JP5186123B2 - Transfer apparatus and transfer method - Google Patents

Description

  The present invention relates to a transfer apparatus and a transfer method, and more particularly, to a device that depressurizes a portion to be transferred to a molded product.

  In recent years, a mold (template, stamper) is manufactured by forming an ultra-fine transfer pattern on a quartz substrate or the like by an electron beam drawing method, and the mold is predetermined on a resist film formed on the surface of the transfer substrate as a molded product. Research and development has been conducted on nanoimprint technology for transferring a transfer pattern formed on the mold by pressing with a pressure of (see Non-Patent Document 1).

As a device for performing transfer by the nanoimprint technology, a mold holding body for holding a mold and a molded article holding body for holding a molded article are provided, and the mold holding body holding the mold is held by the molded article. There is known a structure in which a molded product is pressed relatively close to the molded product holder and the molded product is pressed with a mold to transfer a fine transfer pattern formed on the mold to the molded product (for example, a patent). Reference 1).
JP 2004-34300 A Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology

  By the way, in the conventional transfer device, when pressing the molded product with the mold, the pressing force on the pressing surface (the pressing to the molded product by the mold) is caused by a slight shape error of the transfer device, the mold or the molded product. Pressure) is not constant, and there is a possibility that transfer with high accuracy cannot be performed, for example, the transfer pattern varies in depth.

  The present invention has been made in view of the above problems, and in a transfer apparatus and transfer method for transferring a fine transfer pattern formed on a mold to a molded product, transfer capable of performing accurate transfer. An object is to provide an apparatus and a transfer method.

The invention according to claim 1 is a transfer device that transfers a fine transfer pattern formed on a mold to a molded product, and makes the mold and the molded product contact each other for the transfer. a closed space forming means is positioned in the closed space the contact contact portion has, by lowering the pressure in the closed space formed by the closed space forming unit than air pressure outside the said closed space, the said type to be It is a transfer device having pressure reducing means for making at least one of the molded products deform by applying air pressure outside the closed space to the back surface thereof , and uniformizing the pressure at the contact portion.

According to a second aspect of the present invention, there is provided a transfer apparatus for transferring a fine transfer pattern formed on a mold onto a molded product, and a molded product installation body for installing the molded product, and the mold. A mold holding body that can be held and moved relative to the molding object installation body in a direction approaching / separating from the molding object installation body, and the mold and the molding object to be transferred. And an annular member for positioning a contact portion between the mold and the molded product in a closed space in cooperation with the molded product and the mold holding body when they are brought into contact with each other. Pressure reducing means for depressurizing the inside and deforming at least one of the mold and the molded article by applying atmospheric pressure outside the closed space to the back surface thereof, and uniformizing the pressure in the contact portion; A transfer device.

According to a third aspect of the present invention, there is provided a transfer apparatus for transferring a fine transfer pattern formed on a mold to a molded product, a molded product installation body for installing the molded product, and the molded product A movable body that can be moved and positioned relatively to the molded product installation body in a direction approaching or moving away from the molded product installation body, and a molded product installed in the molded product installation body to perform the transfer When the movable body moves in a direction approaching the mold installed on the mold, the contact portion between the mold and the molded article is positioned in a closed space in cooperation with the molded article and the movable body. And an annular member for reducing pressure inside the closed space, and a pressure reducing means for deforming the product to be molded by applying an air pressure outside the closed space to the back surface thereof to equalize the pressure at the contact portion. A transfer device.

According to a fourth aspect of the present invention, there is provided a transfer apparatus for transferring a fine transfer pattern formed on a mold to a molded product, comprising a thin plate-like member, and the molded product having the plate-like member in between. A molded product installation body that holds the mold, and a mold holding body that is movable and positionable relative to the molded product installation body in a direction that approaches and separates from the molded product installation body, When the mold and the molded product are brought into contact with each other for the transfer, the contact portion between the mold and the molded product is closed in cooperation with the plate member and the mold holder. An annular member positioned in between, and reducing the pressure in the closed space, and deforming the plate member and the molded article by applying an air pressure outside the closed space to the back surface of the plate member, It is a transcription unit and a decompression means for equalizing the pressure at the contact portion

According to a fifth aspect of the present invention, there is provided a transfer method performed using the transfer device according to any one of the first to fourth aspects, wherein the product to be molded includes a flat base material and a base material. A transfer method in which a fine transfer pattern of the mold is transferred to the transfer material. The transfer method includes a film-like transfer material that is thinly provided on one surface in the thickness direction of the material.

According to a sixth aspect of the present invention, there is provided a transfer method for transferring a fine transfer pattern formed on a mold onto a molded product, wherein the mold and the molded product are brought into contact with each other for the transfer. By positioning the contact portion in the closed space and lowering the air pressure in the closed space to be lower than the air pressure outside the closed space, at least one of the mold and the article to be molded is placed on the back surface thereof. This is a transfer method in which the pressure at the contact portion is made uniform by applying a pressure outside the closed space to be deformed.

  According to the present invention, in the transfer apparatus and transfer method for transferring a fine transfer pattern formed on a mold to a molding object, there is an effect that accurate transfer can be performed.

[First Embodiment]
FIG. 1 is a diagram showing a schematic configuration of a transfer apparatus 1 according to an embodiment of the present invention.

  Hereinafter, for convenience of explanation, one horizontal direction is defined as an X-axis direction, another horizontal direction that is perpendicular to the X-axis direction is defined as a Y-axis direction, and the X-axis direction and the Y-axis direction. A direction (vertical direction; vertical direction) perpendicular to Z may be referred to as a Z-axis direction.

  The transfer device 1 uses a fine transfer pattern formed on a surface (for example, a planar lower surface) of a mold (stamper) M, and a surface of the mold M on a surface (for example, a planar upper surface) of a product W. It is an apparatus for transferring by bringing the surface of the article to be molded W into surface contact. As the molded product W, CD-ROM, DVD-ROM, a light guide plate of a liquid crystal display device, and the like can be listed.

  The mold M is made of, for example, quartz glass, and the product to be molded W is a base material W1 made of, for example, silicon or glass, and a film-like transfer material (thinly provided on the surface of the base material W1). For example, a UV curable resin (W3) is provided (see FIG. 3).

  The transfer device 1 includes a base frame 3, and a molded product installation body 9 is provided on the base frame 3. For example, the molded product installation body 9 has a flat upper surface, and the molded product W can be placed and installed on the upper surface. In this way, the to-be-molded product W placed in this way has a thickness direction in the Z-axis direction, and is located at a predetermined position in the X-axis direction and the Y-axis direction.

  The molded product installation body 9 is supported by the base frame 3 via the XY stage 7. Therefore, by driving an actuator (not shown) such as a servo motor that constitutes the XY stage 7 under the control of a control device (not shown), the molded product installation body 9 can move in the X-axis or Y-axis direction. It can be moved and positioned freely. Note that the XY stage 7 may have a function that allows the molded product installation body 9 to rotate and position about an axis parallel to the Z axis.

  The base frame 3 is provided with a mold holder 5. For example, the lower surface of the mold holding body 5 is flat, and the mold M can be held by the lower surface. In the mold M held in this way, the lower surface on which the fine transfer pattern is formed is opposed to the molded product installation body 9 (molded product W).

  The mold holding body 5 is supported on the base frame 3 via a linear guide bearing (not shown), and drives an actuator (not shown) such as a servo motor under the control of the control device, thereby moving in the Z-axis direction. It can be moved and positioned freely.

  Further, the transfer device 1 is provided with a UV light generator (ultraviolet generator; not shown) for irradiating the molding target W with ultraviolet rays, and the mold M is transferred to the molding target W for transfer. When contact is made, ultraviolet rays are generated to cure the transfer material W3 of the product W to be molded. A thermoplastic resin or a thermosetting resin may be adopted as the transfer material W3. In this case, instead of or in addition to the UV light generation device, a heating device for heating the product W is provided.

  Further, the transfer device 1 is provided with a closed space forming means 10 and a pressure reducing means 12 (see FIG. 2). The closed space forming means 10 lowers the mold holding body 5 and makes the mold M and the molded product W contact each other in order to transfer to the molded product W (for example, the molded product W with the mold M). ), The contact portion between the mold M and the workpiece W is positioned in a closed space (for example, a space cut off from the atmosphere). In this case, the back surface of the molded product W is in contact with the atmosphere.

  The decompression means 12 lowers the atmospheric pressure in the closed space SP1 formed by the closed space forming means 10 to be lower than the atmospheric pressure outside the closed space SP1 (for example, atmospheric pressure) (for example, lowers until it becomes almost vacuum), thereby reducing the pressure. The molded product W is elastically deformed by atmospheric pressure so that the molded product W follows the mold M, and the pressure at the contact portion (contact pressure between the mold M and the molded product W) is made uniform.

  The transfer device 1, the mold M, and the molded product W will be described in more detail with examples.

  FIG. 2 is a diagram illustrating a schematic configuration of a main part of the transfer device 1.

  The mold M is formed in a rectangular flat plate shape having a predetermined thickness, and when attached to the mold holder 5, the thickness direction is the Z-axis direction. A fine transfer pattern is formed at the center. A through hole (through hole for allowing the ultraviolet rays from the ultraviolet ray generator to pass) 15 extending in the Z-axis direction is provided at the center of the mold holder 5. A mold support member 11 made of a transparent body is provided. The mold M is provided below the mold support member 11, and the mold M and the mold support member 11 are integrally attached to the mold holding body 5 by the mold holding member 13.

  As described above, the product to be molded W includes a rectangular flat base material W1 and a film-like transfer material W3 provided thinly on one surface in the thickness direction of the base material W1. The fine transfer pattern of the mold M is transferred to the transfer material W3.

  As described above, the molded product installation body 9 is used to install the molded product W. When the molded product installation body 9 is installed on the molded product installation body 9, a fine transfer pattern of the mold M is transferred. The surface (upper surface of the product W) is substantially parallel to the surface (lower surface) on which the fine transfer pattern of the mold M held by the mold holder 5 is formed. Further, the molded product W installed in the molded product installation body 9 can be moved and positioned relatively in the X axis direction and the Y axis direction with respect to the mold M held by the mold holding body 5. It has become.

  In the state where the molded product W is installed on the molded product installation body 9, for example, the end of the molded product W abuts against the butting (not shown) of the molded product installation body 9, Positioning of the molded product W with respect to the molded product installation body 9 (positioning in the X-axis direction and the Y-axis direction) is performed, but the molded product W is simply placed on the molded product installation body 9 in the Z-axis direction. It is placed.

  The contact portion between the molded product installation body 9 and the molded product W (a very small gap between the upper surface of the molded product installation body 9 and the lower surface of the molded product W) TC1 includes air in the atmosphere. Can enter. In addition, in the state in which the molded product W is installed in the molded product installation body 9, in addition to the positioning of the molded product W and the above-described placement, a part of the end portion around the molded product W is The molded product W may be held by the molded product installation body 9 by clamping with a clamper (not shown).

  As described above, the mold holder 5 holds the mold M, but in a state where the mold holder 5 is held, the surface (lower surface) on which the fine transfer pattern of the mold M is formed is Opposite and parallel to the surface (upper surface) to which the fine transfer pattern of the molded product W held by the molded product installation body 9 is transferred. Further, as described above, the mold M held by the mold holding body 5 approaches and separates from the molded product installation body 9 (almost orthogonal to the surface of the mold M on which a fine transfer pattern is formed). (Direction; Z-axis direction) is relatively movable and positionable relative to the molded product installation body 9 (molded product W).

The mold holder 5 is integrally provided with an annular member (annular member) 17. The annular member 17 is formed in, for example, an annular shape, and is provided so that the mold M installed on the mold holding body 5 is located inside. That is, the annular member 17 is provided so as to surround the mold M installed in the mold holding body 5 when viewed from the Z-axis direction. Then, the mold holder 5 holding the mold M for transfer is brought relatively close to the molded product installation body 9 on which the molded product W is installed, so that the mold M and the molded product W are mutually connected. When contacted, the annular member 17, the product to be molded W, and the mold holder 5 cooperate to form a closed space (a space cut off from the atmosphere) SP1. In addition, the contact portion TC2 between the mold M and the molding target W and the surrounding area are located in the closed space SP1. The back surface (lower surface) of the molded product W is open to the atmosphere.

  More specifically, when the mold M and the molded product W are brought into contact with each other for transfer, the tip (lower end) of the annular member 17 is on one surface (upper surface) of the molded product W. A closed space SP <b> 1 is formed by the workpiece W, the mold holding body 5, the mold support member 11, and the annular member 17 in contact with the annular peripheral portion. In the state where the closed space SP1 is formed, the mold M and the mold holding member 13 exist in the closed space SP1 in addition to the contact portion TC2. Moreover, in order to improve the airtightness of closed space SP1, sealing members, such as each O-ring 33 and 35, are provided. The annular member 17 may be integrated with the molded product installation body 9 instead of the mold holding body 5 or may be simply mounted on the molded product installation body 9. May be.

  More specifically, the annular member 17 includes a base end portion member 30 made of metal (a member having rigidity) such as stainless steel or an aluminum alloy, and a base end portion on the tip end side of the base end portion side member 30. A tip end side member 31 provided integrally with the side member 30 is provided. The distal end side member 31 is configured by a member such as rubber (for example, an O-ring) having elasticity.

  In a state where the mold M and the product W are separated from each other, the lower end portion of the tip end side member 31 is positioned slightly below the lower end portion (lower surface) of the mold M. On the other hand, when an upward force is applied to substantially the entire circumference of the lower end portion of the tip end side member 31, the tip end side member 31 is elastically deformed and the lower end portion of the tip end side member 31 is positioned above the lower end portion of the mold M. It is supposed to be.

  Therefore, immediately before the mold M and the molded product W are brought into contact with each other for transfer (when the mold M and the molded product W are slightly separated from each other), the tip side member 31 and the molded product W are The closed portion SP1 is formed by contact with each other. Further, since the tip end side member 31 is elastically deformed, the mold holding body 5 (mold M) is further lowered by a slight distance while the closed space SP1 is formed, and the molded product W can be pressed by the mold M. It can be done.

  In FIG. 2, in order to make the drawing easier to see, the product to be molded W is drawn, but in the transfer device 1, not the product to be molded W but the mold M and the mold holding body 5 are moved. ing.

  The decompression means 12 includes a vacuum pump 23, for example. The closed space SP1 and the vacuum pump 23 are connected by a flow path 19. A part of the flow path 19 is formed by a through hole provided in the mold holding body 5. A valve 21 for opening and closing the flow path 19 is provided in the middle of the flow path 19.

  Then, when the closed space SP1 is formed under the control of the control device (the mold M and the molded product W are in contact with each other to perform the transfer, the contact portion between the mold M and the molded product W) When the vacuum pump 23 is operated and the valve 21 is opened (when the TC2 is located in the closed space SP1), the inside of the closed space SP1 is depressurized, for example, close to a vacuum.

  Note that the transfer device 1 may be provided with a pressurizing unit 14 for increasing the pressure of the gas (air) in the closed space SP1. The pressurizing means 14 includes, for example, a compressed air pressure source 29. The closed space SP1 and the compressed air pressure source 29 are connected by a flow path 25. A part of the flow path 25 is configured by a through hole provided in the mold holding body 5. A valve 27 for opening and closing the flow path 25 is provided in the middle of the flow path 25.

  Then, under the control of the control device, when the valve 27 is opened after the closed space SP1 is formed and the transfer is completed, the inside of the closed space SP1 is pressurized and the product W can be easily removed from the mold M. It can be done. The compressed air pressure source 29 may be deleted, and the end of the flow path 25 may be open to the atmosphere.

  Next, the operation of the transfer device 1 will be described.

  FIG. 3 is a diagram showing an outline of the operation of the transfer apparatus 1.

First, as an initial state, Remind as in FIG. 3 (a), and the mold M is held by the mold holder 5, the molded article W is installed in the molding installation body 9, the mold carrier 5 rises, and the mold M and the annular member 17 are separated from the product W. The molded product installation body 9 (molded product W) is positioned at an appropriate position in the X-axis direction and the Y-axis direction. Further, it is assumed that the vacuum pump 23 is stopped (it may be operating) and the valves 21 and 27 are closed.

  Under the control of the control device, as shown in FIG. 3 (b), the mold holder 5 is lowered from the initial state in order to perform transfer, and the mold M and the workpiece W are brought into contact with each other. The closed space SP1 is formed, and the contact portion TC2 between the mold M and the workpiece W is positioned in the closed space SP1.

  Subsequently, the vacuum pump 23 is operated and the valve 21 is opened, so that the pressure inside the closed space SP1 is lowered (for example, close to the vacuum) outside the pressure outside the closed space SP1 (eg, near atmospheric pressure), and the mold M is further moved. The transfer material W3 is slightly lowered, presses the workpiece W with the mold M, and irradiates ultraviolet rays to cure the transfer material W3. Note that the pressing force of the pressing is controlled to an appropriate value under the control of the control device based on, for example, a load cell provided in the mold holder 5 and a signal from the load cell.

  When the pressure (atmospheric pressure) in the closed space SP1 is lowered, air (atmosphere) enters a very small gap TC1 between the molded product W and the molded product installation body 9, and the molded product W is elastically deformed by atmospheric pressure. The molded product W follows the mold M, and the pressure at the contact portion TC2 between the mold M and the molded product W is made uniform. That is, in any part of the contact portion TC2 between the mold M and the product W, the contact pressure per minute unit area is substantially equal to each other.

  In the above-described operation, during the transfer, in addition to the atmospheric pressure, the mold M is pressed against the molded product W by using the mold holding body 5 (the mold M and the molded product installation body 9). The molded product W is sandwiched between the mold holder 5 and the pressing by the mold holding body 5 is stopped, and the molded product W is deformed by only atmospheric pressure so as to follow the mold M and the molded product W is You may make it press on the type | mold M. FIG.

  After the transfer, as shown in FIG. 3C, the mold holder 5 is raised to separate the mold M from the workpiece W, the valve 21 is closed, the vacuum pump 23 is stopped, and the valve 27 is opened and closed. If the pressure in the space SP <b> 1 is increased, the molded product W can be easily removed from the mold M. Note that, after the transfer shown in FIG. 3B, the inside of the closed space SP1 may be pressurized simultaneously with the rise of the mold holder 5.

  In this way, the residual film is removed from the molded product W on which the fine transfer pattern is transferred to the transfer material W3. After the residual film is removed, the transfer material W3 is used as a mask material to etch the substrate W1 (for example, dry By etching), a fine pattern corresponding to the fine transfer pattern of the mold M is formed on the substrate W1. After the fine pattern is formed on the substrate W1, the transfer material W3 is removed (cleaned).

Here, the removal of the remaining film is to remove a very thin transfer material film covering the base material W1 with the bottom of the fine concave portion of the transfer material W3 after the transfer by O ₂ ashing or the like. As a result, the surface of the substrate W1 is exposed with a fine pattern similar to the fine transfer pattern of the mold M.

  According to the transfer device 1, when the mold M and the workpiece W are brought into contact with each other for transfer, the contact portion TC2 is positioned in the closed space SP1, and the atmospheric pressure of the closed space SP1 is changed from the atmospheric pressure. By lowering the height, the molded product W is deformed and the pressure at the contact portion TC2 is made uniform, so that accurate transfer can be performed.

  That is, by reducing the pressure, the molded product W is deformed at atmospheric pressure to follow the mold M, and the pressure at the contact portion TC2 (the pressing force between the mold M and the molded product W) is made uniform. The depth of the fine transfer pattern formed on the workpiece W is uniform. In addition, by reducing the pressure at the contact portion TC2 until it becomes almost vacuum, mixing of bubbles into the contact portion TC2 can be prevented, and molding defects due to the generation of bubbles can be reduced.

  Furthermore, since the local closed space SP1 is formed in a narrow range around the contact portion TC2 by the mold holder 5, the annular member 17, and the workpiece W, the configuration of the apparatus can be simplified and the pressure can be reduced. It is possible to reduce the energy for performing the operation as compared with the conventional apparatus, and to reduce the running cost of the apparatus.

Incidentally, in the above description, the molded product W is deformed by reducing the pressure in the closed space SP1, but the mold M may be deformed instead of the deformation of the molded product W. In this case, the installation position of the molded product W shown in FIGS. 1 and 2 and the installation position of the mold M may be exchanged so that the transfer apparatus 1 shown in FIGS. 1 and 2 is turned upside down. The mold is formed into a thin plate like the molded product shown in FIGS. 1 and 2 , and when viewed from the Z-axis direction, the molded product is contained inside the mold. and out with the molding installation body (corresponding to the type carrier shown in FIGS. 1 and 2), it is assumed that the closed space is formed.

  Further, the transfer device 1 may include a gimbal mechanism. That is, the mold holding body 5 shown in FIG. 1 is divided into an upper member that is positioned above and moves up and down relative to the base frame 3 and a lower member that is positioned below and holds the mold M. Then, for example, a concave surface configured using a part of a spherical surface is formed on the upper member, a convex surface configured using a part of the spherical surface is formed on the lower member, and the concave surface of the upper member is The upper member and the lower member are engaged with each other by bringing the convex surface of the lower member into surface contact with each other, and the posture of the lower member relative to the upper member (the rotation angle around the X axis and the Y The rotational angle around the axis may be adjustable.

  The transfer device 1 is located on the back surface of the mold (on the opposite side to the bonding surface) when the mold and the molded product are bonded to each other (contact and pressed as necessary) for transfer. And an evacuation means for evacuating the joint so that atmospheric pressure is applied to at least one of the back surfaces of the molded product.

Further, in the transfer method for transferring the fine transfer pattern formed on the mold to the molded product according to the invention according to the first embodiment, the mold and the molded product are mutually connected to perform the transfer. If Ru is joined to at least said evacuated the junction, the back of the mold, the can be grasped as a method for transferring the atmospheric pressure as according to at least one surface of the back of the molding .

[Second Embodiment]
FIG. 4 is a diagram showing a schematic configuration and operation of a transfer apparatus 1a according to the second embodiment of the present invention.

  The transfer apparatus 1a according to the second embodiment of the present invention is configured in substantially the same manner as the transfer apparatus 1 according to the first embodiment of the present invention, except that the mold M is not held by the mold holder. Thus, the transfer apparatus 1 according to the first embodiment of the present invention has substantially the same effect.

  That is, the transfer device 1 a includes a moving body 5 a, a molded product installation body 9, an annular member 17, and a decompression unit 12 that are configured in the same manner as the transfer device 1.

  The moving body 5a has a flat lower surface that is substantially parallel to and opposite to the surface to which the fine transfer pattern of the molded product W installed in the molded product installation body 9 is transferred. It is movable and positionable relative to a molded product (molded product installed in the molded product installation body 9) W.

The annular member 17 moves the moving body 5a downward to perform transfer , and the moving body 5a comes into contact with the mold M placed on the molding target W held by the molding target installation body 9. The contact part TC2 between the mold M and the molded product W and the surrounding area are positioned in the closed space SP1 in cooperation with the molded product W and the moving body 5a.

  More specifically, the mold M is formed in a thin flat plate shape. The molded product W is also formed in a thin plate shape. The molded product W installed in the molded product installation body 9 is installed (placed) on the planar upper surface of the molded product installation body 9 such that the thickness direction is the vertical direction (Z-axis direction). ) The mold M installed (placed) on the workpiece W also has a vertical direction in the thickness direction, and a fine transfer pattern exists on the lower surface. Further, when viewed from the Z-axis direction, the mold M is housed inside the molded product W (see FIG. 4A).

When the movable body 5a is lowered, the planar lower surface of the movable body 5a comes into contact with the planar upper surface (back surface) of the mold M. When the moving body 5a is lowered to a position just before the lower surface of the moving body 5a contacts the upper surface of the mold M, the tip of the annular member 17 contacts one surface (upper surface) of the product W. Thus, the closed space SP1 is formed by the article to be molded W, the mold holder 5 and the annular member 17 (see FIG. 4B).

  The moving body 5a is further lowered slightly, the lower surface of the moving body 5a is in contact with the upper surface of the mold M, the moving body 5a is further lowered slightly, and the product W and the mold M are moved to the moving body 5a. The closed space SP1 is formed even when sandwiched and pressed between the molded object 9 and the molded object 9 (see FIG. 4B).

  Then, when the inside of the closed space SP1 is depressurized by the depressurizing means 12, uniform transfer is performed in the same manner as in the transfer device 1 (see FIG. 4B).

  After the transfer, if the movable body 5a is lifted together with the mold M and the molded article W and the inside of the closed space SP1 is pressurized (if the decompressed state is released), the molded article W and the mold M are removed from the movable body 5a. Leave easily.

  In addition, it is not necessary to perform the pressing for the transfer (the pressing to the workpiece W by the mold M). That is, the moving body 5a may be stopped at the position where the lower surface of the moving body 5a is in contact with the upper surface of the mold M or just before the contact, and the transfer may be performed only by the decompression by the decompression means 12.

[Third Embodiment]
FIG. 5 is a diagram showing a schematic configuration of a transfer apparatus 1b according to the third embodiment of the present invention.

  The transfer device 1b according to the third embodiment of the present invention relates to the first embodiment of the present invention in that the pressure in the closed space SP3 is made higher than the atmospheric pressure to deform the product W. The transfer device 1 is different from the transfer device 1 in other respects and is configured in substantially the same manner as the transfer device 1 according to the first embodiment of the present invention, and is substantially the same as the transfer device 1 according to the first embodiment of the present invention. There is an effect.

  That is, the transfer device 1 b includes a molded product installation body 9 b, a pressurizing unit, and a mold holder 5 and an annular member 17 that are configured in the same manner as the transfer device 1.

The molded product installation body 9b is configured to install (place) the molded product W while supporting a peripheral portion (for example, an annular peripheral portion) of the molded product W. Inside of the molding installation body 9b, at the 37 recess and the recess (film member composed of e.g. elastic) thin film-like member to cover existing inside of the peripheral portion of the upper surface A closed space SP3 is formed.

  Then, when the inside of the closed space SP3 is pressurized to a pressure higher than the atmospheric pressure by the pressurizing means, the film-like member 37 is deformed (for example, elastically deformed) and is installed on the molded product installation body 9b. The product to be molded W is pushed upward. The pressurizing means includes, for example, a valve 27 and a compressed air pressure source 29.

When pressurization is performed by the pressurizing means, the molded product W held by the molded product installation body 9b by the film member 37 is pushed upward. However, since the sheet M is pressed from above by the mold M (mold holding body 5), the molded product W does not rise without limit. When the pressurization is performed, the part of the molded product W that is in contact with the film-like member 37 is pressed, the molded product W is elastically deformed, and is pressed against the mold M with a uniform pressing force. ing.

[Fourth Embodiment]
FIG. 6 is a diagram showing a schematic configuration of a transfer apparatus 1c according to the fourth embodiment of the present invention.

The transfer device 1c according to the fourth embodiment of the present invention is that the closed space is formed by using a plate-like member (plate-like member) 39 instead of the product W to be molded. The transfer device 1 is different from the transfer device 1 according to the embodiment in other respects, and is configured in substantially the same manner as the transfer device 1 according to the first embodiment of the present invention. The transfer device 1 according to the first embodiment of the present invention is different from the transfer device 1 according to the first embodiment of the present invention. The effect is almost the same.

  That is, the transfer device 1 c includes a mold holder 5, a molded product installation body 9, an annular member 17, and a decompression unit 12 that are configured in the same manner as the transfer device 1.

  The molded product installation body 9 includes a thin plate-like member 39 on the upper surface. The thin plate member 39 is made of, for example, metal and has elasticity. The molded product installation body 9 is configured to install (place) the molded product W with the plate-like member 39 interposed therebetween.

  More specifically, the plate-like member 39 is formed on a flat upper surface of the molded product installation body 9 so as to be formed in a thin flat plate shape with the thickness direction being the vertical direction (Z-axis direction). . The plate-like member 39 substantially covers the upper surface of the molded product installation body 9, but is configured to be slightly smaller than the molded product installation body 9 and positioned inside the molded product installation body 9. There may be. Further, the molded product W is formed smaller than the plate-shaped member 39, and the molded product W placed on the plate-shaped member 39 is positioned inside the plate-shaped member 39 when viewed from the Z-axis direction. doing.

Further, the plate-like member 39, at two locations in the vicinity of the end portion of each other apart (e.g., in the left end portion of FIG. 6, each other that are separated by a perpendicular direction to the plane of FIG. 6 x2), The molded product installation body 9 is integrally provided. The contact portion between the molded product installation body 9 and the plate-shaped member 39 (a very small gap between the upper surface of the molded product installation body 9 and the lower surface of the plate-shaped member 39) TC3 includes air in the atmosphere. Can enter.

  Further, in a state where the molded product W is installed on the plate-shaped member 39, the end of the molded product W comes into contact with an abutment (not shown) provided on the plate-shaped member 39, and the molded product W The molded product W is positioned with respect to the product installation body 9 (plate member 39). In addition, in the state in which the molded product W is installed on the molded product installation body 9 (plate member 39), in addition to the positioning of the molded product W and the above-described placement, the surroundings of the molded product W A part of the end may be clamped.

  The annular member 17 cooperates with the plate-like member 39 and the mold holding body 5 when the mold M and the molded article W are brought into contact with each other for transfer, and the mold M and the molded article W are The contact portion (including the entire mold M and the entire workpiece W) is positioned in the closed space SP5.

  At the time of transfer, the inside of the closed space SP5 is decompressed by the decompression means 12.

  By the way, in each of the transfer devices 1, 1a, 1b, and 1c, the mold holder 5 moves in the Z-axis direction, but instead of or in addition to the mold holder 5 moving in the Z-axis direction. And the to-be-molded product installation body 9 may be configured to move in the Z-axis direction. Similarly, the mold holder 5 may move in the X-axis direction and the Y-axis direction.

  Further, as shown in FIG. 7, when transferring, the mold M and the product W are kept in contact with each other, and the mold M and the product W are in contact with each other such as an elastic body. It is housed in the closed space SP6 of the container 41 made of a thin film, and the inside of the closed space SP6 is depressurized using the vacuum pump 23, and the mold M and the product W are elastically deformed to make the pressing force uniform. Transfer may be performed.

1 is a diagram illustrating a schematic configuration of a transfer apparatus 1 according to an embodiment of the present invention. 1 is a diagram illustrating a schematic configuration of a main part of a transfer device 1. FIG. FIG. 5 is a diagram showing an outline of the operation of the transfer device 1. It is a figure which shows schematic structure and operation | movement of the transfer apparatus 1a which concerns on the 2nd Embodiment of this invention. It is a figure which shows schematic structure of the transfer apparatus 1b which concerns on the 3rd Embodiment of this invention. It is a figure which shows schematic structure of the transfer apparatus 1c which concerns on the 4th Embodiment of this invention. It is a figure which shows the modification of transcription | transfer.

Explanation of symbols

1a, 1b, 1c transfer device 5 type holder 9 the molding installation body 10 closed space forming means 12 decompression means 17 annular member M type W to be molded

Claims (6)

In a transfer device for transferring a fine transfer pattern formed on a mold to a molded product,
Closed space forming means for positioning in the closed space a contact portion where the mold and the molded product are brought into contact with each other for the transfer;
By lowering the atmospheric pressure in the closed space formed by the closed space forming means to be lower than the atmospheric pressure outside the closed space, at least one of the mold and the molded product is placed on the back surface of the closed space. Depressurizing means that deforms by applying an external atmospheric pressure and uniformizes the pressure in the contact portion,
A transfer device characterized by that. In a transfer device for transferring a fine transfer pattern formed on a mold to a molded product,
A molded product installation body for installing the molded product;
A mold holder that holds the mold and is movable and positionable relative to the molded article installation body in a direction approaching and moving away from the molded article installation body;
When the mold and the molded product are brought into contact with each other for the transfer, the contact portion between the mold and the molded product is closed in cooperation with the molded product and the mold holder. An annular member positioned in the space;
Reduced pressure in the closed space, and at least one of the mold and the product to be molded is deformed by applying atmospheric pressure outside the closed space to the back surface thereof, and the pressure in the contact portion is made uniform Having means,
A transfer device characterized by that. In a transfer device for transferring a fine transfer pattern formed on a mold to a molded product,
A molded product installation body for installing the molded product;
A movable body which is movable and positionable relative to the molded article installation body in a direction approaching / separating from the molded article installation body;
When the movable body moves in a direction approaching a mold installed on the molded product installed on the molded product installation body for the transfer, it cooperates with the molded product and the movable body And an annular member for positioning a contact portion between the mold and the article to be molded in a closed space;
A pressure reducing unit that decompresses the inside of the closed space and deforms the molding object by applying an air pressure outside the closed space to the back surface thereof, and uniformizes the pressure in the contact portion;
A transfer device characterized by that. In a transfer device for transferring a fine transfer pattern formed on a mold to a molded product,
With a thin plate-like member;
A molded product installation body in which the molded product is installed with the plate-shaped member interposed therebetween;
A mold holder that holds the mold and is movable and positionable relative to the molded article installation body in a direction approaching and moving away from the molded article installation body;
When the mold and the molded product are brought into contact with each other to perform the transfer, the contact portion between the mold and the molded product is closed in cooperation with the plate member and the mold holder. An annular member positioned in the space;
While reducing the pressure in the closed space, the plate-like member and the product to be molded are deformed by applying a pressure outside the closed space to the back surface of the plate-like member, and the pressure in the contact portion is made uniform. Having means,
A transfer device characterized by that. In it assumed that transfer method using a transfer device according to any one of claims 1 to 4,
Before SL be-molded article, a flat plate shaped base material is configured by a thin provided the film-like transfer material on one surface in the thickness direction of the substrate,
The type of fine transfer pattern Ru is transferred to the transfer material,
A transfer method characterized by the above. A fine transfer pattern formed on the mold, the transfer method it transferred to the molded article,
By lowering the pressure in the closed space below the pressure outside the closed space by positioning a contact portion in which the mold and the molded article are in contact with each other to perform the transfer in the closed space, at least one of said mold and the object to be molded, is deformed over the air pressure outside the said closed space on the back, equalize the pressure at the contact portion,
Transfer how, characterized in that.

Images