CN108511381A - Engage equipment and its control method - Google Patents

Engage equipment and its control method Download PDF

Info

Publication number
CN108511381A
CN108511381A CN201810127206.9A CN201810127206A CN108511381A CN 108511381 A CN108511381 A CN 108511381A CN 201810127206 A CN201810127206 A CN 201810127206A CN 108511381 A CN108511381 A CN 108511381A
Authority
CN
China
Prior art keywords
bare die
pneumatic pressure
pickup unit
engaging head
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810127206.9A
Other languages
Chinese (zh)
Other versions
CN108511381B (en
Inventor
郑显权
郑之训
金圣凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanmi Semiconductor Co Ltd
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020170026773A external-priority patent/KR20180099379A/en
Priority claimed from KR1020170037607A external-priority patent/KR102075198B1/en
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of CN108511381A publication Critical patent/CN108511381A/en
Application granted granted Critical
Publication of CN108511381B publication Critical patent/CN108511381B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

A kind of engagement equipment and its control method are disclosed.Engaging equipment includes：Engaging head, individually to adsorb the bare die of cutting；Driver moves engaging head and sends it to the position on X Y planes in vertical direction；Substrate is engaged, the bare die adsorbed by engaging head is installed thereon, engaging head includes：Joint element, vacuum suction bare die；First Pneumatic pressure component supplies buffer power by selectively applying the application of Pneumatic pressure and cancellation Pneumatic pressure to it to joint element, and volume is variable according to pressure；Second Pneumatic pressure component, continuously applied Pneumatic pressure, while the position being transmitted to engaging head on X Y planes, remain applied to the Pneumatic pressure of the first and second Pneumatic pressure components, and when engaging head moves vertically downward, in the state that engaging head separates predetermined altitude with the top for engaging substrate, the Pneumatic pressure for being applied to the first Pneumatic pressure component removes, and is mounted on engagement substrate by the bare die of joint element absorption.

Description

Engage equipment and its control method
Technical field
The present invention relates to a kind of engagement equipment (bonding apparatus) and its control methods.More specifically, this hair Bright to be related to a kind of engagement equipment and its control method, engagement equipment can protect bare die to be joined (die) (such as semiconductor core Piece), and when the bottom surface of bare die is immersed in by engaging the engagement member of equipment in scaling powder, or work as and be soaked with scaling powder Bare die when being installed on engagement substrate with by bare die engagement on substrate (such as printed circuit board), engagement equipment can prevent Only convex block (bump) damage on bare die bottom surface；Engaging equipment can be by bare die high-speed mobile to the dipping plate containing fluxing agent On (dipping plate) or engagement substrate, bare die is immersed in processing time needed for scaling powder to minimize, to most Big metaplasia yield；And the impact for being applied to bare die can be minimized during picking up bare die by engaging equipment, while work as bare die quilt The rotatory inertia of compensation turner (flipper) when pickup and overturning.
Background technology
For example, in the semiconductor core chip bonding equipment as the equipment to engage bare die (such as semiconductor chip), It adsorbs when the independent semiconductor chip being cut into from chip is reversed device and picks up, rotates 180 ° so that above and below semiconductor chip When overturning, being then passed to engaging head, the engaging head of semiconductor chip is picked up by the convex block on the bottom surface of semiconductor chip It is immersed in scaling powder, and will be in semiconductor chip engagement to substrate (such as printed circuit board).In general, by bare die bottom surface Convex block be immersed in the processing in scaling powder and execute in the following manner：Engagement tool is moved down into coated with certain On the dipping plate of the scaling powder of thickness, and the scaling powder for impregnating plate is coated on the bottom surface of the bare die adsorbed by engagement tool Convex block on.
In engaging equipment, turner uses the spring with soft as cushion pad, to be connect in turner and bare die The impact for being applied to bare die is minimized when touching.
In order to make turner rotate to desired range, stopper is installed at the position that turner will stop.When When turner is contacted with stopper, the rotation of turner stops.
In this case, the mechanical part of turner may be shaken due to the rotatory inertia of turner or may be to turning over The mechanical part for turning device applies impact, and wherein rotatory inertia is that rotation is being kept when turner is contacted with stopper and is therefore stopped The dynamic attribute of transhipment.
Further, since pickup unit (pickup unit) is installed to be and is spaced apart with the rotation center of rotating driver, because This higher rotatory inertia is applied to pickup unit.
Similarly, when turner high speed is moved down to pick up bare die, inertia is applied to turner, therefore turner Mechanical part generate unnecessary movement.In view of the inertia of the mechanical part generated when rotation, the rotary speed of turner It is controlled to prevent from going wrong due to inertia.But with the output per hour of equipment (Unit Per Hour, UPH) Increase, turner answers high speed rotation.While the rotary speed of turner increases, spring cannot bear the Machinery Ministry of turner The inertia of part, thus mechanical part repeatedly released and back to mechanical part initial position.Impact is accumulated in as a result, On turner, therefore turner is likely to be broken or is attracted to the bare die on turner and may be dished out forward.
Further, since semi-conductor market is intended to thinner and smaller size of semi-conducting material, the demand to film bare die It is continuously increased.When identical pickup force is applied to the film bare die of turner with what is used in the past, bare die is likely to be broken, Such as bare die may be bent or be fractureed.As a result, bare die is applied to minimize by more gently controlling the spring of turner Impact be critically important.
In addition, since the quantity for being arranged in the convex block on film bare die is reduced, convex block can be applied to the engagement on bare die Power is damaged or bare die can be broken off due to the impact being applied to when bare die is immersed in scaling powder on bare die or fragmentation. In order to solve these problems, to be applied to engagement tool power be controlled in will not cause convex block damage in the range of.
Traditionally, it is controlled to be applied to engagement using the pressure being applied to mounted on the air chamber of engagement tool interior The power of tool.In particular, while engagement tool moves in the horizontal direction, engagement tool is supported by high dynamics so that quilt The bare die of engagement tool absorption will not be by vibration damage.Before being contacted with dipping plate immediately in the bare die adsorbed by engagement tool, When engagement tool moves down above dipping plate, engagement tool is supported by low dynamics so that is arranged in the bottom surface of bare die On convex block can not be damaged.
However, when air chamber volume will support engagement tool pressure be switched to low pressure from high pressure during with pressure Power and it is alterable when, engagement tool may be shaken due to the variation of the volume of air chamber, and bare die can not be immersed in and help It can not be engaged in solder flux or using engagement tool, until the shaking until engaging tool is stablized.Accordingly, it is possible to reduce entire dress Standby UPH, to reduce productivity.
Therefore, the engagement equipment and its control method there is an urgent need to one kind for engaging bare die (such as semiconductor chip), Engagement equipment can minimize to be applied to the impact of thin bare die, to be protected in the case where not reducing the rotary speed of turner Bare die；When the bottom surface of bare die is immersed in scaling powder with by bare die engagement to substrate (such as printed circuit board), engagement Equipment can convex block of the protection arrangement on the bottom surface of bare die, and engaging equipment can be by bare die high-speed mobile to containing helping On the dipping plate of solder flux, bare die is immersed in by the processing time in scaling powder or needed for engagement bare die with minimum, to make life Yield maximizes.
Invention content
The present invention is intended to provide a kind of engagement equipment and its control method, wherein when bare die is reversed device pickup and overturning Rotatory inertia is can compensate for, and can be minimized in the case where not reducing the rotary speed of turner during picking up bare die It is applied to the impact of bare die.
The present invention is also directed to a kind of engagement equipment and its control method, wherein when by bare die be immersed in scaling powder with It being capable of convex block of the protection arrangement on the bottom surface of bare die when by bare die engagement to substrate.
The present invention is also directed to a kind of engagement equipment and its control method, can control engaging force and be engaged with working as bare die Bare die is prevented to be broken off or fragmentation when on to substrate.
The present invention is also directed to a kind of engagement equipment and its control method, can by by bare die high-speed mobile to containing Engaging bare die onto substrate on the dipping plate or engagement substrate of scaling powder, to minimize immersion or engage the place needed for bare die The time is managed, to make productivity maximize.
Technical solution
The present invention provides a kind of engagement equipment, and the engagement equipment includes：Engaging head, the engaging head is individually inhaling The bare die of attached cutting；Driver, the driver pass the engaging head to move the engaging head in vertical direction It is sent to the position on X-Y plane；With engagement substrate, the bare die adsorbed by the engaging head is installed on the engagement substrate, The wherein described engaging head includes：Joint element, the joint element is to bare die described in vacuum suction；First pneumatic pressure portion Part, the first Pneumatic pressure component is to by selectively applying Pneumatic pressure to the first Pneumatic pressure component and taking Disappear the Pneumatic pressure application and to the joint element supply buffer power, wherein the appearance of the first Pneumatic pressure component Product is variable according to pressure；With the second Pneumatic pressure component, the second Pneumatic pressure component is continuously applied Pneumatic pressure, Wherein while the position engaging head being transmitted on the X-Y plane, remain applied to first Pneumatic pressure The Pneumatic pressure of component and the second Pneumatic pressure component, and when the engaging head moves vertically downward, connect described In the state that syncephalon separates predetermined altitude with the top for engaging substrate, it is applied to the pneumatic of the first Pneumatic pressure component Pressure is removed, and the bare die adsorbed by the joint element is installed on the engagement substrate.
The present invention also provides a kind of engagement equipment, the engagement equipment includes：Engaging head, the engaging head is to individually Adsorb the bare die of cutting；Driver, the driver to move the engaging head in vertical direction, and by the engaging head It is transmitted to the position on X-Y plane；Plate is impregnated, the dipping contains fluxing agent, and the scaling powder is to be coated to be layed onto by the engagement On the bottom surface of the bare die of head absorption；With engagement substrate, bare die of the installation coated with the scaling powder on the engagement substrate, The wherein described engaging head includes：Joint element, the joint element is to bare die described in vacuum suction；First pneumatic pressure portion Part, the first Pneumatic pressure component is to by selectively applying Pneumatic pressure to the first Pneumatic pressure component and taking Disappear the Pneumatic pressure application and to the joint element supply buffer power, wherein the appearance of the first Pneumatic pressure component Product is variable according to pressure；With the second Pneumatic pressure component, the second Pneumatic pressure component is continuously applied Pneumatic pressure, Wherein while the position engaging head being transmitted on the X-Y plane, remain applied to first Pneumatic pressure The Pneumatic pressure of component and the second Pneumatic pressure component, and when the engaging head moves vertically downward, connect described In the state that the top of syncephalon and the dipping plate separates predetermined altitude, it is applied to the Pneumatic pressure of the first Pneumatic pressure component Power is removed, and the scaling powder is applied on the bottom surface of the bare die adsorbed by the joint element.
The first Pneumatic pressure component may include:Air chamber channel, the air from extraneous air case pass through described Air chamber channel and be supplied and transmit；Air chamber, the air chamber from the air chamber channel to by supplying The air answered and expand, to supply driving force to the joint element；Power controls to adjust device, and the power controls to adjust device to control Make the pressure for the air supplied from the extraneous air case；And valve, the valve supply to start or stop to the air chamber Answer air.
When stopping supplying air to the air chamber, remaining in the indoor air of the air chamber can be discharged to outside Portion, the Pneumatic pressure for being thus only applied to the second Pneumatic pressure component are retained in the joint element, are applied with reducing To the pressure of the joint element.
The second Pneumatic pressure component may include：Cylinder channel, the air from extraneous air case pass through the cylinder Channel and be supplied and transmit；Cylinder, the cylinder by the pressure for the air supplied by the cylinder channel being sent to branch Support load；It is loaded with the support, the support load is to by according to being sent to the pressure of the support load to described Engagement accessory supplies the buffer power with certain pressure to support the joint element.
When the Pneumatic pressure for being applied to the first Pneumatic pressure component is removed, and the air of air is supplied When the volume of chamber changes thus, the Pneumatic pressure kept by the second Pneumatic pressure component can be used in the support load Power supports, to supply the buffer power to the joint element.
The joint element may include sensor dog, and the engaging head may include sensor element, the sensor Component is to sense the physical distance away from the sensor dog, the sensor element and one spacing of sensor dog interval From.
The joint element may include：Bonding pick device, the bonding pick device to the bare die physical contact simultaneously Adsorb the bare die；And air bearing, to rotate the bonding pick device, the air bearing is coupled to the air bearing The top of the bonding pick device, and the joint element further includes：Watertight aircase, the watertight aircase is supplying air to The air bearing；With air draught control mechanism, the air draught control mechanism is controlling the pressure of supplied air.
The engagement equipment may also include turner, and the turner is picking up the bare die of cutting, the bare die is made to revolve Turn 180 ° so that the bare die turns upside down and the bare die is transmitted to the engaging head, wherein the turner can Including：Pickup unit, the pickup unit is adsorbing and pick up the bare die；Flip-arm, the pickup unit are mounted on institute State on flip-arm, and the flip-arm be mounted on it is in main body and rotatable and can move up or down；Support load, it is described Support load is mounted in the flip-arm and is in the longitudinal direction displaceable in predetermined range, and wherein described Pickup unit is mounted on the end of the support load；Elastic component, the elastic component are single in the pickup to absorb It is first contacted with the bare die during the impact that generates, the elastic component be disposed therein include the support load support portion Between part and the pickup unit；Negative tube, the negative tube to the pickup unit to apply negative pressure, in the bare die The negative pressure, the negative tube is kept to be coupled to the pickup unit while pickup by the pickup unit；And forward voltage diode, institute Forward voltage diode is stated to load supply carrying power, the forward voltage diode to the support by applying positive pressure into the flip-arm It is coupled to the flip-arm, wherein keeping being applied to the positive pressure of the support load by the forward voltage diode in the flip-arm The inertia of the flip-arm is rotated and compensated while moving down, and is contacted with the bare die immediately in the pickup unit Foregoing description positive pressure is removed.
The engagement equipment may also include turner, and the turner is picking up the bare die of cutting, the bare die is made to revolve Turn 180 ° so that the bare die turns upside down and the bare die is transmitted to the engaging head, wherein the turner can Including：Pickup unit, the pickup unit is adsorbing and pick up the bare die；Flip-arm, the pickup unit are mounted on institute State on flip-arm, and the flip-arm be mounted on it is in main body and rotatable and can move up or down；Support load, it is described Support load is mounted in the flip-arm and is in the longitudinal direction displaceable in predetermined range, and wherein described Pickup unit is mounted on the end of the support load；Negative tube, the negative tube are negative to apply to the pickup unit Pressure, to keep the negative pressure, the negative tube to be coupled to the pickup while bare die is picked up by the pickup unit Unit；And forward voltage diode, for the forward voltage diode to apply the first positive pressure or the second positive pressure, the forward voltage diode is coupled to the flip-arm To load supply carrying power to the support by selectively applying positive pressure to the flip-arm；Wherein remain applied to It is described to support the first positive pressure of load to compensate the inertia of the flip-arm while flip-arm rotates and moves down, And before being contacted with the bare die immediately in the pickup unit, apply second positive pressure to support load, it is described Second positive pressure is less than first positive pressure.
The present invention also provides a kind of method of control engagement equipment, the engagement equipment includes engaging head, driver and connects Substrate is closed, the engaging head has joint element, the first Pneumatic pressure component and the second Pneumatic pressure component, the joint element To the bare die of vacuum suction cutting, the volume of the first Pneumatic pressure component is variable with to the engagement according to pressure Component supplies buffer power, and is selectively executed in the first Pneumatic pressure component and apply Pneumatic pressure and cancellation institute State the application of Pneumatic pressure, and the second Pneumatic pressure component is continuously applied Pneumatic pressure, the driver to Vertical Square moves up the engaging head and the engaging head is transmitted to the position on X-Y plane, on the engagement substrate The bare die adsorbed by the engaging head is installed；Described method includes following steps：In the engagement of the bare die of absorption cutting While head transmits above the engagement substrate and is moved vertically downwardly into certain altitude, it is pneumatic to remain applied to described first The Pneumatic pressure of press member and the second Pneumatic pressure component；The engaging head will be applied at the certain altitude The Pneumatic pressure of first Pneumatic pressure component is expelled to outside；When the discharge of the Pneumatic pressure is completed, further to moving down It moves the engaging head and the bare die for adsorbing the engaging head is mounted on the engagement substrate；With installing when the bare die Cheng Shi is applied to the first Pneumatic pressure component in corresponding Pneumatic pressure and is moved vertically upward in the engaging head To while being kept in the state of certain altitude, subsequent processing is executed；Wherein remain applied to first pneumatic pressure portion The step of Pneumatic pressure of part and the second Pneumatic pressure component, the Pneumatic pressure row for being applied to the first Pneumatic pressure component The step of going out, the bare die for moving further downward the engaging head and adsorbing the engaging head are mounted on the engagement substrate The step of and execute subsequent processing the step of be repeatedly executed.
The present invention also provides a kind of methods of control engagement equipment, and the engagement equipment includes engaging head, driver, dipping Plate and engagement substrate, the engaging head has joint element, the first Pneumatic pressure component and the second Pneumatic pressure component, described to connect Close the bare die that is cut to vacuum suction of component, the volume of the first Pneumatic pressure component is variable with to institute according to pressure State joint element supply buffer power, and in the first Pneumatic pressure component selectively execute apply Pneumatic pressure and Cancel the application of the Pneumatic pressure, and the second Pneumatic pressure component is continuously applied Pneumatic pressure, the driver To the position moved the engaging head in vertical direction and be transmitted to the engaging head on X-Y plane, the dipping plate Containing fluxing agent, on bottom surface of the scaling powder to be applied to the bare die adsorbed by the engaging head, in the engagement substrate Upper bare die of the installation coated with the scaling powder, described method includes following steps：In the engagement of the bare die of absorption cutting While head transmits above the dipping plate and is moved vertically downwardly into certain altitude, first Pneumatic pressure is remained applied to The Pneumatic pressure of power component and the second Pneumatic pressure component；The of the engaging head will be applied at the certain altitude The Pneumatic pressure of one Pneumatic pressure component is expelled to outside；When the discharge of corresponding Pneumatic pressure is completed, move further downward The engaging head and the bottom surface that the scaling powder included in the dipping plate is coated to the bare die adsorbed by the engaging head On；When the scaling powder, which is coated to the step on the bottom surface of the bare die, to be completed, described the is applied in Pneumatic pressure One Pneumatic pressure component and while the engaging head is moved to is kept in the state of certain altitude vertically upward, in institute Transmit the bare die in the top for stating engagement substrate；It is installed to the bare die for being coated with the scaling powder on the engagement substrate, The step of wherein remaining applied to the Pneumatic pressure of the first Pneumatic pressure component and the second Pneumatic pressure component is applied to The step of Pneumatic pressure discharge of the first Pneumatic pressure component, moves further downward the engaging head and will be included in institute State the step for impregnating the scaling powder in plate and being coated on the bottom surface of the bare die adsorbed by the engaging head, in the engagement substrate Top the step of transmitting the bare die and be coated with the bare die of the scaling powder and be installed to step on the engagement substrate Suddenly it is repeatedly executed.
The engagement equipment may also include turner, and the turner is picking up the bare die of cutting, the bare die is made to revolve Turn 180 ° so that the bare die turns upside down and the bare die is transmitted to the engaging head, wherein the turner can Including：Pickup unit, the pickup unit is adsorbing and pick up the bare die；Flip-arm, the pickup unit are mounted on institute State on flip-arm, and the flip-arm be mounted on it is in main body and rotatable and can move up or down；Support load, it is described Support load is mounted in the flip-arm, and is in the longitudinal direction displaceable in predetermined range, and wherein institute Pickup unit is stated to be mounted on the end of the support load；Elastic component, the elastic component are disposed therein including described Between the support member and the pickup unit that support load；Negative tube, the negative tube be coupled to the pickup unit with to The pickup unit applies negative pressure；And forward voltage diode, the forward voltage diode are coupled to the flip-arm and are supplied with being loaded to the support Power is carried, and wherein the method further includes following steps：Keep positive pressure, with the pickup unit rotate and vertically to Under the inertia of the flip-arm is compensated while be moved to certain altitude；The positive pressure is discharged at the certain altitude；Institute After the completion of the discharge for stating positive pressure, the pickup unit adsorbs the bare die by applying negative pressure by the negative tube, leads to simultaneously It crosses and is generated to mitigate when the pickup unit moves further downward and is contacted with the bare die using the elastic component Impact；Be applied in the positive pressure and be kept in the state that the pickup unit is moved to certain altitude vertically upward While, rotate the pickup unit, wherein the step of keeping the positive pressure, be discharged the positive pressure the step of, by the pickup Unit adsorbs the step of bare die and is continuously performed the step of rotating the pickup unit.
The engagement equipment may also include turner, and the turner is picking up the bare die of cutting, the bare die is made to revolve Turn 180 ° so that the bare die turns upside down and the bare die is transmitted to the engaging head, wherein the turner can Including：Pickup unit, the pickup unit is adsorbing and pick up the bare die；Flip-arm, the pickup unit are mounted on institute State on flip-arm, and the flip-arm be mounted on it is in main body and rotatable and can move up or down；Support load, it is described Support load is mounted in the flip-arm and is in the longitudinal direction displaceable in predetermined range, and wherein described Pickup unit is mounted on the end of the support load；Negative tube, the negative tube are coupled to the pickup unit with to institute It states pickup unit and applies negative pressure；And forward voltage diode, the forward voltage diode are coupled to the flip-arm to supply to agree to support load Power is carried, the forward voltage diode is branched off into the first forward voltage diode and the second forward voltage diode, and wherein the method further includes following steps：It keeps First positive pressure, to compensate the used of the flip-arm while pickup unit rotates and is moved to certain altitude vertically downward Property；First positive pressure is discharged at the certain altitude；After the completion of the discharge of first positive pressure, apply less than described the Second positive pressure of one positive pressure；The pickup unit adsorbs the bare die by applying negative pressure by the negative tube, passes through simultaneously Second positive pressure mitigates the impact generated when the pickup unit moves further downward and is contacted with the bare die；With It is applied in the positive pressure and while the pickup unit is moved to is kept in the state of certain altitude vertically upward, The pickup unit is rotated, wherein the step of keeping first positive pressure, the step of first positive pressure being discharged, applies described the The step of two positive pressures, by the pickup unit adsorb the bare die the step of and rotate the pickup unit the step of connected It executes continuously.
Description of the drawings
Fig. 1 is to schematically show the figure according to the present invention for engaging the engagement member of equipment；
Fig. 2 be schematically show it is according to the present invention by for engaging that the engagement member of equipment executes for controlling gas The figure of the method for dynamic pressure；
Fig. 3 is the bare die impregnation for indicating to be executed by engagement member according to the present invention and by connecing according to the relevant technologies Close position and the sensor dog (sensor dog) of the engaging head in each processing in the bare die impregnation that component executes Sensor values chart；
Fig. 4 schematically illustrates the control according to the present invention by for engaging the impregnation that the engagement member of equipment executes Flow；
Fig. 5 is the sectional view according to the turner of the engagement equipment of embodiment of the present invention；
Fig. 6 shows that bare die is picked up by the first turner and turned over by second in having there are two the system of the turner of Fig. 5 Turn the state of device unloading and the state of the first turner and the rotation of the second turner；
When Fig. 7 shows that the rotation of the first turner and the second turner in the state of Fig. 6 is completed, by the first overturning The bare die of device pickup is unloaded and the second turner is moved downward to bare die by the state for the height being picked；
Fig. 8 is the sectional view according to the turner of the engagement equipment of another embodiment of the present invention；
Fig. 9 shows that bare die is picked up by the first turner and turned over by second in having there are two the system of the turner of Fig. 8 Turn the state of device unloading and the state of the first turner and the rotation of the second turner；
Figure 10 shows that the bare die picked up by the first turner is unloaded and the second turner is moved downward to bare die and incites somebody to action The state for the height being picked in the state of when the rotation of the first turner and the second turner in the state of figure 9 is completed.
Specific implementation mode
Embodiments of the present invention are discussed in detail below.
It is according to the present invention engagement equipment by using project device (ejector) project be attached to chip bare die (such as Semiconductor chip), the bare die being emitted is adsorbed and picked up by turner, rotates 180 ° of bare die so that bare die turns upside down, and Bare die is transmitted to engaging head.Later, make to be arranged in by the bottom surface of bare die is immersed in scaling powder and be inhaled by engaging head Convex block on the bottom surface of attached bare die coats fluxing agent, and then (for example prints bare die engagement to engagement substrate electric Road plate) on.
Fig. 1 is to schematically show the figure according to the present invention for engaging the engagement member 10 of equipment.
As shown in Figure 1, in engaging equipment, engagement member 10 has engaging head 100, and engaging head 100 is in bare die quilt The bare die of cutting is received and adsorbed in the state of turning upside down from turner, wherein turner picks up bare die and rotates bare die 180°；Engaging head 100 to the mobile engaging head 100 in vertical direction (Z-direction) and is transmitted to by driver (not shown) Position on X-Y plane；And engagement substrate, the bare die adsorbed by engaging head 100 is installed on engagement substrate.Engaging head 100 include：To the joint element 110 of vacuum suction bare die；First Pneumatic pressure component 121, the first Pneumatic pressure component 121 To supply buffer power to joint element 110 by selectively applying Pneumatic pressure and cancelling the application of Pneumatic pressure, The volume of first Pneumatic pressure component 121 can change according to pressure；With the second Pneumatic pressure component 122, the second Pneumatic pressure Component 122 has been continuously applied Pneumatic pressure.While engaging head 100 is sent to corresponding position, first is remained applied to The Pneumatic pressure of Pneumatic pressure component 121 and the second Pneumatic pressure component 122.When engaging head 100 moves vertically downward, connecing In the state that syncephalon 100 is spaced apart predetermined altitude with the top of engagement substrate, it is applied to the pneumatic of the first Pneumatic pressure component 121 Pressure is removed, and the bare die adsorbed by joint element 110 is installed on engagement substrate.
Another embodiment according to the present invention, (it includes engaging head 100, engagement wherein to engage equipment in engaging equipment First 100 individually adsorbing the bare die of cutting；Driver, driver to move engaging head 100 in vertical direction, and Engaging head 100 is transmitted to the position on X-Y plane；Plate 300 is impregnated, dipping plate 300 is containing fluxing agent 310 to use scaling powder The bottom surface for the bare die that 310 coatings are adsorbed by engaging head 100；With engagement substrate, the installation coating fluxing agent on engagement substrate 310 bare die), engaging head 100 includes：To the joint element 110 of vacuum suction bare die；First Pneumatic pressure component 121, the One Pneumatic pressure component 121 is to by selectively applying Pneumatic pressure to the first Pneumatic pressure component 121 and cancelling pneumatic The application of pressure supplies buffer power (buffering power), and the first Pneumatic pressure component to joint element 110 121 volume can change according to pressure；With the second Pneumatic pressure component 122, the second Pneumatic pressure component 122 is continuously applied There is Pneumatic pressure.When engaging head 100 is sent to corresponding position, the first Pneumatic pressure component 121 and second is remained applied to The Pneumatic pressure of Pneumatic pressure component 122.If during the vertical downward movement of engaging head 100, engaging head 100 with engage base The top of plate is spaced apart predetermined altitude, then the Pneumatic pressure for being applied to the first Pneumatic pressure component 121 is removed, and scaling powder It is applied on the bottom surface of the bare die adsorbed by joint element 110.
As shown in (a) of Fig. 1, for engaging the engagement member 10 of equipment by lift actuator (liftingdriver) 200 Then lifting is moved by the transmission device of separation (not shown) in horizontal direction (X or Y direction) high speed relative to ground It is dynamic, to be placed on the bare die adsorbed by engaging head 100 on the scaling powder 310 being coated on dipping plate 300 with certain thickness. Then, as shown in (b) of Fig. 1, engaging head 100 is made to move down by lift actuator 200, to be arranged in by joint portion Convex block on the bottom surface for the bare die that part 110 adsorbs is immersed in scaling powder 310.
Here, scaling powder 310 can be the composition containing epoxy resin etc., and can be used for connecing bare die and substrate It closes, and prevents the conduction of electric current between the convex block on the bottom surface due to bare die and short circuit occurs.Coated on dipping plate 300 The thickness of scaling powder 310 can be controlled as micron-scale corresponding with the height of the convex block on bare die bottom surface.
When the thickness of the scaling powder 310 of coating is less than the height of convex block, convex block is deficiently coated fluxing agent 310, and be therefore fixed on substrate to bare die potentially unstable, and may occur due to the conduction of electric current between convex block Short circuit.On the contrary, when the thickness of the scaling powder 310 of coating is more than the height of convex block, convex block by 310 excessive application of scaling powder, because The content of this scaling powder 310 remained on lug surface may not be necessary excessively high.Therefore, foreign matter is likely to remain on substrate (bare die is bonded on substrate), and the problems such as circuit error therefore may occur in a substrate.
In detail, joint element 110 including the first Pneumatic pressure component 121 and the second Pneumatic pressure component 122 is slow Component, sensor element 130 etc. is rushed to may be embodied in engaging head 100.Here, joint element 110 is for adsorbing bare die Device, and may include：Bonding pick device 111, bonding pick device 111 adsorb bare die to be physically contacted with bare die；It is empty Gas bearing (air bearing) 112, air bearing 112 is couple to the top of bonding pick device 111；Sensor dog 113 is to logical Cross the position etc. that joint element 110 is sensed using sensor element 130.
First Pneumatic pressure component 121 may include：Air chamber channel 121a comes from extraneous air case (air tank) Air be supplied and transmit by air chamber channel 121a；Air chamber 121b, air chamber 121b to by by Air chamber channel 121a supply air and expand, with to joint element 110 apply driving force；Power controls to adjust device, power control Adjuster processed is controlling the pressure for the air supplied from extraneous air case；And valve, valve is starting or stopping to air chamber Air is supplied in 121b.
When stopping supplying air into air chamber 121b, the air remained in air chamber 121b is discharged to outside Portion, and the Pneumatic pressure therefore only applied by the second Pneumatic pressure component 122 is retained in joint element 110.Therefore, apply Pressure to joint element 110 is relatively low.Thus, it is possible to engaging work or fluxes work be executed under low pressure, to drop The low engaging force to be applied to bare die.
Here, the second Pneumatic pressure component 122 may include：Cylinder channel 122a, the air from extraneous air case are logical It crosses cylinder channel 122a and is supplied and transmits；Cylinder 122b, cylinder 122b are to air that will be supplied by cylinder channel 122a Pressure be transmitted to support load (support load) 122c；122c is loaded with support, 122c is to according to biography for support load It is sent to the pressure of support load 122c and there is certain pressure or determining pressure (certain by applying to joint element 110 Pressure buffer power) supports joint element 110.
When the Pneumatic pressure for being applied to the first Pneumatic pressure component 121 is removed and the air chamber of air is therefore supplied When the volume of room 121b changes, the second Pneumatic pressure component 122 can be protected by using by the second Pneumatic pressure component 122 The pressure support support load 122c held to apply buffer power to joint element 110.
That is, engagement equipment according to the present invention may include the first Pneumatic pressure component 121 and the second Pneumatic pressure Power component 122, using as supporting joint element 110 by applying the buffer power of certain grade to joint element 110 Device, especially as being firmly supported joint element 110 during the transmission of engaging head 100 and in bare die By absorbing to be applied to naked when convex block on bottom surface contacts during bare die is immersed in scaling powder 310 with dipping plate 300 The engaging force of on piece inhibits the device of the damage to convex block.
Here, the first Pneumatic pressure component 121 may include：Air chamber channel 121a (does not scheme from extraneous air case Show) air be supplied and transmit by air chamber channel 121a；With air chamber 121b, air chamber 121b is to logical It crosses the air supplied by air chamber channel 121a and expands, it is dynamic to apply the buffering with a determined power to joint element 110 Power, to support joint element 110.
Second Pneumatic pressure component 122 may include：Cylinder channel 122a, the air from extraneous air case (not shown) It is supplied and transmits by cylinder channel 122a；Cylinder 122b, cylinder 112b are to sky that will be supplied by cylinder channel 122a The pressure of gas is transmitted to support load 122c；122c is loaded with support, support load 122c is sent to support load to basis The pressure of 122c and support joint element 110 by applying the buffer power with certain pressure to joint element 110.
Fig. 2 is the control Pneumatic pressure for schematically showing the engagement member 10 according to the present invention for engaging equipment and executing The figure of the method for power.
As shown in Fig. 2, air by power controls to adjust device, to be injected into air chamber 121b under pressure gentle In cylinder 122b, and it can be started or stopped using the valve manually or automatically controlled and inject air into air chamber 121b.
Specifically, engagement member 10 according to the present invention can be immediately in by will be adsorbed and supported by joint element 110 Bare die high-speed mobile to dipping plate 300 scaling powder 310 on and by lift actuator 200 moves down engaging head 100 So that bare die is immersed in before scaling powder 310, bare die 121b, wherein high-pressure buffer are more securely supported using high-pressure buffer power Power is as shown in Fig. 2 (a) according to the slow of the first Pneumatic pressure component 121 of the air being injected into air chamber 121b The summation of power of getting excited and buffer power according to the second Pneumatic pressure component 122 of the air being injected into cylinder 122b.As a result, It can prevent bare die from being detached from joint element 110 and be damaged due to the shaking of joint element 110, and can be due to engagement The excessive lifting of component 110 and when joint element 110 is not contacted with the bottom of dipping plate 300, prevents error signal (such as touch signal).
As shown in (b) of Fig. 2, further move down engaging head 100 immediately in by using lift actuator 200 And bare die is made to be immersed in after scaling powder 310, valve can be turned off to stop injects air to air chamber 121b, and will be residual The air stayed in air chamber 121b is discharged fast into outside, to be applied to the pneumatic of the first Pneumatic pressure component 121 Pressure removes, and is supported using the low pressure buffer power reduced according to the buffer power of the second Pneumatic pressure component 122 Bare die.As a result, when the convex block on the bottom surface of bare die is contacted with dipping plate 300, it is applied to the major part of the engaging force of bare die It can be by support load 122c supports, to inhibit the damage of convex block.
In addition, joint element 110 can be used buffer power and accurately be supported, wherein buffer power be by control from First Pneumatic pressure component 121 is supplied to the buffer power of the relatively large effective area of joint element 110 and keeps simultaneously It is obtained from the second Pneumatic pressure component 122 supplied to the buffer power with relatively small effective area of joint element 110 .Therefore, when the buffer power for joint element 110 is switched to low pressure from high pressure, by what is adsorbed by joint element 110 When bare die is immersed in scaling powder 310, the shaking of joint element 110 is can avoid or minimized.Thus, it is possible to not need or can To reduce the time for stablizing the shaking of joint element 110 to execute needed for the processing of dipping bare die, to greatly improve life Yield.
When stopping injecting air into air chamber 121b, it can use valve that will remain in the sky in air chamber 121b Gas is discharged fast into outside, and therefore can quickly execute the switching of the buffer power by the first Pneumatic pressure component 121.Cause This, productivity can be further improved.
The first Pneumatic pressure component 121 and second that can be using a power control and regulation device and with different area is pneumatic Press member 122 controls multiple power, thereby simplifies power control structure.
Even if a power controls to adjust device applies phase to the first Pneumatic pressure component 121 and the second Pneumatic pressure component 122 With pressure, also due to the different areas of the first Pneumatic pressure component 121 and the second Pneumatic pressure component 121 and generate not Same power.It therefore, can be by applying pressure to the first Pneumatic pressure component 121 and the second Pneumatic pressure component 122 come individually The pressure of the power and the second Pneumatic pressure component 122 that measure the first Pneumatic pressure component 121 collects data；It can also be by right First Pneumatic pressure component 121 and the second Pneumatic pressure component 122, which apply pressure, to be come while measuring the first Pneumatic pressure component 121 With the power of the second Pneumatic pressure component 122, and it is pneumatic by only keeping the pressure of the second Pneumatic pressure component 122 to measure second The power of press member 122 collects data.That is, two power measurement tables about uniform pressure may be implemented.
As described above, by controlling the buffer power from the first Pneumatic pressure component 121 and coming from the second Pneumatic pressure The buffer power of component 122 can be controlled in a wider scope to be applied to the buffer power of joint element 110.Therefore, originally Invention can be widely applied to the engagement equipment for engaging the bare die with various sizes and various weight.
When the buffer power for joint element 110 is switched to low pressure from high pressure, the air axis of joint element 110 is supported Holding the buffer power of 112 the first Pneumatic pressure component 121 reduces, therefore the bare die of the absorption of engaging member 110 and support can It can be shaken and damage.Therefore, it is necessary to stablize the time needed for the shaking of bare die, and productivity may be decreased.Thus, it is possible to Additional to provide watertight aircase and air draught control mechanism, wherein watertight aircase to air bearing 112 supplying air to prevent air axis Hold 112 loosenings, air draught control mechanism is controlling the pressure for the air being supplied.
Here, watertight aircase can increase the appearance of from air draught control mechanism to air bearing 112 air line (airline) Product, to be relatively low by the control of the pressure change of air bearing 112.Therefore, air draught control mechanism can control air axis The internal pressure for holding 112 is stablized.
Sensor element 130 may be arranged to spaced apart with the sensor dog 113 included in joint element 110 Or determine that distance (certain distance) will sense the knot of physical distance to feel the physical distance of distance measuring sensor dog 113 Fruit is converted to electric signal, and electric signal is sent to operator or the automatic controller of device.
In detail, the object that sensor element 130 can in real time between sensing sensor component 130 and sensor dog 113 The variation of distance is managed, and sensing signal is sent to operator or automatic controller, the variation of wherein physical distance is to work as buffer part When the buffer power of part is switched to low pressure from high pressure caused by the shaking of joint element 110.Operator or automatic controller can Do not start to move down engaging head 100 to control lift actuator 200, until the shaking of joint element 110 is stablized, therefore Bare die is immersed in scaling powder 310 by delay.
In addition, sensor element 130 can be with the physical distance between sensing sensor component 130 and sensor dog 113 Increase, and sensing signal is sent to operator or automatic controller, wherein the increase of physical distance is when joint element 110 When shaking is stablized and bare die is immersed in scaling powder 310, the convex block on the bottom surface of bare die contacts the phase with dipping plate 300 Between, due to engaging force be applied to caused on bare die joint element 110 it is small move up caused by.Operator is automatic Controller may insure dip time, the convex block being arranged on the bottom surface of bare die with using scaling powder 310 suitably to coat, can When completing the dipping of bare die, control lift actuator 200 to be to lift engaging head 100, and can towards engagement substrate (such as Chip) transmission engagement member 10, to execute the joining process after impregnation.
Fig. 3 is the bare die impregnation for indicating to be executed by engagement member according to the present invention and by connecing according to the relevant technologies Close the position of the engaging head in each processing in the bare die impregnation that component executes and the sensor values of sensor dog Chart.In the chart of Fig. 3, the longitudinal axis is the z-axis direction of the position in the vertical direction for indicate engaging head and sensor dog, and Horizontal axis indicates the time.
As shown in figure 3, (engagement member includes only by having with relatively large in the engagement member according to the relevant technologies Imitate pressure area air chamber composition buffer unit), when engaging head move down and the buffer power of buffer unit from High pressure switches to low pressure, when so that bare die being immersed in scaling powder, as shown in the sensor values of sensor dog, and joint element It is shaken, and needs a large amount of time to stablize the shaking of joint element, therefore reduce productivity.In contrast, exist (engagement member 10 includes with the first Pneumatic pressure component controlled as described above in engagement member 10 according to the present invention 121 and second Pneumatic pressure component 122 buffer unit 120), as shown in the sensor values of sensor dog 113, though will When being applied to the cushion effect of joint element 110 and being switched to low pressure from high pressure, joint element 110 is also difficult to be shaken.As a result, no longer The time needed for the shaking of stable joint element 110 is needed or substantially reduces, to substantially increase productivity.
Bare die is immersed in by what the engagement member 10 for being used to engage equipment as described above executed the present invention relates to a kind of The control method of processing in scaling powder 310.
Fig. 4 schematically shows according to the present invention by for engaging impregnation that the engagement member 10 of equipment executes Control flow.
As described in Figure 4, according to the present invention by being helped for engage that the engagement member 10 of equipment executes be immersed in bare die The control method of processing in solder flux 310 may include the operation S100 to S700 that will be described below.
In operating S100, engaging head 100 is moved down by lift actuator 200, is adsorbed and is picked up by joint element 110 Take bare die to be joined.
In operating S200, in joint element 110 by the buffer power of the first Pneumatic pressure component 121 of engaging head 100 While support with the buffer power of the second Pneumatic pressure component 122, engaging head 100, and 10 quilt of engagement member are moved up It is transmitted as so that bare die is located on the scaling powder 310 in dipping plate 300.
In operating S300, before being immersed in scaling powder 310 immediately in bare die, from lift actuator 200 to moving down Dynamic engaging head 100.
In operating S400, by removing the buffer power of the first Pneumatic pressure component 121, the buffering of buffer unit is moved Power is switched to low pressure from high pressure.
In operating S500, the joint element 110 as caused by the switching of the buffer power of the first Pneumatic pressure component 121 Shaking stablized.
It, will be on the bottom surface of bare die by moving down engaging head 100 by lift actuator 200 in operating S600 Convex block is immersed in scaling powder 310, and convex block is thus made to coat fluxing agent 310.
In operating S700, after convex block is suitably coated by scaling powder 310, moved up by lift actuator 200 Engaging head 100.
The method that the control engagement equipment according to embodiment of the present invention is described in more detail below.
It (wherein engages equipment to include engaging head, drive in the method according to the control engagement equipment of embodiment of the present invention Dynamic device and engagement substrate；Wherein engaging head includes：To the joint element of the bare die of vacuum suction such as semiconductor chip etc； First Pneumatic pressure component, the first Pneumatic pressure component to the first Pneumatic pressure component to by selectively applying Pneumatic pressure Power and cancel Pneumatic pressure application come to joint element supply buffer power, and the volume of the first Pneumatic pressure component according to Pressure is variable；With the second Pneumatic pressure component, the second Pneumatic pressure component is applied continuously Pneumatic pressure；Wherein drive Device is to the position moving engaging head in vertical direction and be transmitted to engaging head on X-Y plane；Wherein on engagement substrate The bare die adsorbed by engaging head is installed), it repeats and executes following steps：It is being engaged above substrate in the engaging head of absorption bare die While transmitting and be moved vertically downwardly into certain altitude, the first Pneumatic pressure component and the second pneumatic pressure portion are remained applied to The Pneumatic pressure of part；At certain height, the Pneumatic pressure for being applied to the first Pneumatic pressure component of engaging head is discharged to It is external；When the discharge of Pneumatic pressure is completed, moves further downward engaging head and be mounted on the bare die adsorbed by engaging head It engages on substrate；And when installation is complete for bare die, it is applied to the first Pneumatic pressure component in Pneumatic pressure and is engaging Head is moved upwards up to certain altitude or determines in the state of height (certain height) while be kept, and executes follow-up place Reason.
According to the method for control engagement equipment, rushing for bare die is applied to when bare die is mounted on engagement substrate by engaging head Hitting can be mitigated, to prevent bare die fragmentation or fracture.
The method that the control engagement equipment according to another embodiment of the present invention is described below.
In the method for control engagement equipment, engagement equipment includes engaging head 100, driver, dipping plate 300 and engagement base Plate, wherein engaging head 100 include：The joint element 110 of bare die is cut to vacuum suction；First Pneumatic pressure component 121, the One Pneumatic pressure component 121 is to by selectively applying Pneumatic pressure to the first Pneumatic pressure component and cancelling Pneumatic pressure Application to supply buffer power to joint element 110, and the volume of the first Pneumatic pressure component 121 is variable according to pressure 's；With the second Pneumatic pressure component 122, the second Pneumatic pressure component 122 is applied continuously Pneumatic pressure；Wherein driver is used With the position moved engaging head 100 in vertical direction and be transmitted to engaging head 100 on X-Y plane；Wherein dipping plate 300 contains Need to be coated to the scaling powder 310 on the bottom surface of the bare die adsorbed by engaging head 100；Coating wherein is installed on engagement substrate The bare die of fluxing agent 310.In this method, it repeats and executes following steps：Plate is being impregnated in the engaging head 100 of absorption bare die 300 tops transmit and while are moved vertically downwardly into certain altitude, remain applied to the first Pneumatic pressure component 121 and the The Pneumatic pressure of two Pneumatic pressure components 122；The gas of the first Pneumatic pressure component of engaging head is applied at certain altitude Dynamic pressure is discharged to the outside；When the discharge of Pneumatic pressure is completed, engaging head 100 is moved further downward, and leaching will be included in Scaling powder 310 in stain plate 300 is applied on the bottom surface of the bare die adsorbed by engaging head 100；When completing scaling powder 310 to naked When the application of the bottom surface of piece, it is moved to certain altitude vertically upward in engaging head 100 and Pneumatic pressure is applied to first Pneumatic pressure component 121 and in the state of being kept, engaging head 100 is transmitted on engagement substrate；And it is coated with helping weldering The bare die of agent 310 is mounted on engagement substrate.
According to control engagement equipment method, can mitigate when scaling powder 310 be applied to adsorbed by engaging head 100 it is naked The impact applied when on the bottom surface of piece, to prevent damage to be arranged in the convex block on the bottom surface of bare die.In this case, Engaging force control can be executed, to mitigate the impact applied when engaging bare die.When bare die is adsorbed and picked up by engaging head 100 When, engaging force control can also be executed.
The turner and its control method of engagement equipment according to the present invention are described below with reference to accompanying drawings.Fig. 5 is basis The method of the sectional view and control turner 1000 of the turner 1000 of embodiment of the present invention.
Turner 1000 according to the present invention includes：Pickup unit 1100, pickup unit 1100 are naked to adsorb and pick up Piece；Flip-arm 1700, pickup unit 1100 be mounted on flip-arm 1700 on, flip-arm 1700 in main body it is rotatable simultaneously It can move up or down, and there is the first pad 1740 and the second pad 1730；Support load 1400, support load 1400 are mounted on It can be shifted in the longitudinal direction within a predetermined range in flip-arm, and pickup unit 1100 is mounted on support load 1400 On end；Elastic component 1300, elastic component 1300 are disposed therein the support member with support load 1400 and pick up single Between member 1100, and elastic component 1300 is mitigating the impact applied when pickup unit 1100 and bare die contact；Negative pressure Pipe 1200, negative tube 1200 are couple to pickup unit 1100, to apply negative pressure to pickup unit 1100；And forward voltage diode 1800, Forward voltage diode 1800 is couple to flip-arm 1700, is held with will pass through to the application positive pressure of flip-arm 1700 to be provided to support load 1400 Carry power.The positive pressure of support load 1400 is applied to by forward voltage diode 1800 to be kept, to be rotated simultaneously in flip-arm 1700 The inertia of flip-arm is compensated while moving down, and is moved before being contacted with bare die immediately in pickup unit 1100 It removes.
When the first stopper 1920 and the second stopper 1940 of the first pad 1740 and second pad 1730 and Fig. 6 contact, The rotating range of first pad 1740 of flip-arm 1700 and the second pad 1730 limitation flip-arm 1700.
Pickup unit 1100 can include absorption layer 1110 in the bottom end of pickup unit 1100, and when negative pressure Ps is applied in To bare die can be picked up when absorption layer 1110.Therefore, the pickup unit 1100 of absorption layer 1110 may include negative tube 1200, pass through Negative tube 1200 can selectively apply negative pressure Ps.
Pickup unit 1100 may be mounted in turner 1000 and can relatively shift, to prevent during picking up bare die Bare die is pressurizeed and is damaged by absorption layer 1110.
That is, as shown in figure 5, pickup unit 1100 is couple to one end of support load 1400, support load 1400 Can be shifted in flip-arm 1700, and the setting of elastic component 1300 flip-arm 1700 and pickup unit 1100 it Between.
Therefore, the impact applied when pickup unit 1100 picks up bare die can be by supporting moving backward for load 1400 And it is absorbed by elastic component 1300.
While pickup unit 1100 and bare die to be picked up contact, bare die can be by by being couple to pickup unit 1100 Negative tube 1200 apply negative pressure Ps and adsorbed and picked up.
In the method for turner 1000 according to the present invention and control turner 1000, turner 1000 is in bare die It is picked in the state that unit 1100 picks up and rotates.In this case, pickup unit 1100 can not directly be rotated, but The flip-arm 1700 for being equipped with pickup unit 1100 thereon can be rotated.
Flip-arm 1700 may include rotary part 1710, and rotary shaft 1720 is equipped on rotary part 1710；And Support member 1760, support member 1760 is vertically couple to one end of rotary part 1710, and has in support member 1760 Support load 1400.The rotary part 1710 of flip-arm 1700 can be installed to be to be enclosed relative to the main body 1900 of turner 1000 It is rotatable around rotary shaft 1720, and moved upward or downward along lifting guiding piece 1910 by elevation driving unit 1930 It is dynamic.
It can be arranged in flip-arm 1700 in the support member 1760 upwardly extended perpendicular to the side of rotary part 1710 On the end of rotary part 1710.
As described above, support member 1760 can be arranged in the form of hollow, to protect bare die.Therefore, support load 1400 can be installed as can be shifted on the length direction of support member 1760.
Even if support load 1400 is elastically supported by elastic component 1300, flip-arm 1700 flip-arm 1700 branch During part 1760 inside in support part is rotated around rotary shaft 1720, since support loads 1400 rotatory inertia on direction of displacement, It may still move.Due to this movement, the stability of the pickup unit 1100 under pick-up situation may be decreased, and prop up Support load 1400 or pickup unit 1100 may collide with flip-arm 1700 etc..
When turner 1000 include the first and second stoppers 1920 and 1940 to limit the rotating range of flip-arm 1700 When, when flip-arm 1700 and the first and second stoppers 1920 and 1940 contact, the rotation of flip-arm 1700 stops.Therefore, Turner 1000 is by inertia effects bigger.
In the inner cylinders space 1770 for the support member 1760 that one end of support load 1400 is located at flip-arm 1700.Cause This, when applying positive pneumatic pressure by forward voltage diode 1800, carrying power is provided to this one end of support load 1400.
That is, when applying positive pressure Pb by forward voltage diode 1800, support load 1400 can be prevented from entering application There is the inner cylinders space 1770 of positive pressure Pb, to selectively provide carrying power.
Multiple O-rings (O-ring or1, or2 and or3) can be set in the inner cylinders space 1770 of flip-arm 1700, To prevent from being applied to the leakage of the positive pressure Pb in the inner cylinders space 1770 of flip-arm 1700 by forward voltage diode 1800.
In general, positive pressure Pb only can be applied to flip-arm during the rotation of turner 1000 by forward voltage diode 1800 1700 or positive pressure Pb can be variable.For example, if positive pressure Pb is continuously kept during pickup unit 1100 picks up bare die It is constant, then support load 1400 and flip-arm 1700 that can be unified for a rigid body and therefore may damage bare die.
Control turner 1000 according to the present invention and according to the mode of operation of turner 1000 control pass through forward voltage diode The method of the 1800 positive pressure Pb applied the or negative pressure Ps applied by negative tube 1200 will be described with reference to Fig. 6.
Specifically, the present invention can provide a kind of method of control turner, and turner includes：It is naked to adsorb and pick up The pickup unit of piece；Flip-arm, is equipped with pickup unit on flip-arm, and flip-arm in main body it is rotatable simultaneously It can move up or down；Support load, support load is mounted in flip-arm, and within a predetermined range may be used in the longitudinal direction Displacement, and pickup unit is mounted on the end of support load；Elastic component, elastic component are disposed therein negative with support Between the support member and pickup unit of load；Negative tube, negative tube are couple to pickup unit to apply negative pressure to pickup unit；With And forward voltage diode, forward voltage diode are couple to flip-arm, to load supply carrying power to support.In this method, following step can quilt It continuously performs：While pickup unit rotates and is moved vertically downwardly into certain altitude, keep positive pressure to compensate flip-arm Inertia；Positive pressure is discharged at certain height；After the completion of the discharge of positive pressure, by applying negative pressure using pickup by negative tube Unit adsorbs bare die, and is mitigated simultaneously when pickup unit moves further downward and is contacted with bare die by using elastic component When the impact that applies；And in the state that pickup unit is moved to certain altitude vertically upward and applies and maintains positive pressure Rotation pickup unit.
Fig. 6, which is shown, to be had there are two in the system of the turner 1000 of Fig. 5, and bare die C is picked up by the first turner 1000a And by the shape of the state of the second turner 1000b unloadings and the first turner 1000a and the second turner 1000b rotations State.
Specifically, (a) of Fig. 6 shows that there are two turner 1000a and 1000b (such as the turners of Fig. 5 in tool 1000) in system, bare die C is by the first turner 1000a pickups and by the state of the second turner 1000b unloadings.Fig. 6's (b) state of the first turner 1000a and the second turner 1000b rotations are shown.(c) of Fig. 6 shows the turner of Fig. 5 The structure of 1000 forward voltage diode 1800.
The overturning system being shown in FIG. 6 may include two turners 1000a and 1000b, and sequentially pick up heap It folds bare die C on the wafer and transmits bare die C for subsequent processing, without being produced between turner 1000a and 1000b Raw interference.The overturning system of Fig. 6 may include downward visual unit 2000, and downward visual unit 2000 is used to check to be picked up The arrangement of bare die.
In turner 1000a and 1000b according to the present invention and its control method, by turner 1000a and During the pickup unit 1100 of each of 1000b adsorbs and picks up bare die C, negative tube 1200 can be passed through and apply negative pressure Ps.
Therefore, as shown in (a) of Fig. 6, the first turner 1000a can be started to apply negative pressure before adsorbing in bare die C Ps, to reduce vacuum generation time, and as shown in (b) of Fig. 6, even if can if during the rotation of the first turner 1000a It keeps applying negative pressure Ps by negative tube 1200.This means that being picked while unit 1100 picks up in bare die C should keep The application of negative pressure Ps.
Positive pressure Pb is applied to the inner cylinders space 1770 of flip-arm 1700, with prevent support load 1400 movement or It shakes, pickup unit 1100 is installed in support load 1400.Therefore, when starting the absorption of bare die C to pick up bare die C, Positive pressure Pb can not be applied.That is, if positive pressure Pb is applied to the cylinder of flip-arm 1700 by forward voltage diode 1800, Carrying power can be then generated at support load 1400, therefore when bare die C and pickup unit 1100 contact, passes through elastic component The buffer operation of 1300 equal execution may be interfered.
Therefore, during adsorbing bare die C by pickup unit 1100, the application of positive pressure Pb can be cancelled.
Therefore, because the first turner 1000a of (a) of Fig. 6 executes absorption to pick up bare die C, thus positive pressure Pb not by It is applied to the first turner 1000a.Since the second turner 1000b does not pick up bare die C, so positive pressure Pb can be applied to second Turner 1000b loads 1400 and pickup unit 1100 with fixed support.
In addition, as shown in (b) of Fig. 6, when the position of the pickup unit 1100 of each in turner 1000a and 100b When changing due to the rotation of turner 1000a and 1000b, positive pressure Pb can pass through each of turner 1000a and 1000b Forward voltage diode 1800 and be applied in, with prevent support load 1400 and pickup unit 1100 movement, shaking or vibration, to change It has been apt to the reliability of the reliability of the rotation of turner 1000a and 1000b and the bare die C when bare die C is adsorbed.
If the first turner 1000a includes the first stopper 1920 to limit the rotating range of flip-arm 1700, turn over The first pad 1740 on pivoted arm 1700 can be contacted with the first stopper 1920, and therefore when the rotation of flip-arm 1700 is completed When can generate high inertia force.Therefore, in this case, the application of positive pressure Pb can also be kept to prevent the first turner Movement, shaking or the vibration of 1000a.
Therefore, the application of positive pressure Pb can be kept during the rotation of flip-arm 1700.
As shown in (c) of Fig. 6, forward voltage diode 1800 can be couple to the inner cylinders space 1770 of flip-arm 1700, and can To include adjuster 1810 and control valve 1860, adjuster 1810 is uniform to make the positive pressure Pb applied by forward voltage diode 1800 Change, control valve 1860 is selectively stopping positive pressure Pb.Therefore, the inside of flip-arm 1700 is applied to by forward voltage diode 1800 The positive pressure Pb of cylinder space 1770 is conditioned the homogenization of device 1810.It, can be with according to the mode of operation of turner 1000a or 1000b Selectively apply or stop positive pressure Pb using control valve 1860.
When positive pressure Pb is blocked (when the application of positive pressure Pb is cancelled), remain in the sky in inner cylinders space 1770 Gas can be quickly discharged in air, to prevent the positive pressure Pb residuals in the inner cylinders space 1770 for being applied to flip-arm 1700 And the remaining positive pressure Pb when bare die C is picked is prevented to be sent to bare die C.
Fig. 7 show when the first turner 1000a and the second turner 1000b in Fig. 6 states rotation completion when, It is unloaded by the bare die C of the first turner 1000a pickups and the second turner is moved down into the height that bare die C will be picked State.
As shown in (a) of Fig. 7, in the case of not interfered between turner 1000a and 1000b, turner is completed The state of the rotation of 1000a and 1000b should be understood as following state：Complete the rotation of the first turner 1000a so that the The pickup unit 1100 of one turner is face-up, and completes the rotation of the second turner 1000b so that the second turner The pickup unit 1100 of 1000b is face-down.
In this case, negative pressure Ps is applied to the first turner of absorption bare die C by negative tube 1200 1000a, and positive pressure Pb is applied to by forward voltage diode 1800 of the first turner 1000a and the second turner 1000b One turner 1000a and the second turner 1000b.
As described above, bearing load 1400 can be turned over by the first turner 1000a and second is applied to by forward voltage diode 1800 Turn the positive pressure Pb supports of device 1000b, therefore no matter how the first turner 1000a and the second turner 1000b rotates, first turns over Turning the movement, shaking or vibration of device 1000a and the second turner 1000b can all be minimized.In addition, negative pressure Ps and positive pressure Pb mono- It rises and is applied to the first turner 1000a, therefore the adsorbed state for the bare die C being picked can be stably kept.
As shown in (b) of Fig. 7, when being unloaded by the bare die C of the first turner 1000a pickups, it is applied to the first overturning The negative pressure Ps of the pickup unit 1100 of device 1000a can be removed, and can complete moving down for the second turner 1000b.Cause This, the positive pressure Pb applied by forward voltage diode 1800 can be removed in another bare die C before adsorbing.In order to adsorb another Bare die C, negative pressure Pb are applied to pickup unit 1100.
It will be described in moving down for the second turner 1000b now.Second turner 1000b is while being rotated It can be moved down towards chip w.Before the pickup unit 1100 of the second turner 1000 is contacted with bare die C, turn over when second When turning the rotary motion of device 1000 and starting, the second turner 1000b can be moved downward at a high speed predetermined altitude, and later Two turners 1000 can be moved down with low speed.
When being moved down with low speed, before pickup unit 1100 is contacted with bare die C, the second turner 1000b can be with The height of bare die C is moved adjacent to uniform speed.In this case, the second turner 1000b can be by inner cylinders sky Between air in 1770 be discharged in air, and until being moved downwardly until that pickup unit 1100 is contacted with bare die C.
As described above to pick up and overturn bare die C turner 1000a and 1000b can according to turner 1000a and The mode of operation of 1000b selectively provides positive pressure Pb and negative pressure Ps, so as to improve the stability of the adsorbed state of bare die C, And minimize the motion or vibration of turner 1000a and 1000b when turner 1000a and 1000b are operated.
During the overturning of bare die C and the moving downward of turner 1000a and 1000b, positive pressure Pb can limit turner The displacement of the pickup unit 1100 of 1000a and 1000b, and therefore turner 1000a and 1000b can be rotate at high speed and downward It is mobile, thereby increasing productivity.
Fig. 8 is the sectional view for showing turner 1000 and its control method according to another embodiment of the present invention.To Fig. 8 The description of part identical with the various pieces of Fig. 5 as described above to Fig. 7 details are not described herein, will focus on figure now The difference of 8 and Fig. 5 to Fig. 7.
Similar with the embodiment of Fig. 5 in the turner 1000 of Fig. 8, pickup unit 1100 is via support load 1400 It can be shifted in flip-arm 1700, but the elastic structure for absorbing the impact generated during adsorbing bare die be omitted Part 1300.
That is, in the turner 1000 of Fig. 8, the support member 1760 of pickup unit 1100 and flip-arm 1700 it Between elastic component 1300 is not set, and control can be used and apply the method for positive pressure Pb via forward voltage diode 1800 to substitute using bullet Property component 1300.
More specifically, including according to the turner of another embodiment of the present invention：Pickup unit, pickup unit is inhaling Echo pickup bare die；Flip-arm, is equipped with pickup unit on flip-arm, and flip-arm in main body it is rotatable simultaneously It can move up or down；Support load, support load within a predetermined range may be used in the longitudinal direction in flip-arm Displacement, and pickup unit is mounted on the end of support load；Negative tube, negative tube are couple to pickup unit with to pickup unit Apply negative pressure；And forward voltage diode, forward voltage diode are couple to flip-arm, with by selectively applying positive pressure to flip-arm come negative to support It carries and carrying power is provided, and forward voltage diode is applying the first positive pressure or the second positive pressure.It is applied to the first positive pressure of support load It can be kept, to compensate the inertia of flip-arm while flip-arm is rotated and moved down, and immediately in pickup unit The forward direction support load for contacting bare die applies the second positive pressure.
Here, forward voltage diode may include control valve, selectively to apply the first positive pressure and the second positive pressure.First positive pressure is high In the second positive pressure.
That is, in embodiment before, negative pressure Ps is being applied to by pickup unit by negative tube 1200 1100 during picking up bare die by pickup unit 1100, to eliminate and apply positive pressure Pb by forward voltage diode 1800.In contrast, exist In the turner 1000 of Fig. 8, the positive pressure Pb that can be applied by forward voltage diode 1800 is divided into the first estate positive pressure Pb1 and second Grade positive pressure Pb2, the first estate positive pressure Pb1 are used for during the operation (such as rotation of turner 1000) of turner 1000 most The vibration or movement of smallization turner 1000, the second grade positive pressure Pb2 are applied by forward voltage diode 1800 with during picking up bare die The impact generated when bare die is adsorbed is absorbed while applying negative pressure Ps by negative tube 1200.
That is, the second grade positive pressure Pb2 can provide low resistance, this low resistance, which is enough to absorb, is projecting device pin (ejector pin) is applied to the pressure on bare die when being elevated, or absorbs due to the absorption layer 1110 in pickup unit 1100 While contact with bare die bare die be supported on chip and the reaction that generates, and the second grade positive pressure Pb2 may be implemented With the effect essentially identical when being used as cushion pad using elastic component 1300.
Fig. 9 is shown in the system including two turner 1000a and 1000b (such as turner 1000 of Fig. 8), naked Piece C by the first turner 1000a pickup and by the state of the second turner 1000b unloadings and the first turner 1000a and The state of second turner 1000b rotations.
In detail, (a) of Fig. 9 is shown including two turners 1000a and 1000b (such as the turner of Fig. 8 1000) in system, bare die C is by the first turner 1000a pickups and by the state of the second turner 1000b unloadings.Fig. 9's (b) state of the first turner 1000a and the second turner 1000b rotations are shown.(c) of Fig. 9 shows the turner of Fig. 8 The structure of 1000 forward voltage diode 1800.
It is different from embodiment before as shown in (a) of Fig. 9, during picking up bare die C by the first turner 1000a, Apply the second grade positive pressure Pb2 by forward voltage diode 1800.Second grade positive pressure Pb2 is applied to the inner cylinders of flip-arm 1700 Space 1770, to absorb the impact generated during adsorbing bare die C when negative pressure Ps is applied to pickup unit 1100, and it is naked Piece C is adsorbed and is picked up.As shown in (a) of Fig. 9, positive pressure Pb is applied to the second turner 1000b and is loaded with fixed support 1400 and pickup unit 1100, and since the unadsorbed bare die C of the second turner 1000b, negative pressure Ps are not applied to Two turner 1000b.
It is similar with embodiment before, as shown in (b) of Fig. 9, in the first turner 1000a and the second turner While 1000b both rotates, the first estate positive pressure Pb1 by the first turner 1000a and the second turner 1000b just Pressure pipe 1800 and be applied in, to lead to pickup unit 1100 in the rotation due to first baffle 1000a and second baffle 1000b Position change when, prevent support load 1400 and pickup unit 1100 movement, shaking or vibration.Therefore, it can improve and turn over Turn the rotation reliability of device 1000a and 1000b and the reliability of the adsorbed state of bare die C.As in the prior embodiments, Negative pressure Ps is applied only to the first turner 1000a of pickup bare die C.
As shown in (c) of Fig. 9, forward voltage diode 1800 is branched off into apply the first forward voltage diode of the first estate positive pressure Pb1 1800a and to apply the second forward voltage diode 1800b of the second grade positive pressure Pb2.First control valve 1860x is arranged in inner cylinders The front in space 1770 selectively applies the first estate positive pressure with mode of operation according to turner 1000a or 1000b Pb1 or the second grade positive pressure Pb2.Therefore, when applying the first estate positive pressure Pb1, the first control valve 1860x can be by the first positive pressure The channel of pipe 1800a is connected to inner cylinders space 1770.When applying the second grade positive pressure Pb2, the first control valve 1860x can The channel of second positive pressure pipeline 1800b is connected to inner cylinders space 1770.
In the channel of the second forward voltage diode 1800b, adjuster 1810b can be set, to opening according to pressure control channel Put the proportioning valve 1860z of degree (degree of openness), selecting the second of the second forward voltage diode 1800b and air to control Valve 1860y processed etc..
Since forward voltage diode 1800 branches into the first forward voltage diode 1800a and the second forward voltage diode 1800b, so when needing to reduce just When pressing Pb, the pressure of cylinder can be applied to by stopping the channel of respective tube, removal and apply the positive pressure with different amplitudes Pb, rather than by the way that the first estate positive pressure Pb1 is reduced to the second grade positive pressure Pb2, it is applied by forward voltage diode 1800 to improve to be directed to The response of the amplitude variation of the first estate positive pressure Pb1 and the second grade positive pressure Pb2 that add and the first estate positive pressure Pb1 and second The reliability of the amplitude of grade positive pressure Pb2.
The second forward voltage diode 1800b and air are selected due to the use of the second control valve 1860y, inner cylinders space 1770 Residual pressure can be quickly discharged, and can the second forward voltage diode 1800b be connected to internal gas by the second control valve 1860y Cylinder space 1770, to apply the second grade positive pressure Pb2 when the discharge of the residual pressure in inner cylinders space 1770 is completed, to Improve positive pressure handoff response.
Figure 10 shows the state that the rotation in the first and second turner 1000a and 1000b in Fig. 9 states is completed Under, it is unloaded by the bare die C of the first turner 1000a pickups and the second turner 1000b is moved down into bare die C and will be picked up The state of the height taken.
It is similar with embodiment before as shown in (a) of Figure 10, in turner 1000a and 1000b in turner In the state of completing rotation in the case of not interfered between 1000a and 1000b, the rotation of the first turner 1000a is completed, and is made The pickup unit 1100 for obtaining the first turner 1000a is face-up, and the rotation of the second turner 1000b is completed so that second turns over The pickup unit 1100 for turning device 1000b is face-down, and negative pressure Ps first is turned over by what negative tube 1200 were applied to absorption bare die Turn device 1000a, and the first estate positive pressure Pb1 is applied to the first turner 1000a and second by forward voltage diode 1800 and turns over Turn device 1000b.
As shown in (b) of Figure 10, when the bare die by the first turner 1000a pickups is unloaded, it is applied to the first overturning The negative pressure Ps of the pickup unit 1100 of device 1000a can be removed, and moving down for the second turner 1000b can be complete At.Therefore, before adsorbing another bare die C, the operation for applying the first estate positive pressure Pb1 by forward voltage diode 1800 is cancelled, And the first estate positive pressure Pb1 is lowered to the second grade positive pressure Pb2.In order to reduce vacuum generation time, another is being adsorbed Negative pressure Ps is applied to pickup unit 1100 before bare die C.As a result, during adsorbing bare die C by pickup unit 1100, positive pressure quilt The positive pressure for continuously applying, and being applied can be less than the positive pressure applied during the rotation of flip-arm 1700.In such case Under, it, can be by removing applied positive pressure during the moving downward of flip-arm 1700 and applying less than should when applying positive pressure The new positive pressure of positive pressure, to reduce positive pressure.
As described above, in the method according to the control turner of another embodiment of the present invention, (wherein turner includes： Pickup unit, pickup unit is adsorbing and pick up bare die；Flip-arm is equipped with pickup unit on flip-arm, and overturns Arm is rotatable in main body and can move up or down；Support load, support load in flip-arm and It can be shifted within a predetermined range on length direction, and pickup unit is mounted on the end of support load；Negative tube, negative tube Pickup unit is couple to apply negative pressure to pickup unit；And forward voltage diode, forward voltage diode are coupled to flip-arm, to be supplied to support load Power should be carried, forward voltage diode is branched off into the first forward voltage diode and the second forward voltage diode), following steps can be continuously performed：In pickup unit While rotating and be moved vertically downwardly into certain altitude, keep the first positive pressure to compensate the inertia of flip-arm；In certain altitude The first positive pressure of place's discharge；After the discharge for completing the first positive pressure, apply the second positive pressure just forced down than first；Work as pickup unit It is naked to be adsorbed by pickup unit by applying negative pressure by negative tube when further being moved down and therefore being contacted with bare die Piece, while the impact generated during being contacted with bare die is mitigated by using the second positive pressure；With it is vertical upwards in pickup unit It is moved to certain altitude while in the state that the first positive pressure is applied in and keeps, rotation pickup unit.
According to the above method, turner 1000a and 1000b to pick up and overturn bare die C can be according to turners The mode of operation of 1000a and 1000b selectively applies positive pressure Pb and negative pressure Ps, so as to improve the bare die under adsorbed state The stability of C, and movement or vibration when operating turner 1000a and 1000b are minimized, and elastic component can also be performed Function to protect bare die.
According to the present invention in engaging engagement member and its control method of equipment, when bare die (such as semiconductor Chip) engaging force of bare die is applied to when being immersed in scaling powder or be joined on engagement substrate to be accurately controlled.As a result, The convex block on bare die bottom surface can be prevented to be damaged, and bare die fragmentation or rupture can be prevented.
According to the present invention, even if in the Pneumatic pressure component that can be changed according to pressure using volume, Pneumatic pressure can It is divided into two parts, and can be continuously supplied if buffer power even if the volume of Pneumatic pressure component changes to connecing Component is closed, to avoid or minimize the shaking of joint element.Thereby, it is possible to stablize joint element.
In engagement equipment according to the present invention and its control method, by bare die (such as the semiconductor of joint element absorption Chip) can by high-speed mobile to containing fluxing agent dipping plate or engagement substrate on, therefore can be in the case where not reducing UPH most Big metaplasia yield.
Although having been combined exemplary embodiments of the present invention above describes the present invention, the technology of fields Personnel, which should be understood that, to be made various changes and modifications in the case where not departing from the technical concept and range of the present invention.Cause This, it is evident that all modifications are contained in the technical scope of the present invention, as long as these modifications include the present invention's Component claimed in claims.

Claims (14)

1. a kind of engagement equipment, the engagement equipment include：
Engaging head, the engaging head is individually adsorbing the bare die of cutting；
The engaging head is transmitted to X-Y and put down by driver, the driver to move the engaging head in vertical direction Position on face；With
Substrate is engaged, the bare die adsorbed by the engaging head is installed on the engagement substrate,
The wherein described engaging head includes：
Joint element, the joint element is to bare die described in vacuum suction；
First Pneumatic pressure component, the first Pneumatic pressure component is to by selectively to first pneumatic pressure portion Part applies Pneumatic pressure and cancels the application of the Pneumatic pressure and supply buffer power to the joint element, wherein described the The volume of one Pneumatic pressure component is variable according to pressure；With
Second Pneumatic pressure component, the second Pneumatic pressure component are continuously applied Pneumatic pressure,
Wherein while the position engaging head being transmitted on the X-Y plane, it is pneumatic to remain applied to described first The Pneumatic pressure of press member and the second Pneumatic pressure component, and when the engaging head moves vertically downward, in institute It states in the state that engaging head separates predetermined altitude with the top for engaging substrate, is applied to the first Pneumatic pressure component Pneumatic pressure is removed, and the bare die adsorbed by the joint element is installed on the engagement substrate.
2. a kind of engagement equipment, the engagement equipment include：
Engaging head, the engaging head is individually adsorbing the bare die of cutting；
The engaging head is transmitted to X-Y and put down by driver, the driver to move the engaging head in vertical direction Position on face；
Plate is impregnated, the dipping contains fluxing agent, the scaling powder bottom table to be coated for being layed onto the bare die adsorbed by the engaging head On face；With
Substrate is engaged, bare die of the installation coated with the scaling powder on the engagement substrate,
The wherein described engaging head includes：
Joint element, the joint element is to bare die described in vacuum suction；
First Pneumatic pressure component, the first Pneumatic pressure component is to by selectively to first pneumatic pressure portion Part applies Pneumatic pressure and cancels the application of the Pneumatic pressure and supply buffer power to the joint element, wherein described the The volume of one Pneumatic pressure component is variable according to pressure；With
Second Pneumatic pressure component, the second Pneumatic pressure component are continuously applied Pneumatic pressure,
Wherein while the position engaging head being transmitted on the X-Y plane, it is pneumatic to remain applied to described first The Pneumatic pressure of press member and the second Pneumatic pressure component, and when the engaging head moves vertically downward, in institute State engaging head with it is described dipping plate top separate predetermined altitude in the state of, be applied to the gas of the first Pneumatic pressure component Dynamic pressure is removed, and the scaling powder is applied on the bottom surface of the bare die adsorbed by the joint element.
3. engagement equipment according to claim 1 or 2, wherein the first Pneumatic pressure component includes:
Air chamber channel, the air from extraneous air case are supplied and are transmitted by the air chamber channel；
Air chamber, the air chamber by the air supplied from the air chamber channel to be expanded, with to described Joint element supplies driving force；
Power controls to adjust device, and the power controls to adjust device to control the pressure for the air supplied from the extraneous air case；With
Valve, the valve supply air to start or stop to the air chamber.
4. engagement equipment according to claim 3, wherein when stopping supplying air to the air chamber, remain in The indoor air of air chamber is discharged to outside, and the Pneumatic pressure for being thus only applied to the second Pneumatic pressure component is tried hard to keep It stays in the joint element, to reduce the pressure for being applied to the joint element.
5. engagement equipment according to claim 1 or 2, wherein the second Pneumatic pressure component includes:
Cylinder channel, the air from extraneous air case are supplied and are transmitted by the cylinder channel；
Cylinder, the cylinder load the pressure for the air supplied by the cylinder channel is sent to support；With
The support load, the support load is to by attached to the engagement according to the pressure for being sent to the support load Part supplies the buffer power with certain pressure to support the joint element.
6. engagement equipment according to claim 5, wherein when the Pneumatic pressure for being applied to the first Pneumatic pressure component It is removed, and when thus the volume that the air chamber of air is supplied changes, the support load use is by institute The Pneumatic pressure support for stating the holding of the second Pneumatic pressure component, to supply the buffer power to the joint element.
7. engagement equipment according to claim 1 or 2, wherein the joint element includes sensor dog, and
The engaging head includes sensor element, the sensor element to sense the physical distance away from the sensor dog, The sensor element and the sensor dog are spaced apart.
8. engagement equipment according to claim 1 or 2, wherein the joint element includes：
Bonding pick device, the bonding pick device with the bare die being physically contacted and adsorb the bare die；With
Air bearing, to rotate the bonding pick device, the air bearing is coupled to the engagement and picks up the air bearing The top of device is taken, and
The joint element further includes：
Watertight aircase, the watertight aircase is supplying air to the air bearing；With
Air draught control mechanism, the air draught control mechanism is controlling the pressure of supplied air.
9. engagement equipment according to claim 1 or 2, further includes turner, the turner is picking up the naked of cutting Piece makes the bare die rotate 180 ° so that the bare die turns upside down and the bare die is transmitted to the engaging head,
The wherein described turner includes：
Pickup unit, the pickup unit is adsorbing and pick up the bare die；
Flip-arm, the pickup unit are mounted on the flip-arm, and the flip-arm is in main body and rotatable And it can move up or down；
Support load, the support load are mounted in the flip-arm and are in the longitudinal direction removable in predetermined range Position, and the wherein described pickup unit is mounted on the end of the support load；
Elastic component, the elastic component to absorb the impact generated during the pickup unit is contacted with the bare die, The elastic component is disposed therein between the support member and the pickup unit including the support load；
Negative tube, the negative tube to the pickup unit to apply negative pressure, to be picked up by the pickup unit in the bare die The negative pressure, the negative tube is kept to be coupled to the pickup unit while taking；With
Forward voltage diode, the forward voltage diode are dynamic to load supply carrying to the support by applying positive pressure into the flip-arm Power, the forward voltage diode are coupled to the flip-arm,
It wherein keeps being applied to the positive pressure of the support load by the forward voltage diode in flip-arm rotation and to moving down The inertia of the flip-arm is compensated while dynamic, and contacts foregoing description positive pressure immediately in the pickup unit and the bare die It is removed.
10. engagement equipment according to claim 1 or 2, further includes turner, the turner is picking up the naked of cutting Piece makes the bare die rotate 180 ° so that the bare die turns upside down and the bare die is transmitted to the engaging head,
The wherein described turner includes：
Pickup unit, the pickup unit is adsorbing and pick up the bare die；
Flip-arm, the pickup unit are mounted on the flip-arm, and the flip-arm is in main body and rotatable And it can move up or down；
Support load, the support load are mounted in the flip-arm and are in the longitudinal direction removable in predetermined range Position, and the wherein described pickup unit is mounted on the end of the support load；
Negative tube, the negative tube to the pickup unit to apply negative pressure, to be picked up by the pickup unit in the bare die The negative pressure, the negative tube is kept to be coupled to the pickup unit while taking；With
Forward voltage diode, the forward voltage diode to apply the first positive pressure or the second positive pressure, the forward voltage diode be coupled to the flip-arm with By selectively applying positive pressure to the flip-arm supply carrying power is loaded to the support；
The first positive pressure of the support load is wherein remained applied to be mended while the flip-arm rotates and moves down The inertia of the flip-arm is repaid, and
Before being contacted with the bare die immediately in the pickup unit, apply second positive pressure to support load, it is described Second positive pressure is less than first positive pressure.
11. it is a kind of control engagement equipment method, the engagement equipment include engaging head, driver and engage substrate,
There is the engaging head joint element, the first Pneumatic pressure component and the second Pneumatic pressure component, the joint element to use With the bare die that vacuum suction is cut, the volume of the first Pneumatic pressure component is variable with to the joint portion according to pressure Part supplies buffer power, and selectively executes and apply described in Pneumatic pressure and cancellation in the first Pneumatic pressure component The application of Pneumatic pressure, and the second Pneumatic pressure component is continuously applied Pneumatic pressure, and the driver is to vertical Histogram moves up the engaging head and the engaging head is transmitted to the position on X-Y plane, pacifies on the engagement substrate Equipped with the bare die adsorbed by the engaging head；Described method includes following steps：
It is transmitted above the engagement substrate in the engaging head of the bare die of absorption cutting and is moved vertically downwardly into certain height While spending, the Pneumatic pressure of the first Pneumatic pressure component and the second Pneumatic pressure component is remained applied to；
The Pneumatic pressure for the first Pneumatic pressure component for being applied to the engaging head is expelled to outside at the certain altitude；
When the discharge of the Pneumatic pressure is completed, moves further downward the engaging head and adsorb the engaging head naked Piece is mounted on the engagement substrate；With
When installation is complete for the bare die, corresponding Pneumatic pressure be applied to the first Pneumatic pressure component and The engaging head is moved to vertically upward in the state of certain altitude while be kept, and executes subsequent processing；
The step of wherein remaining applied to the Pneumatic pressure of the first Pneumatic pressure component and the second Pneumatic pressure component will apply The step of being added to the Pneumatic pressure discharge of the first Pneumatic pressure component moves further downward the engaging head and will be described The step of step and execution subsequent processing that the bare die of engaging head absorption is mounted on the engagement substrate, is repeatedly executed.
12. a kind of method of control engagement equipment, the engagement equipment includes engaging head, driver, dipping plate and engages substrate, The engaging head has joint element, the first Pneumatic pressure component and the second Pneumatic pressure component, and the joint element is to true The bare die of the attached cutting of suction, the volume of the first Pneumatic pressure component are variable to be supplied to the joint element according to pressure Buffer power is answered, and is selectively executed in the first Pneumatic pressure component and is applied Pneumatic pressure and cancel described pneumatic The application of pressure, and the second Pneumatic pressure component is continuously applied Pneumatic pressure, and the driver is in Vertical Square It moves up the engaging head and the engaging head is transmitted to the position on X-Y plane, the dipping plate contains fluxing agent, institute It states on bottom surface of the scaling powder to be applied to the bare die adsorbed by the engaging head, coating has been installed on the engagement substrate The bare die of scaling powder is stated, described method includes following steps：
It is transmitted above the dipping plate in the engaging head of the bare die of absorption cutting and is moved vertically downwardly into certain altitude While, remain applied to the Pneumatic pressure of the first Pneumatic pressure component and the second Pneumatic pressure component；
The Pneumatic pressure for the first Pneumatic pressure component for being applied to the engaging head is expelled to outside at the certain altitude；
When the discharge of corresponding Pneumatic pressure is completed, moves further downward the engaging head and will be included in the dipping plate Scaling powder be coated on the bottom surface of the bare die adsorbed by the engaging head；
When the scaling powder, which is coated to the step on the bottom surface of the bare die, to be completed, described the is applied in Pneumatic pressure One Pneumatic pressure component and while the engaging head is moved to is kept in the state of certain altitude vertically upward, in institute Transmit the bare die in the top for stating engagement substrate；With
The bare die for being coated with the scaling powder is installed on the engagement substrate,
The step of wherein remaining applied to the Pneumatic pressure of the first Pneumatic pressure component and the second Pneumatic pressure component will apply The step of being added to the Pneumatic pressure discharge of the first Pneumatic pressure component moves further downward the engaging head and will include Scaling powder in the dipping plate is coated to step on the bottom surface of the bare die adsorbed by the engaging head, in the engagement The step of bare die is transmitted in the top of substrate and the bare die for being coated with the scaling powder are installed on the engagement substrate The step of be repeatedly executed.
13. method according to claim 11 or 12, wherein the engagement equipment further includes turner, the turner is used With the bare die of pickup cutting, the bare die is made to rotate 180 ° so that the bare die turns upside down and transmits the bare die To the engaging head,
The wherein described turner includes：
Pickup unit, the pickup unit is adsorbing and pick up the bare die；
Flip-arm, the pickup unit are mounted on the flip-arm, and the flip-arm is in main body and rotatable And it can move up or down；
Support load, the support load is mounted in the flip-arm, and being in predetermined range in the longitudinal direction can Displacement, and the wherein described pickup unit is mounted on the end of the support load；Elastic component, the elastic component are set Set includes between the support support member loaded and the pickup unit wherein；
Negative tube, the negative tube are coupled to the pickup unit to apply negative pressure to the pickup unit；With
Forward voltage diode, the forward voltage diode are coupled to the flip-arm to load supply carrying power to the support, and
Wherein the method further includes following steps：
Positive pressure is kept, to compensate the flip-arm while pickup unit rotates and is moved to certain altitude vertically downward Inertia；
The positive pressure is discharged at the certain altitude；
After the completion of the discharge of the positive pressure, the pickup unit is described naked to adsorb by applying negative pressure by the negative tube Piece, while being mitigated when the pickup unit moves further downward and is contacted with the bare die by using the elastic component When the impact that generates；With
The positive pressure is applied in and is kept in the state that the pickup unit is moved to certain altitude vertically upward Meanwhile the pickup unit is rotated,
The step of wherein keeping the positive pressure, the step that the step of positive pressure is discharged, adsorbs the bare die by the pickup unit Suddenly it is continuously performed and the step of rotating the pickup unit.
14. method according to claim 11 or 12, wherein the engagement equipment further includes turner, the turner is used With the bare die of pickup cutting, the bare die is made to rotate 180 ° so that the bare die turns upside down and transmits the bare die To the engaging head,
The wherein described turner includes：
Pickup unit, the pickup unit is adsorbing and pick up the bare die；
Flip-arm, the pickup unit are mounted on the flip-arm, and the flip-arm is in main body and rotatable And it can move up or down；
Support load, the support load are mounted in the flip-arm and are in the longitudinal direction removable in predetermined range Position, and the wherein described pickup unit is mounted on the end of the support load；
Negative tube, the negative tube are coupled to the pickup unit to apply negative pressure to the pickup unit；With
Forward voltage diode, the forward voltage diode are coupled to the flip-arm to load supply carrying power, the forward voltage diode to the support It is branched off into the first forward voltage diode and the second forward voltage diode,
Wherein the method further includes following steps：
The first positive pressure is kept, to be turned over described in the compensation while pickup unit rotates and is moved to certain altitude vertically downward The inertia of pivoted arm；
First positive pressure is discharged at the certain altitude；
After the completion of the discharge of first positive pressure, apply the second positive pressure less than first positive pressure；
The pickup unit adsorbs the bare die by applying negative pressure by the negative tube, at the same by second positive pressure come Mitigate the impact generated when the pickup unit moves further downward and is contacted with the bare die；With
The positive pressure is applied in and is kept in the state that the pickup unit is moved to certain altitude vertically upward Meanwhile the pickup unit is rotated,
The step of the step of the step of wherein keeping first positive pressure, discharge first positive pressure, application second positive pressure, The step of the step of adsorbing the bare die by the pickup unit and the rotation pickup unit, is continuously performed.
CN201810127206.9A 2017-02-28 2018-02-08 Bonding apparatus and control method thereof Active CN108511381B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020170026773A KR20180099379A (en) 2017-02-28 2017-02-28 Flipping apparatus and controlling method of the same
KR10-2017-0026773 2017-02-28
KR1020170037607A KR102075198B1 (en) 2017-03-24 2017-03-24 Bonding apparatus and method for controlling the same
KR10-2017-0037607 2017-03-24

Publications (2)

Publication Number Publication Date
CN108511381A true CN108511381A (en) 2018-09-07
CN108511381B CN108511381B (en) 2023-05-23

Family

ID=63375642

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810127206.9A Active CN108511381B (en) 2017-02-28 2018-02-08 Bonding apparatus and control method thereof

Country Status (2)

Country Link
CN (1) CN108511381B (en)
TW (1) TWI753109B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114555989A (en) * 2019-10-16 2022-05-27 Vat控股公司 Adjusting device with pressure measuring function for vacuum area

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326580A (en) * 1992-05-26 1993-12-10 Matsushita Electric Ind Co Ltd Bonding head device for electronic component and bonding method for electronic component
JP2006137000A (en) * 2005-11-25 2006-06-01 Origin Electric Co Ltd Suction head
KR20080080358A (en) * 2005-12-06 2008-09-03 토레이 엔지니어링 컴퍼니, 리미티드 Chip mounting apparatus and chip mounting method
JP2009027105A (en) * 2007-07-24 2009-02-05 Shibuya Kogyo Co Ltd Bonding device
CN101740418A (en) * 2008-11-20 2010-06-16 松下电器产业株式会社 Component mounting apparatus and component mounting method
KR20110137602A (en) * 2010-06-17 2011-12-23 한미반도체 주식회사 Bond head for die bonding machine
CN105794333A (en) * 2013-10-21 2016-07-20 富士机械制造株式会社 Method for mounting an electronic-component onto a substrate and electronic-component mounting machine
KR20160144701A (en) * 2015-06-09 2016-12-19 세메스 주식회사 Picker for picking up semiconductor chip

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100565829C (en) * 2005-05-31 2009-12-02 东丽工程株式会社 Coupling device
TWI436702B (en) * 2007-07-31 2014-05-01 Ulvac Inc Substrate bonding apparatus and method for controlling the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326580A (en) * 1992-05-26 1993-12-10 Matsushita Electric Ind Co Ltd Bonding head device for electronic component and bonding method for electronic component
JP2006137000A (en) * 2005-11-25 2006-06-01 Origin Electric Co Ltd Suction head
KR20080080358A (en) * 2005-12-06 2008-09-03 토레이 엔지니어링 컴퍼니, 리미티드 Chip mounting apparatus and chip mounting method
JP2009027105A (en) * 2007-07-24 2009-02-05 Shibuya Kogyo Co Ltd Bonding device
CN101740418A (en) * 2008-11-20 2010-06-16 松下电器产业株式会社 Component mounting apparatus and component mounting method
KR20110137602A (en) * 2010-06-17 2011-12-23 한미반도체 주식회사 Bond head for die bonding machine
CN105794333A (en) * 2013-10-21 2016-07-20 富士机械制造株式会社 Method for mounting an electronic-component onto a substrate and electronic-component mounting machine
KR20160144701A (en) * 2015-06-09 2016-12-19 세메스 주식회사 Picker for picking up semiconductor chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114555989A (en) * 2019-10-16 2022-05-27 Vat控股公司 Adjusting device with pressure measuring function for vacuum area
CN114555989B (en) * 2019-10-16 2023-12-01 Vat控股公司 Adjusting device with pressure measuring function for vacuum zone

Also Published As

Publication number Publication date
CN108511381B (en) 2023-05-23
TWI753109B (en) 2022-01-21
TW201834519A (en) 2018-09-16

Similar Documents

Publication Publication Date Title
JP4386007B2 (en) Component mounting apparatus and component mounting method
US20110079361A1 (en) Apparatus for semiconductor die bonding
US8905290B2 (en) Apparatus for mounting semiconductor chips on a circuit board
CN110400766A (en) Work piece correcting method and work piece correcting device
CN108511381A (en) Engage equipment and its control method
JPH10209208A (en) Method and device for manufacturing semiconductor
JP4653550B2 (en) Semiconductor device manufacturing apparatus and manufacturing method
KR102180244B1 (en) Grinder
KR20210144881A (en) bonding device
JP6574953B2 (en) Component adsorption head
CN110402621A (en) Three-dimensional mounting device and three-dimensional installation method
JP4364393B2 (en) Handling method of bonding object and bump bonding apparatus using the same
TWM507579U (en) Semiconductor device packaging system
KR102282453B1 (en) A component mounting head of surface mounter
KR101619312B1 (en) Parts feeder of Chip mounter
KR20180108178A (en) Bonding apparatus and method for controlling the same
WO2019026160A1 (en) Mounting head and component mounting machine
KR101560306B1 (en) Board transfer assembly
KR102436661B1 (en) A nozzle device for component mounter
TWI616997B (en) Ball mounting process
JP2022037672A (en) Substrate holding device and substrate holding method
JP4338325B2 (en) Bump bonding equipment
JP2016086096A (en) Mounting head for surface mounting machine
CN116583939A (en) Conveying device, conveying method, and program
JP4212226B2 (en) Surface mount component mounting machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant