TWI753109B - Bonding equipment and control method thereof - Google Patents

Abstract

The invention discloses a bonding device and a control method thereof. The bonding equipment includes: a bonding head to individually adsorb the diced dies; a driver to move the bonding head in a vertical direction and transfer it to a position on the XY plane; a bonding substrate on which the dies that are sucked by the bonding head are mounted , the bonding head includes: a bonding part, vacuum suction die; a first pneumatic pressure part, by selectively applying pneumatic pressure to it and canceling the application of pneumatic pressure to supply buffer power to the bonding part, and its volume is variable according to pressure; second The pneumatic pressure member, being continuously applied with pneumatic pressure, maintains the pneumatic pressure applied to the first and second pneumatic pressure members while transferring the bonding head to a position on the XY plane, and when the bonding head moves vertically downward, at the In a state where the bonding head is spaced apart from the upper portion of the bonding substrate by a predetermined height, the pneumatic pressure applied to the first pneumatic pressure member is removed, and the die sucked by the bonding member is mounted on the bonding substrate.

Description

Bonding equipment and control method thereof

The present invention relates to a bonding apparatus and a control method thereof. More specifically, the present invention relates to a bonding apparatus capable of protecting a die to be bonded, such as a semiconductor wafer, and a control method thereof, and when the bottom surface of the die is immersed into the aid through the bonding member of the bonding apparatus. Bonding equipment can prevent bumps on the bottom surface of the die when it is in flux, or when a fluxed die is mounted on a bonding substrate to bond the die to a substrate such as a printed circuit board damage; bonding equipment capable of moving the die at high speed onto a flux-containing dipping plate or bonding substrate to minimize the processing time required to dipping the die into the flux, thereby maximizing productivity; and bonding The device is able to minimize the shock applied to the die during pick up, while compensating for the rotational inertia of the flipper as the die is picked up and flipped.

For example, in a semiconductor wafer bonding apparatus which is an apparatus for bonding bare chips such as semiconductor wafers, when individual semiconductor wafers cut out from the wafers are sucked and picked up by a flipper, rotated 180° so that the semiconductor wafers are turned upside down, and then The bond head that picks up the semiconductor wafer dips the bumps on the bottom surface of the semiconductor wafer into the flux as it is conveyed to the bond head , and bond the semiconductor wafer to a substrate such as a printed circuit board. Typically, the process of dipping the bumps on the bottom surface of the die into the flux is performed by moving the bonding tool down onto a dip plate coated with a thickness of flux, and placing the The flux is applied to the bumps on the bottom surface of the die that are attracted by the bonding tool.

In bonding equipment, the flipper uses a spring with low stiffness as a cushion to minimize shock applied to the die when the flipper is in contact with the die.

In order to rotate the flipper to a desired range, a stopper is installed at the position where the flipper is to be stopped. When the flipper comes into contact with the stopper, the rotation of the flipper stops.

In this case, the mechanical parts of the flipper may shake or shock may be applied to the mechanical parts of the flipper due to the rotational inertia of the flipper, which is to maintain rotational motion when the flipper comes into contact with the stopper and thus stops properties.

Furthermore, since the pickup unit is installed to be spaced apart from the rotation center of the rotary drive, a higher rotational inertia is applied to the pickup unit.

Similarly, when the flipper is moved down at high speed to pick up a die, inertia is applied to the flipper, so the mechanical parts of the flipper create unwanted motion. Taking into account the inertia of the mechanical parts generated when rotating, the rotation speed of the flipper is controlled to prevent problems due to inertia. However, as the unit per hour (UPH) of the equipment increases, the flipper should rotate at high speed. As the rotational speed of the flipper increases, the spring The inertia of the mechanical part of the flipper cannot be sustained, so the mechanical part is repeatedly pushed out and returned to the original position of the mechanical part. As a result, shocks are accumulated on the flipper, so the flipper may be damaged or the die attached to the flipper may be thrown forward.

In addition, the demand for thin film die is increasing as the semiconductor market is trending towards thinner and smaller sized semiconductor materials. When the same pickup force as used in the past is applied to the flipper's thin film die, the die may be damaged, eg the die may be bent or broken. Thus, it is important to minimize the shock applied to the die by controlling the spring of the flipper more gently.

Additionally, as the number of bumps disposed on the thin film die is reduced, the bumps can be damaged by bonding forces applied to the die, or the die can be damaged by shocks applied to the die when the die is dipped in flux Broken or chipped. To solve these problems, the force to be applied to the bonding tool is controlled within a range that does not cause damage to the bumps.

Traditionally, the force to be applied to the bonding tool is controlled using pressure applied to an air chamber mounted inside the bonding tool. In particular, while the bonding tool is moved in the horizontal direction, the bonding tool is supported with a high force so that the die adsorbed by the bonding tool is not damaged by vibration. Immediately before the die adsorbed by the bonding tool comes into contact with the dip plate, the bonding tool is supported with a low force as the bonding tool moves downward over the dip board, so that the bumps arranged on the bottom surface of the die may not be damaged .

However, as the volume of the air chamber can vary with pressure during switching the pressure supporting the bonding tool from high pressure to low pressure, the bonding tool The tool may wobble due to changes in the volume of the air chamber, and the die cannot be immersed in the flux or bonded using the bonding tool until the shaking of the bonding tool is stabilized. As a result, the UPH of the entire equipment may be lowered, thereby reducing productivity.

Therefore, there is an urgent need for a bonding apparatus for bonding dies, such as semiconductor wafers, and a control method thereof, which can minimize the impact to be applied to the thin dies to protect without reducing the rotational speed of the flipper Die; when the bottom surface of the die is dipped in flux to bond the die to a substrate (such as a printed circuit board), the bonding equipment can protect the bumps disposed on the bottom surface of the die, and the bonding equipment can Move the die to a flux-containing dip plate at high speed to minimize the processing time required to dip the die into the flux or bond the die, thereby maximizing productivity.

The present invention aims to provide a bonding apparatus and a control method thereof in which rotational inertia can be compensated when a die is picked up and flipped by a flipper, and in which application of the flipper during pick-up can be minimized without reducing the rotational speed of the flipper shock to the die.

The present invention also aims to provide a bonding apparatus and a control method thereof in which bumps arranged on the bottom surface of the die can be protected when the die is dipped into a flux to bond the die to a substrate.

The present invention also aims to provide a bonding apparatus and a control method thereof capable of controlling the bonding force to prevent the die when the die is bonded to the substrate Broken or chipped.

The present invention also aims to provide a bonding apparatus and a control method thereof capable of minimizing immersion or bonding of the die by moving the die onto a dip plate containing flux or a bonding substrate at a high speed to bond the die to the substrate. required processing time to maximize productivity.

The present invention provides a bonding apparatus, the bonding apparatus comprising: a bonding head for sucking the diced die individually; a driver for moving the bonding head in a vertical direction and moving all the a position where the bonding head is transferred to the XY plane; and a bonding substrate on which the die sucked by the bonding head is mounted, wherein the bonding head includes: a bonding member for vacuuming adsorbing the die; a first pneumatic pressure member to apply pneumatic pressure to the bonding member by selectively applying and canceling application of the pneumatic pressure to the first pneumatic pressure member supplying buffer power, wherein the volume of the first pneumatic pressure member is variable according to the pressure; and a second pneumatic pressure member, the second pneumatic pressure member is continuously applied with pneumatic pressure, wherein the engagement head is transmitted to the While maintaining the position on the XY plane, the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained, and when the engagement head moves vertically downward, the engagement head and the In a state where the upper portion of the bonding substrate is spaced apart by a predetermined height, the pneumatic pressure applied to the first pneumatic pressure member is removed, and the die sucked by the bonding member is mounted on the bonding substrate.

The present invention also provides a bonding equipment, the bonding equipment package Including: a bonding head, the bonding head is used to suck the diced die individually; a driver, the driver is used to move the bonding head in the vertical direction, and transfer the bonding head to the position on the XY plane; a dip board, the dip containing a flux to be applied to the bottom surface of the die adsorbed by the bond head; and a bond substrate on which the flux is applied is mounted The bare chip, wherein the bonding head comprises: a bonding part, the bonding part is used to vacuum the die; a first pneumatic pressure part, the first pneumatic pressure part is used for selectively feeding the first A pneumatic pressure member applies pneumatic pressure and cancels the application of the pneumatic pressure to supply buffer power to the engagement member, wherein the volume of the first pneumatic pressure member is variable according to the pressure; and a second pneumatic pressure member, so The second pneumatic pressure member is continuously applied with pneumatic pressure, wherein the pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained while the bonding head is transferred to the position on the XY plane. pneumatic pressure, and the pneumatic pressure applied to the first pneumatic pressure member is removed in a state where the engagement head is spaced apart from the upper portion of the impregnating plate by a predetermined height when the engagement head is moved vertically downward , and the flux is applied to the bottom surface of the die adsorbed by the bonding member.

The first pneumatic pressure part may include: an air chamber passage through which air from an external air box is supplied and delivered; an air chamber for passing air from the air expansion of the air supplied from the chamber passage to supply driving force to the engagement member; a force control regulator to control the pressure of the air supplied from the external air tank; and a valve, the valve to start or stop Air supply to the air chamber is stopped.

When the air supply to the air chamber is stopped, the air remaining in the air chamber may be discharged to the outside, whereby only the pneumatic pressure applied to the second pneumatic pressure member remains in the engagement member, to reduce the pressure applied to the engagement member.

The second pneumatic pressure part may include: a cylinder passage through which air from an external air box is supplied and delivered; an air cylinder for delivering the pressure of the air supplied by the cylinder passage to the support a load; and the support load to support the engagement member by supplying a damping power having a certain pressure to the engagement attachment according to the pressure transmitted to the support load.

When the pneumatic pressure applied to the first pneumatic pressure member is removed and the volume of the air chamber to which air is supplied is thereby changed, the support load may be maintained by the second pneumatic pressure member using The pneumatic pressure support to supply the damping power to the engagement member.

The engagement member may include a sensor dog, and the engagement head may include a sensor member for sensing a physical distance from the sensor dog, the sensor member A certain distance from the sensor dog.

The bonding member may include: a bonding pickup for physically contacting and attracting the die; and an air bearing for rotating the bonding pickup, the An air bearing is coupled to the upper portion of the engagement pickup, and the engagement member further includes an air box for supplying air to the air shaft a bearing; and an air regulator for controlling the pressure of the supplied air.

The bonding apparatus may further include a flipper to pick up the diced die, rotate the die 180° to turn the die upside down, and transfer the die to the bond head , wherein the flipper may include: a pick-up unit for sucking and picking up the die; a flip arm, on which the pick-up unit is mounted, and the flip arm is mounted on the main body and rotatable and movable upward or downward; a supporting load is installed in the turning arm and is displaceable within a predetermined range in the length direction, and wherein the pickup unit is installed in the on the end portion of the supporting load; an elastic member for absorbing the shock generated during the contact between the pickup unit and the die, the elastic member is provided in which the supporting part for supporting the load and the between the pick-up units; a negative pressure pipe for applying negative pressure to the pick-up unit to maintain the negative pressure while the die is picked up by the pick-up unit, the negative pressure a tube coupled to the pickup unit; and a positive pressure tube to supply carrying power to the support load by applying positive pressure into the flip arm, the positive pressure tube coupled to the flip arm, wherein the positive pressure applied to the support load through the positive pressure tube is maintained to compensate the inertia of the flip arm while the flip arm rotates and moves downward, and is immediately connected between the pickup unit and the support load. The positive pressure is removed before the die contacts.

The bonding apparatus may further include a flipper to pick up the diced die, rotate the die 180° so that the die upside down and transfer the die to the bonding head, wherein the flipper may include: a pick-up unit for sucking and picking up the die; a flip arm, the pick-up unit mounted on on the flip arm, and the flip arm is mounted on the main body and is rotatable and movable upward or downward; a support load is installed in the flip arm and is within a predetermined range in the length direction is displaceable, and wherein the pick-up unit is mounted on the end that supports the load; a negative pressure tube for applying negative pressure to the pick-up unit to be The pickup unit picks up while maintaining the negative pressure, the negative pressure pipe is coupled to the pickup unit; and a positive pressure pipe, the positive pressure pipe is used to apply the first positive pressure or the second positive pressure, the positive pressure A pressure tube is coupled to the flip arm to supply carrying power to the support load by selectively applying a positive pressure to the flip arm; wherein the first positive pressure applied to the support load is maintained to apply a positive pressure to the flip arm Rotating and moving downward while compensating for the inertia of the flip arm, and applying the second positive pressure to the support load immediately before the pickup unit comes into contact with the die, the second positive pressure is low at the first positive pressure.

The present invention also provides a method of controlling a bonding apparatus including a bonding head, a driver and a bonding substrate, the bonding head having a bonding member, a first pneumatic pressure member and a second pneumatic pressure member, the bonding member for The diced die is vacuum suctioned, the volume of the first pneumatic pressure part is variable according to the pressure to supply buffer power to the bonding part, and the application of pneumatic pressure and the application of pneumatic pressure are selectively performed in the first pneumatic pressure part The application of the pneumatic pressure is cancelled, and the second pneumatic pressure member is continuously applied with the pneumatic pressure, and the actuator is used to vertically moving the bonding head upward and transferring the bonding head to a position on the XY plane, where the bare chip sucked by the bonding head is mounted on the bonding substrate; the method includes the steps of: sucking the cut bare chip The bonding head of the sheet is conveyed over the bonding substrate and moved vertically downward to a certain height while maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member; at the certain height At the height, the pneumatic pressure applied to the first pneumatic pressure member of the bonding head is discharged to the outside; when the discharge of the pneumatic pressure is completed, the bonding head is further moved downward and the bonding head is sucked to the die mounted on the bonding substrate; and when the mounting of the die is completed, in a state where a corresponding pneumatic pressure is applied to the first pneumatic pressure member, and the bonding head is moved vertically upward to a certain height While maintaining, subsequent processing is performed; wherein the step of maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member, the step of discharging the pneumatic pressure applied to the first pneumatic pressure member, and the further The steps of moving the bonding head downward and mounting the die sucked by the bonding head on the bonding substrate, and performing subsequent processing are repeatedly performed.

The present invention also provides a method of controlling a bonding apparatus comprising a bonding head, a driver, a dip plate and a bonding substrate, the bonding head having a bonding member, a first pneumatic pressure member and a second pneumatic pressure member, the bonding A part is used to vacuum suction the cut die, the volume of the first pneumatic pressure part is variable according to the pressure to supply buffer power to the bonding part, and the application is selectively performed in the first pneumatic pressure part pneumatic pressure and cancel the application of the pneumatic pressure, and the The second pneumatic pressure member is continuously applied with pneumatic pressure, the driver is used to move the bonding head in a vertical direction and transfer the bonding head to a position on the XY plane, the dip plate contains flux, the auxiliary Flux is to be applied to the bottom surface of the die adsorbed by the bond head, the flux-coated die is mounted on the bond substrate, and the method includes the steps of: The engagement head is conveyed over the dip plate and moved vertically downward to a certain height while maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member; at the certain height The pneumatic pressure applied to the first pneumatic pressure part of the bonding head is discharged to the outside; when the discharge of the corresponding pneumatic pressure is completed, the bonding head is further moved downward and the flux contained in the dip plate is applied applied to the bottom surface of the die adsorbed by the bonding head; when the step of applying the flux to the bottom surface of the die is completed, pneumatic pressure is applied to the first pneumatic pressure member and transferring the die over the bonding substrate while being held in a state where the bonding head is moved vertically upward to a certain height; and mounting the die coated with the flux to the bonding on a base plate, wherein the step of maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member, the step of discharging the pneumatic pressure applied to the first pneumatic pressure member, the further downward movement of the engagement the head and the step of applying the flux contained in the dip plate to the bottom surface of the die adsorbed by the bonding head, the step of transferring the die over the bonding substrate, and the step of applying the The step of mounting the flux-coated die on the bonding substrate is repeated.

The bonding apparatus may further include a flipper for to pick up the diced die, rotate the die 180° to turn the die upside down, and transfer the die to the bond head, wherein the flipper may include a pick-up unit, the A pick-up unit is used for sucking and picking up the die; a flip arm, the pick-up unit is mounted on the flip arm, and the flip arm is mounted on the main body and can be rotated and moved up or down; supporting a load, The supporting load is installed in the turning arm and is displaceable within a predetermined range in the length direction, and wherein the pickup unit is installed on an end of the supporting load; an elastic member, the An elastic member is provided between a support member in which the load is supported and the pickup unit; a negative pressure pipe coupled to the pickup unit to apply a negative pressure to the pickup unit; and a positive pressure the positive pressure tube is coupled to the flip arm to supply carrying power to the support load, and wherein the method further includes the step of maintaining positive pressure to rotate and move vertically downward as the pick unit rotates Compensate the inertia of the flip arm while reaching a certain height; discharge the positive pressure at the certain height; after the discharge of the positive pressure is completed, the pick-up unit is discharged by applying a negative pressure from the negative pressure pipe. attracting the die while mitigating the shock generated when the pickup unit moves further down and comes into contact with the die by using the elastic member; and when the positive pressure is applied and the pickup unit The pickup unit is rotated while being held in the state of being moved vertically upward to a certain height, wherein the step of maintaining the positive pressure, the step of discharging the positive pressure, the step of sucking the die by the pickup unit, And the step of rotating the pickup unit is performed continuously.

The bonding apparatus may further include a flipper for to pick up the diced die, rotate the die 180° to turn the die upside down, and transfer the die to the bond head, wherein the flipper may include a pick-up unit, the A pick-up unit is used for sucking and picking up the die; a flip arm, the pick-up unit is mounted on the flip arm, and the flip arm is mounted on the main body and can be rotated and moved up or down; supporting a load, The support load is installed in the turning arm and is displaceable within a predetermined range in the length direction, and wherein the pick-up unit is installed on the end of the support load; a negative pressure pipe, the A negative pressure tube is coupled to the pickup unit to apply negative pressure to the pickup unit; and a positive pressure tube is coupled to the flip arm to supply carrying power to the support load, the positive pressure tube The pressure pipe branches into a first positive pressure pipe and a second positive pressure pipe, wherein the method further includes the step of: maintaining the first positive pressure to compensate for all the pressure while the pickup unit rotates and moves vertically downward to a certain height The inertia of the flip arm; the first positive pressure is discharged at the certain height; after the discharge of the first positive pressure is completed, a second positive pressure lower than the first positive pressure is applied; the pick-up the unit sucks the die by applying a negative pressure from the negative pressure tube, while at the same time relieves the shock generated when the pick-up unit moves further down and comes into contact with the die by the second positive pressure; and The pickup unit is rotated while the positive pressure is applied and maintained in a state in which the pickup unit moves vertically upward to a certain height, wherein the step of maintaining the first positive pressure, discharging the first positive pressure The step of pressing, the step of applying the second positive pressure, the step of sucking the die by the pickup unit, and the step of rotating the pickup unit are continuously performed.

1: Die

11: Bumps

10: Joining components

100: Splice head

110: Joint parts

111: Engage the extractor

112: Air bearing

113: Sensor Dog

121: The first pneumatic pressure part

121a: Air chamber channel

121b: Air Chamber

122: Second pneumatic pressure part

122a: Cylinder channel

122b: Cylinder

122c: Support load

123: Valve

124: Force Control Regulator

130: Sensor parts

200: lift drive

300: Impregnated Board

310: Flux

1000: Flipper

1000a: First flipper

1000b: Second flipper

1100: Pickup Unit

1110: Adsorption pad

1200: Negative pressure tube

1300: Elastic components

1400: Support Load

1700: Flip Arm

1710: Rotating Parts

1720: Rotary axis

1730: Second Pad

1740: First Pad

1760: Support Parts

1770: Cylinder Space

1800: Positive pressure tube

1800a: First positive pressure tube

1800b: Second positive pressure tube

1810: Regulator

1810b: Regulator

1860: Control Valves

1860x: First Control Valve

1860y: Second control valve 0

1860z: Proportional valve

1900: Subject

1910: Lifting guides

1920: First Stopper

1930: Lifting drive unit

1940: Second Stopper

2000: Downward Vision Unit

1 is a diagram schematically showing a joint member for a joint device according to the present invention; FIG. 2 is a diagram schematically illustrating a method for controlling pneumatic pressure performed by the joint member for a joint device according to the present invention. A diagram of the method; FIG. 3 is a diagram showing the position and sensor of the bonding head in each of the die dipping process performed by the bonding member according to the present invention and the die dipping process performed by the bonding member according to the related art A graph of sensor values of a sensor dog; Fig. 4 schematically shows a control flow of a dipping process performed by a joining member for a joining apparatus according to the present invention; Fig. 5 is a joining apparatus according to an embodiment of the present invention A cross-sectional view of the flipper of FIG. 6; FIG. 6 shows the state in which the die is picked up by the first flipper and unloaded by the second flipper, and the first flipper and the second flipper in a system with two flippers of FIG. 5 The state in which the flipper is rotated; FIG. 7 shows that when the rotation of the first flipper and the second flipper in the state of FIG. 6 is completed, the die picked up by the first flipper is unloaded, and the second flipper is 8 is a cross-sectional view of a flipper of a bonding apparatus according to another embodiment of the present invention; FIG. 9 shows a system with two flippers of FIG. 8 The state in which the middle die is picked up by the first flipper and unloaded by the second flipper, and the first flipper Rotator and second flipper are rotated; FIG. 10 shows that the die picked up by the first flipper is unloaded and the second flipper moves down to the first flip where the die will be in the state of FIG. 9 The state of the height picked up in the state when the rotation of the flipper and the second flipper is completed.

Hereinafter, embodiments of the present invention will be described in detail.

The bonding apparatus according to the present invention ejects a die (such as a semiconductor wafer) attached to a wafer by using an ejector, sucks and picks up the ejected die through a flipper, and rotates the die by 180° so that the die is turned upside down , and transfer the die to the bond head. Thereafter, the bumps disposed on the bottom surface of the die picked up by the bond head are fluxed by dipping the bottom surface of the die into the flux, and the die is then bonded to a bonding substrate (such as printing circuit board).

FIG. 1 is a diagram schematically showing a joining member 10 for a joining apparatus according to the present invention.

As shown in FIG. 1 , in the bonding apparatus, the bonding member 10 has a bonding head 100 for receiving and sucking the diced dies from a flipper in a state where the dies are turned upside down, wherein the flipper picks up the dies and rotate the die 180°; a driver (not shown) to move the bonding head 100 in the vertical direction (Z-axis direction) and transfer the bonding head 100 to a position on the XY plane; and a bonding substrate, on the bonding substrate The die 1 sucked by the bonding head 100 is mounted. The bonding head 100 includes: vacuum adsorption of the die 1 The engaging member 110; the first pneumatic pressure member 121, the first pneumatic pressure member 121 is used to supply buffer power to the engaging member 110 by selectively applying and canceling the application of pneumatic pressure, and the volume of the first pneumatic pressure member 121 can be and a second pneumatic pressure member 122 which is continuously applied with pneumatic pressure. The pneumatic pressure applied to the first pneumatic pressure member 121 and the second pneumatic pressure member 122 is maintained while the bonding head 100 is transferred to the corresponding position. When the bonding head 100 is moved vertically downward, in a state where the bonding head 100 is spaced apart from the upper part of the bonding substrate by a predetermined height, the pneumatic pressure applied to the first pneumatic pressure part 121 is removed, and the bare air sucked by the bonding part 110 is removed. The sheet 1 is mounted on the bonding substrate.

According to another embodiment of the present invention, in a bonding apparatus (wherein the bonding apparatus includes a bonding head 100 for sucking the diced die individually; a driver for moving the bonding head 100 in a vertical direction, and The bonding head 100 is transferred to a position on the XY plane; the dip plate 300 contains the flux 310 to coat the bottom surface of the die 1 adsorbed by the bonding head 100 with the flux 310; and the bonding substrate, in which the bonding substrate is The die 1) coated with the flux 310 is mounted on the top, and the bonding head 100 includes: a bonding part 110 for vacuum sucking the die; a first pneumatic pressure part 121, the first pneumatic pressure part 121 is used for selectively applying The first pneumatic pressure part 121 applies and cancels the application of pneumatic pressure to supply buffering power to the engaging part 110, and the volume of the first pneumatic pressure part 121 can be changed according to the pressure; and the second pneumatic pressure part 122, The second pneumatic pressure member 122 is continuously applied with pneumatic pressure force. The pneumatic pressure applied to the first pneumatic pressure member 121 and the second pneumatic pressure member 122 is maintained when the bonding head 100 is transferred to the corresponding position. If the bonding head 100 is spaced apart from the upper portion of the bonding substrate by a predetermined height during the vertical downward movement of the bonding head 100, the pneumatic pressure applied to the first pneumatic pressure member 121 is removed, and the flux is applied to the bonding Components 110 are attached to the bottom surface of the die.

As shown in (a) of FIG. 1 , the joining member 10 for joining equipment is raised and lowered by a lifting driver 200, and then moved in a horizontal direction (X or Y) relative to the ground through a separate conveying device (not shown). moving at high speed in the axial direction), thereby placing the die sucked by the bonding head 100 on the flux 310 coated on the dip plate 300 with a certain thickness. Next, as shown in (b) of FIG. 1 , the bonding head 100 is moved downward by the lift driver 200 , thereby dipping the bumps 11 arranged on the bottom surface of the die sucked by the bonding member 110 into the flux 310 .

Here, the flux 310 may be a composition containing epoxy resin or the like, and may be used to bond the die to the substrate and prevent short circuits due to conduction of current between the bumps 11 on the bottom surface of the die. The thickness of the flux 310 coated on the dip plate 300 can be controlled to a micrometer size corresponding to the height of the bumps 11 on the bottom surface of the die.

When the thickness of the applied flux 310 is less than the height of the bumps, the bumps are insufficiently coated with the flux 310, and thus the die may be unstablely fixed on the substrate, and may be caused by inter-bump current flow short-circuit due to conduction. Conversely, when the thickness of the applied flux 310 is greater than the height of the bumps, the bumps are over-coated with the flux 310 and thus remain on the bumps The level of flux 310 on the block surface may be unnecessarily high. Therefore, foreign matter may remain on the substrate (on which the die is bonded), and thus, problems such as circuit errors may occur in the substrate.

In detail, the joint part 110 , the buffer part including the first pneumatic pressure part 121 and the second pneumatic pressure part 122 , the sensor part 130 , and the like may be included in the joint head 100 . Here, the bonding part 110 is a device for sucking the die, and may include: a bonding picker 111 for sucking the die in physical contact with the die; an air bearing 112 , an air bearing 112 Coupled to the upper part of the joint pickup 111 ; the sensor dog 113 is used to sense the position of the joint part 110 and the like by using the sensor part 130 .

The first pneumatic pressure part 121 may include: an air chamber passage 121a through which air from an external air tank is supplied and delivered; an air chamber 121b through which air is passed through expansion with air supplied from the air chamber passage 121a to apply a driving force to the engagement member 110; a force control regulator 124 for controlling the pressure of the air supplied from the external air tank; and a valve 123 for starting Or the supply of air into the air chamber 121b is stopped.

When the supply of air into the air chamber 121b is stopped, the air remaining in the air chamber 121b is discharged to the outside, and thus only the pneumatic pressure applied by the second pneumatic pressure member 122 remains in the engaging member 110. Therefore, the pressure applied to the engaging member 110 is low. Thereby, the bonding work or the flux dipping work can be performed at low pressure, thereby reducing the bonding force to be applied to the die.

Here, the second pneumatic pressure part 122 may include: a cylinder passage 122a through which air from an external air box is supplied and delivered; an air cylinder 122b for delivering the pressure of the air supplied by the cylinder passage 122a to the support a support load 122c; and a support load 122c for supporting the engagement member 110 by applying a cushioning power having a certain pressure or a certain pressure to the engagement member 110 according to the pressure transmitted to the support load 122c .

When the pneumatic pressure applied to the first pneumatic pressure member 121 is removed and thus the volume of the air chamber 121b to which the air is supplied is changed, the second pneumatic pressure member 122 can pass through the use of the pressure maintained by the second pneumatic pressure member 122 The support load 122c is used to apply damping power to the engagement member 110.

That is, the engagement apparatus according to the present invention may include the first pneumatic pressure member 121 and the second pneumatic pressure member 122 as means for supporting the engagement member 110 by applying a certain level of cushioning power to the engagement member 110, particularly It is used to firmly support the bonding member 110 during the transfer of the bonding head 100, and the bumps on the bottom surface of the die to be applied by absorbing the dip plate 300 during the dipping of the die into the flux 310. A device that suppresses damage to bumps by bonding forces on the die.

Here, the first pneumatic pressure part 121 may include: an air chamber passage 121a through which air from an external air box (not shown) is supplied and delivered; and an air chamber 121b, an air chamber 121b for expansion through the air supplied from the air chamber channel 121a expansion, so as to apply a buffering power with a certain power to the engaging part 110 , so as to support the engaging part 110 .

The second pneumatic pressure part 122 may include: a cylinder passage 122a through which air from an external air box (not shown) is supplied and delivered; an air cylinder 122b through which the air cylinder 112b is used to pressurize the air supplied by the cylinder passage 122a and a supporting load 122c for supporting the engaging member 110 by applying a buffer power with a certain pressure to the engaging member 110 according to the pressure transmitted to the supporting load 122c.

FIG. 2 is a diagram schematically illustrating a method of controlling pneumatic pressure performed by the engagement member 10 for the engagement apparatus according to the present invention.

As shown in FIG. 2, the air permeability control regulator 124 is injected into the air chamber 121b and the air cylinder 122b under a certain pressure, and the injection into the air chamber 121b can be started or stopped using a manually or automatically controlled valve 123 Air.

Specifically, the bonding member 10 according to the present invention can be immediately contacted by moving the die 1 adsorbed and supported by the bonding member 110 onto the flux 310 of the dip board 300 at high speed and moving the bonding head 100 downward by the lift driver 200 . Before the die 1 is immersed in the flux 310, the die is more firmly supported using a high pressure buffer power, wherein the high pressure buffer power is the first according to the air injected into the air chamber 121b as shown in (a) of FIG. 2 . The sum of the damping power of the one pneumatic pressure member 121 and the damping power of the second pneumatic pressure member 122 according to the air injected into the cylinder 122b. Thereby, the die 1 can be prevented from being separated from the bonding member 110 and caused by the bonding The engaging member 110 is not damaged by shaking of the engaging member 110, and can prevent generation of an erroneous signal (such as a touch signal) when the engaging member 110 is not in contact with the bottom of the dipping plate 300 due to excessive lifting and lowering of the engaging member 110.

As shown in (b) of FIG. 2, immediately after the die is dipped into the flux 310 by further moving the bonding head 100 downward using the lift driver 200, the valve may be closed to stop the injection into the air chamber 121b air, and the air remaining in the air chamber 121b is quickly discharged to the outside, thereby removing the pneumatic pressure applied to the first pneumatic pressure part 121 and using the low pressure reduced according to the buffer power of the second pneumatic pressure part 122 Buffer power to support the die. Thus, when the bumps on the bottom surface of the die are in contact with the dip plate 300, most of the bonding force applied to the die can be supported by the support load 122c, thereby suppressing damage to the bumps.

In addition, the engagement member 110 can be accurately supported using the damping power that is supplied by controlling the relatively large effective area of the engagement member 110 from the first pneumatic pressure member 121, while maintaining the power from the second pneumatic pressure member 121 to a relatively large effective area. The pneumatic pressure member 122 is obtained by supplying the damping power having a relatively small effective area to the engaging member 110 . Therefore, when the buffer power for the bonding part 110 is switched from a high pressure to a low pressure to immerse the die adsorbed by the bonding part 110 into the flux 310 , shaking of the bonding part 110 can be avoided or minimized. Thereby, the time required for stabilizing the shaking of the bonding member 110 to perform the process of dipping the die may not be required or may be reduced, thereby greatly improving productivity.

When the air injection into the air chamber 121b is stopped, the air remaining in the air chamber 121b can be quickly discharged to the outside using a valve, And thus the switching of the buffer power through the first pneumatic pressure member 121 can be quickly performed. Therefore, productivity can be further improved.

Multiple forces can be controlled using one force control regulator and the first and second pneumatic pressure members 121 and 122 having different areas, thereby simplifying the force control structure.

Even if one force control regulator applies the same pressure to the first pneumatic pressure member 121 and the second pneumatic pressure member 122, different forces will be generated due to the different areas of the first pneumatic pressure member 121 and the second pneumatic pressure member 121 . Therefore, data can be collected by separately measuring the force of the first pneumatic pressure member 121 and the pressure of the second pneumatic pressure member 122 by applying pressure to the first pneumatic pressure member 121 and the second pneumatic pressure member 122; The pneumatic pressure part 121 and the second pneumatic pressure part 122 apply pressure to measure the force of the first pneumatic pressure part 121 and the second pneumatic pressure part 122 simultaneously, and measure the second pneumatic pressure by maintaining only the pressure of the second pneumatic pressure part 122 The force of component 122 to collect data. That is, it is possible to implement two force measuring tables for the same pressure.

As described above, by controlling the cushioning power from the first pneumatic pressure member 121 and the cushioning power from the second pneumatic pressure member 122, the cushioning power to be applied to the engagement member 110 can be controlled in a wide range. Therefore, the present invention can be widely applied to bonding equipment for bonding dies having various sizes and various weights.

When the buffer power for the engagement member 110 is switched from high pressure to low pressure, the first pneumatic pressure of the air bearing 112 supporting the engagement member 110 The buffering power of the force member 121 is reduced, so the die sucked and supported by the bonding member 110 may be shaken and damaged. Therefore, the time required to stabilize the shaking of the die is required, and the productivity may decrease. Thus, an air box for supplying air to the air bearing 112 to prevent loosening of the air bearing 112 and an air force regulator for controlling the pressure of the supplied air may be additionally provided.

Here, the air box may increase the volume of the air line from the air regulator to the air bearing 112, thereby controlling the pressure variation of the air bearing 112 to be relatively low. Therefore, the air regulator can control the internal pressure of the air bearing 112 to stabilize.

The sensor part 130 may be arranged at a distance or a certain distance from the sensor dog 113 contained in the engaging part 110 to sense the physical distance from the sensor dog 113, which will sense the physical distance. The result of the distance is converted into an electrical signal and sent to the operator or automatic controller of the device.

In detail, the sensor part 130 can instantly sense the change of the physical distance between the sensor part 130 and the sensor dog 113, and send a sensing signal to the operator or the automatic controller, wherein the change of the physical distance This is caused by the rattling of the engagement member 110 when the buffering power of the buffer member is switched from high pressure to low pressure. An operator or automatic controller may control the lift driver 200 not to start moving the bond head 100 downward until the shaking of the bond components 110 stabilizes, thus delaying dipping the die into the flux 310 .

In addition, the sensor part 130 may sense an increase in the physical distance between the sensor part 130 and the sensor dog 113 and notify the operator Or the automatic controller sends a sense signal, where the increase in physical distance is when the shaking of the bonding part 110 is stabilized and the die 1 is immersed in the flux 310, the bumps 11 on the bottom surface of the die and the dip plate 300 During contact, it is caused by the slight upward movement of the bonding feature 110 due to the bonding force being applied to the die. The operator or automatic controller can ensure the dipping time to properly coat the bumps arranged on the bottom surface of the die 1 with the flux 310, can control the lift driver 200 to lift the bond head 100 when the dipping of the die is completed , and the bonding member 10 may be transferred toward a bonding substrate (such as a wafer) to perform a bonding process after the dipping process.

3 is a diagram showing the position of the bonding head and the sensing of the sensor dog in each of the die dipping process performed by the bonding member according to the present invention and the die dipping process performed by the bonding member according to the related art Graph of device values. In the graph of FIG. 3 , the vertical axis is the z-axis direction representing the positions of the bonding head and the sensor dog in the vertical direction, and the horizontal axis represents time.

As shown in FIG. 3 , in the engaging member according to the related art (the engaging member includes a buffer member composed of only an air chamber having a relatively large effective pressure area), when the joint head moves downward and the buffering power of the buffer member When switching from high voltage to low voltage so that the die is immersed in the flux, the bonding parts are shaken as indicated by the sensor value of the sensor dog, and it takes a lot of time to stabilize the shaking of the bonding parts, thus reducing the productivity. In contrast to this, in the engagement member 10 according to the present invention (the engagement member 10 includes the buffer member 120 having the first pneumatic pressure member 121 and the second pneumatic pressure member 122 controlled as described above), such as a sensor dog The sensor value of 113 is shown, even after the cushioning that will be applied to the engagement member 110 When the force is switched from high pressure to low pressure, the engaging member 110 is also difficult to be shaken. As a result, the time required to stabilize the shaking of the engagement member 110 is no longer required or greatly reduced, thereby greatly improving productivity.

The present invention relates to a control method of a process of dipping a die into a flux 310 performed by the bonding member 10 for a bonding apparatus as described above.

FIG. 4 schematically shows a control flow of the dipping process performed by the joining member 10 for the joining apparatus according to the present invention.

As shown in FIG. 4 , the control method of the process of dipping the die into the flux 310 performed by the bonding member 10 for the bonding apparatus according to the present invention may include operations S100 to S700 which will be described below.

In operation S100 , the bonding head 100 is moved downward by the lift driver 200 , and the die to be bonded is sucked and picked up by the bonding part 110 .

In operation S200, while the engagement part 110 is supported by the cushioning power of the first pneumatic pressure part 121 and the cushioning power of the second pneumatic pressure part 122 of the engagement head 100, the engagement head 100 is moved upward, and the engagement member 10 is transmitted as The die is placed on the flux 310 in the dip board 300 .

In operation S300 , immediately before the die is dipped into the flux 310 , the bonding head 100 is moved downward by the lift driver 200 .

In operation S400, by removing the buffer power of the first pneumatic pressure member 121, the buffer power of the buffer member is switched from high pressure to low pressure.

In operation S500, by the first pneumatic pressure part 121 The shaking of the engagement member 110 caused by the switching of the buffer power is stabilized.

In operation S600 , the bumps on the bottom surface of the die are dipped into the flux 310 by moving the bonding head 100 downward by the lift driver 200 , thereby coating the bumps with the flux 310 .

In operation S700 , after the bumps are properly coated with the flux 310 , the bonding head 100 is moved upward by the lift driver 200 .

A method of controlling a bonding apparatus according to an embodiment of the present invention will be described in more detail below.

In a method of controlling a bonding apparatus according to an embodiment of the present invention (wherein the bonding apparatus includes a bonding head, a driver, and a bonding substrate; wherein the bonding head includes: a bonding member for vacuum suction of a die such as a semiconductor wafer; a first pneumatic a pressure member, the first pneumatic pressure member is used to supply buffer power to the engagement member by selectively applying and canceling the application of the pneumatic pressure to the first pneumatic pressure member, and the volume of the first pneumatic pressure member is variable according to the pressure and a second pneumatic pressure member, the second pneumatic pressure member is continuously applied with pneumatic pressure; wherein the driver is used to move the bonding head in the vertical direction and transfer the bonding head to a position on the XY plane; wherein the bonding substrate is mounted with dies picked up by the bonding head), the following steps may be repeated: while the bonding head picking up the dies is transported over the bonding substrate and moved vertically downward to a certain height, maintaining the application of the first pneumatic pressure member and the second pneumatic pressure Pneumatic pressure of the pressure part; at a certain height, the pneumatic pressure applied to the first pneumatic pressure part of the joint head is discharged to the outside; when the discharge of the pneumatic pressure is completed, the joint head is further moved downward and will be adsorbed by the joint head. Die mounted on bonded substrate and when the mounting of the die is completed, while the pneumatic pressure is applied to the first pneumatic pressure member and held in a state where the bonding head is moved up to a certain height or a certain height, the subsequent processing is performed.

According to the method of controlling the bonding apparatus, the impact applied to the die when the bonding head mounts the die on the bonding substrate can be mitigated, thereby preventing the die from chipping or breaking.

A method of controlling a bonding apparatus according to another embodiment of the present invention will be described below.

In the method of controlling the bonding equipment, the bonding equipment includes a bonding head 100, a driver, a dipping board 300 and a bonding substrate, wherein the bonding head 100 includes: a bonding part 110 for vacuum suction and cutting a die; a first pneumatic pressure part 121, a first a pneumatic pressure member 121 for supplying buffer power to the engagement member 110 by selectively applying pneumatic pressure to the first pneumatic pressure member and canceling the application of the pneumatic pressure, and the volume of the first pneumatic pressure member 121 is variable according to the pressure; and the second pneumatic pressure member 122, which is continuously applied with pneumatic pressure; wherein the driver is used to move the bonding head 100 in the vertical direction and transfer the bonding head 100 to a position on the XY plane; wherein the dip plate 300 Contains flux 310 to be applied to the bottom surface of the die adsorbed by the bond head 100; wherein the flux 310 coated die is mounted on the bond substrate. In this method, the following steps may be repeatedly performed: while the bonding head 100 for sucking the die is conveyed over the dip plate 300 and moved vertically downward to a certain height, the application of the first pneumatic pressure member 121 and the second pneumatic pressure member 121 and the second pneumatic pressure member are maintained. Pneumatic pressure of the pressure member 122; the first pneumatic pressure member to be applied to the engagement head at a certain height The pneumatic pressure is discharged to the outside; when the discharge of the pneumatic pressure is completed, the bonding head 100 is further moved downward, and the flux 310 contained in the dip plate 300 is applied to the bottom surface of the die adsorbed by the bonding head 100; when When the application of the flux 310 to the bottom surface of the die is completed, the bonding head 100 is transferred to the bonding in a state in which the bonding head 100 is moved vertically upward to a certain height and the pneumatic pressure is applied to the first pneumatic pressure member 121 and held and mounting the die coated with flux 310 on the bonding substrate.

According to the method of controlling the bonding apparatus, the impact applied when the flux 310 is applied to the bottom surface of the die adsorbed by the bonding head 100 can be mitigated to prevent damage to bumps arranged on the bottom surface of the die. In this case, bonding force control can also be performed to reduce the shock applied when bonding the die. The bonding force control may also be performed when the die is sucked and picked up by the bonding head 100 .

The flipper of the joining apparatus and the control method thereof according to the present invention will be described below with reference to the accompanying drawings. 5 is a cross-sectional view of a flipper 1000 and a method of controlling the flipper 1000 according to an embodiment of the present invention.

The flipper 1000 according to the present invention includes: a pick-up unit 1100 for sucking and picking up dies; a flip arm 1700, on which the pick-up unit 1100 is mounted, and the flip arm 1700 is mounted on the main body so as to be rotatable and rotatable move up or down, and have a first pad 1740 and a second pad 1730; a support load 1400 is installed in the flip arm to be displaceable in the length direction within a predetermined range, and the pickup unit 1100 is installed on the support On the end of the load 1400; the elastic member 1300, the elastic member 1300 is provided with a support part in which the load 1400 is supported and the pickup unit 1100, and the elastic member 1300 is used to relieve the impact applied when the pickup unit 1100 is in contact with the die; the negative pressure tube 1200, the negative pressure tube 1200 is coupled to the pickup unit 1100 to apply a negative pressure to the pickup unit 1100 and positive pressure tube 1800 coupled to flip arm 1700 to provide carrying power to support load 1400 by applying positive pressure to flip arm 1700. The positive pressure applied to the support load 1400 through the positive pressure tube 1800 can be maintained to compensate for the inertia of the flip arm 1700 while the flip arm 1700 rotates and moves downward, and can be moved just before the pick unit 1100 comes into contact with the die remove.

When the first and second pads 1740 and 1730 are in contact with the first and second stoppers 1920 and 1940 of FIG. 6 , the first and second pads 1740 and 1730 of the flip arm 1700 limit the rotation range of the flip arm 1700 .

The pickup unit 1100 may include a suction pad 1110 at the bottom end of the pickup unit 1100 , and may pick up dies when a negative pressure Ps is applied to the suction pad 1110 . Therefore, the pickup unit 1100 of the adsorption pad 1110 may include a negative pressure tube 1200 through which the negative pressure Ps may be selectively applied.

The pickup unit 1100 may be installed in the flipper 1000 to be relatively displaceable to prevent the die from being pressed and damaged by the suction pad 1110 during picking up the die.

That is, as shown in FIG. 5 , the pickup unit 1100 is coupled to one end of the support load 1400 , the support load 1400 is installed in the flip arm 1700 to be displaceable, and the elastic member 1300 is provided at the flip arm 1700 and the pickup unit 1100 between.

Therefore, the impulse applied when the pickup unit 1100 picks up the die The shock can be absorbed by the rearward movement of the support load 1400 and by the elastic member 1300 .

While the pickup unit 1100 is in contact with the die to be picked up, the die may be adsorbed and picked up by applying a negative pressure Ps from the negative pressure pipe 1200 coupled to the pickup unit 1100 .

In the flipper 1000 and the method of controlling the flipper 1000 according to the present invention, the flipper 1000 is used to rotate in a state where the die is picked up by the pickup unit 1100 . In this case, the pickup unit 1100 may not be directly rotated, but the flip arm 1700 on which the pickup unit 1100 is mounted may be rotated.

The flip arm 1700 may include a rotating part 1710 on which a rotating shaft 1720 is mounted; and a supporting part 1760 vertically coupled to one end of the rotating part 1710 and having a supporting load 1400 therein. The rotating part 1710 of the flip arm 1700 may be installed to be rotatable about the rotation axis 1720 with respect to the main body 1900 of the flipper 1000 and move upward or downward along the lift guide 1910 through the lift drive unit 1930 .

A support part 1760 extending in a direction perpendicular to the rotation part 1710 may be provided on an end of the rotation part 1710 of the flip arm 1700 .

As described above, the support member 1760 may be provided in a hollow form to protect the die. Accordingly, the support load 1400 may be mounted displaceable in the length direction of the support member 1760 .

Even if the supporting load 1400 is elastically supported by the elastic member 1300 During the rotation of the flip arm 1700 around the rotation axis 1720 inside the support member 1760 of the flip arm 1700, movement may still occur due to the rotational inertia of the support load 1400 in the displacement direction. Due to this movement, the stability of the pickup unit 1100 in the pickup state may decrease, and the supporting load 1400 or the pickup unit 1100 may collide with the flip arm 1700 or the like.

When the flipper 1000 includes the first and second stoppers 1920 and 1940 to limit the rotation range of the flipping arm 1700, the rotation of the flipping arm 1700 stops when the flipping arm 1700 contacts the first and second stoppers 1920 and 1940. Therefore, the flipper 1000 is more affected by inertia.

One end of the support load 1400 is located in the inner cylinder space 1770 of the support member 1760 of the flip arm 1700 . Therefore, when positive pneumatic pressure is applied through the positive pressure tube 1800 , the carrying power is supplied to this end of the support load 1400 .

That is, when the positive pressure Pb is applied through the positive pressure pipe 1800, the supporting load 1400 may be prevented from entering the inner cylinder space 1770 to which the positive pressure Pb is applied, thereby selectively providing the bearing power.

A plurality of O-rings (O-rings or1, or2 and or3) may be provided in the inner cylinder space 1770 of the flip arm 1700 to prevent the positive pressure Pb applied to the internal cylinder space 1770 of the flip arm 1700 through the positive pressure pipe 1800 leakage.

Generally, the positive pressure Pb may be applied to the flip arm 1700 through the positive pressure tube 1800 only during the rotation of the flipper 1000, or the positive pressure Pb may be variable. For example, if the positive pressure Pb remains constant continuously during the pickup of the die by the pickup unit 1100, the support load 1400 and the flip arm 1700 can be unified One is a rigid body and can therefore damage the die.

The method of controlling the flipper 1000 according to the present invention and controlling the positive pressure Pb applied through the positive pressure pipe 1800 or the negative pressure Ps applied through the negative pressure pipe 1200 according to the operating state of the flipper 1000 will be described with reference to FIG. 6 .

Specifically, the present invention can provide a method of controlling a flipper, the flipper comprising: a pick-up unit for sucking and picking up dies; a flip arm, on which the pick-up unit is mounted, and the flip arm is mounted on the main body so as to be able to Rotate and can move up or down; support load, support load is installed in the flip arm, and the unit can be displaced within a predetermined range in the length direction, and the pick-up unit is installed on the end of the support load; elastic member, elastic a member is disposed between a support member having a supporting load therein and the pick-up unit; a negative-pressure tube coupled to the pick-up unit to apply negative pressure to the pick-up unit; and a positive-pressure tube coupled to the flip arm, To supply carrying power to the supporting load. In this method, the following steps can be performed continuously: while the pick-up unit is rotated and moved vertically downward to a certain height, a positive pressure is maintained to compensate the inertia of the flip arm; the positive pressure is discharged at a certain height; After the discharge of the pressure is completed, the die is adsorbed by the pickup unit by applying negative pressure from the negative pressure tube, and at the same time, the impact applied when the pickup unit is further moved down and contacts with the die is relieved by using an elastic member; Rotate the pick-up unit while moving vertically upwards to a certain height and applying and maintaining positive pressure.

FIG. 6 shows that in a system with two flippers 1000 of FIG. 5, die C is picked up by a first flipper 1000a and flipped by a second flipper The state in which the flipper 1000b is unloaded, and the state in which the first flipper 1000a and the second flipper 1000b are rotated.

Specifically, (a) of FIG. 6 shows that in a system with two flippers 1000a and 1000b (such as flipper 1000 of FIG. 5 ), die C is picked up by the first flipper 1000a and flipped by the second flipper the state that the server 1000b is unloaded. (b) of FIG. 6 shows a state in which the first flipper 1000a and the second flipper 1000b are rotated. (c) of FIG. 6 shows the structure of the positive pressure pipe 1800 of the flipper 1000 of FIG. 5 .

The flipping system shown in FIG. 6 may include two flippers 1000a and 1000b, and sequentially pick up dies C stacked on a wafer and transfer dies C for subsequent processing without switching between flippers 1000a and 1000b. Interference occurs between 1000b. The flip system of FIG. 6 may include a down vision unit 2000 to inspect the alignment of dies to be picked.

In the flippers 1000a and 1000b and the control method thereof according to the present invention, the negative pressure Ps may be applied through the negative pressure tube 1200 during suction and pickup of the die C through the pickup unit 1100 of each of the flippers 1000a and 1000b.

Therefore, as shown in (a) of FIG. 6 , the first flipper 1000a may start to apply the negative pressure Ps before the die C is sucked to reduce the vacuum generation time, and as shown in (b) of FIG. 6 , even in During the rotation of the first flipper 1000a, the negative pressure Ps can also be maintained to be applied through the negative pressure pipe 1200. This means that the application of the negative pressure Ps should be maintained while the die C is picked up by the pickup unit 1100 .

A positive pressure Pb is applied to the inner cylinder space 1770 of the flip arm 1700 to prevent movement or shaking of the supporting load 1400 on which the pickup unit 1100 is mounted. Therefore, when the suction of the die C is started to pick up the die C, the positive pressure Pb may not be applied. That is to say, if the positive pressure Pb is applied to the cylinder of the flip arm 1700 through the positive pressure tube 1800 , the bearing power can be generated at the supporting load 1400 , so when the die C is in contact with the pick-up unit 1100 , the elastic member 1300 is transmitted through the elastic member 1300 . Buffering operations performed by etc. may be disturbed.

Therefore, during the suction of the die C by the pickup unit 1100, the application of the positive pressure Pb can be canceled.

Therefore, since the first flipper 1000a of FIG. 6(a) performs suction to pick up the die C, the positive pressure Pb is not applied to the first flipper 1000a. Since the second flipper 1000b does not pick up the die C, a positive pressure Pb may be applied to the second flipper 1000b to fixedly support the load 1400 and the pickup unit 1100 .

In addition, as shown in (b) of FIG. 6 , when the position of the pickup unit 1100 of each of the flippers 1000a and 100b is changed due to the rotation of the flippers 1000a and 1000b, the positive pressure Pb can pass through the flippers 1000a and 1000b Each of the positive pressure tubes 1800 is applied to prevent movement, shaking or vibration of the support load 1400 and the pickup unit 1100, thereby improving the reliability of the rotation of the flippers 1000a and 1000b and the reliability of when the die C is sucked Die C reliability.

If the first flipper 1000a includes the first stopper 1920 to limit the rotation range of the flipping arm 1700, the first flipper on the flipping arm 1700 The pad 1740 may be in contact with the first stopper 1920, and thus a high inertial force may be generated when the rotation of the flip arm 1700 is completed. Therefore, also in this case, the application of the positive pressure Pb can be maintained to prevent movement, shaking or vibration of the first flipper 1000a.

Therefore, the application of the positive pressure Pb can be maintained during the rotation of the flip arm 1700 .

As shown in (c) of FIG. 6 , the positive pressure pipe 1800 may be coupled to the inner cylinder space 1770 of the flip arm 1700 and may include a regulator 1810 and a control valve 1860 for applying the pressure through the positive pressure pipe 1800 The positive pressure Pb is uniformized, and the control valve 1860 is used to selectively block the positive pressure Pb. Therefore, the positive pressure Pb applied to the inner cylinder space 1770 of the flip arm 1700 through the positive pressure pipe 1800 is uniformized by the regulator 1810 . The control valve 1860 may be used to selectively apply or block the positive pressure Pb according to the operating state of the flipper 1000a or 1000b.

When the positive pressure Pb is blocked (when the application of the positive pressure Pb is canceled), the air remaining in the inner cylinder space 1770 may be quickly discharged to the atmosphere to prevent the air being applied to the inner cylinder space 1770 of the flip arm 1700 The positive pressure Pb remains and prevents the remaining positive pressure Pb from being transferred to the die C when the die C is picked up.

7 shows that when the rotation of the first flipper 1000a and the second flipper 1000b in the state of FIG. 6 is completed, the die C picked up by the first flipper 1000a is unloaded and the second flipper moves down to the bare The state of the height at which slice C will be picked up.

As shown in (a) of FIG. 7, at the flippers 1000a and 1000b In the absence of interference therebetween, the state in which the rotation of the flippers 1000a and 1000b is completed should be understood as a state in which the rotation of the first flipper 1000a is completed so that the pickup unit 1100 of the first flipper faces upward, and the first flipper is completed. The rotation of the second flipper 1000b makes the pickup unit 1100 of the second flipper 1000b face downward.

In this case, the negative pressure Ps is applied to the first flipper 1000a sucking the die C through the negative pressure pipe 1200, and the positive pressure Pb is passed through the positive pressure pipes 1800 of the first flipper 1000a and the second flipper 1000b Instead, it is applied to the first flipper 1000a and the second flipper 1000b.

As described above, the support load 1400 can be supported by the positive pressure Pb applied to the first flipper 1000a and the second flipper 1000b through the positive pressure pipe 1800, so no matter how the first flipper 1000a and the second flipper 1000b are rotated, the Movement, shaking or vibration of one flipper 1000a and the second flipper 1000b can be minimized. In addition, the negative pressure Ps is applied to the first flipper 1000a together with the positive pressure Pb, so that the suction state of the picked-up die C can be stably maintained.

As shown in (b) of FIG. 7 , when the die C picked up by the first flipper 1000a is unloaded, the negative pressure Ps applied to the pickup unit 1100 of the first flipper 1000a may be removed, and the first flipper 1000a may be completed. The downward movement of the second flipper 1000b. Therefore, the positive pressure Pb applied through the positive pressure pipe 1800 can be removed before another die C is adsorbed. In order to suck another die C, a negative pressure Pb is applied to the pickup unit 1100 .

The downward movement of the second flipper 1000b will now be described in detail. The second flipper 1000b may face the wafer w while being rotated move down. Before the pickup unit 1100 of the second flipper 1000 comes into contact with the die C, when the rotational motion of the second flipper 1000 starts, the second flipper 1000b may move down to a predetermined height at a high speed, and then the second flipper 1000 Can move down at low speed.

When moving downward at a low speed, the second flipper 1000b may move to a height close to the die C at a uniform speed before the pickup unit 1100 contacts the die C. In this case, the second flipper 1000b may exhaust the air in the inner cylinder space 1770 to the atmosphere and move downward until the pickup unit 1100 contacts the die C.

The flippers 1000a and 1000b for picking up and flipping the die C as described above can selectively provide the positive pressure Pb and the negative pressure Ps according to the operating states of the flippers 1000a and 1000b, thereby improving the suction state of the die C. stability, and minimize movement or vibration of the flippers 1000a and 1000b when the flippers 1000a and 1000b are operating.

During the flipping of the die C and the downward movement of the flippers 1000a and 1000b, the positive pressure Pb can limit the displacement of the pickup units 1100 of the flippers 1000a and 1000b, and thus the flippers 1000a and 1000b can rotate and move downward at high speed, thereby increasing productivity.

FIG. 8 is a cross-sectional view illustrating a flipper 1000 and a control method thereof according to another embodiment of the present invention. The descriptions of the same parts of FIG. 8 as those of FIGS. 5 to 7 described above will not be repeated here, and the differences between FIG. 8 and FIGS. 5 to 7 will now be focused on.

In the flipper 1000 of FIG. 8 , similar to the embodiment of FIG. 5 , the pickup unit 1100 is mounted on the flip arm 1700 via a support load 1400 It is displaceable in the middle, but the elastic member 1300 for absorbing the shock generated during adsorption of the die is omitted.

That is, in the flipper 1000 of FIG. 8 , the elastic member 1300 is not provided between the pickup unit 1100 and the supporting part 1760 of the flip arm 1700 , and a method of controlling the application of the positive pressure Pb via the positive pressure pipe 1800 may be used instead. Elastic member 1300.

More specifically, a flipper according to another embodiment of the present invention includes: a pick-up unit for sucking and picking up dies; a flip arm on which the pick-up unit is mounted, and which is mounted on the main body so as to be operable Rotate and can move up or down; support load, support load is installed in the turning arm and displaceable within a predetermined range in the length direction, and the pick-up unit is installed at the end of the support load; negative pressure pipe, negative pressure a tube coupled to the pick unit to apply negative pressure to the pick unit; and a positive pressure tube coupled to the flip arm to provide carrying power to the support load by selectively applying positive pressure to the flip arm, and the positive pressure tube is used for to apply the first positive pressure or the second positive pressure. The first positive pressure applied to the support load can be maintained to compensate for the inertia of the flip arm while the flip arm rotates and moves downward, and a second positive pressure is applied to the support load just before the pick unit contacts the die.

Here, the positive pressure pipe may include a control valve to selectively apply the first positive pressure and the second positive pressure. The first positive pressure is higher than the second positive pressure.

That is, in the previous embodiment, the application of the positive pressure Pb through the positive pressure tube 1800 is eliminated during the application of the negative pressure Ps to the pickup unit 1100 through the negative pressure tube 1200 to pick up the die by the pickup unit 1100 . In contrast, in the flipper 1000 of FIG. 8 , the positive pressure pipe 1800 can be applied The applied positive pressure Pb may be divided into a first-level positive pressure Pb1 and a second-level positive pressure Pb2, the first-level positive pressure Pb1 being used to minimize the flipper during the operation of the flipper 1000 (such as the rotation of the flipper 1000 ) 1000 vibration or movement, the second level positive pressure Pb2 is applied through the positive pressure tube 1800 to absorb the shock generated when the die is sucked while the negative pressure Ps is applied through the negative pressure tube 1200 during pick-up of the die.

That is, the second level positive pressure Pb2 can provide a low resistance enough to absorb the pressure applied to the die when the ejector pin is lifted, or absorb the pressure due to the suction pad of the pickup unit 1100 1110 is in contact with the die while the die is supported on the wafer, and the second-level positive pressure Pb2 can achieve substantially the same effect as when the elastic member 1300 is used as a cushion.

9 shows the state in which die C is picked up by the first flipper 1000a and unloaded by the second flipper 1000b in a system including two flippers 1000a and 1000b (such as flipper 1000 of FIG. 8 ), and the first A state in which a flipper 1000a and a second flipper 1000b are rotated.

In detail, (a) of FIG. 9 shows that in a system including two flippers 1000a and 1000b (eg, flipper 1000 of FIG. 8 ), die C is picked up by a first flipper 1000a and flipped by a second flipper the state that the server 1000b is unloaded. (b) of FIG. 9 shows a state in which the first flipper 1000a and the second flipper 1000b are rotated. (c) of FIG. 9 shows the structure of the positive pressure pipe 1800 of the flipper 1000 of FIG. 8 .

As shown in FIG. 9( a ), unlike the previous embodiments, during the pickup of the die C by the first flipper 1000 a , the positive pressure tube 1800 passes through the A second level positive pressure Pb2 is applied. The second-level positive pressure Pb2 is applied to the inner cylinder space 1770 of the flip arm 1700 to absorb shock generated during suction of the die C when the negative pressure Ps is applied to the pickup unit 1100, and the die C is suctioned and picked up. As shown in (a) of FIG. 9 , the positive pressure Pb is applied to the second flipper 1000b to fixedly support the load 1400 and the pickup unit 1100, and since the second flipper 1000b does not attract the die C, the negative pressure Ps is not applied to the second flipper 1000b.

Similar to the previous embodiment, as shown in (b) of FIG. 9 , while both the first flipper 1000a and the second flipper 1000b are rotated, the first-level positive pressure Pb1 is transmitted through the first flipper 1000a and the second flipper 1000b. The positive pressure pipe 1800 of the second flipper 1000b is applied to prevent the movement of the support load 1400 and the pickup unit 1100 when the position of the pickup unit 1100 is changed due to the rotation of the first flapper 1000a and the second flapper 1000b, Shake or vibrate. Therefore, the rotation reliability of the flippers 1000a and 1000b and the reliability of the suction state of the die C can be improved. As in the previous embodiment, the negative pressure Ps is applied only to the first flipper 1000a that picks up the die C.

As shown in FIG. 9( c ), the positive pressure pipe 1800 is branched into a first positive pressure pipe 1800a for applying the first level positive pressure Pb1 and a second positive pressure pipe 1800b for applying the second level positive pressure Pb2. The first control valve 1860x is disposed in front of the inner cylinder space 1770 to selectively apply the first level positive pressure Pb1 or the second level positive pressure Pb2 according to the operation state of the flipper 1000a or 1000b. Therefore, the first control valve 1860x may communicate the passage of the first positive pressure pipe 1800a with the inner cylinder space 1770 when the first level positive pressure Pb1 is applied. When the second level positive pressure Pb2 is applied, the first control valve 1860x may communicate the passage of the second positive pressure conduit 1800b with the inner cylinder space 1770.

In the passage of the second positive pressure pipe 1800b, a regulator 1810b, a proportional valve 1860z for controlling the degree of openness of the passage according to the pressure, a second pressure for selecting the second positive pressure pipe 1800b and the atmosphere can be provided Control valve 1860y, etc.

Since the positive pressure pipe 1800 is branched into the first positive pressure pipe 1800a and the second positive pressure pipe 1800b, when it is necessary to reduce the positive pressure Pb, it is possible to block the passage of the corresponding pipe, remove the pressure applied to the cylinder, and apply pressure with different The magnitude of the positive pressure Pb, instead of reducing the first-level positive pressure Pb1 to the second-level positive pressure Pb2, improves the resistance to the first-level positive pressure Pb1 and the second-level positive pressure Pb2 applied by the positive pressure tube 1800. The response to amplitude changes and the reliability of the amplitudes of the first-level positive pressure Pb1 and the second-level positive pressure Pb2.

Since the second positive pressure pipe 1800b and the atmosphere are selected using the second control valve 1860y, the residual pressure of the inner cylinder space 1770 can be quickly vented, and the second positive pressure pipe 1800b can be connected to the inner cylinder space through the second control valve 1860y 1770 to apply the second level positive pressure Pb2 when the discharge of the residual pressure of the inner cylinder space 1770 is completed, thereby improving the positive pressure switching response.

FIG. 10 shows that the die C picked up by the first flipper 1000a is unloaded and the second flipper 1000b is moved downward in a state where the rotation of the first and second flippers 1000a and 1000b in the state of FIG. 9 is completed. State to the height at which Die C will be picked.

As shown in (a) of FIG. 10 , similar to the previous embodiment, In a state in which the flippers 1000a and 1000b complete the rotation without interference between the flippers 1000a and 1000b, the rotation of the first flipper 1000a is completed so that the pickup unit 1100 of the first flipper 1000a faces upward, and the first flipper 1000a faces upward. The rotation of the second flipper 1000b is completed, so that the pick-up unit 1100 of the second flipper 1000b faces downward, the negative pressure Ps is applied to the first flipper 1000a that adsorbs the die through the negative pressure tube 1200, and the first level positive pressure Pb1 is applied to the first flipper 1000a and the second flipper 1000b through the positive pressure pipe 1800 .

As shown in (b) of FIG. 10 , when the die picked up by the first flipper 1000a is unloaded, the negative pressure Ps applied to the pickup unit 1100 of the first flipper 1000a may be removed, and the second flipper The downward movement of 1000b can be done. Therefore, the operation of applying the first-level positive pressure Pb1 through the positive-pressure tube 1800 is canceled, and the first-level positive pressure Pb1 is lowered to the second-level positive pressure Pb2 before another die C is adsorbed. In order to reduce the vacuum generation time, a negative pressure Ps is applied to the pickup unit 1100 before another die C is adsorbed. Thus, during the suction of the die C by the pickup unit 1100 , the positive pressure is continuously applied, and the applied positive pressure may be lower than the positive pressure applied during the rotation of the flip arm 1700 . In this case, when the positive pressure is applied, the positive pressure can be reduced by removing the applied positive pressure during the downward movement of the flip arm 1700 and applying a new positive pressure lower than the positive pressure.

As described above, in the method for controlling a flipper according to another embodiment of the present invention (wherein the flipper includes: a pick-up unit, the pick-up unit is used for sucking and picking up the die; a flip arm, on which the pick-up unit is mounted, And the flip arm is mounted on the main body and can be rotated and moved up or down moving; a support load, the support load is installed in the flip arm to be displaceable within a predetermined range in the length direction, and the pick-up unit is installed on the end of the support load; a negative pressure tube, the negative pressure tube is coupled to the pick-up unit to apply negative pressure to the pick-up unit; and a positive pressure pipe, which is coupled to the flip arm to supply bearing power to the supporting load, the positive pressure pipe branches into a first positive pressure pipe and a second positive pressure pipe), which can be continuously The following steps are performed: while the pickup unit is rotated and moved vertically downward to a certain height, the first positive pressure is maintained to compensate the inertia of the flip arm; the first positive pressure is discharged at a certain height; after the discharge of the first positive pressure is completed , applying a second positive pressure lower than the first positive pressure; when the pick-up unit is further moved down and thus comes into contact with the die, the die is attracted by the pick-up unit by A second positive pressure to relieve shock generated during contact with the die; and in a state where the pickup unit is vertically moved upward to a certain height while the first positive pressure is applied and maintained, the pickup unit is rotated.

According to the above method, the flippers 1000a and 1000b for picking up and flipping the die C can selectively apply the positive pressure Pb and the negative pressure Ps according to the operation state of the flippers 1000a and 1000b, thereby improving the die in the suction state The stability of C, and minimize movement or vibration when operating the flippers 1000a and 1000b, and can also perform the function of an elastic member to protect the die.

In the bonding member for the bonding apparatus and the control method thereof according to the present invention, the bonding force applied to the die, such as a semiconductor wafer, when it is dipped into the flux or bonded to the bonding substrate can be precisely controlled. As a result, the bumps on the bottom surface of the die are prevented from being damaged, and The die can be prevented from chipping or cracking.

According to the present invention, even when the pneumatic pressure member whose volume can be changed according to the pressure is used, the pneumatic pressure can be divided into two parts, and even if the volume of the pneumatic pressure member is changed, the damping power can be continuously supplied to the engaging member, thereby Avoid or minimize wobbling of jointed components. Thereby, the joining member can be stabilized.

In the bonding apparatus and the control method thereof according to the present invention, the bare chip (such as a semiconductor wafer) sucked by the bonding member can be moved to the dip plate or the bonding substrate containing the flux at high speed, so that the UPH can be lowered without reducing the UPH. Maximize productivity.

Although the present invention has been described above in conjunction with the exemplary embodiments of the present invention, it should be understood by those skilled in the art that various changes and modifications can be made without departing from the technical spirit and scope of the present invention. Therefore, it is obvious that all modifications are included in the technical scope of the present invention as long as the modifications include components claimed in the scope of the patent application of the present invention.

1: Die

11: Bumps

10: Joining components

100: Splice head

110: Joint parts

111: Engage the extractor

112: Air bearing

113: Sensor Dog

121: The first pneumatic pressure part

121a: Air chamber channel

121b: Air Chamber

122: Second pneumatic pressure part

122a: Cylinder channel

122b: Cylinder

122c: Support load

130: Sensor parts

200: lift drive

300: Impregnated Board

310: Flux

Claims (14)

A bonding apparatus comprising: a bonding head for sucking diced die individually; a driver for moving the bonding head in a vertical direction and moving the bonding head transferred to a position on the XY plane; and a bonding substrate on which the die sucked by the bonding head is mounted, wherein the bonding head includes: a bonding member for vacuum sucking the bonding member a die; a first pneumatic pressure member for supplying buffer power to the engagement member by selectively applying and canceling the application of pneumatic pressure to the first pneumatic pressure member , wherein the first pneumatic pressure member has an air chamber whose volume is variable according to the pressure, and keeps applying pneumatic pressure until the bonding member moves to the upper part of the bonding substrate and reaches a certain height, and when the die is moved removing the pneumatic pressure when mounted to the bonding substrate; and a second pneumatic pressure member continuously applying pneumatic pressure that moves the bonding member to the bonding substrate Pneumatic pressure injected above and up to a certain height until it is mounted to the bonding substrate; wherein while transferring the bonding head to the position on the XY plane, the application of the first pneumatic pressure member and the The pneumatic pressure of the second pneumatic pressure member to firmly support the suction on the a die of the bonding member; and when the bonding head moves vertically downward, in a state where the bonding head is spaced apart from the upper portion of the bonding substrate by a predetermined height, the pressure applied to the first pneumatic pressure member The pneumatic pressure is removed, leaving only the pneumatic pressure applied by the second pneumatic pressure member in the bonding member, and in a state of reducing the bonding force applied to the die sucked by the vacuum, the bare chip sucked by the bonding member A chip is mounted on the bonding substrate. A bonding apparatus comprising: a bonding head for sucking diced die individually; a driver for moving the bonding head in a vertical direction and moving the bonding head conveyed to a position on the XY plane; a dip plate, the dip containing the flux to be applied to the bottom surface of the die adsorbed by the bond head; and a bond substrate, on the bond substrate Mounting the die coated with the flux, wherein the bonding head includes: a bonding part used for vacuum adsorption of the die; a first pneumatic pressure part used for supplying damping power to the engagement member by selectively applying and canceling the application of pneumatic pressure to the first pneumatic pressure member, wherein the specific volume of the first pneumatic pressure member is variable according to the pressure of air a chamber; and a second pneumatic pressure member to which pneumatic pressure is continuously applied, wherein the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained while the bonding head is transferred to the position on the XY plane, and when the bonding head is vertically downward While moving, in a state where the bonding head is spaced apart from the upper portion of the dip plate by a predetermined height, the pneumatic pressure applied to the first pneumatic pressure member is removed, and the flux is applied to the The bonding member is adsorbed on the bottom surface of the die. The joining apparatus according to claim 1 or 2, wherein the first pneumatic pressure member further comprises an air chamber passage through which air from an external air box is supplied and delivered, the air a chamber for expanding by air supplied from the air chamber passage to supply driving force to the engagement member; a force control regulator for controlling the air supply from the outer air box pressure; and a valve to start or stop the supply of air to the air chamber. The joining apparatus according to claim 3, wherein when the supply of air to the air chamber is stopped, the air remaining in the air chamber is discharged to the outside, thereby being applied only to the second pneumatic pressure member The pneumatic pressure is retained in the engagement member to reduce the pressure applied to the engagement member. The joining apparatus of claim 1 or 2, wherein the second pneumatic pressure member comprises: a cylinder passage through which air from an external air box is supplied and delivered; a cylinder to deliver the pressure of the air supplied by the cylinder passage to a support load; and the support load, the A support load is used to support the engagement member by supplying a damping power with a certain pressure to the engagement accessory according to the pressure transmitted to the support load. The joining apparatus according to claim 5, wherein the support is changed when the pneumatic pressure applied to the first pneumatic pressure member is removed and the volume of the air chamber to which air is supplied is thereby changed The load is supported using the pneumatic pressure held by the second pneumatic pressure member to supply the damping power to the engagement member. The bonding apparatus of claim 1 or 2, wherein the bonding member comprises a sensor dog and the bonding head comprises a sensor member for sensing distance from the sensor The physical distance of the dog, the sensor component is spaced a certain distance from the sensor dog. The bonding apparatus according to claim 1 or 2, wherein the bonding member comprises: a bonding pickup for physically contacting and attracting the die; and an air bearing, the air A bearing is used to rotate the engagement pickup, the air bearing is coupled to an upper portion of the engagement pickup, and the engagement member further includes: an air box to supply air to the air bearing; and an air regulator to control the pressure of the supplied air. The bonding apparatus of claim 1 or 2, further comprising a flipper to pick up the diced die, rotate the die 180° to turn the die upside down, and turn the die The wafer is transferred to the bonding head, wherein the flipper includes: a pick-up unit for sucking and picking up the die; a flip arm on which the pick-up unit is mounted, and the The turning arm is mounted on the main body and is rotatable and can move up or down; a support load is installed in the turning arm and is displaceable within a predetermined range in the length direction, and all of which are the pick-up unit is mounted on the end portion that supports the load; an elastic member for absorbing shock generated during the contact of the pick-up unit with the die, the elastic member provided therein including the between a support member supporting a load and the pick-up unit; a negative pressure pipe for applying negative pressure to the pick-up unit to maintain the negative pressure while the die is picked up by the pick-up unit pressure, the negative pressure pipe is coupled to the pickup unit; and a positive pressure pipe for supplying carrying power to the support load by applying positive pressure into the flip arm, the positive pressure pipe coupled to the flip arm, wherein the positive pressure applied to the support load through the positive pressure pipe is maintained to compensate the inertia of the flip arm while the flip arm rotates and moves downward, and the pickup unit is immediately connected to the bare The positive pressure is removed prior to sheet contact. The bonding apparatus of claim 1 or 2, further comprising a flipper to pick up the diced die, rotate the die 180° to turn the die upside down, and turn the die The wafer is transferred to the bonding head, wherein the flipper includes: a pick-up unit for sucking and picking up the die; a flip arm on which the pick-up unit is mounted, and the The turning arm is mounted on the main body and is rotatable and can move up or down; a support load is installed in the turning arm and is displaceable within a predetermined range in the length direction, and all of which are the pick-up unit is mounted on the end that supports the load; a negative pressure tube for applying negative pressure to the pick-up unit to hold the die while being picked up by the pick-up unit a negative pressure, the negative pressure pipe is coupled to the pickup unit; and a positive pressure pipe used to apply a first positive pressure or a second positive pressure, the positive pressure pipe is coupled to the flip arm to supply carrying power to the support load by selectively applying positive pressure to the flip arm; wherein a first positive pressure applied to the support load is maintained to compensate for any the inertia of the flip arm, and The second positive pressure is applied to the support load, the second positive pressure being lower than the first positive pressure, immediately before the pickup unit is brought into contact with the die. A method of controlling a bonding apparatus, the bonding apparatus including a bonding head, a driver and a bonding substrate, the bonding head having a bonding part, a first pneumatic pressure part and a second pneumatic pressure part, the bonding part used for vacuum suction cutting a die, the volume of the first pneumatic pressure part is variable according to pressure to supply buffer power to the engagement part, and the application of pneumatic pressure and the cancellation of the pneumatic pressure are selectively performed in the first pneumatic pressure part The application of pressure, and the second pneumatic pressure member is continuously applied with pneumatic pressure, the driver is used to move the bonding head in the vertical direction and transfer the bonding head to a position on the XY plane, where the bonding A die sucked by the bonding head is mounted on the substrate; the method includes the steps of: while the bonding head sucking the diced die is transported above the bonding substrate and moves vertically downward to a certain height, maintaining the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member; discharging the pneumatic pressure applied to the first pneumatic pressure member of the joint head to the outside at the certain height; When the discharge of the pneumatic pressure is completed, the bonding head is further moved downward and the die sucked by the bonding head is mounted on the bonding substrate; and when the mounting of the die is completed, the corresponding pneumatic pressure is Applied to the The first pneumatic pressure member is maintained in a state where the joint head is moved vertically upward to a certain height, and subsequent processing is performed; wherein the applied pressure to the first pneumatic pressure member and the second pneumatic pressure member is maintained. the step of pneumatic pressure, the step of discharging the pneumatic pressure applied to the first pneumatic pressure member, the step of further moving the bonding head downward and mounting the die sucked by the bonding head on the bonding substrate, and the steps of performing subsequent processing are repeated, after the bonding head is moved vertically above the bonding substrate or the bonding head is moved to a certain height above the bonding substrate, and pneumatic pressure is applied to the first pneumatic The pressure member and the second pneumatic pressure member are held to firmly support the die adsorbed on the bonding member, and the bonding head moves to a certain height above the bonding substrate, then the first pneumatic pressure member The pneumatic pressure is discharged to the outside, and the impact applied to the die is relieved by the relieved pneumatic pressure. When the die adsorbed on the bonding head is mounted on the bonding substrate, the first pneumatic pressure component is discharged. The pneumatic pressure maintained by the second pneumatic pressure member applies a buffer force to the bonding member in a state of a high pneumatic pressure, so that the die adsorbed on the bonding head is mounted on the bonding substrate. A method of controlling a bonding apparatus including a bonding head, a driver, a dip plate and a bonding substrate, the bonding head having a bonding member, a first pneumatic pressure member and a second pneumatic pressure member, the bonding member for vacuuming The diced die is adsorbed, and the volume of the first pneumatic pressure member is variable according to the pressure to supply a cushioning force to the bonding member. force, and the application of pneumatic pressure and the cancellation of the application of the pneumatic pressure are selectively performed in the first pneumatic pressure part, and the second pneumatic pressure part is continuously applied with the pneumatic pressure, and the actuator is used to vertically moving the bonding head up and transporting the bonding head to a position on the XY plane, the dip plate contains the flux to be applied to the bottom surface of the die adsorbed by the bonding head, at The die coated with the flux is mounted on the bonding substrate, and the method includes the steps of: conveying the bonding head above the dip plate and moving vertically downward to a certain height on the bonding head that absorbs the diced die At the same time, the pneumatic pressure applied to the first pneumatic pressure member and the second pneumatic pressure member is maintained; the pneumatic pressure applied to the first pneumatic pressure member of the joint head is discharged to the outside at the certain height ; when the discharge of the corresponding pneumatic pressure is completed, move the bonding head further down and apply the flux contained in the dip plate to the bottom surface of the die adsorbed by the bonding head; when the When the step of applying the flux to the bottom surface of the die is completed, while pneumatic pressure is applied to the first pneumatic pressure member and maintained in a state in which the bonding head is moved vertically upward to a certain height , transferring the die over the bonding substrate; and mounting the flux-coated die onto the bonding substrate, wherein the first pneumatic pressure member and the second pneumatic pressure remain applied The step of pneumatic pressure of the part, the step of discharging the pneumatic pressure applied to the first pneumatic pressure part, the step of moving the bonding head further down and applying the flux contained in the dip plate to be Engagement head suction The steps on the bottom surface of the attached die, transferring the die over the bonding substrate, and mounting the flux coated die on the bonding substrate are repeated . The method of claim 11 or 12, wherein the bonding apparatus further comprises a flipper to pick up the diced die, rotate the die 180° so that the die is turned upside down, and transferring the die to the bonding head, wherein the flipper includes: a pick-up unit for sucking and picking up the die; a flip arm on which the pick-up unit is mounted , and the turning arm is mounted on the main body and is rotatable and can move up or down; a supporting load is installed in the turning arm and is displaceable within a predetermined range in the length direction , and wherein the pick-up unit is installed on the end of the support load; an elastic member, the elastic member is provided between the support member including the support load and the pick-up unit; a negative pressure pipe, so the negative pressure tube is coupled to the pick-up unit to apply negative pressure to the pick-up unit; and a positive pressure tube is coupled to the flip arm to supply bearing power to the support load, and wherein The method further includes the steps of: maintaining a positive pressure to compensate the inertia of the flip arm while the pickup unit rotates and moves vertically downward to a certain height; discharging the positive pressure at the certain height; After the discharge of the positive pressure is completed, the pickup unit adsorbs the die by applying a negative pressure from the negative pressure tube, and at the same time relieves the pickup unit by using the elastic member when the pickup unit moves further downward and an impact generated upon contact with the die; and rotating the pickup unit while the positive pressure is applied and maintained in a state where the pickup unit is moved vertically upward to a certain height, wherein the positive pressure is maintained The step of pressing, the step of discharging the positive pressure, the step of sucking the die by the pickup unit, and the step of rotating the pickup unit are continuously performed. The method of claim 11 or 12, wherein the bonding apparatus further comprises a flipper to pick up the diced die, rotate the die 180° so that the die is turned upside down, and transferring the die to the bonding head, wherein the flipper includes: a pick-up unit for sucking and picking up the die; a flip arm on which the pick-up unit is mounted , and the flip arm is mounted on the main body and is rotatable and can move up or down; a support load is installed in the flip arm and is displaceable within a predetermined range in the length direction , and wherein the pick-up unit is mounted on the end that supports the load; a negative pressure tube coupled to the pick-up unit to apply negative pressure to the pick-up unit; and a positive pressure tube, so The positive pressure tube is coupled to the flip arm to supply carrying power to the support load, the positive pressure tube branches into a first positive pressure tube and a second positive pressure tube A positive pressure tube, wherein the method further comprises the steps of: maintaining a first positive pressure to compensate for the inertia of the flip arm while the pickup unit rotates and moves vertically downward to a certain height; at the certain height The first positive pressure is discharged; after the discharge of the first positive pressure is completed, a second positive pressure lower than the first positive pressure is applied; attracting the die while at the same time alleviating the shock generated when the pickup unit moves further down and comes into contact with the die by the second positive pressure; and when the positive pressure is applied and the pickup The pickup unit is rotated while being held in a state where the unit is moved vertically upward to a certain height, wherein the step of maintaining the first positive pressure, the step of discharging the first positive pressure, the step of applying the second positive pressure The steps, the step of sucking the die by the pickup unit, and the step of rotating the pickup unit are performed continuously.

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