 4(e)). And the temperature at which the resin material in the cavity C hardens|cures is maintained until the said resin material hardens. At that time, since the claw main body 161 exists outside the first holding surface 1511A, the claw main body 161 does not become an obstacle, and the resin over a wide range in the object S is formed. molding can be performed. In addition, at this stage, the claw part main body 161 is arrange|positioned above the lower end of the shaping|molding object S hold|maintained by 1511 A of 1st holding surfaces (FIG.5(d)). Therefore, the claw main body 161 does not come into contact with the upper surface of the peripheral wall member 1521A, and a recess (relief part) for relieving the claw main body 161 is provided on the upper surface of the peripheral wall member 1521A. no need to install Therefore, the claw part main body 161 does not press the release film F, and generate|occur|produce a wrinkle in the said release film F.

After the resin material in the cavity C is cured, the lower movable platen 121 is lowered by the toggle link 113 to open the first molding die 15A and the second molding die 15B ( 4(f)). Paying attention to the first forming die 15A, when the first upper die 151A and the first lower die 152A are spaced apart by a second distance (the same as the first distance in this embodiment), the lower die pressing part body ( Since 171 is spaced apart from the upper surface of the peripheral wall member 1521A and the pressing of the first to-be-pressed portion 163 by the pressing portion 173 is released, the claw portion 16 is in the opposite direction to that of the pressing. rotates, and the claw part main body 161 moves downward (inside) of the 1st holding surface 1511A. Here, depending on the thickness of the resin molded product PS formed on the lower side of the molding object S, the hook main body 161 does not reach the lower surface of the resin molded product PS, but on the side of the resin molded product PS. Although it may contact, when the adsorption|suction of the shaping|molding object S to 1511 A of 1st holding surfaces stops, there is no obstacle in preventing the fall of the shaping|molding object S by the claw part main body 161.

After mold opening, the molding target object S with the resin molded product PS is carried out from the 1st holding surface 1511A by the molding target conveyance mechanism 80. Specifically, first, the second lifting mechanism 83 , the first lifting mechanism 82 , and the object mounting table 81 are connected to the first upper die 151A and the first lower die 152A by the lateral movement mechanism 85 . It is conveyed in between, and the position of the lateral direction of the 2nd pressing part 84 is matched with the position of the lateral direction of the 2nd to-be-pressed part 164. As shown in FIG. Next, by raising the first lifting mechanism 82 and the second pressing unit 84 by the second lifting mechanism 83, the claw main body 161 is moved to the outside of the first holding surface 1511A ( 5(b)) and by raising the molding object mounting table 81 by the first lifting mechanism 82, the molding target mounting table 81 is brought into contact with the lower surface of the resin molded product PS. . Then, the adsorption|suction of the shaping|molding object S by the shaping|molding object adsorption|suction mechanism 19 is stopped, the 1st lifting mechanism 82 lowers the shaping|molding object mounting table 81, and the 2nd raising/lowering mechanism 83 ) to lower the first lifting mechanism 82 . And the 2nd raising/lowering mechanism 83, the 1st raising/lowering mechanism 82, the shaping|molding object mounting base 81, and the shaping|molding object S are connected by the lateral movement mechanism 85 to the 1st upper die 151A and the 1st lower die. By moving it outward from between 152A, the shaping|molding object S can be carried out.

In addition, instead of the object conveying mechanism 80, the object conveying mechanism 80A shown in FIG. 6 can be used. The molding object conveying mechanism 80A includes a molding object mounting table 81A, a lifting mechanism 83A provided below the molding object mounting table 81A to elevate the molding object mounting table 81A, and molding; It has a second pressing portion 84A, which is a pin disposed around the object mounting table 81A and is at least partially made of an elastic member, and a lateral movement mechanism 85A for moving the lifting mechanism 83A in the lateral direction. The lifting mechanism 83A used in this modification can switch the strength and weakness of the force pushing up the shaping|molding object mounting table 81A into two steps. Among the forces for pushing up the object mounting table 81A, the weaker force is such that the elastic member does not bend when the second pressing portion 84A is pressed against the second pressed portion 164, and the stronger one is The force of is a force that bends the elastic member when the second pressing portion 84A is pressed against the second pressed portion 164 . The positional relationship between the object mounting table 81A and the second pressing portion 84A is fixed (in this regard, the vertical positional relationship between the molding object placing table 81 and the second pressing portion 84 is the first). 2 Different from the object conveying mechanism 80 changeable by the lifting mechanism 83), the upper surface of the object mounting table 81A is between the upper end and the lower end of the second pressing portion 84A.

The operation of the molding object conveying mechanism 80A will be described. After loading the object to be molded on the object placing table 81A, the lifting mechanism 83A pushes up the object placing table 81A with the weaker force among the two stages of strength and weakness by the lifting mechanism 83A, and the second pressing part 84A is brought into contact with the second to-be-compressed part 164 . Thereby, the 2nd pressing part 84A presses the 2nd to-be-pressed part 164 without bending an elastic member, makes the claw part 16 rotate, and the claw part main body 161 is moved to the 1st upper die 151A. ) to the outside of the first holding surface 1511A (see Fig. 5 (b)). At this time, since the upper surface of the object mounting table 81A is below the upper end of the second pressing portion 84A, the object to be formed on the object mounting table 81A reaches the first holding surface 1511A. not done

Thereafter, the object mounting table 81A is pushed up by the lifting mechanism 83A by the stronger force of the two stages of strength and weakness. Then, the elastic member of the second pressing portion 84A is bent, and the upper surface of the object mounting table 81A is moved to a higher position than before the elastic member is bent. Thereby, the shaping|molding object on the shaping|molding object mounting table 81A is contacted with 1511A of 1st holding surfaces. At that time, since the claw main body 161 is on the outside of the first holding surface 1511A, the claw main body 161 does not obstruct the rise of the object mounting table 81A. Then, the shaping|molding object is made to adsorb|suck to 1511A of 1st holding surfaces by sucking air from 1512A of gas suction holes. Thereafter, by lowering the object mounting table 81A by means of the lifting mechanism 83A, the claw 16 rotates in the opposite direction to that of the pressing, and the claw body 161 moves to the first holding surface ( 1511A) (see Fig. 5(c)).

(4-2) One Embodiment of the resin molding apparatus of a 2nd aspect, and the manufacturing method of the resin molded article of a 2nd aspect

(4-2-1) Configuration of the resin molding apparatus of the second embodiment

7, the resin molding apparatus 20 which is one Embodiment (2nd Embodiment) of the resin molding apparatus of a 2nd aspect is shown. In (a) of FIG. 7, the whole resin molding apparatus 20 is shown, and in (b), the mold and its surroundings are enlarged and shown. The resin molding apparatus 20 of 2nd Embodiment has the same base 111, tie bar 112, lower movable platen 121, and upper movable platen 122 as the resin molding apparatus 10 of 1st embodiment. ), a toggle link 113 , a heat insulator 141 and a heater 142 . A first lower mold 252A on the upper surface of the lower movable platen 121, a first upper mold 251A on the lower surface of the upper movable platen 122, and a second lower mold 252B on the upper surface of the upper movable platen 122 A second upper mold 251B is provided on the lower surface of the fixed platen 123 , respectively. The first molding die 25A is constituted by the first upper die 251A and the first lower die 252A, and the second molding die 25B is constituted by the second upper die 251B and the second lower die 252B. do. Since the 1st shaping|molding die 25A and the 2nd shaping|molding die 25B have the same structure, each component of the 1st shaping|molding die 25A is demonstrated below. What changed the code|symbol with "A" at the end in the said description to "B" is a component of the 2nd shaping|molding die 25B.

The first upper die 251A has a lower surface serving as a first holding surface 2511A for holding a molded object, and a first gas suction hole 2512A1 and a second gas are provided on the first holding surface 2511A. A suction hole 2512A2 is provided. The first gas suction hole 2512A1 is connected to the vacuum pump 291 through the first gas suction pipe 2513A1 provided in the first upper mold 251A and the heater 142 and a flexible connection pipe (not shown). is connected to The second gas suction hole 2512A2 is connected to the vacuum ejector 292 through the first upper mold 251A and the second gas suction pipe 2513A2 installed in the heater 142 and a flexible connection pipe (not shown). is connected to The vacuum ejector 292 operates by compressed air supplied from a compressed air tank, and compressed air is supplied to the compressed air tank from a compressor (not shown). When the compressor cannot be operated due to a power failure or the like, the vacuum ejector 292 can be operated with the compressed air of the compressed air tank for a while. The first gas suction hole 2512A1, the first gas suction pipe 2513A1, the connecting pipe, and the vacuum pump 291 constitute the first molding object adsorption mechanism, the second gas suction hole 2512A2, the second gas suction pipe ( 2513A2), the connecting pipe, and the vacuum ejector 292 constitute the second molding object adsorption mechanism.

The first lower die 252A has the same circumferential wall member 1521A, the bottom member 1522A, and the elastic member 1523A as those of the first lower die 152A of the first embodiment.

The resin molding apparatus 20 includes a lower mold pressing part main body 271 and a lower mold pressing part 27 having a lower mold pressing part elastic member 272 . However, the lower mold|type press part 27 does not have the structure corresponded to the press part 173 in the lower mold|type press part 17 of 1st Embodiment.

In addition, the resin molding apparatus 20 has a molding object conveying mechanism 80B. As shown in FIG. 8 , the molding target transport mechanism 80B includes a molding target mounting table 81B for loading a molding target, a lifting mechanism 83B for raising and lowering the molding target mounting table 81B, and molding target loading. It has a lateral movement mechanism 85B which moves the base 81B and the lifting mechanism 83A in the lateral direction. In the resin molding apparatus 10 of the first embodiment, the molding object conveying mechanism 80B does not have a configuration corresponding to the second pressing unit and the second lifting mechanism included in the molding object conveying mechanism 80 .

In addition, the claw part is not provided in the resin molding apparatus 20. As shown in FIG. In addition, although the 2nd shaping|molding object adsorption|suction mechanism which has the vacuum ejector 292 was used here, a Bernoulli chuck, an electrostatic chuck, etc. can also be used instead.

(4-2-2) The operation of the resin molding apparatus of the second embodiment and the manufacturing method of the resin molded article

The operation|movement of the resin molding apparatus 20 of 2nd Embodiment and the manufacturing method of a resin molded article are demonstrated using FIG. First, the molding object S is loaded on the molding object mounting table 81B of the molding object conveying mechanism 80B, and then the lifting mechanism 83B and the molding object loading table 81B by the lateral movement mechanism 85B. is moved between the first upper die 251A and the first lower die 252A of the first forming die 25A. Next, the object mounting table 81B is raised by the lifting mechanism 83B, and the object S on the object mounting table 81B is brought into contact with the first holding surface 2511A (FIG. 9). (a)). Then, the vacuum pump 291 is operated to suck air from the first gas suction hole 2512A1 through the first gas suction pipe 2513A1, and the vacuum ejector 292 is started to start the second gas suction pipe ( By sucking air from the second gas suction hole 2512A2 through 2513A2 , the object S on the object mounting table 81B is adsorbed to the first holding surface 2511A. Thereafter, the object mounting table 81B is lowered by the lifting mechanism 83B, and the lifting mechanism 83B and the object placing table 81B are connected to the first upper die 251A by the lateral movement mechanism 85B. It is moved to a position deviated from the first lower mold 252A in the lateral direction.

Next, the release film F is extended and installed on the inner surface of the cavity C of the 1st lower mold 252A by the release film extension installation mechanism which is not shown in figure. Stretching of the release film F can be performed by the same method as that of the resin molding apparatus 10 of the first embodiment. Then, the resin material P is supplied in the cavity C by the resin material supply mechanism (not shown) (FIG.9(b)).

Thereafter, the resin material P is melted by heating with the heater 142 . When the resin material P in the cavity C is melted, the lower movable platen 121 is raised by the toggle link 113 . Thereby, similarly to the resin molding apparatus 10 of 1st Embodiment, the 1st shaping|molding die 25A and the 2nd shaping|molding die 25B are respectively clamped (1st shaping|molding to FIG.9(c)) Indicates the state of the clamping of the mold (25A)). After the mold clamping, the temperature at which the resin material in the cavity C is cured is maintained until the resin material is cured. Thereafter, by lowering the lower movable platen 121 by the toggle link 113, the first molding die 25A and the second molding die 25B are mold-opened (FIG. 9(d)).

After mold opening, the molding target object S in which the resin molded product PS was formed is carried out by the molding target conveyance mechanism 80A from 2511A of 1st holding surfaces. Specifically, first, by the lateral movement mechanism 85, the lifting mechanism 83A and the object mounting table 81B are moved between the first upper die 251B and the first lower die 252A of the first molding die 25A. move it Next, the object mounting table 81B is raised by the lifting mechanism 83B, and the object S on the object mounting table 81B is brought into contact with the first holding surface 2511A (FIG. 9). Same as (a)). After that, all of the adsorption|suction of the shaping|molding object S using the vacuum pump 291 and the vacuum ejector 292 is stopped. Then, the object mounting table 81B is lowered by the lifting mechanism 83B, and the lifting mechanism 83B and the object placing table 81B are connected to the first upper die 151A by the lateral movement mechanism 85. 1 By moving outward from between 152A of lower molds, the shaping|molding object S can be carried out.

In the operation up to this point, the vacuum pump 291 and the compressor are used, for example, by static electricity by using the first object adsorption mechanism using the vacuum pump 291 and the second object adsorption mechanism using the vacuum ejector 292 . Even if is stopped, the supply of compressed air from the compressed air tank of the second object adsorption mechanism to the vacuum ejector 292 is temporarily held, whereby the adsorption of the object S can be temporarily maintained. In addition, even if the vacuum ejector 292 is stopped due to circumstances such as the compressor being out of order for a long time, adsorption of the object S can be maintained by the first object adsorption mechanism. For the above reason, with the resin molding apparatus 20 of 2nd Embodiment, the possibility that a shaping|molding object will fall from an upper mold can be reduced.

In addition, in the resin molding apparatus 20 of the second embodiment, since the claw portion is not used, the resin molded article to be manufactured can be enlarged without interfering with the claw portion, and wrinkles can be prevented from occurring in the release film. can

(4-3) Another embodiment (third embodiment) of the resin molding apparatus of the first aspect, and one embodiment of the method for manufacturing the resin molded article of the third aspect

(4-3-1) Configuration of the resin molding apparatus of the third embodiment

10, the structure of the resin molding apparatus 30 of 3rd Embodiment is shown. In (a) of FIG. 10, the whole resin molding apparatus 30 is shown, and in (b), the mold and its surroundings are enlarged and shown. This resin molding device 30 is a device for performing transfer molding, and holds a base 311, two tie bars 312 erected on the base 311, and the tie bars 312 so as to be movable up and down. The supported movable platen 321, the fixed platen 323 fixed to the upper end of the tie bar 312, and the toggle link 313 installed on the base 311 for moving the movable platen 321 up and down to provide Each of the components described so far is the same as the resin molding apparatus 10 of the first embodiment, except that only one movable platen 321 is provided.

The resin molding apparatus 30 also includes a molding die 35 . The molding die 35 has a lower die 352 provided on the upper surface of the movable platen and an upper die 351 provided on the lower surface of the fixed platen 323 . In the lower die 352, two cavities C surrounded by a peripheral wall member 3521 and a bottom member 3522 are formed as shown in Figs. 10(b) and 11(a), 2 A port 381 is disposed between the jaws of the perimeter wall member 3521 and the bottom member 3522 of the dog. A plunger 382 is inserted through the port 381 from the lower side. A runner 383 connecting the port 381 and the cavity C is provided on the upper surface of the peripheral wall member 3521 . The upper surfaces of the port 381 and the runner 383 are normally open, and are closed only when mold fastening is performed by a port runner block 39 to be described later. On the upper surface of the peripheral wall member 3521, a plurality of suction ports (shown by circles in Fig. 11A) for sucking the release film F are provided.

The upper die 351 is provided on both sides with respect to two sets of peripheral wall members 3521 of the lower die 352 and a holding surface 3511 provided on the upper side of the cavity C, respectively, and two holding surfaces 3511 respectively. A hook portion 16 and a lower mold pressing portion 17 provided outside the hook portion 16 are provided. Since each component of these claw part 16 and the lower mold|type clamp part 17 is the same as that of 1st Embodiment, after attaching the code|symbol attached|subjected in 1st Embodiment as it is, detailed description is abbreviate|omitted. A gas suction hole 3512 is provided in the holding surface 3511 . The gas suction hole 3512 is connected to the vacuum pump 391 via a gas suction pipe 3513 and a flexible connecting pipe (not shown). In addition, a port runner block 39 is provided directly above the port 381 and the runner 383 (FIG. 11(b)). A pair of port runner blocks 39 are provided with the lower mold pressing part 17 interposed therebetween in the vertical direction in Fig. 11 (b) (therefore, without interfering with the lower mold pressing part 17 in position), Correspondingly, a pair of ports 381 and runners 383 are also provided in a row in the vertical direction in Fig. 11A.

The resin molding apparatus 30 also has the same molding object conveyance mechanism 80 as the resin molding apparatus 10 of 1st Embodiment.

(4-3-2) Operation of the resin molding apparatus of the third embodiment and the manufacturing method of the resin molded article

The operation|movement of the resin molding apparatus 30 of 3rd Embodiment and the manufacturing method of a resin molded article are demonstrated using FIG. 12, two sets of peripheral wall members 3521 and bottom face members 3522 of the lower die 352, and two sets of holding surfaces 3511 of the upper die 351, a claw portion 16, and a lower die pressing portion Although only one set of (17) etc. is shown, each component of these two sets operates in the same way.

First, by using the molding object conveying mechanism 80 , by the same operation as the resin molding apparatus 10 of the first embodiment, the molding object conveying mechanism 80 is positioned between the upper die 351 and the lower die 352 . After moving to , the first lifting mechanism 82 is raised by the second lifting mechanism 83 , the second pressing part 84 is pressed to press the second part to be pressed 164 , and further, the first lifting mechanism 82 is pressed. By 82, the object mounting table 81 is raised, and the object S is brought into contact with the holding surface 3511 (FIG. 12(a)). At that time, similarly to the case of the first embodiment, the claw part 16 is pressed by the second pressing part 84 of the object conveying mechanism 80 to press the second pressed part 164 of the claw part 16 . ) rotates and the hook part main body 161 moves to the outside of the holding surface 3511 (refer to FIG. 5(b) ), so that the hook part main body 161 is the molded object mounting table 81 . Nothing hinders the ascent. Thus, by operating the vacuum pump 391 in the state in which the shaping|molding object S contacted the holding surface 3511, the shaping|molding object S is made to attract|suck to the holding surface 3511. After that, when the object mounting table 81 is lowered, the claw part 16 rotates, and the claw part main body 161 moves to the lower side of the holding surface 3511 and the object S. Thereby, even if the vacuum pump 391 stops, since the shaping|molding object S can be received by the claw part main body 161, it can prevent that the shaping|molding object S falls. Thereafter, the object conveying mechanism 80 is removed from the position between the upper die 351 and the lower die 352 .

Next, while injecting|throwing-in the solid resin material P in the port 381, the release film F is extended and installed in the inner surface of the cavity C (FIG.12(b)). When extending the release film F, gas is sucked from a suction port provided on the upper surface of the peripheral wall member 3521 .

Then, the movable platen 321 is raised by the toggle link 313 to perform clamping. At that time, when the upper die 351 and the lower die 352 come close to the claw part movement start distance or less, the lower die presser body 171 abuts against the upper surface of the peripheral wall member 3521 of the lower die 352, and further the upper die ( When the lower mold 351 and the lower mold 352 come close to each other, the lower mold pressing part elastic member 172 is compressed and the pressing part 173 pushes up the first pressed part 163 of the hook part 16 . Thereby, the claw part 16 rotates, and the claw part main body 161 moves to the outside of the holding surface 3511 of the upper die 351 (refer FIG.5(d)). Thereby, resin molding can be performed over a wide range in the shaping|molding object S without the claw part main body 161 being obstructed. In addition, the claw main body 161 does not come into contact with the upper surface of the peripheral wall member 3521, and a recess (relief portion) for relieving the claw main body 161 is provided on the upper surface of the peripheral wall member 3521 . no need. Therefore, the claw part main body 161 does not press the release film F, and generate|occur|produce a wrinkle in the said release film F.

After mold clamping, the resin material P in the pot 381 is melted by heating with a heater (not shown), and the resin material P is extruded from the pot 381 by the plunger 382 (Fig. 12(c)). )). The resin material P extruded from the port 381 passes through the runner 383 and is supplied into the cavity C. After the resin material P in the cavity C is cured, the movable platen 321 is lowered by the toggle link 313 to open the mold (FIG. 12(d)). And by the method similar to the case of 1st Embodiment, manufacture of one resin molded article PS is completed by peeling off the shaping|molding object S from the holding surface 3511 of the upper die 351.

(4-4) Another embodiment (fourth embodiment) of the resin molding apparatus of the second aspect, and one embodiment of the method for manufacturing the resin molded article of the fourth aspect

(4-4-1) Configuration of the resin molding apparatus of the fourth embodiment

Fig. 13 shows the configuration of a resin molding apparatus 40 according to the fourth embodiment. In (a) of FIG. 13, the whole resin molding apparatus 40 is shown, and in (b), the mold and its surroundings are enlarged and shown. The resin molding apparatus 40 of 4th Embodiment has the same base 311, tie bar 312, toggle link 313, movable platen 321, and fixed as the resin molding apparatus 30 of 3rd Embodiment. It has a platen 323 . A lower die 352 is provided on the upper surface of the movable platen 321, and an upper die 451 is provided on the lower surface of the fixed platen 323, respectively, and the molding die 45 is formed by the upper die 451 and the lower die 352. ) is composed. Since the lower mold|type 352 has the same structure as that of the resin molding apparatus 30 of 3rd Embodiment, after attaching|subjecting the code|symbol same as 3rd Embodiment, description is abbreviate|omitted.

The lower surface of the upper die 451 is a holding surface 4511 for holding the object to be molded, and a first gas suction hole 45121 and a second gas suction hole 45122 are provided on the holding surface 4511 . has been The first gas suction hole 45121 is connected to the vacuum pump 491 via the first gas suction pipe 45131 and a flexible connecting pipe (not shown). The second gas suction hole 45122 is connected to the vacuum ejector 492 via a second gas suction pipe 45132 and a flexible connecting pipe (not shown). The vacuum ejector 492 is operated using the compressed air supplied from the compressor to the compressed air tank, similarly to the case of the second embodiment.

The upper die 451 is provided with a lower die pressing portion 17 and a pot runner block (not shown) similar to those of the resin molding apparatus 30 of the third embodiment. However, the pressing part 173 which the lower mold|type press part 17 of the resin molding apparatus 30 of 3rd Embodiment has is not provided in this embodiment. In addition, the claw part which the resin molding apparatus 30 of 3rd Embodiment has is not provided in this embodiment.

The resin molding apparatus 40 is further equipped with the molding object conveyance mechanism 80A similar to the resin molding apparatus 20 of 2nd Embodiment.

(4-4-2) The operation of the resin molding apparatus of the fourth embodiment and the manufacturing method of the resin molded article

14, the operation|movement of the resin molding apparatus 40 of 4th Embodiment, and the manufacturing method of a resin molded article are demonstrated. First, by the method similar to the resin molding apparatus 20 of 2nd Embodiment, the shaping|molding object S is made to adsorb|suck to the holding surface 4511 using the shaping|molding object conveyance mechanism 80A (FIG. 14(a) )). Here, adsorption to the holding surface 4511 operates the vacuum pump 491 to suck air from the first gas suction hole 45121 through the first gas suction pipe 45131 and a vacuum ejector 492 ) and sucking air from the second gas suction hole 45122 through the second gas suction pipe 45132 . Thereby, for example, even if the vacuum pump 491 and the compressor are stopped due to a power failure, the supply of compressed air from the compressed air tank to the vacuum ejector 492 is temporarily maintained, thereby preventing the molding object S from being adsorbed. can hold for a while. In addition, even if the vacuum ejector 492 is stopped due to circumstances such as the compressor being in failure for a long time, the adsorption of the molding object S using the vacuum pump 491 can be maintained.

Next, while injecting|throwing-in the solid resin material P in the port 381, the release film F is extended and installed in the inner surface of the cavity C (FIG.14(b)). Then, the movable platen 321 is raised by the toggle link 313 to perform clamping. In this embodiment, since the claw part is not used, resin molding can be performed over the wide range in the shaping|molding object S without the claw part being obstructed. In addition, since the claw portion does not come into contact with the upper surface of the peripheral wall member 3521 and there is no need to provide a recess (relief portion) for relieving the claw portion on the upper surface of the peripheral wall member 3521, the claw portion does not have a release film ( F) is not wrinkled.

After the mold clamping, the resin material P in the pot 381 is melted by heating with a heater (not shown), the resin material P is extruded from the pot 381 by the plunger 382, and the runner 383 is through the cavity C (Fig. 14(c)). After the resin material P in the cavity C is cured, the movable platen 321 is lowered by the toggle link 313 to open the mold (FIG. 14(d)). And by the method similar to the case of 2nd Embodiment, manufacture of one resin molded article PS is completed by peeling off the shaping|molding object S from the holding surface 4511 of the upper die 451.

(4-5) Resin molding unit incorporating modules

Fig. 15 shows a resin molding unit 50 using any of the resin molding apparatus (resin molding apparatus for performing compression molding) of the first or second embodiment. In addition, in FIG. 15 and the following description, although the example using the resin molding apparatus 10 of 1st Embodiment is demonstrated, the resin molding apparatus 10 of 1st Embodiment is the resin molding apparatus 20 of 2nd Embodiment. It is possible to substitute

The resin molding unit 50 has a material receiving module 51 , a molding module 52 , and a dispensing module 53 . The material accommodating module 51 is a device for receiving the resin material P and the molding object S from the outside and sending them out to the molding module 52 , and the resin material supplying device 510 and the molding object accommodating part 511 . has One molding module 52 is equipped with one set of the resin molding apparatus 10 mentioned above. Although three molding modules 52 are shown in FIG. 15 , any number of molding modules 52 can be provided in the resin molding unit 50 . In addition, even after assembling the resin molding unit 50 and starting to use it, the molding module 52 can be increased or decreased. The dispensing module 53 carries in and holds the resin molded product manufactured by the molding module 52 from the molding module 52 , and has a resin molded product holding part 531 .

In the resin molding unit 50, the molding object S, the resin material conveying tray 58 and the resin so as to pass through the material receiving module 51, one or more molding modules 52 and the dispensing module 53. A main conveying device 56 for conveying the molded product is provided. Moreover, in each module, between the main conveying apparatus 56 and the apparatus in the said module, the shaping|molding object S, the resin material conveyance tray 58, and the sub conveying apparatus 57 which conveys the resin molded article are provided. In addition, the resin molding unit 50 has a power supply and a control unit (both not shown) for operating the respective modules.

The operation of the resin molding unit 50 will be described. The object S to be molded is held in the object storage portion 511 of the material storage module 51 by the operator. The main conveying apparatus 56 and the sub conveying apparatus 57 convey the molding object S from the molding object accommodating part 511 to the resin molding apparatus 10 in one of the molding modules 52, The molding object S is mounted on the molding object mounting table 81 of the molding object conveying mechanism 80 in the resin molding apparatus 10 . Then, in the resin molding apparatus 10, the shaping|molding object S is provided in the 1st holding surface 1511A and the 2nd holding surface 1511B by the method mentioned above. Then, in the resin molding apparatus 10, the release film F is extended and installed in the cavity C of the 1st lower die 152A and the 2nd lower die 152B.

Then, the main conveying apparatus 56 and the sub conveying apparatus 57 carry in the resin material conveying tray 58 into the resin material supplying apparatus 510 . In the resin material supply device 510 , the resin material P is supplied to the resin material feed tray 58 .

The main conveying apparatus 56 and the sub conveying apparatus 57 hold the resin material conveying tray 58 to which the resin material P was supplied, and the shaping|molding object S 1st holding surface 1511A, 2nd holding|maintenance It is conveyed to the resin molding apparatus 10 of the shaping|molding module 52 provided on the support surface 1511B. And the resin material P is supplied to the cavity C of the 1st lower die 152A of the said resin molding apparatus 10, and the 2nd lower die 152B. And in the said resin molding apparatus 10, compression molding is performed. During compression molding in the resin molding apparatus 10, the time between the plurality of molding modules 52 is reduced by performing the same operation as before with respect to the resin molding apparatus 10 in the other molding module 52. Compression molding can be performed in parallel while shifting.

The resin molded article obtained by compression molding is removed from the first holding surface 1511A and the second holding surface 1511B by the method described above by the molding object conveying mechanism 80, and then the main conveying device 56 And it is carried out from the resin molding apparatus 10 by the sub conveying apparatus 57, and is carried in and held in the resin molded article holding|maintenance part 531 of the dispensing module 53. The user takes out the resin molded product from the resin molded product holding portion 531 as appropriate.

The present invention is not limited to the above-described embodiments, and most modifications can be made by those of ordinary skill in the art within the technical spirit of the present invention.

10, 20, 30, 40… resin molding equipment
111, 311… base
112, 312... tie bar
113, 313... toggle link
121… Hagadong Platen
122… Sangga-dong Platen
123, 323... fixed platen
141… insulator
142… heater
15A… 1st mold
15B… 2nd mold
151A… first picture
151B… 2nd pictograph
1511A… first holding surface
1511B… 2nd holding surface
1512A, 1512B, 3512... gas suction hole
1513A, 1513B, 3513... gas suction tube
152A... first lower mold
152B... 2nd lower type
1521A, 1521B, 2521A, 2521B, 3521... no perimeter wall
1522A, 1522B, 2522A, 2522B, 3522... base member
1523A, 1523B, 2523A, 2523B… elastic member
16… hook part
161… claw body
162… axis of rotation
163… 1st to-be-compressed part
164… 2nd to-be-compressed part
165… pressurization device
17, 27… lower type press
171, 271... Lower presser body
172, 272... Lower mold pressing part elastic member
173… press
19… Molded object adsorption mechanism
191, 291, 391, 491... vacuum pump
2512A1, 45121… first gas suction hole
2512A2, 45122... second gas suction hole
2513A1, 45131… first gas suction tube
2513A2, 45132… 2nd gas suction pipe
292, 492... vacuum ejector
323… fixed platen
35, 45… molded mold
351… avoirdupois
3511, 4511... holding surface
352… Ha Hyung
381… port
382… plunger
383… runner
39… port runner block
50… resin molding unit
51… material storage module
510… Resin material feeder
511… Molded object storage unit
52… molding module
53… dispensing module
531… Resin molded product holding part
56… main conveying device
57… resin material transfer tray
58… sub-carrying device
80, 80A, 80B… Molded object conveying mechanism
81, 81A, 81B... Molding object loading stand
82… 1st elevating mechanism
83… 2nd elevating mechanism
83A, 83B… elevating mechanism
84, 84A... second press
85, 85A, 85B… lateral movement mechanism
C… cavity
F… release film
P… resin material
PS… resin molded product
S… molded object

Claims (4)

a) an upper mold having a holding surface at the lower side for holding the object to be molded;
b) a lower mold having a cavity disposed opposite the upper mold;
c) a first molded object adsorption mechanism installed on the holding surface and for adsorbing the object to be molded onto the holding surface by suction of gas by an electric power-driven vacuum pump;
d) a second molded object adsorption mechanism provided on the holding surface for adsorbing the object to be molded onto the holding surface by suction of gas by a vacuum ejector driven by compressed air;
The resin molding apparatus characterized by preventing the object to be molded from falling by the second object adsorption mechanism when the supply of electric power is stopped. The resin molding apparatus according to claim 1, further comprising a storage tank for storing compressed air supplied to the vacuum ejector. A method for manufacturing a resin molded article using the resin molding apparatus according to claim 1 or 2,
a molding target holding step of adsorbing the molding target on the holding surface by the first molding target adsorption mechanism and the second molding target suction mechanism;
a resin material supply step of supplying a resin material to the cavity;
a mold clamping step of clamping the upper mold and the lower mold;
a resin material curing process of curing the resin material after heating the resin material to a temperature at which the resin material in the cavity softens or melts;
A method for manufacturing a resin molded article, characterized in that it has. A method for manufacturing a resin molded article using the resin molding apparatus according to claim 1 or 2,
a molding target holding step of adsorbing the molding target on the holding surface by the first molding target adsorption mechanism and the second molding target suction mechanism;
a mold clamping step of clamping the upper mold and the lower mold;
a resin material supply process of supplying a softened or melted resin material into the cavity;
a resin material curing process of curing the resin material supplied into the cavity;
A method for manufacturing a resin molded article, characterized in that it has.

Images