JP4023510B2 - Board assembly equipment - Google Patents

Description

  The present invention relates to a substrate bonding apparatus, and more particularly to a substrate assembly apparatus suitable for assembling a liquid crystal display panel or the like in which substrates to be bonded are held and opposed to each other in a reduced pressure chamber and bonded to each other with a narrow interval.

  In manufacturing a liquid crystal display panel, two glass substrates provided with a transparent electrode and a thin film transistor array are attached with an adhesive (hereinafter also referred to as a sealing agent) provided on the peripheral edge of the substrate with a very close distance of about several μm. There is a process of bonding (hereinafter, the substrate after bonding is referred to as a cell) and sealing the liquid crystal in the space formed thereby.

  To seal the liquid crystal, liquid crystal is dropped on one substrate drawn in a pattern in which a sealing agent is closed so as not to provide an injection port, and the other substrate is placed on one substrate in a vacuum chamber. There is a method proposed in Patent Document 1 in which the upper and lower substrates are placed close to each other and bonded together.

JP 2000-284295 A

In the prior art disclosed in Patent Document 1, the lower substrate is placed on a flat stage while holding the substrate in a vacuum, but the upper substrate is sucked and adsorbed by a negative pressure in the atmospheric state, In a vacuum state, the substrate is held by electrostatic attraction by electrostatic force. By the way, recently, the substrate size has become larger than 1 m × 1 m, and the substrate thickness tends to be reduced from 0.7 mm to 0.63 mm and 0.5 mm. For this reason, when the substrate is sucked and held by the pressure plate (on the upper table), the substrate is bent and the distance between the peripheral portion of the central portion of the substrate and the central portion of the substrate and the pressure plate is increased. When the pressure plate is delivered, the substrate may not be held. In particular, in the case of holding a large-screen substrate, an alignment film, a TFT, and the like are formed in the central portion of the substrate, so that only the peripheral portion of the substrate can be supported and it is difficult to prevent the substrate from being bent. In addition, the robot hand finger part that holds and conveys the substrate becomes long and the tip side is bent when the substrate is held, and the distance between the substrate on the tip side of the robot hand and the pressurizing plate becomes large and the substrate cannot be sucked. For this reason, unless the said problem with respect to a large sized board | substrate is solved, it will become impossible to perform exact bonding.

  In addition, if the central portion of the substrate is bent and adsorbed from both the central portion and both ends of the substrate, residual stress is generated near the central portion (the portion during gripping) and a reference mark ( The case where the substrate is held in a state where the position of the alignment mark) is shifted occurs, and the bonding accuracy is lowered.

  Therefore, an object of the present invention is to provide a substrate assembling apparatus that can hold a substrate reliably even when the substrate is enlarged, can perform bonding with high accuracy and high speed, and has high productivity.

  In order to achieve the above object, the present invention includes a chamber for creating a reduced pressure atmosphere, a pressure plate configured to hold one substrate in the chamber and movable up and down, and a substrate held by the pressure plate. A substrate holding table that holds the other substrate facing each other at an interval, and driving the substrate holding table, aligning the one substrate with the other substrate, and driving the pressure plate up and down Depending on the amount of deflection at the tip of the finger part of the robot hand that transports the substrate to the pressure plate, in which the gap between the substrates is narrowed and bonding is performed in a reduced pressure atmosphere with the adhesive provided on either of the substrates A configuration is provided in which the finger tip of the robot hand and a substrate tip correction mechanism for pushing up the substrate end between the fingers toward the pressure plate are provided in the chamber.

  According to the substrate bonding apparatus of the present invention, when the substrate is carried into the apparatus, particularly when the large upper substrate is held on the upper table, the influence of the bending generated on the substrate is eliminated and the substrate is surely placed at a predetermined position. Since it can be held, the accuracy of alignment can be improved and the time required for alignment can be shortened.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  In FIG. 1, the substrate assembling apparatus includes a lower chamber T1 portion and an upper chamber T2 portion. The upper chamber T2 is provided with an upper table 2 (hereinafter also referred to as a pressure plate) that can be moved in the vertical direction by a support leg 3 and a plurality of adjustment legs 4 penetrating the upper chamber T2. The support leg 3 is blocked by an O-ring 5 and the adjustment leg 4 is blocked by a welding bellows 6 so that the inside of the upper chamber T2 does not communicate with the atmosphere. The support leg 3 and the adjustment leg 4 of the upper table 2 are fixed to the pressure base plate 7.

  Further, the central portion of the pressure base plate 7 is fixed to the intermediate base plate 8. The intermediate base plate 8 is configured to move up and down using a ball spline guide 13 as a guide by operating a drive mechanism including a drive motor 10 and a speed reducer 11 and a ball screw 12 attached to the ceiling frame 9. Yes. Further, the ceiling frame 9 is supported by a support column provided on the gantry 1 separately from the ball spline guide. The other end of each adjustment leg 4, one end of which is fixed to the pressure base plate 7, is connected to a ball screw 15 driven by a drive motor 14 attached to the intermediate base plate 8. The upper table 2 can be moved up and down while maintaining flatness by driving a vertical adjustment mechanism comprising the drive motor 14 and the ball screw 15 to apply force to the pressure base plate 7.

  The upper chamber T2 is provided with a fastening mechanism for connecting the pressure base plates 7. When the upper chamber T2 is separated from the lower chamber T1, the fastening mechanism is operated to operate the pressure base plate and the upper chamber T2. And the drive motor 10 is operated to lift upward.

  A door valve 16 for loading / unloading the substrate into / from the chamber is installed on the side wall of the upper chamber T2. Further, an ionizer 17 is installed at a position on the side wall of the upper chamber opposite to the door valve 16 so that ionized ultrasonic air is blown onto the surface of the substrate so that the substrate can be neutralized. Further, an ionizer 17a is also provided in the vicinity of the door valve 16 outside the chamber. With this, ionizing air can be blown with the door opened to increase the effect of removing the substrate.

  A plurality of bush-structured sub-guides 18 are provided on the outer wall of the upper surface of the upper chamber T2 so as to project a center shaft 19 into the chamber. The center shaft 19 can be adjusted in the horizontal direction of the upper table 2 by engaging with a hole provided in a protrusion provided on the outer periphery of the upper table 2. That is, the sub guide 18 and the center shaft 19 operate as a horizontal adjustment mechanism for the upper table 2.

  The upper chamber T2 is provided with a plurality of observation windows for observing the substrate mark. A camera barrel 21 is inserted into the observation window, and the mark provided on the substrate is recognized by the camera. The camera barrel 21 is installed on a moving stage having a horizontal (X, Y direction) moving axis and a vertical (Z direction) moving axis, and the moving stage is fixed on the upper chamber T2. It is. Further, the upper table 2 is provided with a hole for recognizing a substrate mark at a position corresponding to the observation window.

  In this embodiment, the camera is arranged outside the chamber. However, the camera can be arranged close to the substrate by directly attaching the camera to the upper table 2 to improve the mark recognition accuracy by the camera. The alignment accuracy between the substrates can be improved.

  Further, a load cell 22 is provided between the intermediate base plate 8 of the support leg 3 and the ball screw in order to measure the pressure applied to the substrate. Further, when adjusting the flatness of the upper table, the load cell 23 is provided for each adjustment leg on the pressure base plate 7 in order to monitor the motor 14 driving each adjustment leg 4 so as not to be overloaded. It is provided.

  A lower table 24 is fixed in the lower chamber T1. If the entire surface of the lower table 24 is bonded and fixed to the lower chamber T1, when the lower chamber T1 is deformed during decompression, the flatness may be shifted due to the deformation. Therefore, only the peripheral part is fixed so as not to be affected by the deformation of the lower chamber T1. Further, a seal ring 25 to be described later is disposed on the entire circumference of the lower chamber T1, the inside is confidential and the decompression chamber is configured when the upper chamber T2 is in contact and the door valve 16 is closed.

The lower chamber T1 is installed on a θ base table 28 configured to be rotated by a motor 26, a ball screw (not shown), and a rotary bearing 27. For fastening the θ base table 28 and the lower chamber T1, a box-shaped member is interposed so that a predetermined space can be secured. This space is provided to attach the UV irradiation mechanism 40, the substrate holding claw elevating mechanism 41, and the substrate lift mechanism 42 below the lower chamber T1. The θ base table 28 is mounted on the Y table 32 via a rotary bearing 27. The Y table 32 is installed so that it can be moved by a motor 29 on a linear rail provided on the X table 33. Further, the X table 33 is provided so as to be moved by driving the motor 30 on the linear rail provided on the gantry 1 side.

  Further, when the upper chamber T2 is brought into contact with the lower chamber T1 to form a decompression chamber, a plurality of upper chamber ball bearings are formed on the outer periphery of the θ base table 28 in order to make the amount of collapse of the seal ring 25 constant. 34 and a receiving seat 35 with an adjusting mechanism are provided. The lower position of the upper chamber portion T2 is adjusted by the ball bear 34 and the receiving seat 35.

  Further, a plurality of ball bears 37 for the θ base plate 28 are attached to a member fixed on the apparatus base (mounting base) 1 so as to support the outer peripheral portion of the θ base table 28 so that the θ base table 28 is not deformed, and an adjusting mechanism. A counter seat 38 is provided. Thus, the load from the θ base plate 28 is received. In this way, the chamber ball bear 34 and the θ base table ball bear 37 are configured to receive the load around the upper and lower chambers in two stages, so that the deformation of the chamber can be suppressed.

  The lower chamber T1 is provided with a plurality of transmitted illuminations 39 for recognizing the mark, and holes are formed at corresponding positions on the lower table 24. Further, a plurality of pressure / UV irradiation mechanisms 40 are provided in the lower chamber T1 in order to crush and cure the UV adhesive so that the bonded substrates are not displaced. Furthermore, when carrying in / out the substrate, the holding claw elevating mechanism 41 for preventing the substrate from bending in the width direction, the bending of the robot hand, the rotating elevating pin for preventing the substrate from bending in the front-rear direction, Substrate lift mechanisms 43 for raising and lowering the combined substrates are provided.

  The lower table 24 is provided with holes so that the pressure / UV irradiation mechanism 40 can move up and down in the lower table 24. The pressurizing / UV irradiation mechanism 40 can also be used as a rotary lift pin. Further, grooves (notches) are provided on the substrate support side so that the substrate lift mechanism 43 can move up and down. When the substrate is carried in and out, the substrate lift mechanism 43 is operated so that the robot hand can be inserted into the lower surface side of the substrate. Since the lower table 24 is fixed to the lower chamber T1, these holes or grooves need only have a minimum margin.

  Further, the pressurizing / UV irradiation mechanism 40, the holding claw elevating mechanism 41, and the substrate lift mechanism 42 each have a vertical movement mechanism penetrating the lower chamber T1, but the lower chamber T1 and these vertical movement mechanism sections are also provided. Is provided with an O-ring between them, thereby maintaining airtightness.

  The holding mechanism of the upper substrate by the upper table 2 in the decompressed state may be either a mechanism that is electrically held by an electrostatic chuck or a mechanism that is physically held by an adhesive material. When electrically holding by the electrostatic chuck, the holding by the upper table 2 can be interrupted by cutting off the applied voltage and raising the upper table 2 after a certain static elimination time. Further, in the case of holding by an adhesive material, a plurality of pins that mechanically press the upper substrate against the lower substrate are provided, and only the upper table 2 is lifted while the pins are pressed downward. The holding of the substrate can be interrupted.

  On the other hand, the holding mechanism of the lower substrate by the lower table 24 in the reduced pressure state is similarly a method including an electrostatic adsorption mechanism that is electrically held by an electrostatic chuck, or an adhesive holding mechanism that is physically held by an adhesive material. Any of the methods comprising The upper table 2 and the lower table 24 are combined in a suction method in which both the upper table 2 and the lower table 24 are electrostatic chucks, or either the upper table 2 or the lower table 24 is an electrostatic chuck. Using the other as an adhesive material is preferable in that it has a flat portion as a reference and can be easily assembled in parallel between the tables, so that the upper and lower substrates can be bonded uniformly. In the present embodiment, both a suction suction mechanism that performs suction suction by negative pressure and an electrostatic suction mechanism by electrostatic force can be used together.

  The decompression in the decompression chamber is performed by connecting to a vacuum valve and a vacuum pump of a dry pump or a turbo molecular pump through an exhaust port (not shown) provided in either the upper or lower chamber. The atmospheric vent in the chamber is performed by introducing an inert gas such as nitrogen or the atmosphere through a valve provided in either the upper or lower chamber (not shown). The atmospheric vent is preferably an inert gas such as nitrogen having a low water molecule content from the viewpoint of reducing moisture adhesion to the chamber and shortening the time for decompressing the inside of the chamber.

  As described above, as an example of the substrate assembling apparatus to which the present invention is applied, the decompression chamber can be divided into two parts. However, the present invention is not limited to this example. Any apparatus can be applied as long as the apparatus holds the substrates and moves the upper table to the lower table side holding the other substrate in that state (narrows the substrate interval) to bond the substrates together.

  FIG. 2 shows a structure of a hand portion of a robot hand for carrying in the board assembly apparatus. FIG. 3 shows a schematic diagram of substrate suction in the suction pad portion of the pressure plate.

  In FIG. 2, the hand portion of the robot hand is provided with a finger portion 51 for supporting a plurality of substrates 60 from the arm portion 52, and the finger portion 51 is provided with a plurality of suction pads 53. The suction pad 53 is provided with a suction hole at the tip so that the substrate 60 can be sucked by a negative pressure. The suction pad 53 of the finger portion 51 is movable up and down, and the portion of the suction pad 53 that comes into contact with the surface of the liquid crystal display portion does not contact the substrate surface in advance according to the number of chamfers of the substrate 60 to be held. It is configured to be retracted to a position. For this reason, as shown in FIG. 2B, in the case of the single-chamfered substrate 60, among the suction pads 53 provided on the central finger, the central suction pad 53b is retracted so as not to contact the substrate surface. The substrate 60 is supported by the peripheral suction pads 53a.

  For this reason, as shown in FIG.2 (b), a board | substrate will be supported by the concave part by the center part. In this state, when the suction hole provided in the pressure plate (upper table) 2 is sucked and sucked by negative pressure, the negative pressure does not act on the central portion of the substrate 60 and the substrate 60 cannot be held on the upper table 2. To do. In addition, even if the substrate can be held, the adsorption of the substrate is not uniform, and a large tensile force acts locally on the substrate, which causes a decrease in accuracy during bonding. Therefore, in this embodiment, as shown in FIG. 3, a plurality of suction pads that are movable up and down are provided near the center of the pressure plate 2 so that the center of the substrate can be reliably suctioned to the upper table (pressure plate) 2. It is provided.

The suction pad includes an air cylinder 55 for moving up and down, a rod portion 57 that extends and contracts by the air cylinder 55, and a pad portion 56 at the tip. Although not shown, the rod portion 57 is hollow and is configured to supply negative pressure air thereto. The pad portion 56 at the tip is also provided with a hole that communicates with the hollow portion of the rod portion 57.

  Although not shown in FIG. 3, a plurality of suction suction holes for negative pressure are provided on the substrate suction surface of the pressure plate 2. When the substrate 60 is transferred from the robot hand 50 with the above-described configuration, the suction suction mechanism using the negative pressure of the pressure plate 2 is operated, and the rod portion 57 of the suction pad that can be moved up and down is provided on the substrate side by a necessary amount. After extending and holding the substrate 60 with the pad portion 56, the rod portion 57 is retracted to the substrate holding surface of the upper table 2, so that the suction suction hole near the center portion is reliably adsorbed. In addition, when bonding is performed by applying a pressing force to the substrate 60, the pad portion 56 is also supplied with a negative pressure as a suction suction hole. The pad portion 56 is made of an elastic body such as rubber so as not to damage the substrate 60 when contacting the substrate 60.

  In the present embodiment, the rod portion 57 is moved up and down by an air cylinder. In this embodiment, the driving unit is attached to the outside of the decompression chamber T2, but may be attached to the side opposite to the pressing surface of the pressing plate. In addition, the amount of elongation of the rod portion 57 of the suction pad is determined in advance by measuring the amount of bending of the substrate in advance and varying the position of the stopper that suppresses elongation according to the amount of measurement. Yes. Moreover, it is good also as a structure which uses a motor etc. as a drive device, It is also possible to provide the sensor which measures the amount of bending for every board | substrate carried in, and to control the extension amount of the rod part 57 according to the measurement result. It is.

  The above is a description of the mechanism that operates when bending occurs in the center of the substrate 60. However, when the substrate 60 is carried in by a plurality of fingers 51 of the robot hand 50, the rigidity of the fingers 51 is increased. For this reason, the finger part 51 becomes large and obstructs the operation of the robot hand 50. For this reason, the rigidity of the finger part 51 cannot be increased. For this reason, when the large-sized substrate is carried in, the tip of the finger portion 51 is bent as shown in FIG. Therefore, a substrate front end correction mechanism 70 having a correction claw for lifting the front end portion of the substrate 60 before the upper substrate 60 is sucked and sucked into the chamber is provided. The substrate tip correction mechanism 70 includes a substrate end holding portion 71 that holds the end portion of the substrate, and a finger portion holding portion 72 for lifting the finger portion 51 of the robot hand. The substrate end holding portion 71 is provided between adjacent finger portions of the robot hand and corrects the bending between the fingers of the substrate as shown in FIG. For this reason, the substrate end holding part 71 is provided not only on the distal end side of the finger part but also on the arm part side.

  In this figure, a substrate tip correction mechanism 70 that moves up and down by a cylinder is provided in the lower chamber T1. Thereby, even if the finger part 51 of the robot hand 50 is bent, the substrate 60 can be reliably adsorbed to the pressure plate 2.

  Instead of providing the substrate tip correction mechanism 70, the position of the substrate holding portion on the tip side of the finger 51 of the robot hand 50 (as opposed to the substrate carry-in entrance side of the chamber, that is, the first, as in the previous embodiment). It is good also as a structure which provides the suction pad provided with the up-and-down drive mechanism in the pressurizing plate 2 of the position equivalent to a back position.

  FIG. 5 shows another embodiment of the present invention. In the present embodiment, the suction suction holes provided in the pressure plate 2 are divided into a plurality of groups (R1, R2, R3), and a negative pressure source is provided so that the negative pressure supplied for each group can be varied. One negative pressure source is branched and a pressure regulating valve is provided in the middle of the pipe so that it can be adjusted.

  In FIG. 5, the suction suction holes are divided into three groups R1, R2, and R3, and each negative pressure source can apply two negative pressures A1 and A2. Since a liquid crystal panel alignment film or the like is formed at the center of the substrate 60, it is supported by the suction pads 53 on both sides of the robot hand and carried into the assembly apparatus. For this reason, as shown in FIG. 5A, the central portion of the substrate is bent and is in a state of being farther from the pressure plate 2. For this reason, a large negative pressure A1 is first applied to the central suction adsorption hole R2 to adsorb the central portion of the substrate (FIG. 5B). Next, by applying a negative pressure A2 smaller than the negative pressure A1 applied to the central part to the suction suction holes R1 and R3 on both sides, the substrate 60 can be adsorbed to the pressure plate 2 without any distortion remaining on the substrate 60. (FIG. 5C). In the present embodiment, the state in which the suction holes are divided into three groups has been described as an example. However, by further dividing the suction holes into groups, the suction holes are gradually sucked from the center of the substrate toward the edge of the substrate. Accurate adsorption is possible. Further, in this operation, a plurality of suction pads 56 that can be moved up and down as described with reference to FIG. 3 are arranged on the pressure plate 2, suctioned and pulled up sequentially toward the center or the periphery, and a corresponding pressure plate 2 is prepared. It can also be realized by adsorbing through a plurality of suction suction holes. Although not shown, the pressure plate is provided with an adhesive holding mechanism and an electrostatic adsorption mechanism in addition to the suction adsorption mechanism described above in order to prevent the substrate from dropping when the inside of the chamber of the substrate assembly apparatus is depressurized. It is.

  Next, the operation of bonding the liquid crystal panel by the substrate assembly apparatus 1 according to the present invention will be described.

  First, place the adhesive in a black matrix surrounding the outer periphery of the liquid crystal panel in a frame shape or the upper substrate coated in the vicinity of the liquid crystal panel so that the surface to which the adhesive is applied is turned down. Place on one finger located on the side. In addition, the lower substrate whose liquid crystal is previously coated on the surface is mounted on the other finger part of the robot hand located on the upper side in a state where the liquid crystal dropping surface is disposed on the upper side. As described above, the robot hand moves in front of the bonding apparatus in a state where the two substrates are mounted on the upper and lower fingers. The substrate assembling apparatus 1 opens the door valve 16 of the upper chamber T2, and the robot hand inserts the inverted upper substrate on the lower finger portion into the apparatus.

  The board assembling apparatus 1 lowers the upper table 2 and holds the upper board inverted under the upper table 2 by suction suction due to negative pressure. At this time, when the substrate is bent, the substrate tip correction mechanism 70 and the suction pad are operated together to hold the substrate flat. That is, when the substrate is bent, the suction pad is projected from the table surface to a position where the substrate can be sucked, and when the suction pad sucks the substrate, it is retracted until the suction pad surface reaches the position of the upper table surface. The substrate can be held flat on the table surface.

  If the suction holes on the upper table are divided into a plurality of groups, negative pressure is applied sequentially from the suction holes in the center toward the suction holes on the end side, so that no distortion remains in the substrate. It can be held flat.

  Next, the lower robot hand once retracts from the inside of the substrate assembly apparatus 1, and after waiting for the backward movement, the substrate assembly apparatus 1 transfers the already-bonded liquid crystal panel on the lower table 24 to the substrate lift mechanism 43, and The holding claw elevating mechanism 41 is used to lift up. In this state, the lower robot hand is again inserted into the lower side of the liquid crystal panel in the substrate assembling apparatus 1, the hand is lifted upward, and then retracted to take out the liquid crystal panel from the substrate assembling apparatus 1. The board assembly apparatus 1 lowers the board lift mechanism 43 and the holding claw elevating mechanism 41.

  Next, the lower substrate on which the liquid crystal is applied in advance on the upper robot hand is inserted into the substrate assembly apparatus 1. The board assembly apparatus 1 raises the holding claw elevating mechanism 41, lifts the lower board, waits for the robot hand to move backward, places the lower board on the lower table 24, and sucks and sucks the lower board.

  Next, the substrate mark position on the upper substrate is measured by moving the camera barrel 21 down the vertical movement axis, and the mark central position of the upper substrate and the center of the camera barrel 21 are determined using the horizontal movement axis. Move to the matching position. Subsequently, the upper table 2 is lowered, and the deviation of the mark position between the upper substrate and the lower substrate is measured by the lens barrel 21 of the camera. Then, by lifting the ball bear 34 by a lifting mechanism (not shown), the upper chamber portion T2 is raised through the receiving seat 35 with an adjusting mechanism, and the seal ring 25 and the upper chamber portion T2 are slightly contacted or contacted. (The load of the upper chamber does not act on the seal ring), and the motor 26, the motor 29, and the motor 30 are driven by the lower chamber portion T1. As a result, the lower table 24 moves horizontally in the XYθ direction together with the lower chamber T1 to perform rough positioning of the alignment marks on the lower substrate and the upper substrate. After the rough positioning, the ball bear 34 is lowered. Next, when the upper and lower tables use substrate chucking by an electrostatic chuck, a voltage is applied to the electrostatic chuck to chuck the substrate. In this state, the door valve 16 is closed and the vacuum chamber is evacuated using a vacuum pump. During the evacuation, the upper table 2 is raised so that the gas between the upper and lower substrates is easily exhausted.

  After the inside of the decompression chamber reaches a certain decompression state, the upper table 2 is lowered again, the positional deviation between the upper and lower substrates is measured, and the motor 26, the motor 29, and the motor 30 are driven by driving the lower chamber T1 portion. By horizontally moving in the XYθ direction, the lower substrate and the alignment mark on the upper substrate are finely positioned. After the fine positioning is completed, while the value of the load cell 22 is measured, the upper table 2 is further lowered to press and bond the substrates. After the applied pressure reaches a predetermined value for crushing the adhesive, the pressurization is terminated, and the pressurizing / UV irradiation mechanism 40 pressurizes the temporary adhesive UV adhesive previously applied to the temporary fixing position of the substrate. While being irradiated with UV light, temporary fixing is performed so that the position of the substrate does not shift.

  After the temporary fixing is completed, the pressurizing / UV irradiation mechanism 40 is raised. When the upper table 2 uses vacuum chucking by an electrostatic chuck, the voltage is cut off and the upper table 2 is lifted after waiting for a charge elimination time. When the upper table 2 uses adhesive, the upper substrate is mechanically pressed against the lower substrate by a plurality of pins, and only the upper table is lifted while the pins are pressed downward. The holding of the substrate is interrupted.

  Thereafter, an inert gas such as nitrogen or the atmosphere is introduced into the decompression chamber through a valve provided in the decompression chamber and released to the atmosphere. Subsequently, the door valve 16 is opened, and the substrate is carried in and out. When maintenance such as cleaning is performed on the inside of the vacuum chamber of the substrate assembly apparatus 1, the fastening mechanism attached to the upper chamber T2 is operated to drive the pressure base plate 7 and the upper chamber T2 to be integrated. The motor 10 is used to lift the upper table 2 together with the upper table 2 in the Z-axis direction. As a result, the upper and lower tables can be maintained with the chamber opened. As described above, the present embodiment solves the problem that when holding a large substrate on the upper table, the substrate cannot be securely held on the upper table due to the bending of the substrate that occurs when the substrate is loaded. The accuracy of bonding can be improved.

It is a figure which shows the structure of the board | substrate assembly apparatus which becomes one Embodiment of this invention. It is a figure which shows the outline | summary of the robot hand used for board | substrate carrying-in. It is a figure explaining the schematic structure of the suction pad provided in the pressurization board, and the method of holding | maintenance when a board | substrate bends. It is explanatory drawing of the mechanism which correct | amends the board | substrate bending by the bending of the finger | toe part of a robot hand. It is a figure of the pressurization board part of other embodiments of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board assembly apparatus, 2 ... Upper table, 3 ... Support leg, 4 ... Adjustment leg, 5 ... O-ring, 6 ... Welding bellows, 7 ... Pressure base board, 8 ... Intermediate base board, 9 ... Ceiling frame, 10 , 14 ... Drive motor, 11 ... Reducer, 13 ... Ball spline guide, 15 ... Ball screw, 16 ... Door valve, 17 ... Ionizer, 18 ... Sub guide, 19 ... Center shaft, 20 ... Observation window,
DESCRIPTION OF SYMBOLS 21 ... Camera barrel, 22, 23 ... Load cell, 24 ... Lower table, 25 ... Seal ring, 26, 29, 30 ... Motor, 27 ... Rotary bearing, 28 ... Base table, 31 ... Linear guide, 32 ... Y Table, 33 ... X table, 34,37 ... Ball bearer, 35,38 ... Reception seat with adjustment mechanism, 36 ... Device base, 39 ... Transmission illumination, 40 ... Pressure / UV irradiation mechanism, 41 ... Holding claw lifting mechanism, 42 ... Rotary lifting pins, 43 ... Substrate lift mechanism,
51: Finger part, 53: Suction pad, 56 ... Pad part, 57 ... Rod part, 60 ... Substrate.

Claims (1)

A chamber for creating a reduced-pressure atmosphere, a pressure plate configured to hold one substrate in the chamber and movable up and down, and the other substrate with an interval facing the substrate held on the pressure plate The substrate holding table to be held and the substrate holding table are driven to align the one substrate with the other substrate, and the pressure plate is driven up and down to narrow the interval between the substrates. In a board assembly apparatus that performs bonding in a reduced-pressure atmosphere with an adhesive provided on either side,
A substrate tip correction mechanism for pushing up the finger tip of the robot hand and the substrate edge between the fingers toward the pressure plate according to the amount of bending of the finger tip of the robot hand that transports the substrate to the pressure plate. A substrate assembling apparatus characterized by being provided in a chamber.

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