KR102398207B1 - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The present invention is to supply a sheet-like resin to a molding die by suppressing bending, wrinkling, or breakage of the sheet-like resin, the first molding die 15 and the second molding die 16 facing each other; A mold fastening mechanism 17 for fastening the first molding die 15 and the second molding die 16, and the sheet-shaped resin J are applied to the first molding die 15 or the second molding die ( 16) provided with a resin supply mechanism 2, wherein the resin supply mechanism 2 has a suction hole for adsorbing the other surface of the sheet-like resin J provided with a protective film PF on one surface. The adsorption member 31 in which the 311 was formed is provided.

Description

A resin molding apparatus and the manufacturing method of a resin molded article TECHNICAL FIELD

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article.

As a conventional resin molding apparatus, as shown in patent document 1, performing resin molding using sheet-like resin is considered.

This resin molding apparatus is configured to collectively carry a plurality of sheet-shaped resins optimally weighed and cut according to the package in advance into a plurality of cavities provided in the lower frame. increase, and equalization of the resin supply amount to each cavity is aimed at.

Japanese Patent Laid-Open No. 2003-133350

However, in the sheet-like resin, a protective film is provided on one or both sides thereof, and the protective film must be peeled off from the sheet-like resin before being supplied to a mold such as a lower mold. Since the sheet-like resin is so soft and brittle that it cannot retain its shape, the sheet-like resin is easy to bend (brittle and bend), wrinkle (wrinkle), and break when or after the protective film is peeled off. In particular, the larger the substrate or wafer, which is the object to be molded, the larger the sheet-like resin becomes, so these problems become more pronounced. For this reason, it is difficult to supply the sheet-like resin from which the protective film was peeled off to a molding die in an appropriate state, and as a result, it will become a cause of molding defect.

Therefore, the present invention has been made in order to solve the above problems, and its main object is to supply the sheet-like resin to the molding die by suppressing bending, wrinkling, or breakage of the sheet-like resin.

That is, the resin molding apparatus according to the present invention comprises a first molding die and a second molding die facing each other, and die-clamping the first molding die and the second molding die. ) a mold clamping mechanism and a resin supply mechanism for supplying the sheet-like resin to the first or second molding die, wherein the resin supply mechanism includes a protective film provided on one side of the sheet-like resin It is characterized by comprising an adsorption member provided with an adsorption hole for adsorbing the other surface of the device.

ADVANTAGE OF THE INVENTION According to this invention, bending, wrinkling, or breakage of a sheet-like resin can be suppressed, and sheet-like resin can be supplied to a shaping|molding die.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically the structure of the resin molding apparatus of this embodiment.
Fig. 2 is a cross-sectional view schematically showing the configuration of a resin molding module of the same embodiment.
Fig. 3 is a perspective view schematically showing (a) the state before peeling off the protective film and (b) the state in which the protective film is peeled off and wrinkled (wrinkled) of the sheet-like resin.
It is a perspective view which shows typically the structure of the adsorption|suction mechanism of the same embodiment.
It is a top view which shows typically the structure of the adsorption|suction mechanism of the same embodiment.
It is sectional drawing which shows typically the structure of the adsorption|suction mechanism of the same embodiment.
Fig. 7 is a partially enlarged cross-sectional view schematically showing irregularities on the surface of the adsorption member of the same embodiment.
It is a schematic diagram which shows the operation|movement of resin molding of the same embodiment.
It is sectional drawing which shows typically the state which positioned the adsorption|suction member of the same embodiment on the lower frame.
It is sectional drawing which shows typically the structure of the adsorption|suction mechanism of a modified embodiment.

Next, the present invention will be described in more detail by way of example. However, this invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention comprises: a first molding die and a second molding die opposite to each other, and a mold fastening mechanism for fastening the first molding die and the second molding die; a resin supply mechanism for supplying the sheet-like resin to the first molding die or the second molding die, wherein the resin supply mechanism is provided on one side of the sheet-like resin with a protective film on the other side It is characterized in that it comprises an adsorption member formed with an adsorption hole for adsorbing the.

In the case of the resin molding apparatus configured in this way, the protective film can be peeled off from the sheet-like resin while the other side of the sheet-like resin provided with the protective film on one side is adsorbed to the adsorption member. The shape of the sheet-like resin can be maintained. Thereby, bending, wrinkling, or breakage of the sheet-like resin can be suppressed, and the sheet-like resin can be supplied to the mold. As a result, the molding defect of resin molding using sheet-like resin can be reduced.

In addition, since a sheet-like resin is used as the resin material, compared to the case where liquid resin or granular resin is used, the amount of resin material supplied into the mold can be uniformed, and the resin molded product can be produced It can also respond to requests such as thinning.

In order to reliably adsorb the sheet-like resin to the adsorption member, it is preferable that a plurality of irregularities are formed on the surface of the adsorption member on which the adsorption holes are formed.

With this configuration, a gap is formed between the adsorption member and the sheet-like resin due to the plurality of irregularities, and air is sucked from the gap through the adsorption hole. As a result, the sheet-like resin is adsorbed not only from the suction hole but also from the recessed portion, so that the pressure-receiving area of the sheet-like resin is increased, and the sheet-like resin can be reliably adsorbed to the adsorption member. In addition, since the pressure applied to the sheet-like resin is dispersed, deformation and breakage of the sheet-like resin can be reduced, and at the same time, the trouble that the sheet-like resin gets into (infiltrates) the suction hole and becomes difficult to peel off can be suppressed. can

It is preferable that the said adsorption|suction hole is provided in the said adsorption|suction member in plurality.

By forming the plurality of adsorption holes in the adsorption member in this way, the pressure that the sheet-like resin receives from the respective adsorption holes can be reduced. As a result, while being able to reduce the deformation|transformation and breakage of sheet-like resin, the trouble that sheet-like resin gets into an adsorption hole and becomes difficult to peel can be suppressed.

When one suction flow path communicates with a plurality of suction holes, the suction force varies between the suction hole located close to the suction flow path and the suction hole located far away from the suction flow path. In order to solve this problem and suppress variation in the adsorption force of the plurality of adsorption holes, it is preferable that the resin supply mechanism has a plurality of suction passages communicating with the plurality of adsorption holes.

When the adsorbed sheet-like resin is supplied to the mold, it is assumed that the sheet-like resin cannot be reliably removed only by canceling the adsorption. Further, when the sheet-like resin is separated from (separated) from the adsorption member, the sheet-like resin is partially curled (curled), and there is a fear that the sheet-like resin supplied to the mold may be bent or wrinkled.

In order to solve these problems, it is preferable that the said adsorption|suction member is comprised so that gas can be ejected to the said other surface of the said sheet-like resin adsorbed.

In this configuration, since gas is blown to the other side of the adsorbed sheet-like resin, the sheet-like resin can be reliably separated from the adsorbing member, and the sheet-like resin after being removed is partially curled (folded) and bent. It can be suppressed from becoming crumpled or wrinkled.

As a specific embodiment of enabling gas to be ejected from the adsorption member, it is conceivable that the adsorption member is provided with a gas ejection hole for ejecting gas on the other surface of the adsorbed sheet-like resin.

At this time, in order to simplify the structure of the adsorption|suction member, it is preferable that the said adsorption|suction hole is also used as the said gas ejection hole. In addition, in the sheet-like resin, since the portion that has penetrated into the suction hole is directly pushed by the gas, the sheet-like resin can be reliably separated from the suction member.

In order to accurately supply the sheet-like resin to the mold, it is preferable to first adsorb the sheet-like resin to the adsorption member in a state aligned with the sheet-like resin. In order to be able to perform this alignment easily, it is preferable that the said adsorption|suction member has a mark part for positioning the said sheet-like resin.

In addition, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product in which a resin molded product is manufactured by fastening a first molding die and a second molding die facing each other, wherein a protective film is provided on one side. An adsorption retention step of adsorbing the other side of the sheet-like resin to an adsorption member and preserving and holding the sheet-like resin, and peeling of peeling off the protective film from the sheet-like resin adsorbed and held by the adsorption member a resin supply step of supplying the sheet-like resin from which the protective film has been peeled off to the first or second molding die; It is characterized by comprising a resin molding step of performing resin molding using the sheet-like resin by fastening it.

With such a method for manufacturing a resin molded article, the protective film can be peeled off from the sheet-shaped resin while the other surface of the sheet-shaped resin provided with a protective film on one surface is adsorbed to the adsorption member, as in the above-described resin molding apparatus. When or after peeling off a protective film, the shape of a sheet-like resin can be maintained. Thereby, bending, wrinkling, or breakage of the sheet-like resin can be suppressed, and the sheet-like resin can be supplied to the mold. As a result, the molding defect of resin molding using sheet-like resin can be reduced.

In order to accurately supply the sheet-like resin to the molding die, in the resin supply step, it is preferable to position the suction member with respect to the first molding die or the second molding die.

The adsorption member is configured to be capable of ejecting gas to the other surface of the adsorbed sheet-like resin, and in the resin supply step, the adsorption in the adsorption retention step is canceled, and the other surface It is preferable to supply the said sheet-like resin to the said 1st shaping|molding die or the said 2nd shaping|molding die by blowing out gas.

In this configuration, since the gas is blown to the other side of the adsorbed sheet-like resin, the sheet-like resin can be reliably separated from the adsorption member, and at the same time, the sheet-like resin is prevented from being partially curled and bent or wrinkled. can do

<One embodiment of the present invention>

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of the resin molding apparatus which concerns on this invention is demonstrated with reference to drawings. In addition, in order to make it easy to understand also about any figure shown below, it abbreviate|omits suitably or exaggerates and is schematically illustrated. About the same component, the same code|symbol is attached|subjected and description is abbreviate|omitted suitably.

<The overall structure of the resin molding apparatus 100>

The resin molding apparatus 100 of this embodiment seals the component mounting surface on which the electronic component was mounted with resin with respect to the board|substrate W on which the electronic component was mounted, and manufactures the resin molded article P. Examples of the substrate include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, and a lead frame.

As shown in FIG. 1, this resin molding apparatus 100 is equipped with the board|substrate supply/storage module A, two resin molding modules B, and the resin supply module C, respectively as components. do. Each component (each module A to C) is detachable and replaceable for each component.

Operation control of the resin molding apparatus 100 including each module A-C shown below is performed by the control part CTL provided in the board|substrate supply/storage module A, for example. This control unit CTL may be provided in modules B and C other than the substrate supply/storage module A. Moreover, the control part CTL may be divided into a plurality and may be provided in at least two modules of the substrate supply/storage module A, the resin molding module B, and the resin supply module C.

<Board supply/storage module (A)>

As shown in FIG. 1, the board|substrate supply/storage module A includes the board|substrate supply part 11 which supplies the board|substrate W before sealing, and the board|substrate W (resin molded article) which finished sealing. P)), the substrate receiving portion 12, the substrate before sealing (W) and the resin molded product (P) are exchanged (received and delivered), the substrate mounting portion 13, and before sealing It has the board|substrate conveyance mechanism 14 which conveys the board|substrate W and the resin molded article P. The board|substrate mounting part 13 moves in the Y-direction between the position corresponding to the board|substrate supply part 11 and the position corresponding to the board|substrate storage part 12 in the board|substrate supply/storage module A. The substrate transport mechanism 14 moves in the X-direction and the Y-direction in the substrate supply/storage module A and each resin molding module B.

<Resin molding module (B)>

Each resin molding module B, as shown in Figs. 1 and 2, includes a lower mold 15, which is a first molding mold in which a cavity 15C is formed, and a second mold for holding the substrate W. It has an upper frame (16) which is a forming frame, and a frame fastening mechanism (17) for fastening the lower frame (15) and the upper frame (16).

The frame fastening mechanism 17, as shown in FIG. 2, includes a movable board 171 to which the lower frame 15 is mounted, an upper fixed board 172 to which the upper frame 16 is mounted, and a movable board ( It has a drive mechanism 173 for moving 171 up and down.

The movable board 171 is a lower frame 15 is mounted on its upper surface, and is supported so as to be movable up and down by a plurality of post parts 175 erected on the lower fixed board 174 .

The upper fixed plate 172 has an upper frame 16 attached to its lower surface, and is fixed to face the movable plate 171 at the upper end of the plurality of support posts 175 .

The drive mechanism 173 is provided between the movable plate 171 and the lower fixed plate 174, and by moving the movable plate 171 up and down, the lower frame 15 and the upper frame 16 are frame-fastened. At the same time, a predetermined molding pressure is applied. The drive mechanism 173 of the present embodiment is a direct-acting type that transmits to the movable board 171 using a ball screw mechanism that converts rotation of a servomotor or the like into linear motion, but uses a power source such as a servomotor, for example. The link system may be used for transmitting to the movable panel 171 using a link mechanism such as a toggle link.

And, between the lower frame 15 and the movable plate 171, the lower frame holding part 176 is provided. The lower frame holding part 176 includes a heater plate 176a for heating the lower frame 15 , a heat insulating member 176b provided on a lower surface of the heater plate 176a , and an upper surface of the heater plate 176a . It has a side wall member 176c provided in the periphery of the lower frame 15 and a seal member 176d provided at the upper end of the side wall member 176c.

Between the upper frame 16 and the upper fixed plate 172, an upper frame holding part 177 is provided. The upper frame holding part 177 includes a heater plate 177a for heating the upper frame 16 , a heat insulating member 177b provided on an upper surface of the heater plate 177a , and a lower surface of the heater plate 177a . It has a side wall member 177c provided in the periphery of the upper frame 16 and a seal member 177d provided at the lower end of the side wall member 177c. And at the time of clamping by the drive mechanism 173, the sealing member 176d of the side wall member 176c and the sealing member 177d of the side wall member 177c closely_contact|adhere, and the lower frame 15 and the upper frame ( 16) The accommodating space is blocked from outside air. Moreover, it is good also as a structure which does not provide either the sealing member 176d or the sealing member 177d.

The upper frame 16 adsorbs and holds the back surface of the substrate W. As shown in FIG. A suction hole (not shown) is formed on the lower surface of the upper frame 16 , and a suction flow path (not shown) is formed inside the upper frame 16 . This suction flow path is connected to an external suction device (not shown).

In the lower frame 15, as shown in FIG. 2, the cavity 15C which accommodates the electronic component and resin material mounted on the board|substrate W is formed. Specifically, the lower frame 15 includes a bottom member 151 which is a single member forming a bottom face of the cavity 15C, and a side member 152 surrounding the bottom member 151 . A cavity 15C is formed by the upper surface of the bottom member 151 and the inner peripheral surface of the side member 152 . The bottom member 151 of this embodiment is a flat plate which forms a rectangular shape in planar view, and the side member 152 forms a rectangular frame shape in planar view. In addition, the side member 152 is provided to be movable up and down relative to the bottom member 151 . Specifically, the base plate 153 of the lower frame 15 is supported by a plurality of elastic members 154 such as coil springs.

<Resin supply module (C)>

The resin supply module C has a resin supply mechanism 2 for supplying a sheet-like resin J as a resin material to the lower frame 15 as shown in FIG. 1 .

Here, if the sheet-like resin (J) is described, as shown in Fig. 3 (a), on one or both sides of the sheet-like resin (J), the sheet-like resin (J) is protected from dirt and damage. A protective film PF is provided for this purpose, and it is necessary to peel this protective film PF before supplying to the lower frame 15 . In addition, in (a) of FIG. 3, what the protective film PF was provided on one side of the sheet-like resin J is illustrated. The sheet-like resin (J) has a thickness or flexibility that cannot maintain its shape, and when the protective film (PF) is peeled off, as shown in Fig. 3 (b), it is bent and wrinkled (wrinkled). easy to lose)

Specifically, as shown in Fig. 1, the resin supply mechanism 2 includes an adsorption mechanism 3 for adsorbing the other surface of the sheet-like resin J provided with a protective film PF on one surface, and the adsorption. A moving mechanism 4 for moving the mechanism 3 is provided.

In addition, the other surface of the sheet-like resin J is an exposed surface on which the protective film PF is not provided, and in the following description, the other surface of the sheet-like resin J is called an exposed surface.

The adsorption mechanism 3 is equipped with the adsorption|suction member 31 in which the adsorption|suction hole 311 was formed, as shown in FIGS. The adsorption member 31 is provided with a plurality of adsorption holes 311 for adsorbing the exposed surface of the sheet-like resin J. As shown in FIG. Specifically, the adsorption member 31 has a planar adsorption holding surface 31X for adsorbing and holding the sheet-like resin J, and a plurality of adsorption holes 311 in the adsorption holding face 31X. ) is open. The plurality of suction holes 311 have, for example, the same opening shape (for example, circular shape). The suction member 31 of this embodiment forms a flat plate shape (plate shape), and the one surface (upper surface) becomes the suction holding|maintenance surface 31X. In this suction holding surface 31X, the plurality of suction holes 311 are arranged regularly in a plan view, for example, and are arranged at equal intervals along each of the directions (vertical and horizontal) orthogonal to each other. There is (see Fig. 5).

And a space forming member ( 32) is provided. A vacuum generator 33 is connected to the space forming member 32 via the internal space 3S and includes a vacuum ejector that applies an adsorption force to the exposed surface of the sheet-like resin J from the adsorption hole 311. . Moreover, this space forming member 32 is connected with the rotating shaft member 37 and the support member 38 mentioned later. Moreover, the vacuum generator 33 is provided so that it can move together with the adsorption|suction member 31. As shown in FIG.

Moreover, the vacuum generator 33 and the internal space 3S are connected by the suction flow path 34. As shown in FIG. In the present embodiment, a plurality of suction passages 34 communicating with the plurality of suction holes 311 are provided. Each suction flow path 34 communicates with the internal space 3S by being connected to the space forming member 32. As shown in FIG. Moreover, each suction flow path 34 is connected corresponding to the some adsorption|suction area|region set in 31X of adsorption|suction holding|maintenance surface 31X. For example, a central region set in the center and a plurality of peripheral regions set around the central region are set on the suction holding surface 31X, and connecting the suction flow path 34 corresponding to each of these regions is I think. Thereby, compared with the case where it attract|sucks by the single suction flow path 34, the adsorption force of the adsorption|suction holding|maintenance surface 31X whole can be equalized|homogenized. In addition, the some suction flow path 34 is comprised by piping, and the structure connected to the vacuum generator 33 may be sufficient as a part of that becomes a common piping. Moreover, you may partition (division) the internal space 3S formed by the space forming member 32 into the some space made to respond|correspond to the some adsorption|suction area|region.

Moreover, as shown in FIG. 7, the some unevenness|corrugation 35 is formed in the surface (adsorption holding|maintenance surface 31X) of the adsorption|suction hole 311 of the adsorption|suction member 31 formed. The plurality of irregularities 35 are formed by, for example, blast processing. By forming such an unevenness|corrugation 35, the clearance gap S communicating with the adsorption|suction hole 311 arises between a recessed part and the exposed surface of the sheet-like resin J. Thereby, the adsorption|suction force from the adsorption|suction hole 311 acts also on the part which does not oppose the adsorption|suction hole 311 in the exposed surface through this clearance gap S. As a result, the sheet-shaped resin (J) is adsorbed not only from the adsorption hole (311) but also from the recessed portion, so that the pressure-receiving area of the sheet-shaped resin (J) becomes large, and the sheet-shaped resin ( J) can be adsorbed reliably. In addition, the plurality of irregularities 35 are not limited to those formed by blast processing, and may be formed by other surface processing. A plurality of irregularities may be formed.

Moreover, the adsorption|suction member 31 is comprised so that gas (for example, air) can blow out to the exposed surface of the sheet-like resin J which adsorb|sucked. Specifically, in the adsorption member 31, a gas ejection hole for ejecting gas is formed on the exposed surface of the adsorbed sheet-like resin J. In the present embodiment, the plurality of adsorption holes 311 are also used as gas ejection holes. And by switching the switching valve (not shown) provided in the suction flow path 34, it is comprised so that gas may be ejected from the some suction hole 311 using the vacuum generator 33. As shown in FIG. For example, the suction fluid circuit in which the suction port of the vacuum ejector in the vacuum generator 33 is connected to the internal space 3S by the piping structure which consists of the suction flow path 34 and the switching valve provided in the suction flow path 34. It is configured such that the ejection fluid circuit in which the exhaust port of the vacuum ejector in the vacuum generator 33 is connected to the internal space 3S is switched. By blowing the gas to the exposed surface of the sheet-like resin J adsorbed in this way, the sheet-like resin J can be reliably separated from the adsorption member 31 and the sheet shape after being separated (removed). It is possible to suppress the resin J from being partially curled (cured) and bent or wrinkled. Moreover, you may connect to the vacuum generator 33 the compressed air supply part for blowing out gas separately from a vacuum ejector. As the compressed air supply unit, it is conceivable to use a compressor, compressed air piped in a factory, or the like.

Moreover, as shown in FIGS. 4 and 5, the adsorption|suction member 31 is provided with the eyeball part 36 for aligning the sheet-like resin J. As shown in FIG. The eye mark part 36 of this embodiment is a some scale provided in 31X of adsorption|suction holding|maintenance surface 31X mentioned above, and is provided along the direction mutually orthogonal in 31X of adsorption|suction holding|maintenance holding surface. In addition, as the eye mark part 36, if it becomes an eye mark (target) for aligning the sheet-like resin J, it does not necessarily need to be a scale, for example, a mark provided by spaced apart at regular distances. etc., you may use various things.

The above-mentioned adsorption|suction member 31 is comprised so that the up-down inversion of 31X of adsorption|suction holding|maintenance surface is possible. Specifically, the adsorption member 31 is rotatably supported by the support member 38 by a rotating shaft member 37 parallel to the adsorption holding surface 31X, as shown in Figs. The rotation shaft member 37 is vertically reversible around the circumference. Here, the rotating shaft member 37 is a planar view of 31X of adsorption holding|maintenance surface WHEREIN: It WHEREIN: It is provided so that it may pass through the center of 31X of adsorption|suction holding|maintenance surface. Although the rotating shaft member 37 of this embodiment is a structure which supports the adsorption|suction member 31 by being connected to the space formation member 32, it is good also as a structure connected to the adsorption|suction member 31. As shown in FIG. In addition, although the vertical reversal operation|movement of the adsorption|suction member 31 is comprised so that it may be performed manually by the knob 37H provided in the rotating shaft member 37, it is good also as a structure in which it is automatically reversed using a motor etc.

As shown in FIG. 1 , the moving mechanism 4 of the adsorption mechanism 3 includes the adsorption mechanism 3 at a receiving position where the adsorption member 31 receives the sheet-like resin J, and the adsorption member ( 31) to move the sheet-shaped resin (J) to the lower frame (15) and to the delivery (hand over) position, in the resin supply module (C) and each resin molding module (B), It is configured to move in at least the X-direction and the Y-direction. The moving mechanism 4 of this embodiment is comprised so that the adsorption|suction member 31 which adsorbed hold|maintained the sheet-like resin J may be moved to the delivery position set above the lower frame 15. As shown in FIG. This transfer position is set above the lower frame 15 that is opened, and the adsorbed sheet-like resin J is located directly above the cavity 15C of the lower frame 15 . am. In addition, in FIG. 1, although the movement path|route of the movement mechanism 4 and the movement path|route of the board|substrate conveyance mechanism 14 are partly common for convenience of description, it is not limited to this.

<Operation of resin molding apparatus 100>

The operation of resin molding (resin encapsulation) in this resin molding apparatus 100 will be described with reference to FIG. 8 .

First, in the board|substrate supply/storage module A, the board|substrate W before sealing is sent out from the board|substrate supply part 11 to the board|substrate mounting part 13. Next, the board|substrate conveyance mechanism 14 in a predetermined standby position is moved, and the board|substrate W before sealing is received from the board|substrate mounting part 13. FIG. And the board|substrate conveyance mechanism 14 is moved to the resin molding module B, and the board|substrate W before sealing is hold|maintained in the upper frame 16 which opened the frame. Then, the board|substrate conveyance mechanism 14 is returned to a predetermined standby position.

In the resin supply module C, the adsorption|suction mechanism 3 is made to stand by at a predetermined receiving position. And sheet-like resin J provided with the protective film PF on one surface is mounted so that the exposed surface may contact the adsorption|suction holding|maintenance surface 31X of the adsorption|suction member 31 (<placement step> of FIG. 8) ). At this time, the sheet-like resin J is positioned at a desired position on the adsorption holding surface 31X while looking at the eye marks 36 such as scales provided on the adsorption holding surface 31X. Here, since the protective film PF is provided on one side of the sheet-like resin J, the sheet-like resin J is hardly deformed and its handling is easy. In addition, when the protective film PF is provided on both surfaces of the sheet-like resin J, after peeling off the protective film PF on one side, it is mounted so that the exposed surface may contact the adsorption|suction holding|maintenance surface 31X.

Next, the suction operation by the vacuum generator 33 is started, the exposed surface of the sheet-like resin J is adsorbed to the suction member 31, and the sheet-like resin J is adsorbed and held (Fig. 8). <Adsorption maintenance step>). At this time, the adsorption force from the plurality of adsorption holes 311 acts on the exposed surface of the sheet-like resin J, and at the same time, since the irregularities 35 are provided on the adsorption holding surface 31X, the adsorption force thereof It is transmitted to the exposed surface of the sheet-like resin J through the gap S between this recessed part and the sheet-like resin J, and the whole exposed surface is adsorbed to the adsorption holding surface 31X.

In the state where the sheet-like resin (J) is adsorbed and held on the adsorption member 31 in this way, the protective film (PF) provided on one side (upper surface) of the sheet-like resin (J) is manually or automatically peeled off ( <Peeling step> in FIG. 8). Thereby, it will be in the state from which the protective film PF was removed from the sheet-like resin J.

Next, the adsorption member 31 which has adsorbed the sheet-like resin J is rotated 180 degrees around the rotation shaft member 37 and vertically inverted so that the sheet-like resin J is placed downward. After setting it as this state, the adsorption|suction mechanism 3 is moved by the movement mechanism 4 from the resin supply module C to the resin molding module B (<movement step> of FIG. 8).

In this moving step, the adsorption|suction mechanism 3 is moved by the moving mechanism 4 to the delivery position which delivers the sheet-like resin J to the lower frame 15 in which the frame was opened. Here, in this embodiment, in order to position the adsorption|suction member 31 with respect to the lower frame 15, the positioning part 39 is provided in the adsorption|suction member 31 (refer FIG. 4 etc.). As the positioning part 39, it is a convex part, for example, and as shown in FIG. 9, it is comprised so that it may engage with the lower frame 15 or the recessed part 15M provided in the member integral with the lower frame 15. has been For this reason, the moving mechanism 4 lowers the suction mechanism 3 in the Z direction above the lower frame 15 from which the frame is opened, and engages the positioning portion 39 with the recessed portion 15M. , the adsorption member 31 is positioned with respect to the lower frame 15 . This positioned state is the delivery position where the adsorption member 31 delivers the sheet-like resin J. Alternatively, the lower frame 15 may be raised in the Z direction to engage the positioning portion 39 with the recessed portion 15M. Moreover, it is good also as a structure in which a guide part is provided in the support member 38, and positioning is carried out so that a guide part may contact and slide with respect to the partial surface of the lower frame 15. As shown in FIG.

Then, the suction operation by the vacuum generator 33 is stopped, and the adsorption|suction of the sheet-like resin J is cancelled|released. Moreover, after this suction is released, the exhaust port of the vacuum generator 33 is communicated with the internal space 3S, the discharge operation by the vacuum generator 33 is started, and the sheet-like resin is discharged from the suction hole 311 . Gas (air) is blown out on the exposed surface of (J). Thereby, the sheet-like resin J is peeled off from the adsorption holding surface 31X and falls, and the sheet-like resin J is supplied to the cavity 15C of the lower frame 15 (<resin supply in FIG. 8 ). step>). In addition, before supplying the sheet-like resin J to the cavity 15C of the lower frame 15, you may provide the release film in the lower frame 15. As shown in FIG.

After the sheet-like resin J is supplied, the adsorption mechanism 3 moves to the resin supply module C by the moving mechanism 4, and returns to the above-described receiving position. The adsorption|suction member 31 of the adsorption|suction mechanism 3 returned to the receiving position is upside-down again so that the adsorption|suction holding|maintenance surface 31X may face upward.

After the above process, in the resin molding module B, the movable plate 171 is raised by the drive mechanism 173, and the seal member 177d of the upper frame holding part 177 and the lower frame holding part are raised. A sealed space is formed by making the sealing member 176d of (176) closely_contact|adhere. In this state, the sealed space is made into a vacuum state by an exhaust mechanism (not shown).

Then, by further raising the movable plate 171 by the driving mechanism 173 , the side member 152 is pressed against the upper frame 16 to compressively deform the elastic member 154 , and at the same time, the electronic component of the substrate W It is immersed in the sheet-like resin J which is this resin material, and the component mounting surface of the board|substrate W is coat|covered with the sheet-like resin J. In this state, the lower mold 15 and the upper mold 16 are molded together by a predetermined molding pressure (<resin molding step> in FIG. 8). After a predetermined time has elapsed, the lower frame 15 is lowered by the frame fastening mechanism 17 to open the lower frame 15 and the upper frame 16 . In addition, you may return the sealed space to atmospheric pressure in the middle of clamping.

Next, the substrate transport mechanism 14 of the substrate supply/storage module A is moved to receive the sealed substrate W from the opened upper mold 16 . The board|substrate conveyance mechanism 14 is moved to the board|substrate mounting part 13, and the board|substrate W which finished sealing is delivered to the board|substrate mounting part 13. The sealed board|substrate W is accommodated in the board|substrate accommodation part 12 from the board|substrate mounting part 13. As shown in FIG. In this way, resin encapsulation using the sheet-like resin J is completed.

<Effect of this embodiment>

According to the resin molding apparatus 100 of this embodiment, in the state which made the adsorption member 31 adsorb|suck the exposed surface of the sheet-like resin J provided with the protective film PF on one side, from the sheet-like resin J Since the protective film PF can be peeled off, the shape of the sheet-like resin J can be maintained at the time or after peeling off the protective film PF. Thereby, bending, wrinkling, or breakage of the sheet-like resin (J) can be suppressed, and the sheet-like resin (J) can be supplied to the lower mold (15). As a result, the molding defect of resin molding using the sheet-like resin (J) can be reduced.

In addition, since the sheet-shaped resin (J) is used as the resin material, the amount of the resin material supplied into the cavity 15C of the lower mold 15 can be uniformed compared to the case where liquid resin or granular resin is used, It is also possible to meet a request such as a desire to make a resin molded product thinner.

<Other modified embodiments>

In addition, this invention is not limited to the said embodiment.

For example, although the adsorption member 31 of the said embodiment was a plate-shaped thing which has the adsorption|suction hole 311 which adsorb|sucks the sheet-like resin J, it may make|form the other shape. Moreover, as the adsorption|suction member 31, what consists of a porous material (porous material) may be used, and in this case, the many holes which the porous material has become the adsorption|suction hole 311.

Moreover, in the said embodiment, although it was the structure which automatically moves the adsorption|suction mechanism 3 to the resin molding module B with the moving mechanism 4, the adsorption|suction mechanism 3 is manually moved to the resin molding module B. In the case of the structure made to do this, the structure which does not have the moving mechanism 4 which moves the adsorption|suction mechanism 3 may be sufficient.

In the case of a configuration in which the adsorbed sheet-like resin J is supplied to the lower frame 15 by natural fall, the adsorption member 31 may not be configured to be capable of ejecting gas (air). In addition, the adsorption mechanism 3 mechanically presses the adsorbed sheet-like resin J with a pressing member (not shown), thereby removing the sheet-like resin J from the adsorbing member 31 . You may be provided with the structure which separates.

Although the resin supply mechanism 2 of the above embodiment supplies the sheet-like resin J to the lower mold 15, it may be supplied to the upper mold 16, and the pair of molds are different from the vertical direction. If it is a case where it is opposingly arrange|positioned in a direction, you may supply to at least one of those shaping|molding die.

In addition, the size, arrangement, and shape of the plurality of adsorption holes 311 are not limited to the above embodiment. For example, the size of the suction holes 311 may be different depending on the different areas (for example, the central area and the peripheral area) of the adsorption holding surface 31X, and the number (dense) per unit area is different. good to do In addition, the plurality of suction holes 311 do not necessarily have to be arranged along a direction orthogonal to each other, for example, may be arranged in a columnar shape or a spiral shape, or irregularly. may be placed. In addition, the suction hole 311 is not limited to a circular shape, You may change suitably into an elongate shape, an elliptical shape, a square shape, a polygonal shape, etc. as appropriate.

Moreover, in the said embodiment, although the adsorption|suction member 31 was the structure which has the some adsorption|suction hole 311, what has the one adsorption|suction hole 311 may be sufficient. In this case, the sheet-like resin J can be adsorbed over a wide area by, for example, making the adsorption hole 311 into a serpentine long hole or a spiral long hole or the like.

In the said embodiment, although the space forming member 32 was provided in the adsorption|suction member 31 and it was the structure which forms the internal space 3S, without providing the space forming member 32, the adsorption|suction member 31 is adsorbed. It is good also as a structure which connects the suction flow path 34 to the hole 311.

Although the adsorption hole 311 is also used as a gas outlet hole in the said embodiment, you may provide the gas outlet hole separately from the adsorption hole 311. As shown in FIG.

Moreover, in the said embodiment, although the vacuum generator 33 containing a vacuum ejector was used as a suction source which sucks air from the suction hole 311, you may use a vacuum pump. When a vacuum pump is used, it is conceivable to configure the suction flow path 34 connected to the vacuum pump with flexible piping so as not to move the pump together with the suction mechanism.

In addition to the configuration in which the gas is supplied to the gas ejection hole (adsorption hole 311) using the vacuum generator 33, as shown in Fig. 10, gas is supplied to the gas ejection hole (adsorption hole 311). You may provide the gas supply part 5 to do. This gas supply unit 5 supplies gas to the adsorption hole 311 via the internal space 3S of the adsorption member 31, and includes an air source 51, the air source 51 and the internal space ( 3S) has a supply flow path 52 for connecting it. As the air source 51, it is conceivable to use a vacuum ejector, a compressor, compressed air piped in a factory, or the like. In addition, the air source 51 may be provided so that it may move together with the adsorption|suction mechanism 3, and may be provided so that it may move together with the adsorption|suction mechanism 3. As shown in FIG. In addition, similarly to the suction flow path 34, the gas supply part 5 may have the structure which has the some supply flow path 52 which communicates with the some gas ejection hole.

In the above embodiment, the suction member 31 is vertically inverted immediately after the sheet-shaped resin J is absorbed by the suction member 31 in the resin supply module C, but the suction member 31 is vertically inverted. The timing may be appropriately changed as long as it is before the sheet-like resin (J) is supplied to the molding die after the sheet-like resin (J) is adsorbed and held and the protective film (PF) is peeled off. In addition, for example, in the case of supplying the sheet-like resin J to the upper frame 16, it is not necessarily necessary to rotate the adsorption|suction member 31. As shown in FIG.

In order to accurately supply the sheet-like resin (J) adsorbed and held by the suction member (31) to the lower mold (15), before releasing the absorption of the sheet-like resin (J), the suction member (31) or It is conceivable to cancel the adsorption of the sheet-like resin J after at least one of the lower molds 15 is moved up and down in the Z direction to decrease the distance therebetween.

In the case of a structure in which a release film is provided on the lower mold 15, at least one of the release film or the adsorption member 31 is moved up and down to decrease the distance between them, and then the sheet-like resin J is adsorbed. I'm thinking of releasing it. By lowering the release film to the lower mold 15 after placing the sheet-like resin J on the release film, the sheet-like resin J can be accurately supplied to the lower mold 15 .

In the above embodiment, two resin molding modules B are connected between the substrate supply/storage module A and the resin supply module C, but the substrate supply/storage module A and the resin supply module It is good also as a structure which made (C) one module, and connected the resin molding module (B) to the module. In addition, the resin molding apparatus does not need to be modularized in each module like the said embodiment.

In addition, this invention is not limited to the said embodiment, It goes without saying that various modifications are possible in the range which does not deviate from the meaning.

100… resin molding equipment
15… 1st forming die (lower frame)
16… 2nd forming mold (upper mold)
17… frame fastener
2… resin supply mechanism
J… sheet resin
PF… protective film
31… adsorption member
311… Adsorption hole (gas outlet hole)
34… suction flow
35… irregularities
36… eye mark

Claims (10)

A lower frame which is a first forming frame and an upper frame which is a second forming frame which are opposed to each other;
a frame fastening mechanism for fastening the lower frame and the upper frame;
a substrate transport mechanism for supplying the substrate before sealing to the upper frame;
and a resin supply mechanism for supplying the sheet-shaped resin to the lower frame,
The resin supply mechanism includes an adsorption member provided with an adsorption hole for adsorbing the other face of the sheet-like resin provided with a protective film on one face thereof,
The adsorption member is configured to adsorb the entire other surface of the sheet-like resin and to be vertically inverted,
The resin supply mechanism adsorbs the other surface of the sheet-like resin in a state in which the surface on which the suction hole is formed faces upward, and vertically inverts the suction member while the protective film is peeled from the sheet-like resin. A resin molding apparatus for supplying the sheet-shaped resin to the lower mold by making the sheet-shaped resin face down. The method of claim 1,
A resin molding apparatus, wherein a plurality of irregularities are formed on a surface of the adsorption member on which the adsorption holes are formed. The method of claim 1,
The resin molding apparatus in which the said adsorption|suction hole is formed in the said adsorption|suction member in plurality. 4. The method of claim 3,
and the resin supply mechanism has a plurality of suction flow passages communicating with the plurality of suction holes. The method of claim 1,
The said adsorption member is comprised so that gas can be ejected to the said other surface of the said sheet-like resin which has adsorb|sucked. 6. The method of claim 5,
and a gas ejection hole for ejecting gas is formed on the other surface of the adsorbed sheet-like resin in the adsorption member. 7. The method of claim 6,
The said adsorption|suction hole is what doubles as the said gas ejection hole, The resin molding apparatus. The method of claim 1,
The said adsorption|suction member has a face part for aligning the said sheet-like resin, The resin molding apparatus. A method for manufacturing a resin molded article in which a resin molded article is manufactured by fastening a lower mold that is a first mold that is opposed to each other and an upper mold that is a second mold that faces each other,
A substrate supply step of supplying the substrate to the upper frame before sealing;
an adsorption holding step of adsorbing the entire other side of the sheet-like resin provided with a protective film on one side to an adsorption member, and preserving and holding the sheet-like resin;
a peeling step of peeling off the protective film from the sheet-like resin adsorbed and held by the adsorption member;
The sheet-like resin from which the protective film has been peeled off a resin supply step of supplying the lower frame;
A method for manufacturing a resin molded article, comprising a resin molding step of molding the lower mold and the upper mold by using the sheet-like resin to mold the resin. 10. The method of claim 9,
The adsorption member is configured to be able to eject gas to the other surface of the adsorbed sheet-like resin,
In the resin supply step, the adsorption in the adsorption holding step is canceled and the gas is blown out to the other surface to supply the sheet-like resin to the lower mold or the upper mold. Way.

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