CN108511381B - Bonding apparatus and control method thereof - Google Patents

Bonding apparatus and control method thereof Download PDF

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Publication number
CN108511381B
CN108511381B CN201810127206.9A CN201810127206A CN108511381B CN 108511381 B CN108511381 B CN 108511381B CN 201810127206 A CN201810127206 A CN 201810127206A CN 108511381 B CN108511381 B CN 108511381B
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die
pneumatic pressure
bonding
pressure
pick
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CN108511381A (en
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郑显权
郑之训
金圣凡
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Hanmi Semiconductor Co Ltd
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Hanmi Semiconductor Co Ltd
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Priority claimed from KR1020170026773A external-priority patent/KR20180099379A/en
Priority claimed from KR1020170037607A external-priority patent/KR102075198B1/en
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Publication of CN108511381A publication Critical patent/CN108511381A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

Disclosed are a bonding apparatus and a control method thereof. The joining apparatus includes: a bonding head for individually sucking the cut die; a driver that moves the bonding head in a vertical direction and conveys it to a position on the X-Y plane; a bonding substrate on which a die adsorbed by a bonding head is mounted, the bonding head comprising: a bonding member vacuum sucking the die; a first pneumatic pressure member to which buffer power is supplied to the engagement member by selectively applying pneumatic pressure thereto and canceling the application of the pneumatic pressure, the volume of which is variable according to the pressure; and a second pneumatic pressure member to which pneumatic pressure is continuously applied, the pneumatic pressure applied to the first and second pneumatic pressure members being maintained while the bonding head is transferred to a position on the X-Y plane, and when the bonding head is vertically moved downward, the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the bonding head is spaced apart from an upper portion of the bonding substrate by a predetermined height, and the die adsorbed by the bonding member is mounted on the bonding substrate.

Description

Bonding apparatus and control method thereof
Technical Field
The invention relates to a joining apparatus (bonding apparatus) and a control method thereof. More particularly, the present invention relates to a bonding apparatus capable of protecting a die (die) to be bonded, such as a semiconductor chip, and preventing bumps (bumps) on the bottom surface of the die from being damaged when the bottom surface of the die is immersed into flux through a bonding member of the bonding apparatus, or when the flux-immersed die is mounted on a bonding substrate to bond the die to the substrate, such as a printed circuit board, and a control method thereof; the bonding apparatus is capable of moving the die onto a soldering plate (soldering plate) or a bonding substrate at a high speed to minimize a process time required for immersing the die into the soldering flux, thereby maximizing productivity; and the bonding apparatus is capable of minimizing an impact applied to the die during picking of the die while compensating for rotational inertia of a flip-flop (flip) when the die is picked and flipped.
Background
For example, in a semiconductor chip bonding apparatus as an apparatus for bonding a die such as a semiconductor chip, when individual semiconductor chips cut from a wafer are sucked and picked up by a flipper, rotated 180 ° so that the semiconductor chips are turned upside down, and then transferred to a bonding head, the bonding head that picks up the semiconductor chips dips bumps on the bottom surface of the semiconductor chips into flux and bonds the semiconductor chips to a substrate such as a printed circuit board. In general, the process of immersing the bumps on the bottom surface of the die into the flux is performed by: the bonding tool is moved down onto the dipping plate coated with flux of a certain thickness, and the flux of the dipping plate is coated onto the bumps on the bottom surface of the die adsorbed by the bonding tool.
In the bonding apparatus, the flipper employs a spring having a low stiffness as a cushion to minimize an impact applied to the die when the flipper is in contact with the die.
In order to rotate the inverter to a desired range, a stopper is installed at a position where the inverter is to be stopped. When the inverter contacts the stopper, the rotation of the inverter is stopped.
In this case, the mechanical parts of the inverter may shake or may apply an impact to the mechanical parts of the inverter due to the rotational inertia of the inverter, which is an attribute of maintaining rotational motion when the inverter contacts the stopper and thus stops.
Further, since a pickup unit (pickup unit) is installed to be spaced apart from the rotation center of the rotation driver, higher rotational inertia is applied to the pickup unit.
Similarly, when the flipper is moved down at high speed to pick up a die, inertia is applied to the flipper, and thus unnecessary movement of mechanical components of the flipper occurs. The rotational speed of the inverter is controlled in consideration of the inertia of the mechanical parts generated at the time of rotation to prevent problems due to the inertia. However, as the Unit Per Hour (UPH) of the equipment increases, the inverter should be rotated at a high speed. While the rotational speed of the inverter is increased, the spring cannot withstand the inertia of the mechanical part of the inverter, and thus the mechanical part is repeatedly pushed out and returned to the original position of the mechanical part. Thereby, the impact is accumulated on the flipper, and thus the flipper may be damaged or the die adsorbed on the flipper may be thrown forward.
Furthermore, as the semiconductor market tends to be thinner and smaller sized semiconductor materials, the demand for thin film dies is increasing. When the same pickup force as used in the past is applied to the film die of the flipper, the die may be damaged, e.g., the die may be bent or broken. Thus, it is important to minimize the impact applied to the die by controlling the springs of the flipper more gently.
In addition, since the number of bumps disposed on the film die is reduced, the bumps may be damaged by a bonding force applied to the die, or the die may be broken or cracked due to an impact applied to the die when the die is immersed in the flux. To solve these problems, the force to be applied to the bonding tool is controlled within a range that does not cause bump damage.
Conventionally, the force to be applied to the bonding tool is controlled using the pressure applied to an air chamber installed inside the bonding tool. In particular, the bonding tool is supported with high force while the bonding tool is moved in the horizontal direction, so that the die adsorbed by the bonding tool is not damaged by vibration. Immediately before the die adsorbed by the bonding tool is brought into contact with the dipping plate, the bonding tool is supported with low force while moving down above the dipping plate so that bumps arranged on the bottom surface of the die may not be damaged.
However, when the volume of the air chamber is changeable with the pressure during switching of the pressure supporting the bonding tool from high pressure to low pressure, the bonding tool may shake due to the change in the volume of the air chamber, and the die cannot be immersed in the flux or cannot be bonded using the bonding tool until the shake of the bonding tool is stabilized. Therefore, the UPH of the entire equipment may be lowered, thereby lowering productivity.
Accordingly, there is an urgent need for a bonding apparatus for bonding a die (such as a semiconductor chip) capable of minimizing an impact to be applied to a thin die to protect the die without reducing a rotational speed of a flipper, and a control method thereof; when the bottom surface of the die is immersed in the flux to bond the die to a substrate (such as a printed circuit board), the bonding apparatus can protect bumps disposed on the bottom surface of the die, and the bonding apparatus can move the die onto an immersion plate containing the flux at a high speed to minimize a process time required to immerse the die in the flux or bond the die, thereby maximizing productivity.
Disclosure of Invention
The present invention is directed to providing a bonding apparatus and a control method thereof, in which rotational inertia can be compensated when a die is picked up and flipped by a flipper, and an impact applied to the die can be minimized without reducing a rotational speed of the flipper during picking up the die.
The present invention is also directed to providing a bonding apparatus and a control method thereof, in which bumps disposed on a bottom surface of a die can be protected when the die is immersed in a flux to bond the die to a substrate.
The present invention is also directed to a bonding apparatus and a control method thereof capable of controlling a bonding force to prevent a die from being broken or chipped when the die is bonded to a substrate.
The present invention is also directed to providing a bonding apparatus and a control method thereof capable of minimizing a process time required to impregnate or bond a die by moving the die onto a dipping plate or a bonding substrate containing a flux at a high speed to bond the die onto the substrate, thereby maximizing productivity.
Technical proposal
The present invention provides a joining apparatus including: a bonding head to individually adsorb the cut die; a driver to move the bonding head in a vertical direction and to convey the bonding head to a position on an X-Y plane; and a bonding substrate on which a die adsorbed by the bonding head is mounted, wherein the bonding head includes: a bonding member to vacuum-adsorb the die; a first pneumatic pressure member to supply buffer power to the engagement member by selectively applying pneumatic pressure to the first pneumatic pressure member and canceling the application of the pneumatic pressure, wherein a volume of the first pneumatic pressure member is variable according to pressure; and a second pneumatic pressure member to which pneumatic pressure is continuously applied, wherein the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained while the bonding head is transferred to a position on the X-Y plane, and when the bonding head is vertically moved downward, the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the bonding head is spaced apart from an upper portion of the bonding substrate by a predetermined height, and a die adsorbed by the bonding member is mounted on the bonding substrate.
The present invention also provides a joining apparatus including: a bonding head to individually adsorb the cut die; a driver to move the bonding head in a vertical direction and to convey the bonding head to a position on an X-Y plane; an immersion plate, the immersion containing a flux to be applied to a bottom surface of a die adsorbed by the bond head; and a bonding substrate on which the die coated with the flux is mounted, wherein the bonding head includes: a bonding member to vacuum-adsorb the die; a first pneumatic pressure member to supply buffer power to the engagement member by selectively applying pneumatic pressure to the first pneumatic pressure member and canceling the application of the pneumatic pressure, wherein a volume of the first pneumatic pressure member is variable according to pressure; and a second pneumatic pressure member to which pneumatic pressure is continuously applied, wherein the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained while the bonding head is transferred to a position on the X-Y plane, and when the bonding head is vertically moved downward, the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the bonding head is spaced apart from an upper portion of the dipping plate by a predetermined height, and the flux is applied to a bottom surface of a die adsorbed by the bonding member.
The first pneumatic pressure means may include an air chamber passage through which air from an external air tank is supplied and transferred; an air chamber to be inflated by air supplied from the air chamber passage to supply a driving force to the engagement member; a force control regulator to control a pressure of air supplied from the external air tank; and a valve to start or stop the supply of air to the air chamber.
When the supply of air to the air chamber is stopped, the air remaining in the air chamber may be discharged to the outside, whereby only the pneumatic pressure applied to the second pneumatic pressure member remains in the joint member to reduce the pressure applied to the joint member.
The second pneumatic pressure component may comprise: a cylinder passage through which air from an external air tank is supplied and transferred; a cylinder to transmit a pressure of air supplied by the cylinder passage to a support load; and the supporting load for supporting the engaging member by supplying the engaging accessory with a buffer power having a certain pressure according to the pressure transmitted to the supporting load.
When the pneumatic pressure applied to the first pneumatic pressure member is removed and the volume of the air chamber to which air is supplied is thereby changed, the support load may be supported using the pneumatic pressure held by the second pneumatic pressure member to supply the buffer power to the engagement member.
The engagement member may include a sensor stop and the engagement head may include a sensor member to sense a physical distance from the sensor stop, the sensor member being spaced a distance from the sensor stop.
The engagement member may include: a bond pick up to physically contact and attract the die; and an air bearing to rotate the engagement pickup, the air bearing being coupled to an upper portion of the engagement pickup, and the engagement member further comprising: an air tank to supply air to the air bearing; and an air regulator to control the pressure of the supplied air.
The bonding apparatus may further include a flipper to pick up a cut die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head, wherein the flipper may include: a pick-up unit to adsorb and pick up the die; a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward; a supporting load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the supporting load; an elastic member to absorb an impact generated during contact of the pick-up unit with the die, the elastic member being disposed between a supporting part including the supporting load therein and the pick-up unit; a negative pressure pipe to apply a negative pressure to the pick-up unit to maintain the negative pressure while the die is picked up by the pick-up unit, the negative pressure pipe being coupled to the pick-up unit; and a positive pressure tube to supply load-bearing power to the support load by applying positive pressure into the flipping arm, the positive pressure tube being coupled to the flipping arm, wherein the positive pressure applied to the support load by the positive pressure tube is maintained to compensate for inertia of the flipping arm while the flipping arm rotates and moves downward, and the positive pressure is removed immediately before the pick-up unit contacts the die.
The bonding apparatus may further include a flipper to pick up a cut die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head, wherein the flipper may include: a pick-up unit to adsorb and pick up the die; a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward; a supporting load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the supporting load; a negative pressure pipe to apply a negative pressure to the pick-up unit to maintain the negative pressure while the die is picked up by the pick-up unit, the negative pressure pipe being coupled to the pick-up unit; and a positive pressure tube to apply a first positive pressure or a second positive pressure, the positive pressure tube coupled to the invert arm to supply load-bearing power to the support load by selectively applying positive pressure to the invert arm; wherein a first positive pressure applied to the support load is maintained to compensate for inertia of the flipping arm while the flipping arm rotates and moves downward, and the second positive pressure is applied to the support load immediately before the pick-up unit contacts the die, the second positive pressure being lower than the first positive pressure.
The present invention also provides a method of controlling a bonding apparatus including a bonding head having a bonding part to vacuum-adsorb a cut die, a first pneumatic pressure part whose volume is variable according to pressure to supply buffer power to the bonding part, and in which application of pneumatic pressure is selectively performed and the application of pneumatic pressure is canceled, and a bonding substrate to which pneumatic pressure is continuously applied, a driver to move the bonding head in a vertical direction and to transfer the bonding head to a position on an X-Y plane, and a second pneumatic pressure part on which a die adsorbed by the bonding head is mounted; the method comprises the following steps: maintaining pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member while the bonding head that adsorbs the cut die is conveyed over the bonding substrate and vertically moved downward to a certain height; discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint to the outside at the certain height; when the discharge of the pneumatic pressure is completed, further moving the bonding head downward and mounting the die adsorbed by the bonding head on the bonding substrate; and performing subsequent processing while a corresponding pneumatic pressure is applied to the first pneumatic pressure member and held in a state in which the bonding head is moved vertically upward to a certain height when the mounting of the die is completed; wherein the step of maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member, the step of discharging the pneumatic pressure applied to the first pneumatic pressure member, the step of further moving the bonding head downward and mounting the die adsorbed by the bonding head on the bonding substrate, and the step of performing the subsequent process are repeatedly performed.
The present invention also provides a method of controlling a bonding apparatus including a bonding head having a bonding part to vacuum-adsorb a cut die, a first pneumatic pressure part whose volume is variable according to pressure to supply buffer power to the bonding part, and in which application of pneumatic pressure and cancellation of the application of pneumatic pressure are selectively performed, and a second pneumatic pressure part to which pneumatic pressure is continuously applied, a driver to move the bonding head in a vertical direction and to transfer the bonding head to a position on an X-Y plane, and a second pneumatic pressure part containing a flux to be applied to a bottom surface of the die adsorbed by the bonding head, the method comprising the steps of: maintaining pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member while the bonding head that adsorbs the cut die is conveyed over the dip board and vertically moved downward to a certain height; discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint to the outside at the certain height; when the discharge of the corresponding pneumatic pressure is completed, the bonding head is further moved downward and the flux contained in the dipping plate is coated onto the bottom surface of the die adsorbed by the bonding head; when the step of applying the flux onto the bottom surface of the die is completed, the die is transferred over the bonding substrate while pneumatic pressure is applied to the first pneumatic pressure member and held in a state in which the bonding head is moved vertically upward to a certain height; and mounting the solder flux coated die onto the bonding substrate, wherein the steps of maintaining pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member, discharging pneumatic pressure applied to the first pneumatic pressure member, moving the bonding head further downward and coating the solder flux contained in the dipping plate onto a bottom surface of the die adsorbed by the bonding head, transferring the die over the bonding substrate, and mounting the solder flux coated die onto the bonding substrate are repeatedly performed.
The bonding apparatus may further include a flipper to pick up a cut die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head, wherein the flipper may include: a pick-up unit to adsorb and pick up the die; a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward; a support load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the support load; an elastic member disposed between a supporting part including the supporting load therein and the pickup unit; a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and a positive pressure tube coupled to the invert arm to supply load-bearing power to the support load, and wherein the method further comprises the steps of: maintaining a positive pressure to compensate for inertia of the invert arm while the pick-up unit rotates and moves vertically downward to a certain height; discharging the positive pressure at the certain height; after the discharge of the positive pressure is completed, the pick-up unit adsorbs the die by applying a negative pressure by the negative pressure pipe while reducing an impact generated when the pick-up unit moves further downward and contacts the die by using the elastic member; and rotating the pick-up unit while the positive pressure is applied and maintained in a state in which the pick-up unit is vertically moved up to a certain height, wherein the step of maintaining the positive pressure, the step of discharging the positive pressure, the step of adsorbing the die by the pick-up unit, and the step of rotating the pick-up unit are continuously performed.
The bonding apparatus may further include a flipper to pick up a cut die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head, wherein the flipper may include: a pick-up unit to adsorb and pick up the die; a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward; a supporting load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the supporting load; a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and a positive pressure tube coupled to the invert arm to supply load-bearing power to the support load, the positive pressure tube branching into a first positive pressure tube and a second positive pressure tube, wherein the method further comprises the steps of: maintaining a first positive pressure to compensate for inertia of the invert arm while the pick-up unit rotates and moves vertically downward to a height; discharging the first positive pressure at the certain height; applying a second positive pressure lower than the first positive pressure after the discharge of the first positive pressure is completed; the pick-up unit adsorbs the die by applying negative pressure by the negative pressure pipe while reducing an impact generated when the pick-up unit moves further downward and contacts the die by the second positive pressure; and rotating the pick-up unit while the positive pressure is applied and maintained in a state in which the pick-up unit is vertically moved up to a certain height, wherein the steps of maintaining the first positive pressure, discharging the first positive pressure, applying the second positive pressure, adsorbing the die by the pick-up unit, and rotating the pick-up unit are continuously performed.
Drawings
Fig. 1 is a view schematically showing an engagement member for an engagement apparatus according to the present invention;
fig. 2 is a diagram schematically illustrating a method for controlling pneumatic pressure performed by an engagement member for an engagement device according to the present invention;
fig. 3 is a graph showing the position of a bonding head and sensor values of a sensor dog in each of a die-dipping process performed by a bonding member according to the present invention and a die-dipping process performed by a bonding member according to the related art;
fig. 4 schematically shows a control flow of the impregnation process performed by the joining member for the joining apparatus according to the present invention;
fig. 5 is a cross-sectional view of a flipper of an engagement device in accordance with an embodiment of the present invention;
fig. 6 shows a state in which a die is picked up by a first flipper and unloaded by a second flipper, and a state in which the first and second flippers are rotated in a system having two flippers of fig. 5;
fig. 7 illustrates a state in which the die picked up by the first flipper is unloaded and the second flipper is moved down to a height at which the die is to be picked up, upon completion of rotation of the first and second flippers in the state of fig. 6;
Fig. 8 is a cross-sectional view of a flipper of an engagement device in accordance with another embodiment of the present invention;
fig. 9 shows a state in which a die is picked up by a first flipper and unloaded by a second flipper, and a state in which the first and second flippers are rotated in a system having two flippers of fig. 8;
fig. 10 shows a state in which the die picked up by the first flipper is unloaded, and the second flipper moves down to a height at which the die will be picked up in a state when the rotations of the first and second flippers in the state of fig. 9 are completed.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
The bonding apparatus according to the present invention ejects a die (such as a semiconductor chip) attached to a wafer by using an ejector (ejector), adsorbs and picks up the ejected die by a flipper, rotates the die by 180 °, turns the die upside down, and transfers the die to a bonding head. Thereafter, bumps arranged on the bottom surface of the die adsorbed by the bonding head are coated with the flux by immersing the bottom surface of the die in the flux, and then the die is bonded to a bonding substrate such as a printed circuit board.
Fig. 1 is a diagram schematically showing an engagement member 10 for an engagement device according to the present invention.
As shown in fig. 1, in the bonding apparatus, the bonding member 10 has a bonding head 100, the bonding head 100 to receive and suction a cut die from a flipper in a state in which the die is turned upside down, wherein the flipper picks up the die and rotates the die by 180 °; a driver (not shown) for moving the bonding head 100 in a vertical direction (Z-axis direction) and transferring the bonding head 100 to a position on the X-Y plane; and a bonding substrate on which the die adsorbed by the bonding head 100 is mounted. The bonding head 100 includes: a bonding part 110 to vacuum-adsorb the die; a first pneumatic pressure part 121, the first pneumatic pressure part 121 to supply buffer power to the joint part 110 by selectively applying pneumatic pressure and canceling the application of pneumatic pressure, the volume of the first pneumatic pressure part 121 being variable according to the pressure; and a second pneumatic pressure member 122, the second pneumatic pressure member 122 being continuously applied with pneumatic pressure. While the bonding head 100 is transferred to the corresponding position, the pneumatic pressure applied to the first pneumatic pressure member 121 and the second pneumatic pressure member 122 is maintained. When the bonding head 100 moves vertically downward, the pneumatic pressure applied to the first pneumatic pressure member 121 is removed in a state where the bonding head 100 is spaced apart from the upper portion of the bonding substrate by a predetermined height, and the die adsorbed by the bonding member 110 is mounted on the bonding substrate.
According to another embodiment of the present invention, in a bonding apparatus (in which the bonding apparatus includes a bonding head 100, the bonding head 100 being used to individually adsorb cut dies, a driver to move the bonding head 100 in a vertical direction and to transfer the bonding head 100 to a position on an X-Y plane, an immersion plate 300, the immersion plate 300 containing a flux 310 to coat a bottom surface of the die adsorbed by the bonding head 100 with the flux 310, and a bonding substrate on which the die coated with the flux 310 is mounted), the bonding head 100 includes: a bonding part 110 to vacuum-adsorb the die; a first pneumatic pressure part 121, the first pneumatic pressure part 121 being configured to supply buffering power (buffering power) to the joint part 110 by selectively applying pneumatic pressure to the first pneumatic pressure part 121 and canceling the application of the pneumatic pressure, and a volume of the first pneumatic pressure part 121 being variable according to the pressure; and a second pneumatic pressure member 122, the second pneumatic pressure member 122 being continuously applied with pneumatic pressure. When the bonding head 100 is transferred to the corresponding position, the pneumatic pressure applied to the first pneumatic pressure member 121 and the second pneumatic pressure member 122 is maintained. If the bonding head 100 is spaced apart from the upper portion of the bonding substrate by a predetermined height during the vertical downward movement of the bonding head 100, the pneumatic pressure applied to the first pneumatic pressure part 121 is removed and the flux is coated on the bottom surface of the die adsorbed by the bonding part 110.
As shown in fig. 1 (a), a bonding member 10 for a bonding apparatus is lifted by a lifting driver 200 and then moved at a high speed in a horizontal direction (X or Y axis direction) with respect to the ground by a separate conveyor (not shown), thereby placing a die adsorbed by a bonding head 100 on a flux 310 coated on an immersion plate 300 with a certain thickness. Next, as shown in (b) of fig. 1, the bonding head 100 is moved downward by the lift driver 200, so that the bumps arranged on the bottom surface of the die adsorbed by the bonding member 110 are immersed in the flux 310.
Here, the flux 310 may be a composition containing epoxy or the like, and may be used to bond the die with the substrate and prevent short circuits from occurring due to conduction of current between bumps on the bottom surface of the die. The thickness of the flux 310 coated on the immersion plate 300 may be controlled to a micrometer size corresponding to the height of the bumps on the bottom surface of the die.
When the thickness of the applied flux 310 is smaller than the height of the bumps, the bumps are insufficiently coated with the flux 310, and thus the die may be unstably fixed on the substrate, and a short circuit may occur due to conduction of current between the bumps. In contrast, when the thickness of the coated flux 310 is greater than the height of the bump, the bump is overcoated with the flux 310, and thus the content of the flux 310 remaining on the surface of the bump may be unnecessarily high. Therefore, foreign matter may remain on the substrate (on which the die is bonded), and thus a circuit error or the like may occur in the substrate.
In detail, the joint member 110, the buffer member including the first and second pneumatic pressure members 121 and 122, the sensor member 130, and the like may be included in the joint head 100. Here, the bonding part 110 is a device for adsorbing a die, and may include: a bonding pick 111, the bonding pick 111 being configured to physically contact the die to attract the die; an air bearing (air bearing) 112, the air bearing 112 being coupled to an upper portion of the joint pickup 111; the sensor block 113 serves to sense the position of the engaging member 110, etc., by using the sensor member 130.
The first pneumatic pressure component 121 may include: an air chamber passage 121a through which air from an external air tank (air tank) is supplied and transferred; an air chamber 121b, the air chamber 121b being configured to be inflated by air supplied from the air chamber passage 121a to apply a driving force to the joint member 110; a force control regulator for controlling the pressure of air supplied from the external air tank; and a valve for starting or stopping the supply of air into the air chamber 121 b.
When the supply of air into the air chamber 121b is stopped, the air remaining in the air chamber 121b is discharged to the outside, and thus only the pneumatic pressure applied by the second pneumatic pressure member 122 remains in the joint member 110. Therefore, the pressure applied to the joint member 110 is low. Thus, the bonding work or the flux dipping work can be performed at a low pressure, thereby reducing the bonding force to be applied to the die.
Here, the second pneumatic pressure member 122 may include: a cylinder passage 122a through which air from an external air tank is supplied and transferred; a cylinder 122b, the cylinder 122b being configured to transmit the pressure of the air supplied from the cylinder passage 122a to a support load 122c; and a supporting load 122c, the supporting load 122c being configured to support the joint member 110 by applying a buffer power having a certain pressure or a certain pressure (pressure) to the joint member 110 according to the pressure transmitted to the supporting load 122 c.
When the pneumatic pressure applied to the first pneumatic pressure member 121 is removed and thus the volume of the air chamber 121b to which air is supplied is changed, the second pneumatic pressure member 122 may apply a buffer power to the joint member 110 by supporting the supporting load 122c using the pressure held by the second pneumatic pressure member 122.
That is, the bonding apparatus according to the present invention may include the first pneumatic pressure part 121 and the second pneumatic pressure part 122 as means for supporting the bonding part 110 by applying a certain level of buffering power to the bonding part 110, in particular, as means for firmly supporting the bonding part 110 during the transfer of the bonding head 100 and suppressing damage to the bumps on the bottom surface of the die by absorbing the bonding force to be applied to the die when the bumps are in contact with the dipping plate 300 during the immersion of the die in the flux 310.
Here, the first pneumatic pressure member 121 may include: an air chamber passage 121a through which air from an external air tank (not shown) is supplied and transferred; and an air chamber 121b, the air chamber 121b being configured to be inflated by air supplied from the air chamber passage 121a to apply a buffer power having a certain power to the joint member 110, thereby supporting the joint member 110.
The second pneumatic pressure component 122 may include: a cylinder passage 122a through which air from an external air tank (not shown) is supplied and transferred; a cylinder 122b, the cylinder 112b being configured to transmit the pressure of the air supplied by the cylinder passage 122a to the support load 122c; and a supporting load 122c, the supporting load 122c being configured to support the engaging member 110 by applying a buffering power having a certain pressure to the engaging member 110 according to the pressure transmitted to the supporting load 122 c.
Fig. 2 is a diagram schematically illustrating a method of controlling pneumatic pressure performed by the engagement member 10 for an engagement device according to the present invention.
As shown in fig. 2, air is injected into the air chamber 121b and the cylinder 122b under a certain pressure by the force control regulator, and the injection of air into the air chamber 121b may be started or stopped using a manually or automatically controlled valve.
Specifically, the bonding member 10 according to the present invention may more firmly support the die using a high-pressure buffer power, which is the sum of the buffer power of the first pneumatic pressure part 121 according to the air injected into the air chamber 121b and the buffer power of the second pneumatic pressure part 122 according to the air injected into the air cylinder 122b, as shown in fig. 2 (a), immediately before the die is immersed in the flux 310 by moving the die adsorbed and supported by the bonding part 110 onto the flux 310 of the immersion plate 300 at a high speed and moving the bonding head 100 downward by the elevation driver 200. Thereby, the die can be prevented from being separated from the bonding part 110 and damaged due to the shake of the bonding part 110, and an erroneous signal (such as a touch signal) can be prevented from being generated when the bonding part 110 is not in contact with the bottom of the dipping plate 300 due to excessive lifting of the bonding part 110.
As shown in (b) of fig. 2, immediately after the die is immersed in the flux 310 by further moving the bonding head 100 downward using the lift driver 200, the valve may be closed to stop injecting air into the air chamber 121b and rapidly discharging air remaining in the air chamber 121b to the outside, thereby removing the pneumatic pressure applied to the first pneumatic pressure part 121 and supporting the die using a low-pressure buffer power lowered according to the buffer power of the second pneumatic pressure part 122. Thus, when the bump on the bottom surface of the die is in contact with the dipping plate 300, most of the bonding force applied to the die can be supported by the supporting load 122c, thereby suppressing damage to the bump.
Further, the joint member 110 can be accurately supported using the damper power obtained by controlling the damper power of a relatively large effective area supplied from the first pneumatic pressure member 121 to the joint member 110 while maintaining the damper power of a relatively small effective area supplied from the second pneumatic pressure member 122 to the joint member 110. Accordingly, when the buffer power for the bonding part 110 is switched from high voltage to low voltage to immerse the die adsorbed by the bonding part 110 in the flux 310, the rattling of the bonding part 110 can be avoided or minimized. Thus, a time required for stabilizing the shake of the bonding part 110 to perform the process of dipping the die may not be required or may be reduced, thereby greatly improving productivity.
When the injection of air into the air chamber 121b is stopped, the air remaining in the air chamber 121b can be rapidly discharged to the outside using the valve, and thus switching of the buffer power by the first pneumatic pressure member 121 can be rapidly performed. Therefore, productivity can be further improved.
One force control regulator and the first and second pneumatic pressure members 121 and 122 having different areas can be used to control a plurality of forces, thereby simplifying the force control structure.
Even if one force control regulator applies the same pressure to the first pneumatic pressure member 121 and the second pneumatic pressure member 122, different forces may be generated due to different areas of the first pneumatic pressure member 121 and the second pneumatic pressure member 122. Accordingly, data may be collected by separately measuring the force of the first pneumatic pressure component 121 and the pressure of the second pneumatic pressure component 122 by applying pressure to the first pneumatic pressure component 121 and the second pneumatic pressure component 122; the data may also be collected by simultaneously measuring the forces of the first pneumatic pressure member 121 and the second pneumatic pressure member 122 by applying pressure to the first pneumatic pressure member 121 and the second pneumatic pressure member 122, and measuring the force of the second pneumatic pressure member 122 by maintaining only the pressure of the second pneumatic pressure member 122. That is, two force gauges with respect to the same pressure may be implemented.
As described above, by controlling the damper power from the first pneumatic pressure member 121 and the damper power from the second pneumatic pressure member 122, the damper power to be applied to the engaging member 110 can be controlled in a wide range. Accordingly, the present invention can be widely applied to a bonding apparatus for bonding dies having various sizes and various weights.
When the buffer power for the bonding member 110 is switched from high pressure to low pressure, the buffer power of the first pneumatic pressure member 121 supporting the air bearing 112 of the bonding member 110 is reduced, and thus the die adsorbed and supported by the bonding member 110 may be shaken and damaged. Therefore, time required to stabilize the shake of the die is required, and productivity may be lowered. Thereby, an air tank for supplying air to the air bearing 112 to prevent the air bearing 112 from loosening and an air regulator for controlling the pressure of the supplied air may be additionally provided.
Here, the air tank may increase the volume of an air line (air line) from the air regulator to the air bearing 112, thereby controlling the pressure variation of the air bearing 112 to be relatively low. Thus, the air regulator can control the internal pressure of the air bearing 112 to stabilize.
The sensor part 130 may be disposed to be spaced apart from the sensor block 113 included in the engagement part 110 by a certain distance or a certain distance (center distance) to sense a physical distance from the sensor block 113, convert a result of sensing the physical distance into an electrical signal, and transmit the electrical signal to an operator of the apparatus or an automatic controller.
In detail, the sensor part 130 may sense a change in physical distance between the sensor part 130 and the sensor block 113 in real time, which is caused by shaking of the engaging part 110 when the buffering power of the buffering part is switched from high pressure to low pressure, and transmit a sensing signal to an operator or an automatic controller. The operator or an automatic controller may control the lift driver 200 not to start moving the bonding head 100 downward until the shake of the bonding part 110 stabilizes, thus delaying the immersion of the die into the flux 310.
Further, the sensor part 130 may sense an increase in physical distance between the sensor part 130 and the sensor block 113, which is caused by a minute upward movement of the bonding part 110 due to the bonding force applied to the die during the bump on the bottom surface of the die being in contact with the dipping plate 300 when the shaking of the bonding part 110 is stabilized and the die is immersed in the flux 310, and transmit a sensing signal to an operator or an automatic controller. The operator or the automatic controller may secure the dipping time to properly coat bumps arranged on the bottom surface of the die with the flux 310, may control the elevation driver 200 to elevate the bonding head 100 when the dipping of the die is completed, and may transfer the bonding member 10 toward the bonding substrate (such as a wafer) to perform the bonding process after the dipping process.
Fig. 3 is a graph showing the position of the bonding head and the sensor value of the sensor block in each of the die-dipping process performed by the bonding member according to the present invention and the die-dipping process performed by the bonding member according to the related art. In the graph of fig. 3, the vertical axis is the z-axis direction indicating the position in the vertical direction of the joint head and the sensor block, and the horizontal axis indicates time.
As shown in fig. 3, in the bonding member according to the related art (the bonding member includes the buffer member composed of only the air chamber having the relatively large effective pressure area), when the bonding head moves downward and the buffer power of the buffer member is switched from high pressure to low pressure in order to immerse the die in the flux, as shown by the sensor value of the sensor stopper, the bonding member is shaken, and a large amount of time is required to stabilize the shaking of the bonding member, thus lowering productivity. In contrast, in the joint member 10 according to the present invention (the joint member 10 includes the buffer member 120 having the first pneumatic pressure member 121 and the second pneumatic pressure member 122 controlled as described above), as shown by the sensor value of the sensor stopper 113, even when the buffer force applied to the joint member 110 is switched from high pressure to low pressure, the joint member 110 is hardly shaken. Thus, the time required to stabilize the shake of the engaging member 110 is no longer required or greatly reduced, thereby greatly improving productivity.
The present invention relates to a control method of a process of immersing a die into a flux 310 performed by a bonding member 10 for a bonding apparatus as described above.
Fig. 4 schematically shows a control flow of the impregnation process performed by the joining member 10 for a joining apparatus according to the present invention.
As described in fig. 4, a control method of a process of immersing a die into a flux 310 performed by a bonding member 10 for a bonding apparatus according to the present invention may include operations S100 to S700 to be described below.
In operation S100, the bonding head 100 is moved downward by the elevation driver 200, and the die to be bonded is suctioned and picked up by the bonding part 110.
In operation S200, the bonding head 100 is moved upward while the bonding part 110 is supported by the buffer power of the first pneumatic pressure part 121 and the buffer power of the second pneumatic pressure part 122 of the bonding head 100, and the bonding member 10 is transferred such that the die is located on the flux 310 in the dipping plate 300.
Immediately before the die is immersed in the flux 310, the bonding head 100 is moved downward by the lift driver 200 in operation S300.
In operation S400, the buffer power of the buffer member is switched from the high pressure to the low pressure by removing the buffer power of the first pneumatic pressure member 121.
In operation S500, the rattling of the joint member 110 caused by the switching of the buffering power of the first pneumatic pressure member 121 is stabilized.
In operation S600, the bumps on the bottom surface of the die are immersed into the flux 310 by moving the bonding head 100 downward by the elevation driver 200, thereby causing the bumps to be coated with the flux 310.
In operation S700, after the bump is properly coated with the flux 310, the bonding head 100 is moved upward by the elevation driver 200.
A method of controlling the engagement device according to an embodiment of the present invention will be described in more detail below.
In a method of controlling a bonding apparatus according to an embodiment of the present invention (in which the bonding apparatus includes a bonding head including a bonding member to vacuum-adsorb a die such as a semiconductor chip, a driver and a bonding substrate, in which the bonding head includes a first pneumatic pressure member to supply buffer power to the bonding member by selectively applying and canceling the application of pneumatic pressure to the first pneumatic pressure member, and a volume of the first pneumatic pressure member is variable according to pressure, and a second pneumatic pressure member to which pneumatic pressure is continuously applied, in which the driver is to move the bonding head in a vertical direction and transfer the bonding head to a position on an X-Y plane, in which the die adsorbed by the bonding head is mounted on the bonding substrate), the steps of: maintaining pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member while the bonding head of the suction die is transferred over the bonding substrate and vertically moved downward to a certain height; discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint to the outside at a certain height; when the discharge of the pneumatic pressure is completed, the bonding head is further moved downward and the die adsorbed by the bonding head is mounted on the bonding substrate; and when the mounting of the die is completed, performing subsequent processing while pneumatic pressure is applied to the first pneumatic pressure member and held in a state in which the bonding head is moved up to a certain height or a certain height (pitch height).
According to the method of controlling the bonding apparatus, the impact applied to the die when the bonding head mounts the die on the bonding substrate can be reduced, thereby preventing the die from chipping or breaking.
A method of controlling the joining apparatus according to another embodiment of the present invention will be described below.
In a method of controlling a bonding apparatus, the bonding apparatus includes a bonding head 100, a driver, a dipping plate 300, and a bonding substrate, wherein the bonding head 100 includes: bonding means 110 to vacuum adsorb the cut die; a first pneumatic pressure part 121, the first pneumatic pressure part 121 to supply buffer power to the joint part 110 by selectively applying pneumatic pressure thereto and canceling the application of the pneumatic pressure, and a volume of the first pneumatic pressure part 121 is variable according to the pressure; and a second pneumatic pressure member 122, the second pneumatic pressure member 122 being continuously applied with pneumatic pressure; wherein the actuator is configured to move the bond head 100 in a vertical direction and to transfer the bond head 100 to a position on the X-Y plane; wherein the dip board 300 contains a flux 310 to be coated onto the bottom surface of the die adsorbed by the bond head 100; wherein a die coated with a flux 310 is mounted on a bonding substrate. In this method, the following steps may be repeatedly performed: while the bonding head 100 sucking the die is transferred over the dipping plate 300 and is vertically moved down to a certain height, the pneumatic pressure applied to the first pneumatic pressure part 121 and the second pneumatic pressure part 122 is maintained; discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint to the outside at a certain height; when the discharge of the pneumatic pressure is completed, the bonding head 100 is further moved downward, and the flux 310 contained in the dipping plate 300 is applied to the bottom surface of the die adsorbed by the bonding head 100; when the application of the flux 310 to the bottom surface of the die is completed, the bonding head 100 is transferred onto the bonding substrate in a state in which the bonding head 100 is vertically moved upward to a certain height and the pneumatic pressure is applied to the first pneumatic pressure member 121 and held; and mounting the die coated with the flux 310 on a bonding substrate.
According to the method of controlling the bonding apparatus, it is possible to alleviate the impact applied when the flux 310 is applied to the bottom surface of the die adsorbed by the bonding head 100, to prevent damage to bumps disposed on the bottom surface of the die. In this case, the bonding force control may also be performed to mitigate the impact applied when bonding the die. The bonding force control may also be performed when the die is suctioned and picked up by the bonding head 100.
The inverter of the joining apparatus and the control method thereof according to the present invention will be described below with reference to the accompanying drawings. Fig. 5 is a cross-sectional view of a inverter 1000 and a method of controlling the inverter 1000 according to an embodiment of the present invention.
The inverter 1000 according to the present invention includes: a pick-up unit 1100, the pick-up unit 1100 being configured to pick up and pick up a die; a flip arm 1700, the pick-up unit 1100 being mounted on the flip arm 1700, the flip arm 1700 being rotatably and upwardly or downwardly movable on the main body, and having a first pad 1740 and a second pad 1730; a supporting load 1400, the supporting load 1400 being mounted in the flipping arm to be displaceable in a length direction within a predetermined range, and the pickup unit 1100 being mounted on an end of the supporting load 1400; an elastic member 1300, the elastic member 1300 being disposed between the pick-up unit 1100 and a supporting part having a supporting load 1400 therein, and the elastic member 1300 serving to mitigate an impact applied when the pick-up unit 1100 is in contact with the die; a negative pressure pipe 1200, the negative pressure pipe 1200 being coupled to the pickup unit 1100 to apply a negative pressure to the pickup unit 1100; and a positive pressure tube 1800, the positive pressure tube 1800 being coupled to the invert arm 1700 to provide load-bearing power to the support load 1400 by applying positive pressure to the invert arm 1700. The positive pressure applied to the support load 1400 through the positive pressure tube 1800 may be maintained to compensate for the inertia of the flipping arm 1700 while the flipping arm rotates and moves downward, and may be removed immediately before the pick-up unit 1100 contacts the die.
When the first and second pads 1740, 1730 are in contact with the first and second stops 1920, 1940 of fig. 6, the first and second pads 1740, 1730 of the invert arm 1700 limit the range of rotation of the invert arm 1700.
The pick-up unit 1100 may include a suction pad 1110 at a bottom end of the pick-up unit 1100, and may pick up the die when the negative pressure Ps is applied to the suction pad 1110. Accordingly, the pickup unit 1100 of the suction pad 1110 may include a negative pressure pipe 1200, through which negative pressure Ps may be selectively applied.
The pick-up unit 1100 may be mounted in the flipper 1000 to be relatively displaceable to prevent the die from being pressurized and damaged by the suction pad 1110 during pick-up of the die.
That is, as shown in fig. 5, the pickup unit 1100 is coupled to one end of the supporting load 1400, the supporting load 1400 is mounted in the flipping arm 1700 to be displaceable, and the elastic member 1300 is disposed between the flipping arm 1700 and the pickup unit 1100.
Accordingly, an impact applied when the pick-up unit 1100 picks up the die may be absorbed by the rearward movement of the support load 1400 and by the elastic member 1300.
While the pick-up unit 1100 is in contact with the die to be picked up, the die may be adsorbed and picked up by applying a negative pressure Ps by a negative pressure tube 1200 coupled to the pick-up unit 1100.
In the flipper 1000 and the method of controlling the flipper 1000 according to the present invention, the flipper 1000 is used to rotate in a state where a die is picked up by the pick-up unit 1100. In this case, the pickup unit 1100 may not be directly rotated, but the flipping arm 1700 on which the pickup unit 1100 is mounted may be rotated.
The flipping arm 1700 may include a rotating member 1710, on which a rotating shaft 1720 is mounted on the rotating member 1710; and a supporting member 1760 vertically coupled to one end of the rotating member 1710, and having the supporting load 1400 therein 1760. The rotating member 1710 of the invert arm 1700 may be mounted rotatably about the rotation shaft 1720 with respect to the main body 1900 of the inverter 1000 and moved up or down along the elevating guide 1910 by an elevating driving unit 1930.
A support member 1760 extending in a direction perpendicular to the rotating member 1710 may be provided on an end of the rotating member 1710 of the invert arm 1700.
As described above, the support member 1760 may be provided in a hollow form to protect the die. Accordingly, the support load 1400 may be mounted to be displaceable in the length direction of the support member 1760.
Even if the support load 1400 is elastically supported by the elastic member 1300, movement may occur due to rotational inertia of the support load 1400 in the displacement direction during rotation of the flip arm 1700 around the rotation shaft 1720 inside the support part 1760 of the flip arm 1700. Due to such movement, the stability of the pickup unit 1100 in the pickup state may be lowered, and the supporting load 1400 or the pickup unit 1100 may collide with the flipping arm 1700 or the like.
When the inverter 1000 includes the first and second stoppers 1920 and 1940 to limit the rotation range of the inverter arm 1700, the rotation of the inverter arm 1700 is stopped when the inverter arm 1700 contacts the first and second stoppers 1920 and 1940. Thus, the inverter 1000 is more affected by inertia.
One end of the support load 1400 is located in the interior cylinder space 1770 of the support member 1760 of the invert arm 1700. Thus, when positive pneumatic pressure is applied through the positive pressure tube 1800, load-bearing power is supplied to the end supporting the load 1400.
That is, when the positive pressure Pb is applied through the positive pressure pipe 1800, the support load 1400 may be prevented from entering the internal cylinder space 1770 to which the positive pressure Pb is applied, thereby selectively providing the load-bearing power.
A plurality of O-rings (O-rings or1, or2, and or 3) may be provided in the inner cylinder space 1770 of the invert arm 1700 to prevent leakage of the positive pressure Pb applied to the inner cylinder space 1770 of the invert arm 1700 through the positive pressure pipe 1800.
In general, the positive pressure Pb may be applied to the invert arm 1700 only during rotation of the inverter 1000 through the positive pressure tube 1800, or the positive pressure Pb may be variable. For example, if the positive pressure Pb is continuously kept constant during the pick-up of the die by the pick-up unit 1100, the support load 1400 and the flip arm 1700 may be unified into one rigid body and thus the die may be damaged.
A method of controlling the inverter 1000 according to the present invention and controlling the positive pressure Pb applied through the positive pressure pipe 1800 or the negative pressure Ps applied through the negative pressure pipe 1200 according to the operation state of the inverter 1000 will be described with reference to fig. 6.
Specifically, the present invention may provide a method of controlling a flipper, the flipper comprising: a pick-up unit to adsorb and pick up the die; a flip arm on which the pickup unit is mounted, and which is mounted on the body to be rotatable and movable upward or downward; a supporting load mounted in the flipping arm to be displaceable in a length direction within a predetermined range, and a pickup unit mounted on an end of the supporting load; an elastic member disposed between the pickup unit and the support part having the support load therein; a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and a positive pressure tube coupled to the invert arm to supply load-bearing power to the support load. In this method, the following steps may be continuously performed: maintaining positive pressure to compensate for inertia of the invert arm while the pick-up unit rotates and is moved vertically downward to a height; discharging positive pressure at a certain height; after the discharge of the positive pressure is completed, sucking the die with the pick-up unit by applying the negative pressure by the negative pressure pipe, and simultaneously reducing an impact applied when the pick-up unit is further moved downward and brought into contact with the die by using the elastic member; and rotating the pickup unit in a state in which the pickup unit is vertically moved up to a certain height and positive pressure is applied and maintained.
Fig. 6 shows a state in which the die C is picked up by the first flipper 1000a and unloaded by the second flipper 1000b, and a state in which the first and second flippers 1000a and 1000b are rotated, in the system having the two flippers 1000 of fig. 5.
Specifically, fig. 6 (a) shows a state in which the die C is picked up by the first flipper 1000a and unloaded by the second flipper 1000b in a system having two flippers 1000a and 1000b (such as the flipper 1000 of fig. 5). Fig. 6 (b) shows a state in which the first inverter 1000a and the second inverter 1000b are rotated. Fig. 6 (c) shows the structure of the positive pressure pipe 1800 of the inverter 1000 of fig. 5.
The flipping system shown in fig. 6 may include two flippers 1000a and 1000b, and sequentially pick up the die C stacked on the wafer and transfer the die C for subsequent processing without interference between the flippers 1000a and 1000 b. The flipping system of fig. 6 may include a downward vision unit 2000, the downward vision unit 2000 to check the arrangement of die to be picked up.
In the flippers 1000a and 1000b and the control method thereof according to the present invention, during the suction and pickup of the die C by the pickup unit 1100 of each of the flippers 1000a and 1000b, the negative pressure Ps may be applied through the negative pressure pipe 1200.
Accordingly, as shown in fig. 6 (a), the first inverter 1000a may start to apply the negative pressure Ps before the die C is adsorbed to reduce the vacuum generation time, and as shown in fig. 6 (b), the negative pressure Ps may be maintained to be applied through the negative pressure tube 1200 even during the rotation of the first inverter 1000a. This means that the application of the negative pressure Ps should be maintained while the die C is picked up by the pick-up unit 1100.
A positive pressure Pb is applied to the inner cylinder space 1770 of the invert arm 1700 to prevent movement or sloshing of the support load 1400 on which the pickup unit 1100 is mounted. Therefore, when the suction of the die C is started to pick up the die C, the positive pressure Pb may not be applied. That is, if the positive pressure Pb is applied to the cylinder of the flip arm 1700 through the positive pressure pipe 1800, a bearing power may be generated at the supporting load 1400, and thus the buffering operation performed by the elastic member 1300 or the like may be disturbed when the die C is in contact with the pick-up unit 1100.
Therefore, during the suction of the die C by the pick-up unit 1100, the application of the positive pressure Pb can be canceled.
Therefore, since the first flipper 1000a of fig. 6 (a) performs suction to pick up the die C, the positive pressure Pb is not applied to the first flipper 1000a. Since the second flipper 1000b does not pick up the die C, a positive pressure Pb may be applied to the second flipper 1000b to fixedly support the load 1400 and the pick-up unit 1100.
In addition, as shown in (b) of fig. 6, when the position of the pick-up unit 1100 of each of the flippers 1000a and 100b is changed due to the rotation of the flippers 1000a and 1000b, positive pressure Pb may be applied through the positive pressure pipe 1800 of each of the flippers 1000a and 1000b to prevent movement, sloshing or vibration of the support load 1400 and the pick-up unit 1100, thereby improving the reliability of the rotation of the flippers 1000a and 1000b and the reliability of the die C when the die C is adsorbed.
If the first inverter 1000a includes the first stopper 1920 to limit the rotation range of the inverter arm 1700, the first pad 1740 on the inverter arm 1700 may contact the first stopper 1920, and thus a high inertial force may be generated when the rotation of the inverter arm 1700 is completed. Therefore, in this case, the application of the positive pressure Pb may also be maintained to prevent the movement, shake, or vibration of the first inverter 1000 a.
Thus, the application of the positive pressure Pb can be maintained during the rotation of the invert arm 1700.
As shown in fig. 6 (c), the positive pressure pipe 1800 may be coupled to an inner cylinder space 1770 of the invert arm 1700, and may include a regulator 1810 to homogenize the positive pressure Pb applied through the positive pressure pipe 1800, and a control valve 1860 to selectively block the positive pressure Pb. Accordingly, the positive pressure Pb applied to the inner cylinder space 1770 of the invert arm 1700 through the positive pressure pipe 1800 is homogenized by the regulator 1810. Depending on the operating state of the inverter 1000a or 1000b, the positive pressure Pb may be selectively applied or blocked using the control valve 1860.
When the positive pressure Pb is blocked (when the application of the positive pressure Pb is canceled), the air remaining in the inside cylinder space 1770 can be rapidly discharged into the atmosphere to prevent the positive pressure Pb applied to the inside cylinder space 1770 of the flip arm 1700 from remaining and to prevent the positive pressure Pb remaining when the die C is picked up from being transferred to the die C.
Fig. 7 illustrates a state in which the die C picked up by the first flipper 1000a is unloaded and the second flipper moves down to a height at which the die C is to be picked up when the rotations of the first and second flippers 1000a and 1000b in the state of fig. 6 are completed.
As shown in fig. 7 (a), in the case where there is no interference between the flippers 1000a and 1000b, the state in which the rotation of the flippers 1000a and 1000b is completed should be understood as the following state: the rotation of the first inverter 1000a is completed such that the pickup unit 1100 of the first inverter faces upward, and the rotation of the second inverter 1000b is completed such that the pickup unit 1100 of the second inverter 1000b faces downward.
In this case, the negative pressure Ps is applied to the first flipper 1000a of the suction die C through the negative pressure pipe 1200, and the positive pressure Pb is applied to the first flipper 1000a and the second flipper 1000b through the positive pressure pipe 1800 of the first flipper 1000a and the second flipper 1000b.
As described above, the support load 1400 may be supported by the positive pressure Pb applied to the first and second flippers 1000a and 1000b through the positive pressure pipe 1800, and thus movement, sloshing or vibration of the first and second flippers 1000a and 1000b may be minimized regardless of rotation of the first and second flippers 1000a and 1000 b. In addition, the negative pressure Ps is applied to the first flipper 1000a together with the positive pressure Pb, and thus the suction state of the picked-up die C can be stably maintained.
As shown in (b) of fig. 7, when the die C picked up by the first flipper 1000a is unloaded, the negative pressure Ps applied to the pick-up unit 1100 of the first flipper 1000a may be removed, and the downward movement of the second flipper 1000b may be completed. Thus, the positive pressure Pb applied through the positive pressure tube 1800 can be removed before another die C is adsorbed. In order to adsorb another die C, a negative pressure Pb is applied to the pick-up unit 1100.
The downward movement of the second inverter 1000b will now be described in detail. The second inverter 1000b may be moved downward toward the wafer w while being rotated. Before the pick-up unit 1100 of the second flipper 1000b contacts the die C, when the rotational motion of the second flipper 1000b is started, the second flipper 1000b may be moved downward to a predetermined height at a high speed, and thereafter the second flipper 1000b may be moved downward at a low speed.
When moving downward at a low speed, the second flipper 1000b can be moved to a height close to the die C at a uniform speed before the pick-up unit 1100 contacts the die C. In this case, the second inverter 1000b may exhaust the air in the inside cylinder space 1770 into the atmosphere and move downward until the pick-up unit 1100 contacts the die C.
The flippers 1000a and 1000b to pick up and flip the die C as described above can selectively supply the positive pressure Pb and the negative pressure Ps according to the operation states of the flippers 1000a and 1000b, thereby improving the stability of the suction state of the die C and minimizing the movement or vibration of the flippers 1000a and 1000b when the flippers 1000a and 1000b are operated.
During the flipping of the die C and the downward movement of the flippers 1000a and 1000b, the positive pressure Pb may limit the displacement of the pick-up unit 1100 of the flippers 1000a and 1000b, and thus the flippers 1000a and 1000b may be rotated at a high speed and moved downward, thereby improving productivity.
Fig. 8 is a sectional view illustrating a inverter 1000 and a control method thereof according to another embodiment of the present invention. The description of the same parts of fig. 8 as those of fig. 5 to 7 as described above will not be repeated here, and differences of fig. 8 from fig. 5 to 7 will now be described collectively.
In the flipper 1000 of fig. 8, similar to the embodiment of fig. 5, the pick-up unit 1100 is displaceable via the mounting of the support load 1400 in the flipper arm 1700, but the elastic member 1300 for absorbing shocks generated during the suction of the die is omitted.
That is, in the inverter 1000 of fig. 8, the elastic member 1300 is not provided between the pickup unit 1100 and the supporting part 1760 of the inverting arm 1700, and a method of controlling the application of the positive pressure Pb via the positive pressure pipe 1800 may be adopted instead of using the elastic member 1300.
More specifically, a flipper according to another embodiment of the present invention includes: a pick-up unit to adsorb and pick up the die; a flip arm on which the pickup unit is mounted, and which is mounted on the body to be rotatable and movable upward or downward; a supporting load mounted in the flipping arm to be displaceable in a length direction within a predetermined range, and a pickup unit mounted at an end of the supporting load; a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and a positive pressure tube coupled to the invert arm to provide load-bearing power to the support load by selectively applying positive pressure to the invert arm, and configured to apply either the first positive pressure or the second positive pressure. The first positive pressure applied to the support load may be maintained to compensate for inertia of the flip arm while the flip arm rotates and moves downward, and the second positive pressure applied to the support load immediately before the pick-up unit contacts the die.
Here, the positive pressure pipe may include a control valve to selectively apply the first positive pressure and the second positive pressure. The first positive pressure is higher than the second positive pressure.
That is, in the previous embodiment, during the application of the negative pressure Ps to the pick-up unit 1100 through the negative pressure tube 1200 to pick up the die by the pick-up unit 1100, the application of the positive pressure Pb through the positive pressure tube 1800 is canceled. In contrast, in the inverter 1000 of fig. 8, the positive pressure Pb applicable through the positive pressure pipe 1800 may be divided into a first level positive pressure Pb1 for minimizing vibration or movement of the inverter 1000 during operation of the inverter 1000 (such as rotation of the inverter 1000) and a second level positive pressure Pb2 applied through the positive pressure pipe 1800 to absorb shock generated when the die is adsorbed while applying the negative pressure Ps through the negative pressure pipe 1200 during picking up of the die.
That is, the second-level positive pressure Pb2 may provide a low resistance sufficient to absorb pressure applied to the die when the ejector pin (ejector pin) is lifted, or absorb a reaction due to the die being supported on the wafer while the suction pad 1110 of the pick-up unit 1100 is in contact with the die, and the second-level positive pressure Pb2 may achieve substantially the same effect as when the elastic member 1300 is used as a cushion pad.
Fig. 9 shows a state in which a die C is picked up by a first flipper 1000a and unloaded by a second flipper 1000b, and a state in which the first and second flippers 1000a and 1000b are rotated, in a system including two flippers 1000a and 1000b, such as the flipper 1000 of fig. 8.
In detail, fig. 9 (a) shows a state in which the die C is picked up by the first flipper 1000a and unloaded by the second flipper 1000b in a system including two flippers 1000a and 1000b (e.g., the flipper 1000 of fig. 8). Fig. 9 (b) shows a state in which the first inverter 1000a and the second inverter 1000b are rotated. Fig. 9 (c) shows the structure of the positive pressure pipe 1800 of the inverter 1000 of fig. 8.
As shown in fig. 9 (a), unlike the previous embodiment, during the picking up of the die C by the first flipper 1000a, a second level positive pressure Pb2 is applied through the positive pressure pipe 1800. The second level positive pressure Pb2 is applied to the inner cylinder space 1770 of the flip arm 1700 to absorb the shock generated during the suction of the die C when the negative pressure Ps is applied to the pick-up unit 1100, and the die C is sucked and picked up. As shown in fig. 9 (a), a positive pressure Pb is applied to the second inverter 1000b to fixedly support the load 1400 and the pick-up unit 1100, and since the second inverter 1000b does not adsorb the die C, a negative pressure Ps is not applied to the second inverter 1000b.
Similar to the previous embodiment, as shown in (b) of fig. 9, while both the first inverter 1000a and the second inverter 1000b are rotated, the first positive pressure Pb1 is applied through the positive pressure pipes 1800 of the first inverter 1000a and the second inverter 1000b to prevent movement, shaking or vibration of the support load 1400 and the pickup unit 1100 when the position of the pickup unit 1100 is changed due to the rotation of the first inverter 1000a and the second inverter 1000 b. Therefore, the rotational reliability of the flippers 1000a and 1000b and the reliability of the suction state of the die C can be improved. As in the previous embodiment, the negative pressure Ps is applied only to the first flipper 1000a of the pick-up die C.
As shown in fig. 9 (c), the positive pressure pipe 1800 is branched into a first positive pressure pipe 1800a for applying the first level positive pressure Pb1 and a second positive pressure pipe 1800b for applying the second level positive pressure Pb2. The first control valve 1860x is disposed in front of the internal cylinder space 1770 to selectively apply the first or second level positive pressure Pb1 or Pb2 according to the operation state of the inverter 1000a or 1000 b. Accordingly, when the first level positive pressure Pb1 is applied, the first control valve 1860x may communicate the passage of the first positive pressure pipe 1800a with the inside cylinder space 1770. When the second level positive pressure Pb2 is applied, the first control valve 1860x may communicate the passage of the second positive pressure pipe 1800b with the internal cylinder space 1770.
In the passage of the second positive pressure pipe 1800b, a regulator 1810b, a proportional valve 1860z for controlling the opening degree (degree of openness) of the passage according to pressure, a second control valve 1860y for selecting the second positive pressure pipe 1800b and the atmosphere, and the like may be provided.
Since the positive pressure pipe 1800 branches into the first positive pressure pipe 1800a and the second positive pressure pipe 1800b, when it is necessary to reduce the positive pressure Pb, the response to the change in the magnitudes of the first-stage positive pressure Pb1 and the second-stage positive pressure Pb2 applied by the positive pressure pipe 1800 and the reliability of the magnitudes of the first-stage positive pressure Pb1 and the second-stage positive pressure Pb2 can be improved by blocking the passages of the respective pipes, removing the pressure applied to the cylinders, and applying the positive pressures Pb having different magnitudes, instead of by reducing the first-stage positive pressure Pb1 to the second-stage positive pressure Pb 2.
Since the second positive pressure pipe 1800b and the atmosphere are selected using the second control valve 1860y, the residual pressure of the internal cylinder space 1770 can be rapidly discharged, and the second positive pressure pipe 1800b can be connected to the internal cylinder space 1770 through the second control valve 1860y to apply the second level positive pressure Pb2 when the discharge of the residual pressure of the internal cylinder space 1770 is completed, thereby improving the positive pressure switching response.
Fig. 10 shows a state in which the die C picked up by the first flippers 1000a is unloaded and the second flipper 1000b moves down to a height at which the die C is to be picked up in a state in which the rotation of the first and second flippers 1000a and 1000b in the state of fig. 9 is completed.
As shown in fig. 10 (a), in a state where the turners 1000a and 1000b finish rotating without interference between the turners 1000a and 1000b, the rotation of the first turner 1000a is finished such that the pickup unit 1100 of the first turner 1000a faces upward and the rotation of the second turner 1000b is finished such that the pickup unit 1100 of the second turner 1000b faces downward, the negative pressure Ps is applied to the first turner 1000a adsorbing the die through the negative pressure pipe 1200, and the first positive pressure Pb1 is applied to the first turner 1000a and the second turner 1000b through the positive pressure pipe 1800, similarly to the previous embodiment.
As shown in (b) of fig. 10, when the die picked up by the first flipper 1000a is unloaded, the negative pressure Ps applied to the pick-up unit 1100 of the first flipper 1000a may be removed, and the downward movement of the second flipper 1000b may be completed. Therefore, before another die C is adsorbed, the operation of applying the first level positive pressure Pb1 through the positive pressure pipe 1800 is canceled, and the first level positive pressure Pb1 is reduced to the second level positive pressure Pb2. In order to reduce the vacuum generation time, a negative pressure Ps is applied to the pick-up unit 1100 before another die C is adsorbed. Thus, during the suction of the die C by the pick-up unit 1100, the positive pressure is continuously applied, and the applied positive pressure may be lower than the positive pressure applied during the rotation of the flip arm 1700. In this case, when positive pressure is applied, the positive pressure may be reduced by removing the applied positive pressure and applying a new positive pressure lower than the positive pressure during the downward movement of the invert arm 1700.
As described above, in a method of controlling a flipper according to another embodiment of the present invention (in which the flipper includes a pickup unit to absorb and pick up a die, a flipper arm on which the pickup unit is mounted and which is mounted on a body to be rotatable and movable upward or downward, a support load mounted in the flipper arm to be displaceable in a length direction within a predetermined range and mounted on an end of the support load, a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit, and a positive pressure pipe coupled to the flipper arm to supply a bearing power to the support load, the positive pressure pipe being branched into a first positive pressure pipe and a second positive pressure pipe), the steps of: maintaining a first positive pressure to compensate for inertia of the invert arm while the pick-up unit rotates and moves vertically downward to a height; discharging the first positive pressure at a height; after the discharge of the first positive pressure is completed, applying a second positive pressure lower than the first positive pressure; when the pick-up unit is further moved downward and thus brought into contact with the die, the die is sucked by the pick-up unit by applying negative pressure by the negative pressure pipe while reducing the impact generated during the contact with the die by using the second positive pressure; and rotating the pick-up unit in a state in which the pick-up unit is vertically moved up to a certain height while the first positive pressure is applied and maintained.
According to the above-described method, the flippers 1000a and 1000b to pick up and flip the die C can selectively apply the positive pressure Pb and the negative pressure Ps according to the operation states of the flippers 1000a and 1000b, thereby improving the stability of the die C in the suction state and minimizing the movement or vibration when the flippers 1000a and 1000b are operated, and also can perform the function of an elastic member to protect the die.
In the bonding member for a bonding apparatus and the control method thereof according to the present invention, a bonding force applied to a die (such as a semiconductor chip) when the die is immersed in a flux or bonded to a bonding substrate can be precisely controlled. Thereby, the bumps on the bottom surface of the die can be prevented from being damaged, and chipping or cracking of the die can be prevented.
According to the present invention, even when a pneumatic pressure member whose volume can be changed according to pressure is used, the pneumatic pressure can be divided into two parts, and even if the volume of the pneumatic pressure member is changed, the buffer power can be continuously supplied to the engagement member, thereby avoiding or minimizing rattling of the engagement member. This can stabilize the joint member.
In the bonding apparatus and the control method thereof according to the present invention, a die (such as a semiconductor chip) adsorbed by a bonding member can be moved onto a dipping plate or a bonding substrate containing a flux at a high speed, and thus productivity can be maximized without lowering UPH.
Although the present invention has been described above in connection with exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the technical spirit and scope of the invention. It is therefore evident that all modifications are included within the technical scope of the present invention, as long as they include the elements claimed in the claims of the present invention.

Claims (14)

1. An engagement apparatus, the engagement apparatus comprising:
a bonding head to individually adsorb the cut die;
a driver to move the bonding head in a vertical direction and to convey the bonding head to a position on an X-Y plane; and
a bonding substrate on which a die adsorbed by the bonding head is mounted,
wherein the bonding head comprises:
a bonding member to vacuum-adsorb the die;
a first pneumatic pressure member to supply buffer power to the joint member by selectively applying pneumatic pressure to the first pneumatic pressure member and canceling the application of the pneumatic pressure, the first pneumatic pressure member having an air chamber whose volume is variable according to pressure, the first pneumatic pressure member applying pneumatic pressure when the joint member is transferred, and canceling the pneumatic pressure when the joint member is mounted; and
A second pneumatic pressure member provided separately from the first pneumatic pressure member, the second pneumatic pressure member continuously maintaining a state in which pneumatic pressure is applied,
wherein pneumatic pressures applied to the first pneumatic pressure member and the second pneumatic pressure member are maintained while the bonding head is transferred to a position on the X-Y plane to firmly support a die adsorbed to the bonding member at the time of transfer by the pneumatic pressures applied to the first pneumatic pressure member and the second pneumatic pressure member,
and when the bonding head moves vertically downward, the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the bonding head is spaced apart from the upper portion of the bonding substrate by a predetermined height, and only the pneumatic pressure applied to the second pneumatic pressure member remains on the bonding member to mount the die adsorbed by the bonding member on the bonding substrate in a state where the bonding force applied to the die adsorbed by the vacuum is reduced.
2. An engagement apparatus, the engagement apparatus comprising:
a bonding head to individually adsorb the cut die;
A driver to move the bonding head in a vertical direction and to convey the bonding head to a position on an X-Y plane;
a dipping plate containing a flux to be applied onto a bottom surface of the die adsorbed by the bonding head; and
a bonding substrate on which a die coated with the flux is mounted,
wherein the bonding head comprises:
a bonding member to vacuum-adsorb the die;
a first pneumatic pressure member to supply buffer power to the engagement member by selectively applying pneumatic pressure to the first pneumatic pressure member and canceling the application of the pneumatic pressure, wherein the first pneumatic pressure member includes an air chamber having a variable volume according to pressure; and
a second pneumatic pressure member to which pneumatic pressure is continuously applied,
wherein pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained while the bonding head is transferred to a position on the X-Y plane, and when the bonding head is moved vertically downward, the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the bonding head is spaced apart from an upper portion of the dipping plate by a predetermined height, and the flux is applied to a bottom surface of the die adsorbed by the bonding member.
3. The joining apparatus according to claim 1 or 2, wherein the first pneumatic pressure member includes:
an air chamber passage through which air from an external air tank is supplied and transferred;
a force control regulator to control a pressure of air supplied from the external air tank; and
a valve to start or stop the supply of air to the air chamber.
4. The joining apparatus according to claim 3, wherein when the supply of air to the air chamber is stopped, air remaining in the air chamber is discharged to the outside, whereby only the pneumatic pressure applied to the second pneumatic pressure member remains in the joining member to reduce the pressure applied to the joining member.
5. The joining apparatus according to claim 1 or 2, wherein the second pneumatic pressure member includes:
a cylinder passage through which air from an external air tank is supplied and transferred;
a cylinder to transmit a pressure of air supplied by the cylinder passage to a support load; and
the support load is configured to support the engagement member by supplying a buffer power having a certain pressure to the engagement member according to a pressure transmitted to the support load.
6. The engagement apparatus according to claim 5, wherein when the pneumatic pressure applied to the first pneumatic pressure member is removed and the volume of the air chamber to which air is supplied is thereby changed, the support load is supported using the pneumatic pressure held by the second pneumatic pressure member to supply the buffer power to the engagement member.
7. The engagement apparatus according to claim 1 or 2, wherein the engagement member includes a sensor stopper, and
the bond head includes a sensor member to sense a physical distance from the sensor block, the sensor member being spaced a distance from the sensor block.
8. The joining apparatus according to claim 1 or 2, wherein the joining member includes:
a bond pick up to physically contact and attract the die; and
an air bearing to rotate the joint picker, the air bearing coupled to an upper portion of the joint picker, and
the engagement member further includes:
an air tank to supply air to the air bearing; and
An air regulator to control the pressure of supplied air.
9. The bonding apparatus of claim 1 or 2, further comprising a flipper to pick up a singulated die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head,
wherein the inverter comprises:
a pick-up unit to adsorb and pick up the die;
a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward;
a supporting load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the supporting load;
an elastic member to absorb an impact generated during contact of the pick-up unit with the die, the elastic member being disposed between a supporting part including the supporting load therein and the pick-up unit;
a negative pressure pipe to apply a negative pressure to the pick-up unit to maintain the negative pressure while the die is picked up by the pick-up unit, the negative pressure pipe being coupled to the pick-up unit; and
A positive pressure tube to supply load-bearing power to the support load by applying positive pressure into the invert arm, the positive pressure tube coupled to the invert arm,
wherein a positive pressure applied to the supporting load through the positive pressure pipe is maintained to compensate for inertia of the flipping arm while the flipping arm rotates and moves downward, and the positive pressure is removed immediately before the pick-up unit contacts the die.
10. The bonding apparatus of claim 1 or 2, further comprising a flipper to pick up a singulated die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head,
wherein the inverter comprises:
a pick-up unit to adsorb and pick up the die;
a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward;
a supporting load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the supporting load;
A negative pressure pipe to apply a negative pressure to the pick-up unit to maintain the negative pressure while the die is picked up by the pick-up unit, the negative pressure pipe being coupled to the pick-up unit; and
a positive pressure tube to apply a first positive pressure or a second positive pressure, the positive pressure tube coupled to the invert arm to supply a load-bearing motive force to the support load by selectively applying a positive pressure to the invert arm;
wherein a first positive pressure applied to the support load is maintained to compensate for inertia of the invert arm while the invert arm rotates and moves downward, and
the second positive pressure is applied to the support load immediately before the pick-up unit is in contact with the die, the second positive pressure being lower than the first positive pressure.
11. A method of controlling a bonding apparatus including a bonding head, a driver, and a bonding substrate,
the bonding head has a bonding part for vacuum-sucking a cut die, a first pneumatic pressure part having an air chamber with a variable volume according to pressure, which applies pneumatic pressure when the bonding part is transferred, and cancels pneumatic pressure when the bonding part is mounted, and a second pneumatic pressure part provided separately from the first pneumatic pressure part, which continuously maintains a state of applying a predetermined pneumatic pressure, the driver for moving the bonding head in a vertical direction and transferring the bonding head to a position on an X-Y plane, on which the die sucked by the bonding head is mounted; the method comprises the following steps:
Maintaining pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member while the bonding head that adsorbs the cut die is conveyed over the bonding substrate and vertically moved downward to a certain height;
discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint to the outside at the certain height;
when the discharge of the pneumatic pressure is completed, further moving the bonding head downward and mounting the die adsorbed by the bonding head on the bonding substrate; and
when the mounting of the die is completed, performing subsequent processing while a corresponding pneumatic pressure is applied to the first pneumatic pressure member and held in a state in which the bonding head is moved vertically upward to a certain height;
wherein the step of maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member, the step of discharging the pneumatic pressure applied to the first pneumatic pressure member, the step of further moving the bonding head downward and mounting the die adsorbed by the bonding head on the bonding substrate, and the step of performing the subsequent process are repeatedly performed,
Stably supporting a die adsorbed to the bonding member by pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member until the bonding head is transferred or the bonding head reaches a predetermined height of an upper portion of the bonding substrate,
and when the bonding head reaches a predetermined height of an upper portion of the bonding substrate, removing the pneumatic pressure applied to the first pneumatic pressure member to reduce the bonding force applied to the die adsorbed by the vacuum,
when the die attached to the bonding head is mounted on the bonding substrate, a buffer force is applied to the bonding member by the pressure held by the second pneumatic pressure member in a state in which the pneumatic pressure of the first pneumatic pressure member is removed, so that the die attached to the bonding member is mounted on the bonding substrate.
12. A method of controlling a bonding apparatus including a bonding head having a bonding part to vacuum-adsorb a cut die, a first pneumatic pressure part whose volume is variable according to pressure to supply buffer power to the bonding part, and in which application of pneumatic pressure and cancellation of the application of pneumatic pressure are selectively performed, and a bonding substrate to which pneumatic pressure is continuously applied, a driver to move the bonding head in a vertical direction and to transfer the bonding head to a position on an X-Y plane, and a second pneumatic pressure part to contain a flux to be applied to a bottom surface of the die adsorbed by the bonding head, the method comprising the steps of:
Maintaining pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member while the bonding head that adsorbs the cut die is conveyed over the dip board and vertically moved downward to a certain height;
discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint to the outside at the certain height;
when the discharge of the corresponding pneumatic pressure is completed, the bonding head is further moved downward and the flux contained in the dipping plate is coated onto the bottom surface of the die adsorbed by the bonding head;
when the step of applying the flux onto the bottom surface of the die is completed, the die is transferred over the bonding substrate while pneumatic pressure is applied to the first pneumatic pressure member and held in a state in which the bonding head is moved vertically upward to a certain height; and
mounting the solder flux coated die onto the bonding substrate,
wherein the step of maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member, the step of discharging the pneumatic pressure applied to the first pneumatic pressure member, the step of further moving the bonding head downward and applying the flux contained in the dipping plate onto the bottom surface of the die adsorbed by the bonding head, the step of transferring the die over the bonding substrate, and the step of mounting the flux-coated die onto the bonding substrate are repeatedly performed.
13. The method of claim 11 or 12, wherein the bonding apparatus further comprises a flipper to pick up a singulated die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head,
wherein the inverter comprises:
a pick-up unit to adsorb and pick up the die;
a flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward;
a support load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the support load;
an elastic member disposed between a supporting part including the supporting load therein and the pickup unit;
a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and
a positive pressure tube coupled to the invert arm to supply load-bearing power to the support load, an
Wherein the method further comprises the steps of:
Maintaining a positive pressure to compensate for inertia of the invert arm while the pick-up unit rotates and moves vertically downward to a certain height;
discharging the positive pressure at the certain height;
after the discharge of the positive pressure is completed, the pick-up unit adsorbs the die by applying a negative pressure by the negative pressure pipe while reducing an impact generated when the pick-up unit moves further downward and contacts the die by using the elastic member; and
rotating the pick-up unit while the positive pressure is applied and held in a state in which the pick-up unit is vertically moved up to a certain height,
wherein the step of maintaining the positive pressure, the step of discharging the positive pressure, the step of adsorbing the die by the pick-up unit, and the step of rotating the pick-up unit are continuously performed.
14. The method of claim 11 or 12, wherein the bonding apparatus further comprises a flipper to pick up a singulated die, rotate the die 180 ° to turn the die upside down, and transfer the die to the bonding head,
wherein the inverter comprises:
a pick-up unit to adsorb and pick up the die;
A flipping arm on which the pickup unit is mounted, and which is mounted on the body and is rotatable and movable upward or downward;
a supporting load mounted in the flipping arm and displaceable in a length direction within a predetermined range, and wherein the pickup unit is mounted on an end of the supporting load;
a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and
a positive pressure tube coupled to the invert arm to supply load-bearing power to the support load, the positive pressure tube branching into a first positive pressure tube and a second positive pressure tube,
wherein the method further comprises the steps of:
maintaining a first positive pressure to compensate for inertia of the invert arm while the pick-up unit rotates and moves vertically downward to a height;
discharging the first positive pressure at the certain height;
applying a second positive pressure lower than the first positive pressure after the discharge of the first positive pressure is completed;
the pick-up unit adsorbs the die by applying negative pressure by the negative pressure pipe while reducing an impact generated when the pick-up unit moves further downward and contacts the die by the second positive pressure; and
Rotating the pick-up unit while the positive pressure is applied and held in a state in which the pick-up unit is vertically moved up to a certain height,
wherein the step of maintaining the first positive pressure, the step of discharging the first positive pressure, the step of applying the second positive pressure, the step of adsorbing the die by the pick-up unit, and the step of rotating the pick-up unit are continuously performed.
CN201810127206.9A 2017-02-28 2018-02-08 Bonding apparatus and control method thereof Active CN108511381B (en)

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