TW201332769A - Sticking apparatus - Google Patents

Abstract

The present invention provides a sticking apparatus, which can excellently perform sticking regardless of the size or shape of a plate-shaped member to be stuck. The sticking apparatus is provided with an auxiliary plate (110) for keeping a second plate-shaped member (102), a first pillow pad (4) for preventing a first end portion (110a) from moving downwards through supporting the lower surface of the first end portion (110a) of the auxiliary plate (110), and a second pillow pad for preventing a second end portion (110b) from moving downwards through supporting the lower surface of the second end portion (110b) of the auxiliary plate (110), wherein the first pillow pad (4) and the second pillow pad (6) can independently move up and down, and the unpressed portion of the second plate-shaped member (102) is not allowed to contact with the first plate-shaped member (101); through maintaining the second end portion (110b) to be higher than the first end portion (110a) and through using a pressing mechanism (8) to press the auxiliary plate (110) in order to press the second plate-shaped member (102).

Description

Laminating device

The present invention relates to a bonding apparatus for pressing a plate member to another plate member by a pressing means such as a roller to bond the two plate members.

In general, it is extremely important that the first plate-like member such as a liquid crystal panel or a touch panel is bonded to the second plate-like member such as a cover glass for protecting the surface thereof, and no air bubbles are mixed between the members. The incorporation of air bubbles causes deterioration in display quality and causes peeling.

As a conventional bonding apparatus for preventing the incorporation of air bubbles, for example, those described in Patent Document 1 are known. As shown in FIG. 8, in the bonding apparatus 11, the liquid crystal display element corresponding to the first plate-shaped member 201 is fixed to the bonding stage 13, and the adhesive sheet 203 is provided on the upper surface of the first plate-shaped member 201.

Moreover, the liquid crystal display element which is bonded to the second plate-shaped member 202 of the first plate-shaped member 201 is subjected to tension by the coil spring 210, and is in a state of being bent.

In the bonding apparatus 11, the second plate-shaped member 202 is pressed to the first plate-shaped member 201 by the roller 18 in a state in which the end portions of the second plate-shaped member 202 and the first plate-shaped member 201 are overlapped with each other. At the same time, the roller 18 is moved in the direction of the arrow (adhesion direction) in the drawing to perform the bonding. Thereby, the second plate-shaped member 202 is bonded while maintaining a predetermined bonding angle θ.

According to the bonding apparatus 11, since the air bubbles can be extruded and simultaneously bonded by the roller 18 moving in the bonding direction, the air bubbles can be prevented from being mixed into the first The plate member 201 is interposed between the second plate member 202.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-207435

However, in the conventional bonding apparatus 11, whenever the size or material of the second plate member 202 is changed, the tension of the coil spring 210 or the adjustment of the coil spring 210 must be changed, which is very time consuming.

Further, in the conventional bonding apparatus 11, since the coil spring 210 is used, if the second plate-shaped member 202 is smaller than the first plate-shaped member 201, it is difficult to apply tension by the coil spring 210, and the precision cannot be accurately performed. The bonding between the second plate member 202 and the first plate member 201 is performed.

Therefore, in the conventional bonding apparatus 11, the size or material of the second plate member 202 is somewhat limited.

The present invention has been made in view of the above problems, and an object of the invention is to provide a bonding apparatus which can be bonded with high precision irrespective of the size or material of a plate-like member to be bonded.

In order to solve the above problems, the bonding apparatus of the present invention is configured such that after the first plate-shaped member placed on the bonding stage is aligned with the second plate-shaped member located above the first plate-shaped member, The first plate member and the second plate member are pressed by pressing one end portion of the second plate member against the first plate member by a pressing means located above the second plate member. The relative position is changed in the bonding direction, whereby the second plate-shaped member is bonded to the first plate-shaped member, and the auxiliary plate is provided, and the length of the bonding direction is longer than that of the second plate-shaped member. paste At the same time, the second plate-shaped member is held between the second plate-shaped member and the pressing means, and the first bushing has a support portion that supports the auxiliary plate on the side of the end of the second holding member that is held. The lower end of the first end portion restricts movement of the first end portion in the downward direction at the time of bonding; and the second bushing has a support portion that supports the auxiliary plate opposite to the first end portion The lower end of the second end portion restricts the movement of the second end portion in the downward direction at the time of bonding; the first bushing and the second bushing can be vertically moved up and down; and the second end portion is maintained at a position higher than the first end portion. In this state, the second plate-shaped member is pressed by the pressing means through the auxiliary plate, whereby the portion of the second plate-shaped member that has not been pressed is not in contact with the first plate-shaped member.

According to this configuration, the second plate-shaped member is held by the auxiliary plate having a length longer than the second plate-shaped member in the bonding direction, and the second plate-shaped member is pressed by the pressing means through the auxiliary plate, so that it can be held by the auxiliary plate. The second plate-shaped member can be attached to the first plate-shaped member with high precision regardless of the size or material.

In the bonding apparatus of the present invention, it is preferable that the auxiliary plate has rigidity such that it is not bent by its own weight and is pressed by the pressing means to be bent together with the second plate-shaped member.

According to this configuration, the central portion of the auxiliary plate can be prevented from being deflected by the weight of the center plate, and the central portion of the second plate-shaped member can be prevented from being bent, and the second plate-shaped member can be attached to the first plate-shaped member before being pressed by the pressing means.

According to this configuration, it is possible to reliably prevent the air bubbles from being mixed into the first plate shape. Between the member and the second plate member.

Here, the "weight" of the auxiliary plate not only supports the weight of the plate but also the weight of the second plate member to be held.

Further, depending on the bonding state, the auxiliary plate may have a rigidity that is bent within a predetermined range due to its own weight.

In the bonding apparatus of the present invention, preferably, the auxiliary plate is composed of a first auxiliary plate that adsorbs and holds the upper surface of the second plate-shaped member, and a second auxiliary plate that is superposed on the first auxiliary plate; The lower side of the auxiliary plate is provided with a plurality of adsorption grooves extending in the bonding direction in parallel with respect to the bonding direction. The first auxiliary plate is provided with a plurality of adsorption holes communicating with the adsorption grooves along the adsorption grooves.

According to this configuration, since the second plate-shaped member can be bent along the auxiliary plate by sucking and holding the upper surface of the second plate-shaped member, it is possible to prevent the central portion of the second plate-shaped member from being bent by the weight of the second plate-shaped member.

According to this configuration, the bonding angle of the second plate-shaped member can be made small without being bent by its own weight. Therefore, the load applied to the second plate-shaped member can be reduced, and deformation of the second plate-shaped member can be suppressed or damage.

According to this configuration, since the plurality of adsorption grooves are provided in parallel with respect to the bonding direction, the thickness of the auxiliary plate in the bonding direction can be made uniform, and the strength of the auxiliary plate can be prevented from being different depending on the pressing portion.

According to this configuration, it is possible to prevent the auxiliary plate from being bent more than necessary when pressed by the pressing means, and it is possible to prevent local stress from being applied to the second plate-shaped member.

Further, in the bonding apparatus of the present invention, the auxiliary plate is provided by the first auxiliary plate that adsorbs and holds the upper surface of the second plate-shaped member, and is superposed on the first auxiliary plate. a second auxiliary plate is formed on the upper surface of the first auxiliary plate; a plurality of adsorption grooves extending in the bonding direction are provided in parallel with respect to the bonding direction; and the adsorption groove is formed on the lower surface side of the first auxiliary plate A plurality of adsorption holes communicating with the adsorption tank are provided; and the second auxiliary plate may cover the adsorption groove.

Furthermore, in the bonding apparatus of the present invention, the plurality of adsorption grooves are connected to each other by a coupling groove extending in a direction non-orthogonal with respect to the bonding direction; and one of the plurality of adsorption grooves and the coupling groove is connected to the outside Vacuum source is also available.

According to this configuration, since the coupling groove extends in a direction non-orthogonal to the bonding direction, the difference in thickness of the auxiliary plate in the bonding direction due to the connection groove can be reduced, and the strength of the auxiliary plate can be prevented from being pressed by the pressing portion. different.

According to this configuration, it is possible to prevent the auxiliary plate from being bent more than necessary when pressed by the pressing means, and it is possible to prevent local stress from being applied to the second plate-shaped member.

Further, in the bonding apparatus of the present invention, it is preferable that the support portion of the second bushing is tiltable in accordance with the bonding angle between the second plate member and the first plate member.

According to this configuration, the lower surface of the auxiliary plate can be reliably supported regardless of the bonding angle.

According to the present invention, it is possible to provide a bonding apparatus which can be bonded with high precision irrespective of the size or material of the plate-like member to be bonded.

Hereinafter, preferred embodiments of the bonding apparatus of the present invention will be described with reference to the drawings.

(Composition of the bonding device)

Fig. 1 shows a bonding apparatus 1 according to an embodiment of the present invention. As shown in the figure, the bonding apparatus 1 of the present embodiment is for using a first plate shape in the atmosphere. The member 101 is attached to the second plate member 102. In the present embodiment, the first plate-shaped member 101 is a TV liquid crystal panel of 60 to 70 inches, and the second plate-shaped member 102 is a cover glass having a thickness of about 0.7 [mm]. Further, in the present embodiment, the length of the second plate-shaped member 102 in the direction in which the first plate-shaped member 101 is attached is shorter.

In the first plate member 101, an adhesive layer 103 made of a transparent liquid adhesive is formed on one of the bonding faces, and is bonded to the second plate member 102 via the adhesive layer 103.

The second plate-shaped member 102 is sucked and held by the auxiliary plate 110 whose length in the bonding direction is longer than the second plate-shaped member 102, and the transmission auxiliary plate 110 is pressed by the roller 8 corresponding to the pressing means of the present invention.

The auxiliary plate 110 has rigidity to such an extent that it is not bent by its own weight and is pressed by the roller 8 to be bent together with the second plate-shaped member 102. Therefore, the central portion of the second plate member 102 is not deflected by the center portion of the auxiliary plate 110 due to its own weight, and the second plate member 102 is attached to the first plate member 101 before being pressed by the roller 8. (Next layer 103).

Moreover, the bonding apparatus 1 of this embodiment is equipped with the stage moving means 2 which moves horizontally. The stage moving means 2 is provided with a bonding stage 3 on which the first plate-shaped member 101 is placed, a first bushing 4, a first bushing driving means 5 for raising and lowering the first bushing 4, and a second axis The lining 6 and the second bushing driving means 7 for raising and lowering the second bushing 6 up and down.

The first bushing 4 and the first bushing driving means 5 are disposed opposite to the second bushing 6 and the second bushing driving means 7 via the bonding stage 3.

A roller 8 is disposed above the bonding stage 3, and a roller drive for lifting the roller 8 up and down Means 9.

The stage moving means 2 is movable along the predetermined guide in the fitting direction and in the opposite direction. When the stage moving means 2 moves in the opposite direction to the bonding direction, the bonding stage 3, the first bushing 4, the first bushing driving means 5, the second bushing 6, and the second bushing driving means 7 are bonded. It also moves in the opposite direction to the bonding direction, and the relative position of the roller 8 changes. That is, the roller 8 moves in the bonding direction with respect to the stage moving means 2.

The bonding stage 3 has a horizontal mounting surface on which the first plate-shaped member 101 is transported from the apparatus of the previous step, and a plurality of suction nozzles 3a provided on the mounting surface. Each of the suction nozzles 3a is connected to a vacuum pump (not shown), and when the vacuum pump is actuated, the first plate-shaped member 101 on the mounting surface is adsorbed and held.

Further, the bonding stage 3 can also be moved horizontally. Thereby, the relative position of the first plate-shaped member 101 adsorbed and held by the bonding stage 3 and the second plate-shaped member 102 adsorbed and held by the auxiliary plate 110 can be finely adjusted.

As shown in FIG. 2, the first bushing 4 has a flat-shaped support portion that is fixed to the shaft portion 4a of the first bushing driving means 5, the main body portion 4b, and the main body portion 4b on the lower side of the bonding stage 3 side. 4c and a cushioning material 4d provided on the upper surface of the support portion 4c.

The main body portion 4b is configured such that the support portion 4c can be tilted from a horizontal position toward a predetermined angle range from the horizontal portion 4a.

The support portion 4c supports the lower surface of the first end portion 110a of the auxiliary plate 110 on the one end side of the second plate-shaped member 102 that is adsorbed and held, and restricts the first end portion 110a from moving downward in the bonding.

Further, the cushioning material 4d serves to alleviate the contact of the first end portion 110a with the body portion The impact generated when the surface of the stage 3 is bonded to the surface of the stage 3 is formed of a soft material such as resin.

In the first bushing 4, as described above, the main body portion 4b is configured to be tiltable downward from the horizontal position, but the vertical line L1 passing through the center of gravity of the tilting portion (the main body portion 4b) is located at the vertical line L2 passing through the axis of the shaft portion 4a. The outer side (opposite to the opposite side of the stage 3) does not tilt the main body portion 4b at the time of bonding, and the support portion 4c is held at a horizontal position (see Fig. 6).

Further, in the case where the center of gravity of the tilting portion is obtained, the weight of the support portion 4c, the cushioning member 4d, and the auxiliary plate 110 must be considered. However, the weight is relatively small compared to the weight of the main body portion 4b, and therefore is ignored here.

Further, in the present embodiment, the first bushing 4 is located on the bonding start side, and the second bushing 6 is located on the bonding end side, so that the first bushing 4 does not tilt.

As shown in FIGS. 3( a ) and 3 ( b ), the second bushing 6 is fixed to the shaft portion 6 a of the second bushing driving device 7 , the main body portion 6 b , and the main body portion 6 b on the bonding stage. The flat support portion 6c at the lower side of the third portion and the cushioning material 6d provided on the upper surface of the support portion 6c further have a surface provided on the opposite side of the main body portion 6b from the bonding stage 3 and from the lower end of the surface And a flat-shaped connecting portion 6e that protrudes at both side ends and a pair of weight portions 6f that are provided at the lower end portions of the connecting portion 6e.

The main body portion 6b is configured such that the support portion 6c can be tilted from a horizontal position toward a predetermined angle range from the horizontal portion 6a.

The support portion 6c supports the lower surface of the second end portion 110b of the auxiliary plate 110 opposed to the first end portion 110a, and restricts the movement of the second end portion 110b in the downward direction at the time of bonding.

The cushioning material 6d is used to reduce the impact generated when the second end portion 110b contacts the surface of the main body portion 6b on the side of the bonding stage 3, and is formed of a soft material such as resin, similarly to the cushioning material 4d. Further, the cushioning material 6d also functions as a fixing auxiliary plate 110 that sandwiches the auxiliary plate 110 together with the cushioning material 4d so that the auxiliary plate 110 does not cause a positional deviation at the time of bonding.

The connecting portion 6e is for attaching the weight portion 6f to the main body portion 6b.

The weight portion 6f is such that the center of gravity of the tilting portion formed by the main body portion 6b and the connecting portion 6e is close to the axial center of the shaft portion 4a, and the support portion 6c is tilted downward from the horizontal position with a slight force.

In the weight portion 6f, in order to tilt the support portion 6c, a rectangular weight W is provided in a portion located inside the axial center of the shaft portion 4a (on the side of the bonding stage 3).

The shape or size of the weight W of the weight portion 6f is adjusted to an initial state before the start of bonding (see FIG. 6(a)). The support portion 6c is held at a horizontal position and is supported at the start of bonding (see FIG. 6(b)). The portion 6c is tilted in accordance with the bonding angle of the second plate member 102.

Here, the "bonding angle" is the angle between the bonding surface (the subsequent surface) of the first plate-shaped member 101 and the curved bonding surface of the second plate-shaped member 102. The fitting angle is indicated by a symbol θ in Fig. 6(b).

Referring again to Fig. 1, the roller driving means 9 is disposed between the top of the apparatus (not shown) and the roller 8. The roller driving means 9 is mainly constituted by a cylinder, and when the roller driving means 9 expands and contracts, the roller 8 moves up and down accordingly.

Thereby, the roller 8 presses the second plate-shaped member 102 against the first plate-shaped member 101 (the subsequent layer 103) through the auxiliary plate 110, and the layer 103 obtains a pressing position which is lowered to a predetermined thickness and a retracted position above it.

The length of the roller 8 is substantially equal to the length of the auxiliary plate 110 in the width direction (the direction orthogonal to the bonding direction) (refer to FIG. 4).

As shown in FIG. 4, the auxiliary plate 110 has a plurality of adsorption grooves 114a extending in the bonding direction, and a coupling groove 114b extending on a diagonal line of the auxiliary plate 110 so as not to be orthogonal to the bonding direction. The adsorption hole 113 is provided along the adsorption groove 114a, and the connection hole 115 for connecting to the external vacuum source.

More specifically, as shown in FIGS. 5(a) and 5(b), the auxiliary plate 110 has the first auxiliary plate 111 having a thickness of 5.0 [mm] on the upper surface of the second plate-shaped member 102. The second auxiliary plate 112 having a thickness of 5.0 [mm] is formed on the first auxiliary plate 111.

The first auxiliary plate 111 is provided with a plurality of adsorption holes 113 penetrating in the thickness direction, and the second auxiliary plate 112 is provided with a plurality of adsorption grooves 114a, a connection groove 114b connecting the adsorption grooves 114a, and a connection groove 114b. The connection hole 115.

The first auxiliary plate 111 and the second auxiliary plate 112 are detachably joined by a joining means 116 such as a bolt, and a sealing means 117 such as a gasket is provided between the first auxiliary plate 111 and the second auxiliary plate 112 to surround the first auxiliary plate 111. The adsorption tank 114a or the connection groove 114b (refer to FIG. 4).

Since the adsorption groove 114a and the connection groove 114b extend in a direction that is not orthogonal to the bonding direction as described above, the grooves 114a and 114b and the roller 8 do not become parallel when bonded.

That is, in the bonding apparatus 1 of the present embodiment, the thickness of the auxiliary plate 110 in the bonding direction is substantially constant, so that the strength of the auxiliary plate can be prevented by the roller 8 The pressing position is different.

Therefore, in the bonding apparatus 1 of the present embodiment, it is possible to prevent the auxiliary plate 110 from being bent more than necessary when the roller 8 is pressed, and it is possible to prevent local stress from being applied to the second plate member 102.

Further, a vacuum source connected to the auxiliary plate 110, a vacuum pump connected to the bonding stage 3, a stage moving means 2, a first bushing driving means 5, a second bushing driving means 7, and a roller driving means 9 are The control unit (not shown) is driven independently of each other under the control of the control unit.

As a result, according to the bonding apparatus 1 of the present embodiment, since the auxiliary plate 110 having a longer length in the bonding direction than the second plate-shaped member 102 is used, the bonding can be performed with high precision irrespective of the size of the second plate-shaped member 102. Hehe.

Further, according to the bonding apparatus 1 of the present embodiment, since the upper surface of the second plate-shaped member 102 is sucked and held by the auxiliary plate 110 which is not bent by its own weight, it can be attached regardless of the material of the second plate-shaped member 102. .

Further, in the case where the auxiliary plate 110 is not provided, the height adjustment of the second bushing driving means 7 must be performed in accordance with the size or material of the second plate member 102.

(Fitting action of the bonding device)

Next, the bonding operation of the bonding apparatus 1 of the present embodiment will be described with reference to Figs. 6(a) to 6(c).

Fig. 6(a) shows the initial state before the start of bonding. The first plate member 101 in which the adhesive layer 103 made of a liquid adhesive is formed is adsorbed and held on the mounting surface of the bonding stage 3.

The auxiliary plate 110 is placed on the support portion 4c of the first bushing 4 and the support portion 6c of the second bushing 6. Under the auxiliary board 110 (the first auxiliary board 111) The second plate member 102 is adsorbed and held by the surface facing downward.

In the initial state, the support portion 4c of the first bushing 4 and the support portion 6c of the second bushing 6 are held in a horizontal position without being tilted, and the heights are uniform. Therefore, in the initial state, the auxiliary plate 110, the second plate-shaped member 102 adsorbed and held by the auxiliary plate 110, and the first plate-shaped member 101 adsorbed and held by the bonding stage 3 are substantially parallel.

Further, in this initial state, the alignment of the auxiliary plate 110 and the second plate member 102 and the alignment of the auxiliary plate 110 and the first plate member 101 are completed.

Specifically, the auxiliary plate 110 that has adsorbed and held the second plate-shaped member 102 at a predetermined position moves toward the support portion 4c of the first bushing 4 and the support portion 6c of the second bushing 6, and is adsorbed and held at a predetermined position. The bonding stage 3 of the plate-shaped member 101 is moved, whereby the alignment of the auxiliary plate 110 and the first plate-shaped member 101 is completed.

In other words, in the bonding apparatus 1 of the present embodiment, the second plate member 102 and the second plate member 102 are indirectly indirectly aligned by the auxiliary plate 110 that adsorbs and holds the second plate member 102 and the first plate member 101. Alignment of the first plate member 101.

Fig. 6(b) shows a state in which the roller driving means 9 is extended to lower the roller 8 to the pressing position. After the roller 8 is lowered, the first end portion 110a of the auxiliary plate 110 is pressed downward in the vertical direction, and the second plate member 102 is bonded to the first plate member 101. After the first end portion 110a of the auxiliary plate 110 is pressed down, the first bushing 4 is also lowered to a predetermined position. After the first bushing 4 is lowered to a predetermined position, it will not fall any more.

On the other hand, since the second bushing 6 is maintained above the adhesive layer 103 With the position, the auxiliary plate 110 and the second plate member 102 are bent as shown in the drawing.

At this time, the support portion 6c of the second bushing 6 is tilted in accordance with the bonding angle θ of the second plate-shaped member 102, and supports the lower surface of the second end portion 110b of the auxiliary plate 110, thereby restricting the second end portion 110b from being downward. mobile. Further, by supporting the lower surface of the second end portion 110b of the auxiliary plate 110 on the upper surface of the support portion 6c, it is possible to prevent the auxiliary plate 110 from being damaged by the edge of the support portion 6c.

Fig. 6(c) shows the state in which the bonding is completed. The bonding system is carried out by moving the stage moving means 2 in the opposite direction to the bonding direction from the state shown in Fig. 6 (b), and the roller 8 is formed in the second plate shape with respect to the auxiliary plate 110 and the second plate. The position of the member 102 and the first plate member 101 changes in the bonding direction.

When the relative position of the roller 8 is changed in the bonding direction in the pressed state, the first plate-shaped member 101 and the second plate-shaped member 102 are directed from the first end portion 110a side of the auxiliary plate 110 toward the second end portion 110b side. fit.

At the time of bonding, the height of the second bushing 6 is changed by the second bushing driving means 7 so as to ensure a predetermined bonding angle θ. At the bonding angle θ, when the unpressed portion of the second plate member 102 is not in contact with the first plate member 101 (the subsequent layer 103), it is preferable that only the load due to the bending is reduced. small.

In the bonding apparatus 1 of the present embodiment, the upper surface of the second plate-shaped member 102 is sucked and held by the auxiliary plate 110 having rigidity which is not bent by its own weight. Therefore, even if the rigidity is as low as the second plate-shaped member 102, the second plate member 102 is second. The weight of the plate-like member 102 itself is curved, and the second plate-shaped member 102 is not bent by the weight of the second plate-shaped member 102 itself.

Therefore, in the bonding apparatus 1 of the present embodiment, the bonding angle θ of the second plate-shaped member 102 can be reduced without being bent by its own weight, so that the load applied to the second plate-shaped member 102 can be further reduced.

Although the preferred embodiment of the bonding apparatus of the present invention has been described above, the present invention is not limited to the configuration of the above embodiment.

For example, instead of the auxiliary plate 110 described above, the auxiliary plate 110' shown in Figs. 7(a) and (b) may be used. As shown in the figure, the auxiliary plate 110' is composed of a first auxiliary plate 111' on which the upper surface of the second plate-shaped member 102 is sucked and held, and a second auxiliary plate 112' which is superposed on the first auxiliary plate 111'.

On the upper surface side of the first auxiliary plate 111', a plurality of adsorption grooves 114a extending in the bonding direction are provided in parallel with respect to the bonding direction. The adsorption grooves 114a are connected to each other by a coupling groove 114b extending in a non-orthogonal direction with respect to the bonding direction, and the connection groove 114b is provided with a connection hole 115 for connecting to a vacuum source outside. On the other hand, on the lower surface side of the first auxiliary plate 111', a plurality of adsorption holes 113 communicating with the adsorption grooves 114a are provided along the adsorption grooves 114a.

The second auxiliary plate 112' covers the adsorption groove 114a and the connection groove 114b.

Further, the auxiliary plates 110, 110' are provided with a connection hole 115 for connecting to the external vacuum source in the connection groove 114b, and one of the adsorption groove 114a and the coupling groove 114b is extended to the end of the first auxiliary plate 111'. A vacuum source connected to the outside can also be used.

Further, in the above embodiment, the adhesive layer 103 is formed of a liquid adhesive, but the adhesive layer 103 may be formed of a solid adhesive.

By forming a bonding layer 103 by a solid adhesive, as compared with In the case where the liquid adhesive forms the adhesive layer 103, the amount of the auxiliary plate 110 caused by the pressing can be reduced, so that the range of strength sought by the auxiliary plate 110 can be increased.

Therefore, in the case where the adhesive layer 103 is formed by a solid adhesive, for example, the coupling groove 114b can be provided in a direction orthogonal to the bonding direction.

Further, in the above embodiment, the back layer 103 is formed in the first plate member 101, but the back layer 103 may be formed in the second plate member 102.

Further, the bonding apparatus of the present invention may include a moving means for moving the auxiliary plates 110, 110' to the bonding stage 3 or moving from the bonding stage 3. As a result, in the bonding apparatus of the present invention, the auxiliary plate 110.110' in which the second plate-shaped member 102 is held by suction can be moved to an arbitrary working position.

For example, in order to apply the adhesive, the second plate member 102 and the auxiliary plate 110 placed on the coating stage can be moved to the bonding stage 3 by an auxiliary means.

Further, in the above-described embodiment, the second bushing 6 is provided with the connecting portion 6e and the pair of weight portions 6f, but may be provided in the first bushing 4. Further, the shape and size of the weight portion 6f can be arbitrarily changed.

Further, in the above-described embodiment, the support portion 6c and the pair of weight portions 6f are provided so that the support portion 6c of the second bushing 6 can be tilted in accordance with the bonding angle θ. However, the support portion 6c is tilted by an electric driving means. Also.

Further, in the above embodiment, the stage moving means 2 is moved so that the bonding stage 3, the first bushing 4, the first bushing driving means 5, the second bushing 6, and the second bushing driving means 7 are moved. The position relative to the roller 8 changes, but instead of moving the stage moving means 2, the roller 8 may be moved.

Further, in the above embodiment, the flat auxiliary plate 110 is used, but the curved plate-shaped auxiliary plate may be used, and the curved plate-shaped auxiliary plate has a degree of initial bending to the fitting angle θ and is supported by the roller 8 The rigidity of the degree of flattening when the pressing means is pressed.

Further, depending on the bonding state (for example, when the thickness precision condition is loose), an auxiliary plate having a flat plate shape or a curved plate shape having a rigidity which is bent within a predetermined range due to its own weight may be used.

Further, the range in which the auxiliary plate 110 is bent by its own weight (the amount of deflection of the auxiliary plate 110) can be changed by changing the material and thickness of the first auxiliary plate 111 and the second auxiliary plate 112, the arrangement of the adsorption groove 114a or the coupling groove 114b, Depth and number can be arbitrarily designed.

Further, in the above-described embodiment, the cover glass (the second plate member 102) is adhered to the liquid crystal panel (the first plate member 101). However, the film sticking device of the present invention can adhere any of the second plate members 102 to any For example, the first plate-shaped member 101 can be adhered to the glass (the first plate-shaped member 101) having a length longer than the glass in the bonding direction (the second plate-shaped member 102).

1‧‧‧Fitting device

2‧‧‧Moving station means

3‧‧‧Fixed stage

4‧‧‧1st bushing

5‧‧‧1st bushing drive

6‧‧‧2nd bushing

7‧‧‧2nd bushing drive

8‧‧‧ Roll

9‧‧‧Roll drive

101‧‧‧1st plate member

102‧‧‧2nd plate member

103‧‧‧Next layer

110,110’‧‧‧Auxiliary board

110a‧‧‧1st end

110b‧‧‧2nd end

111,111’‧‧‧1st auxiliary board

112, 112' ‧ ‧ 2nd auxiliary board

113‧‧‧Adsorption holes

114a‧‧‧Adsorption tank

114b‧‧‧link slot

115‧‧‧connection hole

116‧‧‧Means of engagement

117‧‧‧ Sealing means

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view of the laminating apparatus of the present invention.

Fig. 2 is a side view showing the relationship between the first bushing and the auxiliary plate of the present invention.

Fig. 3 is a view showing the relationship between the second bushing and the auxiliary plate of the present invention, wherein (a) is a side view and (b) is a plan view.

Figure 4 is a bottom plan view showing the relationship between the roller of the present invention and the auxiliary plate.

Fig. 5 is an auxiliary plate of the present invention, (a) is a partial perspective view as seen from the bottom surface side, and (b) is a partially exploded perspective view as seen from the bottom surface side.

Fig. 6 is a view showing the bonding operation of the bonding apparatus of the present invention in the order of (a) → (b) → (c).

Fig. 7 is a perspective view showing a modification of the auxiliary plate of the present invention, (a) is a partial perspective view as seen from the bottom surface side, and (b) is a partially exploded perspective view as seen from the bottom surface side.

Figure 8 is a side elevational view of a conventional fitting device.

1‧‧‧Fitting device

2‧‧‧Moving station means

3‧‧‧Fixed stage

3a‧‧‧Adsorption nozzle

4‧‧‧1st bushing

5‧‧‧1st bushing drive

6‧‧‧2nd bushing

7‧‧‧2nd bushing drive

8‧‧‧ Roll

9‧‧‧Roll drive

101‧‧‧1st plate member

102‧‧‧2nd plate member

103‧‧‧Next layer

110‧‧‧Auxiliary board

110a‧‧‧1st end

110b‧‧‧2nd end

Claims (10)

A bonding apparatus for aligning a first plate-shaped member placed on a bonding stage with a second plate-shaped member located above the first plate-shaped member a pressing means above the plate-shaped member presses one end portion of the second plate-shaped member against the first plate-shaped member, and the first plate-shaped member and the pressing means for the second plate-shaped member are The second plate-shaped member is bonded to the first plate-shaped member, and the auxiliary plate is provided, and the length of the bonding direction is longer than the second plate-shaped member. And the second plate-shaped member is held between the second plate-shaped member and the pressing means at the time of bonding, and the first bushing has a support portion, and the support portion is located at the second portion held by the support a lower end of the first end portion of the auxiliary plate on the one end side of the holding member, the first end portion is restricted from moving downward during the bonding; and the second bushing has a support portion by the support portion Supporting the lower surface of the second end portion of the auxiliary plate opposite to the first end portion, and restricting the second end portion downward during the bonding Moving forward; the first bushing and the second bushing can be vertically raised and lowered independently; and the second end portion is maintained at a position higher than the first end portion, and is pressed by the pressing means through the auxiliary plate In the second plate-shaped member, the portion where the second plate-shaped member is not pressed is not in contact with the first plate-shaped member. The bonding apparatus of claim 1, wherein the auxiliary board has a second bending that is not bent by its own weight and is pressed by the pressing means, and the second The rigidity of the plate member to be bent together. The bonding apparatus of claim 1, wherein the auxiliary board has rigidity to a degree that is bent within a predetermined range due to its own weight. The bonding apparatus according to any one of claims 1 to 3, wherein the auxiliary plate is provided by the first auxiliary plate that adsorbs and holds the upper surface of the second plate-shaped member, and is superposed on the first auxiliary plate. a second auxiliary plate is formed on the lower surface of the second auxiliary plate; a plurality of adsorption grooves extending along the bonding direction are provided in parallel with the bonding direction; and the first auxiliary plate is along the adsorption The groove is provided with a plurality of adsorption holes communicating with the adsorption groove. The bonding apparatus according to any one of claims 1 to 3, wherein the auxiliary plate is provided by the first auxiliary plate that adsorbs and holds the upper surface of the second plate-shaped member, and is superposed on the first auxiliary plate. a second auxiliary plate is formed on the upper surface of the first auxiliary plate; a plurality of adsorption grooves extending along the bonding direction are disposed in parallel with the bonding direction; and the lower surface of the first auxiliary plate is along the side The adsorption tank is provided with a plurality of adsorption holes communicating with the adsorption tank; the second auxiliary plate covers the adsorption tank. The bonding device of claim 4, wherein the plurality of adsorption grooves are connected to each other by a coupling groove extending in a non-orthogonal direction with respect to the bonding direction; a plurality of the adsorption grooves and the coupling groove One of the slots is connected to an external vacuum source. A bonding device according to item 5 of the patent application, wherein the plurality of The adsorption grooves are connected to each other by a coupling groove extending in a non-orthogonal direction with respect to the bonding direction; a plurality of the adsorption grooves and one of the connection grooves are connected to an external vacuum source. The bonding apparatus according to any one of claims 1 to 3, wherein the support portion of the second bushing is tilted to correspond to a bonding angle between the second plate member and the first plate member. The bonding apparatus of the fourth aspect of the invention, wherein the support portion of the second bushing is tilted to correspond to a bonding angle between the second plate member and the first plate member. The bonding apparatus of the fifth aspect of the invention, wherein the support portion of the second bushing is tilted to correspond to a bonding angle between the second plate member and the first plate member.