WO2006118016A1 - Bonding apparatus and bonding system provided with same - Google Patents

Bonding apparatus and bonding system provided with same Download PDF

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Publication number
WO2006118016A1
WO2006118016A1 PCT/JP2006/308056 JP2006308056W WO2006118016A1 WO 2006118016 A1 WO2006118016 A1 WO 2006118016A1 JP 2006308056 W JP2006308056 W JP 2006308056W WO 2006118016 A1 WO2006118016 A1 WO 2006118016A1
Authority
WO
WIPO (PCT)
Prior art keywords
holding
mounting member
bonding
workpiece
bonding apparatus
Prior art date
Application number
PCT/JP2006/308056
Other languages
French (fr)
Japanese (ja)
Inventor
Yasushi Tamura
Satoru Naraba
Seiji Matsuda
Yoshihiro Kinoshita
Original Assignee
Toray Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co., Ltd. filed Critical Toray Engineering Co., Ltd.
Priority to JP2007514585A priority Critical patent/JP4908404B2/en
Priority to KR1020077021112A priority patent/KR101245901B1/en
Publication of WO2006118016A1 publication Critical patent/WO2006118016A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

  • the present invention relates to a bonding apparatus for mounting a chip component such as an electronic component or a film-like circuit board on a powerful workpiece such as a glass resin substrate, and a bonding system using the same.
  • a conventional bonding apparatus supplies a conductive bonding material such as an anisotropic conductive film to a predetermined portion of a circuit board made of glass resin held on a substrate holding table, and adsorbs and holds electrons by a bonding head.
  • the anisotropic conductive film is heated and mounted while pressing the chip component, which is a component, against the location (see, for example, Patent Document 1).
  • FPC Flexible Printed Circuit
  • a circuit board using an individual bonding apparatus (see, for example, Patent Document 2).
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2003-59975
  • Patent Document 2 Japanese Patent Laid-Open No. 2003-66479
  • liquid crystal glass substrates are mounted with surface mount type electronic components, LSI (Large Scale Integrated circuit), and FPC that is easy to use and light in space in a small housing.
  • LSI Large Scale Integrated circuit
  • FPC has a complicated shape because it is bent and stored in a limited space in the housing. It is difficult to automatically mount such a complicated FPC on a small liquid crystal glass substrate.
  • a small liquid crystal glass substrate tends to have a narrower electrode pitch, and it is required to improve not only chip parts such as LSI but also FPC mounting accuracy. Shiina Since FPC is easy to grind and difficult to handle, it is mounted with a manual device, but it is difficult to mount it manually with high accuracy.
  • the present invention has been made in view of such circumstances, and provides a bonding apparatus and a bonding system including the same that can accurately mount different mounting components on a workpiece such as a substrate.
  • the main purpose is to do.
  • the present invention has the following configuration.
  • the bonding apparatus of the present invention is a bonding apparatus for mounting a mounting member on a work via a conductive bonding material, the first holding table for mounting and holding the work, and the chip as the mounting member
  • First holding means for holding a component
  • second holding means for holding a film-like or sheet-like substrate as the mounting member
  • a head to which the first holding means and the second holding means are attached and the first holding
  • a timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on a work placed and held on a table
  • the head or the holding tape First driving means for moving the bull up and down, and operating the first driving means to move the head up and down relatively with respect to the holding table, so that the first or second holding Characterized by comprising a heating means mounted member held in stages you heat the conductive bonding material in a state of being pressed against the workpiece.
  • either the first holding means or the second holding means attached to the head can be operated in accordance with the mounting member to be mounted on the workpiece.
  • mounting components of different shapes such as chip components or film-like substrates can be mounted on the workpiece with a single head.
  • the chip component of the present invention is, for example, an LSI or an electronic component. Therefore, the inventive device can mount LSIs that require high mounting accuracy without mounting deviation, and can therefore improve the mounting accuracy of a film-like substrate.
  • the first holding means is configured to suck and hold evenly in the center or Z and width directions of the chip component
  • the second holding means is configured to suck and hold the vicinity of the plurality of corners of the substrate. And are preferred.
  • the first holding means can accurately hold and hold a hard component such as a chip component. Further, the second holding means can hold the film-like substrate which is easy to stagnate on a flat surface. In other words, chip parts and film-like substrates can be accurately mounted on the workpiece.
  • the bonding apparatus of the present invention includes a second driving unit that moves up and down at least one of the first holding unit and the second holding unit, and both mountings held by the first holding unit and the second holding unit. It is preferable to include a drive control means for controlling the operation of the second drive means according to the difference in thickness of the members.
  • the drive control means controls the operation of the second drive means while both the first holding means and the second holding means hold the mounting member, and both holding means simultaneously mount the mounting member on the workpiece. You may comprise. According to this configuration, work efficiency can be improved.
  • a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table according to a mounting member.
  • the mounting member to be transported
  • the heating means and the anisotropic conductive film supplied to the work by the bonding apparatus are heated, the polymerization reaction is advanced halfway, and the mounting member is mounted on the work in an uncured state.
  • the anisotropic conductive film is further heated to terminate the polymerization reaction and fix the mounting member to the work, and the bonding device.
  • a second workpiece conveying means for conveying the mounted workpiece to the thermocompression bonding means.
  • the bonding system of the present invention preferably includes a cleaning means for cleaning both the chip component and the film or sheet mounting member.
  • a cleaning means for example, a configuration in which a gas or a gas to which ultrasonic waves are applied is blown onto the mounting member can be used.
  • the bonding apparatus apparatus of the present invention is a bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material, the first holding table for mounting and holding the workpiece, and the mounting A holding means having a plurality of suction holes for sucking and holding the mounting parts of both the film-like or sheet-like substrate and chip component mounting members, a head to which the holding means is attached, and the holding means Control means for switching and controlling the suction operation of a plurality of suction holes formed in the holding means in accordance with the shape of the mounting member to be held, and first drive means for moving the holding table and the head up and down relatively The first driving means is operated to move the holding table and the head relatively up and down, and the mounting member held by the holding means is pressed against the workpiece.
  • Heating means for heating the Kishirubeden bonding material characterized by comprising a.
  • the bonding apparatus of the present invention preferably further includes support means for sucking and holding a portion where the holding means force protrudes when the substrate is sucked and held by the holding means.
  • the holding means force is held by the supporting means by suction. Therefore, it is possible to avoid a positional shift to the mounting site due to the stagnation of the substrate.
  • the supporting means is configured to suck and hold the vicinity of a plurality of corners of the substrate.
  • the film substrate can be handled while maintaining a flat state without damaging the film substrate.
  • the bonding apparatus of the present invention is based on the difference in thickness between the second driving means for raising and lowering at least either the holding means or the support means, and the mounting members held by the holding means and the support means. Accordingly, it is preferable to include drive control means for controlling the operation of the second drive means.
  • the drive control means is configured to control the operation of the second drive means in a state where both the holding means and the first support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. More preferred to do.
  • the bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table according to a mounting member.
  • the mounting member to be transported The heating means and the anisotropic conductive film supplied to the work by the bonding apparatus are heated, the polymerization reaction is advanced halfway, and the mounting member is mounted on the work in an uncured state.
  • the anisotropic conductive film is further heated to terminate the polymerization reaction and fix the mounting member to the work, and the bonding device.
  • the second workpiece carrying means for carrying the implemented workpiece mounting member to the heat and pressure means that you with the features.
  • the holding of either the first holding means or the second holding means attached to the head is activated according to the mounting member to be mounted on the workpiece, and the chip component or film It is possible to mount mounting parts with different shapes, such as a shaped board, on the workpiece.
  • a series of processes from supplying an anisotropic conductive film to a workpiece to mounting a mounting member on the supply location is performed without human intervention. Can be done. That is, since it is possible to avoid the dust from adhering to the workpiece during the conveyance process, a high-quality workpiece can be obtained.
  • FIG. 1 is a perspective view of a bonding system according to an embodiment.
  • FIG. 2 is a perspective view showing a schematic configuration of a mounting member supply unit.
  • FIG. 3 is a view of the lower surface force of the suction member of the first and second mounting member transfer mechanisms.
  • FIG. 4 is a diagram showing a state where a mounting member is mounted on a substrate.
  • FIG. 5 is a view of the lower surface force of the first and second holding members provided in the temporary crimping head.
  • FIG. 6 is a perspective view showing a schematic configuration of a provisional pressure bonding head.
  • FIG. 7 is a view of the lower surface force of the first and second holding members provided in the temporary crimping head according to Example 2.
  • FIG. 8 is a diagram for explaining the operation of a bonding apparatus according to a modification.
  • an LSI is mounted as a chip component
  • an FPC Flexible Printed Circuit
  • the chip component for example, all forms on the side to be bonded to the substrate related to the type and size of electronic component, IC chip, semiconductor chip, optical element, surface mount component, wafer and the like are shown.
  • the LSI is simply referred to as a chip.
  • the substrate for example, all forms on the side to which a chip component such as a resin substrate or a glass substrate is bonded are shown.
  • a glass substrate for a liquid crystal display panel is used.
  • FIG. 1 is a perspective view of the bonding system according to the present embodiment.
  • the chip mounting apparatus is broadly divided into an apparatus base 10, a substrate supply unit 20 disposed on one end side (left end in FIG. 1) of the apparatus base 10, and an apparatus base 10.
  • the mounting member supply unit 30 disposed on the back side of the substrate and the lead disposed next to the substrate supply unit 20
  • the board storage unit 70 is arranged on the front side of the apparatus base 10 and four board transfer mechanisms 80A to 80D are provided on the front side of the apparatus base 10.
  • the mounting member supply unit 30 corresponds to the mounting member conveying means of the present invention
  • the conductive material supply unit 40 corresponds to the conductive material supply means
  • the main pressure bonding units 60A and 60B correspond to the thermocompression bonding means.
  • the substrate supply unit 20 includes a substrate storage magazine 21 that stores a plurality of glass substrates 1 (hereinafter simply referred to as "substrates") before mounting LSI and FPC as mounting members in a multistage manner at regular intervals.
  • a raising / lowering table 22 capable of moving up and down and horizontally moving the substrates 1 in order from the substrate storage magazine 21 is provided.
  • the structure of the substrate supply unit 20 is not particularly limited as long as the substrates 1 can be sequentially supplied.
  • the substrate supply unit 20 may be a tray structure in which a plurality of substrates 1 are arranged in a horizontal plane.
  • the mounting member supply unit 30 is arranged in order one by one from the chip tray 3 in which a plurality of chips 2 to be mounted on the substrate 1 are arranged vertically and horizontally in a face-up state.
  • the first mounting member transfer mechanism 31A that takes out and transfers in face-up state, and the FPC tray 5 force and FPC4 that are arranged in a vertical and horizontal orientation in the face-up state, and multiple FPC4s to be mounted on the board 1 are taken out one by one.
  • the second mounting member transport mechanism 31B that transports the FPC4 in a face-up state, and the first and second mounting member transport mechanisms 31A and 31B receive each mounting member alternately, hold the mounting member, and move up and down.
  • the reversing table 32 that changes the posture of the chip 2 and the FPC 4 in the face-down state, and each mounting member is received from the reversing table 32 and each mounting member is in the face-down state And a holding table 33 held by Each mounting member is further received from the holding table 33 by the first and second mounting member transfer mechanisms 31A and 31B, and held and transferred, so that each mounting member is placed in a predetermined position (specifically, the standby member). (Fixed position on slider 34 at position) is supplied face-down.
  • a fixed rail 35A is provided in a direction along one side (Y direction) of the chip tray 3, and a movable rail 35B extending in the X direction travels on the fixed rail 35A. It has become.
  • the first mounting described above is mounted on the movable base 36 traveling on the movable rail 35B.
  • the member transfer mechanism 31A and the second mounting member transfer mechanism 31B are attached with a space therebetween.
  • a suction head 6 A capable of sucking and holding the chip 2 is attached to the lower end portion of the first mounting member transfer mechanism 31 A.
  • a suction head 6B capable of sucking and holding the FPC 4 is attached to the lower end of the second mounting member transfer mechanism 31B.
  • the suction head 6A has a horizontally long rectangular shape covering the entire surface of the chip 2, and a suction hole 8A for sucking and holding the chip 2 is formed at the center thereof.
  • the suction head 6B has a horizontally long rectangular shape that covers the entire surface of the FPC 4, and the suction holes 8B that suck and hold the vicinity of a plurality of corners so that the FPC 4 does not crawl. Is formed.
  • the reversing table 32 is configured to be rotatable around an axis P in the Y direction within a range of 180 degrees.
  • a camera 91 as a recognition means is arranged below the middle of the mounting member transfer from the first and second mounting member transfer mechanisms 31A, 31B to the slider 34, and the lower ends of both mounting member transfer mechanisms 31A, 31B.
  • the suction holding posture of each mounting member held by suction is recognized. Based on the recognized image information, the suction heads of the mounting member transfer mechanisms 31A and 31B are rotated in the 0 direction, and the positions of the X and Y directions are adjusted by the movable rails 35A and 35B.
  • Each mounting member is placed on the slider 34.
  • a mounting member cleaning block 38 is arranged alongside the holding table 33 described above.
  • the chip cleaning block 38 is provided with a gas ejection hole 38A for ejecting a gas such as nitrogen gas or clean air at the center of the upper surface thereof.
  • This gas ejection hole is connected to a gas supply source (not shown).
  • a pair of exhaust holes 38B for sucking and exhausting the gas ejected from the gas ejection holes is provided on both sides of the gas ejection holes.
  • This exhaust hole 38B is connected to a decompression pump (not shown).
  • the holding table 33 and the mounting member cleaning block 38 are arranged side by side on the slide table 39.
  • the slide table 39 is configured to be able to reciprocate along the rotation axis P of the reversing table 32. This movement of the slide table 39 allows the holding table 33 and the mounting member cleaning block 38 to selectively enter the lower position of the reversing table 32 that holds each mounting member in a face-down state. Yes.
  • the slider 34 is configured to be capable of reciprocating along a fixed rail 35C disposed in the Y direction. When the slider 34 is in the standby position (the state shown in FIG. 2), for example, the chip 2 is placed face down in order from the first or second mounting member transfer mechanism 31A, 31B. Supply to the crimping unit 50. After that, FPC4 is processed in the same way.
  • the conductive material supply unit 40 includes a movable table 41 that holds the substrate 1 conveyed from the substrate supply unit 20 in a horizontal position, and a substrate 1-chip shown in FIGS. 2 and 4. Transfer the conductive material from the anisotropic conductive film (ACF) to each part to the bonding part la, which is the part where 2 is mounted, and the bonding part lb, which is the part where FPC4 is mounted. It has two heads 42A and 42B.
  • the movable table 41 includes a substrate holding stage 43 that holds the substrate 1 by suction, and the substrate holding stage 43 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and ⁇ . Yes. Each bonding part la, lb on one end side of the substrate 1 extends forward from the substrate holding stage 43.
  • This anisotropic conductive film is a connecting material having the three functions of adhesion, conduction and insulation at the same time. By thermocompression bonding, the film is conductive in the thickness direction and insulative in the surface direction. This is a polymer film with electrical anisotropy. Conductive particles are mixed in an adhesive binder.
  • the temporary crimping unit 50 includes a movable table 51 that holds the substrate 1 conveyed from the conductive material supply unit 40 in a horizontal posture, and bonding portions la and lb of the substrate 1 to which the conductive material is transferred.
  • a two-field recognition means for example, a two-field camera
  • the movable table 51 corresponds to the first holding table of the present invention
  • the temporary crimping head 52 corresponds to the first drive means of the present invention.
  • the movable table 51 includes a substrate holding stage 54 that holds the substrate 1 by suction, and the substrate holding stage 54 extends in two horizontal (X, Y) directions, up and down (Z) directions, and around the Z axis ( ⁇ ) direction. Each It is configured to move freely.
  • the substrate holding stage 54 corresponds to the first driving means of the present invention.
  • the temporary press-bonding head 52 is movable up and down, and is provided with a first holding member 56A and a second holding member 56B at its lower end for sucking and holding the chip 2 and the FPC4.
  • the first holding member 56A is in contact with the entire surface opposite to the electrode side of the chip 2 and is formed with a horizontally long suction hole 57A for sucking the center.
  • the second holding member 56B abuts to cover the entire surface opposite to the electrode side of the FPC 4, and has a large area.
  • Adsorption holes 57B are formed in the central part of the region and in the vicinity of the plurality of corners. Is formed.
  • the suction holes 57A and 57B of the first holding member 56A and the second holding member 56B are connected to a decompression pump 59 via an intake pipe 58 as shown in FIG.
  • the temporary crimping head 52 has a built-in heater as a heating means.
  • the first holding member 56A corresponds to the first holding means of the present invention
  • the second holding member 56B corresponds to the second holding means.
  • electromagnetic valves El and E2 are provided in the middle of the intake pipes 58 branching toward the tips of the holding members 56A and 56B, so that the electromagnetic valves El and E2 can be opened and closed. Accordingly, the suction holding of the first holding member 56A or the second holding member 56B can be switched.
  • This switching operation is performed by the control unit 90 based on a predetermined processing program. For example, if the first holding member 56A and the second holding member 56B are operated alternately, or if any suction error occurs, the mounting member on the error occurrence side is sucked and held so as to correct the error. Or make it work.
  • the control unit 90 corresponds to the timing control means of the present invention.
  • the face-down chip 2 or FPC 4 transferred by the slider 34 of the mounting member supply unit 30 is sucked and held by the first or second holding members 56A and 56B, and each mounting member is Is heated at a predetermined temperature and pressed against one of the bonding sites la and lb of the substrate 1 with a predetermined pressure while causing a polymerization reaction of the conductive material.
  • heating and pressing are completed in an uncured state from the start of the polymerization reaction to the end of the force reaction.
  • the adhesive becomes semi-cured and the chip 2 and the FPC 4 are temporarily bonded to the substrate 1.
  • the holding structure of the temporary press-bonding head 52 is not limited to the adsorption type, and any holding structure such as electrostatic adsorption using static electricity or magnetic adsorption using magnets can be used.
  • the two-field recognition means 53 is movable in two horizontal (X, Y) directions and up and down (Z) directions, and the tip 2
  • the FPC 4 recognition mark and the recognition mark of the substrate 1 transferred onto the movable table 51 are recognized respectively, and the positional deviation between both recognition marks is detected.
  • the movable table 51 is driven and controlled in the X, Y, and ⁇ directions during temporary crimping so as to eliminate this displacement.
  • the main crimping unit 60 has two blocks of 60 mm and 60 mm, and each of the blocks 60 mm and 60 mm has a movable table 61 mm, 6 IB holding the substrate 1 conveyed from the temporary pressure bonding unit 50 in a horizontal position, Each of chip 2 and FPC4 temporarily bonded to bonding sites la and lb of substrate 1 is pressurized and heated to complete the polymerization reaction of the conductive material and harden, and then bonded to each bonding site la and lb.
  • Each mounting member is provided with two main pressing heads 62A and 62B that are used for main pressing. Backups 63A and 63B are fixedly installed below the respective main crimping heads 62A and 62B.
  • the movable tables 61A and 61B include substrate holding stages 64A and 64B similar to the movable table 41 of the conductive material supply unit 40.
  • each main crimping unit 60A, 60B has a main crimping head 62A that presses the chip 2 and the head 62B presses the FPC4.
  • a mechanism for supplying a protective tape T made of fluorine resin is provided.
  • the protective tape T is fed out by the supply rollers 65A and 65B attached to the main body frame of the main pressing unit 60, and taken up by the take-up rollers 66A and 66B.
  • chip 2 is finally crimped in block 60A, and then substrate 1 is transported to block 60B and FPC4 is finally crimped.
  • the substrate storage unit 70 includes a substrate storage magazine 71 that stores a plurality of substrates 1 on which each mounting member is mounted in multiple stages at regular intervals, and an elevating and lowering unit that sequentially stores the substrates 1 in the substrate storage magazine 71. And a vertically movable lifting table 72.
  • a storage structure of a tray structure may be provided as described in the substrate supply unit 20.
  • the substrate supply unit 20 and the substrate storage unit 70 do not necessarily need to be separate from each other, so that the substrate 1 on which the chip 2 is mounted is returned to the original substrate supply unit.
  • the substrate transport mechanisms 80A to 80D include a rail 81 disposed in the longitudinal direction of the apparatus base 10, a support 82 that runs along the rail 81, and a support 82 that can be moved up and down on the support 82. And a substrate holder 83 that holds 1 by suction.
  • Substrate transport mechanism 80A takes substrate 1 to be processed from substrate supply unit 20 and transports substrate 1 to conductive material supply unit 40.
  • the substrate 1 is transferred onto the substrate holding stage 43 of the movable table 41 and held by suction.
  • the substrate holding stage 43 moves forward (Y direction), and the bonding portion of the substrate 1 is placed on the backup 44.
  • the head 42A descends and a conductive material corresponding to the electrode width of the chip 2 is transferred onto the bonding part la. .
  • the board 1 is moved to the left horizontal direction in the figure to align with the bonding part lb where the FP C4 is mounted, and the head 42B is lowered and the conductive material corresponding to the electrode width of the FPC4 is bonded to the bonding part lb. Transcript to.
  • the substrate holding stage 43 moves horizontally to the delivery position of the substrate 1.
  • the substrate 1 returned to the delivery position is transported to the temporary pressure bonding unit 50 by the substrate transport mechanism 80B.
  • the substrate 1 transported to the temporary pressure bonding unit 50 is transferred onto the substrate holding stage 54 of the movable table 51 and held by suction.
  • the substrate holding stage 54 moves forward (Y direction), and first, the bonding portion la of the substrate 1 is positioned on the backup 55.
  • the first mounting member transfer mechanism 31A moves onto a predetermined chip 2 of the chip tray 3 by moving the movable base 36 in the X and Y directions, respectively. Subsequently, the first mounting member transfer mechanism 31A descends, and the chip 2 in the chip tray 3 is sucked and held by the first holding member 6A. After the first mounting member transfer mechanism 31A rises and the chip 2 is taken out from the chip tray 3, the first mounting member transfer mechanism 31A moves onto the reversing table 32 by moving the movable base 36 in the X and Y directions, respectively. Move to. At this time, the reversing table 32 is in a standby posture (state shown in FIG. 2) with the chip mounting surface facing upward. Next, the first mounting member transfer mechanism 31A descends, and the chip 2 held by the first holding member 6A 2 On the reverse table 32.
  • the chip 2 When the chip 2 is placed on the reversing table 32 and is sucked and held, the chip 2 is reversed around the axis P, and the face 2 in the face-up state is changed to the face-down state. Inverted reversal
  • the mounting member cleaning block 38 enters under the table 32.
  • the slide table 39 moves to move the mounting member cleaning block 38 out of the lower position of the reversing table 32, and the holding table 33 is positioned below the reversing table 32. enter in. Subsequently, chip 2 is transferred from reversal table 32 to holding table 33. The reversing table 32 sucks and holds the chip 2 delivered in the face-down state. After handing over chip 2, reversing table 32 reverses in the opposite direction and returns to the standby position.
  • the first mounting member transfer mechanism 31A that has reached each position descends and holds the chip 2 on the holding table 33 by suction with the suction member 6A.
  • the first mounting device transfer mechanism 31A that holds the chip 2 on the holding table 33 in a face-down state transfers the chip 2 and transfers it onto the camera 91.
  • the camera 91 recognizes the position using the outline of chip 2 or the alignment mark.
  • the suction head is rotated in the ⁇ direction, and the movable base 36 is adjusted in the X and Y directions to be transferred to the slider 34.
  • the slider 34 that has received the chip 2 in the face-down state moves toward the temporary crimping unit 50, and transfers the chip 2 to a position below the temporary crimping head 52.
  • the second mounting member transfer mechanism 31B takes out the FPC 4 from the FPC tray 5 in the same procedure as the chip 2 and performs processing.
  • the electromagnetic valve E1 is opened while the electromagnetic valve E2 is closed by the control unit 90, and the tip 2 transferred by the slider 34 is sucked and held by the first suction member 56A at the lower end of the temporary press-bonding head 52.
  • a two-field recognition means 53 has advanced between the temporary crimping head 52 and the bonding part la of the substrate 1, and the chip 2 and the substrate sucked and held by the first suction member 56A of the temporary crimping head 52
  • the movable table 51 moves in the X, Y, and ⁇ directions to eliminate this misalignment.
  • the alignment between the chip 2 and the substrate 1 is performed.
  • the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered, and the chip 2 is temporarily pressure bonded to the bonding portion la of the substrate 1 to which the conductive material is transferred.
  • the control unit 90 opens the solenoid valve E2 and closes the solenoid valve E1, and the FPC 4 transferred by the slider 34 is moved to the second suction member 56B at the lower end of the temporary crimping head 52. Adsorb and hold. Subsequently, a two-field recognition means 53 advances between the temporary crimping head 52 and the bonding part lb of the substrate 1, and the FPC4 and the substrate 1 that are attracted and held by the second suction member 56B of the temporary crimping head 52 In order to detect misalignment, the alignment mark printed on each is detected.
  • the movable table 51 is controlled in the X, Y, and ⁇ directions so as to eliminate this misalignment, and the FPC 4 and the substrate 1 are aligned.
  • the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered, and the FPC 4 is temporarily pressure bonded to the bonding portion lb of the substrate 1 to which the conductive material is transferred.
  • the substrate holding stage 54 moves horizontally to the delivery position of the substrate 1.
  • the substrate 1 moved to the delivery position is first transferred to the main pressure bonding unit 60A by the substrate transfer mechanism 80C.
  • the substrate 1 conveyed to the main pressure bonding unit 60A is transferred onto the substrate holding stage 64A of the movable table 61A and is sucked and held.
  • the substrate holding stage 64A moves forward (Y direction), and the bonding portion la of the substrate 1 is positioned on the backup 63A.
  • the main crimping head 62A descends, and the temporarily crimped chip 2 is heated and pressurized via the protective tape T.
  • the bumps of the chip 2 are electrically connected to the electrodes of the substrate 1 through the conductive material.
  • the substrate holding stage 64A moves horizontally to the delivery position of the substrate 1.
  • the substrate 1 moved to the delivery position is transferred by the substrate transfer mechanism 80C and transferred to the main pressure unit 60B.
  • the substrate 1 transported to the main pressure bonding unit 60B is transferred and held on the substrate holding stage 64B of the movable table 61B.
  • Substrate holding stage 64B moves forward (Y direction)
  • the bonding part lb of the substrate 1 is positioned on the backup 63B.
  • the main crimping head 62B descends, and the temporarily crimped FPC4 is heated and pressurized via the protective tape T.
  • the electrode of FPC4 is electrically connected to the electrode of substrate 1 through the conductive material.
  • the substrate holding stage 64B moves horizontally to the delivery position of the substrate 1.
  • the substrate 1 moved to the transfer position is transferred by the substrate transfer mechanism 80D and transferred to the lift table 72 of the substrate storage unit 70, and is stored in the substrate storage tray 71 by the lift table 72.
  • the chip mounting of one substrate 1 is completed.
  • the adhesive is transferred to the next substrate 1 in the conductive material supply unit 40.
  • the transfer of the adhesive to the substrate 1, the temporary crimping of the chip 2 or the FPC4, and the final crimping of the chip 2 or the FPC4 are performed in parallel.
  • the substrate 1 transported from the temporary crimping unit 50 can be processed smoothly without delaying the processing of the substrate 1 by adjusting the tact time of each pair of final crimping units 60A and 60B.
  • the bonding system including the bonding apparatus according to the above-described embodiment includes a chip 2 such as an LSI and an FPC 4 that is sometimes handled and flexed with a predetermined bonding of a substrate 1 that is a workpiece with a single bonding apparatus. Can be mounted on the mounting site.
  • the bonding apparatus of this embodiment can mount an LSI with a narrow electrode pitch with high accuracy, it can also realize high-precision mounting even for an FPC4 with a narrow pitch.
  • the bonding system of this embodiment can be taken out from each tray of chip 2 and FPC4 using a single mechanism and transported to temporary crimping unit 50, dust adheres to substrate 1 during the transporting process. Can be suppressed. That is, the processing efficiency can be further improved.
  • the provisional pressure bonding head 52 includes a first holding member 56C and a second holding member 56D at the lower end thereof.
  • the first holding member 56C is located at the center of the shaft core that moves the temporary crimping head 5 up and down.
  • the first holding member 56C is a horizontally-long rectangular shape that is larger than the chip 2 and has a size that covers at least the entire surface of the bonding part 1b for mounting the FPC 4 on the substrate 1. I am doing.
  • a plurality of suction holes 57C and 57D for sucking the mounting member are formed on the lower surface of the first holding member 56C.
  • the suction hole 57C is formed at a position that sucks the center of the chip 2 in the longitudinal direction. Further, the suction holes 57D are formed at positions where both ends of the longitudinal direction of the FPC4 or Z and the center are sucked.
  • the second holding member 56D sucks and holds the portion where the force of the first holding member 56C that cannot be held by the first holding member 56C protrudes. It is arranged close to the same temporary crimping head 52. The shape covers the entire surface of the portion protruding from the first holding member 56C.
  • a plurality of suction holes 57E are formed on the lower surface of the second holding member 56D. These suction holes 57E are in positions for sucking the vicinity of the corners of the FPC4.
  • the first and second holding members 56C, 56D are connected in communication with a decompression pump 59 via an intake pipe 58 as shown in FIG.
  • the intake pipe 58 is branched in three directions (not shown) upstream of the decompression pump 59 side, and each intake pipe is provided with a solenoid valve.
  • two intake pipes are connected in communication with the first holding member 56C, and one intake pipe is connected in communication with the second holding member 56D.
  • one of the intake pipes communicates with the suction hole 57C, and the other intake pipe communicates with the suction hole 57D.
  • the control unit 90 controls the opening / closing operation of the three-port valve so as to operate the suction of the suction holes 56C to 56E according to the mounting member. For example, when chip 2 is mounted, one solenoid valve is opened so that suction hole 57C is activated. When mounting FPC4, open the two solenoid valves to operate the suction holes 56D and 56E.
  • the bonding parts of both the chip 2 and the FPC 4 can be suction-held by the first holding member 56C. it can.
  • the center of the first holding member 56C is the temporary pressure. Since the landing head 52 coincides with the lifting axis, the applied pressure during mounting can be efficiently measured.
  • the portion protruding from the first holding member 56C can be sucked and held by the second holding member 56D, so that the FPC4 is not handled with the FPC4 in a state of being put on. That is, the bonding apparatus of this embodiment can mount the chip 2 and the FPC 4 which are different mounting members with high accuracy.
  • Example 1 when any force of the first holding member 56A, 56B of the temporary crimping unit 50 sucks and holds the mounting member, the holding member on the holding side descends or holds. You may comprise so that the holding member of the side which has not been raised.
  • the second holding member 56B is attached to the ball shaft B connected to the pulse motor M arranged in parallel with the lifting axis of the temporary crimping head 52 via the movable base 100.
  • the second holding member 58B can be moved up and down by forward and reverse rotation of the pulse motor M. Therefore, according to this configuration, when the chip 2 is mounted, the member in the vicinity of the chip 2 and the second holding member 56B do not come into contact with each other so that other members are not damaged. Can be.
  • the first holding member 56 C when the chip 2 is held, the first holding member 56 C may be lowered or the second holding member 56D may be raised! ⁇ .
  • the distance at which the temporary pressing head 52 descends is constant.
  • the relative distance in the height direction of the first holding member 56C and the second holding member 56D may be adjusted so that the height at which the chip 2 and the FPC 4 are mounted on the substrate 1 is reached at the same time.
  • the center of the first holding member 56C does not have to coincide with the axis.
  • the shape of the first holding member 56C changes depending on the workpiece shape, and as a result, the center of the shaft center and the lower surface shape of the first holding member 56C may not be aligned.
  • the first and second chip transfer mechanisms 31A and 31B are configured to move together, but each chip transfer mechanism is configured to move individually. Moyo Yes.
  • the crimping unit is divided into two units of the temporary crimping unit 50 and the main crimping unit 60. You can do it with a crimping unit!
  • each unit and the substrate transport mechanism are not limited to those in the above-described embodiments, and various modifications can be made.
  • a substrate transport mechanism having a plurality of substrate holders is configured to be rotatable around the Z axis, and around this substrate transport mechanism, a substrate supply unit, a mounting member supply unit, an adhesive adhesion unit, a temporary pressure bonding unit
  • the main crimping unit and the substrate storage unit are arranged in this order.
  • a rotary type may be used.
  • the chip mounting apparatus includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.
  • the force for storing the chip 2 in the chip tray in the face-up state is not limited to this, and the wafer may be diced and supplied in the face-up state.
  • the first holding member provided in the temporary press-bonding head with the respective adsorbing members of the first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B of the mounting member supply unit 30 It is possible to individually use the shape according to the mounting member, such as 56A and second holding member 56B.
  • the mounting member supply unit may not be provided with the cleaning block 38.
  • FPC4 is finally crimped by the main crimping head 62A provided in one block 60A of the main crimping unit 60, and the chip 2 is finally crimped by the main crimping head 62B provided in the other block 60B. You may make it do.
  • chip 2 and FP C4 may be finally crimped at the same time for each block 60A and 60B, or chip 2 and FPC4 for each block 60A and 60B. You can make a final crimp.
  • Example 2 when FPC4 is mounted, two solenoid valves are opened so that the suction holes 56D and 56E are actuated. You can make it happen.
  • the suction head 6A provided in the first mounting member transfer mechanism 31A and the suction head 6B provided in the second mounting member transfer mechanism 31B are respectively arranged over the entire surface of the chip 2 and the FP C4.
  • the force that was the covering shape may be the following shape.
  • the suction head 6A may have a shape capable of sucking and holding the central portion of the chip 2
  • the suction head 6B may have a shape surrounding the corner including the corner of the FPC4 or covering the corner and the central portion. Good.
  • the present invention is suitable for mounting a chip component such as an electronic component, a film-like circuit board, or the like on a work having a strong force such as a glass resin substrate.

Abstract

A bonding apparatus and a bonding system are provided with a first holding member for sucking and holding a chip at a lower end of a temporarily press-bonding head, and a second holding member for sucking and holding an FPC. The first holding member sucks and holds the entire surface or a part of a chip component, and the second holding member covers the entire surface of the FPC and sucks and holds at least corner sections. In the bonding system, the chip or/and FPC are sucked and held by operating at least either the first or the second holding member by permitting a control section to switch an electromagnetic valve, corresponding to a transferred mounting member.

Description

明 細 書  Specification
ボンディング装置およびこれを備えたボンディングシステム 技術分野  Bonding apparatus and bonding system provided with the same
[0001] 本発明は、電子部品などのチップ部品やフィルム状の回路基板などを、ガラスゃ榭 脂の基板など力 なるワークに実装するボンディング装置およびこれを用いたボンデ イングシステムに関する。  TECHNICAL FIELD [0001] The present invention relates to a bonding apparatus for mounting a chip component such as an electronic component or a film-like circuit board on a powerful workpiece such as a glass resin substrate, and a bonding system using the same.
背景技術  Background art
[0002] 従来のボンディング装置は、基板保持テーブルに保持したガラスゃ榭脂の回路基 板の所定箇所に異方導電性フィルムなど導電性接合材料を供給し、ボンディングへ ッドによって吸着保持した電子部品であるチップ部品を当該箇所に押圧しながら異 方導電性フィルムを加熱して実装して ヽる (例えば、特許文献 1参照)。  [0002] A conventional bonding apparatus supplies a conductive bonding material such as an anisotropic conductive film to a predetermined portion of a circuit board made of glass resin held on a substrate holding table, and adsorbs and holds electrons by a bonding head. The anisotropic conductive film is heated and mounted while pressing the chip component, which is a component, against the location (see, for example, Patent Document 1).
[0003] また、チップ部品とは異なる実装部材である FPC (Flexible Printed Circuit)を個別 のボンディング装置を利用して回路基板に実装している（例えば、特許文献 2参照参 照)。  [0003] FPC (Flexible Printed Circuit), which is a mounting member different from a chip component, is mounted on a circuit board using an individual bonding apparatus (see, for example, Patent Document 2).
特許文献 1：特開 2003 - 59975号公報  Patent Document 1: Japanese Unexamined Patent Publication No. 2003-59975
特許文献 2：特開 2003 - 66479号公報  Patent Document 2: Japanese Patent Laid-Open No. 2003-66479
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0004] 近年、携帯電話や携帯端末の PDA (Personal Digital Assistant)などの小型の機器 においては、液晶パネルを搭載しつつも、小型かつ軽量化が要求されている。その ため、液晶ガラス基板には、面実装タイプの電子部品や LSI (Large Scale Integrated circuit)、および小さい筐体内の空間利用が容易で軽量な FPCとが実装されている。 特に、 FPCは、湾曲させて筐体内の限られたスペースに収納させるので複雑な形状 をして 、る。このような複雑な形状の FPCを小型の液晶ガラス基板に自動実装するこ とが困難な状況にある。 [0004] In recent years, small devices such as mobile phones and PDAs (Personal Digital Assistants) of mobile terminals have been required to be small and light while mounting a liquid crystal panel. For this reason, liquid crystal glass substrates are mounted with surface mount type electronic components, LSI (Large Scale Integrated circuit), and FPC that is easy to use and light in space in a small housing. In particular, the FPC has a complicated shape because it is bent and stored in a limited space in the housing. It is difficult to automatically mount such a complicated FPC on a small liquid crystal glass substrate.
[0005] また、小型の液晶ガラス基板は、その電極のピッチが狭くなる傾向にあり、 LSIなど のチップ部品のみならず FPCの実装精度を高めることが要求されている。し力しなが ら、 FPCは橈みやすく取り扱いが困難であるので、手動装置にて実装するが、手動 で精度よく実装することが困難である。 [0005] Furthermore, a small liquid crystal glass substrate tends to have a narrower electrode pitch, and it is required to improve not only chip parts such as LSI but also FPC mounting accuracy. Shiina Since FPC is easy to grind and difficult to handle, it is mounted with a manual device, but it is difficult to mount it manually with high accuracy.
[0006] また、従来のように、実装部品ごとに異なるボンディング装置を利用した場合、装置 間の基板搬送過程で人が介在して基板に塵埃が付着し、品質不良が発生すると ヽ つた問題もある。 [0006] In addition, when different bonding devices are used for each mounting component as in the past, there is a problem that a person may intervene in the process of transporting the substrate between the devices and dust adheres to the substrate, resulting in poor quality. is there.
[0007] 本発明は、このような事情に鑑みてなされたものであって、基板などのワークに異な る実装部品を精度よく実装することができるボンディング装置およびこれを備えたボン デイングシステムを提供することを主たる目的とする。  [0007] The present invention has been made in view of such circumstances, and provides a bonding apparatus and a bonding system including the same that can accurately mount different mounting components on a workpiece such as a substrate. The main purpose is to do.
課題を解決するための手段  Means for solving the problem
[0008] 本発明は、このような目的を達成するために、次のような構成をとる。  In order to achieve such an object, the present invention has the following configuration.
すなわち、本発明のボンディング装置は、ワークに導電性接合材料を介して実装部 材を実装するボンディング装置であって、前記ワークを載置保持する第 1保持テープ ルと、前記実装部材であるチップ部品を保持する第 1保持手段と、前記実装部材で あるフィルム状またはシート状の基板を保持する第 2保持手段と、前記第 1保持手段 と第 2保持手段を取り付けるヘッドと、前記第 1保持テーブルの載置保持されたワーク に前記各実装部材を実装するとき、前記第 1保持手段と第 2保持手段による各実装 部材の保持タイミングを制御するタイミング制御手段と、前記ヘッドまたは前記保持テ 一ブルを昇降させる第 1駆動手段と、前記第 1駆動手段を作動させて前記ヘッドを保 持テーブルに対して相対的に昇降移動させ、前記第 1または第 2保持手段に保持さ れた実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱す る加熱手段とを備えたことを特徴とする。  That is, the bonding apparatus of the present invention is a bonding apparatus for mounting a mounting member on a work via a conductive bonding material, the first holding table for mounting and holding the work, and the chip as the mounting member First holding means for holding a component, second holding means for holding a film-like or sheet-like substrate as the mounting member, a head to which the first holding means and the second holding means are attached, and the first holding A timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on a work placed and held on a table; and the head or the holding tape First driving means for moving the bull up and down, and operating the first driving means to move the head up and down relatively with respect to the holding table, so that the first or second holding Characterized by comprising a heating means mounted member held in stages you heat the conductive bonding material in a state of being pressed against the workpiece.
[0009] 本発明のボンディング装置によれば、ワークに実装する実装部材に応じて、ヘッド に取り付けた第 1保持手段または第 2保持手段のいずれかの保持を作動させることが できる。つまり、チップ部品またはフィルム状の基板など異なる形状の実装部品を単 一のヘッドでワークに実装することができる。なお、本発明のチップ部品としては、例 えば、 LSIや電子部品などである。したがって、発明装置は、実装ずれのない高度な 実装精度の要求される LSIの実装が可能となるので、フィルム状の基板の実装精度 の向上も図ることができる。 [0010] なお、第 1保持手段は、チップ部品の中央または Zおよび幅方向に均等に吸着保 持し、 第 2保持手段は、前記基板の複数の角部近傍を吸着保持するよう構成するこ とが好ましい。 [0009] According to the bonding apparatus of the present invention, either the first holding means or the second holding means attached to the head can be operated in accordance with the mounting member to be mounted on the workpiece. In other words, mounting components of different shapes such as chip components or film-like substrates can be mounted on the workpiece with a single head. The chip component of the present invention is, for example, an LSI or an electronic component. Therefore, the inventive device can mount LSIs that require high mounting accuracy without mounting deviation, and can therefore improve the mounting accuracy of a film-like substrate. [0010] The first holding means is configured to suck and hold evenly in the center or Z and width directions of the chip component, and the second holding means is configured to suck and hold the vicinity of the plurality of corners of the substrate. And are preferred.
[0011] この構成によれば、第 1保持手段は、チップ部品のような硬質な部品を精度よく吸 着保持することができる。また、第 2保持手段は、フィルム状の橈みやすい基板を平 面状に保持することができる。すなわち、チップ部品やフィルム状の基板などをワーク に精度よく実装することができる。  [0011] According to this configuration, the first holding means can accurately hold and hold a hard component such as a chip component. Further, the second holding means can hold the film-like substrate which is easy to stagnate on a flat surface. In other words, chip parts and film-like substrates can be accurately mounted on the workpiece.
[0012] また、本発明のボンディング装置は、第 1保持手段または第 2保持手段の少なくとも ともいずれかを昇降させる第 2駆動手段と、第 1保持手段および第 2保持手段に保持 される両実装部材の厚みの差に応じて、第 2駆動手段の作動制御する駆動制御手 段とを備えることが好ましい。  [0012] In addition, the bonding apparatus of the present invention includes a second driving unit that moves up and down at least one of the first holding unit and the second holding unit, and both mountings held by the first holding unit and the second holding unit. It is preferable to include a drive control means for controlling the operation of the second drive means according to the difference in thickness of the members.
[0013] この構成によれば、実装部材をワークに実装する場合に、実装部材を保持している 保持手段を降下、または、実装部材を保持していない保持手段を上昇させることによ り、実装部材を保持しないいずれかの保持手段が、近隣にある部材と接触および押 圧して破損させるのを防止することができる。  [0013] According to this configuration, when mounting the mounting member on the workpiece, the holding means holding the mounting member is lowered or the holding means not holding the mounting member is raised, Any holding means that does not hold the mounting member can be prevented from being damaged by contact and pressure with a member in the vicinity.
[0014] また、駆動制御手段は、第 1保持手段および第 2保持手段の両方が実装部材を保 持した状態で第 2駆動手段を作動制御し、両保持手段が実装部材を同時にワークに 実装するように構成してもよい。この構成によれば、作業効率の向上を図ることができ る。  [0014] The drive control means controls the operation of the second drive means while both the first holding means and the second holding means hold the mounting member, and both holding means simultaneously mount the mounting member on the workpiece. You may comprise. According to this configuration, work efficiency can be improved.
[0015] また、本発明のボンディング装置を備えたボンディングシステムは、前記ワークを載 置保持する第 2保持テーブルと、前記第 2保持テーブルに載置保持されたワークの 所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料 供給手段と、異方導電性フィルムの供給された前記ワークをボンディング装置に搬送 する第 1ワーク搬送手段と、前記ボンディング装置に実装部材を搬送する実装部材 搬送手段と、前記ボンディング装置によりワークに供給された異方導電性フィルムを 加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させ た後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実 装部材をワークに固着させる加熱圧着手段と、前記ボンディング装置で実装部材の 実装されたワークを前記加熱圧着手段に搬送する第 2ワーク搬送手段と、を備えたこ とを特徴とする。 [0015] In addition, a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table according to a mounting member. A plurality of conductive material supply means for supplying an anisotropic conductive film having a different width, a first work transfer means for transferring the work supplied with the anisotropic conductive film to a bonding apparatus, and a mounting member for the bonding apparatus. The mounting member to be transported The heating means and the anisotropic conductive film supplied to the work by the bonding apparatus are heated, the polymerization reaction is advanced halfway, and the mounting member is mounted on the work in an uncured state. The anisotropic conductive film is further heated to terminate the polymerization reaction and fix the mounting member to the work, and the bonding device. Of in the mounting member And a second workpiece conveying means for conveying the mounted workpiece to the thermocompression bonding means.
[0016] すなわち、この構成によれば、ワークに異方導電性フィルムを供給してから、当該供 給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる 。したがって、搬送過程などにおいて、ワークに塵埃が付着するのを回避することが できるので、高品位のワークを得ることができる。  That is, according to this configuration, a series of processes from supplying an anisotropic conductive film to a workpiece to mounting a mounting member on the supply location can be performed without human intervention. . Accordingly, it is possible to avoid the dust from adhering to the workpiece during the conveyance process and the like, so that a high-quality workpiece can be obtained.
[0017] なお、本発明のボンディングシステムは、チップ部品およびフィルム状またはシート 状の両実装部材を洗浄する洗浄手段を備えることが好ましい。この洗浄手段としては 、例えば、気体または超音波を付与した気体を実装部材に吹き付けるよう構成があ げられる。  [0017] Note that the bonding system of the present invention preferably includes a cleaning means for cleaning both the chip component and the film or sheet mounting member. As this cleaning means, for example, a configuration in which a gas or a gas to which ultrasonic waves are applied is blown onto the mounting member can be used.
[0018] また、本発明のボンディング装置装置は、ワークに導電性接合材料を介して実装部 材を実装するボンディング装置であって、前記ワークを載置保持する第 1保持テープ ルと、前記実装部材であるフィルム状またはシート状の基板およびチップ部品の両実 装部材の実装部位を吸着保持する複数個の吸着孔の形成された保持手段と、前記 保持手段を取り付けるヘッドと、前記保持手段に保持する実装部材の形状に応じて 、当該保持手段に形成された複数個の吸着孔の吸着作動を切換制御する制御手段 と、前記保持テーブルとヘッドとを相対的に昇降移動させる第 1駆動手段と、前記第 1駆動手段を作動させて前記保持テーブルとヘッドとを相対的に昇降移動させ、前 記保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電 性接合材料を加熱する加熱手段と、を備えたことを特徴とする。  [0018] Further, the bonding apparatus apparatus of the present invention is a bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material, the first holding table for mounting and holding the workpiece, and the mounting A holding means having a plurality of suction holes for sucking and holding the mounting parts of both the film-like or sheet-like substrate and chip component mounting members, a head to which the holding means is attached, and the holding means Control means for switching and controlling the suction operation of a plurality of suction holes formed in the holding means in accordance with the shape of the mounting member to be held, and first drive means for moving the holding table and the head up and down relatively The first driving means is operated to move the holding table and the head relatively up and down, and the mounting member held by the holding means is pressed against the workpiece. Heating means for heating the Kishirubeden bonding material, characterized by comprising a.
[0019] この構成によれば、保持手段の形成された複数個の吸着孔の作動を制御すること により、単一の保持手段を利用してチップと基板の両方を適時に吸着保持することが できる。また、チップの実装精度と同じ実装精度によって基板を精度よく実装すること ができる。  [0019] According to this configuration, by controlling the operation of the plurality of suction holes formed with the holding means, it is possible to suction and hold both the chip and the substrate in a timely manner using a single holding means. it can. In addition, it is possible to mount the substrate with high accuracy with the same mounting accuracy as that of the chip.
[0020] なお、本発明のボンディング装置は、さらに保持手段によって基板を吸着保持した ときに、保持手段力 はみ出る部位を吸着保持する支持手段を備えることが好ましい  [0020] Note that the bonding apparatus of the present invention preferably further includes support means for sucking and holding a portion where the holding means force protrudes when the substrate is sucked and held by the holding means.
[0021] この構成によれば、保持手段力 はみ出した基板を支持手段により吸着保持する ので、基板の橈みによる実装部位への位置ずれなどを回避することができる。 [0021] According to this configuration, the holding means force is held by the supporting means by suction. Therefore, it is possible to avoid a positional shift to the mounting site due to the stagnation of the substrate.
[0022] また、支持手段は、基板の複数の角部近傍を吸着保持するよう構成することが好ま しい。  [0022] Further, it is preferable that the supporting means is configured to suck and hold the vicinity of a plurality of corners of the substrate.
[0023] この構成によれば、フィルム基板などを橈ますことなく平坦状態を維持したまま取り 扱うことができる。  [0023] According to this configuration, the film substrate can be handled while maintaining a flat state without damaging the film substrate.
[0024] また、本発明のボンディング装置は、保持手段または支持手段の少なくともともいず れかを昇降させる第 2駆動手段と、保持手段および支持手段に保持される両実装部 材の厚みの差に応じて、第 2駆動手段の作動制御する駆動制御手段と、を備えること が好ましい。  [0024] Further, the bonding apparatus of the present invention is based on the difference in thickness between the second driving means for raising and lowering at least either the holding means or the support means, and the mounting members held by the holding means and the support means. Accordingly, it is preferable to include drive control means for controlling the operation of the second drive means.
[0025] また、駆動制御手段は、保持手段および第支持手段の両方が実装部材を保持した 状態で第 2駆動手段を作動制御し、保持手段が両実装部材を同時にワークに実装 するように構成することがより好ま 、。  [0025] The drive control means is configured to control the operation of the second drive means in a state where both the holding means and the first support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. More preferred to do.
[0026] また、本発明のボンディング装置を備えたボンディングシステムは、前記ワークを載 置保持する第 2保持テーブルと、前記第 2保持テーブルに載置保持されたワークの 所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料 供給手段と、異方導電性フィルムの供給された前記ワークをボンディング装置に搬送 する第 1ワーク搬送手段と、前記ボンディング装置に実装部材を搬送する実装部材 搬送手段と、前記ボンディング装置によりワークに供給された異方導電性フィルムを 加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させ た後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実 装部材をワークに固着させる加熱圧着手段と、前記ボンディング装置で実装部材の 実装されたワークを前記加熱圧着手段に搬送する第 2ワーク搬送手段と、を備えたこ とを特徴とする。  [0026] In addition, the bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table according to a mounting member. A plurality of conductive material supply means for supplying an anisotropic conductive film having a different width, a first work transfer means for transferring the work supplied with the anisotropic conductive film to a bonding apparatus, and a mounting member for the bonding apparatus. The mounting member to be transported The heating means and the anisotropic conductive film supplied to the work by the bonding apparatus are heated, the polymerization reaction is advanced halfway, and the mounting member is mounted on the work in an uncured state. The anisotropic conductive film is further heated to terminate the polymerization reaction and fix the mounting member to the work, and the bonding device. In which the second workpiece carrying means for carrying the implemented workpiece mounting member to the heat and pressure means, that you with the features.
[0027] すなわち、この構成によれば、ワークに異方導電性フィルムを供給してから、当該供 給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる 。したがって、搬送過程などにおいて、ワークに塵埃が付着するのを回避することが できるので、高品位のワークを得ることができる。  That is, according to this configuration, a series of processes from supplying an anisotropic conductive film to a workpiece to mounting a mounting member on the supply location can be performed without human intervention. . Accordingly, it is possible to avoid the dust from adhering to the workpiece during the conveyance process and the like, so that a high-quality workpiece can be obtained.
発明の効果 [0028] 本発明に係るにボンディング装置によれば、ワークに実装する実装部材に応じて、 ヘッドに取り付けた第 1保持手段または第 2保持手段のいずれかの保持を作動させ、 チップ部品またはフィルム状の基板など異なる形状の実装部品をワークに実装するこ とがでさる。 The invention's effect [0028] According to the bonding apparatus of the present invention, the holding of either the first holding means or the second holding means attached to the head is activated according to the mounting member to be mounted on the workpiece, and the chip component or film It is possible to mount mounting parts with different shapes, such as a shaped board, on the workpiece.
[0029] また、この発明に係るボンディングシステムによれば、ワークに異方導電性フィルム を供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介 さずに行なうことができる。すなわち、搬送過程などにおいて、ワークに塵埃が付着す るのを回避することができるので、高品位のワークを得ることができる。  [0029] Further, according to the bonding system according to the present invention, a series of processes from supplying an anisotropic conductive film to a workpiece to mounting a mounting member on the supply location is performed without human intervention. Can be done. That is, since it is possible to avoid the dust from adhering to the workpiece during the conveyance process, a high-quality workpiece can be obtained.
[0030] また、装置およびシステムが簡素化されるので、装置導入費用を抑えることができる とともに、生産効率を上げることができる。  [0030] Further, since the apparatus and the system are simplified, the apparatus introduction cost can be suppressed and the production efficiency can be increased.
図面の簡単な説明  Brief Description of Drawings
[0031] [図 1]実施例に係るボンディングシステムの斜視図である。 FIG. 1 is a perspective view of a bonding system according to an embodiment.
[図 2]実装部材供給ユニットの概略構成を示した斜視図である。  FIG. 2 is a perspective view showing a schematic configuration of a mounting member supply unit.
[図 3]第 1および第 2実装部材移送機構の吸着部材の下面力も見た図である。  FIG. 3 is a view of the lower surface force of the suction member of the first and second mounting member transfer mechanisms.
[図 4]基板に実装部材を実装した様子を示す図である。  FIG. 4 is a diagram showing a state where a mounting member is mounted on a substrate.
[図 5]仮圧着ヘッドに備わった第 1および第 2保持部材の下面力 見た図である。  FIG. 5 is a view of the lower surface force of the first and second holding members provided in the temporary crimping head.
[図 6]仮圧着ヘッドの概略構成を示す斜視図である。  FIG. 6 is a perspective view showing a schematic configuration of a provisional pressure bonding head.
[図 7]実施例 2に係る仮圧着ヘッドに備わった第 1および第 2保持部材の下面力 見 た図である。  FIG. 7 is a view of the lower surface force of the first and second holding members provided in the temporary crimping head according to Example 2.
[図 8]変形例のボンディング装置の動作を説明する図である。  FIG. 8 is a diagram for explaining the operation of a bonding apparatus according to a modification.
符号の説明  Explanation of symbols
[0032] la- - - ボンディング部位（チップ用） [0032] la---Bonding part (for chip)
lb- - - ボンディング部位 (FPC用）  lb---Bonding part (for FPC)
2 … チップ  2… Chip
4 … FPC  4… FPC
20 … 基板供給ユニット  20… Board supply unit
30 … 実装部材供給ユニット  30… Mounting material supply unit
31A— 第 1実装部材移送機構 31Β· ·· 第 2実装部材移送機構 31A— First mounting member transfer mechanism 31Β ··· 2nd mounting member transfer mechanism
40 … 導電材料供給ユニット  40… Conductive material supply unit
50 … 仮圧着ユニット  50… Temporary crimping unit
52 … 仮圧着ヘッド  52… Temporary crimping head
54 … 基板保持ステージ  54… Substrate holding stage
56Α· · - 第 1保持部材  56Α ··-First holding member
56Β· ·· 第 2保持部材  56Β ···· Second holding member
56C- - - 第 1保持部材  56C---First holding member
56D- - - 第 2保持部材  56D---Second holding member
60Α· · - 本圧着ユニット（チップ用）  60Α · ·-Crimp unit (for chip)
60Β· ·· 本圧着ユニット (FPC用）  60Β ··············· This crimping unit (for FPC)
70 … 基板収納ユニット  70… Board storage unit
90 … 制御部  90… Control section
実施例 1  Example 1
[0033] 以下、図面を参照して本発明のボンディング装置を備えたボンディングシステムの 実施例を説明する。なお、本実施例では、チップ部品として LSIを、フィルム状の基 板などとしては FPC (Flex¾le Printed Circuit)をワークであるガラス基板に実装する 場合を例にとって説明する。なお、チップ部品としては、その他に例えば、電子部品 、 ICチップ、半導体チップ、光素子、表面実装部品、ウェハなどの種類や大きさに関 係なぐ基板と接合させる側の全ての形態を示す。なお、以下、本実施例では、 LSI を単にチップという。  Hereinafter, embodiments of a bonding system provided with the bonding apparatus of the present invention will be described with reference to the drawings. In the present embodiment, an example will be described in which an LSI is mounted as a chip component, and an FPC (Flex Printed Circuit) is mounted on a glass substrate as a workpiece as a film-like substrate. In addition, as the chip component, for example, all forms on the side to be bonded to the substrate related to the type and size of electronic component, IC chip, semiconductor chip, optical element, surface mount component, wafer and the like are shown. Hereinafter, in this embodiment, the LSI is simply referred to as a chip.
[0034] また、基板としては、例えば、榭脂基板やガラス基板などチップ部品などが接合さ れる側の全ての形態を示す。なお、本実施例では液晶ディスプレイパネル用のガラス 基板を利用する。  Further, as the substrate, for example, all forms on the side to which a chip component such as a resin substrate or a glass substrate is bonded are shown. In this embodiment, a glass substrate for a liquid crystal display panel is used.
[0035] 図 1は、本実施例に係るボンディングシステムの斜視図である。  FIG. 1 is a perspective view of the bonding system according to the present embodiment.
本実施例に係るチップ実装装置は、大きく分けて、装置基台 10と、この装置基台 1 0の一端側（図 1では左端）に配設された基板供給ユニット 20と、装置基台 10の奥側 に配設された実装部材供給ユニット 30と、基板供給ユニット 20の隣に配設された導 電材料供給ユニット 40と、その隣に配設された仮圧着ユニット 50と、さらにその隣に 配設された本圧着ユニット 60A、 60Bと、装置基台 10の他端側（図 1では右端）に配 設された基板収納ユニット 70と、装置基台 10の手前側に配設された 4つの基板搬送 機構 80A〜80Dとから構成されている。なお、実装部材供給ユニット 30は、本発明 の実装部材搬送手段に相当し、導電材料供給ユニット 40は導電材料供給手段に相 当し、本圧着ユニット 60A、 60Bは加熱圧着手段に相当する。 The chip mounting apparatus according to the present embodiment is broadly divided into an apparatus base 10, a substrate supply unit 20 disposed on one end side (left end in FIG. 1) of the apparatus base 10, and an apparatus base 10. The mounting member supply unit 30 disposed on the back side of the substrate and the lead disposed next to the substrate supply unit 20 Electric material supply unit 40, provisional crimping unit 50 arranged next to it, and main crimping units 60A and 60B arranged next to it, and the other end side of the device base 10 (right end in FIG. 1) The board storage unit 70 is arranged on the front side of the apparatus base 10 and four board transfer mechanisms 80A to 80D are provided on the front side of the apparatus base 10. The mounting member supply unit 30 corresponds to the mounting member conveying means of the present invention, the conductive material supply unit 40 corresponds to the conductive material supply means, and the main pressure bonding units 60A and 60B correspond to the thermocompression bonding means.
[0036] 基板供給ユニット 20は、実装部材である LSIと FPCの実装前の複数枚のガラス基 板 1 (以下、単に「基板」という）を一定間隔で多段に収納する基板収納マガジン 21と 、この基板収納マガジン 21から基板 1を順に取り出す昇降および水平移動可能な昇 降テーブル 22とを備えている。また、基板供給ユニット 20は、基板 1を順に供給可能 であれば、その構造は特に限定されず、例えば、複数枚の基板 1を水平面内に整列 配置したトレイ構造であってもよ 、。  [0036] The substrate supply unit 20 includes a substrate storage magazine 21 that stores a plurality of glass substrates 1 (hereinafter simply referred to as "substrates") before mounting LSI and FPC as mounting members in a multistage manner at regular intervals. A raising / lowering table 22 capable of moving up and down and horizontally moving the substrates 1 in order from the substrate storage magazine 21 is provided. Further, the structure of the substrate supply unit 20 is not particularly limited as long as the substrates 1 can be sequentially supplied. For example, the substrate supply unit 20 may be a tray structure in which a plurality of substrates 1 are arranged in a horizontal plane.
[0037] 実装部材供給ユニット 30は、図 2に示すように、基板 1に実装すべき複数個のチッ プ 2をフェイスアップ状態で縦横に整列配置したチップトレイ 3からチップ 2を 1個ずつ 順に取り出し、フェイスアップ状態で移送する第 1実装部材移送機構 31Aと、基板 1 に実装すべき複数個の FPC4をフェイスアップ状態で縦横に整列配備した FPCトレ ィ 5力 、 FPC4を 1個ずつ順に取り出し、その FPC4をフェイスアップ状態で移送す る第 2実装部材移送機構 31Bと、これら第 1および第 2実装部材搬送機構 31A、 31B 力 交互に各実装部材を受け取り、その実装部材を保持して上下反転することにより 、そのチップ 2および FPC4をフェイスダウン状態の姿勢変換する反転テーブル 32と 、この反転テーブル 32から各実装部材を受け取り、各実装部材をフェイスダウン状態 で保持する保持テーブル 33とを備える。この保持テーブル 33から各実装部材を、さ らに第 1および第 2実装部材移送機構 31A、 31Bが受け取り、保持して移送すること により、その各実装部材を所定位置 (具体的には、待機位置にあるスライダー 34上の 所定位置）にフェイスダウン状態などで供給する。  [0037] As shown in FIG. 2, the mounting member supply unit 30 is arranged in order one by one from the chip tray 3 in which a plurality of chips 2 to be mounted on the substrate 1 are arranged vertically and horizontally in a face-up state. The first mounting member transfer mechanism 31A that takes out and transfers in face-up state, and the FPC tray 5 force and FPC4 that are arranged in a vertical and horizontal orientation in the face-up state, and multiple FPC4s to be mounted on the board 1 are taken out one by one. The second mounting member transport mechanism 31B that transports the FPC4 in a face-up state, and the first and second mounting member transport mechanisms 31A and 31B receive each mounting member alternately, hold the mounting member, and move up and down. By reversing, the reversing table 32 that changes the posture of the chip 2 and the FPC 4 in the face-down state, and each mounting member is received from the reversing table 32 and each mounting member is in the face-down state And a holding table 33 held by Each mounting member is further received from the holding table 33 by the first and second mounting member transfer mechanisms 31A and 31B, and held and transferred, so that each mounting member is placed in a predetermined position (specifically, the standby member). (Fixed position on slider 34 at position) is supplied face-down.
[0038] 具体的には、チップトレイ 3の一辺に沿う方向（Y方向）に固定レール 35Aが設けら れており、この固定レール 35A上を、 X方向に延びる可動レール 35Bが走行するよう になっている。この可動レール 35B上を走行する可動ベース 36に上述した第 1実装 部材移送機構 31Aと第 2実装部材移送機構 31Bとが間隔をあけて取り付けられてい る。 [0038] Specifically, a fixed rail 35A is provided in a direction along one side (Y direction) of the chip tray 3, and a movable rail 35B extending in the X direction travels on the fixed rail 35A. It has become. The first mounting described above is mounted on the movable base 36 traveling on the movable rail 35B. The member transfer mechanism 31A and the second mounting member transfer mechanism 31B are attached with a space therebetween.
[0039] 第 1実装部材移送機構 31Aの下端部には、チップ 2を吸着保持可能な吸着ヘッド 6 Aが取り付けられている。また、第 2実装部材移送機構 31Bの下端部には、 FPC4を 吸着保持可能な吸着ヘッド 6Bが取り付けられている。吸着ヘッド 6Aは、図 3 (a)に示 すように、チップ 2の全面を覆う横長矩形状であり、その中央にチップ 2を吸着保持す る吸着孔 8Aが形成されている。また吸着ヘッド 6Bは、図 3 (b)に示すように、 FPC4 の全面を覆う横長矩形状であり、 FPC4が橈むことのな 、ように複数の角部の近傍を 吸着保持する吸着孔 8Bが形成されている。  A suction head 6 A capable of sucking and holding the chip 2 is attached to the lower end portion of the first mounting member transfer mechanism 31 A. A suction head 6B capable of sucking and holding the FPC 4 is attached to the lower end of the second mounting member transfer mechanism 31B. As shown in FIG. 3 (a), the suction head 6A has a horizontally long rectangular shape covering the entire surface of the chip 2, and a suction hole 8A for sucking and holding the chip 2 is formed at the center thereof. As shown in Fig. 3 (b), the suction head 6B has a horizontally long rectangular shape that covers the entire surface of the FPC 4, and the suction holes 8B that suck and hold the vicinity of a plurality of corners so that the FPC 4 does not crawl. Is formed.
[0040] 反転テーブル 32には、 Y方向の軸心 P周りに 180度の範囲で回動可能に構成され ている。なお、第 1および第 2実装部材移送機構 31A、 31Bからスライダー 34に実装 部材が移送される途中の下方に認識手段であるカメラ 91が配備されており、両実装 部材移送機構 31A、31Bの下端に吸着保持された各実装部材の吸着保持姿勢を 認識するようになっている。そして、認識された画像情報に基づいて、各実装部材移 送機構 31A、 31Bの吸着ヘッドを 0方向に回転させたり、各可動レール 35A、 35B によって X、 Y方向の位置を調整したりして、各実装部材をスライダー 34に載置する ようになっている。  [0040] The reversing table 32 is configured to be rotatable around an axis P in the Y direction within a range of 180 degrees. In addition, a camera 91 as a recognition means is arranged below the middle of the mounting member transfer from the first and second mounting member transfer mechanisms 31A, 31B to the slider 34, and the lower ends of both mounting member transfer mechanisms 31A, 31B. The suction holding posture of each mounting member held by suction is recognized. Based on the recognized image information, the suction heads of the mounting member transfer mechanisms 31A and 31B are rotated in the 0 direction, and the positions of the X and Y directions are adjusted by the movable rails 35A and 35B. Each mounting member is placed on the slider 34.
[0041] 図 2に示すように、上述した保持テーブル 33に並んで実装部材洗浄ブロック 38が 配設されている。チップ洗浄ブロック 38は、その上面の中央部に窒素ガスあるいは清 浄空気などの気体を噴出する気体噴出孔 38Aが設けられて 、る。この気体噴出孔 は図示しないガス供給源に接続されている。気体噴出孔の両隣に気体噴出孔から噴 出された気体を吸引排気する一対の排気孔 38Bが設けられている。この排気孔 38B は図示しな ヽ減圧ポンプに接続されて ヽる。  As shown in FIG. 2, a mounting member cleaning block 38 is arranged alongside the holding table 33 described above. The chip cleaning block 38 is provided with a gas ejection hole 38A for ejecting a gas such as nitrogen gas or clean air at the center of the upper surface thereof. This gas ejection hole is connected to a gas supply source (not shown). A pair of exhaust holes 38B for sucking and exhausting the gas ejected from the gas ejection holes is provided on both sides of the gas ejection holes. This exhaust hole 38B is connected to a decompression pump (not shown).
[0042] 保持テーブル 33および実装部材洗浄ブロック 38は、スライドテーブル 39上に並べ て配設されている。このスライドテーブル 39は、反転テーブル 32の回動軸心 Pに沿つ て往復移動可能に構成されている。このスライドテーブル 39の移動によって、各実装 部材をフェイスダウン状態に保持して ヽる反転テーブル 32の下方位置に、保持テー ブル 33および実装部材洗浄ブロック 38を択一的に進入させるようになつている。 [0043] スライダー 34は、 Y方向に配設された固定レール 35Cに沿って往復移動可能に構 成されている。スライダー 34は、待機位置（図 2の状態）にあるときに、第 1または第 2 実装部材移送機構 31A、 31Bから順に、例えば、チップ 2をフェイスダウン状態で載 置され、そのチップ 2を仮圧着ユニット 50に供給する。また、その後に FPC4を同様 に処理する。 The holding table 33 and the mounting member cleaning block 38 are arranged side by side on the slide table 39. The slide table 39 is configured to be able to reciprocate along the rotation axis P of the reversing table 32. This movement of the slide table 39 allows the holding table 33 and the mounting member cleaning block 38 to selectively enter the lower position of the reversing table 32 that holds each mounting member in a face-down state. Yes. [0043] The slider 34 is configured to be capable of reciprocating along a fixed rail 35C disposed in the Y direction. When the slider 34 is in the standby position (the state shown in FIG. 2), for example, the chip 2 is placed face down in order from the first or second mounting member transfer mechanism 31A, 31B. Supply to the crimping unit 50. After that, FPC4 is processed in the same way.
[0044] 図 1に戻って、導電材料供給ユニット 40は、基板供給ユニット 20から搬送されてき た基板 1を水平姿勢で保持する可動テーブル 41と、図 2および図 4に示す基板 1〖こ チップ 2を実装する部位であるボンディング部位 laと、 FPC4を実装する部位である ボンディング部位 lbとに異方導電性フィルム（ACF: Anisotropic Conductive Film ) から導電材料を各部位に転写する、フィルム幅の異なる 2つのヘッド 42A、 42Bを備 えている。可動テーブル 41は、基板 1を吸着保持する基板保持ステージ 43を備え、 この基板保持ステージ 43が水平 2軸 (X, Y)方向、上下 (Z)方向、および Θ方向に 移動自在に構成されている。基板 1の一端側である各ボンディング部位 la、 lbは基 板保持ステージ 43から前方に延び出ている。  Returning to FIG. 1, the conductive material supply unit 40 includes a movable table 41 that holds the substrate 1 conveyed from the substrate supply unit 20 in a horizontal position, and a substrate 1-chip shown in FIGS. 2 and 4. Transfer the conductive material from the anisotropic conductive film (ACF) to each part to the bonding part la, which is the part where 2 is mounted, and the bonding part lb, which is the part where FPC4 is mounted. It has two heads 42A and 42B. The movable table 41 includes a substrate holding stage 43 that holds the substrate 1 by suction, and the substrate holding stage 43 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and Θ. Yes. Each bonding part la, lb on one end side of the substrate 1 extends forward from the substrate holding stage 43.
[0045] なお、この異方性導電フィルムは、接着 ·導電 ·絶縁という 3つの機能を同時にもつ 接続材料で、熱圧着することにより、膜の厚み方向には導通性、面方向には絶縁性 という電気的異方性をもつ高分子膜であり、接着性のあるバインダー内に導電粒子 が混在している。  [0045] This anisotropic conductive film is a connecting material having the three functions of adhesion, conduction and insulation at the same time. By thermocompression bonding, the film is conductive in the thickness direction and insulative in the surface direction. This is a polymer film with electrical anisotropy. Conductive particles are mixed in an adhesive binder.
[0046] 仮圧着ユニット 50は、導電材料供給ユニット 40から搬送されてきた基板 1を水平姿 勢で保持する可動テーブル 51と、導電材料が転写された基板 1の各ボンディング部 位 la、 lbにチップ 2および FPC4を仮圧着する仮圧着ヘッド 52と、仮圧着時に基板 1とチップ 2および FPC4との位置合わせを行なう上下 2方向の認識視野をもつ 2視野 の認識手段 (例えば、 2視野カメラ） 53とを備えている。なお、可動テーブル 51は、本 発明の第 1保持テーブルに相当し、仮圧着ヘッド 52は、本発明の第 1駆動手段に相 当する。  [0046] The temporary crimping unit 50 includes a movable table 51 that holds the substrate 1 conveyed from the conductive material supply unit 40 in a horizontal posture, and bonding portions la and lb of the substrate 1 to which the conductive material is transferred. A two-field recognition means (for example, a two-field camera) with a two-field recognition field that aligns the substrate 1 with the chip 2 and the FPC4 when pre-bonding the chip 2 and FPC4. And 53. The movable table 51 corresponds to the first holding table of the present invention, and the temporary crimping head 52 corresponds to the first drive means of the present invention.
[0047] また、仮圧着ヘッド 52の下方にバックアップ 55が固定設置されている。可動テープ ル 51は、基板 1を吸着保持する基板保持ステージ 54を備え、この基板保持ステージ 54が水平 2軸 (X, Y)方向、上下 (Z)方向、および Z軸周り（ Θ )方向に、それぞれ移 動自在に構成されている。なお、基板保持ステージ 54は、本発明の第 1駆動手段に 相当する。 Further, a backup 55 is fixedly installed below the temporary pressure bonding head 52. The movable table 51 includes a substrate holding stage 54 that holds the substrate 1 by suction, and the substrate holding stage 54 extends in two horizontal (X, Y) directions, up and down (Z) directions, and around the Z axis (Θ) direction. Each It is configured to move freely. The substrate holding stage 54 corresponds to the first driving means of the present invention.
[0048] 仮圧着ヘッド 52は昇降自在であって、その下端には、チップ 2と FPC4を吸着保持 する第 1保持部材 56Aと、第 2保持部材 56Bとを備えている。図 5に示すように、第 1 保持部材 56Aは、チップ 2の電極側とは反対面の全面を覆うように当接し、その中央 を吸着する横長の吸着孔 57Aが形成されている。また、第 2保持部材 56Bは、 FPC 4の電極側とは反対面の全面を覆うように当接し、面積の広!、領域の中央部分およ び複数の角部の近傍に吸着孔 57Bが形成されている。これら第 1保持部材 56Aおよ び第 2保持部材 56Bの各吸着孔 57A、 57Bは、図 6に示すように、吸気管 58を介し て減圧ポンプ 59と連通接続されている。また、仮圧着ヘッド 52〖こは、加熱手段である ヒータが内蔵されている。なお、第 1保持部材 56Aは、本発明の第 1保持手段に相当 し、第 2保持部材 56Bは第 2保持手段に相当する。  [0048] The temporary press-bonding head 52 is movable up and down, and is provided with a first holding member 56A and a second holding member 56B at its lower end for sucking and holding the chip 2 and the FPC4. As shown in FIG. 5, the first holding member 56A is in contact with the entire surface opposite to the electrode side of the chip 2 and is formed with a horizontally long suction hole 57A for sucking the center. Further, the second holding member 56B abuts to cover the entire surface opposite to the electrode side of the FPC 4, and has a large area. Adsorption holes 57B are formed in the central part of the region and in the vicinity of the plurality of corners. Is formed. The suction holes 57A and 57B of the first holding member 56A and the second holding member 56B are connected to a decompression pump 59 via an intake pipe 58 as shown in FIG. In addition, the temporary crimping head 52 has a built-in heater as a heating means. The first holding member 56A corresponds to the first holding means of the present invention, and the second holding member 56B corresponds to the second holding means.
[0049] また、各保持部材 56A、 56Bの先端に向力つて分岐している吸気管 58の途中には 、電磁弁 El、 E2が設けられており、各電磁弁 El、 E2の開閉動作に応じて第 1保持 部材 56Aまたは第 2保持部材 56Bの吸着保持を切換作動できるようになつている。 なお、この切換動作は、予め決められて処理プログラムに基づいて制御部 90によつ て行なわれる。例えば、第 1保持部材 56Aと第 2保持部材 56Bを交互に作動させたり 、いずれかの吸着エラーが発生した場合には、エラー補正するようにエラー発生側の 実装部材を吸着保持させるように連続作動させたりする。なお、制御部 90は、本発明 のタイミング制御手段に相当する。  [0049] In addition, electromagnetic valves El and E2 are provided in the middle of the intake pipes 58 branching toward the tips of the holding members 56A and 56B, so that the electromagnetic valves El and E2 can be opened and closed. Accordingly, the suction holding of the first holding member 56A or the second holding member 56B can be switched. This switching operation is performed by the control unit 90 based on a predetermined processing program. For example, if the first holding member 56A and the second holding member 56B are operated alternately, or if any suction error occurs, the mounting member on the error occurrence side is sucked and held so as to correct the error. Or make it work. The control unit 90 corresponds to the timing control means of the present invention.
[0050] 具体的な動作は、実装部材供給ユニット 30のスライダー 34で移送されてきたフェイ スダウン状態のチップ 2または FPC4を第 1または第 2保持部材 56A、 56Bに吸着保 持し、各実装部材を所定温度で加熱し、導電材料の重合反応をさせながら所定圧力 で基板 1の各ボンディング部位 la、 lbのいずれかに押し付ける。このとき、重合反応 が開始して力 反応終了するまでの未硬化状態で加熱および押し付けを終了する。 これにより接着剤が半硬化状態になってチップ 2および FPC4が基板 1に仮圧着され る。なお、仮圧着ヘッド 52の保持構造は吸着式に限らず、静電気を使った静電吸着 、磁石を使った磁気吸着など、任意の保持構造を用いることもできる。 [0051] 図 1に戻り、 2視野の認識手段 53は、水平 2軸 (X, Y)方向および上下 (Z)方向に 移動可能であって、仮圧着ヘッド 52に吸着保持されたチップ 2および FPC4の認識 マークと、可動テーブル 51上に移送された基板 1の認識マークとをそれぞれ認識し て、両認識マークの位置ズレを検出する。この位置ズレを無くすように仮圧着時に可 動テーブル 51が X、 Y、および Θ方向に駆動制御される。 [0050] Specifically, the face-down chip 2 or FPC 4 transferred by the slider 34 of the mounting member supply unit 30 is sucked and held by the first or second holding members 56A and 56B, and each mounting member is Is heated at a predetermined temperature and pressed against one of the bonding sites la and lb of the substrate 1 with a predetermined pressure while causing a polymerization reaction of the conductive material. At this time, heating and pressing are completed in an uncured state from the start of the polymerization reaction to the end of the force reaction. As a result, the adhesive becomes semi-cured and the chip 2 and the FPC 4 are temporarily bonded to the substrate 1. The holding structure of the temporary press-bonding head 52 is not limited to the adsorption type, and any holding structure such as electrostatic adsorption using static electricity or magnetic adsorption using magnets can be used. [0051] Returning to Fig. 1, the two-field recognition means 53 is movable in two horizontal (X, Y) directions and up and down (Z) directions, and the tip 2 The FPC 4 recognition mark and the recognition mark of the substrate 1 transferred onto the movable table 51 are recognized respectively, and the positional deviation between both recognition marks is detected. The movable table 51 is driven and controlled in the X, Y, and Θ directions during temporary crimping so as to eliminate this displacement.
[0052] 本圧着ユニット 60は 2ブロック 60Α、 60Β力らなり、各ブロック 60Α、 60Βは、仮圧 着ユニット 50から搬送されてきた基板 1を水平姿勢で保持する可動テーブル 61Α、 6 IBと、基板 1の各ボンディング部位 la、 lbに仮圧着されたチップ 2および FPC4のそ れぞれを加圧および加熱し、導電材料の重合反応を完了させて硬化させ、各ボンデ イング部位 la、 lbに各実装部材を本圧着する 2本 1組からなる本圧着ヘッド 62A、 6 2Bとを備えている。各本圧着ヘッド 62A、 62Bのそれぞれの下方にバックアップ 63 A、 63Bが固定設置されている。また、可動テーブル 61A、 61Bは、導電材料供給ュ ニット 40の可動テーブル 41と同様の基板保持ステージ 64A、 64Bを備えている。さ らに、各本圧着ユニット 60A、 60Bは、本圧着ヘッド 62Aでチップ 2を、ヘッド 62Bで FPC4を加圧するときに、基板 1に付着された導電材料に含まれる接着剤が各本圧 着ヘッド 62A、 62Bに付着するのを防止するために、フッソ榭脂製の保護テープ Tを 供給する機構をそれぞれのブロック 60A、 60Bに備えている。保護テープ Tは、本圧 着ユニット 60の本体フレームに取り付けられた供給ローラ 65A、 65B力ら繰り出され て、巻き取りローラ 66A、 66Bに巻き取られる。なお、本実施例では、ブロック 60Aで チップ 2を本圧着し、その後に基板 1をブロック 60Bに搬送し、 FPC4の本圧着を行な  [0052] The main crimping unit 60 has two blocks of 60 mm and 60 mm, and each of the blocks 60 mm and 60 mm has a movable table 61 mm, 6 IB holding the substrate 1 conveyed from the temporary pressure bonding unit 50 in a horizontal position, Each of chip 2 and FPC4 temporarily bonded to bonding sites la and lb of substrate 1 is pressurized and heated to complete the polymerization reaction of the conductive material and harden, and then bonded to each bonding site la and lb. Each mounting member is provided with two main pressing heads 62A and 62B that are used for main pressing. Backups 63A and 63B are fixedly installed below the respective main crimping heads 62A and 62B. The movable tables 61A and 61B include substrate holding stages 64A and 64B similar to the movable table 41 of the conductive material supply unit 40. In addition, each main crimping unit 60A, 60B has a main crimping head 62A that presses the chip 2 and the head 62B presses the FPC4. In order to prevent the heads 62A and 62B from adhering to each of the blocks 60A and 60B, a mechanism for supplying a protective tape T made of fluorine resin is provided. The protective tape T is fed out by the supply rollers 65A and 65B attached to the main body frame of the main pressing unit 60, and taken up by the take-up rollers 66A and 66B. In this embodiment, chip 2 is finally crimped in block 60A, and then substrate 1 is transported to block 60B and FPC4 is finally crimped.
[0053] 基板収納ユニット 70は、各実装部材の実装された複数枚の基板 1を一定間隔で多 段に収納する基板収納マガジン 71と、この基板収納マガジン 71に基板 1を順に収納 する昇降および水平移動可能な昇降テーブル 72とを備えて 、る。この基板収納マガ ジン 71に代えて、基板供給ユニット 20で説明したと同様に、トレイ構造の収納構造を 備えてもよい。また、基板供給ユニット 20と基板収納ユニット 70とは必ずしも個別であ る必要はなぐこれらを単一のユニットにして、チップ 2が実装された基板 1を元の基 板供給ユニットに戻すようにしてもょ 、。 [0054] 基板搬送機構 80A〜80Dは、装置基台 10の長手方向に配設されたレール 81と、 このレール 81に沿って走行する支柱 82と、この支柱 82に昇降自在に取り付けられて 基板 1を吸着保持する基板保持具 83とを備えている。 The substrate storage unit 70 includes a substrate storage magazine 71 that stores a plurality of substrates 1 on which each mounting member is mounted in multiple stages at regular intervals, and an elevating and lowering unit that sequentially stores the substrates 1 in the substrate storage magazine 71. And a vertically movable lifting table 72. Instead of the substrate storage magazine 71, a storage structure of a tray structure may be provided as described in the substrate supply unit 20. Also, the substrate supply unit 20 and the substrate storage unit 70 do not necessarily need to be separate from each other, so that the substrate 1 on which the chip 2 is mounted is returned to the original substrate supply unit. Well ... [0054] The substrate transport mechanisms 80A to 80D include a rail 81 disposed in the longitudinal direction of the apparatus base 10, a support 82 that runs along the rail 81, and a support 82 that can be moved up and down on the support 82. And a substrate holder 83 that holds 1 by suction.
[0055] 次に上述した構成を備えたボンディングシステムの動作を説明する。図 1から図 6を 参照しながら説明する。  Next, the operation of the bonding system having the above-described configuration will be described. This will be described with reference to FIGS.
[0056] 基板搬送機構 80Aは、基板供給ユニット 20から処理対象の基板 1を取り出して、こ の基板 1を導電材料供給ュ-ット 40に搬送する。この基板 1は可動テーブル 41の基 板保持ステージ 43上に移載されて吸着保持される。基板保持ステージ 43が前方 (Y 方向）に移動して、基板 1のボンディング部位をバックアップ 44上に載せる。  Substrate transport mechanism 80A takes substrate 1 to be processed from substrate supply unit 20 and transports substrate 1 to conductive material supply unit 40. The substrate 1 is transferred onto the substrate holding stage 43 of the movable table 41 and held by suction. The substrate holding stage 43 moves forward (Y direction), and the bonding portion of the substrate 1 is placed on the backup 44.
[0057] 基板 1のチップ 2を実装するボンディング部位 laがバックアップ 44によって水平に 支持された状態で、ヘッド 42Aが下降しボンディング部位 la上にチップ 2の電極幅に 応じた導電材料が転写される。その後、基板 1を図中の左水平方向に移動させて FP C4を実装するボンディング部位 lbに位置合わせを行な 、、ヘッド 42Bを降下させて FPC4の電極幅に応じた導電材料をボンディング部位 lbに転写する。各ボンディン グ部位 la、 lbへの導電材料の転写が終わると、基板保持ステージ 43が基板 1の受 け渡し位置に水平移動する。受け渡し位置に戻された基板 1は基板搬送機構 80Bに よって、仮圧着ユニット 50に搬送される。  [0057] In a state where the bonding part la on which the chip 2 of the substrate 1 is mounted is horizontally supported by the backup 44, the head 42A descends and a conductive material corresponding to the electrode width of the chip 2 is transferred onto the bonding part la. . After that, the board 1 is moved to the left horizontal direction in the figure to align with the bonding part lb where the FP C4 is mounted, and the head 42B is lowered and the conductive material corresponding to the electrode width of the FPC4 is bonded to the bonding part lb. Transcript to. When the transfer of the conductive material to each bonding site la, lb is completed, the substrate holding stage 43 moves horizontally to the delivery position of the substrate 1. The substrate 1 returned to the delivery position is transported to the temporary pressure bonding unit 50 by the substrate transport mechanism 80B.
[0058] 仮圧着ユニット 50に搬送された基板 1は可動テーブル 51の基板保持ステージ 54 上に移載されて吸着保持される。基板保持ステージ 54が前方 (Y方向）に移動して、 先ず基板 1のボンディング部位 laをバックアップ 55上に位置させる。  The substrate 1 transported to the temporary pressure bonding unit 50 is transferred onto the substrate holding stage 54 of the movable table 51 and held by suction. The substrate holding stage 54 moves forward (Y direction), and first, the bonding portion la of the substrate 1 is positioned on the backup 55.
[0059] 一方、実装部材供給ユニット 30では、可動ベース 36とが X、 Y方向にそれぞれ移 動することにより、第 1実装部材移送機構 31Aがチップトレイ 3の所定のチップ 2上に 移動する。続いて第 1実装部材移送機構 31Aが下降して、チップトレイ 3内のチップ 2 を第 1保持部材 6Aで吸着保持する。第 1実装部材移送機構 31Aが上昇してチップ 2 をチップトレイ 3から取り出した後、可動ベース 36とが X、 Y方向にそれぞれ移動する ことにより、第 1実装部材移送機構 31Aが反転テーブル 32上に移動する。このとき反 転テーブル 32は、チップ載置面が上方を向いた待機姿勢 (図 2に示す状態）にある。 次に第 1実装部材移送機構 31Aが下降し、第 1保持部材 6Aで保持していたチップ 2 を反転テーブル 32上に移す。 On the other hand, in the mounting member supply unit 30, the first mounting member transfer mechanism 31A moves onto a predetermined chip 2 of the chip tray 3 by moving the movable base 36 in the X and Y directions, respectively. Subsequently, the first mounting member transfer mechanism 31A descends, and the chip 2 in the chip tray 3 is sucked and held by the first holding member 6A. After the first mounting member transfer mechanism 31A rises and the chip 2 is taken out from the chip tray 3, the first mounting member transfer mechanism 31A moves onto the reversing table 32 by moving the movable base 36 in the X and Y directions, respectively. Move to. At this time, the reversing table 32 is in a standby posture (state shown in FIG. 2) with the chip mounting surface facing upward. Next, the first mounting member transfer mechanism 31A descends, and the chip 2 held by the first holding member 6A 2 On the reverse table 32.
[0060] 反転テーブル 32上にチップ 2が載置されて吸着保持されると、軸心 P周りに反転し 、フェイスアップ状態のチップ 2をフェイスダウン状態に姿勢変換する。反転した反転 テーブル 32の下に実装部材洗浄ブロック 38が進入する。  When the chip 2 is placed on the reversing table 32 and is sucked and held, the chip 2 is reversed around the axis P, and the face 2 in the face-up state is changed to the face-down state. Inverted reversal The mounting member cleaning block 38 enters under the table 32.
[0061] チップ 2の洗浄が終わると、スライドテーブル 39が移動することにより、実装部材洗 浄ブロック 38が反転テーブル 32の下方位置カゝら退出するとともに、保持テーブル 33 が反転テーブル 32の下方に進入する。続いて反転テーブル 32から保持テーブル 3 3へチップ 2が受け渡される。反転テーブル 32はフェイスダウン状態で受け渡された チップ 2を吸着保持する。チップ 2を受け渡した後、反転テーブル 32は逆方向に反転 して待機姿勢に復帰する。  [0061] When the cleaning of the chip 2 is finished, the slide table 39 moves to move the mounting member cleaning block 38 out of the lower position of the reversing table 32, and the holding table 33 is positioned below the reversing table 32. enter in. Subsequently, chip 2 is transferred from reversal table 32 to holding table 33. The reversing table 32 sucks and holds the chip 2 delivered in the face-down state. After handing over chip 2, reversing table 32 reverses in the opposite direction and returns to the standby position.
[0062] 反転テーブル 32が待機姿勢に復帰すると、第 1実装部材移送機構 31Aが保持テ 一ブル 33のチップ 2の上方に移動する。  When the reversing table 32 returns to the standby position, the first mounting member transfer mechanism 31 A moves above the chip 2 of the holding table 33.
[0063] 各位置に達した第 1実装部材移送機構 31Aは下降して、保持テーブル 33上のチ ップ 2を吸着部材 6Aで吸着保持する。  [0063] The first mounting member transfer mechanism 31A that has reached each position descends and holds the chip 2 on the holding table 33 by suction with the suction member 6A.
[0064] 保持テーブル 33上のチップ 2をフェイスダウン状態で保持した第 1実装装置移送機 構 31Aは、そのチップ 2を移送してカメラ 91の上に移送する。カメラ 91でチップ 2の 外形またはァライメントマークを利用して位置を認識する。そして、認識された画像情 報に基づいて吸着ヘッドを Θ方向に回転したり、可動ベース 36を X、 Y方向に位置 調整したりして、スライダー 34に受け渡す。チップ 2をフェイスダウン状態で受け取つ たスライダー 34は仮圧着ユニット 50に向けて移動し、そのチップ 2を仮圧着ヘッド 52 の下方にまで移送する。その間、第 2実装部材移送機構 31Bは、チップ 2と同じ手順 で FPCトレイ 5から FPC4を取り出して処理を行なう。  The first mounting device transfer mechanism 31A that holds the chip 2 on the holding table 33 in a face-down state transfers the chip 2 and transfers it onto the camera 91. The camera 91 recognizes the position using the outline of chip 2 or the alignment mark. Then, based on the recognized image information, the suction head is rotated in the Θ direction, and the movable base 36 is adjusted in the X and Y directions to be transferred to the slider 34. The slider 34 that has received the chip 2 in the face-down state moves toward the temporary crimping unit 50, and transfers the chip 2 to a position below the temporary crimping head 52. Meanwhile, the second mounting member transfer mechanism 31B takes out the FPC 4 from the FPC tray 5 in the same procedure as the chip 2 and performs processing.
[0065] 制御部 90によって電磁弁 E2を閉じた状態で電磁弁 E1を開放させ、スライダー 34 で移送されたチップ 2を仮圧着ヘッド 52の下端の第 1吸着部材 56Aにより吸着保持 させる。続いて、仮圧着ヘッド 52と、基板 1のボンディング部位 laとの間に 2視野の認 識手段 53が進出してきて、仮圧着ヘッド 52の第 1吸着部材 56Aに吸着保持された チップ 2と基板 1との位置ズレを検出するために、それぞれに印字されたァライメント マーク検出する。この位置ズレを無くすように可動テーブル 51が X、 Yおよび Θ方向 に制御されて、チップ 2と基板 1との位置合わせが行われる。 [0065] The electromagnetic valve E1 is opened while the electromagnetic valve E2 is closed by the control unit 90, and the tip 2 transferred by the slider 34 is sucked and held by the first suction member 56A at the lower end of the temporary press-bonding head 52. Subsequently, a two-field recognition means 53 has advanced between the temporary crimping head 52 and the bonding part la of the substrate 1, and the chip 2 and the substrate sucked and held by the first suction member 56A of the temporary crimping head 52 In order to detect misalignment with 1, the alignment mark printed on each is detected. The movable table 51 moves in the X, Y, and Θ directions to eliminate this misalignment. Thus, the alignment between the chip 2 and the substrate 1 is performed.
[0066] 位置合わせが終わると、 2視野の認識手段 53は元の位置にまで後退する。続いて 、仮圧着ヘッド 52が下降して、導電材料が転写された基板 1のボンディング部位 la にチップ 2を仮圧着する。  [0066] When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered, and the chip 2 is temporarily pressure bonded to the bonding portion la of the substrate 1 to which the conductive material is transferred.
[0067] チップ 2の仮圧着が終わると、制御部 90は電磁弁 E2を開放して電磁弁 E1を閉じ、 スライダー 34で移送されてきた FPC4を仮圧着ヘッド 52の下端の第 2吸着部材 56B が吸着保持させる。続いて、仮圧着ヘッド 52と、基板 1のボンディング部位 lbとの間 に 2視野の認識手段 53が進出してきて、仮圧着ヘッド 52の第 2吸着部材 56Bに吸着 保持された FPC4と基板 1との位置ズレを検出するために、それぞれに印字されたァ ライメントマーク検出する。この位置ズレを無くすように可動テーブル 51が X、 Yおよ び Θ方向に制御されて、 FPC4と基板 1との位置合わせが行われる。  [0067] When the temporary crimping of the chip 2 is completed, the control unit 90 opens the solenoid valve E2 and closes the solenoid valve E1, and the FPC 4 transferred by the slider 34 is moved to the second suction member 56B at the lower end of the temporary crimping head 52. Adsorb and hold. Subsequently, a two-field recognition means 53 advances between the temporary crimping head 52 and the bonding part lb of the substrate 1, and the FPC4 and the substrate 1 that are attracted and held by the second suction member 56B of the temporary crimping head 52 In order to detect misalignment, the alignment mark printed on each is detected. The movable table 51 is controlled in the X, Y, and Θ directions so as to eliminate this misalignment, and the FPC 4 and the substrate 1 are aligned.
[0068] 位置合わせが終わると、 2視野の認識手段 53は元の位置にまで後退する。続いて 、仮圧着ヘッド 52が下降して、導電材料が転写された基板 1のボンディング部位 lb に FPC4を仮圧着する。  [0068] When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered, and the FPC 4 is temporarily pressure bonded to the bonding portion lb of the substrate 1 to which the conductive material is transferred.
[0069] 両実装部材の仮圧着が終了すると、基板保持ステージ 54が基板 1の受け渡し位置 に水平移動する。受け渡し位置に移動した基板 1は基板搬送機構 80Cによって、先 ず本圧着ユニット 60Aに搬送される。  [0069] When the temporary pressure bonding of both mounting members is completed, the substrate holding stage 54 moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is first transferred to the main pressure bonding unit 60A by the substrate transfer mechanism 80C.
[0070] 本圧着ユニット 60Aに搬送された基板 1は可動テーブル 61 Aの基板保持ステージ 64A上に移載されて吸着保持される。基板保持ステージ 64Aが前方 (Y方向）に移 動して、基板 1のボンディング部位 laをバックアップ 63A上に位置させる。ボンディン グ部位 laがバックアップ 63Aで支持されると、本圧着ヘッド 62Aが下降して、仮圧着 されたチップ 2を保護テープ Tを介して加熱'加圧する。これによりチップ 2のバンプが 導電材料を介して基板 1の電極に電気的に接続する。  [0070] The substrate 1 conveyed to the main pressure bonding unit 60A is transferred onto the substrate holding stage 64A of the movable table 61A and is sucked and held. The substrate holding stage 64A moves forward (Y direction), and the bonding portion la of the substrate 1 is positioned on the backup 63A. When the bonding part la is supported by the backup 63A, the main crimping head 62A descends, and the temporarily crimped chip 2 is heated and pressurized via the protective tape T. As a result, the bumps of the chip 2 are electrically connected to the electrodes of the substrate 1 through the conductive material.
[0071] チップ 2の本圧着が終わると、基板保持ステージ 64Aが基板 1の受け渡し位置に水 平移動する。受け渡し位置に移動した基板 1は基板搬送機構 80Cで移送されて本圧 着ユニット 60Bに搬送される。  [0071] When the final press-bonding of the chip 2 is completed, the substrate holding stage 64A moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is transferred by the substrate transfer mechanism 80C and transferred to the main pressure unit 60B.
[0072] 本圧着ユニット 60Bに搬送された基板 1は可動テーブル 61Bの基板保持ステージ 6 4B上に移載されて吸着保持される。基板保持ステージ 64Bが前方 (Y方向）に移動 して、基板 1のボンディング部位 lbをバックアップ 63B上に位置させる。ボンディング 部位 lbがバックアップ 63Bで支持されると、本圧着ヘッド 62Bが下降して、仮圧着さ れた FPC4を保護テープ Tを介して加熱 '加圧する。これにより FPC4の電極が導電 材料を介して基板 1の電極に電気的に接続する。 [0072] The substrate 1 transported to the main pressure bonding unit 60B is transferred and held on the substrate holding stage 64B of the movable table 61B. Substrate holding stage 64B moves forward (Y direction) Then, the bonding part lb of the substrate 1 is positioned on the backup 63B. When the bonding part lb is supported by the backup 63B, the main crimping head 62B descends, and the temporarily crimped FPC4 is heated and pressurized via the protective tape T. As a result, the electrode of FPC4 is electrically connected to the electrode of substrate 1 through the conductive material.
[0073] FPC4の本圧着が終わると、基板保持ステージ 64Bが基板 1の受け渡し位置に水 平移動する。受け渡し位置に移動した基板 1は基板搬送機構 80Dで移送されて基 板収納ユニット 70の昇降テーブル 72に受け渡され、この昇降テーブル 72によって基 板収納トレィ 71に収納される。  [0073] When the final press-bonding of the FPC 4 is completed, the substrate holding stage 64B moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the transfer position is transferred by the substrate transfer mechanism 80D and transferred to the lift table 72 of the substrate storage unit 70, and is stored in the substrate storage tray 71 by the lift table 72.
[0074] 以上で一枚の基板 1のチップ実装が終了する。なお、ある基板 1が仮圧着ユニット 5 0でチップ 2を仮圧着されている間に、導電材料供給ユニット 40では次の基板 1へ接 着剤が転写されている。このように各ユニットでは基板 1への接着剤の転写、チップ 2 または FPC4の仮圧着、チップ 2または FPC4の本圧着が並行して行われている。ま た、仮圧着ユニット 50から搬送される基板 1は、各 1組の本圧着ユニット 60A、 60Bの タクトタイムを調整して基板 1の処理が滞ることなくスムーズに処理できるよにしている  Thus, the chip mounting of one substrate 1 is completed. Note that while a certain substrate 1 is temporarily pressure-bonded to the chip 2 by the temporary pressure bonding unit 50, the adhesive is transferred to the next substrate 1 in the conductive material supply unit 40. As described above, in each unit, the transfer of the adhesive to the substrate 1, the temporary crimping of the chip 2 or the FPC4, and the final crimping of the chip 2 or the FPC4 are performed in parallel. In addition, the substrate 1 transported from the temporary crimping unit 50 can be processed smoothly without delaying the processing of the substrate 1 by adjusting the tact time of each pair of final crimping units 60A and 60B.
[0075] 上述の本実施例に係るボンディング装置を備えたボンディングシステムは、 LSIの ようなチップ 2と、取り扱 、時に撓むような FPC4を単一のボンディング装置でワーク である基板 1の所定の実装部位に実装することができる。また、この実施例のボンデ イング装置は、電極のピッチの狭い LSIを高精度で実装が可能であるので、ピッチの 狭い FPC4に対しても、高精度な実装が実現できる。さらに、この実施例のボンディン グシステムは、チップ 2と FPC4の各トレイから 1台機構を利用して取り出して仮圧着 ユニット 50に搬送することができるので、搬送過程での基板 1への塵埃の付着を抑制 することができる。つまり、処理効率を一層向上させることもできる。 [0075] The bonding system including the bonding apparatus according to the above-described embodiment includes a chip 2 such as an LSI and an FPC 4 that is sometimes handled and flexed with a predetermined bonding of a substrate 1 that is a workpiece with a single bonding apparatus. Can be mounted on the mounting site. In addition, since the bonding apparatus of this embodiment can mount an LSI with a narrow electrode pitch with high accuracy, it can also realize high-precision mounting even for an FPC4 with a narrow pitch. Furthermore, since the bonding system of this embodiment can be taken out from each tray of chip 2 and FPC4 using a single mechanism and transported to temporary crimping unit 50, dust adheres to substrate 1 during the transporting process. Can be suppressed. That is, the processing efficiency can be further improved.
実施例 2  Example 2
[0076] 本実施例では、仮圧着ヘッド 52の構成のみが上記実施例 1と異なるので、他の同 じ構成部分には同一符号を付すに留め、異なる部分について具体的に説明する。  In the present embodiment, only the configuration of the temporary press-bonding head 52 is different from that of the first embodiment. Therefore, the same reference numerals are given to the other same components, and different portions will be specifically described.
[0077] 仮圧着ヘッド 52は、その下端に第 1保持部材 56Cと、第 2保持部材 56Dとを備えて いる。第 1保持部材 56Cは、仮圧着ヘッド 5を昇降させる軸芯に、その中央が位置す るように仮圧着ヘッド 52に取り付けられている。また、図 7に示すように、第 1保持部 材 56Cは、チップ 2よりも大きぐかつ、 FPC4を基板 1に実装するボンディング部位 1 bの全面を少なくとも覆う程度の大きさを有する横長矩形状をしている。また、第 1保 持部材 56Cの下面には、実装部材を吸着する複数個の吸着孔 57C、 57Dが形成さ れている。 [0077] The provisional pressure bonding head 52 includes a first holding member 56C and a second holding member 56D at the lower end thereof. The first holding member 56C is located at the center of the shaft core that moves the temporary crimping head 5 up and down. As shown in FIG. Further, as shown in FIG. 7, the first holding member 56C is a horizontally-long rectangular shape that is larger than the chip 2 and has a size that covers at least the entire surface of the bonding part 1b for mounting the FPC 4 on the substrate 1. I am doing. A plurality of suction holes 57C and 57D for sucking the mounting member are formed on the lower surface of the first holding member 56C.
[0078] 吸着孔 57Cは、チップ 2の長手方向の中央を吸着する位置に形成されている。また 吸着孔 57Dは、 FPC4の長手方向の両端側または Zおよび中央を吸着する位置に 形成されている。  The suction hole 57C is formed at a position that sucks the center of the chip 2 in the longitudinal direction. Further, the suction holes 57D are formed at positions where both ends of the longitudinal direction of the FPC4 or Z and the center are sucked.
[0079] 第 2保持部材 56Dは、第 1保持部材 56Cによって FPC4を吸着保持した場合に、 第 1保持部材 56Cによって保持しきれない第 1保持部材 56C力もはみ出た部分を吸 着保持するように同じ仮圧着ヘッド 52に近接配置されている。その形状は、第 1保持 部材 56Cからはみ出た部分の全面を覆う形状をしている。また、第 2保持部材 56D の下面には複数個の吸着孔 57Eが形成されている。これら吸着孔 57Eは、 FPC4の 角部の近傍を吸着する位置にある。  [0079] When the FPC 4 is sucked and held by the first holding member 56C, the second holding member 56D sucks and holds the portion where the force of the first holding member 56C that cannot be held by the first holding member 56C protrudes. It is arranged close to the same temporary crimping head 52. The shape covers the entire surface of the portion protruding from the first holding member 56C. A plurality of suction holes 57E are formed on the lower surface of the second holding member 56D. These suction holes 57E are in positions for sucking the vicinity of the corners of the FPC4.
[0080] 第 1および第 2保持部材 56C、 56Dは、図 6に示すように、吸気管 58を介して減圧 ポンプ 59と連通接続されている。この吸気管 58は、減圧ポンプ 59側の上流で、図示 しないが 3方向に分岐され、各吸気管に電磁弁を備えている。具体的には、第 1保持 部材 56Cに 2本の吸気管が連通接続され、第 2保持部材 56Dに 1本の吸気管が連 通接続されている。  [0080] The first and second holding members 56C, 56D are connected in communication with a decompression pump 59 via an intake pipe 58 as shown in FIG. The intake pipe 58 is branched in three directions (not shown) upstream of the decompression pump 59 side, and each intake pipe is provided with a solenoid valve. Specifically, two intake pipes are connected in communication with the first holding member 56C, and one intake pipe is connected in communication with the second holding member 56D.
[0081] 第 1保持部材 56Cに連通接続された 2本の吸気管のうち 1本が、吸着孔 57Cと連通 され、他方の吸気管は吸着孔 57Dと連通している。  [0081] Of the two intake pipes connected in communication with the first holding member 56C, one of the intake pipes communicates with the suction hole 57C, and the other intake pipe communicates with the suction hole 57D.
[0082] 制御部 90は、実装部材に応じて各吸着孔 56C〜56Eの吸着を作動させるように 3 ポート弁の開閉動作を制御する。例えば、チップ 2を実装する場合は、吸着孔 57Cを 作動させるように 1個の電磁弁を開放する。 FPC4を実装する場合は、吸着孔 56D、 56Eを作動させるように 2個の電磁弁を開放する。  [0082] The control unit 90 controls the opening / closing operation of the three-port valve so as to operate the suction of the suction holes 56C to 56E according to the mounting member. For example, when chip 2 is mounted, one solenoid valve is opened so that suction hole 57C is activated. When mounting FPC4, open the two solenoid valves to operate the suction holes 56D and 56E.
[0083] 上述の本実施例に係るボンディング装置によれば、吸着孔 57Cおよび 57Dの作動 を切り換えることによって、チップ 2および FPC4の両方のボンディング部位を第 1保 持部材 56Cで吸着保持することができる。特に、第 1保持部材 56Cの中心は、仮圧 着ヘッド 52を昇降軸芯と一致しているので、実装時の加圧力を効率的にカ卩えること ができる。また、 FPC4を実装する場合は、第 1保持部材 56Cからはみ出る部分は、 第 2保持部材 56Dによって、その全面を吸着保持することができるので、 FPC4を橈 ました状態で取り扱うことがない。つまり、本実施例のボンディング装置は、異なる実 装部材であるチップ 2と FPC4を高精度に実装することができる。 [0083] According to the above-described bonding apparatus according to the present embodiment, by switching the operation of the suction holes 57C and 57D, the bonding parts of both the chip 2 and the FPC 4 can be suction-held by the first holding member 56C. it can. In particular, the center of the first holding member 56C is the temporary pressure. Since the landing head 52 coincides with the lifting axis, the applied pressure during mounting can be efficiently measured. In addition, when mounting FPC4, the portion protruding from the first holding member 56C can be sucked and held by the second holding member 56D, so that the FPC4 is not handled with the FPC4 in a state of being put on. That is, the bonding apparatus of this embodiment can mount the chip 2 and the FPC 4 which are different mounting members with high accuracy.
[0084] なお、本発明は上述した実施例に限らず、次のように変形実施することができる。  Note that the present invention is not limited to the above-described embodiments, and can be modified as follows.
[0085] (1)上記実施例 1において、仮圧着ユニット 50の第 1保持部材 56A、 56Bのいずれ 力が実装部材を吸着保持したときに、保持した側の保持部材が降下、または、保持し ていない側の保持部材が上昇するように構成してもよい。例えば、図 8に示すよう、仮 圧着ヘッド 52の昇降軸芯に平行に配備されたパルスモータ Mに連結されたボール 軸 Bに可動台 100を介して第 2保持部材 56Bを取り付ける。このように構成すれば、 パルスモータ Mの正逆転により第 2保持部材 58Bを昇降させることができる。したがつ て、この構成によれば、チップ 2を実装するときに、チップ 2の近隣に在る部材と、第 2 保持部材 56Bとが接触したりして、他の部材に損傷与えないようにすることができる。  (1) In Example 1 above, when any force of the first holding member 56A, 56B of the temporary crimping unit 50 sucks and holds the mounting member, the holding member on the holding side descends or holds. You may comprise so that the holding member of the side which has not been raised. For example, as shown in FIG. 8, the second holding member 56B is attached to the ball shaft B connected to the pulse motor M arranged in parallel with the lifting axis of the temporary crimping head 52 via the movable base 100. With this configuration, the second holding member 58B can be moved up and down by forward and reverse rotation of the pulse motor M. Therefore, according to this configuration, when the chip 2 is mounted, the member in the vicinity of the chip 2 and the second holding member 56B do not come into contact with each other so that other members are not damaged. Can be.
[0086] 実施例 2のボンディング装置の場合、チップ 2を保持した場合に、第 1保持部材 56 Cを降下させるか、第 2保持部材 56Dを上昇させるように構成すればよ！ヽ。  In the case of the bonding apparatus according to the second embodiment, when the chip 2 is held, the first holding member 56 C may be lowered or the second holding member 56D may be raised!ヽ.
[0087] また、実施例 1のボンディング装置を利用してチップ 2と FPC4を各保持部材 56A、 56Bで同時に吸着保持して基板 1に同時に実装する場合、仮圧着ヘッド 52の降下 する距離を一定で、基板 1にチップ 2および FPC4が実装される高さに同時に到達す るよう、第 1保持部材 56Cおよび第 2保持部材 56Dの高さ方向の相対距離を調整す ればよい。  [0087] In addition, when the chip 2 and the FPC 4 are simultaneously sucked and held by the holding members 56A and 56B using the bonding apparatus of Example 1 and mounted on the substrate 1 at the same time, the distance at which the temporary pressing head 52 descends is constant. Thus, the relative distance in the height direction of the first holding member 56C and the second holding member 56D may be adjusted so that the height at which the chip 2 and the FPC 4 are mounted on the substrate 1 is reached at the same time.
[0088] また、実施例 2のボンディング装置の場合、第 1保持部材 56Cの中心と軸心が一致 しなくてもよい。ワーク形状により、第 1保持部材 56Cの形状が変わり、結果として、軸 心と第 1保持部材 56Cの下面形状の中心が合わなくてもよい。  [0088] Further, in the case of the bonding apparatus according to the second embodiment, the center of the first holding member 56C does not have to coincide with the axis. The shape of the first holding member 56C changes depending on the workpiece shape, and as a result, the center of the shaft center and the lower surface shape of the first holding member 56C may not be aligned.
[0089] (2)チップ 2の洗浄効果を高めるために、上記実施例のようにエアーに超音波を付 与するのが好ま 、が、必ずしも超音波を付与しなくてもょ 、。  [0089] (2) In order to enhance the cleaning effect of the chip 2, it is preferable to apply ultrasonic waves to the air as in the above embodiment, but it is not always necessary to apply ultrasonic waves.
[0090] (3)上記実施例では、第 1および第 2のチップ移送機構 31A、 31Bが一体になつて 移動するように構成したが、各チップ移送機構が個別に移動するように構成してもよ い。 (3) In the above embodiment, the first and second chip transfer mechanisms 31A and 31B are configured to move together, but each chip transfer mechanism is configured to move individually. Moyo Yes.
[0091] (4)上記実施例では処理効率を上げるために圧着ユニットを仮圧着ユニット 50と本 圧着ユニット 60との 2つのユニットに分割した力 チップ 2の位置合わせと電気的接続 とを一つの圧着ユニットで行なうようにしてもよ!、。  [0091] (4) In the above embodiment, in order to increase the processing efficiency, the crimping unit is divided into two units of the temporary crimping unit 50 and the main crimping unit 60. You can do it with a crimping unit!
[0092] (5)本発明にお ヽて各ユニットおよび基板搬送機構の配置や構成は上記実施例の ものに限定されず、種々変更実施可能である。例えば、複数個の基板保持具を備え た基板搬送機構を Z軸周りに回転可能に構成し、この基板搬送機構の周りに、基板 供給ユニット、実装部材供給ユニット、接着剤付着ユニット、仮圧着ユニット、本圧着 ユニット、および基板収納ユニットを順に配置する、例えば、ロータリー式であってもよ い。  (5) In the present invention, the arrangement and configuration of each unit and the substrate transport mechanism are not limited to those in the above-described embodiments, and various modifications can be made. For example, a substrate transport mechanism having a plurality of substrate holders is configured to be rotatable around the Z axis, and around this substrate transport mechanism, a substrate supply unit, a mounting member supply unit, an adhesive adhesion unit, a temporary pressure bonding unit The main crimping unit and the substrate storage unit are arranged in this order. For example, a rotary type may be used.
[0093] (6)本発明に係るチップ実装装置は、チップ搭載のための単なるマウント装置や、 加熱加圧プロセスを有したボンディング装置など、種々の形態のものを含む。  [0093] (6) The chip mounting apparatus according to the present invention includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.
[0094] (7)実施例では、チップ 2をフェイスアップ状態でチップトレイに収納した力 本発明 はこれに限らず、ウェハをダイシングした状態で、かつフェイスアップで供給してもよ い。  (7) In the embodiment, the force for storing the chip 2 in the chip tray in the face-up state The present invention is not limited to this, and the wafer may be diced and supplied in the face-up state.
[0095] (8)各実施例において、実装部材供給ユニット 30の第 1実装部材移送機構 31Aお よび第 2実装部材移送機構 31Bのそれぞれの吸着部材を、仮圧着ヘッドに備わった 第 1保持部材 56Aおよび第 2保持部材 56Bのように実装部材に応じて形状のものを 個別に利用するようにしてもょ 、。  (8) In each embodiment, the first holding member provided in the temporary press-bonding head with the respective adsorbing members of the first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B of the mounting member supply unit 30 It is possible to individually use the shape according to the mounting member, such as 56A and second holding member 56B.
[0096] (9)実施例において、チップ 2および FPC4の電極が予め下向きのフェイスダウンの 状態でそれぞれのトレイ 3、 5にセットされている場合は、反転機構が設けられていな い構成にしてもよい。  (9) In the embodiment, when the electrodes of the chip 2 and the FPC 4 are set in the respective trays 3 and 5 in the face-down state in advance, the reversing mechanism is not provided. Also good.
[0097] (10)実施例にお!、て、実装部材供給ユニットに洗浄ブロック 38を設けな 、構成で あってもよい。  (10) In the embodiment, the mounting member supply unit may not be provided with the cleaning block 38.
[0098] (11)実施例において、本圧着ユニット 60の一方のブロック 60Aに備わった本圧着 ヘッド 62Aで FPC4を本圧着し、他方のブロック 60Bに備わった本圧着ヘッド 62Bで チップ 2を本圧着するようにしてもよい。また、ブロック 60A、 60Bごとに、チップ 2と FP C4を同時に本圧着してもよいし、ブロック 60A、 60Bごとにチップ 2と FPC4を順番に 本圧着するようにしてもよ ヽ。 [11] (11) In the embodiment, FPC4 is finally crimped by the main crimping head 62A provided in one block 60A of the main crimping unit 60, and the chip 2 is finally crimped by the main crimping head 62B provided in the other block 60B. You may make it do. In addition, chip 2 and FP C4 may be finally crimped at the same time for each block 60A and 60B, or chip 2 and FPC4 for each block 60A and 60B. You can make a final crimp.
[0099] (12)実施例 2では、 FPC4を実装する場合に吸着孔 56D、 56Eを作動させるように 2個の電磁弁を開放して 、たが、 V、ずれか一方の電磁弁を作動させるようにしてもよ い。  [0099] (12) In Example 2, when FPC4 is mounted, two solenoid valves are opened so that the suction holes 56D and 56E are actuated. You can make it happen.
[0100] (13)実施例 1では、第 1実装部材移送機構 31Aに備わった吸着ヘッド 6Aおよび第 2実装部材移送機構 31Bに備わった吸着ヘッド 6Bは、それぞれがチップ 2および FP C4の全面を覆う形状であった力 次のような形状であってもよい。例えば、吸着へッ ド 6Aは、チップ 2の中央部分を吸着保持できる形状、吸着ヘッド 6Bは、 FPC4の角 部を含むその周り、または、角部と中央部分を覆うような形状であってもよい。  [0100] (13) In Example 1, the suction head 6A provided in the first mounting member transfer mechanism 31A and the suction head 6B provided in the second mounting member transfer mechanism 31B are respectively arranged over the entire surface of the chip 2 and the FP C4. The force that was the covering shape may be the following shape. For example, the suction head 6A may have a shape capable of sucking and holding the central portion of the chip 2, and the suction head 6B may have a shape surrounding the corner including the corner of the FPC4 or covering the corner and the central portion. Good.
産業上の利用可能性  Industrial applicability
[0101] 以上のように、本発明は、電子部品などのチップ部品やフィルム状の回路基板など を、ガラスゃ榭脂の基板など力もなるワークに実装するのに適している。 As described above, the present invention is suitable for mounting a chip component such as an electronic component, a film-like circuit board, or the like on a work having a strong force such as a glass resin substrate.

Claims

請求の範囲 The scope of the claims
[1] ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、 前記ワークを載置保持する第 1保持テーブルと、  [1] A bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material, a first holding table for mounting and holding the workpiece,
前記実装部材であるチップ部品を保持する第 1保持手段と、  First holding means for holding the chip component which is the mounting member;
前記実装部材であるフィルム状またはシート状の基板を保持する第 2保持手段と、 前記第 1保持手段と第 2保持手段を取り付けるヘッドと、  A second holding means for holding a film-like or sheet-like substrate as the mounting member; a head for attaching the first holding means and the second holding means;
前記第 1保持テーブルの載置保持されたワークに前記各実装部材を実装するとき 、前記第 1保持手段と第 2保持手段による各実装部材の保持タイミングを制御するタ イミング制御手段と、  Timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on the work placed and held on the first holding table;
前記保持テーブルとヘッドとを相対的に昇降移動させる第 1駆動手段と、 前記第 1駆動手段を作動させて前記保持テーブルとヘッドとを相対的に昇降移動 させ、前記第 1または第 2保持手段に保持された実装部材を前記ワークに押圧されて Vヽる状態の前記導電性接合材料を加熱する加熱手段と、  A first driving means for moving the holding table and the head up and down relatively; and a first driving means for operating the first driving means to move the holding table and the head up and down relatively to move the first and second holding means. Heating means for heating the conductive bonding material in a state where the mounting member held by the workpiece is pressed by the workpiece and rolled up;
を備えたことを特徴とするボンディング装置。  A bonding apparatus comprising:
[2] 請求項 1に記載のボンディング装置にぉ 、て、 [2] The bonding apparatus according to claim 1, wherein
前記第 1保持手段は、チップ部品の中央または Zおよび幅方向に均等に吸着保持 し、  The first holding means sucks and holds evenly in the center or Z and width direction of the chip part,
前記第 2保持手段は、前記基板の複数の角部近傍を吸着保持する  The second holding means sucks and holds the vicinity of a plurality of corners of the substrate.
ことを特徴とするボンディング装置。  A bonding apparatus characterized by that.
[3] 請求項 1に記載のボンディング装置お!/、て、 [3] The bonding apparatus according to claim 1!
前記第 1保持手段または第 2保持手段の少なくともともいずれかを昇降させる第 2駆 動手段と、  Second driving means for moving up and down at least one of the first holding means and the second holding means;
前記第 1保持手段および第 2保持手段に保持される両実装部材の厚みの差に応じ て、前記第 2駆動手段の作動制御する駆動制御手段と、  Drive control means for controlling the operation of the second drive means according to a difference in thickness between the mounting members held by the first holding means and the second holding means;
を備えたことを特徴とするボンディング装置。  A bonding apparatus comprising:
[4] 請求項 3に記載のボンディング装置お!/ヽて、 [4] The bonding apparatus according to claim 3!
前記駆動制御手段は、前記第 1保持手段および第 2保持手段の両方が実装部材 を保持した状態で第 2駆動手段を作動制御し、両保持手段が実装部材を同時に前 記ワークに実装するように構成した The drive control means controls the operation of the second drive means in a state in which both the first holding means and the second holding means hold the mounting member. It was configured to be mounted on the work
ことを特徴とするボンディング装置。  A bonding apparatus characterized by that.
[5] 請求項 1に記載のボンディング装置を備えたボンディングシステムにお 、て、 [5] In a bonding system comprising the bonding apparatus according to claim 1,
前記ワークを載置保持する第 2保持テーブルと、  A second holding table for placing and holding the workpiece;
前記第 2保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅 の異方導電性フィルムを供給する複数の導電材料供給手段と、  A plurality of conductive material supply means for supplying an anisotropic conductive film having a width corresponding to the mounting member to a predetermined portion of the work placed and held on the second holding table;
異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第 1ヮ ーク搬送手段と、  First cake conveying means for conveying the workpiece supplied with the anisotropic conductive film to a bonding apparatus;
前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、  Mounting member transport means for transporting the mounting member to the bonding apparatus;
前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重 合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該 ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をヮ ークに固着させる加熱圧着手段と、  The anisotropic conductive film supplied to the workpiece by the bonding apparatus is heated, the polymerization reaction proceeds halfway, the mounting member is mounted on the workpiece in an uncured state, and then the anisotropic conductive film of the workpiece is removed. A thermocompression bonding means for further heating to terminate the polymerization reaction and fixing the mounting member to the cake;
前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送 する第 2ワーク搬送手段と、  A second workpiece conveying means for conveying a workpiece mounted with a mounting member by the bonding apparatus to the thermocompression bonding means;
を備えたことを特徴とするボンディングシステム。  A bonding system characterized by comprising:
[6] 請求項 5に記載のボンディングシステムにお!/、て、 [6] In the bonding system according to claim 5,! /
前記チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手 段を備えた  Provided with a cleaning means for cleaning both the chip component and the film-like or sheet-like mounting member.
ことを特徴とするボンディングシステム。  A bonding system characterized by that.
[7] 請求項 6に記載のボンディングシステムにお 、て、 [7] In the bonding system according to claim 6,
前記洗浄手段は、気体または超音波を付与した気体を実装部材に吹き付ける ことを特徴とするボンディングシステム。  The said cleaning means sprays the gas which provided gas or the ultrasonic wave on a mounting member. The bonding system characterized by the above-mentioned.
[8] ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、 前記ワークを載置保持する第 1保持テーブルと、 [8] A bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material, the first holding table for mounting and holding the workpiece,
前記実装部材であるフィルム状またはシート状の基板およびチップ部品の両実装 部材の実装部位を吸着保持する複数個の吸着孔の形成された保持手段と、 前記保持手段を取り付けるヘッドと、 前記保持手段に保持する実装部材の形状に応じて、当該保持手段に形成された 複数個の吸着孔の吸着作動を切換制御する制御手段と、 A holding means in which a plurality of suction holes for holding the mounting parts of both the mounting member of the film-like or sheet-like substrate and the chip component, which are the mounting members, are formed; a head for attaching the holding means; Control means for switching and controlling the suction operation of the plurality of suction holes formed in the holding means according to the shape of the mounting member held by the holding means;
前記保持テーブルとヘッドとを相対的に昇降移動させる第 1駆動手段と、 前記第 1駆動手段を作動させて前記保持テーブルとヘッドとを相対的に昇降移動 させ、前記保持手段に保持された実装部材を前記ワークに押圧されている状態の前 記導電性接合材料を加熱する加熱手段と、  A first driving means for moving the holding table and the head relatively up and down; and a mounting held by the holding means by operating the first driving means to move the holding table and the head up and down relatively. Heating means for heating the conductive bonding material in a state where the member is pressed against the workpiece;
を備えたことを特徴とするボンディング装置。  A bonding apparatus comprising:
[9] 請求項 8に記載にボンディング装置にぉ 、て、  [9] The bonding apparatus according to claim 8, wherein
前記保持手段によって前記基板を吸着保持したときに、前記保持手段からはみ出 る部位を吸着保持する支持手段を備えた  When the substrate is sucked and held by the holding means, a supporting means for sucking and holding a portion protruding from the holding means is provided.
ことを特徴とするボンディング装置。  A bonding apparatus characterized by that.
[10] 請求項 9に記載にボンディング装置において、 [10] In the bonding apparatus according to claim 9,
前記支持手段は、前記基板の複数の角部近傍を吸着保持する  The support means sucks and holds the vicinity of a plurality of corners of the substrate.
ことを特徴とするボンディング装置。  A bonding apparatus characterized by that.
[11] 請求項 9に記載にボンディング装置において、 [11] In the bonding apparatus according to claim 9,
前記保持手段または前記支持手段の少なくともともいずれかを昇降させる第 2駆動 手段と、  Second driving means for raising and lowering at least one of the holding means and the support means;
前記保持手段および支持手段に保持される両実装部材の厚みの差に応じて、前 記第 2駆動手段の作動制御する駆動制御手段と、  Drive control means for controlling the operation of the second drive means according to the difference in thickness between the mounting members held by the holding means and the support means;
を備えたことを特徴とするボンディング装置。  A bonding apparatus comprising:
[12] 請求項 11に記載のボンディング装置お ヽて、 [12] The bonding apparatus according to claim 11,
前記駆動制御手段は、前記保持手段および支持手段の両方が実装部材を保持し た状態で第 2駆動手段を作動制御し、保持手段が両実装部材を同時に前記ワーク に実装するように構成した  The drive control means is configured to control the operation of the second drive means in a state where both the holding means and the support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece.
ことを特徴とするボンディング装置。  A bonding apparatus characterized by that.
[13] 請求項 8に記載のボンディング装置を備えたボンディングシステムにお 、て、 前記ワークを載置保持する第 2保持テーブルと、 [13] In the bonding system comprising the bonding apparatus according to claim 8, a second holding table for placing and holding the workpiece,
前記第 2保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅 の異方導電性フィルムを供給する複数の導電材料供給手段と、 A width corresponding to the mounting member on a predetermined portion of the work placed and held on the second holding table A plurality of conductive material supply means for supplying the anisotropic conductive film of
異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第 1ヮ ーク搬送手段と、  First cake conveying means for conveying the workpiece supplied with the anisotropic conductive film to a bonding apparatus;
前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、  Mounting member transport means for transporting the mounting member to the bonding apparatus;
前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重 合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該 ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をヮ ークに固着させる加熱圧着手段と、  The anisotropic conductive film supplied to the workpiece by the bonding apparatus is heated, the polymerization reaction proceeds halfway, the mounting member is mounted on the workpiece in an uncured state, and then the anisotropic conductive film of the workpiece is removed. A thermocompression bonding means for further heating to terminate the polymerization reaction and fixing the mounting member to the cake;
前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送 する第 2ワーク搬送手段と、  A second workpiece conveying means for conveying a workpiece mounted with a mounting member by the bonding apparatus to the thermocompression bonding means;
を備えたことを特徴とするボンディングシステム。  A bonding system characterized by comprising:
[14] 請求項 13に記載のボンディングシステムにお!/、て、 [14] In the bonding system according to claim 13,! /
前記チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手 段を備えた  Provided with a cleaning means for cleaning both the chip component and the film or sheet mounting member.
ことを特徴とするボンディングシステム。  A bonding system characterized by that.
[15] 請求項 14に記載のボンディングシステムにお!/、て、 [15] In the bonding system according to claim 14,! /
前記洗浄手段は、気体または超音波を付与した気体を実装部材に吹き付ける ことを特徴とするボンディングシステム。  The said cleaning means sprays the gas which provided gas or the ultrasonic wave on a mounting member. The bonding system characterized by the above-mentioned.
PCT/JP2006/308056 2005-04-28 2006-04-17 Bonding apparatus and bonding system provided with same WO2006118016A1 (en)

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KR102441535B1 (en) * 2020-08-07 2022-09-07 정라파엘 Apparatus for laminating an object
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TW200642021A (en) 2006-12-01
KR101245901B1 (en) 2013-03-20

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