KR102637392B1 - Microstructure manufacturing apparatus and microstructure manufacturing method - Google Patents

Abstract

By changing the control of the internal pressure difference, the opposite operation of joining or additional pressure of the separated uneven parts and separation of the joined uneven parts is performed. Provided between a pressure chamber formed inside the chamber to accommodate the first plate member and the second plate member to be accessible, and the first non-opposing surface of the first plate member accommodated in the transformation chamber and the first interior surface of the chamber. A support portion provided between the variable portion, the second non-opposing surface of the second plate-shaped member accommodated in the transformer chamber, and the second interior surface of the chamber, and a support portion provided between the first interior surface of the chamber and the variable portion, are separated from the transformer chamber to ensure airtightness. a first space portion provided, a real pressure adjusting section that increases the internal pressure of either the variable pressure chamber or the first space section relative to the internal pressure of the other, and a control section that controls the operation of the real pressure adjusting section, wherein the variable section is the first space portion of the chamber. It has a displacement portion that contacts a first non-opposing surface of the first plate-shaped member with respect to the interior and can be deformed or moved in the thickness direction thereof, and the support portion is a second non-opposing surface of the second plate-shaped member with respect to the second interior surface of the chamber. It has a support portion for supporting, and the control portion causes the first plate-shaped member to move toward the second plate-shaped member or the first space portion together with the displacement portion of the variable portion due to the pressure difference between the pressure change chamber and the first space portion due to the operation of the actual pressure adjusting portion. A microstructure manufacturing device characterized in that control.

Description

Microstructure manufacturing apparatus and microstructure manufacturing method

The present invention provides microstructures including microstructures containing microelements such as microLEDs and microchips, micromolded articles molded using microprocessing technologies such as nanoimprint, and microinsulating pieces containing glass small pieces. It relates to a microstructure manufacturing device used for production and a microstructure manufacturing method using the microstructure manufacturing device.

In detail, it relates to a microstructure manufacturing apparatus used for bonding or additional pressing of separated microstructures, separation (peeling) of bonded microstructures, or transfer of microstructures, and a microstructure manufacturing method. .

Conventionally, this type of microstructure manufacturing apparatus includes a mold, at least one of which is in the form of a film, a peeling prevention means for pressurizing the molded object so that it does not peel off to a predetermined peeling position, and a device for supporting either the mold or the molded object. There is a mold release device including a support portion, tension-applying means for applying tension to the mold or object, means for preventing separation, and moving means for relatively moving the mold and object (for example, patent document 1).

Using nanoimprint technology, a molded pattern is pressed onto a molded object such as resin, the molded pattern is transferred to the molded object using heat or light, and then the mold is released from the molded object.

In the illustrated example of Patent Document 1, a mold formed of a flexible film is peeled from the peeling position with respect to the molded object supported by a support portion, and the angle between the mold after peeling and the molded object is adjusted to be constant. Adjustment means are provided. That is, the forming pattern of the mold is obliquely pulled out from the object to be molded at a certain mold release angle by means of the angle adjustment means.

Patent Document 1: International Publication No. 2015/072572

However, in Patent Document 1, since the molding pattern of the mold is pulled out in an oblique direction at a predetermined angle with respect to the uneven pattern transferred to the molded object, the uneven pattern of the molded object is deformed in shape during the peeling process, causing damage.

In detail, the case of nano imprint shown in Figures 15 (a) to (c) will be described.

In the state before peeling shown in (a) of FIG. 15, the uneven pattern 210 transferred to the molded object 200 by uneven bonding with the molded pattern 110 of the mold 100 is formed on the molded object 200. It stands vertically with respect to the bottom surface 220.

However, in the state at the time of peeling shown in Figure 15(b), as the forming pattern 110 of the mold 100 is pulled out in the oblique direction, the convex-shaped portion ( 211) is tilted.

For this reason, even in the state after peeling shown in Figure 15(c), the convex-shaped portion 211 of the concavo-convex pattern 210 that has been tilted once remains tilted and does not return to the state before peeling.

In this way, when the direction in which the forming pattern 110 of the mold 100 is pulled out from the uneven pattern 210 of the molded object 200 (peeling direction) is oblique, the shape deforms, especially as the uneven difference between the uneven patterns 210 becomes longer. There was a problem that it became prone to tilting and high-precision imprint molding could not be achieved.

In particular, in the case of nano imprint, since the concavo-convex pattern is extremely fine, even a slight shape deformation (tilt) during peeling can cause damage to the concavo-convex pattern, causing the problem that high-precision concavo-convex patterns cannot be produced.

However, it is not limited to micro-molded articles molded and processed using nanoimprint technology, but microstructures containing micro-elements such as micro LEDs or microchips, micro-structures made of micro-insulating pieces containing glass fragments, etc. may be small in size. In addition, it is difficult to handle because it is easy to take damage. For this reason, in addition to a separation device including a release device such as Patent Document 1, there is a demand for a device for joining separated microstructures, an additional pressing device, and a transfer device for microstructures.

Under such circumstances, there is a demand for a manufacturing device that can perform bonding, additional pressing, separation, transfer, etc. of microstructures in the same structure.

In order to solve this problem, the microstructure manufacturing apparatus according to the present invention is provided by joining or convexing the uneven portions of either or both of the first opposing surface of the first plate-shaped member or the second opposing surface of the second plate-shaped member. An apparatus for manufacturing a microstructure that separates, comprising: a pressure chamber formed inside the chamber to accommodate the first plate member and the second plate member so that they can enter and exit; and a first non-opposing surface of the first plate member accommodated in the transformation chamber. and a variable portion provided between the first interior surface of the chamber, a support portion provided between the second non-opposing surface of the second plate-shaped member accommodated in the pressure transformation chamber and the second interior surface of the chamber, and A first space portion separated from the transformer chamber and provided between the first interior surface of the chamber and the variable portion in an airtight manner, and an internal pressure of either the transformer chamber or the first space portion is distributed to the other side. It has an actual pressure adjustment unit that increases the internal pressure, and a control unit that controls the operation of the actual pressure adjustment unit, wherein the variable section includes the first non-opposing surface of the first plate-shaped member with respect to the first interior surface of the chamber. and a displacement portion that abuts to be deformable or movable in the thickness direction, wherein the support portion has a support portion that supports the second non-opposing surface of the second plate-shaped member with respect to the second interior surface of the chamber, The control unit moves the first plate-shaped member together with the displacement part of the variable unit toward the second plate-shaped member or the first space due to a pressure difference between the transformation chamber and the first space due to the operation of the actual pressure adjustment unit. It is characterized in that it is controlled to do so.

In addition, in order to solve such problems, the method for manufacturing microstructures according to the present invention is to provide irregularities on either or both of the first opposing surface of the first plate-shaped member or the second opposing surface of the second plate-shaped member, which are opposed to each other. A method of manufacturing a microstructure for bonding or separating, comprising: a loading step of placing the first plate-shaped member and the second plate-shaped member into a pressure chamber formed inside a chamber, and moving the first plate-shaped member along a first interior surface of the chamber. a support step of positioning and positioning the second plate-shaped member along a second interior surface of the chamber, an actual pressure adjustment step of adjusting an internal pressure of the pressure transformation chamber, the first plate-shaped member and the second plate-shaped member; A carrying out step of taking out from the pressure transformation chamber, wherein in the supporting step, the first plate shape The first non-opposing surface of the member is brought into contact with the first interior surface in the thickness direction, and the first non-opposing surface becomes movable with respect to the first interior surface as the displacement portion is deformed or moved in the thickness direction. Together, a first space portion is provided between the first indoor surface and the variable portion in an airtight manner separated from the pressure transformer chamber, and a support portion is provided between the second non-opposing surface of the second plate-shaped member and the second indoor surface. The second non-opposing surface of the second plate member is supported in the thickness direction with respect to the support portion of The internal pressure of one side is increased relative to the internal pressure of the other side, and the first plate-shaped member moves toward the second plate-shaped member or the first space portion together with the displacement portion of the motion variable section.

1 is an explanatory diagram showing the overall configuration of a microstructure manufacturing device and a microstructure manufacturing method (joining device and joining method) according to an embodiment (first embodiment) of the present invention, with (a) being a longitudinal front view after loading; , (b) is a transverse plan view of (a) in Figure 1.
Figure 2 is an explanatory diagram showing the loading process to the support process of the same joining method, where (a) is a longitudinal front view of the first loading process, (b) is a longitudinal front view of the second loading process, and (c) is a support process. This is a longitudinal front view of.
Figure 3 is an explanatory diagram showing the support process to the unloading process of the same joining method, (a) is a longitudinal front view after chamber closure, (b) is a longitudinal front view of the differential pressure process and the pressure bonding process, (c) ) is a longitudinal front view of the atmospheric opening process and unloading process.
Figure 4 is an explanatory diagram showing the overall configuration of a microstructure manufacturing device and a microstructure manufacturing method (separation device and separation method) according to an embodiment (second embodiment) of the present invention, where (a) is a longitudinal front view after loading; , (b) is a transverse plan view of (a) in Figure 4, and (c) is a partially enlarged longitudinal front view.
Figure 5 is an explanatory diagram showing the support process to the actual pressure adjustment process of the same separation method, where (a) is a longitudinal front view after chamber closure, (b) is a longitudinal front view of the differential pressure process, and (c) is a longitudinal front view of the peeling process. am.
Figure 6 is an explanatory diagram showing the actual pressure adjustment process to the export process of the same separation method, where (a) is a longitudinal front view of the atmospheric release process, (b) is a longitudinal front view of the first export process, and (c) is a secondary This is a longitudinal front view of the unloading process.
7 is an explanatory diagram showing the overall configuration of a microstructure manufacturing device and a microstructure manufacturing method (transfer device and transfer method) according to an embodiment (third embodiment) of the present invention, where (a) is a longitudinal front view after loading; , (b) is a transverse plan view of (a) in Figure 7.
Figure 8 is an explanatory diagram showing the loading process to the support process of the same transfer method, where (a) is a longitudinal front view of the first loading process, (b) is a longitudinal front view of the second loading process, and (c) is a support process. This is a longitudinal front view of.
Figure 9 is an explanatory diagram showing the support process to the actual pressure adjustment process of the same transfer method, where (a) is a longitudinal front view after chamber closure, (b) is a longitudinal front view of the differential pressure process and the pressure bonding process, and (c) is the differential pressure. This is a longitudinal front view of the process and peeling process.
Figure 10 is an explanatory diagram showing the actual pressure adjustment process to the export process of the same transfer method, where (a) is a longitudinal front view of the atmospheric release process, (b) is a longitudinal front view of the first export process, and (c) is a secondary export process. This is a longitudinal front view of the unloading process.
11 is an explanatory diagram showing a modification (fourth embodiment) of the microstructure manufacturing apparatus and microstructure manufacturing method according to an embodiment of the present invention, where (a) is a longitudinal front view after loading and (b) is a pressure differential process. (c) is the longitudinal front view of the peeling process.
Figure 12 is an explanatory diagram showing a modification (fifth embodiment) of the microstructure manufacturing apparatus and microstructure manufacturing method according to an embodiment of the present invention, where (a) is a longitudinal front view after loading and (b) is a pressure differential process. (c) is the longitudinal front view of the peeling process.
13 is an explanatory diagram showing a modification (sixth embodiment) of the microstructure manufacturing apparatus and microstructure manufacturing method according to an embodiment of the present invention, where (a) is a longitudinal front view after loading and (b) is a pressure differential process. (c) is the longitudinal front view of the peeling process.
14 is an explanatory diagram showing a modification (seventh embodiment) of the microstructure manufacturing apparatus and microstructure manufacturing method according to an embodiment of the present invention, where (a) is a longitudinal front view after loading and (b) is a pressure differential process. (c) is the longitudinal front view of the peeling process.
Figure 15 is an explanatory diagram showing an example of a conventional separation method, where (a) is a partially enlarged longitudinal front view before peeling, (b) is a partially enlarged longitudinal front view during peeling, and (c) is a partially enlarged longitudinal front view after peeling. .

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

As shown in FIGS. 1 to 14, the microstructure manufacturing apparatus (A) and the microstructure manufacturing method according to an embodiment of the present invention include either a first plate-shaped member (B) or a second plate-shaped member (C) facing each other. A manufacturing apparatus and manufacturing method for producing a microstructure (M) by joining or separating uneven portions of one or both of a first plate-shaped member (B) and a second plate-shaped member (C). The joining or separation of the uneven portions is performed by relative approaching or moving the first plate-shaped member (B) and the second plate-shaped member (C) in opposite directions.

The first plate-shaped member (B) and the second plate-shaped member (C) are made of a hard material such as glass or synthetic resin, and are formed into a rectangular (quadrilateral with right-angled corners, including rectangles and squares) or circular thin plate shapes.

A first opposing surface Bf on the surface side of the first plate member B facing the second plate member C, and a first opposing surface Bf on the surface side facing the first plate member B in the second plate member C. The second opposing surface Cf on the surface side is either the first opposing surface Bf or the second opposing surface Cf, or both the first opposing surface Bf and the second opposing surface Cf. , and has uneven portions that become part of the microstructure M described later.

That is, the microstructure (M) described later with respect to the first opposing surface (Bf) of the first plate-shaped member (B) or the second opposing surface (Cf) of the second plate-shaped member (C) is permanently fixed by adhesive or the like, Alternatively, it is temporarily fixed using a removable support, or is integrated into an integrated form and arranged in an uneven manner. For this reason, as the support means D for the microstructure M described later, in the case of main fixation, a fixing layer D1 such as an adhesive is applied to the first opposing surface Bf or the second opposing surface Bf of the first plate-shaped member B. It is provided on the second opposing surface Cf of the plate-shaped member C, and in the case of temporary fixation, the support chuck D2 is placed on the first opposing surface Bf of the first plate-shaped member B or the second plate-shaped member C. ) is provided on the second opposing surface (Cf). Specific examples of the support chuck D2 include a vacuum chuck, an adhesive chuck using an adhesive member, and an electrostatic chuck using electrostatic adsorption.

The microstructure (M) includes a microstructure (M1) having microelements such as microLEDs and microchips, microinsulating pieces such as small pieces of glass, and microcomponents Ma that protrude in an uneven shape, such as microcomponents similar to these. , there is a micro-molded product (M2) having a mold (Mb) and a molded substrate (Mc) that are joined to each other in a concave-convex shape, which are molded and processed using a micro-processing technology such as nano imprint.

As shown in FIGS. 1 to 3, the microstructure M1 is joined so as to sandwich the microcomponent Ma disposed (mounted) between the first plate-shaped member B and the second plate-shaped member C. As shown in FIGS. 7 to 10, a lamination type and a transfer type in which the minute component Ma disposed (mounted) on either the first plate-shaped member B or the second plate-shaped member C is transferred to the other side. There is. In general, the minute parts Ma are often arranged in a plurality arranged in parallel at predetermined intervals with respect to the first plate-shaped member B or the second plate-shaped member C.

For this reason, regardless of whether the lamination type or the transfer type is used, in the initial state before joining, the first opposing surface Bf of the first plate-shaped member B or the second opposing surface Cf of the second plate-shaped member C ), the minute component Ma disposed on one side (the second opposing surface Cf in the illustrated example) partially protrudes toward the other side. For this reason, either the first opposing surface Bf of the first plate-shaped member B or the second opposing surface Cf of the second plate-shaped member C is a non-contact contact with the minute component Ma partially protruding. It has an uneven portion (non-bonded uneven portion (Cu)).

As an example of a microstructure manufacturing apparatus (A) and a microstructure manufacturing method for manufacturing a laminated type microstructure (M1) in which a non-contact concavo-convex portion (Cu) is joined as a non-contact concavo-convex portion, a bonding device or a bonding method is used. do.

As another example of the microstructure manufacturing apparatus (A) and the microstructure manufacturing method for manufacturing a transfer type microstructure (M1) in which the non-contact concavo-convex portion (Cu) is transferred as a non-contact concavo-convex portion, a transfer device or a transfer method is used. do.

In the micro-molded product M2, as shown in FIGS. 4 to 6, a mold Mb or the like is disposed on either the first plate-shaped member B or the second plate-shaped member C, and a molded substrate is placed on the other side. (Mc), etc. are arranged and concavo-convex jointed to each other, and the entirety of either the first plate-shaped member (B) or the second plate-shaped member (C) becomes a mold (Mb), and the entirety of the other is a molded substrate. (Mc) There is an integrated type (not shown) in which the uneven joints are joined together. In addition, although not shown in the micro molded product M2, a micro component Ma is disposed on either the first plate-shaped member B or the second plate-shaped member C, and the micro component Ma is detachably supported. Separate types and integrated types in which support means such as adhesive chucks are arranged on the other side are also included.

For this reason, regardless of whether it is a separate type or an integrated type, in the initial state before separation, the forming die Mb or the minute component Ma of either the first plate-shaped member B or the second plate-shaped member C and a pair of uneven portions (the first bonded uneven portion B1 and the second bonded uneven portion C1) that are unevenly joined to the other molded substrate Mc or support means.

A separate type having a first bonded uneven portion (B1) and a second bonded uneven portion (C1), which are uneven portions in which the mold (Mb), micropart (Ma), etc., and the molded substrate (Mc) or support means, etc. are unevenly joined. As another example of the microstructure manufacturing apparatus (A) and the microstructure manufacturing method for manufacturing the integrated micromolded product (M2), a separation device or a separation method is used.

In particular, in the case of the micro-molded product M2, it is preferable to have a gap E between the first plate-shaped member B and the second plate-shaped member C. As a specific example of the gap E, the outer gap E1, such as a square frame shape or annular shape, is formed on the outside of the plurality of first joint uneven portions B1 and second joint uneven portions C1 shown in Figures 4, 5, etc. ), a through gap E2 passing between the plurality of first joint uneven portions B1 and second joint uneven portions C1, the first plate-shaped member B or the second plate-shaped member shown in FIG. 13 ( There is an inner gap (E3) that communicates with the through hole (h) drilled in C).

In detail, the microstructure manufacturing apparatus (A) according to the embodiment of the present invention includes a pressure transformation chamber (1) in which the first plate-shaped member (B) and the second plate-shaped member (C) are accommodated, and the pressure transformation chamber (1). A variable portion (2) provided on the rear side of the first plate-shaped member (B) accommodated in the pressure change chamber (1), a support portion (3) provided on the other rear side of the second plate-shaped member (C) accommodated in the pressure transformation chamber (1), The main elements include a first space 4 provided separately from the transformer chamber 1 and an actual pressure adjuster 5 provided to generate a pressure difference in the internal pressure of the transformer chamber 1 and the first space portion 4. It is provided as a component.

In addition, the first internal pressure adjustment unit 6 that changes the internal pressure of the first space 4, the second space 7 provided separately from the pressure transformation chamber 1, and the second space 7 It is desirable to provide a second internal pressure adjusting unit 8 that changes the internal pressure, and a control unit 9 that operates and controls the actual pressure adjusting unit 5, the first internal pressure adjusting unit 6, and the second internal pressure adjusting unit 8.

In addition, the first plate-shaped member (B) and the second plate-shaped member (C) are usually arranged to face each other in the vertical direction, and the thickness direction of the first plate-shaped member (B) and the second plate-shaped member (C) is hereinafter referred to as " It is called “Z direction”. The direction along the first plate-shaped member (B) and the second plate-shaped member (C) that intersect the Z direction is hereinafter referred to as the "XY direction".

In the illustrated example, a rectangular first plate-shaped member B is disposed above, and a rectangular second plate-shaped member C is disposed below. In addition, as other examples, although not shown, conversely, the rectangular first plate-shaped member B is disposed downward and the rectangular second plate-shaped member C is disposed upward, or the circular first plate-shaped member B ) and arranging the circular second plate-shaped member C above and below are also possible.

The transformation chamber 1 is formed to be sealable inside the chamber 10, and spans the transformation chamber 1 within the chamber 10 and the external space of the chamber 10, and includes the first plate-shaped member B and the second plate-shaped member B. 2 The plate-shaped member (C) is accommodated in an inaccessible manner.

The interior of the chamber 10 includes a first interior surface 10a and a second interior surface arranged in opposite shapes in the thickness direction (Z direction) to the loaded first plate-shaped member B and second plate-shaped member C. We have (10b).

The first interior surface 10a is formed on a plane in the It is preferable to arrange a gap detection sensor (not shown) on the first interior surface 10a in order to detect the position of the first non-opposing surface Br of the first plate-shaped member B, etc.

The second interior surface 10b is formed on a plane in the

The chamber 10 has an entrance 10c for allowing the first plate-shaped member B and the second plate-shaped member C into and out of the sealable transformer chamber 1. The entrance 10c of the chamber 10 is configured to be openable and closed, and is opened and closed by a drive mechanism 10d made of an actuator or the like. In addition, the transformer chamber 1 of the chamber 10 has a split type and a partially open/closed type, and each has a different structure of the entrance/exit 10c.

The first plate-shaped member B and the second plate-shaped member C are carried into the transformer chamber 1 sequentially or simultaneously using, for example, a transfer means (not shown) such as a transfer robot. The first plate-shaped member (B) and the second plate-shaped member (C) from the pressure transformation chamber 1 are carried out simultaneously or sequentially by conveyance means.

The variable portion 2 is in contact with the first non-opposing surface Br of the loaded first plate-shaped member B in the thickness direction (Z direction), and is also in contact with the first interior surface 10a of the chamber 10. It is placed so that it is spaced apart from the.

The displacement portion 2 is in contact with the first non-opposing surface Br of the first plate-shaped member B carried in in the thickness direction (Z direction) with respect to the first interior surface 10a of the chamber 10. It has a region (2a).

The displacement portion 2a is configured to be deformable or movable in the thickness direction (Z direction), and is brought into contact with the first non-opposing surface Br of the brought in first plate-shaped member B, in the thickness direction ( It is integrated by positioning in a direction that intersects the Z direction (XY direction) so that misalignment is impossible.

That is, the variable portion 2 is disposed so that the displacement portion 2a is deformable or movable in the Z direction with respect to the first interior surface 10a of the chamber 10, and the displacement portion 2a is deformed or movable. In accordance with the movement, the first plate-shaped member B is configured to move in the Z direction.

A first space 4 is formed between the variable pressure unit 2 and the first interior surface 10a of the chamber 10, and is isolated from the variable pressure chamber 1. The first space portion 4 is formed in an airtight manner by bringing the first non-opposing surface Br of the first plate-shaped member B into contact with the displacement portion 2a of the motion variable portion 2.

Additionally, the motion variable portion 2 preferably has a first ventilation hole 2b that communicates the first non-opposing surface Br of the first plate-shaped member B with the first space portion 4.

In the case shown in FIGS. 1 to 6 as a specific example of the variable unit 2, it is composed of an elastic ventilation body 21 mounted to be elastically deformable in the Z direction with respect to the first interior surface 10a of the chamber 10. do.

The elastic ventilation body 21 in the illustrated example is made of an elastically deformable material such as soft synthetic resin or rubber, and is a packing or O It is made of annular members such as rings. One end of the elastic ventilation body 21 in the thickness direction (Z direction) has a mounting portion 21a for the first interior surface 10a of the chamber 10. The elastic ventilation body 21 has the other end in the thickness direction (Z direction) as the displacement portion 2a, and is brought into contact with the first non-opposing surface Br of the first plate-shaped member B, thereby providing elasticity. A first space 4 is formed inside the ventilation body 21. For this reason, the elastic ventilation body 21 is capable of elastically compressing and expanding in the Z direction due to the pressure difference between the internal pressure of the pressure transformation chamber 1 and the internal pressure of the first space 4.

Also, as another example of the elastic ventilation body 21, which is not shown, a plate-shaped member having a plurality of first ventilation holes 2b, a porous member having a plurality of first ventilation holes 2b, etc. may be used instead of the annular member. possible.

In these cases, abnormal deformation of the first plate-shaped member B is detected by detecting the position of the first plate-shaped member B with a gap detection sensor disposed on the first interior surface 10a of the chamber 10. It becomes possible to detect excessive deformation. It is also possible to provide a deformation suppressing member (not shown) such as a stopper to mechanically prevent excessive deformation of the first plate-shaped member B.

Furthermore, the first space 4 and the first non-opposing surface Br of the first plate-shaped member B are always in communication through the first vent hole 2b provided in the motion variable portion 2. For this reason, by using the pressure difference between the internal pressure of the first space 4 lowered by the first internal pressure adjustment unit 6, which will be described later, and the internal pressure of the variable pressure chamber 1, the displacement portion 2a of the variable unit 2 ), the first plate-shaped member B becomes capable of vacuum adsorption.

As a result, the first non-opposing surface Br of the first plate-shaped member B is suction-supported and temporarily fixed to the displacement portion 2a in a detachable manner due to an increase in the internal pressure of the pressure transformation chamber 1.

In addition, although not shown as another example of the variable portion 2, it is also possible to change to temporary fixation using an adhesive member or electrostatic adsorption instead of vacuum adsorption.

The support portion 3 is arranged so as to contact the second non-opposing surface Cr of the brought in second plate-shaped member C in the thickness direction (Z direction).

Additionally, the support portion 3 moves in the thickness direction (Z direction) with respect to the second non-opposing surface Cr of the loaded second plate-shaped member C with respect to the second interior surface 10b of the chamber 10. It has a support portion 3a that is impossibly abutted.

That is, the support portion 3 makes the second non-opposing surface Cr of the second plate member C come into contact with the support portion 3a, so that the second plate member C cannot move in the Z direction. It is constructed to be supported.

It is preferable to form a second space 7 between the support portion 3 and the second interior surface 10b of the chamber 10 in isolation from the transformer chamber 1. The second space 7 is airtightly formed by bringing the second non-opposing surface Cr of the second plate-shaped member C into contact with the support portion 3a of the support portion 3.

Moreover, it is preferable that the support part 3 has the 2nd ventilation hole 3b which communicates the 2nd non-opposing surface Cr of the 2nd plate-shaped member C and the 2nd space part 7.

In the case shown in FIGS. 1 to 6 as a specific example of the support portion 3, it is a support annular body 31 fixed to the second interior surface 10b of the chamber 10, and the support annular body 31 The inner space becomes the second ventilation hole 3b and forms the second space portion 7.

The supporting annular body 31 in the illustrated example is made of, for example, an elastically deformable material such as soft synthetic resin or rubber, or an indeformable material such as hard synthetic resin or metal, and is formed in the shape of a square frame or annular shape. The annular support body 31 may be composed of an annular member such as packing or an O-ring in the same way as the elastic ventilation body 21 of the motion variable unit 2. In this case, the annular support body 31 is Compression deformation and expansion deformation are possible elastically in the Z direction. At one end of the annular support body 31 in the thickness direction (Z direction), there is a fixing portion 31a for support with respect to the second interior surface 10b of the chamber 10. The other end of the support annular body 31 in the thickness direction (Z direction), which becomes the support portion 3a, is in contact with the second non-opposing surface Cr of the brought in second plate-shaped member C.

In addition, since the second space portion 7, which becomes the second vent hole 3b of the support portion 3, and the second non-opposing surface Cr of the second plate-shaped member C are always in communication, the second space portion 7, which will be described later, Using the pressure difference between the internal pressure of the second space 7 lowered by the internal pressure adjustment unit 8 and the internal pressure of the pressure transformation chamber 1, a second plate-shaped member is applied to the support portion 3a of the support portion 3. (C) becomes possible for vacuum adsorption.

As a result, as the internal pressure of the transformer chamber 1 increases, the second non-opposing surface Cr of the second plate-shaped member C is suction-supported and temporarily fixed to the support portion 3a in a detachable manner.

In addition, although not shown as another example of the support portion 3, it is also possible to change to temporary fixation using an adhesive member or electrostatic adsorption instead of vacuum adsorption.

In addition, in the case shown in FIGS. 1 to 3 and FIG. 14, the size in the thickness direction (Z direction) of the elastic ventilation body 21 of the variable portion 2 is determined by the size of the annular support body 31 of the support portion 3. The size in the Z direction is approximately the same. In contrast, in the case shown in FIGS. 4 to 6, 11, and 13, the Z-direction size of the elastic ventilation body 21 of the variable portion 2 is expressed as the Z of the support annular body 31 of the support portion 3. By making it larger than the direction size, the amount of compressive deformation and expansion deformation of the variable portion 2 are set to be emphasized.

In addition, although not shown as an example, the Z-direction size of the elastic ventilation body 21 of the variable portion 2 shown in FIGS. 1 to 3 and FIG. 14 is calculated from the It is larger than the Z-direction size, and the Z-direction size of the elastic ventilation body 21 of the variable part 2 shown in FIGS. 4 to 6, 11, and 13 is changed to the support annular body of the support part 3 ( Changes such as making it approximately the same as the Z-direction size in 31) are also possible.

The actual pressure adjustment unit 5 supplies (air supply) fluid 5F, such as compressed air, gas, or water, from a supply source (not shown) toward the transformer pressure chamber 1, thereby controlling the internal pressure of the transformer chamber 1. It is configured to raise and lower the internal pressure of the transformer chamber 1 by discharging (exhausting) the fluid 5F, such as air, from the transformer chamber 1.

In the case shown in (a) of FIG. 1 as a specific example of the real pressure adjusting unit 5, for example, a real pressure driving source such as a vacuum pump or compressor (not shown) penetrates the chamber 10 and enters the variable pressure chamber 1. It has a real flow path 5a leading to the air flow path 5a, and a real pressure control valve 5b provided in the middle of the real flow path 5a.

By operating the real pressure adjustment unit 5 (actual pressure drive source or real pressure control valve 5b), the internal pressure of the variable pressure chamber 1 can be set from an atmospheric atmosphere to a vacuum or low-pressure atmosphere close to vacuum or a predetermined high-pressure atmosphere. .

To explain in detail, the negative pressure fluid 5F discharged from the real oil path 5a or the positive pressure fluid 5F supplied to the real oil path 5a is controlled by the operation control of the actual pressure drive source or the actual pressure control valve 5b. ) It is desirable to control the total amount of pressure to adjust the internal pressure of the pressure transformation chamber (1) step by step.

The first internal pressure adjusting unit 6 adjusts the internal pressure of the first space 4 to the internal pressure of the pressure transformation chamber 1 by discharging (exhausting) the first fluid 6F, such as air, from the first space 4. By lowering it further and supplying (air supplying) the first fluid 6F to the first space 4, the internal pressure of the first space 4 is configured to increase than the internal pressure of the pressure transformation chamber 1.

In the case shown in (a) of FIG. 1 as a specific example of the first internal pressure adjustment unit 6, for example, a first drive source such as a vacuum pump or compressor (not shown) penetrates the chamber 10 and enters the first space. It has a first flow path 6a leading to the section 4, and a first control valve 6b provided in the middle of the first flow path 6a.

By operating the first internal pressure adjusting unit 6 (the first drive source or the first control valve 6b), the internal pressure of the first space 4 is changed from an atmospheric atmosphere to a vacuum or a low-pressure atmosphere close to vacuum or a predetermined high-pressure atmosphere. It can be set up to.

In detail, the negative pressure first fluid 6F discharged from the first flow path 6a, or the positive pressure supplied to the first flow path 6a, is controlled by the operation of the first drive source or the first control valve 6b. It is desirable to control the total amount of the first fluid 6F to adjust the internal pressure of the first space 4 in stages.

The second internal pressure adjusting unit 8 adjusts the internal pressure of the second space 7 to the internal pressure of the pressure transformation chamber 1 by discharging (exhausting) the second fluid 8F, such as air, from the second space 7. By lowering it further and supplying (air supplying) the second fluid 8F to the second space 7, the internal pressure of the second space 7 is configured to increase than the internal pressure of the pressure transformation chamber 1.

In the case shown in (a) of FIG. 1 as a specific example of the second internal pressure adjusting unit 8, for example, a second drive source such as a vacuum pump or compressor (not shown) penetrates the chamber 10 to create a second space. It has a second flow path 8a leading to the section 7 and a second control valve 8b provided in the middle of the second flow path 8a.

By operating the second internal pressure adjusting unit 8 (second drive source or second control valve 8b), the internal pressure of the second space 7 changes from an atmospheric atmosphere to a vacuum or a low-pressure atmosphere close to vacuum or a predetermined high-pressure atmosphere. It can be set up to.

In detail, the negative pressure second fluid 8F discharged from the second flow path 8a or the positive pressure supplied to the second flow path 8a is controlled by the operation of the second drive source or the second control valve 8b. It is desirable to control the total amount of the second fluid 8F to adjust the internal pressure of the second space 7 in stages.

The control unit 9 is a controller having a control circuit (not shown) electrically connected to the actual pressure adjustment unit 5, the first internal pressure adjustment unit 6, and the second internal pressure adjustment unit 8, respectively.

Additionally, it is electrically connected to a drive mechanism 10d that opens and closes the entrance 10c of the chamber 10. In addition, the first plate-shaped member (B) and the second plate-shaped member (C) are electrically connected to conveyance means for entering and leaving the transformer chamber (1).

The controller serving as the control unit 9 sequentially controls each operation at a preset timing according to a program preset in its control circuit (not shown).

Then, the program set in the control circuit of the control unit 9 will be explained as a method of manufacturing a microstructure using the microstructure manufacturing apparatus A.

The microstructure manufacturing method using the microstructure manufacturing apparatus (A) according to the embodiment of the present invention is divided into an import process, a support process, an actual pressure adjustment process, and an unloading process.

In detail, the microstructure manufacturing method according to the embodiment of the present invention includes a loading step of inserting the first plate-shaped member (B) and the second plate-shaped member (C) into the transformer chamber (1), and A support process for supporting the first plate-shaped member (B) and the second plate-shaped member (C), an actual pressure adjustment process for adjusting the internal pressure of the pressure transformation chamber, and the first plate-shaped member (B) and the second plate-shaped member (C) The unloading process of taking out from the transformer chamber 1 is included as a major process.

In the loading process, as shown in Fig. 2 (a) and (b), Fig. 4 (a), and Fig. 8 (a) and (b), the operation of the conveyance means is carried out from the external space of the chamber 10. Accordingly, the first plate-shaped member (B) and the second plate-shaped member (C) are placed in the pressure transformation chamber (1) and accommodated therein.

When the first plate-shaped member (B) and the second plate-shaped member (C) are in a separated state as shown in Fig. 2 (a) and (b) or Fig. 8 (a) and (b) at the time of loading, A primary loading process for placing either the first plate-shaped member (B) or the second plate-shaped member (C) into the transforming chamber (1) and a secondary loading process for placing the other into the transforming chamber (1) are required. .

In addition, when the first plate-shaped member B and the second plate-shaped member C are in a joined state as shown in Fig. 4(a) at the time of loading, the uneven portion (the first bonded uneven portion B1, The first plate-shaped member (B) and the second plate-shaped member (C), in which the 2 jointed uneven portions (C1) are unevenly joined to each other and integrated, are placed in the transformer chamber (1) in the unevenly joined state.

In the support process, as shown in FIG. 2 (c), FIG. 4 (a), or FIG. 8 (c), the first plate-shaped member B is applied to the displacement portion 2a of the motion variable portion 2. The first non-opposing surface Br is brought into contact with the thickness direction (Z direction). At the time of this contact, the internal pressure of the first space 4 decreases due to the discharge of the first fluid 6F by the operation of the first internal pressure adjustment unit 6, and the first vent hole of the variable unit 2 ( It is preferable to vacuum adsorb the first non-opposing surface Br of the first plate-shaped member B to the displacement portion 2a of the motion variable portion 2 via 2b).

For this reason, the first non-opposing surface Br of the first plate-shaped member B is misaligned in the direction (XY direction) intersecting the thickness direction (Z direction) at the displacement portion 2a of the moving portion 2. Impossibly positioned and integrated. As a result, the first plate-shaped member B can be moved with respect to the first interior surface 10a of the chamber 10 as the displacement portion 2a is deformed or moved in the thickness direction (Z direction).

The second non-opposing surface Cr of the second plate-shaped member C is brought into contact with the support portion 3a of the support portion 3 in the thickness direction (Z direction). At the time of this contact, the internal pressure of the second space 7 decreases due to the discharge of the second fluid 8F by the operation of the second internal pressure adjustment unit 8, and the second ventilation hole 3b of the support part 3 It is preferable to vacuum adsorb the second non-opposing surface Cr of the second plate-shaped member C to the support portion 3a of the support portion 3 via ).

For this reason, it is impossible for the second non-opposing surface Cr of the second plate-like member C to be misaligned with the support portion 3a of the support portion 3 in the direction (XY direction) intersecting the thickness direction (Z direction). It is positioned and integrated. Thereby, the second plate-shaped member C is supported immovably in the thickness direction (Z direction) with respect to the second interior surface 10b of the chamber 10. In addition, when the support portion 3 is elastically deformable, the second plate-shaped member C is attached to the second interior surface 10b of the chamber 10 in accordance with the deformation of the support portion 3a in the thickness direction (Z direction). ), it is also possible to change it to be movable in the thickness direction (Z direction).

After supporting the first plate-shaped member B and the second plate-shaped member C, as shown in FIG. 3 (a), FIG. 5 (a), or FIG. 9 (a), the chamber 10 ) is closed, the transformer room 1 within the chamber 10 is cut off from the external space of the chamber 10 and is in a sealed state.

In the actual pressure adjustment process, a differential pressure process is controlled so that a pressure difference is generated between the internal pressure of the transforming pressure chamber 1 and the internal pressure of the first space 4 by at least the operation of the real pressure adjustment unit 5, and this pressure difference A pressure bonding process of relatively moving the first plate-shaped member (B) and the second plate-shaped member (C) in opposite directions, or the opposing process of the first plate-shaped member (B) and the second plate-shaped member (C) by pressure difference. It includes a peeling process of moving the gases relatively apart in one direction and an atmospheric opening process in which the internal pressure of the transformer chamber 1 is returned to atmospheric pressure.

The differential pressure process is the discharge or supply of fluid 5F by the operation of the actual pressure adjusting unit 5, as shown in FIG. 3 (b), FIG. 5 (b), or FIG. 9 (b). (1) or the internal pressure of one of the first space parts (4) is increased than the internal pressure of the other. As a result, a pressure difference occurs between the internal pressure of the transformer chamber 1 and the internal pressure of the first space 4.

At this time, in addition to the change in internal pressure of the transformation pressure chamber 1 due to the operation of the actual pressure adjusting unit 5, the supply or discharge of the first fluid 6F due to the operation of the first internal pressure adjusting unit 6, the first space ( It is preferable to simultaneously change the internal pressure in 4) and control the pressure difference between the internal pressure of the pressure transformation chamber 1 and the internal pressure of the first space 4 to become larger.

Moreover, when the support part 3 is elastically deformable, in addition to the change in internal pressure of the first space part 4 due to the operation of the first internal pressure adjusting part 6, the change in internal pressure of the first space part 4 due to the operation of the second internal pressure adjusting part 8 By supplying or discharging the fluid 8F, the internal pressure of the second space 7 is changed at the same time, and the pressure difference between the internal pressure of the pressure transformation chamber 1 and the internal pressure of the second space 7 is controlled to become larger. possible.

In the pressure bonding process, only the discharge of the fluid 5F by the operation of the actual pressure adjustment unit 5, or in addition, the supply of the first fluid 6F by the operation of the first internal pressure adjustment unit 6 or the second internal pressure adjustment unit ( By supplying the second fluid 8F by the operation of 8), the internal pressure of the pressure transformation chamber 1 is lowered than the internal pressure of the first space 4 or the internal pressure of the second space 7.

The resulting pressure difference generates a pressing force that moves and presses the first plate-shaped member (B) along with the displacement portion (2a) of the motion variable portion (2) in the thickness direction (Z direction) toward the second plate-shaped member (C). do.

Due to this pressing force, when the second opposing surface Cf of the second plate-like member C has a non-contact uneven portion (non-contacted uneven portion Cu) as shown in (b) of FIG. 3, the first The first opposing surface Bf of the plate-shaped member B is joined to the non-bonded uneven portion Cu of the second plate-shaped member C and is pressed in the thickness direction (Z direction), and is pressed against the non-bonded uneven portion Cu. The first opposing surface Bf is overlapped to imitate the shape of the non-bonded portion Mf, which is the surface of the micro component Ma, so that the first plate-shaped member B is connected to the second plate-shaped member due to the pressure difference (fluid). It is pressed evenly toward the non-bonded uneven portion Cu of (C).

In the peeling process, only the supply of the fluid 5F by the operation of the actual pressure adjustment unit 5, or in addition, the discharge of the first fluid 6F by the operation of the first internal pressure adjustment unit 6 or the second internal pressure adjustment unit 8 ), the internal pressure of the transformer chamber 1 is raised above the internal pressure of the first space 4 or the internal pressure of the second space 7.

The pressure difference thus generated generates an attractive force that pulls the first plate-shaped member B along with the displacement portion 2a of the variable portion 2 in the thickness direction (Z direction) toward the first space portion 4.

Due to this attractive force, the first opposing surface Bf of the first plate-shaped member B has a first joined uneven portion B1 as one side of the unevenly joined uneven portion, as shown in Fig. 5(c), etc., and the second plate-shaped member B has a first opposing surface Bf. When the second opposing surface Cf of the member C has the second joint uneven portion C1 as the other side of the uneven portion, the first bonded uneven portion B1 of the first plate-shaped member B has the second bonded uneven portion B1. The plate-shaped member C is separated from the second bonded uneven portion C1 in the thickness direction (Z direction), and the first bonded uneven portion B1 is peeled from the second bonded uneven portion C1.

In addition, as in the illustrated example, when there is a gap E between the first plate-shaped member B and the second plate-shaped member C, positive pressure fluid 5F penetrates into the gap E, thereby causing 1 A repulsive force is generated to relatively push the first joint uneven portion B1 of the plate-shaped member B and the second joint uneven portion C1 of the second plate-shaped member C.

In addition, the gap detection sensor disposed on the first interior surface 10a of the chamber 10 detects the position of the first non-opposing surface Br of the first plate-shaped member B, etc., and monitors the detection value. , the progress of bonding or peeling of the uneven portions (non-bonded uneven portion (Cu), first bonded uneven portion (B1), and second bonded uneven portion (C1)) or the completion of bonding or peeling can be detected.

The atmospheric release process stops the discharge or supply of the fluid 5F by the operation of the actual pressure adjustment unit 5, as shown in FIG. 3 (c), FIG. 6 (a), or FIG. 10 (a). In addition, the entrance 10c of the chamber 10 is opened by the driving mechanism 10d, and the fluid 5F filled in the transformer chamber 1 is discharged to the external space of the transformer chamber 1. Return the internal pressure in (1) to atmospheric pressure.

The unloading process involves the operation of the first internal pressure adjustment unit 6 and the second internal pressure, as shown in Figure 3 (c), Figure 6 (b), (c), Figure 10 (b), (c), etc. The operation of the adjustment unit 8 is sequentially stopped, and the first plate-shaped member B and the second plate-shaped member C are taken out from the pressure transformation chamber 1 to the external space of the chamber 10 by operation of the transfer means. do.

When the first plate-shaped member (B) and the second plate-shaped member (C) are in a joined state as shown in (c) of FIG. 3 at the time of export, the uneven portion (non-bonded uneven portion (Cu)) is unevenly joined. The integrated first plate-shaped member (B) and second plate-shaped member (C) are taken out of the pressure transformation chamber (1) in a concavo-convex joint state.

In addition, when the first plate-shaped member (B) and the second plate-shaped member (C) are in a separated state as shown in Fig. 6 (b), (c) or Fig. 10 (b), (c), etc. at the time of loading. In this, a first unloading process for taking out either the first plate-shaped member (B) or the second plate-shaped member (C) out of the transformer chamber (1), and a second step for taking the other out of the transformer chamber (1) A car removal process becomes necessary.

Next, specific examples (first to third embodiments) and modified examples (fourth to seventh embodiments) of the microstructure manufacturing apparatus (A) according to the embodiments of the present invention will be described.

The microstructure manufacturing apparatus A1 of the first embodiment shown in FIGS. 1 to 3 is a microstructure M disposed (mounted) between the first plate-shaped member B and the second plate-shaped member C. This is a bonding device for manufacturing a laminated type microstructure (M1) joined with microcomponents (Ma) interposed therebetween.

By the relative approaching movement of the first plate-shaped member (B) and the second plate-shaped member (C), the first opposing surface (Bf) of the first plate-shaped member (B) or the second opposing surface of the second plate-shaped member (C) The non-contact uneven portion (non-bonded uneven portion Cu) of the minute component Ma disposed on one side of (Cf) is joined to be integrated with the other side.

In the case of the illustrated example, the support means D for the minute component Ma is provided on the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C. A fixing layer D1 such as an adhesive and a support chuck D2 such as an adhesive chuck are provided. A plurality of micro components Ma are arranged in parallel.

In the initial state (importing process) before joining shown in FIGS. 2(a) and 2(b), the support means D (fixed layer D1, The micro component Ma is arranged immovably on the support chuck D2) and has a non-contact concave-convex portion (non-contact concave-convex portion Cu).

Following this, in the support process shown in Figure 3 (a) to the actual pressure adjustment process (differential pressure process, pressure bonding process) shown in Figure 3 (b), the relative approach of the first plate-shaped member B due to the fluid differential pressure By the movement, the first opposing surface Bf of the first plate-shaped member B is joined to the non-bonded uneven portion Cu of the second plate-shaped member C and is pressed in the thickness direction (Z direction). Accordingly, the first opposing surface Bf is overlapped to imitate the shape of the non-bonded portion Mf, which is the surface of the micro component Ma, in the non-bonded uneven portion Cu, and is non-bonded due to a pressure difference (fluid). It is pressed evenly toward the uneven portion (Cu). For this reason, the first plate-shaped member B and the second plate-shaped member C are integrated with the minute component Ma between them to form a laminate.

Also, in the illustrated example, the transformer chamber 1 of the chamber 10 is of the split type. The split-type transformer chamber 1 refers to dividing the chamber 10 into a first chamber 11 and a second chamber 12, and forming a space between the first chamber 11 and the second chamber 12. An entrance (10c) is formed. A seal material 13 made of a square frame-shaped or annular-shaped packing or O-ring is mounted on the entrance/exit 10c. By bringing the first chamber 11 or the second chamber 12 relatively close to the driving mechanism 10d, the entrance 10c is airtightly covered with the seal material 13, and the transformer chamber 1 can be opened and closed. It also has a sealed structure.

In the illustrated example, only the upper first chamber 11 is reciprocated with respect to the lower second chamber 12, but only the lower second chamber 12, or the first chamber 11 and the second chamber ( It is possible to change the structure to a structure other than the example shown, such as moving both sides of 12) back and forth.

The microstructure manufacturing apparatus A2 of the second embodiment shown in FIGS. 4 to 6 includes concave-convex portions joined to each other disposed on the first plate-shaped member B and the second plate-shaped member C as the microstructure M. The configuration of the separation device for separating the first joint uneven portion B1 and the second joint uneven portion C1 is different from the first embodiment described above, and the other configuration is the same as the first embodiment. will be.

Due to the relative separation of the first plate-shaped member (B) and the second plate-shaped member (C), the mold (Mb) and the molded substrate (Mc) that become the micro-molded product (M2) are separated or the micro-structure (M1) is separated. A first bonding uneven portion B1 disposed on the first opposing surface Bf of the first plate-shaped member B joined to each other in an uneven shape, such as peeling off the supporting means such as an adhesive chuck and the micro component Ma to be formed. And, the second joint uneven portion C1 disposed on the second opposing surface Cf of the second plate-shaped member C is peeled off.

In the illustrated example, a separate type case is shown in which the mold Mb is disposed on the first plate-shaped member B and the mold substrate Mc is disposed on the second plate-shaped member C. In a state where the uneven pattern of the forming mold (Mb) is transferred to the molding substrate (Mc) by nano imprint molding, etc., the molding mold (Mb) and the molding substrate (Mc) are unevenly joined to each other, forming an integrated laminate that can be transported. there is. The molded substrate Mc is laminated with a resin layer Me whose pattern is transferred by light, heat, etc. to become the second bonding uneven portion C1 on the surface of the substrate Md made of a hard material.

Additionally, on the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C, an adhesive chuck or the like is provided as a support means D for the micro-molded product M2. A support chuck D2 and a fixing layer D1 such as adhesive are provided.

In the initial state (importing process) at the time of joining shown in Fig. 4(a), the first back surface B2 of the mold Mb, which becomes the first joining uneven portion B1, is the first plate-shaped member B. The support means D (support chuck D2, fixed layer D1) is arranged to be immovable on the first opposing surface Bf. The first back surface C2 of the molded substrate Mc, which becomes the second bonding uneven portion C1, is provided with a support means D (support chuck D2) on the second opposing surface Cf of the second plate-like member C. ), it is placed in a fixed layer (D1)) so that it cannot be moved.

In the actual pressure adjustment process (differential pressure process, peeling process) shown in Figures 5(b) and 5(c), the relative separation of the first plate-shaped member B due to the fluid differential pressure causes the first joint uneven portion to be formed. The mold Mb, which becomes (B1), is separated from the molded substrate, Mc, which becomes the second bonding uneven portion C1 in the thickness direction (Z direction).

In addition, in the illustrated example, between the first plate-shaped member B and the second plate-shaped member C, a plurality of first joint uneven portions B1 (molding mold Mb) and second joint uneven portion C1 are formed. (Molded substrate Mc) is arranged in parallel at predetermined intervals in the .

As a result, the positive pressure fluid 5F penetrates not only the outer gap E1 but also the plurality of penetration gaps E2, thereby pushing the first plate-shaped member B and the second plate-shaped member C entirely. A repulsive force is generated.

The microstructure manufacturing apparatus A3 of the third embodiment shown in FIGS. 7 to 10 is arranged (mounted) as a microstructure M on either the first plate-shaped member B or the second plate-shaped member C. The configuration of the transfer device for manufacturing the transfer-type microstructure M1 that transfers the microcomponent Ma to the other side is different from the above-described first embodiment, and other configurations are the same as those of the first embodiment. .

By the relative approach and separation movements of the first plate member (B) and the second plate member (C), the first opposing surface (Bf) of the first plate member (B) or the first opposing surface (Bf) of the second plate member (C) The non-contact uneven portion (non-contact uneven portion Cu) of the micro component Ma disposed on one of the two opposing surfaces Cf is reversed and moved to the other side.

In the case of the illustration, the first opposing surface Bf of the first plate-shaped member B is set as the transfer destination for the micro component Ma, and the strong adhesive surface D3 becomes the support means D for the micro component Ma. ) has. The second opposing surface Cf of the second plate-shaped member C is set as a transfer source for the micro component Ma, and has a weakly adhesive surface D4 that serves as the support means D for the micro component Ma. A plurality of micro components Ma are arranged in parallel.

The strong adhesive surface D3 and the weak adhesive surface D4 are support chucks D2 that detachably support and temporarily fix the microcomponent Ma. Among the support chucks D2, it is preferable to use an adhesive chuck with an adhesive member whose holding force of the minute component Ma can be easily controlled. In this case, an adhesive member with a strong adhesive force is used as the strong adhesive surface D3, and an adhesive member with a weak adhesive force is used as the weakly adhesive surface D4. In addition, as another example, it is possible to replace the adhesive chuck with a vacuum chuck with a controlled suction force or an electrostatic chuck with a controlled electrostatic suction force.

In the initial state (importing process) before transfer shown in FIGS. 8(a) and 8(b), a support means D (support chuck D2) is placed on the second opposing surface Cf of the second plate-shaped member C. On the weakly adhesive surface D4), the joint portions Mr, which are the back surfaces of the plurality of micro-components Ma, are arranged so as to be immovable.

Following this, in the support process shown in Figure 9 (a) to the actual pressure adjustment process (differential pressure process, pressure bonding process) shown in Figure 9 (b), the relative approach of the first plate-shaped member B due to the fluid differential pressure By movement, the support means D (strong adhesive surface D3) of the first opposing surface Bf is joined to the non-bonded portion Mf, which is the surface of the plurality of micro components Ma, in the thickness direction (Z direction). and become integrated.

Thereafter, in the actual pressure adjustment process (peeling process) shown in (c) of FIG. 9, the support means D on the second opposing surface Cf is moved apart relative to the first plate-shaped member B due to the fluid differential pressure. The back surface (joint portion Mr) of the plurality of micro components Ma is separated from the (weakly adhesive surface D4) in the thickness direction (Z direction).

As a result, the plurality of microstructures M1 are transferred from the second plate-shaped member C to the first plate-shaped member B without changing their alignment.

The microstructure manufacturing apparatus A4 of the fourth embodiment shown in Fig. 11 (a) to 11 (c) has a partially open/closed type transformer chamber 1, similar to the configuration of the first to third embodiments described above. It is different from this, and other configurations are the same as those of the first to third embodiments.

In the illustrated example, the case of the separation device of the second embodiment is shown.

An entrance 10c is provided in a part of the box-shaped chamber 14, and the door 14a is opened and closed with respect to the entrance 10c by a drive mechanism 10d.

As a result, a portion of the transformer chamber 1 can be opened and closed and is configured to have a sealed structure.

The microstructure manufacturing apparatus A5 of the fifth embodiment shown in Figures 12 (a) to 12 (c) includes concave-convex portions ( The configuration in which the first joint uneven portion B1 and the second joint uneven portion C1 are separated by movement of the variable portion 2 is different from the above-described second and third embodiments, and other than that, The configuration is the same as that of the second and third embodiments.

In the illustrated example, the case of the separation device of the second embodiment is shown.

The movable motion variable portion 2 is composed of a lifting and lowering ventilation body 22 supported so as to be movable back and forth in the Z direction with respect to the first indoor surface 10a of the chamber 10. The lifting ventilation body 22 has a ventilation hole 2c corresponding to the first ventilation hole 2b that communicates the first non-opposing surface Br of the first plate-shaped member B with the first space 4. has

The lifting ventilation body 22 is, for example, made of a non-deformable material such as hard synthetic resin or metal, and is made of a plate-shaped member formed in the shape of a square plate or disk, etc., with a single ventilation hole 2c formed in the center thereof. . The side surface of the lifting ventilation body 22 extends in the Z direction along the third indoor surface 10e formed in the Z direction between the first indoor surface 10a and the second indoor surface 10b of the chamber 10. It is capable of reciprocating movement and has a sliding portion 22a that is airtightly supported. The third interior surface 10e of the chamber 10 has a stopper 10f on one side and a stopper 10g on the other side that protrudes toward the lifting/lowering ventilation body 22. The movement range of the lifting ventilation body 22 is regulated by the lifting ventilation body 22 moving in the Z direction coming into contact with the stopper 10f on one side or the stopper 10g on the other side. The lifting ventilation body 22 uses the distal end portion in the thickness direction (Z direction) as the displacement portion 2a, and brings it into contact with the first non-opposing surface Br of the brought in first plate-shaped member B, thereby forming the lifting ventilation body. A first space 4 is formed between the base 22 and the first interior surface 10a of the chamber 10.

For this reason, due to the difference between the increase in the internal pressure of the variable pressure chamber 1 due to the inflow of the positive pressure fluid 5F and the internal pressure of the first space 4, the lifting and lowering ventilation body 22 moves in the Z direction, and the displacement portion thereof The first plate-shaped member B is moved together with (2a) toward the first space portion 4. Thereby, the first plate-shaped member (B) is separated from the second plate-shaped member (C).

Additionally, as another example of the lifting ventilation body 22, which is not shown, instead of a plate-shaped member having one ventilation hole 2c, a plate-shaped member having a plurality of ventilation holes 2c or a plurality of ventilation holes 2c are used. It is also possible to use a porous plate-shaped member, etc.

In addition, instead of a support structure in which the sliding portion 22a of the lifting ventilation body 22 is movably supported along the third interior surface 10e, a lifting cylinder is provided in the center of an elastically deformable thin plate-shaped flexible member such as stainless steel. By supporting the body 22 in the shape of a floating island, it is also possible to change the support structure to a support structure in which the lifting and lowering ventilation body 22 is supported so as to be reciprocatable in the Z direction by elastic deformation of the flexible member. In the case of this floating island shape, the outer periphery of the flexible member is mounted on the third interior surface 10e of the chamber 10, so that the first space 4 is pressure-transforming on the back side of the flexible member. It is separated from the room (1) and is kept confidential.

The microstructure manufacturing apparatus A6 of the sixth embodiment shown in Figures 13 (a) to 13 (c) is connected to the inner gap E3 in the first plate-shaped member (B) or the second plate-shaped member (C). The configuration in which the through hole h is formed is different from the above-described second and third embodiments, and other configurations are the same as those of the second and third embodiments.

In the illustrated example, the case of the separation device of the second embodiment is shown.

The through hole (h) is formed in one or both of the first plate-shaped member (B) or the second plate-shaped member (C) so as to be isolated from the first space (4) or the second space (7), Positive pressure fluid 5F from the pressure transformation chamber 1 passes through the through hole h and enters the inner gap E3.

In addition, in the illustrated example, between the first plate-shaped member B and the second plate-shaped member C, a plurality of first joint uneven portions B1 and second joint uneven portions B1 and The joint uneven portions C1 are arranged in parallel at predetermined intervals, and a plurality of through gaps (not shown) pass in a straight line, such as in a radial direction centered on the outer gap E1 and the inner gap E3. does not have).

A through hole h is formed in the center of the first plate-shaped member B facing the first space 4.

On the first interior surface 10a of the chamber 10 facing the through hole h, an introduction passage 5c through which the positive pressure fluid 5F passes is formed to communicate with the through hole h. Positive pressure fluid 5F is introduced into the through hole h from the outlet at 5c.

Additionally, similarly to the second embodiment described above, the uneven portions (the first bonded uneven portion B1 and the second bonded uneven portion C1) that are joined to each other are separated by deformation of the variable portion 2. However, since the outlet of the introduction passage 5c is opened in the first interior surface 10a of the chamber 10, there is a passage from the outlet of the introduction passage 5c to the through hole h, and a first space ( 4) needs to be separated confidentially.

Therefore, the variable section 2 in the illustrated example extends from the outlet of the introduction passage 5c to the through hole h, separately from the outer annular member 23 corresponding to the elastic ventilation body 21 of the first embodiment. An inner annular member 24 is provided to surround the passage. A first space 4 is formed between the outer annular member 23 and the inner annular member 24.

In addition, as another example of the elastic ventilation body 21, which is not shown, instead of the outer annular member 23 or the inner annular member 24, a plate-shaped member having a plurality of first vent holes 2b or a plurality of first vent holes 2b are used. It is also possible to use a porous member or the like having a ventilation hole 2b.

As a result, the positive pressure fluid 5F penetrates not only the outer gap E1 but also the inner gap E3 through the introduction path 5c, the inner passage of the inner annular member 24, and the through hole h. Since each flows from the inner gap E3 to a plurality of through gaps (not shown), a repulsive force is generated that pushes the first plate-shaped member B and the second plate-shaped member C all over.

The microstructure manufacturing apparatus A7 of the seventh embodiment shown in Figures 14 (a) to 14 (c) determines the adhesive force of the strong adhesive surface D3 or weak adhesive surface D4 serving as the support means D by temperature. The configuration controlled by change is different from the third embodiment described above, and the other configuration is the same as the third embodiment.

When the strong adhesive surface D3 or the weak adhesive surface D4 is made of an adhesive member, it is possible to increase the adhesive force by heating and reduce the adhesive force by cooling.

In the illustrated example, the strong adhesive surface D3 of the first opposing surface Bf of the first plate-shaped member B, which serves as a transfer source for the micropart Ma, and the second plate-shaped member, which serves as a transfer source for the microcomponent Ma. The temperature of both weakly adhesive surfaces D4 of the second opposing surface Cf of the member C is controlled by heating and cooling alternate temperature members, the operation of which is controlled by the control unit 9, respectively.

On the first interior surface 10a of the chamber 10 opposite to the first non-opposing surface Br of the first plate-shaped member B in the Z direction, the first alternate temperature member G1 is provided with a heat insulating material B4 between them. It is provided near the strong adhesive surface D3.

On the second interior surface 10b of the chamber 10 opposite to the second non-opposing surface Cr of the second plate-shaped member C in the Z direction, the second temperature differential member G2 is provided with the heat insulating material B5 between them. It is provided near the weakly adhesive surface D4.

The first alternate temperature member G1 or the second alternate temperature member G2 has one or both of a warming function such as a heater or a cooling function such as a refrigerant pipe.

For this reason, in the actual pressure adjustment process (differential pressure process, pressure bonding process) shown in (b) of FIG. 14, the surfaces of the plurality of micro components Ma are moved relative to each other by the relative approach movement of the first plate-shaped member B due to the fluid differential pressure. When the strongly adhesive surface D3 of the first opposing surface Bf is joined to the non-bonded portion Mf in the thickness direction (Z direction), the first temperature alternating member G1 is heated. As a result, the adhesive force of the strongly bonded surface D3 increases, and the surfaces (non-bonded portions Mf) of the plurality of micro components Ma can be strongly bonded.

At the same time, by cooling the weakly adhesive surface D4 with the second alternate temperature member G2, the adhesive force of the weakly adhesive surface D4 is reduced, and the back surface (joint portion Mr) of the plurality of micro components Ma is approximately It becomes easy to separate from the adhesive surface D4. For this reason, in the actual pressure adjustment process (peeling process) shown in (c) of FIG. 14, a plurality of micro components Ma are separated from the weakly adhesive surface D4 by relative separation movement of the first plate-shaped member B due to the fluid differential pressure. ) The back side (joint portion (Mr)) is separated smoothly. As a result, it is possible to control the adhesive strength to make bonding and peeling easier than at room temperature, and the processing time required for bonding and peeling in the chamber 10 can be shortened.

In addition, although not shown as another example, it is also possible to control the adhesive force of either the strong adhesive surface D3 or the weak adhesive surface D4 by temperature changes.

According to the microstructure manufacturing apparatus (A) and the microstructure manufacturing method according to the embodiment of the present invention, by accommodating the first plate-shaped member (B) and the second plate-shaped member (C) in the pressure transformation chamber (1), 1 The first non-opposing surface Br of the plate-shaped member B abuts against the displacement portion 2a of the moving portion 2 in a deformable or movable manner. For this reason, the first plate-shaped member B can move in the thickness direction (Z direction) with respect to the first interior surface 10a of the chamber 10. The second non-opposing surface Cr of the second plate-shaped member C abuts the support portion 3a of the support portion 3 and is supported with respect to the second interior surface 10b of the chamber 10.

From this accommodation state, the internal pressure of the first space 4 is increased by the actual pressure adjustment unit 5 to be higher than the internal pressure of the variable pressure chamber 1, thereby forming the first plate-shaped member B together with the displacement portion 2a of the variable unit 2. ) moves toward the second plate-shaped member (C). For this reason, either the first opposing surface Bf of the first plate-shaped member B or the second opposing surface Cf of the second plate-shaped member C has an uneven portion (non-bonded uneven portion Cu). In the case where the other side overlaps so as to imitate the uneven surface shape of the uneven portion (non-bonded uneven portion Cu), the first plate-shaped member B is moved to the second plate-shaped member C due to a pressure difference (fluid). is pressed evenly toward.

In addition, by lowering the internal pressure of the variable pressure chamber 1 with the actual pressure adjustment unit 5 than the internal pressure of the first space 4, the first plate-shaped member B is moved together with the displacement portion 2a of the variable unit 2. It moves toward the first space portion 4. For this reason, both the first opposing surface Bf of the first plate-shaped member B and the second opposing surface Cf of the second plate-shaped member C have uneven portions (first joint uneven portion B1, In the case of having two joint uneven portions C1), the uneven portions of the first plate-shaped member B (the first bonded uneven portions) extend from the uneven portions of the second plate-shaped member C (second bonded uneven portions C1). (B1)) is separated.

Therefore, by changing the control of the internal pressure difference, the joint or additional pressure of the separated uneven portion (non-bonded uneven portion (Cu)) and the bonded uneven portion (first bonded uneven portion (B1), second bonded uneven portion (C1) ) can perform the opposite operation of separation.

As a result, compared to the conventional one, which only has a separation function of releasing the mold from the molded object, the uneven parts (non-bonded uneven parts ( It can be used as a joining device for (Cu)), an additional pressing device, or a separation device for joined uneven portions (first bonded uneven portion (B1), second bonded uneven portion (C1)), and is excellent in ease of use.

In particular, in joining or additional pressing of the separated uneven portion (non-bonded uneven portion (Cu)), the first plate-shaped member (B) is pressed evenly along the surface shape of the uneven portion (non-bonded uneven portion (Cu)). You can. For this reason, when there is partial thickness unevenness in the first plate-shaped member (B) or the second plate-shaped member (C), or between the first plate-shaped member (B) and the second plate-shaped member (C), the microstructure (M ) Even in the case of joining in an uneven shape, pressure is not concentrated only on convex-shaped parts such as the microstructure M, and joining is possible under uniform pressure. As a result, damage to the convex portion can be prevented, and high-precision joining and additional pressure can be achieved.

In addition, the first plate-shaped member (B) and the second plate-shaped member (C) have uneven portions (first joint uneven portion (B1), second joint uneven portion (C1)) that are joined to each other in an uneven shape, and the control unit ( 9), due to the operation of the actual pressure adjusting unit 5, the internal pressure of the variable pressure chamber 1 increases than the internal pressure of the first space 4, and the first plate-shaped member along with the displacement portion 2a of the variable unit 2 It is preferable to move (B) toward the first space 4.

In this case, by raising the internal pressure of the pressure transformation chamber 1 to the internal pressure of the first space 4, the first plate-shaped member B together with the displacement portion 2a of the variable pressure chamber 2 is moved to the first space 4. It moves in the thickness direction (Z direction) toward the part 4.

For this reason, the uneven portion of the first plate-shaped member B (the first bonded uneven portion B1) is separated from the uneven portion of the second plate-shaped member C (the second bonded uneven portion C1).

Therefore, the uneven portions (the first bonded uneven portion B1 and the second bonded uneven portion C1) of the first plate-shaped member B and the second plate-shaped member C can be separated without deforming (tilting) their shape. You can.

As a result, compared to the conventional method in which the uneven pattern of the mold is pulled out obliquely from the uneven pattern transferred to the molded object, even if the protruding amount of the uneven portion (the first bonded uneven portion B1 and the second bonded uneven portion C1) becomes longer, , shape deformation due to peeling can be prevented.

For this reason, when used for imprint molding including a nano imprint, the uneven pattern of the uneven portions (the first bonded uneven portion B1 and the second bonded uneven portion C1) is not damaged, and a high-precision uneven pattern is formed. can be produced.

In addition, in the case of a conveyance device that separates small components Ma, such as small elements arranged in parallel, from an adhesive chuck and transfers the small components Ma, the small components Ma are not damaged and high-precision transfer is achieved. can be done.

Additionally, it is preferable to provide a first internal pressure adjusting unit 6 that lowers the internal pressure of the first space 4.

In this case, at the same time as the internal pressure of the transformation chamber 1 increases, the internal pressure of the first space 4 is lowered by the first internal pressure adjustment unit 6, thereby increasing the internal pressure of the transformation chamber 1 and the first space 4. ) The pressure difference between the internal pressure becomes larger.

For this reason, the attractive force pulling the variable part 2 toward the first space part 4 increases.

Accordingly, the uneven portions (the first bonded uneven portion B1 and the second bonded uneven portion C1) of the first plate-shaped member B and the second plate-shaped member C that are unevenly joined to each other can be smoothly peeled.

As a result, the peeling ability can be improved.

In particular, for operation control of one or both of the actual pressure adjustment unit 5 (actual pressure drive source or real pressure control valve 5b) or the first internal pressure adjustment unit 6 (first drive source or first control valve 6b), When the internal pressure of the transformer chamber 1 and the internal pressure of the first space 4 are relatively adjusted stepwise, the uneven portions (the first joint uneven portion B1, the second joint uneven portion C1) can be peeled off more smoothly.

In addition, due to the pressure difference between the internal pressure of the pressure transformation chamber 1 and the internal pressure of the first space 4, the first non-opposing surface of the first plate-shaped member B is It becomes possible for (Br) to be vacuum adsorbed. As a result, the first plate shape moved toward the first space 4 together with the displacement portion 2a of the variable portion 2 due to the pressure difference between the internal pressure of the pressure transformation chamber 1 and the internal pressure of the first space 4. The member B can be adsorbed and supported.

In addition, an airtight second space 7 formed between the second interior surface 10b of the chamber 10 and the support portion 3, and a second internal pressure that lowers the internal pressure of the second space 7. It is desirable to have an adjustment unit (8).

In this case, by lowering the internal pressure of the first space 4 simultaneously with the increase in the internal pressure of the transformer pressure chamber 1 or before the start of the increase in the internal pressure of the transformer chamber 1, the internal pressure of the transformer chamber 1 and the first A pressure difference occurs between the internal pressures of the space portion 4.

For this reason, the second non-opposing surface Cr of the second plate-shaped member C is vacuum adsorbed to the support portion 3a of the support portion 3 due to a pressure difference. As a result, the second plate-shaped member C is adsorbed and supported immovably on the support portion 3a.

Therefore, the second plate-shaped member C can be reliably fixed to the support portion 3a of the support portion 3.

As a result, the uneven portions (the first bonded uneven portion B1 and the second bonded uneven portion C1) of the first plate-shaped member B and the second plate-shaped member C can be reliably separated.

Additionally, between the first plate-shaped member B and the second plate-shaped member C, there is a gap E through which the fluid 5F supplied from the actual pressure adjustment unit 5 to the pressure change chamber 1 can penetrate. It is desirable.

In this case, the pressure difference between the pressure transformation chamber 1 and the first space 4 generates an attractive force that pulls the variable unit 2 toward the first space 4, and at the same time, the actual pressure adjustment unit ( The positive pressure fluid 5F supplied from 5) to the transformer chamber 1 penetrates into the gap E, causing the uneven portion (first joint uneven portion) of the first plate-shaped member B and the second plate-shaped member C. (B1), a repulsive force is generated that relatively pushes the second joint uneven portion (C1)).

Accordingly, the attractive and repulsive forces can be combined to peel the uneven portions (the first bonded uneven portion (B1) and the second bonded uneven portion (C1)) more smoothly.

As a result, further improvement in peeling ability is achieved.

And, a plurality of microstructures in which either the first plate-shaped member (B) or the second plate-shaped member (C) has a strong adhesive surface D3, and the other has a weak adhesive surface D4 and is detachably arranged in parallel. It has (M1), and the control unit 9 is configured to cause the internal pressure of the first space 4 to increase than the internal pressure of the variable pressure chamber 1 due to the operation of the actual pressure adjustment unit 5, so that the first plate-shaped member B is 2 moves toward the plate-shaped member C, and subsequently the internal pressure of the pressure transformation chamber 1 increases than the internal pressure of the first space 4, and the first plate-shaped member B moves into the first space 4. It is desirable to control it to move toward .

In this case, the first plate-shaped member B moves toward the second plate-shaped member C by increasing the internal pressure of the first space 4 than the internal pressure of the pressure transformation chamber 1. For this reason, the first plate-shaped member B approaches the second plate-shaped member C, and the surface (non-bonded uneven portion Cu) of the plurality of microstructures M1 is bonded to the strong adhesive surface D3. .

Next, the internal pressure of the transformer chamber 1 is raised to be higher than the internal pressure of the first space 4, so that the first plate-shaped member B moves toward the first space 4. For this reason, the first plate-shaped member B is separated from the second plate-shaped member C, and the back surface (joined portion Mr) of the plurality of microstructures M1 is separated from the weakly adhesive surface D4.

Accordingly, the plurality of microstructures M1 can be moved from one of the first plate-shaped member B or the second plate-shaped member C to the other without changing the alignment state.

As a result, high-precision transfer can be performed without damaging the plurality of microstructures M1, and the back side (joined portion Mr) of the plurality of microstructures M1 joined before transfer by flipping the front and back can be can be exposed.

In addition, in the above-described embodiments (first to seventh embodiments), only the case where the first plate-shaped member B and the second plate-shaped member C are rectangular is shown in the illustrated examples, but this is not limited to this. , it may be circular in addition to rectangular.

In addition, in the illustrated example of the second embodiment, only the separate type of the micro-molded product M2 is shown, but it is not limited to this, and either the first plate-shaped member B or the second plate-shaped member C is molded as a whole. It may be a mold (Mb), and it may be an integrated type in which the entire other side becomes a molded substrate (Mc).

In addition, in the illustrations of the fourth to sixth embodiments, only a modification of the second embodiment (separation device) is shown, and in the illustration of the seventh embodiment, a modification of the third embodiment (transfer device) is shown. Although only this is shown, it is not limited to this, and the fourth to seventh embodiments may be the first embodiment (joining device), the second embodiment (separating device), or the third embodiment (transferring device) not shown. do.

Even in this case, the same effects and advantages as those in the first to seventh embodiments described above are obtained.

A: Microstructure manufacturing device 1: Transformer room
2: Variable part 2a: Displacement part
3: support portion 3a: support portion
4: first space part 5: actual pressure adjustment part
5F: Fluid 6: First internal pressure adjustment unit
7: second space part 8: second internal pressure adjustment part
9: Control unit 10a: First indoor surface
10b: Second interior surface B: First plate-shaped member
B1: uneven portion (first joint uneven portion) Bf: first opposing surface
Br: first non-opposing surface C: second plate-shaped member
C1: Concave-convex portion (second joint uneven portion) Cf: Second opposing surface
Cr: Second non-opposing surface Cu: Concave-convex portion (non-bonded uneven portion)
D3: Strongly adhesive side D4: Weakly adhesive side
E: gap

Claims (14)

A microstructure manufacturing device for joining or separating uneven portions of one or both of the first opposing surface of a first plate-shaped member or the second opposing surface of a second plate-shaped member, which are opposed to each other,
A transformer chamber formed inside the chamber to accommodate the first plate-shaped member and the second plate-shaped member to be able to enter and exit;
a variable portion provided between a first non-opposing surface of the first plate-shaped member accommodated in the pressure transformation chamber and a first interior surface of the chamber;
a support portion provided between a second non-opposing surface of the second plate-shaped member accommodated in the pressure transformation chamber and a second interior surface of the chamber;
a first space separated from the variable pressure chamber and provided in an airtight manner between the first interior surface of the chamber and the variable portion;
an airtight second space formed between the second interior surface of the chamber and the support portion;
an actual pressure adjusting unit that increases the internal pressure of either the transformation chamber or the first space than the internal pressure of the other;
a second internal pressure adjusting unit that lowers the internal pressure of the second space;
It has a control unit that controls the operation of the actual pressure adjustment unit,
The variable portion has a displacement portion that abuts the first non-opposing surface of the first plate-shaped member to be deformable or movable in its thickness direction with respect to the first interior surface of the chamber,
The support portion has a support portion that supports the second interior surface of the chamber by contacting the second non-opposing surface of the second plate-shaped member,
The control unit moves the first plate-shaped member together with the displacement part of the variable unit toward the second plate-shaped member or the first space due to a pressure difference between the transformation chamber and the first space due to the operation of the actual pressure adjustment unit. Control it to do so,
By sequentially stopping the operation of the actual pressure adjustment unit and the operation of the second internal pressure adjustment unit, the first plate-shaped member is detached from the displacement portion and the second plate-shaped member is detached from the support portion. . The method according to claim 1, wherein the first plate-shaped member and the second plate-shaped member have the uneven portions joined to each other in an uneven shape,
The control unit causes the internal pressure of the transformation chamber to increase than the internal pressure of the first space due to the operation of the actual pressure adjustment unit, so that the first plate-shaped member moves toward the first space along with the displacement portion of the motion variable unit. A microstructure manufacturing device characterized by: The microstructure manufacturing apparatus according to claim 1 or 2, comprising a first internal pressure adjusting unit that lowers the internal pressure of the first space portion. The microstructure manufacturing apparatus according to claim 1, wherein there is a gap between the first plate-shaped member and the second plate-shaped member through which fluid supplied from the actual pressure adjustment unit to the pressure change chamber can penetrate. The microstructure manufacturing apparatus according to claim 2, wherein there is a gap between the first plate-shaped member and the second plate-shaped member through which fluid supplied from the actual pressure adjustment unit to the pressure change chamber can penetrate. The microstructure manufacturing apparatus according to claim 3, wherein there is a gap between the first plate-shaped member and the second plate-shaped member through which fluid supplied from the real pressure adjustment unit to the pressure change chamber can penetrate. The method according to claim 1, wherein one of the first plate member or the second plate member has a strong adhesive surface, and the other has a plurality of microstructures detachably arranged side by side with a weak adhesive surface interposed therebetween,
The control unit causes the internal pressure of the first space to rise above the internal pressure of the transformation chamber due to the operation of the actual pressure adjustment unit, so that the first plate-shaped member moves toward the second plate-shaped member, and subsequently, the internal pressure of the transformation chamber is increased. A microstructure manufacturing apparatus, characterized in that the internal pressure of the first space increases, and the first plate-shaped member is controlled to move toward the first space. A microstructure manufacturing method for joining or separating uneven portions of one or both of the first opposing surface of a first plate-shaped member or the second opposing surface of a second plate-shaped member, which are opposed to each other, comprising:
a loading step of placing the first plate-shaped member and the second plate-shaped member into a pressure transformation chamber formed inside the chamber;
a support process of positioning the first plate-shaped member along a first interior surface of the chamber and positioning the second plate-shaped member along a second interior surface of the chamber;
an actual pressure adjustment process for adjusting the internal pressure of the transformer chamber;
A carrying out process of taking out the first plate-shaped member and the second plate-shaped member from the pressure transformation chamber,
In the support step, the first non-opposing surface of the first plate-shaped member is aligned with the displacement portion of the motion variable portion provided between the first non-opposing surface of the first plate-shaped member and the first interior surface in the thickness direction. and, in accordance with deformation or movement of the displacement portion in the thickness direction, the first non-opposing surface becomes movable with respect to the first interior surface, and a space between the first interior surface and the variable portion is formed. A first space portion is provided in an airtight manner separated from the transformer chamber, and a second space portion is provided between a support portion provided between the second non-opposing surface of the second plate-shaped member and the second interior surface and the second interior surface. It is provided in an airtight manner, and supports the second non-opposing surface of the second plate-shaped member in the thickness direction with respect to the support portion of the support portion,
In the actual pressure adjustment step, the internal pressure of one of the pressure change chamber or the first space is raised to be higher than the internal pressure of the other by the real pressure adjustment unit, and the first plate-shaped member along with the displacement portion of the variable section is replaced with the second moving the plate-shaped member or the first space toward the second space, and lowering the internal pressure of the second space to adsorb and support the second plate-shaped member at the support portion,
In the unloading process, the first plate-shaped member is detached from the displacement portion and the second plate-shaped member is detached from the support portion by sequentially stopping the operation of the actual pressure adjusting unit and the operation of the second internal pressure adjusting unit. Method for manufacturing microstructures. delete delete delete delete delete delete