JPH09246790A - Device for loading electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the mounting quality of electronic circuit board by sucking an electronic part by a suction nozzle without giving damages to the part during mounting. SOLUTION: A suction nozzle 16 consists of a nozzle body 16a and a tip end nozzle 29, and the body 16a is inserted/fitted to a nozzle holder 9 of a head part 6 in a manner that it is attachable and detachable and slidable in a horizontal direction. Further, the body 16a is energized downward by means of a spring 17 inside the holder 9 and the nozzle 29 is inserted/ fitted into the body 16a in a manner that it may be slidable horizontally, and at the same time the nozzle 29 is energized downward by means of a spring 32 inside the body 16a, allowing the nozzle 29 to be brought into contact with an electronic part 33 when the part is sucked.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting electronic components on an electronic circuit board.

[0002]

2. Description of the Related Art In recent years, when mounting electronic components on an electronic circuit board, it is required to mount the electronic components without damaging them and improve the mounting quality of the electronic circuit substrates.

(First Conventional Example) A first example of a conventional electronic component mounting apparatus will be described below with reference to FIGS. FIG. 3 is a schematic general view of a conventional electronic component mounting apparatus, in which a reference numeral 42 indicates a transport section for loading and unloading an electronic circuit board 49, and a reference numeral 4
Reference numeral 5 denotes an XY robot, which positions a head portion 46 including a suction nozzle that sucks an electronic component and mounts the electronic component on an electronic circuit board 49 at an arbitrary position. 43 is a reel mounted component supply unit for electronic components such as chip components, and 44 is a tray mounted component supply unit for electronic components such as QFP. Reference numeral 47 is a component recognition camera for picking up and measuring the suction posture of the electronic component, and 48 is a nozzle station for replacing and storing the suction nozzle.
FIG. 4 shows a part of a cross-sectional view of the head portion 46, and the upper end of the air path of the suction nozzle 34 is closed by a plug 35,
A connecting pipe is attached to the side that connects to the vacuum pump. The suction nozzle 34 can slide up and down in the nozzle holder 36, and is urged downward by a spring 40 and a piston 39 in the nozzle holder 36. Further, the spring 38 embedded in the side peripheral wall of the nozzle holder 36 and the spring 3
The ball 37 urged by 8 stops the suction nozzle 34 from stopping in the vertical direction and from rotating.

Next, the operation of the electronic component mounting apparatus will be described. The electronic circuit board 49 is carried into the mounting position by the carrying section 42. The XY robot 45 moves the head unit 46 onto the reel mounted component supply unit 43, and the suction nozzle 34 sucks the electronic component 41. In general, in order to stabilize the suction of the electronic component 41, the suction nozzle 34 is lowered to a position slightly lower than the upper surface of the electronic component 41. That is, the suction height of the suction nozzle 34 is set so as to be pushed into the electronic component 41. At this time, the suction nozzle 34 makes contact with the electronic component 41 and gives a contact impact to the electronic component 41 while maintaining a considerable speed. The picked-up posture of the picked-up electronic component 41 is picked up by the component recognition camera 48, and the position-corrected electronic circuit board 49 is mounted based on this information. Further, for example, when an electronic component such as QFP of the tray-mounted component supply unit 44 is mounted according to the electronic component to be mounted, the nozzle station 48 replaces it with an appropriate suction nozzle 34 and performs the mounting operation.

(Second Conventional Example) A second example of a conventional electronic component mounting apparatus will be described below with reference to FIG. It is already known, for example, in Japanese Patent Publication No. 63-14518, to urge the suction nozzle downward by a spring. FIG. 5 is a suction mechanism diagram of a second example of a conventional electronic component mounting apparatus. A suction chuck 59 that sucks an electronic component 60 is urged downward by a spring 58 provided in the suction rod 53, and the suction rod 53. Drives the vertical movement of the shaft 52, which is subject to the swing of the link 51, to the suction rod 5
Block 5 urged by a collar 54 and a spring 57 provided in
Receive via 6.

Next, the operation will be briefly described. The reel-supplied and supplied electronic component 60 is sucked by the suction chuck 59 in the component supply unit 62, and the electronic component 60 after suction is mounted on the electronic circuit board 61 after the suction posture is measured and the position is corrected.

[0007]

In the above configuration,
It has the following problems.

(Problems with respect to the first conventional example) In recent years, electronic components to be mounted range widely from small chip components to medium-sized and large-sized components such as QFPs and connectors, and there are various suction nozzles corresponding thereto.

In particular, when the parts such as the QFP, which require high mounting accuracy, are mounted, the sliding portion between the nozzle holder 36 and the suction nozzle 34 becomes long, and the suction nozzle 34 itself becomes heavy due to its high rigidity. It can reach 5-10 grams. Further, it is an essential condition for the electronic component mounting machine to improve the productivity, and the vertical movement speed of the suction nozzle for suction and mounting is shortened year by year in order to shorten the work cycle. As the suction nozzle becomes heavier and the suction speed becomes faster, the contact impact value between the electronic component and the suction nozzle during suction is about 2
In chip capacitors with a shock resistance load of less than ~ 3 kg, 90% or more of the chip cracks and chips occur.

(Problem with Second Conventional Example) Japanese Patent Publication No. 63-
The mounting speed of the electronic component mounting device at that time, which is disclosed in Japanese Patent No. 14518, is extremely slow, and with the structure of the suction mechanism, the pressing pressure when the electronic component and the suction chuck 59 contact each other at the time of suction is almost the biasing pressure of the spring 58. It was equal. If the same suction mechanism abuts at the speed of the current component mounting machine, almost 100% of electronic components will be damaged. In addition, the type of the suction chuck 59 cannot be selected so as to accommodate mounting of various electronic components.

As described above, in recent years, there has been a demand for a mounting means which is compatible with a wide range of components in the component mounting machine and at the same time realizes productivity improvement and which does not damage the components.

[0012]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a head portion in which a suction nozzle for sucking an electronic component can be replaced according to the type of the target electronic component, and the head unit. And a mechanism to position the
In an electronic component mounting apparatus having a mechanism for replacing and accommodating the suction nozzle, the suction nozzle is composed of a nozzle body and a tip nozzle, and the nozzle body can be attached to and detached from the nozzle holder of the head part and can be slid vertically. While the nozzle body is biased downward by the spring in the nozzle holder, the tip nozzle is slidably attached in the nozzle body in the vertical direction, and the tip in the nozzle body is moved by the spring. The nozzle is biased downward, the tip nozzle is configured to contact the electronic component at the time of component suction, and the spring in the nozzle body of various suction nozzles provided according to the type of electronic component It is characterized in that the spring strength is set appropriately so as not to damage the target electronic component at the time of contact according to the type of the electronic component to be operated.

According to the present invention, it is the tip nozzle having a small mass that comes into contact with the electronic component at the time of suction, and at that time, the tip nozzle is backed up to exert the biasing force mainly depending on the type of the electronic component. Since it is a spring inside the nozzle body set to an appropriate spring strength that does not cause damage at the time of contact, it is possible to absorb the impact at the time of contact, and as a result, the suction nozzle sucks electronic components without damaging them. Therefore, the mounting quality of the electronic circuit board can be improved.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG.

FIG. 1 is an overall schematic view of an electronic component mounting apparatus.
In FIG. 2, 2 is a carrying section for carrying in and out the electronic circuit board 1,
Reference numeral 5 denotes an XY robot, which positions a head portion 6 including a suction nozzle 16 that sucks an electronic component and mounts it on the electronic circuit board 1 at an arbitrary position. 3 is a reel mounted component supply unit for electronic components such as chip components, and 4 is a tray mounted component supply unit for electronic components such as QFP. Reference numeral 7 is a component recognition camera for imaging and measuring the suction posture of the electronic component, and 8 is a nozzle station for replacing and storing the suction nozzle.

As shown in FIG. 2, which is a sectional view of the head portion 6, the suction nozzle 16 includes a nozzle body 16a and a tip nozzle 2.
9. The nozzle body 16a can slide up and down in the nozzle holder 9, is biased downward by a spring 17 and a piston 18 in the nozzle holder 9, and is stopped in the vertical direction by a ball plunger 11 embedded in the side peripheral wall of the nozzle holder 9. And the rotation direction is stopped. The nozzle body 16a is provided with a shaft hole 88 whose lower end is open in the axial direction, and a tip nozzle 29 which is vertically slidable is inserted in the shaft hole 88. In addition, the nozzle body 16
A has a spring 32 for urging the tip nozzle 29 downward and a pin 31 for preventing the tip nozzle 29 from falling. Here, the urging force of the spring 32 is such that when the tip nozzle 29 comes into contact with the electronic component 33 and adsorbs it, the tip nozzle 29
Is set to be suitable for elastically receiving ascending as a piston.

The nozzle holder 9 is supported on the head body 19 by a pair of rotary bearings 20 and 21, and an output shaft 24 of a θ rotary motor 25 fixed to the head body 19.
Are connected with a set bolt 26. The head body 19 is fixed to the slider 28 of the LM guide 27,
It can be freely moved up and down by a vertical drive shaft (not shown).

Next, the air piping path to the suction nozzle 16 will be described. The air passage 13 provided in the annular groove shape on the outer periphery of the nozzle holder 9 is the air passage 22 of the head body 19.
And is connected to a vacuum circuit via a connector 23.
On the other hand, the nozzle holder 9 has an air passage 12 closed by the plugs 14 and 15. The air passage 12 is connected to the axial center of the tip nozzle 29 through the air passage formed by the axial hole 88 of the suction nozzle body 16a. It communicates with the formed air suction hole 30.

Next, the operation of the electronic component mounting apparatus will be described with reference to FIGS. The electronic circuit board 1 is carried into the mounting position by the carrier 2. The XY robot 5 moves the head unit 6 onto the reel mounted component supply unit 3, and the suction nozzle 16 sucks the electronic component 33. Since the suction height of the electronic component 33 is set so as to be pushed in to stabilize the suction, the speed is not zero when the tip nozzle 29 of the suction nozzle 16 contacts the electronic component 33. The tip nozzle 29 comes into contact with the electronic component 33 while maintaining a considerable speed, but the tip nozzle 29 weighs about 0.3 g, which is one tenth or less of the weight of the entire suction nozzle 16, and the electronic component 33 is almost shocked. Don't give. The impact value at that time is about 150 grams which is almost the same as the urging force of the spring 32, and even a chip capacitor having a small impact resistance will not be damaged at all.
The electronic component 33 after the suction is mounted on the electronic circuit board 1 after the suction posture is measured by the component recognition camera 7 and the position is corrected.

In the nozzle station 8, the nozzle body 16a is provided with a spring 32 set to an appropriate spring strength so as not to damage the target electronic component upon abutting, depending on the type of the target electronic component. Various suction nozzles 16 provided therein are housed.

For example, the QFP of the tray mounting component supply unit 4
The suction nozzle 16 used for electronic parts such as the above is arranged. In this case, the spring 32 of the suction nozzle 16 is adapted so as to be suitable for the electronic parts such as QFP, which has a larger shock resistance value than the chip capacitor. The urging force of is set to be larger than that described above.

The various suction nozzles 16 are constructed so as to be replaceable with respect to the head portion 6. Specifically, the nozzle holder 9 of the head portion 6 has a nozzle body 16a of the suction nozzle 16 mounted therein.
, With a force greater than the force that acts during the mounting operation,
The suction nozzle 16 can be inserted into the nozzle holder 9 by temporarily retracting the ball of the ball plunger 11 and then returning it to the original position. Suction nozzle 16
When removing from the nozzle holder 9, the reverse operation may be performed. Nozzle replacement means (not shown) for automatically performing such an operation is arranged in the nozzle station 8.

Then, an appropriate suction nozzle 16 is attached to the head portion 6 according to the type of the electronic component 33, and the electronic component 3
The mounting operation of 3 is performed.

In the above embodiment, the contact impact value when the electronic component is sucked is mainly mentioned, but the same can be said for the contact impact between the electronic component and the electronic circuit board which are sucked at the time of mounting. .

[0025]

According to the present invention, the electronic component can be adsorbed by the adsorption nozzle without damaging it, and the mounting quality of the electronic circuit board can be improved.

Further, only by exchanging the suction nozzle, it is possible to properly perform the mounting operation of a wide range of electronic components from a small component having a small impact resistance value to a large component having a large impact resistance value.

[Brief description of drawings]

FIG. 1 is an overall schematic diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a head portion thereof.

FIG. 3 is an overall schematic diagram of a first conventional electronic component mounting apparatus.

FIG. 4 is a sectional view of the head.

FIG. 5 is a view showing a suction mechanism of a second conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic circuit board 2 Transport part 3 Reel mounted component supply part 4 Tray mounted component supply part 5 XY robot 6 Head part 8 Nozzle station 9 Nozzle holder 11 Ball plunger 16 Adsorption nozzle 16a Nozzle body 17 Spring 18 Piston 29 Tip nozzle 32 Spring 33 Electronic components

Claims (1)

[Claims] 1. A head unit in which a suction nozzle for sucking an electronic component is replaceable according to the type of the target electronic component, and a mechanism for positioning the head unit at an arbitrary position.
In an electronic component mounting apparatus having a mechanism for replacing and accommodating the suction nozzle, the suction nozzle is composed of a nozzle body and a tip nozzle, and the nozzle body is detachable and vertically slidable on a nozzle holder of the head unit. The nozzle body is biased downward by a spring in the nozzle holder, while the tip nozzle is slidably mounted in the nozzle body in the vertical direction, and the spring in the nozzle body The tip nozzle is biased downward so that the tip nozzle contacts the electronic component when picking up the component, and the spring in the nozzle body of the various suction nozzles provided according to the type of the electronic component is the target. According to the type of electronic component to be used, each is set to an appropriate spring strength that does not damage the target electronic component at the time of contact. Child component mounting apparatus.