TWI462665B - Adhesive chuck and substrate bonding apparatus - Google Patents

Description

Adhesive suction base and substrate bonding equipment

One or more embodiments of the present invention relate to the use of an adhesive susceptor for substrate bonding.

A liquid crystal display (LCD) can be formed by injecting between a thin film transistor (TFT) substrate and a color filter (CF) substrate coated with a fluorescent material. A sealant can be applied to the peripheral surface of the substrate to prevent leakage. Prior to sealing, a liner may be placed between the substrates to maintain a gap therebetween. However, problems arising in the manufacturing process of bonding substrates may cause the LCD to be expensive to manufacture or unreliable in operation.

The present invention provides a substrate bonding apparatus comprising: a first chamber, a second chamber, an adhesive module, and a lifting module, the first chamber including a first surface plate, the first surface plate Supporting a first substrate; the second chamber is spaced apart from the first chamber and includes a second surface plate supporting a second substrate to be bonded to the first substrate; the adhesive module Provided on the first surface plate and including a plurality of adhesive rubber regions for supporting the first substrate; and the lifting module to lift and lower at least one of the adhesive rubber regions.

The invention provides an adhesive suction cup comprising: an adhesive module, The adhesive module includes a plurality of adhesive rubber regions, and a lifting module for lifting and lowering at least one of the adhesive rubber regions.

A liquid crystal display (LCD) can be formed by bonding a TFT and a CF substrate together. A liquid crystal material is then implanted between the substrates. This combined process is one of the most important processes for determining LCD quality and is typically performed via a device having a chamber that is a vacuum.

One type of bonding device includes two electrostatic chucks (ESCs) disposed opposite each other in the chamber to support the respective substrates. The device operates by directing the electrostatic chucks close to each other while precisely maintaining the parallelism of the docks. This bonding process is performed when the suction seat is in this position.

The electrostatic chuck for supporting the substrate is fabricated to include a metal pattern on a polyimide film. Use this type of suction cup to increase costs. Furthermore, the polyimide sub-cavity film coated on the surface of each of the holders can be destroyed by particles generated during the substrate bonding process. This results in a less desirable LCD.

Figure 1 shows an embodiment of a substrate bonding apparatus that overcomes at least some of these disadvantages. The device includes a first chamber 100 and a second chamber 200. This first chamber is supported by a lifter 300 and moved up and down. This second chamber is fixed below the first chamber.

The first chamber 100 includes an adhesive holder 110 that supports the first substrate S1, and the second chamber includes a substrate holder 210 that supports the second substrate S2. Adhesive suction The seat 110 is provided on the first surface plate 101 of the first chamber, and a substrate suction seat 210 is provided on the second surface plate 201 of the second chamber. The substrate holder 210 can support the second substrate S2 by an electrostatic force electrostatic chuck (ESC).

The first chamber also includes a plurality of vacuum suction cups 120 that pass through the first surface plate 101 and are movable up and down. When the first substrate S1 is brought into the first chamber, the vacuum suction cup 120 is lowered to the bottom of the adhesive suction base 110. When the vacuum suction guide guides the first substrate S1 to the adhesive suction base 110, the vacuum suction holder holds and supports the first substrate by vacuum.

The second chamber 200 includes a plurality of lifting tips 220 that pass through the second surface plate 201 and are movable up and down. When the second substrate S2 is brought into the second chamber, the lifting tip rises to the top of the substrate holder 210. After the bonding process is completed, the lifting tip is raised to the top of the substrate holder to separate the bonded panels by the substrate holder 210.

A camera 130 is provided at the top of the first chamber 100. The camera takes an alignment of the first substrate S1 and the second substrate S2, and a lighting unit 230 is provided at the bottom of the second chamber 200 to provide camera light. The camera and the illumination unit cooperate to determine whether the first substrate S1 and the second substrate S2 are in precise positions.

The first and second chambers are guided to approach each other to form an airtight process space. A turbo molecular pump (TMP) or a dry pump can be used to create a vacuum in the process space. At the same time, the adhesive suction base 110 can hold the first substrate S1 by adhesion.

Fig. 2 is a plan view showing an adhesive module of one of the substrate bonding devices of Fig. 1, and Fig. 3 is a cross-sectional view taken along line I-I' of Fig. 2. As shown in Figures 2 and 3, the adhesive holder 110 can include a plurality of adhesive modules 124.

The adhesive modules are arranged in an array on the first surface plate 101. Modules arranged in the array allow them to operate independently. This also allows modules to be replaced, repaired and maintained independently.

Each adhesive module includes a plurality of adhesive rubber regions 126 and 127 and a plate 129. The adhesive rubber regions 126 and 127 can be cured, for example, by curing 10 to 75 parts by weight of an organopolysiloxane having an alkenyl group bonded to a ruthenium atom, and 5 to 30 parts by weight of an organic hydrogen oxime ( Organhydrogenpolysiloxane) and an additive curable silicone rubber composition containing a curable catalyst.

The adhesive rubber regions 126 and 127 are formed by compression molding or injection molding, or directly forming an outer shape according to any of a variety of known techniques.

According to one embodiment, the device can use two areas of adhesive rubber. Different types, numbers, and/or shapes of adhesive rubber regions can be used in other embodiments.

The two adhesive rubber regions 126 and 127 can be divided into a first adhesive rubber region 126 and a second adhesive rubber region 127. This first adhesive rubber region can be fixed to the plate 129, and the second adhesive rubber region 127 is mounted to be movable up and down with respect to the plate 129.

Further, the second adhesive rubber region 127 is raised by the lifting module 131 disposed at the top of the first chamber. The second adhesive rubber region moves up and down to allow the first substrate S1 to fall to the second substrate S2, so that the substrates can be bonded together.

When the first substrate S1 is loaded (for example, by a machine device), the second adhesive rubber region 127 holds and supports the first substrate S1 such that the surface of the second adhesive rubber region facing the first substrate S1 is parallel Facing the surface of the first adhesive rubber region 126 of the first substrate S1.

The second adhesive rubber region is raised to drop the first substrate S1 on the second substrate S2 to bond the substrate. That is, in a state where the first substrate S1 approaches the second substrate S2, the second adhesive rubber region 127 is raised by the lift module 131. The first substrate S1 is then separated by a second adhesive rubber region. Since the first substrate is only supported and supported by the first adhesive rubber region 126, the adhesion force is gradually lowered, so the first substrate S1 is separated by the first adhesive rubber region and falls down to the second substrate S2 to be bonded thereto. on. Preferably, each of the second adhesive rubber regions has a contact area with respect to the first substrate S1, the contact area being larger than the contact area of the first adhesive rubber region. In other embodiments, the sizes of such regions may be different.

The first adhesive rubber region 126 or the second adhesive rubber region 127 may have an arcuate circumference or may have a polygonal periphery. In other embodiments, the first adhesive rubber region can have a polygonal perimeter and the second adhesive rubber region can have an arcuate perimeter, or vice versa.

4A-4D show an illustration of an adhesive suction mount that can be used in at least one of the foregoing embodiments. During the bonding, each lifting module 131 moves up and down through the plate 129 to a lifting rod 133 connected to the second adhesive rubber region 127. A single lifting module 131 can be used to move the second adhesive rubber region 127 upward and downward, or a plurality of lifting modules 131 can be used to independently move up and down relative to a specific portion of the first substrate S1. Adhesive rubber area 127.

According to at least one of the foregoing embodiments, the operation of the substrate bonding apparatus will be described with reference to FIGS. 5A to 5D.

As shown in FIG. 5A, in a state in which the first chamber 100 and the second chamber 200 are spaced apart from each other, the first substrate S1 and the second substrate S2 are brought to a position between the first and second chambers by, for example, a machine device. . The first substrate S1 is supported and raised by the lowered vacuum suction cup 120. The first substrate S1 is held by the first adhesive rubber region 126 and the second adhesive rubber region 127. The second substrate is supported and lowered by the lifting tip 220. This second substrate is received on the second surface plate 201 and is electrostatically held by the substrate holder 210.

The first and second substrates can be simultaneously brought to the first and second chambers respectively supported by the vacuum suction cup 120 and the lifting tip 220. In other embodiments, one of the first substrate S1 or the second substrate S2 may be brought between the first chamber and the second chamber and supported by the respective surface plates, and then the other substrate may be brought to the first chamber and the first The two chambers are supported by the other surface plates.

After these steps, the first chamber is lowered by the lifter 300 to approach the second chamber 200, thereby forming a process space. Then generate a true in the process space Empty, for example, by a dry pump or turbomolecular pump. At this time, the first surface plate 101 is lowered to perform substantially alignment between the first and second substrates. After the approximate alignment is completed, the precise alignment between the substrates as shown in FIG. 5B is completed.

After these steps, the first substrate S1 and the second substrate S2 are close to each other. In this state, the lift module 131 raises the second adhesive rubber region 127. When the second adhesive rubber region is raised, the adhesion force applied to the first substrate S1 by the second adhesive rubber region is interrupted. Since the first substrate S1 cannot maintain the adhesion state only by the first adhesive rubber region 126, the first substrate S1 falls onto the second substrate S2 and is bonded together as shown in FIG. 5C.

Air can be released from the process space to create an atmospheric pressure state. Nitrogen (N ₂ ) gas may be supplied from the first chamber 100 such that the first substrate S1 and the second substrate S2 may be tightly coupled during the bonding process. The first chamber can then be raised to be separated from the second chamber. This lifting tip 220 is then moved upward to separate the bonded panels by the second surface panel 201, as shown in Figure 5D. Then, a machine device can enter the process space and move out of the combined panel, thus completing the bonding process.

Adhesive holder 110 can be included in the aforementioned substrate bonding apparatus or can be used in a separate unit.

According to one or more of the foregoing embodiments, a substrate bonding device can be provided to support the substrate by adhesive force, thereby facilitating maintenance and repair, and reducing equipment investment cost.

According to an embodiment, a substrate bonding apparatus includes: a first chamber, a second chamber, an adhesive module, and a lifting module, the first chamber including a first surface panel, the first surface panel The upper system supports a first substrate; The second chamber is spaced apart from the first chamber and includes a second surface plate supporting a second substrate to be coupled to the first substrate; the adhesive module is provided on the first surface The panel includes a plurality of adhesive rubber regions for holding the first substrate; and the lifting module is configured to lift and lower at least one of the adhesive rubber regions. The adhesive module can include a plate, a first adhesive rubber secured to the plate, and a second adhesive rubber coupled to the plate for movement up and down by the lift module.

According to another embodiment, an adhesive suction cup comprises: an adhesive module comprising a plurality of adhesive rubber regions; and a lifting module for lifting and lowering the adhesive rubber regions At least one. The adhesive module may include a plate, a first adhesive rubber fixed to the plate, and a second adhesive rubber coupled to the plate, which is movable up and down by the lifting module.

The foregoing embodiments of the substrate bonding apparatus thus have at least the following advantages. Since the substrate is supported by the adhesive rubber region, it can reduce the investment cost of the device, thereby reducing the overall manufacturing cost. Furthermore, because the adhesive holder has a simple structure including an adhesive rubber region, it facilitates easier and more convenient maintenance and repair.

Any reference to "one embodiment", "an embodiment", "example embodiment" and the like in the specification means a particular feature, structure, or Features are included in at least one embodiment of the invention. These words appear in different parts of the description of the invention and are not necessarily described as the same Example. In addition, the particular features, structures, or characteristics described in the embodiments are intended to be within the skill of the art.

While the present invention has been described in connection with the various embodiments, it should be understood that various other modifications and embodiments can be practiced by those skilled in the art and are also in the scope of the invention. In particular, it is possible to make reasonable variations and modifications of the component elements and/or combinations of the present invention in the scope of the disclosure, the drawings and the appended claims. Variational uses are also apparent to those skilled in the art, as well as variations and modifications in the component components and/or combinations.

100‧‧‧First Room

101‧‧‧First surface plate

110‧‧‧Adhesive suction seat

120‧‧‧Vacuum suction

124‧‧‧Adhesive module

126, 127‧‧‧Adhesive rubber area

129‧‧‧ board

130‧‧‧ camera

131‧‧‧ Lifting module

133‧‧‧ Lifting rod

200‧‧‧Second room

201‧‧‧Second surface plate

210‧‧‧ substrate holder

220‧‧‧ lifting tips

230‧‧‧Lighting unit

300‧‧‧ Lifter

S1‧‧‧ first substrate

S2‧‧‧second substrate

Fig. 1 is a schematic view showing an embodiment of a substrate bonding apparatus.

Fig. 2 is a plan view showing the adhesive module in the substrate bonding apparatus of Fig. 1.

Fig. 3 is a schematic cross-sectional view taken along line I-I' of Fig. 2.

4A-4D is a schematic diagram showing an adhesive susceptor that can be used to form a substrate bonding apparatus as in FIG. 1 or other embodiments described herein.

5A-5D are schematic views showing operations that can be performed by at least one embodiment of the substrate bonding apparatus of the present invention.

100‧‧‧First Room

101‧‧‧First surface plate

110‧‧‧Adhesive suction seat

120‧‧‧Vacuum suction

130‧‧‧ camera

131‧‧‧ Lifting module

200‧‧‧Second room

201‧‧‧Second surface plate

210‧‧‧ substrate holder

220‧‧‧ lifting tips

230‧‧‧Lighting unit

300‧‧‧ Lifter

S1‧‧‧ first substrate

S2‧‧‧second substrate

Claims (12)

A substrate bonding apparatus comprising: a first chamber comprising a first surface plate supporting a first substrate; a second chamber spaced apart from the first chamber and including a second a surface plate supporting a second substrate to be bonded to the first substrate; an adhesive module provided on the first surface plate and including a plurality of adhesions for the first substrate And a lifting module for lifting and lowering at least one of the adhesive rubber regions, wherein the adhesive module comprises: a plate; a first adhesive rubber region fixed to the plate; and a a second adhesive rubber region connected to the plate and movable up and down independently of the first adhesive rubber region by the lifting module. The device of claim 1, wherein the second adhesive rubber region has a contact area with respect to the first substrate, the contact area being larger than a contact area of the first adhesive rubber region. The device of claim 1, wherein each of the second adhesive rubber regions is substantially circular and formed around a circumference of the first adhesive rubber region. The device of claim 1, wherein the adhesive module comprises: a first adhesive rubber region; and a plurality of second adhesive rubber regions formed around the first adhesive rubber region. The device of claim 4, wherein each of the second adhesive rubber regions is substantially triangular. The device of claim 4, wherein each of the second adhesive rubber regions has a substantially elliptical shape. The device of claim 6, wherein the substantially elliptical shape is an arcuate ellipse. An adhesive suction cup comprising: an adhesive module comprising a plurality of adhesive rubber regions; and a lifting module for lifting and lowering at least one of the adhesive rubber regions, The adhesive module comprises: a plate; a first adhesive rubber region fixed to the plate; and a second adhesive rubber region connected to the plate and independently of the lifting module Moving up and down in the first adhesive rubber region. The adhesive absorbing base of claim 8, wherein the second adhesive rubber region has a contact area with respect to a target substrate, the contact area being larger than a contact area of the first adhesive rubber region. The adhesive suction cup of claim 8, wherein at least one of the first adhesive rubber region or the second adhesive rubber region has a curved periphery. The adhesive absorbing base of claim 8, wherein at least one of the first adhesive rubber region or the second adhesive rubber region has a polygonal periphery. The adhesive suction cup of claim 8, wherein at least one of the first adhesive rubber region or the second adhesive rubber region has a polygonal periphery and the other has an arc shape Periphery.