JP2011158737A - Device for laminating workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for laminating workpieces, which is capable of reliably laminating a pair of workpieces, and further greatly reducing time required for depressurization of a vacuum chamber, thereby reducing energy consumption and operational cost. <P>SOLUTION: The device for laminating the workpieces is premised such that a second workpiece W2 is pressed on a first workpiece W1 with a presser 6 to perform a primary lamination, while depressurizing the interior of the vacuum chamber 2, and further a pressurized air is supplied into the interior of the vacuum chamber 2 to perform a secondary lamination. The interior of the vacuum chamber 2 is divided into a first chamber 21 and a second chamber 22 by using a seal 20 arranged between the vacuum chamber 2 and either one of surface plates 4. When performing the primary lamination, the vacuum pressure of a vacuum source 3 is applied to each of the first chamber 21 and the second chamber 22 for depressurization thereof. In the secondary lamination, the pressurized air is applied to the first chamber 21 and the second chamber 22, thereby reducing a pressurization load acting on a surface plate driving structure 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a workpiece laminating apparatus suitable for laminating a functional sheet such as a polarizing sheet, an antireflection film, an electromagnetic wave shielding film, and an ultraviolet shielding film on a substrate such as a liquid crystal substrate or a plasma display substrate.

  In the bonding apparatus of the present invention, bonding is performed in a vacuum chamber to avoid air entrainment on the bonding surface, but this type of bonding is widely known as a method for manufacturing a liquid crystal display panel. (See Patent Document 1). In this case, a pair of surface plates that support the glass substrate are arranged inside the vacuum chamber, and after the pair of glass substrates are bonded in a state where the inside of the vacuum chamber is decompressed, the sealing material sandwiched between the two glass substrates is heated. Harden. The glass substrate to be bonded is attracted and held by an electrostatic chuck provided on each surface plate. Both glass substrates are bonded together by pressing the movable side platen against the fixed side platen and face each other with a gap of a predetermined dimension.

  In the bonding apparatus of the present invention, the volume of the vacuum chamber is reduced, and the inside of the chamber is further divided into upper and lower parts to shorten the time required for decompression. A similar apparatus is disclosed in Patent Document 2. There, a stage for placing a pre-assembled substrate, a light source unit disposed above the stage, an O-ring provided on the opposing surface of both, and a UV disposed between the O-rings The pasting device is composed of a transparent special sheet. The temporarily assembled substrate is composed of a pair of glass substrates opposed via a spacer, and a UV curable resin disposed between the glass substrates. The light source unit is configured with a hollow lamp house as an outer body, and a UV lamp, a heat ray cut filter, and an openable / closable shutter are disposed therein. An exhaust hole is formed in the lower wall of the lamp house.

  In the bonding apparatus of Patent Document 2, when the inside of the lamp house is evacuated, the UV transmissive special sheet is adsorbed on the bottom wall of the lamp house to block the exhaust hole. Further, when the space around the substrate placed on the stage is evacuated, the UV transmissive special sheet is brought into close contact with the upper surface of the substrate to reduce the amount of air to be exhausted. Therefore, evacuation can be performed in a shorter time than the vacuum chamber of Patent Document 1.

  In the bonding apparatus of the present invention, bonding is performed by pressing a workpiece with a metal diaphragm (press body). This type of bonding apparatus is known, for example, in Patent Document 3, where the lower surface of the base material is used. A rubber diaphragm membrane is fixed to the top. Moreover, regarding the bonding apparatus of the present invention, Patent Document 4 discloses that pressurized air is applied to the upper and lower surfaces of a liquid crystal display element cell to make the gap between the liquid crystal display element cells constant. The liquid crystal display element cell before pressurization is obtained by temporarily joining a pair of glass substrates via a predetermined gap, and pressing both glass substrates together with pressurized air makes the previous gap uniform. In addition, the bonding apparatus of patent documents 3 and 4 performs bonding in air | atmosphere.

JP 2002-40398 (paragraph number 0042, FIG. 2) JP 2009-58783 A (paragraph number 0077, FIG. 1-2) JP 2001-255540 A (paragraph number 0015, FIG. 3) Japanese Patent Laid-Open No. 04-147217 (page 3, upper right column, line 18, FIG. 5)

  When the functional sheet is bonded to the entire surface of the glass substrate in a reduced pressure environment as in the bonding apparatus of Patent Document 1, air entrapment on the bonding surface can be eliminated. However, in this kind of bonding apparatus, since there is a lot of useless space around the surface plate, it takes a long time to decompress (evacuate) the inside of the vacuum chamber. Specifically, since a pair of glass substrates and a bonded liquid crystal display panel are taken in and out by the substrate transfer robot, it is necessary to secure the operation space of the robot and the elevation space of the surface plate in the chamber. The volume of inevitably increases. Therefore, the time required for decompression of the vacuum chamber becomes long, and energy consumption and operation cost increase.

  In that respect, according to the bonding apparatus of Patent Document 2, when vacuuming the lamp house or vacuuming the periphery of the substrate, the UV transparent special sheet is adsorbed to each surface plate. Compared with the apparatus, the amount of air to be exhausted can be reduced to some extent. However, since it takes a long time to evacuate the interior of the lamp house having a large volume, it still takes a long time for decompression. Further, since vacuuming is performed using the UV transparent special sheet as a shield, a large amount of UV transparent special sheet is consumed for each production lot, and the cost required for bonding increases accordingly. Furthermore, since the bonding apparatus of patent document 2 is an apparatus which carries out the secondary bonding of a pair of glass substrates temporarily assembled, a functional sheet is bonded on the entire surface of the glass substrate like the bonding apparatus of the present invention. Not suitable for use. This is because an adhesive layer is formed on the bonding surface of the functional sheet, so that it cannot be temporarily assembled to the glass substrate and must be bonded at once.

  Printed wiring such as connection terminals and signal lines may be formed on the bonding surface of the liquid crystal substrate to be bonded. In such a case, since the bonding surface of the functional sheet is received by the surface of a projection such as a printed wiring, the functional sheet may not be securely bonded. This is because the sheet bonding surface floats between adjacent protrusions or between the peripheral edge of the protrusion and the substrate surface.

  The inventor of the present invention has previously proposed a bonding apparatus that can eliminate such bonding defects and can adhere the functional sheet along the outline of the protrusion. There, the functional sheet is pressed against the liquid crystal substrate with a press body (diaphragm) and primary bonded, then pressurized air is fed into the vacuum chamber to perform secondary bonding, and it floats away from the bonding surface. The sheet portion is adhered to the surface of the protrusion. Thus, in the bonding method of pressurizing the inside of the vacuum chamber at the time of secondary bonding, a pair of surface plates are accommodated in the vacuum chamber. However, in this structure, since the chamber volume to be evacuated becomes large as described above, it is inevitable that the decompression takes time.

The purpose of the present invention is to reliably bond a pair of workpieces, improve the yield of the bonded product, and greatly reduce the time required for vacuum chamber decompression, reducing energy consumption and operating costs, It is providing the workpiece | work bonding apparatus which can improve the productivity of the bonding body product.
The objective of this invention is providing the bonding apparatus which can bond a pair of workpiece | work reliably by performing secondary bonding, even when there exists protrusions and recessed parts, such as a printed wiring, on the bonding surface.
The object of the present invention is to greatly reduce the time required for the vacuum chamber to be depressurized in a laminating apparatus that moves up and down a surface plate with a surface plate driving structure, and further, an excessive load is applied to the surface plate driving structure during secondary bonding. An object of the present invention is to provide a laminating apparatus that eliminates the need to simplify the structure and reduce the overall cost.

  In the work laminating apparatus of the present invention, the first surface plate 4 that sucks and holds the first work W1 and the second work W2 are sucked and held in the vacuum chamber 2 and is directed to the first surface plate 4. And a second surface plate 5 provided with a press body 6 to be pressed. At the time of bonding, the second workpiece W2 is pressed against the first workpiece W1 with the press body 6 in the state where the inside of the vacuum chamber 2 is depressurized, and further, the pressurized air is supplied to the inside of the vacuum chamber 2. Then, secondary bonding is performed. In said workpiece bonding apparatus, the inside of the vacuum chamber 2 is divided into the 1st chamber 21 and the 2nd chamber 22 with the sealing body 20 provided between the vacuum chamber 2 and any one surface plate 4. . When primary bonding is performed, the vacuum pressure of the vacuum source 3 is applied to each of the first chamber 21 and the second chamber 22 to reduce the pressure (see FIG. 5).

  The vacuum chamber 2 is provided with a surface plate drive structure 14 that adjusts the bonding gap between the first workpiece W and the second workpiece W2 by moving one of the first surface plate 4 and the second surface plate 5. During the secondary bonding, pressurized air is applied to the first chamber 21 and the second chamber 22 to reduce the pressure load acting on the surface plate drive structure 14 (see FIG. 1).

  A first surface plate 4 and a second surface plate 5 are arranged inside the vacuum chamber 2 so as to face each other in the vertical direction. The first surface plate 4 is disposed close to the chamber body 2A constituting the vacuum chamber 2 via a slide gap E1 secured between the two chambers 2A and 4. The first chamber 21 and the second chamber 22 are divided into upper and lower portions by the seal body 20 disposed in the slide gap E1 between the chamber body 2A and the first surface plate 4.

  The vacuum chamber 2 includes a chamber body 2A and a chamber lid body 2B that opens and closes the inlet / outlet 8 of the chamber body 2A. The opposing gap E2 between the first surface plate 4 and the second surface plate 5 in a state where the chamber lid 2B is joined to the chamber body 2A and the inlet / outlet 8 is closed is the total thickness of the first workpiece W1 and the second workpiece W2. And a value obtained by adding a bonding gap between the workpieces W1 and W2 set by the surface plate drive structure 14 and a margin gap.

  In the present invention, the second workpiece W2 is pressed against the first workpiece W1 with the press body 6 in a state where the vacuum chamber 2 is evacuated, so that primary bonding is performed. Further, after the pressurization by the press body 6 is stopped, the pressurized air is supplied to the vacuum chamber 2, and the second workpiece W2 is pressed against the first workpiece W1 with the pressurized air to perform secondary bonding. . In this way, when both the workpieces W1 and W2 are primarily bonded in a vacuum environment, the bonding surfaces of both the workpieces are closely adhered and sealed, and air enters the bonding surface in the subsequent bonding process. It can be surely prevented. Furthermore, the entire surface of the second workpiece W2 can be pressed evenly with the pressurized air by pressing the compressed air directly on the surface of the second workpiece W2 for secondary bonding. The part which did not exist can be pressed. For example, a pair of workpieces can be reliably bonded by pressing the sheet surface facing the uneven body S present on the bonding surface with pressurized air and bringing it into close contact with the surface of the uneven body S.

  Furthermore, in the bonding apparatus of the present invention, when the primary bonding is performed, each of the divided first chamber 21 and second chamber 22 is individually depressurized, so the volume of each chamber 21 and 22 to be evacuated. The time required for decompression can be shortened accordingly. Therefore, according to the bonding apparatus of the present invention, it is possible to reliably bond a pair of workpieces to improve the yield of the bonded product, and to greatly reduce the time required for decompression of the vacuum chamber, energy consumption and operation Cost can be reduced and productivity of bonded products can be improved.

  In the bonding apparatus provided with the surface plate drive structure 14 for adjusting the bonding gap between both the workpieces W1 and W2, when performing the secondary bonding, when the pressurized air is applied only to the second chamber 22 side, A large pressing force corresponding to the area acts on the first surface plate 4. This pressing force is finally received by the surface plate drive structure 14, which causes parts constituting the surface plate drive structure 14 to be consumed at an early stage or cause a failure. However, when pressurized air is applied to both the first chamber 21 and the second chamber 22 during the secondary bonding, the pressing force acting on the first surface plate 4 is canceled and the surface plate driving structure 14 is affected. The pressurizing load to be reduced can be greatly reduced. Therefore, it is not necessary to unnecessarily increase the load resistance of the surface plate drive structure 14, and the overall structure of the surface plate drive structure 14 can be simplified to reduce the overall cost of the workpiece bonding apparatus.

  When the first surface plate 4 is disposed close to the chamber body 2A via the slide gap E1, the amount of space surrounding the peripheral side surface of the first surface plate 4 is significantly increased in both the first and second chambers 21 and 22. The amount of air to be exhausted can be reduced by reducing the size. Thereby, pressure reduction of both chambers 21 and 22 can be performed in a shorter time, and the energy consumption and operation cost which pressure reduction requires can further be reduced. In addition, since the seal body 20 is provided in the slide gap E1 between the chamber body 2A and the first surface plate 4 and the inside of the vacuum chamber 2 is divided vertically, the seal body 20 having a very simple structure, for example, made of rubber The inside of the vacuum chamber 2 can be reliably divided by a seal ring or the like.

  The opposing gap E2 between the first and second surface plates 4 and 5 with the chamber lid 2B closed is set to the total thickness of the second workpieces W1 and W2 and both workpieces set by the surface plate drive structure 14. When the value is set to a value obtained by adding the bonding gap between W1 and W2 and the margin gap, the volume of the second chamber 22 can be further reduced. Therefore, the time required for decompressing the second chamber 22 can be shortened, wasteful consumption of energy can be eliminated, and the operating cost can be further reduced.

It is a vertical side view which shows schematic structure of the workpiece | work bonding apparatus which concerns on this invention. It is a vertical side view which shows schematic structure of a workpiece | work bonding apparatus. It is a top view which shows the bonding surface of a chamber cover body. It is a vertical side view of the state which opened the chamber cover body. It is a vertical side view of the state which closed the vacuum chamber. It is a vertical side view of the primary bonding state which expanded the press body. It is sectional drawing which shows notionally the primary bonding state of a workpiece | work. It is a vertical side view which shows the secondary pasting state of a work notionally.

  1 to 8 show an embodiment of a workpiece bonding apparatus according to the present invention. In FIG. 2, the workpiece bonding apparatus is vertically opposed to the inside of the vacuum chamber 2, the vacuum chamber 2 provided at the upper part of the base 1, the vacuum pump (vacuum source) 3 that exhausts the air in the vacuum chamber 2. The first surface plate 4 and the second surface plate 5 are arranged in a state, and a compressor (pressure source) 7 that generates pressurized air. The first work W1 is sucked and fixed to the first surface plate 4 side, and the second work W2 is sucked and fixed to the press body 6 provided on the second surface plate 5.

  The 1st work W1 consists of glass substrates, such as a liquid crystal substrate or a plasma display substrate, and printed wiring (concavo-convex body) S (refer to Drawing 8) is formed in the pasting side. The second work W2 is a plastic sheet or a functional sheet based on a plastic film, such as a polarizing sheet, the same size and the same size as the first work W1, an antireflection film, an electromagnetic wave shielding film, an ultraviolet shielding film, a protective sheet, etc. Consists of. On the bonding surface of the functional sheet, a transparent adhesive layer is formed over the entire surface. The first workpiece W1 may be formed of a plastic substrate or a film substrate.

  The vacuum chamber 2 includes a chamber body 2A having a square box structure, and a chamber lid 2B connected to the chamber body 2A by a swing shaft 9 so as to be swingable and openable. A loading / unloading port 8 is opened on the upper surface of the chamber body 2A. The chamber lid 2B is formed in a flat rectangular block shape that also serves as the second surface plate 5, and is opened and closed by an air cylinder (not shown) to close the inlet / outlet 8 of the chamber body 2A (FIG. 1). 2) and an open position that reverses 180 degrees from the closed position. A sealing body 10 for sealing the chamber internal space of the vacuum chamber 2 is provided on the joint surface between the two 2A and 2B.

  The chamber body 2 </ b> A is fixed to the base 1, and supports the first surface plate 4 disposed therein via a plurality of guide shafts 13 and a surface plate driving structure 14. The surface plate drive structure 14 is composed of a step motor (or servo motor), a ball screw, and the like, and precisely moves the first surface plate 4 up and down toward the second surface plate 5 via its output unit 15. The bonding gap between the first workpiece W1 and the second workpiece W2 is adjusted. The guide shaft 13 is guided and supported by a slide bush provided in the chamber body 2A so as to be slidable up and down, and is formed in a state in which a fourth passage 29 described later is vertically passed through one of the slide bushes (FIG. 1 and FIG. 1). (See FIG. 4).

  A working chamber 17 that opens toward the first surface plate 4 is formed in the inner surface of the second surface plate 5 so as to cover the entire opening surface when the chamber lid 2B is closed at the closed position. In this state, the press body 6 is fixed to the second surface plate 5. As shown in FIG. 3, the working chamber 17 has a square spiral groove 17a that gradually approaches the central portion along each side portion of the second surface plate 5, and the groove end of the central portion is a third passage described later. It is connected to the vacuum pump 3 and the compressor 7 via 28.

  The press body 6 is made of a plate-like stainless steel plate having vent holes 18 opened over the entire surface, and the periphery thereof is fixed to the second surface plate 5 with a square press frame 19. The vent holes 18 are round holes having a diameter of several millimeters, and are formed at regular intervals over the entire surface of the press body 6. As shown in FIG. 4, the press body 6 in the free state is received and flattened by the peripheral wall of the groove opening of the working chamber 17, and in this state, each vent 18 faces the spiral groove 17a. . The press body 6 sucks and holds the second workpiece W2 or presses the sucked and held second workpiece W2 toward the first surface plate 4 to perform primary bonding.

  The first surface plate 4 is formed in a flat rectangular block shape similar to the chamber body 2A, and an adsorption chamber 11 for adsorbing and holding the first workpiece W1 is formed on the upper surface thereof. The suction chamber 11 is formed with a lattice-like suction groove. The first surface plate 4 is accommodated in a state close to the inner surface of the chamber recess of the chamber body 2A. Specifically, as shown in FIG. 5, the inner peripheral surface of the concave portion of the chamber body 2 </ b> A and the peripheral side surface of the first surface plate 4 are opposed to each other via a slide gap E <b> 1 secured between the two surface portions 2 </ b> A and 4. The first surface plate 4 is accommodated in the state. The value of the slide gap E1 is preferably as small as possible because the amount of air in the chamber can be reduced.

  A seal groove is formed in a circumferential shape on the peripheral side surface of the first surface plate 4, and a seal ring (seal body) 20 is attached to the groove. The seal ring 20 is in close contact with the inner peripheral surface of the recess of the chamber body 2A, and the internal space of the vacuum chamber 2 is divided into a first chamber 21 below the seal ring 20 and a second chamber 22 above the seal ring 20. It is divided. The first surface plate 4 and the second surface plate 5 face each other vertically within the second chamber 22.

  The first chamber 21, the second chamber 22, and the working chamber 17 are respectively connected to the vacuum pump 3 and the compressor via a first passage (passage) 26, a second passage (passage) 27, and a third passage (passage) 28. 7 is connected. The adsorption chamber 11 is connected to the vacuum pump 3 through a fourth passage (passage) 29. An air release valve 46 and a pressure sensor 47 are provided in each of the passages 26 to 29, respectively. The fourth passage 29 communicates with the adsorption chamber 11 through a vertical passage formed in one of the guide shafts 13.

  The first passage 26 and the vacuum pump 3 are connected via a first branch passage 31 for the first chamber. By switching a switching valve 33 provided in the first branch passage 31, the first passage 26 and the vacuum pump 3 are connected to the first chamber 21. A vacuum pressure can be applied. The first passage 26 and the compressor 7 are connected via a second branch passage 32 for the first chamber. By switching a switching valve 34 provided in the second branch passage 32, the first passage 26 is added to the first chamber 21. Pressurized air can be applied.

  The second passage 27 and the vacuum pump 3 are connected via a first branch passage 35 for the second chamber. By switching a switching valve 37 provided in the first branch passage 35, the second passage 27 is connected to the second chamber 22. A vacuum pressure can be applied. The second passage 27 and the compressor 7 are connected via a second branch passage 36 for the second chamber. By switching a switching valve 38 provided in the second branch passage 36, the second passage 27 and the compressor 7 are added to the second chamber 22. Pressurized air can be applied.

  The third passage 28 and the vacuum pump 3 are connected via a first branch passage 39 for the working chamber. By switching a switching valve 41 provided in the first branch passage 39, a vacuum pressure is applied to the working chamber 17. Can act. The third passage 28 and the compressor 7 are connected via a second branch passage 40 for the working chamber. By switching a switching valve 42 provided in the second branch passage 40, the pressurized air is supplied to the working chamber 17. Can act.

  The fourth passage 29 is connected to the vacuum pump 3, and a vacuum pressure can be applied to the adsorption chamber 11 by switching a switching valve 43 provided in the middle of the fourth passage 29. Each of the switching valves 33, 34, 37, 38, 41, 42, 43, and the atmosphere release valve 46 is an electromagnetic valve that can be switched between an open state and a closed state, and each of the first to fourth passages. It can switch to the state which interrupts 26-29, and the state which can be ventilated.

  The bonding apparatus comprised as mentioned above bonds the 1st workpiece | work W1 and the 2nd workpiece | work W2 through a primary bonding process and a secondary bonding process. First, in a state where the chamber lid 2B is opened 180 degrees from the closed position and opened, the first workpiece W1 is placed on the upper surface of the first surface plate 4, and the periphery thereof is positioned by a positioning tool (not shown). In this state, as shown in FIG. 4, the switching valve 43 can be vented, the vacuum pressure of the vacuum pump 3 is applied to the suction chamber 11, and the first work W <b> 1 is suction fixed to the upper surface of the first surface plate 4. .

  Similarly, the 2nd workpiece | work W2 is mounted in the adsorption | suction surface of the press body 6, and it positions with a positioning jig. In this state, as shown in FIG. 4, the switching valve 41 is made ventable, the vacuum pressure of the vacuum pump 3 is applied to the working chamber 17, and the second workpiece W <b> 2 is adsorbed and fixed by the press body 6. The positioning jig is removed from the second surface plate 5 after the second workpiece W2 is adsorbed by the press body 6. In FIG. 4, only the passages 28, 29 and 39 in which the vacuum pressure acts are indicated by thick lines, and the other passages to which the vacuum pressure and pressurized air are not acting are indicated by broken lines. 1, 5, and 6, similarly, only the passage where the vacuum pressure or the pressurized air is operating is indicated by a bold line, and the other passages are indicated by a broken line.

  After completion of the bonding preparation, as shown in FIG. 5, the chamber lid 2B is put on the opening surface of the chamber body 2A to close the vacuum chamber 2, and the chamber lid 2B is chambered with a lock structure not shown. Lock and fix to the main body 2A. In the meantime, the vacuum pressure is continuously applied to the working chamber 17 and the adsorption chamber 11. The facing gap E2 between the first surface plate 4 and the second surface plate 5 in the closed state is preferably set as small as possible. The smaller the facing gap E2, the smaller the volume of the second chamber 22 is required for decompression. Time can be shortened. Practically, the total thickness of both the first and second workpieces W1 and W2, the bonding gap between the workpieces W1 and W2 set by the surface plate drive structure 14 to be described later, and the total marginal clearance are set to a total value. If so, the volume of the second chamber 22 can be reduced while the chamber lid 2B is smoothly opened and closed.

  Next, the surface plate drive structure 14 is started, the 1st surface plate 4 approaches and raises toward the 2nd surface plate 5, and the clearance gap suitable for bonding the opposing clearance gap of the 1st workpiece | work W1 and the 2nd workpiece | work W2 is carried out. Set to (bonding gap). The bonding gap is adjusted depending on the material and thickness of the second workpiece W2, but is preferably set within a range of approximately 0.1 to 1 mm. In this state, the switching valves 33 and 37 are allowed to vent, and the first chamber 21 and the second chamber 22 are depressurized by applying a vacuum pressure. As described above, when the first chamber 21 and the second chamber 22 separated by the seal ring 20 are individually decompressed, the chambers 21 and 22 are compared with the case where the entire inner chamber of the vacuum chamber 2 is decompressed collectively. The time required for reducing the pressure can be shortened. For example, when the volume of the first chamber 21 is 1 and the volume of the second chamber 22 is 2, and the total volume of the internal chamber of the vacuum chamber 2 is 3, the decompression of the first and second chambers 21 and 22 is reduced. The time required for can be reduced to one third and two thirds of the time required to decompress the entire internal chamber.

  In this embodiment, the slide gap E1 is made as small as possible, and the opposing gap E2 in the state where the chamber lid 2B is closed is made as small as possible to reduce the volume of the second chamber 22. The decompression can be completed in a shorter time than the apparatus. Therefore, the energy consumption and operation cost of the bonding apparatus can be reduced.

  For example, if only the second chamber 22 is depressurized while the first chamber 21 is opened to the atmosphere, the first surface plate 4 is slightly displaced by receiving the differential pressure between the two chambers 21 and 22, and the first workpiece W1. There is a possibility that the bonding gap between the second workpiece W2 and the second workpiece W2 changes. However, as described above, when the pressure of the second chamber 22 is reduced, if the pressure of the first chamber 21 is reduced in parallel, the vacuum pressures of both the chambers 21 and 22 can be made substantially the same. Therefore, it is possible to prevent the bonding gap from changing at the time of depressurization and perform an accurate bonding.

  After confirming that the exhaust of the first chamber 21 and the second chamber 22 has been completed by the output signals from the pressure sensors 47 and 47 of the first passage 26 and the second passage 27, as shown in FIG. The valve 33 is switched to the shut-off state. The switching valve 37 on the second passage 27 side keeps the vacuum pressure acting on the second chamber 22 without switching. Next, the switching valve 41 on the first branch passage 39 side of the third passage 28 is switched to the shut-off state, and at the same time, the switching valve 42 on the second branch passage 40 side of the third passage 28 is switched to a ventable state, Pressurized air is applied to the working chamber 17.

  When the pressurized air is supplied to the working chamber 17, the press body 6 expands downward as shown in FIG. 6, presses the second workpiece W2 against the first workpiece W1, and primarily bonds them together. As for the press body 6 at the time of primary bonding, the center part expand | swells downwards ahead of others, and the area | region to expand expands to a peripheral part. Therefore, the 2nd work W2 is pasted to the peripheral part to the 1st work W1 from the central part. Therefore, even if very low pressure air remains between the workpieces W1 and W2 for some reason, the air can be forcibly pushed out from the periphery of the workpiece and bonded. The pressure of the pressurized air at this time is about 5 atm, and the pressurized state is maintained for several seconds. During the primary bonding, a part of the pressurized air is blown out from the vent 18 into the vacuum chamber 2. In order to exhaust this, the switching valve 37 of the second passage 27 is allowed to vent for only a few seconds after the primary bonding is finished, as well as during the primary bonding. Continue to exhaust the air.

  After several seconds have passed since the peripheral portion of the second workpiece W2 has been bonded to the first workpiece W1, the switching valves 37 and 43 of the second passage 27 and the fourth passage 29 are switched to the shut-off state, and the second The exhaust of the chamber 22 is stopped, and the adsorption action by the adsorption chamber 11 is stopped. At the same time, the switching valve 42 on the third passage 28 side is switched to the shut-off state to release the pressing force of the press body 6, and all the air release valves 46 are also vented. As a result, the pressurized air is discharged from the atmosphere release valve 46, the inside of the working chamber 17 becomes atmospheric pressure, the press body 6 returns to a flat state, and is separated from the second workpiece W2.

  When the primary bonding is completed, the second workpiece W2 is lifted away from the bonding surface of the first workpiece W1 on both sides of the cross section of the printed wiring S as shown in FIG. In order to make the part which floated away in this way adhere to the surface of the printed wiring S and the bonding surface of the 1st workpiece | work W1, secondary bonding is performed. In addition, since primary bonding is performed under a reduced pressure environment, even if a part of the first workpiece W1 is lifted from the bonding surface, there is no air in the gap between the workpieces W1 and W2.

  When performing secondary bonding, all the air release valves 46 are switched to a shut-off state. Further, the switching valves 34 and 38 of the first passage 26 and the second passage 27 are switched to a state in which ventilation is possible, and pressurized air is supplied to the first chamber 21 and the second chamber 22. At this time, the pressure of the pressurized air supplied into both chambers 21 and 22 is 5 atmospheres.

  When pressurized air is supplied to both the first and second chambers 21 and 22, the second workpiece W2 is directly pressed against the surface of the first workpiece W1 with the pressurized air, and the entire surface is even with the pressurized air. Pressed. As a result, the sheet surface of the second workpiece W2 that faces the previous gap or the sheet surface that is lifted away is pressed to fill the gap, and the surface of the printed wiring S and the first workpiece W1 are pasted as shown in FIG. Adhere closely to the mating surface. Finally, after switching the switching valves 34 and 38 to the shut-off state, the air release valves 46 of the first passage 26 and the second passage 27 are opened, and both the first and second chambers 21 and 22 are at atmospheric pressure. The chamber lid 2B is opened, and the bonded body is taken out from the first surface plate 4.

  Thereafter, by repeating the above procedure, the pair of workpieces W1 and W2 can be bonded in a shorter time. In addition, since the first work W1 is supported by the first surface plate 4 and the second work W2 is sucked and held by the pressing surface of the press body 6, the pasting is performed. Compared to the combined device, the cost required for introducing the bonding equipment can be reduced, and the bonded product can be reduced in cost. Furthermore, since the press body 6 is expanded in a reduced pressure environment and the second workpiece W2 is bonded to the first workpiece W1 from the central portion to the peripheral portion, the bonding is performed accurately without any room for biting air. Yes.

  By the way, when performing secondary bonding, if the pressurized air is supplied to at least the second chamber 22, the sheet surface from which the second workpiece W2 is lifted is bonded to the printed wiring S or the first workpiece W1. However, the following problems occur. The inside of the vacuum chamber 2 is divided into a first chamber 21 and a second chamber 22 in order to perform decompression in a short time. Therefore, if pressurized air is applied only to the second chamber 22 side, a large pressing force corresponding to the area is applied to the first surface plate 4, and the surface plate driving structure 14 finally applies the previous pressing force. Will receive.

  Specifically, an excessive load is applied to the ball screw shaft constituting the surface plate drive structure 14, and the ball screw shaft and its bearing are quickly broken. If the first surface plate 4 is supported by a plurality of sets of ball screw shafts, it can withstand the previous pressing force, but the structure of the surface plate drive structure 14 becomes complicated, and the overall cost of the bonding apparatus increases. In order to avoid such damage to the ball screw shaft and to support the first surface plate 4 with only one ball screw shaft, and to simplify the structure of the surface plate drive structure 14, the first and second Pressurized air is supplied to both chambers 21 and 22 to prevent a differential pressure from being generated on the first surface plate 4.

As is apparent from the above description, in the workpiece bonding apparatus of the present invention, the first workpiece W1 and the second workpiece W2 made of a functional sheet are subjected to the following process in a reduced pressure environment inside the vacuum chamber 2. Can be pasted.
A step of adsorbing and fixing the first work W1 to the first surface plate 4 and adsorbing and fixing the second work W2 to the press body 6 of the second surface plate 5;
The vacuum chamber 2 is closed, and the first surface plate 4 is moved by the surface plate drive structure 14 so that the first work W1 and the second work W2 are opposed to each other through a predetermined bonding gap. Reducing the pressure in the chamber 22;
A process of applying pressure air to the press body 6 of the second surface plate 5 and pressing the second work W2 against the first work W1 to perform primary bonding;
The action of the pressurized air on the press body 6 is stopped, the second work W2 is separated from the press body 6, the pressurized air is supplied to the first chamber 21 and the second chamber 22, and the second work W2 is moved. Both works W1 and W2 are bonded through a process of pressing the first work W1 with pressurized air and performing secondary bonding.

  A workpiece bonding body is a bonding body of a first workpiece W1 made of a substrate having a protrusion S on a part of the bonding surface and a second workpiece W2 made of a functional sheet, and in a reduced pressure environment, the second workpiece After pressing W2 against the first workpiece W1 and performing primary bonding, it is obtained through secondary bonding in which the second workpiece W2 is pressed against the first workpiece W1 with pressurized air in a pressurized environment.

  According to said workpiece | work bonding form, when protrusions, such as printed wiring S, are formed in the bonding surface of 1st workpiece | work W1, or when the recessed part is formed in the bonding surface of 1st workpiece | work W1, etc. Especially, a particularly suitable bonding result can be obtained, but a suitable bonding result can be obtained in the same manner when the workpieces having a flat bonding surface are bonded to each other.

  In the above embodiment, the chamber lid 2B also serves as the second surface plate 5, but the second surface plate 5 can be formed as a separate component from the chamber lid 2B. In this way, when the second surface plate 5 is configured separately from the chamber lid 2B, the second surface plate 5 is operated by the surface plate driving structure 14 provided on the chamber lid 2B side, The bonding gap can be adjusted. Adjustment of the bonding gap between the first workpiece W1 and the second workpiece W2 can be performed after the air in the chambers 21 and 22 is exhausted by the vacuum pump 3. In addition, the first surface plate 4 is supported by an alignment stand provided inside the chamber body 2A, an alignment device is provided between the two, and both workpieces W1 are based on the second workpiece W2 adsorbed to the press body 6.・ W2 can be positioned automatically.

  The working chamber 17 does not need to be formed by spiral grooves, and can be configured by lattice-like grooves, linear row groove groups, or the like. Similarly, the adsorption chamber 11 can be configured by spiral grooves, linear rows of grooves, or the like. In short, any structure that can simultaneously act on the press body 6 with vacuum pressure or pressurized air may be used. The surface plate driving structure 14 may be a structure that can precisely move the first surface plate 4 up and down, and does not need to be a structure having the ball screw described in the embodiment as an operation element.

  The chamber lid 2B can be configured to swing open and close around a vertical axis. If necessary, the vacuum chamber 2 can be closed by joining the chamber lid 2B not connected to the chamber main body 2A in a lid-matching manner. The press body 6 can be formed of a plastic plate material such as fluororesin. In that case, when the two workpieces W1 and W2 are bonded in a heating environment, the second workpiece W2 after the primary bonding is pressed. It can be easily separated from the body 6. The press body 6 in the case of bonding both the works W1 and W2 in a room temperature environment can be formed of rubber.

2 Vacuum chamber 2A Chamber body 2B Chamber lid 3 Vacuum source (vacuum pump)
4 1st surface plate 5 2nd surface plate 6 Press body 7 Pressure source (compressor)
11 Adsorption chamber 14 Surface plate drive structure 15 Output section 17 Working chamber

Claims (4)

Inside the vacuum chamber (2), the first surface plate (4) for adsorbing and holding the first work (W1) and the second work plate (W2) are adsorbed and held toward the first surface plate (4). And a second surface plate (5) provided with a press body (6) for pressing and
In a state where the inside of the vacuum chamber (2) is depressurized, the second work (W2) is pressed against the first work (W1) with the press body (6) to perform primary bonding, and further, the inside of the vacuum chamber (2). A workpiece laminating apparatus for supplying secondary air to the secondary laminating,
The inside of the vacuum chamber (2) is a seal body (20) provided between the vacuum chamber (2) and one of the surface plates (4). The first chamber (21) and the second chamber (22) And is divided into
When performing primary bonding, the work bonding apparatus characterized by reducing the pressure by applying the vacuum pressure of the vacuum source (3) to each of the first chamber (21) and the second chamber (22). A surface plate drive structure (14) for adjusting the joining gap between the first workpiece (W) and the second workpiece (W2) by moving one of the first surface plate (4) and the second surface plate (5). ) Is provided in the vacuum chamber (2),
The pressure load acting on the surface plate drive structure (14) is reduced by causing pressurized air to act on the first chamber (21) and the second chamber (22) during the secondary bonding. Work bonding device. Inside the vacuum chamber (2), the first surface plate (4) and the second surface plate (5) are arranged so as to face each other vertically,
The first surface plate (4) is disposed close to the chamber body (2A) constituting the vacuum chamber (2) via a slide gap (E1) secured between both (2A, 4). And
The first chamber (21) and the second chamber (22) are vertically divided by the seal body (20) disposed in the slide gap (E1) between the chamber body (2A) and the first surface plate (4). The workpiece bonding apparatus according to claim 2. The vacuum chamber (2) is composed of a chamber body (2A) and a chamber lid (2B) that opens and closes the inlet / outlet (8) of the chamber body (2A),
The opposing gap (E2) between the first surface plate (4) and the second surface plate (5) in a state where the chamber lid (2B) is joined to the chamber body (2A) and the inlet / outlet (8) is closed,
A value obtained by adding the total thickness of the first work (W1) and the second work (W2), the bonding gap between the two works (W1 and W2) set in the surface plate drive structure (11), and a margin gap. The bonding apparatus according to claim 2 or 3, wherein

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