TW201408488A - Substrate bonding device and bonding method - Google Patents

Abstract

A substrate bonding device and a bonding method thereof are provided, which can provide bonding stress for a substrate through a very simple and low priced configuration. The invention includes: a chamber 1 receiving a substrate S1 and a substrate S2 as bonding objects; a first supporting portion 2 supporting the substrate S1 in the chamber 1; a second supporting portion 3 supporting the substrate S2 at a position facing the substrate S1 in the chamber 1, wherein the chamber 1 is disposed with the following: a first space 11b opposite to the supporting side of the substrate S1 in the first supporting portion 2; a second space 12b between the space where the substrate S1 is facing the substrate S2, and the first supporting portion 2 includes a stretching portion 21, the stretching portion 21 separates the first space 11b and the second space 12b, holds the substrate S1, and extends by the pressure of the first space 11b being higher than the second space 12b, thus the substrate S1 is pressed to the substrate S2.

Description

Substrate bonding device and bonding method

The present invention relates to a substrate bonding apparatus and a bonding method for bonding a pair of substrates.

There are two methods of bonding a pair of substrates via an adhesive, such as a method of bonding in the air and a method of bonding in a vacuum.

In the bonding in the air, depending on the application pattern of the adhesive, the bonding pressure, the pressure application method, or the like, bubbles may remain on the bonding surface. On the other hand, in the case of the adhesion in the vacuum, if the atmosphere is sufficiently exhausted, the gas is not present in the surroundings, and the bonding of the bubbles can be performed relatively easily (see Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-53119

In the case where a touch panel, a cover, or the like is laminated on the electro-optical element and bonded together, it is necessary to eliminate the air bubbles or the space remaining without being completely adhered, and the like. A pair of substrates are biased to each other. At this time, there is a case where a pressing mechanism that presses the substrate is used, and the substrate is fixedly held by one substrate and the other substrate is fixedly held.

In this case, the pressing mechanism must be airtightly disposed in a chamber for vacuum bonding, and the apparatus is complicated and large, and the manufacturing cost is also increased.

Moreover, in recent years, it has been proposed to perform a gesture operation by a touch panel on the side portion. Therefore, in the laminated substrate body, it is also necessary to be configured such that the both ends are bent or bent and raised to have a concave shape, and cover the surface from the surface.

As an example of the substrate body in which the concave shape is laminated, first, both ends of the glass or resin substrate which is a cover plate are bent or bent to be formed into a concave shape. Next, the flexible touch panel sheet is laminated in such a manner as to be in close contact with the concave surface of the cover. As a method of the lamination process, for example, the mounting surface of the substrate bonding apparatus is a convex surface that is fitted to the concave surface of the cover, and the touch panel sheet to which the adhesive is applied in advance is deflected and along the convex surface Keep it up. Then, it is pressed into the concave surface of the cover to join the two.

However, in the case of such a manufacturing method, when the touch panel sheet is pressed into the concave surface of the cover plate, the difference in the shape of the rising portion due to bending or bending the both ends of the cover plate is However, the shape of the convex surface of the fitting is inconsistent, so that the cover plate and the touch panel sheet cannot be properly joined, or a gap is generated, thereby causing a defect in the product. Capability.

Further, in the case where the shape of the rising portion obtained by bending or bending due to the product is different, it is necessary to prepare a member having a convex shape having a fitting surface conforming to the shape in advance, thereby causing preparation or replacement of the member. This may also result in a decrease in productivity.

The present invention has been made to solve the problems of the prior art as described above, and a main object thereof is to provide a substrate bonding apparatus and a bonding method capable of providing a pressure for bonding to a substrate with a very simple and inexpensive configuration. .

Another object of the present invention is to provide a substrate bonding apparatus and a bonding method capable of bonding together with high precision through an adhesive even when a substrate is laminated in a concave shape.

A feature of the present invention includes a chamber that accommodates a first substrate and a second substrate to be bonded together, a first support portion that supports the first substrate in the chamber, and a second support portion that is inside the chamber The second substrate is supported at a position facing the first substrate, wherein a first space on a side opposite to a support side of the first substrate of the first support portion and a first substrate are provided in the chamber; a second space facing the second substrate, wherein the first support portion includes an expansion-contraction portion that separates the first space from the second space and holds the first substrate, and the expansion/contraction portion is The first space is expanded by a pressure higher than the second space, and the first substrate is pressed against the second substrate.

The above-mentioned expansion and contraction portion may also be all or a part of the adsorption force by energization The elastic body that changes, and the first support portion includes an electrode portion that energizes the expansion and contraction portion.

The chamber may be divided into: the first chamber having the first space and the first support portion; and the second chamber having the second space and the second support portion The expansion/contraction portion is sandwiched by a portion closed by the first chamber and the second chamber.

The expansion and contraction portion may also be in the shape of a bag.

The present invention may further include: a first air passage that supplies the exhaust gas to the first space; and a second air passage that supplies the exhaust gas to the second space, at least one of the first air passage and the second air passage One of the pressure adjustment units is connected to the pressure adjustment unit, and the pressure adjustment unit adjusts the pressure of the first space or the second space to switch the expansion and contraction of the expansion and contraction unit.

The pressure adjustment unit may also include a vacuum source.

The pressure adjustment unit may also include a pressurized source.

The present invention may further include a temporary hardening treatment unit that temporarily cures an adhesive adhering to at least one of the first substrate and the second substrate.

In the present invention, the first substrate may be a concave substrate having a concave surface, and the second substrate may be a flexible thin substrate, and the bag-shaped stretchable portion may be expanded in accordance with the concave surface of the concave substrate. In the process, the expansion and contraction portion is inserted into the concave space formed by the concave surface of the concave substrate together with the thin substrate before the expansion and contraction portion is modeled on the concave surface, and the expansion and contraction portion is further expanded. In the process, the thin substrate is opened by the expansion and contraction portion in accordance with the concave surface.

The expansion/contraction portion may further include a center block, and a portion located on both sides of the center block may be expanded to a portion along a concave surface of a side portion of the concave substrate.

The expansion/contraction portion may further include an abutting unit that can abut against the center of the first substrate and that is extended toward the first substrate after the abutting unit abuts against the center of the first substrate The way to expand.

Further, the bonding method of the above-described substrate bonding apparatus is also an embodiment of the present invention.

According to the present invention, by providing the expansion-contraction portion, the substrate can be held in a very simple and inexpensive configuration, and the pressure for bonding can be applied to the substrate. The expansion-contraction portion holds the first substrate and is formed by the first space. The pressure is increased higher than the pressure in the second space, and the first substrate is pressed to the second substrate.

Further, according to the present invention, even if the side portion of the concave substrate has an individual difference in a curved or bent shape, the stretchable portion expands in conformity with the concave surface so as to absorb the difference caused by the individual difference, and thus is attached to the thin substrate. There will be no gaps or wrinkles when it is combined. Therefore, the thin substrate can be bonded to the concave substrate with high precision. Further, even when the bending or bending shape of the side portions is different depending on the type of the concave substrate, or the bending ratio or the bending angle is different, since the expansion/contraction portion expands in conformity with various concave substrates, it is not necessary. A member having a convex shape having a fitting surface that coincides with each of the concave substrates is prepared in advance. Therefore, saving the preparation of the components or replacing the work, thereby Productive improvement.

1‧‧‧ chamber

2‧‧‧1st Support Department

3‧‧‧2nd Support Department

3a‧‧‧ Keeping Department

4‧‧‧ Temporary Hardening Treatment Department

11‧‧‧1st chamber

11a‧‧‧1st ventilation path

11b‧‧‧1st space

11c, 12c‧‧‧ Pressure Adjustment Department

12‧‧‧2nd chamber

12a‧‧‧2nd ventilation path

12b‧‧‧2nd space

21‧‧‧Flexing Department

22‧‧‧Electrode

100‧‧‧Substrate bonding device

103‧‧‧ Keeping Department

104‧‧‧Pushing mechanism

104a‧‧‧ bag body

104b‧‧‧ fluid introduction hole

104c‧‧‧ tube

104d‧‧‧Opening and closing valve

104e‧‧‧Abutment

104f‧‧‧Central Block

109‧‧‧vacuum chamber

120‧‧‧ concave substrate

120a‧‧‧ concave

120b‧‧‧Sideside

120c‧‧‧ concave space

121‧‧‧Thin substrate

M‧‧‧Substrate bonding device

R‧‧‧Adhesive

S1, S2, S3‧‧‧ substrates

UV‧‧‧UV

Fig. 1 is a cross-sectional view showing a substrate bonding apparatus according to a first embodiment.

Fig. 2 is a cross-sectional view showing a temporary hardening treatment unit according to the first embodiment.

Fig. 3 is a cross-sectional view showing the first chamber in the first embodiment in a standby state.

Fig. 4 is a cross-sectional view showing a state in which the first chamber of the first embodiment is lowered.

Fig. 5 is a cross-sectional view showing the evacuation in the first embodiment.

Fig. 6 is a cross-sectional view showing a state in which a first space according to the first embodiment is ventilated.

Fig. 7 is a cross-sectional view showing the atmosphere in the first embodiment.

Fig. 8 is a cross-sectional view showing a state in which the first chamber of the first embodiment is raised.

Fig. 9 is a cross-sectional view showing the first chamber in a standby state in the second embodiment.

Fig. 10 is a cross-sectional view showing a state in which a first space in the second embodiment is ventilated.

11(a) to 11(c) are schematic views showing various substrates after bonding.

Fig. 12 is a cross-sectional view showing the first chamber in a standby state in the third embodiment.

Fig. 13 is a cross-sectional view showing a state in which a first space in the third embodiment is ventilated.

Fig. 14 is a cross-sectional view showing a modification of the third embodiment.

Fig. 15 is a configuration diagram of a substrate bonding apparatus according to a fourth embodiment.

(a) to (c) of FIG. 16 are configuration diagrams of a pressing mechanism provided in the substrate bonding apparatus of the fourth embodiment.

(a) and (b) of FIG. 17 are configuration diagrams of a pressing mechanism provided in the substrate bonding apparatus of the fifth embodiment.

(a) to (c) of FIG. 18 are configuration diagrams of a pressing mechanism provided in the substrate bonding apparatus of the sixth embodiment.

Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[First Embodiment]

[composition]

As shown in FIG. 1, this embodiment is a substrate bonding apparatus M in which a pair of substrates S1 and S2 are bonded together via an adhesive R. For example, the substrate S1 is a touch panel of a display device, and the substrate S2 is a cover of the display device.

The substrate bonding apparatus M includes a chamber 1, a first support portion 2 provided inside the chamber 1, and a second support portion 3. The chamber 1 is a container that allows the interior to be a vacuum. The chamber 1 has a first chamber 11 and a second chamber 12.

The first chamber 11 is a component that is disposed to face the second chamber 12 and is moved by a drive mechanism (not shown) to be in contact with or separated from the second chamber 12 . Alternatively, the movement of the first chamber 11 by the drive mechanism may be not only a movement in a direction in which the second chamber 12 is in contact with or separated from the second chamber 12, but also a horizontal movement or a reverse rotation. action.

In the first chamber 11, a first space 11b through which the exhaust gas is supplied via the first air passage 11a is provided. The pressure adjustment unit 11c is connected to the first ventilation path 11a. The pressure adjustment unit 11c includes, for example, a vacuum source (such as a vacuum pump) that is connected to the first ventilation path 11a via a pipe. Furthermore, it is also possible to set the switching vacuum state and A switching unit such as a valve in a vent state. In the center of the first space 11b in the first chamber 11, a protruding portion having a horizontal surface that protrudes toward the second chamber 12 side is provided. The substrate is held by the first support portion 2 described below at a position where the protruding portion is provided.

The first support portion 2 is provided at a position facing the second chamber 12 in the first chamber 11. The first support portion 2 is a component that supports the substrate S1 toward the first chamber 11 side. The first support portion 2 has an expansion and contraction portion 21 and an electrode portion 22 .

The stretchable portion 21 is a film including an elastic body that seals the side of the first space 11b that faces the second chamber 12. At the position of the elastic body corresponding to the protruding portion, the adhesive force for holding the substrate S1 is maintained. The adhesive portion having the adhesive force may be the entire stretchable portion 21 or may be only a portion that holds the partial substrate. For the adhesive portion, for example, an adhesive material such as a silicone gel sheet or an electrorheological fluid (ER) (including an ER gel) whose adsorption force is changed by energization can be used. Further, the adhesive portion may not be provided in the expansion-contraction portion 21, and the substrate S1 may be held by the electrostatic force by the expansion-contraction portion 21 by the electrostatic chuck including the electrode portion 22 described below. In addition, as the elastic portion 21, for example, a synthetic rubber such as natural rubber, polybutadiene, nitrile or chloroprene, or a fiber such as polyurethane may be used. Further, the fluid to be introduced in order to expand and contract the expansion/contraction portion 21 is not limited to air, and may be a single gas such as nitrogen gas or oxygen gas, a mixed gas or a liquid.

The electrode portion 22 is a sheet-shaped energization electrode disposed between the horizontal surface of the protruding portion in the center of the first space 11b in the first chamber 11 and the expansion and contraction portion 21. Although not shown, the electrode portion 22 is connected to a power source and a switch via a connection line. The electrode portion 22 can be set as an electrostatic chuck as described above, or can be used as a power source for the ER fluid. Hereinafter, the present embodiment will be described in the case where the substrate S1 is held using the ER fluid.

The second chamber 12 is provided with a second space 12b through which the exhaust gas is supplied via the second air passage 12a. The pressure adjusting portion 12c is connected to the second ventilation path 12a. The pressure adjustment unit 12c includes, for example, a vacuum source (such as a vacuum pump) that is connected to the second ventilation path 12a via a pipe. Further, a switching unit such as a valve that switches between a vacuum state and a ventilation state may be provided.

The bottom surface of the second space 12b of the second chamber 12 serves as the second support portion 3. The second support portion 3 is a component that supports the substrate S2 toward the second chamber 12 side. In addition, as the second support portion 3, a sheet-like elastic body having an adsorption force may be provided between the bottom surface of the second space 12b and the substrate S2 as an anti-slip portion of the substrate S2.

In the second space 12b, the first chamber 11 is lowered toward the second chamber 12 side, and is in contact with each other via the expansion-contraction portion 21, whereby the side facing the first chamber 11 is sealed. Further, the first chamber 11 and the second chamber 12 do not have to be in contact with each other via the expansion and contraction portion 21. Further, the expansion/contraction portion 21 does not have to be sandwiched between the first chamber 11 and the second chamber 12, but may have a bag shape.

Further, in the present embodiment, as shown in FIG. 2, the temporary hardening treatment portion 4 for temporarily curing the adhesive R applied to the substrate S1 before bonding is included. The temporary hardening treatment unit 4 has a light source that emits UV (ultraviolet) light, for example, when the adhesive R is an ultraviolet curable resin.

[effect]

The bonding step of the present embodiment as described above will be described. First, by The electrode portion 22 connected to the power source is switched to energize the adhesive portion provided in the expansion and contraction portion 21 when the switch is switched. Thereby, the adhesive portion has an adsorption force to hold the substrate S1. Thereby, the first support unit 2 supports the substrate S1.

Further, an adhesive R is applied to the substrate S1. Then, the temporary hardening processing unit 4 temporarily hardens the adhesive R of the substrate S1. This temporary hardening treatment may be performed before the support of the first support unit 2 or after the support. For example, when the adhesive R is an ultraviolet curable resin, as shown in FIG. 2, the light source of the temporary curing treatment portion 4 is temporarily cured by irradiating UV light. Temporary hardening means a state in which hardening is not completely achieved. This temporary hardening can also be achieved by irradiation with weak intensity or by irradiation with oxygen suppression in the atmosphere.

As described above, the first chamber 11 supporting the substrate S1 moves to the second chamber 12 side by the drive mechanism as shown in FIG. Then, as shown in FIG. 4, the expansion-contraction part 21 of the 1st chamber 11 is in contact with the edge part of the 2nd chamber 12. Thereby, the expansion-contraction part 21 isolates the 1st space 11b of the 1st chamber 11 and the 2nd space 12b of the 2nd chamber 12.

In this state, as shown in FIG. 5, the vacuum source connected to the first air passage 11a and the vacuum source connected to the second air passage 12a are actuated to evacuate the first space 11b and the second space 12b. In the present embodiment, both the first space 11b and the second space 12b are evacuated. However, as shown in the fourth embodiment to be described later, only one space, for example, only the second space 12b may be pumped. Vacuum.

The vacuum is evacuated until the gas which may become a bubble on the bonding surface is sufficiently reduced, and then the first portion is connected to the switching portion of the first ventilation path 11a to perform the first Ventilation of space 11b. Then, as shown in FIG. 6, since the air pressure in the first space 11b is increased compared to the second space 12b, the expansion/contraction portion 21 is expanded toward the substrate S2 side, and the surface of the substrate S1 to which the adhesive R is adhered is pressed. To the substrate S2. That is, the expansion and contraction portion 21 constitutes a pressing mechanism that presses the substrate S1.

At this time, since the stretchable portion 21 is separated from the electrode portion 22, the expansion of the stretchable portion 21 is instantaneous, and a certain degree of adsorption force remains in the adhesive portion, so that there is no problem in holding the substrate S1.

Then, the ventilation of the second space 12b is performed by the switching unit connected to the second ventilation path 12a. Then, since the second space 12b returns to the same atmospheric pressure as the first space 11b, the stretchable portion 21 is separated from the substrate S1 as shown in FIG. At this time, since the stretchable portion 21 is separated from the electrode portion 22 and the suction force of the stretchable portion 21 is lowered, it is easy to peel off from the substrate S1.

Further, as shown in FIG. 8, the first chamber 11 is raised to open the upper space of the second chamber 12. Further, the transfer device or the like transports the bonded substrate S1 and the substrate S2 located in the second chamber 12 to the next step. For example, the substrate S1 and the substrate S2 are transported in a vacuum toward a main hardened portion that irradiates ultraviolet rays.

[effect]

According to the present embodiment as described above, the expansion-contraction portion 21 of the adsorption-retaining substrate S1 is biased by the atmospheric pressure, whereby the substrate S1 can be uniformly pressure-bonded to the substrate S2 without bubbles in the vacuum. In this manner, the member that holds the substrate S1 and the member that presses the substrate S1 against the substrate S2 are the common expansion-contraction portions 21, and the expansion-contraction portion 21 is merely a film of an elastic body. Therefore, the device can be constructed very simply and inexpensively.

Further, since the first support portion 2 is provided in the first chamber 11 and moves together with the first chamber 11, it is not necessary to separately provide a special drive mechanism to move the first support portion 2 of the holding substrate S1.

In addition, the elastic member that changes the adsorption force due to energization can have an adsorption force to the substrate S1 even in a vacuum, and the substrate S1 can be reliably released after being bonded.

Further, by temporarily curing the adhesive R before bonding, it is possible to prevent the adhesive R from falling or unevenness. Further, the substrate S1 is pressed against the substrate S2 by the difference in pressure between the vacuum and the atmospheric pressure, so that a strong pressure can be obtained in a short time. Further, before the pressing of the pressure difference between the vacuum and the atmospheric pressure is performed, the first chamber 11 is also exhausted as the second chamber 12 is exhausted, so that the substrate S1 and the substrate S2 become bubbles when they are bonded together. The substrate S1 is prevented from coming into contact with the substrate S2 before the gas is sufficiently discharged. However, even if such simultaneous evacuation is not performed, the closely adhered substrate S1 and the substrate S2 are continuously pressed at atmospheric pressure, and the slightly remaining gas disappears. Therefore, it is not necessary to perform simultaneous evacuation, and in this case, the overall bonding time can be shortened.

[Second Embodiment]

[composition]

This embodiment is basically the same as the above-described first embodiment. However, in the present embodiment, as shown in Fig. 9, the positional relationship between the first chamber 11 and the second chamber 12 is reversed. Further, a holding portion 3a that holds the substrate S2 is provided in the second support portion 3 of the second chamber 12. As the holding portion 3a, for example, an electrostatic chuck is used. Although not shown in the figure, the electrostatic chuck is connected to a power source and a switch via a connection line.

[effect]

The bonding step of the present embodiment as described above is basically the same as that of the first embodiment described above. In particular, in the present embodiment, the substrate S2 is held by the holding portion 3a of the second support portion 3. For example, the substrate S2 is adsorbed by an electrostatic chuck to which a voltage is applied.

Then, as shown in FIG. 10, the first space 11b and the second space 12b are evacuated, and the first space 11b is ventilated. Thereby, the expansion-contraction part 21 expands, and the surface of the board|substrate S1 which apply|coated the adhesive agent R is crimped to the board|substrate S2.

Then, by performing the ventilation of the second space 12b, the air pressure difference between the second space 12b and the first space 11b disappears, and the expansion/contraction portion 21 is separated from the substrate S1. The substrate S1 is supported by the second support portion 3 together with the substrate S2 held by the holding portion 3a.

[effect]

According to the present embodiment, even when the substrate S1 is pressed from below the substrate S2 and bonded, the same effects as those of the first embodiment can be obtained. Since the substrate S1 is held by the expansion-contraction portion 21, even when the substrate S1 is pushed up, positional deviation or the like can be prevented.

Further, even if the substrate S3 having the bent portion or the bent portion is used instead of the substrate S2, the substrate S1 can be uniformly bonded to the inner surface of the entire substrate S3 as in the second embodiment.

[Third embodiment to sixth embodiment]

Next, the third embodiment to the sixth embodiment of the substrate bonding apparatus of the present invention will be described in detail with reference to the drawings.

(substrate)

The laminated substrate which is bonded in advance by the substrate bonding apparatus of the present invention will be described. 11(a) to 11(c) are schematic views showing various substrates after bonding. In the substrate bonding apparatus 100 of the present invention, the thin substrate 121 is bonded along the concave surface 120a of the concave substrate 120 by using the adhesive R.

The thin substrate 121 is a touch panel, a decorative film, or an organic electroluminescence (EL) display or a liquid crystal display. The concave substrate 120 is used to protect the thin substrate 121 from glass or propylene. panel. For example, for the purpose of protecting the thin substrate 121, the entire surface of the thin substrate 121 is adhered to the concave substrate 120 by the adhesive R so that the entire surface of the thin substrate 121 is covered by the concave substrate 120.

The thin substrate 121 is a thin substrate having flexibility. In order to attach to the concave surface 120a of the concave substrate 120, it is sufficient that the flexibility is such that it can be bent and deformed along the concave surface 120a.

Further, the concave substrate 120 is a substrate in which at least the side portion 120b is formed by a curved portion or a bent portion and has a concave surface 120a. That is, the substrate on which the concave surface 120a is formed on the surface of the substrate by bending or bending is the concave substrate 120. The central region other than the side portion 120b of the concave substrate 120 may be flat or curved in connection with the side portion 120b. Further, the concave substrate 120 may be entirely lifted up, and the back surface may have a shape unrelated to the concave surface 120a, for example, a flat surface. Further, the pair of side portions 120b facing each other may be erected, or the two side portions 120b facing each other so as to surround the center from the four sides may be erected.

Specifically, the concave substrate 120 includes a substantially tile shape as shown in FIG. 11( a ), and the side portion 120 b as shown in FIG. 11( b ) is substantially at right angles. The font shape and the side portion 120b shown in Fig. 11(c) are substantially U-shaped by the curved portion.

Hereinafter, when it is called only the side part 120b, it is a side part 120b which rises in order to form the concave surface 120a. Further, a space surrounded by the plane including the both ends of the side portion 120b and the concave surface 120a is referred to as a concave space 120c formed by the concave surface 120a.

The adhesive R is not particularly limited as long as it is cured by external energy, and is, for example, a thermosetting resin, a photocurable resin, a radiation curable resin, various resins which are cured by receiving other electromagnetic waves, or hardened by drying. Resin.

(Third embodiment)

(constitution)

This embodiment is basically the same configuration as the above-described first embodiment. In the present embodiment, as shown in FIG. 12, the substrate to be bonded is a concave substrate 120 having a curved portion or a bent portion and having a concave surface 120a as in the above-described side portion 120b. The concave substrate 120 is supported by the second support portion 3 of the second chamber 12. Further, the substrate bonded to the concave substrate 120 is the above-described thin substrate 121.

(effect)

The bonding step of this embodiment as described above is basically the same as that of the first embodiment described above. In particular, in the present embodiment, as shown in FIG. 13, when the stretchable portion 21 presses the substrate S1 to the concave substrate 120, the stretchable portion 21 is deformed into a curved portion or a bent portion with the side edge portion of the concave substrate 120. Matching shapes. Therefore, the thin substrate 121 is self-contained The flat surface of the inner bottom of the concave substrate 120 starts to be bonded along the curved portion or the bent portion of the side edge portion.

(effect)

According to the present embodiment, the thin substrate 121 is pressed against the concave substrate 120 by the elastic member 21 which is not only the flat pressing member but also the elastic film. Therefore, the elastic portion 21 is deformed according to the bonding target. Therefore, even in the case of the concave substrate 120 having the bent portion or the bent portion, the thin substrate 121 can be uniformly bonded to the entire inner surface thereof.

(Modification)

As a modification of the above-described embodiment, as shown in FIG. 14 , the center of the expansion/contraction portion 21 may have a configuration in which the fluid introduction hole 104b is formed as in the embodiment described later. The fluid introduction hole 104b is a hole that communicates with the first space 11b through the first chamber 11 and the electrode portion 22. The fluid introduction hole 104b is connected to a tube 104c that communicates with the atmosphere, and the tube 104c is provided with an opening and closing valve 104d. The fluid introduction hole 104b and the tube 104c correspond to the first ventilation path 11a. With this configuration, the expansion and contraction portion 21 can be introduced into the atmosphere on the concave substrate 120 side more directly. Further, by introducing the atmosphere into the center of the expansion and contraction portion 21, it is possible to apply pressure so that the thin substrate 121 is opened from the center to the side edge portion 120b. Therefore, it is possible to more reliably suppress the case where the respective portions of the thin substrate 121 are adhered to the erroneous portion of the concave substrate 120, wrinkles are formed on the thin substrate 121, or between the thin substrate 121 and the concave substrate 120. An unbonded portion is produced, so that a high quality laminate can be produced.

(Fourth embodiment)

The substrate bonding apparatus 100 of the present embodiment will be described with reference to the drawings. Fig. 15 is a configuration diagram of the substrate bonding apparatus 100 of the embodiment. (a) to (c) of FIG. 16 are configuration diagrams of the pressing mechanism 104 (pressing unit) included in the substrate bonding apparatus 100 of the present embodiment.

(constitution)

As shown in FIG. 15, in the vacuum chamber 109, the substrate bonding apparatus 100 has the holding portion 103 and the pressing mechanism 104 (the pressing unit) face each other at a fixed distance. The outside of the pressing mechanism 104 inside the vacuum chamber 109 corresponds to the second space 12b, and a second ventilation path 12a connected to the vacuum source is provided. The holding portion 103 holds the concave substrate 120 by an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, or various other chuck mechanisms. The pressing mechanism 104 opens the concave surface 120a while bending and deforming the thin substrate 121 in accordance with the concave surface 120a of the concave substrate 120.

As shown in FIGS. 16(a) to 16(c), the pressing mechanism 104 is a bag body 104a as the above-described expansion and contraction portion 21. The bag body 104a has, for example, a larger size than the concave space 120c, but is shaped like the concave space 120c. However, as long as the maximum expandable size is larger than the concave space 120c, the shape of the bag body 104a is not particularly limited. The inside of the bag body 104a corresponds to the first space 11b. Further, it is preferable that the upper portion of the bag body 104a has an adhesive force for holding the thin substrate 121. The adhesive portion having the adhesive force can be attached to the surface of the bag body 104a even if a sheet having an adhesive material such as the above ER fluid is formed as a part of the bag body 104a.

A fluid introduction hole 104b is formed at the bottom of the bag body 104a. Fluid introduction The hole 104b is connected to a tube 104c that communicates with the atmosphere, and the tube 104c is provided with an opening and closing valve 104d. The fluid introduction hole 104b and the tube 104c correspond to the first ventilation path 11a. The bag body 104a reaches the concave surface 120a of the concave substrate 120 during expansion, and further elastically deforms the concave surface 120a while applying pressure to the concave surface 120a.

The bag body 104a having an elastic force includes, for example, a synthetic rubber such as natural rubber, polybutadiene, nitrile or chloroprene, or a fiber such as polyurethane. Further, the fluid introduced into the bag body 104a is not limited to air, and may be a single gas such as nitrogen or oxygen, a mixed gas or a liquid.

The bag body 104a is shrunk, does not enter the thin substrate 121 in contact with the concave surface 120a, and enters the concave space 120c. By expanding, the thin substrate 121 is bent and deformed in such a manner as to face the concave surface 120a from the center of the substrate toward the outside. Therefore, the thin substrate 121 is in close contact with the concave substrate 120 via the adhesive R.

(effect)

In the substrate bonding apparatus 100, as shown in FIG. 16(a), the bag body 104a is first expanded to such an extent that it does not reach the concave substrate 120. By this expansion, on the surface facing the concave substrate 120, there is a flat surface to which the thin substrate 121 can be placed. This flat surface can be referred to as an adhesive portion as described above. The thin substrate 121 is placed on the flat surface. In the case where the surface becomes an adhesive portion, the thin substrate 121 is held by the adhesive force. On the other hand, the concave surface 120a is directed to the bag body 104a, and the concave substrate 120 is held by the holding portion 103.

At this time, the concave substrate 120 and the thin substrate 121 are in the vacuum chamber 109. Opposite. The concave substrate 120 is provided on the thin substrate 121 so as to face the concave surface 120a. The adhesive R is applied to the concave substrate 120, the thin substrate 121, or the opposing faces of the both.

When the opening and closing valve 104d is opened in a state in which the concave substrate 120 and the thin substrate 121 are provided, as shown in FIG. 16(b), the inside of the bag body 104a and the atmosphere are passed through the tube 104c and the fluid introduction hole 104b. Connected. In the bag body 104a communicating with the atmosphere, air flows into the inside of the bag body 104a. The inside of the vacuum chamber 109 is evacuated via the second ventilation path 12a. Therefore, the bag body 104a starts to expand toward the concave surface 120a of the concave substrate 120. At this time, the thin substrate 121 located between the bag body 104a and the concave substrate 120 is pushed up toward the concave substrate 120 as the bag body 104a expands.

Further, the thin substrate 121 is pressed into the concave space 120c formed by the concave surface 120a of the concave substrate 120 as the bag body 104a expands. In the middle of the expansion of the bag body 104a reaching the central region of the concave substrate 120, the inflow amount of the air is adjusted so that the overall shape and size of the bag body 104a are smaller than the concave space 120c of the concave substrate 120. With this adjustment, the thin substrate 121 is not in surface contact with the side portion 120b of the concave substrate 120. Since the surface contact is not performed, the thin substrate 121 is not pressed along the side edge portion 120b of the concave substrate 120 without surface rubbing.

When the air continues to flow into the bag body 104a, the bag body 104a expands in accordance with the concave surface 120a of the concave substrate 120 while being elastically deformed as shown in Fig. 16(c). At this time, the thin substrate 121 is pressed to the concave surface 120a of the concave substrate 120 from the central portion toward the end portion in accordance with the expansion of the concave surface 120a of the bag body 104a. Since the bag body 104a is elastically deformed, the bag body 104a is deformed to stand with the concave substrate 120. The outer side shape of the side portion 120b having the same shape is uniform. Therefore, the thin substrate 121 and the concave substrate 120 are in close contact with each other without a gap. Further, since the centers are closely contacted from the center toward the end portions, no space is formed between the concave substrate 120 and the thin substrate 121.

(effect)

As described above, the pressing mechanism 104 included in the substrate bonding apparatus 100 of the present embodiment has the bag body 104a which is inflated by the concave surface 120a of the concave substrate 120 by the inflow of the fluid. Further, in the process of expanding the bag body 104a, the bag body 104a is brought into the concave space 120c formed by the concave surface 120a of the concave substrate 120 together with the thin substrate 121 before the bag body 104a follows the concave surface 120a. In the process of further expanding the bag body 104a, the thin substrate 121 is opened by the above-described concave surface 120a by the above-described bag body 104a.

According to the pressing mechanism 104, the bag body 104a expands in conformity with the shape of the concave surface 120a. Therefore, even if the side portion 120b of the concave substrate 120 has a difference in individual shape of a curved or bent shape, the bag body 104a can absorb the difference of the individual body. The difference generated does not cause a gap or wrinkle when it is bonded to the thin substrate 121. Therefore, the thin substrate can be bonded to the concave substrate with high precision.

Further, even when the bending or bending shape of the side portion 120b is different or the bending rate or the bending angle is different depending on the type of the concave substrate 120, the bag body 104a conforms to the various concave substrates 120. Since it expands, it is not necessary to prepare a member having a convex shape having a fitting surface that coincides with each of the concave substrates 120 in advance. Therefore, the labor for preparing or replacing the components is saved, and the productivity is improved.

Further, when the thin substrate 121 is pressed into the concave space of the concave substrate 120 In the case of the space 120c, the thin substrate 121 and the side portion 120b of the concave substrate 120 are not in surface contact. Therefore, it is possible to prevent the erroneous portions from sticking to each other, the wrinkles of the thin substrate 121, and the non-adhered portions between the thin substrate 121 and the concave substrate 120. Further, the thin substrate 121 is not pressed along the side portion 120b of the concave substrate 120 while being rubbed by the surface, thereby preventing the adhesive R from flowing out to the outside, thereby preventing a decrease in the adhesive force and a decrease in designability. Short circuit of the adhesive R, etc.

Further, since the bag body 104a expands in accordance with the concave surface 120a of the concave substrate 120, the unbonded portion does not occur, and the thin substrate 121 can be adhered to the entire region with respect to the concave substrate 120. Therefore, when the thin substrate 121 is bonded to the concave substrate 120, a high-quality laminate can be produced.

(Fifth Embodiment)

(a) and (b) of FIG. 17 are configuration diagrams of the pressing mechanism 104 included in the substrate bonding apparatus 100 of the present embodiment. The same components as those in the fourth embodiment are denoted by the same reference numerals and will not be described in detail.

(constitution)

As shown in FIGS. 17(a) and 17(b), the pressing mechanism 104 is provided with an abutting portion 104e inside the bag body 104a. The abutting portion 104e is a long flat plate along the central axis of the concave substrate 120. The central axis of the concave substrate 120 is an axis along the rising side portion 120b.

The abutting portion 104e is fixed to a driving unit (not shown). The drive unit is an actuator that linearly moves the fixture, and the abutting portion 104e enters toward the central axis of the concave substrate 120 held by the holding portion 103. In addition, formed at the front end of the abutting portion 104e A circular portion is formed to prevent the bag body 104a from being pierced. That is, the abutting portion 104e leads the bag body 104a and enters and exits toward the concave substrate 120.

(effect)

In the substrate bonding apparatus 100, before the air flows into the bag body 104a, as shown in FIG. 17(a), the abutting portion 104e is moved in and out toward the concave substrate 120, and the abutting portion 104e is abutted against the concave substrate. The central area of 120. Then, the bag body 104a is guided by the abutting portion 104e, thereby reaching the central region of the concave substrate 120 in advance. That is, the thin substrate 121 is also pressed first to the central region of the concave substrate 120.

When the opening and closing valve 104d is opened in a state in which the abutting portion 104e is abutted, as shown in FIG. 17(b), the bag body 104a is elastically deformed and expands in accordance with the concave surface 120a of the concave substrate 120. At this time, the thin substrate 121 is pressed toward the concave portion 120a of the concave substrate 120 toward the end portion from the central region against which the concave portion 120a of the bag body 104a is expanded.

(effect)

As described above, the pressing mechanism 104 included in the substrate bonding apparatus 100 of the present embodiment further includes an abutting portion 104e that is erected inside the bag body 104a and that abuts against the concave substrate 120. The center of the concave surface 120a. When the abutting portion 104e abuts against the concave surface 120a of the concave substrate 120, the bag body 104a is expanded so as to expand toward the side edge portion 120b of the concave substrate 120.

For example, the fluid is made to flow strongly toward the portion of the bag body 104a that collides with the center of the concave surface 120a, or the film forming the bag body 104a is uneven, and the portion of the bag body 104a that collides with the center of the concave surface 120a is softened or Thinning, thereby making the bag body The 104a expands in such a manner as to expand from the central portion toward the side portion 120b. However, by providing the abutting portion 104e, the thin substrate 121 can be easily opened from the center toward the side portion 120b without complicated fluid control or complicated bag configuration.

Therefore, it is possible to more reliably suppress the respective portions of the thin substrate 121 from being stuck to the erroneous portion of the concave substrate 120, wrinkles on the thin substrate 121, or between the thin substrate 121 and the concave substrate 120. The adhesive portion allows for the manufacture of high quality laminates.

(Sixth embodiment)

(constitution)

The substrate bonding apparatus 100 of the present embodiment will be described with reference to the drawings. (a) to (c) of FIG. 18 are configuration diagrams of the pressing mechanism 104 included in the substrate bonding apparatus 100 of the present embodiment. The same configurations as those of the fourth embodiment and the fifth embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in Figs. 18(a) to 18(c), the pressing mechanism 104 of the present embodiment further includes a center block 104f having a bag body 104a on both sides thereof. The bag body 104a has a larger spatial area than, for example, a concave surface 120a and a side surface of the center block 104f, but is shaped in accordance with the shape of the space area. However, the shape of the bag body 104a is not particularly limited as long as it is most expandable larger than the space area.

The central block 104f presses the central region of the thin substrate 121 to the central region of the concave substrate 120. That is, the center block 104f is a substantially rectangular parallelepiped having an upper surface that follows the surface shape of the central portion of the concave surface 120a. In the case of a substantially rectangular parallelepiped, if the central region of the concave surface 120a is curved, the upper surface is mimicked according to the central region. When the central area of the concave surface 120a is flat, the upper surface is flat in accordance with the central area. The central block 104f is stationary with respect to the side portion 120b of the recessed substrate 120 covered.

On the other hand, the bag body 104a opens the thin substrate 121 in accordance with the concave surface 120a of the concave substrate 120, and closes the side portion of the thin substrate 121 to the rising side portion of the concave substrate 120 without a gap. 120b. Therefore, the fluid introduction hole 104b is formed in each of the bag bodies 104a, and is connected to the atmosphere by the tube 104c opened and closed by the opening and closing valve 104d. The tube 104c passes through the interior of the central block 104f and branches toward each pocket 104a.

In the pressing mechanism 104, the bag body 104a on both sides is reduced, and the thin substrate 121 is not caught in contact with the concave surface 120a and enters the concave space 120c, and is expanded by the bag bodies 104a on both sides. The substrate 121 is bent and deformed so as to conform to the concave surface 120 a from the center of the substrate toward the outside, and the thin substrate 121 is brought into close contact with the concave substrate 120 via the adhesive R.

(effect)

The substrate bonding apparatus 100 first serves as a first step, and as shown in FIG. 18(a), the bag body 104a is left empty without flowing air. Further, the concave portion 120 is provided on the holding portion 103, and the thin substrate 121 is placed on the upper surface of the central block 104f and the bag bodies 104a on both sides.

Next, as a second step, as shown in FIG. 18(b), the holding portion 103 and the pressing mechanism 104 are relatively close to each other. When the pressing mechanism 104 enters the concave space 120c, the thin substrate 121 is also pressed into the concave space 120c. At this time, due to the bag body Since the 104a is empty, the pressing mechanism 104 is smaller than the concave space 120c. Therefore, the thin substrate 121 does not face-contact with the side portion 120b of the concave substrate 120. Since the surface contact is not performed, the thin substrate 121 is not pressed along the side edge portion 120b of the concave substrate 120 without surface rubbing.

The relative approach of the holding portion 103 to the reduced body continues until the central region of the thin substrate 121 is pressed to the central region of the concave substrate 120. For example, the pressing can be sensed by providing a torque sensor or the like at the actuator.

In the third step, when the opening and closing valve 104d is opened, the bag body 104a is inflated as shown in Fig. 18(c). When the air continues to flow into the bag body 104a, the bag body 104a expands in accordance with the concave surface 120a of the concave substrate 120 while being elastically deformed as shown in Fig. 18(c). At this time, the thin substrate 121 is pressed to the concave surface 120a of the concave substrate 120 from the central portion toward the end portion in accordance with the expansion of the concave surface 120a of the bag body 104a. Since the bag body 104a is elastically deformed, the bag body 104a is deformed into an outer shape that matches the surface shape of the rising side edge portion 120b of the concave substrate 120.

Therefore, the thin substrate 121 and the concave substrate 120 are in close contact with each other without a gap. Further, first, the central block 104f presses the thin substrate 121, and secondly, the bag bodies 104a on both sides are inflated, so that the thin substrate 121 is closely adhered from the center toward the end portion, so that the concave substrate 120 and the thin substrate 121 do not overlap. Create space.

(effect)

As described above, in the present embodiment, the pressing mechanism 104 further includes a central block 104f which is fixed with respect to the direction of the rising side portion 120b of the concave surface 120a, and the bag body 104a is located on both sides of the central block 104f, and Expanding to along the concave substrate 120 The side portion 120b has a portion of the concave surface 120a.

According to the pressing mechanism 104, the thin substrate 121 can be simply opened from the center toward the side without using a complicated fluid control or a complicated bag configuration.

Therefore, it is possible to more reliably suppress that the respective portions of the thin substrate 121 are stuck to the erroneous portion of the concave substrate 120, wrinkles are formed in the thin substrate 121, or the spliced between the thin substrate 121 and the concave substrate 120 is not closely adhered. The part makes it possible to produce a high quality laminate.

(Modification)

In the present embodiment, the bag body 104a is disposed on both sides of the center block 104f. However, the center block 104f may not necessarily be the center block 104f, and the other bag body 104a may be disposed instead of the center block 104f. That is, three or more pockets 104a may be arranged. By introducing a gas into the center bag body 104a, the center area of the thin substrate 121 is first pressed to the center area of the concave substrate 120 as in the abutting portion 104e of the second embodiment, and then the two sides are The bag body 104a introduces a gas to open the thin substrate 121 to the outside. Thereby, the same operational effects as those of the fifth embodiment or the sixth embodiment can be obtained. Further, in each of the above embodiments, the vacuum chamber 109 may be evacuated or the bag body 104a may be evacuated before the bonding. At the time of bonding, the opening and closing valve 104d can be opened while maintaining the vacuum of the vacuum chamber 109, whereby the atmosphere flows into the bag body 104a, and is expanded and bonded as described above. Further, when the bag body 104a is evacuated, the mounting surface may be formed in a thickness or material that does not shrink in order to secure a flat surface to which the thin substrate 121 can be placed.

[Other Embodiments]

The present invention is not limited to the above embodiments. For example, the following forms are also included in the present invention.

(1) The expansion/contraction portion may have an adhesive force for holding the substrate and a stretchability of pressing the substrate to the opposing substrate, and is not limited to the ER fluid. Further, instead of the electrostatic chuck of the above embodiment, an ER fluid and an electrode portion whose adsorption force is changed by energization may be used.

(2) The vacuum source and the switching unit as the pressure adjusting unit may be separately provided in the first air passage and the second air passage, and the configuration may be simplified by using a common vacuum source and a switching unit. In the case of the sharing, the switching unit is configured to switch between the ventilation of either the first ventilation path and the second ventilation path, and the ventilation of both.

(3) The type of the resin used in the adhesive is not limited to the ultraviolet curable resin. Various resins such as a resin which is hardened by electromagnetic waves or a thermosetting resin can be used. In this case, various methods such as irradiation of electromagnetic waves, temperature change (heating, cooling), and air blowing are applied to the method of curing treatment depending on the type of resin. Therefore, the treatment when the adhesive is temporarily cured is also different depending on the resin. Further, it is not necessary to carry out temporary hardening of the adhesive.

(4) The bonding of the substrate can be carried out in a vacuum or in the atmosphere. That is, as long as a difference in pressure is generated between the first space and the second space, it is not necessary to use a vacuum. For example, instead of a vacuum source such as a vacuum pump, a pressurizing pump can be used for pressurization. In other words, the pressure adjusting unit may be a vacuum source (such as a vacuum pump) or a pressurized source (such as a pressurizing pump) to constitute the present invention. In the above embodiment, by the first The pressure source (pressure pump) connected to the air passage 11a raises the pressure in the first space 11b, whereby the expansion/contraction portion 21 can be expanded toward the substrate S2 side, and the surface of the substrate S1 to which the adhesive R adheres can be attached. Pressing to the substrate S2. A pressurized source may be connected to the first ventilation path 11a, and a vacuum source may be connected to the second ventilation path 12a. Further, the gas for generating the gas pressure difference is not limited to the atmosphere as described above.

For example, in each of the embodiments, the concave substrate 120 and the thin substrate 121 are bonded together in a vacuum. However, the present invention is not limited thereto, and the bonding may be performed under atmospheric pressure. Even in the atmospheric pressure, if the gas is introduced into the bag body 104a so that the bag body 104a expands outward from the central portion, the gas is less likely to remain in the bag body 104a.

In addition, the atmosphere is introduced into the bag body 104a by decompression such as vacuum, and the gas may be introduced into the bag body 104a by a pump such as a compressor. Even in this case, the bonding can be carried out either in a vacuum or at atmospheric pressure.

When the ER fluid as the adsorption member is used for the bag body, the electrode portion may be built in the bag body. The electrode connected to the power source may be disposed in the bag body and connected to the ER fluid, thereby ensuring the electrical conduction between the ER fluid and the power source to obtain the adsorption force when the bag body contracts. A part of the electrode may also serve as a flexible wiring that expands and contracts with the bag body. Further, a contact which is opened and closed according to expansion and contraction of the bag body may be provided in the electrode, and after the bag body is inflated to bond the substrate, the electrical conduction is immediately cut off to lower the adsorption force.

(5) As a substrate to be bonded, a cover or a touch panel, a liquid crystal module, an organic EL module, a display panel and a backlight constituting the modules, and the like are typical examples. However, as long as it can be a pair of attached objects, regardless of its size, shape, Material can be used. For example, it can also be applied to various members constituting a display device, a semiconductor wafer, an optical disk, and the like. The adhesive can be freely attached to any of the substrates, and is not only applicable to the case where one of the adhesives is attached to the substrate, but also applied to both of them. Further, it is also applicable to a case where one substrate is pressure-bonded to another substrate without using an adhesive. This crimping also includes the case where the closely connected substrates are continuously pressed at atmospheric pressure.

(6) The above embodiments are not intended to limit the scope of the invention. It is to be understood that the scope of the invention is not limited by the scope of the invention and the scope of the invention.

1‧‧‧ chamber

2‧‧‧1st Support Department

3‧‧‧2nd Support Department

11‧‧‧1st chamber

11a‧‧‧1st ventilation path

11b‧‧‧1st space

11c, 12c‧‧‧ Pressure Adjustment Department

12‧‧‧2nd chamber

12a‧‧‧2nd ventilation path

12b‧‧‧2nd space

21‧‧‧Flexing Department

22‧‧‧Electrode

M‧‧‧Substrate bonding device

R‧‧‧Adhesive

S1, S2‧‧‧ substrate

Claims (13)

A substrate bonding apparatus comprising: a chamber that houses a first substrate and a second substrate to be bonded together; a first support portion that supports the first substrate in the chamber; and a second support portion The second substrate is supported at a position facing the first substrate in the chamber, wherein a first space on a side opposite to a support side of the first substrate of the first support portion is provided in the chamber; a first space in which the first substrate and the second substrate face each other, and the first support portion includes an expansion-contraction portion that separates the first space from the second space and holds the first substrate. Further, the expansion/contraction portion is expanded by a pressure higher than the first space, and the first substrate is pressed against the second substrate. The substrate bonding apparatus according to claim 1, wherein all or a part of the expansion/contraction portion is an elastic body whose adsorption force is changed by energization, and the first support portion includes an electrode that energizes the expansion and contraction portion. unit. The substrate bonding apparatus according to claim 1, wherein the chamber is divided into: the first chamber has the first space, and the first support portion is provided; And the second chamber has the second space, and the second support portion is provided, and the expansion/contraction portion is sandwiched by a portion closed by the first chamber and the second chamber. The bonding apparatus according to claim 1, wherein the expansion and contraction portion has a bag shape. The substrate bonding apparatus according to claim 1, comprising: a first ventilation path for supplying the exhaust gas to the first space; and a second ventilation path for supplying the exhaust gas to the second space, wherein the first ventilation path is At least one of the air passage and the second air passage is connected to the pressure adjusting unit, and the pressure adjusting unit adjusts the pressure of the first space or the second space to switch the expansion and contraction of the expansion/contraction unit. The substrate bonding apparatus according to claim 5, wherein the pressure adjusting unit includes a vacuum source. The substrate bonding apparatus according to claim 5, wherein the pressure adjusting unit includes a pressure source. The substrate bonding apparatus according to claim 1, comprising a temporary curing treatment unit that temporarily cures an adhesive adhering to at least one of the first substrate and the second substrate. A substrate bonding method characterized in that an expansion and contraction portion that partitions a chamber into a first space and a second space is in the second space The first substrate is held in between, and the expansion/contraction portion supports the second substrate at a position facing the first substrate in the second space, and the expansion and contraction portion is expanded by a pressure difference between the first space and the second space. Thereby, the first substrate is pressed to the second substrate. The substrate bonding method according to claim 9, wherein the first substrate is a concave substrate having a concave surface, the second substrate is a flexible thin substrate, and the expansion/contraction portion is a bag-shaped bag. The substrate bonding method includes the steps of: flowing a fluid into the first space inside the bag body, expanding the bag body to simulate the concave surface of the concave substrate; and performing the step of expanding the bag body Before the bag body is modeled on the concave surface, the bag body and the thin substrate are integrated into the concave space formed by the concave surface of the concave substrate, and the bag body is used in the process of further expanding the bag body. The thin substrate is opened in the same manner as the concave surface. The substrate bonding apparatus according to claim 4, wherein the first substrate is a concave substrate having a concave surface, and the second substrate is a flexible thin substrate, and the bag-shaped expansion and contraction portion is formed. In the process of expanding in accordance with the concave surface of the concave substrate, the expansion and contraction portion and the thin substrate are collectively entered into the concave space formed by the concave surface of the concave substrate before the expansion and contraction portion is patterned. In the process of further expanding the expansion/contraction portion, the thin substrate is opened by the expansion and contraction portion in accordance with the concave surface. The substrate bonding apparatus according to claim 11, wherein the expansion and contraction portion further includes a central block, and a portion located on both sides of the central block is expanded to have a side portion along the concave substrate. The part of the concave surface. The substrate bonding apparatus according to claim 1, wherein the expansion and contraction portion further includes an abutting unit, wherein the abutting unit can abut against a center of the first substrate, and the abutting unit abuts against the abutting unit After the center of the first substrate, the first substrate is expanded to expand toward the first substrate.