JP2008260234A - Device for loading resin into compression-molding die, resin sealing device equipped with resin loading device and resin loading method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin loading device which can inhibit or reduce the holding of air generated between a resin and a molding die during loading the resin in the molding die, and to provide a resin loading method. <P>SOLUTION: This resin loading device 101 can load the resin 102 into a resin sealing mold for compression-sealing a substrate with a mounted semiconductor chip using the resin 102. In addition, the resin loading device 101 comprises a retention part 104 which can retain the resin 102 until the resin 102 is loaded onto the resin sealing mold, a partition wall part 107 which surrounds the retention part 104 and the resin 102 retained by the retention part 104 and can form a closed space M around the resin 102 by coming into contact with the mold, and a suction pump P which can suck the air inside the closed space M in the state that the resin 102 is retained by the retention part 104. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technical field of a resin sealing device that compresses and seals a substrate on which a semiconductor chip or the like is mounted with resin.

  Conventionally, a resin sealing device 1 shown in FIG. 3 is known (see Patent Document 1).

  The resin sealing device 1 includes an upper mold 2 and a lower mold 4. The lower mold 4 includes a frame-shaped mold 4B having a through hole 5 and a compression mold 4A that is disposed so as to be capable of moving forward and backward in the through hole 5.

  In this resin sealing device 1, a substrate 60 on which a semiconductor chip is mounted is held by suction on the upper mold 2 side, and a resin 80 is introduced to the lower mold 4 side through a release film 50. The lower mold 4 is brought into contact with each other to perform compression sealing. In the resin sealing device 1, prior to the compression between the upper die 2 and the lower die 4, the air in the molding space 40 formed by the contact between the upper die 2 and the lower die 4 is transferred to a suction device V (not shown). The molding space 40 is depressurized and compressed and sealed. Such pressure reduction is performed in order to prevent the generation of voids that may occur in the molded product after resin sealing due to, for example, air entering the resin 80.

JP-A-2005-324341

  However, when the resin 80 is simply placed (put in) on the lower mold 4 (strictly on the release film 50), air is introduced between the resin 80 and the surface of the lower mold 4 by the placement. There is a possibility of carrying it. In particular, in the case where the resin to be charged is a plate-like resin formed into a plate shape, it is difficult to discharge the trapped air once the “holding” of air occurs. In a compression type resin sealing device (resin sealing mold), a heater is incorporated in the upper mold 2 and the lower mold 4 in order to melt the charged resin, and the temperature of the mold is constant. Is maintained. As a result, the plate-shaped resin is heated and softened at the stage where the plate-shaped resin is charged, and the state is such that it sticks to the surface of the lower mold 4 exactly. As a result, when the air is “held”, it becomes difficult to discharge the air. This is not limited to a plate-like resin, but can occur in a powdery or granular resin.

  Thus, the air held between the resin 80 and the surface of the lower mold 4 at the time of charging expands due to the decompression of the molding space 40 prior to the compression process. That is, a pressure difference is generated between the air in the molding space 40 and the “enclosed air” due to the decompression of the molding space 40, and the “enclosed air” expands in an attempt to eliminate the differential pressure. Since the expanded air has no escape, it expands to lift the resin, and in some cases, it expands to burst the resin. Such “lifted” or “pushed out” resin affects the bonding wire (gold wire) of the semiconductor chip mounted on the substrate, for example, causing a short circuit or disconnection of the bonding wire. obtain. Further, if the “trapped air” is mixed in the resin 80, it can be a void generated in the molded product after resin sealing.

  The present invention has been made to solve such problems, and prevents or reduces “clogging of air” that may occur between the resin and the mold when the resin is put into the mold. The present invention provides a resin charging apparatus and a resin charging method.

  The present invention is a resin charging apparatus capable of charging the resin into a resin sealing mold for compressing and sealing a substrate on which a semiconductor chip is mounted with resin, and the resin is placed on the resin sealing mold. A holding portion capable of holding the resin until the resin is placed, and the sealing portion surrounds the resin by surrounding the holding portion and the resin held by the holding portion and contacting the mold. The above-mentioned problem is solved by comprising a partition wall part capable of forming a space and a pressure reducing mechanism capable of sucking air in the sealed space in a state where the resin is held by the holding part. is there.

  By adopting such a configuration, it has become possible to prevent or reduce “carrying of air” at the time of resin charging. That is, prior to placing the resin on the mold (on the surface), a sealed space composed of the partition wall and the mold is formed around the resin, and the air in the sealed space is sucked. The resin can be placed on the mold after the pressure is reduced. Reducing the pressure in the sealed space by sucking air means eliminating / reducing the “air” that may be held when the resin is placed. As a result, if the resin is placed (introduced) on the mold (on the surface) in a reduced pressure state, the amount of air carried is physically reduced. Furthermore, after the resin is placed, the reduced pressure state in the sealed space is once released (since the resin charging device needs to be retracted from the mold, the release of the reduced pressure state is unavoidable. The resin is pressed to the mold side by the differential pressure generated by such release, and the adhesion between the resin and the mold can be further secured (that is, the resin and the mold are subsequently disposed between the resin and the mold). Air can be prevented from being carried in.)

  In addition, if it is set as the structure provided with the sealing member in the contact surface to the said metal mold | die in a partition part, the sealing performance of sealed space can be made more reliable. Further, since the partition wall abuts on the mold (and the release film when the release film is supplied on the mold surface) via the seal member, the mold is not affected even if the partition wall is repeatedly contacted. It is possible to prevent the mold (and the release film when the release film is supplied on the mold surface) from being damaged. Furthermore, by periodically exchanging the seal member, it becomes possible to maintain the sealing performance over a long period of time.

  Furthermore, if a gas supply mechanism capable of supplying a predetermined gas is provided in the sealed space, the resin and the mold can be separated by “pressurizing” the sealed space after placing (injecting) the resin. Adhesion can be improved more actively. For example, if this gas is dehumidified air or an inert gas, it is possible to prevent the occurrence of defective molded products due to moisture absorption of the resin.

  Further, the resin is a plate-like resin formed into a plate shape, and the holding portion has an adsorption mechanism capable of adsorbing the plate-like resin, and the negative pressure generated by the adsorption mechanism is generated by the decompression mechanism. If it is configured to be larger than the negative pressure, the resin can be reliably held even when the sealed space is decompressed.

  In addition, it is also possible to comprise as a resin sealing apparatus provided with the said resin injection apparatus.

  The present invention is also a resin charging method in which the resin is charged into a resin-sealed mold for compressing and sealing a substrate on which a semiconductor chip is mounted with a resin, the resin being the resin-sealed metal mold. Before placing on the mold, the step of decompressing the space between the resin and the resin-sealed mold, and placing the resin on the resin-sealed mold in a decompressed state And a resin charging method including a step of pressurizing the space by supplying a predetermined gas to the space.

  In the “mold” in the present specification and claims, in the case of a mode in which a release film (release film) is supplied on the mold surface, the “mold” Is a concept that may include a release film.

  By applying the present invention, it is possible to prevent air from being trapped between the charged resin and the mold that is the charging destination, and as a result, the resin is pushed and spread even during decompression in the compression process. It is possible to prevent the wire and the like from being damaged. In addition, it is possible to prevent the trapped air from being mixed into the resin and causing voids in the molded product after resin sealing.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic configuration diagram showing a relationship between a resin charging apparatus 101 and a compression mold (lower mold) as an example of an embodiment of the present invention. FIG. 2 is a view showing a state in which the resin is placed (input) on the compression mold (lower mold) by the resin injection device 101.

<Configuration of resin charging device>
The resin charging device 101 includes an arm part 110 and a holding part 104 that is suspended from the arm part 110 via an up-and-down mechanism 105. Moreover, the arm part 110 is connected with a drive mechanism (not shown), and can enter and retract into the compression mold at a predetermined timing. Further, the entire resin charging device 101 including the arm part 110 can be moved up and down by the drive mechanism. Here, reference numeral 120 denotes a lower mold constituting a compression forming mold (resin-sealed mold), and includes a compression mold 120A and a frame-shaped mold 120B. A release film (release film) 111 is supplied on the surface of the lower mold 120. Note that the upper die paired with the lower die 120 does not appear in FIGS.

  The holding portion 104 is provided with a plurality of suction pads 103, and the plate-like resin 102 can be held by sucking and releasing the plate-like resin 102 at a predetermined timing. Further, the holding unit 104 can be moved forward and backward with respect to the arm unit 110 at a predetermined timing by an up-and-down mechanism 105 configured by an air cylinder or the like (not shown). In addition, the arm part 110 is provided with a partition part 107 via a support member 109. The partition wall 107 is a so-called “bottom body without a bottom”, and has a size capable of enclosing and surrounding the holding portion 104 and the plate-like resin 102 held by the holding portion 104. Further, a through hole 107A is provided on the upper surface side of the partition wall 107, and the above-described vertical mechanism 105 is disposed through the through hole 107A. Further, a seal member 106 made of an O-ring is disposed between the through hole 107A and the vertical mechanism 105, and the hermeticity of the sealed space M (details will be described later) is maintained. Further, a seal member 108 made of an elastic body is provided on the lowermost surface of the partition wall 107 (that is, the side surface of the lower mold 120). Thus, since the partition wall portion 107 contacts the lower mold 120 (strictly, the release film 111) via the sealing member 108 made of an elastic body, the lower mold 120 is maintained even when the partition wall portion 107 is repeatedly contacted. The (and release film 111) side is prevented from being damaged. Furthermore, the sealing performance can be maintained over a long period of time by periodically replacing the seal member 108. As a result of such a configuration, the partition wall 107 abuts on the surface of the lower mold 120, whereby the sealed space M can be formed around the plate-like resin 102.

  Further, a through hole 107B is provided on a side surface of the partition wall 107, and is connected to a suction pump (decompression mechanism) P through the through hole 107B. The suction pump P can suck the air in the sealed space M. That is, the atmospheric pressure in the sealed space M can be reduced.

  Further, the suction pad 103 provided in the holding unit 104 described above can suck and hold the plate-like resin 102 by sucking air, and at the same time, a predetermined gas is ejected from the suction pad 103 side to enter the sealed space M. It also functions as a gas supply mechanism. The gas ejected here is, for example, dehumidified air or inert gas. If this gas is dehumidified air or an inert gas, it is possible to prevent the occurrence of molding defects due to moisture absorption of the resin.

<Operation of resin charging device>
Next, the operation of the resin charging device 101 will be described. The plate-like resin 102 is held by the holding unit 104 in a plate-like resin supply unit (not shown) in which a plurality of plate-like resins 102 are stocked. The holding is performed by suction of the suction pad 103 provided in the holding unit 104. The resin charging device 101 holding the plate-like resin 102 is moved to the compression mold side by a drive mechanism (not shown) connected to the arm portion 110. At this time, the upper mold (not shown) and the lower mold 120 are spaced apart from each other by a predetermined interval, and the resin charging device 101 enters between them. Since the resin charging apparatus 101 can move up and down as a whole, when the resin charging apparatus 101 reaches a predetermined position with respect to the lower mold 120, the entire resin charging apparatus 101 moves to the lower mold 120 side. As a result, the seal member 108 provided on the lowermost surface of the partition wall 107 comes into contact with the lower mold 120. A sealed space M is formed between the lower mold 120 and the partition wall 107 by the contact. At this time, since the holding unit 104 is positioned on the upper side (upper side in FIG. 1) by the vertical mechanism 105, the plate-like resin 102 held by the suction pad 103 does not contact the surface of the lower mold 120. . That is, a space M1 is formed between the plate-like resin 102 and the lower mold 120. The space M1 is a part of the sealed space M.

  Thereafter, the air in the sealed space M is sucked and decompressed by the suction pump (decompression mechanism) P. The suction of the suction pad 103 sucks the plate-like resin 102 with a negative pressure larger than the negative pressure generated in the sealed space M so that the plate-like resin 102 can be held even by the reduced pressure. By reducing the pressure of the sealed space M by the suction pump P, the absolute amount of air present in the space M1 existing between the plate-like resin 102 and the lower mold 120 is reduced.

  Subsequently, the plate-like resin 102 is moved close to the surface of the lower mold 120 by operating the vertical mechanism 105. At the same time, the suction of the suction pad 103 is released, and the plate-like resin 102 is placed (loaded) on the surface of the lower mold 120.

  By placing (injecting) the plate-like resin 102 on the lower mold through such steps, it is possible to prevent or reduce “clogging of air” at the time of resin injection. That is, prior to placing the plate-shaped resin 102 on the lower mold 120 to which the plate-shaped resin 102 is charged, a sealed space M composed of the partition wall 107 and the lower mold 120 is formed around the plate-shaped resin 102. The plate-like resin 102 can be placed on the lower mold 120 after the air in the sealed space M is sucked and decompressed. Reducing the pressure in the sealed space M by sucking air means that “air” itself that may be held when the plate-like resin 102 is placed is eliminated / reduced. As a result, if the plate-like resin 102 is placed on (inserted into) the lower mold 120 in a reduced pressure state, the amount of air to be carried is physically reduced.

  In the present embodiment, the suction pad 103 also functions as a gas supply mechanism. After releasing the adsorption of the plate-like resin 102, dehumidified air or inert gas can be supplied into the sealed space M. Is possible. That is, by actively supplying the gas, the inside of the sealed space M can be “pressurized”, and the adhesion between the plate-like resin 102 and the lower mold 120 can be more positively improved. That is, it is possible to prevent air from entering between the plate-like resin 102 and the lower mold 120 later.

  If the gas supply mechanism is configured separately from the suction pad 103, dehumidified air and inert gas can be supplied to the sealed space M in advance (at the same time, the air in the sealed space M is sucked by the suction pump P). Therefore, after the air in the sealed space M is replaced with dehumidified air or an inert gas, the pressure is reduced by the suction pump P, and then the plate-like resin 102 can be placed. If such a procedure is adopted, it is possible to minimize the moisture absorption of the resin because it is dehumidified air or inert gas even if “clogging” occurs. It is possible to minimize the influence.

  Thereafter, the resin charging device 101 is retracted from between the upper mold and the lower mold 120, the upper mold and the lower mold 120 are brought into contact with each other to form a molding space, and the molding space is decompressed as necessary, and then compressed. It will be sealed. Thereafter, the same operation as described above is repeated.

  The present invention is suitable as a resin charging device for a resin sealing device that compresses and seals a substrate on which a semiconductor chip is mounted with resin.

The schematic block diagram which showed the relationship between the resin injection | throwing-in apparatus 101 which is an example of embodiment of this invention, and a compression mold (lower mold) The figure which showed the state which mounted resin on the compression-molding metal mold | die (lower mold) with the resin injection apparatus 101 Schematic configuration diagram of resin sealing device described in Patent Document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Resin charging device 102 ... Plate-shaped resin 103 ... Adsorption pad 104 ... Holding part 105 ... Vertical mechanism 106, 108 ... Seal member 107 ... Partition part 107A, 107B ... Through-hole 109 ... Support member 110 ... Arm part 111 ... Release film 120 ... Lower mold 120A ... Compression mold 120B ... Frame-shaped mold M ... Sealed space P ... Suction pump (decompression mechanism)

Claims (8)

A resin charging device capable of charging the resin into a resin sealing mold for compressing and sealing a substrate on which a semiconductor chip is mounted with resin,
A holding part capable of holding the resin until the resin is placed on the resin-sealed mold; and
A partition portion that surrounds the holding portion and the resin held by the holding portion, and can form a sealed space around the resin by contacting the mold;
A pressure reducing mechanism capable of sucking air in the sealed space in a state where the resin is held by the holding unit. In claim 1,
A resin charging device, wherein a sealing member is provided on a contact surface of the partition wall to the mold. In claim 1 or 2,
Further, the resin charging device is provided with a gas supply mechanism capable of supplying a predetermined gas into the sealed space. In claim 3,
The resin charging device, wherein the gas is dehumidified air or an inert gas. In any one of Claims 1 thru | or 4,
The resin is a plate-shaped resin formed into a plate shape,
The holding part has an adsorption mechanism capable of adsorbing the plate-like resin;
The resin charging device, wherein a negative pressure generated by the adsorption mechanism is larger than a negative pressure generated by the pressure reducing mechanism.   A resin sealing device comprising the resin charging device according to claim 1. A resin charging method for charging the resin with respect to a resin sealing mold for compressing and sealing a substrate on which a semiconductor chip is mounted with resin,
Reducing the space between the resin and the resin sealing mold before the resin is placed on the resin sealing mold;
Placing the resin on the resin-sealed mold while the pressure is reduced, and a resin charging method. In claim 7,
The method further includes a step of supplying a predetermined gas to the space.

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