JPWO2006118016A1 - Bonding apparatus and bonding system having the same - Google Patents

Bonding apparatus and bonding system having the same Download PDF

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JPWO2006118016A1
JPWO2006118016A1 JP2007514585A JP2007514585A JPWO2006118016A1 JP WO2006118016 A1 JPWO2006118016 A1 JP WO2006118016A1 JP 2007514585 A JP2007514585 A JP 2007514585A JP 2007514585 A JP2007514585 A JP 2007514585A JP WO2006118016 A1 JPWO2006118016 A1 JP WO2006118016A1
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holding
mounting member
bonding
workpiece
bonding apparatus
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JP4908404B2 (en
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泰司 田村
泰司 田村
奈良場　聰
聰 奈良場
誠次 松田
誠次 松田
義浩 木下
義浩 木下
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Toray Engineering Co Ltd
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
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Abstract

本発明のボンディング装置およびボンディングシステムは、仮圧着ヘッドの下端にチップを吸着保持する第１保持部材と、ＦＰＣを吸着保持する第２保持部材を備えている。第１保持部材は、チップ部品の全面または一部を吸着保持し、第２保持部材は、ＦＰＣの全面を覆うとともに、少なくとも角部を吸着保持する。そして、このボンディングシステムは、搬送されてきた実装部材に応じて、制御部が電磁弁を切り換えて第１または第２保持部材の少なくともいずれかを作動させてチップまたは／およびＦＰＣを吸着保持する。The bonding apparatus and the bonding system according to the present invention include a first holding member that sucks and holds a chip at the lower end of the temporary press-bonding head and a second holding member that sucks and holds the FPC. The first holding member sucks and holds the entire surface or part of the chip component, and the second holding member covers the entire surface of the FPC and holds and holds at least the corners. In this bonding system, the control unit switches the electromagnetic valve according to the transported mounting member and operates at least one of the first and second holding members to suck and hold the chip or / and the FPC.

Description

本発明は、電子部品などのチップ部品やフィルム状の回路基板などを、ガラスや樹脂の基板などからなるワークに実装するボンディング装置およびこれを用いたボンディングシステムに関する。   The present invention relates to a bonding apparatus for mounting a chip component such as an electronic component or a film-like circuit board on a workpiece made of a glass or resin substrate, and a bonding system using the same.

従来のボンディング装置は、基板保持テーブルに保持したガラスや樹脂の回路基板の所定箇所に異方導電性フィルムなど導電性接合材料を供給し、ボンディングヘッドによって吸着保持した電子部品であるチップ部品を当該箇所に押圧しながら異方導電性フィルムを加熱して実装している（例えば、特許文献１参照）。   A conventional bonding apparatus supplies a chip material, which is an electronic component that is sucked and held by a bonding head, by supplying a conductive bonding material such as an anisotropic conductive film to a predetermined portion of a circuit board made of glass or resin held on a substrate holding table. The anisotropic conductive film is heated and mounted while being pressed to a place (see, for example, Patent Document 1).

また、チップ部品とは異なる実装部材であるＦＰＣ（Flexible Printed Circuit）を個別のボンディング装置を利用して回路基板に実装している（例えば、特許文献２参照参照）。
特開２００３−５９９７５号公報 特開２００３−６６４７９号公報 Further, an FPC (Flexible Printed Circuit), which is a mounting member different from a chip component, is mounted on a circuit board using an individual bonding apparatus (see, for example, Patent Document 2).
JP 2003-59975 A JP 2003-66479 A

近年、携帯電話や携帯端末のＰＤＡ（Personal Digital Assistant）などの小型の機器においては、液晶パネルを搭載しつつも、小型かつ軽量化が要求されている。そのため、液晶ガラス基板には、面実装タイプの電子部品やＬＳＩ（Large Scale Integrated circuit）、および小さい筐体内の空間利用が容易で軽量なＦＰＣとが実装されている。特に、ＦＰＣは、湾曲させて筐体内の限られたスペースに収納させるので複雑な形状をしている。このような複雑な形状のＦＰＣを小型の液晶ガラス基板に自動実装することが困難な状況にある。   In recent years, small devices such as mobile phones and PDAs (Personal Digital Assistants) of portable terminals have been required to be small and light while mounting a liquid crystal panel. Therefore, on the liquid crystal glass substrate, a surface mount type electronic component, an LSI (Large Scale Integrated circuit), and an FPC that is easy to use and light in space in a small casing are mounted. In particular, the FPC has a complicated shape because it is curved and stored in a limited space in the housing. It is difficult to automatically mount such a complicated shaped FPC on a small liquid crystal glass substrate.

また、小型の液晶ガラス基板は、その電極のピッチが狭くなる傾向にあり、ＬＳＩなどのチップ部品のみならずＦＰＣの実装精度を高めることが要求されている。しかしながら、ＦＰＣは撓みやすく取り扱いが困難であるので、手動装置にて実装するが、手動で精度よく実装することが困難である。   In addition, a small liquid crystal glass substrate tends to have a narrower pitch of electrodes, and it is required to improve not only chip components such as LSIs but also FPC mounting accuracy. However, since FPC is flexible and difficult to handle, it is mounted with a manual device, but it is difficult to mount it manually with high accuracy.

また、従来のように、実装部品ごとに異なるボンディング装置を利用した場合、装置間の基板搬送過程で人が介在して基板に塵埃が付着し、品質不良が発生するといった問題もある。   In addition, when different bonding apparatuses are used for different mounting parts as in the prior art, there is a problem in that a person is interposed in the process of transporting the board between the apparatuses and dust adheres to the board, resulting in poor quality.

本発明は、このような事情に鑑みてなされたものであって、基板などのワークに異なる実装部品を精度よく実装することができるボンディング装置およびこれを備えたボンディングシステムを提供することを主たる目的とする。   The present invention has been made in view of such circumstances, and a main object of the present invention is to provide a bonding apparatus capable of accurately mounting different mounting components on a workpiece such as a substrate, and a bonding system including the same. And

本発明は、このような目的を達成するために、次のような構成をとる。
すなわち、本発明のボンディング装置は、ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、前記ワークを載置保持する第１保持テーブルと、前記実装部材であるチップ部品を保持する第１保持手段と、前記実装部材であるフィルム状またはシート状の基板を保持する第２保持手段と、前記第１保持手段と第２保持手段を取り付けるヘッドと、前記第１保持テーブルの載置保持されたワークに前記各実装部材を実装するとき、前記第１保持手段と第２保持手段による各実装部材の保持タイミングを制御するタイミング制御手段と、前記ヘッドまたは前記保持テーブルを昇降させる第１駆動手段と、前記第１駆動手段を作動させて前記ヘッドを保持テーブルに対して相対的に昇降移動させ、前記第１または第２保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱する加熱手段とを備えたことを特徴とする。In order to achieve such an object, the present invention has the following configuration.
That is, the bonding apparatus of the present invention is a bonding apparatus that mounts a mounting member on a workpiece via a conductive bonding material, and includes a first holding table for mounting and holding the workpiece, and a chip component that is the mounting member. A first holding means for holding; a second holding means for holding a film-like or sheet-like substrate as the mounting member; a head for attaching the first holding means and the second holding means; and a first holding table. When mounting each mounting member on the mounted workpiece, timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means, and the head or the holding table are moved up and down. The first driving means and the first driving means are operated to move the head up and down relatively with respect to the holding table, and the first or second holding means. Characterized by comprising a heating means for heating the conductive bonding material in a state of being pressed mounting member held in the unit to the workpiece.

本発明のボンディング装置によれば、ワークに実装する実装部材に応じて、ヘッドに取り付けた第１保持手段または第２保持手段のいずれかの保持を作動させることができる。つまり、チップ部品またはフィルム状の基板など異なる形状の実装部品を単一のヘッドでワークに実装することができる。なお、本発明のチップ部品としては、例えば、ＬＳＩや電子部品などである。したがって、発明装置は、実装ずれのない高度な実装精度の要求されるＬＳＩの実装が可能となるので、フィルム状の基板の実装精度の向上も図ることができる。   According to the bonding apparatus of the present invention, either the first holding means or the second holding means attached to the head can be operated in accordance with the mounting member to be mounted on the workpiece. That is, mounting components having different shapes such as chip components or film-like substrates can be mounted on the workpiece with a single head. The chip component of the present invention is, for example, an LSI or an electronic component. Therefore, the inventive device can mount LSIs that require high mounting accuracy without mounting deviation, and can therefore improve the mounting accuracy of a film-like substrate.

なお、第１保持手段は、チップ部品の中央または／および幅方向に均等に吸着保持し、 第２保持手段は、前記基板の複数の角部近傍を吸着保持するよう構成することが好ましい。   Preferably, the first holding means is configured to suck and hold evenly in the center or / and the width direction of the chip component, and the second holding means is configured to suck and hold near the plurality of corners of the substrate.

この構成によれば、第１保持手段は、チップ部品のような硬質な部品を精度よく吸着保持することができる。また、第２保持手段は、フィルム状の撓みやすい基板を平面状に保持することができる。すなわち、チップ部品やフィルム状の基板などをワークに精度よく実装することができる。   According to this configuration, the first holding means can accurately hold and hold a hard component such as a chip component. The second holding means can hold the film-like flexible substrate in a flat shape. That is, a chip component, a film-like substrate, or the like can be accurately mounted on the workpiece.

また、本発明のボンディング装置は、第１保持手段または第２保持手段の少なくともともいずれかを昇降させる第２駆動手段と、第１保持手段および第２保持手段に保持される両実装部材の厚みの差に応じて、第２駆動手段の作動制御する駆動制御手段とを備えることが好ましい。   In the bonding apparatus of the present invention, the thicknesses of the second driving means for raising and lowering at least one of the first holding means and the second holding means, and the thicknesses of both mounting members held by the first holding means and the second holding means. It is preferable to include drive control means for controlling the operation of the second drive means in accordance with the difference between the two.

この構成によれば、実装部材をワークに実装する場合に、実装部材を保持している保持手段を降下、または、実装部材を保持していない保持手段を上昇させることにより、実装部材を保持しないいずれかの保持手段が、近隣にある部材と接触および押圧して破損させるのを防止することができる。   According to this configuration, when the mounting member is mounted on the workpiece, the mounting member is not held by lowering the holding means holding the mounting member or raising the holding means not holding the mounting member. Any of the holding means can be prevented from being damaged by contacting and pressing a member in the vicinity.

また、駆動制御手段は、第１保持手段および第２保持手段の両方が実装部材を保持した状態で第２駆動手段を作動制御し、両保持手段が実装部材を同時にワークに実装するように構成してもよい。この構成によれば、作業効率の向上を図ることができる。   The drive control means is configured to control the operation of the second drive means while both the first holding means and the second holding means hold the mounting member, and both the holding means simultaneously mount the mounting member on the workpiece. May be. According to this configuration, work efficiency can be improved.

また、本発明のボンディング装置を備えたボンディングシステムは、前記ワークを載置保持する第２保持テーブルと、前記第２保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第１ワーク搬送手段と、前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第２ワーク搬送手段と、を備えたことを特徴とする。   In addition, a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table having a width corresponding to a mounting member. A plurality of conductive material supply means for supplying an anisotropic conductive film, a first work transfer means for transferring the work supplied with the anisotropic conductive film to a bonding apparatus, and a mounting for transferring a mounting member to the bonding apparatus After heating the anisotropic conductive film supplied to the workpiece by the member conveying means and the bonding apparatus, the polymerization reaction is advanced halfway to mount the mounting member on the workpiece in an uncured state, and then the anisotropic of the workpiece The conductive film is further heated to terminate the polymerization reaction, and the thermocompression bonding means for fixing the mounting member to the work, and mounting by the bonding apparatus. Characterized by comprising a second workpiece carrying means for carrying the implemented workpiece timber in the heat pressing means.

すなわち、この構成によれば、ワークに異方導電性フィルムを供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる。したがって、搬送過程などにおいて、ワークに塵埃が付着するのを回避することができるので、高品位のワークを得ることができる。   That is, according to this configuration, a series of processes from supplying the anisotropic conductive film to the workpiece to mounting the mounting member at the supply location can be performed without human intervention. Therefore, dust can be prevented from adhering to the workpiece during the conveyance process and the like, so that a high-quality workpiece can be obtained.

なお、本発明のボンディングシステムは、チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手段を備えることが好ましい。この洗浄手段としては、例えば、気体または超音波を付与した気体を実装部材に吹き付けるよう構成があげられる。   In addition, it is preferable that the bonding system of this invention is equipped with the washing | cleaning means which wash | cleans both chip components and a film-like or sheet-like mounting member. As this cleaning means, for example, a configuration in which a gas or a gas to which ultrasonic waves are applied is blown onto the mounting member can be mentioned.

また、本発明のボンディング装置装置は、ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、前記ワークを載置保持する第１保持テーブルと、前記実装部材であるフィルム状またはシート状の基板およびチップ部品の両実装部材の実装部位を吸着保持する複数個の吸着孔の形成された保持手段と、前記保持手段を取り付けるヘッドと、前記保持手段に保持する実装部材の形状に応じて、当該保持手段に形成された複数個の吸着孔の吸着作動を切換制御する制御手段と、前記保持テーブルとヘッドとを相対的に昇降移動させる第１駆動手段と、前記第１駆動手段を作動させて前記保持テーブルとヘッドとを相対的に昇降移動させ、前記保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱する加熱手段と、を備えたことを特徴とする。   Moreover, the bonding apparatus apparatus of this invention is a bonding apparatus which mounts a mounting member on a workpiece | work via a conductive bonding material, Comprising: The 1st holding table which mounts and hold | maintains the said workpiece | work, and the film form which is the said mounting member Alternatively, a holding means having a plurality of suction holes for sucking and holding the mounting portions of both the sheet-like substrate and the chip component mounting member, a head to which the holding means is attached, and the shape of the mounting member held by the holding means In response to the control means, the control means for switching and controlling the suction operation of the plurality of suction holes formed in the holding means, the first drive means for moving the holding table and the head relatively up and down, and the first drive The conductive table in a state where the mounting member held by the holding means is pressed against the workpiece by moving the holding table and the head relatively up and down by operating the means. Heating means for heating the bonding material, characterized by comprising a.

この構成によれば、保持手段の形成された複数個の吸着孔の作動を制御することにより、単一の保持手段を利用してチップと基板の両方を適時に吸着保持することができる。また、チップの実装精度と同じ実装精度によって基板を精度よく実装することができる。   According to this configuration, by controlling the operation of the plurality of suction holes formed with the holding means, both the chip and the substrate can be suctioned and held in a timely manner using a single holding means. In addition, the substrate can be mounted with high accuracy by the same mounting accuracy as the mounting accuracy of the chip.

なお、本発明のボンディング装置は、さらに保持手段によって基板を吸着保持したときに、保持手段からはみ出る部位を吸着保持する支持手段を備えることが好ましい。   Note that the bonding apparatus of the present invention preferably further includes support means for sucking and holding a portion protruding from the holding means when the substrate is sucked and held by the holding means.

この構成によれば、保持手段からはみ出した基板を支持手段により吸着保持するので、基板の撓みによる実装部位への位置ずれなどを回避することができる。   According to this configuration, since the substrate protruding from the holding means is sucked and held by the supporting means, it is possible to avoid a positional shift to the mounting site due to the bending of the substrate.

また、支持手段は、基板の複数の角部近傍を吸着保持するよう構成することが好ましい。   Further, it is preferable that the support means is configured to suck and hold the vicinity of a plurality of corners of the substrate.

この構成によれば、フィルム基板などを撓ますことなく平坦状態を維持したまま取り扱うことができる。   According to this configuration, the film substrate or the like can be handled while being kept flat without being bent.

また、本発明のボンディング装置は、保持手段または支持手段の少なくともともいずれかを昇降させる第２駆動手段と、保持手段および支持手段に保持される両実装部材の厚みの差に応じて、第２駆動手段の作動制御する駆動制御手段と、を備えることが好ましい。   Further, the bonding apparatus of the present invention has a second driving unit that moves up and down at least one of the holding unit and the supporting unit, and the second driving unit according to a difference in thickness between the mounting members held by the holding unit and the supporting unit. Drive control means for controlling the operation of the drive means.

また、駆動制御手段は、保持手段および第支持手段の両方が実装部材を保持した状態で第２駆動手段を作動制御し、保持手段が両実装部材を同時にワークに実装するように構成することがより好ましい。   The drive control means may be configured to control the operation of the second drive means in a state where both the holding means and the first support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. More preferred.

また、本発明のボンディング装置を備えたボンディングシステムは、前記ワークを載置保持する第２保持テーブルと、前記第２保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第１ワーク搬送手段と、前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第２ワーク搬送手段と、を備えたことを特徴とする。   In addition, a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table having a width corresponding to a mounting member. A plurality of conductive material supply means for supplying an anisotropic conductive film, a first work transfer means for transferring the work supplied with the anisotropic conductive film to a bonding apparatus, and a mounting for transferring a mounting member to the bonding apparatus After heating the anisotropic conductive film supplied to the workpiece by the member conveying means and the bonding apparatus, the polymerization reaction is advanced halfway to mount the mounting member on the workpiece in an uncured state, and then the anisotropic of the workpiece The conductive film is further heated to terminate the polymerization reaction, and the thermocompression bonding means for fixing the mounting member to the work, and mounting by the bonding apparatus. Characterized by comprising a second workpiece carrying means for carrying the implemented workpiece timber in the heat pressing means.

すなわち、この構成によれば、ワークに異方導電性フィルムを供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる。したがって、搬送過程などにおいて、ワークに塵埃が付着するのを回避することができるので、高品位のワークを得ることができる。   That is, according to this configuration, a series of processes from supplying the anisotropic conductive film to the workpiece to mounting the mounting member at the supply location can be performed without human intervention. Therefore, dust can be prevented from adhering to the workpiece during the conveyance process and the like, so that a high-quality workpiece can be obtained.

本発明に係るにボンディング装置によれば、ワークに実装する実装部材に応じて、ヘッドに取り付けた第１保持手段または第２保持手段のいずれかの保持を作動させ、チップ部品またはフィルム状の基板など異なる形状の実装部品をワークに実装することができる。   According to the bonding apparatus of the present invention, the holding of either the first holding means or the second holding means attached to the head is operated according to the mounting member to be mounted on the work, and the chip component or the film-like substrate Mounting parts with different shapes can be mounted on the workpiece.

また、この発明に係るボンディングシステムによれば、ワークに異方導電性フィルムを供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる。すなわち、搬送過程などにおいて、ワークに塵埃が付着するのを回避することができるので、高品位のワークを得ることができる。   Moreover, according to the bonding system which concerns on this invention, a series of processes after supplying an anisotropic conductive film to a workpiece | work until mounting a mounting member in the said supply location can be performed without a person. . That is, since it is possible to avoid the dust from adhering to the workpiece during the conveyance process, a high-quality workpiece can be obtained.

また、装置およびシステムが簡素化されるので、装置導入費用を抑えることができるとともに、生産効率を上げることができる。   In addition, since the apparatus and the system are simplified, it is possible to suppress the apparatus introduction cost and increase the production efficiency.

実施例に係るボンディングシステムの斜視図である。It is a perspective view of the bonding system which concerns on an Example. 実装部材供給ユニットの概略構成を示した斜視図である。It is the perspective view which showed schematic structure of the mounting member supply unit. 第１および第２実装部材移送機構の吸着部材の下面から見た図である。It is the figure seen from the lower surface of the adsorption member of the 1st and 2nd mounting member transfer mechanism. 基板に実装部材を実装した様子を示す図である。It is a figure which shows a mode that the mounting member was mounted in the board | substrate. 仮圧着ヘッドに備わった第１および第２保持部材の下面から見た図である。It is the figure seen from the lower surface of the 1st and 2nd holding member with which the temporary crimping head was equipped. 仮圧着ヘッドの概略構成を示す斜視図である。It is a perspective view which shows schematic structure of a temporary crimping | compression-bonding head. 実施例２に係る仮圧着ヘッドに備わった第１および第２保持部材の下面から見た図である。FIG. 10 is a view of the first and second holding members provided in the provisional pressure bonding head according to the second embodiment when viewed from the lower surface. 変形例のボンディング装置の動作を説明する図である。It is a figure explaining operation | movement of the bonding apparatus of a modification.

符号の説明Explanation of symbols

１ａ… ボンディング部位（チップ用）
１ｂ… ボンディング部位（ＦＰＣ用）
２ … チップ
４ … ＦＰＣ
２０ … 基板供給ユニット
３０ … 実装部材供給ユニット
３１Ａ… 第１実装部材移送機構
３１Ｂ… 第２実装部材移送機構
４０ … 導電材料供給ユニット
５０ … 仮圧着ユニット
５２ … 仮圧着ヘッド
５４ … 基板保持ステージ
５６Ａ… 第１保持部材
５６Ｂ… 第２保持部材
５６Ｃ… 第１保持部材
５６Ｄ… 第２保持部材
６０Ａ… 本圧着ユニット（チップ用）
６０Ｂ… 本圧着ユニット（ＦＰＣ用）
７０ … 基板収納ユニット
９０ … 制御部1a ... Bonding part (for chip)
1b ... Bonding part (for FPC)
2 ... Chip 4 ... FPC
DESCRIPTION OF SYMBOLS 20 ... Board | substrate supply unit 30 ... Mounting member supply unit 31A ... 1st mounting member transfer mechanism 31B ... 2nd mounting member transfer mechanism 40 ... Conductive material supply unit 50 ... Temporary pressure bonding unit 52 ... Temporary pressure bonding head 54 ... Substrate holding stage 56A ... First holding member 56B ... Second holding member 56C ... First holding member 56D ... Second holding member 60A ... Main pressure bonding unit (for chip)
60B ... Main crimping unit (for FPC)
70 ... Substrate storage unit 90 ... Control unit

以下、図面を参照して本発明のボンディング装置を備えたボンディングシステムの実施例を説明する。なお、本実施例では、チップ部品としてＬＳＩを、フィルム状の基板などとしてはＦＰＣ（Flexible Printed Circuit）をワークであるガラス基板に実装する場合を例にとって説明する。なお、チップ部品としては、その他に例えば、電子部品、ＩＣチップ、半導体チップ、光素子、表面実装部品、ウエハなどの種類や大きさに関係なく、基板と接合させる側の全ての形態を示す。なお、以下、本実施例では、ＬＳＩを単にチップという。   Embodiments of a bonding system including a bonding apparatus according to the present invention will be described below with reference to the drawings. In this embodiment, an example will be described in which an LSI is mounted as a chip component, and an FPC (Flexible Printed Circuit) is mounted as a film substrate on a glass substrate as a workpiece. In addition, as the chip component, for example, all forms on the side to be bonded to the substrate are shown regardless of the types and sizes of electronic components, IC chips, semiconductor chips, optical elements, surface mount components, wafers, and the like. Hereinafter, in this embodiment, the LSI is simply referred to as a chip.

また、基板としては、例えば、樹脂基板やガラス基板などチップ部品などが接合される側の全ての形態を示す。なお、本実施例では液晶ディスプレイパネル用のガラス基板を利用する。   Moreover, as a board | substrate, all the forms by the side to which chip components etc., such as a resin substrate and a glass substrate, are joined are shown, for example. In this embodiment, a glass substrate for a liquid crystal display panel is used.

図１は、本実施例に係るボンディングシステムの斜視図である。
本実施例に係るチップ実装装置は、大きく分けて、装置基台１０と、この装置基台１０の一端側（図１では左端）に配設された基板供給ユニット２０と、装置基台１０の奥側に配設された実装部材供給ユニット３０と、基板供給ユニット２０の隣に配設された導電材料供給ユニット４０と、その隣に配設された仮圧着ユニット５０と、さらにその隣に配設された本圧着ユニット６０Ａ、６０Ｂと、装置基台１０の他端側（図１では右端）に配設された基板収納ユニット７０と、装置基台１０の手前側に配設された４つの基板搬送機構８０Ａ〜８０Ｄとから構成されている。なお、実装部材供給ユニット３０は、本発明の実装部材搬送手段に相当し、導電材料供給ユニット４０は導電材料供給手段に相当し、本圧着ユニット６０Ａ、６０Ｂは加熱圧着手段に相当する。FIG. 1 is a perspective view of the bonding system according to the present embodiment.
The chip mounting apparatus according to the present embodiment is roughly divided into an apparatus base 10, a substrate supply unit 20 disposed on one end side (left end in FIG. 1) of the apparatus base 10, and an apparatus base 10. The mounting member supply unit 30 disposed on the back side, the conductive material supply unit 40 disposed adjacent to the substrate supply unit 20, the temporary pressure bonding unit 50 disposed adjacent thereto, and further disposed adjacent thereto. The main crimping units 60A and 60B provided, the substrate storage unit 70 disposed on the other end side (the right end in FIG. 1) of the apparatus base 10, and the four units disposed on the front side of the apparatus base 10. It is comprised from board | substrate conveyance mechanisms 80A-80D. The mounting member supply unit 30 corresponds to the mounting member conveying means of the present invention, the conductive material supply unit 40 corresponds to the conductive material supply means, and the main pressure bonding units 60A and 60B correspond to the thermocompression bonding means.

基板供給ユニット２０は、実装部材であるＬＳＩとＦＰＣの実装前の複数枚のガラス基板１（以下、単に「基板」という）を一定間隔で多段に収納する基板収納マガジン２１と、この基板収納マガジン２１から基板１を順に取り出す昇降および水平移動可能な昇降テーブル２２とを備えている。また、基板供給ユニット２０は、基板１を順に供給可能であれば、その構造は特に限定されず、例えば、複数枚の基板１を水平面内に整列配置したトレイ構造であってもよい。   The substrate supply unit 20 includes a substrate storage magazine 21 that stores a plurality of glass substrates 1 (hereinafter simply referred to as “substrates”) before mounting LSI and FPC, which are mounting members, in multiple stages at regular intervals, and the substrate storage magazine. And a lifting table 22 capable of moving up and down and horizontally moving the substrate 1 in order. The substrate supply unit 20 is not particularly limited in structure as long as the substrates 1 can be sequentially supplied. For example, the substrate supply unit 20 may have a tray structure in which a plurality of substrates 1 are arranged in a horizontal plane.

実装部材供給ユニット３０は、図２に示すように、基板１に実装すべき複数個のチップ２をフェイスアップ状態で縦横に整列配置したチップトレイ３からチップ２を１個ずつ順に取り出し、フェイスアップ状態で移送する第１実装部材移送機構３１Ａと、基板１に実装すべき複数個のＦＰＣ４をフェイスアップ状態で縦横に整列配備したＦＰＣトレイ５から、ＦＰＣ４を１個ずつ順に取り出し、そのＦＰＣ４をフェイスアップ状態で移送する第２実装部材移送機構３１Ｂと、これら第１および第２実装部材搬送機構３１Ａ、３１Ｂから交互に各実装部材を受け取り、その実装部材を保持して上下反転することにより、そのチップ２およびＦＰＣ４をフェイスダウン状態の姿勢変換する反転テーブル３２と、この反転テーブル３２から各実装部材を受け取り、各実装部材をフェイスダウン状態で保持する保持テーブル３３とを備える。この保持テーブル３３から各実装部材を、さらに第１および第２実装部材移送機構３１Ａ、３１Ｂが受け取り、保持して移送することにより、その各実装部材を所定位置（具体的には、待機位置にあるスライダー３４上の所定位置）にフェイスダウン状態などで供給する。   As shown in FIG. 2, the mounting member supply unit 30 sequentially takes out the chips 2 one by one from the chip tray 3 in which a plurality of chips 2 to be mounted on the substrate 1 are arranged vertically and horizontally in a face-up state. The FPC 4 is taken out one by one from the FPC tray 5 in which the first mounting member transport mechanism 31A for transporting in a state and a plurality of FPCs 4 to be mounted on the substrate 1 are arranged in the vertical and horizontal directions in a face-up state. By receiving each mounting member alternately from the second mounting member transport mechanism 31B that transports in the up state, and the first and second mounting member transport mechanisms 31A, 31B, and holding the mounting member upside down, A reversing table 32 for converting the posture of the chip 2 and the FPC 4 in a face-down state, and each mounting unit from the reversing table 32 Receive, each mounting member and a holding table 33 for holding face-down state. Each mounting member is further received from the holding table 33 by the first and second mounting member transfer mechanisms 31A and 31B, and held and transferred to move the mounting member to a predetermined position (specifically, to the standby position). A predetermined position on a slider 34) is supplied in a face-down state or the like.

具体的には、チップトレイ３の一辺に沿う方向（Ｙ方向）に固定レール３５Ａが設けられており、この固定レール３５Ａ上を、Ｘ方向に延びる可動レール３５Ｂが走行するようになっている。この可動レール３５Ｂ上を走行する可動ベース３６に上述した第１実装部材移送機構３１Ａと第２実装部材移送機構３１Ｂとが間隔をあけて取り付けられている。   Specifically, a fixed rail 35A is provided in a direction (Y direction) along one side of the chip tray 3, and a movable rail 35B extending in the X direction travels on the fixed rail 35A. The first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B described above are attached to the movable base 36 that travels on the movable rail 35B with an interval therebetween.

第１実装部材移送機構３１Ａの下端部には、チップ２を吸着保持可能な吸着ヘッド６Ａが取り付けられている。また、第２実装部材移送機構３１Ｂの下端部には、ＦＰＣ４を吸着保持可能な吸着ヘッド６Ｂが取り付けられている。吸着ヘッド６Ａは、図３（ａ）に示すように、チップ２の全面を覆う横長矩形状であり、その中央にチップ２を吸着保持する吸着孔８Ａが形成されている。また吸着ヘッド６Ｂは、図３（ｂ）に示すように、ＦＰＣ４の全面を覆う横長矩形状であり、ＦＰＣ４が撓むことのないように複数の角部の近傍を吸着保持する吸着孔８Ｂが形成されている。   A suction head 6A capable of sucking and holding the chip 2 is attached to the lower end of the first mounting member transfer mechanism 31A. A suction head 6B capable of sucking and holding the FPC 4 is attached to the lower end portion of the second mounting member transfer mechanism 31B. As shown in FIG. 3A, the suction head 6A has a horizontally long rectangular shape that covers the entire surface of the chip 2, and a suction hole 8A that sucks and holds the chip 2 is formed at the center thereof. Further, as shown in FIG. 3B, the suction head 6B has a horizontally long rectangular shape that covers the entire surface of the FPC 4, and has suction holes 8B that suck and hold the vicinity of a plurality of corners so that the FPC 4 does not bend. Is formed.

反転テーブル３２には、Ｙ方向の軸心Ｐ周りに１８０度の範囲で回動可能に構成されている。なお、第１および第２実装部材移送機構３１Ａ、３１Ｂからスライダー３４に実装部材が移送される途中の下方に認識手段であるカメラ９１が配備されており、両実装部材移送機構３１Ａ、３１Ｂの下端に吸着保持された各実装部材の吸着保持姿勢を認識するようになっている。そして、認識された画像情報に基づいて、各実装部材移送機構３１Ａ、３１Ｂの吸着ヘッドをθ方向に回転させたり、各可動レール３５Ａ、３５ＢによってＸ、Ｙ方向の位置を調整したりして、各実装部材をスライダー３４に載置するようになっている。   The reversing table 32 is configured to be rotatable around the axis P in the Y direction within a range of 180 degrees. It should be noted that a camera 91 as a recognition means is provided below the way the mounting member is transferred from the first and second mounting member transfer mechanisms 31A, 31B to the slider 34, and the lower ends of both the mounting member transfer mechanisms 31A, 31B. The suction holding posture of each mounting member held by suction is recognized. Based on the recognized image information, the suction heads of the mounting member transfer mechanisms 31A and 31B are rotated in the θ direction, or the positions in the X and Y directions are adjusted by the movable rails 35A and 35B. Each mounting member is placed on the slider 34.

図２に示すように、上述した保持テーブル３３に並んで実装部材洗浄ブロック３８が配設されている。チップ洗浄ブロック３８は、その上面の中央部に窒素ガスあるいは清浄空気などの気体を噴出する気体噴出孔３８Ａが設けられている。この気体噴出孔は図示しないガス供給源に接続されている。気体噴出孔の両隣に気体噴出孔から噴出された気体を吸引排気する一対の排気孔３８Ｂが設けられている。この排気孔３８Ｂは図示しない減圧ポンプに接続されている。   As shown in FIG. 2, the mounting member cleaning block 38 is arranged alongside the holding table 33 described above. The chip cleaning block 38 is provided with a gas ejection hole 38A for ejecting a gas such as nitrogen gas or clean air at the center of the upper surface thereof. This gas ejection hole is connected to a gas supply source (not shown). A pair of exhaust holes 38B for sucking and exhausting the gas ejected from the gas ejection holes are provided on both sides of the gas ejection holes. The exhaust hole 38B is connected to a decompression pump (not shown).

保持テーブル３３および実装部材洗浄ブロック３８は、スライドテーブル３９上に並べて配設されている。このスライドテーブル３９は、反転テーブル３２の回動軸心Ｐに沿って往復移動可能に構成されている。このスライドテーブル３９の移動によって、各実装部材をフェイスダウン状態に保持している反転テーブル３２の下方位置に、保持テーブル３３および実装部材洗浄ブロック３８を択一的に進入させるようになっている。   The holding table 33 and the mounting member cleaning block 38 are arranged side by side on the slide table 39. The slide table 39 is configured to reciprocate along the rotation axis P of the reversing table 32. By the movement of the slide table 39, the holding table 33 and the mounting member cleaning block 38 are selectively entered under the reversing table 32 that holds each mounting member in a face-down state.

スライダー３４は、Ｙ方向に配設された固定レール３５Ｃに沿って往復移動可能に構成されている。スライダー３４は、待機位置（図２の状態）にあるときに、第１または第２実装部材移送機構３１Ａ、３１Ｂから順に、例えば、チップ２をフェイスダウン状態で載置され、そのチップ２を仮圧着ユニット５０に供給する。また、その後にＦＰＣ４を同様に処理する。   The slider 34 is configured to be able to reciprocate along a fixed rail 35C disposed in the Y direction. When the slider 34 is in the standby position (the state shown in FIG. 2), for example, the chip 2 is placed face down in order from the first or second mounting member transfer mechanism 31A, 31B. Supply to the crimping unit 50. Thereafter, the FPC 4 is similarly processed.

図１に戻って、導電材料供給ユニット４０は、基板供給ユニット２０から搬送されてきた基板１を水平姿勢で保持する可動テーブル４１と、図２および図４に示す基板１にチップ２を実装する部位であるボンディング部位１ａと、ＦＰＣ４を実装する部位であるボンディング部位１ｂとに異方導電性フィルム（ＡＣＦ：Anisotropic Conductive Film ）から導電材料を各部位に転写する、フィルム幅の異なる２つのヘッド４２Ａ、４２Ｂを備えている。可動テーブル４１は、基板１を吸着保持する基板保持ステージ４３を備え、この基板保持ステージ４３が水平２軸（Ｘ，Ｙ）方向、上下（Ｚ）方向、およびθ方向に移動自在に構成されている。基板１の一端側である各ボンディング部位１ａ、１ｂは基板保持ステージ４３から前方に延び出ている。   Returning to FIG. 1, the conductive material supply unit 40 mounts the chip 2 on the movable table 41 that holds the substrate 1 conveyed from the substrate supply unit 20 in a horizontal posture and the substrate 1 shown in FIGS. 2 and 4. Two heads 42A having different film widths for transferring a conductive material from an anisotropic conductive film (ACF) to each part to a bonding part 1a as a part and a bonding part 1b as a part where the FPC 4 is mounted. , 42B. The movable table 41 includes a substrate holding stage 43 that holds the substrate 1 by suction. The substrate holding stage 43 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and θ. Yes. Each bonding part 1 a, 1 b which is one end side of the substrate 1 extends forward from the substrate holding stage 43.

なお、この異方性導電フィルムは、接着・導電・絶縁という３つの機能を同時にもつ接続材料で、熱圧着することにより、膜の厚み方向には導通性、面方向には絶縁性という電気的異方性をもつ高分子膜であり、接着性のあるバインダー内に導電粒子が混在している。   This anisotropic conductive film is a connecting material that has the three functions of adhesion, conduction and insulation at the same time. By thermocompression bonding, it is electrically conductive in the thickness direction of the film and insulative in the surface direction. It is a polymer film having anisotropy, and conductive particles are mixed in an adhesive binder.

仮圧着ユニット５０は、導電材料供給ユニット４０から搬送されてきた基板１を水平姿勢で保持する可動テーブル５１と、導電材料が転写された基板１の各ボンディング部位１ａ、１ｂ にチップ２およびＦＰＣ４を仮圧着する仮圧着ヘッド５２と、仮圧着時に基板１とチップ２およびＦＰＣ４との位置合わせを行なう上下２方向の認識視野をもつ２視野の認識手段（例えば、２視野カメラ）５３とを備えている。なお、可動テーブル５１は、本発明の第１保持テーブルに相当し、仮圧着ヘッド５２は、本発明の第１駆動手段に相当する。   The temporary crimping unit 50 includes a movable table 51 that holds the substrate 1 conveyed from the conductive material supply unit 40 in a horizontal position, and the chip 2 and the FPC 4 on each bonding site 1a, 1b of the substrate 1 to which the conductive material is transferred. A provisional crimping head 52 for provisional crimping, and a two-field recognition means (for example, a two-field camera) 53 having a recognition field in two vertical directions for aligning the substrate 1 with the chip 2 and the FPC 4 during provisional crimping are provided. Yes. The movable table 51 corresponds to the first holding table of the present invention, and the temporary crimping head 52 corresponds to the first driving means of the present invention.

また、仮圧着ヘッド５２の下方にバックアップ５５が固定設置されている。可動テーブル５１は、基板１を吸着保持する基板保持ステージ５４を備え、この基板保持ステージ５４が水平２軸（Ｘ，Ｙ）方向、上下（Ｚ）方向、およびＺ軸周り（θ）方向に、それぞれ移動自在に構成されている。なお、基板保持ステージ５４は、本発明の第１駆動手段に相当する。   In addition, a backup 55 is fixedly installed below the temporary pressure bonding head 52. The movable table 51 includes a substrate holding stage 54 that holds the substrate 1 by suction, and the substrate holding stage 54 is arranged in two horizontal axes (X, Y), up and down (Z), and around the Z axis (θ). Each is configured to be freely movable. The substrate holding stage 54 corresponds to the first driving means of the present invention.

仮圧着ヘッド５２は昇降自在であって、その下端には、チップ２とＦＰＣ４を吸着保持する第１保持部材５６Ａと、第２保持部材５６Ｂとを備えている。図５に示すように、第１保持部材５６Ａは、チップ２の電極側とは反対面の全面を覆うように当接し、その中央を吸着する横長の吸着孔５７Ａが形成されている。また、第２保持部材５６Ｂは、ＦＰＣ４の電極側とは反対面の全面を覆うように当接し、面積の広い領域の中央部分および複数の角部の近傍に吸着孔５７Ｂが形成されている。これら第１保持部材５６Ａおよび第２保持部材５６Ｂの各吸着孔５７Ａ、５７Ｂは、図６に示すように、吸気管５８を介して減圧ポンプ５９と連通接続されている。また、仮圧着ヘッド５２には、加熱手段であるヒータが内蔵されている。なお、第１保持部材５６Ａは、本発明の第１保持手段に相当し、第２保持部材５６Ｂは第２保持手段に相当する。   The temporary press-bonding head 52 can be moved up and down, and includes a first holding member 56A and a second holding member 56B that hold the chip 2 and the FPC 4 by suction. As shown in FIG. 5, the first holding member 56 </ b> A abuts so as to cover the entire surface opposite to the electrode side of the chip 2, and has a horizontally long suction hole 57 </ b> A that sucks the center. Further, the second holding member 56B abuts so as to cover the entire surface opposite to the electrode side of the FPC 4, and suction holes 57B are formed in the vicinity of a central portion and a plurality of corner portions of a wide area. The suction holes 57A and 57B of the first holding member 56A and the second holding member 56B are connected to a decompression pump 59 through an intake pipe 58 as shown in FIG. Further, the temporary press-bonding head 52 has a built-in heater as a heating means. The first holding member 56A corresponds to the first holding means of the present invention, and the second holding member 56B corresponds to the second holding means.

また、各保持部材５６Ａ、５６Ｂの先端に向かって分岐している吸気管５８の途中には、電磁弁Ｅ１、Ｅ２が設けられており、各電磁弁Ｅ１、Ｅ２の開閉動作に応じて第１保持部材５６Ａまたは第２保持部材５６Ｂの吸着保持を切換作動できるようになっている。なお、この切換動作は、予め決められて処理プログラムに基づいて制御部９０によって行なわれる。例えば、第１保持部材５６Ａと第２保持部材５６Ｂを交互に作動させたり、いずれかの吸着エラーが発生した場合には、エラー補正するようにエラー発生側の実装部材を吸着保持させるように連続作動させたりする。なお、制御部９０は、本発明のタイミング制御手段に相当する。   In addition, electromagnetic valves E1 and E2 are provided in the middle of the intake pipe 58 branched toward the tips of the holding members 56A and 56B. The first and second operations are performed according to the opening / closing operation of the electromagnetic valves E1 and E2. The suction holding of the holding member 56A or the second holding member 56B can be switched. This switching operation is performed by the control unit 90 based on a predetermined processing program. For example, when the first holding member 56A and the second holding member 56B are operated alternately, or any suction error occurs, the mounting member on the error occurrence side is continuously sucked and held so as to correct the error. To make it work. The control unit 90 corresponds to the timing control means of the present invention.

具体的な動作は、実装部材供給ユニット３０のスライダー３４で移送されてきたフェイスダウン状態のチップ２またはＦＰＣ４を第１または第２保持部材５６Ａ、５６Ｂに吸着保持し、各実装部材を所定温度で加熱し、導電材料の重合反応をさせながら所定圧力で基板１の各ボンディング部位１ａ、１ｂのいずれかに押し付ける。このとき、重合反応が開始してから反応終了するまでの未硬化状態で加熱および押し付けを終了する。これにより接着剤が半硬化状態になってチップ２およびＦＰＣ４が基板１に仮圧着される。なお、仮圧着ヘッド５２の保持構造は吸着式に限らず、静電気を使った静電吸着、磁石を使った磁気吸着など、任意の保持構造を用いることもできる。   Specifically, the chip 2 or the FPC 4 in the face-down state transferred by the slider 34 of the mounting member supply unit 30 is sucked and held by the first or second holding members 56A and 56B, and each mounting member is held at a predetermined temperature. It heats and it presses against each bonding site | part 1a, 1b of the board | substrate 1 with predetermined pressure, making the polymerization reaction of an electrically-conductive material. At this time, heating and pressing are finished in an uncured state from the start of the polymerization reaction to the end of the reaction. Thereby, the adhesive is in a semi-cured state, and the chip 2 and the FPC 4 are temporarily bonded to the substrate 1. The holding structure of the temporary press-bonding head 52 is not limited to an adsorption type, and any holding structure such as electrostatic adsorption using static electricity or magnetic adsorption using magnets can be used.

図１に戻り、２視野の認識手段５３は、水平２軸（Ｘ，Ｙ）方向および上下（Ｚ）方向に移動可能であって、仮圧着ヘッド５２に吸着保持されたチップ２およびＦＰＣ４の認識マークと、可動テーブル５１上に移送された基板１の認識マークとをそれぞれ認識して、両認識マークの位置ズレを検出する。この位置ズレを無くすように仮圧着時に可動テーブル５１がＸ、Ｙ、およびθ方向に駆動制御される。   Returning to FIG. 1, the two-field recognition means 53 is movable in two horizontal (X, Y) directions and up and down (Z) directions, and recognizes the chip 2 and the FPC 4 that are sucked and held by the temporary pressure bonding head 52. The mark and the recognition mark of the substrate 1 transferred onto the movable table 51 are respectively recognized, and the positional deviation between the both recognition marks is detected. The movable table 51 is driven and controlled in the X, Y, and θ directions at the time of temporary pressure bonding so as to eliminate this positional deviation.

本圧着ユニット６０は２ブロック６０Ａ、６０Ｂからなり、各ブロック６０Ａ、６０Ｂは、仮圧着ユニット５０から搬送されてきた基板１を水平姿勢で保持する可動テーブル６１Ａ、６１Ｂと、基板１の各ボンディング部位１ａ、１ｂに仮圧着されたチップ２およびＦＰＣ４のそれぞれを加圧および加熱し、導電材料の重合反応を完了させて硬化させ、各ボンディング部位１ａ、１ｂに各実装部材を本圧着する２本１組からなる本圧着ヘッド６２Ａ、６２Ｂとを備えている。各本圧着ヘッド６２Ａ、６２Ｂのそれぞれの下方にバックアップ６３Ａ、６３Ｂが固定設置されている。また、可動テーブル６１Ａ、６１Ｂは、導電材料供給ユニット４０の可動テーブル４１と同様の基板保持ステージ６４Ａ、６４Ｂを備えている。さらに、各本圧着ユニット６０Ａ、６０Ｂは、本圧着ヘッド６２Ａでチップ２を、ヘッド６２ＢでＦＰＣ４を加圧するときに、基板１に付着された導電材料に含まれる接着剤が各本圧着ヘッド６２Ａ、６２Ｂに付着するのを防止するために、フッソ樹脂製の保護テープＴを供給する機構をそれぞれのブロック６０Ａ、６０Ｂに備えている。保護テープＴは、本圧着ユニット６０の本体フレームに取り付けられた供給ローラ６５Ａ、６５Ｂから繰り出されて、巻き取りローラ６６Ａ、６６Ｂに巻き取られる。なお、本実施例では、ブロック６０Ａでチップ２を本圧着し、その後に基板１をブロック６０Ｂに搬送し、ＦＰＣ４の本圧着を行なう。   The main crimping unit 60 includes two blocks 60A and 60B. Each of the blocks 60A and 60B includes movable tables 61A and 61B that hold the substrate 1 conveyed from the temporary crimping unit 50 in a horizontal posture, and each bonding portion of the substrate 1. Each of the chip 2 and the FPC 4 temporarily press-bonded to 1a and 1b is pressurized and heated to complete and harden the polymerization reaction of the conductive material, and each mounting member is finally press-bonded to each bonding site 1a and 1b. A pair of main pressure bonding heads 62A and 62B is provided. Backups 63A and 63B are fixedly installed below the main pressure bonding heads 62A and 62B, respectively. The movable tables 61A and 61B include substrate holding stages 64A and 64B similar to the movable table 41 of the conductive material supply unit 40. Furthermore, each press-bonding unit 60A, 60B has an adhesive contained in the conductive material attached to the substrate 1 when the chip 2 is pressed by the main press-bonding head 62A and the FPC 4 is pressed by the head 62B. In order to prevent adhering to 62B, each block 60A, 60B is equipped with the mechanism which supplies the protective tape T made from a fluororesin. The protective tape T is unwound from supply rollers 65A and 65B attached to the main body frame of the main pressure bonding unit 60, and is wound around the winding rollers 66A and 66B. In this embodiment, the chip 2 is finally pressure-bonded in the block 60A, and then the substrate 1 is transported to the block 60B, and the FPC 4 is pressure-bonded.

基板収納ユニット７０は、各実装部材の実装された複数枚の基板１を一定間隔で多段に収納する基板収納マガジン７１と、この基板収納マガジン７１に基板１を順に収納する昇降および水平移動可能な昇降テーブル７２とを備えている。この基板収納マガジン７１に代えて、基板供給ユニット２０で説明したと同様に、トレイ構造の収納構造を備えてもよい。また、基板供給ユニット２０と基板収納ユニット７０とは必ずしも個別である必要はなく、これらを単一のユニットにして、チップ２が実装された基板１を元の基板供給ユニットに戻すようにしてもよい。   The substrate storage unit 70 is capable of moving up and down and horizontally moving the substrate storage magazine 71 that stores a plurality of substrates 1 mounted with each mounting member in multiple stages at regular intervals, and that sequentially stores the substrates 1 in the substrate storage magazine 71. Elevating table 72 is provided. Instead of the substrate storage magazine 71, a tray structure storage structure may be provided as described in the substrate supply unit 20. Further, the substrate supply unit 20 and the substrate storage unit 70 do not necessarily have to be separate, and they may be made a single unit so that the substrate 1 on which the chip 2 is mounted is returned to the original substrate supply unit. Good.

基板搬送機構８０Ａ〜８０Ｄは、装置基台１０の長手方向に配設されたレール８１と、このレール８１に沿って走行する支柱８２と、この支柱８２に昇降自在に取り付けられて基板１を吸着保持する基板保持具８３とを備えている。   The substrate transport mechanisms 80A to 80D are attached to the rail 81 arranged in the longitudinal direction of the apparatus base 10, the support 82 that runs along the rail 81, and the support 82 that can be moved up and down to adsorb the substrate 1. And a substrate holder 83 to be held.

次に上述した構成を備えたボンディングシステムの動作を説明する。図１から図６を参照しながら説明する。   Next, the operation of the bonding system having the above-described configuration will be described. This will be described with reference to FIGS.

基板搬送機構８０Ａは、基板供給ユニット２０から処理対象の基板１を取り出して、この基板１を導電材料供給ユニット４０に搬送する。この基板１は可動テーブル４１の基板保持ステージ４３上に移載されて吸着保持される。基板保持ステージ４３が前方（Ｙ方向）に移動して、基板１のボンディング部位をバックアップ４４上に載せる。   The substrate transport mechanism 80A takes out the substrate 1 to be processed from the substrate supply unit 20 and transports the substrate 1 to the conductive material supply unit 40. The substrate 1 is transferred onto the substrate holding stage 43 of the movable table 41 and held by suction. The substrate holding stage 43 moves forward (Y direction), and the bonding portion of the substrate 1 is placed on the backup 44.

基板１のチップ２を実装するボンディング部位１ａがバックアップ４４によって水平に支持された状態で、ヘッド４２Ａが下降しボンディング部位１ａ上にチップ２の電極幅に応じた導電材料が転写される。その後、基板１を図中の左水平方向に移動させてＦＰＣ４を実装するボンディング部位１ｂに位置合わせを行ない、ヘッド４２Ｂを降下させてＦＰＣ４の電極幅に応じた導電材料をボンディング部位１ｂに転写する。各ボンディング部位１ａ、１ｂへの導電材料の転写が終わると、基板保持ステージ４３が基板１の受け渡し位置に水平移動する。受け渡し位置に戻された基板１は基板搬送機構８０Ｂによって、仮圧着ユニット５０に搬送される。   In a state where the bonding part 1a for mounting the chip 2 on the substrate 1 is horizontally supported by the backup 44, the head 42A is lowered, and a conductive material corresponding to the electrode width of the chip 2 is transferred onto the bonding part 1a. Thereafter, the substrate 1 is moved in the left horizontal direction in the drawing to align with the bonding part 1b where the FPC 4 is mounted, and the head 42B is lowered to transfer the conductive material corresponding to the electrode width of the FPC 4 to the bonding part 1b. . When the transfer of the conductive material to each bonding site 1a, 1b is completed, the substrate holding stage 43 moves horizontally to the delivery position of the substrate 1. The substrate 1 returned to the delivery position is transported to the temporary pressure bonding unit 50 by the substrate transport mechanism 80B.

仮圧着ユニット５０に搬送された基板１は可動テーブル５１の基板保持ステージ５４上に移載されて吸着保持される。基板保持ステージ５４が前方（Ｙ方向）に移動して、先ず基板１のボンディング部位１ａをバックアップ５５上に位置させる。   The substrate 1 transported to the temporary pressure bonding unit 50 is transferred onto the substrate holding stage 54 of the movable table 51 and held by suction. The substrate holding stage 54 moves forward (Y direction), and the bonding portion 1 a of the substrate 1 is first positioned on the backup 55.

一方、実装部材供給ユニット３０では、可動ベース３６とがＸ、Ｙ方向にそれぞれ移動することにより、第１実装部材移送機構３１Ａがチップトレイ３の所定のチップ２上に移動する。続いて第１実装部材移送機構３１Ａが下降して、チップトレイ３内のチップ２を第１保持部材６Ａで吸着保持する。第１実装部材移送機構３１Ａが上昇してチップ２をチップトレイ３から取り出した後、可動ベース３６とがＸ、Ｙ方向にそれぞれ移動することにより、第１実装部材移送機構３１Ａが反転テーブル３２上に移動する。このとき反転テーブル３２は、チップ載置面が上方を向いた待機姿勢（図２に示す状態）にある。次に第１実装部材移送機構３１Ａが下降し、第１保持部材６Ａで保持していたチップ２を反転テーブル３２上に移す。   On the other hand, in the mounting member supply unit 30, the first mounting member transfer mechanism 31 </ b> A moves onto the predetermined chip 2 of the chip tray 3 by moving the movable base 36 in the X and Y directions. Subsequently, the first mounting member transfer mechanism 31A descends, and the chips 2 in the chip tray 3 are sucked and held by the first holding members 6A. After the first mounting member transfer mechanism 31A is lifted and the chip 2 is taken out from the chip tray 3, the first mounting member transfer mechanism 31A moves on the reversing table 32 by moving the movable base 36 in the X and Y directions. Move to. At this time, the reversing table 32 is in a standby posture (state shown in FIG. 2) with the chip placement surface facing upward. Next, the first mounting member transfer mechanism 31 </ b> A descends, and the chip 2 held by the first holding member 6 </ b> A is transferred onto the reversing table 32.

反転テーブル３２上にチップ２が載置されて吸着保持されると、軸心Ｐ周りに反転し、フェイスアップ状態のチップ２をフェイスダウン状態に姿勢変換する。反転した反転テーブル３２の下に実装部材洗浄ブロック３８が進入する。   When the chip 2 is placed on the reversing table 32 and sucked and held, the chip 2 is reversed around the axis P and the posture of the chip 2 in the face-up state is changed to the face-down state. The mounting member cleaning block 38 enters under the inverted reversing table 32.

チップ２の洗浄が終わると、スライドテーブル３９が移動することにより、実装部材洗浄ブロック３８が反転テーブル３２の下方位置から退出するとともに、保持テーブル３３が反転テーブル３２の下方に進入する。続いて反転テーブル３２から保持テーブル３３へチップ２が受け渡される。反転テーブル３２はフェイスダウン状態で受け渡されたチップ２を吸着保持する。チップ２を受け渡した後、反転テーブル３２は逆方向に反転して待機姿勢に復帰する。   When the cleaning of the chip 2 is completed, the mounting table cleaning block 38 is retracted from the lower position of the reversing table 32 and the holding table 33 is moved below the reversing table 32 by moving the slide table 39. Subsequently, the chip 2 is delivered from the reverse table 32 to the holding table 33. The reversing table 32 sucks and holds the chip 2 delivered in the face-down state. After delivering the chip 2, the reversing table 32 reverses in the reverse direction and returns to the standby posture.

反転テーブル３２が待機姿勢に復帰すると、第１実装部材移送機構３１Ａが保持テーブル３３のチップ２の上方に移動する。   When the reversing table 32 returns to the standby position, the first mounting member transfer mechanism 31A moves above the chip 2 of the holding table 33.

各位置に達した第１実装部材移送機構３１Ａは下降して、保持テーブル３３上のチップ２を吸着部材６Ａで吸着保持する。   The first mounting member transfer mechanism 31A that has reached each position descends and holds the chip 2 on the holding table 33 by suction with the suction member 6A.

保持テーブル３３上のチップ２をフェイスダウン状態で保持した第１実装装置移送機構３１Ａは、そのチップ２を移送してカメラ９１の上に移送する。カメラ９１でチップ２の外形またはアライメントマークを利用して位置を認識する。そして、認識された画像情報に基づいて吸着ヘッドをθ方向に回転したり、可動ベース３６をＸ、Ｙ方向に位置調整したりして、スライダー３４に受け渡す。チップ２をフェイスダウン状態で受け取ったスライダー３４は仮圧着ユニット５０に向けて移動し、そのチップ２を仮圧着ヘッド５２の下方にまで移送する。その間、第２実装部材移送機構３１Ｂは、チップ２と同じ手順でＦＰＣトレイ５からＦＰＣ４を取り出して処理を行なう。   The first mounting device transfer mechanism 31 </ b> A that holds the chip 2 on the holding table 33 in a face-down state transfers the chip 2 and transfers it onto the camera 91. The camera 91 recognizes the position using the outer shape of the chip 2 or the alignment mark. Then, based on the recognized image information, the suction head is rotated in the θ direction, or the position of the movable base 36 is adjusted in the X and Y directions to be transferred to the slider 34. The slider 34 that has received the chip 2 in the face-down state moves toward the temporary pressure bonding unit 50, and transfers the chip 2 to a position below the temporary pressure bonding head 52. Meanwhile, the second mounting member transfer mechanism 31B takes out the FPC 4 from the FPC tray 5 and performs processing in the same procedure as the chip 2.

制御部９０によって電磁弁Ｅ２を閉じた状態で電磁弁Ｅ１を開放させ、スライダー３４で移送されたチップ２を仮圧着ヘッド５２の下端の第１吸着部材５６Ａにより吸着保持させる。続いて、仮圧着ヘッド５２と、基板１のボンディング部位１ａとの間に２視野の認識手段５３が進出してきて、仮圧着ヘッド５２の第１吸着部材５６Ａに吸着保持されたチップ２と基板１との位置ズレを検出するために、それぞれに印字されたアライメントマーク検出する。この位置ズレを無くすように可動テーブル５１がＸ、Ｙおよびθ方向に制御されて、チップ２と基板１との位置合わせが行われる。   The electromagnetic valve E1 is opened while the electromagnetic valve E2 is closed by the control unit 90, and the chip 2 transferred by the slider 34 is sucked and held by the first suction member 56A at the lower end of the temporary pressure bonding head 52. Subsequently, the recognition means 53 having two fields of view advances between the temporary press-bonding head 52 and the bonding part 1 a of the substrate 1, and the chip 2 and the substrate 1 sucked and held by the first suction member 56 </ b> A of the temporary press-bonding head 52. In order to detect misalignment, the alignment mark printed on each is detected. The movable table 51 is controlled in the X, Y, and θ directions so as to eliminate this positional deviation, and the alignment between the chip 2 and the substrate 1 is performed.

位置合わせが終わると、２視野の認識手段５３は元の位置にまで後退する。続いて、仮圧着ヘッド５２が下降して、導電材料が転写された基板１のボンディング部位１ａにチップ２を仮圧着する。   When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary press-bonding head 52 is lowered, and the chip 2 is temporarily press-bonded to the bonding portion 1a of the substrate 1 to which the conductive material is transferred.

チップ２の仮圧着が終わると、制御部９０は電磁弁Ｅ２を開放して電磁弁Ｅ１を閉じ、スライダー３４で移送されてきたＦＰＣ４を仮圧着ヘッド５２の下端の第２吸着部材５６Ｂが吸着保持させる。続いて、仮圧着ヘッド５２と、基板１のボンディング部位１ｂとの間に２視野の認識手段５３が進出してきて、仮圧着ヘッド５２の第２吸着部材５６Ｂに吸着保持されたＦＰＣ４と基板１との位置ズレを検出するために、それぞれに印字されたアライメントマーク検出する。この位置ズレを無くすように可動テーブル５１がＸ、Ｙおよびθ方向に制御されて、ＦＰＣ４と基板１との位置合わせが行われる。   When the provisional pressure bonding of the chip 2 is completed, the control unit 90 opens the electromagnetic valve E2 and closes the electromagnetic valve E1, and the second adsorption member 56B at the lower end of the temporary pressure bonding head 52 adsorbs and holds the FPC 4 transferred by the slider 34. Let Subsequently, the recognition means 53 having two fields of view advances between the temporary press-bonding head 52 and the bonding part 1b of the substrate 1, and the FPC 4 and the substrate 1 that are sucked and held by the second suction member 56 </ b> B of the temporary press-bonding head 52. In order to detect the positional deviation, the alignment marks printed on each are detected. The movable table 51 is controlled in the X, Y, and θ directions so as to eliminate this positional deviation, and the FPC 4 and the substrate 1 are aligned.

位置合わせが終わると、２視野の認識手段５３は元の位置にまで後退する。続いて、仮圧着ヘッド５２が下降して、導電材料が転写された基板１のボンディング部位１ｂにＦＰＣ４を仮圧着する。   When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered to temporarily pressure bond the FPC 4 to the bonding portion 1b of the substrate 1 to which the conductive material is transferred.

両実装部材の仮圧着が終了すると、基板保持ステージ５４が基板１の受け渡し位置に水平移動する。受け渡し位置に移動した基板１は基板搬送機構８０Ｃによって、先ず本圧着ユニット６０Ａに搬送される。   When the temporary pressure bonding of both the mounting members is completed, the substrate holding stage 54 moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is first transported to the main pressure bonding unit 60A by the substrate transport mechanism 80C.

本圧着ユニット６０Ａに搬送された基板１は可動テーブル６１Ａの基板保持ステージ６４Ａ上に移載されて吸着保持される。基板保持ステージ６４Ａが前方（Ｙ方向）に移動して、基板１のボンディング部位１ａをバックアップ６３Ａ上に位置させる。ボンディング部位１ａがバックアップ６３Ａで支持されると、本圧着ヘッド６２Ａが下降して、仮圧着されたチップ２を保護テープＴを介して加熱・加圧する。これによりチップ２のバンプが導電材料を介して基板１の電極に電気的に接続する。   The substrate 1 conveyed to the main pressure bonding unit 60A is transferred onto the substrate holding stage 64A of the movable table 61A and is sucked and held. The substrate holding stage 64A moves forward (Y direction), and the bonding portion 1a of the substrate 1 is positioned on the backup 63A. When the bonding part 1a is supported by the backup 63A, the main pressure bonding head 62A is lowered, and the temporarily pressure-bonded chip 2 is heated and pressurized via the protective tape T. As a result, the bumps of the chip 2 are electrically connected to the electrodes of the substrate 1 through the conductive material.

チップ２の本圧着が終わると、基板保持ステージ６４Ａが基板１の受け渡し位置に水平移動する。受け渡し位置に移動した基板１は基板搬送機構８０Ｃで移送されて本圧着ユニット６０Ｂに搬送される。   When the final pressure bonding of the chip 2 is completed, the substrate holding stage 64A moves horizontally to the transfer position of the substrate 1. The substrate 1 moved to the delivery position is transferred by the substrate transfer mechanism 80C and transferred to the main pressure bonding unit 60B.

本圧着ユニット６０Ｂに搬送された基板１は可動テーブル６１Ｂの基板保持ステージ６４Ｂ上に移載されて吸着保持される。基板保持ステージ６４Ｂが前方（Ｙ方向）に移動して、基板１のボンディング部位１ｂをバックアップ６３Ｂ上に位置させる。ボンディング部位１ｂがバックアップ６３Ｂで支持されると、本圧着ヘッド６２Ｂが下降して、仮圧着されたＦＰＣ４を保護テープＴを介して加熱・加圧する。これによりＦＰＣ４の電極が導電材料を介して基板１の電極に電気的に接続する。   The substrate 1 transported to the main pressure bonding unit 60B is transferred and held on the substrate holding stage 64B of the movable table 61B. The substrate holding stage 64B moves forward (Y direction), and the bonding portion 1b of the substrate 1 is positioned on the backup 63B. When the bonding part 1b is supported by the backup 63B, the main pressure bonding head 62B is lowered, and the temporarily bonded FPC 4 is heated and pressurized via the protective tape T. Thereby, the electrode of the FPC 4 is electrically connected to the electrode of the substrate 1 through the conductive material.

ＦＰＣ４の本圧着が終わると、基板保持ステージ６４Ｂが基板１の受け渡し位置に水平移動する。受け渡し位置に移動した基板１は基板搬送機構８０Ｄで移送されて基板収納ユニット７０の昇降テーブル７２に受け渡され、この昇降テーブル７２によって基板収納トレイ７１に収納される。   When the final press-bonding of the FPC 4 is completed, the substrate holding stage 64B moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is transferred by the substrate transport mechanism 80D and transferred to the lifting table 72 of the substrate storage unit 70, and is stored in the substrate storage tray 71 by the lifting table 72.

以上で一枚の基板１のチップ実装が終了する。なお、ある基板１が仮圧着ユニット５０でチップ２を仮圧着されている間に、導電材料供給ユニット４０では次の基板１へ接着剤が転写されている。このように各ユニットでは基板１への接着剤の転写、チップ２またはＦＰＣ４の仮圧着、チップ２またはＦＰＣ４の本圧着が並行して行われている。また、仮圧着ユニット５０から搬送される基板１は、各１組の本圧着ユニット６０Ａ、６０Ｂのタクトタイムを調整して基板１の処理が滞ることなくスムーズに処理できるよにしている。   Thus, the chip mounting of one substrate 1 is completed. The adhesive is transferred to the next substrate 1 in the conductive material supply unit 40 while a certain substrate 1 is temporarily crimped to the chip 2 by the temporary crimping unit 50. As described above, in each unit, the transfer of the adhesive to the substrate 1, the temporary pressure bonding of the chip 2 or the FPC 4, and the main pressure bonding of the chip 2 or the FPC 4 are performed in parallel. In addition, the substrate 1 transported from the temporary crimping unit 50 can be processed smoothly without delaying the processing of the substrate 1 by adjusting the tact time of each pair of the final crimping units 60A and 60B.

上述の本実施例に係るボンディング装置を備えたボンディングシステムは、ＬＳＩのようなチップ２と、取り扱い時に撓むようなＦＰＣ４を単一のボンディング装置でワークである基板１の所定の実装部位に実装することができる。また、この実施例のボンディング装置は、電極のピッチの狭いＬＳＩを高精度で実装が可能であるので、ピッチの狭いＦＰＣ４に対しても、高精度な実装が実現できる。さらに、この実施例のボンディングシステムは、チップ２とＦＰＣ４の各トレイから１台機構を利用して取り出して仮圧着ユニット５０に搬送することができるので、搬送過程での基板１への塵埃の付着を抑制することができる。つまり、処理効率を一層向上させることもできる。   The bonding system including the bonding apparatus according to the above-described embodiment mounts the chip 2 such as an LSI and the FPC 4 that bends during handling on a predetermined mounting portion of the substrate 1 as a workpiece with a single bonding apparatus. be able to. In addition, since the bonding apparatus according to this embodiment can mount an LSI with a narrow electrode pitch with high accuracy, it can realize high-accuracy mounting even for an FPC 4 with a narrow pitch. Furthermore, since the bonding system of this embodiment can be taken out from each tray of the chip 2 and the FPC 4 using a single mechanism and transported to the temporary press-bonding unit 50, dust adheres to the substrate 1 during the transporting process. Can be suppressed. That is, the processing efficiency can be further improved.

本実施例では、仮圧着ヘッド５２の構成のみが上記実施例１と異なるので、他の同じ構成部分には同一符号を付すに留め、異なる部分について具体的に説明する。   In the present embodiment, only the configuration of the provisional pressure bonding head 52 is different from that of the first embodiment. Therefore, the same reference numerals are given to other same components, and different portions will be specifically described.

仮圧着ヘッド５２は、その下端に第１保持部材５６Ｃと、第２保持部材５６Ｄとを備えている。第１保持部材５６Ｃは、仮圧着ヘッド５を昇降させる軸芯に、その中央が位置するように仮圧着ヘッド５２に取り付けられている。また、図７に示すように、第１保持部材５６Ｃは、チップ２よりも大きく、かつ、ＦＰＣ４を基板１に実装するボンディング部位１ｂの全面を少なくとも覆う程度の大きさを有する横長矩形状をしている。また、第１保持部材５６Ｃの下面には、実装部材を吸着する複数個の吸着孔５７Ｃ、５７Ｄが形成されている。   The temporary press-bonding head 52 includes a first holding member 56C and a second holding member 56D at the lower end thereof. 56 C of 1st holding members are attached to the temporary crimping head 52 so that the center may be located in the axial center which raises / lowers the temporary crimping head 5. Further, as shown in FIG. 7, the first holding member 56 </ b> C has a horizontally long rectangular shape that is larger than the chip 2 and has a size that covers at least the entire surface of the bonding portion 1 b that mounts the FPC 4 on the substrate 1. ing. A plurality of suction holes 57C and 57D for sucking the mounting member are formed on the lower surface of the first holding member 56C.

吸着孔５７Ｃは、チップ２の長手方向の中央を吸着する位置に形成されている。また吸着孔５７Ｄは、ＦＰＣ４の長手方向の両端側または／および中央を吸着する位置に形成されている。   The suction hole 57 </ b> C is formed at a position that sucks the center in the longitudinal direction of the chip 2. Further, the suction holes 57D are formed at positions for sucking both ends or / and the center of the FPC 4 in the longitudinal direction.

第２保持部材５６Ｄは、第１保持部材５６ＣによってＦＰＣ４を吸着保持した場合に、第１保持部材５６Ｃによって保持しきれない第１保持部材５６Ｃからはみ出た部分を吸着保持するように同じ仮圧着ヘッド５２に近接配置されている。その形状は、第１保持部材５６Ｃからはみ出た部分の全面を覆う形状をしている。また、第２保持部材５６Ｄの下面には複数個の吸着孔５７Ｅが形成されている。これら吸着孔５７Ｅは、ＦＰＣ４の角部の近傍を吸着する位置にある。   When the FPC 4 is sucked and held by the first holding member 56C, the second holding member 56D has the same temporary pressure-bonding head so as to suck and hold the portion protruding from the first holding member 56C that cannot be held by the first holding member 56C. 52. The shape covers the entire surface of the portion protruding from the first holding member 56C. A plurality of suction holes 57E are formed on the lower surface of the second holding member 56D. These suction holes 57E are at positions for sucking the vicinity of the corners of the FPC 4.

第１および第２保持部材５６Ｃ、５６Ｄは、図６に示すように、吸気管５８を介して減圧ポンプ５９と連通接続されている。この吸気管５８は、減圧ポンプ５９側の上流で、図示しないが３方向に分岐され、各吸気管に電磁弁を備えている。具体的には、第１保持部材５６Ｃに２本の吸気管が連通接続され、第２保持部材５６Ｄに１本の吸気管が連通接続されている。   As shown in FIG. 6, the first and second holding members 56 </ b> C and 56 </ b> D are connected to a decompression pump 59 through an intake pipe 58. The intake pipe 58 is branched in three directions (not shown) upstream of the decompression pump 59 side, and each intake pipe is provided with an electromagnetic valve. Specifically, two intake pipes are connected in communication with the first holding member 56C, and one intake pipe is connected in communication with the second holding member 56D.

第１保持部材５６Ｃに連通接続された２本の吸気管のうち１本が、吸着孔５７Ｃと連通され、他方の吸気管は吸着孔５７Ｄと連通している。   One of the two intake pipes connected to the first holding member 56C is in communication with the suction hole 57C, and the other intake pipe is in communication with the suction hole 57D.

制御部９０は、実装部材に応じて各吸着孔５６Ｃ〜５６Ｅの吸着を作動させるように３ポート弁の開閉動作を制御する。例えば、チップ２を実装する場合は、吸着孔５７Ｃを作動させるように１個の電磁弁を開放する。ＦＰＣ４を実装する場合は、吸着孔５６Ｄ、５６Ｅを作動させるように２個の電磁弁を開放する。   The controller 90 controls the opening / closing operation of the three-port valve so as to operate the suction of the suction holes 56C to 56E according to the mounting member. For example, when the chip 2 is mounted, one electromagnetic valve is opened so as to operate the suction hole 57C. When the FPC 4 is mounted, the two solenoid valves are opened so as to operate the suction holes 56D and 56E.

上述の本実施例に係るボンディング装置によれば、吸着孔５７Ｃおよび５７Ｄの作動を切り換えることによって、チップ２およびＦＰＣ４の両方のボンディング部位を第１保持部材５６Ｃで吸着保持することができる。特に、第１保持部材５６Ｃの中心は、仮圧着ヘッド５２を昇降軸芯と一致しているので、実装時の加圧力を効率的に加えることができる。また、ＦＰＣ４を実装する場合は、第１保持部材５６Ｃからはみ出る部分は、第２保持部材５６Ｄによって、その全面を吸着保持することができるので、ＦＰＣ４を撓ました状態で取り扱うことがない。つまり、本実施例のボンディング装置は、異なる実装部材であるチップ２とＦＰＣ４を高精度に実装することができる。   According to the above-described bonding apparatus according to the present embodiment, by switching the operation of the suction holes 57C and 57D, both the bonding parts of the chip 2 and the FPC 4 can be sucked and held by the first holding member 56C. In particular, since the center of the first holding member 56C coincides with the temporary crimping head 52 with the lifting / lowering shaft core, it is possible to efficiently apply a pressing force during mounting. When the FPC 4 is mounted, the portion protruding from the first holding member 56C can be sucked and held by the second holding member 56D, so that the FPC 4 is not handled in a bent state. That is, the bonding apparatus of the present embodiment can mount the chip 2 and the FPC 4 which are different mounting members with high accuracy.

なお、本発明は上述した実施例に限らず、次のように変形実施することができる。   The present invention is not limited to the above-described embodiment, and can be modified as follows.

（１）上記実施例１において、仮圧着ユニット５０の第１保持部材５６Ａ、５６Ｂのいずれかが実装部材を吸着保持したときに、保持した側の保持部材が降下、または、保持していない側の保持部材が上昇するように構成してもよい。例えば、図８に示すよう、仮圧着ヘッド５２の昇降軸芯に平行に配備されたパルスモータＭに連結されたボール軸Ｂに可動台１００を介して第２保持部材５６Ｂを取り付ける。このように構成すれば、パルスモータＭの正逆転により第２保持部材５８Ｂを昇降させることができる。したがって、この構成によれば、チップ２を実装するときに、チップ２の近隣に在る部材と、第２保持部材５６Ｂとが接触したりして、他の部材に損傷与えないようにすることができる。   (1) In the first embodiment, when one of the first holding members 56A and 56B of the temporary pressure bonding unit 50 holds the mounting member by suction, the holding member on the holding side descends or does not hold it. You may comprise so that this holding member may raise. For example, as shown in FIG. 8, the second holding member 56 </ b> B is attached to the ball shaft B connected to the pulse motor M arranged in parallel with the lifting axis of the temporary crimping head 52 via the movable table 100. If comprised in this way, the 2nd holding member 58B can be raised / lowered by forward / reverse rotation of the pulse motor M. Therefore, according to this configuration, when the chip 2 is mounted, the member in the vicinity of the chip 2 and the second holding member 56B are in contact with each other so that other members are not damaged. Can do.

実施例２のボンディング装置の場合、チップ２を保持した場合に、第１保持部材５６Ｃを降下させるか、第２保持部材５６Ｄを上昇させるように構成すればよい。   In the case of the bonding apparatus according to the second embodiment, when the chip 2 is held, the first holding member 56C may be lowered or the second holding member 56D may be raised.

また、実施例１のボンディング装置を利用してチップ２とＦＰＣ４を各保持部材５６Ａ、５６Ｂで同時に吸着保持して基板１に同時に実装する場合、仮圧着ヘッド５２の降下する距離を一定で、基板１にチップ２およびＦＰＣ４が実装される高さに同時に到達するよう、第１保持部材５６Ｃおよび第２保持部材５６Ｄの高さ方向の相対距離を調整すればよい。   Further, when the chip 2 and the FPC 4 are simultaneously sucked and held by the holding members 56A and 56B using the bonding apparatus of the first embodiment and are simultaneously mounted on the substrate 1, the distance by which the temporary press-fitting head 52 descends is constant, The relative distance in the height direction of the first holding member 56C and the second holding member 56D may be adjusted so that the height at which the chip 2 and the FPC 4 are mounted on 1 is reached at the same time.

また、実施例２のボンディング装置の場合、第１保持部材５６Ｃの中心と軸心が一致しなくてもよい。ワーク形状により、第１保持部材５６Ｃの形状が変わり、結果として、軸心と第１保持部材５６Ｃの下面形状の中心が合わなくてもよい。   In the case of the bonding apparatus according to the second embodiment, the center of the first holding member 56C and the axis need not coincide with each other. The shape of the first holding member 56C changes depending on the work shape, and as a result, the center of the shaft center and the lower surface shape of the first holding member 56C may not match.

（２）チップ２の洗浄効果を高めるために、上記実施例のようにエアーに超音波を付与するのが好ましいが、必ずしも超音波を付与しなくてもよい。   (2) In order to enhance the cleaning effect of the chip 2, it is preferable to apply ultrasonic waves to the air as in the above embodiment, but it is not always necessary to apply ultrasonic waves.

（３）上記実施例では、第１および第２のチップ移送機構３１Ａ、３１Ｂが一体になって移動するように構成したが、各チップ移送機構が個別に移動するように構成してもよい。   (3) In the above embodiment, the first and second chip transfer mechanisms 31A and 31B are configured to move together, but each chip transfer mechanism may be configured to move individually.

（４）上記実施例では処理効率を上げるために圧着ユニットを仮圧着ユニット５０と本圧着ユニット６０との２つのユニットに分割したが、チップ２の位置合わせと電気的接続とを一つの圧着ユニットで行なうようにしてもよい。   (4) In the above embodiment, the crimping unit is divided into two units, the temporary crimping unit 50 and the main crimping unit 60, in order to increase the processing efficiency. However, the positioning and electrical connection of the chip 2 are combined into one crimping unit. You may make it carry out.

（５）本発明において各ユニットおよび基板搬送機構の配置や構成は上記実施例のものに限定されず、種々変更実施可能である。例えば、複数個の基板保持具を備えた基板搬送機構をＺ軸周りに回転可能に構成し、この基板搬送機構の周りに、基板供給ユニット、実装部材供給ユニット、接着剤付着ユニット、仮圧着ユニット、本圧着ユニット、および基板収納ユニットを順に配置する、例えば、ロータリー式であってもよい。   (5) In the present invention, the arrangement and configuration of each unit and substrate transport mechanism are not limited to those of the above-described embodiments, and various modifications can be made. For example, a substrate transport mechanism having a plurality of substrate holders is configured to be rotatable around the Z axis, and a substrate supply unit, a mounting member supply unit, an adhesive adhesion unit, a temporary pressure bonding unit are provided around the substrate transport mechanism. For example, a rotary type may be used in which the main pressure bonding unit and the substrate storage unit are arranged in this order.

（６）本発明に係るチップ実装装置は、チップ搭載のための単なるマウント装置や、加熱加圧プロセスを有したボンディング装置など、種々の形態のものを含む。   (6) The chip mounting apparatus according to the present invention includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.

（７）実施例では、チップ２をフェイスアップ状態でチップトレイに収納したが、本発明はこれに限らず、ウエハをダイシングした状態で、かつフェイスアップで供給してもよい。   (7) In the embodiment, the chip 2 is stored in the chip tray in a face-up state. However, the present invention is not limited to this, and the wafer may be diced and supplied in a face-up state.

（８）各実施例において、実装部材供給ユニット３０の第１実装部材移送機構３１Ａおよび第２実装部材移送機構３１Ｂのそれぞれの吸着部材を、仮圧着ヘッドに備わった第１保持部材５６Ａおよび第２保持部材５６Ｂのように実装部材に応じて形状のものを個別に利用するようにしてもよい。   (8) In each embodiment, the first holding member 56A and the second holding member 56A provided in the temporary pressure-bonding head are used as the first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B of the mounting member supply unit 30, respectively. You may make it utilize the thing of a shape according to a mounting member like the holding member 56B separately.

（９）実施例において、チップ２およびＦＰＣ４の電極が予め下向きのフェイスダウンの状態でそれぞれのトレイ３、５にセットされている場合は、反転機構が設けられていない構成にしてもよい。   (9) In the embodiment, when the electrodes of the chip 2 and the FPC 4 are set in advance on the respective trays 3 and 5 in a face-down state facing downward, the reversing mechanism may not be provided.

（１０）実施例において、実装部材供給ユニットに洗浄ブロック３８を設けない構成であってもよい。   (10) In the embodiment, the mounting member supply unit may not be provided with the cleaning block 38.

（１１）実施例において、本圧着ユニット６０の一方のブロック６０Ａに備わった本圧着ヘッド６２ＡでＦＰＣ４を本圧着し、他方のブロック６０Ｂに備わった本圧着ヘッド６２Ｂでチップ２を本圧着するようにしてもよい。また、ブロック６０Ａ、６０Ｂごとに、チップ２とＦＰＣ４を同時に本圧着してもよいし、ブロック６０Ａ、６０Ｂごとにチップ２とＦＰＣ４を順番に本圧着するようにしてもよい。   (11) In the embodiment, the FPC 4 is finally pressure-bonded by the main pressure-bonding head 62A provided in one block 60A of the main pressure-bonding unit 60, and the chip 2 is finally pressure-bonded by the main pressure-bonding head 62B provided in the other block 60B. May be. Further, the chip 2 and the FPC 4 may be finally pressure-bonded simultaneously for each of the blocks 60A and 60B, or the chip 2 and the FPC 4 may be finally pressure-bonded in order for each of the blocks 60A and 60B.

（１２）実施例２では、ＦＰＣ４を実装する場合に吸着孔５６Ｄ、５６Ｅを作動させるように２個の電磁弁を開放していたが、いずれか一方の電磁弁を作動させるようにしてもよい。   (12) In the second embodiment, when the FPC 4 is mounted, the two solenoid valves are opened so that the suction holes 56D and 56E are actuated. However, either one of the solenoid valves may be actuated. .

（１３）実施例１では、第1実装部材移送機構３１Ａに備わった吸着ヘッド６Ａおよび第2実装部材移送機構３１Ｂに備わった吸着ヘッド６Ｂは、それぞれがチップ２およびＦＰＣ４の全面を覆う形状であったが、次のような形状であってもよい。例えば、吸着ヘッド６Ａは、チップ２の中央部分を吸着保持できる形状、吸着ヘッド６Ｂは、ＦＰＣ４の角部を含むその周り、または、角部と中央部分を覆うような形状であってもよい。   (13) In the first embodiment, the suction head 6A provided in the first mounting member transfer mechanism 31A and the suction head 6B provided in the second mounting member transfer mechanism 31B each have a shape that covers the entire surface of the chip 2 and the FPC 4. However, it may have the following shape. For example, the suction head 6A may have a shape capable of sucking and holding the central portion of the chip 2, and the suction head 6B may have a shape surrounding the corner including the corner of the FPC 4 or covering the corner and the central portion.

以上のように、本発明は、電子部品などのチップ部品やフィルム状の回路基板などを、ガラスや樹脂の基板などからなるワークに実装するのに適している。   As described above, the present invention is suitable for mounting a chip component such as an electronic component or a film-like circuit board on a workpiece made of a glass or resin substrate.

Claims (15)

ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、
前記ワークを載置保持する第１保持テーブルと、
前記実装部材であるチップ部品を保持する第１保持手段と、
前記実装部材であるフィルム状またはシート状の基板を保持する第２保持手段と、
前記第１保持手段と第２保持手段を取り付けるヘッドと、
前記第１保持テーブルの載置保持されたワークに前記各実装部材を実装するとき、前記第１保持手段と第２保持手段による各実装部材の保持タイミングを制御するタイミング制御手段と、
前記保持テーブルとヘッドとを相対的に昇降移動させる第１駆動手段と、
前記第１駆動手段を作動させて前記保持テーブルとヘッドとを相対的に昇降移動させ、前記第１または第２保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱する加熱手段と、
を備えたことを特徴とするボンディング装置。A bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material,
A first holding table for placing and holding the workpiece;
First holding means for holding a chip component which is the mounting member;
Second holding means for holding a film-like or sheet-like substrate as the mounting member;
A head for attaching the first holding means and the second holding means;
Timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on the work placed and held on the first holding table;
First driving means for moving the holding table and the head up and down relatively;
The conductivity in a state where the first driving means is operated to move the holding table and the head relatively up and down and the mounting member held by the first or second holding means is pressed against the workpiece. Heating means for heating the bonding material;
A bonding apparatus comprising: 請求項１に記載のボンディング装置において、
前記第１保持手段は、チップ部品の中央または／および幅方向に均等に吸着保持し、
前記第２保持手段は、前記基板の複数の角部近傍を吸着保持する
ことを特徴とするボンディング装置。The bonding apparatus according to claim 1,
The first holding means is uniformly sucked and held in the center or / and the width direction of the chip component,
The bonding apparatus, wherein the second holding unit sucks and holds the vicinity of a plurality of corners of the substrate. 請求項１に記載のボンディング装置おいて、
前記第１保持手段または第２保持手段の少なくともともいずれかを昇降させる第２駆動手段と、
前記第１保持手段および第２保持手段に保持される両実装部材の厚みの差に応じて、前記第２駆動手段の作動制御する駆動制御手段と、
を備えたことを特徴とするボンディング装置。In the bonding apparatus according to claim 1,
Second driving means for moving up and down at least one of the first holding means and the second holding means;
Drive control means for controlling the operation of the second drive means according to a difference in thickness between the mounting members held by the first holding means and the second holding means;
A bonding apparatus comprising: 請求項３に記載のボンディング装置おいて、
前記駆動制御手段は、前記第１保持手段および第２保持手段の両方が実装部材を保持した状態で第２駆動手段を作動制御し、両保持手段が実装部材を同時に前記ワークに実装するように構成した
ことを特徴とするボンディング装置。In the bonding apparatus according to claim 3,
The drive control means controls the operation of the second drive means in a state where both the first holding means and the second holding means hold the mounting member, and both the holding means simultaneously mount the mounting member on the workpiece. A bonding apparatus characterized by comprising. 請求項１に記載のボンディング装置を備えたボンディングシステムにおいて、
前記ワークを載置保持する第２保持テーブルと、
前記第２保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、
異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第１ワーク搬送手段と、
前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、
前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、
前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第２ワーク搬送手段と、
を備えたことを特徴とするボンディングシステム。In the bonding system provided with the bonding apparatus according to claim 1,
A second holding table for placing and holding the workpiece;
A plurality of conductive material supply means for supplying an anisotropic conductive film having a width corresponding to a mounting member to a predetermined portion of the work placed and held on the second holding table;
A first workpiece transfer means for transferring the workpiece supplied with the anisotropic conductive film to a bonding apparatus;
Mounting member transport means for transporting the mounting member to the bonding apparatus;
After heating the anisotropic conductive film supplied to the workpiece by the bonding apparatus, the polymerization reaction proceeds to the middle and the mounting member is mounted on the workpiece in an uncured state, and then the anisotropic conductive film of the workpiece is Further heating and pressure bonding means for terminating the polymerization reaction and fixing the mounting member to the workpiece,
A second workpiece transfer means for transferring a workpiece mounted with a mounting member in the bonding apparatus to the thermocompression bonding means;
A bonding system characterized by comprising: 請求項５に記載のボンディングシステムにおいて、
前記チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手段を備えた
ことを特徴とするボンディングシステム。The bonding system according to claim 5,
A bonding system comprising a cleaning means for cleaning both the chip component and the film or sheet mounting member. 請求項６に記載のボンディングシステムにおいて、
前記洗浄手段は、気体または超音波を付与した気体を実装部材に吹き付ける
ことを特徴とするボンディングシステム。The bonding system according to claim 6, wherein
The said cleaning means sprays the gas which provided gas or the ultrasonic wave on a mounting member. The bonding system characterized by the above-mentioned. ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、
前記ワークを載置保持する第１保持テーブルと、
前記実装部材であるフィルム状またはシート状の基板およびチップ部品の両実装部材の実装部位を吸着保持する複数個の吸着孔の形成された保持手段と、
前記保持手段を取り付けるヘッドと、
前記保持手段に保持する実装部材の形状に応じて、当該保持手段に形成された複数個の吸着孔の吸着作動を切換制御する制御手段と、
前記保持テーブルとヘッドとを相対的に昇降移動させる第１駆動手段と、
前記第１駆動手段を作動させて前記保持テーブルとヘッドとを相対的に昇降移動させ、前記保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱する加熱手段と、
を備えたことを特徴とするボンディング装置。A bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material,
A first holding table for placing and holding the workpiece;
A holding means having a plurality of suction holes for sucking and holding the mounting parts of both the mounting member of the film-like or sheet-like substrate and chip component as the mounting member;
A head to which the holding means is attached;
Control means for switching and controlling the suction operation of a plurality of suction holes formed in the holding means according to the shape of the mounting member held by the holding means;
First driving means for moving the holding table and the head up and down relatively;
The first driving means is operated to relatively move the holding table and the head up and down, and the conductive bonding material in a state where the mounting member held by the holding means is pressed against the workpiece is heated. Heating means;
A bonding apparatus comprising: 請求項８に記載にボンディング装置において、
前記保持手段によって前記基板を吸着保持したときに、前記保持手段からはみ出る部位を吸着保持する支持手段を備えた
ことを特徴とするボンディング装置。In the bonding apparatus according to claim 8,
A bonding apparatus comprising: a supporting unit that sucks and holds a portion protruding from the holding unit when the substrate is sucked and held by the holding unit. 請求項９に記載にボンディング装置において、
前記支持手段は、前記基板の複数の角部近傍を吸着保持する
ことを特徴とするボンディング装置。In the bonding apparatus according to claim 9,
The bonding device is characterized in that the supporting means sucks and holds the vicinity of a plurality of corners of the substrate. 請求項９に記載にボンディング装置において、
前記保持手段または前記支持手段の少なくともともいずれかを昇降させる第２駆動手段と、
前記保持手段および支持手段に保持される両実装部材の厚みの差に応じて、前記第２駆動手段の作動制御する駆動制御手段と、
を備えたことを特徴とするボンディング装置。In the bonding apparatus according to claim 9,
Second driving means for raising and lowering at least one of the holding means and the support means;
Drive control means for controlling the operation of the second drive means according to the difference in thickness between the mounting members held by the holding means and the support means;
A bonding apparatus comprising: 請求項１１に記載のボンディング装置おいて、
前記駆動制御手段は、前記保持手段および支持手段の両方が実装部材を保持した状態で第２駆動手段を作動制御し、保持手段が両実装部材を同時に前記ワークに実装するように構成した
ことを特徴とするボンディング装置。The bonding apparatus according to claim 11,
The drive control means is configured to control the operation of the second drive means in a state where both the holding means and the support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. A characteristic bonding apparatus. 請求項８に記載のボンディング装置を備えたボンディングシステムにおいて、
前記ワークを載置保持する第２保持テーブルと、
前記第２保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、
異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第１ワーク搬送手段と、
前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、
前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、
前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第２ワーク搬送手段と、
を備えたことを特徴とするボンディングシステム。In the bonding system provided with the bonding apparatus according to claim 8,
A second holding table for placing and holding the workpiece;
A plurality of conductive material supply means for supplying an anisotropic conductive film having a width corresponding to a mounting member to a predetermined portion of the work placed and held on the second holding table;
A first workpiece transfer means for transferring the workpiece supplied with the anisotropic conductive film to a bonding apparatus;
Mounting member transport means for transporting the mounting member to the bonding apparatus;
After heating the anisotropic conductive film supplied to the workpiece by the bonding apparatus, the polymerization reaction proceeds to the middle and the mounting member is mounted on the workpiece in an uncured state, and then the anisotropic conductive film of the workpiece is Further heating and pressure bonding means for terminating the polymerization reaction and fixing the mounting member to the workpiece,
A second workpiece transfer means for transferring a workpiece mounted with a mounting member in the bonding apparatus to the thermocompression bonding means;
A bonding system characterized by comprising: 請求項１３に記載のボンディングシステムにおいて、
前記チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手段を備えた
ことを特徴とするボンディングシステム。The bonding system according to claim 13,
A bonding system comprising a cleaning means for cleaning both the chip component and the film or sheet mounting member. 請求項１４に記載のボンディングシステムにおいて、
前記洗浄手段は、気体または超音波を付与した気体を実装部材に吹き付ける
ことを特徴とするボンディングシステム。


The bonding system according to claim 14, wherein
The said cleaning means sprays the gas which provided gas or the ultrasonic wave on a mounting member. The bonding system characterized by the above-mentioned.


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