KR101510815B1 - Imaging device and imaging method - Google Patents

Abstract

The present invention relates to an image device for an inline bonding device, capable of imagining an inspection object with two alignment marks which are separated with a preset distance. The present invention includes two imaging units which are arranged to be overlapped with a preset vertical step and face each other in a horizontal direction to independently obtain the image about a region including each alignment mark. Thereby, the defective rate of a product is minimized while automating a bonding process of a panel and a semiconductor chip at high speed by accurately checking and imaging the alignment mark of the panel which is the inspection object.

Description

[0001] IMAGING DEVICE AND IMAGING METHOD [0002]

The present invention relates to an imaging apparatus and an imaging method. More particularly, the present invention relates to an image pickup apparatus and an image pickup method for picking up an alignment state of semiconductor chips and panels for bonding them, and an inline bonding apparatus for supplying semiconductor chips picked up according to such image pickup apparatuses and image pick- .

In recent years, demand for high-density semiconductor packages has also increased as portable electronic devices such as mobile phones, notebooks, tablet PCs, and navigation devices are rapidly spreading.

In order to manufacture such a high-density semiconductor package, a TCP (Tape Carrier Package) system in which semiconductor chips as a plurality of integrated circuit elements are mounted on a single panel in a high density has been mainly used. Techniques for mounting a semiconductor chip on a chip on board (COB), a chip on glass (COG), a film on glass (FOG), or a film on film (FOF)

A process of attaching an anisotropic conductive film to a cleaned panel according to the semiconductor chip mounting technique and arranging COF (Chip On Film or Chip On Flex) semiconductor chip on the attached anisotropic conductive film to perform preliminary bonding, An OLB (Outer Lead Bonding) type bonding apparatus for bonding a semiconductor chip to a film without creating a separate device hole by developing a main bonding process by applying pressure to the chip has been developed.

In order to align the alignment between the semiconductor chip and the panel in the bonding process performed in such a bonding apparatus, an image pickup apparatus having a structure in which two image pickup units implemented with a camera having an optical unit are horizontally opposed to the lower portion of the bonding apparatus .

However, in such an image pickup apparatus that is horizontally disposed, there is a limit in the distance that the two image pickup sections facing each other can approach each other due to the mechanical configuration of the camera constituting the image pickup section. Further, in the case of a small panel, improvement is required so that the minimum distance of the alignment mark can be correctly recognized and picked up.

Accordingly, an object of the present invention is to provide an image pickup apparatus and an image pickup method so that two image pickup sections of an image pickup apparatus used in an in-line bonding apparatus can accurately identify and capture an alignment mark such as a panel, which is an object to be inspected.

The present invention provides an imaging device and an image sensing device used in an in-line bonding device for accurately and accurately detecting an alignment mark such as a panel to be inspected and automating the bonding process of the semiconductor chip, And a method thereof.

The object is achieved by an image pickup apparatus for picking up an inspection object having two alignment marks spaced apart from each other by a predetermined distance, the image pickup apparatus comprising: And an image pickup device having two image pickup portions arranged so as to overlap each other with the upper and lower steps of the image pickup device.

Here, the two image sensing units are arranged in a first horizontal direction below the object to be inspected, and an image of a first region including one of the alignment marks is incident on one end in the first horizontal direction, A first image pickup section having a first reflection section to be converted and output and a first image acquisition section to acquire an image emitted from the first reflection section at the other end in the first horizontal direction; And an image of a second region including the other one of the alignment marks is incident on one end of the second horizontal direction so as to be converted and emitted at a right angle And a second image pickup unit having a second reflection unit and a second image acquisition unit for acquiring an image emitted from the second reflection unit at the other end in the second horizontal direction.

Here, the image pickup apparatus may be arranged so that at least one of the first horizontal direction and the second horizontal direction with respect to at least one of the image pickup sections And a control unit for controlling the amount of movement of the second lens group to the second lens group.

Here, the control unit may adjust the amount of movement such that the first imaging unit and the second imaging unit are spaced apart from and close to each other in the horizontal direction facing each other.

Here, it is preferable that when the first imaging unit and the second imaging unit are arranged so as to be close to each other without being overlapped with each other, the horizontal distance between the two optical axes of the first imaging unit and the second imaging unit is two And when it is judged that it is larger than the minimum distance of the alignment mark, it adjusts the amount of movement in the horizontal direction so as to overlap with the other one imaging unit at the time of capturing the image of the one imaging unit, The distance may be adjusted to be less than or equal to the minimum distance.

Here, in the case where the first imaging unit and the second imaging unit are disposed in close proximity to each other without being overlapped with each other, the horizontal distance between the two optical axes of the first imaging unit and the second imaging unit is Can be made larger than the minimum distance of the alignment marks.

Here, when the first imaging unit and the second imaging unit overlap each other and are arranged close to each other, the horizontal distance between the two optical axes of the first imaging unit and the second imaging unit is two It can be made equal to or smaller than the minimum distance of the alignment mark.

Here, the image pickup apparatus may make the size of the image of the first area and the size of the image of the second area equal to each other.

Here, the imaging device may cause each of the alignment marks to be disposed at the center position of the first area and the second area.

Here, the imaging device may be arranged so that the respective alignment marks are aligned with the optical axes of the first imaging section and the second imaging section.

According to another aspect of the present invention, there is provided an imaging method for imaging an object to be inspected having at least two alignment marks spaced from each other, the method comprising: providing a first imaging section arranged in a first horizontal direction below the object to be inspected; ; Providing a second image sensing unit spaced apart from the first sensing unit by a predetermined vertical distance and arranged in a second horizontal direction so as to be superimposed on the first sensing unit; Determining whether a distance between two alignment marks of the inspection object is equal to a predetermined minimum distance; When the distance between the two alignment marks of the inspection object is equal to or smaller than a preset minimum distance, when one of the two imaging units is overlapped with another, Adjusting the amount of movement in at least one of the first horizontal direction and the second horizontal direction so as not to be disturbed; The image for the first region including one of the alignment marks incident on the upper portion of the first image sensing portion is converted to a right angle and the image is acquired by the first image acquiring portion of the first image sensing portion provided at the other end in the first horizontal direction ; The image for the second area including the other one of the alignment marks incident on the second imaging unit is converted to a right angle and the second image obtained by the second image acquiring unit of the second imaging unit provided at the other end in the second horizontal direction And a step of acquiring the image data.

Here, the moving amount adjustment step may include a step of adjusting the amount of movement such that the first imaging unit and the second imaging unit are spaced apart from and close to each other in the horizontal direction opposite to each other with respect to the inspected object.

Here, in the image pickup method, the image of the first area and the image of the second area may have the same size.

Here, in the imaging method, each of the alignment marks may be disposed at a center position of the first area and the second area.

Here, in the imaging method, each of the alignment marks may be arranged to coincide with the optical axis of the first imaging unit and the second imaging unit.

Here, the determining may be such that, when the first imaging unit and the second imaging unit are disposed in close proximity without overlapping each other, the horizontal distance between the two optical axes of the first imaging unit and the second imaging unit is And determining whether the horizontal distance between the two optical axes is larger than the minimum distance between the two alignment marks of the inspected object, Adjusting the amount of movement in the horizontal direction so as to overlap with another imaging unit when acquiring an image of one imaging unit so that the horizontal distance between the optical axes of the two imaging units is less than or equal to the minimum distance .

According to another aspect of the present invention, there is provided a plasma display panel comprising: a heat supply unit for supplying heat required for bonding a panel and a semiconductor chip; A compression head that receives heat from the heat supply unit and compresses the semiconductor chip on the panel; A light irradiating unit provided above or below the panel to irradiate light to obtain an image for alignment of the semiconductor chip with the panel; And an imaging device that receives the panel and the semiconductor chip as an object to be inspected and picks up the object to be inspected.

According to the imaging device and the imaging method of the present invention, it is possible to accurately recognize and capture an alignment mark such as a panel, which is an object to be inspected, of two imaging units of the imaging apparatus used in an inline bonding apparatus.

According to the imaging device and the imaging method of the present invention, it is possible to automate and speed up the bonding process of the panel and the semiconductor chip by accurately checking and photographing the alignment mark such as the panel to be inspected in the inline bonding device, .

Fig. 1 is a schematic view of an image pickup device arranged horizontally opposite to each other according to an embodiment of the present invention,
Fig. 2 is a schematic view of a minimum distance imaging of an alignment mark according to the imaging device of Fig. 1,
Fig. 3 is a schematic view of an image pickup device disposed at an upper and lower stepwise position in the horizontal direction and facing each other according to an embodiment of the present invention,
4 is a schematic view showing the structure of the one-side image pickup unit according to the embodiment of the present invention in detail,
5 is a configuration diagram of an in-line bonding apparatus including an image pickup apparatus according to an embodiment of the present invention,
6 is a schematic view showing an alignment state of the object to be inspected,
7 is a flowchart showing an imaging method according to an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an imaging apparatus and method according to an embodiment of the present invention and an in-line bonding apparatus using the same will be described in detail with reference to the accompanying drawings. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

Fig. 1 schematically shows an imaging apparatus used in an in-line bonding apparatus 100 (see Fig. 5) according to an embodiment of the present invention. As shown in Fig. 1, the image capturing apparatus 300 is composed of two image capturing sections 301 and 302 arranged at the lower part of the in-line bonding apparatus. The alignment marks m ₁₀ and m ₂₀ of the panel P are used to check the alignment state of the inspection object such as the panel P provided in various specifications placed on the stage S of the in- (Hereinafter referred to as a FOV area, FOV10, and FOV20) of each imaging unit, and captures the corresponding area in each imaging unit. Here, the size of the FOV area corresponds to the size of an image pickup surface of an image sensor or the like provided in an image obtaining section of each image pickup section described later.

At this time, the separation distance (H ₁₀ ) between the two imaging units is the minimum distance that can be minimized because of the mechanical limitations of the imaging unit. For example, the closest distance (H _{10 min} ) between the two imaging units can be maintained at 1 mm. Accordingly, the separation distance between the alignment mark of the panel (P) object to be inspected (dm ₁₀₎ is less than a predetermined minimum distance may be difficult to perform an appropriate image capture for the object to be inspected.

That is, the alignment marks on the panel _{(P) (m 10, m} 20) is preferably arranged at a central location available in each imaging unit FOV area, the center positions of the respective FOV region recognition reference point (f _10, f ₂₀₎ Lt; / RTI > In particular, since the pitch between terminal terminals provided on the panel P to be inspected has micrometer units, it is difficult to accurately recognize when the alignment mark of the panel P is out of the center position of the FOV region, It is necessary to minimize the distortion according to the inherent optical specifications and characteristics.

Therefore, since the distortion of the image to be captured can be minimized in the vicinity of the center position of the FOV region, that is, in the vicinity of the recognition reference point (f ₁₀ , f ₂₀ ), it is preferable that the respective alignment marks are arranged to coincide with the center position of the FOV region. This is due to the optical structure in which the center position of the FOV area is aligned along the optical axes L10 and L20 which are the centers of the light passing through the optical parts provided in the respective image pickup parts.

Accordingly, the separation distance dm ₁₀ of the alignment marks m ₁₀ and m ₂₀ provided on the panel P in Fig. 1 is equal to the distance df ₁₀ between the recognition reference points f ₁₀ and f ₂₀ of the FOV region And can be picked up.

And the distance between the contrast and the panel (P) of the 2 1, more spacing of the alignment mark on a small panel (P) (dm ₁₁₎ is, two FOV area recognition reference point of the _{(FOV 10, FOV 20) (} df ₁₀ , for example, df ₁₀ is 9 mm, and dm ₁₁ is 6 mm. In this case, since the alignment mark deviates from the recognition reference point as described above, distortion of the captured image or the like It may be difficult to accurately recognize the alignment mark.

In such a case, it is preferable that at least one of the image pickup units is arranged so as to be inclined with respect to the horizontal direction so as to adopt a reflective portion such as a common prism, or to change the optical characteristics of the image pickup portion, The alignment mark can be configured to match the recognition reference point of each FOV area.

In addition, as in the other embodiment of the present invention shown in Fig. 3, a structure in which two imaging units arranged in the horizontal direction have upper and lower steps and can overlap each other can be adopted.

3, a predetermined minimum distance dm _min with respect to the separation distance dm ₁ of the alignment marks of the panel P or the like to be inspected is arranged to be opposed horizontally in accordance with the arrangement structure of the imaging device as shown in Fig. The distance between the two reference points of the FOV area is smaller than the distance (df ₁₀ ) between the recognition reference points of the FOV area due to the interval in which the two image pickup parts have recently to be secured by the mechanical limitations of the respective plates, Fig. 6 shows a structure of an image pickup apparatus for obtaining an image for a mark.

The imaging apparatus 200 according to the embodiment of the present invention shown in Fig. 3 is configured by two imaging units 201 and 202 disposed under the in-line bonding apparatus 100 in the same manner as the imaging apparatus 300 shown in Fig. 1 . The alignment marks m ₁ and m ₂ of the panel P are used to check the alignment state of the panel P or the like which is provided in various specifications placed on the stage S of the in- Is taken as the FOV regions FOV ₁ and FOV ₂ of the respective image pickup units, and the corresponding regions are picked up by the respective image pickup units.

Here, the image sensing device 200 with two image pick-up unit (201, 202) that make up of Figure 3, the image of the area including respective alignment marks (m _1, m ₂₎ of the panel (P) FOV area (V ₁ ) so as to be independently obtained with the vertical and horizontal steps (FOV ₁ , FOV ₂ ).

One imaging unit (hereinafter referred to as "first imaging unit" 201) of the two imaging units is disposed in the first horizontal direction below the panel P or the like to be inspected. In the first imaging unit, an image of a first region including one (m ₁ ) of alignment marks is incident on the FOV region (FOV ₁ ) at _one end in the first horizontal direction, A first image acquiring unit 210 may be implemented with an image sensor such as a CCD or CMOS for acquiring an image emitted from the first reflecting unit 210 at the other end in the first horizontal direction, (See FIG. 4). A first optical unit 230 (see FIG. 4) having a predetermined specification and optical characteristics may be disposed between the first reflecting unit 210 and the first image obtaining unit 220.

The other imaging unit (hereinafter, referred to as "second imaging unit") 202 of the two imaging units is spaced apart from the first imaging unit 201 by a predetermined upper and lower steps V ₁ , Is disposed in the second horizontal direction so as to be superimposed on the first horizontal plane (201). Here, the second horizontal direction is parallel to the first horizontal direction, but is provided in a direction opposite to the first horizontal direction.

The second image sensing unit 202 may have a second reflection unit and a second image acquisition unit similar to the first image sensing unit 201 and a second optical unit may be disposed between the second reflection unit and the second image acquisition unit. have.

That is, in the second imaging unit 202, an image of the second area including one (m ₂ ) of the alignment marks is incident on the FOV area FOV ₂ at one end in the second horizontal direction, And a second image acquiring unit is provided at the other end of the second horizontal direction, which can be implemented by an image sensor such as a CCD or CMOS, which acquires an image emitted from the second reflecting unit.

Here, the second optical portion of the second imaging unit 202 may be provided so as to have different specifications and optical characteristics from the first optical portion 230. The FOV areas FOV ₁ and FOV ₂ provided by the two image pickup units are provided in the same size as each other. However, the FOV areas FOV ₁ and FOV ₂ provided by the two image pickup units are provided in the same size, Working distance (W / D) to the upper surface (W / D) is different from W / D ₁ and W / D ₂ .

When the second optical section having the same specification and optical characteristics as those of the first optical section 230 provided in the first image pickup section 201 is provided in the first image pickup section 202, Since the D ₂₎ is far less than the first optical unit working distance (W / D ₁₎ a region including the alignment mark (m ₂₎ of the panel (P) is secured by a second optical portion FOV region (FOV ₂₎ is, The area including the alignment mark m ₁ of the panel P secured by the FOV area FOV ₁ of the first optical part.

Therefore, the accumulation of the regions including the alignment marks of the panel P included in the two FOV regions of the same size is different, which may interfere with the recognition of the fine pitch of the terminal terminals formed on the panel P. [

Despite the operating distances (W / D ₁ , W / D ₂ ) which are different from each other as described above, in order to secure the FOV area in which the area including the alignment marks of the panel P are equal to each other, The first image sensing unit 201 arranged close to the image sensing unit P is provided with an optical unit having a relatively wide angle characteristic as compared with the second image sensing unit 202, 2 imaging section 202 may be provided as an optical section having a relatively telephoto characteristic in contrast to the first imaging section 201. [ Further, an optical element may be further provided on the incident side of the reflection portion of each image pickup portion.

Of course, since the center positions of the FOV areas FOV ₁ and FOV ₂ , that is, the distortion of the image captured at the recognition reference points f ₁ and f ₂ are minimized, the respective alignment marks m ₁ and m ₂ are FOV It is preferable that they are arranged so as to coincide with the center positions of the regions. Further, the center position of the FOV area is arranged so as to coincide with the optical axes (L1, L2) of the optical part provided in each imaging section.

Accordingly, the separation distance (dm ₁₎ is a base point recognition of the respective FOV region of the alignment mark (m _1, m ₂₎ corresponding to FIG on (dm _min) the predetermined minimum distance is provided on the third panel (P) (f _1, f ₂ ) of the _first lens group G1.

In the imaging apparatus of Fig. 3, the distances between the recognition reference points of the latest dish in the range where the two imaging units opposed horizontally with the upper and lower steps are not overlapped with each other are as follows: Can be set the same.

Accordingly, if the alignment marks (m _1, m ₂₎ spaced distance (dm ₁₎ a pre-set minimum distance (dm _min) of the panel (P) in Fig. 3, with the bottom step difference (V ₁₎ Horizontal The distance df ₁ between the recognition reference points f ₁ and f ₂ is adjusted to correspond to the minimum distance dm _min of the alignment mark by adjusting the amount of movement so that the two imaging units 201 and 202 opposed to each other in the direction . The moving amount of the image sensing unit may be realized by a control unit 400 (see FIG. 5) provided in the inline bonding apparatus 100. FIG.

3, the control unit 400 controls the operation of the image pickup unit (for example, the second image pickup unit 202) of either the first image pickup unit or the second image pickup unit 201 or 202, At least either one of the first horizontal direction and the second horizontal direction with respect to any one of the imaging units 201 or 202 so as not to interfere with another one of the imaging units (e.g., the first imaging unit 201) The amount of movement in one direction can be adjusted, and the amount of movement of the two imaging units can be adjusted in the same manner.

In addition, any one of the two imaging units constituting the imaging device 200 of Fig. 1 may be adjusted so as to have a step in the vertical direction and the moving amount of the imaging unit in the horizontal direction may be adjusted, Can be implemented. At this time, it is possible to adopt a structure in which an image pickup section having an optical section having an optical characteristic of any one of the two image pickup sections, for example, a magnification corresponding to the operation distance, can be exchanged.

On the other hand, the structure of one of the imaging units included in the imaging apparatus disclosed in the embodiments of the present invention will be described in detail with reference to FIG.

The image sensing unit of FIG. 4 shows the first image sensing unit 201 arranged in the first horizontal direction in more detail. Here, each of the imaging units 301 and 302 shown in Fig. 1 is arranged in the opposite horizontal direction and provided with the same specifications, and each of the imaging units 201 and 203 shown in Fig. Each of the imaging units 201, 202, 301, and 303 is mechanically arranged in the first imaging unit 210 of FIG. 4, except that the imaging units 201, 202, 301, and 303 are arranged and provided with different specifications (e.g., differences in working distance, It is not necessary to repeatedly describe each imaging unit.

When the first reflecting portion 210 of the first image pickup portion 201 of FIG. 4 is disposed horizontally opposite to the image pickup device of FIG. 1, the first reflecting portion 210 is spaced apart from the second reflecting portion of the second image pickup portion by a predetermined distance H ₁₀ , and the minimum value of the separation distance H ₁₀ can be set in accordance with the mechanical limitations of the image pickup section.

Here, the reflector 211 formed of the prism, mirror, or the like disposed in the first reflector 210 may be provided in a predetermined (predetermined or predeterminable) range from the end of the reflector 211 in order to reduce the error of irregular reflection of the image corresponding to the incident FOV region, Provide the safe distance (e ₁ ) of the dimension.

In addition, the reflector 211 disposed in the first reflector 210 has a predetermined arrangement interval t ₁ with the outer surface of the first reflector 210 in terms of mechanical structure.

The image of the area corresponding to the light ensured by the area of the FOV area, that is, the lateral dimension X and the longitudinal dimension Y is transmitted along the optical axis L1 of the first image sensing unit 201 to the first reflection unit 210, and converted into a right angle and emitted.

4, the incident image of the FOV region is converted into a rectangular image through the reflector 211, passes through the first optical unit 230, and is provided to the first image obtaining unit 220. Therefore, the horizontal dimension X The two ends La and Lb of the light beam L1 can be represented as being bisected (a, a) around the optical axis L1. The vertical dimension (Y) of the FOV region can also be represented corresponding to the horizontal dimension (X).

Thus if according as the closest distance F _10min between the two image pick-up portion FOV area in the imaging device of Figure 1, looking relative to the transverse dimension (X) of the FOV area, safety distance portion first sensing e _{1, the} spacing of the reflector t ₁ , the closest distance between the imaging units H _{10 min} , the safety distance of the second imaging unit (same as e ₁ ), and the arrangement interval of the reflectors (same as t ₁ ).

Formula _{(1): F 10min = 2} * (e 1 + t 1) + H 10min

And when referred to as the closest distance df _min between the two image sensing unit recognizes the reference point in the imaging device of Figure 1, looking relative to the transverse dimension (X) of the FOV area, the value of the above F _10min 2 equally divided values a to 2 plus Value. ≪ / RTI >

Equation (2): df _min = F _{10 min} + 2 * a

In addition, the distance between the distance (F ₁₎ between the FOV area recently plate when also been placed a two-state imaging additional vertical step (V _1), as in the imaging device of the third case where the counter arranged in the horizontal direction two image pick-up portion overlapping each other F _min , it can be expressed as a value excluding the distance (H ₁ ) in which the two image pickup portions are overlapped in the horizontal direction and the closest distance H _10min from the above-mentioned F _10min .

Formula _{(3): F min = F} 10min - (H 1 + H 10min)

Accordingly, the two image pickup section vertically interference imaging FOV region including the alignment mark for the like steps of the panel (P) object to be inspected with a (V ₁₎ in a mutually superimposed condition that make up the imaging device of Figure 3 as described above The range that does not cause the occurrence of the focal length can be set in consideration of the closest distance _Fmin of the FOV area, and based on this, the control unit can adjust the amount of movement of the imaging unit.

On the other hand, the control unit according to the imaging apparatus of the present invention adjusts the amount of movement such that the first imaging unit 201 and the second imaging unit 202 are spaced apart from and close to each other in the horizontal direction opposite to each other with respect to the panel P .

The control unit according to the imaging apparatus of the present invention is configured such that when the first imaging unit 201 and the second imaging unit 202 are arranged so as to be close to each other without overlapping each other, the first imaging unit 201 and the second imaging unit (The same as the interval between f ₁ and f ₂ ) of the FOV area in Fig. 3 is the distance between the two alignment marks m (m) of the panel P _1, may be configured to determine whether or not greater than the minimum distance (dm _min) preset in m _2). here, the large if it is determined, the one of the imaging unit images a different one of the imaging unit when picked up with each other, The horizontal distance between the optical axes of the two imaging units can be adjusted to be less than or equal to a predetermined minimum distance between the alignment marks by adjusting the amount of movement in the horizontal direction so as to overlap.

On the other hand, in the image pickup apparatus according to the embodiment of the present invention, when the first image pickup section and the second image pickup section are arranged close to each other without being overlapped with each other, the horizontal distance between the two optical axes of the first image pickup section and the second image pickup section May be provided larger than the minimum distance of the two alignment marks such as the panel (P). This is also true in the case where the two image pickup units are arranged with a predetermined upper and lower steps.

In the image pickup apparatus of the present invention, when the first image pickup section and the second image pickup section are vertically arranged so as to overlap each other with the upper and lower steps facing each other in the horizontal direction, the horizontal distance between the two optical axes of the first image pickup section and the second image pickup section And may be equal to or smaller than the minimum distance of the two alignment marks such as the panel P as an object to be inspected.

The driving unit, which is not shown for moving the two imaging units in a predetermined direction, may be constituted by a conveying mechanism such as a two-axis conveying mechanism for vertical / horizontal conveyance, a three-axis conveying mechanism, an actuator, (Not shown).

FIG. 5 shows a schematic configuration of an in-line bonding apparatus for bonding a panel and a semiconductor chip using the imaging apparatus according to the embodiment of the present invention described above.

The inline bonding device 100 shown in the figure is an anisotropic conductive film which is attached to the panel P supplied from the outside to the stage S and then anisotropic conductive film attached to the semiconductor chip C A heat supply part 10, a compression head 20 and a light irradiation part 31 for pressing the film toward the panel P. [

The stage S is provided in a lower region of the in-line bonding apparatus 100 to provide a work space in which the panel P and the semiconductor chip C supplied from the outside respectively move to perform a bonding operation. The stage S may be a flat surface for supporting the panel P and a not shown transmitting portion may be seated on the stage S to support the panel P. [

The panel P may include an anisotropic conductive film or the like on which the semiconductor chips are placed on the stage S.

The heat supply unit 10 supplies heat required to perform the bonding process of the panel and the semiconductor chip, and the heat supply unit 10 can be implemented in the form of a heating box.

The pressing head 20 receives heat from the heat supply unit 10 and presses the semiconductor chip C on the panel P. The compression head 20 transfers the heat supplied from the heat supply unit 10 to the panel P and the semiconductor chip C and applies pressure to the semiconductor chip. The pressing head 20 for supplying the semiconductor chip is adjusted in position with reference to the alignment mark of the panel P picked up by the unillustrated conveying mechanism (for example, three-axis conveying device or the like) as described above, The panel P and the semiconductor chip C conveyed by the compression head 20 are accurately aligned and pressed to each other.

The light irradiation unit 31 is provided on the upper side of the panel P and is coupled to at least one of the heat supply unit 10 and the compression head 20. The light irradiation unit 31 irradiates light to the panel P for alignment with the semiconductor chip, And provides illumination for accurately picking up the alignment mark area of the panel P in the apparatus 200, The light irradiating unit 31 may further include a lamp such as an LED for emitting light and a reflector for reflecting the irradiated light.

On the other hand, the other light irradiating unit 32 provided below the panel P illuminates the semiconductor chip supplied from the panel P fixed on the stage S and the pressing head 20, 300 provide illumination necessary to image an image of each alignment mark region. The other light irradiating unit 32 may be realized as a backlight of a known configuration of a Bar type which does not include a reflector.

The clamp 40 is slid up and down to perform a function of fixing the panel P in the second position so that there is no shaking of the panel P located on the stage S.

Unshown transmissive portions are formed in the respective imaging portions 201, 202, 301, and 302 of the image pickup device so as to align the respective alignment marks of the panel P and the semiconductor chip And transmits the light irradiated from the light irradiation units 31 and 32 so as to obtain an image for the region. Here, the transmitting portion may be formed of a transparent quartz or the like, and a vacuum suction hole may be provided on the upper surface thereof by a vacuum mechanism (not shown) so that the panel P can be vacuum-adsorbed and fixed.

Each of the image sensing units 201, 202, 301 and 303 constituting the image sensing apparatuses 200 and 300 is provided in a lower region of the stage S to sense the entry of the panel P, The image of the panel P on the stage S is picked up so that the state of the panel P arranged on the panel P can be aligned. Further, the image pickup devices 200 and 300 can capture an image of the alignment mark area of the semiconductor chip by picking up an image of the semiconductor chip C supplied to the compression head 20.

6 is an enlarged view showing the state of the panel P and the semiconductor chip C which are provided as an object to be inspected in the imaging apparatus according to the embodiment of the present invention and bonded by the inline bonding apparatus. Here, the alignment marks m of the panel P and the semiconductor chip C are accurately aligned with each other, and the alignment mark m can use various geometric shapes in addition to the illustrated + shape.

Hereinafter, an imaging method for an object to be inspected according to an embodiment of the present invention will be described in detail with reference to FIG.

First, a panel P or the like is prepared as an inspection object having two alignment marks (m ₁ , m ₂ ) spaced from each other (S10). At this time, a panel, a semiconductor chip or the like to be inspected may be provided on the stage S of the in-line bonding apparatus 100 using a separate transfer mechanism.

The imaging device for imaging the panel P or the like to be inspected is made up of two imaging sections as described above, and the imaging sections are arranged facing each other horizontally below the examination subject (S20). The first imaging unit 201 of the two imaging units is disposed in the first horizontal direction below the object to be inspected and the second imaging unit 202 is disposed below the first imaging unit 201 at the upper and lower levels V ₁ So as to be opposed to each other in the second horizontal direction so as to be overlapped with the first image sensing unit 201. [

Then, it is determined whether or not the object to be inspected is equal to the panel (P) separation distance (dm ₁₎ a (dm _min) pre-set minimum distance between the alignment marks, such as provided by (S30). It is as described above that an appropriate interval between the two imaging units is maintained to secure an area including an alignment mark in the FOV area to perform accurate imaging.

When the distance between the two alignment marks of the object to be inspected is equal to a preset minimum distance according to the determination result, the two imaging units are overlapped with each other, and when one imaging unit acquires an image, the other imaging unit is not interfered The amount of movement in at least one of the first horizontal direction and the second horizontal direction can be adjusted (S40). This is also true when the distance between the two alignment marks of the object to be inspected is smaller than a preset minimum distance. Further, the formulas necessary to prevent interference between the image pickup units, the predetermined dimensions between the members constituting the image pickup unit, and the like are as described above.

On the other hand, when the distance between the two alignment marks of the object to be inspected is larger than a predetermined minimum distance in accordance with the determination result, at least one of the first horizontal direction and the second horizontal direction (Step S50). [0051] In step S50, At this time, also in the image sensor according to the embodiment of the image pick-up 3 it can be performed by the image pickup unit 2 that have different optical properties while maintaining a predetermined vertical level difference (V _1). Also, as in the embodiment of Fig. 1, it is also possible to use an image pickup apparatus having two image pickup units arranged horizontally without upper and lower steps.

Thereafter, an image for the FOV area is acquired at each imaging unit (S60). That is, the image for the first region including one of the alignment marks incident on the upper portion of the first image sensing unit 201 is converted and emitted at a right angle at the first reflector 210, and the first optical portion 230 And may be acquired by the first image acquiring unit 220 of the first image sensing unit provided at the other end in the first horizontal direction.

The image of the second region including the other one of the alignment marks incident on the upper portion of the second image sensing unit 202 is converted and emitted at a right angle in the second reflection portion and is transmitted through the second optical portion in the second horizontal direction The second image acquiring unit of the second image sensing unit provided at the other end of the second image sensing unit.

Here, it is assumed that the horizontal distance between the two optical axes (L1, L2) of the first imaging unit and the second imaging unit when the first imaging unit and the second imaging unit are disposed in close proximity without overlapping each other (Dm _min ) of the two alignment marks of the object to be inspected.

Here, in the case where it is determined that the horizontal distance between the optical axes of the two image sensing units is larger than the minimum distance of the two alignment marks of the object to be inspected, the step of adjusting the movement amounts of the image sensing units in S40 and S50, Adjusting the amount of movement in the horizontal direction so as to overlap with the other imaging unit so that the horizontal distance between the optical axes of the two imaging units is equal to the minimum distance of the alignment mark, And the like.

The adjustment of the necessary movement amount in the horizontal direction and in the vicinity of each image pickup unit is as described above.

In addition, the image obtained by the imaging apparatus and the imaging method according to the embodiment of the present invention can be recognized by a user using an image processing unit for image processing and a display device for displaying the processed image, which are not shown.

In addition, although the imaging device and the imaging method according to the embodiments of the present invention are described as being applied to the in-line bonding device, it is natural that they can be employed in manufacturing, inspecting and measuring devices for various semiconductors and imaging devices.

Although the present invention has been described in detail with reference to the exemplary embodiments of the present invention, the present invention is not limited thereto and various changes and modifications may be made within the scope of the appended claims. It will be apparent to those skilled in the art that modifications and variations can be made in the embodiments of the present invention without departing from the principles or spirit of the invention. The scope of the present invention shall be determined by the appended claims and their equivalents.

100: inline bonding device 200, 300: imaging device
400: control unit 201: first imaging unit
202: second image pickup unit 210: first reflection unit
220: first image obtaining unit 230: first optical unit

Claims (16)

An imaging apparatus for an in-line bonding apparatus for picking up an inspection object having two alignment marks spaced apart from each other by a predetermined distance,
And at least one of the two image pickup portions is disposed so as to be able to independently acquire an image for an area including the respective alignment marks and overlap each other in a horizontal direction with a predetermined upper and lower steps,
Wherein the two imaging units
A first reflector disposed at a lower portion of the object to be inspected in a first horizontal direction, wherein an image of a first region including one of the alignment marks is incident on one end of the first horizontal direction, A first image capturing unit having a first image capturing unit for capturing an image emitted from the first reflecting unit at the other end in the first horizontal direction,
And a second area including a second one of the alignment marks at a first end in the second horizontal direction, the second area being spaced apart from the first image sensing unit by a predetermined upper and lower steps and overlapping with the first image sensing unit, And a second image capturing unit having a second image capturing unit for capturing an image to be emitted from the second reflecting unit at the other end in the second horizontal direction, . delete The method according to claim 1,
A control unit for adjusting a movement amount of at least one of the imaging units in at least one of the first horizontal direction and the second horizontal direction so that the other imaging unit does not interfere with any one of the imaging units Further comprising: The method of claim 3,
Wherein the control section adjusts the amount of movement such that the first imaging section and the second imaging section are spaced apart from and close to each other in a horizontal direction facing each other with respect to the inspected object. The method of claim 3,
Wherein,
When the horizontal distance between the two optical axes of the first imaging section and the second imaging section is larger than the minimum distance of the two alignment marks of the inspected object when the first imaging section and the second imaging section are arranged so as not to overlap each other And when it is judged that the two images are large, the movement amount in the horizontal direction is adjusted so as to overlap with the other one imaging unit at the time of capturing the images of the one imaging unit, so that the horizontal distance between the optical axes of the two imaging units is smaller than the minimum distance Or equal to each other. The method according to claim 1,
The horizontal distance between the two optical axes of the first imaging section and the second imaging section is larger than the minimum distance of the two alignment marks of the inspected object when the first imaging section and the second imaging section are disposed close to each other without being overlapped with each other And the inspection device. The method according to claim 1,
The horizontal distance between the two optical axes of the first imaging unit and the second imaging unit is equal to or smaller than the minimum distance of the two alignment marks of the inspection object when the first imaging unit and the second imaging unit are disposed close to each other Characterized in that it is small. The method according to claim 1,
Wherein the image of the first area and the image of the second area are the same in size. 9. The method of claim 8,
Wherein each of the alignment marks is disposed at a center position of the first region and the second region. 9. The method of claim 8,
Wherein each of the alignment marks is arranged to coincide with the optical axis of the first imaging unit and the second imaging unit. An image pickup method for picking up an inspection object having at least two alignment marks spaced from each other,
Providing a first imaging unit disposed in a first horizontal direction below the object to be inspected;
Providing a second image sensing unit spaced apart from the first sensing unit by a predetermined vertical distance and arranged in a second horizontal direction so as to be superimposed on the first sensing unit;
Determining whether a distance between two alignment marks of the inspection object is equal to a predetermined minimum distance;
When the distance between the two alignment marks of the inspection object is equal to or smaller than a preset minimum distance, when one of the two imaging units is overlapped with another, Adjusting the amount of movement in at least one of the first horizontal direction and the second horizontal direction so as not to be disturbed;
The image for the first region including one of the alignment marks incident on the upper portion of the first image sensing portion is converted to a right angle and the image is acquired by the first image acquiring portion of the first image sensing portion provided at the other end in the first horizontal direction ;
The image of the second region including the other one of the alignment marks incident on the second imaging unit is converted to a right angle and the second image obtained by the second image acquiring unit of the second imaging unit provided at the other end in the second horizontal direction And acquiring the acquired image data. 12. The method of claim 11,
Wherein the moving amount adjusting step includes a step of adjusting a moving amount such that the first imaging unit and the second imaging unit are spaced apart from and close to each other in a horizontal direction facing each other with respect to the inspected object. 12. The method of claim 11,
Wherein an image of the first area and an image of the second area are equal to each other. 12. The method of claim 11,
And each of the alignment marks is disposed at a center position of the first area and the second area. 12. The method of claim 11,
Wherein each of the alignment marks is arranged to coincide with an optical axis of the first imaging unit and the second imaging unit. 12. The method of claim 11,
Wherein the determining step comprises:
When the horizontal distance between the two optical axes of the first imaging section and the second imaging section is larger than the minimum distance of the two alignment marks of the inspected object when the first imaging section and the second imaging section are arranged so as not to overlap each other And judging whether or not it is possible,
Wherein the moving amount adjusting step comprises:
When it is determined that the horizontal distance between the two optical axes is larger than the minimum distance between the two alignment marks of the inspected object, the amount of movement in the horizontal direction is adjusted so as to overlap with the other imaging unit And adjusting the horizontal distance between the optical axes of the two imaging units to be less than or equal to the minimum distance.

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