TWI436702B - Substrate bonding apparatus and method for controlling the same - Google Patents

Description

Substrate bonding device and method for controlling substrate bonding device

The present invention relates to a method of controlling a substrate bonding apparatus and a substrate bonding apparatus, and more specifically, it is suitable for use in bonding two substrates of a flat panel display (FDP: Flat Panel Display) used for liquid crystal or the like. The substrate bonding apparatus and the method of controlling the substrate bonding apparatus.

Conventionally, as one type of flat panel display, for example, a liquid crystal display (LCD) has been known. A liquid crystal display panel (liquid crystal panel) generally has a plurality of TFTs (thin film transistors) formed into an array substrate array, and a color filter substrate on which color filters (red, green, blue) or light shielding films are formed. It is manufactured by placing it in an extremely narrow interval (a few μm) and sealing the liquid crystal between the two substrates. Moreover, the purpose of the light-shielding film is to increase the contrast or to shield the TFT from light to prevent the generation of light leakage current. Then, the array substrate and the color filter substrate are bonded together with a sealing material.

The bonding of such two substrates is performed using a substrate bonding apparatus. The substrate bonding apparatus is provided with a holding plate and a lower holding plate which are disposed opposite to each other in the processing chamber. In the substrate bonding apparatus, when the upper holding plate and the lower holding plate are brought close to each other and the two substrates are bonded together, it is necessary to precisely maintain the parallelism between the two holding plates while spacing the thickness direction between the substrates to the substrate. Keep it evenly in the face. For example, in the substrate bonding apparatus described in Patent Document 1, a plurality of adhesive sheets are provided on the substrate holding surface of each of the holding sheets, and each of the holding sheets receives a substrate adsorbed by a plurality of adsorption pads in the processing chamber. The substrate is brought into contact with the substrate holding surface to hold the substrate with an adhesive force.

(Patent Document 1) Japanese Patent Laid-Open Publication No. 2005-351961

However, in the substrate bonding apparatus described in Patent Document 1, the substrate held by the adsorption pad is deflected by its own weight or the like, and the substrate is brought into contact with the substrate holding surface in this state, so that the substrate is in a state of being deflected. Keep on the retaining plate. However, it is very difficult to correct the deflection of the substrate on the holding plate while holding the substrate in the holding plate. In addition, when the two substrates are bonded in a state in which the substrate is deflected, the displacement is increased, and there is a problem that the aperture ratio of each pixel is reduced or the light leakage from the light shielding portion is poor. In particular, in recent years, the manufactured bonded substrates have been developed in size, and the above problems have become more and more remarkable.

The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate bonding apparatus and a substrate bonding apparatus capable of holding a substrate in a state of high flatness.

In order to solve the above problems, a first aspect of the invention provides a substrate bonding apparatus in which a first substrate is held by an upper holding plate and a second substrate is held by a lower holding plate in a processing chamber under atmospheric pressure, and the processing chamber is placed in the processing chamber. The first substrate and the second substrate are bonded together under reduced pressure, and the moving mechanism portion includes a plurality of adsorption pads that adsorb the first substrate, and raises the plurality of adsorption pads to cause the first substrate a first moving means for moving the substrate to the vicinity of the upper holding plate; and an adhesive mechanism portion disposed between the plurality of adsorption pads and mounted on the upper holding plate; the adhesive mechanism portion includes: The pressure plate is disposed between the plurality of adsorption pads and has a plurality of through holes; the adhesive member is disposed on the pressure plate so as to protrude below the pressure plate; the plurality of adsorption heads are respectively disposed on the plurality of adsorption heads The inside of the through hole is supported by the adhesive mechanism portion so as to be able to move in and out from the lower surface of the pressure plate, and the first substrate can be adsorbed by the moving mechanism portion to the vicinity of the pressure plate; The moving means is configured to raise the plurality of adsorption heads so that the first substrate adsorbed by the plurality of adsorption heads adheres to the adhesive member.

In a second aspect, a substrate bonding apparatus is provided in which a first substrate is held by an upper holding plate in a processing chamber under atmospheric pressure, and a second substrate is held by a lower holding plate, and the processing chamber is decompressed to fit. The first substrate and the second substrate are characterized in that the moving mechanism portion includes a plurality of adsorption pads that adsorb the first substrate, and raises the plurality of adsorption pads to move the first substrate to the first substrate a first moving means in the vicinity of the upper holding plate; and an adhesive mechanism portion disposed between the plurality of adsorption pads and mounted on the upper holding plate; the adhesive mechanism portion includes a pressure plate disposed in the plurality Between the adsorption pads, there are a plurality of through holes; the adhesive member is disposed under the pressure plate so as to be flush with the lower surface of the pressure plate; and a plurality of adsorption heads are respectively disposed in the plurality of through holes, And being supported by the adhesive mechanism portion so as to be able to move in and out from the lower surface of the pressure plate, and to adsorb the first substrate moved to the vicinity of the pressure plate by the moving mechanism portion; and the second moving means is raised a plurality of adsorption heads, The first substrate adsorbed by the plurality of adsorption heads is adhered to the adhesive member.

The third aspect thereof provides a method for controlling a substrate bonding apparatus. In the substrate bonding apparatus, the first substrate is held by the upper holding plate in the processing chamber under atmospheric pressure, and the second substrate is held by the lower holding plate, and the processing chamber is depressurized to bond the first substrate and the second substrate. a substrate comprising: a step of adsorbing and loading the first substrate in the processing chamber under atmospheric pressure by a plurality of adsorption pads; and applying the first substrate to the plurality of adsorption pads The adsorption pad is raised to move the first substrate to a vicinity of an adhesive mechanism portion attached to the upper holder of the upper holding plate, and the adhesive mechanism portion includes a pressure plate disposed between the plurality of adsorption pads; Provided on the pressing plate, the adhesive member disposed on the pressing plate in a manner that protrudes below the lower surface of the pressing plate; and a plurality of adsorption heads so as to be able to enter and exit downward from the lower surface of the pressing plate Supporting the adhesive mechanism portion; the step of adsorbing and moving the first substrate in the vicinity of the adhesive mechanism portion by the plurality of adsorption heads; and making the plural substrate in a state in which the first substrate is adsorbed by the plurality of adsorption heads Adsorption head The step of the first substrate is adhered to the adhesive member.

According to the present invention, it is possible to provide a substrate bonding apparatus and a substrate bonding apparatus capable of holding a substrate in a state of high flatness.

(First embodiment)

Hereinafter, a substrate bonding apparatus according to a first embodiment of the present invention will be described with reference to the drawings.

1 is a block diagram showing an overall schematic configuration of a panel manufacturing apparatus for bonding two substrates to manufacture a flat panel display (FDP). Wait for the panel. Moreover, in the first embodiment, a panel manufacturing apparatus for manufacturing an active matrix liquid crystal panel will be described as an example.

In the panel manufacturing apparatus, two types of substrates W1 and W2 constituting a liquid crystal panel are supplied. The first substrate W1 is formed as an array substrate (TFT substrate) such as a TFT, and the second substrate W2 is a color filter substrate such as a color filter or a light shielding film. The first and second substrates W1 and W2 are formed by respective processes and then supplied to the panel manufacturing apparatus.

The first and second substrates W1 and W2 are first supplied to the seal drawing device 11. In the seal drawing device 11, the upper surface of one of the first and second substrates W1 and W2 is sealed on the upper surface (inner surface) of the second substrate W2 in the first embodiment, and the ultraviolet curable resin is sealed. The material is painted in a frame shape. Then, the first substrate W1 and the second substrate W2 to which the sealing material has been applied are transported to the next liquid crystal dropping device 12 by the transport device 21.

The liquid crystal dropping device 12 drops the liquid crystal onto a predetermined plurality of predetermined positions on the upper surface of the second substrate W2 to which the sealing material has been applied. Then, the first substrate W1 and the second substrate W2 from which the liquid crystal has been dropped are transported to the pressing device 14 of the next substrate bonding apparatus 13 by the transport device 22.

The pressing device 14 is provided with a chamber 31 for processing a chamber (see Fig. 2). At least one adhesive mechanism portion 52 (in the first embodiment, a plurality of adhesive mechanism portions 52) is disposed in the chamber 31, and the stage 42 is disposed. Further, in the first embodiment, for example, the pressing device 14 holds the second substrate W2 by the stage 42, and the first substrate W1 is held by the plurality of bonding mechanism portions 52, and the inside of the chamber 31 is decompressed (vacuum exhaust) ).

Next, the pressing device 14 is disposed on the first and second substrates W1. An alignment mark (not shown) of W2 optically positions the two substrates W1 and W2 in alignment. Next, after the position is aligned, a predetermined pressure is applied to the both substrates W1 and W2, and the two substrates W1 and W2 are pressed to a predetermined substrate interval, and then the inside of the chamber 31 is opened (atmospheric introduction). Thereby, the two substrates W1 and W2 are further pressed to a predetermined cell thickness due to the pressure difference between the atmospheric pressure and the pressure between the substrates W1 and W2. The bonded substrate W3 (see, for example, FIG. 12) which is formed by bonding the two substrates W1 and W2 in this manner is transported to the next curing device 15 by the transport device 23.

The curing device 15 is provided with a lamp that emits ultraviolet rays (UV), and transmits ultraviolet rays from the lamp to the bonding substrate W3 through a hood (not shown). The hood is only used to cure the sealing material by preventing ultraviolet rays from being irradiated onto the liquid crystal or the like. Thus, the bonded substrate W3 (liquid crystal panel) whose sealing material has been hardened is transported to the next inspection device 16 by the transport device 24.

The inspection device 16 measures the displacement between the two substrates of the bonded substrate W3, and outputs the measured value to the control device 17. The control device 17 performs control such as alignment correction of the pressing device 14 based on the measured value of the inspection device 16. For example, the control device 17 performs the positional alignment correction by shifting the amount of displacement generated by the bonded substrate W3 in the direction opposite to the direction in which it is displaced. Thereby, the displacement of the next liquid crystal panel to be manufactured is prevented.

Next, the pressing device 14 will be described in detail.

As shown in FIG. 2, the chamber 31 of the pressing device 14 is composed of an upper container 32 and a lower container 33. The upper container 32 can be moved up and down with respect to the lower container 33 by a drive mechanism such as an actuator (not shown). And when the upper container The side edge portion of 32 is lowered to abut against the side edge portion of the lower container 33, that is, the processing chamber (chamber 31) is formed by the space sealed by the upper container 32 and the lower container 33. Further, an O-ring 34 is attached to the side edge portion of the lower container 33 at a contact surface with the side edge portion of the upper container 32, and the O-ring 34 ensures the airtightness of the chamber 31.

A stage 42 is disposed on the lower container 33 through the lower holder 41. Further, in the first embodiment, the lower holder 41 and the stage 42 constitute a lower holding plate. The lower substrate holding device 43 for transferring the second substrate W2 to the stage 42 is supported in the lower container 33 so as to be movable up and down. As shown in FIG. 3, the lower substrate holding device 43 is formed in a grid shape by connecting both end portions of the plurality of support bars 44 by a connecting frame 45. In the stage 42, when the lower substrate holding device 43 is lowered to the lowermost limit, the receiving grooves 42a for accommodating the respective support bars 44 are formed so that the support bars 44 are not exposed to the upper surface of the stage 42. Further, on one side of the connecting frame 45 constituting the lower substrate holding device 43, a front end of the supporting conveyance device 22 (the upper arm 104, see FIG. 2) is protruded upward to prevent the upper arm 104 from sagging due to its own weight. .

As shown in FIG. 3 and FIG. 4, a plurality of adsorption holes 42b for vacuum-adsorbing the second substrate W2 are formed on the upper surface of the stage 42 and on the contact surface with the second substrate W2, and the surface is porous and ventilated. A plurality of porous sheets 47 made of, for example, polyethylene or the like having a surface friction coefficient of 0.3 to 0.4. Each of the adsorption holes 42b is connected to a line 42c for supplying a negative pressure to each of the adsorption holes 42b, and the line 42c is connected to the negative pressure source 49 through a valve 48 disposed outside the chamber 31. The valve 48 and the negative pressure source 49 are controlled by the control unit 35 to vacuum-adsorb the second substrate W2. Moreover, the porous sheet 47 is in the first embodiment. The form is formed to a thickness of about 300 to 500 μm, and is attached to a position where the receiving groove 42a formed in the stage 42 is not covered. Therefore, the second substrate W2 is vacuum-adsorbed through the adsorption holes 42b, and is also held by the static frictional resistance of the porous sheet 47.

On the other hand, as shown in FIG. 2, the upper fixing base 51 is supported in the upper container 32, and a plurality of adhesive mechanism portions 52 are attached to the lower surface of the upper fixing base 51. Further, in the first embodiment, the upper holding base 51 and the plurality of adhesive mechanism portions 52 constitute the upper holding plate. The upper fixing base 51 is suspended from the driving device 53 including the motor through the suspension shaft 54 above the upper container 32, and is lifted and lowered by the driving device 53 below the upper container 32.

A substrate holding device 55 that can move the first substrate W1 to the vicinity of the adhesive mechanism portion 52 is disposed below the adhesive mechanism portion 52. As shown in FIG. 5, the upper substrate holding device 55 includes a plurality of support bars 56. Similarly to the lower substrate holding device 43, the both ends of the plurality of support bars 56 are connected by a connecting rod 57 to form a grid. . Each of the support bars 56 is provided with a plurality of adsorption pads 58 (see FIG. 2) that are opened downward. In the first embodiment, a plurality of the adhesive mechanism portions 52 are arranged in an array on the lower surface of the upper holder 51. Further, each of the adhesive mechanism portions 52 has the same configuration. Each of the storage grooves 52a is disposed between the adhesive mechanism portions 52 adjacent to each other (adjacent to the vertical direction in FIG. 5), and the support rods 56 (adsorption pads 58) of the upper substrate holding device 55 are housed under the adhesive mechanism portion 52 (Fig. 6,7 shows the position above the lower surface 73) of the pressure plate 71. Therefore, when the upper substrate holding device 55 is raised to the uppermost limit, the support rod 56 is housed in the storage groove 52a without being exposed downward from the lower surface of the adhesive mechanism portion 52. As shown in FIG. 2, on both sides of the upper substrate holding device 55, the mounting is performed. A support shaft 59 extending upwardly through the upper container 32, and an upper end portion of the support shaft 59 is suspended and supported by the lift shaft 61 through the flexible coupling 60. Further, the elevating shaft 61 is raised and lowered in accordance with the control of the driving device 53. Further, in the first embodiment, the support shaft 59, the flexible coupling 60, and the lifting shaft 61 constitute a supporting means, and the upper substrate holding device 55 performs the lifting operation in accordance with the control of the driving device 53. Further, the driving device 53, the upper substrate holding device 55, and the supporting means (the support shaft 59, the flexible coupling 60, and the lifting shaft 61) constitute a first moving means. Further, the first moving means (the driving device 53, the upper substrate holding device 55, the flexible coupling 60, and the lifting shaft 61) and the suction pad 58 constitute a moving mechanism portion.

The upper substrate holding device 55 is supported by the flexible coupling 60 so as to be movable in the horizontal direction with respect to the lifting shaft 61. The flexible coupling 60 allows the horizontal direction of the adhesive mechanism portion 52 and the upper substrate holding device 55 when the alignment process is performed to correct the displacement of the first substrate W1 held by the adhesive mechanism portion 52 in the horizontal direction. Relative movement.

As shown in FIGS. 6 and 7, each of the adhesive mechanism portions 52 is provided with a pressure plate 71. FIG. 6 shows one pressure plate 71 provided in one of the adhesive mechanism portions 52. Further, the pressure plate 71 shown in Fig. 6 is also provided in the other adhesive mechanism portion 52. Each of the pressing plates 71 is disposed between the two support bars 56 on both sides of the corresponding adhesive mechanism portion 52 (on both sides in the vertical direction of FIG. 5). Therefore, each of the pressure plates 71 is disposed between a plurality of adsorption pads adjacent to the pressure plate 71. A plurality of through holes 72 (for example, eight in FIG. 6) are formed in each of the pressing plates 71. In the first embodiment, the plurality of through holes 72 are arranged in a square frame shape at a predetermined interval in the plane of the pressure plate 71. An annular adhesive member that is adjacent to each of the through holes 72 and surrounds the entire circumference of each of the through holes 72 is attached to the lower surface 73 of the pressure plate 71. 74. In the first embodiment, each of the adhesive members 74 is fixed to the lower surface 73 of the pressure plate 71 in a state in which the lower surface 73 of the pressure plate 71 protrudes downward. Further, the region of the pressure plate 71 of the adhesive member 74 is defined as the contact region T. The contact region T is a region where the first substrate W1 and the adhesive member 74 are in contact with each other when the adsorption pad 75 (described later) of the adhesive mechanism portion 52 is raised while adsorbing the first substrate W1. In detail, a plurality of holding projections 74a (holding portions) each having a substantially hemispherical shape are formed in the adhesive member 74 (that is, the contact region T), and the holding projections 74a are brought into contact with the first substrate W1. Preferably, as shown in FIG. 6, a plurality of holding projections 74a are annularly arranged on the adhesive member 74. The adhesive member 74 is fixed to the lower surface 73 of the pressure plate 71, for example, by a follow-up member (not shown). The adhesive member 74 is preferably made of polybutadiene rubber, and can temporarily hold the substrate and can be quickly peeled off.

The adhesive mechanism portion 52 includes a plurality of (ie, eight) adsorption heads 75 disposed in the eight through holes 72, and supported by the adhesive mechanism portion 52 so as to be able to enter and exit from the lower surface of the pressure plate 71; The actuator 76 lifts the eight adsorption heads 75. Therefore, the eight adsorption heads 75 are arranged in a square frame shape at a predetermined interval in the plane of the pressure plate 71, similarly to the eight through holes 72. Each of the adsorption heads 75 is connected to a line 77 for supplying a negative pressure, and the line 77 is connected to a negative pressure source 79 (see FIG. 5) through a valve 78 disposed outside the chamber 31. The adsorption head 75 can adsorb the first substrate W1 moved to the vicinity of the adhesive mechanism portion 52 by the upper substrate holding device 55 from the upper surface (outer surface) side thereof.

As shown in FIG. 7, at the lower end of the adsorption head 75, a flange portion 80 as an adsorption portion is formed on the outer side in the radial direction, and a planar contact surface 81 which can be in contact with the first substrate W1 is formed. Therefore, the contact surface 81 of the adsorption head 75 is sucked. The first substrate W1 and the pressure plate 71 are parallel to each other with the first substrate W1 attached. Further, in the first embodiment, the contact surface 81 of the adsorption portion (the flange portion 80) is formed in an annular shape. Further, the contact surface 81 is disposed coaxially with the annular adhesive member 74. In this configuration, the distance between the inner peripheral end of the adhesive member 74 and the outer peripheral end of the adsorption portion of the adsorption head 75 (the distance in the radial direction) is equal to the entire circumference. As a result, when the first substrate W1 is pressed away from the pressure plate 71 by the adsorption head 75, the stress can be uniformly applied between the first substrate W1 and the adhesive member 74 to prevent the first The substrate W1 is broken. Moreover, this substrate peeling step will be described later. Each of the adsorption heads 75 is connected to the actuator 76 through the plate-shaped support member 82, and by the actuation of the actuator 76, all of the adsorption heads 75 can be simultaneously raised and lowered. In the first embodiment, the actuator 76 and the support member 82 constitute a second moving means. The actuator 76 is controlled by the control unit 35, and the adsorption head 75, the actuator 76, and the control unit 35 constitute a peeling control means. Further, in the actuator 76 of the first embodiment, by supplying air into the diaphragm (not shown), the driving member (not shown) connected to the supporting member 82 is moved up and down along the guide, thereby Each of the adsorption heads 75 is raised and lowered. The attachment member 84 is fixed to the upper surface of the pressure plate 71 by screws 83, and the attachment member 84 is fixed to the lower surface of the upper holder 51 by screws 85, so that the adhesion mechanism portion 52 is detachably attached to the upper holder 51.

Further, a plurality of adsorption holes 86 are formed in the pressure plate 71 between the respective adhesive members 74. Each of the adsorption holes 86 is connected to a line 87 for supplying a negative pressure, and the line 87 is connected to a negative pressure source 89 (see FIG. 5) through a valve 88 disposed outside the chamber 31. The opening and closing of the valve 88 is controlled by the control unit 35, and the valve 88 and the control unit 35 constitute an adsorption control means. Therefore, the first substrate W1 is degreased. The adhesion of the member 74 is further maintained by the vacuum adhesion through the adsorption holes 86. Further, the first substrate W1 can be peeled off from the adhesive member 74 by being pressed by the adsorption head 75.

As shown in FIG. 8, the chamber 31 is provided with a line 91 for supplying a negative pressure in the chamber 31, and the line 91 is connected to the negative pressure source 93 through a valve 92 disposed outside the chamber 31. Further, the line 42c is connected to a line 94 for making the pressure in the line 42c (back pressure of the second substrate W2) substantially equal to the pressure in the chamber 31, and a valve is provided in the line 94. 95. Further, the line 87 is connected to a line 96 for making the pressure in the line 87 (back pressure of the first substrate W1) substantially equal to the pressure in the chamber 31, and a valve is provided in the line 96. 97. The opening and closing of the valves 95 and 97 is controlled by the control unit 35 (see Fig. 2). The equal pressure control means is constituted by the valves 95, 97 and the control unit 35.

As described above, the first and second substrates W1 and W2 are carried into the pressing device 14 by the transport device 22. As shown in FIG. 2, the conveying device 22 includes a first robot arm 101 that holds the first substrate W1 and a second robot arm 102 that holds the second substrate W2. Between the lower substrate holding device 43 and the upper substrate holding device 55, the first substrate arm 101 is carried into the first substrate W1, and the second substrate arm 102 is carried into the second substrate W2. The main frame 103 is coupled to the base end of the first robot arm 101, and a plurality of upper arms 104 and a plurality of lower arms 105 are extended in parallel from the main frame 103. A plurality of adsorption pads 106 for adsorbing the first substrate W1 are coupled to the upper arms 104. The lower arm 105 can support the bonding substrate W3. The upper arm 104 is longer than the lower arm 105. When currently entering the chamber 31, the lower end of the front end of the upper arm 104 is located on the movement locus of the deflection preventing piece 46 of the lower substrate holding device 43.

9 and 10 show the positional relationship between the upper arm 104 of the first robot arm 101 holding the first substrate W1 and the chamber 31 of the upper substrate holding device 55. As shown in FIG. 10, a plurality of upper arms (6 in the first embodiment) are extended from the main frame 103. Seven adsorption pads 106a to 106g are provided in each of the upper arms 104. Further, each of the upper arms 104 is connected to the three pipes for supplying a negative pressure through the main frame 103. The three lines are connected to the negative pressure source 108 through three valves 107a to 107c disposed outside the main frame 103. The valves 107a to 107c are controlled by the control unit 35.

The three adsorption pads 106c, 106d, and 106e located at the center among the seven adsorption pads 106a to 106g of the upper arms 104 are opened and closed by a valve 107c. Further, the two adsorption pads 106b and 106f located outside the three adsorption pads 106c, 106d, and 106e are opened and closed by the valve 107b. Further, the two adsorption pads 106a and 106g located at the outermost side among the seven adsorption pads 106a to 106g are opened and closed by the valve 107a. This control is the same for each of the six upper arms 104.

Before the first substrate W1 is carried into the chamber 31, when the upper arm 104 is attracted to the first substrate W1, the valve 107c is first opened. Thereby, the central region of the upper surface (outer surface) of the first substrate W1 is adsorbed by the adsorption pads 106c, 106d, and 106e of the upper arms 104. Next, the valve 107b is opened. Thereby, in addition to the adsorption pads 106c, 106d, and 106e of the upper arms 104, the central regions of the upper surface of the first substrate W1 and the vicinity of the center of the outer side of the first substrate W1 are adsorbed by the adsorption pads 106b and 106f. Finally, the valve 107a is opened. Thereby, in addition to the adsorption pads 106c, 106d, and 106e of the upper arms 104 and the adsorption pads 106b and 106f, the central region of the upper surface of the first substrate W1, the vicinity of the center, and the like are adsorbed by the adsorption pads 106a and 106g. The outer area of the outer side. At this time, the upper surface of the first substrate W1 is held by all of the adsorption pads 106a to 106g of the upper arms 104.

Nine adsorption pads 58a to 58i are provided on each of the support bars 56 of the upper substrate holding device 55. Further, in each of the support bars 56, three pipes for supplying a negative pressure are connected through the connection frame 57. As shown in FIG. 9, the three lines are connected to the negative pressure source 110 through the three valves 109a to 109c disposed outside the connecting frame 57. The valves 109a to 109c are controlled by the control unit 35.

The three adsorption pads 58d, 58e, and 58f located at the center among the nine adsorption pads 58a to 58i of each of the support bars 56 are opened and closed by the valve 109c. Further, the two adsorption pads 58c and 58g located outside the three adsorption pads 58d, 58e, and 58f are opened and closed by the valve 109b. The four adsorption pads 58a, 58b, 58h, and 58i located outside the adsorption pads 58c and 58g are opened and closed by the valve 109a. The control as described above is also the same for each of the five support bars 56.

When the substrate holding device 55 adsorbs the first substrate W1, the valve 109c is first opened. Thereby, the central region of the upper surface (outer surface) of the first substrate W1 is adsorbed by the adsorption pads 58d, 58e, and 58f of the respective support bars 56. Next, the valve 109b is opened. Thereby, in addition to the adsorption pads 58d, 58e, and 58f of the support rods 56, the central portion of the upper surface of the first substrate W1 and the region near the center of the outer side of the first substrate W1 are adsorbed by the adsorption pads 58c and 58g. Finally, the valve 109a is opened. Thereby, in addition to the adsorption pads 58d, 58e, 58f and the adsorption pads 58c, 58g, the central region of the upper surface of the first substrate W1, the region near the center, and the like are further adsorbed by the adsorption pads 58a, 58b, 58h, 58i. The outer area of the outer side. At this time, the upper surface of the first substrate W1 is held by all of the adsorption pads 58a to 58i of the upper substrate holding device 55.

Fig. 11 shows a specific configuration of the adsorption pad 58a of the upper substrate holding device 55. The other adsorption pads 58b to 58i and the adsorption pads 106 of the first robot arm 101 are also configured in the same manner. The abutting member 111 is supported in the support rod 56 so as to be movable in the up and down direction, and the abutting member 111 is inserted in common to supply the negative pressure output pipe 112. The output pipe 112 is formed in the support rod 56 with a flange 113 that abuts against the abutting member 111. In addition to the support rod 56, a suction pad 58a formed in a bellows shape is attached to the front end of the output tube 112.

A coil spring 114 is disposed between the adsorption pad 58a and the support rod 56. By the elastic pressure of the coil spring 114 having the support rod 56 as a fulcrum, the suction pad 58 is biased at a position downward from the support rod 56, that is, downward. Further, in the support rod 56, a plurality of coil springs 115 are disposed around the output tube 112 between the abutting member 111 and the bottom side of the support rod 56. When the distance between the abutting member 111 and the bottom edge of the support rod 56 is equal to or less than a predetermined value, the upward biasing force acts on the abutting member 111 by the elastic pressure of the coil spring 115 having the support rod 56 as a fulcrum.

When the substrate holding device 55 receives the first substrate W1 from the first robot arm 101 in the state of FIG. 11 (a), the upward pressing pressure acts on the adsorption pad 58a. Therefore, as shown in Fig. 11 (b), the coil spring 114 is shortened to raise the adsorption pad 58a. Further, when the upper substrate holding device 55 hands the first substrate W1 to the adhesive mechanism portion 52 of the upper holding plate, the downward tensile force acts on the adsorption pad 58a. Therefore, as shown in Fig. 11 (c), the coil spring 114 is stretched and the coil spring 115 is shortened, and the suction pad 58a is lowered.

Next, the operation of the substrate bonding apparatus having the above configuration will be described with reference to Figs. 12 to 29 .

Before the first and second substrates W1 and W2 are carried in, as shown in FIG. 12, the first substrate W1 is adsorbed by the first robot arm 101, and the second substrate W2 is supported by the second robot arm 102. Further, the lower substrate holding device 43 is supported by the bonded substrate W3 to which the front cycle has been bonded.

From this state, the lower substrate holding device 43 is raised, and the first robot arm 101 is advanced into the chamber 31 which is in an open state (Fig. 13), and then descends (Fig. 14). In this state, the lower surface of the front end portion of the upper arm 104 of the first robot arm 101 is supported by the deflection preventing piece 46, and the weight of the upper arm 104 (and the first substrate W1) is corrected to sag.

Next, the upper substrate holding device 55 is lowered, and the upper surface (outer surface) of the first substrate W1 is adsorbed by the adsorption pad 58 (FIG. 15). Then, the first robot arm 101 releases the adsorption of the first substrate W1 and moves upward (FIG. 16), and then the lower substrate holding device 43 descends (FIG. 17). As a result, the bonded substrate W3 is in a state of being supported by the lower arm 105 of the first robot arm 101.

Next, the first robot arm 101 retreats to the outside of the processing chamber (Fig. 18). Then, the upper substrate holding device 55 is raised to move the first substrate W1 to the vicinity of the adhesive mechanism portion 52 (for example, 2 to 5 mm below the adhesive mechanism portion 52 (pressure plate 71)) (FIG. 19). 19 to 23, 28, and 29, for convenience of explanation, only the adhesive member 74 is shown, and the holding projection 74a is omitted. In the state of FIG. 19, each adsorption head 75 is simultaneously lowered to adsorb the upper surface of the first substrate W1 (FIG. 20), and then the upper substrate holding device 55 releases the adsorption of the first substrate W1 and moves upward (FIG. 21). Thereby, the first substrate W1 is held by the adsorption head 75 at a narrow interval between the respective adsorption pads 58 of the upper substrate holding device 55. Therefore, it is generated in a state of being held by the upper substrate holding device 55. The deflection is corrected and maintained in a high degree of flatness. Further, the contact surface 81 (see FIG. 7) of the adsorption head 75 is formed in a planar shape. Therefore, in a state where the adsorption head 75 adsorbs and holds the first substrate W1, the contact surface 81 of the adsorption head 75 is parallel to the pressure plate 71. As a result, the deflection of the first substrate W1 in contact with the contact surface 81 can be corrected and maintained in a state of higher flatness.

Next, the adsorption head 75 rises in a state where the first substrate W1 is vacuum-adsorbed. Thereby, the first substrate W1 is adhered to the holding protrusion 74a of the adhesive member 74 (FIG. 22). As a result, the first substrate W1 is held by the adhesive force of the adhesive member 74. In the state of FIG. 22, the negative pressure is supplied to the first substrate W1 through the adsorption holes 86, whereby the first substrate W1 is suction-adsorbed. Therefore, the first substrate W1 is surely held by the adhesive mechanism portion 52 (pressure plate 71) by the adhesive force of the adhesive member 74 and the negative pressure from the adsorption hole 86. Next, the adsorption of the adsorption head 75 is released, and the adsorption head 75 is moved upward (Fig. 23).

Next, the second robot arm 102 advances into the chamber 31 (FIG. 24), and the lower substrate holding device 43 is raised to support the second substrate W2 on the lower substrate holding device 43 (FIG. 25).

Next, the second robot arm 102 retreats to the outside of the chamber 31, and the lower substrate holding device 43 is lowered to support the second substrate W2 on the stage 42 (FIG. 26). In this state, the negative pressure is supplied to the second substrate W2 through the adsorption holes 42b, whereby the second substrate W2 is vacuum-adsorbed onto the stage 42 through the porous sheet 47. Then, the upper container 32 and the lower container 33 are closed (Fig. 27). In the above manner, the first and second substrates W1 and W2 are completed and carried into the chamber 31.

In this state, the valve 92 is opened to evacuate the inside of the chamber 31. At this time, the valves 95, 97 are also opened almost simultaneously with the opening of the valve 92. One side The pressure in the line 42c (back pressure of the second substrate W2) and the pressure in the line 87 (back pressure of the first substrate W1) are simultaneously reduced in pressure in the chamber 31 under reduced pressure. Further, the valves 48, 88 are closed after the valves 95, 97 are opened, or when the vacuum of the negative pressure source 93 approaches the vacuum of the negative pressure sources 49, 89. By the above control, the back pressures of the first and second substrates W1, W2 are controlled to be substantially the same pressure (or less) as the pressure in the chamber 31. Therefore, it is possible to prevent the first and second substrates W1 and W2 from being peeled off from the pressurizing plate 71 and the stage 42, respectively.

Next, as shown in FIG. 27, pressing treatment is performed in a reduced pressure state in the chamber 31, and the first and second substrates W1 and W2 are bonded together. At this time, alignment for correcting the relative positions of the two substrates W1 and W2 in the horizontal direction within a certain range is performed. With this position alignment, the fixing base 51 and the upper substrate holding device 55 are displaced in the horizontal direction, and are absorbed by the flexible coupling 60. After the bonding process is completed, as shown in FIG. 28, the adsorption head 75 presses the bonded substrate W3. Then, in a state where the pressure substrate W3 is brought into contact with the stage 42 by the adsorption head 75, as shown in FIG. 29, the pressure plate 71 is moved upward. As a result, the lower end of the adhesive member 74 (holding projection 74a) is positioned above the lower end of the adsorption head 75. That is, the contact surface 81 of the adsorption head 75 is positioned below the lower surface 73 of the pressure plate 71 by the rising pressure plate 71, whereby the bonded substrate W3 can be peeled off from the adhesive member 74. At the same time, the supply pressure is applied to the adsorption holes 86 of the pressure plate 71, so that the adhesive member 74 and the substrate W3 can be peeled off more quickly.

The substrate bonding apparatus of the first embodiment has the following advantages.

(1) The adhesive mechanism portion 52 is disposed between the two support bars 56 (adsorption pads 58) adjacent to each other on the lower surface of the upper holder 51. The adhesive mechanism portion 52 includes: a pressure plate 71 having a plurality of through holes 72; and a lower surface of the pressure plate 71 73 is provided as an adhesive member 74 that protrudes downward from the lower side 73. Further, the adhesive mechanism portion 52 includes a suction head 75 that is disposed in each of the through holes 72 and that is supported by the lower surface 73 of the pressure plate 71. The adsorption head 75 is moved by the upper substrate holding device 55 to the upper surface of the first substrate W1 in the vicinity of the adhesive mechanism portion 52. Further, the adhesive mechanism portion 52 includes an actuator 76 and a support member 82 for raising the adsorption head 75 so that the first substrate W1 held by the adsorption head 75 is adhered to the adhesive member 74. Here, the interval between the adsorption heads 75 that rise and fall in the through hole 72 of the adhesive mechanism portion 52 is narrower than the interval between the two support rods 56 (adsorption pads 58) adjacent to the adhesive mechanism portion 52. Therefore, when the adhesive mechanism portion 52 receives the first substrate W1 held by the upper substrate holding device 55, the adsorption head 75 of the adhesive mechanism portion 52 holds the first substrate at a shorter interval than the adsorption pad 58 of the upper substrate holding device 55. Above W1 (see Figure 20). Therefore, even if the first substrate W1 held by the adsorption pad 58 is deflected by its own weight, the first substrate W1 can be held by the adsorption pad 58 to correct the deflection. Therefore, the first substrate W1 can be held in a high flatness state. Further, when the first substrate W1 held by the adsorption head 75 is attached to the adhesive member 74, the first substrate W1 is adhered to the holding projection 74a. At this time, the first substrate W1 is surely held by the adsorption force of the adsorption head 75 and the adhesive force of the adhesive member 74. Therefore, the first substrate W1 can be reliably held by the adhesive member 74 of the pressure plate 71 in a state where the first substrate W1 is held at a high flatness.

(2) The contact surface 81 of the adsorption head 75 is formed in a planar shape, and the first substrate W1 held by the adsorption head 75 is parallel to the pressure plate 71. Thereby, when the first substrate W1 abuts on the contact surface 81, the first substrate W1 is corrected to a plane. In the shape, the flatness of the first substrate W1 can be further improved.

(3) Since the adhesive member 74 is annularly provided around each of the through holes, the first substrate W1 can be brought into contact with the adhesive member 74 by the peripheral portion of the adsorption head 75. Therefore, the first substrate W1 can be reliably adhered and held.

(4) The pressure plate 71 is moved upward so that the lower surface of the adsorption head 75 (contact surface 81) is adhered by the adsorption head 75 pressing the bonded substrate W3 against the stage 42 (lower holding plate). Below the lower end of member 74 (see Figure 29). Therefore, since the bonded substrate W3 is peeled off from the pressurizing plate 71 (adhesive member 74) in a state of abutting against the stage 42, the bonded substrate W3 can be prevented from falling and being damaged. also. It is not necessary to separately provide a configuration for peeling off the bonded substrate W3 from the adhesive member 74, and the bonded substrate W3 can be peeled off from the adhesive member 74 by the adsorption head 75.

(5) When the inside of the chamber 31 is evacuated, the valves 95 and 97 are opened simultaneously with the opening of the valve 92, and the pressure in the line 42c is made while the pressure in the chamber 31 is reduced (the second substrate W2) The back pressure) and the pressure in the line 87 (back pressure of the first substrate W1) are simultaneously reduced in pressure. Thereby, since the back pressures of the first and second substrates W1 and W2 can be controlled to be substantially the same as the pressure in the chamber 31, it is possible to prevent the first and second substrates W1 and W2 from being respectively removed from the stage 42 and the pressure plate. 71 peeling off.

(6) The plurality of adhesive mechanism portions 52 are arranged in an array on the lower surface of the upper holder 51, and the first substrate W1 is held by the plurality of adhesive mechanism portions 52. Therefore, even if the first substrate W1 is large, the first substrate W1 can be held while the size of each of the adhesive mechanism portions 52 is prevented from being increased.

(7) A receiving groove 52a for accommodating the two support bars 56 corresponding to the upper substrate holding device 55 is provided on both sides of each of the adhesive mechanism portions 52. The receiving groove 52a The receiving support rod 56 is positioned above the lower surface 73 of the pressure plate 71. Therefore, since the support rod 56 accommodated in the accommodation groove 52a is not exposed below the lower surface 73 of the pressure plate 71, the first substrate W1 can be prevented from interfering with the support rod 56. Further, in this configuration, since the accommodation groove 52a for accommodating the support rod 56 (adsorption pad 58) is disposed between the adhesive mechanism portions 52, the upper surface of the first substrate W1 (outer surface) can be maintained on the inner surface side of the fixed base 51. . Therefore, as compared with the case where the first substrate W1 is adsorbed and held only from the periphery of the upper holder 51, the deflection of the first substrate W1 can be made small, and the adsorption head 75 can surely contact the first substrate W1. As a result, the first substrate W1 can be reliably adsorbed and held.

(8) Each of the adhesive mechanism portions 52 is provided to be detachable from the upper holder 51 by a screw 83. Therefore, when any of the adhesive mechanism portions 52 is defective, only the defective adhesive mechanism portion 52 can be replaced. Therefore, compared with the case where all of the upper mount 51 and the adhesive mechanism portion 52 are replaced, it is possible to suppress an increase in cost.

(Second embodiment)

Hereinafter, a substrate bonding apparatus according to a second embodiment of the present invention will be described with reference to the drawings. Further, the second embodiment differs from the above-described first embodiment mainly in the configuration of the adsorption head. Therefore, in the convenience of the description, the same portions as those in the first embodiment will be denoted by the same reference numerals and will not be described.

As shown in FIG. 30, the adsorption head 121 of the second embodiment includes a main body portion 122 that is fixed to the support member 82 and has a substantially cylindrical shape, an adsorption portion 123 that is disposed below the main body portion 122, and a lower end portion that is disposed at the lower end of the main body portion 122. And supporting the elastic support portion 124 of the adsorption portion 123.

A circular recess 131 is formed at a lower end of the body portion 122. Further, the body portion 122 is formed to be connected to the conduit 77 (ie, the negative pressure source 79 of FIG. 5). The vent hole 133 is opened at the bottom surface 132 of the recess 131 (the lower end of the body portion 122). The vent hole 133 has a substantially T-shaped cross section in the vertical direction. Further, an extension portion 134 extending outward in the radial direction is formed at a lower end of the main body portion 122, and an annular fixing portion 135 is screwed to the outer periphery of the extension portion 134. The main body portion 122 and the fixing portion 135 are formed of a highly rigid material such as stainless steel.

The adsorption portion 123 is formed substantially in a columnar shape, and a flange portion 141 extending outward in the radial direction is formed in a lower portion thereof. Further, in the adsorption unit 123, the suction hole 142 that can communicate with the vent hole 133 and open at the lower end of the adsorption unit 123 is formed to have the same diameter as the vent hole 133. Further, a contact surface 143 that is in contact with the first substrate W1 and an inclined surface 144 that is inclined upward from the contact surface 143 at the center of the adsorption portion 123 are formed at the lower end of the adsorption portion 123. Further, a step portion 145 having a smaller diameter than the shaft diameter of the upper end of the adsorption portion 123 is formed in the adsorption portion 123.

The elastic support portion 124 closes between the main body portion 122 and the adsorption portion 123, and supports the main body portion 122 and the adsorption portion 123 in such a manner as to be able to contact/disengage. Specifically, the outer peripheral edge of the elastic support portion 124 is fixed between the fixed portion 135 and the extended portion 134 of the main body portion 122 through the annular cushioning member 136 and the ring 137 disposed in the fixed portion 135. The inner circumference of the elastic support portion 124 is inserted into the step portion 145. Therefore, the adsorption portion 123 is supported by the elastic support portion 124. Further, the cushioning member 136 is made of an elastic material such as rubber, and the ring 137 is made of a metal material such as iron. Further, in a state where vacuum adsorption is not performed, the bottom surface 132 of the main body portion 122 is finely separated from the upper end surface 146 of the adsorption portion 123, and the adsorption portion 123 can be tilted. On the other hand, in When the first substrate W1 is vacuum-adsorbed, the adsorption portion 123 is adsorbed by the main portion 122, and the upper end surface 146 of the adsorption portion 123 abuts against the bottom surface 132 of the main body portion 122 to restrict the tilting movement of the adsorption portion 123. Further, in the second embodiment, when the upper end surface 146 of the adsorption portion 123 abuts against the bottom surface 132 of the main body portion 122, a space 138 surrounded by the main body portion 122 and the adsorption portion 123 and the elastic support portion 124 is formed in the main body portion. 122, a communication hole 139 capable of connecting the space 138 and the vent hole 133 is formed. Further, a large diameter portion 141a extending outward from the flange portion 141 in the radial direction is formed on the outer circumferential surface of the flange portion 141, and an inner circumferential surface of the fixing portion 135 extends beyond the position of the large diameter portion 141a. There is a small diameter portion 135a that faces the outer peripheral surface of the flange portion 141. Therefore, the adsorption portion 123 is supported by the elastic support portion 124 in a state where the large diameter portion 141a is located above the small diameter portion 135a. When the large diameter portion 141a can abut against the small diameter portion 135a, the distance from which the adsorption portion 123 can be separated from the main body portion 122 and the amount of tilt movement of the adsorption portion 123 are limited to a predetermined range. Thereby, the adsorption portion 123 is prevented from being tilted and moved by a predetermined range or more so as to fall off from the elastic support portion 124.

In the second embodiment, the bottom surface 132 of the concave portion 131 and the upper end surface 146 of the adsorption portion 123 are formed substantially parallel to the lower surface 73 of the pressure plate 71, and the contact surface 143 of the adsorption portion 123 is formed to be in contact with the pressure plate 71. The 73 below is roughly parallel. When the adsorption head 121 adsorbs the first substrate W1, the upper end surface 146 of the adsorption portion 123 abuts against the bottom surface 132 of the concave portion 131 to restrict the tilting movement of the adsorption portion 123, so that the contact surface 143 of the adsorption portion 123 is substantially parallel to the addition. The lower surface 73 of the pressure plate 71. Further, the adhesive member 74 is fixed to the base portion 151 having substantially the same shape as the adhesive member 74, and is fixed to the pressure plate 71 by screws 152.

Next, the operation of the substrate bonding apparatus will be described. Since the operation of the substrate bonding apparatus is the same as that of the first embodiment, the adsorption operation of the adsorption head 121 will be described here with reference to Figs. 31 to 35 are views corresponding to Figs. 19 to 23 of the first embodiment, and are partial cross-sectional views of the adsorption head 121 including the substrate bonding apparatus.

As shown in FIG. 31, the first substrate W1 is deflected by its own weight or the like in a state of being vacuum-adsorbed by the adsorption pad 58. Next, as shown in FIG. 32, each adsorption head 121 is lowered to adsorb the upper surface of the first substrate W1. At this time, the adsorption portion 123 of the adsorption head 121 moves obliquely along the deflection of the first substrate W1, and the entire circumference of the contact surface 143 of the adsorption portion 123 contacts the first substrate W1. Therefore, the first substrate W1 can be surely vacuum-adsorbed by the adsorption head 121. Further, since the inclined surface 144 is formed at the lower end of the adsorption portion 123, the difference in pressure difference (pressure difference) between the inner side and the outer side of the adsorption portion 123 can be increased without the inclined surface 144, and the adsorption can be made by adsorption. The portion of the portion 123 that adsorbs the first substrate W1 is enlarged. As a result, the first substrate W1 can be firmly vacuum-adsorbed.

Next, as shown in FIG. 33, the upper substrate holding device 55 releases the adsorption of the first substrate W1 and moves upward. Thereby, the first substrate W1 is held by the adsorption head 121 at a narrow interval between the adsorption pads 58 of the upper substrate holding device 55. Thereby, the deflection of the first substrate W1 is prevented, and the first substrate W1 is maintained in a state of high flatness. In addition, the tilting movement of the adsorption unit 123 is restricted while the adsorption head 121 adsorbs and holds the first substrate W1, and the contact surface 143 of the adsorption unit 123 is parallel to the lower surface 73 of the pressure plate 71. Therefore, the deflection of the first substrate W1 is more reliably prevented. The first substrate W1 is held at a higher flatness. Moreover, at this time, the main body portion 122 and the adsorption portion 123 are The air in the space 138 surrounded by the elastic support portion 124 is attracted through the communication hole 139. Therefore, when the chamber 31 is evacuated in a vacuum, the pressure in the space 138 can be prevented from being higher than the pressure in the chamber 31. Thereby, the elastic support portion 124 is prevented from being deformed by the difference between the pressure in the space 138 and the pressure in the chamber 31 to prevent the adsorption portion 123 from moving.

Next, as shown in FIG. 34, the adsorption head 121 rises in a state where the first substrate W1 is vacuum-adsorbed, and the first substrate W1 is adhered to the holding protrusion 74a of the adhesive member 74. In this state, the first substrate W1 is held by the adhesive force of the adhesive member 74 and the vacuum suction force of the adsorption head 121. Next, as shown in FIG. 35, the adsorption head 121 releases the vacuum adsorption of the first substrate W1 and moves upward. Then, similarly to the above-described first embodiment, bonding of the first substrate W1 and the second substrate W2 is performed.

The substrate bonding apparatus of the second embodiment has the following advantages in addition to the advantages of the first embodiment described above.

(9) Since the adsorption portion 123 of the adsorption head 121 is configured to be tiltably movable, when the adsorption portion 123 abuts against the first substrate W1, it moves obliquely along the deflection of the first substrate W1. Thereby, the entire circumference of the contact surface 143 of the adsorption portion 123 can be brought into contact with the first substrate W1. Therefore, the first substrate W1 can be surely vacuum-adsorbed by the adsorption head 121, and the first substrate W1 can be surely brought into contact with the adhesive member 74.

(10) The contact surface 143 of the adsorption unit 123 is formed in a planar shape, the adsorption head 121 adsorbs and holds the first substrate W1, and the tilting movement of the adsorption unit 123 is restricted, so that the lower surface 73 of the pressure plate 71 and the contact surface 143 become flat. Therefore, the adsorption head 121 (adsorption portion 123) can hold the first substrate with high flatness. W1.

(11) The adsorption head 121 includes a main body portion 122 and an adsorption portion 123 disposed below the main body portion 122. The main body portion 122 has a vent hole 133 that is connected to the negative pressure source 79 and opens to the bottom surface 132 of the concave portion 131. The adsorption portion 123 has a suction hole 142 that is connected to the vent hole 133 and that is open at the lower end of the adsorption portion 123. Further, the adsorption head 121 is fixed to the main body portion 122, and includes an elastic support portion 124 that closes between the main body portion 122 and the adsorption portion 123 and supports the main body portion 122 and the adsorption portion 123 so as to be in contact with and separated. The adsorption portion 123 is tiltably movable when it is separated from the main body portion 122, and restricts the oblique movement when it abuts against the main body portion 122. The adsorption unit 123 deforms the elastic support portion 124 and moves obliquely while being separated from the main body portion 122. In the present configuration, as compared with the case where the bellows-like adsorption portion is provided at the lower end of the main body portion, the adsorption portion 123 can be largely tilted and moved even if the axial length of the adsorption head 121 is shortened. Therefore, the size of the adsorption head 121 can be reduced.

(12) A communication hole 139 through which the vent hole 133 communicates with the space 138 is formed in the adsorption head 121. Since air is sucked from the space 138 through the communication hole 139, it is possible to prevent the pressure in the space 138 from being higher than the pressure in the chamber 31 in a state where the chamber 31 is evacuated. Therefore, it is possible to prevent the elastic support portion 124 from being deformed to prevent the adsorption portion 123 from generating an unintended operation.

(13) Since the adhesive member 74 is fixed to the pressure plate 71 through the base portion 151 by using the screw 152, for example, when the adhesive member 74 is deteriorated, it is not necessary to replace the entire pressure plate 71, and only the deteriorated adhesive member 74 can be replaced. Therefore, an increase in cost can be suppressed.

(14) Since the inclined surface 144 is formed at the lower end of the adsorption portion 123, When the contact surface is formed only at the lower end of the adsorption portion 123, the difference in pressure (pressure difference) between the inside and the outside of the adsorption portion 123 can be increased. Thereby, the area of the adsorption first substrate W1 is increased by the adsorption unit 123, and the first substrate W1 can be firmly vacuum-adsorbed.

(15) The large diameter portion 141a is formed on the outer circumferential surface of the flange 141, and the small diameter portion 135a that can abut against the large diameter portion 141a is formed on the inner circumferential surface of the fixing portion 135. Therefore, the adsorption unit 123 is supported by the elastic support portion 124 in a state where the small diameter portion 135a of the large diameter portion 141a is located above. Since the large diameter portion 141a can abut against the small diameter portion 135a, the distance from which the adsorption portion 123 can be separated from the main body portion 122 and the amount of tilt movement of the adsorption portion 123 are limited to a predetermined range. Thereby, it is possible to prevent the adsorption portion 123 from falling off from the elastic support portion 124 by obliquely moving over a predetermined range.

(Third embodiment)

Hereinafter, a substrate bonding apparatus according to a third embodiment of the present invention will be described with reference to the drawings. Further, the third embodiment differs from the above-described first embodiment mainly in the configuration of the adhesive member. Therefore, in the convenience of the description, the same portions as those in the first embodiment will be denoted by the same reference numerals and will not be described.

As shown in Fig. 36, on the lower surface 73 of the pressurizing plate 71, a full sheet-like (flat-plate) adhesive member 161 of the lower surface 73 is fixedly covered by a screw (not shown). Specifically, the flat adhesive member 161 has a hole at a position corresponding to the through hole 72 of the pressure plate 71, the suction hole 86, and the attachment hole of the screw 83. In the adhesive member 161, the vicinity of the adsorption head 75 is defined such that the first substrate W1 contacts the contact region T of the adhesive member 161 (the region surrounded by the two-dot chain line in Fig. 36) when the adsorption head 75 is raised. In the contact area T, A plurality of holding projections 161a are annularly arranged on the adhesive member 161. Further, outside the contact region T, a plurality of pressurizing projections 161b (pressurizing portions) having a checkerboard shape are formed in the adhesive member 161. The holding projection 161a and the pressurizing projection 161b are formed at substantially the same height. Further, in the third embodiment, the holding projection 161a and the pressurizing projection 161b are formed in a substantially hemispherical shape.

Next, the pressurizing plate 71 is pressed against the first substrate W1 through the adhesive member 161 which is provided to protrude below the lower surface 73 of the pressurizing plate 71. Therefore, when the adhesive member 74 is provided only in the contact region T as in the first embodiment, the first substrate W1 cannot be directly pressed outside the contact region T, and the bonding of the two substrates W1 and W2 cannot be sufficiently performed. Hey. On the other hand, according to the third embodiment, the pressurizing projection 161b is provided in addition to the holding projection 161a in the contact region T and outside the contact region T. Thereby, even when the two substrates W1 and W2 are bonded together, the first substrate W1 can be directly pressed by the pressurizing protrusion 161b even outside the contact region T of the lower surface 73 of the pressurizing plate 71. Therefore, the bonding can be sufficiently performed.

The substrate bonding apparatus of the third embodiment has the following advantages in addition to the advantages of the first embodiment described above.

(16) An adhesive member 161 covering the entire lower surface 73 is provided on the lower surface 73 of the pressing plate 71, and a pressurizing projection 161b is formed outside the contact region T of the adhesive member 161. Therefore, when the two substrates W1 and W2 are to be bonded together, the first substrate W1 can be directly pressed by the pressurizing protrusion 161b even in the contact region T. Therefore, the bonding of the substrates W1 and W2 can be sufficiently performed. For example, by increasing the number of the adsorption heads 75 of one pressure plate 71 (adhesion mechanism portion 52) to increase the ratio of the contact regions T, the bonding ability can also be improved. However, in this case The configuration of the adhesive mechanism portion 52 becomes complicated. Therefore, in the third embodiment, since the pressure-adhering member 161b is formed by the adhesive member 161, the bonding ability can be improved with a simple structure.

(17) The adhesive member 161 is provided to cover the entire lower surface 73 of the pressure plate 71, and the pressurizing protrusion 161b is integrally formed on the adhesive member 161. Therefore, the number of members can be reduced as compared with the case where the adhesive member 161 is formed as another member and disposed on the lower surface 73 of the pressure plate 71.

(Fourth embodiment)

Hereinafter, a substrate bonding apparatus according to a fourth embodiment of the present invention will be described with reference to the drawings. Further, the fourth embodiment differs from the above-described first embodiment mainly in the configuration of the adhesive member. Therefore, in the convenience of the description, the same portions as those in the first embodiment will be denoted by the same reference numerals and will not be described.

As shown in Fig. 37, a plurality of (for example, eight in Fig. 37) adhesive members 200 are provided on the lower surface 73 of the pressurizing plate 71. The eight adhesive members 200 are disposed in eight through holes as in the first embodiment. 72 corresponds to the location. That is, the eight adhesive members 200 are arranged in a square frame shape at predetermined intervals around the lower surface 73 of the pressure plate 71. Each of the adhesive members 200 is formed in an annular shape and surrounds the entire through hole 72 corresponding thereto. Each of the adhesive members 200 is preferably an adhesive sheet made of butadiene rubber, and can temporarily hold the substrate (in this case, the first substrate W1), and can quickly peel off the substrate W1. As shown in FIG. 38, each of the adhesive members 200 is provided on the pressure plate 71 so as to be flush with the lower surface 73 of the pressure plate 71. That is, the lower surface 200a of each of the adhesive members 200 is located in the same plane as the lower surface 73 of the pressure plate 71. The structure of the fourth embodiment also has substantially the same advantages as the first embodiment. Also, with the first implementation In the same manner, a holding protrusion 74a (holding portion) that protrudes downward may be provided in the surface of each of the adhesive members 200.

Further, each of the above embodiments may be implemented as follows.

. In the above embodiments, the first substrate W1 is held by the eight adsorption heads 75 (or 121). However, the present invention is not limited thereto, and the adsorption heads 75 are disposed in one pressure plate 71 (adhesion mechanism portion 52) (or 121) The number can be any number.

. In each of the above embodiments, a plurality of the adsorption heads 75 (or 121) are arranged in a square frame shape in the pressure plate 71. However, the arrangement of the plurality of adsorption heads 75 and 121 may be, for example, an annular shape or a triangular frame shape. , in addition, can also be arranged randomly.

. In the first and third embodiments, the flange portion 80 extending outward in the radial direction is formed at the lower end of the adsorption head 75, whereby the contact surface 81 is formed in a planar shape parallel to the pressure plate 71, but is not limited thereto. Therefore, the flange portion 80 may not be provided as long as the contact surface 81 has a flat shape.

. In the second embodiment, the contact surface 143 is formed in a planar shape, and the tilting movement of the adsorption portion 123 is restricted in a state where the adsorption head 121 adsorbs and holds the first substrate W1, and the contact surface 143 is formed below the pressure plate 71. 73 is parallel, but is not limited thereto, and the adsorption portion 123 may be formed not to be parallel to the lower surface 73.

. In the second embodiment, the lower surface of the fixing portion 135 may be formed in a planar shape parallel to the lower surface 73 of the pressure plate 71, and the adsorption portion 123 may be positioned closer to the fixing portion 135 than the fixing portion 135. Upper, the first substrate W1 is brought into contact with the lower surface of the fixing portion 135 to correct the deflection.

. In the second embodiment described above, the adsorption head 121 includes the main body portion 122, the elastic support portion 124, and the adsorption portion 123, but is not limited thereto. E.g, A bellows-like adsorption portion may be provided at a lower end of the body portion 122. Further, the entire adsorption head 121 can be tilted and moved.

. In the first and second embodiments, the adhesive member 74 is formed in a ring shape. However, the adhesive member 74 is not limited thereto, and may be a circular shape or a polygonal shape such as a triangle or a square. Further, the adhesive member 74 may not be provided over the entire circumference of the through hole, and may have any shape.

. In the third embodiment, the adhesive member 161 is formed to cover the entire lower surface 73 of the pressure plate 71 and the pressure protrusion 161b is integrally formed on the adhesive member 161. However, the present invention is not limited thereto, and for example, it may have a pressure protrusion. A plurality of additional adhesive members are disposed outside the contact area T. Further, the pressurizing protrusion may be formed on the lower surface 73 of the pressure plate 71 by forming a material other than the adhesive member.

. In each of the above embodiments, the substantially hemispherical shape holding projections 74a and 161a are arranged in a ring shape in the adhesive members 74 and 161. However, the present invention is not limited thereto, and any arrangement may be employed.

. In the above-described first and second embodiments, the holding member 74a having a substantially hemispherical shape is formed in the adhesive member 74. However, the present invention is not limited thereto, and the holding projection 74a may be formed in a shape such as a triangular pyramid or a column. . Further, the holding projection 74a may be formed as a step portion having a different step in the radial direction.

. It is not necessary to form the retaining projection 74a.

. In addition to the through hole 72 or the adsorption hole 86, an adhesive member 74 may be entirely formed on the lower surface 73 of the pressure plate 71.

. For example, the contact faces 81 and 143 may be formed in an annular shape, and the adhesive member 74 may be formed in a non-annular shape such as a triangular frame shape. In this case, the more sticky The outer diameter of the member is smaller, and the contact area between the adhesive member and the contact surface becomes smaller. Therefore, the first substrate W1 can be peeled off from the adhesive member with a small pressing force.

. In the first embodiment, the adhesive member 74 is fixed next to the adhesive member 74. However, the adhesive member 74 is not limited thereto. Further, as in the second embodiment, the adhesive member 74 may be fixed to the base portion 151 having substantially the same shape as the adhesive member 74, and may be fixed by screws 152 or the like. On the pressure plate 71. Similarly, in the second and third embodiments, the adhesive member 74 may be fixed next.

. In the third embodiment, the adhesive member 161 is formed in a sheet shape so that the adhesive member 161 covers the entire lower surface 73 of the pressure plate 71. However, the present invention is not limited thereto, and the pressure protrusion 161b may be integrally formed. Cover the full range of 73 below.

. In the above-described embodiments, the bonding substrate W3 is pressed against the stage 42 (lower holding plate) by the adsorption heads 75 and 121, and the pressure plate 71 is moved upward in this state. However, the pressure plate 71 is not limited thereto. The peeling control means (the adsorption head 75 (121), the actuator 76, and the control unit 35) raises the pressure plate 71, just before the pressure plate 71 rises, and immediately after the pressure plate 71 rises At any one of the times, the bonded substrate W3 is pressed by a plurality of adsorption heads 75 (121). By the operation of the peeling control means, it is not necessary to separately provide a structure for peeling off the bonded substrate W3 from the adhesive member 74, and the bonded substrate W3 can be peeled off from the adhesive member 74 by the adsorption head 75 (121).

. In the above embodiments, the plurality of adhesive mechanism portions 52 are arranged in an array on the lower surface of the upper holder 51. However, the present invention is not limited thereto. For example, a plurality of the adhesive mechanism portions 52 may be arranged in a ring shape. Further, only one adhesive mechanism portion 52 may be provided below the upper holder 51. At this time, by having and One of the adhesive mechanism portions 52 having the same structure as the pressure plate 71 shown in Fig. 6 and the upper fixing base 51 constitute an upper holding plate.

. In the above embodiments, the adhesive mechanism portion 52 is detachably attached to the upper holder 51. However, the present invention is not limited thereto. For example, the upper fixing base 51 may be welded to the upper holder 51 so as not to be attached or detached.

. In the above-described embodiments, the first substrate W1 is vacuum-adsorbed by the adhesive member 74, and the first substrate W1 is vacuum-adsorbed by the adsorption holes 86. However, the first substrate W1 is not limited thereto, and the adsorption head 75 may be taken from the upper substrate holding device 55. After the first substrate W1, the first substrate W1 is subjected to vacuum adsorption before being brought into contact with the adhesive member 74.

. In the above embodiments, the second substrate W2 is held by the stage 42 and the first substrate W1 is held by the pressing plate 71. However, the first substrate W1 is not limited thereto, and the first substrate W1 may be held on the stage 42. 2 The substrate W2 is held by the pressure plate 71.

. In each of the above embodiments, the adhesive mechanism portion may be provided on the lower holder 41, and the second substrate W2 may be held by the adhesive mechanism portion.

. In the above embodiments, the actuator 76 is configured such that air is supplied to the diaphragm and the driving member fixed to the support member 82 is moved up and down along the guide. However, the actuator 76 is not limited thereto. It is a drive mechanism such as a motor.

. In each of the above embodiments, the adsorption hole 86 is provided in the adhesion mechanism portion 52 (the pressure plate 71), but the invention is not limited thereto, and the adsorption hole 86 may not be provided.

. In each of the above embodiments, the contact region T is a region indicated by the two-dot chain line of FIGS. 6 and 35, but is not limited thereto, and the material or shape of the substrate can be considered. The shape, or the shape of the contact faces 81, 143, etc. are changed.

. In the first and second embodiments described above, a pressurizing protrusion (pressurizing portion) may be provided on the lower surface 73 of the pressurizing plate 71.

13‧‧‧Substrate bonding device

14‧‧‧ Pressing device

51‧‧‧上固定座

52‧‧‧Adhesive Department

52a‧‧‧storage trough

53‧‧‧ drive

56‧‧‧Support bar

58a~58i‧‧‧Adsorption pad

59‧‧‧ fulcrum

60‧‧‧Flexible coupling

61‧‧‧ lifting shaft

71‧‧‧ Pressurized plate

72‧‧‧through holes

73‧‧‧Under the pressure plate

74,161,200‧‧‧Adhesive members

74a, 161a‧‧‧ Keeping the protrusion

75, 121‧‧‧Adsorption head

76‧‧‧Actuator

79‧‧‧Negative source

81, 143‧‧ ‧ contact surface

82‧‧‧Support components

86‧‧‧Adsorption holes

122‧‧‧ Body Department

123‧‧‧Adsorption Department

124‧‧‧Flexible Support Department

133‧‧‧vents

138‧‧‧ space

139‧‧‧Connected holes

142‧‧‧Attraction hole

161b‧‧‧ Pressurized protrusion

T‧‧‧Contact area

W1‧‧‧1st substrate

W2‧‧‧2nd substrate

Fig. 1 is a block diagram showing a schematic configuration of a panel manufacturing apparatus.

Fig. 2 is a general view showing a schematic configuration of a pressing device according to the first embodiment.

Fig. 3 is a plan view showing the lower substrate holding device.

Fig. 4 is a perspective view showing a stage and a porous sheet.

Fig. 5 is a bottom view showing the upper substrate holding device and the upper holder.

Fig. 6 is a bottom view showing the adhesive mechanism portion of the first embodiment.

Figure 7 is a cross-sectional view taken along line A-A of Figure 6.

Fig. 8 is a conceptual diagram showing a schematic configuration of a pressure reducing mechanism and an adsorption mechanism.

Fig. 9 is a side view showing the upper substrate holding device and the first robot arm.

Fig. 10 is a bottom view showing the upper substrate holding device and the first robot arm.

Fig. 11 (a), (b) and (c) are cross-sectional views showing the adsorption pad.

Fig. 12 is a view showing an operational procedure of the substrate bonding apparatus according to the first embodiment.

Fig. 13 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 14 is a view showing an operational procedure of the substrate bonding apparatus according to the first embodiment.

Fig. 15 is a view showing the operation steps of the substrate bonding apparatus of the first embodiment.

Fig. 16 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 17 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 18 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 19 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 20 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 21 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 22 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 23 is a view showing the operation steps of the substrate bonding apparatus of the first embodiment;

Fig. 24 is a view showing an operational procedure of the substrate bonding apparatus of the first embodiment;

Fig. 25 is a view showing the operation steps of the substrate bonding apparatus of the first embodiment.

Fig. 26 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment.

Fig. 27 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment;

Fig. 28 is a view showing the operation steps of the substrate bonding apparatus of the first embodiment;

Fig. 29 is a view showing the operational steps of the substrate bonding apparatus of the first embodiment;

Fig. 30 is a partial cross-sectional view showing an adhesive mechanism portion of the adsorption head according to the second embodiment.

Fig. 31 is a view showing the operational steps of the substrate bonding apparatus of the second embodiment.

Fig. 32 is a view showing the operation steps of the substrate bonding apparatus of the second embodiment.

Fig. 33 is a view showing the operational steps of the substrate bonding apparatus of the second embodiment.

Fig. 34 is a view showing the operational steps of the substrate bonding apparatus of the second embodiment.

Fig. 35 is a view showing the operation steps of the substrate bonding apparatus of the second embodiment.

Fig. 36 is a bottom view showing the adhesive mechanism portion of the third embodiment.

Fig. 37 is a bottom view showing the adhesive mechanism portion of the fourth embodiment.

Figure 38 is a cross-sectional view taken along line A-A of Figure 37.

52‧‧‧Adhesive Department

71‧‧‧ Pressurized plate

72‧‧‧through holes

73‧‧‧Under the pressure plate

74‧‧‧Adhesive members

74a‧‧‧ Keeping the protrusion

75‧‧‧Adsorption head

76‧‧‧Actuator

81‧‧‧Contact surface

82‧‧‧Support components

83‧‧‧ screws

84‧‧‧Installation components

86‧‧‧Adsorption holes

T‧‧‧Contact area

Claims (17)

A substrate bonding apparatus for holding a first substrate (W1) on an upper holding plate (51, 52) and a second substrate (W2) in a lower holding plate (41) in a processing chamber (31) under atmospheric pressure 42) The first substrate and the second substrate are bonded together under reduced pressure in the processing chamber, and the moving mechanism portion (53, 55, 58 to 61) is provided to have a plurality of adsorptions of the first substrate Adsorption pads (58); and first moving means (53, 55, 59, 60, 61) for raising the plurality of adsorption pads to move the first substrate to the vicinity of the upper holding plate; and an adhesive mechanism portion ( 52) disposed between the plurality of adsorption pads and mounted on the upper holding plate (51); the adhesive mechanism portion includes: a pressure plate (71) disposed between the plurality of adsorption pads, a plurality of through holes (72); the adhesive member (74 or 161) is disposed on the pressing plate so as to protrude below the pressing plate; a plurality of adsorption heads (121) are respectively disposed in the plurality of The inside of the through hole is supported by the adhesive mechanism portion so as to be able to enter and exit downward from the lower surface of the pressure plate, and can be adsorbed to the card by the moving mechanism portion The first substrate in the vicinity of the plate; and the second moving means (76, 82), the plurality of adsorption heads are raised to adhere the first substrate adsorbed by the plurality of adsorption heads to the adhesive member; Each of the adsorption heads (121) includes an adsorption portion (123) for adsorbing the first substrate, and at least the adsorption portion (123) of each adsorption head is configured to be tiltable; The adsorption portion (123) has a contact surface (143) that is in contact with the first substrate, and restricts the tilting movement of the adsorption portion in a state in which the adsorption head adsorbs the first substrate to make the lower surface of the pressure plate and the adsorption portion The contact faces become parallel. The substrate bonding apparatus according to claim 1, wherein the contact surface of the adsorption portion is formed in a planar shape. The substrate bonding apparatus of claim 1, wherein the contact surface of the adsorption portion is formed in an annular shape; the adhesive member is formed in an annular shape surrounding the contact surface; and the adhesive member is disposed in the adsorption portion On the same axis. The substrate bonding apparatus of claim 1, wherein the adsorption head (121) comprises a body portion (122) having a vent hole (133) connected to the negative pressure source (79), wherein the vent hole is The body portion is formed to open at a lower end of the body portion; the adsorption head further includes an elastic support portion (124) disposed between the body portion and the adsorption portion disposed under the body portion to close the The main body portion and the adsorption portion are elastically deformable to selectively perform an operation of the adsorption portion abutting on the main body portion and an operation of the adsorption portion to be separated from the main body portion; the adsorption portion is provided in the adsorption portion a suction hole (142) that is open at a lower end of the adsorption portion and that can be coupled to the vent, and the adsorption portion can be tilted when the adsorption portion is separated from the body portion, and the adsorption portion abuts against the body portion The tilting movement of the adsorption portion is restricted. The substrate bonding apparatus of claim 4, wherein the body portion further has a communication hole (139), the communication hole being in the body portion The body portion is connected to a space (138) surrounded by the adsorption portion and the elastic support portion, and a vent hole of the body portion. The substrate bonding apparatus according to claim 1, wherein when the plurality of adsorption heads adsorb the first substrate and rise, one of the adhesive members that are in contact with the first substrate is defined as a contact region (T) The other portion of the adhesive member outside the contact area or the pressurizing plate outside the contact area is provided with a pressurizing portion (161b) that protrudes downward. The substrate bonding apparatus according to claim 1, wherein the adhesive member is annularly provided around the through holes. The substrate bonding apparatus according to claim 7, wherein the adhesive member is formed with a plurality of holding portions (74a) protruding downward. The substrate bonding apparatus of claim 6, wherein the adhesive member is formed in a sheet shape so as to cover the lower surface of the pressing plate; the pressing plate and the adhesive member disposed outside the contact region Integrated. The substrate bonding apparatus according to the first aspect of the invention, wherein the substrate bonding apparatus is formed by bonding the first substrate and the second substrate to form a bonding substrate (W3); Further, a peeling control means is provided in which the lower end of the adhesive member is positioned by raising the pressing plate while the bonded substrate is pressed against the lower holding plate by a plurality of adsorption heads. Above the lower end of each adsorption head, the bonded substrate is peeled off from the adhesive member. The substrate bonding apparatus of claim 10, wherein the The peeling control means presses the bonded substrate with the plurality of adsorption heads at the same time as the pressure plate is raised, or immediately before the pressure plate is raised, or immediately after the pressure plate is raised. Hold the plate under. The substrate bonding apparatus according to claim 1, wherein the substrate bonding apparatus includes a plurality of adhesive mechanism portions arranged in an array on the upper holding plate, and the plurality of adhesive mechanism portions apply The adhesive mechanism department of the first item of the patent scope. The substrate bonding apparatus according to claim 12, wherein the first moving means includes a plurality of support rods (56) disposed in the processing chamber, and a supporting means for supporting the plurality of support rods to be movable up and down (59~61), the plurality of adsorption pads are mounted on the plurality of support bars; the plurality of adhesive mechanism portions are arranged to receive the plurality of storage grooves (52a) formed between the plurality of adhesive mechanism portions respectively The plurality of support rods. The substrate bonding apparatus of claim 1, wherein the adhesive mechanism portion is provided to be attachable and detachable. A substrate bonding apparatus for holding a first substrate (W1) on an upper holding plate (51, 52) and a second substrate (W2) in a lower holding plate (41) in a processing chamber (31) under atmospheric pressure 42) The first substrate and the second substrate are bonded together under reduced pressure in the processing chamber, and the moving mechanism portion (53, 55, 58 to 61) is provided to have a plurality of adsorptions of the first substrate Adsorption pads (58); and first moving means (53, 55, 59, 60, 61) for raising the plurality of adsorption pads to move the first substrate to the vicinity of the upper holding plate; The adhesive mechanism portion (52) is disposed between the plurality of adsorption pads and is mounted on the upper holding plate upper fixing seat (51); the adhesive mechanism portion includes: a pressure plate (71) disposed in the plurality of adsorption The pad has a plurality of through holes (72); the adhesive member (200) is disposed under the pressing plate so as to be flush with the lower surface of the pressing plate; and the plurality of adsorption heads (121) are respectively disposed on The plurality of through holes are supported by the adhesive mechanism portion so as to be able to move in and out from the lower surface of the pressure plate, and the first substrate that is moved to the vicinity of the pressure plate by the moving mechanism portion can be adsorbed; 2 moving means (76, 82) for raising the plurality of adsorption heads so that the first substrate adsorbed by the plurality of adsorption heads adheres to the adhesive member; the plurality of adsorption heads (121) respectively comprise adsorption The adsorption portion (123) of the first substrate is configured such that at least the adsorption portion (123) of each adsorption head is configured to be tiltable, and the adsorption portion (123) has a contact surface (143) that is in contact with the first substrate. The state in which the adsorption head adsorbs the first substrate restricts the tilting movement of the adsorption portion to make the pressure plate under The adsorption of the contact portion is parallel with the surface. A method of controlling a substrate bonding apparatus for holding a first substrate (W1) on an upper holding plate (51, 52) and a second substrate (W2) in a processing chamber (31) under atmospheric pressure The first holding substrate and the second substrate are bonded to the lower holding plate (41, 42), and the processing chamber is depressurized, and is characterized in that: a step of adsorbing the first substrate in the processing chamber under atmospheric pressure by a plurality of adsorption pads (58); and raising the plurality of adsorption pads in a state in which the plurality of adsorption pads adsorb the first substrate a step of moving the first substrate to a vicinity of an adhesive mechanism portion (52) attached to the upper holder (51) of the upper holding plate, wherein the adhesive mechanism portion includes a pressure plate disposed between the plurality of adsorption pads (71); disposed on the pressing plate, the adhesive member (74 or 161) disposed on the pressing plate so as to protrude below the pressing plate; and a plurality of adsorption heads (121) Supporting the adhesive mechanism portion from the lower surface of the pressure plate in a downward direction; the step of adsorbing and moving to the first substrate in the vicinity of the adhesive mechanism portion by the plurality of adsorption heads; and by the plurality of adsorptions a step of adsorbing the plurality of adsorption heads in a state in which the first substrate is adsorbed to adhere the first substrate to the adhesive member; and the plurality of adsorption heads (121) respectively include an adsorption portion that adsorbs the first substrate ( 123), at least the adsorption portion (123) of each adsorption head is configured to be tiltable The step of adsorbing the first substrate by the plurality of adsorption heads is a step of adsorbing the first substrate by the plurality of adsorption heads in a state in which the adsorption portion can be tilted, including by the plurality of adsorptions When the first substrate is adsorbed by the head, the tilting movement of the adsorption portion is restricted such that the lower surface of the adsorption portion is parallel to the lower surface of the pressure plate; and the step of adhering the first substrate to the adhesive member includes a step of raising the plurality of adsorption heads in a state in which the adsorption portion is tilted and restricted Step. The method of controlling a substrate bonding apparatus according to claim 16, wherein the method of controlling the substrate bonding apparatus further includes: bonding the first substrate and the second substrate by the plurality of adsorption heads a step of raising the pressing plate so that the lower end of the adhesive member is positioned above the lower end of each of the adsorption heads to peel the bonded substrate from the adhesive member in a state where the substrate (W3) is pressed against the lower holding plate .