TWI643696B - Bonding/debonding device and bonding method and debonding method for using the same - Google Patents

Abstract

A removal device and a removal method and a bonding method for applying the same. The removing bonding device is adapted to remove a first substrate from a second substrate or to bond the first substrate to the second substrate, and the removing bonding device comprises a loading platform, a flexible fixing member and a Supporting element. The stage is used to fix the first substrate. A flexible fixture is used to secure the second substrate. The support member connects the stage and the flexible fixture, and the stage and the flexible fixture are spaced apart by a distance. A first variable pressure chamber is formed between the stage, the flexible fixture and the support member. The first variable pressure chamber has a first inlet and outlet port.

Description

Removal of the bonding device and removal method and bonding method using the same

The present invention relates to a take-off device and a method for attaching and attaching the same, and more particularly to a device suitable for removing a substrate from another substrate or bonding the substrate to another substrate. The method of applying this device.

In the soft electronic component industry, the fabrication of components is primarily done in a sheet to sheet process. After completing the process steps, the problem that must be faced is how to smoothly remove the substrate required for the final product. In addition, the removed substrate often needs to be attached with a protective film or a functional film, but it is easy to fit in the bonding work. When the removed substrate is deformed due to internal stress, the problem of uneven bonding is caused.

One method is that a soft member is adsorbed on one of the substrates to be removed, and the soft member has a plurality of variable pressure compartments, and the soft member can be scratched by pumping the variable pressure compartments. Curved deformation. Thereby, the substrate fixed to the flexible member is pulled up by the deformation of the soft member. Although the substrate can be separated in this manner, the substrate is easily warped after being removed due to the internal stress of the substrate, which causes difficulty in bonding the subsequent protective film. Further, if the adhesion between the substrates is large, the substrate is likely to be excessively stressed. The substrate is damaged, and even the substrate is broken.

The embodiment of the invention provides a method for removing the bonding device, so as to solve the problem of damage to the substrate caused by excessive force during the operation of removing or laminating the substrate, thereby helping to improve the yield of the removed substrate.

The detaching and bonding device disclosed in the embodiment of the invention is adapted to remove a first substrate from a second substrate or to bond the first substrate to the second substrate. Remove the fitting device and include A stage, a flexible fixing member and a supporting member. The stage is used to fix the first substrate. A flexible fixture is used to secure the second substrate. The support member connects the stage and the flexible fixture, and the stage and the flexible fixture are spaced apart by a distance. A first variable pressure chamber is formed between the stage, the flexible fixture and the support member. The first variable pressure chamber has a first inlet and outlet port.

The removing method disclosed in the embodiment of the present invention is for removing a first substrate from a second substrate, and the removing method comprises the following steps: providing the removing device as described above, and the first The substrate is fixed to the stage, the second substrate is fixed to the flexible fixing member, a first internal pressure in the first variable pressure chamber is increased, and the flexible fixing member is deflected away from the carrier to separate a first substrate and a second substrate.

The bonding method disclosed in the embodiment of the present invention is for bonding a first substrate to a second substrate, and the bonding method comprises the following steps: providing the removing device as described above, and the first Fixing the substrate on the stage, fixing the second substrate to the flexible fixing member, reducing a first internal pressure in the first variable pressure chamber, and flexing the flexible fixing member toward the carrier plate to The second substrate is bonded to the first substrate.

The removing and fitting device and the method thereof are disclosed in the embodiment of the present invention, by adjusting the gas pressure in the first variable pressure chamber to generate a pressure difference on opposite sides of the flexible fixing member, so that the flexible fixing member The substrate can be flexed together for the removal or bonding operation.

The above description of the embodiments of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

91‧‧‧First substrate

92‧‧‧second substrate

100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100, 1200a, 1200b, 1300, 1400, 1500, 1600‧‧‧ Remove the fitting device

110, 210, 310, 410, 510, 610, 710, 810, 910, 1010, 1110, 1210, 1310, 1410, 1510, 1610‧‧‧

110a, 210a, 310a, 410a, 510a, 610a, 710a, 810a, 910a, 1010a, 1110a, 1210a, 1310a, 1410a, 1510a, 1610a ‧ ‧ first inlet and outlet

110b, 210b, 310b, 410b, 510b, 610b, 710b, 810b, 910b, 1010b, 1110b, 1210b, 1310b, 1410b, 1510b, 1610b‧‧‧ suction port

120, 220, 320, 420, 520, 620, 720, 820, 920, 1020, 1120, 1220, 1320, 1420, 1520, 1620‧‧‧ support elements

121, 221, 321, 421, 521, 621, 721, 821, 921, 1021, 1121, 1221, 1321, 1421, 1521, 1621‧‧‧

130, 230, 330, 430, 530, 630, 730, 830, 930, 1030, 1130, 1230, 1330, 1430, 1530, 1630 ‧ ‧ flexible fasteners

140, 240, 340, 440, 540, 640, 740, 840, 940, 1040, 1040, 1240, 1340, 1440, 1540, 1640‧‧‧ first variable pressure chamber

250‧‧‧Porosive material layer

325, 425, 525, 625, 725, 825, 925, 1025, 1125, 1225, 1325, 1425, 1525, 1625 ‧ ‧ upper cover

450, 560, 950 ‧ ‧ pre-stripping components

550, 650, 750, 1250, 1350, 1450, 1550‧‧‧ second variable pressure chamber

525a, 625a, 725a, 825a, 1225a, 1325a, 1425a, 1521a, 1625a‧‧‧ second inlet and outlet

561‧‧‧ linkage rod

563‧‧‧Sucker

760, 860‧ ‧ absorbing parts

951‧‧‧ drive parts

953‧‧‧Wedge type shovel head

1050‧‧‧ Height adjustment mechanism

1023‧‧‧ bottom

1060‧‧‧Aperture seals

1261‧‧‧ Track pieces

1263, 1265‧‧‧ Limits

1265a‧‧‧Fitting surface

1265a1‧‧‧ concave

1265a2‧‧ ‧ convex

1360, 1460‧‧‧ flex limit components

1360a‧‧‧ hardware

1360b‧‧‧Software

1460a‧‧‧ shaft parts

1460b‧‧‧Connecting parts

1560‧‧‧Displacement Monitoring Module

1561‧‧‧Displacement monitor

1563‧‧‧Flexible conductive plates

1631‧‧‧Variable pressure compartment

P1‧‧‧ first internal pressure

P2‧‧‧Second internal pressure

P3‧‧‧ internal pressure

D1~d4‧‧‧distance

T0~T4‧‧‧ time point

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing the first embodiment of the present invention with the removal of the bonding apparatus before the second substrate is removed from the first substrate.

2 is a schematic view showing a process of removing a second substrate from a first substrate in a bonding apparatus according to a first embodiment of the present invention.

3 is a schematic view showing a process of attaching a second substrate to a first substrate in a bonding apparatus according to a first embodiment of the present invention.

4 is a schematic view showing a process of removing a second substrate from a first substrate in a bonding apparatus according to a second embodiment of the present invention.

5A is a schematic cross-sectional view showing the second substrate before being removed from the first substrate in the bonding apparatus according to the third embodiment of the present invention.

5B is a schematic view showing a process of removing the second substrate from the first substrate in the bonding apparatus according to the third embodiment of the present invention.

Fig. 6 is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the fourth embodiment of the present invention.

7A is a schematic cross-sectional view showing the second substrate before being removed from the first substrate in the bonding apparatus according to the fifth embodiment of the present invention.

7B is a schematic view showing the pre-cracking of the second substrate before the second substrate is removed from the first substrate according to the fifth embodiment of the present invention.

Figure 8A is a cross-sectional view showing the second substrate before being removed from the first substrate in the bonding apparatus according to the sixth embodiment of the present invention.

Figure 8B is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the sixth embodiment of the present invention.

9A to 9E are timing charts for removing the first internal pressure and the second internal pressure in the bonding apparatus according to the sixth embodiment of the present invention.

Figure 10 is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the seventh embodiment of the present invention.

Figure 11 is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the eighth embodiment of the present invention.

Figure 12 is a schematic view showing the pre-cracking of the second substrate before the second substrate is removed from the first substrate in the detaching bonding apparatus according to the ninth embodiment of the present invention.

13A to 13B are schematic views showing a process of removing a second substrate from a first substrate in a bonding apparatus according to a tenth embodiment of the present invention.

Figure 14 is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the eleventh embodiment of the present invention.

Figure 15 is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the twelfth embodiment of the present invention.

Figure 16A is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the thirteenth embodiment of the present invention.

Figure 16B is a partially enlarged schematic view of the constraining member of Figure 16A in accordance with the present invention.

Figure 17A is a cross-sectional view showing the second substrate before being removed from the first substrate in the bonding apparatus according to the fourteenth embodiment of the present invention.

Figure 17B is a top plan view of the flexure limit assembly of Figure 17A in accordance with the present invention.

Figure 17C is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the fourteenth embodiment of the present invention.

Figure 17D is a partial enlarged view of Figure 17C in accordance with the present invention.

Figure 18A is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the fifteenth embodiment of the present invention.

Figure 18B is a partial enlarged view of Figure 18A in accordance with the present invention.

Figure 19 is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the sixteenth embodiment of the present invention.

Fig. 20A is a schematic view showing the second substrate before being removed from the first substrate in the detaching bonding apparatus according to the seventeenth embodiment of the present invention.

Figure 20B is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the seventeenth embodiment of the present invention.

The content of the present invention is described in detail in the following embodiments, which are sufficient for any person skilled in the art to understand the technical contents of the present invention and implement it according to the contents of the present specification, the scope of the patent application, and the drawings. The technique of the present invention can be easily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

Referring to FIG. 1, a cross-sectional view of a first embodiment of the present invention is performed before the second substrate is removed from the first substrate. 1 illustrates a removal of the bonding apparatus 100 for removing a first substrate 91 from a second substrate 92 or bonding the first substrate 91 to the second substrate 92, but the present invention is not Limited. For example, in other embodiments in which the first substrate 91 and the second substrate 92 are oppositely adjusted, it can be understood that the second substrate 92 is removed from the first substrate 91 or the second substrate 91 is attached. To the first substrate 91. The first substrate 91 and the second substrate 92 referred to herein may be, but not limited to, a protective film layer, a soft panel layer, or a glass material layer (plate).

In this embodiment, the removal of the bonding apparatus 100 includes a stage 110, a support member 120, and a flexible fixture 130. The support member 120 connects the stage 110 and the flexible fixture 130. Specifically, the support member 120 includes a plurality of side wall portions 121 that are connected to each other and that are erected on the stage 110. The opposite sides of the flexible fixing member 130 are connected to the side wall portion 121 of the supporting member 120 and spaced apart from the stage 110 by a distance d1. The flexible fixing member 130 described herein may be, but not limited to, a material having elastic deformation ability or flexibility such as rubber or silicone.

Further, the stage 110, the side wall portion 121 of the support member 120, and the flexible fixing member 130 are collectively formed around a first variable pressure chamber 140. The first variable pressure chamber 140 has a first inlet and outlet port 110a, and the first inlet and outlet port 110a can be connected to a pressure regulating device (not shown). The pressure regulating device may change the first internal pressure P1 of the first variable pressure chamber 140 by inhaling or pumping the first inlet and outlet port 110a. In the present embodiment, the first inlet and outlet port 110a is formed on the stage 110, but the position of the first inlet and outlet port 110a is not in the present invention. As long as it is possible to communicate the first variable pressure chamber 140 with the design of the pressure regulating device, it is within the scope of the present invention. For example, in other embodiments, the first inlet and outlet port 110a may also be formed on the support member 120.

Furthermore, in the embodiment, the first substrate 91 may be a flexible panel layer and stacked on the stage 110. The stage 110 has a plurality of intake ports 110b, and the first substrate 91 is provided on the stage 110 corresponding to the intake ports 110b. The air inlet 110b can be connected to the aforementioned pressure regulating device or connected to another pressure regulating device (not shown), and can suck the air inlet 110b to generate a suction airflow at the air inlet 110b, that is, inhale. Port 110b provides a negative pressure. Thereby, the first substrate 91 can be adsorbed and fixed to the stage 110 via the suction airflow at the intake ports 110b. The second substrate 92 may be a layer (plate) of glass material, and may be, but not limited to, fixed to the flexible fixture 130 by adhesive bonding. However, it can be understood that the fixing manner of the first substrate 91 and the second substrate 92 is not intended to limit the present invention, as long as the first substrate 91 and the second substrate 92 can be stably disposed on the stage 110 and flexibly fixed. The design of the piece 130 is within the scope of the invention. For example, in other embodiments, the first substrate 91 and the second substrate 92 may be respectively fixed to the stage 110 and the flexible fixture 130 by bonding. Alternatively, in other embodiments, the flexible fixture 130 may also have a design similar to the suction port 110b on the aforementioned stage 110, and may directly adsorb the second substrate 92 via an external pressure adjusting device. In addition, in other embodiments, the first substrate 91 may also be a layer of glass material (plate), and the second substrate 92 may also be a flexible panel layer, and the invention is not limited thereto.

Next, a procedure of applying the above-described removal of the bonding apparatus 100 to perform the removal operation will be described. Referring to FIG. 2, a schematic view of a process of removing a second substrate from a first substrate in a bonding apparatus according to a first embodiment of the present invention.

First, the first internal pressure P1 in the first variable pressure chamber 140 is increased by the manner in which the pressure adjusting device injects the first inlet and outlet port 110a, and the first internal pressure P1 is boosted to be greater than the ambient pressure. To the extent that the first internal pressure P1 is greater than the external pressure (eg, atmospheric pressure) outside the first variable pressure chamber 140, thereby causing the first variable pressure chamber 140 to communicate with the outside There is a pressure difference between the environments. In this case, the second substrate 92 and the flexible fixing member 130 are collectively deflected by the pressure difference, so that the second substrate 92 is separated from the first substrate 91. Meanwhile, in the process of removing the second substrate 92 from the first substrate 91, the surface on which the first substrate 91 and the second substrate 92 are separated is subjected to gas pressure, that is, the separation surface of the first substrate 91 is uniformly oriented. The lower gas pressure counteracts the stress that the first substrate 91 is pulled upward by the second substrate 92, and the total stress of the first substrate 91 can be reduced. Thereby, it is helpful to improve the problem that the substrate is damaged due to excessive stress during the removal process of the substrate in the conventional method. In addition, according to the result of the simulation experiment, when the first internal pressure P1 of the first variable pressure chamber 140 of the present embodiment is boosted to 20 times atmospheric pressure, the removal process is completed, and the stress on the substrate is compared with The prior art removal method can be reduced by at least 20%.

Next, the steps of applying the above-described removal of the bonding apparatus 100 to perform the bonding work will be described. Please refer to FIG. 3, which is a schematic diagram of a process of removing a second substrate from a bonding apparatus to a first substrate according to a first embodiment of the present invention.

Different from the above-mentioned removal operation, in the bonding industry, the first substrate 91 is fixed to the carrier 110 and the second substrate 92 is fixed in a state where the first substrate 91 and the second substrate 92 are separated from each other. In the flexible fixture 130. Next, the first inlet and outlet port 110a is evacuated by the pressure adjusting device to reduce the first internal pressure P1 in the first variable pressure chamber 140, and the first internal pressure P1 is depressurized to a level less than the ambient pressure. That is, a pressure difference is generated between the first variable pressure chamber 140 and the external environment, and the second substrate 92 and the flexible fixing member 130 are collectively deflected downward by the pressure difference to be second. The substrate 92 is attached to the first substrate 91.

Next, another embodiment of the detaching bonding apparatus which is also applicable to the removal of the first substrate 91 from the second substrate 92 or the bonding of the first substrate 91 to the second substrate 92 in the present invention will be described below. It should be noted that the descriptions of the first substrate 91 and the second substrate 92 in the following embodiments are the same as those in the first embodiment, and will not be described again. Further, the steps in the following embodiments regarding the removal operation and the bonding work are substantially similar to those described in the first embodiment unless otherwise specified.

For example, please refer to FIG. 4, which is a schematic diagram of the process of removing the second substrate from the first substrate in the bonding apparatus according to the second embodiment of the present invention.

FIG. 4 illustrates a removal of the bonding apparatus 200, which is substantially similar in structure to the removal of the bonding apparatus 100 of the first embodiment, and includes a stage 210, a support member 220, and a flexible fixing. Piece 230. The support member 220 includes a plurality of side wall portions 221 that are connected to each other and that are erected on the stage 210. The opposite sides of the flexible fixing member 230 are connected to the side wall portion 221 of the supporting member 220 and spaced apart from the stage 210 by a distance d1. The flexible fixing member 230 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

The stage 210 and the side wall portion 221 of the supporting member 220 and the flexible fixing member 230 are integrally formed to form a first variable pressure chamber 240. The first variable pressure chamber 240 has a first inlet and outlet port 210a on the stage 210. The first inlet and outlet port 210a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P1 of 240. The stage 210 has a plurality of air inlets 210b connected to the aforementioned pressure regulating means for generating a suction airflow at the air inlet 210b. The first substrate 91 is interposed between the flexible fixture 230 and the carrier 210, and the second substrate 92 can be, but is not limited to, adhesively fixed to the flexible fixture 230.

The main difference between the embodiment and the first embodiment is that the removal device 200 of the embodiment further includes a porous material layer 250 disposed on the stage 210, and the first substrate 91 is stacked on the substrate. The porous material layer 250, that is, the porous material layer 250 is interposed between the stage 210 and the flexible fixture 230. The porous material layer 250 described herein may be, but not limited to, a material having a porous material such as foam. In detail, the porous material layer 250 is disposed on the stage 210 corresponding to the plurality of suction ports 210b, and the suction airflow generated at the suction port 210b can be formed by a porous structure flowing through the porous material layer 250. It is evenly dispersed on the surface of the first substrate 91. Thereby, the first substrate 91 can be firmly adsorbed on the porous material layer 250 via the porous material layer 250. In more detail, due to the porosity of the porous material layer 250 The size is much smaller than the size of the air inlet 210b, and the number is much larger than the number of the air inlets 210b. Therefore, the suction airflow of the air inlet 210b can be uniformly dispersed to cover the surface of the first substrate 91, thereby avoiding suction airflow adsorption. A problem of stress concentration occurs at the surface of the first substrate 92.

In addition, in this embodiment or other embodiments, in order to match the dimensional shape of the first substrate 91, a portion of the porous material layer 250 may be covered by a patterning process to avoid attraction on the porous material layer 250. The airflow emanates from the portion not covered by the first substrate 91, and the adsorption force to the first substrate 91 is lowered.

5A to 5B, FIG. 5A is a schematic cross-sectional view of the second substrate before being removed from the first substrate in the bonding apparatus according to the third embodiment of the present invention, and FIG. 5B is a diagram according to the present invention. A schematic view of the process of removing the second substrate from the first substrate in the bonding apparatus in the third embodiment.

FIG. 5A illustrates a detachable bonding apparatus 300 having a structure substantially similar to that of the detaching bonding apparatus 100 of the first embodiment, including a stage 310, a support member 320, and a flexible fixing. Pieces 330. The support member 320 includes a plurality of side wall portions 321 that are connected to each other and that are erected on the stage 310. The opposite sides of the flexible fixing member 330 are coupled to the side wall portion 321 of the support member 320 and maintained at a distance d1 from the stage 310. The flexible fixing member 330 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

The first variable pressure chamber 340 is formed around the stage 310, the side wall portion 321 of the supporting member 320, and the flexible fixing member 330. The first variable pressure chamber 340 has a first inlet and outlet port 310a on the stage 310. The first inlet and outlet port 310a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P1 of 340. The stage 310 has a plurality of air inlets 310b, and the air inlets 310b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 310b. 310. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 230 in an adhesive manner.

The main difference between this embodiment and the first embodiment is that the support member 320 in the removal of the bonding device 300 may include an upper cover portion 325 in addition to the plurality of side wall portions 321 . Specifically, the upper cover portion 325 is provided on the side of the side wall portion 321 opposite to the stage 310, that is, the side wall portion 321 is interposed between the upper cover portion 325 and the stage 310. In addition, the upper cover portion 325 is maintained at a distance d2 from the flexible fixture 330. As shown in FIG. 5B, in the removing operation, by the arrangement of the upper cover portion 325, the upward deflection amount of the flexible fixing member 330 can be restricted to prevent the flexible fixing member 330 from being excessively deflected. The second substrate 92 attached thereto is caused to be bent and broken due to excessive deflection.

Next, referring to FIG. 6, a schematic view of the process of removing the second substrate from the first substrate in the bonding apparatus according to the fourth embodiment of the present invention.

FIG. 6 illustrates a removal of the bonding apparatus 400, which is substantially similar in structure to the removal of the bonding apparatus 300 of the third embodiment, and includes a stage 410, a support member 420, and a flexible fixing. Piece 430. The support member 420 includes a plurality of side wall portions 421 and an upper cover portion 425. The side wall portions 421 are connected to each other and are erected on the stage 410, and the upper cover portion 425 is disposed on the side of the side wall portion 421 opposite to the stage 410, that is, the side wall portion 421 is interposed between the upper cover portion 425 and the stage 410. between. The opposite sides of the flexible fixing member 430 are connected to the side wall portion 421 of the supporting member 420 and spaced apart from the stage 410 by a distance d1. The upper cover portion 425 and the flexible fixing member 430 are maintained at a distance d2. However, in the embodiment, the upper cover portion 425 is optional, and the user can set it according to actual needs. The flexible fixing member 430 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

The first variable pressure chamber 440 is formed around the stage 410, the side wall portion 421 of the supporting member 420 and the flexible fixing member 430. The first variable pressure chamber 440 has a first inlet and outlet port 410a on the stage 410. The first inlet and outlet port 410a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P1 of 440.

The stage 410 has a plurality of air inlets 410b, and the air inlets 410b can be connected to the aforementioned pressure adjusting device to discharge the first substrate by sucking the air inlets 410b. 91 is firmly adsorbed on the stage 410. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 430 in an adhesive manner.

The main difference between the embodiment and the third embodiment is that the detaching and pasting device 400 of the embodiment further includes a pre-separating element 450 disposed on the side wall portion 421. The pre-separation element 450 described herein can be a high pressure nozzle. An impact gas flow can be generated to the first variable pressure chamber 440 by externally connecting the high pressure nozzle 450 to a gas generating device (not shown). Therefore, the user can apply a gas having an impact force to the edge of the first substrate 91 and the second substrate 92 at a high pressure nozzle 450 before the removal operation, so as to generate a pre-fabrication at the bonding portion. Rift 97. Thereby, when the subsequent removal operation is facilitated, the second substrate 92 can be peeled off from the pre-crack 97 and removed from the first substrate 91 more quickly.

7A-7B, FIG. 7A is a cross-sectional view of the second substrate in the bonding apparatus according to the fifth embodiment of the present invention, before the second substrate is removed from the first substrate, and FIG. 7B is in accordance with the present invention. In the fifth embodiment, a schematic diagram of pre-cracking before the second substrate is removed from the first substrate in the bonding apparatus is removed.

FIG. 7A illustrates a detachable bonding apparatus 500 having a structure substantially similar to that of the detaching bonding apparatus 400 of the fourth embodiment, including a stage 510, a support member 520, and a flexible fixing. A piece 530 and a pre-stripping element 560. The support member 520 includes a plurality of side wall portions 521 and an upper cover portion 525. The side wall portions 521 are connected to each other and are erected on the stage 510, and the upper cover portion 525 is disposed on the side of the side wall portion 521 opposite to the stage 510, that is, the side wall portion 521 is interposed between the upper cover portion 525 and the stage 510. between. The opposite sides of the flexible fixing member 530 are connected to the side wall portion 521 of the supporting member 520, and are respectively separated from the loading table 510 and the upper cover portion 525 by a distance d1 and a distance d2. The pre-separation element 560 is disposed on the support element 520. The flexible fixing member 530 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 540 is formed around the stage 510, the side wall portion 521 of the support member 520, and the flexible fixing member 530. Upper cover portion 525 and flexible fixing member 530 A second variable pressure chamber 550 can be formed around the circumference. The first variable pressure chamber 540 has a first inlet and outlet port 510a on the stage 510, and the second variable pressure chamber 550 has a second inlet and outlet port 525a on the upper cover portion 525. The first inlet and outlet port 510a and the second inlet and outlet port 525a are both connected to a pressure regulating device (not shown) for changing the first internal pressure P1 of the first variable pressure chamber 540 and the second variable pressure chamber 550. The second internal pressure P2. However, in the embodiment, the second inlet and outlet port 525a is optional, and the user can set according to actual needs. The stage 510 has a plurality of air inlets 510b. The air inlets 510b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage 510. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 530 in an adhesive manner.

The main difference between the present embodiment and the fourth embodiment is that the pre-separation element 560 of the removing device 500 of the embodiment includes a linkage rod 561 and a suction cup 563. Specifically, one end of the linkage rod 561 is movably disposed on the upper cover portion 525, and the suction cup 563 is coupled to the linkage rod 561 and is attracted to the flexible fixing member 530. Therefore, as shown in FIG. 7B, before the removal operation, the suction rod 563 can be linked in advance by the linkage rod 561 to move upward, so as to drive the flexible fixing member 530 to warp one side of the second substrate 92 upward. A pre-crack 97 is formed between the second substrate 92 and the first substrate 91. Thereby, when the removal operation is performed, the second substrate 92 can be detached from the first substrate 91 from the pre-crack 97 and can be removed from the first substrate 91 more quickly.

However, it can be understood that the position of the pre-separation member 560 is not limited to the embodiment as long as the linkage rod 561 can be linked to the suction cup 563 to flexibly deform the flexible fixing member 530. For example, in other embodiments, the linkage rod 561 of the pre-separation element 560 can also be selectively disposed on the side wall portion 521.

8A-8B, FIG. 8A is a cross-sectional view of the second substrate in the bonding apparatus according to the sixth embodiment of the present invention, before the second substrate is removed from the first substrate, and FIG. 8B is in accordance with the present invention. A schematic view of the process of removing the second substrate from the first substrate in the bonding apparatus in the sixth embodiment. 9A to 9E are timing charts for removing the first internal pressure and the second internal pressure in the bonding apparatus according to the sixth embodiment of the present invention.

FIG. 8A illustrates a detachable bonding apparatus 600 having a structure substantially similar to that of the detaching bonding apparatus 300 of the third embodiment, including a stage 610, a support member 620, and a flexible fixing. Piece 630. The support member 620 includes a plurality of side wall portions 621 and an upper cover portion 625. The side wall portions 621 are connected to each other and are erected on the stage 610, and the upper cover portion 625 is disposed on the side of the side wall portion 621 opposite to the stage 610, that is, the side wall portion 621 is interposed between the upper cover portion 625 and the stage 610. between. The opposite sides of the flexible fixing member 630 are connected to the side wall portion 621 of the supporting member 620, and are respectively separated from the loading table 610 and the upper cover portion 625 by a distance d1 and a distance d2. The flexible fixing member 630 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 640 is formed around the stage 610, the side wall portion 621 of the supporting member 620, and the flexible fixing member 630. The first variable pressure chamber 640 has a first inlet and outlet port 610a on the stage 610. The first inlet and outlet port 610a can be connected to a pressure regulating device (not shown) for changing the first internal pressure P1 of the first variable pressure chamber 640. The stage 610 has a plurality of air inlets 610b, and the air inlets 610b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 610b. On 610. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 630 in an adhesive manner.

The main difference between the present embodiment and the first embodiment is that in the detaching and pasting device 600 of the embodiment, a second variable pressure chamber 650 can be formed around the upper cover portion 625 and the flexible fixing member 630. . The second variable pressure chamber 650 has a second inlet and outlet port 625a at the upper cover portion 625, and the second inlet and outlet port 625a is connectable to the pressure regulating device for changing the second internal pressure P2 of the second variable pressure chamber 650. .

Next, the removal of the bonding device 600 is applied to the removal operation as an example. As shown in FIG. 8B, unlike the foregoing embodiment, the removal bonding device 600 of the present embodiment can also be used by The second internal pressure P2 in the second variable pressure chamber 650 is adjusted since the two inlet and outlet ports 625a are in the form of intake or extraction, so as to be pushed against the opposite sides of the flexible fixing member 630 with a precise configuration. The gas pressure is effective to control the flexural deformation of the flexible fixing member 630, thereby facilitating the control of the removal operation or the bonding work. For example, when the removal operation is performed, the second substrate 92 can be maintained in an upwardly raised state by reducing the second internal pressure P2, and the portion of the second substrate 92 removed from the first substrate 91 can be prevented from being removed. It falls back onto the first substrate 91 to increase the success rate of the removal operation.

More specifically, as shown in FIGS. 9A to 9E, the internal pressure timing diagram of the detaching bonding apparatus 600 of the present embodiment after the removal operation simulation experiment is performed.

First, as shown in FIG. 9A, during the process from the time point T0 to the time point T1, the first internal pressure P1 and the second internal pressure P2 are simultaneously boosted simultaneously, that is, the first variable pressure chamber 640 is simultaneously increased. The pressure of the second variable pressure chamber 650. After the time point T1, the first internal pressure P1 is switched to the mode of slow boost until the removal operation is completed, and the second internal pressure P2 is also changed to the slow boost mode, but at the time point T2, the second inner Pressing P2 will greatly reduce the pressure. At this time, a pressure difference is suddenly generated between the first internal pressure P1 and the second internal pressure P2, and at the time point T3, the magnitude of the pressure reduction of the second internal pressure P1 is more moderate, so that the pressure between the two The difference is increased at a gentle speed to continuously remove the second substrate 92 from the first substrate 91.

Next, as shown in FIG. 9B, the control manners of the first internal pressure P1 and the second internal pressure P2 during the time point T0 to the time point T1 are substantially similar to those of FIG. 9A, and the difference is only after the time point T1. The second internal pressure P2 is converted into the slow boost mode until the removal operation is completed, and the first internal pressure P1 is slowly boosted from the time point T1 to the time point T2 together with the second internal pressure P2, and the sudden change is made. l, until the time point T3 tends to ease.

Next, as shown in FIG. 9C, the manner of controlling the first internal pressure P1 and the control method for the second internal pressure P2 during the time point T0 to the time point T2 are substantially similar to those of FIG. 9A except that During the time point T2 and the time point T3, the second internal pressure P2 changes through a plurality of relatively severe pressures until the time point T3. After the time point T3, the second internal pressure P2 will change to the slow boost mode, but the boosting amplitude is slightly higher than the boosting amplitude of the first internal pressure P1, thereby gradually reducing the pressure between the two. difference.

Next, as shown in FIG. 9D, the difference from the foregoing timing chart is that, from the time point T0, the first internal pressure P1 and the second internal pressure P2 are simultaneously boosted at the same time, and the second internal pressure P2 has a smaller boosting range. And only lasts until time T1, after the time point T1, the second internal pressure P2 is adjusted to the mode of slow boost until the removal operation is completed. The boosting amplitude of the first internal pressure P1 is large and continues to the time point T2 until the time point T2, and it is understood that the first internal pressure P1 and the second internal pressure P2 start from the work. That is, a pressure difference is generated. Next, at the time point T3, the first internal pressure P1 suddenly drops to lower the pressure difference therebetween, and until the time point T4, the first internal pressure P1 is adjusted to the same boosting amplitude as the second internal pressure P2.

Next, as shown in FIG. 9E, the control method for the first internal pressure P1 is substantially similar to that of FIG. 9D, except that the first internal pressure P1 and the second internal pressure P2 are simultaneously The boosting, but the second internal pressure P2 has a larger boosting range, that is, the second internal pressure P2 is greater than the first internal pressure P1, which helps to stabilize the position of the second substrate 92 before the two substrates start phase separation.

Next, referring to FIG. 10, a schematic view of a process of removing a second substrate from a first substrate in a bonding apparatus according to a seventh embodiment of the present invention.

FIG. 10 illustrates a removal of the bonding apparatus 700, which is substantially similar in structure to the removal of the bonding apparatus 600 of the sixth embodiment, and includes a stage 710, a support member 720, and a flexible fixture. Piece 730. The support member 720 includes a plurality of side wall portions 721 and an upper cover portion 725. The side wall portions 721 are connected to each other and are erected on the stage 710, and the upper cover portion 725 is disposed on the side of the side wall portion 721 opposite to the stage 710, that is, the side wall portion 721 is interposed between the upper cover portion 725 and the stage 710. between. The opposite sides of the flexible fixing member 730 are connected to the side wall portion 721 of the supporting member 720, and are respectively separated from the stage 710 and the upper cover portion 725 by a distance d1 and a distance d2. The flexible fixing member 730 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 740, an upper cover portion 725 and a flexible fixing member 730 are formed around the stage 710, the side wall portion 721 of the supporting member 720 and the flexible fixing member 730. A second variable pressure chamber 750 can be formed around the circumference. The first variable pressure chamber 740 has a first inlet and outlet port 710a on the stage 710, and the second variable pressure chamber 750 has a second inlet and outlet port 725a on the upper cover portion 725. The first inlet and outlet port 710a and the second inlet and outlet port 725a may be connected to a pressure regulating device (not shown) for changing the first internal pressure P1 and the second variable pressure chamber of the first variable pressure chamber 740. The second internal pressure P2 of 750. However, in this embodiment, the second inlet and outlet ports 725a are optional, and the user can set according to actual needs. The stage 710 has a plurality of air inlets 710b, and the air inlets 710b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 710b. On 710. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 730 in an adhesive manner.

The main difference between the embodiment and the sixth embodiment is that the detaching and pasting device 700 of the embodiment further includes a plurality of absorbing members 760 fixed to the upper cover portion 725 of the supporting member 720 and interposed between the upper cover portion 725 and the upper cover portion 725. Between the flexible fixtures 730. The adsorbent 760 described herein can be, but is not limited to, a suction cup. Thereby, during the removal operation, the flexible fixing member 730 can be adsorbed by the adsorption member 760, so that the second substrate 92 fixed on the flexible fixing member 730 is not removed from the first substrate 91. It will fall back to the first substrate 91 to improve the success rate of the removal operation.

Next, referring to FIG. 11, a schematic view of a process of removing a second substrate from a first substrate in a bonding apparatus according to an eighth embodiment of the present invention.

FIG. 11 illustrates a detachable bonding apparatus 800 having a structure substantially similar to that of the detaching bonding apparatus 700 of the seventh embodiment, including a stage 810, a support member 820, and a flexible fixing. A member 830 and a plurality of adsorbing members 860. The support member 820 includes a plurality of side wall portions 821 and an upper cover portion 825. The side wall portions 821 are connected to each other and are erected on the stage 810, and the upper cover portion 825 is disposed on the side of the side wall portion 821 opposite to the stage 810, that is, the side wall portion 821 is interposed between the upper cover portion 825 and the stage 810. between. The opposite sides of the flexible fixing member 830 are connected to the side wall portion 821 of the supporting member 820, and are respectively separated from the loading table 810 and the upper cover portion 825 by a distance d1 and a distance d2. The adsorbing member 860 is fixed to the upper cover portion 825 of the supporting member 820, and Between the upper cover portion 825 and the flexible fixing member 830, the adsorption member 860 may be made of an elastic material or a structure that can vary in length with air pressure, such as a telescopic structure similar to an accordion, and may be arranged in a two-dimensional array. The flexible fixing member 830 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone. The sorbent member 860 described herein can be, but is not limited to, a suction cup.

A first variable pressure chamber 840 is formed around the stage 810, the side wall portion 821 of the support member 820, and the flexible fixing member 830. The first variable pressure chamber 840 has a first inlet and outlet port 810a on the stage 810. The first inlet and outlet port 810a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P1 of 840. The stage 810 has a plurality of air inlets 810b, and the air inlets 810b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 810b. On the 810. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 830 in an adhesive manner.

The main difference between the embodiment and the seventh embodiment is that the upper cover portion 825 of the detaching and pasting device 800 of the embodiment further has a plurality of second inlet and outlet ports 825a, and the second inlet and outlet ports 825a respectively correspond to and communicate with the foregoing Adsorbent 860. In addition, the second inlet and outlet port 825a may be connected to the aforementioned pressure regulating device, and the pressure regulating device may inhale or pump air to the second inlet and outlet port 825a to respectively control the adsorption force of the adsorbing member 860, since the adsorbing member 860 is made of elastic material or It is constituted by a structure which can change the length with the air pressure, and when the pressure adjusting means lowers the internal pressure of the adsorbing member 860, the adsorbing member 860 can be simultaneously shortened. Therefore, when performing the removing operation or the bonding operation, the pressure adjusting device can sequentially inhale or pump the second inlet and outlet ports 825a in a sequential manner, thereby sequentially changing the lengths of the adsorbing members 860. That is, the deflection of the flexible fixing member 830 is controlled in such a manner that the length of the adsorbing member 860 is sequentially adjusted, so that the removal operation or the bonding work can be accurately controlled.

Next, referring to FIG. 12, a schematic diagram of pre-cracking a pre-crack before the second substrate is removed from the first substrate in the detaching bonding apparatus according to the ninth embodiment of the present invention.

FIG. 12 illustrates a detaching and affixing device 900, which is substantially similar in structure to the detaching and affixing device 400 of the fourth embodiment, and includes a carrier 910, a support member 920, and a flexible fixing. A piece 930 and a pre-stripping element 950. The support member 920 includes a plurality of side wall portions 921 and an upper cover portion 925. The side wall portions 921 are connected to each other and are erected on the stage 910, and the upper cover portion 925 is disposed on the side of the side wall portion 921 opposite to the stage 910, that is, the side wall portion 921 is interposed between the upper cover portion 925 and the stage 910. between. The opposite sides of the flexible fixing member 930 are connected to the side wall portion 921 of the supporting member 920, and are respectively separated from the stage 910 and the upper cover portion 925 by a distance d1 and a distance d2. However, in the embodiment, the upper cover portion 925 is optional, and the user can set it according to actual needs. The pre-stripping element 950 is disposed on the support element 920. The flexible fixing member 930 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 940 is formed between the stage 910, the side wall portion 921 of the support member 920, and the flexible fixing member 930. The first variable pressure chamber 940 has a first inlet and outlet port 910a. The first inlet and outlet port 910a can be connected to a pressure regulating device (not shown) for changing the first internal pressure of the first variable pressure chamber 940. P1. The stage 910 has a plurality of air inlets 910b, and the air inlets 910b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by sucking the air inlets 910b. On the 910. The second substrate 92 can be, but is not limited to, adhesively attached to the flexible fixture 930 with an adhesive.

The main difference between this embodiment and the fourth embodiment is that the pre-separation element 950 of the bonding device 900 of the present embodiment includes a driving member 951 and a wedge-shaped shovel head 953. Specifically, the driving member 951 is disposed on the side wall portion 921 of the supporting member 920, and the wedge-shaped shovel head 953 is movably disposed to the driving member 951. The wedge-shaped shovel head 953 can be pushed from the side wall by the driving member 951. The portion 921 protrudes in a direction inside the first variable pressure chamber 940. Therefore, before the removal operation, the edge of the first substrate 91 and the second substrate 92 can be aligned with the wedge-shaped shovel head 953 in advance, and the first step of the wedge-shaped shovel head 953 is further A pre-crack 97 is formed when the substrate 91 and the second substrate 92 are in contact with each other. Thereby, when the subsequent removal operation is facilitated, the second substrate 92 can be Peeling from the pre-crack 97 and being removed from the first substrate 91 more quickly facilitates the subsequent removal operation.

13A to 13B are schematic views showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the tenth embodiment of the present invention.

FIG. 13A illustrates a removal of the bonding apparatus 1000 including a stage 1010, a support member 1020, a flexible fixture 1030, and a height adjustment mechanism 1050. The support member 1020 connects the stage 1010 with the flexible fixture 1030, and the height adjustment mechanism 1050 is coupled between the support member 1020 and the stage 1010. Specifically, the supporting member 1020 includes a plurality of side wall portions 1021, a plurality of bottom portions 1023, and an upper cover portion 1025. The side wall portions 1021 are connected to each other and surround the bottom portion 1023, and the upper cover portion 1025 is disposed on the side wall portion 1021. The side opposite to the bottom portion 1023, that is, the side wall portion 1021 is interposed between the upper cover portion 1025 and the bottom portion 1023. However, in this embodiment, the upper cover portion 1025 is optional, and the user can set it according to actual needs. The stage 1010 is connected between the side wall portions 1021 and at a distance d3 from the bottom portion 1023. The opposite sides of the flexible fixing member 1030 are connected to the side wall portion 1021 of the supporting member 1020, and are spaced apart from the upper cover 1025 and the loading table 1010 by a distance d2 and a distance d4, respectively. The height adjustment mechanism 1050 is movably connected between the bottom portion 1023 and the stage 1010, thereby adjusting the distance d3 between the stage 1010 and the bottom portion 1023, thereby adjusting the distance d4 between the flexible fixing member 1030 and the stage 1010. . The flexible fixing member 1030 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone. The height adjustment mechanism 1050 can be, but is not limited to, a screw.

A first variable pressure chamber 1040 is formed between the stage 1010, the side wall portion 1021 of the support member 1020, and the flexible fixing member 1030. The first variable pressure chamber 1040 has a first inlet and outlet port 1010a on the stage 1010. The first inlet and outlet port 1010a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P10 of 1040. The stage 1010 has a plurality of suction ports 1010b connectable to the aforementioned pressure regulating device for generating a suction air flow.

The height adjustment mechanism 1050 can adjust the distance d4 between the flexible fixing member 1030 and the stage 1010. The volume of the first variable pressure chamber 1040 can be different according to the height of the stack of substrates to be operated. Adjustment. As shown in FIG. 13A, the splicing device 1000 can accommodate a three-layer structure in which the first substrate 91, the second substrate 92, and the third substrate 93 are stacked and laminated. In this embodiment, the first The substrate 91 and the third substrate may be a glass material layer (plate), and the second substrate 92 may be a soft panel layer. The first substrate 91 can be adsorbed and fixed on the stage 1010, and the third substrate 93 can be adhered and fixed to the flexible fixing member 1030.

Alternatively, as shown in FIG. 13B, the distance d4 between the flexible fixing member 1030 and the stage 1010 is reduced by the height adjusting mechanism 1050 to fit the stacking of the first substrate 91 and the second substrate 92. The two-layer board structure. It can be seen that, by the arrangement of the height adjustment mechanism 1050, the removal of the bonding apparatus 1000 can perform the removal operation of the substrates of different stack heights.

In addition, in the present embodiment, the removal bonding device 1000 further includes an annular seal 1060 disposed between the bottom portion 1023 and the stage 1010. The annular seal 1060 described herein may be, but not limited to, a material having elastic deformability such as rubber. Specifically, the annular seal 1060 is normally pressed against the bottom 1023 and the stage 1010. Thereby, when performing the removing operation, it is ensured that the gas in the first variable pressure chamber 1040 does not overflow from the gap between the stage 1010 and the supporting member 1020 to the external environment, when performing the bonding work. It is ensured that the atmosphere of the external environment does not enter the first variable pressure chamber 1040 from the gap between the stage 1010 and the support member 1020.

Next, referring to FIG. 14, a schematic view of a process of removing a second substrate from a first substrate in a bonding apparatus according to an eleventh embodiment of the present invention.

FIG. 14 illustrates a removal of the bonding apparatus 1100, which is substantially similar in structure to the removal of the bonding apparatus 300 of the third embodiment, and includes a stage 1110, a support member 1120, and a flexible fixture. Piece 1130. The support member 1120 includes a plurality of side wall portions 1121 and an upper cover portion 1125. The side wall portions 1121 are connected to each other and are erected on the stage 1110, and the upper cover portion 1125 is disposed on the side of the side wall portion 1121 opposite to the stage 1110, that is, the side wall portion 1121 It is between the upper cover portion 1125 and the stage 110. The flexible fixing member 1130 is interposed between the upper cover portion 1125 and the stage 1110. The flexible fixing member 1130 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 1140 is formed around the stage 1110, the support member 1120, and the flexible fixing member 1130. The first variable pressure chamber 1140 has a first inlet and outlet port 1110a on the stage 1110. The first inlet and outlet port 1110a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P1 of 1140. The stage 1110 has a plurality of air inlets 1110b, and the air inlets 1110b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by sucking the air inlets 1110b. On the 1110. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 1130 in an adhesive manner.

The difference between this embodiment and the third embodiment is that one side of the flexible fixing member 1130 of the removing device 1100 of the embodiment is adhered and fixed to the upper cover portion 1125, and the other side is used for the opposite side. The second substrate 92 is fixed, that is, the flexible fixing member 1130 is sandwiched between the upper cover 1125 and the second substrate 92. Therefore, when the operation is removed, the second substrate 92 is deflected upward to compress the flexible fixing member 1130. In this case, since the flexible fixing member 1130 can be compressed to a limited extent, the second substrate 92 can be restricted. The amount of deformation of the upward deflection is prevented from occurring in the case where the second substrate 92 is bent and broken due to excessive deflection.

Next, referring to FIG. 15, FIG. 15 is a schematic diagram of a process of removing a second substrate from a first substrate in a bonding apparatus according to a twelfth embodiment of the present invention.

FIG. 15 illustrates a detachable bonding apparatus 1200a having a structure substantially similar to that of the detaching bonding apparatus 600 of the sixth embodiment, including a stage 1210, a support member 1220, and a flexible fixing Piece 1230. The support member 1220 includes a plurality of side wall portions 1221 and an upper cover portion 1225. The side wall portions 1221 are connected to each other and are erected on the stage 1210, and the upper cover portion 1225 is disposed on the side of the side wall portion 1221 opposite to the stage 1210, that is, the side wall portion 1221 is interposed between the upper cover portion 1225 and the stage 1210. between. The opposite sides of the flexible fixing member 1230 It is connected to the side wall portion 1221 of the supporting member 1220, and is respectively separated from the stage 1210 and the upper cover portion 1225 by a distance d1 and a distance d2. The flexible fixing member 1230 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 1240 is formed around the stage 1210, the side wall portion 1221 of the supporting member 1220, and the flexible fixing member 1230. The upper cover portion 1225 and the flexible fixing member 1230 are formed together to form a joint. The second variable pressure chamber 1250. The first variable pressure chamber 1240 has a first inlet and outlet port 1210a on the stage 1210, and the second variable pressure chamber 1250 has a second inlet and outlet port 1225a on the upper cover portion 1225. The first inlet and outlet port 1210a and the second inlet and outlet port 1225a may be connected to a pressure regulating device (not shown) for changing the first internal pressure P1 and the second variable pressure chamber of the first variable pressure chamber 1240. The second internal pressure P2 of 1250. However, in this embodiment, the second inlet and outlet port 1225a is optional, and the user can set it according to actual needs. The stage 1210 has a plurality of air inlets 1210b, and the air inlets 1210b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 1210b. On the 1210. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 1230 in an adhesive manner.

The main difference between the embodiment and the sixth embodiment is that the removal device 1200a of the embodiment further includes a track member 1261 and a limiting member 1263. Specifically, the rail member 1261 is fixed to the upper cover portion 1225, and the limiting member 1263 is provided with a roller on one end thereof, and the opposite end is slidably disposed on the rail member 1261. It can be understood that the rail member 1261 can be The limiting stopper 1263 slides in a single axial direction. Therefore, when the removal operation is performed, although the flexural deformation of the flexible fixing member 1230 can push the roller of the limiting member 1263 to drive the limiting member 1263 to slide on the rail member 1261, the flexible fixing member 1230 will The restricted position member 1263 is only limited to slide in a single axial direction, and therefore, the second substrate 92 fixed to the flexible fixing member 1230 can be removed only in a single axial direction. In addition, in the removing operation, since the limiting member 1263 is provided with the roller, the flexural curvature of the flexible fixing member 1230 can be effectively controlled, and the second substrate 92 fixed to the flexible fixing member 1230 can be controlled. Flexing the curvature to avoid the second substrate 92 The situation of fragmentation due to excessive bending occurs. Similarly, when the bonding work is performed, the second substrate 92 can be restricted from being bonded to the first substrate 91 only in a single axial direction by the arrangement of the rail member 1261 and the limiting member 1263.

It can be understood that the design of the limiting member 1263 is not limited to the above embodiment, and any design that helps to effectively control the flexural curvature of the second substrate 92 during the removal operation or the bonding operation belongs to the present invention. The scope. For example, please refer to FIG. 16A to FIG. 16B together. FIG. 16 is a schematic diagram of the process of removing the second substrate from the first substrate in the bonding apparatus according to the thirteenth embodiment of the present invention, and FIG. 16B is a schematic diagram of FIG. A partially enlarged schematic view of the constraining member of Fig. 16A in accordance with the present invention.

The thirteenth embodiment proposes a removal of the bonding device 1200b. It should be noted that the structure of the detaching bonding apparatus 1200b of the present embodiment is substantially similar to that of the detaching bonding apparatus 1200a of the twelfth embodiment, and the difference is only that the affixing apparatus 1200b of the embodiment is removed. The limiting member 1265 can be a bump and has a bonding surface 1265a. Specifically, the abutting surface 1265a is composed of a concave surface 1265a1 and a convex surface 1265a2 which are connected to each other, and the concave surface 1265a1 is farther away from the carrier 1210 than the convex surface 1265a2. When the removal operation is performed, the flexure-deformable flexible fixing member 1230 is matched with the shape formed by the concave surface 1265a1 and the convex surface 1265a2 of the limiting member 1265, thereby limiting the proper flexural curvature of the flexible fixing member 1230. Further, the flexural curvature of the second substrate 92 fixed to the flexible fixture 1230 can be controlled within an appropriate range.

17A to 17D, FIG. 17A is a cross-sectional view of the second substrate before being removed from the first substrate in the fusing device according to the fourteenth embodiment of the present invention, and FIG. 17B is a view according to the present invention. 17A is a top view of the flexure limiter assembly in FIG. 17C, and FIG. 17C is a schematic view showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the fourteenth embodiment of the present invention, and FIG. 17D is based on the present invention. A partially enlarged view of Fig. 17C of the invention.

FIG. 17A illustrates a detaching and fitting device 1300 having a structure substantially similar to that of the detaching and affixing device 600 of the sixth embodiment, including a stage 1310, a support member 1320, and a flexible fixing. Piece 1330. The support member 1320 includes a plurality of side wall portions 1321 And an upper cover portion 1325. The side wall portions 1321 are connected to each other and are erected on the stage 1310, and the upper cover portion 1325 is disposed on the side of the side wall portion 1321 opposite to the stage 1310, that is, the side wall portion 1321 is interposed between the upper cover portion 1325 and the stage 1310. between. The opposite sides of the flexible fixing member 1330 are connected to the side wall portion 1321 of the supporting member 1320, and are respectively separated from the stage 1310 and the upper cover portion 1325 by a distance d1 and a distance d2. However, in the embodiment, the upper cover portion 1325 is optional, and the user can set it according to actual needs. The flexible fixing member 1330 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

The stage 1310, the side wall portion 1321 of the supporting member 1320 and the flexible fixing member 1330 are collectively formed around a first variable pressure chamber 1340, and the upper cover portion 1325 and the flexible fixing member 1330 can be collectively surrounded. A second variable pressure chamber 1350 is formed. The first variable pressure chamber 1340 has a first inlet and outlet port 1310a on the stage 1310, and the second variable pressure chamber 1350 can have a second inlet and outlet port 1325a on the upper cover portion 1325. The first inlet and outlet port 1310a and the second inlet and outlet port 1325a may be connected to a pressure regulating device (not shown) for changing the first internal pressure P1 and the second variable pressure chamber of the first variable pressure chamber 1340. The second internal pressure P2 of 1350. However, in the embodiment, the second inlet and outlet port 1325a is optional, and the user can set according to actual needs. The stage 1310 has a plurality of air inlets 1310b, and the air inlets 1310b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 1310b. On the 1310. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 1330 in an adhesive manner.

The main difference between the embodiment and the sixth embodiment is that the detaching and fixing device 1300 of the embodiment further includes a flexure limiting component 1360 fixed to the flexible fixing member 1330. Specifically, as shown in FIG. 17B, the flex limit component 1360 is composed of a plurality of hardware 1360a and a plurality of software 1360b interlaced, and the extending direction of each hardware 1360a and each software 1360b is horizontal to the Z axis. In addition, the hardware 1360a can be composed of a rigid material and has an inflexible property, while the software 1360b is composed of a soft material and has a flexible property. Thereby, the flexure limiter assembly 1360 can only flex and deform along the same flexural crankshaft direction (eg, the Z-axis direction). Next, as shown in FIGS. 17C to 17D, when the above-described removal of the bonding device 1300 is applied to perform the removal operation, the flexible fixing member 1330 is restricted by the flexure limiting member 1360 and can only be in the same flexing crankshaft. The deflection is upwardly deformed. Therefore, the fixing to the second substrate 92 is also subject to the same limitation and can only be flexed in the same flexing direction. Thereby, the second substrate 92 can be prevented from being simultaneously removed during the removal process. The shaft flexes the crankshaft toward deflection, causing a problem of excessive stress.

It will be appreciated that the design of the flexure limiter assembly 1360 is not limited to the above-described embodiments and is within the scope of the present invention as long as it helps to limit the deflection of the substrate to the same flexural crankshaft. For example, please refer to FIG. 18A to FIG. 18B together. FIG. 18A is a schematic diagram showing the process of removing the second substrate from the first substrate in the bonding apparatus according to the fifteenth embodiment of the present invention, and FIG. 18B is a schematic diagram of FIG. A partial enlarged view of Fig. 18A in accordance with the present invention.

The fifteenth embodiment proposes a removal of the bonding device 1400. It should be noted that the structure of the splicing device 1400 of the present embodiment is substantially similar to that of the affixing device 1300 of the fourteenth embodiment, and the difference is only that the affixing device 1400 of the embodiment is removed. The flexure limiting assembly 1460 is comprised of a plurality of shaft members 1460a interleaved with a plurality of connectors 1460b, each pivot member 1460a being pivotally coupled between the two connectors 1460b.

Next, referring to FIG. 19, a schematic view of the process of removing the second substrate from the first substrate in the bonding apparatus according to the sixteenth embodiment of the present invention.

FIG. 19 illustrates a detachable bonding apparatus 1500 having a structure substantially similar to that of the detaching bonding apparatus 600 of the sixth embodiment, including a stage 1510, a support member 1520, and a flexible fixture. Piece 1530. The support member 1520 includes a plurality of side wall portions 1521 and an upper cover portion 1525. The side wall portions 1521 are connected to each other and are erected on the stage 1510, and the upper cover portion 1525 is disposed on the side of the side wall portion 1521 opposite to the stage 1510, that is, the side wall portion 1521 is interposed between the upper cover portion 1525 and the stage 1510. between. The opposite sides of the flexible fixing member 1530 are connected to the side wall portion 1521 of the supporting member 1520, and are respectively separated from the loading table 1510 and the upper cover portion 1525 by a distance d1 and a distance d2. The flexible fixing member 1530 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

The stage 1510, the side wall portion 1521 of the supporting member 1520 and the flexible fixing member 1530 are collectively formed around a first variable pressure chamber 1540, and the upper cover portion 1525 and the flexible fixing member 1530 are formed together. A second variable pressure chamber 1550. The first variable pressure chamber 1540 can have a first inlet and outlet port 1510a on the stage 1510, and the second variable pressure chamber 1550 can have a second inlet and outlet port 1521a. The first inlet and outlet port 1510a and the second inlet and outlet port 1521a may be connected to a pressure regulating device (not shown) for changing the first internal pressure P1 and the second variable pressure chamber of the first variable pressure chamber 1540. The second internal pressure P2 of 1550. The stage 1510 has a plurality of air inlets 1510b, and the air inlets 1510b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 1510b. 1510. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 1530 in an adhesive manner.

The main difference between the present embodiment and the sixth embodiment is that the second inlet and outlet port 1521a is located in the side wall portion 1521 in the detaching and pasting device 1500 of the embodiment. In addition, the removal of the bonding device 1500 can also include a displacement monitoring module 1560 that includes a displacement monitor 1561 and two flexible conductive plates 1563a and 1563b. Specifically, the displacement monitor 1561 is disposed on the upper cover portion 1525, the flexible conductive plates 1563a and 1563b are located in the first variable pressure chamber 1540, and the flexible conductive plate 1563a is disposed on the upper cover portion 1525, and is flexible. The conductive plate 1563b is disposed on the flexible fixture 1530. The displacement monitor 1561 can be used to detect a change in the capacitance value caused by a change in the distance between the two flexible conductive plates 1563a and 1563b. In detail, during the removal operation or the bonding operation, the flexible conductive plate 1563b disposed on the flexible fixing member 1530 is deformed according to the deflection of the flexible fixing member 1530, and the second flexible conductive The distance d5 between the plates 1563a and 1563b changes with the deflection of the flexible fixing member 1530, thereby generating a change in the capacitance value, and the displacement monitor 1561 can calculate the change in the capacitance value. In fact, the change in distance d5 can be used to monitor the removal of the job or the cooperation.

20A to 20B, FIG. 20A is a schematic view of the second substrate before being removed from the first substrate in the bonding apparatus according to the seventeenth embodiment of the present invention, and FIG. 20B A schematic view of the process of removing the second substrate from the first substrate in the bonding apparatus according to the seventeenth embodiment of the present invention.

FIG. 20A illustrates a detachable bonding apparatus 1600 having a structure substantially similar to that of the detaching bonding apparatus 1100 of the eleventh embodiment, including a stage 1610, a support member 1620, and a flexible portion. Fixing member 1630. The support member 1620 includes a plurality of side wall portions 1621 and an upper cover portion 1625. The side wall portions 1621 are connected to each other and are erected on the stage 1610, and the upper cover portion 1625 is disposed on the side of the side wall portion 1621 opposite to the stage 1610, that is, the side wall portion 1621 is interposed between the upper cover portion 1625 and the stage 1610. between. The flexible fixing member 1630 is disposed on the upper cover portion 1625 and interposed between the upper cover portion 1625 and the stage 1610. The flexible fixing member 1630 described herein may be, but not limited to, a material having elastic deformability or flexibility such as rubber or silicone.

A first variable pressure chamber 1640 is formed around the stage 1610, the support member 1620 and the flexible fixing member 1630. The first variable pressure chamber 1640 has a first inlet and outlet port 1610a on the stage 1610. The first inlet and outlet port 1610a can be connected to a pressure regulating device (not shown) for changing the first variable pressure chamber. The first internal pressure P1 of 1640. The stage 310 has a plurality of air inlets 1610b, and the air inlets 1610b can be connected to the pressure adjusting device to stably adsorb the first substrate 91 to the stage by pumping the air inlets 1610b. On the 1610. The second substrate 92 can be, but is not limited to, fixed to the flexible fixture 1630 in an adhesive manner.

The difference between this embodiment and the eleventh embodiment is that the flexible fixing member 1630 of the removing device 1600 of the present embodiment may have a plurality of variable pressure compartments 1631. In addition, the upper cover portion 1625 may further have a plurality of second inlet and outlet ports 1625a corresponding to the plurality of variable pressure compartments 1631 of the flexible fixture 1630, respectively. In detail, the second inlet and outlet ports 1625a can be connected to the pressure regulating device, and the pressure regulating device can respectively change the variable pressure compartments in the flexible fixing member 1630 by means of these second inlet and outlet ports 1625a. The internal pressure P3 of 1631. As shown in FIG. 20B, the pressure regulating device may have a take-off operation or a bonding operation. The second inlet and outlet ports 1625a are sequentially inducted or evacuated, and the internal pressures P3 of the variable pressure compartments 1631 are sequentially changed, whereby the gas pressures on opposite sides of the flexible fixing member 1630 can be accurately controlled. In turn, the flexure of the flexible fixing member 1630 can be precisely controlled, and the removal operation or the bonding work can be effectively controlled.

According to the above, in the embodiment of the present invention, the removing device and the removing method and the bonding method thereof are applied, and the relative pressure of the flexible fixing member is adjusted by adjusting the gas pressure in the first variable pressure chamber. A pressure difference is generated on the side so that the flexible fixing member and the substrate can be flexed together for the purpose of removing or fitting.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

Claims (19)

A removing device is adapted to remove a first substrate from a second substrate or to bond the first substrate to the second substrate, the removing and pasting device comprising: a loading stage having a bearing surface, a plurality of air inlets, and a first inlet and outlet port, wherein the bearing surface is configured to carry the first substrate, and the air inlets and the first inlet and outlet ports are formed on the bearing surface of the loading platform. And the suction port is configured to adsorb the first substrate carried on the bearing surface; a flexible fixing member for fixing the second substrate; and a supporting component connecting the carrier and the flexible fixing The support member and the flexible fixing member are spaced apart by a distance, wherein the supporting member comprises a plurality of side wall portions and an upper cover portion, and the side wall portions are interposed between the upper cover portion and the loading table. The flexible fixing member is fixed to the inside of the side wall portion, and the flexible fixing member is kept at a distance from the joint surface of the side wall portion and the upper cover portion, wherein the first inlet and outlet ports of the loading platform are directly Communicating with the stage, the flexible fixing member and the side wall portions of the supporting member A first transformer chamber. The removing device of claim 1 further comprising at least one pre-stripping element for generating a pre-crack between the first substrate and the second substrate. The removal device is removed as claimed in claim 2, wherein the at least one pre-separation element is a high pressure nozzle. The removal device of claim 2, wherein the at least one pre-separation element comprises a suction cup and a linkage rod, the linkage rod is coupled to the support member, and the suction cup is movably disposed on the linkage rod. The stripping device is removed as claimed in claim 2, wherein the at least one pre-separating member comprises a driving member and a wedge-type shovel head, and the wedge-shaped shovel head is movably disposed on the driving member. The removing device of claim 1 , wherein the upper cover portion of the supporting member has at least one second inlet and outlet port, and a second variable pressure chamber is formed between the upper cover portion and the flexible fixing member. room. The removing device of claim 1 further includes a limiting member and a rail member, wherein the rail member is fixed to the upper cover portion, and the limiting member is slidably disposed on the rail member to limit the first The flexural curvature of the two substrates. The removing device of claim 1 further includes a displacement monitoring module for monitoring a change in distance between the flexible fixing member and the upper cover portion. The removing device of claim 1 further includes a plurality of adsorbing members fixed to the upper cover portion of the supporting member and interposed between the upper cover portion and the flexible fixing member, the supporting member The upper cover portion has a plurality of second inlet and outlet ports corresponding to the adsorbing members, and changes the lengths of the adsorbing members by air pressure. The removing device of claim 1 further comprising at least one height adjusting mechanism coupled between the supporting member and the stage to adjust the distance between the stage and the flexible fixing member . The detaching device of claim 1, wherein the flexible fixing member is interposed between the upper cover portion and the stage, and one side of the flexible fixing member is attached to the upper cover portion, and The other side is opposite to the second substrate. The removing device of claim 11, wherein the flexible fixing member has a plurality of variable pressure compartments, and the upper cover portion has a plurality of second inlet and outlet ports respectively corresponding to the variable pressure compartments . The stripping device as claimed in claim 1, further comprising a flexure limiting component interleaved by a plurality of hardware and a plurality of software, fixed to the flexible fixing member for limiting the flexibility The fixing member is flexibly deformed toward a crankshaft. The removing device of claim 1 further comprising a flexure limiting component, wherein the plurality of shaft members are interleaved with the plurality of connecting members, and is fixed to the flexible fixing member, the shaft members being pivotable The rotating connection is connected to the connecting members for limiting the flexible deformation of the flexible fixing member in a flexing direction of the crankshaft. A removing method for removing a first substrate from a second substrate, the removing method comprising: providing the removing bonding device as claimed in claim 1; fixing the first substrate to the carrier Fixing the second substrate to the flexible fixing member; increasing a first internal pressure in the first variable pressure chamber to deflect the flexible fixing member away from the carrier plate, Separating the first substrate from the second substrate. The removing method of claim 15, wherein the upper cover portion and the flexible fixing member together form a second variable pressure chamber, the second variable pressure chamber has a second internal pressure, and the second variable pressure chamber has a second internal pressure The first internal pressure is greater than the second internal pressure. A bonding method for bonding a first substrate to a second substrate, the bonding method comprising: providing the removing bonding device according to claim 1; fixing the first substrate to the carrier Fixing the second substrate to the flexible fixing member; Lowering a first internal pressure in the first variable pressure chamber to deflect the flexible fixing member toward the carrier to bond the second substrate to the first substrate. The bonding method of claim 17, wherein the upper cover portion and the flexible fixing member together form a second variable pressure chamber, the second variable pressure chamber has a second internal pressure, and the second variable pressure chamber has a second internal pressure The first internal pressure is less than the second internal pressure. A removing device is adapted to remove a first substrate from a second substrate, the removing device comprising: a loading platform having a bearing surface, a plurality of suction ports and a first inlet and outlet port, the bearing The surface is configured to carry the first substrate, the air inlets and the first inlet and outlet ports are formed on the bearing surface of the carrier, and the suction ports can provide a negative pressure to be adsorbed and carried on the bearing surface. The first substrate; a flexible fixing member for fixing the second substrate; and a supporting member connecting the stage and the flexible fixing member, and the stage and the flexible fixing member are spaced apart a first distance, wherein the first inlet and outlet of the stage is directly connected to the stage, a first variable pressure chamber formed by the flexible fixing member and the supporting member, and the first inlet and outlet ports are A positive pressure is provided to vary the pressure of the first variable pressure chamber.