JP6772305B2 - Resin molding equipment and resin molded product manufacturing method - Google Patents

Description

The present invention relates to a resin molding apparatus and a method for producing a resin molded product using the resin molding apparatus.

Electronic components are generally sealed in resin to protect them from the environment such as light, heat and humidity. Therefore, resin molding is performed by a compression molding method, a transfer molding method, or the like. In the compression molding method, a resin molding mold consisting of a lower mold and an upper mold is used, a resin material is supplied to the cavity of the lower mold, and a molding object (for example, a substrate on which an electronic component is mounted) is attached to the upper mold. Then, in order to melt the resin material, the lower mold and the upper mold are heated and both are molded to perform resin molding. In the transfer molding method, a cavity is provided in one of the upper mold and the lower mold, an object to be molded is attached to the other, the lower mold and the upper mold are heated and both are molded, and the resin is put into the cavity with a plunger. Resin molding is performed by supplying.

Patent Document 1 shows two examples as a configuration for attaching a molded object to an upper mold. In the first example, an air circuit that passes through the upper mold and has an opening on the clamp surface (lower surface) of the upper mold is provided, and a vacuum pump sucks gas from the opening through the air circuit to form an object to be molded. It is attracted to the clamp surface. In the second example, a chuck claw is provided on the clamp surface of the upper die, and the outer peripheral portion of the object to be molded is gripped by the chuck claw.

JP-A-2016-198945 ([0021] etc.)

When the object to be molded is adsorbed on the clamp surface by sucking the gas with the vacuum pump, when the vacuum pump stops for some reason, the suction of the gas stops and the suction suction cannot be maintained. The object to be molded falls from the upper mold.

On the other hand, when the object to be molded is gripped by the chuck claw, the size of the resin molded product is limited because resin molding cannot be performed on the portion of the object to be molded that is gripped by the chuck claw.

The problem to be solved by the present invention is to provide a resin molding apparatus and a resin molded product manufacturing method capable of reducing the risk of the molded object falling from the upper mold and making the resin molded product to be manufactured as large as possible. That is.

The first aspect of the resin molding apparatus according to the present invention made to solve the above problems is
a) An upper mold having a holding surface for holding the object to be molded on the lower side,
b) A lower mold with a cavity placed facing the upper mold and
c) With the molding object adsorption mechanism provided on the holding surface,
d) With the claws provided on the upper mold so as to extend downward from the side of the object to be molded held on the holding surface.
e) When the upper mold and the lower mold are clamped, the upper mold and the lower mold are located below the object to be molded held on the holding surface when the upper mold and the lower mold approach the claw portion movement start distance or less. It is characterized by including a claw portion moving mechanism for moving the claw portion to the outside of the object to be molded.

The second aspect of the resin molding apparatus according to the present invention is
a) An upper mold having a holding surface for holding the object to be molded on the lower side,
b) A lower mold with a cavity placed facing the upper mold and
c) A first molding object adsorption mechanism provided on the holding surface for adsorbing a molding object on the holding surface by suction of gas by a vacuum pump.
d) A second molding object adsorption mechanism provided on the holding surface, which adsorbs the object to be molded to the holding surface by means other than suction of gas by a vacuum pump.
It is characterized by having.

The first aspect of the method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus of the first aspect.
A molding target holding step of extending the claw portion below the molding target in a state where the molding target is adsorbed on the holding surface by the molding target suction mechanism.
The resin material supply process for supplying the resin material to the cavity and
When the upper mold and the lower mold are brought closer to each other and the upper mold and the lower mold are closer to the claw portion movement start distance or less, the claw portion is moved to the outside of the molding target by the claw portion moving mechanism. And the claw movement process to move
A mold clamping step of molding the upper mold and the lower mold, and
It is characterized by having a resin material curing step of heating the resin material to a temperature at which the resin material in the cavity softens or melts, and then curing the resin material.

The second aspect of the method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus of the second aspect.
A molding object holding step of adsorbing a molding object on the holding surface by the first molding object adsorption mechanism and the second molding object adsorption mechanism.
The resin material supply process for supplying the resin material to the cavity and
A mold clamping step of molding the upper mold and the lower mold, and
It is characterized by having a resin material curing step of heating the resin material to a temperature at which the resin material in the cavity softens or melts, and then curing the resin material.

A third aspect of the method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus of the first aspect.
A molding target holding step of extending the claw portion below the molding target in a state where the molding target is adsorbed on the holding surface by the molding target suction mechanism.
When the upper mold and the lower mold are brought closer to each other and the upper mold and the lower mold are closer to the claw portion movement start distance or less, the claw portion is moved to the outside of the molding target by the claw portion moving mechanism. The claw movement process to move
A mold clamping step of molding the upper mold and the lower mold, and
A resin material supply step of supplying a softened or melted resin material into the cavity, and
It is characterized by having a resin material curing step of curing the resin material supplied into the cavity.

A fourth aspect of the method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus of the second aspect.
A molding object holding step of adsorbing a molding object on the holding surface by the first molding object adsorption mechanism and the second molding object adsorption mechanism.
A mold clamping step of molding the upper mold and the lower mold, and
A resin material supply step of supplying a softened or melted resin material into the cavity, and
It is characterized by having a resin material curing step of curing the resin material supplied into the cavity.

According to the present invention, it is possible to reduce the possibility that the object to be molded falls from the upper mold and to make the resin molded product to be manufactured as large as possible.

A schematic configuration diagram (a) showing an embodiment (first embodiment) of the resin molding apparatus of the first aspect, and an enlarged view (b) showing a molding die of the resin molding apparatus and its surroundings. A perspective view (a) and a side view (b) of a claw portion in the resin molding apparatus of the first embodiment. The schematic block diagram which shows the molding object transport mechanism which the resin molding apparatus of 1st Embodiment has. The figure which shows the operation of the resin molding apparatus of 1st Embodiment and the manufacturing method of a resin molded article. The enlarged view which shows the operation of the claw part and the component around it in the resin molding apparatus and the resin molded article manufacturing method of 1st Embodiment. The schematic block diagram which shows the modification of the molding object transfer mechanism. A schematic configuration diagram (a) showing one embodiment (second embodiment) of the resin molding apparatus of the second aspect, and an enlarged view (b) showing a molding die of the resin molding apparatus and its surroundings. FIG. 6 is a schematic configuration diagram showing a molding object transport mechanism included in the resin molding apparatus of the second embodiment. The figure which shows the operation of the resin molding apparatus of 2nd Embodiment, and the resin molded article manufacturing method. The schematic block diagram which shows the other embodiment (third embodiment) of the resin molding apparatus of 1st aspect. Top view (a) of the lower mold and bottom view (b) of the upper mold included in the resin molding apparatus of the third embodiment. The figure which shows the operation of the resin molding apparatus of 3rd Embodiment, and the resin molded article manufacturing method. FIG. 6 is a schematic configuration diagram showing another embodiment (fourth embodiment) of the resin molding apparatus of the second aspect. The figure which shows the operation of the resin molding apparatus of 4th Embodiment, and the resin molded article manufacturing method. The schematic block diagram which shows an example of a modularized resin molding unit.

(1) Resin molding apparatus of the first aspect In the resin molding apparatus of the first aspect, the object to be molded is adsorbed on the holding surface by the object adsorption mechanism provided on the holding surface and held on the upper mold. .. Then, the claw portion is arranged below the object to be molded (hence, inside the object to be molded). Therefore, even if the suction of the molding object to the holding surface by the molding target suction mechanism does not work for some reason, the molding target does not fall.

On the other hand, when the upper mold and the lower mold approach the claw movement start distance or less, the claw movement mechanism moves the claw portion to the outside of the object to be molded, so that the claw portion has been arranged below until then. Resin sealing can also be performed on the surface portion of the object to be molded. As a result, the size of the resin molded product to be produced can be increased. Here, the "claw portion movement start distance" means that even if the molding target object suction mechanism does not function and the molding target object falls from the upper mold (even if the molding target portion is not arranged below the molding target object). ) It is defined by the distance between the upper and lower molds where no problem occurs.

Since the claw portion is for preventing the molding target from falling when the molding target cannot be attracted to the holding surface by the molding target suction mechanism, the claw is placed below the molding target. When the portions are arranged, there may be some gap between the surface of the object to be molded and the claw portion.

In the present invention, the object to be molded is, for example, a substrate, and more specifically, examples thereof include a substrate, a resin substrate, a wiring substrate, a wafer, glass, and a metal plate. However, the object to be molded in the present invention is not limited to these, and is arbitrary. Further, in the present invention, the object to be molded may or may not have a member such as a chip mounted on one surface thereof.

In the resin molding apparatus of the first aspect, the claw portion moving mechanism is further held on the holding surface when the upper mold and the lower mold approach the claw portion movement start distance or less. It is desirable that the claw portion is moved above the lower end.

The reason will be explained. In a resin molding apparatus, in order to easily release a molded resin product from a cavity, a release film is generally applied to the inner surface of the cavity before supplying the resin material to the cavity. The release film must cover a larger area than the upper and lower clamp surfaces (adhesion surface) in order to take out the resin molded product later and to ensure that the upper and lower clamp surfaces are in close contact with each other. In the resin molding apparatus of Patent Document 1, a relief portion for accommodating the chuck claw when the mold is tightened while the object to be molded is held by the chuck claw is provided on the clamp surface of the lower mold. , A release film will be stretched on this relief part as well. Then, at the time of mold clamping, the chuck claw pushes the release film into the relief portion, which may cause wrinkles on the release film, and the wrinkles may be transferred to the resin molded product. On the other hand, in the resin molding apparatus of the first aspect, a claw portion moving mechanism for moving the claw portion above the lower end of the object to be molded is used when the upper mold and the lower mold approach the claw portion movement start distance or less. According to the configuration, it is not necessary to provide a relief portion in the lower mold, so that the claw portion does not push the release film into the relief portion. Therefore, it is possible to prevent wrinkles from being generated on the release film and to prevent wrinkles from being transferred to the resin molded product.

In the resin molding apparatus of the first aspect, the claw portion moving mechanism further separates the upper mold and the lower mold from the second claw portion moving start distance when the upper mold and the lower mold are opened. Occasionally, it is desirable to move the claw portion to the lower side of the object to be molded held on the holding surface. As a result, even when the mold is opened, if the object to be molded cannot be adsorbed on the holding surface by the object adsorption mechanism, the object to be molded is held by the claws, so that the object to be molded falls. Never. The claw portion movement start distance and the second claw portion movement start distance may be the same or different.

The resin molding apparatus of the first aspect is
Further, it is provided with a pressing portion and an urging mechanism for urging the claw portion below the object to be molded held on the holding surface.
The claw portion is provided on a substantially horizontal rotation shaft and a lower portion closer to the outside of the holding surface than the rotation shaft, and the upper mold and the lower mold approach the claw portion movement start distance or less. It is sometimes desirable to have a pressed portion that is pressed by the pressing portion.

According to the resin molding apparatus of the first aspect provided with such a pressed portion, a pressing portion and an urging mechanism, the urging mechanism is maintained until the upper die and the lower die approach the claw portion movement start distance or less at the time of mold clamping. Bounces the claws so that the claws are placed below the object to be molded. On the other hand, when the upper die and the lower die approach the claw portion movement start distance or less, the pressing portion presses the pressed portion so that the claw portion moves from below the molding target to the outside of the molding target. , Since it rotates about the rotation axis, the above-mentioned effect is obtained.

If the claw portion is rotated here, the claw portion can be moved to the outside of the object to be molded and above the lower end of the object to be molded.

In the resin molding apparatus of the first aspect including the pressed portion, the pressing portion and the urging mechanism, the claw portion is further closer to the outside of the holding surface than the rotating shaft, and the pressed portion is It is desirable to provide the second pressed portion at different positions. Such a second pressed portion can be used to move the claw portion to the outside of the molding target when the molding target is held on the holding surface and when the molding target is removed from the holding surface. .. At that time, the second pressed portion is pressed by a second pressing portion different from the pressing portion, but the second pressing portion may be provided outside the resin molding apparatus of the first aspect. Since the second pressed portion is provided at a position different from that of the pressed portion, the second pressed portion and the pressed portion do not interfere with each other.

The resin molding apparatus of the first aspect including the second pressed portion further comprises.
A molding object mounting table on which the molding object is placed,
A first elevating mechanism for elevating and lowering the object mounting table,
A second elevating mechanism on which the first elevating mechanism is mounted and elevating the first elevating mechanism, and
A second pressing portion which is the upper end of the second elevating mechanism and is provided on both sides of the molding object mounting table so as to correspond to the lateral position of the second pressed portion.
A position where the object to be molded placed on the object mounting table is between the upper mold and the lower mold and directly below the holding surface, and a position deviated from between the upper mold and the lower mold. It is desirable to further provide a molding object transport mechanism having a lateral movement mechanism for moving the second elevating mechanism in the lateral direction.

Using this molding target transfer mechanism, the molding target before resin molding can be carried into the holding surface of the upper mold as follows. First, after placing the object to be molded on the object to be molded, the second elevating mechanism (and the first elevating mechanism directly or indirectly mounted on the elevating mechanism, the object to be molded, and the object to be molded are placed by the lateral movement mechanism. The object to be molded) moves between the upper mold and the lower mold. At that time, the second pressing portion corresponds to the lateral position of the second pressed portion of the claw portion. By raising the second elevating mechanism from there, the second pressing portion presses the second pressed portion. Then, the claw portion moves to the outside of the holding surface. Next, the first elevating mechanism is raised until the object to be molded comes into contact with the holding surface. At that time, since the claw portion is on the outside of the holding surface, it does not interfere. After the object to be molded is adsorbed on the holding surface by the object adsorption mechanism for molding, the first elevating mechanism and the second elevating mechanism are lowered. As a result, the second pressing portion is separated from the second pressed portion, and the claw portion moves to the holding surface and the lower part of the molding object held by the holding surface. After that, the lateral movement mechanism moves the second elevating mechanism (and the first elevating mechanism and the object mounting table) to a position deviated from between the upper mold and the lower mold so that compression molding can be performed. Become.

It is also possible to use this molding target transfer mechanism to carry out the molding target after resin molding from the holding surface of the upper mold. In that case, first, the second elevating mechanism (and the first elevating mechanism and the object mounting table for molding) is moved between the upper mold and the lower mold by the lateral movement mechanism, and then the second elevating mechanism is raised. As a result, the second pressing portion presses the second pressed portion to move the claw portion to the outside of the holding surface, and then the first elevating mechanism rises, where the adsorption by the molding object adsorption mechanism is released. As a result, the object to be molded is placed on the object mounting table. After that, after the first elevating mechanism and the second elevating mechanism are lowered, the second elevating mechanism (and the first elevating mechanism, the object mounting table and the object to be molded) is made of the upper and lower dies by the lateral movement mechanism. By moving to a position out of the gap, the object to be molded is carried out.

The resin molding apparatus of the first aspect including the pressed portion, the pressing portion and the urging mechanism further comprises.
A lower mold holding portion that extends downward from the upper mold, and when the upper mold and the lower mold approach the claw portion movement start distance, the lower end abuts on the upper surface of the lower mold, and the pressing portion is attached. When,
An elastic member provided between the upper mold and the lower mold holding portion, and
It is desirable to provide.

According to the resin molding apparatus of the first aspect provided with such a lower mold pressing portion and an elastic member, when the upper mold and the lower mold approach the claw portion movement start distance or less at the time of mold clamping, the lower mold pressing portion is used. The attached pressing portion presses the pressed portion, whereby the claw portion moves from below the molding target to above the lower end of the molding target and outside the molding target. As a result, the claw portion is moved only by the power of the relative movement mechanism (mold tightening mechanism) of the upper mold and the lower mold, so that a separate power for moving the claw portion is not required. At the same time, since the lower end of the lower mold holding portion abuts on the upper surface of the lower mold, the mold release film extending to the outside of the cavity can be held by the lower mold holding portion, particularly when a mold release film is used. In this case, the claw portion movement start distance can be defined by the distance between the upper die and the lower die when the lower end of the lower die holding portion abuts on the upper surface of the lower die.

(2) Resin molding device of the second aspect In the resin molding device of the second aspect, the first molding object adsorption mechanism for adsorbing the object to be molded on the holding surface by suctioning gas by the vacuum pump and the vacuum pump are used. By using the second molded object adsorption mechanism that adsorbs the molded object to the holding surface by means other than suction of gas, even if the vacuum pump stops for some reason, the second molded object adsorption mechanism causes the molded object to be molded. Adsorption can be maintained. On the other hand, even if the operation of the second molding target suction mechanism is stopped, the molding target suction mechanism can maintain the suction of the molding target. In this way, by using the two systems of the molding target adsorption mechanism together, the possibility that the molding target falls from the upper mold can be reduced.

Further, since it is not necessary to use the claw portion in the resin molding apparatus of the second aspect, the resin molded product to be manufactured can be enlarged.

Furthermore, since it is not necessary to use the claw portion, it is possible to prevent wrinkles from being generated on the release film and to prevent wrinkles from being transferred to the resin molded product when the release film is used.

As the second molding object adsorption mechanism, a vacuum ejector, a Bernoulli chuck, an electrostatic chuck, or the like can be used. Of these, the vacuum ejector operates with the stored compressed air, so it normally does not require power for a while, so it is molded even when the power is cut off due to a power outage or an emergency stop operation by the operator. It is desirable because the adsorption of the object can be maintained for a while.

(3) Method for manufacturing resin molded product according to the first to fourth aspects The method for producing a resin molded product according to the first aspect is for producing a resin molded product by a compression molding method using the resin molding apparatus according to the first aspect. Is. The method for producing a resin molded product according to the second aspect is to produce a resin molded product by a compression molding method using the resin molding apparatus according to the second aspect. The resin molded product manufacturing method of the third aspect is to manufacture a resin molded product by a transfer molding method using the resin molding apparatus of the first aspect. The resin molded product manufacturing method of the fourth aspect is to manufacture a resin molded product by a transfer molding method using the resin molding apparatus of the second aspect. In any of the resin molded product manufacturing methods, the resin molding apparatus is operated as described above, which is different from the conventional resin molded product manufacturing method, and other points are the same as those of the conventional resin molded product manufacturing method.

(4) Specific Embodiments of the Resin Molding Device of the First and Second Aspects and the Resin Molded Product Manufacturing Method of the First to Fourth Aspects Hereinafter, the first and first methods are used with reference to FIGS. 1 to 15. A more specific embodiment of the resin molding apparatus according to the second aspect and the method for producing a resin molded product using the resin molding apparatus will be described.

(4-1) One Embodiment of the resin molding apparatus of the first aspect and the resin molded article manufacturing method of the first aspect (first embodiment)
(4-1-1) Configuration of Resin Molding Device of First Embodiment FIG. 1 shows a resin molding device 10 which is one embodiment (first embodiment) of the resin molding device of the first embodiment. FIG. 1A shows the entire resin molding apparatus 10, and FIG. 1B shows the molding die and its surroundings in an enlarged manner. The resin molding apparatus 10 of the first embodiment is an apparatus that performs compression molding, and is held by a base 111, two tie bars 112 erected on the base 111, and tie bars 112 so as to be movable up and down. The lower movable platen 121 and the upper movable platen 122, the fixed platen 123 fixed to the upper end of the tie bar 112, and the toggle link 113 provided on the base 111 for moving the lower movable platen 121 up and down are provided. Further, the resin molding apparatus 10 has a first lower mold 152A on the upper surface of the lower movable platen 121, a first upper mold 151A on the lower surface of the upper movable platen 122, and a second lower mold 152B on the upper surface of the upper movable platen 122. A second upper mold 151B is provided on the lower surface of the fixed platen 123, respectively. The first upper mold 151A and the first lower mold 152A form the first molding mold 15A, and the second upper mold 151B and the second lower mold 152B form the second molding mold 15B. The resin molding apparatus 10 further includes a heat insulating material 141 closer to the platen and a heater 142 closer to the upper or lower mold between each platen and the upper or lower mold. In the present embodiment, the heat insulating material 141 uses a plurality of columnar heat insulating members arranged in a two-dimensional shape, but other heat insulating materials such as a plate-shaped heat insulating material may be used.

Next, the configurations of the first molding die 15A and the second molding die 15B will be described with reference to FIG. 1 (b). The first molding die 15A and the second molding die 15B have the same configuration. Therefore, each component of the first molding die 15A will be described below. The component of the second molding die 15B is the one in which the reference numeral ending in "A" is changed to "B" in the description.

The first molding die 15A includes a first upper die 151A and a first lower die 152A.

The lower surface of the first upper mold 151A is a first holding surface 1511A for holding an object to be molded, and the first holding surface 1511A is provided with a gas suction hole 1512A. The gas suction hole 1512A is vacuumed through a gas suction pipe 1513A provided in the first upper mold 151A and the heater 142, and a flexible connecting pipe (not shown) connected to the gas suction pipe 1513A. It is connected to pump 191. The gas suction hole 1512A, the gas suction pipe 1513A, the connection pipe, and the vacuum pump 191 constitute a molding object suction mechanism 19. A vacuum ejector may be used instead of the vacuum pump 191. Alternatively, instead of the molding target suction mechanism 19 shown here, a Bernoulli chuck, an electrostatic chuck, or the like may be used as the molding target suction mechanism.

The first lower mold 152A is provided on the peripheral wall member 1521A having a rectangular frame in a planar shape (top view), the bottom member 1522A of a rectangular parallelepiped embedded in the frame of the peripheral wall member 1521A, and the lower surface of the peripheral wall member 1521A. It has an elastic member 1523A. The space surrounded by the peripheral wall member 1521A and the bottom surface member 1522A serves as the cavity C to which the resin material is supplied. The planar shape of the peripheral wall member 1521A can take a circular shape other than a rectangle depending on the shape of the resin molded product to be manufactured, and the shape of the bottom surface member 1522A is appropriately changed according to the planar shape of the peripheral wall member 1521A. It is possible.

Claws 16 are provided on both sides of the first holding surface 1511A sandwiching the first holding surface 1511A of the first upper mold 151A. FIG. 2A shows a perspective view of the claw portion 16, and FIG. 2B shows a side view. The claw portion 16 includes a claw portion main body 161, a rotation shaft 162, a first pressed portion (corresponding to the pressed portion) 163, a second pressed portion 164, and an urging mechanism 165. The claw portion main body 161 extends from the outside to the inside of the first holding surface 1511A, and is held by the first holding surface 1511A and the first holding surface 1511A in a state of being urged by the urging mechanism 165. It is arranged on the lower side of the object to be molded (Fig. 1 (b)). The rotation shaft 162 is substantially horizontal, and the entire claw portion 16 can rotate about the rotation shaft 162. Both the first pressed portion 163 and the second pressed portion 164 are closer to the outside of the first holding surface 1511A than the rotation shaft 162, and are provided at the lower part of the entire claw portion 16. In the direction in which the rotation shaft 162 extends, the second pressed portion 164 is arranged on the center side of the claw portion 16, and the first pressed portion 163 is arranged on both sides (that is, two places) of the second pressed portion 164. ing. Further, the second pressed portion 164 is arranged below the first pressed portion 163. The urging mechanism 165 urges the entire claw portion 16 so that the claw portion main body 161 rotates from the outside to the lower side of the first holding surface 1511A about the rotation shaft 162. When the claw portion main body 161 is located below the first holding surface 1511A due to the urging by the urging mechanism 165, the pressing portion 173, which will be described later, comes into contact with the first pressed portion 163. The claw portion main body 161 is held at the position without rotating the entire claw portion 16. Therefore, the pressing portion 173, the first pressed portion 163, and the urging mechanism 165 function as the claw portion moving mechanism.

A lower mold holding portion 17 is provided on the side of the first holding surface 1511A and outside the claw portion 16 (FIG. 1 (b)). The lower mold holding portion 17 has a lower mold holding portion main body 171, a lower mold holding portion elastic member 172, and a pressing portion 173. The lower mold holding portion main body 171 is a bar member extending downward, which is provided with the lower mold holding portion elastic member 172 sandwiched between the lower mold holding portion main body 171 and the first upper mold 151A. The pressing portion 173 is a bar material extending from the lower mold pressing portion main body 171 toward the claw portion 16, and is provided at a height at which it comes into contact with the first pressed portion 163 when the mold is not fastened. Two pressing portions 173 are provided in one lower mold pressing portion 17 in response to the provision of the first pressed portion 163 in two places in one claw portion 16.

Further, the resin molding apparatus 10 has a molding object transport mechanism 80. As shown in FIG. 3, the molding target transfer mechanism 80 includes a molding target mounting table 81 on which a molding target is placed, a first lifting mechanism 82 for raising and lowering the molding target mounting table 81, and a first lifting mechanism. A second elevating mechanism 83 for mounting the 82 and raising and lowering the first elevating mechanism 82, and a second elevating mechanism 83 at the upper end of the second elevating mechanism 83 and provided on both sides of the molding object mounting table 81. It has a pressing portion 84 and a lateral movement mechanism 85 that moves the second elevating mechanism 83 in a lateral direction (substantially horizontal direction; a direction perpendicular to the paper surface of FIGS. 1A and 3). The lateral movement mechanism 85 has a position where the molding target placed on the molding target mounting table 81 is between the first upper mold 151A and the first lower mold 152A and directly below the first holding surface 1511A. The second elevating mechanism 83 is moved laterally between the positions deviated from between the upper die 151A and the first lower die 152A. The lateral position of the second pressing portion 84 is the lateral position of the second pressed portion 164 of the claw portion 16 when the lateral positions of the object mounting table 81 and the first holding surface 1511A are aligned. Matches. Although the first molding die 15A has been described here as an example, the same molding object transport mechanism 80 is provided for the second molding die 15B.

(4-1-2) Operation of Resin Molding Device of First Embodiment and Method of Manufacturing Resin Molded Product Using FIGS. 4 and 5, the operation of the resin molding device 10 of the first embodiment and the method of manufacturing a resin molded product are described. explain. FIG. 4 shows the overall operation of the resin molding apparatus 10 of the first embodiment, and FIG. 5 shows an enlarged operation of the claw portion 16 and its peripheral components in the resin molding apparatus 10. Actually, the first molding die 15A and the second molding die 15B perform the same operation at the same time, but only the operation of the first molding die 15A will be described below unless otherwise specified.

Before the start of operation, as described above, the claw portion main body 161 of the claw portion 16 is located below the lower surface of the first holding surface 1511A (FIG. 5A).

First, the molding target S is placed on the molding target mounting table 81 of the molding target transport mechanism 80, and then directly or indirectly mounted on the second elevating mechanism 83 and the second elevating mechanism 83 by the lateral movement mechanism 85. The first elevating mechanism 82, the object mounting table 81, and the object S to be molded are moved between the first upper die 151A and the first lower die 152A of the first molding die 15A. At the same time, the lateral position of the second pressing portion 84 provided at the upper end of the first elevating mechanism 82 is aligned with the lateral position of the second pressed portion 164. Next, the first elevating mechanism 82 is raised by the second elevating mechanism 83, and the second pressed portion 164 is pressed by the second pressing portion 84 (FIG. 4A). As a result, the claw portion 16 rotates, and the claw portion main body 161 moves to the outside of the first holding surface 1511A of the first upper die 151A (FIG. 5 (b)). In this state, the molding target mounting table 81 is raised by the first elevating mechanism 82, and the molding target S on the molding target mounting table 81 is brought into contact with the first holding surface 1511A (FIG. 4B). At that time, since the claw portion main body 161 is on the outside of the first holding surface 1511A, the claw portion main body 161 does not hinder the ascent of the object mounting table 81 to be molded.

Then, the vacuum pump 191 is operated to suck air from the gas suction hole 1512A through the gas suction pipe 1513A, so that the molding target S on the molding target mounting table 81 is attracted to the first holding surface 1511A. .. After that, the first elevating mechanism 82 lowers the molding object mounting table 81, the second elevating mechanism 83 lowers the first elevating mechanism 82, and the lateral movement mechanism 85 lowers the second elevating mechanism 83 and the first elevating mechanism. The 82 and the object mounting table 81 to be molded are moved to a position laterally deviated from between the first upper mold 151A and the first lower mold 152A (FIG. 4 (c)). Here, when the first elevating mechanism 82 is lowered, the pressing of the second pressed portion 164 by the second pressing portion 84 is released, so that the claw portion 16 rotates in the direction opposite to the pressing. , The claw portion main body 161 moves downward (inside) of the first holding surface 1511A (FIG. 5 (c)).

Next, the release film F is attached to the inner surface of the cavity C of the first lower mold 152A by a release film attachment mechanism (not shown). Specifically, the release film F is stretched by sucking air from between the peripheral wall member 1521A and the bottom surface member 1522A with a vacuum pump 191 while covering the upper surface of the peripheral wall member 1521A and the upper side of the cavity C and its surroundings. Do it by doing. At this time, the release film F exists not only on the inner surface of the cavity C but also on the upper surface of the peripheral wall member 1521A. Subsequently, the resin material P is supplied into the cavity C by a resin material supply mechanism (not shown) (FIG. 4 (d)). Then, the resin material P is melted by heating with the heater 142.

When the resin material P in the cavity C is melted, the lower movable platen 121 is raised by the toggle link 113. As a result, the first lower mold 152A on the lower movable platen 121 abuts on the first upper mold 151A to push up the first upper mold 151A and the upper movable platen 122, and further, the second lower mold on the upper movable platen 122. 152B comes into contact with the second upper mold 151B. Since the second upper mold 151B is fixed to the fixed platen 123, the first upper mold 151A and the first lower mold 152A, and the second upper mold 151B and the second lower mold 152B are molded.

Focusing on the first molding die 15A again, when the first molding die 15A is molded, the first lower die 152A approaches the first upper die 151A. At this stage, the claw portion main body 161 exists under the first holding surface 1511A, and by any chance the vacuum pump 191 stops, the adsorption of the object S to be molded to the first holding surface 1511A stops. However, since the object S to be molded is received by the claw portion main body 161, it is possible to prevent the object S to be molded from falling. Further, when the first lower mold 152A approaches the first upper mold 151A to the first distance (the claw portion movement start distance), the lower mold holding portion main body 171 comes into contact with the upper surface of the peripheral wall member 1521A of the first lower mold 152A. That is, the claw portion movement start distance can be defined by the distance between the first upper die 151A and the first lower die 152A in which the lower die holding portion main body 171 abuts on the peripheral wall member 1521A. Further, when the first lower mold 152A approaches the first upper mold 151A, the lower mold holding portion elastic member 172 is compressed, and the pressing portion 173 pushes up the first pressed portion 163 of the claw portion 16. As a result, the claw portion 16 rotates, and the claw portion main body 161 moves to the outside of the first holding surface 1511A of the first upper die 151A (FIG. 5 (d)). The first distance and the second distance, which will be described later, are set to distances so that even if the molding target suction mechanism does not function here and the molding target falls from the upper mold, no problem occurs. Therefore, after that, the mold is tightened, and the mold is further opened until the first upper mold 151A and the first lower mold 152A are separated from each other by the second distance, although the claw portion main body 161 does not protect the object to be molded. There is no problem even if it falls.

After that, the first lower mold 152A approaches the first upper mold 151A, and the first upper mold 151A and the first lower mold 152A are molded (FIG. 4 (e)). Then, the temperature at which the resin material in the cavity C is cured is maintained until the resin material is cured. At that time, since the claw portion main body 161 exists outside the first holding surface 1511A, resin molding can be performed over a wide range in the molding object S without the claw portion main body 161 becoming an obstacle. .. Further, at this stage, the claw portion main body 161 is arranged above the lower end of the molding object S held on the first holding surface 1511A (FIG. 5 (d)). Therefore, the claw portion main body 161 does not come into contact with the upper surface of the peripheral wall member 1521A, and it is not necessary to provide a recess (relief portion) on the upper surface of the peripheral wall member 1521A for allowing the claw portion main body 161 to escape. Therefore, the claw portion main body 161 does not push the release film F to cause wrinkles on the release film F.

After the resin material in the cavity C is cured, the lower movable platen 121 is lowered by the toggle link 113 to open the first molding die 15A and the second molding die 15B (FIG. 4 (f)). Focusing on the first molding die 15A, when the first upper die 151A and the first lower die 152A are separated by a second distance (the same as the first distance in this embodiment), the lower die holding portion main body 171 is a peripheral wall member. As the surface of the 1521A is separated from the upper surface, the pressing portion 173 releases the pressing of the first pressed portion 163, so that the claw portion 16 rotates in the direction opposite to the pressing, and the claw portion main body 161 becomes the first holding surface. It moves downward (inside) of 1511A. Here, depending on the thickness of the resin molded product PS formed on the lower side of the object S to be molded, the case where the claw portion main body 161 does not reach the lower surface of the resin molded product PS but comes into contact with the side surface of the resin molded product PS. However, there is no problem in preventing the molding target S from falling by the claw portion main body 161 when the suction of the molding target S to the first holding surface 1511A is stopped.

After the mold is opened, the molding target S on which the resin molded product PS is formed is carried out from the first holding surface 1511A by the molding target transport mechanism 80. Specifically, first, the second elevating mechanism 83, the first elevating mechanism 82, and the object mounting table 81 to be molded are conveyed between the first upper mold 151A and the first lower mold 152A by the lateral movement mechanism 85, and the second The lateral position of the pressing portion 84 is aligned with the lateral position of the second pressed portion 164. Next, the claw portion main body 161 is moved to the outside of the first holding surface 1511A by raising the first elevating mechanism 82 and the second pressing portion 84 by the second elevating mechanism 83 (similar to FIG. 5B), and further. By raising the object mounting table 81 to be molded by the first elevating mechanism 82, the object mounting table 81 is brought into contact with the lower surface of the resin molded product PS. After that, the adsorption of the object S to be molded by the object suction mechanism 19 is stopped, the object mounting table 81 is lowered by the first elevating mechanism 82, and the first elevating mechanism 82 is lowered by the second elevating mechanism 83. Then, the second elevating mechanism 83, the first elevating mechanism 82, the molding object mounting table 81, and the molding object S are moved outward from between the first upper mold 151A and the first lower mold 152A by the lateral movement mechanism 85. Therefore, the object S to be molded can be carried out.

Instead of the molding target transport mechanism 80, the molding target transport mechanism 80A shown in FIG. 6 can be used. The molding target transport mechanism 80A is provided below the molding target mounting table 81A and the molding target mounting table 81A, and raises and lowers the molding target mounting table 81A, and the molding target mounting table 81A. It has a second pressing portion 84A which is a pin arranged around and at least a part of which is made of an elastic member, and a lateral movement mechanism 85A which moves the elevating mechanism 83A in the lateral direction. The elevating mechanism 83A used in this modification can switch the strength of the force for pushing up the object mounting table 81A in two steps. Of the forces that push up the object mounting table 81A to be molded, the weaker force is such that the elastic member does not bend when the second pressing portion 84A is pressed against the second pressed portion 164, and the stronger force is used. Is a force that causes the elastic member to bend when the second pressing portion 84A is pressed against the second pressed portion 164. The positional relationship between the molding target mounting table 81A and the second pressing portion 84A is fixed (at this point, the vertical positional relationship between the molding target mounting table 81 and the second pressing portion 84 is determined by the second elevating mechanism 83. The upper surface of the molding object mounting table 81A (unlike the variable molding object conveying mechanism 80) is located between the upper end and the lower end of the second pressing portion 84A.

The operation of the object transfer mechanism 80A to be molded will be described. After the object to be molded is placed on the object mounting table 81A, the elevating mechanism 83A pushes up the object mounting table 81A with the weaker force of the two strength stages, and presses the second pressing portion 84A second. It is brought into contact with the portion 164. As a result, the second pressing portion 84A presses the second pressed portion 164 without bending the elastic member, rotates the claw portion 16, and makes the claw portion main body 161 the first holding surface 1511A of the first upper mold 151A. Move to the outside of (see FIG. 5 (b)). At this point, since the upper surface of the molding target mounting table 81A is below the upper end of the second pressing portion 84A, the molding target on the molding target mounting table 81A has not reached the first holding surface 1511A.

After that, the elevating mechanism 83A pushes up the object mounting table 81A with the stronger force of the two strength stages. Then, the elastic member of the second pressing portion 84A bends, and the upper surface of the object mounting table 81A to be molded moves to a position higher than before the elastic member bends. As a result, the object to be molded on the object mounting table 81A is brought into contact with the first holding surface 1511A. At that time, since the claw portion main body 161 is outside the first holding surface 1511A, the claw portion main body 161 does not hinder the ascending of the object mounting table 81A. Subsequently, the object to be molded is adsorbed on the first holding surface 1511A by sucking air from the gas suction hole 1512A. After that, by lowering the object mounting table 81A to be molded by the elevating mechanism 83A, the claw portion 16 rotates in the direction opposite to that when pressing, and the claw portion main body 161 moves downward (inside) of the first holding surface 1511A. Move (see FIG. 5 (c)).

(4-2) One Embodiment of the resin molding apparatus of the second aspect and the resin molded article manufacturing method of the second aspect
(4-2-1) Configuration of Resin Molding Device of Second Embodiment FIG. 7 shows a resin molding device 20 which is one embodiment (second embodiment) of the resin molding device of the second embodiment. FIG. 7A shows the entire resin molding apparatus 20, and FIG. 7B shows the molding die and its surroundings in an enlarged manner. The resin molding apparatus 20 of the second embodiment has the same base 111, tie bar 112, lower movable platen 121, upper movable platen 122, toggle link 113, heat insulating material 141, and heater 142 as the resin molding apparatus 10 of the first embodiment. Have. The first lower mold 252A is on the upper surface of the lower movable platen 121, the first upper mold 251A is on the lower surface of the upper movable platen 122, the second lower mold 252B is on the upper surface of the upper movable platen 122, and the second is on the lower surface of the fixed platen 123. Each of the upper molds 251B is provided. The first upper mold 251A and the first lower mold 252A form the first molding mold 25A, and the second upper mold 251B and the second lower mold 252B form the second molding mold 25B. Since the first molding die 25A and the second molding die 25B have the same configuration, each component of the first molding die 25A will be described below. The component of the second molding die 25B is the one in which the reference numeral ending in "A" is changed to "B" in the description.

The lower surface of the first upper mold 251A is a first holding surface 2511A for holding an object to be molded, and the first holding surface 2511A is provided with a first gas suction hole 2512A1 and a second gas suction hole 2512A2. .. The first gas suction hole 2512A1 is connected to the vacuum pump 291 via the first upper mold 251A, the first gas suction pipe 2513A1 provided in the heater 142, and a flexible connecting pipe (not shown). ing. The second gas suction hole 2512A2 is connected to the vacuum ejector 292 via the first upper mold 251A, the second gas suction pipe 2513A2 provided in the heater 142, and a flexible connecting pipe (not shown). ing. The vacuum ejector 292 operates by the compressed air supplied from the compressed air tank, and the compressed air is supplied to the compressed air tank from a compressor (not shown). When the compressor cannot be operated due to a power failure or the like, the vacuum ejector 292 can be operated by the compressed air in the compressed air tank for a while. The first gas suction hole 2512A1, the first gas suction pipe 2513A1, the connecting pipe and the vacuum pump 291 constitute the first molding object suction mechanism, and the second gas suction hole 2512A2, the second gas suction pipe 2513A2, the connecting pipe and the vacuum. The ejector 292 constitutes a second molding object suction mechanism.

The first lower mold 252A has a peripheral wall member 1521A, a bottom surface member 1522A, and an elastic member 1523A similar to the first lower mold 152A of the first embodiment.

The resin molding apparatus 20 includes a lower mold holding portion main body 271 and a lower mold holding portion 27 having a lower mold holding portion elastic member 272. However, the lower mold holding portion 27 does not have a configuration corresponding to the pressing portion 173 in the lower mold holding portion 17 of the first embodiment.

Further, the resin molding apparatus 20 has a molding object transport mechanism 80B. As shown in FIG. 8, the molding target transfer mechanism 80B includes a molding target mounting table 81B on which the molding target is placed, an elevating mechanism 83B for raising and lowering the molding target mounting table 81B, and a molding target mounting table 81B. It also has a lateral movement mechanism 85B that moves the elevating mechanism 83A laterally. The molded object conveying mechanism 80B does not have a configuration corresponding to the second pressing portion and the second elevating mechanism of the molded object conveying mechanism 80 in the resin molding apparatus 10 of the first embodiment.

The resin molding apparatus 20 is not provided with a claw portion. Further, although the second molded object adsorption mechanism having the vacuum ejector 292 is used here, a Bernoulli chuck, an electrostatic chuck, or the like can be used instead.

(4-2-2) Operation of Resin Molding Device of Second Embodiment and Method of Manufacturing Resin Molded Product The operation of the resin molding device 20 of the second embodiment and the method of manufacturing a resin molded product will be described with reference to FIG. First, the molding target S is placed on the molding target mounting table 81B of the molding target transport mechanism 80B, and then the elevating mechanism 83B and the molding target mounting table 81B are mounted on the first molding mold 25A by the lateral movement mechanism 85B. It is moved between the first upper mold 251A and the first lower mold 252A. Next, the elevating mechanism 83B raises the object mounting table 81B to bring the object S to be molded on the object mounting table 81B into contact with the first holding surface 2511A (FIG. 9A). Then, the vacuum pump 291 is operated to suck air from the first gas suction hole 2512A1 through the first gas suction pipe 2513A1, and the vacuum ejector 292 is started to suck the air through the second gas suction pipe 2513A2. 2 By sucking air from the gas suction holes 2512A2, the molding target S on the molding target mounting table 81B is attracted to the first holding surface 2511A. After that, the elevating mechanism 83B lowers the molding target mounting table 81B, and the lateral movement mechanism 85B disengages the elevating mechanism 83B and the molding target mounting table 81B laterally from between the first upper mold 251A and the first lower mold 252A. Move to the correct position.

Next, the release film F is attached to the inner surface of the cavity C of the first lower mold 252A by a release film attachment mechanism (not shown). The release film F can be stretched by the same method as the resin molding apparatus 10 of the first embodiment. Subsequently, the resin material P is supplied into the cavity C by a resin material supply mechanism (not shown) (FIG. 9 (b)).

Then, the resin material P is melted by heating with the heater 142. When the resin material P in the cavity C is melted, the lower movable platen 121 is raised by the toggle link 113. As a result, the first molding die 25A and the second molding die 25B are respectively molded in the same manner as in the resin molding apparatus 10 of the first embodiment (in FIG. 9C, the state of the first molding die 25A being molded. Shows). After molding, the temperature at which the resin material in the cavity C is cured is maintained until the resin material is cured. After that, the lower movable platen 121 is lowered by the toggle link 113 to open the first molding die 25A and the second molding die 25B (FIG. 9 (d)).

After the mold is opened, the molding target S on which the resin molded product PS is formed is carried out from the first holding surface 2511A by the molding target transport mechanism 80A. Specifically, first, the lateral movement mechanism 85 moves the elevating mechanism 83A and the object mounting table 81B between the first upper mold 251B and the first lower mold 252A of the first molding mold 25A. Next, the elevating mechanism 83B raises the object mounting table 81B to bring the object S to be molded on the object mounting table 81B into contact with the first holding surface 2511A (similar to FIG. 9A). After that, the adsorption of the object S to be molded using the vacuum pump 291 and the vacuum ejector 292 is stopped. Then, the elevating mechanism 83B lowers the molding target mounting table 81B, and the lateral movement mechanism 85 moves the elevating mechanism 83B and the molding target mounting table 81B outward from between the first upper mold 151A and the first lower mold 152A. As a result, the object S to be molded can be carried out.

In the operations up to this point, by using the first object adsorption mechanism for molding using the vacuum pump 291 and the second object adsorption mechanism using the vacuum ejector 292, the vacuum pump 291 and the compressor stopped due to a power failure. Even so, the supply of compressed air from the compressed air tank of the second molding object adsorption mechanism to the vacuum ejector 292 is maintained for a while, whereby the adsorption of the molding object S can be maintained for a while. Further, even if the vacuum ejector 292 is stopped due to a reason such as the compressor remaining in failure for a long time, the adsorption of the object S to be molded can be maintained by the first adsorption mechanism for the object to be molded. For the above reasons, the resin molding apparatus 20 of the second embodiment can reduce the possibility that the object to be molded falls from the upper mold.

Further, since the resin molding apparatus 20 of the second embodiment does not use the claw portion, the resin molded product to be manufactured can be enlarged without being hindered by the claw portion, and the release film can be prevented from wrinkling. Can be done.

(4-3) Another embodiment of the resin molding apparatus of the first aspect (third embodiment), and one embodiment of the resin molded article manufacturing method of the third aspect.
(4-3-1) Configuration of Resin Molding Device of Third Embodiment FIG. 10 shows the configuration of the resin molding device 30 of the third embodiment. FIG. 10A shows the entire resin molding apparatus 30, and FIG. 10B shows the molding die and its surroundings in an enlarged manner. The resin molding apparatus 30 is an apparatus for performing transfer molding, and is a base 311, two tie bars 312 erected on the base 311 and a movable platen held by the tie bars 312 so as to be movable up and down. A fixed platen 323 fixed to the upper end of the tie bar 312 and a toggle link 313 provided on the base 311 for moving the movable platen 321 up and down are provided. Each component described so far is the same as the resin molding apparatus 10 of the first embodiment, except that only one movable platen 321 is provided.

The resin molding apparatus 30 further includes a molding die 35. The molding die 35 has a lower die 352 provided on the upper surface of the movable platen and an upper die 351 provided on the lower surface of the fixed platen 323. As shown in FIGS. 10B and 11A, the lower mold 352 is formed with two cavities C surrounded by a peripheral wall member 3521 and a bottom surface member 3522, and the two peripheral wall members are formed. A pot 381 is arranged between the set of 3521 and the bottom member 3522. A plunger 382 is inserted into the pot 381 from below. A runner 383 that connects the pot 381 and the cavity C is provided on the upper surface of the peripheral wall member 3521. The upper surfaces of the pot 381 and the runner 383 are normally open and are closed only when the mold is clamped by the pot runner block 39 described later. A plurality of suction ports (indicated by circles in FIG. 11A) for sucking the release film F are provided on the upper surface of the peripheral wall member 3521.

The upper mold 351 has a holding surface 3511 provided on each of the two sets of peripheral wall members 3521 of the lower mold 352 and the upper side of the cavity C, and claw portions 16 and the claws provided on both sides of each of the two holding surfaces 3511. A lower mold holding portion 17 provided outside the portion 16 is provided. Since each of the components of the claw portion 16 and the lower mold holding portion 17 is the same as that of the first embodiment, the reference numerals given in the first embodiment are attached as they are, and detailed description thereof is omitted. To do. The holding surface 3511 is provided with a gas suction hole 3512. The gas suction hole 3512 is connected to the vacuum pump 391 via a gas suction pipe 3513 and a flexible connecting pipe (not shown). Further, a pot runner block 39 is provided directly above the pot 381 and the runner 383 (FIG. 11 (b)). A pair of pot runner blocks 39 are provided so as to sandwich the lower mold holding portion 17 in the vertical direction of FIG. 11 (b) (thus, the position does not interfere with the lower mold holding portion 17), and the pots correspond to the pot runner blocks 39. A pair of 381 and a runner 383 are also provided side by side in the vertical direction of FIG. 11 (a).

The resin molding apparatus 30 further has a molding object transport mechanism 80 similar to the resin molding apparatus 10 of the first embodiment.

(4-3-2) Operation of Resin Molding Device of Third Embodiment and Method of Manufacturing Resin Molded Product The operation of the resin molding device 30 of the third embodiment and the method of manufacturing a resin molded product will be described with reference to FIG. In FIG. 12, only one set of the two sets of peripheral wall members 3521 and the bottom member 3522 of the lower die 352, the two sets of holding surfaces 3511 of the upper die 351 and the claw portion 16 and the lower die holding portion 17 and the like are used. As shown, each of these two sets of components works in the same way.

First, using the molding target transport mechanism 80, the molding target transport mechanism 80 is moved to a position between the upper mold 351 and the lower mold 352 by the same operation as the resin molding device 10 of the first embodiment. Then, the first elevating mechanism 82 is raised by the second elevating mechanism 83, the second pressed portion 164 is pressed by the second pressing portion 84, and the molding object mounting table 81 is further raised by the first elevating mechanism 82. The object S to be molded is brought into contact with the holding surface 3511 (FIG. 12 (a)). At that time, as in the case of the first embodiment, the claw portion 16 is rotated by pressing the second pressed portion 164 of the claw portion 16 with the second pressing portion 84 of the molding object transport mechanism 80, and the claws are clawed. Since the portion main body 161 moves to the outside of the holding surface 3511 (see FIG. 5B), the claw portion main body 161 does not hinder the ascent of the object mounting table 81 to be molded. By operating the vacuum pump 391 in a state where the object S to be molded is in contact with the holding surface 3511 in this way, the object S to be molded is attracted to the holding surface 3511. After that, when the molding target mounting table 81 is lowered, the claw portion 16 rotates, and the claw portion main body 161 moves to the lower side of the holding surface 3511 and the molding target S. As a result, even if the vacuum pump 391 is stopped, the object S to be molded can be received by the claw portion main body 161, so that the object S to be molded can be prevented from falling. After that, the object transport mechanism 80 to be molded is removed from the position between the upper mold 351 and the lower mold 352.

Next, the solid resin material P is put into the pot 381, and the release film F is stretched on the inner surface of the cavity C (FIG. 12 (b)). When the release film F is stretched, gas is sucked from a suction port provided on the upper surface of the peripheral wall member 3521.

Subsequently, the movable platen 321 is raised by the toggle link 313 to perform mold clamping. At that time, when the upper die 351 and the lower die 352 approach the claw portion movement start distance or less, the lower die holding portion main body 171 abuts on the upper surface of the peripheral wall member 3521 of the lower die 352, and the upper die 351 and the lower die 352 further approach. As the lower mold holding portion elastic member 172 is compressed, the pressing portion 173 pushes up the first pressed portion 163 of the claw portion 16. As a result, the claw portion 16 rotates, and the claw portion main body 161 moves to the outside of the holding surface 3511 of the upper die 351 (see FIG. 5 (d)). As a result, resin molding can be performed over a wide range in the molding target S without the claw portion main body 161 becoming an obstacle. Further, the claw portion main body 161 does not come into contact with the upper surface of the peripheral wall member 3521, and it is not necessary to provide a recess (relief portion) on the upper surface of the peripheral wall member 3521 to allow the claw portion main body 161 to escape. Therefore, the claw portion main body 161 does not push the release film F to cause wrinkles on the release film F.

After molding, the resin material P in the pot 381 is melted by heating with a heater (not shown), and the resin material P is extruded from the pot 381 by the plunger 382 (FIG. 12 (c)). The resin material P extruded from the pot 381 passes through the runner 383 and is supplied into the cavity C. After the resin material P in the cavity C is cured, the movable platen 321 is lowered by the toggle link 313 to open the mold (FIG. 12 (d)). Then, by removing the object S to be molded from the holding surface 3511 of the upper mold 351 by the same method as in the case of the first embodiment, the production of one resin molded product PS is completed.

(4-4) Another Embodiment of the Resin Molding Device of the Second Embodiment (Fourth Embodiment), and One Embodiment of the Resin Molded Product Manufacturing Method of the Fourth Embodiment
(4-4-1) Configuration of Resin Molding Device of Fourth Embodiment FIG. 13 shows the configuration of the resin molding device 40 of the fourth embodiment. FIG. 13A shows the entire resin molding apparatus 40, and FIG. 13B shows the molding die and its surroundings in an enlarged manner. The resin molding apparatus 40 of the fourth embodiment has the same base 311, tie bar 312, toggle link 313, movable platen 321 and fixed platen 323 as the resin molding apparatus 30 of the third embodiment. A lower mold 352 is provided on the upper surface of the movable platen 321 and an upper mold 451 is provided on the lower surface of the fixed platen 323, and the upper mold 451 and the lower mold 352 constitute the molding mold 45. Since the lower mold 352 has the same configuration as that of the resin molding apparatus 30 of the third embodiment, the same reference numerals as those of the third embodiment will be added, and the description thereof will be omitted.

The lower surface of the upper mold 451 is a holding surface 4511 for holding the object to be molded, and the holding surface 4511 is provided with a first gas suction hole 45121 and a second gas suction hole 45122. The first gas suction hole 45121 is connected to the vacuum pump 491 via the first gas suction pipe 45131 and a flexible connecting pipe (not shown). The second gas suction hole 45122 is connected to the vacuum ejector 492 via the second gas suction pipe 45132 and a flexible connecting pipe (not shown). The vacuum ejector 492 is operated by using the compressed air supplied from the compressor to the compressed air tank as in the case of the second embodiment.

The upper mold 451 is provided with a lower mold holding portion 17 and a pot runner block (not shown) similar to the resin molding apparatus 30 of the third embodiment. However, the pressing portion 173 of the lower mold pressing portion 17 of the resin molding apparatus 30 of the third embodiment is not provided in the present embodiment. Further, the claw portion of the resin molding apparatus 30 of the third embodiment is not provided in the present embodiment.

The resin molding apparatus 40 further includes a molding object conveying mechanism 80A similar to the resin molding apparatus 20 of the second embodiment.

(4-4-2) Operation of Resin Molding Device of Fourth Embodiment and Method of Manufacturing Resin Molded Product The operation of the resin molding device 40 of the fourth embodiment and the method of manufacturing a resin molded product will be described with reference to FIG. First, the object S to be molded is adsorbed on the holding surface 4511 by using the object transfer mechanism 80A in the same manner as the resin molding device 20 of the second embodiment (FIG. 14A). Here, for suction to the holding surface 4511, the vacuum pump 491 is operated to suck air from the first gas suction hole 45121 through the first gas suction pipe 45131, and the vacuum ejector 492 is activated to start the vacuum ejector 492. 2 This is performed by sucking air from the second gas suction hole 45122 via the gas suction pipe 45132. As a result, even if the vacuum pump 491 and the compressor are stopped due to a power failure, the supply of compressed air from the compressed air tank to the vacuum ejector 492 is maintained for a while, whereby the adsorption of the object S to be molded can be maintained for a while. .. Further, even if the vacuum ejector 492 is stopped due to a situation such as the compressor remaining in failure for a long time, the adsorption of the object S to be molded using the vacuum pump 491 can be maintained.

Next, the solid resin material P is put into the pot 381, and the release film F is stretched on the inner surface of the cavity C (FIG. 14 (b)). Subsequently, the movable platen 321 is raised by the toggle link 313 to perform mold clamping. Since the claw portion is not used in the present embodiment, the resin molding can be performed over a wide range in the molding target S without the claw portion becoming an obstacle. Further, since the claw portion does not come into contact with the upper surface of the peripheral wall member 3521 and it is not necessary to provide a recess (relief portion) on the upper surface of the peripheral wall member 3521 to allow the claw portion to escape, the claw portion is wrinkled on the release film F. Does not cause.

After molding, the resin material P in the pot 381 is melted by heating with a heater (not shown), and the resin material P is extruded from the pot 381 by the plunger 382 and supplied into the cavity C via the runner 383 (FIG. 14 (c)). After the resin material P in the cavity C is cured, the movable platen 321 is lowered by the toggle link 313 to open the mold (FIG. 14 (d)). Then, by removing the object S to be molded from the holding surface 4511 of the upper mold 451 by the same method as in the case of the second embodiment, the production of one resin molded product PS is completed.

(4-5) Resin Molding Unit Combined with Modules FIG. 15 shows a resin molding unit 50 using either of the resin molding apparatus (resin molding apparatus for performing compression molding) of the first or second embodiment. In FIG. 15 and the following description, an example using the resin molding apparatus 10 of the first embodiment will be described, but the resin molding apparatus 10 of the first embodiment is replaced with the resin molding apparatus 20 of the second embodiment. Is possible.

The resin molding unit 50 includes a material receiving module 51, a molding module 52, and a dispensing module 53. The material receiving module 51 is a device for receiving the resin material P and the molding object S from the outside and sending them to the molding module 52, and has a resin material supply device 510 and a molding object receiving unit 511. One molding module 52 includes one set of the above-mentioned resin molding apparatus 10. Although three molding modules 52 are shown in FIG. 15, any number of molding modules 52 can be provided in the resin molding unit 50. Further, the molding module 52 can be increased or decreased even after the resin molding unit 50 is assembled and used. The payout module 53 carries in and holds the resin molded product manufactured by the molding module 52 from the molding module 52, and has a resin molded product holding portion 531.

The resin molding unit 50 is mainly transported to transport the molding object S, the resin material transfer tray 58, and the resin molded product so as to penetrate the material receiving module 51, one or a plurality of molding modules 52, and the dispensing module 53. A device 56 is provided. Further, in each module, a molding object S, a resin material transfer tray 58, and an auxiliary transfer device 57 for transferring a resin molded product are provided between the main transfer device 56 and the device in the module. In addition, the resin molding unit 50 has a power supply and a control unit (none of which are shown) for operating each of the above modules.

The operation of the resin molding unit 50 will be described. The molded object S is held by the operator in the molded object receiving portion 511 of the material receiving module 51. The main transfer device 56 and the sub-transfer device 57 convey the object S to be molded from the object receiving unit 511 to the resin molding device 10 in one of the molding modules 52, and the object S to be molded is molded by the resin. It is placed on the molding target mounting table 81 of the molding target transport mechanism 80 in the apparatus 10. After that, in the resin molding apparatus 10, the object S to be molded is attached to the first holding surface 1511A and the second holding surface 1511B by the above method. After that, in the resin molding apparatus 10, the release film F is stretched in the cavities C of the first lower mold 152A and the second lower mold 152B.

Subsequently, the main transfer device 56 and the sub transfer device 57 carry the resin material transfer tray 58 into the resin material supply device 510. In the resin material supply device 510, the resin material P is supplied to the resin material transfer tray 58.

In the main transfer device 56 and the sub transfer device 57, the resin of the molding module 52 in which the resin material transfer tray 58 to which the resin material P is supplied is attached to the first holding surface 1511A and the second holding surface 1511B of the object S to be molded. It is conveyed to the molding apparatus 10. Then, the resin material P is supplied to the cavities C of the first lower mold 152A and the second lower mold 152B of the resin molding apparatus 10. Then, compression molding is performed in the resin molding apparatus 10. While the resin molding apparatus 10 is performing compression molding, the same operations as before are performed on the resin molding apparatus 10 in the other molding modules 52 to shift the time between the plurality of molding modules 52. However, compression molding can be performed in parallel.

The resin molded product obtained by compression molding is removed from the first holding surface 1511A and the second holding surface 1511B by the method described above by the object transfer mechanism 80, and then resin molded by the main transfer device 56 and the sub transfer device 57. It is carried out from the device 10 and carried in and held in the resin molded product holding portion 531 of the payout module 53. The user appropriately takes out the resin molded product from the resin molded product holding unit 531.

The present invention is not limited to the embodiments described above, and many modifications are possible by those who have ordinary knowledge in the art within the technical idea of the present invention.

10, 20, 30, 40 ... Resin molding apparatus 111, 311 ... Base 112, 312 ... Tie bar 113, 313 ... Toggle link 121 ... Lower movable platen 122 ... Upper movable platen 123 ... 323 ... Fixed platen 141 ... Insulation material 142 ... Heater 15A ... 1st molding die 15B ... 2nd molding die 151A ... 1st upper die 151B ... 2nd upper die 1511A, 2511A ... 1st holding surface 1511B ... 2nd holding surface 1512A, 1512B, 3512 ... Gas suction holes 1513A, 1513B , 3513 ... Gas suction tube 152A ... 1st lower mold 152B ... 2nd lower mold 1521A, 1521B, 2521A, 2521B, 3521 ... Peripheral wall members 1522A, 1522B, 2522A, 2522B, 3522 ... Bottom members 1523A, 1523B, 2523A, 2523B ... Elastic member 16 ... Claw portion 161 ... Claw portion main body 162 ... Rotation shaft 163 ... First pressed portion 164 ... Second pressed portion 165 ... Biasing mechanism 17, 27 ... Lower mold pressing portion 171, 271 ... Lower mold pressing Main body 172, 272 ... Lower mold holding part Elastic member 173 ... Pressing part 19 ... Molding object suction mechanism 191, 291, 391, 491 ... Vacuum pumps 2512A1, 45121 ... First gas suction holes 2512A2, 45122 ... Second gas suction Holes 2513A1, 45131 ... 1st gas suction pipe 2513A2, 45132 ... 2nd gas suction pipe 292, 492 ... Vacuum ejector 323 ... Fixed platen 35, 45 ... Molded mold 351 ... Upper mold 3511, 4511 ... Holding surface 352 ... Lower mold 381 ... Pot 382 ... Plunger 383 ... Runner 39 ... Pot runner block 50 ... Resin molding unit 51 ... Material receiving module 510 ... Resin material supply device 511 ... Molding object receiving part 52 ... Molding module 53 ... Discharging module 531 ... Resin molded product holding Part 56 ... Main transfer device 57 ... Resin material transfer tray 58 ... Sub-transfer device 80, 80A, 80B ... Molded object transfer mechanism 81, 81A, 81B ... Molded object mounting table 82 ... First elevating mechanism 83 ... Second elevating mechanism Mechanism 83A, 83B ... Elevating mechanism 84, 84A ... Second pressing portion 85, 85A, 85B ... Lateral movement mechanism C ... Cavity F ... Release film P ... Resin material PS ... Resin molded product S ... Molded object

Claims (4)

a) An upper mold having a holding surface for holding the object to be molded on the lower side,
b) A lower mold with a cavity placed facing the upper mold and
c) A first molding object adsorption mechanism for adsorbing a molded object to the holding surface by suctioning gas by a vacuum pump driven by electric power provided on the holding surface.
d) A second molding object adsorption mechanism that adsorbs the object to be molded to the holding surface by suctioning gas by a vacuum ejector driven by compressed air provided on the holding surface.
The resin molding apparatus is characterized in that, when the supply of electric power is stopped, the second molding target adsorption mechanism prevents the molding target from falling . The resin molding apparatus according to claim 1, further comprising a storage tank for storing compressed air supplied to the vacuum ejector. A method for producing a resin molded product using the resin molding apparatus according to claim 1 or 2.
A molding object holding step of adsorbing a molding object on the holding surface by the first molding object adsorption mechanism and the second molding object adsorption mechanism.
The resin material supply process for supplying the resin material to the cavity and
A mold clamping step of molding the upper mold and the lower mold, and
A method for producing a resin molded product, which comprises a resin material curing step of heating the resin material to a temperature at which the resin material in the cavity softens or melts, and then curing the resin material. A method for producing a resin molded product using the resin molding apparatus according to claim 1 or 2.
A molding object holding step of adsorbing a molding object on the holding surface by the first molding object adsorption mechanism and the second molding object adsorption mechanism.
A mold clamping step of molding the upper mold and the lower mold, and
A resin material supply step of supplying a softened or melted resin material into the cavity, and
A method for producing a resin molded product, which comprises a resin material curing step of curing the resin material supplied into the cavity.

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