JP7312421B2 - Mold, resin molding apparatus, resin molding method, and carrier - Google Patents

Description

The present disclosure relates to a molding die, a resin molding apparatus, a resin molding method, and a carrier used in these apparatuses and methods for resin-molding a workpiece having a plurality of chips mounted on a substrate with the surface of each chip exposed.

With the spread of AI technology in recent years, a processor unit such as a GPU (Graphics Processing Unit) and HBM (High Bandwidth Memory) are placed close to each other on a silicon substrate with TSV wiring, and SIP (System In Package) structure products that connect chips with high-density wiring and products related to FPGA (Field-Programmable Gate Array) of similar configuration have been developed. For example, a large number of semiconductor chips such as GPUs, FPGAs, and HBMs are mounted on a wafer as an interposer with a diameter of 300 mm, and there is a need to package and provide these semiconductor chips with different heights in order to protect the circuits and facilitate connection with external peripheral circuits.

In this case, the GPU has a large mounting area, for example, 20×30 mm, and includes an extremely large number of elements, and the HBM is stacked in multiple layers, so an extremely large number of memory elements are arranged. For this reason, in resin molding, it is necessary to expose the surface of each semiconductor chip to ensure heat dissipation. In addition, since the height of each semiconductor chip is different, there is also a problem that it is vulnerable to mechanical stress and easily distorted.

For this reason, when resin-molding a work on which a large number of semiconductor chips such as GPUs and HBMs are mounted, the chip surface is once covered with mold resin in order to eliminate high heat generation of the semiconductor chips, and then the resin on the chip surface is cut by cutting or the like (including cases where it is chemically removed) to expose the chip surface, or after singulation, a heat sink is attached.
There is also a method of compression molding using a compression molding die having a lower mold cavity (Patent Document 1: JP-A-2017-87453; see FIGS. 16 and 17).
In addition, as an apparatus for underfill molding, a method has been proposed in which a clamping piece for a semiconductor chip (hereinafter simply referred to as a "chip") and a pressurizing piece for pressurizing a resin are used together to perform compression molding of a mold resin supplied into a lower mold cavity. (Patent Document 2: WO2015/159743; see FIGS. 1 to 6).

JP 2017-87453 A WO2015/159743

If the chip surface is exposed by cutting (including chemical removal) after the chip surface is once covered with the mold resin, the boundary between the chip and the mold resin may be damaged due to filler mixed in the mold resin. In addition, chipping during cutting and warping due to stress are likely to occur. Due to the increasing demand for thinner products in recent years, the drawbacks of this manufacturing method have become more noticeable.
As an example of resin molding with the chip exposed, as in Patent Document 1, after the chip is clamped by a spring, the mold resin is melted from outside the cavity of the lower mold, sent into the cavity, and pressurized. Moreover, since unnecessary resin remains outside the cavity, the unnecessary resin must be removed after molding. In addition, resin flash occurs on the chip because it is not possible to follow the case where the height of the chip is different.
In addition, when the mold resin is placed around the chip in the lower die cavity and pressurized by the pressure piece as in Patent Document 2, the chips are arranged very close to each other, so there may be cases where the installation space for the pressure piece cannot be secured. If the elongation of the film becomes large, there is also a risk of breakage.

The disclosure applied to the several embodiments described below has been made to solve the above problems, and the object thereof is to provide a molding die, a resin molding apparatus, a resin molding method, and an optimum carrier for these apparatuses and methods, which can reliably expose the chip surface for resin molding.

The disclosure relating to some embodiments described below includes at least the following configurations.即ち、基板上に複数のチップ同士が近接して搭載されたワークを、各チップ表面を露出させて樹脂モールドするモールド金型であって、前記ワークを支持する上型と、下型ベースに対して第一弾性部材によりフローティング支持される連結板と、前記連結板に前記ワークのチップ搭載エリアのチップ配置に応じて対向配置された第二弾性部材によりチップ押さえ支持部より離間してフローティング支持されたチップ押さえ駒と、前記チップ押さえ駒の外周側で前記連結板をよけて前記下型ベースに立設された加圧駒と、前記加圧駒より外周側で前記連結板に支持されたクランパと、を有し、前記チップ押さえ駒と前記クランパとの間に設けられた前記加圧駒に囲まれて形成された凹部にモールド樹脂が収容される下型と、を備え、前記上型と前記下型を型閉じしながら前記チップ押さえ駒を前記チップに押し当てたまま前記第二弾性部材を撓ませて前記チップ押さえ支持部に向かってチップ厚さ分押し下げて前記凹部の容積を相対的に縮小させ、前記クランパが前記ワークに押し当てられると前記第一弾性部材を撓ませて前記加圧駒の相対位置が変位して前記凹部に収容された前記モールド樹脂を前記チップ搭載エリアの前記チップの隙間に加圧しながら充填することを特徴とする。

In this manner, while the first mold and the second mold are closed, the volume of the recess is relatively reduced while the chip holding piece is pressed against the chip, and the mold resin accommodated in the recess is filled into the gap between the chips while being pressurized, thereby exposing the surface of the chip and filling the gap between the chips and the gap between the chip and the substrate with the mold resin.
At this time, the mold resin is filled while pressing the individual chips with the chip holding pieces and releasing the excessive clamping pressure with the elastic member while applying the resin pressure to the mold resin. Therefore, the mold resin can be pressurized to fill the gaps around the chips, between the stacked chips, and between the chips and the substrate while preventing the resin from entering the chip surface without applying excessive mechanical stress to the chips.
In particular, variations in chip height are absorbed by the second elastic member for urging the chip pressing pieces, and mechanical stress acting on the work as the mold is closed is absorbed by the first and second elastic members, so excessive mechanical stress does not act on the chip.

The clamper constituting the lower die and the chip pressing piece may be supported at the same height.
In this way, the chip holding piece and the clamper are supported at the same height and surrounded by them to form a recess, so that the mold resin can be reliably delivered to the recess without spilling. In addition, the pressing piece surrounded by the clamper and the chip holding pieces, which are supported at the same height, can press the chip surface with the chip holding piece and relatively move so as to reduce the volume of the concave portion by the mold closing operation, thereby filling the clearance of the chip with the mold resin under pressure. Therefore, the chip surface can be exposed and resin-molded with less mechanical stress acting on the chip.

The pressure pieces arranged in the cavity area may relatively move to a height position that forms a gap for performing underfill molding with respect to the workpiece in the mold closed state.
As a result, in the mold closed state, the pressure pieces can preferentially carry out underfill molding while being relatively moved to a height position forming a gap for underfill molding with respect to the workpiece.

A plurality of the recesses may be provided in the cavity area other than the chip mounting surface of the work area.
As a result, according to the shape of the work (circular, rectangular, etc.) and the layout of the chips to be mounted on the substrate, the molding resin can be supplied to areas other than the chip mounting surface to pressurize and fill the gaps between the chips.

基板上に複数のチップ同士が近接して搭載されたワークを、各チップ表面を露出させて樹脂モールドするモールド金型であって、チップ搭載面を上向きにして前記基板を吸着保持する下型と、上型ベースに対して第一弾性部材により吊り下げ支持される連結板と、前記連結板に前記ワークのチップ搭載エリアのチップ配置に応じて対向配置された第二弾性部材によりチップ押さえ支持部より離間して吊り下げ支持されたチップ押さえ駒と、前記チップ押さえ駒の外周側で前記連結板に支持された貫通孔を有するポットブロックと、前記上型ベースに支持され前記貫通孔内に挿入されたプランジャと、前記ポットブロックの外周側で前記上型ベースに前記第一弾性部材により吊り下げ支持され前記ワークをクランプするクランパと、を有し、前記ワーク上に供給されたモールド樹脂が対向する前記ポットブロックの前記貫通孔内に収容される上型と、を備え、前記上型と前記下型を型閉じしながら前記チップ押さえ駒により前記チップを押さえたまま前記第二弾性部材を撓ませて前記チップ押さえ支持部に向かってチップ厚さ分押し上げてポットの容積を相対的に縮小させ、前記クランパが前記ワークに押し当てられると前記第一弾性部材を撓ませて前記プランジャの相対位置が変位して前記ポットブロックに収容された前記モールド樹脂を前記チップ搭載エリアの前記チップの隙間に加圧しながら充填することを特徴とする。
As a result, the mold resin and the workpiece can be simultaneously carried in and efficiently transferred to the clamping surface of the lower die. In addition, while the upper mold and the lower mold are closed, chips having different heights mounted on a workpiece held on the clamping surface of the lower mold are held down by the chip holding piece provided on the upper mold, and the volume of the recess is relatively reduced.
In particular, the second elastic member absorbs variations in the pressing force of the chip pressing piece that presses the chip, and the first and second elastic members absorb the mechanical stress acting on the workpiece when the mold is closed, so that excessive mechanical stress does not act on the chip.

A resin molding apparatus for resin-molding a workpiece having a plurality of chips mounted close to each other on a substrate with the surface of each chip exposed, the upper mold holding the substrate by suction with the chip mounting surface facing downward;a connecting plate that is floatingly supported by a first elastic member with respect to the lower mold base; a chip holding piece that is floatingly supported apart from the chip holding support portion by a second elastic member that is opposed to the connecting plate in accordance with the chip arrangement in the chip mounting area of the workpiece; Mold resin is accommodated in the formed concave portiona lower die; and a carrier having a resin accommodating portion in which through holes for introducing resin are bored corresponding to the recesses in the carrier main body, a film is held on the lower surface of the carrier body, and the lower end opening of the through holes is closed.NoteThe film is delivered to the ramper and the mold resin is supplied to the concave portion. While the upper mold and the lower mold are closed, the chip holding piece is pressed against the chip through the film, the second elastic member is deflected, and the second elastic member is pushed down toward the chip holding support portion by the thickness of the chip to relatively reduce the volume of the concave portion. It is characterized in that the gap between the chips is filled while being pressurized.

As a result, the lower die in which the workpiece is held on the clamping surface of the lower die and the molding resin is provided on the substrate, and the upper die with the film adsorbed and held on the clamping surface of the upper die are closed, the volume of the recess is relatively reduced while the chip mounted on the work is pressed through the film by the chip pressing piece, and the mold resin accommodated in the recess can be filled while pressurizing the gap between the chips. Therefore, exposure molding can be performed while the chip surface is uniformly pressed. In addition, by covering the chip surface with a film, it is possible to absorb variations in height and to prevent infiltration of mold resin during molding.
Furthermore, it is possible to select an optimum molding die according to the shape of the workpiece and perform resin molding while exposing the chip surface. For example, a processor unit such as a GPU and semiconductor chips with different heights such as HBM are arranged close to each other around it, and an FPGA (Field-Programmable Gate Array) with a SIP (System In Package) structure that connects the chips with high-density wiring can realize high-quality package molding.
A release film or a porous film is preferably used as the film. In addition, in the case of a porous film, since air can escape without allowing the mold resin to enter, the molding quality can be improved by releasing the air mixed in the mold resin and the generated gas under a reduced pressure environment.

Further, the conveying tool for conveying the molding resin together with the film into the cavity area of the molding die is characterized in that the conveying tool main body is provided with through-holes for inserting the resin corresponding to the outside of the chip mounting area in the cavity area, and the lower surface of the conveying tool main body holds the film and has a resin storage part in which the lower end opening of the through-hole is closed.
By using the conveying tool, the film is delivered to the clamping surface of the lower die and the mold resin accommodated in the resin accommodating portion is dropped into the concave portion around the chip holding piece, so that the mold resin and the film can be efficiently supplied.

In the resin molding method, a step of preparing a carrier having a resin containing portion in which a through hole for introducing resin is bored outside a chip mounting area in a carrier body and a film is held on one surface of the carrier body and a lower end opening of the through hole is closed;upper mold and lower moldOpened mold moldSaida step of loading the substrate into a lower mold; a step of sucking and holding a workpiece having a plurality of chips mounted close to each other on a substrate onto the upper mold clamping surface of the molding die with the chip mounting surface facing downward;A connected plate that is supported by the first bullet basis for the lower bass and the tip holding the chips on the chip of the chips with the tip of the work on the connecting plate, and the chip holding down the chip is separated from the supporting unit, and the floating support part, and the outer side of the tip pressed piece There is a pressurized piece established on the base base base, and a crampa supported by the outer periphery on the outer peripheral side of the pressurized piece, and is surrounded by the press pressed piece between the chip pressed piece and the crampa.The conveying tool is aligned with the resin containing portion and the concave portion on the lower mold clamp surface formed with the concave portion for containing the mold resin, and the film is placed between the chip holding piece and the mold resin.Saida step of overlapping the film so as to be sandwiched between the clampers;NoteBy starting the adsorption of the film by the ramper, the film isSaidlower dieclampa step of transferring the resin container to a surface and dropping the resin containing portion into the recess; removing the conveying tool to close the upper mold and the lower mold;said molda step of forming a vacuum space in the mold; proceeding with a mold closing operation to flex the second elastic member while pressing the chip pressing piece against the chip through the film to press down the chip thickness toward the chip pressing support portion to relatively reduce the volume of the recess; and a step of filling the gap between the chips in the chip mounting area with the molding resin while applying pressure.

As a result, the mold resin and the film can be efficiently supplied by transferring the film to the clamping surface of the lower die by means of the carrier and dropping the mold resin accommodated in the resin accommodating portion into the concave portion around the chip holding piece, so that the molding resin and the film can be efficiently supplied. At this time, since molding can be performed while pressurizing the mold resin, not only narrow gaps around the chips and gaps between stacked chips but also flip-chip mounted chips can be underfill-molded.

It is possible to provide a molding die, a resin molding apparatus, and a resin molding method that can reliably expose the surface of a chip for resin molding. Further, it is possible to provide a conveying tool that is used in these apparatuses and methods and efficiently feeds the molding resin and the film.

It is a cross-sectional explanatory view of the mold according to the first embodiment. FIG. 2 is a cross-sectional explanatory view of the molding die following FIG. 1; FIG. 3 is a cross-sectional explanatory view of the molding die following FIG. 2 ; FIG. 4 is a cross-sectional explanatory view of the molding die following FIG. 3 ; FIG. 5 is a cross-sectional explanatory view of the molding die following FIG. 4; FIG. 6 is a cross-sectional explanatory view of the molding die following FIG. 5; FIG. 7 is a cross-sectional explanatory view of the molding die following FIG. 6 ; It is a top view of a lower mold|type. It is a top view of a carrier. It is a mold cross-sectional explanatory view showing another example of the chip holding piece. FIG. 11A is a plan view showing another example of the carrier, and FIG. 11B is a perspective view showing the arrangement of the resin injection holes of the chip and the carrier. It is a top view which shows an example of a molded article. It is cross-sectional explanatory drawing of the molding die which concerns on 2nd Example. FIG. 14 is a cross-sectional explanatory view of the molding die following FIG. 13; It is a top view of a lower mold|type. It is a cross-sectional explanatory view of the mold according to the third embodiment. FIG. 17 is a cross-sectional explanatory view of the molding die following FIG. 16; It is a cross-sectional explanatory view of the mold according to the fourth embodiment. FIG. 19 is a plan view of the upper mold clamp surface of FIG. 18; FIG. 19 is a plan view of the carrier and lower mold clamp surface of FIG. 18; FIG. 11 is a plan view of a carrier and a lower die clamp surface according to another example; FIG. 11 is a plan view of a carrier and a lower die clamp surface according to another example; FIG. 11 is a plan view of a carrier and a lower die clamp surface according to another example; It is a cross-sectional explanatory view of the mold according to the fifth embodiment. Figure 26 is a plan view of the carrier and lower die clamp surface of Figure 25; FIG. 10 is a cross-sectional view of a mold according to a sixth embodiment and a plan view of an upper mold clamp surface; Figure 27 is a plan view of the carrier and lower die clamp surface of Figure 26;

An embodiment for carrying out the invention will be described in detail below with reference to the accompanying drawings. Incidentally, the term "molding mold" refers to the upper mold and the lower mold respectively supported by the mold base, excluding the mold opening/closing mechanism. In addition, when referring to a resin molding apparatus, it is an apparatus that includes a mold and a mold opening/closing mechanism (electric motor, screw shaft, toggle link mechanism, etc.; not shown) for opening and closing the mold, and at least one or more of a resin conveying device, a work conveying device, and a work unloading device after molding. In the case of resin transport transfer molding that transports a work loader 4 and a transport tool 5, which will be described later, a transfer mechanism that operates a plunger inserted in a pot, and a decompression mechanism that forms a decompression space in the mold when the mold is closed are provided. The following description will focus on the configuration of the molding die. In addition, the work W is assumed to be an interposer substrate (semiconductor wafer, resin substrate, etc.) on which a large number of semiconductor chips such as processors and HBMs are mounted, and an interposer substrate (semiconductor wafer, resin substrate, etc.) on which MEMS chips and the like are mounted. As for the mold, the lower mold is movable and the upper mold is fixed, but the upper mold may be movable and the lower mold may be fixed, or both may be movable.

The work W is composed of a substrate K and a chip T, and the chip T is electrically connected to the substrate K (flip-chip connection or the like). The chip T includes not only semiconductor chips but also functional parts such as MEMS chips. Although the above-described semiconductor chip, MEMS chip, and the like have been exemplified as the chip T that needs to be exposed, the present invention is not limited to these, and can be applied even when the surface of a radiator plate or an imaging element is exposed. It is assumed that the chip T indicates all the components mounted on the board K that need to be exposed.
In the following description, the film F is used to hold the chip T and mold it. However, the film F is not necessarily a necessary member and may be omitted.

[First embodiment]
FIG. 1 is a cross-sectional explanatory view of a molding die 1. FIG. A plurality of chips T are mounted on the workpiece W by arranging processor chips such as GPU and HBM chips around them on a silicon wafer substrate K on which wiring patterns such as TSVs of φ300 mm are formed. The molding die 1 includes an upper die 2 (first die) and a lower die 3 (second die), and the workpiece W is resin-molded with the surface of each chip T exposed.

In FIG. 1, the upper die 2 has a workpiece adsorption portion 2b on the upper die clamping surface 2a. A suction hole 2m (see FIG. 10) is formed in the workpiece suction portion 2b and connected to a suction mechanism. The work W is carried into the open mold 1 by the work loader 4, and the upper side surface of the substrate of the work W is sucked. The lower die 3 is formed with a chip holding piece 3d arranged opposite to the chip mounting area of the workpiece W, and a concave portion 3i formed around the piece for accommodating the molding resin R. As shown in FIG.

A configuration example of the molding die 1 will be specifically described below.
The upper die 2 is provided with an upper die block 2B overlaid on an upper die base 2A. A workpiece suction portion 2b is provided on the upper die clamp surface 2a of the upper die block 2B. A plurality of suction holes 2m (see FIG. 10) are provided in the work suction portion 2b. Each suction hole 2m is connected to a suction mechanism (not shown). The work W is transferred from the work loader 4 to the upper die 2 with the chip T mounting surface facing downward, and is held by the work suction portion 2b by suction (see FIG. 2). Although the workpiece W is attracted to the molding die 1 by suction, it may be fixed by a clamping mechanism without being limited to suction.

The connecting plate 3B of the lower die 3 is floatingly supported by a plurality of first coil springs 3a (first elastic members) provided on the lower die base 3A. A first pressing piece 3b is erected on the lower die base 3A to press the mold resin R when the connecting plate 3B is relatively moved by the bending of the first coil spring 3a. A chip pressing support portion 3c is provided on the connecting plate 3B so as to face the chip mounting area E. As shown in FIG. A suspending pin 3e connected to the lower surface of the tip pressing piece 3d is inserted into the tip pressing support portion 3c. The lower end of each suspending pin 3e is urged by a second coil spring 3f (second elastic member), and the tip pressing piece 3d is floatingly supported with respect to the tip pressing support portion 3c. Therefore, the upper surface of the chip holding piece 3d is supported so as to be higher than the bottom surface of the recess 3i.

As shown in FIG. 8, the tip pressing pieces 3d are divided according to the arrangement of the opposing chips T, and the tip pressing pieces 3d divided into small piece blocks are biased by the second coil springs 3f shown in FIG. The chip holding piece 3d may be movable for each chip, or may be movable for each group of functional products. In the case of a normal IC chip arranged in a matrix, the chip holding pieces 3d are arranged in a matrix according to the workpiece. The height of the top surface of the chip pressing piece 3d may be about the same as or slightly higher than the height of the top surface of the lower die clamper 3h. If it is slightly higher, the total thrust of the second coil spring 3f of the tip pressing piece 3d must be set weaker than the total thrust of the first coil spring 3a. Also, as shown in FIG. 1, a second pressure piece 3g is supported and fixed on the first pressure piece 3b on the outer peripheral side of the chip pressing support portion 3c (when the connection plate 3B is rod-shaped, the first pressure piece 3b or the second pressure piece 3g may be stacked across the rod-shaped connection plate 3B. In any case, it is sufficient if the lower mold base 3A is erected avoiding the connection plate 3B). By changing the total height dimension of the first pressure piece 3b and the second pressure piece 3g, the supply amount of the mold resin R can be adjusted. Incidentally, the first pressure piece 3b and the second pressure piece 3g may be integrally formed. A lower die clamper 3h is supported on the connecting plate 3B on the outer peripheral side of the second pressing piece 3g. A mold resin R is accommodated in a concave portion 3i surrounded by a second pressing piece 3g provided between the chip pressing piece 3d and the lower die clamper 3h, as will be described later. A clamping surface of the lower clamper 3h is provided with suction holes 3n (see FIG. 10) for sucking and holding the film F, as will be described later, and connected to a suction mechanism (not shown). 8 also shows the lower outer wall 3k (see FIG. 5) surrounding the outer peripheral side of the lower die clamper 3h. A sealing member 8 may be provided on the end surface of the lower outer wall 3k.
Although the chip holding piece 3d is divided into small piece blocks as shown in FIG. 8, it may be formed as a single block as shown in FIG. In this case, a plurality of suction holes 3n for sucking and holding the film F must be perforated in the chip holding piece 3d.

The mold resin R is transported by a transporting tool 5 as shown in FIG. As shown in FIG. 9, the carrier 5 is provided with a plate-shaped carrier body 5a and through holes 5b corresponding to the recesses 3i.
As shown in FIG. 1, the carrier main body 5a is provided with suction holes 5d (see FIG. 10), which are connected to a suction mechanism (not shown). The suction holes 5d may be suction grooves. A film F having an external size slightly larger than the size for covering the work W is held by suction on the lower surface of the carrier main body 5a. The film F does not necessarily need to be sucked to the lower surface of the carrier 5, and the through hole 5b may be closed by covering the lower surface of the carrier 5 by mechanically gripping and stretching the film F. Therefore, the lower end opening of the through hole 5b of the conveying member 5 is covered with the film F to form the resin accommodating portion 5c.

The through hole 5b provided in the carrier 5 does not necessarily have a shape along the outer diameter of the recess 3i provided in the lower mold 3. As shown in FIG. For example, as shown in FIGS. 11A and 11B, a through hole 5b having an arbitrary shape (for example, a round hole) may be provided outside the chip mounting area E (see FIG. 11B). In this case, the second pressing pieces 3g may also be circular in shape. In this way, it is not necessary to use the second pressure piece 3g for all the planar space excluding the chip holding piece 3d from the cavity area shape. Conversely, the second pressure piece 3g may be arranged in the entire planar space excluding the chip holding piece 3d from the shape of the cavity area. In this case, the molding resin R may be selectively supplied from the carrier 5 onto the second pressing piece 3g. In order to make it easier to put the mold resin R onto the second pressure piece 3g from the carrier 5, it is preferable that the shape (recess 3i) of the second pressure piece 3g is larger than the through hole 5b. Further, the outer shape of the carrier 5 may be rectangular as shown in FIG. 11A or may be circular as shown in FIG. 11B.

As shown in FIG. 1, a carrier 5 containing mold resin R (granular resin, powdered resin, liquid resin, solid resin) in the resin container 5c is loaded into the opened mold 1 by a resin loader (not shown). As shown in FIG. 2, the carrier 5 aligns the through hole 5b with the concave portion 3i of the lower die 3 and overlaps the lower die clamp surface. Then, the film suction (holding) on the conveying member 5 side is released, and the film F is transferred by starting the suction of the lower die clamp surface, and the mold resin R is supplied to the concave portion 3i (see FIG. 3). Since the chip holding piece 3d and the lower die clamper 3h are supported at approximately the same height and surrounded by them to form the concave portion 3i, the mold resin R contained in the resin containing portion 5c is reliably delivered to the concave portion 3i without spilling. Moreover, since the mold resin R is not placed on at least the chip holding piece 3d, the melted mold resin R does not enter the chip surface.

As the film F, for example, a release film (sheet-fed film) having a thickness of about 50 μm and having heat resistance is used. The release film is easily peeled off from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, polyvinylidene chloride. As a result, the surface of the chip T can be covered to absorb variations in height, and the mold resin R can be prevented from entering the chip surface for exposure molding.

Moreover, the film F may be a filter-membrane-like porous film that does not allow water or the like to pass through and allows humidity and air to escape, such as Poreflon (trade name), microporous film, and the like. In addition, in the case of a porous film, since air can escape without allowing the mold resin R to enter, the molding quality can be improved by releasing the air mixed in the mold resin R or the generated gas under a reduced pressure environment.

Here, the molding operation of the molding die 1 will be described with reference to FIGS. 1 to 7. FIG. As shown in FIG. 1, a plate-shaped carrier body 5a is provided with a through hole 5b for inserting a resin outside the chip mounting area, and a carrier 5 is prepared by sucking and holding a film F that closes the lower end opening of the through hole 5b.
An amount of molding resin R necessary for one molding operation is weighed and stored in the resin storage portion 5c of the carrier 5. As shown in FIG. If the mold resin R is a granular resin or a powdery resin, it is desirable to melt the surface of the resin by preheating to prevent dust from being blown up during transportation.

As shown in FIG. 1, a work W having a plurality of chips T mounted on a substrate K is held by a work loader 4 and carried into the opened molding die 1 . The work loader 4 places the work W on the upper mold clamping surface 2a with the chip mounting surface facing downward, and causes the work suction portion 2b to hold the substrate K by suction. Further, a resin loader (not shown) loads the carrier 5 containing the mold resin R in the resin container 5c into the lower mold 3 of the opened mold 1. As shown in FIG.
The work W, the mold resin R and the film F may be carried in first or last, or may be carried out simultaneously.

As shown in FIG. 2, the resin accommodating portion 5c and the recessed portion 3i are aligned with the lower die clamping surface having the chip holding piece 3d of the lower die 3 and the recessed portion 3i formed therearound. At this time, since the chip holding piece 3d is set to be the same as or slightly higher than the lower clamper 3h, the planar shape of the resin containing portion 5c and the planar shape of the concave portion 3i are overlapped with the film F therebetween.

As shown in FIG. 3, the film suction of the conveying tool main body 5a is released (released from holding), and the film F is transferred to the lower die clamp surface by starting the suction of the film F by the chip holding piece 3d and the lower die clamper 3h. At this time, since the chip holding piece 3d is set to be the same as or slightly higher than the lower clamper 3h, the mold resin R is reliably delivered. A suction hole (not shown) is provided in each gap of the recess 3i between the lower die clamper 3h and the second pressure piece 3g and/or the chip holding piece 3d, and the film F is supplied to the lower die 3 together with the mold resin R following the shape of the recess 3i as the film is adsorbed on the clamp surface of the lower die. At this time, the resin containing portion 5c is dropped into the concave portion 3i and the film F is held by suction. As a result, the mold resin R and the film F can be supplied efficiently and reliably by transferring the film F to the clamping surface of the lower die by the carrier 5 and dropping the mold resin R accommodated in the resin accommodation portion 5c into the concave portion 3i around the chip holding piece 3d.

As shown in FIG. 4, the work loader 4 is retracted from the molding die 1, and the carrier 5 is held by a resin loader (not shown) and removed from the lower die 3. As shown in FIG. The carrier 5 may be carried by a dedicated carrier means without being removed by the resin loader.

Next, as shown in FIG. 5, the upper mold 2 and the lower mold 3 are closed to form a vacuum space in the mold. For example, an upper outer wall 2c provided on the upper mold base 2A and a lower outer wall 3k provided on the lower mold base 3A are overlapped to seal the mold space with a sealing material 8, and air is sucked from a suction hole 3m provided in the lower outer wall 3k to form a decompressed space. Alternatively, the end surfaces of the upper outer wall 2c and the lower outer wall 3k may be sandwiched with a sealing material interposed therebetween.

As the mold closing operation progresses as shown in FIG. 6, the lower die clamper 3h clamps the work W (outer periphery of the substrate K) through the film F while the chip T and the chip holding piece 3d are pressed against each other through the film F. At this time, even if the heights of the plurality of chips T are uneven, the second coil spring 3f that urges the film F and the chip pressing piece 3d is bent, so that the chip T is pushed down by the thickness of the chip without applying excessive stress. The second coil spring 3f begins to bend from the state where the tip pressing piece 3d is pressed against the tip T. As shown in FIG. In addition, the first coil spring 3a begins to bend from the state where the lower die clamper 3h is pressed against the work W via the film F, and continues to bend until the final clamping position, thereby releasing excessive stress acting on the chip T during the mold closing operation. In addition, the bending of the first coil spring 3a raises the height of the second pressure piece 3g relative to the connecting plate 3B, and the molding resin R heated and melted in the recess 3i by the second pressure piece 3g begins to enter the chip mounting area E (see FIG. 11B). Since the mold is equipped with a heater (not shown), the mold resin R is heated and melted.

As shown in FIG. 7, as the mold closing progresses, the lower die 3 moves upward while the workpiece W and the chip pressing piece 3d are pressed against each other through the film F, thereby further raising the relative position of the second pressing piece 3g and relatively reducing the volume of the recess 3i. At this time, the mold resin R accommodated in the concave portion 3i is filled while pressurizing the gap between the chips of the work W and the gap corresponding to the underfill portion under the chip (hereinafter collectively referred to as "gap"). Further, when the pressing force increases due to mold closing, the connecting plate 3B is pushed down to the final clamping position against the urging force of the first coil spring 3a. In this manner, the molten molding resin R is heated and cured while the workpiece W is clamped at the final clamping position by the upper mold 2 and the lower mold 3 .

Therefore, when the chip mounting area is pressed through the film F by the chip pressing piece 3d and the mold resin R is pressurized and filled into the gap of the work W, the chip surface can be exposed and molded without applying excessive stress to the chips T having different heights. Further, since molding can be performed while pressurizing the mold resin R, not only the narrow gap around the chip but also the flip-chip mounted chip T can be underfill-molded.

FIG. 12 shows the workpiece W after molding. FIG. 12A shows the workpiece W that has been formed. The work W is molded with the mold resin R covering the gaps between the chips T and between the substrate K and the chips T while leaving the surface of each chip T exposed. A plurality of exposed chips T are diced from the molded workpiece W in units of functional units to manufacture individual pieces of semiconductor devices. FIG. 12B shows a plurality of chips T diced into functional units.

In this way, while the upper die 2 and the lower die 3 are closed, the volume of the recess 3i is relatively reduced while the chip holding piece 3d is pressed against the work W (chip T) through the film F, and the mold resin R accommodated in the recess 3i is filled into the gap of the work W while being pressurized.
At this time, while the chip T is held down by the chip holding piece 3d through the film F, the elastic member (the second coil spring 3f and the first coil spring 3a) relieves excessive clamping pressure while applying resin pressure to the mold resin R while filling the gap.

[Second embodiment]
Next, a second embodiment of the molding die 1 will be described with reference to FIGS. 13 to 15. FIG. The same members as those in the first embodiment are given the same reference numerals, and the following description focuses on the different configurations.
In the first embodiment, granular resin is used as the molding resin R, but solid resin (tablet-like resin) may be used as shown in FIG. The amount of molding resin R required for one molding operation is stored in the resin storage portion 5c of the carrier 5. As shown in FIG. A resin loader (not shown) loads the carrier 5 containing the mold resin R in the resin container 5c into the lower mold 3 of the opened mold 1. As shown in FIG.

As shown in FIG. 13, the resin containing portion 5c and the recessed portion 3i are aligned with the lower die clamping surface having the chip holding piece 3d of the lower die 3 and the recessed portion 3i formed therearound, and the film F of the conveying tool 5 is superimposed on the lower clamping surface. At this time, the inside of the recessed portion 3i is sucked so that the film F is sucked and held along the recessed portion 3i. As a result, the film F is transferred to the clamping surface of the lower die by the carrier 5, and the mold resin R contained in the resin container 5c is dropped into the concave portion 3i so that it can be efficiently and reliably transferred. FIG. 15 shows a state in which the molding resin R (tablet-like resin) is dropped into the concave portion 3i provided in the lower mold 3. As shown in FIG. Note that the tablet dropping position is an example, and is not limited to the form in FIG. 15 . In FIG. 15, there is a chip holding piece 3d in a wafer-shaped circular cavity area, and all but the chip holding piece 3d in the cavity area are the second pressure piece 3g, and the tablet-like resin R is partially placed. may be). In this case, the other part of the second pressure piece (3g) becomes a recess (3s) and is supported higher than the bottom of the support part 3c, and the height (depth) is preferably such that the same gap as the underfill height is formed when the mold is closed. The height of the concave portion (3s) does not necessarily have to be the height for underfill molding, and may be the same as the chip height.

FIG. 14 shows a state in which the closing of the upper mold 2 and the lower mold 3 is completed, and the melted resin is cured by heating while the workpiece W is clamped at the final position. At this time, while the chip F is pressed by the chip holding piece 3d through the film F, the elastic members (the second coil spring 3f and the first coil spring 3a) release excessive clamping pressure and apply resin pressure to the molding resin R to fill the gaps.

[Third embodiment]
Next, a third embodiment of the molding die 1 will be described with reference to FIGS. 16 and 17. FIG. The same members as those in the first embodiment are given the same reference numerals, and the following description focuses on the different configurations. In the first and second embodiments, the workpiece W is supported by the upper mold 2 and the film F and molding resin R are supported by the lower mold 3. However, this embodiment employs a vertically inverted construction.

In FIG. 16, the lower mold 3 is provided with a lower mold block 3C overlaid on a lower mold base 3A. A workpiece suction portion 3q is provided on the lower die clamp surface 3p of the lower die block 3C. A plurality of suction holes (not shown) for sucking a work W are provided in the work suction portion 3q, and these are connected to a suction mechanism (not shown). The workpiece W has the chip T mounting surface facing upward, and the substrate K is adsorbed and held by the workpiece adsorption portion 3q. Further, a mold resin R (solid resin; tablet resin) is supplied outside the chip mounting area E (see FIG. 11B) of the substrate K. As shown in FIG.

In the upper die 2, a connecting plate 2C is suspended and supported by a plurality of first coil springs 2d (first elastic members) provided on the upper die base 2A. A plunger 2D is suspended from the upper die base 2A so as to face the molding resin R (solid resin) supplied onto the substrate K. As shown in FIG. A chip pressing support portion 2e is provided on the connecting plate 2C so as to face the chip mounting area E (see FIG. 11B). A hanging pin 2f is inserted into the chip holding support portion 2e, and a chip holding piece 2g is connected to the lower end of the hanging pin 2f. A second coil spring 2h (second elastic member) is provided between the connecting plate 2C and the upper end of the suspension pin 2f. The tip pressing piece 2g is suspended from the tip pressing support portion 2e by the second coil spring 2h. Similarly to the lower die 3 of FIG. 8, the chip holding pieces 2g are divided according to the chips T facing each other, and the chip holding pieces 2g divided into small piece blocks are biased by the second coil springs 2h and supported apart from the chip holding support portion 2e.

A pot block 2i is suspended and supported by a coil spring 2j on the connecting plate 2C on the outer peripheral side of the chip pressing support portion 2e. A lower end portion of a plunger 2D is slidably inserted into the cylindrical hole of the pot block 2i. When the mold 1 is closed, the mold resin R (solid resin) supplied to the substrate K is accommodated in the cylindrical hole of the pot block 2i. An upper die clamper 2k is supported on the connecting plate 2C on the outer peripheral side of the pot block 2i. The upper mold clamping surface (pot block 2i, upper clamper 2k) is provided with suction holes for sucking and holding the film F, and is connected to a suction mechanism (not shown). The pot block 2i may be supported higher in the height direction than the chip pressing support portion 2e and may form part of the cavity recess.
Although the chip holding piece 2g is divided into small piece blocks as shown in FIG. 8, it may be formed as a single block as shown in FIG. It may also be an intermediate size block grouped by a plurality of chips or by functional chips. In this case, a plurality of suction holes (see FIG. 10) for sucking and holding the film F must be perforated in the chip holding piece 2g.

As shown in FIG. 16, the film F is sucked and held on the clamping surface of the upper die 2 provided with the chip holding piece 2g of the upper die 2, the pot block 2i and the upper die clamper 2k provided therearound, and the mold resin R (solid resin) is supplied onto the substrate K of the work W which is held by the work suction portion 3q of the lower die 3. The film F and the mold resin R may be supplied individually, or may be supplied collectively by a resin loader.

FIG. 17 shows a state in which the closing of the upper mold 2 and the lower mold 3 is completed, and the melted resin is cured by heating while the workpiece W is clamped at the final position. The plunger 2D inserted into the pot block 2i relatively moves to pressurize the molding resin R, thereby filling the gap of the workpiece W. As shown in FIG. The bottom surface of the pot block 2i may have a height at which the resin flows to the chip T (ideally, the height of the gap between the chip T and the substrate K), or a concave portion serving as a runner may be formed partially. At this time, while pressing the chip T through the film F with the chip pressing piece 2g, the elastic member (the second coil spring 2h and the first coil spring 2d) relieves excessive clamping pressure and applies resin pressure to the mold resin R while filling the gap.

[Fourth embodiment]
Next, a fourth embodiment of the molding die 1 will be described with reference to FIGS. 18 to 23. FIG. The same members as those in the first embodiment are given the same reference numerals, and the following description focuses on the different configurations. In the first embodiment, as the work W, the substrate K on which the chip T is mounted is assumed to be a circular silicon wafer, but it may be a rectangular resin substrate or the like. Further, in the first to third embodiments, the concave portion for containing the mold resin R is provided in the cavity area, but the concave portion does not necessarily have to be provided in the cavity, and the case where the concave portion is provided outside the cavity and outside the workpiece W is exemplified. In the case of a wafer, it is necessary to provide a concave portion inside the cavity because the end face is chamfered, but in the case of a substrate, since the end face is not chamfered compared to a wafer, it is possible to provide a concave portion outside the cavity.

FIG. 18 shows a cross-sectional configuration of the molding die 1. As shown in FIG. As shown in FIG. 19, the upper die 6 is provided with a work suction portion 6b corresponding to the outer shape of the work W which is carved into the upper die clamping surface 6a. As shown in FIG. 19, the workpiece suction portion 6b is provided with a plurality of suction holes 6c along the outer periphery, which are connected to a suction mechanism (not shown). As shown in FIG. 18, the work W is sucked and held by the work sucking portion 6b with the chip mounting surface facing downward.

In FIG. 18, a lower die base 7A has a chip holding piece 7b floatingly supported via a coil spring 7a (elastic member) facing a chip mounting area E (see FIG. 11B). An annular lower die clamper 7c is floatingly supported by a coil spring 7d around the chip pressing piece 7b. A pot hole (through hole) 7e is provided in the lower clamper 7c. A plunger 7B is inserted into the pot hole 7e and is supported by the lower die base 7A. As shown in FIG. 20A, the pot holes 7e and the plungers 7B are provided at a plurality of locations (for example, three locations) along the opposing sides (short sides) of the rectangular work area L (the range in which the workpiece W is mounted).

As shown in FIG. 20A, on the clamping surface side of the lower die clamper 7c, an annular lower die cull 7f is carved around the pot hole 7e, and a lower die runner gate 7g connected to the lower die cull 7f is carved toward the chip holding piece 7b. In addition, a plurality of suction holes 7h for sucking the film F are provided around the outer periphery of the chip holding piece 7b forming the lower die clamping surface, the outer periphery of the work area of the lower die clamper 7c, the lower die cull 7f and the lower die runner gate 7g, and are connected to a suction mechanism (not shown).

The film F and the mold resin R are conveyed by the conveying tool 5 as shown in FIG. As shown in FIG. 20B, the carrier 5 is provided with a plate-shaped carrier body 5a and through holes 5b corresponding to the pot holes 7e. A plurality of suction holes 5d are provided in the carrier main body 5a along a portion corresponding to the outer shape of the workpiece and along the periphery of the through hole 5b, and these are connected to a suction mechanism (not shown). Incidentally, the suction holes 5d may be suction grooves or may be provided with both as required. A film F large enough to cover the work W is held by suction on the lower surface side of the carrier main body 5a. As a result, as shown in FIG. 18, the openings at the lower ends of the through holes 5b of the carrier 5 are covered with the film F to form the resin accommodating portion 5c.

Here, another example of the lower mold 3 and carrier 5 will be described with reference to FIGS. 21 to 23. FIG. FIG. 21 shows another example of the layout arrangement of the pot holes 7e provided in the lower clamper 7c and the through holes 5b of the carrier 5. As shown in FIG. In FIG. 21A, pot holes 7e may be provided at a pair of diagonal portions of the rectangular work area L of the lower clamper 7c. This is advantageous in that the resin flows from a pair of diagonal portions, and the air and the initial impurity-rich resin flow to the other diagonal portions. An annular lower die cull 7f is carved around the pot hole 7e, and a lower die runner gate 7g connected to the lower die cull 7f is carved toward the chip holding piece 7b. A plurality of suction holes 7h for sucking the film F are provided around the outer periphery of the work area L of the lower die clamper 7c and the periphery of the lower die cull 7f and the lower die runner gate 7g. Incidentally, the pot holes 7e may be further provided in the other pair of diagonal portions, or may be one.
As shown in FIG. 21B, the carrier body 5a of the carrier 5 is provided with through holes 5b corresponding to the pot holes 7d shown in FIG. 21A. The carrier body 5a is provided with a plurality of suction holes 5d along a portion corresponding to the outer shape of the workpiece and the perimeter of the through hole 5b.

Another example of the lower mold 7 and carrier 5 will be described with reference to FIG. FIG. 22 shows another example of the layout arrangement of the pot holes 7e provided in the lower clamper 7c and the through holes 5b of the carrier 5. As shown in FIG. In FIG. 22A, a plurality of (for example, three) pot holes 7d may be provided along adjacent sides (long side and short side) of the rectangular work area L of the lower clamper 7c. This is advantageous in that the mold resin R flows to the corners diagonally opposite to the corners of the adjacent sides, and the air and the initial resin with a large amount of impurities flow. An annular lower die cull 7f is carved around the pot hole 7e, and a lower die runner gate 7g connected to the lower die cull 7f is carved toward the chip holding piece 7b. A plurality of suction holes 7h for sucking the film F are provided around the outer periphery of the rectangular work area L of the lower die clamper 7c and the periphery of the lower die cull 7f and the lower die runner gate 7g. The pot holes 7e may be further provided along other adjacent sides (long side and short side).
As shown in FIG. 22B, the carrier body 5a of the carrier 5 is provided with through holes 5b corresponding to the pot holes 7d shown in FIG. 22A. The carrier body 5a is provided with a plurality of suction holes 5d along a portion corresponding to the outer shape of the workpiece and the perimeter of the through hole 5b.

Another example of the lower mold 7 and carrier 5 will be described with reference to FIG. FIG. 23 shows another example of the layout arrangement of the pot holes 7e provided in the lower clamper 7c and the through holes 5b of the carrier 5. As shown in FIG. In FIG. 23A, pot holes 7e may be provided parallel to each side (long side and short side) of the rectangular work area L of the lower clamper 7c. In this case, powders and granular resins other than resin tablets can be easily used. Although pot holes 7e are provided on all sides, any one of them may be selectively provided. A plurality of lower die runner gates 7g are carved into each pot hole 7e toward the chip holding piece 7b. A plurality of suction holes 7h for sucking the film F are provided around the outer periphery of the rectangular work area L of the lower clamper 7c and the lower runner gate 7g.
As shown in FIG. 23B, the carrier main body 5a of the carrier 5 is provided with through holes 5b corresponding to the pot holes 7d shown in FIG. 23A. The carrier body 5a is provided with a plurality of suction holes 5d along a portion corresponding to the outer shape of the workpiece and the perimeter of the through hole 5b.

[Fifth embodiment]
Next, a fifth embodiment, which is a modification of the molding die 1 (fourth embodiment) shown in FIG. 18, will be described with reference to FIGS. 24 and 25. FIG. The same members as those of the fourth embodiment are given the same reference numerals, and the following description focuses on the different configurations. The difference from the fourth embodiment is the form of the lower mold 7 and carrier 5 .
In FIG. 24, the upper mold 6 has a workpiece suction portion 6b corresponding to the outer shape of the workpiece W on the upper mold clamping surface 6a. A work W is sucked and held by the work suction portion 6b with its chip mounting surface facing downward.

As shown in FIG. 24, the lower die 7 has a lower die base 7A and a chip holding piece 7b which is floatingly supported by a coil spring 7a. A plunger 7B is erected and supported in contact with the lower die base 7A outside the chip holding piece 7b. An annular lower die clamper 7c surrounding the chip pressing piece 7b and the plunger 7B is floatingly supported by a coil spring 7d on the lower die base 7A. Pot holes 7e (through holes) are formed in two opposing sides (short sides) between the lower die clamper 7c and the chip pressing piece 7b. A rectangular plunger 7B is inserted into the pot hole 7e.

As shown in FIG. 25A, the pot hole 7e is formed in a rectangular shape along the short side of the tip pressing piece 7b, and the plunger 7B is formed in a rectangular shape so as to slide along the pot hole 7e.
Further, as shown in FIG. 25B, the carrier body 5a of the carrier 5 is provided with a rectangular through hole 5b corresponding to the pot hole 7d shown in FIG. 25A. The carrier body 5a is provided with a plurality of suction holes (not shown) along a portion corresponding to the outer shape of the workpiece and the perimeter of the through hole 5b. As shown in FIG. 24, the openings at the lower ends of the through holes 5b of the carrier 5 are covered with the film F to form the resin accommodating portion 5c.

[Sixth embodiment]
Next, a sixth embodiment, which is a modification of the molding die 1 (fourth embodiment) shown in FIG. 18, will be described with reference to FIGS. 26 and 27. FIG. The same members as those of the fourth embodiment are given the same reference numerals, and the following description focuses on the different configurations. The difference from the fourth embodiment is the form of the lower mold 7 and carrier 5 .
In FIG. 26A, the upper mold 6 has a workpiece suction portion 6b formed on the upper mold clamp surface 6a corresponding to the outer shape of the workpiece W, and the workpiece W is suction-held by the workpiece suction portion 6b with the chip mounting surface facing downward. As shown in FIG. 26B, the workpiece W has chips T mounted on a rectangular substrate K in a matrix arrangement (for example, 3 rows and 6 columns).

As shown in FIG. 26A, the lower die 7 has a lower die base 7A and a chip holding piece 7b facing the chip T in a matrix arrangement and supported by coil springs 7a in a floating manner. A pressing piece 7i is supported and fixed on the lower die base 7A around the chip pressing piece 7b. An annular lower die clamper 7c surrounding the chip pressing piece 7b and the pressure piece 7i is floatingly supported by the lower die base 7A by a coil spring 7d (see FIG. 27A).

As shown in FIG. 27A, the upper surface of the pressing piece 7i corresponding to the gap between the chip pressing pieces 7b corresponds to the pot into which the molding resin R is introduced. The amount of mold resin R supplied can be adjusted by changing the height of the pressing pieces 7i.
Further, as shown in FIG. 27B, the carrying tool body 5a of the carrying tool 5 is provided with a through hole 5b at a portion corresponding to the pressing piece 7i shown in FIG. The carrier body 5a is provided with a plurality of suction holes (not shown) along the portion corresponding to the outer shape of the workpiece and the perimeter of the through hole 5b. As shown in FIG. 26A, the lower end opening of the through hole 5b of the carrier 5 is covered with the film F to form the resin accommodating portion 5c.

Although the workpiece W described above is held by suction on the upper clamping surface or the lower clamping surface, it can be mechanically held by claws or the like, or both suction and claw holding can be used.

1 Mold K Substrate T Chip R Mold Resin E Chip Mounting Area F Film L Work Area 2, 6 Upper Die 2A Upper Die Base 2B Upper Die Block 2D, 7B Plungers 2a, 6a Upper Die Clamping Surface 2b, 3q, 6b Work Suction Part 2c Upper Outer Wall 2d, 3a First Coil Spring 2e, 3c Chip Pressing Supporting Part 2f, 3e Hanging Pin 2g, 3d chip holding piece 2h, 3f second coil spring 2i pot block 2j, 7a, 7d coil spring 2k upper die clamper 2m, 3j, 3n, 5d, 6c, 7h suction hole 3, 7 lower die 3A, 7A lower die base 2C, 3B connecting plate 3C lower die block 3b first pressure piece 3g second pressure piece 7i pressure piece 3h, 7c lower clamper 3i concave portion 3k lower outer wall 3m suction hole 3p lower die clamping surface 4 work loader 5 carrier 5a carrier body 5b through hole 5c resin accommodating portion 7b chip holding piece 7e pot hole 7f lower die cull 7g lower die runner gate 8 sealing material

Claims (7)

A mold for resin-molding a workpiece having a plurality of chips mounted close to each other on a substrate with the surface of each chip exposed,
an upper mold for supporting the workpiece;
a connecting plate that is floatingly supported by a first elastic member with respect to the lower mold base; a chip holding piece that is floatingly supported apart from the chip holding support portion by a second elastic member that is opposed to the connecting plate according to the chip arrangement in the chip mounting area of the workpiece; a pressing piece that is erected on the lower mold base by avoiding the connecting plate on the outer peripheral side of the chip holding piece; and a clamper that is supported by the connecting plate on the outer peripheral side of the pressing piece; a lower mold in which the mold resin is accommodated in the formed recess,
While the upper mold and the lower mold are closed, the second elastic member is flexed while the chip pressing piece is pressed against the chip, and the second elastic member is pressed down toward the chip pressing support portion by the thickness of the chip to relatively reduce the volume of the recess. 2. A mold according to claim 1, wherein said clamper constituting said lower mold and said chip holding piece are supported at the same height. 3. The mold according to claim 2, wherein the pressure piece arranged in the cavity area surrounded by the chip pressing piece and the clamper relatively moves to a height position that forms a gap for performing underfill molding with respect to the workpiece in the mold closed state. 4. The mold according to any one of claims 1 to 3, wherein a plurality of said concave portions are provided in a cavity area other than the chip mounting surface of the work area. A mold for resin-molding a workpiece having a plurality of chips mounted close to each other on a substrate with the surface of each chip exposed,
a lower mold for sucking and holding the substrate with the chip mounting surface facing upward;
上型ベースに対して第一弾性部材により吊り下げ支持される連結板と、前記連結板に前記ワークのチップ搭載エリアのチップ配置に応じて対向配置された第二弾性部材によりチップ押さえ支持部より離間して吊り下げ支持されたチップ押さえ駒と、前記チップ押さえ駒の外周側で前記連結板に支持された貫通孔を有するポットブロックと、前記上型ベースに支持され前記貫通孔内に挿入されたプランジャと、前記ポットブロックの外周側で前記上型ベースに前記第一弾性部材により吊り下げ支持され前記ワークをクランプするクランパと、を有し、前記ワーク上に供給されたモールド樹脂が対向する前記ポットブロックの前記貫通孔内に収容される上型と、を備え、
While the upper mold and the lower mold are closed, the second elastic member is deflected while the chip is held down by the chip holding piece and pushed up toward the chip holding support portion by the thickness of the chip to relatively reduce the volume of the pot. When the clamper is pressed against the work, the first elastic member is bent to displace the relative position of the plunger, and the mold resin accommodated in the pot block is filled while pressurizing the gap between the chips in the chip mounting area. A resin molding apparatus for resin-molding a workpiece having a plurality of chips mounted close to each other on a substrate with the surface of each chip exposed,
an upper mold for sucking and holding the substrate with the chip mounting surface facing downward;
a connecting plate that is floatingly supported by a first elastic member with respect to the lower mold base; a chip holding piece that is floatingly supported apart from the chip holding support portion by a second elastic member that is opposed to the connecting plate according to the chip arrangement in the chip mounting area of the workpiece; a pressing piece that is erected on the lower mold base by avoiding the connecting plate on the outer peripheral side of the chip holding piece; and a clamper that is supported by the connecting plate on the outer peripheral side of the pressing piece; a lower mold in which the mold resin is accommodated in the formed recess;
a conveying tool having a resin containing portion in which a through hole for introducing resin is bored in the conveying tool main body corresponding to the recess, a film is held on the lower surface of the conveying tool main body, and the lower end opening of the through hole is closed;
前記搬送具に保持されたフィルム上にモールド樹脂が収容されたまま下型クランプ面と重ね合わせて前記チップ押さえ駒及び前記クランパに前記フィルムを受け渡すと共に前記凹部に前記モールド樹脂が供給され、前記上型と前記下型を型閉じしながら前記チップ押さえ駒を前記フィルムを介して前記チップに押し当てたまま前記第二弾性部材を撓ませて前記チップ押さえ支持部に向かってチップ厚さ分押し下げて前記凹部の容積を相対的に縮小させ、前記クランパが前記ワークに押し当てられると前記第一弾性部材を撓ませて前記加圧駒の相対位置が変位して前記凹部に収容された前記モールド樹脂を前記チップ搭載エリアの前記チップの隙間に加圧しながら充填することを特徴とする樹脂モールド装置。 a step of preparing a carrier having a resin accommodating portion in which a through hole for introducing resin is bored outside a chip mounting area in a carrier body, a film is held on one surface of the carrier body, and a lower end opening of the through hole is closed;
a step of carrying the conveying tool containing the mold resin in the resin containing part into the lower mold of the mold with the mold opened between the upper mold and the lower mold;
a step of sucking and holding a work in which a plurality of chips are mounted close to each other on a substrate to the upper mold clamp surface of the molding die with the chip mounting surface facing downward;
下型ベースに対して第一弾性部材によりフローティング支持される連結板と、前記連結板に前記ワークのチップ搭載エリアのチップ配置に応じて対向配置された第二弾性部材によりチップ押さえ支持部より離間してフローティング支持されたチップ押さえ駒と、前記チップ押さえ駒の外周側で前記連結板をよけて前記下型ベースに立設された加圧駒と、前記加圧駒より外周側で前記連結板に支持されたクランパと、を有し、前記チップ押さえ駒と前記クランパとの間に設けられた前記加圧駒に囲まれてモールド樹脂を収容する凹部が形成された下型クランプ面に、前記搬送具を前記樹脂収容部と前記凹部を位置合わせし、前記フィルムを前記チップ押さえ駒及び前記クランパに挟み込まれるように重ね合わせる工程と、
a step of releasing the holding of the film by the conveying tool main body and starting to suck the film by the chip holding piece and the clamper , thereby transferring the film to the clamping surface of the lower mold and dropping the resin containing portion into the concave portion;
a step of removing the carrier and closing the upper mold and the lower mold to form a reduced pressure space in the mold ;
While the mold closing operation is advanced to press the chip pressing piece against the chip through the film, the second elastic member is deflected and pushed down toward the chip pressing support portion by the thickness of the chip to relatively reduce the volume of the recess, and when the clamper is pressed against the work through the film, the first elastic member is deflected and the mold closing operation is further progressed while being pressed against the work, and the relative position of the pressure piece is displaced to displace the mold resin contained in the recess in the chip mounting area. and a step of filling gaps between chips while applying pressure.

Images