JP5352329B2 - Mounting processing work apparatus, mounting processing work method, and display substrate module assembly line - Google Patents

Abstract

The present invention provides an operation edge fixing base which can prevent component loading position precision or jointing reliability reduction caused by display substrate warpage in component loading joint processing of display device, a mounting processing operation device with an operation edge fixing base or a mounting processing operation method using the operation edge fixing base, a production line structure with the mounting operation device or operation method for providing a display substrate module assembly line with high yield rate and high operation efficiency. The mounting processing operation device or operation method for mounting components at the periphery of the display substrate comprises the following components: the operation edge fixing base for supporting and loading the operation edge of the loading component from the lower part; two movable side holding parts which support two edges for clamping the operation edge from the lower part; and a conveying moving base with a dimension which allows entering a dent-shaped part that is composed of the operation edge fixing base and the two side holding parts, wherein the operation edge fixing base is also provided with a substrate adsorption pad which adsorbs a planar display substrate after the adsorption of the planar display substrate.

Description

  In the present invention, a driving IC is mounted around a display substrate of an FPD (Flat Panel Display) such as liquid crystal or plasma, so-called TAB (Tape Automated Bonding) connection such as COF (Chip on Film), FPC (Flexible Printed Circuit), and the like. The present invention relates to a mounting processing work apparatus for mounting a peripheral board (PCB, Printed Circuit Board), and a display board module assembly line composed of them. More specifically, for example, a mounting processing work device and mounting processing work method having a substrate fixing base suitable for processing work for mounting TAB and IC, and a display configured based on the mounting processing work device or mounting processing work method The present invention relates to a substrate module assembly line or a display substrate module assembly method.

  The display substrate module assembly line is a process substrate for FPD display substrates such as liquid crystal and plasma (hereinafter, simply abbreviated as a substrate, and clearly described as a PCB substrate in the case of a PCB, for example). Is a device for mounting a driving IC, a TAB, a PCB substrate, and the like around the substrate by sequentially performing the above.

  For example, as an example of the processing step, (1) a terminal cleaning step for cleaning the TAB attachment portion at the substrate end, (2) an anisotropic conductive film (ACF, Anisotropic Conductive Film) is attached to the substrate end after cleaning. (3) A mounting step in which the TAB or IC is positioned and mounted at the position where the ACF is pasted on the substrate. (4) A pressing step in which the mounted TAB or IC is fixed by ACF by thermocompression bonding. (5) A PCB process (consisting of a plurality of processes) for attaching and mounting a PCB substrate on which an ACF is previously bonded to the side opposite to the TAB substrate side is included. Note that the ACF only needs to be attached in advance to either one of the members to be joined. As another example of the above processing steps, a configuration in which the ACF is attached in advance to the TAB or IC side is also possible. Furthermore, the number of processing apparatuses, processing units for rotating the substrates, and the like are required depending on the number of sides of the substrate to be processed and the number of TABs and ICs to be processed.

  Through such a series of processes, electrical connection is made through conductive particles inside the ACF by thermocompression bonding between the electrode on the substrate and the electrode provided on the TAB, IC, or the like. . At the same time, the substrate and TAB, IC, etc. are also mechanically bonded by curing of the ACF base resin.

In general, as the substrate size becomes larger or thinner, the edge of the substrate tends to be warped. In each of the above-described processes, for example, a mounting process for mounting TAB or IC, if a substrate on which a component is mounted is warped, it causes a mounting shift. Ideally, the board is directly fixed to the base surface with high plane accuracy when mounting components.
When positioning and holding the substrate on the substrate fixing base for fixing the substrate, generally, negative pressure air is used at the suction pad as described in Patent Document 1 or Patent Document 2, and the substrate is directed toward the processing apparatus. Adsorb and hold at front and rear ends or left and right ends. The structure of the suction pad itself is disclosed in, for example, Patent Document 3.

Japanese Patent Application Laid-Open No. 2001-228452 JP 2007-150077 A JP 2007-313607 A

However, in the method of holding the substrate on the surface of the suction pad described in Patent Document 1 or Patent Document 2, it is difficult to produce flat display devices in recent years in terms of ensuring flatness. For example, when the distance between the support portions is 500 mm, even in the case of a relatively good substrate, the flatness is about 0.1 to 0.5 mm, and it is difficult to increase the accuracy beyond that, and the mounting accuracy is limited. . This improvement in accuracy has become an urgent task for stabilizing the production of large display devices as the size of substrates increases.
Moreover, the conventional suction pad as disclosed in Patent Document 3 has a structure in which the surface of the panel is directly supported by the suction surface, and it is difficult to improve the accuracy of the substrate flatness.

SUMMARY OF THE INVENTION Accordingly, a first object of the present invention is to provide a display substrate module assembly line having a high yield or operating rate, which has a transport positioning mechanism capable of ensuring high-accuracy flatness capable of stably realizing production of a large display. It is.
A second object of the present invention is to provide a mounting processing work apparatus or mounting processing working method with a high yield or operating rate that can hold a substrate with high accuracy on a substrate fixing base.

  In order to achieve the first object, a work side fixing base that supports the work side on which the components of the display board are mounted is supported from below, and is parallel to the work side, and the lower portions of both sides sandwiching the work side are supported. A first feature is that a movable both-side holding part is provided, and a transporting and moving base having a size capable of entering the recessed portion formed by the working-side fixing base and the both-side holding part is provided.

  In order to achieve the first object, in addition to the first feature, the movable both-side holding part has a connecting part installed in parallel to the work side fixing base, and the both-side holding part The second feature is that it has a drive actuator that can move automatically and a position adjustment mechanism that can be manually adjusted.

  Further, the work side fixing base protrudes from the surface of the work side fixing pedestal, the suction part that sucks the display board, and draws the display substrate near the suction part of the work side fixing base by the negative pressure of vacuum suction, A third feature is that a suction pad that returns to its original position at the end of suction is provided.

ADVANTAGE OF THE INVENTION According to this invention, the suction pad which can hold | maintain a board | substrate to a board | substrate fixed base with high precision can be provided.
In addition, according to the present invention, it is possible to provide a mounting processing work apparatus or a mounting processing work method that can hold the substrate on the substrate fixing base with high accuracy.
Furthermore, according to the present invention, a display substrate module assembly line with a high yield or operating rate can be provided by adopting a line configuration having the mounting processing work apparatus or mounting processing work method described above.

It is a figure which shows the display board module assembly line which is the 1st Embodiment of this invention. It is an operation explanatory view of the transport and mounting unit for mounting the TAB / IC substrate TAB / IC board processing work apparatus equipment and conveying apparatus according to an embodiment of the present invention. 3 (a) is by the conveying means 2, the warpage of the substrate P, taking into account the deflection diagrams that transfers a substrate board fixing base by Ri H content high position of the mounting device. FIG. 3B is a diagram in which the substrate is placed on the substrate fixing base and the substrate holding means. FIG. 4A is an enlarged view of a part of the left side of the substrate fixing base according to the embodiment of the present invention shown in FIG. FIG.4 (b) is an enlarged view which shows the shape of the adsorption | suction groove | channel which shows other embodiment of the said embodiment. It is a diagram schematically showing a negative pressure system to the base surface adsorption grooves and the substrate suction pad which is an embodiment of the present invention to a negative pressure. It is a figure which shows the 1st Example of the board | substrate suction pad which is embodiment of this invention. It is the figure which showed the fundamental motion of the board | substrate suction pad and the board | substrate in the distortion correction function in 1st Example which is embodiment of this invention. It is a figure which shows the whole processing flow which considered the other flow in addition to the basic processing. It is the figure which showed the other Example of the board | substrate suction pad which is embodiment of this invention. FIG. 10A is a perspective view showing a state in which the support member is moved in order to perform the mounting process of the display substrate having a size different from that in FIG. 3 in the embodiment of the present invention. FIG. 10B is a partially enlarged view showing a part of the moving mechanism for moving the movable support member and a manual adjustment mechanism used when processing a display substrate having a different aspect ratio. Figure 11 is used as the other forms of embodiment of the present invention, is a perspective view showing an appearance of the base surface adsorption grooves.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a view showing a basic configuration of a display board module assembly line 1 according to an embodiment of the present invention, and FIG.

The apparatus of FIG. 1 has a substrate holding means 12 for holding a substrate P and a transfer device 2 including a transfer arm unit 11 for transferring the substrate to the position of an adjacent mounting processing work apparatus, from left to right in the figure. This is a line apparatus that performs various processing operations on the peripheral portion of the substrate while sequentially transporting the substrate toward the substrate, and performs mounting assembly operations such as IC and TAB. The apparatus of FIG. 1 first performs processing on the long side of the substrate with the mounting processing work group 13L on the long side of the left substrate, performs processing on the long side of the substrate, and then rotates the substrate with the substrate rotating means 19. Then, processing on the short side of the substrate is performed by the mounting processing apparatus group 13S on the short side of the substrate having the same configuration. In the substrate long side 13L and the substrate short side 13S, the same symbols are used for the same devices and functions.

1. From the left side of the long side of the substrate shown in FIG. 1, as a process, (1) a terminal cleaning process for cleaning the TAB attaching portion at the end of the substrate, (2) an anisotropic conductive film (ACF) at the end of the substrate after cleaning ACF process for pasting, (3) Mounting process for mounting TAB or IC by positioning with substrate wiring at the position where ACF is pasted, (4) Crimping fixed by ACF by heat pressing the mounted TAB or IC The process is sequentially performed, and further, a processing operation for mounting a PCB substrate as a peripheral substrate is performed at the end on the long side of the substrate.
14 to 20 in the figure are denoted by the same reference numerals on the long side and the short side, respectively, and the terminal cleaning processing work device 14, the ACF sticking processing work device 15, the TAB / IC mounting processing work device 16, and the main pressure bonding processing work, respectively. An apparatus 17 and a substrate rotating means 19 are shown. Note that a PCB substrate mounting processing work apparatus is omitted.

FIG. 2 is a cross-sectional view taken along the line AA as viewed from the X direction, which is the transport direction of the substrate P, and shows the mounting portion 16a for mounting the TAB / IC substrate of the TAB / IC mounting processing work device 16 and the transport device 2. It is. The mounting portion 16a adsorbs the TAB / IC substrate IC substrate at a substrate fixing base 20 (an example of a working side fixing base) on which the substrate P is placed and other positions, and the TAB / IC at a predetermined position on the substrate fixing base. And a mounting head 18 mounted on the substrate. The mounting head 18 includes, for example, a suction head 18a for sucking and holding an electronic component 3 represented by a flexible substrate COF or TAB on which a semiconductor integrated circuit IC is mounted, and a suction head for mounting the electronic component 3 on the mounting position of the substrate P. It has a cylinder 18b that moves up and down, a cylinder drive unit 18c that drives the cylinder, and an arm 18d that turns the cylinder drive unit to transport the IC substrate. Further, a lower support 18e is provided at a position facing the suction head 18a and sandwiching the substrate P.

On the other hand, the transfer device 2 includes a transfer arm unit 11 and a substrate holding unit 12. As shown in FIG. 1, the substrate holding means 12 has a holding portion 12B provided on the processing work apparatus side by connecting the holding portions 12A on both sides of the substrate and the holding portions on both sides. When the substrate P is transferred to the substrate fixing base 20 which is a processing work place of the substrate, the both-side holding unit 12A and the connection holding unit 12B are
The board | substrate P can be mounted reducing the bending of a board | substrate. On the other hand, the transfer arm 11A to the transport arm 11 moves up and down between the two side holding portion 12A (the example of the transfer movement the seat), FIGS. 2 (a) the substrate P as shown in (b) the substrate holding means 12置又mounting to have a substrate transfer arm lifting unit 11B for raising and lowering the transport arm 11A for separating the slider 11D that are moved in the transport direction the carrier arm 11 a on the guide rail 11C.

  According to the transfer apparatus 2 of this embodiment, since the substrate P can be directly transferred onto the substrate fixing base, there is no need to move the substrate P to the substrate fixing base after the transfer, thereby shortening the processing time. It can be done.

In the transport method in such a structure, the substrate P shown in FIG.
Will be described as an example of transporting from TAB / IC to the TAB / IC mounting processing work device 16. Transfer arms 11
As shown in FIG. 2 (b), the substrate P is held by the transfer arm 11A and lifted by the substrate transfer member lifting / lowering means 11B at the location of the ACF sticking processing work device 15, and the substrate P is connected to both side holding portions 12A. Separated from the holding portion 12B. Thereafter, the substrate P is transported to the position of the TAB / IC mounting processing work device 16 by the slider 11D while the substrate P is held upward. At this time, the transfer arm 11 </ b> A moves between the two substrate holding means 12. In the TAB / IC mounting processing apparatus 16, the substrate P is lowered and placed on the substrate holding means 12 (FIG. 2B), and the transfer arm 11A is separated from the substrate P. The substrate P is processed for mounting by the TAB / IC mounting processing device 16. During this mounting operation, the transfer arm 11A holds the posture not holding the substrate, and returns to the ACF attachment processing work device 15 to transfer the next substrate. The above series of operations is performed in synchronism with all the substrates P in operation on the assembly line 1, and all operations are conveyed and processed in synchronism.

  The display substrate module assembly line, the TAB / IC mounting processing work device, and the transfer device shown in FIGS. 1 and 2 are one embodiment. In particular, what mounting processing work devices need to be connected depends on the assembly work. Needless to say, it depends on the configuration of the display substrate module that performs the above.

  Hereinafter, the TAB / IC mounting component work processing apparatus 16 described above will be described as an example of the board fixing base 20 which is the most characteristic of the present invention.

FIG. 3A shows that the substrate is transferred by the transfer device 2 at a position higher by H than the substrate fixing base 20 of the mounting device while taking into account warpage and deflection of the substrate P, and the substrate P is directly transferred to the substrate fixing base 20. It is the figure conveyed above. In FIG. 3, for ease of understanding, the outline of the substrate P is shown by a solid line, and the in-plane transparent portion is shown as a transport and fixing mechanism. 3B, the transfer arm 11A is lowered from the position shown in FIG. 3A by the transfer arm elevating unit 11B shown in FIG. 2, and the substrate P is placed on the substrate fixing base 20 and the substrate holding means 12. FIG. The substrate holding means 12 has both side holding portions 12A on both sides and is composed of a connection holding portion 12B for connecting them on the substrate fixing base 20 side, so that the substrate P is stably held together with the substrate fixing base 20. Is possible. The width of the transfer arm 11 A is smaller than the width of the recessed shape is shaped from the connection holding section 12B and both side support portion 12A which is a component of a substrate holding means 12. For this reason, the transfer arm 11 </ b> A can move under the substrate holding unit 12 by moving down the substrate P to the substrate holding unit 12 and then descending downward.

The substrates placed on the substrate fixing base 20 and the transport holding means 12 are aligned by adjusting the transport arm 11A. After the alignment is completed, a substrate flattening correction process, which will be described later, is performed, and an electronic component 3 mounting process work is performed. In the above, alignment was performed after placing the substrate. However, the substrate P is lowered to some extent and aligned in a non-contact state in order to avoid sliding of the substrate with the substrate fixing base 20, and then the substrate is placed. May be.
Alternatively, it is also effective to reduce the sliding by ejecting some compressed air from the suction portion provided on the surface of the substrate fixing base 20 so that excessive sliding does not occur during the alignment operation after the lowering.

  In addition, as shown to Fig.10 (a), the said both-side holding | maintenance part 12A is installed in the said connection holding | maintenance part 12B so that the movement to the diagonal direction is possible. For this reason, when processing different substrates P, the substrate size is automatically adjusted to the required substrate size by the oblique movement mechanism 12C. However, since some display substrates have different aspect ratios, the display substrate also includes an aspect ratio adjustment mechanism 12D that can manually change the aspect ratio setting. In the present embodiment, the aspect ratio adjusting mechanism 12D is a sliding mechanism by screw tightening for the sake of simplicity. However, in applications where the aspect ratio is frequently changed, this portion may be automatically adjustable. In this case, the setup change operation is not required when changing the aspect ratio, so that the equipment can be quickly restarted when frequent product changes are made.

  FIG. 4A is an enlarged view of a part of the left side of the substrate fixing base 20 shown in FIG. The substrate fixing base 20 has a predetermined surface accuracy, and includes a base main body 21 having a contact surface 21a with the substrate P, a lattice-like base surface adsorption groove 22 provided on the contact surface, and Substrate suction pads 23 for retracting the substrate provided alternately with the base surface suction groove portions, suction groove air holes 24a for making the base surface suction groove portions 22 and the substrate suction pads 23 negative pressure, and pads, respectively. Air holes 24b. In this embodiment shown in FIG. 3, 13 base surface suction grooves 22 and 12 substrate suction pads 23 are provided. Further, an adsorption portion 11Aa made of a rubber-like member for preventing the positional deviation of the substrate P during transportation is provided on the substrate transportation surface of the transportation arm 11A. A piping system (not shown) for connecting the substrate suction pad 23 and the base surface suction groove portion 22 on the back surface is covered with a back surface lid 21b.

  FIG. 4B shows an example in which the suction force at the time of flattening suction is increased by expanding the lattice-like substrate suction base surface suction groove 22 to the vicinity of the substrate suction pad 23 as a modified example. is there.

  Furthermore, as shown in FIG. 11, the base surface adsorption groove 22 can be a round groove. In this case, since the schematic shapes of the substrate suction pad 23 and the base surface suction groove 22 can be made equal, it can be expected that the suction effect on the substrate P is uniform.

  FIG. 5 schematically shows a negative pressure system 25 for setting the base surface suction groove and the substrate suction pad to a negative pressure. Each of the negative pressure systems 25 selects an object to be negative pressure from among a system of an exhaust device 25a for negative pressure, a regulator 25b for stable exhaust, a base surface suction groove 22 and a substrate suction pad 23. Solenoid valves 25c1 and 25c2 provided in the system, pressure switches 25D1 and 25D2 that check whether each system is normally obtaining negative pressure, and check that prevents backflow of air, respectively, provided on the substrate suction pads 23a to 23l It includes a valve system 25f including valves 25e1 to 25e12 (not shown in FIG. 3), a suction groove air hole 24a, a pad air hole 24b, and a control device 30 for controlling them. In this embodiment, the chucking portion 25e is not provided in the base surface suction groove portion 22 for cost reduction, but it is natural that providing the cost is allowed to stabilize the suction force if the cost permits. Furthermore, by reducing the groove width and groove depth of the base surface adsorption groove portion 22, it is natural that the loss of decompression of the portion that is not adsorbed can be reduced.

  The substrate fixing base 20 having such a mechanism and the negative pressure system 25 are controlled to perform a flattening process for increasing the flatness of the substrate P placed. If the substrate P is simply placed on the substrate fixing base 20, the warp of the end portion of the substrate P cannot be corrected. The basic idea of this embodiment is to forcibly pull the substrate with a plurality (12) of the substrate suction pads 23 to eliminate the warp of the substrate and increase the flatness. Thereafter, together with the 13 base surface suction grooves 22, the substrate is stably held at a negative pressure during the substrate processing operation. The substrate pull-in amount is preferably such that the bottom surface of the substrate P is flush with the contact surface 21 a of the base body 21. Therefore, in order to pull in the substrate P, the substrate suction pad 23 has a pull-in restoration means that realizes a pull-in restoration function that contracts when the negative pressure is reached and restores the original state when the negative pressure is released. Further, the substrate suction pad 23 further includes at least a substrate suction portion that sucks the substrate P in order to cope with a self-recovery force against distortion such as waviness or warpage of the substrate when the substrate is placed. It has a distortion correction function means that realizes a function of correcting distortion such as swell and warp by moving the direction with flexibility. Further, a control means for controlling the pull-in amount is provided.

  FIG. 6 is a cross-sectional view showing the basic movement of the substrate P in the first embodiment 23A of the substrate suction pad 23 realizing the above two means and the pull-in restoration function. Each of them shows, in order from the top, immediately after the start of suction of the substrate P, during the progress of suction, and when the suction is completed. (A) is an example in which a normal suction cup having no lateral movement function is used for the substrate suction pad 23. When the curved substrate P is sucked, the suction cup absorbs a lateral error when the curvature is flattened. Because it is not possible, the curved portion strengthened like a bowl finally remains in the center. Therefore, by providing the vacuum suction pad 23 with the lateral movement function, as shown in (b), the horizontal suction is absorbed by the vacuum suction pad 23 in accordance with the flattening of the curved substrate P. In particular, it closely contacts the substrate fixing base 20.

  FIG. 7 is a diagram showing the basic movement of the substrate suction pad 23 and the substrate P in the distortion correction function. In FIG. 7, since the substrate P is thin, hatching is omitted. FIG. 8 is a diagram showing an overall processing flow in which other flows are added to the basic processing described above.

  The pull-in restoring force function by the substrate suction pad 23 will be described together with the overall processing flow. In FIG. 6, the substrate P is transported to the mounting position of the substrate fixing base 20 (FIG. 6B, at the start of suction, FIG. 8 step (1)), and then the substrate P is mounted on the substrate fixing base 20 ( FIG. 6 (b) (Step (2) in FIG. 8) while the adsorption is in progress. The TAB / IC mounting processing work device 16 performs alignment between the substrate P and mounting components (for example, the IC substrate 3 shown in FIG. 2). The alignment is performed by controlling the posture of the substrate fixing base 20 or the transfer arm 11A (step (3) in FIG. 9). After the alignment is completed, the negative pressure system 25 sets the twelve substrate suction pads 23a to 23l to a negative pressure and overcomes the restoring force to maintain the state in which the suction is in progress in FIG. Forcibly retracts to the reference surface which is the contact surface 21a of the fixed base 20 (FIG. 6B, when the suction is completed, step (4) in FIG. 8).

At this time, the 13 pieces of the base surface suction groove 22a~22m adsorption of the substrate P is performed, fixed holding of the substrate P becomes more reliable. Adsorption by the base surface suction grooves 22, since the substrate P is enabled in close proximity to the board fixing base 20, is less effective at the start substrate adsorption. Thus the decompression of the base surface suction grooves 22, compared with the reduced pressure of the substrate suction pads 23, by slowing certain time, it is possible to perform smoothly the suction holding of the substrate P.
In this case, the pulling force KP can be expressed by the equation (i), so that the design becomes easy.
KP = (Suction area of the substrate suction part) × Negative pressure−Spring force (i)
Further, the restoring force RP can be designed by the following equation.
RP = spring force + diaphragm spring force−adsorption pad mass × gravity acceleration (ii)
The pull-in amount Kh is obtained in advance by obtaining a relationship between the negative pressure and the pull-in amount with respect to the target substrate, and is controlled by the control device 30 based on the relationship.

  After drawing the substrate P, the negative pressure system 25 also applies negative pressure to the 13 base surface suction groove portions 22a to 22i, and the flatness of the substrate P together with the substrate suction pad 23 is maintained at 50 μm over a 500 mm span (step (5 in FIG. 8). )). The electronic component 3 is mounted while maintaining the flatness (step (6) in FIG. 8). After the processing operation is completed, the negative pressure of the base surface suction groove portion 22 and the substrate suction pad 23 is released (step (7) in FIG. 9), and the substrate is mounted on the transfer arm 11A and transferred ((step (8) in FIG. 8)). In step (8), the substrate suction pad 23 returns to the state shown in Fig. 7A due to the restoring force that is the spring force of the connecting spring 23A3. May be weak enough to overcome the dead weight of the substrate suction pad 23.

  At this time, by removing the negative pressure of the base surface suction groove portion 22 first as compared with the reduced pressure of the substrate suction pad 23, the warp and the deflection of the substrate P can be gradually released rather than released at once. The internal loss due to the viscoelasticity of the substrate suction pad 23 can be used effectively, and the adsorption of the substrate P can be released without giving excessive vibration or impact to the substrate P.

According to the present embodiment, the mounting processing work apparatus that corrects the warping of the substrate and holds the substrate on the substrate fixing base with high accuracy by using the substrate suction pad that can forcibly pull the substrate into the substrate fixing base. Alternatively, an implementation processing work method can be provided.
In addition, according to the present embodiment, the substrate suction portion of the substrate suction pad is flexible in the lateral direction, so that the swell or warpage of the substrate can be eliminated, and the substrate can be held on the substrate fixing base with high accuracy. A mounting processing work device or a mounting processing work method can be provided.
Furthermore, according to the present embodiment, by providing a base surface suction groove on the substrate fixing base in addition to the substrate suction pad 23A, the mounting processing work apparatus or mounting processing work method can stably hold the substrate on the substrate fixing base. Can be provided.

Furthermore, according to the present embodiment, it is possible to provide a suction pad that can hold the substrate with high precision on the substrate fixing base.
Furthermore, according to the present embodiment, a display substrate module assembly line having a high yield or a high operating rate can be provided by adopting a line configuration having the mounting processing work apparatus or the mounting processing work method described above. .

FIG. 9 shows another embodiment of the substrate suction pad 23 described so far. A substrate suction pad 23B shown in FIG. 9A is a type in which a pull-in restoring force function and a distortion correction function are realized by a compression spring provided therein, similarly to the substrate suction pad 23A. Substrate suction pad 23
B is a connecting part 23Bg for connecting the horn-shaped substrate attracting portion 23Bk broadly includes a base portion 23B c, and a base portion 23 Bc and the substrate attracting portion Bk. In the connecting portion 23 Bg, a coiled compression spring 23Ba having a low spring constant is provided between the substrate adsorption portion Bk and the pedestal portion Bc. The substrate suction pad 23B has a structure in which the whole is stretchable in the vertical direction and is covered with flexible soft thin rubber or soft thin resin on the left and right. Specifically, conductive silicon rubber is used as the covering material.

Similarly to the substrate suction pad 23A, the pedestal portion 23Bc includes a fixed suction hole 23Be having a suction passage communicating with the substrate suction portion 23Bk, and a fixing plate 23Bh for fixing the substrate suction pad 23B to the substrate fixing base 20. Have. The fixing plate 23Bh is fastened and fixed to the male screw 23Bf with a female screw provided in the fixed suction hole Be. The low spring constant may be weak enough to overcome the weight of the substrate suction pad 23B, like the substrate suction pad 23A.
Also in this embodiment, the panel can be adsorbed and a high pulling force can be generated with a degree of freedom in the lateral direction, and a pulling restoring force function and a distortion correcting function can be realized.

FIGS. 9B and 9C show Examples 23C and 23D of the substrate suction pad 23 having a diaphragm structure having a pull-in restoring force function and a distortion correction function. The substrate suction pads 23C and 23D are roughly divided into trumpet-like or step-like substrate suction portions 23Ca and 23Da at the tip, a pedestal portion, and connecting portions 23C9 and 23D9 that connect the pedestal portion and the substrate suction portion. The substrate suction portion has suction holes 23Ci and 23Di. Pedestal, the adsorption hole 23Ce, have 23De, substrate suction pads 23C, the fixed portion 23Cc for fixing 23D to the substrate fixing base 20, the fixing plate 23Ch provided in the lower part of 23Dc, the 23Dh and the fixed plate The substrate suction pads 23C and 23D are fixed by the nuts 23Cf and 23Df for fixing the substrate suction pads 23C and 23D to the substrate fixing base 20. The connecting portions 23C9 and 23D9 are a diaphragm 23C3 that connects the lower periphery of the substrate suction portion and the upper periphery of the fixed portion, or a bellows-like soft portion, and these, the pedestal portion, and the substrate suction portions 23Ca and 23Da. And form a vacuum gap. Its structure of the diaphragm is U-groove type in the substrate suction pad 23C, a suction pad bellows grooved in 23D substrate attraction. In the present embodiment, the retracting force function and the distortion correction function can be realized by the longitudinal stretchability and the lateral flexibility of the diaphragms 23Ca and 23Da.

According to the substrate suction pads in the three embodiments described above, the panel can be sucked and a high pull-in force can be generated with a degree of freedom in the lateral direction, and the substrate P can be held on the substrate fixing base with high accuracy. A suction pad can be provided.
In addition, by using the substrate suction pads in the three embodiments described above for the substrate fixing base, the substrate can be forcibly drawn into the substrate fixing base, and the substrate can be held on the substrate fixing base with high accuracy. A working device or a mounting processing work method can be provided.
Furthermore, by using the substrate suction pads in the three embodiments described above for the substrate fixing base, it is possible to eliminate distortions such as waviness and warping of the substrate, and to hold the substrate on the substrate fixing base with high accuracy. Alternatively, an implementation processing work method can be provided.

In addition, the display substrate module assembly line or the display substrate module assembly method having a high yield can be provided by adopting a line configuration having the mounting processing work apparatus or the mounting processing work method described above.
In the above embodiment, the base surface suction groove portion 22 and the substrate suction pad 23 are used in combination, but the substrate suction pad 23 alone may be used.
Further, in the above-described embodiment, all of them have a distortion correction function, but when the substrate is placed, if the distortion such as undulation and warpage is small enough to be ignored, the rigidity in the lateral direction or the sliding direction of the substrate is increased. May be.

1: Display board module assembly line 2: conveying means 3: Electronic component 11: transfer arms 11 A: transport arm (examples of conveying movement pedestal) 12: substrate holding means 12A: both side holding portion 12B: connection holding section 13L: substrate Long side mounting processing device group 13S: Substrate short side mounting processing device group 14: Terminal cleaning processing device 15: ACF sticking processing device 16: TAB / IC mounting processing device 16a: Mounting portion 17: Main crimping processing device 19: Substrate rotating means 20: Substrate fixing base (example of work side fixing base) 21: Base body 21a: Contact surface 22: Base surface suction groove 23: Substrate suction pad 23A to D: Substrate suction pad Example 25: Negative pressure system 30: Controller P: Substrate (display substrate).

Claims (13)

In mounting the process working device for mounting components on the periphery of the flat display substrate, supported substantially parallel to the working sides of mounting parts and work side fixing base for supporting it from below, both sides sandwiching the working edge from the bottom,
The both sides holding part movable with respect to the working side fixing base, and having a dimension that enters a concave shape part composed of the working side fixing base and the both side holding part, and the flat display substrate is placed in the concave shape part. A mounting processing work apparatus characterized in that a transport moving base for transporting is provided. In a mounting processing work apparatus for mounting components on the periphery of a flat display substrate, a connecting portion for connecting both side holding portions supporting the both sides from below is provided, and the connecting portion and the both side holding portions are connected and supported so as to be movable relative to each other. The mounting processing work device according to claim 1. In a mounting processing work apparatus for mounting components around a flat display board, the flat display board is drawn into the work side fixing base after the flat display board starts to be sucked, thereby copying the flat display board to the working side fixing base. according to the substrate suction pad to planarize adsorb Align the flat display substrate, characterized in that it has a suction groove the flat display substrate adsorbs the flat display substrate from a state close to the vicinity of the working side fixed base The mounting processing work apparatus according to claim 1 or 2. In mounting the process working device for mounting components on the periphery of the flat display substrate, a plurality of the substrate suction pad, without a vacuum system of the same type are connected to each other, a plurality of the suction groove is the same type are connected to each other None of depressurization system, at the start adsorbing first subjected to vacuum of the substrate suction pads, mounting processing operations according to claim 3, characterized in that it has a negative pressure system for the decompression of the suction groove after the predetermined time elapses apparatus. In mounting the process working device for mounting components on the periphery of the flat display substrate, a plurality of the substrate suction pad without a vacuum system of the same type are connected to each other, the plurality of the suction groove, of the same type are connected to each other No vacuum system, mounting processing work apparatus according to claim 3, characterized in that it has a negative pressure system to terminate the substrate vacuum suction pads after first the exit vacuum suction grooves, during suction termination. In mounting the process working device for mounting components on the periphery of the flat display substrate, the transfer to the mobile base, the plane display the plane display adsorbs the substrate board suction pad or the substrate suction groove portion flattening when transporting the substrate The mounting processing work apparatus according to claim 1, further comprising: In mounting the process working device for mounting components on the periphery of the flat display substrate, the substrate suction pad is longitudinally has a compression spring having a spring property enough to lift the flat display substrate relative to the weight of the flat panel display substrate any of claims 3 to 6, characterized in that enhanced movement flexibility in the lateral direction in the transverse direction into thin thin rubber or soft highly flexible soft resin to coat the compressed spring The mounting processing work apparatus described in 1. In the mounting processing work apparatus for mounting components around the flat display substrate, the substrate suction pad includes a substrate suction portion provided at a tip, and a fixing portion for fixing the substrate suction portion to the work side fixing base. A second connecting part that connects the fixed part and the substrate suction part, and the second connecting part is a diaphragm that connects the lower periphery of the substrate suction part and the upper periphery of the fixed part . , said substrate attracting portion, said fixing portion, said forming a vacuum gap portion in the diaphragm, the diaphragm, claims 3 to characterized in that it has a U-groove type or bellows trench structure 6 The mounting processing work apparatus according to any one of the above. In a mounting processing work method for mounting components on the periphery of a flat display substrate, a work side fixing pedestal is supported from below by a work side fixing pedestal, and both sides sandwiching the work side with respect to the work side fixing pedestal performs processing operations supported from below by each side holding portion movable, upon movement of the flat display substrate has dimensions entering the formed recess shaped portion of the working side fixing base and the two side retaining portions, the recessed shaped part A mounting processing work method , wherein the flat display substrate is moved by a transfer moving base for transferring the flat display substrate. In the mounting processing work method for mounting components around the flat display substrate, when processing products having different dimensions of the flat display substrate, the working sides of the flat display substrate to be processed are moved by moving the both side holding portions. The mounting processing work method according to claim 9, wherein the mounting processing work method is preliminarily installed at a position where both sides sandwiching can be supported from below. In a mounting processing work method for mounting components around a flat display board, the flat display board having a warp is sucked by a board suction pad at the start of the processing work, and the flat display board is drawn by drawing the board into the work side fixing base. the so modeled after the work side fixed base and planarizing the flat display substrate, the working sides claim 9 or claim 10, wherein ensuring that the plane display holding of the substrate by the suction grooves of the fixing base thereafter Implementation processing work method. In mounting the process working method for mounting components on a periphery of the flat display substrate, the processing work end when releasing the suction of the suction groove of the working side fixed base opened a small amount of warping of the flat display substrate, and thereafter, the substrate adsorption mounting processing work method of claim 11, wherein the releasing the suction of the pad to the planar display substrate easily move the flat display substrate by lifting from the working edge fixed base. A plurality of work processing devices constituting a line comprising the mounting work processing device according to any one of claims 1 to 8 and another work processing device for performing other work processing, and the flat display substrate as the mounting work processing device. And a flat display substrate module assembly line having a transfer device that sequentially transfers between the other work processing devices,
1 set moving mounting mechanism without passing through the transport device dimensional worlds said plurality to the substrate, stationary base of the work processing apparatus of the rear said flat display substrate from the substrate fixing base on the front side of the work processing apparatus mechanism Display board module assembly line, which is directly transported by

Images