TWM507579U - Semiconductor device packaging system - Google Patents

Description

Semiconductor device packaging system

This creation is generally related to wafer packaging, and more specifically to die bonding.

The fabrication process of a semiconductor device typically includes the step of attaching or bonding the die to the substrate. One purpose of the attachment or bonding step is to create a strong physical bond between the die and the substrate. There are different methods of grain attachment, such as eutectic methods, welding methods, and bonding methods. The bonding method is widely used because of its economy and suitable for pipeline operation.

In the conventional die bonding process, the colloid is applied to the substrate or the lead frame by the siphon action and capillary action of the coating head by means of fluid contact of the coating head with the substrate or the lead frame at a close distance. The coating amount (volume) of the colloid is affected by the distance between the coating head and the substrate or the lead frame. When the distance is slightly longer, the coating amount is large, and when the distance is slightly, the coating amount is small. Due to various undesired factors such as fluctuations in the pipeline, warpage of the substrate or the lead frame, the amount of colloid coating per time is unstable, thereby affecting the quality of the grain bonding and the yield of the finished semiconductor device, and reducing the production efficiency.

One object of the present invention is to provide a semiconductor device packaging system to improve the quality of die bonding.

In one embodiment, a system for fabricating a semiconductor device is provided, the system comprising: a jetting head configured to inject a thermoset colloid onto a carrier; a mounting head configured to pass the semiconductor die via The thermoset colloid is applied to the carrier. Carrier example Such as but not limited to lead frames or printed circuit boards.

In one embodiment, the system also includes a transmitter configured to transmit the carrier.

In one embodiment, the system also includes an image sensor configured to detect the position of the carrier.

In one embodiment, the system also includes a controller configured to control the action of the injection head and the assembly head.

In one embodiment, the injection head includes a chamber to accommodate the thermoset colloid, the volume of the chamber being in the range of 0.1 to 200 cubic millimeters.

In one embodiment, the chamber in the injection head has a cylindrical shape with an inner diameter in the range of 0.01 mm to 2 mm and a height in the range of 0.02 mm to 100 mm.

In one embodiment, the system also includes a support structure to support the injection head and the assembly head.

10‧‧‧System

12‧‧‧Injection head

14‧‧‧Sensor

15a‧‧‧Vector

15b‧‧‧Vector

15c‧‧‧ Carrier

16‧‧‧Assembled head

18‧‧‧ Sensor

20‧‧‧ Controller

25‧‧‧transmitter

26‧‧‧ arrow

28‧‧‧Shell

The detailed description of the preferred embodiments of the present invention will be more readily understood from the accompanying drawings. The present invention is illustrated by way of example, and is not limited by the accompanying drawings.

1 shows a schematic perspective view of a system 10 for fabricating a semiconductor device; and FIG. 2 shows a partial cross-sectional view of the injection head 12 of the system 10.

The detailed description of the drawings is intended to be illustrative of the preferred embodiments of the present invention and is not intended to It is to be understood that the same or equivalent functions may be carried out in various embodiments that are intended to be included within the spirit and scope of the present invention.

As shown in FIG. 1, system 10 includes a controller 20, a jetting head 12, a mounting head 16, image sensors 14 and 18, a conveyor 25, and a housing 28. In order to clearly show other components, the outer casing 28 is indicated by a broken line. The outer casing 28 is generally used as a support structure for other components and can Dustproof and other functions. The injector head 12, the assembly head 16, the image sensors 14 and 18 are communicatively coupled to the controller 20 and operate under the control of the controller 20. The conveyor 25 can be, for example, a conveyor belt as shown in the figures, generally advanced in the direction indicated by arrow 26, carrying a carrier 15 such as, but not limited to, a lead frame or printed circuit board. Three carriers 15a, 15b and 15c are shown, wherein each carrier 15 comprises a plurality of carrier units arranged in a matrix. The conveyor 25 is controlled to intermittently stop the carrier 15 to facilitate the corresponding operation of the carrier by the glue head 12 and the assembly head 16.

The image sensor 14 is configured to detect the position of the carrier 15, and based on the detected position, the injection head 12 is controlled to inject a thermosetting colloid onto the carrier by the movement of the piston. The image sensor 18 is configured to detect the position of the glued carrier 15, and based on the detected position, the assembly head 16 is controlled to attach the semiconductor die to the thermoset colloid. In operation, when positioning the carrier, a single carrier unit positioning method may be employed. In addition, the image sensors 14 and 18 may also position the carrier by means of regional positioning. The glue head 12 and the assembly head 16 operate in the region according to the regional positioning result, and after the operation of the first carrier unit, jump to the next carrier unit according to the fixed spacing between the carrier units on the carrier. The operation is performed until the carrier unit in the area is completely operated, and the next area is again positioned by the image sensor. The figure shows a carrier 15a to which a colloid has not been injected, a carrier 15b which has been sprayed with a colloid but has not been bonded to a crystal grain, and a carrier 15c which has been bonded with crystal grains. Thereafter, the carrier that completes the die attach can be sent to an oven for heat curing. Typically, the injection head 12 includes a tubular chamber for receiving the colloid, the volume of which defines the volume of the gel that is injected each time. The jetting head 12 uses a gas and mechanical motion to complete the colloidal injection action. Therefore, in the pipeline operation, the amount of colloid applied per time is kept stable, thereby ensuring the quality of the die bonding, improving the yield of the finished semiconductor device, improving the production efficiency, and reducing the cost.

In addition to detecting the position of the carrier 15, the image sensors 14 and 18 can also be used to detect the operation quality. For example, the sensor 14 is used to detect the quality of the glue, and the image sensor 18 is used for detecting. Die bonding quality.

Fig. 2 is a partial cross-sectional view showing the injection head 12, and the hatched portion indicates the solid portion of the cross section. The tubular chamber may have a cylindrical shape with an inner diameter D and a height H. The inner diameter D is usually in the range of 0.01 mm to 2 mm, the height H is usually in the range of 0.02 mm to 100 mm, and the volume of the chamber is usually in the range of 0.1 to 200 mm 3 . The smaller inner diameter D is more conducive to the precise control of the amount of colloidal injection. The injection head 12 can be configured to be detachable, and different sizes of injection heads can be replaced to suit different needs.

Although the injection head 12 and the assembly head 16 are shown as being housed in the same housing 28 in the embodiment shown in FIG. 1, those skilled in the art will readily appreciate that the injection procedure and the die attach procedure can be separated and sprayed. The injector and assembly heads can also be integrated into two separate subsystems, controlled by separate controllers.

In another embodiment, a system for fabricating a semiconductor device includes an inkjet head, a mounting head, a fixed platform, a transfer robot, and the like. The fixed platform is used to place the carrier for operation by the injection head and the assembly head. A transfer robot is used to transport the carrier on a fixed platform.

In one embodiment, the support structure of the injection head includes a suspension rail that is substantially perpendicular to the forward direction of the conveyor belt, and the injection head is attached to the robot arm on the suspension rail so as to be controllable back and forth along the direction of the suspension rail mobile. The robot arm to which the injection head is attached may also be arranged to be able to move a short distance along the length of the conveyor belt, which can be achieved by an auxiliary suspension rail suspended above the suspension rail and perpendicular to the direction of the suspension rail.

In one embodiment, a plurality of injection heads may be attached to one robot arm so that a plurality of carriers or a plurality of regions on one carrier (such as but not limited to a plurality of die carriers on one lead frame) may be used at a time. Spray. The distance between the injection heads matches the injection area on the carrier.

Although various embodiments of the present work have been illustrated and described, the present work is not limited to such embodiments. Technical features that appear only in certain claims or embodiments are not meant to be combined with other claims or other features in the embodiments to achieve beneficial new techniques. Program. Many modifications, changes, variations, substitutions and equivalents will be apparent to those skilled in the art without departing from the scope of the invention.

10‧‧‧System

12‧‧‧Injection head

14‧‧‧Sensor

15a‧‧‧Vector

15b‧‧‧Vector

15c‧‧‧ Carrier

16‧‧‧Assembled head

18‧‧‧ Sensor

20‧‧‧ Controller

25‧‧‧transmitter

26‧‧‧ arrow

28‧‧‧Shell

Claims (7)

A semiconductor device package system, the system comprising: a transmitter configured to transport a carrier; a jetting head configured to inject a thermoset colloid onto the carrier; a mounting head configured And bonding a semiconductor die to the carrier of the injected thermosetting colloid, wherein the semiconductor die is attached to the carrier via the thermosetting colloid; and a controller coupled to the injection head and the assembly head It is configured and controlled to control the action of the injection head and the assembly head. The system of claim 1 further comprising an image sensor configured to detect the location of the carrier. A system according to claim 1, characterized in that the injection head comprises a chamber for accommodating the thermosetting colloid, the volume of the chamber being in the range of 0.1 to 200 cubic millimeters. The system of claim 3, wherein the chamber has a cylindrical shape with an inner diameter in the range of 0.01 mm to 2 mm and a height in the range of 0.02 mm to 100 mm. A system according to claim 1, further comprising a support structure for supporting the injection head and the assembly head. A system according to claim 1, characterized in that the carrier is a lead frame or a printed circuit board. A semiconductor device package system, the system comprising: a fixed platform configured to place the carrier; a transfer robot configured to transport the carrier on the fixed platform; and a jetting head Configuring to inject a thermoset colloid onto the carrier; a mounting head configured to attach the semiconductor die to the injected thermoset adhesive On the carrier of the body, and wherein the semiconductor die is attached to the carrier via the thermosetting colloid; and a controller coupled to the injection head and the assembly head and configured to control the injection head and The action of the assembly head.