TWI763593B - Microstructure manufacturing apparatus and microstructure manufacturing method - Google Patents
Microstructure manufacturing apparatus and microstructure manufacturing method Download PDFInfo
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- TWI763593B TWI763593B TW110136200A TW110136200A TWI763593B TW I763593 B TWI763593 B TW I763593B TW 110136200 A TW110136200 A TW 110136200A TW 110136200 A TW110136200 A TW 110136200A TW I763593 B TWI763593 B TW I763593B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7555—Mechanical means, e.g. for planarising, pressing, stamping
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Abstract
本發明提供一種微小構造物製造裝置,其能夠進行藉由內壓差的控制變更分離之凹凸部的接合、追加按壓及被接合之凹凸部的分離的反向操作。上述微小構造物製造裝置的特徵為,具備:變壓室,其形成於腔室的內部並以進出自如的方式收容第一板狀構件及第二板狀構件;變動部,設置在收容於變壓室之第一板狀構件的第一非對置面與腔室的第一室內表面之間;保持部,設置在收容於變壓室之第二板狀構件的第二非對置面與腔室的第二室內表面之間;第一空間部,在腔室的第一室內表面及變動部之間與變壓室分離而設置成氣密狀;室壓調整部,使變壓室或第一空間部中的任一者的內壓比另一者的內壓上升更多;及控制部,對室壓調整部進行作動控制,變動部具有變位部位,該變位部位相對於腔室的第一室內表面與第一板狀構件的第一非對置面沿厚度方向變形或移動自如地抵接,保持部具有保持部位,該保持部位相對於腔室的第二室內表面支撐第二板狀構件的第二非對置面,控制部藉由基於室壓調整部的作動之變壓室與第一空間部的壓力差控制第一板狀構件與變動部的變位部位一同朝向第二板狀構件或第一空間部移動。The present invention provides an apparatus for manufacturing a microstructure capable of performing reverse operations of changing the joining of the separated concavo-convex portions, additional pressing, and separation of the joined concavo-convex portions by controlling the internal pressure difference. The above-mentioned microstructure manufacturing apparatus is characterized by comprising: a transformer chamber formed inside the chamber and accommodating the first plate-shaped member and the second plate-shaped member freely in and out; between the first non-opposing surface of the first plate-shaped member of the pressure chamber and the first inner surface of the chamber; the holding part is arranged between the second non-opposing surface and the second non-opposing surface of the second plate-shaped member accommodated in the transformer chamber. between the second interior surfaces of the chamber; the first space part is separated from the transformer chamber between the first interior surface of the chamber and the variable part to be airtight; the chamber pressure adjustment part makes the transformer chamber or The internal pressure of any one of the first space parts rises more than the internal pressure of the other; and the control part controls the operation of the chamber pressure adjustment part, and the variable part has a displacement part relative to the cavity The first inner surface of the chamber is in contact with the first non-opposing surface of the first plate-like member in a deformable or movable direction in the thickness direction, and the holding portion has a holding portion that supports the first non-opposing surface of the chamber with respect to the second inner surface of the chamber. On the second non-opposing surfaces of the two plate-like members, the control portion controls the first plate-like member and the displacement portion of the variable portion to face together by the pressure difference between the transformation chamber and the first space portion based on the operation of the chamber pressure adjustment portion The second plate-shaped member or the first space portion moves.
Description
本發明有關一種微小構造物製造裝置及使用了微小構造物製造裝置之微小構造物的製造方法,該微小構造物製造裝置用於製造包含微型LED、微晶片等微小元件之微小構造體,藉由奈米壓印等微細加工技術成形加工之微小成形物,由包含玻璃小片之微小絕緣片等構成之微小構造物。 具體而言,有關一種用於被分離之微小構造物的接合、追加按壓或被接合之微小構造物的分離(剝離)或者微小構造物的轉印等之微小構造物製造裝置及微小構造物的製造方法。 The present invention relates to a microstructure manufacturing apparatus and a microstructure manufacturing method using the microstructure manufacturing apparatus. The microstructure manufacturing apparatus is used for manufacturing microstructures including microscopic components such as micro LEDs and microchips. Micro-molded objects formed by micro-processing techniques such as rice imprinting, micro-structures composed of micro-insulation sheets including glass chips, etc. Specifically, it relates to a microstructure manufacturing apparatus and a microstructure for joining, additionally pressing, or separating (peeling) the joined microstructures, or transferring the microstructures to be separated. Manufacturing method.
以往,作為該種微小構造物製造裝置,有一種脫模裝置,其具備:防剝離機構,以至少一者為膜狀的模具與被成形物到既定剝離位置為止不會剝離的方式加壓;保持部,其保持模具或被成形物中的任一者;張力賦予機構,對模具或被成形物賦予張力;及移動機構,其使防剝離機構與模具及被成形物相對移動(例如,參考專利文獻1)。
藉由奈米壓印技術,將模具的成形圖案加壓至樹脂等被成形物,藉由利用熱、光,將成形圖案轉印至被成形物之後,將模具從被成形物分離。
在專利文獻1的圖示例中具備一種角度調節機構,其相對於被保持部保持的被成形物,將具有撓性之形成為膜狀之模具從剝離位置剝離,並將剝離後的模具與被成形物之間的角度調節成一定角度。亦即,藉由角度調節機構,以一定的脫模角度從被成形物斜向抽出模具的成形圖案。
[先前技術文獻]
[專利文獻]
Conventionally, as such a microstructure manufacturing apparatus, there is a mold release device including a peeling prevention mechanism that pressurizes at least one of a film-shaped mold and a to-be-molded object so as not to peel off until a predetermined peeling position is reached; A holding part that holds either the mold or the object to be molded; a tension imparting mechanism that imparts tension to the mold or the object to be molded; and a moving mechanism that relatively moves the peeling prevention mechanism to the mold and the object to be molded (for example, refer to Patent Document 1).
Using the nanoimprint technology, the molding pattern of the mold is pressed to a molded object such as resin, and the molding pattern is transferred to the molding object by using heat and light, and then the mold is separated from the molding object.
The example shown in
[專利文獻1]國際公開第2015/072572號[Patent Document 1] International Publication No. 2015/072572
[發明所欲解決之問題][Problems to be Solved by Invention]
然而,在專利文獻1中,相對於轉印至被成形物之凹凸圖案,以既定角度斜向抽出模具的成形圖案,因此在剝離過程中被成形物的凹凸圖案發生形狀變形而導致產生損傷。
具體而言,對圖15(a)~圖15(c)所示之奈米壓印的情況進行說明。
在圖15(a)所示之剝離前的狀態下,藉由與模具100的成形圖案110的凹凸接合,轉印至被成形物200之凹凸圖案210相對於被成形物200的底面220以垂直狀立起。
然而,在圖15(b)所示之剝離時的狀態下,隨著斜向抽出模具100的成形圖案110,被成形物200的凹凸圖案210中凸狀部211發生倒塌。
因此,在圖15(c)所示之剝離後的狀態下,一旦倒塌的凹凸圖案210的凸狀部211會維持倒塌狀態而不會恢復剝離前的狀態。
如此,從被成形物200的凹凸圖案210抽出模具100的成形圖案110之方向(剝離方向)為斜向時,尤其凹凸圖案210的凹凸差越長,越容易發生形狀變形(倒塌)而存在無法實現高精度的壓印成形的問題。
尤其,在奈米壓印的情況下,由於凹凸圖案極其微細,因此即使剝離時的微小形狀變形(倒塌)亦會成為凹凸圖案的破損因素而存在無法製作高精度的凹凸圖案的問題。
然而,不僅是藉由奈米壓印技術成形加工之微小成形物,包含微型LED、微晶片等微小元件之微小構造體、由包含玻璃小片之微小絕緣片等構成之微小構造物亦不僅尺寸小且容易受損,因此不易操作。因此,除了如專利文獻1的包含脫模裝置之分離裝置以外,亦需要被分離之微小構造物的接合裝置、追加按壓裝置,微小構造物的轉印裝置等。
在該種情況下,期待一種用同一構造進行微小構造物的接合、追加按壓,分離,轉印等之製造裝置。
[解決問題之技術手段]
However, in
為了解決該種課題,本發明之微小構造物製造裝置使相互對置之第一板狀構件的第一對置面或第二板狀構件的第二對置面中的任一者或兩者所具有之凹凸部接合或分離,該微小構造物製造裝置的特徵為,具備:變壓室,其形成於腔室的內部並以進出自如的方式前述第一板狀構件及前述第二板狀構件;變動部,設置在收容於前述變壓室之前述第一板狀構件的第一非對置面與前述腔室的第一室內表面之間;保持部,設置在收容於前述變壓室之前述第二板狀構件的第二非對置面與前述腔室的第二室內表面之間;第一空間部,在前述腔室的前述第一室內表面及前述變動部之間與前述變壓室分離而設置成氣密狀;室壓調整部,使前述變壓室或前述第一空間部中的任一者的內壓比另一者的內壓上升更多;及控制部,對前述室壓調整部進行作動控制,前述變動部具有變位部位,該變位部位相對於前述腔室的前述第一室內表面與前述第一板狀構件的前述第一非對置面沿厚度方向變形或移動自如地抵接,前述保持部具有保持部位,該保持部位相對於前述腔室的前述第二室內表面支撐前述第二板狀構件的前述第二非對置面,前述控制部藉由基於前述室壓調整部的作動之前述變壓室與前述第一空間部的壓力差控制前述第一板狀構件與前述變動部的前述變位部位一同朝向前述第二板狀構件或前述第一空間部移動。 又,為了解決該種課題,本發明之微小構造物的製造方法使相互對置之第一板狀構件的第一對置面或第二板狀構件的第二對置面中的任一者或兩者所具有之凹凸部接合或分離,該製造方法的特徵為,包括:搬入步驟,將前述第一板狀構件及前述第二板狀構件搬入形成於腔室的內部之變壓室;保持步驟,沿前述腔室的第一室內表面對前述第一板狀構件進行定位,沿前述腔室的第二室內表面對前述第二板狀構件進行定位;室壓調整步驟,調整前述變壓室的內壓;以及搬出步驟,從前述變壓室搬出前述第一板狀構件及前述第二板狀構件,在前述保持步驟中,使前述第一板狀構件的前述第一非對置面沿其厚度方向與設置於前述第一板狀構件的第一非對置面與前述第一室內表面之間之變動部的變位部位抵接,伴隨沿前述變位部位的厚度方向的變形或移動,前述第一非對置面能夠相對於前述第一室內表面移動,並且在前述第一室內表面及前述變動部之間,第一空間部與前述變壓室分離而設置成氣密狀,使前述第二板狀構件的前述第二非對置面沿前述厚度方向與設置於前述第二板狀構件的第二非對置面與前述第二室內表面之間之保持部的保持部位抵接而支撐,前述室壓調整步驟中,藉由室壓調整部,使前述變壓室或前述第一空間部中的任一者的內壓比另一者的內壓上升更多,使前述第一板狀構件與前述變動部的前述變位部位一同朝向前述第二板狀構件或前述第一空間部移動。 In order to solve such a problem, the apparatus for manufacturing a microstructure of the present invention makes either or both of the first opposing surfaces of the first plate-shaped member and the second opposing surfaces of the second plate-shaped member which are opposed to each other. The microstructure manufacturing apparatus is characterized by including: a transformer chamber formed inside the chamber, the first plate-shaped member and the second plate-shaped member being freely movable in and out. a member; a variable portion provided between a first non-opposing surface of the first plate-like member accommodated in the transformer chamber and a first inner surface of the chamber; a holding portion provided in the transformer chamber between the second non-opposing surface of the second plate-shaped member and the second inner surface of the chamber; the first space portion is between the first inner surface of the chamber and the variable portion and the variable portion. The pressure chamber is separated and installed in an airtight state; the chamber pressure adjustment part increases the internal pressure of either the transformation chamber or the first space part more than the internal pressure of the other; and the control part The chamber pressure adjusting portion performs operation control, and the variable portion has a displacement portion along the thickness direction with respect to the first inner surface of the chamber and the first non-opposing surface of the first plate-like member. Deformable or movable contact, the holding part has a holding part, the holding part supports the second non-opposing surface of the second plate-shaped member with respect to the second inner surface of the chamber, and the control part is configured by The first plate-shaped member and the displacement portion of the variable portion are controlled to be directed toward the second plate-shaped member or the first plate-shaped member together with the pressure difference between the transformation chamber and the first space portion based on the operation of the chamber pressure adjustment portion. The space department moves. Moreover, in order to solve such a problem, the manufacturing method of the microstructure of the present invention makes either the first opposing surface of the first plate-shaped member or the second opposing surface of the second plate-shaped member facing each other. Or the concave and convex portions of both are joined or separated, and the manufacturing method is characterized by comprising: a carrying-in step of carrying the first plate-shaped member and the second plate-shaped member into a transformer chamber formed inside the chamber; In the holding step, the first plate-shaped member is positioned along the first inner surface of the chamber, and the second plate-shaped member is positioned along the second inner surface of the chamber; the chamber pressure adjustment step is to adjust the pressure transformation the internal pressure of the chamber; and a carrying-out step of carrying out the first plate-like member and the second plate-like member from the transformer chamber, and in the holding step, the first non-opposing surface of the first plate-like member Abutting in the thickness direction of the displacement portion of the variable portion provided between the first non-opposing surface of the first plate-like member and the first interior surface, accompanied by deformation in the thickness direction of the displacement portion or moving, the first non-opposing surface can move relative to the first interior surface, and between the first interior surface and the variable portion, the first space portion is separated from the transformer chamber and provided in an airtight shape, The second non-opposing surface of the second plate-shaped member is brought into contact with a holding portion of the holding portion provided between the second non-opposing surface of the second plate-shaped member and the second interior surface in the thickness direction. Then, in the step of adjusting the chamber pressure, the internal pressure of either the transformation chamber or the first space portion is increased more than the internal pressure of the other by the chamber pressure adjusting portion, so that the above-mentioned The first plate-shaped member moves toward the second plate-shaped member or the first space portion together with the displacement portion of the variable portion.
以下,根據附圖對本發明的實施形態進行詳細說明。 如圖1~圖14所示,本發明的實施形態之微小構造物製造裝置A及微小構造物的製造方法係用於使相互對置之第一板狀構件B或第二板狀構件C中的任一者或第一板狀構件B及第二板狀構件C兩者所具有之凹凸部接合或分離而製造微小構造物M之製造裝置及製造方法。藉由第一板狀構件B及第二板狀構件C沿對置方向的相對接近或分開移動,進行凹凸部的接合、分離。 第一板狀構件B及第二板狀構件C由玻璃、合成樹脂等硬質材料形成為矩形(包括長方形及正方形之角為直角的四邊形)、圓形的薄板狀。 關於在第一板狀構件B中與第二板狀構件C對置之表側的第一對置面Bf和在第二板狀構件C中與第一板狀構件B對置之表側的第二對置面Cf,第一對置面Bf或第二對置面Cf中的任一者或第一對置面Bf及第二對置面Cf兩者具有成為後述微小構造物M的一部分之凹凸部。 亦即,相對於第一板狀構件B的第一對置面Bf、第二板狀構件C的第二對置面Cf,後述微小構造物M藉由基於接著等之正式固定或基於可裝卸的保持之臨時固定或基於形成為一體之一體化,配置成凹凸狀。因此,作為後述微小構造物M的保持機構D,在正式固定的情況下,將接著劑等固定層D1設置於第一板狀構件B的第一對置面Bf、第二板狀構件C的第二對置面Cf,在臨時固定的情況下,將保持夾頭D2設置於第一板狀構件B的第一對置面Bf、第二板狀構件C的第二對置面Cf。作為保持夾頭D2的具體例,可舉出真空夾頭,基於黏著構件之黏著夾頭,基於靜電吸附之靜電夾頭等。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. As shown in FIGS. 1 to 14 , the microstructure manufacturing apparatus A and the microstructure manufacturing method according to the embodiment of the present invention are used to make the first plate-shaped member B or the second plate-shaped member C facing each other. The manufacturing apparatus and manufacturing method which manufacture the microstructure M by joining or separating the uneven parts which any one of the 1st plate-shaped member B and the 2nd plate-shaped member C have. The concave and convex portions are joined and separated by the relative approaching or separating movement of the first plate-shaped member B and the second plate-shaped member C in the opposing direction. The first plate-shaped member B and the second plate-shaped member C are formed into rectangular (including rectangular and square quadrilaterals with right-angled corners) or circular thin plates made of hard materials such as glass and synthetic resin. Regarding the first opposing surface Bf on the front side of the first plate-like member B facing the second plate-like member C, and the second plate-like member C on the front side of the second plate-like member C facing the first plate-like member B The opposing surface Cf, any one of the first opposing surface Bf or the second opposing surface Cf, or both the first opposing surface Bf and the second opposing surface Cf have irregularities that become part of the microstructure M to be described later department. That is, with respect to the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C, the microstructures M described later can be fixed by formal fixing based on bonding or the like, or can be attached and detached. The temporary fixation of the holding or the integration based on the formation of one body is configured in a concave and convex shape. Therefore, as the holding mechanism D of the microstructure M, which will be described later, in the case of actual fixing, a fixing layer D1 such as an adhesive is provided on the first opposing surface Bf of the first plate-shaped member B and the second plate-shaped member C. The second opposing surface Cf is provided with the holding chuck D2 on the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C when temporarily fixed. Specific examples of the holding chuck D2 include a vacuum chuck, an adhesive chuck based on an adhesive member, an electrostatic chuck based on electrostatic adsorption, and the like.
微小構造物M有微小構造體M1和微小成形物M2,該微小構造體M1具有微型LED、微晶片等微小元件,玻璃小片等微小絕緣片,與該等類似之微小零件等以凹凸狀突出的微小零件Ma,該微小成形物M2具有藉由奈米壓印等微細加工技術成形加工之以相互凹凸狀接合之成形模具Mb及成形基板Mc等。 微小構造體M1有積層式和轉印式,如圖1~圖3所示,該積層式將配置(搭載)於第一板狀構件B與第二板狀構件C之間之微小零件Ma以夾持的方式接合,如圖7~圖10所示,該轉印式將配置(搭載)於第一板狀構件B或第二板狀構件C中的任一者之微小零件Ma轉移至另一者。通常,微小零件Ma大多設為如下排列配置:複數個微小零件Ma分別隔著既定間隔並列狀搭載於第一板狀構件B、第二板狀構件C。 因此,無論是積層式、轉印式中的哪一種,在其接合前的初始狀態下,配置於第一板狀構件B的第一對置面Bf或第二板狀構件C的第二對置面Cf中的任一者(圖示例中為第二對置面Cf)之微小零件Ma均朝向另一者局部突出。因此,第一板狀構件B的第一對置面Bf或第二板狀構件C的第二對置面Cf中的任一者具有微小零件Ma局部突出之非接觸凹凸部(非接合凹凸部Cu)。 作為用於製造非接合凹凸部Cu作為非接觸凹凸部接合之積層式微小構造體M1的微小構造物製造裝置A及微小構造物的製造方法的一例,可以利用接合裝置、接合方法。 作為用於製造作為非接觸凹凸部的非接合凹凸部Cu被轉移之轉印式微小構造體M1的微小構造物製造裝置A及微小構造物的製造方法的其他例子,可以利用轉印裝置、轉印方法。 The microstructure M includes a microstructure M1 and a micromolded object M2. The microstructure M1 has microscopic elements such as microLEDs and microchips, microscopic insulating sheets such as glass chips, and similar microparts protruding in a concave and convex shape. The microparts Ma and the micromolded object M2 include a molding die Mb, a molding substrate Mc, and the like which are formed and processed by a microfabrication technique such as nanoimprinting to be joined to each other in a concavo-convex shape. The microstructure M1 is of a build-up type and a transfer type. As shown in FIGS. 1 to 3 , in the build-up type, the micro-components Ma arranged (mounted) between the first plate-shaped member B and the second plate-shaped member C are As shown in FIGS. 7 to 10 , the transfer method transfers the minute parts Ma arranged (mounted) on either the first plate-shaped member B or the second plate-shaped member C to another one. Usually, the minute parts Ma are often arranged in a row in which a plurality of minute parts Ma are mounted on the first plate-shaped member B and the second plate-shaped member C in parallel with each other at predetermined intervals. Therefore, regardless of whether it is a lamination type or a transfer type, in the initial state before joining, it is arranged on the first opposing surface Bf of the first plate-shaped member B or the second pair of the second plate-shaped member C. The minute parts Ma of any one of the facing surfaces Cf (the second facing surface Cf in the illustrated example) partially protrude toward the other. Therefore, either the first opposing surface Bf of the first plate-shaped member B or the second opposing surface Cf of the second plate-shaped member C has a non-contact uneven part (non-joining uneven part) in which the minute parts Ma partially protrude Cu). As an example of the microstructure manufacturing apparatus A and the manufacturing method of the microstructure for manufacturing the layered microstructure M1 in which the non-bonded concavo-convex portion Cu is joined as a non-contact concavo-convex portion, a joining apparatus and a joining method can be used. As another example of the microstructure manufacturing apparatus A and the manufacturing method of the microstructure for manufacturing the transfer type microstructure M1 in which the non-bonding unevenness Cu, which is the non-contact unevenness portion, is transferred, a transfer apparatus, a transfer apparatus, and a transfer apparatus can be used. printing method.
如圖4~圖6等所示,微小成形物M2有分體式和一體式(未圖示),該分體式為在第一板狀構件B或第二板狀構件C中的任一者配置有成形模具Mb等且在另一者配置成形基板Mc等而使兩者相互凹凸接合,該一體式為第一板狀構件B或第二板狀構件C中的任一者整體成為成形模具Mb且另一者整體成為成形基板Mc而使兩者相互凹凸接合。又,雖未圖示於微小成形物M2,但亦包括在第一板狀構件B或第二板狀構件C中的任一者配置微小零件Ma且在另一者配置裝卸自如地保持微小零件Ma之黏著夾頭等保持機構之分體式或一體式。 因此,無論是分體式、一體式中的哪一種,在其分離前的初始狀態下,均具有第一板狀構件B或第二板狀構件C中的任一者的成形模具Mb、微小零件Ma與另一者的成形基板Mc、保持機構凹凸接合之一對凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。 作為用於製造具有第一接合凹凸部B1(成為成形模具Mb、微小零件Ma等與成形基板Mc、保持機構等凹凸接合之凹凸部)、第二接合凹凸部C1之分體式、一體式微小成形物M2的微小構造物製造裝置A及微小構造物的製造方法的其他例子,可以利用分離裝置、分離方法。 尤其,在微小成形物M2的情況下,在第一板狀構件B與第二板狀構件C之間具有間隙E為較佳。作為間隙E的具體例,有圖4、圖5等所示之形成於複數個第一接合凹凸部B1及第二接合凹凸部C1的外側之方框狀、圓環狀等外側間隙E1、通過複數個第一接合凹凸部B1與第二接合凹凸部C1彼此之間的貫穿間隙E2、圖13所示之與開通於第一板狀構件B、第二板狀構件C之通孔h連通之內側間隙E3等。 As shown in FIGS. 4 to 6 , etc., the micro-molded article M2 has a split type and an integrated type (not shown), and the split type is arranged on either the first plate-shaped member B or the second plate-shaped member C There are forming molds Mb and the like, and a forming substrate Mc and the like are arranged in the other to be joined to each other in a concavo-convex manner, and this integrated type is that either the first plate-shaped member B or the second plate-shaped member C is the entirety of the forming mold Mb. In addition, the other is formed as a molded substrate Mc as a whole, and the two are joined to each other in concavo-convex. In addition, although not shown in the micro-molded product M2, the micro-components Ma are arranged in either the first plate-shaped member B or the second plate-shaped member C, and the micro-components are detachably held in the other. The separate or integrated type of the holding mechanism such as the adhesive chuck of Ma. Therefore, regardless of whether it is a split type or an integrated type, in the initial state before separation, there is a molding die Mb and minute parts of either the first plate-shaped member B or the second plate-shaped member C. Ma is concavo-convex bonded to one pair of concavo-convex portions (first joining concavo-convex portion B1 , second joining concavo-convex portion C1 ) in concavo-convex bonding with the other molding substrate Mc and the holding mechanism. As a separate type and integrated micro-molding for manufacturing the first joining concavo-convex part B1 (concave-convex part that becomes the concavo-convex part for forming mold Mb, micro parts Ma, etc., forming substrate Mc, holding mechanism, etc. to join concave-convex part) and second joining concavo-convex part C1 As another example of the microstructure manufacturing apparatus A of the object M2 and the manufacturing method of the microstructure, a separation apparatus and a separation method can be used. In particular, in the case of the minute molded product M2, it is preferable that the gap E is provided between the first plate-shaped member B and the second plate-shaped member C. As a specific example of the gap E, there are the square-shaped, annular and other outer gaps E1 formed on the outer sides of the plurality of first joint concavo-convex portions B1 and the second joint concavo-convex portions C1 as shown in FIGS. 4 and 5 . The penetration gaps E2 between the plurality of first engaging concave-convex portions B1 and the second engaging concave-convex portions C1 communicate with each other as shown in FIG. Inner clearance E3, etc.
具體而言,本發明的實施形態之微小構造物製造裝置A具備:收容有第一板狀構件B及第二板狀構件C之變壓室1;在收容於變壓室1之第一板狀構件B的背面設置之變動部2;在收容於變壓室1之第二板狀構件C的另一背面設置之保持部3;與變壓室1分離設置之第一空間部4;以及以變壓室1及第一空間部4的內壓產生壓力差之方式設置之室壓調整部5作為主要的構成要件。
進一步具備變更第一空間部4的內壓之第一內壓調整部6、與變壓室1分離設置之第二空間部7、變更第二空間部7的內壓之第二內壓調整部8、對室壓調整部5、第一內壓調整部6及第二內壓調整部8等進行作動控制之控制部9為較佳。
又,通常,第一板狀構件B及第二板狀構件C配置成沿上下方向對置,以下將第一板狀構件B及第二板狀構件C的厚度方向稱為“Z方向”。以下,將與Z方向交叉之沿第一板狀構件B及第二板狀構件C之方向稱為“XY方向”。
在圖示例中,在上方配置有矩形的第一板狀構件B,在下方配置有矩形的第二板狀構件C。另外,作為其他例子,雖未圖示,但亦能夠進行如下變更:相反地將矩形的第一板狀構件B配置於下方,將矩形的第二板狀構件C配置於上方、將圓形的第一板狀構件B及圓形的第二板狀構件C上下配置等。
Specifically, the microstructure manufacturing apparatus A according to the embodiment of the present invention includes: a
變壓室1在腔室10的內部可密封地形成,在腔室10內的變壓室1及腔室10的外部空間範圍,以進出自如的方式收容第一板狀構件B及第二板狀構件C。
腔室10的內部具有沿厚度方向(Z方向)與被搬入之第一板狀構件B及第二板狀構件C以對置狀配置之第一室內表面10a和第二室內表面10b。
第一室內表面10a在第一板狀構件B上,沿Z方向與背面的第一非對置面Br直接或間接地對置而形成於XY方向的平面上。為了檢測第一板狀構件B的第一非對置面Br等的位置,在第一室內表面10a配置間隙檢測感測器(未圖示)為較佳。
第二室內表面10b在第二板狀構件C上,沿Z方向與背面的第二非對置面Cr直接或間接地對置而形成於XY方向的平面上。
腔室10具有用於使第一板狀構件B及第二板狀構件C相對於可密封的變壓室1進出的出入口10c。腔室10的出入口10c構成為開閉自如,並且利用由致動器等構成之驅動機構10d進行開閉。另外,腔室10的變壓室1有分體式和部分開閉式等,出入口10c的構造各自不同。
關於第一板狀構件B及第二板狀構件C向變壓室1的搬入,例如利用輸送機器人等輸送機構(未圖示),依次或同時進行。關於第一板狀構件B及第二板狀構件C從變壓室1的搬出,藉由輸送機構同時或依次進行。
The
變動部2沿厚度方向(Z方向)與被搬入之第一板狀構件B的第一非對置面Br接觸,且配置成與腔室10的第一室內表面10a分開。
變動部2具有如下變位部位2a:相對於腔室10的第一室內表面10a,沿厚度方向(Z方向)與被搬入之第一板狀構件B的第一非對置面Br抵接。
變位部位2a構成為能夠沿厚度方向(Z方向)變形或移動,藉由使其與被搬入之第一板狀構件B的第一非對置面Br抵接,以無法沿與厚度方向(Z方向)交叉之方向(XY方向)發生位移之方式進行定位來一體化。
亦即,變動部2構成為如下:相對於腔室10的第一室內表面10a,變位部位2a沿Z方向配置成變形自如或移動自如,伴隨變位部位2a的變形或移動,使第一板狀構件B沿Z方向移動。
在變動部2與腔室10的第一室內表面10a之間,與變壓室1分開形成第一空間部4。第一空間部4藉由使第一板狀構件B的第一非對置面Br與變動部2的變位部位2a抵接而形成為氣密狀。
進而,變動部2具有使第一板狀構件B的第一非對置面Br與第一空間部4連通之第一通風口2b為較佳。
The fluctuating
作為變動部2的具體例示於圖1~圖6等的情況下,由以能夠沿Z方向彈性變形的方式安裝於腔室10的第一室內表面10a之彈性通風體21構成。
例如,圖示例的彈性通風體21由襯墊或O形環等環狀構件構成,該環狀構件由軟質合成樹脂、橡膠等能夠彈性變形的材料形成為在其中央具有一個第一通風口2b之方框狀、圓環狀等。彈性通風體21的厚度方向(Z方向)的一端部具有相對於腔室10的第一室內表面10a之安裝部位21a。彈性通風體21將厚度方向(Z方向)的另一端部作為變位部位2a,使其與被搬入之第一板狀構件B的第一非對置面Br抵接,藉此在彈性通風體21的內側形成第一空間部4。因此,藉由變壓室1的內壓與第一空間部4的內壓的壓力差,彈性通風體21能夠沿Z方向進行彈性壓縮變形及膨脹變形。
另外,作為彈性通風體21的其他例子,雖未圖示,但亦能夠使用具有複數個第一通風口2b之板狀構件、具有複數個第一通風口2b之多孔質構件等代替環狀構件。
在該等情況下,藉由利用配置於腔室10的第一室內表面10a的間隙檢測感測器檢測第一板狀構件B的位置,能夠檢測第一板狀構件B的異常變形、過度變形。亦能夠設置用於機械性防止第一板狀構件B的過度變形的限制器等變形抑制構件(未圖示)。
進而,通過開設於變動部2之第一通風口2b,第一空間部4與第一板狀構件B的第一非對置面Br始終連通。因此,利用藉由後述第一內壓調整部6下降之第一空間部4的內壓與變壓室1的內壓的壓力差,第一板狀構件B能夠對變動部2的變位部位2a進行真空吸附。
藉此,藉由變壓室1的內壓上升,將第一板狀構件B的第一非對置面Br裝卸自如地吸附保持在變位部位2a而進行臨時固定。
又,作為變動部2的其他例子,雖未圖示,但亦能夠變更為利用黏著構件、靜電吸附等代替真空吸附之臨時固定。
1 to 6 etc. as a specific example, the
將保持部3配置成沿厚度方向(Z方向)與被搬入之第二板狀構件C的第二非對置面Cr接觸。
進而,保持部3具有保持部位3a,該保持部位3a相對於腔室10的第二室內表面10b,沿厚度方向(Z方向)不可移動地與被搬入之第二板狀構件C的第二非對置面Cr抵接。
亦即,保持部3構成為如下:藉由使第二板狀構件C的第二非對置面Cr與保持部位3a抵接,第二板狀構件C沿Z方向不可移動地保持。
在保持部3與腔室10的第二室內表面10b之間,與變壓室1分開形成第二空間部7為較佳。藉由使第二板狀構件C的第二非對置面Cr與保持部3的保持部位3a抵接,第二空間部7形成為氣密狀。
又,保持部3具有使第二板狀構件C的第二非對置面Cr與第二空間部7連通之第二通風口3b為較佳。
The holding
作為保持部3的具體例示於圖1~圖6等的情況下為固定於腔室10的第二室內表面10b之保持用環狀體31,保持用環狀體31的內側空間成為第二通風口3b而形成第二空間部7。
例如,圖示例的保持用環狀體31由軟質合成樹脂、橡膠等能夠彈性變形的材料或硬質合成樹脂、金屬等無法變形的材料形成為方框狀、圓環狀等。與變動部2的彈性通風體21同樣地,保持用環狀體31亦能夠由襯墊或O形環等環狀構件構成,此時,保持用環狀體31能夠沿Z方向彈性壓縮變形及膨脹變形。在保持用環狀體31的厚度方向(Z方向)的一端部具有相對於腔室10的第二室內表面10b之保持用固定部位31a。在保持用環狀體31上成為保持部位3a之厚度方向(Z方向)的另一端部與被搬入之第二板狀構件C的第二非對置面Cr抵接。
進而,成為保持部3的第二通風口3b之第二空間部7與第二板狀構件C的第二非對置面Cr始終連通,因此利用藉由後述第二內壓調整部8下降之第二空間部7的內壓與變壓室1的內壓的壓力差,第二板狀構件C能夠真空吸附於保持部3的保持部位3a。
藉此,藉由變壓室1的內壓上升,將第二板狀構件C的第二非對置面Cr裝卸自如地吸附保持在保持部位3a而進行臨時固定。
又,作為保持部3的其他例子,雖未圖示,但亦能夠變更為利用黏著構件、靜電吸附等代替真空吸附之臨時固定。
另外,示於圖1~圖3、圖14時,將變動部2的彈性通風體21的厚度方向(Z方向)尺寸設為與保持部3的保持用環狀體31的Z方向尺寸大致相同。相對於此,示於圖4~圖6,圖11,圖13時,藉由將變動部2的彈性通風體21的Z方向尺寸設為大於保持部3的保持用環狀體31的Z方向尺寸,設定成強調變動部2的壓縮變形量及膨脹變形量。
又,作為其他例子,雖未圖示,但亦能夠進行如下變更:將圖1~圖3,圖14所示之變動部2的彈性通風體21的Z方向尺寸設為大於保持部3的保持用環狀體31的Z方向尺寸或將圖4~圖6、圖11、圖13所示之變動部2的彈性通風體21的Z方向尺寸設為與保持部3的保持用環狀體31的Z方向尺寸大致相同等。
1 to 6 etc. as a specific example of the holding
室壓調整部5構成為如下:藉由從供應源(未圖示)向變壓室1供應壓縮空氣、氣體、水等流體5F(送氣),使變壓室1的內壓上升,且藉由從變壓室1排出空氣等流體5F(排氣),使變壓室1的內壓下降。
作為室壓調整部5的具體例示於圖1(a)等的情況下,例如具有從真空泵、壓縮機等室壓用驅動源(未圖示)貫穿腔室10並連通變壓室1之室流路5a及設置於室流路5a的中途之室壓用控制閥5b。
藉由室壓調整部5(室壓用驅動源、室壓用控制閥5b)的作動,變壓室1的內壓能夠從大氣環境設定至真空或接近真空的低壓環境或既定高壓環境。
具體而言,藉由室壓用驅動源、室壓用控制閥5b的作動控制,控制從室流路5a排出之負壓流體5F或供應至室流路5a之正壓流體5F的總量而階段性調整變壓室1的內壓為較佳。
The chamber
第一內壓調整部6構成為如下:藉由從第一空間部4排出空氣等第一流體6F(排氣),使第一空間部4的內壓比變壓室1的內壓下降更多,且藉由向第一空間部4供應第一流體6F(送氣),使第一空間部4的內壓上比變壓室1的內壓上升更多。
作為第一內壓調整部6的具體例示於圖1(a)等的情況下,例如具有從真空泵、壓縮機等第一驅動源(未圖示)貫穿腔室10並連通第一空間部4之第一流路6a及設置於第一流路6a的中途之第一控制閥6b。
藉由第一內壓調整部6(第一驅動源、第一控制閥6b)的作動,第一空間部4的內壓能夠從大氣環境設定至真空或接近真空的低壓環境或既定高壓環境。
具體而言,藉由第一驅動源、第一控制閥6b的作動控制,控制從第一流路6a排出之負壓第一流體6F或供應至第一流路6a之正壓第一流體6F的總量而階段性調整第一空間部4的內壓為較佳。
The first internal
第二內壓調整部8構成為如下:藉由從第二空間部7排出空氣等第二流體8F(排氣),使第二空間部7的內壓比變壓室1的內壓下降更多,且藉由向第二空間部7供應第二流體8F(送氣),使第二空間部7的內壓比變壓室1的內壓上升更多。
作為第二內壓調整部8的具體例示於圖1(a)等的情況下,例如具有從真空泵、壓縮機等第二驅動源(未圖示)貫穿腔室10並連通第二空間部7之第二流路8a及設置於第二流路8a的中途之第二控制閥8b。
藉由第二內壓調整部8(第二驅動源、第二控制閥8b)的作動,第二空間部7的內壓能夠從大氣環境設定至真空或接近真空的低壓環境或既定高壓環境。
具體而言,藉由第二驅動源、第二控制閥8b的作動控制,控制從第二流路8a排出之負壓第二流體8F或供應至第二流路8a之正壓第二流體8F的總量而階段性調整第二空間部7的內壓為較佳。
The second internal
控制部9係具有分別與室壓調整部5、第一內壓調整部6及第二內壓調整部8等電連接之控制電路(未圖示)之控制器。
進而,與開閉腔室10的出入口10c之驅動機構10d電連接。除此以外,亦與用於使第一板狀構件B及第二板狀構件C進出變壓室1的輸送機構等電連接。
成為控制部9之控制器按照預先設定於其控制電路(未圖示)之程式,以預先設定之時序,依次分別進行作動控制。
The
又,將設定於控制部9的控制電路之程式作為基於微小構造物製造裝置A之微小構造物的製造方法進行說明。
使用了本發明的實施形態之微小構造物製造裝置A之微小構造物的製造方法可分為搬入步驟,保持步驟,室壓調整步驟,搬出步驟。
具體而言,作為主要的步驟,本發明的實施形態之微小構造物的製造方法包括:搬入步驟,將第一板狀構件B及第二板狀構件C搬入變壓室1;保持步驟,將第一板狀構件B及第二板狀構件C保持在變壓室1內;室壓調整步驟,調整變壓室的內壓;以及搬出步驟,從變壓室1搬出第一板狀構件B及第二板狀構件C。
Moreover, the program of the control circuit set in the
在搬入步驟中,如圖2(a)、圖2(b)、圖4(a)、圖8(a)、圖8(b)等所示,藉由輸送機構的作動,將第一板狀構件B及第二板狀構件C從腔室10的外部空間放入並收容於變壓室1。
如圖2(a)、圖2(b)、圖8(a)、圖8(b)等所示,在搬入時第一板狀構件B與第二板狀構件C為分離狀態的情況下,需要用於將第一板狀構件B或第二板狀構件C中的任一者放入變壓室1中的一次搬入過程和用於將另一者放入變壓室1中的二次搬入過程。
又,如圖4(a)等所示,在搬入時第一板狀構件B與第二板狀構件C為接合狀態的情況下,將凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)相互凹凸接合而被一體化之第一板狀構件B及第二板狀構件C以凹凸接合的狀態放入變壓室1中。
In the carrying-in step, as shown in Fig. 2(a), Fig. 2(b), Fig. 4(a), Fig. 8(a), Fig. 8(b), etc., the first plate is moved by the operation of the conveying mechanism. The shaped member B and the second plate-shaped member C are inserted into and accommodated in the
如圖2(c)、圖4(a)、圖8(c)等所示,在保持步驟中,使第一板狀構件B的第一非對置面Br沿厚度方向(Z方向)與變動部2的變位部位2a抵接。該抵接時,藉由基於第一內壓調整部6的作動之第一流體6F的排出,第一空間部4的內壓下降,通過變動部2的第一通風口2b,使第一板狀構件B的第一非對置面Br真空吸附於變動部2的變位部位2a為較佳。
因此,第一板狀構件B的第一非對置面Br與變動部2的變位部位2a以無法沿與厚度方向(Z方向)交叉之方向(XY方向)發生位移之方式進行定位來一體化。藉此,伴隨變位部位2a沿厚度方向(Z方向)變形或移動,第一板狀構件B能夠相對於腔室10的第一室內表面10a移動。
使第二板狀構件C的第二非對置面Cr沿厚度方向(Z方向)與保持部3的保持部位3a抵接。該抵接時,藉由基於第二內壓調整部8的作動之第二流體8F的排出,第二空間部7的內壓下降,通過保持部3的第二通風口3b,使第二板狀構件C的第二非對置面Cr真空吸附於保持部3的保持部位3a為較佳。
因此,第二板狀構件C的第二非對置面Cr與保持部3的保持部位3a以無法沿與厚度方向(Z方向)交叉之方向(XY方向)發生位移之方式進行定位來一體化。藉此,第二板狀構件C被保持為如下:相對於腔室10的第二室內表面10b,沿厚度方向(Z方向)不可移動。又,保持部3能夠彈性變形時,伴隨保持部位3a沿厚度方向(Z方向)變形等,亦能夠將第二板狀構件C變更為相對於腔室10的第二室內表面10b,能夠沿厚度方向(Z方向)移動。
如圖3(a)、圖5(a)、圖9(a)等所示,第一板狀構件B及第二板狀構件C在該種保持後關閉腔室10的出入口10c,腔室10內的變壓室1與腔室10的外部空間阻斷而成為密閉狀態。
As shown in FIG. 2( c ), FIG. 4( a ), FIG. 8( c ), etc., in the holding step, the first non-opposing surface Br of the first plate-shaped member B is made to be parallel to the thickness direction (Z direction) of the first plate-shaped member B. The
室壓調整步驟包括:至少藉由室壓調整部5的作動,控制為變壓室1的內壓與第一空間部4的內壓之間產生壓力差之差壓過程;藉由該壓力差,使第一板狀構件B及第二板狀構件C朝向對置方向相對接近移動之加壓接合過程;藉由壓力差,使第一板狀構件B及第二板狀構件C朝向對置方向相對分開移動之剝離過程;以及變壓室1的內壓恢復至大氣壓之大氣開放過程。
如圖3(b)、圖5(b)、圖9(b)等所示,在差壓過程中,藉由基於室壓調整部5的作動之流體5F的排出或供應,使變壓室1或第一空間部4中的任一者的內壓比另一者的內壓上升更多。藉此,在變壓室1的內壓與第一空間部4的內壓之間產生壓力差。
此時,除了基於室壓調整部5的作動之變壓室1的內壓變化以外,藉由基於第一內壓調整部6的作動之第一流體6F的供應或排出,同時進行第一空間部4的內壓變化,控制變壓室1的內壓與第一空間部4的內壓的壓力差變得更大為較佳。
又,保持部3能夠彈性變形時,除了基於第一內壓調整部6的作動之第一空間部4的內壓變化以外,亦能夠藉由基於第二內壓調整部8的作動之第二流體8F的供應或排出,同時進行第二空間部7的內壓變化,控制變壓室1的內壓與第二空間部7的內壓的壓力差變得更大。
The step of adjusting the chamber pressure includes: at least by the action of the chamber
在加壓接合過程中,僅藉由基於室壓調整部5的作動之流體5F的排出,或者除此以外亦藉由基於第一內壓調整部6的作動之第一流體6F的供應、基於第二內壓調整部8的作動之第二流體8F的供應,使變壓室1的內壓比第一空間部4的內壓、第二空間部7的內壓下降更多。
由於藉此產生之壓力差,會產生將第一板狀構件B與變動部2的變位部位2a一同朝向第二板狀構件C沿厚度方向(Z方向)移動而加壓之按壓力。
如圖3(b)等所示,藉由該按壓力,第二板狀構件C的第二對置面Cf具有非接觸凹凸部(非接合凹凸部Cu)時,第一板狀構件B的第一對置面Bf與第二板狀構件C的非接合凹凸部Cu接合而沿厚度方向(Z方向)被推壓,使第一對置面Bf在非接合凹凸部Cu以追隨成為微小零件Ma的表面之非接合部Mf的形狀的方式重合,由此藉由壓力差(流體),第一板狀構件B朝向第二板狀構件C的非接合凹凸部Cu均等地被加壓。
During the pressure joining process, only by the discharge of the fluid 5F based on the operation of the chamber
在剝離過程中,僅藉由基於室壓調整部5的作動之流體5F的供應,或者除此以外亦藉由基於第一內壓調整部6的作動之第一流體6F的排出、基於第二內壓調整部8的作動之第二流體8F的排出,使變壓室1的內壓比第一空間部4的內壓、第二空間部7的內壓上升更多。
由於藉此產生之壓力差,會產生將第一板狀構件B與變動部2的變位部位2a一同朝向第一空間部4沿厚度方向(Z方向)吸引之引力。
如圖5(c)等所示,藉由該引力,第一板狀構件B的第一對置面Bf具有第一接合凹凸部B1作為凹凸接合的凹凸部的一者,第二板狀構件C的第二對置面Cf具有第二接合凹凸部C1作為凹凸部的另一者時,第一板狀構件B的第一接合凹凸部B1相對於第二板狀構件C的第二接合凹凸部C1沿厚度方向(Z方向)被拉開,由此從第二接合凹凸部C1剝離第一接合凹凸部B1。
進而,如圖示例所示,在第一板狀構件B與第二板狀構件C之間具有間隙E時,由於正壓流體5F侵入間隙E,會產生將第一板狀構件B的第一接合凹凸部B1與第二板狀構件C的第二接合凹凸部C1相對推開之斥力。
又,藉由配置於腔室10的第一室內表面10a的間隙檢測感測器,檢測第一板狀構件B的第一非對置面Br等的位置而監測其檢測值,藉此能夠檢測凹凸部(非接合凹凸部Cu、第一接合凹凸部B1、第二接合凹凸部C1)的接合或剝離的進行、接合或剝離的結束。
In the peeling process, only by supplying the
如圖3(c)、圖6(a)、圖10(a)等所示,大氣開放過程使基於室壓調整部5的作動之流體5F的排出或供應停止,並且藉由驅動機構10d開啟腔室10的出入口10c,將充滿在變壓室1之流體5F釋放於變壓室1的外部空間等,藉此使變壓室1的內壓恢復至大氣壓。As shown in FIG. 3( c ), FIG. 6( a ), FIG. 10( a ), etc., the atmosphere opening process stops the discharge or supply of the fluid 5F based on the operation of the chamber
如圖3(c)、圖6(b)、圖6(c)、圖10(b)、圖10(c)等所示,搬出步驟使第一內壓調整部6的作動及第二內壓調整部8的作動依次停止,並且藉由輸送機構的作動,將第一板狀構件B及第二板狀構件C從變壓室1提取至腔室10的外部空間。
如圖3(c)等所示,在搬出時第一板狀構件B與第二板狀構件C為接合狀態的情況下,將凹凸部(非接合凹凸部Cu)進行凹凸接合而被一體化之第一板狀構件B及第二板狀構件C以凹凸接合的狀態提取至變壓室1的外部。
又,如圖6(b)、圖6(c)、圖10(b)、圖10(c)等所示,在搬入時第一板狀構件B與第二板狀構件C為分離狀態的情況下,需要用於將第一板狀構件B或第二板狀構件C中的任一者提取至變壓室1的外部的一次搬出過程和用於將另一者提取至變壓室1的外部的二次搬出過程。
3( c ), FIG. 6( b ), FIG. 6( c ), FIG. 10( b ), FIG. 10( c ), etc., the unloading step causes the operation of the first internal
接著,對本發明的實施形態之微小構造物製造裝置A的具體例(第一實施形態~第三實施形態)及變形例(第四實施形態~第七實施形態)進行說明。 圖1~圖3所示之第一實施形態的微小構造物製造裝置A1係製造以夾持的方式接合配置(搭載)於第一板狀構件B與第二板狀構件C之間之微小零件Ma之積層式微小構造體M1作為微小構造物M之接合裝置。 藉由第一板狀構件B及第二板狀構件C的相對接近移動,將配置於第一板狀構件B的第一對置面Bf或第二板狀構件C的第二對置面Cf中的任一者之微小零件Ma的非接觸凹凸部(非接合凹凸部Cu)以夾持在與另一者之間的方式接合而使其一體化。 在圖示例的情況下,在第一板狀構件B的第一對置面Bf及第二板狀構件C的第二對置面Cf設置有接著劑等固定層D1、黏著夾頭等保持夾頭D2作為微小零件Ma的保持機構D。複數個微小零件Ma分別以並列狀排列配置。 在圖2(a)、圖2(b)所示之接合前的初始狀態(搬入步驟)下,微小零件Ma藉由保持機構D(固定層D1、保持夾頭D2)不可移動地配置於第二板狀構件C的第二對置面Cf,具有非接觸凹凸部(非接合凹凸部Cu)。 在從接下來的圖3(a)所示之保持步驟至圖3(b)所示之室壓調整步驟(差壓過程、加壓接合過程)中,藉由基於流體差壓之第一板狀構件B的相對接近移動,第一板狀構件B的第一對置面Bf與第二板狀構件C的非接合凹凸部Cu接合而沿厚度方向(Z方向)被推壓。伴隨於此,第一對置面Bf在非接合凹凸部Cu以追隨成為微小零件Ma的表面之非接合部Mf的形狀之方式重合,由此藉由壓力差(流體)朝向非接合凹凸部Cu均等地被加壓。因此,藉由在第一板狀構件B與第二板狀構件C之間夾持微小零件Ma並一體化而成為積層體。 Next, specific examples (first to third embodiments) and modified examples (fourth to seventh embodiments) of the microstructure manufacturing apparatus A according to the embodiment of the present invention will be described. The microstructure manufacturing apparatus A1 of the first embodiment shown in FIGS. 1 to 3 manufactures microparts that are joined (mounted) between the first plate-shaped member B and the second plate-shaped member C in a sandwiched manner The layered microstructure M1 of Ma serves as a bonding device for the microstructure M. By the relative approaching movement of the first plate-shaped member B and the second plate-shaped member C, the first plate-shaped member B will be arranged on the first opposing surface Bf of the first plate-shaped member B or the second opposing surface Cf of the second plate-shaped member C The non-contact concavo-convex portion (non-joining concavo-convex portion Cu) of any one of the minute parts Ma is joined and integrated with the other one. In the case of the illustrated example, the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C are provided with a fixing layer D1 such as an adhesive, an adhesive chuck, etc. to hold the The chuck D2 serves as the holding mechanism D for the minute parts Ma. The plurality of minute parts Ma are arranged in parallel, respectively. In the initial state (carrying-in step) before joining shown in FIG. 2( a ) and FIG. 2( b ), the micro parts Ma are immovably arranged on the first place by the holding mechanism D (fixed layer D1 , holding chuck D2 ). The second opposing surfaces Cf of the two plate-shaped members C have non-contact concavo-convex portions (non-joining concave-convex portions Cu). In the following steps from the holding step shown in FIG. 3( a ) to the chamber pressure adjustment step (differential pressure process, pressurization bonding process) shown in FIG. 3( b ), by the first plate based on the fluid differential pressure The relative approaching movement of the plate-shaped member B causes the first opposing surface Bf of the first plate-shaped member B to engage with the non-bonding concave-convex portion Cu of the second plate-shaped member C to be pressed in the thickness direction (Z direction). Along with this, the first opposing surface Bf overlaps the non-joining concave-convex portion Cu so as to follow the shape of the non-joining portion Mf that becomes the surface of the minute component Ma, and thereby moves toward the non-joining concave-convex portion Cu by the pressure difference (fluid). Pressurized equally. Therefore, the minute parts Ma are sandwiched between the first plate-shaped member B and the second plate-shaped member C and integrated to form a layered body.
進而,在圖示例中,腔室10的變壓室1為分體式。關於分體式變壓室1,將腔室10分割成第一腔室11和第二腔室12,在分開的第一腔室11與第二腔室12之間形成出入口10c。在出入口10c中插裝有由方框狀、圓環狀的襯墊或O形環等構成之密封材料13。利用驅動機構10d使第一腔室11、第二腔室12相對接近,藉此利用密封材料13氣密狀關閉出入口10c,變壓室1開閉自如且成為密封構造。
在圖示例中,僅使上側的第一腔室11相對於下側的第二腔室12往復移動,但能夠變更為僅使下側的第二腔室12、或者第一腔室11及第二腔室12兩者往復移動等除圖示例以外的構造。
Furthermore, in the illustrated example, the
圖4~圖6所示之第二實施形態的微小構造物製造裝置A2係分離裝置這一構造與前述第一實施形態不同,除此以外的構造與第一實施形態相同,該分離裝置剝離作為微小構造物M配置於第一板狀構件B及第二板狀構件C之相互接合的凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。 藉由第一板狀構件B及第二板狀構件C的相對分開移動,如成為微小成形物M2之成形模具Mb與成形基板Mc的剝離、成為微小構造體M1之微小零件Ma與黏著夾頭等保持機構的剝離等,剝離以相互凹凸狀接合之配置於第一板狀構件B的第一對置面Bf之第一接合凹凸部B1與配置於第二板狀構件C的第二對置面Cf之第二接合凹凸部C1。 圖示例的情況下,示出了在第一板狀構件B配置成形模具Mb且在第二板狀構件C配置了成形基板Mc之分體式。在藉由奈米壓印成形等將成形模具Mb的凹凸圖案轉印至成形基板Mc之狀態下,成形模具Mb與成形基板Mc相互凹凸接合而成為可輸送地一體化的積層體。成形基板Mc在由硬質材料構成之基板Md的表面積層有成為第二接合凹凸部C1之藉由光、熱等被圖案轉印之樹脂層Me。 進而,在第一板狀構件B的第一對置面Bf及第二板狀構件C的第二對置面Cf,設置有黏著夾頭等保持夾頭D2、接著劑等固定層D1作為微小成形物M2的保持機構D。 The microstructure manufacturing apparatus A2 of the second embodiment shown in FIGS. 4 to 6 is different from the first embodiment in that the structure is a separation device, and the other structure is the same as that of the first embodiment, and the separation device peels off as a The microstructures M are arranged on the concavo-convex portions (first joining concavo-convex portion B1 , second joining concavo-convex portion C1 ) of the first plate-like member B and the second plate-like member C to be joined to each other. By the relative separation movement of the first plate-shaped member B and the second plate-shaped member C, such as the peeling of the forming die Mb and the forming substrate Mc that become the micromolding body M2, and the microparts Ma and the adhesive chuck that become the microstructure M1 Such as peeling of the holding mechanism, etc., the first joint concavo-convex portion B1 arranged on the first opposing surface Bf of the first plate-shaped member B and the second opposing portion of the second plate-like member C, which are joined to each other in a concavo-convex shape, are separated. The second joint concavo-convex portion C1 of the surface Cf. In the case of the illustrated example, a separate type in which the forming die Mb is arranged on the first plate-like member B and the forming substrate Mc is arranged on the second plate-like member C is shown. In a state in which the concavo-convex pattern of the forming mold Mb is transferred to the forming substrate Mc by nanoimprint molding or the like, the forming mold Mb and the forming substrate Mc are joined to each other in concavities and convexities to form a transportable integrated laminate. The molded substrate Mc has a resin layer Me that is pattern-transferred by light, heat, or the like to serve as the second bonding concavo-convex portion C1 on the surface layer of the substrate Md made of a hard material. Furthermore, on the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C, a holding chuck D2 such as an adhesive chuck, and a fixing layer D1 such as an adhesive are provided as minute The holding mechanism D of the molded object M2.
在圖4(a)所示之接合時的初始狀態(搬入步驟)下,成為第一接合凹凸部B1之成形模具Mb的第一背面B2藉由保持機構D(保持夾頭D2、固定層D1)不可移動地配置於第一板狀構件B的第一對置面Bf。成為第二接合凹凸部C1之成形基板Mc的第一背面C2藉由保持機構D(保持夾頭D2、固定層D1)不可移動地配置於第二板狀構件C的第二對置面Cf。 在接下來的圖5(b)、圖5(c)所示之室壓調整步驟(差壓過程、剝離過程)中,藉由基於流體差壓之第一板狀構件B的相對分開移動,成為第一接合凹凸部B1之成形模具Mb從成為第二接合凹凸部C1之成形基板Mc沿厚度方向(Z方向)被拉開。 In the initial state (carrying-in step) at the time of joining shown in FIG. 4( a ), the first back surface B2 of the forming mold Mb that becomes the first joining concave-convex portion B1 is held by the holding mechanism D (holding chuck D2 , fixing layer D1 ) ) is arranged on the first opposing surface Bf of the first plate-shaped member B so as to be immovable. The first back surface C2 of the molding substrate Mc serving as the second bonding concavo-convex portion C1 is immovably arranged on the second opposing surface Cf of the second plate member C by the holding mechanism D (holding chuck D2, fixing layer D1). In the following chamber pressure adjustment steps (differential pressure process, peeling process) shown in FIGS. 5( b ) and 5( c ), by the relative separation movement of the first plate-like member B based on the fluid differential pressure, The forming die Mb that becomes the first joining concavo-convex portion B1 is pulled apart from the forming substrate Mc that becomes the second joining concavo-convex portion C1 in the thickness direction (Z direction).
進而,在圖示例中,在第一板狀構件B與第二板狀構件C之間,沿XY方向分別隔著既定間隔並列配置有複數個第一接合凹凸部B1(成形模具Mb)及第二接合凹凸部C1(成形基板Mc),且具有方框狀的外側間隙E1和沿XY方向雙向直線狀通過之複數個貫穿間隙E2。
藉此,正壓流體5F不僅流入外側間隙E1,亦會分別侵入複數個貫穿間隙E2,因此會產生將第一板狀構件B與第二板狀構件C整體推開之斥力。
Furthermore, in the illustrated example, between the first plate-like member B and the second plate-like member C, a plurality of first joining concavo-convex portions B1 (molding die Mb) and The second joining concavo-convex portion C1 (molding substrate Mc) has a frame-shaped outer gap E1 and a plurality of penetration gaps E2 passing linearly in both directions in the XY direction.
Thereby, the
圖7~圖10所示之第三實施形態的微小構造物製造裝置A3係轉印裝置這一構造與前述第一實施形態不同,除此以外的構造與第一實施形態相同,該轉印裝置製造將作為微小構造物M配置(搭載)於第一板狀構件B和第二板狀構件C中的任一者之微小零件Ma轉移至另一者之轉印式微小構造體M1。 藉由第一板狀構件B及第二板狀構件C的相對接近移動和分開移動,對配置於第一板狀構件B的第一對置面Bf或第二板狀構件C的第二對置面Cf中的任一者之微小零件Ma的非接觸凹凸部(非接合凹凸部Cu)進行表背反轉而轉移至另一者。 在圖示例的情況下,將第一板狀構件B的第一對置面Bf設定為微小零件Ma的轉印目的地而具有成為微小零件Ma的保持機構D之強接著面D3。將第二板狀構件C的第二對置面Cf設定為微小零件Ma的轉印源並具有成為微小零件Ma的保持機構D之弱接著面D4。複數個微小零件Ma分別以並列狀排列配置。 強接著面D3及弱接著面D4係將微小零件Ma可裝卸地保持而進行臨時固定之保持夾頭D2。在保持夾頭D2中,使用基於能夠簡單地控制微小零件Ma的保持力之黏著構件之黏著夾頭為較佳。此時,作為強接著面D3,使用黏著力強的黏著構件,作為弱接著面D4,使用黏著力弱的黏著構件。又,作為其他例子,亦能夠變更為對吸附力進行強弱控制之真空夾頭、對靜電吸附力進行強弱控制之靜電夾頭來代替黏著夾頭。 The microstructure manufacturing apparatus A3 of the third embodiment shown in FIGS. 7 to 10 is different from the first embodiment in that the structure is a transfer device, and the other structure is the same as that of the first embodiment. A transfer-type microstructure M1 in which the microparts Ma arranged (mounted) on either the first plate-shaped member B and the second plate-shaped member C as the microstructure M is transferred to the other is produced. By the relative approach movement and separation movement of the first plate-shaped member B and the second plate-shaped member C, the second pair of the first opposing surface Bf of the first plate-shaped member B or the second plate-shaped member C The non-contact concavo-convex portion (non-joining concavo-convex portion Cu) of the micro parts Ma of any one of the placement surfaces Cf is reversed and transferred to the other. In the case of the illustrated example, the first opposing surface Bf of the first plate-shaped member B is set as the transfer destination of the minute parts Ma, and has a strong bonding surface D3 serving as the holding mechanism D of the minute parts Ma. The second opposing surface Cf of the second plate-shaped member C is set as a transfer source of the minute parts Ma, and has a weak bonding surface D4 serving as a holding mechanism D of the minute parts Ma. The plurality of minute parts Ma are arranged in parallel, respectively. The strong adhesive surface D3 and the weak adhesive surface D4 are holding chucks D2 that hold the minute parts Ma detachably and temporarily fix them. In the holding chuck D2, it is preferable to use an adhesive chuck based on an adhesive member that can easily control the holding force of the minute parts Ma. At this time, as the strong adhesive surface D3, an adhesive member having a strong adhesive force is used, and as the weak adhesive surface D4, an adhesive member having a weak adhesive force is used. In addition, as another example, instead of the adhesive chuck, it is possible to change to a vacuum chuck that controls the strength of the suction force, or an electrostatic chuck that controls the strength of the electrostatic suction force.
在圖8(a)、圖8(b)所示之轉印前的初始狀態(搬入步驟)下,成為複數個微小零件Ma的背面之接合部Mr藉由保持機構D(保持夾頭D2、弱接著面D4)不可移動地排列配置於第二板狀構件C的第二對置面Cf。 在從接下來的圖9(a)所示之保持步驟至圖9(b)所示之室壓調整步驟(差壓過程、加壓接合過程)中,藉由基於流體差壓之第一板狀構件B的相對接近移動,使第一對置面Bf的保持機構D(強接著面D3)沿厚度方向(Z方向)與成為複數個微小零件Ma的表面之非接合部Mf接合而被一體化。 之後,在圖9(c)所示之室壓調整步驟(剝離過程)中,藉由基於流體差壓之第一板狀構件B的相對分開移動,將複數個微小零件Ma的背面(接合部Mr)從第二對置面Cf的保持機構D(弱接著面D4)沿厚度方向(Z方向)拉開。 藉此,以不改變排列狀態的方式對複數個微小構造體M1進行表背反轉而從第二板狀構件C轉移至第一板狀構件B。 In the initial state (carrying-in step) before transfer shown in FIGS. 8( a ) and 8 ( b ), the joint portion Mr that becomes the back surface of the plurality of minute parts Ma is held by the holding mechanism D (holding chuck D2 , The weak bonding surface D4) is arranged on the second opposing surface Cf of the second plate-shaped member C so as to be immovable. In the following steps from the holding step shown in FIG. 9( a ) to the chamber pressure adjustment step (differential pressure process, pressurization bonding process) shown in FIG. 9( b ), by the first plate based on the fluid differential pressure The relative approaching movement of the shaped member B causes the holding mechanism D (strong adhesive surface D3 ) of the first opposing surface Bf to be integrated with the non-joining portion Mf which is the surface of the plurality of minute parts Ma in the thickness direction (Z direction). change. After that, in the chamber pressure adjustment step (peeling process) shown in FIG. 9( c ), by the relative separation movement of the first plate-shaped member B based on the fluid differential pressure, the back surfaces (joint parts of the plurality of minute parts Ma) are separated. Mr) is pulled away in the thickness direction (Z direction) from the holding mechanism D (weak bonding surface D4 ) of the second opposing surface Cf. Thereby, the front and back of the plurality of microstructures M1 are reversed and transferred from the second plate-shaped member C to the first plate-shaped member B without changing the arrangement state.
圖11(a)~圖11(c)所示之第四實施形態的微小構造物製造裝置A4係部分開閉式變壓室1這一構造與前述第一實施形態~第三實施形態不同,除此以外的構造與第一實施形態~第三實施形態相同。
在圖示例中,示出係第二實施形態的分離裝置的情況。
在箱形腔室14的一部分中開設有出入口10c,利用驅動機構10d,使門扇14a相對於出入口10c進行開關。
藉此,變壓室1的一部分構成為開閉自如且成為密封構造。
The microstructure manufacturing apparatus A4 of the fourth embodiment shown in FIGS. 11( a ) to 11 ( c ) is different from the first to third embodiments described above in that the structure is a partially openable and closed
圖12(a)~圖12(c)所示之第五實施形態的微小構造物製造裝置A5藉由變動部2的移動剝離配置於第一板狀構件B和第二板狀構件C之相互接合之凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)這一構造與前述第二實施形態、第三實施形態不同,除此以外的構造與第二實施形態、第三實施形態相同。
在圖示例中,示出係第二實施形態的分離裝置的情況。
能夠移動的變動部2由升降通風體22構成,該升降通風體22被支撐為相對於腔室10的第一室內表面10a能夠沿Z方向往復移動。升降通風體22具有相當於使第一板狀構件B的第一非對置面Br與第一空間部4連通之第一通風口2b之通風孔2c。
例如,升降通風體22由板狀構件構成且在其中央開通有一個通風孔2c,該板狀構件由硬質合成樹脂、金屬等無法變形的材料形成為四邊板狀、圓板狀等。升降通風體22的側面具有滑動部位22a,該滑動部位22a在腔室10的第一室內表面10a與第二室內表面10b之間,沿形成於Z方向上的第三室內表面10e,沿Z方向往復移動自如且被支撐為氣密狀。腔室10的第三室內表面10e具有朝向升降通風體22突出之一側的限制器10f及另一側的限制器10g。沿Z方向移動之升降通風體22與一側的限制器10f或另一側的限制器10g抵接,藉此限制升降通風體22的移動範圍。升降通風體22使厚度方向(Z方向)的前端部作為變位部位2a與被搬入之第一板狀構件B的第一非對置面Br抵接,藉此在升降通風體22與腔室10的第一室內表面10a之間形成第一空間部4。
因此,藉由基於正壓流體5F的流入之變壓室1的內壓上升及第一空間部4的內壓差,升降通風體22沿Z方向移動而使第一板狀構件B與其變位部位2a一同朝向第一空間部4移動。藉此,將第一板狀構件B從第二板狀構件C拉開。
另外,作為升降通風體22的其他例子,雖未圖示,但亦能夠使用具有複數個通風孔2c之板狀構件、具有複數個通風孔2c之多孔質板狀構件等代替具有一個通風孔2c之板狀構件。
進而,亦能夠變更為如下支撐構造來代替升降通風體22的滑動部位22a被支撐為能夠沿第三室內表面10e移動之支撐構造:藉由在不鏽鋼等能夠彈性變形的薄板狀撓性構件的中央以浮島狀支撐升降通風體22,利用撓性構件的彈性變形,升降通風體22被支撐為能夠沿Z方向往復移動。在該浮島狀的情況下,藉由將撓性構件的外周安裝於腔室10的第三室內表面10e,在撓性構件的背面,第一空間部4與變壓室1分離而設置成氣密狀。
The microstructure manufacturing apparatus A5 of the fifth embodiment shown in FIGS. 12( a ) to 12 ( c ) is separated and disposed between the first plate-shaped member B and the second plate-shaped member C by the movement of the
圖13(a)~圖13(c)所示之第六實施形態的微小構造物製造裝置A6在第一板狀構件B、第二板狀構件C形成有與內側間隙E3連通之通孔h這一構造與前述第二實施形態、第三實施形態不同,除此以外的構造與第二實施形態、第三實施形態相同。
在圖示例中,示出係第二實施形態的分離裝置的情況。
通孔h在第一板狀構件B或第二板狀構件C中的任一者或兩者以與第一空間部4、第二空間部7分開的方式開通,正壓流體5F從變壓室1通過通孔h侵入內側間隙E3。
進而,在圖示例中,在第一板狀構件B與第二板狀構件C之間,沿以內側間隙E3為中心的圓周方向等分別隔著既定間隔並列配置有複數個第一接合凹凸部B1及第二接合凹凸部C1,且具有外側間隙E1和沿以內側間隙E3為中心的放射方向等直線狀通過之複數個貫穿間隙(未圖示)。
在與第一空間部4對置之第一板狀構件B的中央開通有通孔h。
在與通孔h對置之腔室10的第一室內表面10a形成正壓流體5F流通之導入路徑5c以與通孔h連通,由此將正壓流體5F從導入路徑5c的流出口導入至通孔h。
又,與前述第二實施形態同樣地,剝離藉由變動部2的變形相互接合之凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。然而,導入路徑5c的流出口在腔室10的第一室內表面10a開口,因此需要將從導入路徑5c的流出口到通孔h的通路與第一空間部4氣密狀分離。
因此,圖示例的變動部2中,除了相當於第一實施形態的彈性通風體21之外側環狀構件23以外,以包圍從導入路徑5c的流出口到通孔h的通路之方式單獨設置有內側環狀構件24。在外側環狀構件23與內側環狀構件24之間形成有第一空間部4。
另外,作為彈性通風體21的其他例子,雖未圖示,但亦能夠使用具有複數個第一通風口2b之板狀構件、具有複數個第一通風口2b之多孔質構件等代替外側環狀構件23、內側環狀構件24。
藉此,正壓流體5F不僅流入外側間隙E1,通過導入路徑5c、內側環狀構件24的內側通路、通孔h而亦侵入內側間隙E3,並從內側間隙E3分別流經複數個貫穿間隙(未圖示),因此會產生將第一板狀構件B與第二板狀構件C整體推開之斥力。
The microstructure manufacturing apparatus A6 of the sixth embodiment shown in FIGS. 13( a ) to 13 ( c ) has the first plate-shaped member B and the second plate-shaped member C formed with through holes h communicating with the inner gap E3 This structure is different from the aforementioned second and third embodiments, and other structures are the same as those of the second and third embodiments.
In the illustrated example, the case of the separation device of the second embodiment is shown.
The through-hole h is opened in either or both of the first plate-shaped member B or the second plate-shaped member C so as to be separated from the
圖14(a)~圖14(c)所示之第七實施形態的微小構造物製造裝置A7藉由溫度變化控制成為保持機構D之強接著面D3、弱接著面D4的接著力這一構造與前述第三實施形態不同,除此以外的構造與第三實施形態相同。
強接著面D3、弱接著面D4由黏著構件構成時,能夠藉由加熱使黏著力增大,且能夠藉由冷卻降低黏著力。
在圖示例中,藉由受到控制部9的作動控制之加熱用或冷卻用變溫構件分別對成為微小零件Ma的轉印目的地之第一板狀構件B的第一對置面Bf所具有之強接著面D3和成為微小零件Ma的轉印源之第二板狀構件C的第二對置面Cf所具有之弱接著面D4兩者進行溫度控制。
在沿Z方向與第一板狀構件B的第一非對置面Br對置之腔室10的第一室內表面10a,第一變溫構件G1夾著絕熱材料B4設置於強接著面D3的附近。
在沿Z方向與第二板狀構件C的第二非對置面Cr對置之腔室10的第二室內表面10b,第二變溫構件G2夾著絕熱材料B5設置於弱接著面D4的附近。
第一變溫構件G1、第二變溫構件G2具有加熱器等的加熱功能或冷媒配管等的冷卻功能中的任一者或兩者。
因此,在圖14(b)所示之室壓調整步驟(差壓過程、加壓接合過程)中,藉由基於流體差壓之第一板狀構件B的相對接近移動,第一對置面Bf的強接著面D3沿厚度方向(Z方向)與複數個微小零件Ma的表面(非接合部Mf)接合時,加熱第一變溫構件G1。藉此,強接著面D3的接著力增大而能夠牢固地接合複數個微小零件Ma的表面(非接合部Mf)。
與此同時,由於利用第二變溫構件G2冷卻弱接著面D4,弱接著面D4的接著力下降,由此容易從弱接著面D4剝離複數個微小零件Ma的背面(接合部Mr)。因此,在圖14(c)所示之室壓調整步驟(剝離過程)中,藉由基於流體差壓之第一板狀構件B的相對分開移動,將複數個微小零件Ma的背面(接合部Mr)從弱接著面D4順利拉開。其結果,能夠控制為比常溫時更容易接合及剝離的接著力,並可以縮短腔室10內的接合或剝離所需的處理時間。
又,作為其他例子,雖未圖示,但亦能夠藉由溫度變化控制強接著面D3、弱接著面D4中的任一者的接著力。
The microstructure manufacturing apparatus A7 of the seventh embodiment shown in FIGS. 14( a ) to 14 ( c ) has a structure in which the adhesive force of the strong bonding surface D3 and the weak bonding surface D4 of the holding mechanism D is controlled by temperature change Different from the third embodiment described above, other structures are the same as those of the third embodiment.
When the strong adhesive surface D3 and the weak adhesive surface D4 are composed of adhesive members, the adhesive force can be increased by heating, and the adhesive force can be decreased by cooling.
In the illustrated example, the heating or cooling temperature changing members controlled by the operation of the
根據該種本發明的實施形態之微小構造物製造裝置A及微小構造物的製造方法,藉由在變壓室1收容第一板狀構件B及第二板狀構件C,第一板狀構件B的第一非對置面Br與變動部2的變位部位2a變形抵接或移動自如地抵接。因此,第一板狀構件B能夠相對於腔室10的第一室內表面10a沿厚度方向(Z方向)移動。第二板狀構件C的第二非對置面Cr與保持部3的保持部位3a抵接而支撐於腔室10的第二室內表面10b。
在該收容狀態下,藉由室壓調整部5使第一空間部4的內壓比變壓室1的內壓上升更多,藉此第一板狀構件B與變動部2的變位部位2a一同朝向第二板狀構件C移動。因此,在第一板狀構件B的第一對置面Bf或第二板狀構件C的第二對置面Cf中的任一者具有凹凸部(非接合凹凸部Cu)時,另一者以追隨凹凸部(非接合凹凸部Cu)的凹凸表面形狀的方式被重合,由此藉由壓力差(流體),第一板狀構件B朝向第二板狀構件C均等地被加壓。
又,藉由室壓調整部5使變壓室1的內壓比第一空間部4的內壓下降更多,第一板狀構件B與變動部2的變位部位2a一同朝向第一空間部4移動。因此,第一板狀構件B的第一對置面Bf及第二板狀構件C的第二對置面Cf兩者均具有凹凸部(第一接合凹凸部B1,第二接合凹凸部C1)時,從第二板狀構件C的凹凸部(第二接合凹凸部C1)拉開第一板狀構件B的凹凸部(第一接合凹凸部B1)。
因此,能夠進行藉由內壓差的控制變更分離之凹凸部(非接合凹凸部Cu)的接合、追加按壓及被接合之凹凸部(第一接合凹凸部B1,第二接合凹凸部C1)的分離的反向操作。
其結果,相較於僅具有將模具從被成形物分離之分離功能之習知產品,僅藉由變更變壓室1與第一空間部4的內壓差的設定,就能夠用作被分離之凹凸部(非接合凹凸部Cu)的接合裝置、追加按壓裝置或被接合之凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)的分離裝置,使用方便性優異。
尤其,在被分離之凹凸部(非接合凹凸部Cu)的接合、追加按壓中,能夠沿凹凸部(非接合凹凸部Cu)的表面形狀均等地加壓第一板狀構件B。因此,即使在第一板狀構件B、第二板狀構件C中存在局部厚度不均的情況或在第一板狀構件B與第二板狀構件C之間將微小構造物M以凹凸狀夾持而接合之情況下,亦能夠以均勻的加壓狀態接合而不會使壓力僅集中於微小構造物M等的凸狀部位。藉此,能夠防止凸狀部位的破損,並能夠實現高精度的接合、追加按壓。
According to the microstructure manufacturing apparatus A and the manufacturing method of the microstructure according to the embodiment of the present invention, by accommodating the first plate-shaped member B and the second plate-shaped member C in the
進一步具有第一板狀構件B與第二板狀構件C以相互凹凸狀接合之凹凸部(第一接合凹凸部B1、第二接合凹凸部C1),控制部9藉由室壓調整部5的作動使變壓室1的內壓比第一空間部4的內壓上升更多而使第一板狀構件B與變動部2的變位部位2a一同朝向第一空間部4移動為較佳。
此時,藉由使變壓室1的內壓比第一空間部4的內壓上升更多,第一板狀構件B與變動部2的變位部位2a一同朝向第一空間部4沿厚度方向(Z方向)移動。
因此,將第一板狀構件B的凹凸部(第一接合凹凸部B1)從第二板狀構件C的凹凸部(第二接合凹凸部C1)拉開。
因此,能夠剝離第一板狀構件B與第二板狀構件C的凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)而不使其發生形狀變形(倒塌)。
其結果,相較於從轉印至被成形物之凹凸圖案斜向抽出模具的凹凸圖案之習知產品,即使凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)的突出量變長,亦能夠防止伴隨剝離發生之形狀變形。
因此,在包括奈米壓印之壓印成形等中使用時,能夠製作高精度的凹凸圖案而不會使凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)的凹凸圖案破損。
又,在從黏著夾頭剝離並列配置的微小元件等微小零件Ma並進行微小零件Ma的移交之輸送裝置等的情況下,可以進行高精度的移交而不會使微小零件Ma破損。
Further, the first plate-shaped member B and the second plate-shaped member C have concavo-convex portions (first engaging concave-convex portion B1, second engaging concave-convex portion C1) in which the first plate-like member B and the second plate-like member C are joined in a concavo-convex shape. It is preferable to move the first plate-shaped member B toward the
進一步具備使第一空間部4的內壓下降之第一內壓調整部6為較佳。
此時,藉由變壓室1的內壓上升的同時利用第一內壓調整部6使第一空間部4的內壓下降,變壓室1的內壓與第一空間部4的內壓的壓力差變得更大。
因此,將變動部2朝向第一空間部4吸引之引力增大。
因此,能夠順利地剝離相互凹凸接合之第一板狀構件B與第二板狀構件C的凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。
其結果,可實現剝離能力的提高。
尤其,藉由室壓調整部5(室壓用驅動源、室壓用控制閥5b)或第一內壓調整部6(第一驅動源、第一控制閥6b)中的任一者或兩者的作動控制,對變壓室1的內壓與第一空間部4的內壓階段性地進行相對調整時,能夠更順利地剝離凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。
又,藉由變壓室1的內壓與第一空間部4的內壓的壓力差,第一板狀構件B的第一非對置面Br能夠真空吸附於變動部2的變位部位2a。藉此,藉由變壓室1的內壓與第一空間部4的內壓的壓力差,能夠吸附保持與變動部2的變位部位2a一同朝向第一空間部4移動的第一板狀構件B。
It is preferable to further comprise the 1st internal
進一步具備形成於腔室10的第二室內表面10b與保持部3之間之氣密狀的第二空間部7和使第二空間部7的內壓下降之第二內壓調整部8為較佳。
此時,藉由變壓室1的內壓上升的同時或從變壓室1的內壓上升開始前,使第一空間部4的內壓下降,在變壓室1的內壓與第一空間部4的內壓之間產生壓力差。
因此,第二板狀構件C的第二非對置面Cr藉由壓力差真空吸附於保持部3的保持部位3a。藉此,第二板狀構件C不可移動地吸附保持於保持部位3a。
因此,能夠將第二板狀構件C確實地固定於保持部3的保持部位3a。
其結果,能夠確實地剝離第一板狀構件B與第二板狀構件C的凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。
Further, it is provided with an airtight second space portion 7 formed between the second
又,在第一板狀構件B與第二板狀構件C之間進一步具有從室壓調整部5供應至變壓室1之流體5F能夠侵入的間隙E為較佳。
此時,由於變壓室1與第一空間部4的壓力差,會產生將變動部2朝向第一空間部4吸引之引力的同時,從室壓調整部5供應至變壓室1之正壓流體5F侵入間隙E而產生將第一板狀構件B與第二板狀構件C的凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)相對推開之斥力。
因此,藉由引力與斥力相互作用,能夠更順利地剝離凹凸部(第一接合凹凸部B1、第二接合凹凸部C1)。
其結果,可實現剝離能力的進一步提高。
In addition, it is preferable to further have a gap E between the first plate-shaped member B and the second plate-shaped member C through which the
又,第一板狀構件B或第二板狀構件C中的任一者具有強接著面D3,另一者具有隔著弱接著面D4裝卸自如地並列設置的複數個微小構造體M1,控制部9以如下方式控制為較佳:藉由室壓調整部5的作動,第一空間部4的內壓比變壓室1的內壓上升更多,由此第一板狀構件B朝向第二板狀構件C移動,接著變壓室1的內壓比第一空間部4的內壓上升更多,由此第一板狀構件B朝向第一空間部4移動。
此時,藉由使第一空間部4的內壓比變壓室1的內壓上升更多,第一板狀構件B朝向第二板狀構件C移動。因此,第一板狀構件B與第二板狀構件C靠近,複數個微小構造體M1的表面(非接合凹凸部Cu)與強接著面D3接合。
接著,藉由使變壓室1的內壓比第一空間部4的內壓上升更多,第一板狀構件B朝向第一空間部4移動。因此,第一板狀構件B從第二板狀構件C分離,將複數個微小構造體M1的背面(接合部Mr)從弱接著面D4拉開。
因此,能夠以不改變排列狀態的方式對複數個微小構造體M1進行表背反轉而從第一板狀構件B或第二板狀構件C中的任一者轉移至另一者。
其結果,可以高精度地進行複數個微小構造體M1的轉移而不使其受損,並且藉由表背反轉,能夠使轉移前被接合之複數個微小構造體M1的背面(接合部Mr)露出。
Further, either the first plate-shaped member B or the second plate-shaped member C has a strong adhesive surface D3, and the other has a plurality of microstructures M1 detachably arranged in parallel with the weak adhesive surface D4 interposed therebetween, and the control The
另外,在前述實施形態(第一實施形態~第七實施形態)中,圖示例中僅示出了第一板狀構件B及第二板狀構件C係矩形的情況,但並不限定於此,除了矩形以外,亦可以為圓形等。 進而,在第二實施形態的圖示例中僅示出了微小成形物M2的分體式,但並不限定於此,亦可以為第一板狀構件B或第二板狀構件C中的任一者的整體成為成形模具Mb且另一者的整體成為成形基板Mc之一體式。 又,在第四實施形態~第六實施形態的圖示例中僅示出第二實施形態(分離裝置)的變形例,在第七實施形態的圖示例中僅示出第三實施形態(轉印裝置)的變形例,但並不限定於此,亦可以為第四實施形態~第七實施形態未圖示之第一實施形態(接合裝置)、第二實施形態(分離裝置)、第三實施形態(轉印裝置)。 在該種情況下,亦可獲得與前述第一實施形態~第七實施形態相同的作用、優點。 In addition, in the aforementioned embodiments (the first to seventh embodiments), only the case where the first plate-shaped member B and the second plate-shaped member C are rectangular is shown in the illustrated example, but it is not limited to Here, in addition to a rectangle, a circle or the like may be used. Furthermore, in the illustration example of the second embodiment, only the split type of the micromolded object M2 is shown, but it is not limited to this, and either the first plate-shaped member B or the second plate-shaped member C may be used. The entirety of one becomes the molding die Mb, and the entirety of the other becomes an integral form of the molding substrate Mc. In addition, in the illustration examples of the fourth to sixth embodiments, only a modification of the second embodiment (separation device) is shown, and in the illustration examples of the seventh embodiment, only the third embodiment ( A modification of the transfer device), but not limited to this, the fourth to seventh embodiments may be the first embodiment (bonding device), the second embodiment (separating device), the first embodiment (separating device), and the The third embodiment (transfer device). Even in this case, the same functions and advantages as those of the first to seventh embodiments described above can be obtained.
1:變壓室 2:變動部 2a:變位部位 2b:第一通風口 3:保持部 3a:保持部位 3b:第二通風口 4:第一空間部 5:室壓調整部 5a:室流路 5F:流體 6:第一內壓調整部 6a:第一流路 6F:第一流體 7:第二空間部 8:第二內壓調整部 8a:第二流路 8F:第二流體 9:控制部 10:腔室 10a:第一室內表面 10b:第二室內表面 10c:出入口 10d:驅動機構 11:第一腔室 12:第二腔室 13:密封材料 21:彈性通風體 21a:安裝部位 31:保持用環狀體 31a:保持用固定部位 A, A1:微小構造物製造裝置 B:第一板狀構件 B1:凹凸部(第一接合凹凸部) Bf:第一對置面 Br:第一非對置面 C:第二板狀構件 C1:凹凸部(第二接合凹凸部) Cf:第二對置面 Cr:第二非對置面 Cu:凹凸部(非接合凹凸部) D1:固定層 D2:保持夾頭 D3:強接著面 D4:弱接著面 E:間隙 M, M1:微小構造物 Ma:微小零件 Mf:非接合部 Mr:接合部 1: Transformer room 2: Change Department 2a: Displacement site 2b: First vent 3: Holding Department 3a: Holding part 3b: Second vent 4: The first space department 5: Room pressure adjustment part 5a: Chamber flow path 5F: Fluid 6: The first internal pressure adjustment part 6a: First flow path 6F: First Fluid 7: Second Space Department 8: Second internal pressure adjustment part 8a: Second flow path 8F: Second fluid 9: Control Department 10: Chamber 10a: First interior surface 10b: Second interior surface 10c: Entrance and exit 10d: drive mechanism 11: The first chamber 12: Second chamber 13: Sealing material 21: Elastic ventilation body 21a: Installation part 31: Ring body for holding 31a: Fixing parts for holding A, A1: Microstructure manufacturing device B: First plate-like member B1: Concave-convex part (first joint concave-convex part) Bf: First Opposite Surface Br: first non-opposite surface C: Second plate member C1: Concave-convex part (second joint concave-convex part) Cf: Second Opposite Surface Cr: Second non-opposite surface Cu: Concave-convex part (non-bonded concave-convex part) D1: Fixed layer D2: Hold the collet D3: Strong Adhesion D4: Weak contact surface E: Clearance M, M1: tiny structures Ma: tiny parts Mf: non-joint part Mr:Joint
圖1係表示本發明的實施形態(第一實施形態)之微小構造物製造裝置及微小構造物的製造方法(接合裝置及接合方法)的整體構造之說明圖,圖1(a)係搬入後的縱斷前視圖,圖1(b)係圖1(a)的橫斷俯視圖。 圖2係表示上述接合方法的搬入步驟~保持步驟之說明圖,圖2(a)係一次搬入過程的縱斷前視圖,圖2(b)係二次搬入過程的縱斷前視圖,圖2(c)係保持步驟的縱斷前視圖。 圖3係表示上述接合方法的保持步驟~搬出步驟之說明圖,圖3(a)係關閉腔室後的縱斷前視圖,圖3(b)係差壓過程及加壓接合過程的縱斷前視圖,圖3(c)係大氣開放過程及搬出步驟的縱斷前視圖。 圖4係表示本發明的實施形態(第二實施形態)之微小構造物製造裝置及微小構造物的製造方法(分離裝置及分離方法)的整體構造之說明圖,圖4(a)係搬入後的縱斷前視圖,圖4(b)係圖4(a)的橫斷俯視圖,圖4(c)係將一部分局部放大之縱斷前視圖。 圖5係表示上述分離方法的保持步驟~室壓調整步驟之說明圖,圖5(a)係關閉腔室後的縱斷前視圖,圖5(b)係差壓過程的縱斷前視圖,圖5(c)係剝離過程的縱斷前視圖。 圖6係表示上述分離方法的室壓調整步驟~搬出步驟之說明圖,圖6(a)係大氣開放過程的縱斷前視圖,圖6(b)係一次搬出過程的縱斷前視圖,圖6(c)係二次搬出過程的縱斷前視圖。 圖7係表示本發明的實施形態(第三實施形態)之微小構造物製造裝置及微小構造物的製造方法(轉印裝置及轉印方法)的整體構造之說明圖,圖7(a)係搬入後的縱斷前視圖,圖7(b)係圖7(a)的橫斷俯視圖。 圖8係表示上述轉印方法的搬入步驟~保持步驟之說明圖,圖8(a)係一次搬入過程的縱斷前視圖,圖8(b)係二次搬入過程的縱斷前視圖,圖8(c)係保持步驟的縱斷前視圖。 圖9係表示上述轉印方法的保持步驟~室壓調整步驟之說明圖,圖9(a)係關閉腔室後的縱斷前視圖,圖9(b)係差壓過程及加壓接合過程的縱斷前視圖,圖9(c)係差壓過程及剝離過程的縱斷前視圖。 圖10係表示上述轉印方法的室壓調整步驟~搬出步驟之說明圖,圖10(a)係大氣開放過程的縱斷前視圖,圖10(b)係一次搬出過程的縱斷前視圖,圖10(c)係二次搬出過程的縱斷前視圖。 圖11係表示本發明的實施形態之微小構造物製造裝置及微小構造物的製造方法的變形例(第四實施形態)之說明圖,圖11(a)係搬入後的縱斷前視圖,圖11(b)係差壓過程的縱斷前視圖,圖11(c)係剝離過程的縱斷前視圖。 圖12係表示本發明的實施形態之微小構造物製造裝置及微小構造物的製造方法的變形例(第五實施形態)之說明圖,圖12(a)係搬入後的縱斷前視圖,圖12(b)係差壓過程的縱斷前視圖,圖12(c)係剝離過程的縱斷前視圖。 圖13係表示本發明的實施形態之微小構造物製造裝置及微小構造物的製造方法的變形例(第六實施形態)之說明圖,圖13(a)係搬入後的縱斷前視圖,圖13(b)係差壓過程的縱斷前視圖,圖13(c)係剝離過程的縱斷前視圖。 圖14係表示本發明的實施形態之微小構造物製造裝置及微小構造物的製造方法的變形例(第七實施形態)之說明圖,圖14(a)係搬入後的縱斷前視圖,圖14(b)係差壓過程的縱斷前視圖,圖14(c)係剝離過程的縱斷前視圖。 圖15係表示習知之分離方法的一例之說明圖,圖15(a)係剝離前的局部放大縱斷前視圖,圖15(b)係剝離中的局部放大縱斷前視圖,圖15(c)係剝離後的局部放大縱斷前視圖。 FIG. 1 is an explanatory diagram showing the overall structure of an apparatus for manufacturing a microstructure and a method for manufacturing a microstructure (a bonding apparatus and a bonding method) according to an embodiment (first embodiment) of the present invention, and FIG. 1( a ) is after loading The longitudinal front view of Fig. 1(b) is the cross-sectional top view of Fig. 1(a). Fig. 2 is an explanatory view showing the carrying-in step to the holding step of the above-mentioned joining method, Fig. 2(a) is a longitudinally cut front view of the primary carrying-in process, Fig. 2(b) is a longitudinally-cut front view of the secondary carrying-in process, Fig. 2 (c) Longitudinal front view of the retention step. Fig. 3 is an explanatory view showing the holding step to the unloading step of the above-mentioned joining method, Fig. 3(a) is a longitudinally cut front view after the chamber is closed, and Fig. 3(b) is a longitudinal cut of a differential pressure process and a pressure welding process Front view, Fig. 3(c) is a longitudinal front view of the process of opening the atmosphere and the step of taking it out. FIG. 4 is an explanatory diagram showing the overall structure of the apparatus for manufacturing microstructures and the method for manufacturing microstructures (separation apparatus and separation method) according to an embodiment (second embodiment) of the present invention, and FIG. 4( a ) is after the loading Fig. 4(b) is a cross-sectional top view of Fig. 4(a), and Fig. 4(c) is a partial enlarged longitudinal front view. Fig. 5 is an explanatory view showing the holding step to the chamber pressure adjustment step of the above separation method, Fig. 5(a) is a longitudinally cut front view after the chamber is closed, and Fig. 5(b) is a longitudinally cut front view of the differential pressure process, Figure 5(c) is a longitudinal front view of the peeling process. Fig. 6 is an explanatory view showing the chamber pressure adjustment step to the unloading step of the above-mentioned separation method, Fig. 6(a) is a longitudinal front view of the atmospheric opening process, and Fig. 6(b) is a longitudinal cut front view of the primary unloading process, Fig. 6(c) is the longitudinal front view of the secondary removal process. 7 is an explanatory diagram showing the overall structure of an apparatus for producing a microstructure and a method for producing a microstructure (transfer device and transfer method) according to an embodiment (third embodiment) of the present invention, and FIG. 7( a ) is a Fig. 7(b) is a cross-sectional plan view of Fig. 7(a), which is a vertical cross-sectional front view after being carried in. FIG. 8 is an explanatory diagram showing the carrying-in step to the holding step of the above-mentioned transfer method, FIG. 8( a ) is a longitudinally cut front view of the primary carrying-in process, and FIG. 8( b ) is a vertical-cut front view of the secondary carrying-in process, FIG 8(c) is a longitudinal front view of the retention step. FIG. 9 is an explanatory diagram showing the holding step to the chamber pressure adjustment step of the above-mentioned transfer method, FIG. 9( a ) is a longitudinally cut front view after closing the chamber, and FIG. 9( b ) is a differential pressure process and a press bonding process Figure 9(c) is the longitudinal front view of the differential pressure process and the peeling process. Fig. 10 is an explanatory view showing the chamber pressure adjustment step to the unloading step of the above-mentioned transfer method, Fig. 10(a) is a longitudinal front view of the atmosphere opening process, and Fig. 10(b) is a longitudinal front view of the primary unloading process, Fig. 10(c) is a longitudinal front view of the secondary removal process. FIG. 11 is an explanatory diagram showing a modification example (fourth embodiment) of the apparatus for manufacturing a microstructure and the method for manufacturing a microstructure according to the embodiment of the present invention, and FIG. 11(b) is the longitudinal front view of the differential pressure process, and Fig. 11(c) is the longitudinal front view of the peeling process. Fig. 12 is an explanatory diagram showing a modification example (fifth embodiment) of the apparatus for manufacturing a microstructure and the method for manufacturing a microstructure according to the embodiment of the present invention, and Fig. 12(a) is a longitudinally cut front view after loading, Fig. 12(a) 12(b) is the longitudinal front view of the differential pressure process, and Fig. 12(c) is the longitudinal front view of the peeling process. 13 is an explanatory diagram showing a modification example (sixth embodiment) of the apparatus for manufacturing a microstructure and the method for manufacturing a microstructure according to the embodiment of the present invention, and FIG. 13( a ) is a longitudinally cut front view after being loaded in, FIG. 13(b) is the longitudinal front view of the differential pressure process, and Fig. 13(c) is the longitudinal front view of the peeling process. FIG. 14 is an explanatory diagram showing a modification (seventh embodiment) of the apparatus for manufacturing a microstructure and the method for manufacturing a microstructure according to the embodiment of the present invention, and FIG. 14( a ) is a longitudinally cut front view after being loaded in, and FIG. 14(b) is a longitudinal front view of the differential pressure process, and Fig. 14(c) is a longitudinal front view of the peeling process. Fig. 15 is an explanatory view showing an example of a conventional separation method, Fig. 15(a) is a partially enlarged longitudinal front view before peeling, Fig. 15(b) is a partially enlarged longitudinal front view during peeling, Fig. 15(c) ) is a partially enlarged longitudinal section front view after stripping.
1:變壓室
2:變動部
2a:變位部位
2b:第一通風口
3:保持部
3a:保持部位
3b:第二通風口
4:第一空間部
5a:室流路
5F:流體
6a:第一流路
6F:第一流體
7:第二空間部
8a:第二流路
8F:第二流體
10:腔室
10a:第一室內表面
10b:第二室內表面
10c:出入口
10d:驅動機構
11:第一腔室
12:第二腔室
13:密封材料
21:彈性通風體
21a:安裝部位
31:保持用環狀體
31a:保持用固定部位
A, A1:微小構造物製造裝置
B:第一板狀構件
Bf:第一對置面
Br:第一非對置面
C:第二板狀構件
Cf:第二對置面
Cr:第二非對置面
Cu:凹凸部(非接合凹凸部)
D:保持機構
D1:固定層
D2:保持夾頭
M,M1:微小構造體
Ma:微小零件
Mf:非接合部
Mr:接合部
1: Transformer room
2:
Claims (14)
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WOPCT/JP2021/009784 | 2021-03-11 | ||
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007230235A (en) * | 2006-03-01 | 2007-09-13 | Hitachi Global Storage Technologies Netherlands Bv | Method and apparatus for separating stamper from pattern formed substrate |
JP2010258274A (en) * | 2009-04-27 | 2010-11-11 | Shin-Etsu Engineering Co Ltd | Laminating method and device |
JP2012045842A (en) * | 2010-08-27 | 2012-03-08 | Toshiba Mach Co Ltd | Transfer device and transfer method |
JP2012227430A (en) * | 2011-04-21 | 2012-11-15 | Hoya Corp | Nanoimprint device and mold release method |
WO2013076874A1 (en) * | 2011-11-25 | 2013-05-30 | 信越エンジニアリング株式会社 | Wafer transport apparatus and wafer assembly line |
TWI663472B (en) * | 2014-07-25 | 2019-06-21 | 日商綜研化學股份有限公司 | Manufacturing method of fine structure |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100504080B1 (en) * | 2003-05-26 | 2005-07-27 | 한국기계연구원 | Uv nanoimprint lithography using the selective added pressure |
KR100913497B1 (en) * | 2007-12-27 | 2009-08-25 | 한국산업기술대학교산학협력단 | Apparatus and method for imprinting |
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JP2012213889A (en) * | 2011-03-31 | 2012-11-08 | Hoya Corp | Imprint device and demolding method |
WO2015072572A1 (en) | 2013-11-18 | 2015-05-21 | Scivax株式会社 | Mold release device and mold release method |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007230235A (en) * | 2006-03-01 | 2007-09-13 | Hitachi Global Storage Technologies Netherlands Bv | Method and apparatus for separating stamper from pattern formed substrate |
JP2010258274A (en) * | 2009-04-27 | 2010-11-11 | Shin-Etsu Engineering Co Ltd | Laminating method and device |
JP2012045842A (en) * | 2010-08-27 | 2012-03-08 | Toshiba Mach Co Ltd | Transfer device and transfer method |
JP2012227430A (en) * | 2011-04-21 | 2012-11-15 | Hoya Corp | Nanoimprint device and mold release method |
WO2013076874A1 (en) * | 2011-11-25 | 2013-05-30 | 信越エンジニアリング株式会社 | Wafer transport apparatus and wafer assembly line |
TWI663472B (en) * | 2014-07-25 | 2019-06-21 | 日商綜研化學股份有限公司 | Manufacturing method of fine structure |
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