KR20220123577A - Method for integrating work and sheet material, apparatus for integrating work and sheet material, and manufacturing method of semiconductor products - Google Patents

Abstract

The present invention provides a method for integrating a workpiece and a sheet material, an apparatus for integrating a workpiece and a sheet material, and a method for manufacturing a semiconductor product, which can more reliably prevent the workpiece from being damaged and further improve the adhesion between the sheet material and the workpiece when manufacturing the semiconductor product by adhering the sheet material to the workpiece and integrating the workpiece and the sheet material. The method for integrating a workpiece and a sheet material includes: a vertical space forming process in which an adhesive tape (DT) is sandwiched so that a chamber (29) is divided into a lower space (H1) and an upper space (H2); a first integration process in which the pressure inside the chamber (29) is reduced and the pressure difference formed between the lower space (H1) and the upper space (H2) is used to adhere the adhesive tape (DT) to the wafer (W); a pressure difference adjustment process in which the pressure difference between the upper space (H2) and the lower space (H1) is adjusted; and a second integration process in which the pressure of the internal space of the chamber (29) is increased above the atmospheric pressure in a state in which the pressure difference is adjusted, thereby causing the adhesive tape to adhere to the wafer (W).

Description

A method of integrating a work and a sheet material, an apparatus for integrating a work and a sheet material, and a manufacturing method of a semiconductor product TECHNICAL FIELD

According to the present invention, a semiconductor wafer (hereinafter, appropriately referred to as "wafer") or a substrate on which a semiconductor chip or electronic component is mounted is integrated by attaching a sheet material such as a tape-like adhesive material as an example. , a method for integrating a work and a sheet material used for manufacturing a semiconductor product, an apparatus for integrating a work and a sheet material, and a method for manufacturing a semiconductor product.

After a circuit pattern is formed on the surface of the wafer, the back surface of the wafer is ground by a backgrind process, and the wafer is divided into a plurality of chip components by a dicing process.

In the process of back surface grinding, in some cases, an annular convex portion is formed on the outer periphery of the back surface of the wafer so as to surround the backgrind region by grinding only the central portion while leaving the outer periphery of the back surface of the wafer.

In this case, even when the central portion of the wafer is reduced in thickness, since it is reinforced by the annular convex portion, it is possible to avoid occurrence of deformation or the like during handling. After the backgrinding step, a wafer having an annular convex portion is placed in the center of the ring frame, and an adhesive tape (dicing tape) for support is affixed over the ring frame and the back surface of the wafer. A mount frame is created by affixing a dicing tape and integrating a wafer and a dicing tape, and it is provided in a dicing process.

The following is proposed as an example of the method of sticking the adhesive sheet using the dicing tape as an example with respect to the wafer in which the level|step difference was formed by the annular convex part. That is, the pressure-sensitive adhesive sheet is sandwiched in the joint portion of the chamber formed of a pair of upper and lower hyging. And while pressure-reducing the inside of a chamber and generating a differential pressure|voltage in the two spaces partitioned by the said adhesive sheet, the said adhesive tape is concave-shaped, and the process which affixes an adhesive sheet on the wafer back surface is performed. Further, after relieving the pressure differential in the chamber, the second sticking process is performed by supplying a gas from the first pressing member to the adhesive sheet floating without being fully adhered at the inner corner of the annular convex portion (refer to Patent Document 1). ).

Moreover, the trial which diverts the process of affixing an adhesive sheet to a device sealing process is made|formed. That is, in the manufacturing process of an electronic product such as a BGA (Ball grid array) package, a device such as a semiconductor chip mounted on the surface of a work such as a wafer or a substrate as an example is made of a sealing material such as a resin composition. The process of sealing and packaging is performed.

Conventionally, a method in which a liquid resin is poured into a mold in which a workpiece on which a device is mounted is placed, then thermosets the resin to seal the device, etc. (for example, refer to Patent Document 2) . On the other hand, the workpiece is placed inside a chamber formed by sandwiching a sheet-like device sealing material having an adhesive force by a pair of upper and lower housings, and a differential pressure is generated inside the chamber to convert the device on the workpiece into an adhesive sheet of a device sealing material. A method of integrating both by sealing with a , has been separately proposed by the present applicant.

Japanese Patent Laid-Open No. 2013-232582 Japanese Patent Laid-Open No. 2017-087551

However, the conventional method has the following problems. That is, in the conventional method, as time elapses after affixing the sheet|seat material which makes an adhesive sheet or a sheet-like sealing material as an example to a work, adhesiveness falls and a possibility arises that a sheet|seat material may peel from a work. Moreover, when affixing a sheet|seat material to a workpiece|work, the subject that damage, such as a crack, a defect, or deformation|transformation, generate|occur|produces in a workpiece|work also arises newly.

The present invention has been made in view of such circumstances, and in manufacturing a semiconductor product by attaching and integrating the sheet material to the work, while more reliably avoiding the occurrence of damage to the work, the adhesion between the sheet material and the work is improved. A main object is to provide a method for integrating a work and a sheet material that can be improved, an apparatus for integrating a work and a sheet material, and a method for manufacturing a semiconductor product.

In order to achieve the above object, the present invention has the following configuration.

That is, the present invention is a method for integrating a work and a sheet material for integrating a work and a sheet material in an internal space of a chamber having an upper chamber and a lower chamber,

By sandwiching the sheet material by the upper chamber and the lower chamber, the inner space of the chamber is divided into a lower space in which the work is disposed and an upper space facing the lower space through the sheet material. The process of forming upper and lower space,

By depressurizing the inside of the chamber so that the pressure of the lower space becomes lower than the pressure of the upper space, the sheet material is brought into contact with the work by the differential pressure formed between the upper space and the lower space in the chamber, so that the sheet material is removed from the sheet material. A first integration process of attaching to the work;

After the first integration process, a pressure difference adjustment process for adjusting the pressure difference between the upper space and the lower space in the chamber;

and a second integration process of bringing the sheet material into close contact with the work by raising the pressure of the internal space of the chamber to a pressure equal to or higher than atmospheric pressure in a state in which the pressure difference is adjusted.

(Operation/Effect) According to this structure, after dividing the inner space of a chamber into a lower space and an upper space by a sheet|seat material in the up-and-down space formation process, in a 1st integration process, the sheet|seat material is made to contact a workpiece|work. Since the inside of the chamber is depressurized in the first integration process, it is possible to avoid mixing of air bubbles between the sheet material and the work when the sheet material is brought into contact with the work using the differential pressure formed between the upper space and the lower space.

In addition, in the second integration process, since the internal space of the chamber is raised to a pressure equal to or higher than atmospheric pressure, a strong pressing force acts between the sheet material in contact with the work and the work. As a result, since the adhesiveness of a sheet|seat material and a workpiece|work can be improved significantly, even if time passes after sticking a sheet|seat material to a workpiece|work, the situation in which a sheet|seat material peels from a workpiece|work is prevented.

Then, a pressure difference adjustment process of adjusting the pressure difference between the upper space and the lower space to be less than or equal to a predetermined value is performed before the second integration process. By performing the pressure difference adjustment process, in the second integration process, the pressure in the internal space of the chamber can be increased to a pressure equal to or higher than atmospheric pressure while the pressure difference between the upper space and the lower space is adjusted to be less than or equal to a predetermined value. Therefore, it is possible to avoid a situation in which a large pressure difference is generated between the upper space and the lower space by pressurizing the inner space of the chamber to atmospheric pressure or higher, and damage such as cracks, defects or deformation occurs in the workpiece due to the pressure difference. have. Accordingly, in the process of integrating the work and the sheet material, damage to the work can be avoided while increasing the adhesion between the work and the sheet material.

Further, in the above-described invention, in the pressure difference adjustment process, it is preferable that the upper space and the lower space communicate through the through hole by forming a through hole in the sheet material.

(Action/Effect) According to this structure, a through hole is formed in a sheet|seat material in a pressure difference adjustment process. That is, as the pressure difference adjustment process is performed, the upper space and the lower space communicate through the through hole, so even if a bias occurs between the atmospheric pressure in the upper space and the lower space, the gas is transferred between the upper space and the lower space through the through hole. This bias is quickly resolved by the distribution of In the second integration process, since the internal space of the chamber is pressurized to atmospheric pressure or higher while the through-hole is formed, the pressure difference occurring between the upper space and the lower space is more reliably suppressed to a predetermined value or less and the internal space of the chamber is lowered to atmospheric pressure or higher. can be pressurized.

Further, in the above-described invention, it is preferable that the pressure difference adjustment process maintains the pressure difference by controlling at least one of the upper space and the lower space to increase the pressure in stages.

(Operation/Effect) According to this configuration, by performing the pressure difference adjustment process, in the second integration process, the internal space of the chamber is raised to atmospheric pressure or higher while controlling to increase the pressure of at least one of the upper space and the lower space in stages. pressurize By increasing the pressure of at least one of the upper space and the lower space in stages, it is possible to prevent the pressure difference occurring between the upper space and the lower space from becoming larger than a predetermined value. Accordingly, it is possible to pressurize the inner space of the chamber to atmospheric pressure or more while more reliably suppressing the pressure difference generated between the upper space and the lower space to a predetermined value or less.

Further, in the above-described invention, the chamber includes a first transforming mechanism for adjusting the pressure in the upper space, a second transforming mechanism for adjusting the pressure in the lower space, and the first transforming mechanism and the second transforming mechanism. and a control unit for independently controlling a mechanism, wherein the pressure difference adjustment process includes the control unit independently controlling the first and second transformation mechanisms, thereby maintaining the pressure difference while maintaining the pressure difference between the upper space and the lower portion. It is desirable to increase the pressure in the space.

(Action/Effect) According to this structure, the 1st pressure-transformation mechanism which adjusts the pressure of an upper space, and the 2nd pressure-transformation mechanism which adjusts the pressure of the lower space are provided. In addition, the control unit may independently control the pressure of the upper space and the pressure of the lower space by independently controlling the first and second transforming mechanisms. Therefore, in the process of adjusting the pressure difference, the control unit independently controls the first and second transforming mechanisms, thereby more reliably reducing the pressure difference between the upper space and the lower space to a predetermined value or less in the second integration process. It is possible to pressurize the inner space of the chamber above atmospheric pressure while suppressing it.

Further, in the invention described above, in the first integration process, it is preferable to make the sheet material contact the work by deforming the sheet material in a convex shape toward the work.

(Operation/Effect) According to this configuration, since the sheet material is deformed convexly toward the work, the sheet material can be brought into contact with the work so as to expand radially from one point. Therefore, it is possible to avoid mixing of air bubbles when the sheet material is brought into contact with the work.

Moreover, in the above-mentioned invention, it is preferable that the said sheet|seat material has a predetermined shape according to the said workpiece|work.

(Operation/Effect) According to this configuration, the sheet material has a predetermined shape corresponding to the work in advance. Therefore, according to the shape of a workpiece|work, a sheet|seat material can be made to contact a workpiece|work appropriately. Moreover, since the process of cutting|disconnecting a sheet material into an appropriate predetermined shape becomes unnecessary, the process of integrating a sheet|seat material and a workpiece|work can be shortened.

Further, in the above-described invention, the sheet material is held by a long conveyance sheet and includes a sheet-like elastic body disposed inside the upper housing, and in the upper and lower space forming process, the upper housing and the lower part Preferably, the sheet-like elastic body is arranged so that the sheet-like elastic body is in contact with a surface of the conveying sheet that does not hold the sheet material by sandwiching the conveying sheet with a housing.

(Operation/Effect) According to this configuration, in the first integration process, the sheet-like elastic body is deformed convexly with a more uniform curvature over the whole by the differential pressure formed between the upper space and the lower space. Therefore, since a sheet material becomes easy to deform|transform according to the shape of the surface of a workpiece|work, the adhesiveness of the sheet|seat material with respect to a workpiece|work can be improved more. Therefore, the situation in which the sheet|seat material integrated with the workpiece|work peels from a workpiece|work over time can be avoided more reliably.

Moreover, in the above-mentioned invention, it is preferable that the said work has an annular convex part on the outer periphery of one surface, and the said sheet|seat material is closely_contact|adhered to the surface in which the said cyclic|annular convex part is formed among the said workpiece|work.

(Operation and Effect) According to this configuration, the work and the sheet material are integrated by bringing the sheet material into close contact with the surface on which the annular convex portion is formed among the workpieces having the annular convex portion on the outer periphery of one surface. In general, when a sheet material is integrated into a work having an annular convex portion, the inner corner portion of the annular convex portion is a portion where pressure is likely to be concentrated, and thus breakage is likely to occur, and the sheet material is liable to peel from the inner corner portion of the annular convex portion.

In the present invention, since the first integration process, the pressure difference adjustment process, and the second integration process are performed, damage to the workpiece can be avoided while increasing the adhesion between the workpiece and the sheet material. Therefore, even when the sheet material is integrated into the work having the annular convex portion on the outer periphery, both the situation in which the work is damaged and the situation in which the sheet material peels from the work can be prevented. Therefore, the sheet material can be more suitably integrated with the workpiece which has an annular convex part on the outer periphery of one surface.

Further, in the above invention, it is preferable that the work is a substrate on which the optical element is mounted, and the sheet material is in close contact with the surface on which the optical element is mounted among the work.

(Operation/Effect) According to this configuration, the work and the sheet material are integrated by bringing the sheet material into close contact with the optical element mounting surface of the substrate on which the optical element is mounted. In the present invention, since the first integration process, the pressure difference adjustment process, and the second integration process are performed, damage to the workpiece can be avoided while increasing the adhesion between the workpiece and the sheet material. Therefore, the sheet material can be more suitably integrated with respect to the board|substrate on which the optical element is mounted.

In order to achieve such an object, this invention may take the following structure.

That is, the present invention is an apparatus for integrating a work and a sheet material for integrating a work and a sheet material in an internal space of a chamber having an upper chamber and a lower chamber,

a holding table for holding the work;

a chamber accommodating the holding table and formed by sandwiching the sheet material by the upper chamber and the lower chamber, the chamber being divided into an upper space and a lower space through the sheet material;

a supply mechanism for supplying the sheet material;

The sheet material is formed by depressurizing the inside of the chamber so that the pressure of the lower space becomes lower than the pressure of the upper space, and bringing the sheet-like sealing material into contact with the work by the differential pressure formed between the upper space and the lower space in the chamber. a first integration mechanism attached to the work;

a differential pressure adjusting mechanism for adjusting the pressure difference between the upper space and the lower space in the chamber after the sheet material is attached to the work;

and a second integration mechanism for bringing the sheet material into close contact with the work by raising the pressure in the internal space of the chamber to a pressure equal to or higher than atmospheric pressure in a state where the pressure difference is adjusted.

(Operation/Effect) According to this configuration, in the chamber divided into the lower space and the upper space by the sheet material, the first integration mechanism brings the sheet material into contact with the work. At this time, since the inside of the chamber is depressurized, it is possible to avoid mixing of air bubbles between the sheet material and the work when the sheet material is brought into contact with the work using the differential pressure formed between the upper space and the lower space.

In addition, since the second integration mechanism raises the internal space of the chamber to a pressure equal to or higher than atmospheric pressure to integrate the sheet material and the work, a strong pressing force acts between the sheet material and the work in contact with the work. As a result, since the adhesiveness of a sheet|seat material and a work can be improved significantly, even if time passes after sticking a sheet|seat material to a work, the situation that a sheet|seat material peels from a work is prevented.

Then, the differential pressure adjusting mechanism adjusts the pressure difference between the upper space and the lower space to be less than or equal to a predetermined value. That is, when the differential pressure adjusting mechanism operates in advance, the second integrated mechanism increases the pressure in the internal space of the chamber to a pressure equal to or higher than atmospheric pressure while the pressure difference between the upper space and the lower space is adjusted to be equal to or less than a predetermined value. Therefore, it is possible to avoid a situation in which a large pressure difference is generated between the upper space and the lower space by pressurizing the inner space of the chamber to atmospheric pressure or higher, and damage such as cracks, defects or deformation occurs in the workpiece due to the pressure difference. have. Accordingly, in the process of integrating the work and the sheet material, damage to the work can be avoided while increasing the adhesion between the work and the sheet material.

In order to achieve such an object, this invention may take the following structure.

That is, the present invention is a method of manufacturing a semiconductor product for manufacturing a semiconductor product by integrating a work and a sheet material in an internal space of a chamber having an upper chamber and a lower chamber,

By sandwiching the sheet material by the upper chamber and the lower chamber, the inner space of the chamber is divided into a lower space in which the work is disposed and an upper space facing the lower space through the sheet material. The process of forming upper and lower space,

By depressurizing the inside of the chamber so that the pressure of the lower space becomes lower than the pressure of the upper space, the sheet material is brought into contact with the work by the differential pressure formed between the upper space and the lower space in the chamber, so that the sheet material is removed from the sheet material. A first integration process of attaching to the work;

After the first integration process, a pressure difference adjustment process of adjusting the pressure in the chamber so that the pressure difference between the upper space and the lower space in the chamber is reduced;

and a second integration process of bringing the sheet material into close contact with the work by raising the pressure of the internal space of the chamber to a pressure equal to or higher than atmospheric pressure in a state in which the pressure difference is adjusted.

(Operation/Effect) According to this structure, after dividing the inner space of a chamber into a lower space and an upper space by a sheet|seat material in the up-and-down space formation process, in a 1st integration process, the sheet|seat material is made to contact a workpiece|work. Since the inside of the chamber is depressurized in the first integration process, it is possible to avoid mixing of air bubbles between the sheet material and the work when the sheet material is brought into contact with the work using the differential pressure formed between the upper space and the lower space.

In addition, in the second integration process, since the internal space of the chamber is raised to a pressure equal to or higher than atmospheric pressure, a strong pressing force acts between the sheet material in contact with the work and the work. As a result, since the adhesiveness of a sheet|seat material and a workpiece|work can be improved significantly, even if time passes after sticking a sheet|seat material to a workpiece|work, the situation in which a sheet|seat material peels from a workpiece|work is prevented.

Then, a pressure difference adjustment process of adjusting the pressure difference between the upper space and the lower space to be less than or equal to a predetermined value is performed before the second integration process. By performing the pressure difference adjustment process, in the second integration process, the pressure in the internal space of the chamber can be increased to a pressure equal to or higher than atmospheric pressure while the pressure difference between the upper space and the lower space is adjusted to be less than or equal to a predetermined value. Therefore, it is possible to avoid a situation in which a large pressure difference is generated between the upper space and the lower space by pressurizing the inner space of the chamber to atmospheric pressure or higher, and damage such as cracks, defects or deformation occurs in the workpiece due to the pressure difference. have. Accordingly, in the process of integrating the work and the sheet material, damage to the work can be avoided while increasing the adhesion between the work and the sheet material. Therefore, when manufacturing the semiconductor product in which the workpiece|work and the sheet|seat material were integrated, while being able to prevent generation|occurrence|production of the defective product with which a workpiece|work was damaged, the quality of the semiconductor product manufactured can be improved more.

According to the method for integrating a work and a sheet material, an apparatus for integrating a work and a sheet material, and a method for manufacturing a semiconductor product according to the present invention, after dividing the inner space of the chamber into the lower space and the upper space by the sheet material in the process of forming the upper and lower spaces , the sheet material is brought into contact with the work in the first integration process. Since the inside of the chamber is depressurized in the first integration process, it is possible to avoid mixing of air bubbles between the sheet material and the work when the sheet material is brought into contact with the work using the differential pressure formed between the upper space and the lower space.

In addition, in the second integration process, since the internal space of the chamber is raised to a pressure equal to or higher than atmospheric pressure, a strong pressing force acts between the sheet material in contact with the work and the work. As a result, since the adhesiveness of a sheet|seat material and a workpiece|work can be improved significantly, even if time passes after sticking a sheet|seat material to a workpiece|work, the situation in which a sheet|seat material peels from a workpiece|work is prevented.

Then, a pressure difference adjustment process for adjusting the pressure difference between the upper space and the lower space is performed before the second integration process. By performing the pressure difference adjustment process, in the second integration process, the pressure in the internal space of the chamber can be increased to a pressure equal to or higher than atmospheric pressure while the pressure difference between the upper space and the lower space is adjusted.

Therefore, it is possible to avoid a situation in which a large pressure difference is generated between the upper space and the lower space by pressurizing the inner space of the chamber to atmospheric pressure or higher, and damage such as cracks, defects or deformation occurs in the workpiece due to the pressure difference. have. Accordingly, in the process of integrating the work and the sheet material, damage to the work can be avoided while increasing the adhesion between the work and the sheet material. Therefore, when manufacturing the semiconductor product in which the workpiece|work and the sheet|seat material were integrated, while being able to prevent generation|occurrence|production of the defective product with which a workpiece|work was damaged, the quality of the semiconductor product manufactured can be improved more.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the semiconductor wafer which concerns on Example 1, (a) is a partially broken perspective view of a semiconductor wafer, (b) is a perspective view of the back side of a semiconductor wafer, (c) is a perspective view of a semiconductor wafer It is a partial longitudinal section.
2 is a cross-sectional view showing the configuration of the pressure-sensitive adhesive sheet according to Example 1. FIG.
It is a top view of the adhesive sheet pasting apparatus which concerns on Example 1. FIG.
It is a front view of the adhesive sheet sticking apparatus which concerns on Example 1. FIG.
It is a front view of the sticking unit which concerns on Example 1. FIG.
Fig. 6 is a longitudinal sectional view of the chamber according to the first embodiment.
7 is a perspective view of a sheet perforation part according to Example 1. FIG.
It is a flowchart explaining the operation|movement of the adhesive sheet sticking apparatus which concerns on Example 1. FIG.
Fig. 9 is a perspective view of a mount frame according to the first embodiment.
Fig. 10 is a diagram for explaining step S2 according to the first embodiment.
11 is a diagram for explaining step S3 according to the first embodiment.
12 is a diagram for explaining step S3 according to the first embodiment.
13 is a diagram for explaining step S4 according to the first embodiment.
14 is a diagram for explaining step S4 according to the first embodiment.
15 is a diagram for explaining step S4 according to the first embodiment.
16 is a diagram for explaining step S5 according to the first embodiment.
Fig. 17 is a plan view for explaining the position of a through hole formed when the sheet perforation portion descends in step S5 according to the first embodiment.
18 is a diagram for explaining step S5 according to the first embodiment.
It is a top view explaining the position of the through-hole formed by the sheet|seat perforation part rotating in step S5 which concerns on Example 1. FIG.
20 is a diagram for explaining step S5 according to the first embodiment.
21 is a diagram for explaining step S6 according to the first embodiment.
22 is a diagram for explaining step S7 according to the first embodiment.
23 is a diagram for explaining step S7 according to the first embodiment.
24 is a diagram for explaining step S8 according to the first embodiment.
25 is a graph for explaining a pressure control pattern inside a chamber according to a comparative example.
26 is a graph for explaining the pressure control pattern inside the chamber according to the second embodiment.
Fig. 27 is a longitudinal sectional view of the chamber according to the third embodiment.
28 is a diagram for explaining step S6 according to the third embodiment.
29 is a graph for explaining a change in pressure inside a chamber according to Example 3. FIG.
Fig. 30 is a longitudinal sectional view of the chamber according to the fourth embodiment.
Fig. 31 is a diagram showing the configuration of a sealing member according to Example 5, wherein (a) is a perspective view of the back side of the sealing member, and (b) is a longitudinal sectional view of the sealing member.
Fig. 32 is a perspective view showing the configuration of a substrate and a ring frame according to Example 5;
33 is a plan view of the device sealing apparatus according to the fifth embodiment.
34 is a front view of the device sealing apparatus according to the fifth embodiment.
Fig. 35 is a front view of the sealing unit according to the fifth embodiment.
Fig. 36 is a flowchart for explaining the operation of the device sealing apparatus according to the fifth embodiment.
Fig. 37 is a diagram for explaining step S2 according to the fifth embodiment.
Fig. 38 is a diagram for explaining step S2 according to the fifth embodiment.
Fig. 39 is a diagram for explaining step S3 according to the fifth embodiment.
Fig. 40 is a diagram for explaining step S3 according to the fifth embodiment.
Fig. 41 is a diagram for explaining step S4 according to the fifth embodiment.
42 is a diagram for explaining step S4 according to the fifth embodiment.
Fig. 43 is a diagram for explaining step S5 according to the fifth embodiment.
44 is a diagram for explaining step S5 according to the fifth embodiment.
It is a top view explaining the position of the through-hole formed by rotation of a sheet|seat perforation part in step S5 which concerns on Example 5. FIG.
Fig. 46 is a diagram for explaining step S6 according to the fifth embodiment.
47 is a diagram for explaining step S7 according to the fifth embodiment.
Fig. 48 is a diagram for explaining step S7 according to the fifth embodiment.
49 is a diagram for explaining step S8 according to the fifth embodiment.
Fig. 50 is a view for explaining the effect of the fifth embodiment, (a) is a longitudinal sectional view for explaining the configuration in the case where a gap is formed when sealing is performed by depressurizing the inside of the chamber; It is a longitudinal sectional view explaining the state in which a clearance gap part is filled by sealing.
It is a figure explaining step S4 which concerns on a modification.
52 is a view for explaining the configuration according to the modified example, (a) is a longitudinal sectional view showing the configuration of the chamber according to the modified example having an elastic body, (b) is a comparative example without the elastic body It is a figure explaining the problem which exists, and (c) is a figure explaining the advantage in the modified example which has an elastic body.
53 is a view for explaining a configuration according to a modified example, (a) is a diagram showing the configuration of a modified example including a heating mechanism, (b) is a diagram showing a configuration of a modified example in which the heating mechanism is brought close to the adhesive tape It is a drawing.
Fig. 54 is a diagram for explaining the configuration according to the modification, (a) is a vertical sectional view showing the configuration of the substrate according to the modification, (b) is a vertical sectional view for explaining the configuration of the holding table according to the modification to be.
It is a figure explaining the process of step S3 which concerns on a modification.
It is a figure explaining the process of step S2 which concerns on a modification.
57 is a view for explaining the process of step S3 according to the modification.
58 is a longitudinal sectional view of the chamber according to Example 2. FIG.

[Example 1]

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Example 1 is an example of the structure which integrates a workpiece|work and a sheet|seat material, and demonstrates using the adhesive sheet pasting apparatus 1 which sticks an adhesive sheet with respect to a workpiece|work.

In the adhesive sheet sticking apparatus 1 which concerns on Example 1, the adhesive tape DT (dicing tape) for support is used as an adhesive sheet, and a semiconductor wafer W (hereafter, "wafer W") as a workpiece|work which is the object to which an adhesive sheet is affixed. ), and ring frame f shall be used. That is, in the adhesive sheet sticking apparatus 1 which concerns on Example 1, the mount frame MF is created by sticking the adhesive tape DT over the wafer W and the ring frame f. The mount frame MF is a semiconductor product in which the adhesive tape DT is integrated with respect to the wafer W and the ring frame f. In Example 1, the mount frame MF corresponds to the semiconductor product in this invention.

As shown in Figs. 1(a) to 1(c), the wafer W was subjected to a backgrind treatment in a state in which the circuit protection protective tape PT was affixed to the surface on which the circuit pattern was formed. The back surface of the wafer W is ground (background) leaving about 3 mm of the outer periphery in the radial direction. That is, while the flat recessed part He is formed in the back surface, what was processed into the shape in which the annular convex part Ka remained along the outer periphery is used. As an example, it is processed so that the depth d ground in the flat recessed part He may become several hundred micrometers, and the wafer thickness J of the flat recessed part He may be 30 micrometers - 50 micrometers. Accordingly, the annular convex portion Ka formed on the outer periphery of the back surface functions as an annular rib that increases the rigidity of the wafer W, and suppresses bending deformation of the wafer W in handling and other processing steps. In addition, it has shown using the code|symbol Kf about the inner corner part of the annular convex part Ka. The inner corner portion Kf corresponds to the boundary between the annular convex portion Ka and the flat concave portion He. The back surface of the wafer W corresponds to the annular convex portion formation surface of the workpiece in the present invention.

As shown in Fig. 2, the adhesive tape DT used in the present embodiment has an elongate structure in which a non-adhesive base material Ta and an adhesive material Tb are laminated. A separator S is added to the adhesive material Tb. That is, the separator S is attached to the adhesive surface of the adhesive tape DT, and the adhesive surface of the adhesive tape DT is exposed by peeling the separator S from the adhesive tape DT.

Examples of the material constituting the substrate Ta include polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate, polyvinyl chloride Leadene, polyethylene methacrylic acid copolymer, polypropylene, methacrylic acid terephthalate, polyamideimide, polyurethane elastomer, etc. are mentioned. Moreover, what combined two or more of the above-mentioned materials may be used as base material Ta. In addition, a single layer may be sufficient as the base material Ta, and the structure which laminated|stacked several layers may be sufficient as it.

The adhesive material Tb is composed of a material that can ensure the function of maintaining the state in which the adhesive tape DT adheres to the wafer W and the ring frame f and the function of preventing the chip components from scattering in the subsequent dicing process. desirable. An acrylic acid ester copolymer etc. are mentioned as an example of the material which comprises the adhesive material Tb. As an example of the separator S, an elongate paper material, plastic, etc. are mentioned. In addition, you may use an adhesive material or an adhesive agent instead of the adhesive material Tb.

<Description of the overall configuration>

Here, the whole structure of the adhesive sheet sticking apparatus 1 which concerns on Example 1 is demonstrated. 3 : is a top view which shows the basic structure of the adhesive sheet sticking apparatus 1 which concerns on Example 1. FIG. The adhesive sheet sticking apparatus 1 has a structure provided with the horizontal rectangular part 1a and the protrusion part 1b. The protrusion 1b is connected at the central portion of the rectangular portion 1a and is configured to protrude upward. In addition, in the following description, the long side direction of the rectangular part 1a is called a left-right direction (x direction), and the horizontal direction (y direction) orthogonal to this is called a front-back direction.

A wafer transfer mechanism 3 is disposed on the right side of the rectangular portion 1a. At a position in the vicinity of the lower right side of the rectangular portion 1a, two containers 5 containing the wafer W are mounted in parallel. Inside the container 5, the wafer W with the protective tape PT affixed to the surface is accommodated in multiple stages with the surface side facing down. At the left end of the rectangular part 1a, a frame recovery part 6 for recovering the mount frame MF shown in FIG. 9 after the wafer W has been mounted is disposed.

From the upper right side of the rectangular part 1a, the aligner 7, the holding table 9, and the frame supply part 12 are arrange|positioned in this order. The sticking unit 13 which sticks the adhesive tape DT (dicing tape) for support over the back surface of the wafer W and the ring frame f is arrange|positioned in the protrusion part 1b.

As shown in FIG. 4 , the wafer transfer mechanism 3 is a wafer transfer device 16 supported so as to be able to reciprocate left and right on the right side of a guide rail 15 installed horizontally on the left and right on the upper portion of the rectangular portion 1a . is provided. Further, on the left side of the guide rail 15, a frame conveying device 17 supported so as to be movable left and right is provided.

The wafer transport device 16 is configured to transport the wafer W taken out from either side of the container 5 to the left and right and back and forth. The wafer transfer apparatus 16 is equipped with a left-right movable table 18 and a front-back movable movable table 19 .

The left-right movable base 18 is comprised so that reciprocating movement is possible in the left-right direction along the guide rail 15. As shown in FIG. The front-back movable base 19 is comprised so that it may be reciprocally moved in the front-back direction along the guide rail 20 with which the left-right movable base 18 was equipped.

Further, a holding unit 21 for holding the wafer W is provided under the front and rear movable table 19 . The holding unit 21 is configured to be reciprocally movable in the vertical direction (z-direction) along the elevating rail 22 extending in the longitudinal direction. In addition, the holding unit 21 is capable of turning around an axis in the z direction by a rotation shaft (not shown).

The lower part of the holding unit 21 is equipped with a horseshoe-shaped holding arm 23 . A plurality of slightly protruding suction pads are provided on the holding surface of the holding arm 23 , and the wafer W is adsorbed and held through the suction pads. Moreover, the holding arm 23 is communicated with the compressed air device through the flow path formed therein, and the connection flow path connected at the base end side of this flow path.

By using the above movable structure, the wafer W held by suction can be moved back and forth, left and right, and pivotally around the z-direction axis by the holding arm 23 .

The frame conveying device 17 includes a left-right movable table 24 , a forward/backward movable movable table 25 , a flexible link mechanism 26 connected to a lower portion of the horizontally movable movable table 24 , and a flexible link mechanism 26 . ) is provided with a suction plate 27 and the like equipped at the lower end. The adsorption plate 27 adsorbs and holds the wafer W. A plurality of suction pads 28 for adsorbing and holding the ring frame f are arranged around the suction plate 27 . Therefore, the frame conveying apparatus 17 adsorbs-holds the ring frame f or the mount frame MF which were loaded and held by the holding table 9, and can be conveyed up and down and front-back, right and left. The suction pad 28 is slide-adjustable in the horizontal direction corresponding to the size of the ring frame f.

As shown in FIGS. 5 and 6 , the holding table 9 is a metal chuck table having the same shape or larger size as the wafer W, and a vacuum device 31 and a pressurizing device 32 disposed outside. is connected to each of the The operation of the vacuum device 31 and the pressurization device 32 is controlled by the control unit 33 .

In Example 1, the holding table 9 is provided with the annular projection part 9a in the outer peripheral part, and is hollow as a whole. The protrusion 9a is configured at a position substantially coincident with the arrangement of the annular convex part Ka of the wafer W in plan view, and the protrusion 9a supports the annular convex part Ka of the wafer W, so that the holding table 9 is It is possible to hold the wafer W without contacting the thin flat concave portion He.

5, the holding table 9 is accommodated in the lower housing 29A constituting the chamber 29, and is connected to one end of the rod 35 penetrating the lower housing 29A. has been The other end of the rod 35 is driven and connected to an actuator 37 having a motor or the like. Therefore, the holding table 9 is movable up and down inside the chamber 29 .

The lower housing 29A includes a frame holding portion 38 that surrounds the lower housing 29A. The frame holding portion 38 is configured such that the upper surface of the ring frame f and the cylindrical top of the lower housing 29A are at the same height when the ring frame f is mounted. Moreover, it is preferable that the mold release process is given to the cylindrical top of 29A of lower housing|casings.

Further, as shown in Fig. 3, the holding table 9, together with the lower housing 29A, along the rail 40 laid in the front-rear direction, can be reciprocally moved between the initial position and the pasting position. have. The initial position is inside the rectangular portion 1a, and in FIG. 3, the holding table 9 is a position indicated by a solid line. In the initial position, the wafer W and the ring frame f are mounted on the holding table 9 .

The affixing position exists in the inside of the protrusion part 1b, and is the position where the holding table 9 is shown by the dotted line in FIG. By moving the holding table 9 to the affixing position, it becomes possible to perform the affixing process of affixing the adhesive tape DT to the wafer W mounted on the holding table 9 .

The frame supply unit 12 accommodates a drawer-type cassette in which a predetermined number of ring frames f are stacked and accommodated.

As shown in FIG. 5 , the pasting unit 13 includes a sheet supply unit 71 , a separator collection unit 72 , a sheet pasting unit 73 , a sheet recovery unit 74 , and a sheet perforation unit 76 , etc. is composed of The sheet supply part 71 is equipped with the supply bobbin with which the raw material roll by which the adhesive tape DT for support was wound was mounted. And it is comprised so that the separator S may be peeled by the peeling roller 75 in the process of supplying adhesive tape DT from the supply bobbin of the sheet|seat supply part 71 to a pasting position. Moreover, the supply bobbin provided in the sheet|seat supply part 71 is interlockingly connected with the electromagnetic brake, and suitable rotational resistance is applied. Therefore, feeding of the excess tape from the supply bobbin is prevented.

The separator collection part 72 is equipped with the collection|recovery bobbin which winds up the separator S peeled from the adhesive tape DT. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor.

The sheet sticking part 73 is comprised by the chamber 29, the sheet|seat sticking mechanism 81, the sheet|seat cutting mechanism 82, etc.

The chamber 29 is constituted by a lower housing 29A and an upper housing 29B. 29A of lower housings are arrange|positioned so that the holding table 9 may be surrounded, and it reciprocates between an initial stage position and a sticking position with the holding table 9 in the front-back direction. The upper housing 29B is disposed on the protrusion 1b and is configured to be liftable.

As shown in Fig. 6, the lower housing 29A is in communication with the flow passage 201 for pressure reduction, and the upper housing 29B is in communication connection with the flow passage 202 for pressure reduction. The flow path 201 and the flow path 202 are both in communication with the vacuum device 31 via the flow path 101 for pressure reduction. That is, the lower housing 29A is communicated with the vacuum device 31 for pressure reduction via the flow path 101 and the flow path 201 . And the upper housing 29B is communicated with the vacuum device 31 for pressure reduction via the flow path 101 and the flow path 202. As shown in FIG.

Further, the lower housing 29A is in communication with the flow passage 203 for pressurization, and the upper housing 29B is in communication with the flow passage 204 for pressure. Both the flow path 203 and the flow path 204 are in communication with the pressurization device 32 via the flow path 102 for pressurization. That is, the lower housing 29A is in communication with the pressurizing device 32 via the flow passage 102 and the flow passage 203 . And the upper housing 29B is connected in communication with the pressurizing device 32 through the flow path 102 and the flow path 204 .

In addition, the flow path 101 is provided with a solenoid valve 103 , and the flow path 102 is provided with a solenoid valve 104 . Moreover, the flow path 109 provided with the solenoid valves 105 and 107 for atmospheric release is connected in communication with both housings 29A, 29B, respectively. The flow path 201 is provided with a solenoid valve 113 , and the flow path 203 is provided with a solenoid valve 114 .

Moreover, the flow path 111 provided with the solenoid valve 110 which adjusts the internal pressure once pressure-reduced by leakage is communicating with the upper housing 29B. The solenoid valve 110 is provided with an opening degree control valve 112 . The opening degree control valve 112 adjusts the amount of gas leaked through the flow path 111 by appropriately adjusting the opening degree of the solenoid valve 110 . In addition, the opening/closing operation of these solenoid valves 103, 104, 105, 107, 113, 114, opening degree adjustment of the solenoid valve 110, the operation of the vacuum device 31, and the operation of the pressurization device 32 are controlled (33) is done.

That is, the vacuum device 31 is comprised so that the atmospheric pressure of the space on the side of the lower housing 29A can pressure-reduce and the atmospheric pressure of the space on the side of the upper housing 29B can be pressure-reduced. And the pressurizing device 32 is comprised so that the air pressure of the space by the side of the lower housing 29A and the air pressure of the space by the side of the upper housing 29B can be pressurized and adjusted.

Further, in the first embodiment, when the solenoid valve 103 is disposed in the flow path 101 , the solenoid valve 113 may be disposed in the flow path 202 instead of the flow path 201 . When the solenoid valve 113 is disposed in the flow path 201 , the solenoid valve 103 may be disposed in the flow path 202 instead of the flow path 101 . When the solenoid valve 104 is disposed in the flow path 102 , the solenoid valve 114 may be disposed in the flow path 204 instead of the flow path 203 . When the solenoid valve 114 is disposed in the flow path 203 , the solenoid valve 104 may be disposed in the flow path 204 instead of the flow path 102 .

The sheet sticking mechanism 81 includes a movable table 84 , a sticking roller 85 , a nip roller 86 , and the like. The movable table 84 moves horizontally left and right along the guide rail 88 installed in the left and right direction. The sticking roller 85 is pivotally supported by a bracket connected to the tip of a cylinder provided in the movable table 84 . The nip roller 86 is arrange|positioned at the sheet|seat collection|recovery part 74 side, and is provided with the conveyance roller 89 driven by the motor, and the pinch roller 90 which raises and lowers by the cylinder.

The sheet cutting mechanism 82 is disposed on a lifting drive 91 for raising and lowering the upper housing 29B, a support shaft 92 extending in the z direction, and a boss rotating around the support shaft 92 . A portion 93 is provided. The boss portion 93 includes a plurality of support arms 94 extending in the radial direction. At the tip of the at least one support arm 94, a disk-shaped cutter 95 for cutting the adhesive tape DT along the ring frame f is disposed so as to be movable up and down. At the tip of the other support arm 94, a pressing roller 96 is disposed so as to be movable up and down.

The sheet collection part 74 is equipped with the collection bobbin which winds up the unnecessary adhesive tape DT peeled after cutting|disconnection. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor (not shown).

In the frame recovery section 6, as shown in Fig. 4, a cassette 41 for loading and collecting the mount frame MF is arranged. The cassette 41 is provided with a vertical rail 45 connected and fixed to the device frame 43 , and a lifting platform 49 that is screwed and moved up and down by a motor 47 along the vertical rail 45 . Therefore, the frame collection part 6 is comprised so that the mount frame MF may be mounted on the hoisting table 49, and pitch conveyance may descend|fall.

The sheet perforation part 76 is arrange|positioned inside the upper housing 29B. The sheet perforation part 76 is provided with the lifting/lowering drive base 97 and the rotating shaft part 99, as shown in FIG. The raising/lowering drive base 97 is comprised so that raising/lowering movement is possible in the z direction in the inside of the upper housing 29B. The rotating shaft part 99 extends in the z direction and is connected to the lower part of the lift drive base 97 . The rotating shaft portion 99 is configured to be rotatable around the axis in the z direction by a motor (not shown).

A support arm 127 extending in the radial direction of the rotating shaft portion 99 is provided on a side surface of the rotating shaft portion 99 . The base end side of each support arm 127 is connected to the rotation shaft part 99 . A cutter 129 supported by a cutter holder 128 is disposed on the tip side of each support arm 127 . In Example 1, although the sheet|seat perforation part 76 is equipped with the four support arms 127, you may change the number of the support arms 127 suitably.

The cutter 129 forms a through hole in the adhesive tape DT in the inside of the chamber 29, and is arrange|positioned below the cutter holder 128 with the cutter blade facing down. That is, as the lifting drive 97 moves up and down in the z direction, the cutter 129 supported by each support arm 127 moves up and down together with the elevating drive 97 in the z direction. Further, as the rotating shaft portion 99 rotates, each of the cutters 129 moves along with the support arm 127 along a circular orbit L1 centering on the rotating shaft portion 99 together with the support arm 127 .

<Outline of action>

Here, the basic operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 1 is demonstrated. 8 : is a flowchart explaining a series of processes of affixing adhesive tape DT to the wafer W using the adhesive sheet sticking apparatus 1. As shown in FIG.

Step S1 (workpiece supply)

When a sticking command is given, the ring frame f is conveyed from the frame supply unit 12 to the frame holding unit 38 of the lower housing 29A, and the wafer W is conveyed from the container 5 to the holding table 9 . .

That is, the frame conveying device 17 sucks the ring frame f from the frame supply unit 12 and moves and mounts it on the frame holding unit 38 . When the frame conveying device 17 releases the suction of the ring frame f and rises, the ring frame f is aligned. The alignment is performed, for example, by synchronously moving a plurality of support pins erected so as to sway the frame holding portion 38 in the central direction. The ring frame f is set on the frame holding part 38, and waits until the wafer W is conveyed.

While the frame transport device 17 transports the ring frame f, the wafer transport device 16 inserts the holding arms 23 between the wafers W stored in multiple stages inside the container 5 . The holding arm 23 adsorbs and holds the wafer W, carries it out, and conveys it to the aligner 7 . The aligner 7 sucks the center of the wafer W by the suction pad protruding from the center. At the same time, the wafer transfer device 16 cancels the suction of the wafer W and retracts upward. The aligner 7 holds and rotates the wafer W with a suction pad, and performs position alignment based on a notch or the like.

When the alignment is completed, the suction pad on which the wafer W is adsorbed is protruded from the surface of the aligner 7 . The wafer transfer device 16 moves to the position to adsorb and hold the wafer W. The adsorption pad cancels adsorption|suction and descend|falls.

The wafer transfer device 16 moves above the holding table 9 to place the wafer W on the holding table 9 with the surface side on which the protective tape PT is affixed facing downward. When the holding table 9 adsorbs and holds the wafer W, and the frame holding unit 38 adsorbs and holds the ring frame f, the lower housing 29A moves from the initial position along the rail 40 to the sheet attaching mechanism ( 81), and move to the pasting position. A state in which the wafer W is supplied to the holding table 9 and moved to the affixing position is shown in FIG. 10 .

Step S2 (supply of the adhesive sheet)

When the workpiece is supplied by the wafer transfer device 16 or the like, the adhesive tape DT is supplied in the sticking unit 13 . That is, a predetermined amount of adhesive tape DT is fed out from the sheet supply unit 71 while the separator S is peeled off. As a whole, the elongate adhesive tape DT is guided above a pasting position along a predetermined|prescribed conveyance path|route.

Step S3 (formation of chamber)

When the work and the adhesive tape DT are supplied, the sticking roller 85 descends as shown in FIG. 11 . Then, the adhesive tape DT is affixed over the ring frame f and the top of the lower housing 29A while rolling on the adhesive tape DT. In association with the movement of the sticking roller 85 , a predetermined amount of the adhesive tape DT is fed out from the sheet supply unit 71 while the separator S is peeled off.

When the adhesive tape DT is affixed to the ring frame f, while returning the sticking roller 85 to an initial stage, the upper housing 29B is lowered. With the lowering of the upper housing 29B, as shown in Fig. 12, the adhesive tape DT of the portion affixed to the top of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A. Supported, a chamber 29 is constructed.

At this time, while the adhesive tape DT functions as a sealing material, the chamber 29 is divided into two spaces by the adhesive tape DT. That is, it is divided into the lower space H1 on the side of the lower housing 29A and the upper space H2 on the side of the upper housing 29B with the adhesive tape DT interposed therebetween. The wafer W positioned in the lower housing 29A is closely opposed to the adhesive tape DT with a predetermined clearance therebetween.

Step S4 (first pasting process)

After forming the chamber 29, the first sticking process is started. First, the control part 33 opens the solenoid valves 103 and 113 while closing the solenoid valves 104, 105, 107, 110, 114 shown in FIG. Then, the control unit 33 operates the vacuum device 31 to reduce the atmospheric pressure in the lower space H1 and the atmospheric pressure in the upper space H2 to predetermined values. As an example of a predetermined value, 10 Pa - 100 Pa are mentioned.

When the atmospheric pressure of the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 closes the solenoid valve 103 and stops the operation of the vacuum device 31 . And the control part 33 is connected to the upper space H2 with the solenoid valves 103, 105, 107, 113 connected to the lower space H1 closed so that the atmospheric pressure side of the upper space H2 may become higher than the atmospheric pressure of the lower space H1. It is controlled to leak by adjusting the opening degree of the solenoid valve 110 .

When the atmospheric pressure side of the upper space H2 becomes higher than the atmospheric pressure of the lower space H1, as shown in FIG. 13, the differential pressure Fa generate|occur|produces between both spaces. When the differential pressure Fa is generated, the pressure-sensitive adhesive tape DT is drawn in from the center portion toward the lower housing 29A, and is deformed in a convex shape. In the present embodiment, in step S4, the atmospheric pressure in the upper space H2 and the lower space H1 is adjusted to 10 Pa, and then the differential pressure Fa is generated by adjusting the atmospheric pressure in the upper space H2 from 10 Pa to 100 Pa.

After generating the differential pressure Fa, as shown in FIG. 14 , the actuator 37 is driven to raise the holding table 9 . The pressure-sensitive adhesive tape DT is deformed by the differential pressure Fa and the holding table 9 is raised, causing the pressure-sensitive adhesive tape DT to radially contact the back surface of the wafer W from the center toward the outer periphery in the lower space H1 where the gas is removed. Goes. By this contact, the back surface of the wafer W is covered with the adhesive tape DT. 15 shows a state in which the back surface of the wafer W is covered with the adhesive tape DT.

When the back surface of the wafer W is covered with the adhesive tape DT, the control unit 33 leaves the solenoid valves 105 and 107 open to open the upper space H2 and the lower space H1 to the atmosphere. By the said atmospheric release, the 1st sticking process is completed. Thus, in the 1st sticking process, operation of covering the back surface side of wafer W with adhesive tape DT is performed by making adhesive tape DT contact with the back surface of wafer W in the state which pressure-reduced the internal space of the chamber 29. In addition, in Example 1, the 1st sticking process corresponds to the 1st integration process which concerns on this invention.

Step S5 (pressure difference adjustment process)

After the first sticking process using the differential pressure Fa is completed, the pressure differential adjustment process is started. The pressure difference adjustment process is a process of performing a process for suppressing the pressure difference generated between the upper space H2 and the lower space H1 to a predetermined value or less in the following. In Example 1, the pressure difference generated later between the upper space H2 and the lower space H1 is suppressed to a predetermined value or less by forming a through hole in the adhesive tape DT using the sheet perforation portion 76 . As an example of a predetermined value, 8000 Pa - 10000 Pa are mentioned. The predetermined value is appropriately changed according to various conditions in the step of integrating the sheet material and the work. As an example of the conditions, the material of the wafer W, the thickness of the wafer W, etc. are mentioned.

When step S5 is started, as shown in FIG. 16 , the control unit 33 drives the lifting drive 97 to lower the seat perforation portion 76 . As the sheet perforation portion 76 descends, each of the cutters 129 disposed on each of the support arms 127 is penetrated by the adhesive tape DT. As the cutter 129 penetrates the adhesive tape DT, as shown in FIG. 17, a through hole PH is formed in the portion between the wafer W and the ring frame f in the adhesive tape DT. In Example 1, since the four cutters 129 are arrange|positioned so that the rotating shaft part 99 may be enclosed, the through-hole PH is formed in four places so that the wafer W may be enclosed.

By forming the through hole PH, a ventilation hole through which gas flows is formed between the upper space H2 and the lower space H1. That is, by forming the through hole PH in the adhesive tape DT, the state divided into the upper space H2 and the lower space H1 inside the chamber 29 is eliminated. By allowing the gas to flow between the upper space H2 and the lower space H1 through the through hole PH, the pressure difference generated between the upper space H2 and the lower space H1 in step S6 can be set to a predetermined value or less. For convenience of explanation, even after the through hole PH is formed in the adhesive tape DT, the space on the side where the wafer W is arranged with the adhesive tape DT as a boundary is referred to as the lower space H1. And the space on the opposite side to the lower space H1 is made into the upper space H2 across the adhesive tape DT, and description is continued.

After the sheet perforation part 76 is lowered and the cutter 129 is penetrated through the adhesive tape DT, as shown in FIG. 18, the rotating shaft part 99 is rotated around the axis in the z direction. As the rotating shaft portion 99 rotates, each of the cutters 129 disposed on the tip side of the support arm 127 cuts the adhesive tape DT while moving along the circular orbit L1. The circular orbit L1 is a circular orbit whose diameter is the length of the support arm 127 centering on the rotating shaft part 99 . In other words, the circular orbit L1 is a circular orbit whose diameter is the length of the support arm 127 with the center Q of the wafer W shown in FIG. 19 as the center.

As the cutter 129 moves along the circular trajectory L1, each of the through holes PH expands in an arc shape along the circular trajectory L1, as shown in FIG. The rotation angle θ of the rotating shaft portion 99 in step S5 is determined to be an angle that can appropriately perform the step of conveying the mount frame MF in step S8. By expanding the through hole PH, more gas can flow between the upper space H2 and the lower space H1, so that the pressure difference generated between the upper space H2 and the lower space H1 in step S6 can be made smaller.

After the through hole PH is formed by the lowering and rotation of the sheet perforation portion 76, the control unit 33 drives the lifting drive 97 to move the sheet perforation portion 76 to the initial position as shown in FIG. raise to While raising the seat perforation portion 76 , the control unit 33 controls the actuator 37 to lower the holding table 9 to the initial position. By forming the through hole PH at the predetermined position, the pressure difference adjustment process according to the first embodiment is completed.

Step S6 (second sticking process)

After the through-hole PH is formed in the adhesive tape DT by the sheet perforation part 76, a 2nd sticking process is started. In Example 1, the 2nd sticking process corresponds to the 2nd integration process in this invention. When the second sticking process is started, first, the control unit 33 opens the solenoid valves 104 and 114 while closing the solenoid valves 103, 105, 107, 110 and 113 shown in FIG. Then, the control unit 33 operates the pressurizing device 32 to supply gas Ar to the lower space H1 and the upper space H2 to pressurize the lower space H1 and the upper space H2 to a specific value PN. 0.3 Mpa - 0.6 Mpa are mentioned as an example of specific value PN. When the pressurizing device 32 performs pressurization operation, both the atmospheric pressure of the lower space H1 and the atmospheric pressure of the upper space H2 become higher than atmospheric pressure.

By pressurizing the upper space H2, as shown in FIG. 21, the pressing force V1 acts toward the adhesive tape DT from the upper space H2. Further, since the entire upper space H2 is pressed, the pressing force V1 acts uniformly over the entire adhesive tape DT. In addition, since the entire lower space H1 is pressed, the pressing force V2 uniformly acts on the downward surface of the wafer W from the lower space H1. That is, by pressing with a specific value PN higher than atmospheric pressure, the pressing force V1 and the pressing force V2 act between the adhesive tape DT and the wafer W. That is, the adhesive tape DT is affixed to the back surface of the wafer W with high precision by making the force larger than atmospheric pressure act uniformly. As a result, since the adhesiveness of the wafer W and the adhesive tape DT improves, it can avoid that the situation that the adhesive tape DT peels from the back surface of the wafer W with progress of time arises.

In Example 1, after the through-hole PH is formed in the adhesive tape DT in step S5, the lower space H1 and the upper space H2 are pressed to the specific value PN. Therefore, even if a pressure difference is generated between the atmospheric pressure Ph2 of the lower space H1 and the atmospheric pressure Ph1 of the upper space H2 due to a factor such as the difference between the area of the lower space H1 and the area of the upper space H2, the pressure difference is quickly resolved. That is, since the gas can flow between the lower space H1 and the upper space H2 through the through hole PH, it is possible to prevent a bias from occurring between the atmospheric pressure Ph1 and the atmospheric pressure Ph2. Accordingly, the pressure difference generated between the lower space H1 and the upper space H2 is suppressed to a predetermined value or less. Practically, the pressure difference between the lower space H1 and the upper space H2 becomes close to zero.

The magnitude of the pressing force V1 depends on the atmospheric pressure Ph1, and the magnitude of the pressing force V2 depends on the atmospheric pressure Ph2. Therefore, by suppressing the difference between the atmospheric pressure Ph1 and the atmospheric pressure Ph2 to a predetermined value or less, the difference between the pressing force V1 acting on the wafer W from the side of the upper space H2 and the pressing force V2 acting on the wafer W from the side of the lower space H1 is reduced It can be suppressed below a predetermined value. Accordingly, when the pressure difference between the lower space H1 and the upper space H2 becomes small, it is possible to avoid a situation in which cracks or defects occur in the wafer W due to the pressure difference.

In a state in which the lower space H1 and the upper space H2 are pressurized to an atmospheric pressure higher than atmospheric pressure, after a pressing force is applied between the adhesive tape DT and the wafer W for a predetermined time, the control unit 33 stops the pressing device 32 . And the control part 33 makes the solenoid valve 105 and the solenoid valve 107 into an open state, and makes the lower space H1 and the upper space H2 open to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 9 so that the surface of the wafer W is aligned with the wafer holding surface of the holding table 9 . make it touch

Step S7 (cutting the sheet)

Moreover, while performing the process regarding step S4 - step S6 in the chamber 29, the sheet|seat cutting mechanism 82 is operated and adhesive tape DT is cut|disconnected. At this time, as shown in FIG. 22 , the cutter 95 cuts the adhesive tape DT affixed to the ring frame f into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 and follows the ring frame f. The sheet cut part on the frame f is pressed while rolling.

Since the 1st sticking process about step S4 and the 2nd sticking process about step S5 are completed at the time of raising the upper housing 29B, the pinch roller 90 is raised and the nip of the adhesive tape DT is released. Thereafter, as shown in FIG. 23 , the nip roller 86 is moved to wind the unnecessary adhesive tape DT after being cut toward the sheet recovery unit 74 to be recovered, and from the sheet supply unit 71 a predetermined amount of The adhesive tape DT is fed out. By each process up to step S6, the mount frame MF in which the ring frame f and the wafer W were integrated via the adhesive tape DT is formed.

When the unnecessary adhesive tape DT is wound up and recovered, the nip roller 86 and the sticking roller 85 return to their initial positions. And in the state holding the mount frame MF, the holding table 9 moves from a affixing position to an initial position.

Step S8 (number of mount frames)

When the holding table 9 returns to the initial position, as shown in FIG. 24 , the suction pad 28 provided in the frame transport device 17 adsorbs and holds the mount frame MF, and the lower housing 29A. Detach the mount frame MF from the The frame conveying apparatus 17 which adsorbed and held the mount frame MF conveys the mount frame MF to the frame collection|recovery part 6 . The conveyed mount frame MF is loaded and accommodated in the cassette 41 .

In the above, the operation of one sequence of affixing the adhesive tape DT to the wafer W is completed. Thereafter, the above processing is repeated until the number of mount frames MF reaches a predetermined number.

<Effect by the configuration of Example 1>

According to the apparatus according to the first embodiment, the first sticking process and the second sticking process are performed using the chamber. That is, after affixing adhesive tape DT to the wafer W by a 1st sticking process, by performing a 2nd sticking process, adhesive tape DT is affixed so that it may closely_contact|adhere with respect to the wafer W more precisely. With such a structure, the adhesive tape DT can be affixed with high precision with respect to the wafer W which has annular convex part Ka on one surface, avoiding the situation where the wafer W is damaged.

In the 1st sticking process which concerns on this invention, the inside of the lower space H1 in which the wafer W is arrange|positioned inside the chamber 29 is pressure-reduced. That is, since the space around the adhesive tape DT and the wafer W is degassed by pressure reduction, when the adhesive tape DT comes into contact with the wafer W and covers the back surface of the wafer W, it is possible to prevent gas from entering between the adhesive tape DT and the wafer W. can Therefore, the fall of the adhesive force resulting from mixing of gas can be avoided.

Moreover, in the 2nd sticking process which concerns on this invention, the adhesive tape DT is affixed on the back surface of the wafer W with high precision by pressurizing the atmospheric pressure of the lower space H1 and the upper space H2 so that it may become larger than atmospheric pressure.

When the differential pressure Fa is generated by depressurizing the inside of the chamber using a vacuum device, the magnitude of the differential pressure Fa generated by the decompression from the atmospheric pressure is equal to or less than atmospheric pressure. That is, when the pressure-sensitive adhesive tape DT is pressed against the wafer W using the differential pressure Fa, there is an upper limit on the magnitude of the force for pressing the pressure-sensitive adhesive tape DT against the back surface of the wafer W.

Therefore, in the state in which the adhesive tape DT was made to contact the wafer W by the differential pressure Fa by pressure_reduction|reduced_pressure, the adhesiveness of the adhesive tape DT and the wafer W is low. Further, in the conventional configuration using the first pressing member, the pressing force can be applied only to a limited portion of the adhesive tape DT. Moreover, since the magnitude|size of the said pressing force is also insufficient, it is difficult to improve the adhesiveness of the adhesive tape DT and the wafer W.

On the other hand, in the present invention, the upper space H2 and the lower space H1 in the chamber 29 are pressurized so that the pressure is greater than atmospheric pressure using the pressurizing device 32 . That is, in the second sticking process, pressing forces V1 and V2 sufficiently larger than the differential pressure Fa can be applied to the adhesive tape DT and the wafer W. Further, the pressing forces V1 and V2 act over the entire surface of the adhesive tape DT affixed to the wafer W. Therefore, since the adhesiveness of the adhesive tape DT and the wafer W can be greatly improved by performing the 2nd sticking process, even if time passes after a series of sticking processes are completed, it can avoid that the adhesive tape DT peels from the wafer W .

Moreover, in a 2nd sticking process, the magnitude|size of the pressing force V1 and V2 can be adjusted to arbitrary values by controlling the pressing device 32 appropriately. Therefore, even when various conditions such as the constituent material of the pressure-sensitive adhesive Tb or the size of the wafer W and the thickness of the annular convex portion Ka are changed, by appropriately adjusting the sizes of the pressing forces V1 and V2, the pressure-sensitive adhesive tape DT is reliably transferred to the wafer. It can be affixed to the annular convex part formation surface of W.

In the adhesive sheet sticking apparatus 1 which concerns on Example 1, by performing a pressure difference adjustment process before a 2nd sticking process, the difference of the atmospheric pressure which generate|occur|produces between the upper space H2 and the lower space H1 in a 2nd sticking process is a predetermined value. reduced below. By performing the pressure difference adjustment process, the occurrence of damage such as cracks or defects in the wafer W can be more reliably avoided while improving the adhesiveness between the adhesive tape DT and the wafer W.

Here, the effect of the pressure difference adjustment process will be described. According to the inventor's diligent examination, when the upper space H2 and the lower space H1 are pressurized to atmospheric pressure or higher in a state in which the interior of the chamber 29 is partitioned into the upper space H2 and the lower space H1 by the adhesive tape DT, the wafer W may crack or It was found that there was a problem that damage such as defects occurred.

As a result of the inventor further earnestly examining, the following hypotheses were discovered. That is, by pressurizing the inside of the chamber 29 to atmospheric pressure or higher, a large pressure difference is generated between the pressing force V1 generated in the upper space H2 and the pressing force V2 generated in the lower space H1. Since both the upper space H2 and the lower space H1 are connected to the pressurizing device 32 via the flow path 102, the amount of gas supplied to each of the upper space H2 and the lower space H1 is equal.

However, due to the difference in the volumes of the upper space H2 and the lower space H1, the speed at which the atmospheric pressure (compression force V1) in the upper space H2 rises and the speed at which the atmospheric pressure (compression force V2) in the lower space H1 rises even if the gas supply amounts are equal. may be different. As a result, in step S6, it is considered that the wafer W is damaged such as cracks or defects due to the pressure difference between the pressing force V1 and the pressing force V2.

Then, in the adhesive sheet sticking apparatus 1 which concerns on Example 1, the through-hole PH is formed in the adhesive tape DT using the sheet|seat perforation part 76 before a 2nd sticking process. By allowing gas to flow between the upper space H2 and the lower space H1 through the through hole PH, even when a pressure difference occurs between the pressing force V1 and the pressing force V2, the pressure difference is quickly resolved by the flow of the gas. Therefore, when the inside of the chamber 29 is pressed in step S6, the pressure difference generated between the pressing force V1 and the pressing force V2 can be maintained in a state in which the pressure difference is reduced to a predetermined value or less. While increasing the adhesiveness between the tape DT and the wafer W, it is possible to avoid the occurrence of breakage in the wafer W due to the pressure difference between the pressing force V1 and the pressing force V2.

[Example 2]

Hereinafter, Embodiment 2 of the present invention will be described with reference to the drawings. In Example 1, the pressure difference generated between the upper space H2 and the lower space H1 in the second sticking process related to step S6 is reduced by forming a through hole PH in the adhesive tape DT using the sheet perforation portion 76. The configuration has been described as an example. On the other hand, in Example 2, the control part 33 reduces the pressure difference which generate|occur|produces between the upper space H2 and the lower space H1 in step S6 by pressurizing each of the upper space H2 and the lower space H1 in stages. In addition, about the same structure as the adhesive sheet sticking apparatus 1 which concerns on Example 1, it only attaches|subjects the same number, and demonstrates in detail about another structural part.

The adhesive sheet sticking apparatus 1 which concerns on Example 2 has the structure in common with the adhesive sheet sticking apparatus 1 which concerns on Example 1 except the chamber 29. However, in the second embodiment, the pressure difference generated between the upper space H2 and the lower space H1 is reduced according to the control pattern set by the control unit 33 . Therefore, in the adhesive sheet pasting apparatus 1 which concerns on Example 2, the sheet|seat perforation part 76 can be abbreviate|omitted.

58 is a longitudinal sectional view of the chamber according to Example 2. FIG. In the second embodiment, the solenoid valve 104 is disposed in the flow path 204 , and the solenoid valve 114 is disposed in the flow path 203 . That is, since the control unit 33 independently controls the opening and closing operations of the solenoid valve 104 and the solenoid valve 114 , in the second embodiment, on/off of gas supply to the lower space H1 and gas supply to the upper space H2 It is configured to independently control the on/off of the

<Pressure control according to Example 2>

The detail of the control by which the control part 33 pressurizes the upper space H2 and the lower space H1 in Example 2 is demonstrated, comparing with the press control in Example 1. FIG. 25 is a graph for explaining a general control method in which the control unit 33 pressurizes the atmospheric pressures in the upper space H2 and the lower space H1 from an initial value PS to a specific value PN. In addition, the case where the initial value PS is 1 atmosphere and the specific value PN is 6 atmospheres is demonstrated as an example. In addition, the volume of the lower space H1 is larger than that of the upper space H2, and the pressurization rate in the lower space H1 is lower than the pressurization rate in the upper space H2.

In general, when pressurizing the upper space H2 and the lower space H1 to an atmospheric pressure higher than atmospheric pressure, the respective atmospheric pressures of the upper space H2 and the lower space H1 are raised from the initial value PS to the predetermined specific value PN by one pressurization step. make it That is, the control part 33 pressurizes each of the upper space H2 and the lower space H1 which are a state of 1 atmospheric pressure, making 6 atmospheric pressure which is a specific value PN a target value.

Since both the upper space H2 and the lower space H1 are connected to the pressurizing device 32 through the same flow path 102, an equal amount of gas is supplied to each of the upper space H2 and the lower space H1 per unit time. However, the speed at which the atmospheric pressure Ph1 in the upper space H2 shown by the solid line in FIG. 25 rises is different from the speed at which the atmospheric pressure Ph2 in the lower space H1 shown by the dotted line in FIG. 25 rises. That is, since the volume of the upper space H2 is smaller than the volume of the lower space H1, the rising speed of atmospheric pressure Ph1 is larger than the rising speed of atmospheric pressure Ph2. Therefore, after the atmospheric pressure Ph1 reaches the target value of 6 atmospheres quickly at the time ta, the target value is maintained. On the other hand, atmospheric pressure Ph2 does not reach the target value of 6 atmospheres at the time point of time ta because an increase rate is slow, but reaches 6 atmospheres at time tb which is slower than time ta.

In this way, in a general pressurization control pattern of pressurizing to a specific value PN by one pressurization step Rv, the pressure difference Ds between the atmospheric pressure Ph1 and the atmospheric pressure Ph2 becomes very large. That is, as shown in FIG. 25, the pressure difference Ds becomes large at time ta. And when pressurization is performed at the pressurization speed|rate as shown in FIG. 25, the pressure difference Ds in time ta is larger than 2 atmospheres. As a result, since a large differential pressure acts on the wafer W in step S6 due to the very large pressure difference Ds, damage to the wafer W tends to occur.

On the other hand, in the pressurization control according to the second embodiment, as shown in FIG. 26 , the process of pressurizing the upper space H2 and the lower space H1 is divided into n pressurization steps R1 to Rn, and both spaces are pressurized step by step. In addition, about the value of n, if it is an integer of 2 or more, you may change suitably.

In each of the divided pressurization steps R1 to Tn, control is performed to open the solenoid valves 104 and 114 to pressurize the upper space H2 and the lower space H1 to the target value M determined for each pressurization step. And the one which reached the target value M first among the upper space H2 and the lower space H1 is controlled so that the value of atmospheric pressure may be maintained at the said target value M until the other space reaches the said target value M.

As an example, when the atmospheric pressure in the upper space H2 first reaches the target value M, when the atmospheric pressure in the upper space H2 reaches the target value M, the control unit 33 closes the solenoid valve 104 to Stop the gas supply. On the other hand, the control unit 33 maintains the solenoid valve 114 in an open state to continue supplying the gas to the lower space H1. By this control, the atmospheric pressure in the upper space H2 is maintained at the target value M, while the atmospheric pressure in the lower space H1 rises toward the target value M. When the atmospheric pressure of the lower space H1 reaches the target value M first, the control part 33 performs control which closes the solenoid valve 114, maintaining the solenoid valve 104 in the open state. When both the atmospheric pressures of the lower space H1 and the upper space H2 reach the target value M, the next pressurization step R is started, both the solenoid valves 104 and 114 are opened, and the lower space H1 and the upper space H2 are pressurized.

In addition, about each of the target values M determined in each of press step R1 - Rn, it distinguishes as target values M1 - Mn. As an example, about the target value M determined in the pressurization step R1, it is set as the target value M1, and it distinguishes from the target value M which other press steps R2 to Rn have. The target values M1 to Mn are predetermined so as to increase step by step. That is, compared with the target value M1, the target value M2 is determined to be higher, and the target value Mn is determined to be the highest.

You may change the number of pressurization steps which generate|occur|produce by division|segmentation of the process of pressurizing the upper space H2 and the lower space H1, ie, the value of n suitably. That is, the number n of the pressurization steps R1 to Rn is predetermined so that the pressure difference between the upper space H2 and the lower space H1 is maintained at a predetermined value or less.

In FIG. 26, the process of pressurizing the upper space H2 and the lower space H1 is divided|segmented into 5 pressurization steps R1 - T5, and the structure which performs control which pressurizes both spaces from 1 atmosphere to 6 atmospheres is illustrated. In this case, first, the target value M1 is set to 2 atmospheres in 1st pressurization step R1. That is, the control unit 33 controls the pressurizing device 32 so that the upper space H2 and the lower space H1 are pressurized from 1 atm as the starting value to 2 atm as the target value M1.

When the first pressurization step R1 is started at the time t0, the atmospheric pressure Ph1 of the upper space H2 will quickly reach the target value of 2 atmospheric pressure at the time t1. When the atmospheric pressure Ph1 of the upper space H2 reaches the target value, the control unit 33 switches the solenoid valve 104 from the opened state to the closed state while maintaining the solenoid valve 114 in the open state. By this control, the supply of gas to the upper space H2 is stopped, while the supply of the gas to the lower space H1 is continued. And until the time t2 when the atmospheric pressure Ph2 of the lower space H1 reaches 2 atmospheric pressure, the atmospheric pressure Ph1 does not rise and the state of the 2 atmospheric pressure which is the target value M1 is maintained.

When both the upper space H2 and the lower space H1 reach the 2 atmospheric pressure which is the target value M1, 2nd pressurization step R2 is started. When the 2nd pressurization step R2 is started, the control part 33 controls so that both the solenoid valves 104 and 114 may be in the opened state, and supplies gas to the lower space H1 and the upper space H2.

In the second pressurization step R2, the target value M2 is determined to be 3 atmospheres higher than the target value M1. That is, in the second pressurization step R2, the upper space H2 and the lower space H1 are pressurized from the starting value of 2 atm to the target value M2 of 3 atm. Atmospheric pressure Ph1 of upper space H2 reaches 3 atm which is the target value M2 at time t3, and maintains the state of 3 atm until time t4. And when atmospheric pressure Ph2 reaches 3 atmospheric|air pressure (target value M2) in time t4, it transfers to 3rd pressurization step R3 from 2nd pressurization step R2.

In the third pressurization step R3, the target value M3 is set to 4 atm higher than the target value M2, and the upper space H2 and the lower space H1 are pressurized from 3 atm to 4 atm. At time t4, 3rd pressurization step R3 is started, and atmospheric|air pressure Ph1 reaches 4 atmospheric pressure which is target value M3 in time t5. And atmospheric pressure Ph2 reaches 4 atmospheric pressure in time t6, and it transfers to 4th pressurization step R4 from 3rd pressurization step R3.

In the fourth pressurization step R4, the target value M4 is set to 5 atm which is a value higher than the target value M3, and the upper space H2 and the lower space H1 are pressurized from 4 atm to 5 atm. At time t6, the 4th pressurization step R4 is started, and atmospheric|air pressure Ph1 reaches 5 atmospheric pressure at time t7. And atmospheric pressure Ph2 reaches 5 atmospheric|air pressure in time t8, and it transfers to 5th pressurization step R5 from 4th pressurization step R4.

In the fifth pressurization step R5, the target value M5 is set to a final target of 6 atm (specific value PN), and the upper space H2 and the lower space H1 are pressurized from 5 atm to 6 atm. At time t8, 5th pressurization step R5 is started, and atmospheric|air pressure Ph1 reaches 6 atmospheres at time t9. And the atmospheric pressure Ph2 reaches 6 atmospheres at time t10, and the whole process of pressurizing the upper space H2 and the lower space H1 from the initial value PS to the specific value PN is completed.

In this way, by dividing the process of pressurizing the upper space H2 and the lower space H1 from the initial value PS to the specific value PN into a plurality of steps, and having a configuration in which the upper space H2 and the lower space H1 are pressurized step by step, in Example 2 The pressure difference Ds between atmospheric pressure Ph1 and atmospheric pressure Ph2 can be reduced. The time at which the pressure difference Ds becomes the maximum in the configuration of Example 2 shown in Fig. 26 is the time t1, t3, t5, t7, t9 at which the atmospheric pressure Ph1 reaches the target value in each of the pressurization steps R1 to R5. . The maximum value of the pressure difference Ds in Example 2 shown in FIG. 26 is very high compared with the maximum value of the pressure difference Ds in the structure pressurized to the specific value PN in one pressurization step Rv as shown in FIG. gets smaller

That is, the maximum value of the pressure difference Ds can be made small by dividing the process of pressurizing the upper space H2 and the lower space H1 to the specific value PN into a plurality of pressurization steps T1 to Tn and pressurizing it step by step. In other words, the maximum value of the pressure difference Ds can be made small by repeating the operation|movement of raising the atmospheric pressure of the upper space H2 and the lower space H1 to the target value set in each pressurization step R1 - Rn.

The reason that the maximum value of the pressure difference Ds can be made small is that the difference between the start value and the target value in each pressurization step can be made small by dividing into a plurality of pressurization steps R1 to Rn. Specifically, in the configuration shown in Fig. 25, in one pressurization step, the upper space H2 and the lower space H1 are pressurized from 1 atm as the starting value (initial value PS) to 6 atm as the target value (specific value PN). That is, the increase amount (difference between the start value and the target value) of the atmospheric pressure in the one pressurization step is 5 atmospheres. Accordingly, in the case of raising the pressure by 5 atmospheres in one pressurization step, the pressure difference Ds can be at most 5 atmospheres.

On the other hand, in the structure shown in FIG. 26, since the process of pressurizing from 1 atm to 6 atm is divided into five pressurization steps T1 to T5, the amount of increase in atmospheric pressure in each of the pressurization steps T1 to T5 becomes 1 atm. Therefore, in each pressurization step T1 - T5, the maximum value of the pressure difference Ds can be suppressed to 1 atmosphere or less.

<Operation in Example 2>

Here, the operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 2 is demonstrated. The outline of the flowchart relating to the second embodiment is common to the flowchart relating to the first embodiment shown in FIG. About the process similar to the operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 1, description is simplified, and step S5 and step S6 which are another process are demonstrated in detail.

Step S5 (pressure difference adjustment process)

When the 1st sticking process concerning step S4 is completed, the control part 33 sets the press control pattern in step S6. In other words, the control unit 33 sets a control pattern for pressurizing the upper space H2 and the lower space H1 so that the atmospheric pressure is higher than atmospheric pressure. Specifically, by executing five pressurization steps R1 to R5 in which target values M1 to M5 that are increased in stages are determined, the control pattern for pressurizing the upper space H2 and the lower space H1 to an atmospheric pressure higher than atmospheric pressure. set

Each of the pressurization steps R1 to R5 is a step of raising the atmospheric pressure of the upper space H2 and the lower space H1 to the target value M determined for each pressurization step. The process for suppressing the pressure difference generated between the upper space H2 and the lower space H1 to a predetermined value or less, that is, the pressure difference adjustment process, is completed by the control part 33 setting the pressurization control pattern having pressurization steps R1 to R5.

Step S6 (second sticking process)

After the press control pattern of the upper space H2 and lower space H1 using several press step R1 - R5 is set, a 2nd sticking process is started. The control part 33 opens the solenoid valves 104 and 114 while closing the solenoid valves 103, 105, 107, 110, 113 shown in FIG. Then, the control unit 33 operates the pressurization device 32 to supply gas to the lower space H1 and the upper space H2, and independently controls the opening and closing of the solenoid valves 104 and 114, so that the pressurization control pattern set in step S5 is applied. Accordingly, the lower space H1 and the upper space H2 are pressurized step by step to a specific value PN. In Example 2, in each of the pressurization steps R1 to R5 divided into five, the atmospheric pressure of the lower space H1 and the upper space H2 is increased by one atmosphere.

In each of the pressurization steps R1 to R5, when one atmospheric pressure of the lower space H1 and the upper space H2 reaches the target value M, when the other atmospheric pressure of the lower space H1 and the upper space H2 reaches the target value M Until then, the air pressure in one of the lower space H1 and the upper space H2 maintains the target value M, the control unit 33 controls the pressurizing device 32 .

As an example, when the atmospheric pressure Ph1 in the upper space H2 reaches the target value M1 before the atmospheric pressure Ph2 in the lower space H1 in the pressurization step R1 having the target value M1, the solenoid valve 104 is opened while the solenoid valve 114 is opened. By closing , the atmospheric pressure Ph1 maintains the target value M1 until the atmospheric pressure Ph2 reaches the target value M1. In other words, the atmospheric pressure Ph1 is not made higher than the target value M1 until the atmospheric pressure Ph2 reaches the target value M1. Accordingly, the pressure difference Ds between the lower space H1 and the upper space H2 generated in the pressurization step R1 is suppressed to be equal to or less than the increase amount of the atmospheric pressure in the pressurization step R1 (1 atm or less in the second embodiment).

When both the atmospheric pressures of the upper space H2 and the lower space H1 reach the target value M1, the pressurization step R1 is completed and the next pressurization step R2 is started. In pressurization step R2, the upper space H2 and the lower space H1 are pressurized to the target value M2. When the atmospheric pressure Ph1 in the upper space H2 reaches the target value M2 before the atmospheric pressure Ph2 in the lower space H1, the atmospheric pressure Ph1 maintains the target value M2 until the atmospheric pressure Ph2 reaches the target value M2. When both the atmospheric pressures of the upper space H2 and the lower space H1 reach the target value M2, the pressurization step R2 is completed and the next pressurization step R3 is started. Hereinafter, the upper space H2 and the lower space H1 are pressurized in stages by executing the pressurization steps R3 to R5 in order.

In this way, by sequentially executing the pressurization steps R1 to R5 for pressurizing the atmospheric pressures in the upper space H2 and the lower space H1 to the target values M1 to M5, the atmospheric pressures in the upper space H2 and the lower space H1 are changed from the initial value PS to the specific value PN. rise step by step. By dividing the process of pressurizing the upper space H2 and the lower space H1 from the initial value PS to the specific value PN into a plurality of pressurization steps R1 to R5, the upper space H2 and the lower space H1 generated in each pressurization step R1 to R5 The upper limit of the pressure difference is reduced according to the number of pressurization steps R1 to R5.

Accordingly, the pressure difference between the upper space H2 and the lower space H1 generated in the process of pressurizing the upper space H2 and the lower space H1 by stepwise pressurizing the upper space H2 and the lower space H1 by sequentially executing the pressurization steps R1 to R5. can be suppressed below a predetermined value. Accordingly, it is possible to avoid damage to the wafer W due to the pressure difference between the upper space H2 and the lower space H1 even when the upper space H2 and the lower space H1 are pressurized to a pressure higher than atmospheric pressure.

By completing the pressing steps R1 to R5 and applying the pressing forces V1 and V2 to the wafer W for a predetermined period of time in a state pressurized to a specific value PN higher than atmospheric pressure, the adhesive tape DT is affixed so as to be more closely adhered to the wafer W. After applying the pressing forces V1 and V2 for a predetermined time, the control unit 33 stops the pressing device 32 . And the control part 33 makes the solenoid valves 105, 107 fully open, and makes the lower space H1 and the upper space H2 open to atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 9 so that the surface of the wafer W is aligned with the wafer holding surface of the holding table 9 . By touching, the process related to step S6 is completed. After step S6 is completed, the mount frame MF is created by carrying out the process of step S7 and step S8 similarly to Example 1.

In the second embodiment, the pressure difference adjustment process is executed by setting the pressure control pattern by the control unit 33 . That is, by making the pressure control pattern set by the control part 33 into the control pattern which pressurizes the upper space H2 and the lower space H1 step by step by several press step R1-R5, in a 2nd sticking process, the upper space H2 and the lower part The pressure difference in the space H1 can be suppressed to a predetermined value or less. Therefore, even if a new mechanism exemplified by the sheet perforation portion 76 is not included in the adhesive tape pasting apparatus 1, it is possible to prevent damage to the wafer W by updating the program of the control unit 33 relating to the pressure control pattern. While avoiding it, the adhesiveness of the wafer W and the adhesive tape DT can be improved.

[Example 3]

Hereinafter, Embodiment 3 of the present invention will be described with reference to the drawings. The adhesive sheet sticking apparatus 1 which concerns on Example 3 has a structure in common with the adhesive sheet sticking apparatus 1 which concerns on Example 1. FIG. In the third embodiment, the configuration of the flow path and the solenoid valve connected to the pressurizing device 32 is different from the configuration of the first or second embodiment shown in FIG. 6 . Moreover, in Example 3, similarly to Example 2, the sheet|seat perforation part 76 can be abbreviate|omitted.

Fig. 27 is a longitudinal sectional view of the chamber according to the third embodiment. In Examples 1 and 2, the solenoid valve 104 and the solenoid valve 114 are configured to switch between a fully opened state and a fully closed state. That is, when gas is supplied to the lower space H1 and the upper space H2 with the solenoid valve 104 and the solenoid valve 114 in an open state, the amount of gas supplied to the lower space H1 and the upper space H2 per unit time The amount of gas supplied is of equal composition.

On the other hand, the chamber 29 according to the third embodiment is configured such that the amount of gas supplied to the lower space H1 per unit time and the amount of gas supplied to the upper space H2 per unit time can be independently adjusted, respectively. have. In other words, the speed at which the atmospheric pressure in the lower space H1 rises by the supply of gas and the speed at which the atmospheric pressure in the upper space H2 increases by the supply of gas can be independently adjusted.

In Example 3, similarly to Example 2, the solenoid valve 104 is arrange|positioned in the flow path 204, and the solenoid valve 114 is arrange|positioned in the flow path 203. FIG. However, in the chamber 29 according to the third embodiment, as shown in FIG. 27 , the opening/closing control valve 115 is provided in the solenoid valve 104 , and the opening/closing control valve 116 is provided in the solenoid valve 114 . . The opening degree control valve 115 adjusts the amount of gas supplied to the upper space H2 through the flow path 204 by appropriately adjusting the opening degree of the solenoid valve 104 . The opening degree control valve 116 adjusts the amount of gas supplied to the lower space H1 through the flow path 203 by appropriately adjusting the opening degree of the solenoid valve 114 .

In addition to the opening/closing operation of the solenoid valves 104 and 114 , adjustment of the opening degree of the solenoid valve 104 through the opening degree control valve 115 , and opening of the solenoid valve 114 through the opening degree control valve 116 . All adjustment of the figure is performed by the control part 33. As shown in FIG. That is, in the third embodiment, by providing the opening degree control valve 115 and the opening degree control valve 116, not only the on/off of the supply of gas to the lower space H1 and the upper space H2 is independently controlled, but also the upper space H2 It is also possible to independently control the gas supply rate to and the gas supply rate to the lower space H1.

Thus, in Example 3, when the pressurization device 32 is actuated, the rising speed of the atmospheric|air pressure in the upper space H2 can be adjusted by adjusting the opening degree of the solenoid valve 104. And by adjusting the opening degree of the solenoid valve 114, the rising speed of the atmospheric pressure in the lower space H1 can be adjusted. That is, in Example 3, when the control part 33 independently controls the opening degree of the solenoid valve 114 and the opening degree of the solenoid valve 104, the speed at which the atmospheric pressure of the upper space H2 rises in step S6, and the lower space H1 It has a configuration that can independently control the rate at which the atmospheric pressure rises. And the control unit 33 controls the opening degree of the solenoid valve 114 and the opening degree of the solenoid valve 104 so that the speed at which the air pressure in the upper space H2 rises and the air pressure in the lower space H1 are equal to each other, The pressure difference generated between the upper space H2 and the lower space H1 is suppressed to a predetermined value or less.

The mechanism for adjusting the pressure of the upper space H2 including the pressurization device 32 , the flow path 204 , the solenoid valve 104 , and the opening degree control valve 115 is equivalent to the first transforming mechanism in the present invention. do. The mechanism which is provided with the pressurization device 32, the flow path 203, the solenoid valve 114, and the opening degree control valve 116, and adjusts the pressure of the lower space H1 is equivalent to the 2nd pressure transformation mechanism in this invention do.

<Operation in Example 3>

Here, the operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 3 is demonstrated. The outline of the flowchart relating to the third embodiment is common with the flowchart relating to the first embodiment shown in FIG. About the process similar to the operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 1, description is simplified, and step S5 and step S6 which are another process are demonstrated in detail.

Step S5 (pressure difference adjustment process)

In Example 3, when the 1st sticking process concerning step S4 is completed, the process of suppressing the pressure difference which generate|occur|produces between the upper space H2 and the lower space H1 to a predetermined value or less is started. That is, the control part 33 has the opening degree of the solenoid valve 114 provided in the flow path 203 for lower space pressurization, and the opening degree of the solenoid valve 104 provided in the flow path 204 for upper space pressurization. control independently. At this time, the opening degree of the solenoid valve 114 and the opening degree of the solenoid valve 104 are respectively controlled so that the speed at which the atmospheric pressure of the upper space H2 rises and the speed at which the atmospheric pressure of the lower space H1 rises become equal.

In the adhesive sheet sticking apparatus 1 which concerns on Example 3 similarly to another Example, the volume of the upper space H2 is smaller than the volume of the lower space H1. Therefore, when the opening degree of the solenoid valve 114 and the opening degree of the solenoid valve 104 are equal, the speed at which the atmospheric pressure of the upper space H2 rises becomes larger than the speed at which the atmospheric pressure of the lower space H1 rises. Then, the control part 33 makes the opening degree of the solenoid valve 114 larger than the opening degree of the solenoid valve 104 so that the air pressure rising speed of the upper space H2 and the lower space H1 may become equal. When the control unit 33 adjusts the opening degrees of the solenoid valve 114 and the solenoid valve 104 , the pressure difference adjustment process is completed.

Step S6 (second sticking process)

After the opening degree of the solenoid valves 114 and 104 is adjusted by the control unit 33, the second sticking process is started. That is, as shown in FIG. 28 , in a state in which the opening degree of the solenoid valve 114 is controlled to be larger than the opening degree of the solenoid valve 104 , the control unit 33 operates the pressurizing device 32 to operate the upper space H2 and gas is supplied to each of the lower space H1. By supplying gas to each of the upper space H2 and the lower space H1, the control unit 33 raises the pressures in the upper space H2 and the lower space H1 to a pressure higher than atmospheric pressure.

As an example, when the pressurizing device 32 is operated in a state where the opening degree of the solenoid valve 114 is equal to the opening degree of the solenoid valve 104 , the rising speed of the atmospheric pressure Ph2 in the lower space H1 is the increase in the atmospheric pressure Ph1 in the upper space H2. Since it is smaller than the velocity, a large pressure difference Ds occurs between the atmospheric pressure Ph1 and the atmospheric pressure Ph2 (see Fig. 25).

On the other hand, in Example 3, since the pressurizing device 32 is operated in a state in which the opening degree of the solenoid valve 114 is controlled to be greater than the opening degree of the solenoid valve 104, compared with the gas Ar1 supplied to the upper space H2, , gas Ar2 supplied to the lower space H1 increases the amount of gas supplied per unit time. Therefore, in Example 3, as shown in FIG. 29, the rising speed of atmospheric pressure Ph2 becomes equal to the rising speed of atmospheric pressure Ph1. That is, the rising speed of atmospheric pressure Ph2 increases from the speed|rate shown by the dashed-dotted line in FIG. 29 to the speed|rate shown by the solid line.

By increasing the rate of increase of atmospheric pressure Ph2 and making it equal to the rate of increase of atmospheric pressure Ph1, the difference between atmospheric pressure Ph1 and atmospheric pressure Ph2 is suppressed to a predetermined value or less. Therefore, since the difference between the pressing force V1 acting on the wafer W from the side of the upper space H2 and the pressing force V2 acting on the wafer W from the side of the lower space H1 is suppressed to a predetermined value or less, damage to the wafer W is not caused in step S6. can be avoided from occurring.

By applying the pressing forces V1 and V2 to the wafer W for a predetermined period of time in a state pressurized with a specific value PN higher than atmospheric pressure, the adhesive tape DT is affixed to be more closely adhered to the wafer W. After applying the pressing forces V1 and V2 for a predetermined time, the control unit 33 stops the pressing device 32 . And the control part 33 makes the solenoid valves 105 and 107 fully open, and makes the lower space H1 and the upper space H2 open to atmosphere.

Thereafter, the control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 9 to hold the surface of the wafer W on the holding table 9 . By contacting the surface, the process related to step S6 is completed. After step S6 is completed, the mount frame MF in which the wafer W and the adhesive tape DT are integrated is created by performing the process of step S7 and step S8 similarly to Example 1.

In the third embodiment, by arranging the opening degree regulating valve 115 in the solenoid valve 104 and the opening regulating valve 116 in the solenoid valve 114, the air pressure increase rate in the upper space H2 and the lower space H1 It has a structure which independently controls each of the atmospheric pressure rise speed. And the pressure difference between the upper space H2 and the lower space H1 which generate|occur|produces in step S6 is suppressed to the predetermined value or less by the structure which pressurizes and controls each of the upper space H2 and the lower space H1 independently. In this third embodiment, since the sheet perforation portion 76 is unnecessary, there is no need to consider the position and area for forming the through hole PH in the adhesive tape DT.

Moreover, after the atmospheric pressure of one of the upper space H2 and the lower space H1 reaches the specific value PN by making equal the atmospheric|air pressure rising speed in upper space H2 and the atmospheric|air pressure rising speed in lower space H1, the other atmospheric pressure The occurrence of a waiting time until this specific value PN is reached can be avoided. As shown in FIG. 29, the time at which the atmospheric pressure Ph2 reaches the specific value PN is accelerated from tb to ta by making the rising rate of atmospheric pressure Ph2 in the lower space H1 equal to the rising rate of atmospheric pressure Ph1 in the upper space H2. As a result, since the time at which both the upper space H2 and the lower space H1 reach the specific value PN can be made faster, the time required for the process of step S6 can be shortened.

[Example 4]

Hereinafter, Embodiment 4 of the present invention will be described with reference to the drawings. The adhesive sheet sticking apparatus 1 which concerns on Example 4 has a structure in common with the adhesive sheet sticking apparatus 1 which concerns on Example 1. FIG. However, in the fourth embodiment, the configuration of the chamber 29 is different from the configuration of the other embodiments.

30 is a cross-sectional view of the chamber 29 according to the fourth embodiment. The chamber 29 according to the fourth embodiment is provided with a flow path 135 for communicating and connecting the lower housing 29A and the upper housing 29B. The flow path 135 is provided with a solenoid valve 137 , and the opening/closing operation of the solenoid valve 137 is controlled by the control unit 33 . When the solenoid valve 137 is opened, gas can flow between the upper space H2 and the lower space H1. That is, when the solenoid valve 137 is opened, the flow path 135 functions as a vent hole through which the gas flows between the upper space H2 and the lower space H1.

<Operation in Example 4>

Here, the operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 4 is demonstrated. The flowchart relating to the fourth embodiment is common to the flowchart relating to the first embodiment shown in FIG. About the process similar to the operation|movement of the adhesive sheet sticking apparatus 1 which concerns on Example 1, description is simplified, and step S5 and step S6 which are another process are demonstrated in detail.

Step S5 (pressure difference adjustment process)

In Example 4, when the 1st sticking process concerning step S4 is completed, as a pressure difference adjustment process, the process which enables gas to flow between the upper space H2 and the lower space H1 is performed. That is, when step S5 is started, the control part 33 performs control which opens the solenoid valve 137. As shown in FIG. By opening the solenoid valve 137 , the gas can flow between the upper space H2 and the lower space H1 through the flow path 135 . When the control unit 33 opens the solenoid valve 137, the pressure difference adjustment process is completed.

Step S6 (second sticking process)

After the solenoid valve 137 is opened by the control part 33, the 2nd sticking process is started. First, the control part 33 opens the solenoid valves 104 and 114 while closing the solenoid valves 103, 105, 107, 110, 113 shown in FIG. And while the solenoid valve 137 is maintained in an open state, the control unit 33 operates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2 to set the lower space H1 and the upper space H2 to specific values. Pressurize to PN.

By pressing the upper space H2, the pressing force V1 acts from the upper space H2 toward the front side of the adhesive tape DT and the wafer W, and the pressing force V2 acts from the lower space H1 toward the back side of the wafer W (FIG. 21). see). When the pressing force V1 and the pressing force V2, which are pressures higher than atmospheric pressure, act, the adhesiveness between the adhesive tape DT and the wafer W increases.

In Example 4, after opening the solenoid valve 137 in step S5, the lower space H1 and the upper space H2 are pressurized to the specific value PN higher than atmospheric pressure. Therefore, even if a pressure difference occurs between the atmospheric pressure Ph2 in the lower space H1 and the atmospheric pressure Ph1 in the upper space H2, the gas flows through the flow path 135 between the lower space H1 and the upper space H2, so that the pressure difference is quickly resolved. . Accordingly, it is possible to pressurize the lower space H1 and the upper space H2 to a specific value PN higher than atmospheric pressure while the pressure difference generated between the lower space H1 and the upper space H2 is suppressed to a predetermined value or less.

After applying the pressing forces V1 and V2 for a predetermined time, the control unit 33 stops the pressing device 32 . And the control part 33 makes the solenoid valve 105 and the solenoid valve 107 fully open, and makes the lower space H1 and the upper space H2 open to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 9 so that the surface of the wafer W is aligned with the wafer holding surface of the holding table 9 . By touching, the process related to step S6 is completed. After step S6 is completed, the mount frame MF is created by carrying out the process of step S7 and step S8 similarly to Example 1.

In the fourth embodiment, the flow path 135 and the solenoid valve 137 are provided, so that gas can be circulated between the upper space H2 and the lower space H1. And by pressurizing the upper space H2 and the lower space H1 to a pressure higher than atmospheric pressure with the solenoid valve 137 open, the pressure difference between the upper space H2 and the lower space H1 generated in step S6 can be suppressed to a predetermined value or less. can In such a fourth embodiment, even if the through-hole PH is not formed in the adhesive tape DT, the gas can be circulated between the upper space H2 and the lower space H1, and therefore the sheet perforation portion 76 can be omitted.

[Example 5]

Hereinafter, Embodiment 5 of the present invention will be described with reference to the drawings. In Examples 1-4, the structure of this invention was demonstrated using the adhesive sheet sticking apparatus 1 which sticks the adhesive tape DT using the wafer W which has annular convex part Ka as a workpiece|work. On the other hand, in the fifth embodiment, as an example of a configuration for integrating the work and the sheet material, a device sealing device 301 for integrating the work and the sheet material by attaching a sheet-like sealing material having adhesive force to the device mounted on the work. The configuration of the present invention will be described using

Moreover, the structure of the device sealing apparatus 301 which concerns on Example 5 is fundamentally common with the structure of the adhesive sheet sticking apparatus 1 which concerns on Example 1. FIG. Therefore, about the same structure as the adhesive sheet sticking apparatus 1 which concerns on Example 1, it only attaches|subjects the same number, and demonstrates in detail about another structural part.

The device sealing apparatus 301 seals a device mounted on a work with a sheet material, and in this embodiment, the LED 311 is attached to the substrate 310 on which the LED 311 is mounted by attaching a sheet-shaped sealing member BP. seal the

<Composition of work and sheet material>

First, the structure of the work and the sheet|seat material which concerns on this Example is demonstrated. Fig. 31(a) is a perspective view showing the back side of the sealing member BP, and Fig. 31(b) is a longitudinal sectional view of the sealing member BP. Fig. 32 is a perspective view showing the configuration of the substrate 310 to be sealed by the sealing member BP and the ring frame f.

The sealing member BP which concerns on this Example is equipped with the sealing sheet BS and the sheet|seat BT for conveyance, as shown to Fig.31 (a). The sealing sheet BS is cut in advance into a predetermined shape according to the shape of the substrate 310 . In the present embodiment, the sealing sheet BS is preliminarily cut into a substantially rectangular shape. Here, the substantially rectangular shape means a shape in which each corner of the rectangle is rounded as shown in Fig. 31A. In addition, in this embodiment, the size of the sealing sheet BS is larger than the board|substrate 310, and it is set so that it may become smaller than the inner diameter of the lower housing 29A mentioned later.

The sheet|seat BT for conveyance is elongate, and sealing sheet BS is affixed and hold|maintained by the sheet|seat BT for conveyance at predetermined pitch. In Example 5, sealing sheet BS corresponds to the sheet|seat material in this invention.

As shown in FIG. 31(b), the sheet|seat BT for conveyance is equipped with the structure in which the non-adhesive base material BTa and the adhesive material BTb which have adhesiveness were laminated|stacked. Polyolefin, polyethylene, etc. are mentioned as an example of the material which comprises base material BTa. An acrylic acid ester copolymer etc. are mentioned as an example of the material which comprises the adhesive material BTb.

As shown in Fig. 31(b), the sealing sheet BS has a structure in which a non-adhesive base material BSa and an adhesive sealing material BSb are laminated. When the base material BSa is affixed to the adhesive material BTb of the sheet BT for conveyance, the sheet BT for conveyance holds the sealing sheet BS. Polyolefin, polyethylene, etc. are mentioned as an example of the material which comprises base material BSa. Although the shape of sealing sheet BS is a substantially rectangular shape in a present Example, it can change suitably according to the shape of the board|substrate 310. As shown in FIG.

A separator BS (not shown) is added to the sealing material BSb, and the adhesive surface of the sealing material BSb is exposed when the separator BS is peeled off. In this embodiment, it is assumed that OCA (Optical Clear Adhesive), which is an optically transparent adhesive, is used as a material constituting the sealing material BSb.

As shown in FIG. 32 , a plurality of LEDs 311 and TFTs (not shown) are mounted in parallel in a two-dimensional matrix on the central portion of the surface of the substrate 310 . That is, by the LED 311, the surface of the board|substrate 310 is in the state in which the unevenness|corrugation was formed. The LED 311 is connected to the substrate 310 via TFTs, bumps (not shown), or the like. Examples of the substrate 310 include a glass substrate, an organic substrate, a circuit substrate, and a silicon wafer. Although the substrate 310 has a substantially rectangular shape in the present embodiment, the shape of the substrate 310 may be appropriately changed to any shape exemplified by a rectangular shape, a circular shape, a polygonal shape, or the like. In Example 5, the board|substrate 310 corresponds to the workpiece|work in this invention. The LED 311 corresponds to the device in the present invention.

The ring frame f has a size and shape surrounding the substrate 310 . The device sealing apparatus 301 according to the embodiment seals the LED 311 mounted on the substrate 310 with the sealing sheet BS, so that the substrate 310 and the ring frame f are integrated by the sealing sheet BS. The sealing body BMF with which it has is created. In Example 5, the sealing body BMF corresponds to the semiconductor product in this invention.

<Description of the overall configuration>

Here, the whole structure of the device sealing apparatus 301 which concerns on Example 5 is demonstrated. 33 is a plan view showing the basic configuration of a device sealing apparatus 301 according to the fifth embodiment. The device sealing apparatus 301 has a structure provided with the horizontal rectangular part 301a and the protrusion part 301b. The protruding portion 301b is connected at the central portion of the rectangular portion 301a and is configured to protrude upward.

A substrate transport mechanism 303 is disposed on the right side of the rectangular portion 301a. At a position near the lower right side of the rectangular portion 301a, two containers 305 containing the substrate 310 are placed in parallel. At the left end of the rectangular portion 301a, a sealing body recovery portion 306 for recovering the sealing body BMF is disposed.

The aligner 7, the holding table 309, and the frame supply part 12 are arrange|positioned in this order from the upper right side of the rectangular part 301a. The sealing unit 313 which seals each of the LED 311 mounted on the board|substrate 310 with the sealing sheet BS is arrange|positioned in the protrusion part 301b.

As shown in FIG. 34, the board|substrate conveyance mechanism 303 is the board|substrate conveying apparatus 316 supported so that left-right reciprocation is possible on the right side of the guide rail 15 installed horizontally on the left and right on the upper part of the rectangular part 301a. is provided. Further, on the left side of the guide rail 15, a frame conveying device 17 supported so as to be movable left and right is provided.

The substrate transport device 316 is configured to transport the substrate 310 taken out from either side of the container 5 to the left and right and back and forth. The substrate transport apparatus 16 is equipped with a left-right movable table 18 and a forward-backward movable movable table 19 . A holding unit 21 for holding the substrate 310 is provided at the lower portion of the forward/backward movable table 19 . The lower part of the holding unit 21 is equipped with a horseshoe-shaped holding arm 23 . The holding arm 23 adsorbs and holds the substrate 310 through a suction pad provided on the holding surface. The holding arm 23 is configured to be able to perform a forward and backward movement, a left-right movement, and a pivotal movement around the z-direction axis in a state in which the substrate 310 is adsorbed and held.

The holding table 309 is a metal chuck table having the same shape or larger size as that of the substrate 310, as shown in FIG. are connected to each other. The operation of the vacuum device 31 and the pressurization device 32 is controlled by the control unit 33 . The holding table 309 is accommodated in the lower housing 29A constituting the chamber 29 , and can be moved up and down inside the chamber 29 .

Moreover, in Example 5, the holding table 309 differs from the holding table 9 concerning Example 1 in that it is not provided with the annular projection part 9a. That is, since the board|substrate 310 does not have the annular convex part Ka and the flat recessed part He, the holding table 309 which concerns on Example 5 does not need to be provided with the annular protrusion part 9a. Accordingly, the holding table 309 is flat as a whole.

The lower housing 29A includes a frame holding portion 38 that surrounds the lower housing 29A. The frame holding portion 38 is configured such that the upper surface of the ring frame f and the cylindrical top of the lower housing 29A are at the same height when the ring frame f is mounted. Moreover, it is preferable that the mold release process is given to the cylindrical top of 29A of lower housing|casings.

Moreover, as shown in FIG. 33, the holding table 309 is comprised so that reciprocating movement between an initial stage position and a sealing position is possible along the rail 40 laid in the front-back direction. The initial position is inside the rectangular portion 1a, and is a position where the holding table 309 is indicated by a solid line in FIG. 33 . In the set position, the substrate 310 is mounted on the holding table 309 .

The sealing position is inside the protrusion 301b, and in FIG. 33, the holding table 309 is a position indicated by a dotted line. By moving the holding table 309 to the sealing position, it becomes possible to perform a sealing process using the sealing member BP with respect to the substrate 310 mounted on the holding table 309 . The frame supply unit 12 accommodates a drawer-type cassette in which a predetermined number of ring frames f are stacked and accommodated.

As shown in FIG. 5 , the sealing unit 313 includes a sheet supply unit 371 , a separator recovery unit 72 , a device sealing unit 373 , a sheet recovery unit 374 , and the like. The sheet supply unit 371 supplies the sealing member BP to the sealing position from a supply bobbin loaded with a fabric roll on which a sealing member with a separator BPS (a sealing member BP with a separator S is attached) wound thereon is supplied to the sealing position, the separator peeling roller 75 ) to peel off the separator S.

The separator collection part 72 is equipped with the collection|recovery bobbin which winds up the separator S peeled from the sealing member BP. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor.

The device sealing portion 373 includes a chamber 29 , a device sealing mechanism 381 , a sheet cutting mechanism 82 , and the like.

The chamber 29 is constituted by a lower housing 29A and an upper housing 29B. The lower housing 29A is disposed so as to surround the holding table 309 and reciprocates between the initial position and the sealing position together with the holding table 9 in the front-rear direction. The upper housing 29B is disposed on the protrusion 301b and is configured to be liftable. In the fifth embodiment, since the configuration of the chamber 29 is common to that of the first embodiment shown in FIG. 6, the details are omitted.

The device sealing mechanism 381 includes a movable table 84 , a sticking roller 85 , a nip roller 86 , and the like. The sheet cutting mechanism 82 is disposed on a lifting drive 91 for raising and lowering the upper housing 29B, a support shaft 92 extending in the z direction, and a boss rotating around the support shaft 92 . A portion 93 is provided. The boss portion 93 includes a plurality of support arms 94 extending in the radial direction. At the tip of the at least one support arm 94 , a disk-shaped cutter 95 for cutting the conveyance sheet BT of the sealing member BP along the ring frame f is disposed so as to be vertically movable.

The sheet collection|recovery part 374 is equipped with the collection|recovery bobbin which winds up the unnecessary conveyance sheet|seat BT peeled after cutting. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor (not shown). As shown in Fig. 4, in the sealing body recovery section 306, a cassette 41 for loading and recovering the sealing body BMF is arranged. The cassette 41 is provided with a vertical rail 45 connected and fixed to the device frame 43 , and a lifting platform 49 that is screwed and moved up and down by a motor 47 along the vertical rail 45 . Therefore, the sealing body collection|recovery part 306 is comprised so that the sealing body BMF may be mounted on the hoisting table 49, and pitch conveyance may descend|fall.

In the fifth embodiment, a sheet perforation portion 76 is disposed inside the upper housing 29B as in the first embodiment. In Example 5, the sheet perforation portion 76 forms a through hole PH in the conveying sheet BT. The configuration of the sheet perforation portion 76 according to the fifth embodiment is the same as that of the first embodiment shown in FIG. 7 .

<Outline of action>

Here, the basic operation of the device sealing apparatus 301 according to the fifth embodiment will be described. FIG. 36 is a flowchart for explaining a series of processes for manufacturing the sealing body BMF by sealing the LED 311 mounted on the substrate 310 with the sealing sheet BS using the device sealing apparatus 301 .

Step S1 (workpiece supply)

When a sealing command is given, the ring frame f is conveyed from the frame supply unit 12 to the frame holding unit 38 of the lower housing 29A, and the substrate 310 is transferred from the container 305 to the holding table 309 . is returned

That is, the frame conveying device 17 sucks the ring frame f from the frame supply unit 12 and moves and mounts it on the frame holding unit 38 . When the frame conveying device 17 releases the suction of the ring frame f and rises, the ring frame f is aligned. The alignment is performed, for example, by synchronously moving a plurality of support pins erected so as to sway the frame holding portion 38 in the central direction. The ring frame f waits until the board|substrate 310 is conveyed in the state set in the frame holding part 38. As shown in FIG.

While the frame conveying apparatus 17 conveys the ring frame f, the board|substrate conveying apparatus 316 inserts the holding arm 23 between the board|substrates 310 comrades accommodated in multiple stages. The holding arm 23 adsorbs and holds the part (part on the periphery side) on which the LED 311 is not mounted on the surface of the substrate 310 , carries it out, and conveys it to the aligner 7 . The aligner 7 adsorbs the center of the back surface of the substrate 310 by the suction pad protruding from the center thereof. At the same time, the substrate transfer device 316 cancels the adsorption of the substrate 310 and retracts upward. The aligner 7 holds and rotates the substrate 310 with a suction pad to align the position based on the notch or the like.

When the alignment is completed, the suction pad on which the substrate 310 is adsorbed is protruded from the surface of the aligner 7 . The substrate transfer device 316 moves to the position, and the substrate 310 is adsorbed and held from the surface side. The adsorption pad cancels adsorption|suction and descend|falls.

The substrate transfer device 316 moves above the holding table 309 and loads the substrate 310 on the holding table 309 with the front side on which the LED 311 is mounted facing upward. . When the holding table 309 adsorbs and holds the substrate 310 and the frame holding portion 38 adsorbs and holds the ring frame f, the lower housing 29A seals the device from the initial position along the rail 40. It moves to the sealing position on the instrument 381 side. A state in which the substrate 310 is supplied to the holding table 309 and moved to the sealed position is shown in FIG. 37 .

Step S2 (supply of sealing sheet)

When supply of the workpiece|work by the board|substrate conveyance apparatus 316 etc. is performed, in the sealing unit 313, the sealing sheet BS will be supplied. That is, a predetermined amount of the sealing member BP is fed out from the sheet supply unit 371 while the separator S is peeled off. The sealing member BP which is elongate as a whole is guided above a sealing position along a predetermined|prescribed conveyance path|route. At this time, as shown in FIG. 38, positioning is performed so that sealing sheet BS hold|maintained by sheet|seat BT for conveyance may be located above the board|substrate 310 mounted on the holding table 309.

Step S3 (formation of chamber)

When the work and sealing sheet BS are supplied, as shown in FIG. 39, the sticking roller 85 descend|falls. And the sticking roller 85 affixes the sheet|seat BT for conveyance over the ring frame f and the top part of 29 A of lower housings, rolling on the sheet|seat BT for conveyance. In association with the movement of the sticking roller 85 , a predetermined amount of the sealing member BP is fed out from the sheet supply unit 371 while the separator S is peeled off.

When the sheet BT for conveyance is affixed to the ring frame f, while returning the sticking roller 85 to an initial stage, the upper housing 29B is lowered. With the lowering of the upper housing 29B, as shown in Fig. 40, the conveyance sheet BT of the portion affixed to the top of the lower housing 29A is formed by the upper housing 29B and the lower housing 29A. Fitted, the chamber 29 is configured.

At this time, while the sheet|seat BT for conveyance functions as a sealing material, the chamber 29 is divided|segmented into two spaces by the adhesive tape DT. That is, it is divided|segmented into the lower space H1 by the side of the lower housing 29A, and the upper space H2 by the side of the upper housing 29B across the sheet|seat BT for conveyance. The board|substrate 310 located in the lower housing 29A is closely facing with the sealing sheet BS with a predetermined|prescribed clearance.

Step S4 (first sealing process)

After forming the chamber 29, the first sealing process is started. In Example 5, the 1st sealing process corresponds to the 1st integration process in this invention. When the first sealing process is started, first, the control unit 33 opens the solenoid valves 103 and 113 while closing the solenoid valves 104 , 105 , 107 , 110 and 114 . Then, the control unit 33 operates the vacuum device 31 to reduce the atmospheric pressure in the lower space H1 and the atmospheric pressure in the upper space H2 to predetermined values. As an example of a predetermined value, 10 Pa - 100 Pa are mentioned.

When the atmospheric pressure of the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 closes the solenoid valve 103 and stops the operation of the vacuum device 31 . And the control part 33 closes the solenoid valves 103, 105, 107, 113 connected to the lower space H1 so that the atmospheric pressure of the upper space H2 may become higher than the atmospheric pressure of the lower space H1, and it enters the upper space H2. Controlled so as to leak by adjusting the degree of opening of the connected solenoid valve 110 .

When the atmospheric pressure side of the upper space H2 becomes higher than the atmospheric pressure of the lower space H1, as shown in FIG. 41, the differential pressure Fa generate|occur|produces between both spaces. When the differential pressure Fa is generated, the pressure-sensitive adhesive tape DT is drawn in from the center portion toward the lower housing 29A, and is deformed in a convex shape. In Example 5, after adjusting the atmospheric pressure of the upper space H2 and the lower space H1 to 10 Pa in step S4 similarly to Example 1, the differential pressure Fa is generated by adjusting the atmospheric pressure of the upper space H2 from 10 Pa to 100 Pa.

After generating the differential pressure Fa, as shown in FIG. 42 , the actuator 37 is driven to raise the holding table 309 . Deformation of the sealing member BP by the differential pressure Fa and the rise of the holding table 309 cause the sealing sheet BS to radiate from the center toward the outer periphery in the interior of the lower space H1 that has been degassed on the surface of the substrate 310. come into contact By this contact, each of the LEDs 311 mounted on the board|substrate 310 is covered with the sealing sheet BS.

When the LED 11 is covered by the sealing sheet BS, the control unit 33 opens the solenoid valves 105 and 107 to open the upper space H2 and the lower space H1 to the atmosphere. By this atmospheric release, the first sealing process is completed. In this way, in the first sealing process, the sealing sheet BS is brought into contact with the surface of the substrate 310 in a state in which the internal space of the chamber 29 is decompressed, thereby covering the LED 311 with the sealing sheet BS. By the said operation, it will be in the state which the sealing sheet BS adhered to the board|substrate 310.

Step S5 (pressure difference adjustment process)

After the first sealing process using the differential pressure Fa is completed, the pressure differential adjustment process is started. In Example 5, by using the sheet perforation part 76 similarly to Example 1, the process which suppresses the pressure difference which generate|occur|produces between the upper space H2 and the lower space H1 later to a predetermined value or less is performed. That is, by forming a through hole in sheet|seat BT for conveyance using the sheet|seat perforation part 76, the pressure difference which generate|occur|produces between the upper space H2 and the lower space H1 in step S6 is suppressed to predetermined value or less.

When step S5 is started, as shown in FIG. 43 , the control unit 33 drives the lifting drive 97 to lower the seat perforation portion 76 . When the sheet perforation part 76 descends, each of the cutters 129 penetrates with respect to the part between the ring frame f and sealing sheet BS among sheet|seat BT for conveyance. When the cutter 129 penetrates through the sheet|seat BT for conveyance, the part between the ring frame f and sealing sheet BS among sheet|seat BT for conveyance WHEREIN: Through-hole PH is formed.

By forming the through hole PH, a ventilation hole through which gas flows is formed between the upper space H2 and the lower space H1. That is, when the through-hole PH is formed in the sheet|seat BT for conveyance, the state divided into the upper space H2 and the lower space H1 inside the chamber 29 is eliminated. By allowing the gas to flow between the upper space H2 and the lower space H1 through the through hole PH, the pressure difference generated between the upper space H2 and the lower space H1 in step S6 can be set to a predetermined value or less. In addition, for convenience of description, even after the through hole PH is formed in the sheet BT for conveyance, let the space on the side where the board|substrate 310 is arrange|positioned bordering on the sheet|seat BT for conveyance the lower space H1. And the space on the opposite side to the lower space H1 is made into the upper space H2 across the sheet|seat BT for conveyance, and description is continued.

After the sheet perforation part 76 is lowered and the cutter 129 is penetrated through the sheet BT for conveyance, as shown in FIG. 44, the rotating shaft part 99 is rotated around the axis|shaft of the z direction. When the rotating shaft part 99 rotates, each of the cutters 129 arranged on the tip side of the support arm 127 moves along the circular orbit L1 centering on the rotating shaft part 99 while moving the conveyance sheet BT. going to cut

As the cutter 129 moves along the circular trajectory L1, each of the through holes PH expands in an arc shape along the circular trajectory L1, as shown in FIG. The rotation angle θ of the rotating shaft portion 99 in step S5 is determined to be an angle that can appropriately carry out the step of conveying the sealing body BMF in step S8. By expanding the through hole PH, more gas can flow between the upper space H2 and the lower space H1, so that the pressure difference generated between the upper space H2 and the lower space H1 in step S6 can be made smaller.

After the through hole PH is formed by the lowering and rotation of the sheet perforation portion 76 , the control unit 33 drives the lifting drive 97 to raise the sheet perforation portion 76 to the initial position. While raising the seat perforation portion 76 , the control unit 33 controls the actuator 37 to lower the holding table 309 to the initial position. By forming the through hole PH at the predetermined position, the pressure difference adjustment process related to step S5 of the fifth embodiment is completed.

Step S6 (second sealing process)

After the through hole PH is formed in the conveyance sheet BT by the sheet perforation portion 76, the second sealing process is started. In Example 5, the 2nd sealing process corresponds to the 2nd integration process in this invention. When the second sealing process is started, first, the control unit 33 closes the solenoid valves 103 , 105 , 107 , 110 and 113 shown in FIG. 6 and opens the solenoid valves 104 and 114 . Then, the control unit 33 operates the pressurizing device 32 to supply gas Ar to the lower space H1 and the upper space H2 to pressurize the lower space H1 and the upper space H2 to a specific value PN. 0.3 Mpa - 0.6 Mpa are mentioned as an example of specific value PN. When the pressurizing device 32 performs pressurization operation, both the atmospheric pressure of the lower space H1 and the atmospheric pressure of the upper space H2 become higher than atmospheric pressure.

By pressing of the upper space H2, as shown in FIG. 46, the pressing force V1 acts toward the sealing sheet BS from the upper space H2. Moreover, since the whole upper space H2 is pressed, the pressing force V1 acts uniformly over the whole sealing sheet BS. Moreover, since the whole of the lower space H1 is pressed, the pressing force V2 acts uniformly with respect to the downward surface of the board|substrate 310 from the lower space H1. That is, the pressing force V1 and the pressing force V2 act between the sealing sheet BS and the board|substrate 310 by pressurizing with the specific value PN higher than atmospheric pressure.

And the sealing material BSb of sealing sheet BS is filling in the clearance gap between LED311 comrades by making the pressing force V1 and the pressing force V2 which are a force larger than atmospheric pressure act uniformly. As a result, since the adhesiveness of sealing sheet BS and the board|substrate 310 improves, it can avoid that the situation that sealing sheet BS peels from the board|substrate 310 with progress of time arises. As a result, while the board|substrate 310 and sealing sheet BS are closely_contact|adhered more, LED311 is sealed by sealing sheet BS.

In Example 5, after the through hole PH is formed in the sheet|seat BT for conveyance in step S5, the lower space H1 and the upper space H2 are pressed to the specific value PN. Therefore, even if a pressure difference is generated between the atmospheric pressure Ph2 of the lower space H1 and the atmospheric pressure Ph1 of the upper space H2 due to a factor such as the difference between the area of the lower space H1 and the area of the upper space H2, the pressure difference is quickly resolved. That is, since the gas can flow between the lower space H1 and the upper space H2 through the through hole PH, it is possible to prevent a bias from occurring between the atmospheric pressure Ph1 and the atmospheric pressure Ph2. Accordingly, the pressure difference generated between the lower space H1 and the upper space H2 is suppressed to a predetermined value or less.

The magnitude of the pressing force V1 depends on the atmospheric pressure Ph1, and the magnitude of the pressing force V2 depends on the atmospheric pressure Ph2. Therefore, by suppressing the difference between the atmospheric pressure Ph1 and the atmospheric pressure Ph2 to a predetermined value or less, the difference between the pressing force V1 acting on the wafer W from the side of the upper space H2 and the pressing force V2 acting on the wafer W from the side of the lower space H1 is reduced It can be suppressed below a predetermined value. Accordingly, as the pressure difference between the lower space H1 and the upper space H2 becomes smaller, it is possible to avoid a situation in which damage such as cracks, defects or deformation occurs in the substrate 310 due to the pressure difference.

In a state in which the lower space H1 and the upper space H2 are pressurized to an atmospheric pressure higher than atmospheric pressure, after a pressing force is applied between the sealing sheet BS and the substrate 310 for a predetermined time, the control unit 33 stops the pressing device 32 . Then, the control unit 33 opens the solenoid valve 105 and the solenoid valve 107 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 309 to place the back surface of the substrate 310 on the substrate supporting surface of the holding table 309 . make it touch

Step S7 (cutting the sheet)

Moreover, in the chamber 29, while performing the process related to step S4 - step S6, the sheet|seat cutting mechanism 82 is operated, and sealing member BP is cut|disconnected. At this time, as shown in FIG. 47, while the cutter 95 cut|disconnects the sealing member BP (specifically, the sheet|seat BT for conveyance) affixed to the ring frame f in the shape of the ring frame f, the pressure roller 96 ) follows the cutter 95 and presses the sheet cutting site on the ring frame f while rolling.

Since the 1st sticking process about step S4 and the 2nd sticking process about step S5 are completed at the time of raising the upper housing 29B, the pinch roller 90 is raised and the nip of the sheet|seat BT for conveyance is cancelled|released. Thereafter, as shown in FIG. 48 , while moving the nip roller 86 and winding and collecting the unnecessary conveyance sheet BT after cutting toward the sheet recovery unit 374 , a predetermined amount from the sheet supply unit 371 of the sealing member BP is fed out. By each process up to step S7, the sealing body BMF in which the ring frame f and the board|substrate 310 were integrated via the sealing member BP is formed.

When the unnecessary sheet BT for conveyance is wound up and collect|recovered, the nip roller 86 and the sticking roller 85 will return to an initial position. And in the state holding the sealing body BMF, the holding table 309 moves from a sticking position to an initial position.

Step S8 (recovery of sealing body)

When the holding table 309 returns to the initial position, as shown in Fig. 49, the suction pad 28 provided in the frame conveying device 17 adsorbs and holds the sealing body BMF, and the lower housing 29A. Detach the seal BMF from the The frame conveying device 17 adsorbing and holding the sealing body BMF conveys the sealing body BMF to the sealing body recovery unit 306 . The conveyed sealing body BMF is loaded and accommodated in the cassette 41 .

As mentioned above, the operation|movement of a sequence of sealing the LED311 mounted on the board|substrate 310 with sealing sheet BS is complete|finished. Thereafter, the above process is repeated until the sealing body BMF reaches a predetermined number.

<Effect by the configuration of Example 5>

According to the apparatus according to the fifth embodiment, the LED 311 mounted on the substrate 310 is sealed with the sealing sheet BS which is a sheet-like sealing material by adjusting the atmospheric pressure inside the chamber 29 . In the device sealing method according to Patent Document 1 in which a liquid sealing material is filled around the device and then the sealing material is cured, the flatness on the surface of the sealing material is improved due to a cause such as mixing of air bubbles in the resin in an uncured state. is lowered

On the other hand, the structure of this invention WHEREIN: Each of the base material BSa and sealing material BSb with which sealing sheet BS is equipped is made into the sheet shape flat previously. Therefore, the sealing by sealing sheet BS is completed WHEREIN: The flatness in the surface of sealing sheet S can be improved. Further, in a state in which the substrate 310 and the sealing sheet BS are arranged inside the chamber 29, sealing is performed by adjusting the atmospheric pressure inside the chamber 29, so that the differential pressure Fa over the entire sealing sheet BS, or The pressing forces V1 and V2 act uniformly. Therefore, since it originates in the bias of the force which acts on sealing sheet BS, and it can avoid reliably that unevenness|corrugation generate|occur|produces on the surface of sealing sheet BS, the flatness of sealing sheet BS can be improved more reliably.

According to the device sealing apparatus 301 which concerns on the said Example 5, the effect similar to the adhesive sheet sticking apparatus 1 which concerns on Example 1 can be acquired. When sealing the sealing sheet BS with respect to the board|substrate 310 on which the LED 311 is mounted by performing a 1st sealing process, a pressure difference adjustment process, and a 2nd sealing process using the chamber 29, the board|substrate ( While avoiding a situation in which the 310 is damaged, the adhesion between the sealing sheet BS and the substrate 310 can be improved.

In the 1st sealing process concerning step S4, the inside of the lower space H1 in which the board|substrate 310 is arrange|positioned inside the chamber 29 is pressure-reduced. That is, since the surrounding space of the sealing sheet BS and the substrate 310 is degassed by reduced pressure, when the sealing sheet BS contacts the LED 11 and covers the LED 11 , the gas is disposed between the sealing sheet BS and the LED 311 . mixing can be prevented. Therefore, the fall of the adhesive force resulting from mixing of gas can be avoided.

Moreover, in the 2nd sealing process concerning step S6, the sealing material BSb of sealing sheet BS is filled in the clearance gap of LED11 with high precision by pressurizing the atmospheric pressure of the lower space H1 and the upper space H2 so that it may become larger than atmospheric pressure.

When the differential pressure Fa is generated by depressurizing the inside of the chamber using a vacuum device, the magnitude of the differential pressure Fa generated by the decompression from the atmospheric pressure is equal to or less than atmospheric pressure. That is, when pressing sealing sheet BS to LED311 using only differential pressure Fa, there exists an upper limit in the magnitude|size of the force which presses LED311 to sealing sheet BS. Therefore, as shown in Fig. 50(a), in a state in which the sealing material BSb of the sealing sheet BS covers the LED 11 by the differential pressure Fa due to reduced pressure, the sealing material BSb completely fills the space around the LED 311. It cannot be fully filled, and the gap part J may generate|occur|produce.

On the other hand, in the device sealing apparatus 301 concerning Example 5, the upper space H2 and the lower space H1 in the chamber 29 are pressurized so that the pressurization apparatus 32 may become atmospheric pressure larger than atmospheric pressure. That is, in the second sealing process, pressing forces V1 and V2 greater than the differential pressure Fa can be applied to the sealing sheet BS and the LED 311 . Accordingly, as shown in Fig. 50B, the sealing material BSb in an uncured state is further compressed and deformed by the action of the pressing forces V1 and V2, and the gap portion J is filled reliably. Therefore, since the LED 311 can be sealed more accurately by performing the 2nd sealing process, the board|substrate 310 and the sealing sheet BS can be integrated in the state which improved the adhesiveness of the board|substrate 310 and sealing sheet BS more. have.

In addition, in the second sealing process, by appropriately controlling the pressing device 32 , the magnitudes of the pressing forces V1 and V2 can be adjusted to arbitrary values. Therefore, even when various conditions such as the constituent material of the pressure-sensitive adhesive BTb or the size of the substrate 310 and the size of the LED 311 are changed, by appropriately adjusting the sizes of the pressing forces V1 and V2, the LED 311 ) can be sealed.

In the device sealing apparatus 1 according to the fifth embodiment, by performing the pressure difference adjustment process before the second sealing process, the difference in atmospheric pressure generated between the upper space H2 and the lower space H1 in the second sticking process is set to a predetermined value or less. to be reduced to By performing the pressure difference adjustment process, damage, such as a crack, a defect, or deformation|transformation, generate|occur|produces in the board|substrate 310 can be avoided more reliably, while improving the adhesiveness of sealing sheet BS and the board|substrate 310.

Specifically, a through hole PH is formed in the sealing member BP using the sheet perforation 76 before the second sticking process. By allowing gas to flow between the upper space H2 and the lower space H1 through the through hole PH, even when a pressure difference occurs between the pressing force V1 and the pressing force V2, the pressure difference is quickly resolved by the flow of the gas. Therefore, when the inside of the chamber 29 is pressed in step S6, the pressure difference generated between the pressing force V1 and the pressing force V2 can be kept in a state in which the pressure difference is reduced to a predetermined value or less, so that it is sealed by the high pressing force V1 and the pressing force V2. While increasing the adhesion between the sheet BS and the substrate 310, it is possible to avoid damage to the substrate 310 or the LED 311 due to the pressure difference between the pressing force V1 and the pressing force V2.

[Example 6]

Next, Example 6 of the present invention will be described. In Example 6, in the device sealing apparatus 301 according to Example 5, the pressure difference adjustment process according to Example 2 is performed. That is, the structure of the device sealing apparatus 301 which concerns on Example 6 becomes the structure in which the sheet|seat perforation part 76 was abbreviate|omitted from the device sealing apparatus 301 which concerns on Example 5. FIG.

And when the LED 311 mounted on the board|substrate 301 is sealed with the sealing sheet BS using the device sealing apparatus 301 which concerns on Example 6, by the control pattern set by the control part 33, the upper space H2 and reduce the pressure difference occurring between the lower space H1. The control pattern set by the control unit 33 in step S5 according to the sixth embodiment is in common with the control pattern of the second embodiment shown in Fig. 26, and therefore a description thereof is omitted.

The operation of the device sealing apparatus 301 according to the sixth embodiment is as follows. In the series of operations related to Example 6, the steps of Steps S1 to S4 are common to Example 5, and the steps of Steps S5 to S6 are different from those of Example 5. When the 1st sticking process concerning step S4 is completed, the pressure difference adjustment process concerning step S5 is started. That is, the control part 33 sets the pressure control pattern in step S6. Specifically, by executing five pressurization steps R1 to R5 in which target values M1 to M5 that are increased in stages are determined, the control pattern for pressurizing the upper space H2 and the lower space H1 to an atmospheric pressure higher than atmospheric pressure. set

Each of the pressurization steps R1 to R5 is a step of raising the atmospheric pressure of the upper space H2 and the lower space H1 to the target value M determined for each pressurization step. The process for reducing the pressure difference generated between the upper space H2 and the lower space H1 to a predetermined value or less, that is, the pressure difference adjustment process, is completed by the control part 33 setting the pressurization control pattern having pressurization steps R1 to R5.

And after the press control pattern of the upper space H2 and the lower space H1 using several press step R1-R5 is set, the 2nd sealing process concerning step S6 is started. The control part 33 closes the solenoid valves 103, 105, 107, 110, 113 shown in FIG. 58, and opens the solenoid valves 104 and 114. As shown in FIG. And the control part 33 operates the pressurization device 32 to supply gas to the lower space H1 and the upper space H2, and according to the pressurization control pattern set in step S5, the lower space H1 and the upper space H2 to the specific value PN. pressurize step by step. In Example 6, in each of the pressurization steps R1 to R5 divided into five, the atmospheric pressure of the lower space H1 and the upper space H2 is increased by one atmospheric pressure.

In each of the pressurization steps R1 to R5, when one atmospheric pressure of the lower space H1 and the upper space H2 reaches the target value M, when the other atmospheric pressure of the lower space H1 and the upper space H2 reaches the target value M Until then, the air pressure in one of the lower space H1 and the upper space H2 maintains the target value M, the control unit 33 controls the pressurizing device 32 . By sequentially executing the pressurization steps R1 to R5, the upper space H2 and the lower space H1 are pressurized in stages while maintaining the state in which the pressure difference between the upper space H2 and the lower space H1 is reduced. Since the pressure difference between the upper space H2 and the lower space H1 is reduced, even when the upper space H2 and the lower space H1 are pressurized to a pressure higher than atmospheric pressure, due to the pressure difference between the upper space H2 and the lower space H1, the damage can be avoided.

When the pressing steps R1 to R5 are completed and the pressing forces V1 and V2 are applied to the substrate 310 and the sealing member BP for a predetermined period of time while being pressurized to a specific value PN higher than atmospheric pressure, the sealing sheet BS is formed on the substrate 310 and the LED ( 311) to be more closely sealed. After the pressing forces V1 and V2 are applied for a predetermined period of time, the control unit 33 stops the pressing device 32 and opens the lower space H1 and the upper space H2 to the atmosphere. Furthermore, the control part 33 raises the upper housing 29B, opens the chamber 29, and raises the holding table 309, and the process related to step S6 is completed. After step S6 is completed, the sealing body BMF is created by performing the process of step S7 and step S8 similarly to Example 5.

Thus, in Example 6, using the device sealing apparatus 301, by performing the pressure difference adjustment process and the 2nd sealing process according to Example 2, the LED 311 is sealed with the sealing sheet BS, and the sealing body BMF is sealed. The manufacturing process WHEREIN: The advantageous effect similar to Example 2 can be acquired. That is, by making the pressurization control pattern set by the control part 33 into the control pattern which pressurizes the upper space H2 and the lower space H1 step by step by several press step R1 - R5, in a 2nd sealing process, the upper space H2 and the lower part The pressure difference in the space H1 can be suppressed to a predetermined value or less. Therefore, even if the device sealing apparatus 301 does not newly incorporate a mechanical mechanism taking the sheet perforation portion 76 as an example, by updating the program of the control unit 33 related to the pressure control pattern, damage to the substrate 310 is prevented. While avoiding it, the adhesion between the substrate 310 and the sealing sheet BS can be improved.

[Example 7]

Next, Example 7 of the present invention will be described. In the seventh embodiment, in the device sealing apparatus 301 according to the fifth embodiment, the pressure difference adjustment process according to the third embodiment is performed. That is, the configuration of the device sealing apparatus 301 according to the seventh embodiment is a configuration in which the chamber 29 described in FIG. 27 is arranged with respect to the device sealing apparatus 301 according to the fifth embodiment.

That is, in the device sealing device 301 according to the seventh embodiment, the solenoid valve 104 disposed in the flow path 204 is provided with an opening degree control valve 115 , and the solenoid valve disposed in the flow path 203 . 114 is provided with an opening degree control valve 116 . That is, in Example 7, similarly to Example 3, when the control part 33 independently controls the opening degree of the solenoid valve 114 and the opening degree of the solenoid valve 104, in step S6, the atmospheric pressure of the upper space H2 rises. It has a configuration that can independently control the speed and the rate at which the atmospheric pressure in the lower space H1 rises.

<Operation in Example 7>

Here, the operation of the device sealing apparatus 301 according to the seventh embodiment will be described. The flowchart relating to the seventh embodiment is common with the flowchart relating to the fifth embodiment shown in FIG. The description is simplified about the same process as the operation|movement of the device sealing apparatus 301 which concerns on Example 5, and steps S5 and S6 which are other processes are demonstrated in detail.

Step S5 (pressure difference adjustment process)

In the seventh embodiment, when the first sealing process related to step S4 is completed, a process for reducing the pressure difference generated between the upper space H2 and the lower space H1 thereafter to a predetermined value or less is started. That is, the control part 33 has the opening degree of the solenoid valve 114 provided in the flow path 203 for lower space pressurization, and the opening degree of the solenoid valve 104 provided in the flow path 204 for upper space pressurization. control independently. At this time, the opening degree of the solenoid valve 114 and the opening degree of the solenoid valve 104 are respectively controlled so that the speed at which the atmospheric pressure in the upper space H2 rises and the speed at which the atmospheric pressure in the lower space H1 rises become equal. As an example, when the volume of the upper space H2 is smaller than the volume of the lower space H1 , the opening degree of the solenoid valve 114 is made larger than the opening degree of the solenoid valve 104 . When the control unit 33 adjusts the opening degrees of the solenoid valve 114 and the solenoid valve 104 , the pressure difference adjustment process is completed.

Step S6 (second sticking process)

After the opening degree of the solenoid valves 114 and 134 is adjusted by the control unit 33, the second sticking process is started. That is, as shown in FIG. 28 , in a state in which the opening degree of the solenoid valve 114 is controlled to be larger than the opening degree of the solenoid valve 104 , the control unit 33 operates the pressurizing device 32 to operate the upper space H2 and gas is supplied to each of the lower space H1. By supplying gas to each of the upper space H2 and the lower space H1, the control unit 33 raises the pressures in the upper space H2 and the lower space H1 to a pressure higher than atmospheric pressure.

In Example 7, since the pressurizing device 32 is operated in a state in which the opening degree of the solenoid valve 114 is controlled to become larger than the opening degree of the solenoid valve 104, the rising speed of the atmospheric pressure Ph2 is equal to the rising speed of the atmospheric pressure Ph1 (see FIG. 29). That is, similarly to Example 3, the rate of increase of Ph2 increases from the rate indicated by the dashed-dotted line in Fig. 29 to the rate indicated by the solid line. As a result, the difference between atmospheric pressure Ph1 and atmospheric pressure Ph2 is suppressed to below a predetermined value. That is, since the difference between the pressing force V1 acting on the substrate 310 from the side of the upper space H2 and the pressing force V2 acting on the substrate 310 from the side of the lower space H1 is suppressed to a predetermined value or less, in step S6, the substrate It is possible to avoid the occurrence of breakage in 310 or LED 311 .

By applying the pressing forces V1 and V2 to the wafer W for a predetermined period of time while being pressurized to a specific value PN higher than atmospheric pressure, the sealing sheet BS is sealed so as to be more closely attached to the substrate 310 and the LED 311, and The surrounding space is filled by the sealing material BSb.

After applying the pressing forces V1 and V2 for a predetermined time, the control unit 33 stops the pressing device 32 . Then, the control unit 33 opens the solenoid valves 105 and 107 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 309 to place the back surface of the substrate 310 on the substrate supporting surface of the holding table 309 . By contacting, the process related to step S6 is completed. After step S6 is completed, the sealing body BMF is created by performing the process of step S7 and step S8 similarly to Example 3.

In Example 7, similarly to Example 3, by providing the opening degree regulating valve 115 and the opening degree regulating valve 116, it has the structure which pressurizes and controls each of the upper space H2 and the lower space H1 independently. And the pressure difference between the upper space H2 and the lower space H1 which generate|occur|produces in step S6 is suppressed below a predetermined value by the structure which pressurizes and controls each of the upper space H2 and the lower space H1 independently. In this third embodiment, since the sheet perforation portion 76 is unnecessary, there is no need to consider the position and area for forming the through hole PH in the sealing member BP.

Moreover, after the atmospheric pressure of one of the upper space H2 and the lower space H1 reaches the specific value PN by making equal the atmospheric|air pressure rising speed in upper space H2 and the atmospheric|air pressure rising speed in lower space H1, the other atmospheric pressure The occurrence of a waiting time until this specific value PN is reached can be avoided. As shown in FIG. 29, the time at which the atmospheric pressure Ph2 reaches the specific value PN is accelerated from tb to ta by making the rising rate of atmospheric pressure Ph2 in the lower space H1 equal to the rising rate of atmospheric pressure Ph1 in the upper space H2. As a result, since the time at which both the upper space H2 and the lower space H1 reach the specific value PN can be made faster, the time required for the process of step S6 can be shortened.

[Example 8]

Next, Example 8 of the present invention will be described. The device sealing apparatus 301 according to the eighth embodiment performs the pressure difference adjustment process according to the fourth embodiment in the device sealing apparatus 31 according to the fifth embodiment. That is, the configuration of the device sealing apparatus 301 according to the eighth embodiment is a configuration in which the chamber 29 described in Fig. 30 is arranged with respect to the device sealing apparatus 301 according to the fifth embodiment.

In the device sealing apparatus 301 according to the eighth embodiment, the chamber 29 is provided with a flow path 135 for communicatingly connecting the lower housing 29A and the upper housing 29B. The flow path 135 is provided with a solenoid valve 137 , and the opening/closing operation of the solenoid valve 137 is controlled by the control unit 33 . When the solenoid valve 137 is opened, gas can flow between the upper space H2 and the lower space H1. When the solenoid valve 137 is opened, the flow path 135 functions as a vent hole through which gas flows between the upper space H2 and the lower space H1.

<Operation in Example 8>

Here, the operation of the device sealing apparatus 301 according to the eighth embodiment will be described. The outline of the flowchart relating to the eighth embodiment is common with the flowchart relating to the fifth embodiment shown in FIG. The description is simplified about the same process as the operation|movement of the device sealing apparatus 301 which concerns on Example 5, and steps S5 and S6 which are other processes are demonstrated in detail.

Step S5 (pressure difference adjustment process)

In the eighth embodiment, when the first sealing process related to step S4 is completed, a process for enabling gas to flow between the upper space H2 and the lower space H1 is performed as a pressure difference adjustment process. That is, when step S5 is started, the control part 33 performs control which opens the solenoid valve 137. As shown in FIG. By opening the solenoid valve 137 , the gas can flow between the upper space H2 and the lower space H1 through the flow path 135 . When the control unit 33 opens the solenoid valve 137, the pressure difference adjustment process is completed.

Step S6 (second sticking process)

After the solenoid valve 137 is opened by the control part 33, the 2nd sticking process is started. First, the control part 33 opens the solenoid valves 104 and 114 while closing the solenoid valves 103, 105, 107, 110, 113 shown in FIG. And while the solenoid valve 137 is maintained in an open state, the control unit 33 operates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2 to set the lower space H1 and the upper space H2 to specific values. Pressurize to PN.

By pressing the upper space H2, the pressing force V1 acts from the upper space H2 toward the front side of the adhesive tape DT and the wafer W, and the pressing force V2 acts from the lower space H1 toward the back side of the substrate 310 ( see Figure 46). When the pressing force V1 and the pressing force V2 which are pressures higher than atmospheric pressure act, the adhesiveness between the board|substrate 310 in which the LED311 is mounted, and sealing sheet BS becomes high.

In Example 8, similarly to Example 4, in the state which opened the solenoid valve 137 in step S5, the lower space H1 and the upper space H2 are pressurized to the specific value PN higher than atmospheric pressure. Therefore, even if a pressure difference occurs between the atmospheric pressure Ph2 in the lower space H1 and the atmospheric pressure Ph1 in the upper space H2, the gas flows through the flow path 135 between the lower space H1 and the upper space H2, so that the pressure difference is quickly resolved. . Accordingly, it is possible to pressurize the lower space H1 and the upper space H2 to a specific value PN higher than atmospheric pressure while the pressure difference generated between the lower space H1 and the upper space H2 is suppressed to a predetermined value or less.

After the pressing forces V1 and V2 are applied for a predetermined time, the control unit 33 stops the pressing device 32 . Then, the control unit 33 opens the solenoid valves 105 and 107 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 309 to abut against the substrate 310 , thereby completing the process related to step S6 . After step S6 is completed, the sealing body BMF is created by performing the process of step S7 and step S8 similarly to Example 4.

In Example 8, by providing the flow path 135 and the solenoid valve 137, it has a structure which makes it possible to distribute|circulate gas between the upper space H2 and the lower space H1. And by pressurizing the upper space H2 and the lower space H1 to a pressure higher than atmospheric pressure with the solenoid valve 137 open, the pressure difference between the upper space H2 and the lower space H1 generated in step S6 can be suppressed to a predetermined value or less. can In such a fourth embodiment, even if the through hole PH is not formed in the sealing member BP, the gas can be circulated between the upper space H2 and the lower space H1, so that the sheet perforation portion 76 can be omitted.

<Other embodiment>

In addition, embodiment disclosed this time is an illustration in all points, and is not restrictive. The scope of the present invention is indicated by the claims rather than the description of the above-described embodiments, and all changes (modifications) within the meaning and scope equivalent to the claims are included. For example, the present invention may be modified as follows.

(1) In step S4 related to each example, after adjusting the atmospheric pressures in the upper space H2 and the lower space H1 to 10 Pa, the differential pressure Fa is generated by adjusting the atmospheric pressure in the upper space H2 from 10 Pa to 100 Pa, but limited to this doesn't happen That is, as long as the atmospheric pressure of the upper space H2 is adjusted to be higher than the atmospheric pressure of the lower space H1, the atmospheric pressure of the upper space H2 and the lower space H1 in step S4 may be changed appropriately. As an example, after reducing the atmospheric pressure in the lower space H1 and the upper space H2 to a predetermined value, the pressure difference Fa may be generated by returning the atmospheric pressure in the upper space H2 to atmospheric pressure. In the configuration in which the atmospheric pressure in the upper space H2 is returned to atmospheric pressure to generate the differential pressure Fa, the differential pressure Fa can be made larger. can be completed more quickly.

(2) In step S6 concerning each embodiment, although the pressurization apparatus 32 pressurized the inside of both the lower space H1 and the upper space H2, it is not limited to this. That is, the pressing device 32 pressurizes only the upper space H2 until it becomes an atmospheric pressure higher than atmospheric pressure, and may adhere the adhesive tape DT more precisely by the pressing force V1.

As another modified example of the configuration in which only the upper space H2 is pressurized, the pressure-sensitive adhesive tape DT by pressurizing the inside of the upper space H2 to an atmospheric pressure higher than atmospheric pressure while maintaining the pressure-reduced state of the inside of the lower space H1 to an atmospheric pressure lower than atmospheric pressure The structure may be affixed. In the said structure, after performing the 1st sticking process by the differential pressure Fa in step S4, the solenoid valve 105 connected to the upper space H2 is opened, maintaining the state in which the atmospheric pressure of the lower space H1 was pressure-reduced to a predetermined value. Thus, only the upper space H2 is released to the atmosphere. And in step S5, the pressurization apparatus 32 is actuated, the inside of upper space H2 is pressurized, and it is made higher than atmospheric pressure.

In the modified example, in step S5, in a state in which the holding table 9 is raised and the holding table 9 is brought into contact with the back surface of the wafer W, the inside of the upper space H2 is pressed to perform the second sticking process. do By pressing the upper space H2 while holding the wafer W by the holding table 9 to generate a pressing force V1, the pressing force V1 is applied to the pressure-sensitive adhesive tape DT and the wafer W even when the lower space H1 is depressurized to be lower than atmospheric pressure. It can be applied evenly over the entire surface.

(3) In step S4 according to each embodiment, by generating a differential pressure Fa inside the chamber 29 using the vacuum device 31, the adhesive tape DT is deformed into a convex shape to form an annular convex portion of the wafer W Although it is brought into contact with the surface, the method of deforming the adhesive tape DT into a convex shape is not limited to the configuration in which the differential pressure Fa is generated. That is, as shown in FIG. 51, the structure provided with the pressing member 141 inside the upper housing 29B may be sufficient.

The pressing member 141 has a convex bottom surface (as an example, a hemispherical shape), and is disposed so as to be positioned above the adhesive tape DT. Therefore, by lowering the pressing member 141 , the bottom surface of the convex pressing member 141 presses the adhesive tape DT, and the adhesive tape DT is deformed convexly so that it can contact the wafer W. In this case, the configuration necessary for generating the differential pressure Fa can be omitted. Moreover, as another structure which deform|transforms the adhesive tape DT in convex shape, the structure etc. which press the adhesive tape DT from upper direction using a roller etc. are mentioned.

(4) In each Example, although the structure of sticking the adhesive tape DT for support to the wafer W was demonstrated as an example, the adhesive sheet sticking to the wafer W is not limited to this. As long as it is a structure which sticks the sheet-form adhesive material using the adhesive tape for circuit protection as an example, the structure concerning each Example is applicable.

(5) In Examples 1 to 4, the wafer W and the ring frame f were exemplified as the work to be adhered to the pressure-sensitive adhesive sheet, but the work is not limited thereto. As an example, the ring frame f may be omitted and the adhesive sheet (adhesive tape DT) may be affixed only to the wafer W. When the ring frame f is abbreviate|omitted, the wafer W in which the 2nd sticking process is completed and the adhesive tape DT is closely_contact|adhered and is in the stuck state corresponds to the semiconductor product in this invention. In addition, also in Examples 5-8, the ring frame f may be abbreviate|omitted and the sealing member BP may be affixed only to the board|substrate 310. FIG. When the ring frame f is abbreviate|omitted, the board|substrate 310 in which the 2nd sealing process is completed and the sealing sheet BS is closely_contact|adhered and is in the affixed state corresponds to the semiconductor product in this invention.

(6) In each embodiment, various semiconductor members such as wafers, substrates, and panels can be applied as work pieces. Moreover, as a shape of a workpiece|work, other than a circular shape, a rectangular shape, a polygonal shape, a substantially circular shape, etc. may be sufficient.

(7) In each embodiment, although the holding table 9 or the holding table 309 is moved up and down at a predetermined timing to integrate the work and the sheet material, the holding table 9 or the holding table ( 309) may be appropriately changed. As an example, the pressing process concerning step S6 is not limited to the structure performed after lowering|falling the holding table 9, You may perform a press process, maintaining a raised state.

(8) In each embodiment, the frame holding portion 38 is disposed outside the lower housing 29A, but the frame holding portion 38 may be provided inside the lower housing 29A. In this case, the process after step S4 is performed in a state in which each of the ring frame f and the wafer W is accommodated in the chamber 29 .

(9) In each embodiment, as shown in Fig. 52(a), the chamber 29 may be provided with a sheet-like elastic body Gs. Hereinafter, the present modification will be described by exemplifying the configuration of the sixth embodiment.

The elastic body Gs is arranged inside the upper housing 29B, and is configured so as to be in contact with the inner diameter of the upper housing 29B. Moreover, it is comprised so that the lower surface of the elastic body Gs and the cylindrical bottom of the upper housing 29B may become the same height. Therefore, when the lower housing 29A and the upper housing 29B sandwich the conveyance sheet P to form the chamber 29, the elastic body Gs will come into contact with the conveyance sheet P. Specifically, in the sheet P for conveyance, elastic body Gs comes into contact with the side opposite to the surface holding the adhesive tape DT (in the figure, the upper surface side). By disposing the elastic body Gs in contact with the inner diameter of the lower housing 29A, the elastic body Gs is not sandwiched when forming the chamber 29, so that the sealing property of the chamber 29 is prevented from being deteriorated by the elastic body Gs. can Examples of the material constituting the elastic body Gs include rubber, elastomer, or gel-like polymeric material.

When the chamber 29 is provided with the elastic body Gs, when deforming the sealing member BP convexly in step S4, the bending rate of the sealing member BP can be made more uniform. Here, the effect of the structure provided with the elastic body Gs is demonstrated. As an example, when the sealing sheet BS is comprised by the comparatively hard material, as shown in FIG.52(b), the bending rate of the sealing member BP becomes non-uniform|heterogenous easily.

That is, in the area|region P1 by which sealing sheet BS is hold|maintained by sheet|seat BT for conveyance among sheet|seat BT for conveyance, since hard sealing sheet BS exists, the bending rate of sheet|seat BT for conveyance by differential pressure Fa is small. On the other hand, in the area|region P2 by which sealing sheet BS is not hold|maintained by sheet|seat BT for conveyance among sheet|seat BT for conveyance, the bending rate of sheet|seat BT for conveyance by differential pressure Fa is comparatively large. That is, the bending rate of the sheet|seat BT for conveyance in the area|region P1 further falls because the area|region P2 side deform|transforms easily with the differential pressure Fa.

Moreover, the side close|similar to the area|region P2 among sealing sheet BS has a large curvature rate of sealing sheet BS, and the curvature rate of sealing sheet BS becomes small in the center part of sealing sheet BS. Thus, each of sealing sheet BS and sheet|seat BT for conveyance WHEREIN: The bending rate by differential pressure Fa becomes non-uniform|heterogenous. As a result, with respect to the sealing sheet BS affixed on the board|substrate 310, the adhesiveness of sealing sheet BS and the board|substrate 310 falls.

On the other hand, when the elastic body Gs is provided, the entire elastic body Gs is uniformly convexly deformed by the differential pressure Fa, as shown in Fig. 52(c). Therefore, since the curvature rate of sheet|seat BT in the area|region P1 improves and the difference with the curvature rate in area|region P2 becomes small, the curvature rate of sheet|seat BT for conveyance and sealing sheet BS becomes uniform as a whole. That is, since the sealing sheet BS becomes easy to deform|transform according to the shape of the device formation surface of the board|substrate 310, the adhesiveness of sealing sheet BS and the board|substrate 310 can further be improved.

(10) In each Example, you may further provide the structure which heats the adhesive tape DT or the sealing member BP. As an example of a configuration for heating the adhesive tape DT or the like, the sheet sticking mechanism 81 has a heating mechanism 120 inside the upper housing 29B, as shown in FIG. 53A . Fig. 53(a) shows a configuration in which the heating mechanism 120 is provided in the configuration of the second embodiment as an example of this modification.

The heating mechanism 120 includes a cylinder 121 and a heating member 123 . The cylinder 121 is connected to the upper portion of the heating member 123 , and the heating member 123 may move up and down in the chamber 29 by the operation of the cylinder 121 . In addition, as long as the heating member 123 can warm the adhesive tape DT, it may not be a structure which can move up and down.

A heater 125 for heating the adhesive tape DT is embedded in the heating member 123 . The temperature of the heating by the heater 125 is adjusted so that it may become the temperature at which the adhesive tape DT becomes soft. As an example of the temperature of the said heating, about 50 degreeC - 70 degreeC is mentioned. The shape of the bottom surface of the warming member 123 may be changed according to the shape of the wafer W. As an example, the warming member 123 is cylindrical as a whole.

In addition, before starting step S4, it is preferable to heat the upper space H2 using the heating mechanism 120 beforehand. That is, the controller 33 operates the heater 125 to heat the heating device 123 to a predetermined temperature. When the heating device 123 is heated, the upper space H2 is heated by the heat conduction effect, and the adhesive tape DT is also heated.

Since the adhesive tape DT becomes soft by being heated, the deformability of the adhesive tape DT by the differential pressure Fa improves. That is, when covering the wafer W with the adhesive tape DT, the followability|trackability of the adhesive tape DT with respect to the wafer W can be improved more. Moreover, as shown in (b) of FIG. 53, the heating member 123 may be lowered|falling so that it may approach or contact with the adhesive tape DT, and the adhesive tape DT may be directly heated by the heating member 123. As shown in FIG.

In addition, the heating mechanism 120 is arrange|positioned on the side of the upper space H2 in the chamber 29, and is not limited to the structure which heats up the upper space H2. That is, the heating mechanism 120 may be configured to heat the lower space H1. As an example, the structure which arrange|positions the heater 125 inside the holding table 9, and heats the adhesive tape DT by the heater 125 heating the lower space H1 is mentioned. In addition, the heating mechanism 120 may be configured to heat both the upper space H2 and the lower space H1.

(11) As the work according to Examples 5 to 8, a substrate 310 having an LED 311 mounted on the front side and a flat back side was used for explanation. However, the back side of the work is not limited to a flat configuration. . That is, as shown in Fig. 54A, a substrate 331 having an LED 311 mounted on the front side and a convex member 330 on the back side may be used as a work. Examples of the convex member 330 include, for example, an electronic component exemplified by LEDs as a constituent material of the substrate 331 . That is, it is assumed that the substrate 331 having irregularities on the back side includes a configuration in which irregularities are formed on the back surface of the substrate 331 itself.

When sealing the LED 311 mounted on the front side with the sealing sheet S with respect to the board|substrate 331 provided with the convex member 330 on the back side side, the device sealing apparatus 301 is a holding table 309 ) instead of the holding table 335 as shown in Fig. 54(b).

The holding table 335 has an annular projection 337 on its outer periphery, and a recess 339 on its center. That is, the holding table 335 is hollow as a whole. The recessed part 339 is comprised in the position which includes the area|region in which the convex member 330 is arrange|positioned in the board|substrate 331 in planar view. The projection 337 supports a portion of the back surface of the substrate 331 where the convex member 330 is not disposed, so that the holding table 335 holds the substrate 331 without contacting the convex member 330 . can hold.

55 shows a state in which the holding table 335 is supporting the substrate 331 in the configuration in which the lower housing 29A includes the holding table 335 . This state corresponds to the process of forming the chamber 29 in step S3. Since each process of sealing the LED 311 on the board|substrate 310 with sealing sheet BS in the structure provided with the holding table 335 is the same as that of the already demonstrated embodiment, detailed description is abbreviate|omitted.

(13) In Examples 5-8, although LED311 was demonstrated as an example as a device used as the object of sealing by sealing sheet BS, it is not limited to this. As another example of the device, a semiconductor element, an electronic component, etc. are mentioned in addition to the optical element which takes the LED 311 as an example.

(14) In Examples 5-8, after sealing LED311 with sealing sheet BS, you may perform the process of hardening sealing material BSb of sealing sheet BS. Although the process of hardening the sealing material BSb can be changed suitably according to the material of the sealing material BSb, hardening by heat processing, hardening by ultraviolet treatment, etc. are mentioned as an example.

(15) In Examples 5-8, although OCA is used as sealing material BSb, it is not limited to this. That is, the sealing material Sb may use an optically opaque material other than an optically transparent material, and may use a colorless or colored material.

(16) In each of the embodiment and the modification, the first sticking process or the first sealing process is not limited to the configuration performed inside the chamber 29 . That is, outside of the chamber 29, you may perform the process of making a sheet|seat material contact a workpiece|work beforehand, and making a sheet|seat material work-bonding. Hereinafter, in the device sealing apparatus 301, the said modification is demonstrated taking the structure which performs a 1st sealing process outside the chamber 29 as an example.

In a modified example in which the first sealing process is performed outside the chamber 29 , the device sealing apparatus 301 is provided with a lifting table 338 outside the chamber 29 . The raising/lowering table 338 is arrange|positioned in the rectangular part 301a as an example, The aligner 7, the raising/lowering table 338, the holding table 309, and the frame supply part from the upper right side of the rectangular part 1a. They are arranged in the order of (12).

The raising/lowering table 338 is comprised so that a reciprocating movement between an initial stage position and a sealing position is possible along the rail 54 laid in the front-back direction (y direction). The initial position is inside the rectangular part 1a, and the board|substrate 310 is mounted on the raising/lowering table 338 in the said initial position. The sealing position is inside the protrusion 301b, and by moving the lifting table 8 to the sealing position, it becomes possible to bring the substrate 310 mounted on the lifting table 338 into contact with the sealing member BP.

The lifting table 338 holds the substrate 310 and is, for example, a metal chuck table having the same shape or size as that of the substrate 310 . As a preferable structure of the raising/lowering table 338, it is comprised so that the board|substrate 310 may be adsorbed and held by the suction device provided inside. The lifting table 338 is connected with one end of the rod 352 penetrating the support 351 supporting the lifting table 338, as shown in FIGS. 56 and 57, and the like. The other end of the rod 352 is driven and connected to an actuator 353 having a motor or the like. By the rod 352 and the actuator 353, the raising/lowering movement of the raising/lowering table 338 is possible.

<Operation in Modified Example>

Here, the operation of the device sealing apparatus 301 according to the modified example will be described. The outline of the flowchart related to the modified example is common with the flowchart relating to the fifth embodiment shown in FIG. The description is simplified about the same process as the operation|movement of the device sealing apparatus 301 which concerns on Example 5, and steps S1 - S4 which are other processes are demonstrated in detail.

Step S1 (workpiece supply)

When a sealing command is given, the ring frame f is conveyed from the frame supply unit 12 to the frame holding unit 38 of the lower housing 29A, and the substrate 310 is conveyed from the container 305 to the elevating table 338 . do. When the frame holding portion 38 holds the ring frame f, the lower housing 29A, together with the holding table 309, moves along the rail 40 from the initial position to the sealing position on the device sealing mechanism 81 side. Move.

While the frame transport device 17 transports the ring frame f, the substrate transport device 316 adsorbs and holds the substrate 310 using the holding arm 23 to carry it out and transport it to the aligner 7 . do. The aligner 7 holds and rotates the substrate 310 with a suction pad to align the position based on the notch or the like. When the alignment is completed, the substrate transfer device 316 unloads the substrate 310 from the aligner 7 and loads the substrate 310 on the elevating table 338 . When the lifting table 8 adsorbs and holds the substrate 10 , the lifting table 338 moves along the rail 54 from the initial position to the sealing position on the device sealing mechanism 381 side. The state in which each of the raising/lowering table 338 and the holding table 309 moved to the sealed position is shown in FIG.

Step S2 (supply of sealing sheet)

When supply of the workpiece|work by the board|substrate conveyance apparatus 316 etc. is performed, in the sealing unit 313, the sealing sheet BS will be supplied. That is, a predetermined amount of the sealing member BP is fed out from the sheet supply unit 371 while the separator S is peeled off. The sealing member BP which is elongate as a whole is guided above a sealing position along a predetermined|prescribed conveyance path|route. At this time, as shown in FIG. 56, positioning is performed so that sealing sheet BS hold|maintained by sheet|seat BT for conveyance may be located above the board|substrate 310 mounted on the raising/lowering table 338.

Step S3 (first sealing process)

When the work and the sealing sheet BS are supplied, the first sealing process is started. That is, the control unit 33 drives the actuator 353 to raise the lifting table 338 . By raising the raising/lowering table 338, as shown in FIG. 57, the upper surface of the LED311 mounted on the board|substrate 310 contacts sealing sheet BS. By this contact, the sealing sheet BS is attached to the board|substrate 310, and both are integrated.

By this contact, the LED 311 is attached to the sealing layer BSb which has adhesive force, and the board|substrate 310 is hold|maintained by the sealing sheet BS via the LED 311. What is integrated with the board|substrate 10 and sealing member BP via sealing sheet BS is hereinafter referred to as sealing material composite BM. After the sealing material composite BM is formed, the sealing material composite BM is conveyed above the holding table 309 by feeding out a predetermined amount of the sealing member BP. While the sealing material composite BM is conveyed, the raising/lowering table 338 descends and returns to an initial state. When the sealing material composite BM is formed and conveyed to the holding table 309, the 1st sealing process concerning step S3 is completed.

Step S4 (formation of chamber)

When the sealing material composite M is conveyed above the holding table 309 , the attaching roller 85 descends. And the sheet|seat BT for conveyance is affixed over the top part of the ring frame f and 29 A of lower housings, rolling over the sheet|seat BT for conveyance.

When the sheet BT for conveyance is affixed to the ring frame f, while returning the sticking roller 85 to an initial stage, the upper housing 29B is lowered. With the lowering of the upper housing 29B, the conveyance sheet T of the portion affixed to the top of the lower housing 29A is sandwiched by the upper housing 29B and the lower housing 29A, and the chamber 29 is composed Thereafter, the process of steps S5 - S8 is performed similarly to the structure of Examples 5-8, and the sealing body BMF is created.

The sealing sheet BS adhered to the board|substrate 310 in a 1st sealing process will be in the state with higher adhesiveness with the board|substrate 310 in a 2nd sealing process. In the second sealing process, when a pressure higher than atmospheric pressure acts between the substrate 310 and the sealing sheet BS, the adhesion between the substrate 310 and the sealing sheet BS is increased, and the LED 311 mounted on the substrate 310 is It is tightly sealed by the sealing sheet BS.

(17) In Examples 1 to 4, the elongated adhesive tape DT was pasted over the back surface of the wafer W and the ring frame f, and then applied to the shape of the work (here, the shape of the wafer W or the ring frame f). Although the configuration for cutting into a predetermined shape has been described as an example, the present invention is not limited thereto. That is, an adhesive tape having a predetermined shape according to the shape of the work may be affixed to the work in advance.

The configuration of the adhesive tape DT according to the modified example is the same as that of the sealing member BP shown in FIG. 31A . That is, the adhesive tape DT of a predetermined shape is affixed by predetermined pitch on one surface of the sheet|seat BT for elongate shape, and is hold|maintained. The adhesive tape DT is cut beforehand into a predetermined shape according to the shape of the formation surface (the back surface in this embodiment) of the annular convex part Ka in the wafer W. In the said modification, the chamber 29 is formed in step S3 by the upper housing 29B and the lower housing 29A sandwiching the sheet|seat BT for conveyance.

(18) In the first embodiment or the fifth embodiment, the sheet perforated portion 76 is configured to form an arc-shaped through hole PH by elevating movement and rotational movement, but as long as the through hole PH is formed, the sheet perforation portion 76 The operation of (76) may be appropriately changed. As an example, the sheet perforation portion 76 may form the through hole PH only by lifting and lowering movement. Specifically, by lowering the sheet perforation portion 76, the cutter 129 is penetrated through the adhesive tape DT to form a through hole PH, and then the sheet perforation portion 76 is raised to return to the initial position.

(19) In Embodiment 1 or Embodiment 5, the sheet perforation portion 76 is not limited to the configuration in which the through-hole PH is formed using the cutter 129 having a cutter blade, but instead of the cutter 129 A needle-like member or a conical member may be provided. In this case, the through hole PH is formed by penetrating the tip of the needle-like member or the conical member through the adhesive tape DT.

1: Adhesive sheet pasting device
3: Wafer transfer mechanism
5: Courage
6: Frame recovery unit
7: Aligner
9: Holding table
12: frame supply
13: affixing unit
16: wafer transfer device
17: frame conveying device
23: holding arm
31: vacuum device
32: pressurization device
33: control unit
38: frame holding part
71: sheet supply unit
72: separator recovery unit
73: sheet pasting
74: sheet recovery unit
76: sheet perforation
81: sheet attaching mechanism
82: sheet cutting mechanism
85: sticking roller
86: nip roller
95: cutter
97: elevating drive
99: rotation shaft part
101: Euro
102: Euro
103: solenoid valve
104: solenoid valve
120: warming mechanism
127: support arm
128: cutter holder
129: cutter
131: Euro
132: solenoid valve
133: Euro
134: solenoid valve
135: Euro
137: solenoid valve
141: no pressure
301: device sealing device
309: holding table
310: substrate
311: LED
f: ring frame
DT: adhesive tape
MF: mount frame
BT: sheet for transport
BS: sealing sheet
BP: sealing member
BMF: Seal
PH: through hole
Ka: annular convex
Kf: inner corner
He: flat concave

Claims (11)

A method of unifying a work and a sheet material for integrating a work and a sheet material in an internal space of a chamber having an upper chamber and a lower chamber,
By sandwiching the sheet material by the upper chamber and the lower chamber, the inner space of the chamber is divided into a lower space in which the work is disposed and an upper space facing the lower space through the sheet material. The process of forming upper and lower space,
By depressurizing the inside of the chamber so that the pressure of the lower space becomes lower than the pressure of the upper space, the sheet material is brought into contact with the work by the differential pressure formed between the upper space and the lower space in the chamber, so that the sheet material is removed from the sheet material. A first integration process of attaching to the work;
After the first integration process, a pressure difference adjustment process for adjusting the pressure difference between the upper space and the lower space in the chamber;
A method for integrating a work and a sheet material comprising: a second integration process of bringing the sheet material into close contact with the work by increasing the pressure in the inner space of the chamber to a pressure equal to or higher than atmospheric pressure in a state where the pressure difference is adjusted; . The method of claim 1,
The pressure difference adjustment process is
A method for integrating a work and a sheet material, characterized in that by forming a through hole in the sheet material, the upper space and the lower space are communicated through the through hole. The method of claim 1,
The pressure difference adjustment process is
The method for integrating a work and a sheet material according to claim 1, wherein the pressure difference is maintained by controlling the pressure of at least one of the upper space and the lower space to increase in stages. The method of claim 1,
The chamber is
a first transforming mechanism for adjusting the pressure of the upper space;
a second transformation mechanism for adjusting the pressure of the lower space;
a control unit for independently controlling the first transformer mechanism and the second transformation mechanism;
The pressure difference adjustment process is
The method for integrating a work and a sheet material, wherein the control unit independently controls the first and second transforming mechanisms to increase the pressures in the upper space and the lower space while maintaining the pressure difference. 5. The method according to any one of claims 1 to 4,
In the first integration process, the sheet material is brought into contact with the work by deforming the sheet material in a convex shape toward the work. 5. The method according to any one of claims 1 to 4,
The method for integrating a work and a sheet material, wherein the sheet material has a predetermined shape corresponding to the work. 5. The method according to any one of claims 1 to 4,
The sheet material is held by a long conveyance sheet,
and a sheet-like elastic body disposed inside the upper chamber,
In the process of forming the vertical space, the sheet-like elastic body is in contact with a surface of the conveying sheet that does not hold the sheet material by sandwiching the conveying sheet between the upper chamber and the lower chamber, The method for integrating the work and the sheet material, characterized in that the sheet-like elastic body is arranged. 5. The method according to any one of claims 1 to 4,
The work has an annular convex portion on the outer periphery of one surface,
The method for integrating a work and a sheet material, wherein the sheet material is in close contact with a surface of the work on which the annular convex portion is formed. 5. The method according to any one of claims 1 to 4,
The work is a substrate on which an optical element is mounted,
The method for integrating the work and the sheet material, characterized in that the sheet material is in close contact with a surface on which the optical element is mounted among the work. An apparatus for integrating a work and a sheet material for integrating a work and a sheet material in an internal space of a chamber having an upper chamber and a lower chamber,
a holding table for holding the work;
a chamber accommodating the holding table and formed by sandwiching the sheet material by the upper chamber and the lower chamber, the chamber being divided into an upper space and a lower space through the sheet material;
a supply mechanism for supplying the sheet material;
By depressurizing the inside of the chamber so that the pressure of the lower space becomes lower than the pressure of the upper space, the sheet material is brought into contact with the work by the differential pressure formed between the upper space and the lower space in the chamber, so that the sheet material is removed from the sheet material. a first integration mechanism attached to the work;
a differential pressure adjusting mechanism for adjusting the pressure difference between the upper space and the lower space in the chamber after the sheet material is attached to the work;
and a second integration mechanism for bringing the sheet material into close contact with the work by raising the pressure in the internal space of the chamber to a pressure equal to or higher than atmospheric pressure while the pressure difference is adjusted. A method of manufacturing a semiconductor product for manufacturing a semiconductor product by integrating a work and a sheet material in an internal space of a chamber having an upper chamber and a lower chamber,
By sandwiching the sheet material by the upper chamber and the lower chamber, the inner space of the chamber is divided into a lower space in which the work is disposed and an upper space facing the lower space through the sheet material. The process of forming upper and lower space,
By depressurizing the inside of the chamber so that the pressure of the lower space becomes lower than the pressure of the upper space, the sheet material is brought into contact with the work by the differential pressure formed between the upper space and the lower space in the chamber, so that the sheet material is removed from the sheet material. A first integration process of attaching to the work;
After the first integration process, a pressure difference adjustment process of adjusting the pressure in the chamber so that the pressure difference between the upper space and the lower space in the chamber is reduced;
and a second integration step of bringing the sheet material into close contact with the work by raising the pressure in the internal space of the chamber to a pressure equal to or higher than atmospheric pressure while the pressure difference is adjusted.

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