CN100565829C - Coupling device - Google Patents
Coupling device Download PDFInfo
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- CN100565829C CN100565829C CNB2006800162419A CN200680016241A CN100565829C CN 100565829 C CN100565829 C CN 100565829C CN B2006800162419 A CNB2006800162419 A CN B2006800162419A CN 200680016241 A CN200680016241 A CN 200680016241A CN 100565829 C CN100565829 C CN 100565829C
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- sheet material
- suction head
- identification
- workpiece
- coupling device
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- 230000008878 coupling Effects 0.000 title claims description 23
- 238000010168 coupling process Methods 0.000 title claims description 23
- 238000005859 coupling reaction Methods 0.000 title claims description 23
- 239000000463 material Substances 0.000 claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 238000001179 sorption measurement Methods 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 claims description 29
- 238000001514 detection method Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000001915 proofreading effect Effects 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 description 28
- 238000012545 processing Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 238000002788 crimping Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004606 Fillers/Extenders Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005314 correlation function Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000027455 binding Effects 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000035611 feeding Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
Make the framework reversing of concave shape and in the lower openings of framework transparent adsorption section is installed to constitute suction head, the Projection Division that will have 2 speculums is sent into from the side mouth forward end of this suction head.Then, the sheet material that the portion of being adsorbed absorption is kept the surperficial formed alignment mark that plays the projected electrode of alignment mark effect and be labeled in substrate surface is mapped on two speculums of Projection Division.Being mapped in two alignment marks on this two speculum is projected in suction head and is configured in discretely on the ccd video camera of side side.
Description
Technical field
The present invention relates to a kind of sheet materials such as electronic unit are mounted to coupling device on the workpiece that substrate by glass, resin and metal etc. constitutes.
Background technology
The sheet material that will have projected electrode in the past is mounted to heads state can be from the alignment mark of the upside of sheet material identification simultaneously sheet material and in order to the alignment mark of the installation site on the identification substrate as the coupling device on the substrate of workpiece.Particularly, keep the suction head of sheet material partly to use prism in absorption, the picture of two parts that makes two alignment marks that comprise sheet material and substrate is by the inclined-plane of prism reflection, is projected to be independent of the suction head fixed configurations on the ccd video camera of suction head side.In addition, when the dislocation of proofreading and correct according to the identification result of two alignment marks with respect to the installation site of sheet material, make the holding plate that keeps substrate to horizontal direction in length and breadth to moving, and around the central shaft rotation (for example with reference to patent documentation 1) of sheet material.
Patent documentation 1:WO2003/041478
Disclosure of the Invention
Invent technical problem to be solved
In recent years, for improving the efficient of producing in enormous quantities, substrate size has the trend of expansion, and the substrate that need carry out high-density installation also is one of them.Coupling device in the past is by making thin slice keep mobile along the vertical direction mechanism of suction head and the mechanism that substrate holding plate along continuous straight runs and direction of rotation are moved to constitute.Therefore, follow in the past structure come corresponding large substrate, when utilizing thin slice to keep suction head that sheet material is mounted to the substrate universe, need 2 times substrate installation region and be the moving processes of rotary area, therefore can cause device to maximize with the diagonal angle length of substrate.
For addressing this problem, the method that makes the suction head sideway swivel is effective.Yet because the relativeness of ccd video camera and prism changes, the shape of the alignment mark of thin slice and substrate can change.In addition, even the relativeness of ccd video camera and prism is proofreaied and correct, the position finding result who obtains is worsened.
In addition, for addressing this problem, if make the relativeness of ccd video camera and prism as one man the ccd video camera unit is mounted to rotating shaft, the load increase or the suction head that then can cause bearing on the rotating shaft (θ axle) of suction head need bigger problems such as space on every side, cause cost to increase or maximization.
The technical scheme that is used for the technical solution problem
In view of the above problems, the object of the present invention is to provide a kind of coupling device that improves installation accuracy with simple apparatus structure.
Therefore, the present invention has following structure for achieving the above object.
It is coupling device of the present invention, in order to sheet material is installed on the workpiece that remains on the workpiece retaining member, it is characterized in that, comprise: suction head, this suction head comprise be the case shape and at least the part of side and lower aperture framework and be installed on the lower aperture of described framework, in order to keep the transparent thin slice retaining member of described sheet material; In the opening of the framework side of described suction head advance and retreat, see through described thin slice retaining member and identification member that identification is carried out in the reference position in order to identification sheet material installation position of the workpiece that keeps to the sheet material that kept by described thin slice retaining member with by described workpiece retaining member; Make 1st drive member of described suction head around the center longitudinal axis rotation of this sheet material that keeps described sheet material; Make the 2nd drive member of described suction head and the lifting relatively of described workpiece retaining member; The 3rd drive member that described suction head and described workpiece retaining member are relatively moved horizontally; And detecting relative position skew between the reference position of described sheet material and workpiece according to the identification result of described identification member, described the 1st drive member of drive controlling and the 3rd drive member are to proofread and correct the control member of its offset.
If use coupling device of the present invention, make its center longitudinal axis rotation by driving suction head, so need not to make the substrate rotation around sheet material.That is to say, need not to guarantee to consider the space that the diagonal angle length greater than the length in length and breadth of workpiece is rotated.Its result can make apparatus structure oversimplify.In addition, the identification member can reach certain distance identification sheet material and workpiece all the time at a certain angle in the side mouth of suction head advance and retreat, therefore can not cause the variation (distortion) of image because of the variation of optical projection angle etc.Thus, the position of identification sheet material and workpiece correctly is to improve installation accuracy.
In addition, the identification member preferably include in order to the ccd video camera of two reference positions of identification sheet material and workpiece and be arranged at the advance and retreat direction of ccd video camera the front side, the reference position of sheet material and workpiece is projected in projection means on the ccd video camera.
If use this structure, after receiving sheet material, need not to make the identification member to keep out of the way when mounted, therefore can the time under reach.
In addition, preferably have 2 described ccd video cameras, projection means is projected in the reference position of sheet material and workpiece respectively on 2 ccd video cameras.At this moment, can adopt following structure.Projection means comprises: map out sheet material and workpiece two reference positions 1 couple the 1st reflective mirror and will be mapped in the picture reflection of reference position on the 1st reflective mirror and be projected in 1 couple the 2nd reflective mirror on the ccd video camera.
And, when being arranged on the alignment mark at 2 places in bight separately in two reference positions of sheet material and workpiece, preferably the described alignment mark with a side two bights is mapped on a side the 1st reflective mirror, utilize the 2nd reflective mirror reflection and be projected on a side the ccd video camera, the alignment mark in the opposing party's two bights is mapped on the opposing party's the 1st reflective mirror, utilizes the reflection of the 2nd reflective mirror and be projected on the opposing party's the ccd video camera.
If use this structure, can utilize independent projection means identification sheet material and workpiece respectively, even therefore in the narrow opening of suction head, also can be with the reference position of broad visual field identification correctly two parts.For example, when having a plurality of reference positions (alignment mark), can handle the whole alignment mark of identification by 1 time away from sheet material.In addition, the projection that forms can be constituted the reference position of sheet material on the sheet material of installing with the state that faces up.
In addition, for the simplification of implement device, preferably make suction head sheet material is being mounted to lifting between the active position of substrate and the position of readiness above it, or suction head is moved horizontally with respect to real estate, or make above-mentioned two kinds of textural associations.
In addition, the 2nd drive member is actuator preferably, is included in to slide mobile piston in the cylinder and from the extended push rod of the front end of this piston, piston can rotate around the axle center in cylinder.In addition, preferably utilize linkage that the push rod of cylinder of the 2nd drive member and the 1st drive member are linked, the actuating force of the 2nd drive member is transformed to the 1st rotation of driving component power.
That is to say that if use this structure, therefore the revolving force of the piston push rod of the 2nd drive member when suction head has the 1st drive member, can simplify the structure of suction head side by linkage indirect transfer to the 1 drive member.That is to say,, therefore, for example when making the lifting of suction head side, can easily carry out lift adjustment, and can excessively not pressurize sheet material because the light in structure of suction head side is quantized.
In addition, preferably make on the outer peripheral face of push rod to have guider, and linkage comprises 2 connecting rods and with the flexure operation of 2 connecting rods company's joint part of two connecting rods is slided, so that the length of two connecting rods becomes certain flexible guider.
And, preferably have the scale plate of the front end that is fixed in the connecting rod that links with the push rod side, and also comprise in order to the detection means of detection with the anglec of rotation of the scale plate of the rotation interlock of connecting rod; And the control member that suction head is positioned according to the testing result of detection means.
If use this structure, can improve the position alignment precision of suction head.
In addition, in the control member of the present invention, preferably make the control member utilization have the main substrate of the scale plate that is associated with the installation site of sheet material in advance, try to achieve the dependency relation and the storage of the position information of each installation site that the identification member picked out and the driving shaft that described the 1st to the 3rd drive member is had, when sheet material is mounted to workpiece, utilize of the dislocation of each drive member of dependency relation drive controlling with the driving shaft of offsetting each drive member.
If use this structure, the installation accuracy in the time of can improving sheet material and be mounted to workpiece.
The invention effect
Coupling device of the present invention makes its center longitudinal axis rotation around sheet material by driving suction head, so need not to make the substrate rotation, therefore need not to guarantee the space that rotates for the workpiece greater than sheet material.Its result can make apparatus structure oversimplify.In addition, the identification member can reach certain distance identification sheet material and workpiece all the time at a certain angle in the side mouth of suction head advance and retreat, therefore can not cause the variation (distortion) of image because of the variation of optical projection angle etc.Thus, the position of identification sheet material and workpiece correctly is to improve installation accuracy.
Description of drawings
Fig. 1 is the stereogram of the crimping system of embodiment.
Fig. 2 is the front view of the schematic configuration of expression installation unit.
Fig. 3 is the vertical view of the structure of expression linkage.
Fig. 4 is the end view of the schematic configuration of expression Identification Division.
Fig. 5 is the vertical view of the schematic configuration of expression Projection Division.
Fig. 6 is the figure that expression is projected in the image on the ccd video camera.
(symbol description)
11 sheet materials, 14 substrate holders
15 movable platens, 17 suction head
18 horizontal drive mechanisms, 19 lift drive mechanisms
20 rotary drive mechanisms, 22 adsorption sections
29A, 29B control part 37 ccd video cameras
39a the 1st speculum 39b the 2nd speculum
Embodiment
Below, with reference to accompanying drawing embodiments of the invention are described.In addition, in the present embodiment, with will with the projection electronic unit be that example describes as the situation that sheet material is mounted to substrate.In addition, for example whole forms of the side that engages with substrate of irrelevant kind such as IC chip, semiconductor chip, optical element, surface mounting assembly, wafer and size ground of other sheet material have been represented.
In addition, for example whole forms of the side that engages with sheet material such as resin substrate, glass substrate, film substrate, metal substrate (for example copper base) of substrate have been represented.
Fig. 1 is the stereogram of the crimping system of present embodiment.
The thin slice erecting device of present embodiment roughly is divided into: device base station 1, be provided in the front side (left end of Fig. 1) of this device base station 1 substrate feed unit 2, be provided in the inboard of device base station 1 installation unit 3, be provided in the sheet material feed unit 4 on installation unit 3 left sides.
The pilot pin 8 that is formed on the location hole on the substrate W can be inserted with upright being provided with of predetermined distance in the surface of mounting plate 6.
Carrying mechanism 7 has the adsorption plate 9 on the surface of adsorbable substrate W, this adsorption plate 9 can be moved along 1 (Y) direction of the top of the top of mounting plate 6 and substrate holder 14, and can be in the relative position lifting (along Z-direction) of mounting plate 6 and substrate holder 14.In addition, adsorption plate 9 is connected with pump by not shown pipe arrangement.
Maintaining part 10 comprises substrate holder 14 and movable platen 15, and this substrate holder 14 keeps the adsorption plate 9 substrate W that absorption keeps and carrying is come that the surface is handled upside down mechanism 7 with flat-hand position absorption; Movable platen 15 can make substrate holder 14 move along 1 (Y) direction of level.Movable platen 15 drives by making the just contrary rotation of not shown motor, can move forward and backward along guide rail 16 screw rod feedings.In addition, maintaining part 10 also can be a module extender board.In addition, keep not shown heater in the bottom of substrate holder 14, can heat from the inside to substrate W.
Left side among Fig. 2 of lift drive mechanism 19 is equipped with the motor M2 that constitutes rotary drive mechanism 20 with the state under the axial rotary of motor M2.The rotating shaft of motor M2 is provided with the linkage 32 by push rod 28 bindings of push rod guider G and actuator.
In addition, the scale plate 35 of fan-shaped is installed on the connecting rod 33b, utilizes neighbor configuration to read at the encoder 36 that constitutes by memory of this scale plate side.Promptly the anglec of rotation by reading piston 27 and its result is sent to control part 29B reads the anglec of rotation of suction head 17 around the Z axle.In addition, encoder 36 is equivalent to detection means of the present invention, and control part 29B is equivalent to control member.
Sheet material feed unit 4 comprises as shown in Figure 1: in order to the mounting plate 41 of mounting sheet material 11, this sheet material 11 is maintained at semiconductor chip is carried out on the ring-shaped frame after the cutting processing, or is arranged in the thin slice pallet; Sheet material carrying mechanism 42 with sheet material 11 absorption maintenances and carrying; And relay and the guide plate 43 accepting to carry the sheet material 11 that comes and hand to suction head 17.
Sheet material carrying mechanism 42 comprises: the movable framework 45 that can move before and after on the guide rail 44 that extends along the Y direction of device base station 1; The movable table 47 that can move to level (Y) direction along guide rail 46 towards the front of this movable framework 45, and, the adsorption head 48 of adsorbable maintenance sheet material 11 movably disposed on this movable table 47 up and down.That is to say that the sheet material 11 that is positioned in the assigned position on the mounting plate 41 is adsorbed 48 absorption and keeps, and is delivered to relay 50, is delivered to guide plate 43 then
Next, referring to figs. 1 through Fig. 6 the action of coupling device with said structure is described.In addition, present embodiment has illustrated from the inside of ring-shaped frame keeping in the central semiconductor chip to carry out cutting processing by adhesive tape, will a plurality ofly being that projected electrode is positioned at surperficial state, promptly the face up sheet material 11 of state is installed to situation on the resin substrate of sheet.At this moment, from ring-shaped frame absorption maintenance sheet material 11 time, the back side transfer printing of sheet material 11 has resinoid.
At first, before the mounting plate 6 of substrate feed unit 2, the main substrate mounting that is carved with the reference graduation that is associated with the installation position of substrate W is carried out position alignment in mounting plate and utilization pin 9 in mounting.Then, utilize carrying mechanism 7 carrying main substrates, with the substrate holder 14 of its mounting in installation unit 3, make installation unit 3 and Identification Division 13 actions simultaneously, Projection Division 38 in the opening that is admitted to suction head 17 maps out the reference graduation on the main substrate successively, and its view data is taken into from ccd video camera, by ccd video camera 37, each driving shaft (X of substrate holder 14 grades, Y, Z) coordinate and each the driving shaft (X that tries to achieve according to view data, Y, Z) coordinate is tried to achieve ccd video camera 37 and the dependency relation of each, and is stored in the device body as correlation function.
Next, to the processing of sheet material 11 is installed as the substrate W of mounting object.At first, at the framework that is provided with on the mounting plate 41 of sheet material feed unit 4 in order to the ring-type of the semiconductor chip after keeping being cut processing.Then, make the shutter door 5 of substrate feed unit 2 open, will put on mounting plate 6 after the substrate W contraposition, shutter door 5 is closed.After shutter door 5 was closed, adsorption plate 9 moved, and the relative position decline at substrate W keeps substrate W and is carried to substrate holder 14 from surface adsorption.
After adsorption plate moved to the top of substrate holder 14, adsorption plate 9 descended, and makes the back side and substrate holder 14 butts of substrate W, removes the absorption of adsorption plate side then.The adsorption plate of removing after adsorbing 9 returns position of readiness.When the absorption of adsorption plate is disengaged, make the absorption action of substrate holder 14 keep substrate W with absorption.
When this substrate W is carried to substrate holder 14, sheet material 11 is consigned to the suction head 17 of installation unit 3 from sheet material feed unit 4.Particularly, the movable framework 45 and the movable table 47 that are equiped with adsorption head 48 are moved along level (X, Y) direction, the sheet material of stipulating 11 is kept with the state absorption that faces up.The adsorption head 48 that absorption maintains sheet material 11 utilizes the right-hand member of movable table 47 in figure to move and sheet material 11 is consigned to relay 50, so relay 50 is delivered to sheet material 11 on the sliding panel 43.
The movable table 47 that receives sheet material 11 moves to the position of paying sheet material 11 to suction head 17 along guide rail.
Utilize the position that sheet material 11 is moved to installation along guide rail 24 of moving of movable table 25.Suction head 17 will be carried to the sheet material 11 absorption maintenances of installation site by sliding panel 43.
Be positioned in advance suction head 17 opening Projection Division 38 as shown in Figure 6, to mark in the alignment mark R1 of substrate W and 2 protruding R2 of diagonal position of being positioned at sheet material 11 as alignment mark, shine upon on the 1st and the 2nd speculum 39a, the 39b that constitute pair of right and left, the alignment mark R1 on right side among the figure of substrate W is projected on a side the ccd video camera 37, the alignment mark R1 in left side among the figure of substrate W is projected on the opposing party's the ccd video camera 37.
Then, the alignment mark R2 on right side among the figure of sheet material 11 is projected on a side the ccd video camera 37, the alignment mark R2 in left side among the figure of sheet material 11 is projected on the opposing party's the ccd video camera 37.
In addition, control part 29B makes movable platen 15 move along level (Y) direction according to this corrected value, and movable table is moved along level (X) direction, and makes suction head 17 around Z axle rotation (θ), to aim at.
After finishing aligning, make actuator action make suction head 17 descend, sheet material 11 is urged to the installation position of substrate W.At this moment, utilize control part 29A to make the pressure of the balancing gate pit of cylinder keep certain, so sheet material 11 is applied in set pushing force.In addition, in pushing, the heater that is built in substrate holder 14 heats the adhesive at the back side of sheet material 11, to promote polymerization reaction.Then, in case the polymerization reaction of adhesive is finished, suction head 17 is returned the position of readiness of top.After polymerization reaction was finished, sheet material 11 was fixed in substrate W.
After this a series of action has been carried out in the installation position of all sheet materials 11 on the substrate W, adsorption plate 9 moves, move to substrate holder 14, the substrate W absorption that sheet material 11 is installed is kept and is carried to the mounting plate 6 of substrate feed unit 2.If this substrate is taken out from substrate feed unit 2, a series of processing that then sheet material 11 are mounted to substrate W finish.
In the coupling device of above-mentioned present embodiment, suction head 17 is rotated around the axle center, therefore need not to make substrate W rotation greater than sheet material 11.In other words, because the radius of turn of suction head 17 less than the radius of turn of the substrate W of square or rectangle, therefore can make equipment miniaturization.In addition, advanced and retreat in the opening of suction head 17 with the alignment mark of identification substrate W and sheet material 11 in the Projection Division, therefore can make optic imaging conditions keep certain, and, can will 37 keep the image projection of certain distances from speculum to ccd video camera to ccd video camera.Consequently, can not be subjected to the influence of variation of the projection image of the prism that changes with projection angle etc., therefore the alignment mark that is projected on the ccd video camera 37 does not deform, can be correctly by identification, thus prevent setup error.
In addition,, make the 1st and the 2nd speculum 39a, 39b and ccd video camera 37 individual configuration, therefore can position processing abreast according to the view data of each ccd video camera 37 for the alignment mark of indivedual identification substrate W and sheet material 11 in the Projection Division.That is to say,, can improve installation rate by localization process is carried out parallel processing.In addition, at this moment, when the distance of the alignment mark of substrate W and sheet material 11 is far away, can bring into play function effectively.
In addition, linkage 32 utilizes the angle on the concentric circles at guiding push rod centers to detect the scale plate 35 and the encoder 36 of usefulness, can not be subjected to the loss error that deterioration caused etc. of linkage 32 to carry out high-precision Spin Control with influencing.In addition, owing to only make the partial rotation of suction head 17, can make rotating mechanism miniaturization and lightweight.
In addition, the present invention is not limited to the foregoing description, can carry out following distortion.
(1) in the foregoing description, movable platen 15 is moved along level (Y) direction, yet it is moved along directions X.At this moment, compare, mobile radius is reduced with making substrate W rotation.
(2) in the foregoing description,, make the 1st and the 2nd speculum 39a, 39b and ccd video camera 37 individual configuration, yet also can adopt single structure for the alignment mark of indivedual identification substrate W and sheet material 11 in the Projection Division.In addition, when adopting single structure, preferably sheet material 11 is less, and substrate W and the more approaching situation of alignment mark.
(3) thin slice erecting device of the present invention comprises in order to the simple assembling device of installing thin slice and the device with various forms such as coupling device of heating and pressurizing operation.
(4) among the embodiment, thin slice 2 is accommodated in the thin slice pallet with the state of facing up, however the present invention be not limited thereto, also can under state, it be supplied with facing up wafer cutting.
(5) the identification member is not defined as ccd video camera 37, can use CMOS or camera tube yet.
Utilize possibility on the industry
In sum, the present invention is applicable to the sheet materials such as electronic unit is mounted to by glass or resin On the workpiece that substrate etc. consist of.
Claims (11)
1, a kind of coupling device in order to sheet material is installed on the workpiece that remains on the workpiece retaining member, is characterized in that, comprising:
Suction head, this suction head comprises: be the case shape and at least the framework of the part of side and lower aperture and the lower aperture that is installed on described framework in order to keep the transparent thin slice retaining member of described sheet material;
The identification member, this identification member is advanced and retreat in the opening of the framework side of described suction head, identification is carried out in the reference position of the workpiece that sees through described thin slice retaining member and keep to the sheet material that kept by described thin slice retaining member with by described workpiece retaining member, and described reference position is in order to the installation position of identification sheet material;
Make 1st drive member of described suction head around the center longitudinal axis rotation of the sheet material that is kept;
Make the 2nd drive member of described suction head and the lifting relatively of described workpiece retaining member;
Make described suction head and described workpiece retaining member the 3rd drive member that moves of along continuous straight runs relatively; And
Detect relative position skew between the reference position of described sheet material and workpiece and described the 1st drive member of drive controlling and the 3rd drive member according to the identification result of described identification member proofreading and correct the control member of its offset,
Described identification member is made of 2 identification members in order to the reference position of the reference position of the described sheet material of identification and described workpiece;
In the front side of the advance and retreat direction of described 2 identification members, have reference position with described sheet material and described workpiece and be projected in projection means on the described identification member respectively,
It is characterized in that described projection means comprises: 1 couple the 1st reflective mirror that maps out the reference position of the reference position of described sheet material and described workpiece; And will be mapped in the picture reflection of reference position on described the 1st reflective mirror and be projected in 1 couple the 2nd reflective mirror on the described identification member.
2, coupling device as claimed in claim 1 is characterized in that,
Described identification member is a ccd video camera.
3, coupling device as claimed in claim 2 is characterized in that,
The reference position of described sheet material and the reference position of described workpiece are arranged on 2 place's alignment marks in two bights separately respectively,
The described alignment mark in two bights of one side is mapped on a side the 1st reflective mirror, and utilize a side the 2nd reflective mirror reflection and be projected on a side the ccd video camera, the alignment mark in two bights of the opposing party is mapped on the opposing party's the 1st reflective mirror, and utilizes the opposing party's the 2nd reflective mirror reflection and be projected on the opposing party's the ccd video camera.
4, coupling device as claimed in claim 1 is characterized in that,
The reference position of described sheet material is the projection that forms on the sheet material of installing with heads state.
5, coupling device as claimed in claim 1 is characterized in that,
Described the 2nd drive member makes the lifting between active position that sheet material is mounted to the substrate that constitutes described workpiece and the position of readiness above it of described suction head.
6, coupling device as claimed in claim 1 is characterized in that,
Described the 3rd drive member makes described suction head move with respect to the face along continuous straight runs of the substrate that constitutes described workpiece.
7, coupling device as claimed in claim 1 is characterized in that,
Be formed with the adsorption hole of the described sheet material of absorption on the described thin slice retaining member.
8, coupling device as claimed in claim 1 is characterized in that,
Described the 2nd drive member is an actuator, is included in to slide mobile piston in the cylinder and from the extended push rod of the front end of this piston, described piston can rotate around the axle center in cylinder,
Utilize linkage that the push rod and described the 1st drive member of the cylinder of described the 2nd drive member are linked, and the actuating force of the 2nd drive member is transformed to described the 1st rotation of driving component power.
9, coupling device as claimed in claim 8 is characterized in that,
Have guider on the outer peripheral face of described push rod,
Described linkage comprises: 2 connecting rods; And
With the flexure operation of described 2 connecting rods company's joint part of two connecting rods is slided so that the length of two connecting rods becomes certain flexible guider.
10, coupling device as claimed in claim 8 is characterized in that,
Scale plate with the front end that is fixed in the connecting rod that links with described push rod side,
And also comprise: in order to the detection means of detection with the anglec of rotation of the scale plate of the rotation interlock of described connecting rod; And
The control member that described suction head is positioned according to the testing result of described detection means.
11, coupling device as claimed in claim 1 is characterized in that,
Described control member utilization has the main substrate of the scale plate that is associated with the installation site of sheet material, try to achieve the dependency relation and the storage of the position information of each installation site that the identification member picked out and the driving shaft that described the 1st to the 3rd drive member is had in advance
When sheet material is mounted to described workpiece, utilize of the dislocation of each drive member of dependency relation drive controlling with the driving shaft of offsetting each drive member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005160071 | 2005-05-31 | ||
| JP160071/2005 | 2005-05-31 |
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| CN101176197A CN101176197A (en) | 2008-05-07 |
| CN100565829C true CN100565829C (en) | 2009-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006800162419A Active CN100565829C (en) | 2005-05-31 | 2006-05-25 | Coupling device |
Country Status (5)
| Country | Link |
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| JP (1) | JP5065892B2 (en) |
| KR (1) | KR101245995B1 (en) |
| CN (1) | CN100565829C (en) |
| TW (1) | TWI368466B (en) |
| WO (1) | WO2006129547A1 (en) |
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| KR100933353B1 (en) * | 2008-01-25 | 2009-12-22 | 주식회사 탑 엔지니어링 | Position sensing device of bonding equipment and its manufacturing method |
| TWI381200B (en) * | 2008-11-11 | 2013-01-01 | Au Optronics Suzhou Corp | Alignment inspection method and apparatus |
| CN103367175B (en) * | 2013-07-02 | 2015-08-19 | 华中科技大学 | A kind of multiple degrees of freedom bonding head for flip-chip |
| KR101510815B1 (en) * | 2013-12-26 | 2015-04-10 | 세광테크 주식회사 | Imaging device and imaging method |
| JP6724421B2 (en) * | 2016-03-02 | 2020-07-15 | Tdk株式会社 | Component mounting apparatus and mounting method |
| CN108511381B (en) * | 2017-02-28 | 2023-05-23 | 韩美半导体株式会社 | Bonding apparatus and control method thereof |
| KR102430480B1 (en) * | 2017-10-19 | 2022-08-08 | 세메스 주식회사 | Apparatus and method of bonding dies |
| JP2019102771A (en) | 2017-12-08 | 2019-06-24 | アスリートＦａ株式会社 | Electronic component mounting device and electronic component mounting method |
| KR102272618B1 (en) * | 2020-01-03 | 2021-07-05 | 주식회사 제이스텍 | Vertical Alignment and bonding of display panel and COF |
| WO2024023926A1 (en) * | 2022-07-26 | 2024-02-01 | ヤマハ発動機株式会社 | Surface mounter and surface mounting method |
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| JP3620868B2 (en) * | 1994-03-07 | 2005-02-16 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| US6203082B1 (en) * | 1999-07-12 | 2001-03-20 | Rd Automation | Mounting apparatus for electronic parts |
| WO2002071470A1 (en) * | 2001-03-02 | 2002-09-12 | Toray Engineering Co., Ltd. | Chip mounting method and apparatus therefor |
| JP3680785B2 (en) * | 2001-11-15 | 2005-08-10 | 松下電器産業株式会社 | Electronic component bonding apparatus and bonding method |
| JP2004006467A (en) * | 2002-05-31 | 2004-01-08 | Osaki Engineering Co Ltd | Parts mounting apparatus of panel or substrate |
| JP2004031868A (en) * | 2002-06-28 | 2004-01-29 | Toray Eng Co Ltd | Mounting method and mounting apparatus |
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2006
- 2006-05-25 WO PCT/JP2006/310446 patent/WO2006129547A1/en active Application Filing
- 2006-05-25 CN CNB2006800162419A patent/CN100565829C/en active Active
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| Publication number | Publication date |
|---|---|
| JPWO2006129547A1 (en) | 2008-12-25 |
| CN101176197A (en) | 2008-05-07 |
| KR20080007349A (en) | 2008-01-18 |
| TW200708213A (en) | 2007-02-16 |
| TWI368466B (en) | 2012-07-11 |
| KR101245995B1 (en) | 2013-03-20 |
| WO2006129547A1 (en) | 2006-12-07 |
| JP5065892B2 (en) | 2012-11-07 |
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