JP2012045842A - Transfer device and transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer device which can prevent separation of a mold or a molded object from a correspondent installation body in mold releasing.SOLUTION: The transfer device is constituted to have: a mold installation body 13 for installing a mold M; and a molded object installation body 21 for installing the molded object W and freely moving relatively to the mold installation body 13. The molded object installation body 21 is constituted to hold the molded object W by vacuum suction. When the mold M is released from the molded body W after a fine transfer pattern is transferred to the molded object W by pressing the mold M to the molded body W by getting the mold installation body 13 and the molded object installation body 21 close to each other, a room R is formed to inside include the mold M, the molded object W, a mold installation part 13m in which the mold M of the mold installation body 13 is installed, and a molded object part 21w in which the molded object W of the molded object installation body 21 is installed, and the air pressure in the room R is made higher than the atmospheric pressure in order to increase the holding force by vacuum suction.

Description

  The present invention relates to a transfer apparatus and a transfer method for transferring a fine transfer pattern formed on a mold to a product to be molded.

  In recent years, a fine transfer pattern is formed on a quartz substrate or the like by an electron beam drawing method to form a mold (mold), and the transfer pattern formed on the mold by pressing the mold with a predetermined pressure on the molded product. Research and development has been conducted on nanoimprint technology for transferring images onto a substrate (for example, see Non-Patent Document 1).

  An imprint method using a lithography technique has been devised as a method for forming a nano-order fine transfer pattern at a low cost.

  This molding method is roughly classified into a UV (ultraviolet) imprint method and a thermal imprint method.

  In the UV imprint method, a transparent mold that transmits light is used, the mold is pressed against the UV curable liquid, and the UV curable liquid is cured by irradiating with UV radiation for an appropriate time to form a fine transfer pattern in the UV curable liquid. After the transfer, the mold is pulled away from the UV curable liquid (molded product).

  In the thermal imprint method, a mold is pressed onto a substrate made of a thermoplastic polymer, and the substrate (thermoplastic polymer) is heated to a temperature at which the thermoplastic polymer can sufficiently flow to form a resin (thermoplastic resin) in a fine transfer pattern. After the polymer is introduced, the mold and the substrate are cooled to below the glass transition temperature, the fine transfer pattern transferred to the substrate is solidified, and the mold is pulled away from the substrate.

  Recently, in rotary storage devices such as hard disks, CDs, and DVDs, there is an interest in a method of utilizing the above-described nanoimprint technology as a means for forming a storage medium (recording medium) for forming high-density data on a disk. It's getting higher.

Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology 25 (2001) 192-199

  By the way, when separating the mold from the molded product (releasing the mold), the transfer pattern is fine, so the adhesive force between the mold and the molded product is large (strong), and the mold and the molded product are compatible with the installation body. The inconvenience of leaving will occur.

  The present invention has been made to solve the above inconveniences, and provides a transfer device and a transfer method capable of preventing a mold or a molded product from being separated from a corresponding installation body when releasing the mold. is there.

  The invention according to claim 1 is a transfer device for transferring a fine transfer pattern formed on a mold to a molded product, wherein a mold installation body for installing the mold, and the molded product are installed. , A molded product installation body that is relatively movable with respect to the mold installation body, and at least one of the mold installation body and the molded product installation body is vacuum-adsorbed to form the mold and the molded product. The fine transfer pattern is transferred to the molded product by holding the mold installation body and the molded product installation body close to each other and pressing the mold against the molded product. The mold, the molded product, the mold installation site where the mold of the mold installation body is installed, and the molded product of the molded product installation body when the mold is separated from the molded product Form a room where the molded product installation site where the , Characterized in that it is configured to be higher than atmospheric pressure to atmospheric pressure in the room to increase the holding force by the vacuum suction.

  The invention according to claim 2 is a transfer device for transferring a fine transfer pattern formed on a mold to a molded product, a first installation body for installing the mold or the molded product, A second installation body on which the mold or the molded product is installed and movable relative to the first installation body, the first installation body and the second installation body; At least one of which is configured to hold the mold and the molded article by vacuum suction, and the first installation body and the second installation body are brought close to each other to bring the mold into the molded article. After the fine transfer pattern is transferred to the molded product by pressing, the mold, the molded product, and the first and second installation bodies are separated when the mold is released from the molded product. Form a room into which the mold and the installation site where the molded product is installed enter. Characterized in that it is configured to be higher than atmospheric pressure to atmospheric pressure in the room to increase the holding force by the vacuum suction.

  According to a third aspect of the present invention, in the transfer device according to the first or second aspect, a contact portion between the mold and the molded product when the fine transfer pattern is transferred to the molded product. On the outside, a mold pressure receiving part that presses the mold away from the mold by atmospheric pressure higher than atmospheric pressure, and a mold that pushes the molded article away from the mold by atmospheric pressure higher than atmospheric pressure At least one of the product pressure receiving portion is formed.

  According to a fourth aspect of the present invention, a fine transfer pattern formed on a mold is transferred to a molded product using the transfer device according to any one of the first to third aspects. This is a transfer method.

  According to this invention, when the mold is separated from the product to be molded (released), the interior of the room becomes higher than the atmospheric pressure, so that it is possible to prevent the mold and the product from being separated from the corresponding installation body. .

1 is a partially cutaway front view showing a schematic configuration of a transfer apparatus according to a first embodiment of the present invention. It is explanatory drawing which shows the outline | summary of the transcription | transfer by UV imprint method. It is explanatory drawing which shows the circumference | surroundings of the contact site | part of the type | mold and to-be-molded product shown in FIG. It is explanatory drawing which shows the effect | action of a type | mold pressure receiving part and a to-be-molded product pressure receiving part. FIG. 2 is an operation explanatory diagram of the transfer device shown in FIG. 1. It is a front view which partially fractures and shows schematic structure of the transfer apparatus which is 2nd Example of this invention. FIG. 7 is a front view showing a schematic configuration of a transfer device according to a third embodiment of the present invention, partially broken away. It is a front view which partially fractures and shows schematic structure of the transfer apparatus which is 4th Example of this invention. It is a front view which partially fractures and shows schematic structure of the transfer apparatus which is 5th Example of this invention. It is explanatory drawing which shows the outline | summary of the transcription | transfer by a thermal imprint method.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a partially cutaway front view showing a schematic configuration of a transfer apparatus according to a first embodiment of the present invention.

  The transfer device (nanoimprint device) 1 is a device for transferring a fine transfer pattern formed on a mold M to a molding product (molding material) W in the atmosphere.

  The mold M is, for example, a flat plate made of quartz glass that transmits light, and has a fine transfer pattern (for example, the height and pitch of the unevenness is a wavelength of visible light on one surface (for example, the lower surface) Ma in the thickness direction. A transfer pattern formed with fine irregularities having a size of about 10 mm is formed.

  The product to be molded W is, for example, a base material W1 configured in a flat plate shape with silicon or glass and a film-like transfer material (for example, thinly provided on one surface (for example, the upper surface) W1a of the base material W1 (for example, , UV curable resin) W3, and the fine transfer pattern of the mold M is transferred to one surface (upper surface) W3a of the transfer material W3.

  Examples of the molded product W include an information recording disk (for example, a DVD-ROM, a recording medium for a hard disk), a light guide plate of a backlight of a liquid crystal display device, and the like.

  The transfer is performed, for example, by the UV imprint method described above.

  Here, transfer by the UV imprint method will be briefly described with reference to FIG.

  First, in the state shown in FIG. 2 (a), the mold M is moved in the direction of the arrow, and as shown in FIG. 2 (b), the product W is pressed with a predetermined force (small force). The transfer material (UV curable resin) W3 is cured by irradiating ultraviolet rays.

  Then, when the mold M is moved in the direction of the arrow shown in FIG. 2B and the mold M is separated (released) from the molded product W, as shown in FIG. A fine transfer pattern is transferred onto the transfer material W3).

  Up to here, the transfer is performed using the transfer device 1.

After the above transfer, the state shown in FIG. 2D is obtained by performing the remaining film removal process by O ₂ ashing or the like in the state shown in FIG.

  Here, the remaining film is a bottom part of a fine recess of the transfer material W3 after transfer, and is a thin film covering the base material W1.

  In the state shown in FIG. 2D, a fine transfer pattern is formed on the substrate W1 by etching, using the cured transfer material W3 as a masking member, as shown in FIG.

  Thereafter, by removing the cured transfer material W3 with, for example, a solvent, the transfer of the fine transfer pattern onto the substrate W1 is completed as shown in FIG.

  When the fine transfer pattern formed on the mold M as described above is transferred to the molded product W, as shown in FIGS. 3 (a), 3 (b) and 4, the mold M and the molded product. On the outside of the contact part C with W, the mold receiving part Mc that circulates and presses the mold M in the direction away from the molded product W by the atmospheric pressure higher than the atmospheric pressure, and the molded product W by the atmospheric pressure higher than the atmospheric pressure. There is provided a molded product pressure receiving portion Wc that is rotated in a direction away from the mold M.

  The mold pressure receiving portion Mc is formed by a portion of the mold M that does not contact the molded product W, and the molded product pressure receiving portion Wc is formed by a portion of the molded product W that does not contact the mold M.

  3A shows a case where the mold M and the molded product W are circular in plan view, and FIG. 3B shows a case where the mold M and the molded product W are rectangular (square) in plan view. Yes.

  Returning to FIG. 1, the transfer device 1 includes a base body 11.

  The base body 11 is provided with a mold installation body 13, a molded product installation body 21, a control unit 41 that controls each part, and the like.

  The above-described mold installation body 13 is provided integrally with the base body 11 via a linear guide bearing (not shown) and is movable via an actuator such as a servo motor and a ball screw (molded product installation body). 21).

  The mold installation body 13 includes a flat mold installation surface 13a on the lower side. For example, the mold installation member 17 is attached to the mold installation body 13 with bolts (not shown) in the thickness direction of the mold M. The other surface (a planar upper surface on which a fine transfer pattern is not formed) Mb is brought into contact (surface contact) with the mold installation surface 13a to install the mold M.

  The mold installation body 13 is provided with a backup body attachment hole 13b on the lower side, and a through hole 13c that communicates with the backup body attachment hole 13b and penetrates to the upper side. Second and third flow paths 13f and 13g penetrating to the side surfaces are provided.

  A back-up glass (back-up body) 15 having translucency is airtightly attached in the backup body mounting hole 13a of the mold installation body 13, and the upper side of the mold installation body 13 is passed from the through hole 13c to the backup glass 15. And an ultraviolet ray generator 19 for irradiating ultraviolet rays (UV).

  The mold installation surface 13 a is also formed by the flat surface of the backup glass 15.

  The molded product installation body 21 described above includes a planar molded product installation surface 21a facing the mold installation surface 13a of the mold installation body 13, and the other surface in the thickness direction of the molded product W (base material W1). The molding material W is installed by bringing the planar lower surface (W1b) on which the transfer material W3 is not provided into contact (surface contact) with the molding product installation surface 21a.

  And the to-be-molded product installation body 21 is provided with an annular groove 21d that circulates inside the portion of the to-be-molded product installation surface 21a that comes into contact with the to-be-molded product W. A fourth flow path 21e is provided for communication and opening.

  A room forming member 31 for forming the room R is attached to the lower surface of the mold installation body 13 described above.

  Here, the room R means that the mold installation body 13 and the molded product installation body 21 are brought close to each other and the mold M is pressed against the molded product W to transfer a fine transfer pattern to the molded product W. When the mold M is separated from the molded product W after the transfer, the mold M, the molded product W, the mold installation site 13m where the mold M of the mold installation body 13 is installed, and the molded product installation body 21 covered This is a space in which the molded product installation site 21w in which the molded product W is installed enters the inside (inside).

  The room forming member 31 includes a cylindrical bellows 31a whose upper end is airtightly attached to the lower surface of the mold installation body 13, and an annular O-ring installation body 31b airtightly attached to the lower end of the bellows 31a. The O-ring installation body 31b is configured by an O-ring 31c attached in such a manner as to protrude downward from the O-ring installation body 31b in an annular groove 31bb formed on the lower surface side of the O-ring installation body 31b.

  A second pressure reducing mechanism 35 is connected to the fourth flow path 21e, a third pressure reducing mechanism 37 is connected to the second flow path 13f, and a pressure is applied to the third flow path 13g. A mechanism 39 is connected.

  The second pressure reducing mechanism 35 described above is for holding the molded product W on the molded product installation body 21, the second opening / closing valve 35 a connected to the fourth flow path 21 e, and the second opening / closing valve 35 a. The second vacuum pump 35b is connected to the open / close valve 35a.

  The annular groove 21d, the fourth flow path 21e, and the second decompression mechanism 35 constitute a molded product holding mechanism.

  The third decompression mechanism 37 is used to evacuate the room R, and is connected to the third opening / closing valve 37a connected to the second flow path 13f and the third opening / closing valve 37a. It is comprised with the 3rd vacuum pump 37b.

  The second flow path 13f and the third decompression mechanism 37 constitute a vacuum evacuation mechanism.

  The pressurizing mechanism 39 pressurizes the interior of the room R to an atmospheric pressure higher than atmospheric pressure, for example, 1200 hPa to 3000 hPa. The fourth open / close valve 39a connected to the third flow path 13g, And a pressurizing pump 39b connected to the fourth on-off valve 39a.

  The third flow path 13g and the pressurizing mechanism 39 constitute an overpressure control mechanism.

  Next, the operation of the transfer apparatus 1 will be described with reference to FIG.

  As an initial state, as shown in FIG. 1, the mold M is held by the mold mounting member 13 by the mold mounting member 17, the molded product W is held by the molded product mounting body 21 by vacuum suction, and each open / close valve 37 a, 39a is closed.

  In the state of FIG. 1, for example, when a start switch (not shown) of the transfer device 1 is pressed, the mold installation body 13 is lowered under the control of the control device 41, and the O-ring 31 c is moved to the molded product installation body. Then, the mold installation body 13 starts to come into contact with the molded product installation surface 21a of 21 and descends by a predetermined distance (a slight distance) and approaches the molded product installation body 21 (see FIG. 5A).

  In this state, the bellows 31a and the O-ring 31c are slightly elastically deformed, and the room R is formed by the mold installation body 13, the molded product installation body 21, and the room forming member 31, but the mold M and the molded product. It is slightly separated from W.

  Subsequently, the third open / close valve 37a is opened and the third vacuum pump 37b is operated, so that the atmospheric pressure in the room R is lower than the atmospheric pressure outside the room R (for example, atmospheric pressure) (for example, close to vacuum). ), The mold M is further lowered slightly, the molded product W is pressed by the mold M, and the ultraviolet ray generator 19 is operated to irradiate the ultraviolet ray to cure the transfer material W3 (see FIG. 5B). .

  The pressing force for pressing the mold M against the workpiece W is controlled to an appropriate value under the control of the control unit 41 based on a signal from the load cell provided in the mold installation body 13, for example. Shall.

  When the pressure (atmospheric pressure) in the room R is lowered, air (atmosphere) enters a very small gap between the molded product W and the molded product installation body 21, and the molded product W is elastically deformed. Follows the mold M, and the pressure at the contact portion C between the mold M and the workpiece W is equalized.

  That is, in any part of the contact part C between the mold M and the product W, the contact pressures per minute unit area are substantially equal to each other.

  After the transfer described above, as shown in FIG. 5C, when the mold installation body 13 is raised to separate the mold M from the product W, the third open / close valve 37a is closed and the third vacuum pump 37a is turned on. While stopping, the 4th opening-and-closing valve 39a is opened, the pressurization pump 39b is operated, and the pressure in the room R is raised above atmospheric pressure.

  When the mold M is separated from the workpiece W in this way, if the pressure in the room R is increased above the atmospheric pressure, the mold pressure receiving part Mc provided in the mold M causes the mold M to be moved by the atmospheric pressure higher than the atmospheric pressure. Pressed in the direction away from the molded product W, the molded product pressure receiving portion Wc provided in the molded product W is pressed in the direction away from the mold M by the atmospheric pressure higher than atmospheric pressure, When the molded product W is separated from the peripheral edge of the contact portion C, the mold M is easily separated from the molded product W.

  Then, by further raising the mold installation body 13 to a predetermined position, the initial state shown in FIG. 1 and FIG. 5D is obtained, the fourth open / close valve 39a is closed, the pumps 35b and 39b are stopped, and the transfer is performed. The molded product W that has been subjected to the removal is removed from the molded product installation body 21, and the next molded product W that has not been transferred is vacuum-sucked by the molded product holding mechanism.

  In this way, the remaining film of the molding product W having the fine transfer pattern transferred onto the transfer material W3 is removed, and after the remaining film is removed, the transfer material W3 is used as a mask material to etch the substrate W1 (for example, dry etching). ), A fine pattern corresponding to the fine transfer pattern of the mold M is formed on the substrate W1. After the fine pattern is formed on the substrate W1, the transfer material W3 is removed (cleaned).

  In addition, although demonstrated as what the type | mold installation body 13 moves, it may replace with or add to the type | mold installation body 13, and the structure to which the to-be-molded product installation body 21 moves to the up-down direction of FIG.

  Moreover, although it demonstrated as a structure which hold | maintains only the to-be-molded product W in the to-be-molded product installation body 21 by vacuum suction, while hold | maintaining the type | mold M to the mold installation body 13 by vacuum suction, and to-be-molded product W by vacuum suction Even if the molded product installation body 21 is held, the mold M is held on the mold installation body 13 by vacuum suction, and the molded product W is held on the molded product installation body 21 by the molded product mounting member. Good.

  In addition, the configuration has been described in which the mold pressure receiving portion Mc is provided on the outer periphery of the mold M and the molded product pressure receiving portion Wc is provided on the outer periphery of the molded product W. Only the product W may be provided with a molded product pressure receiving portion Wc. In this case, the mold pressure receiving portion Mc or the molded product pressure receiving portion Wc may not be provided around.

  According to the transfer device 1 of one embodiment of the present invention, even when the room R is depressurized, the O-ring 31c continues to contact the molded product installation body 21 and maintains the depressurized state of the room R. It is possible to reliably prevent the occurrence of defects such as bubbles generated in the molded product W during the transfer.

  Further, since the molded product W is held by the molded product installation body 21 by the molded product holding mechanism, the molded product W can be easily replaced.

  In addition, when the mold installation body 13 is moved in a direction away from the molding product installation body 21 so as to separate the mold M from the molding product W after the transfer, the pressure in the room R is made higher than the atmospheric pressure. Even if the molded product installation body 21 holds the molded product W with a large force and a force is applied to release the molded product W from the molded product installation body 21 during release, the mold M and the molded product W are applied. Can be prevented from separating the molded product W from the molded product installation body 21.

  In addition, since the mold pressure receiving portion Mc is provided in the mold M and the molded product pressure receiving portion Wc is provided in the molded product W, when the pressure in the room R becomes higher than the atmospheric pressure during mold release, The part Mc is pressed in a direction to separate the mold M from the molded product W by the atmospheric pressure higher than the atmospheric pressure, and the molded product pressure receiving part Wc is pressed in a direction to separate the molded product W from the mold M by the atmospheric pressure higher than the atmospheric pressure. The mold M and the molded product W are separated from the periphery of the contact portion C, whereby the mold M can be easily separated (disconnected) from the molded product W, and the mold M can be prevented from being separated from the mold installation body 13. In addition, the molded product W can be prevented from leaving the molded product installation body 21.

  FIG. 6 is a front view showing the schematic configuration of the transfer apparatus according to the second embodiment of the present invention, partially broken away, and is the same as the part shown in FIGS. 1 to 5 or the part shown in FIGS. Corresponding portions are denoted by the same reference numerals, and description thereof is omitted.

  In FIG. 6, illustration of a part of the components shown in FIG. 1 is omitted.

  The transfer apparatus 1A of the second embodiment is different from the transfer apparatus 1 of the first embodiment in that the mold M is held on the mold installation body 13 by a mold holding mechanism by vacuum suction.

  That is, the mold installation body 13 is provided with an annular groove 13d that circulates inside the portion of the mold installation surface 13a that contacts the mold M, and the annular groove 13d is, for example, a first that communicates with and opens to the side surface. The flow path 13e is provided.

  The first pressure reducing mechanism 33 is connected to the first flow path 13e.

  The first decompression mechanism 33 described above is for holding the mold M on the mold installation body 13, and includes a first opening / closing valve 33a connected to the first flow path 13e, and the first opening / closing valve 33a. The first vacuum pump 33b is connected to the first vacuum pump 33b.

  The annular groove 13d, the first flow path 13e, and the second pressure reducing mechanism 35 constitute a mold holding mechanism.

  The description of the operation and the like is the same as in the previous embodiment, and will be omitted.

  In the transfer device 1A of the second embodiment, the same effect as that of the transfer device 1 of the first embodiment can be obtained.

  FIG. 7 is a partially cutaway front view showing a schematic configuration of a transfer apparatus according to a third embodiment of the present invention. In FIG. 7, the same part as shown in FIGS. 1 to 6 or the part shown in FIGS. Corresponding portions are denoted by the same reference numerals, and description thereof is omitted.

  In FIG. 7, illustration of a part of the components shown in FIGS. 1 to 6 is omitted.

  The transfer device 1B of the third embodiment is different from the transfer device 1A of the second embodiment in that the molded product mounting member 23 is mounted on the molded product installation body 21 with bolts or the like which are not shown in the drawing. The other surface in the thickness direction of the product W (the planar lower surface of the base material W1 on which the transfer member W3 is not formed) W1b is brought into contact (surface contact) with the molding product installation surface 21a, and the molding product W is installed. It is where it is done.

  The description of the operation and the like is the same as in the previous embodiment, and will be omitted.

  In the transfer device 1B of the third embodiment, the same effect as that of the transfer device 1 of the first embodiment can be obtained.

  FIG. 8 is a partially cutaway front view showing a schematic configuration of a transfer apparatus according to a fourth embodiment of the present invention. In FIG. 8, the same part as that shown in FIGS. 1 to 7 or the part shown in FIGS. Corresponding portions are denoted by the same reference numerals, and description thereof is omitted.

  In FIG. 8, illustration of a part of the components shown in FIGS. 1 to 7 is omitted, and the illustration is omitted. However, the molded product installation body is provided with holes and holes, a backup glass, and an ultraviolet generator. Is attached.

  The transfer device 1C of the fourth embodiment is different from the transfer device 1A of the second embodiment in that the mold installation body 13 is used as the first installation body 13A and the mold M is installed, and the molded product installation body 21 is used. The second installation body 21A is used to install the mold M, and the transfer material W3 is provided on both surfaces of the base material W1 to form the molded product WA.

  Since the description of the operation and the like is the same as in the previous embodiment, it will be omitted. However, the molded product WA is placed between the molds M (or on the lower mold M) by an appropriate mechanism (means). Installed.

  In the transfer device 1C of the fourth embodiment, the same effect as that of the transfer device 1 of the first embodiment can be obtained.

  FIG. 9 is a partially cutaway front view showing a schematic configuration of a transfer apparatus according to a fifth embodiment of the present invention. In FIG. 9, the same part as shown in FIGS. 1 to 8 or the part shown in FIGS. Corresponding portions are denoted by the same reference numerals, and description thereof is omitted.

  9, illustration of a part of the components shown in FIGS. 1 to 8 is omitted.

  The transfer device 1D of the fifth embodiment is different from the transfer device 1C of the fourth embodiment in that the molding product W is installed on the first installation body 13A and the second installation body 21A, and on both sides (upper , The lower surface) is formed into a mold MA by forming a fine transfer pattern.

  The description of the operation and the like is the same as in the previous embodiment, and will be omitted. However, the mold MA is placed between the molded products W (or above the lower molded product W by an appropriate mechanism (means)). ).

  In the transfer device 1D of the fifth embodiment, the same effect as that of the transfer device 1 of the first embodiment can be obtained.

  FIG. 10 is an explanatory diagram showing an outline of transfer by the thermal imprint method.

  In the case of the thermal imprint method, the transfer device takes charge of the steps shown in FIGS.

  In the case of the thermal imprint method, the mold M is made of metal, quartz glass, or the like, and the molded product W is made of a thermoplastic resin or the like.

  10A, at least the workpiece W is heated by a heater, the mold M is moved in the direction of the arrow shown in FIG. 10A, and the mold M is molded as shown in FIG. 10B. The product W is pressed.

  Then, after the molded product W is heated to a temperature at which the transfer portion of the molded product W can sufficiently flow, a part of the molded product W is caused to flow into a fine transfer pattern, and then the mold M and the molded product The W is cooled by a Peltier element or the like until it becomes lower than the glass transition temperature, and the fine transfer pattern transferred to the product W is solidified.

  Then, when the mold M is moved in the direction of the arrow shown in FIG. 10B and the mold M is moved away from the molding target W, a fine transfer pattern is formed on the molding target W as shown in FIG. Transcribed.

  When transferring by this thermal imprinting method, in the previous embodiment, for example, a heater or a Peltier element is embedded in the molded product installation body 21 or the second installation body 21A, and the molded product W is heated. By adopting a configuration for controlling the above, it is possible to transfer the fine transfer pattern of the mold M onto the product W.

DESCRIPTION OF SYMBOLS 1 Transfer apparatus 1A-1D Transfer apparatus 11 Base body 13, 13A Mold installation body 13a Mold installation surface 13b Backup body attachment hole 13c Through hole 13d Annular groove 13e First flow path 13f Second flow path 13g Third flow path 13m type installation site 15 Backup glass (backup body)
17 Mold mounting member 19 UV generator 21, 21 A Molded product installation body 21 a Molded product installation part surface 21 d Annular groove 21 e Fourth channel 21 w Molded product installation site 23 Molded product installation member 31 Room forming member 31 a Bellows 31b O-ring installation body 31bb Annular groove 31c O-ring 33 First decompression mechanism 33a First on-off valve 33b First vacuum pump 35 Second decompression mechanism 35a Second on-off valve 35b Second vacuum pump 37 Third Pressure reducing mechanism 37a third on-off valve 37b third vacuum pump 39 pressurizing mechanism 39a fourth on-off valve 39b pressurizing pump 41 control unit M, MA type Ma one side Mb other side Mc type pressure receiving unit W, WA Molded product W1 Base material W1a One side W1b The other side W3 Transfer material W3a One side Wc Molded product pressure receiving part C Site R room touch

Claims (4)

In a transfer device for transferring a fine transfer pattern formed on a mold to a molded product,
A mold installation body for installing the mold;
The molded product is installed, and has a molded product installation body that is relatively movable with respect to the mold installation body,
At least one of the mold installation body and the molded product installation body is configured to hold the mold and the molded product by vacuum suction,
The fine transfer pattern is transferred to the molded product by bringing the mold installation body and the molded product installation body close to each other and pressing the mold against the molded product, and then from the molded product. When the mold is released, the mold, the molded product, a mold installation site where the mold of the mold installation body is installed, and a molded product installation where the molded product of the molded product installation body is installed Forming a room where the part enters, and configured to increase the atmospheric pressure in the room higher than the atmospheric pressure in order to increase the holding force by the vacuum adsorption,
A transfer device characterized by that. In a transfer device for transferring a fine transfer pattern formed on a mold to a molded product,
A first installation body for installing the mold or the molded article;
Installing the mold or the molded article, and having a second installation body movable relative to the first installation body,
At least one of the first installation body and the second installation body is configured to hold the mold and the article to be molded by vacuum suction,
After the first installation body and the second installation body are brought close to each other and the mold is pressed against the molded product, the fine transfer pattern is transferred to the molded product, and then the molded product When separating the mold from the product, forming the mold, the molded product, the mold of the first and second installation bodies, a chamber into which the installation site where the molded product is installed enters, The atmospheric pressure in the room is configured to be higher than the atmospheric pressure in order to increase the holding force by vacuum adsorption,
A transfer device characterized by that. In the transfer device according to claim 1 or 2,
When the fine transfer pattern is transferred to the molded product, the mold is pressed outside the contact area between the mold and the molded product in a direction away from the molded product by atmospheric pressure higher than atmospheric pressure. At least one of a mold pressure receiving portion and a molded product pressure receiving portion that presses the molded product in a direction away from the mold by an atmospheric pressure higher than atmospheric pressure,
A transfer device characterized by that. A fine transfer pattern formed on a mold using the transfer device according to any one of claims 1 to 3 is transferred to a product to be molded.
A transfer method characterized by the above.

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